[go: up one dir, main page]

Wu et al., 2020 - Google Patents

Ultrasonic-assisted bonding of Al2O3 ceramic, Cu, and 5056 aluminum alloy with Sn-Zn-Sb solders

Wu et al., 2020

Document ID
12891441969319243613
Author
Wu Y
Li H
Qu W
Zhang J
Zhuang H
Publication year
Publication venue
Welding in the World

External Links

Snippet

Ceramic-metal composite components manufactured by brazing/soldering technology have broad application in industry due to their excellent properties. The present study investigated soldering of Al2O3 ceramic with Al2O3 ceramic, copper, and 5056 aluminum alloy …
Continue reading at link.springer.com (other versions)

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C

Similar Documents

Publication Publication Date Title
Wu et al. Ultrasonic-assisted bonding of Al2O3 ceramic, Cu, and 5056 aluminum alloy with Sn-Zn-Sb solders
Nagaoka et al. Selection of soldering temperature for ultrasonic-assisted soldering of 5056 aluminum alloy using Zn–Al system solders
Wu et al. Microstructural evolution of SiC joints soldered using Zn–Al filler metals with the assistance of ultrasound
Lu et al. TZM/graphite interface behavior in high-temperature brazing by Ti-based brazing filler materials
Dai et al. Microstructure and properties of 6061 aluminum alloy brazing joint with Al–Si–Zn filler metal
Choudhary et al. Microstructure evolution during stainless steel-copper vacuum brazing with a Ag/Cu/Pd filler alloy: effect of nickel plating
Chen et al. Review of ultrasonic-assisted soldering in Sn-based solder alloys
Jin et al. Joining of Al2O3 ceramic to Cu using refractory metal foil
Elrefaey et al. Preliminary investigation on brazing performance of Ti/Ti and Ti/steel joints using copper film deposited by PVD technique
Pei et al. Microstructures and mechanical properties of brazed 6063 aluminum alloy joint with Al-Cu-Si-Ni filler metal
Li et al. Microstructure and formation mechanism of Al2O3/Zn5Al/2024Al joint by ultrasonic assisted soldering process
Niu et al. Preparation and properties of a novel Al-Si-Ge-Zn filler metal for brazing aluminum
Yuan et al. Joining of Al2O3 to Cu with Cu-Sn-Ti active brazing filler alloy
Mu et al. Effect of Ni on the wetting and brazing characterization of 304 stainless steel by Ag–Cu alloy
Koleňák et al. Study of direct bonding ceramics with metal using Sn2La solder
Seo et al. Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer
Kolenak et al. Direct bonding of silicon with solders type Sn-Ag-Ti
Zhang et al. The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2. 5Ag0. 7Cu0. 1RE/Cu soldered joints
Qiu et al. Brazing 55 vol.% SiCp/ZL102 composites with Al-17.0 Cu-8.0 Mg-1.5 Ni filler metal
Wang et al. Micro–nano filler metal foil on vacuum brazing of SiCp/Al composites
Tsao et al. Direct active soldering of Al0. 3CrFe1. 5MnNi0. 5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder
Qiu et al. A novel brazing technology for SiCp/ZL102 composites used for lightweight transmit/receive module in new generation phased array radar
Zhang et al. Wetting behavior of a novel Al-Si-Ti active brazing filler metal foil on aluminum matrix composite
Li et al. Microstructure evolution and mechanical properties of ultrasonically soldered 7075 Al alloy joint with metal foam/Sn composite solder
Wang et al. Interfacial reactions of Sn-3.0 Ag-0.5 Cu solder with sputter Cu-Ti alloy film UBM