Ihlemann et al., 1993 - Google Patents
Excimer laser micromachiningIhlemann et al., 1993
- Document ID
- 12562437042693333596
- Author
- Ihlemann J
- Schmidt H
- Wolff‐Rottke B
- Publication year
- Publication venue
- Advanced Materials for Optics and Electronics
External Links
Snippet
The machining of several materials such as polymers, metals and ceramics using excimer lasers (193, 248 and 308 nm) was investigated. By photoablation, micrometer resolution can be achieved for polymers if the wavelength and fluence are chosen properly. High‐definition …
- 238000005459 micromachining 0 title description 11
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
- G03F7/70008—Production of exposure light, i.e. light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
- G03F7/708—Construction of apparatus, e.g. environment, hygiene aspects or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Ghantasala et al. | Patterning, electroplating and removal of SU-8 moulds by excimer laser micromachining | |
Duocastella et al. | Bessel and annular beams for materials processing | |
US4980536A (en) | Removal of particles from solid-state surfaces by laser bombardment | |
JP3943089B2 (en) | Method and apparatus for generating X-ray radiation or extreme ultraviolet radiation | |
Bravo et al. | Demonstration of nanomachining with focused extreme ultraviolet laser beams | |
Hong et al. | Laser assisted surface nanopatterning | |
Ihlemann et al. | Excimer laser micromachining | |
Lee et al. | Excimer laser ablation removal of thin chromium films from glass substrates | |
Lim et al. | Sub-micron surface patterning by laser irradiation through microlens arrays | |
Venkatakrishnan et al. | Femtosecond laser ablation of thin films for the fabrication of binary photomasks | |
Gerlach et al. | Design and performance of an excimer-laser based optical system for high precision microstructuring | |
WO1986002774A1 (en) | Focused substrate alteration | |
EP1280654A1 (en) | Method for applying a layer containing at least polymeric material | |
JP2922126B2 (en) | Fine processing method of TFE-based polymer and finely processed member | |
Schmidt et al. | Excimer laser micromachining based on dielectric masks | |
Ghantasala et al. | Excimer laser micromachining of structures using SU-8 | |
Davies | Use of energy beams for ultra-high precision processing of materials | |
Jacob et al. | Excimer laser micromachining and its applications | |
Endert et al. | Microstructuring with 157-nm laser light | |
Hayes et al. | Nanometer resolution excimer laser ablat ion of thin polymer films | |
Hayden | Excimer Laser Micromachined Three-dimensional Microstructures—Techniques and Applications | |
Christensen Jr | Micromachining of diamond substrates with waveguide excimer lasers | |
Holmes et al. | Modeling of solid-state and excimer laser processes for 3D micromachining | |
Zhang et al. | Micro-scale free surface rapid prototyping | |
Yang et al. | High-resolution UV laser repair of phase-shifting photomasks |