Lehovec et al., 1963 - Google Patents
Field Effect‐Capacitance Analysis of Surface States on SiliconLehovec et al., 1963
View PDF- Document ID
- 11357949474214592279
- Author
- Lehovec K
- Slobodskoy A
- Sprague J
- Publication year
- Publication venue
- physica status solidi (b)
External Links
Snippet
The capacitance of a space charge layer, induced on a semiconductor surface, is analyzed to obtain information on the charge of surface states. Capacitance measurements on silicon‐ silicon oxide‐metal combinations are presented, and these indicate a quasi‐continuous …
- 229910052710 silicon 0 title description 32
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors with potential-jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/0405—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising semiconducting carbon, e.g. diamond, diamond-like carbon
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies; Multistep manufacturing processes therefor characterised by the materials of which they are formed
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/40—Electrodes; Multistep manufacturing processes therefor
- H01L29/43—Electrodes; Multistep manufacturing processes therefor characterised by the materials of which they are formed
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L47/00—Bulk negative resistance effect devices, e.g. Gunn-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Lehovec et al. | Field Effect‐Capacitance Analysis of Surface States on Silicon | |
Luo et al. | Theory and experiments of 1/f noise in Schottky-barrier diodes operating in the thermionic-emission mode | |
Bahl et al. | Amorphous versus crystalline GeTe films. III. Electrical properties and band structure | |
Goetzberger et al. | Interface states on semiconductor/insulator surfaces | |
Roberts et al. | Capacitance energy level spectroscopy of deep‐lying semiconductor impurities using Schottky barriers | |
McWhorter | 1/f noise and related surface effects in germanium. | |
McGarrity et al. | Silicon carbide JFET radiation response | |
Ast et al. | Thickness and temperature dependence of the conductivity of phosphorus-doped hydrogenated amorphous silicon | |
Jonscher et al. | Dielectric spectroscopy of semi-insulating gallium arsenide | |
Kerr | Effect of temperature and bias on glass-silicon interfaces | |
Levy et al. | Field‐effect conductance of YBa2Cu3O6 | |
Scott | Depletion width in SrTiO3 and BaxSr1− xTiO3 films | |
Seidel et al. | Dependence of hole velocity upon electric field and hole density for p-type silicon | |
Goto et al. | An improved method of determining deep impurity levels and profiles in semiconductors | |
Balberg et al. | Tunneling in hydrogenated amorphous silicon | |
Theodoropoulou et al. | Transient and ac electrical transport under forward and reverse bias conditions in aluminum/porous silicon∕ p-cSi structures | |
Green et al. | Frequency response of the current multiplication process in MIS tunnel diodes | |
Polanco et al. | AC and DC electrical conductivity in amorphous arsenic trisulphide films | |
KR960011537B1 (en) | Method and apparatus for measuring carrier concentration in semiconductor | |
Hickmott | Temperature dependence of FET properties for Cr-doped and LEC semi-insulating GaAs substrates | |
Kohn | GaAs-MESFET for digital application | |
Kano et al. | Reverse characteristics of Mo-Si epitaxial Schottky diodes | |
Los et al. | Model of Schottky junction admittance taking into account incomplete impurity ionization and large-signal effects | |
Pike et al. | Electronic properties of silicon grain boundaries | |
Hasegawa et al. | Properties of surface passivation dielectrics for GaAs integrated circuits |