[go: up one dir, main page]

Wargulski et al., 2020 - Google Patents

Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings

Wargulski et al., 2020

Document ID
11172847646078396679
Author
Wargulski D
May D
Boschman E
Hutzler A
Wunderle B
Ras M
Publication year
Publication venue
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

External Links

Snippet

This study shows a technique to avoid the necessary spray-coating of devices under test with low-emissivity surfaces in failure analyses by pulsed IR thermography. Such samples can be sintered or soldered electronic components. The mentioned technique is based on a …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/91—Investigating the presence of flaws or contamination using penetration of dyes, e.g. fluorescent ink
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons by transmitting the radiation through the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by the preceding groups

Similar Documents

Publication Publication Date Title
Wargulski et al. Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings
Panahandeh et al. Pulsed infrared thermal imaging as inline quality assessment tool
Wargulski et al. Pulsed infrared thermography failure analysis of low-emissivity specimens without contaminations caused by high-emissivity coatings
Wargulski et al. Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation
CN106680314B (en) Infrared thermal imaging device and method for projection non-destructive detection of internal defects between thin films
Panahandeh et al. Inline failure analysis of sintered layers in power modules using infrared thermography
JP2011247735A (en) Method of measuring in-plane distribution of heat characteristics of metal/ceramic bonded substrate by laser pulse excitation infrared camera measurement method
Lu et al. Defects inspection of the solder bumps using self reference technology in active thermography
Elger et al. Inline thermal transient testing of high power LED modules for solder joint quality control
Liu et al. Location resolved transient thermal analysis to investigate crack growth in solder joints
Pacheco et al. Advanced Fault Isolation and Failure Analysis Techniques for Future Package Technologies.
May et al. IR pulse thermography as failure analytical tool applied to die attach processes
Wargulski et al. Paving the way for the replacement of solder interconnections in power electronics by silver-sinter using pulsed infrared thermography
Dreher et al. Non-destructive imaging of defects in Ag-sinter die attach layers–A comparative study including X-ray, scanning acoustic microscopy and thermography
Wargulski et al. An in-line failure analysis system based on IR thermography ready for production line integration
Panahandeh et al. Infrared thermal imaging as inline quality assessment tool
Martin et al. Detection of delaminations in sub-wavelength thick multi-layered packages from the local temporal coherence of ultrasonic signals
Panahandeh et al. Failure analysis of sintered layers in power modules using laser lock-in thermography
Liu et al. A novel method and device for solder joint quality inspection by using laser ultrasound
CN115792573A (en) A Chip Detection Method Based on Electromagnetic Field
Li et al. Imaging-based NDT methods for electronic devices
Schiffmacher et al. In-situ detection of degradation in power electronic modules during lifetime testing using lock-in thermography
Panahandeh et al. Laser Lock-in Thermography for Inspection of Silver-Sintered Die Attaches
JP2018534539A (en) Arrangement to determine the achievable bond strength prior to continuous material connection to the mating surface
Li et al. Fault isolation and failure analysis of 3D packaging