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Fang et al., 2022 - Google Patents

Low temperature fine-pitch Cu-Cu bonding using Au nanoparticles as intermediate

Fang et al., 2022

Document ID
11156444977999203050
Author
Fang J
Cai J
Wang Q
Shi X
Zheng K
Zhou Y
Publication year
Publication venue
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

External Links

Snippet

In this paper, we propose a Cu-Cu bonding approach utilizing Au nanoparticles (NPs) fabricated by Physical Vapor Deposition (PVD) method as intermediate to realize time- saving, low-temperature and fine-pitch bonding. Confocal microscope was used to observe …
Continue reading at ieeexplore.ieee.org (other versions)

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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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