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ZA200303747B - Thermally conductive casting compound. - Google Patents

Thermally conductive casting compound.

Info

Publication number
ZA200303747B
ZA200303747B ZA200303747A ZA200303747A ZA200303747B ZA 200303747 B ZA200303747 B ZA 200303747B ZA 200303747 A ZA200303747 A ZA 200303747A ZA 200303747 A ZA200303747 A ZA 200303747A ZA 200303747 B ZA200303747 B ZA 200303747B
Authority
ZA
South Africa
Prior art keywords
casting compound
thermally conductive
conductive casting
thermal conductivity
compound
Prior art date
Application number
ZA200303747A
Other languages
English (en)
Inventor
Irene Jennrich
Kristian Leo
Markus Muzic
Wolfgang Endres
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ZA200303747B publication Critical patent/ZA200303747B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Braking Arrangements (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Mold Materials And Core Materials (AREA)
  • Investigation Of Foundation Soil And Reinforcement Of Foundation Soil By Compacting Or Drainage (AREA)
  • Buildings Adapted To Withstand Abnormal External Influences (AREA)
  • Soil Conditioners And Soil-Stabilizing Materials (AREA)
ZA200303747A 2000-11-16 2003-05-14 Thermally conductive casting compound. ZA200303747B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10057111A DE10057111C1 (de) 2000-11-16 2000-11-16 Wärmeleitfähige Vergußmasse

Publications (1)

Publication Number Publication Date
ZA200303747B true ZA200303747B (en) 2004-07-19

Family

ID=7663693

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200303747A ZA200303747B (en) 2000-11-16 2003-05-14 Thermally conductive casting compound.

Country Status (11)

Country Link
US (1) US7183363B2 (xx)
EP (1) EP1341847B1 (xx)
JP (1) JP2004514042A (xx)
AT (1) ATE301164T1 (xx)
AU (2) AU1898002A (xx)
DE (2) DE10057111C1 (xx)
ES (1) ES2247200T3 (xx)
MX (1) MXPA03004318A (xx)
PL (1) PL362756A1 (xx)
WO (1) WO2002040589A1 (xx)
ZA (1) ZA200303747B (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10247280B4 (de) * 2002-10-10 2004-09-09 SICcast Mineralguß GmbH & Co. KG Verwendung eines Siliciumcarbidverbundmaterials
DE502004007114D1 (de) * 2003-09-29 2008-06-26 Bosch Gmbh Robert Härtbares Reaktionsharzsystem
WO2005047378A2 (en) * 2003-11-05 2005-05-26 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
JP2005330335A (ja) * 2004-05-18 2005-12-02 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
KR101166015B1 (ko) * 2006-04-26 2012-07-19 삼성에스디아이 주식회사 전자 방출원, 전자 방출원 형성용 조성물, 상기 전자방출원의 제조 방법 및 상기 전자 방출원을 구비한 전자방출 소자
JP4871646B2 (ja) * 2006-05-26 2012-02-08 太陽ホールディングス株式会社 フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板およびフレキシブル基板の製造方法
DE102006049062A1 (de) * 2006-10-13 2008-04-17 Christian Pluta Verschleißschutzbeschichtung
BRPI0722152A2 (pt) * 2007-10-08 2014-03-18 Abb Research Ltd Sistema de isolamento elétrico de concreto polimérico
US20110003946A1 (en) * 2008-01-18 2011-01-06 Klaus-Volker Schuett Curable reaction resin system
US8618211B2 (en) 2009-03-16 2013-12-31 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
DE102009003132A1 (de) * 2009-05-15 2010-11-18 Robert Bosch Gmbh Kunststoffformmasse sowie Verfahren zu deren Herstellung
DE102015200425A1 (de) * 2015-01-14 2016-07-14 Robert Bosch Gmbh Reaktionsharzsystem mit hoher Wärmeleitfähigkeit
DE102015010669A1 (de) 2015-08-14 2017-02-16 Stephan Matthies Vergussmasse mit Füllstoffen
CN107216726A (zh) * 2016-03-21 2017-09-29 华越科技股份有限公司 散热涂层的制备方法及其所制成的金属散热复合膜
DE102018214641B4 (de) * 2018-08-29 2022-09-22 Robert Bosch Gmbh Vergussmasse, Verfahren zum elektrischen Isolieren eines elektrischen oder elektronischen Bauteils unter Verwendung der Vergussmasse, elektrisch isoliertes Bauteil, hergestellt über ein solches Verfahren und Verwendung der Vergussmasse

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4826896A (en) * 1987-03-19 1989-05-02 The Dexter Corporation Encapsulating electronic components
JP2570002B2 (ja) * 1991-05-29 1997-01-08 信越化学工業株式会社 フリップチップ用封止材及び半導体装置
DE4138411C2 (de) * 1991-11-22 1995-01-26 Bosch Gmbh Robert Härtende Vergußmassen
US5319005A (en) * 1992-01-27 1994-06-07 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component
US5353498A (en) 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
DE19523897C2 (de) 1995-06-30 2002-10-24 Bosch Gmbh Robert Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile
SG48462A1 (en) * 1995-10-26 1998-04-17 Ibm Lead protective coating composition process and structure thereof
DE19638630B4 (de) * 1996-09-20 2004-11-18 Siemens Ag UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen
JP3816604B2 (ja) * 1996-12-06 2006-08-30 ソマール株式会社 フィルムコンデンサ用難燃性エポキシ樹脂組成物及びそれを用いたフィルムコンデンサ
JP3444199B2 (ja) * 1998-06-17 2003-09-08 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
JP2000248182A (ja) * 1999-03-02 2000-09-12 Dow Corning Toray Silicone Co Ltd 樹脂用添加剤、硬化性樹脂組成物、および硬化樹脂
DE19910711A1 (de) * 1999-03-10 2000-09-14 Bakelite Ag Imprägniervergußmassen, ihre Verwendung sowie ein Verfahren zur Imprägnierung von Zündspulen
US6323263B1 (en) * 1999-11-11 2001-11-27 Shin-Etsu Chemical Co., Ltd. Semiconductor sealing liquid epoxy resin compositions

Also Published As

Publication number Publication date
EP1341847B1 (de) 2005-08-03
PL362756A1 (en) 2004-11-02
JP2004514042A (ja) 2004-05-13
DE50107000D1 (de) 2005-09-08
US7183363B2 (en) 2007-02-27
US20040092654A1 (en) 2004-05-13
EP1341847A1 (de) 2003-09-10
DE10057111C1 (de) 2002-04-11
AU2002218980B2 (en) 2006-12-21
ES2247200T3 (es) 2006-03-01
ATE301164T1 (de) 2005-08-15
MXPA03004318A (es) 2004-06-30
AU1898002A (en) 2002-05-27
WO2002040589A1 (de) 2002-05-23

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