WO2026022550A1 - Integrated connector - Google Patents

Abstract

A connector of a lead system for an implantable medical device includes a pin. A first conductor that is electrically connected to a first electrode of the lead system is electrically connected to the pin. The first conductor extends through proximal connector assembly rings of the connector. One or more tabs are connected to a respective one or more of the proximal connector assembly rings. A second conductor that is electrically coupled to a second electrode of the lead system is electrically connected to the one or more tabs. A single overmold at least partially encapsulates a distal portion of the pin, the plurality of proximal connector assembly rings and the second conductor.

Description

INTEGRATED CONNECTOR

[0001] This application claims the benefit of U.S. Provisional Patent Application Serial No. 63/675,129, filed July 24, 2024, the entire content of which is incorporated herein by reference.

TECHNICAL FIELD

[0002] This disclosure relates to medical device systems including one or more leads.

BACKGROUND

[0003] Medical devices may be used to deliver therapy to a patient to treat symptoms or conditions such as chronic pain, seizure disorders (e.g., epilepsy), heart arrhythmias (e.g., bradycardia and fibrillation), tremor, Parkinson’s disease, other types of movement disorders, obesity, mood disorders, urinary or fecal incontinence, or other types of symptoms or conditions. The therapy may be electrical stimulation therapy or, in some cases, higher voltage electrical shocks. Medical devices, such as implantable medical devices (IMDs), may be used for therapies such as deep brain stimulation (DBS), spinal cord stimulation (SCS), sacral neuromodulation, pelvic stimulation, gastric stimulation, peripheral nerve stimulation, cardiac stimulation, functional electrical stimulation, or other types of stimulation, as well as cardioversion or defibrillation. A medical device may include one or more leads carrying one or more electrodes. The medical device may deliver the electrical therapy to one or more target tissue sites within the patient and/or sense one or more electrical signals produced by tissue of the patient via the one or more electrodes the lead.

SUMMARY

[0004] An implantable medical lead connector is a component of various implantable medical leads. The connector may be configured to serve as the interface between the implantable medical lead and the main device body of the IMD. These connectors may ensure a reliable, secure connection that maintains the integrity of electrical signals being passed between the implanted device and the target tissue. In general, the manufacturing process for a connector may be complex, which can introduce various problems, such as higher costs, quality control challenges, slower production times, scalability issues, etc. [0005] In accordance with techniques of this disclosure, a connector may be integrated into the lead. For example, a connector may be manufactured using injection molding. Injection molding may enable the production of complex geometries that would be difficult or impossible to achieve with other manufacturing processes. In turn, injection molding may reduce costs while increasing rate of production. The techniques may also improve the overall quality and reliability of the connector.

[0006] In some examples, a connector of a lead system for an implantable medical device, the connector comprises: a pin, wherein a first conductor that is electrically connected to a first one or more electrodes of the lead system is electrically connected to the pin; a plurality of proximal connector assembly rings, wherein the first conductor extends through the plurality of proximal connector assembly rings; one or more tabs, wherein each tab of the one or more tabs is connected to a respective one or more rings of the plurality of proximal assembly rings, wherein a second conductor that is electrically coupled to a second one or more electrodes of the lead system is electrically coupled to the one or more tabs; and a single overmold at least partially encapsulating a distal portion of the pin, the plurality of proximal connector assembly rings and a portion of the second conductor.

[0007] In some examples, an implantable medical device lead comprises: a lead body comprising: a plurality of electrodes including a fist electrode and a second electrode positioned at a distal portion of the lead body; a first conductor extending along at least a portion of the lead body and electrically connected to the first electrode; and a second conductor extending over at least a portion of the cable and electrically connected to the second electrode, wherein the coiled conductor is electrically insulated from the cable; and a connector at a proximal end of the lead body. The connector comprises: a pin, wherein the first conductor is electrically connected to the pin; a plurality of proximal connector assembly rings, wherein the first conductor extends through the plurality of proximal connector assembly rings; one or more tabs, wherein each tab of the one or more tabs is connected to a respective one or more rings of the plurality of proximal connector assembly rings, wherein the second conductor is electrically coupled to the one or more tabs; and a single overmold encapsulating a distal portion of the pin, the plurality of proximal connector assembly rings and a portion of the second conductor.

[0008] In some examples, a method of manufacturing a connector of a lead system for an implantable medical device comprises: extending a first conductor through a plurality of proximal connector assembly rings, wherein each tab of one or more tabs is electrically connected to a respective one or more of the plurality of proximal connector assembly rings; electrically connecting a second conductor to the one or more tabs, wherein the second conductor is connected or connectable to a second electrode of the lead system; electrically connecting a pin to a first conductor, the first conductor connected or connectable to a first electrode of the lead system; and encapsulating at least a portion of a distal portion of the pin, the plurality of proximal assembly rings and the coiled conductor with a single overmold.

[0009] The summary is intended to provide an overview of the subject matter described in this disclosure. It is not intended to provide an exclusive or exhaustive explanation of the systems, device, and methods described in detail within the accompanying drawings and description below. Further details of one or more examples of this disclosure are set forth in the accompanying drawings and in the description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims.

BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1 is a conceptual diagram of an example medical device system in accordance with techniques of this disclosure.

[0011] FIG. 2 is a conceptual diagram of an example connector in accordance with techniques of this disclosure.

[0012] FIG. 3 is a conceptual diagram of an example proximal portion of a connector without an overmold, in accordance with techniques of this disclosure.

[0013] FIG. 4 is a flowchart illustrating an example technique for manufacturing a connector in accordance with techniques of this disclosure.

[0014] FIG. 5 is a conceptual diagram of another example connector in accordance with the techniques of this disclosure. DETAILED DESCRIPTION

[0015] As described above, some examples of the disclosure relate to medical device leads (also referred to as “lead systems,” “medical leads,” or “leads”) including one or more electrodes. Using the lead and electrode, a medical device may deliver or sense electrical signals to provide therapy to a patient to treat a patient condition. Medical leads may include a conductive electrode member electrically and mechanically connected to one or more conductive lead wires (which also may be referred to as “conductors”) extending through the lead body. Electrical stimulation from a medical device may be conducted along the lead wire to be delivered across the electrode surface.

[0016] A connector is a medical component and part of a lead system. A connector may be configured to simplify the complex interfacing between a lead and an IMD, ensuring a more streamlined and efficient connection. For instance, instead of requiring multiple separate connections (which may increase the risk of errors during implantation and potentially complicate the procedure), the connector may integrate multiple electrical contacts into a single, unified connection, simplifying the process and enhancing reliability. For example, the DF4 connector is a type of connector that may be part of a lead system including multiple electrodes and attached to an IMD that utilizes the multiple electrodes for sensing and/or therapy delivery, e.g., attached to an implantable cardioverter-defibrillator (ICD).

[0017] In general, manufacturing a connector is a complex process, reflecting the stringent requirements and high standards necessary for medical devices. For example, a connector may require intricate components to ensure reliable electrical contact and mechanical stability. Achieving the necessary tolerances and specifications may involve advanced techniques, making the manufacturing process time-consuming and expensive. [0018] This disclosure describes techniques for improving the manufacturing process for a connector. Streamlining the production method may enhance the speed of production, allowing for faster turnaround times and higher throughput. Moreover, improved manufacturing processes may enhance product quality and consistency. Higher precision and better control over the manufacturing process may result in connectors with more consistent performance and fewer defects (which may also reduce the costs and delays associated with quality control and post-production testing). [0019] FIG. l is a conceptual diagram illustrating an example medical device system 10 (“system 10”). In the example of FIG. 1, system 10 is configured to deliver His- Purkinje conduction system (HPCS) pacing to a heart 12 of a patient 14. However, in other examples, system 10 may be configured to deliver other types of therapy to heart 12 and/or to other regions of patient 14. As illustrated by system 10 in FIG. 1, system 10 may include an IMD 16 with cardiac pacing capabilities.

[0020] IMD 16 is connected to an implantable medical lead 22. IMD 16 senses electrical signals attendant to the depolarization and repolarization of heart 12, e.g., a cardiac EGM, via electrodes on one or more of lead 22 and/or the housing of IMD 16. IMD 16 may also deliver therapy in the form of electrical signals, e.g., cardiac pacing and/or antitachyarrhythmia shock, to heart 12 via electrodes located on lead 22. In the illustrated example, lead 22 includes lead body 23 and a connector 32 (as described further below) at a proximal end of lead body 23 and a distal electrode 25 A at a distal end of lead body 23 of lead 22 and a proximal electrode 25B located proximally of the distal end (collectively, “electrodes 25”). In other examples, lead may include more or fewer electrodes 25, such as examples in which lead 22 includes only electrode 25A.

[0021] Lead body 23 extends into heart 12 of patient 14 to position electrodes 25 to sense electrical activity of heart 12 and/or deliver electrical stimulation to heart 12. In the example shown in FIG. 1, lead body 23 extends through one or more veins (not shown), the superior vena cava (not shown), and right atrium 26, and into right ventricle 28.

System 10 may include additional leads coupled to IMD 16, such as a left ventricular (LV) lead that extends through one or more veins, the vena cava, right atrium 26, and into the coronary sinus to a region adjacent to the free wall of left ventricle 31 of heart 12, and/or a lead that extends into right atrium 26.

[0022] Lead 22, e.g., distal electrode 25A, is positioned to provide pacing to the HPCS. Providing HPCS pacing is sometimes referred to as “His-Purkinje pacing.” In the illustrated example, lead 22 is positioned to provide pacing to His-Purkinje 20 between an atrioventricular bundle (not shown) and branches of Purkinje fibers 30. In other examples, lead 22 and distal electrode 25A may be implanted at positions to provide pacing to other portions of the HPCS, such as a left bundle branch (LBB) or right bundle branch (RBB). [0023] Distal electrode 25 A may be extended from a distal end of lead body 23 and into cardiac tissue. Distal electrode 25A may take the form of a fixed helix, an extendable helix, or tine tip electrode, in some examples. Electrode 25B may take the form of a coil electrode electrically insulated from electrode 25A. In some examples, each of electrodes 25 A and 25B is electrically coupled to a respective conductor within the body 23 of lead 22 and thereby coupled to circuitry within IMD 16.

[0024] In some examples, lead 22 may be an integrated bipolar lead. For example, lead 22 may be configured to both pace and sense while also integrating a defibrillation coil (e.g., electrode 25B). Electrode 25B may be configured to deliver high-energy shocks for defibrillation to terminate life-threatening arrhythmias like ventricular fibrillation or ventricular tachycardia. Electrode 25B may also serve as the anode during pacing and sensing. In this configuration, electrode 25A may acts as the cathode, in other examples, electrode 25B could be a ring electrode, and lead 22 could include one or more coil electrodes in addition to a tip electrode 25 A and a ring electrode 25B.

[0025] Distal electrode 25 A may be positioned within the cardiac tissue such that pacing stimulation delivered via distal electrode 25A activates the HPCS. During an implantation procedure for lead 22, an implanting physician may position a distal end of lead at a desired location, and fix distal electrode 25 A distally from the distal end of lead 22 to a desired depth within the cardiac tissue, e.g., the intraventricular myocardium.

[0026] Lead 22 may be connected to IMD 16 via a connector 32. In some examples, the connector 32 may be inserted into or otherwise coupled to header 33 (e.g., connector block, connector head, etc.) of IMD 16. Header 33 may include one or more ports for receiving lead 22. The ports in header 33 may connect to the electronic circuitry of IMD 16, enabling IMD 16 to send electrical impulses to heart 12 and receive signals from heart 12 via lead 22.

[0027] As described above, connector 32 may require precise engineering to ensure reliable electrical connections and secure attachment to lead body 23, which is crucial for the functionality of IMD 16 and safety of patient 14. As a result, connector 32 may be expensive and difficult to manufacture. In accordance with techniques of this disclosure, the manufacturing process for a connector may be improved, thereby enhancing the speed of production and product quality and decreasing costs. For example, the techniques may reduce the number of components and simplify the manufacturing process. The techniques may include overmolding, allowing for the integration of multiple components into a single assembly, The techniques may further include final forming (e.g., injection molding), potentially eliminating the need for multiple processes such as gluing and reflowing.

[0028] FIG. 2 is a conceptual diagram of connector 32 in accordance with techniques of this disclosure. As shown in FIG. 2, connector 32 may include one or more proximal connector assembly (PCA) rings, such as PCA rings 34A-34B (collectively, “PCA rings 34”). PCA rings 34 may be configured to avoid various complications that may be present in conventional connector designs. For example, PCA rings 34 may remove the need for gluing operations and thermal bonding operations, simplifying the ring design. PCA rings 34 may also remove the need for a “snout,” or material joining PCA rings 34 and a distal connection assembly (DCA) ring 36. That said, connector 32 may still include a snout in some examples to facilitate laser welding.

[0029] PCA rings 34 and DCA rings 36 may be configured to provide a secure and stable electrical connection between lead 22 and IMD 16. PCA rings 34 and DCA rings 36 may ensure that electrical signals are reliably transmitted, e.g., for sensing, pacing, and/or defibrillation. To that end, PCA rings 34 and DCA rings 36 may require precise manufacturing (e.g., to make firm contact with the corresponding contacts to prevent any disconnection or signal loss). In some examples, PCA rings 34 and DCA rings 36 may be made from highly conductive and biocompatible metals such as platinum, iridium, or titanium.

[0030] As shown in FIG. 2, a coiled conductor 44 may include a proximal portion 46 that extends and is electrically coupled within connector 32. Coiled conductor 44 may be configured to transmit electrical signals between the patient’s body and IMD 16 via rings 34 and 36. For example, coiled conductor 44 may extend along at least a portion of lead body 23 and electrically couple to one or more electrodes at a distal portion of lead 22 (e.g., coil electrode 25B) to provide electrical connection between IMD 16 and the one or more electrodes. Coiled conductor 44 may be formed from materials like MP35N (e.g., a nickel-cobalt-chromium-molybdenum alloy) or other biocompatible metals to ensure durability and flexibility within the body. In some examples, coiled conductor 44 may deliver pacing pulses, sense cardiac activity, and in the case of defibrillators, deliver high- energy anti-tachyarrhythmia shocks to restore normal heart rhythm.

[0031] Coiled conductor 44 may be insulated with biocompatible materials like silicone or polyurethane to prevent electrical interference and ensure safe, reliable signal transmission. Proximal portion 46 of coiled conductor 44 may electrically couple or interface to one or more tabs 48 of PCA rings 34, which may be electrically common. Proximal portion 46 of coiled conductor 44 may extend through DC A ring 36 to PCA rings 34. In the example of FIG. 2, DCA ring 36 is not connected to a conductor within lead body 23, or to an electrode 25. I other examples, in which lead 22 includes an additional electrode, DCA ring may be connected to the additional electrode.

[0032] Connector 32 may include a pin 40. Pin 40 may include an anti-rotation feature 42. Anti-rotation feature 42 may be configured to ensure that components of connector 32, e.g., pin and/or cable, remain in the correct orientation and position, maintaining the integrity of the electrical connection and preventing mechanical or electrical issues that could arise from rotational movement of such components relative to other components of connector 32 and/or the overmold 38, which is further discussed below. A cross-section of anti-rotation feature 42 may have a simple shape, such as a square or other non-circular shape, in order to be easier to machine and have a lower cost. In some examples, antirotation feature 42 may be formed on pin 40.

[0033] A cable 50 may be electrically connected to a first one or more electrodes of the lead system is electrically connected to pin 40. For example, cable 50 may extend along at least a portion of lead body 23 and connect to one or more electrodes, e.g., tip electrode 25 A, of lead 22. For example, cable 50 may be positioned along a central axis or core of lead body 23 with coiled conductor 44 positioned over at least a portion of cable 50 such that the coiled conductor is electrically insulated from the cable. Cable 50 may be welded or otherwise connected to pin 40, which electrically connects circuitry within IMD to pin 40. Cable 50 may extend through PCA rings 34 and DCA ring 36. IMD 14 may sense cardiac activity and deliver pacing pulses via electrode 25A, cable 50, and pin 40. IMD 15 may sense cardiac activity and deliver antitachyarrhythmia shocks via electrode 25B, coiled conductor 44, and PCA rings 34. Cable 50 and coiled conductor 44 may be referred to as first and second conductors.

[0034] Connector 32 may include overmold 38. Overmold 38 may be the result of final injection molding, or final form-shaping through injection molding. Overmold 38 may not be an assembly of discrete components of connector 32 (e.g., formed through injection molding) that are glued or otherwise coupled together; instead, overmold 38 may be a single, integrated unit (which is comparatively simple and efficient). Overmold 38 may at least partially encapsulate PCA rings 34, DCA ring 36, and other components of connector 32. In this way, overmold 38 may protect these elements, ensuring the integrity and longevity of connector 32. Some or all of the outer surfaces of rings 34 and/or 36 may not be covered by overmold 38, e.g., to allow electrically connection with corresponding components in header 33 of IMD 14. Overmold 38 may encapsulate at least a distal portion of pin 40. Proximal portion of pin 40 may be exposed, e.g., to allow electrically connection with corresponding components in header 33 of IMD 14.

[0035] By integrating these components during the final molding step by way of overmold 38, the techniques may streamline the production process and reduce assembly time (e.g., by eliminating injection molding of multiple components and thermal bonding of those components). Overmold 38 may be formed from polyurethane, silicone rubber, elastomers, etc. Overmold 38 may provide insulation to prevent electrical interference and also be flexible to accommodate deformation.

[0036] In some examples, grinding (e.g., centerless grinding) may be performed on overmold 38 to achieve specific dimensional or functional requirements. One advantage of overmold 38 during grinding is that, because overmold 38 encapsulates portions of PCA rings 34 and DCA rings 36, grinding overmold 38 may ensure precise tolerances for all the rings (e.g., the diameters of PCA rings 34 and DCA rings 36 are the same, and the centers of PCA rings 34 and DCA rings 36 are aligned). Thus, the techniques may help reduce the risk of a mismatch between the components, improving quality control.

[0037] Overmold 38 may be seamless in that overmold 38 does not have any ingress points. Thus, overmold 38 may integrate components of connector 32 with a protective layer of material, effectively sealing interfaces and joints (e.g., adhesion joints) that could otherwise allow fluids or other contaminants to enter sensitive areas (e.g., fluid may interfere with electrical components in terms of impedance, resistance, continuity, etc.). By being substantially (or completely) hermetic, overmold 38 may address this critical issue as well as eliminate the need for internal seals. Thus, overmold 38 may advance the goal of designed for manufacturing and assembly (DFMA). By eliminating components, the techniques simplify the manufacturing process, meeting the requirements, and improving the design.

[0038] FIG. 3 is a conceptual diagram illustrating a proximal portion 52 of connector 32 without overmold 38. As shown in FIG. 3, PCA rings 34 may be connected to each other via tabs 48. PCA rings 34 and tabs 48 may be formed as a single or integrated component, removing the need for gluing operations and thermal bonding operations. A cross-section of anti-rotation feature 42 of pin 40 may have a simple shape, such as a square or other non-circular shape, in order to be easier to machine and have a lower cost. In some examples, proximal portion 52 may be a single or integrated assembly, such that no joining of individual components is required.

[0039] FIG. 4 is a flowchart illustrating an example technique for manufacturing connector 32 in accordance with techniques of this disclosure. In the illustrated example, proximal portion 46 of coiled conductor 44 may be extended through DCA ring 36 and into PCA rings 34 to be welded or otherwise electrically coupled to the PCA rings, e.g., to tabs 48 (400). Cable 50 may be extended through DCA ring 36 and PCA rings 34 (402), and a proximal end thereof may be welded or otherwise coupled to pin 40 (404). Cable 50 may extend through or along coiled conductor 44, with both being insulated from one another. In some examples, coiled conductor 44 may be manufactured from fine wires of platinum-iridium or other suitable materials. Coiled conductor 44 may be coated with insulation materials like PTFE or silicone.

[0040] This assembly may be overmolded with overmold 38 (406). Overmold 38 may be the result of final injection molding, or final form-shaping through injection molding. Overmold 38 may be a single, integrated unit that at least partially encapsulates PCA rings 34, DCA ring 36, pin 50, and other components of connector 32. In this way, overmold 38 may protect these elements, ensuring the integrity and longevity of connector 32. Overmold 38 may be formed from polyurethane, silicone rubber, elastomers, etc.

[0041] In some examples, grinding (e.g., centerless grinding) may be performed on overmold 38 to achieve specific dimensional or functional requirements (406). For example, centerless grinding may be performed to achieve a surface finish and smoothness. By centerless grinding overmold 38, which encapsulates PCA rings 34 and DCA rings 36, the diameters of PCA rings 34 and DCA rings 36 may be the same, and the centers of PCA rings 34 and DCA rings 36 may be aligned). Thus, the techniques may help reduce the risk of a mismatch between the components, improving quality control. [0042] FIG. 5 is a conceptual diagram of another example connector 132 in accordance with the techniques of this disclosure. Connector 132 of FIG. 5 may be in some aspects similar to connector 32 illustrated in FIG. 3, with like numbers representing like components. Connector 132 differs from connector 32 in that connector 132 includes a snout 47 electrically connected to, e.g., formed as a single piece or assembly with, PC A rings 34. Snout 47 may provide a point of electrical connection between coiled conductor 44 and PCA rings 34, e.g., via welding of the conductor to snout 47.

[0043] The present disclosure includes the following examples:

[0044] Example 1. A connector of a lead system for an implantable medical device, the connector comprising: a pin, wherein a first conductor that is electrically connected to a first one or more electrodes of the lead system is electrically connected to the pin; a plurality of proximal connector assembly rings, wherein the first conductor extends through the plurality of proximal connector assembly rings; one or more tabs, wherein each tab of the one or more tabs is connected to a respective one or more rings of the plurality of proximal assembly rings, wherein a second conductor that is electrically coupled to a second one or more electrodes of the lead system is electrically coupled to the one or more tabs; and a single overmold at least partially encapsulating a distal portion of the pin, the plurality of proximal connector assembly rings and a portion of the second conductor.

[0045] Example 2. The connector of Example 1, wherein the connector further comprises an anti-rotation feature having a non-circular cross-sectional shape, and wherein the single overmold encapsulates the anti-rotation feature.

[0046] Example 3. The connector of Example 2, wherein the anti -rotation feature is formed on the pin.

[0047] Example 4. The connector of any one or more of Examples 1 to 3, wherein the connector further comprises a distal connector assembly ring, wherein a proximal portion of the second conductor extends through the distal connector assembly ring to the proximal connector assembly rings, wherein the first conductor extends through the distal connector assembly ring, and wherein the single overmold at least partially encapsulates the distal connector assembly ring.

[0048] Example 5. The connector of any one or more of Examples 1 to 4, wherein centerless grinding is performed on the single overmold.

[0049] Example 6. The connector of any one or more of Examples 1 to 5 wherein the connector is a DF4 connector. [0050] Example 7. The connector of any one or more of Examples 1 to 6, wherein the first conductor comprises a cable.

[0051] Example 8. The connector of any one or more of Examples 1 to 7, wherein the second conductor comprises a coiled conductor.

[0052] Example 9. An implantable medical device lead comprising: a lead body comprising: a plurality of electrodes including a fist electrode and a second electrode positioned at a distal portion of the lead body; a first conductor extending along at least a portion of the lead body and electrically connected to the first electrode; and a second conductor extending over at least a portion of the cable and electrically connected to the second electrode, wherein the coiled conductor is electrically insulated from the cable; and a connector at a proximal end of the lead body, the connector comprising: a pin, wherein the first conductor is electrically connected to the pin; a plurality of proximal connector assembly rings, wherein the first conductor extends through the plurality of proximal connector assembly rings; one or more tabs, wherein each tab of the one or more tabs is connected to a respective one or more rings of the plurality of proximal connector assembly rings, wherein the second conductor is electrically coupled to the one or more tabs; and a single overmold encapsulating a distal portion of the pin, the plurality of proximal connector assembly rings and a portion of the second conductor.

[0053] Example 10. The implantable medical device lead of Example 9, wherein the connector further comprises an anti-rotation feature having a cross section in the shape of a square, and wherein the single overmold encapsulates the anti-rotation feature.

[0054] Example 11. The implantable medical device lead of Example 10, wherein the anti-rotation feature is formed on the pin.

[0055] Example 12. The implantable medical device lead of any one or more of

Examples 9 to 11, wherein the connector further comprises a distal assembly ring, wherein a proximal portion of the coiled conductor extends through the distal assembly ring to the proximal assembly ring, wherein the cable extends through the distal assembly ring, and wherein the single overmold encapsulates the distal assembly ring.

[0056] Example 13. The implantable medical device lead of any one or more of

Examples 9 to 12, wherein centerless grinding is performed on the single overmold.

[0057] Example 14. The implantable medical device lead of any one or more of

Examples 9 to 13, wherein the connector is a DF4 connector. [0058] Example 15. The implantable medical device lead of any one or more of Examples 9 to 14, wherein the first conductor comprises a cable.

[0059] Example 16. The implantable medical device lead of any one or more of

Examples 9 to 15, wherein the second conductor comprises a coiled conductor.

[0060] Example 17. The implantable medical device lead of any one or more of

Examples 9 to 16, wherein the pin, the first conductor, and the first electrode are configured to transfer cardiac pacing from an implantable medical device to a patient. [0061] Example 18. The implantable medical device lead of any one or more of Examples 9 to 16, wherein the first electrode, the first conductor, and the pin are configured to transfer cardiac signals from a patient to an implantable medical device. [0062] Example 19. The implantable medical device lead of any one or more of Examples 9 to 16, wherein the second electrode, the second conductor, and the one or more proximal connector rings are configured to transfer cardiac signals from a patient to an implantable medical device.

[0063] Example 20. The implantable medical device lead of any one or more of Examples 9 to 16, wherein the one or more proximal connector rings, the second conductor, and the second electrode are configured to transfer an antitachyarrhythmia shock from an implantable medical device to a patient.

[0064] Example 21. A method of manufacturing a connector of a lead system for an implantable medical device, the method comprising: extending a first conductor through a plurality of proximal connector assembly rings, wherein each tab of one or more tabs is electrically connected to a respective one or more of the plurality of proximal connector assembly rings; electrically connecting a second conductor to the one or more tabs, wherein the second conductor is connected or connectable to a second electrode of the lead system; electrically connecting a pin to a first conductor, the first conductor connected or connectable to a first electrode of the lead system; and encapsulating at least a portion of a distal portion of the pin, the plurality of proximal assembly rings and the coiled conductor with a single overmold.

[0065] Example 22. The method of Example 21, further comprising forming an anti-rotation feature of the connector having a non-circular cross-sectional shape, and wherein the single overmold encapsulates the anti-rotation feature. [0066] Example 23. The method of Example 22, wherein forming the antirotation feature comprises forming the anti-rotation feature on the pin.

[0067] Example 24. The method of any one or more of Examples 21 to 23, further comprising: extending a proximal portion of the second conductor through a distal connector assembly ring to the proximal connector assembly ring; extending the first conductor through the distal connector assembly ring; and encapsulating at least a portion of the distal assembly ring with the single overmold.

[0068] Example 25. The method of any one or more of Examples 21 to 24, further comprising performing centerless grinding on the single overmold.

[0069] Example 26. The method of any of any one or more of Examples 21 to

25, wherein the connector is a DF4 connector.

[0070] Example 27. The method of any one or more of Examples 21 to 26, wherein the first conductor comprises a cable.

[0071] Example 28. The method of any one or more of Examples 21 to 27, wherein the second conductor comprises a coiled conductor.

Claims

WHAT IS CLAIMED IS:

1. A connector of a lead system for an implantable medical device, the connector comprising: a pin, wherein a first conductor that is electrically connected to a first one or more electrodes of the lead system is electrically connected to the pin; a plurality of proximal connector assembly rings, wherein the first conductor extends through the plurality of proximal connector assembly rings; one or more tabs, wherein each tab of the one or more tabs is connected to a respective one or more rings of the plurality of proximal assembly rings, wherein a second conductor that is electrically coupled to a second one or more electrodes of the lead system is electrically coupled to the one or more tabs; and a single overmold at least partially encapsulating a distal portion of the pin, the plurality of proximal connector assembly rings and a portion of the second conductor.

2. The connector of claim 1, wherein the connector further comprises an antirotation feature having a non-circular cross-sectional shape, and wherein the single overmold encapsulates the anti-rotation feature.

3. The connector of claim 2, wherein the anti-rotation feature is formed on the pin.

4. The connector of any of claims 1-3, wherein the connector further comprises a distal connector assembly ring, wherein a proximal portion of the second conductor extends through the distal connector assembly ring to the proximal connector assembly rings, wherein the first conductor extends through the distal connector assembly ring, and wherein the single overmold at least partially encapsulates the distal connector assembly ring.

5. The connector of any of claims 1-4, wherein the single overmold is formed by centerless grinding.

6. The connector of any of claims 1-5, wherein the connector is a DF4 connector.

7. The connector of any of claims 1-6, wherein the first conductor comprises a cable.

8. The connector of any of claims 1-7, wherein the second conductor comprises a coiled conductor.

9. The connector of claim 8, wherein the second conductor is coiled around the cable.

10. The connector of claim 8 or claim 9, wherein the coiled conductor is electrically insulated from the cable

11. The connector of any of claims 1-10, wherein the first electrode and the second electrode are positioned at a distal portion of the lead body.

12. A method of manufacturing a connector of a lead system for an implantable medical device, the method comprising: extending a first conductor through a plurality of proximal connector assembly rings, wherein each tab of one or more tabs is electrically connected to a respective one or more of the plurality of proximal connector assembly rings; electrically connecting a second conductor to the one or more tabs, wherein the second conductor is connected or connectable to a second electrode of the lead system; electrically connecting a pin to a first conductor, the first conductor connected or connectable to a first electrode of the lead system; and encapsulating at least a portion of a distal portion of the pin, the plurality of proximal assembly rings and the coiled conductor with a single overmold.

13. The method of claim 12, further comprising forming an anti-rotation feature of the connector having a non-circular cross-sectional shape, and wherein the single overmold encapsulates the anti-rotation feature.

14. The method of claim 12 or claim 13, further comprising performing centerless grinding on the single overmold.

15. The method of any of claims 12-14, further comprising: extending a proximal portion of the second conductor through a distal connector assembly ring to the proximal connector assembly ring; extending the first conductor through the distal connector assembly ring; and encapsulating at least a portion of the distal assembly ring with the single overmold.