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WO2025187276A1 - Display apparatus and electronic device - Google Patents

Display apparatus and electronic device

Info

Publication number
WO2025187276A1
WO2025187276A1 PCT/JP2025/003126 JP2025003126W WO2025187276A1 WO 2025187276 A1 WO2025187276 A1 WO 2025187276A1 JP 2025003126 W JP2025003126 W JP 2025003126W WO 2025187276 A1 WO2025187276 A1 WO 2025187276A1
Authority
WO
WIPO (PCT)
Prior art keywords
power supply
transistor
display device
circuit
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/003126
Other languages
French (fr)
Japanese (ja)
Other versions
WO2025187276A8 (en
Inventor
成賛 星本
聖二 鷺直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Semiconductor Solutions Corp
Original Assignee
Sony Semiconductor Solutions Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Semiconductor Solutions Corp filed Critical Sony Semiconductor Solutions Corp
Publication of WO2025187276A1 publication Critical patent/WO2025187276A1/en
Publication of WO2025187276A8 publication Critical patent/WO2025187276A8/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3206Monitoring of events, devices or parameters that trigger a change in power modality
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234Power saving characterised by the action undertaken
    • G06F1/3287Power saving characterised by the action undertaken by switching off individual functional units in the computer system
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/04Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions
    • G09G3/06Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions using controlled light sources
    • G09G3/12Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions using controlled light sources using electroluminescent elements
    • G09G3/14Semiconductor devices, e.g. diodes
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G09G3/3233Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/123Connection of the pixel electrodes to the thin film transistors [TFT]

Definitions

  • This technology relates to display devices and electronic devices.
  • Patent Document 1 discloses a technology that reduces the power consumption of a display IF circuit by configuring the registers of the display IF circuit with non-volatile memory and reducing the number of register accesses after restarting the power supply.
  • Patent Document 2 discloses a technology that performs waveform adjustment processing on the gate waveform when the power is turned on and does not perform waveform adjustment processing when the power is turned off, thereby suppressing the voltage applied to pixels when the power is off.
  • Patent Document 3 discloses a technology related to microprocessor power gating, which involves inserting a circuit between blocks to fix the input of the circuit when power is cut off, thereby maintaining the output even when power is stopped, thereby reducing power consumption while suppressing malfunctions and increases in area.
  • JP 2023-153768 A Japanese Patent Application Laid-Open No. 2015-197484 JP 2012-094171 A
  • One of the objectives of this technology is to provide, for example, display devices and electronic devices that can suppress leakage power.
  • This technology is, for example, It has a plurality of circuit blocks that operate during display operation,
  • the display device includes a first circuit block whose power supply is controlled to be turned off during standby.
  • This technology is, for example, An electronic device having a display device according to the present technology.
  • FIG. 1 is a diagram showing a schematic configuration example of a display device to which the present technology can be applied.
  • FIG. 2 is a diagram showing an example of the configuration of main power supply paths in a display device according to a comparative example.
  • FIG. 3 is a diagram showing an example of the configuration of main power supply paths of the display device according to the first embodiment.
  • FIG. 4 is a diagram illustrating an example of the configuration of a switch circuit.
  • FIG. 5 is a diagram showing another example of the configuration of the switch circuit.
  • FIG. 6 is a diagram illustrating the layout of the switch circuit.
  • FIG. 7 is a diagram illustrating an example of the configuration of the control circuit.
  • FIG. 8 is a diagram showing another example of the configuration of the control circuit.
  • FIG. 1 is a diagram showing a schematic configuration example of a display device to which the present technology can be applied.
  • FIG. 2 is a diagram showing an example of the configuration of main power supply paths in a display device according to a comparative example.
  • FIG. 9 is a diagram illustrating an example of the configuration of a display device according to the second embodiment.
  • FIG. 10 is a diagram illustrating the layout of the switch circuit according to the third embodiment.
  • FIG. 11 is a diagram illustrating an example of the configuration of a display device according to the fourth embodiment.
  • FIG. 12 is a diagram illustrating an example of the configuration of a display device according to the fifth embodiment.
  • FIG. 13A shows a plan view of a pixel
  • FIG. 13B shows an example of a configuration for dissipating leakage current between pixels.
  • FIG. 14 is a diagram illustrating an example of the configuration of a display device according to the sixth embodiment.
  • FIG. 15 is a conceptual diagram illustrating an example of the configuration of a substrate to which the present technology can be applied.
  • FIG. 15 is a conceptual diagram illustrating an example of the configuration of a substrate to which the present technology can be applied.
  • FIG. 16 is a diagram illustrating an example of the configuration of a display device according to the seventh embodiment.
  • FIG. 17 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 18 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 19 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 20 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 21 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 22 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 23 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 24 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 24 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 25 is a diagram showing an example of the configuration of a pixel circuit.
  • FIG. 26 is a perspective view showing an example of the appearance of a head-mounted display.
  • FIG. 27 is a perspective view showing an example of the appearance of another head-mounted display.
  • 28A and 28B are front and rear views showing an example of the external appearance of a digital still camera.
  • FIG. 29 is a perspective view showing an example of the appearance of a television device.
  • FIG. 30 is a perspective view showing an example of the appearance of a smartphone.
  • 31A and 31B are diagrams illustrating an example of the interior of a vehicle viewed from the rear to the front of the vehicle, respectively, and are diagrams illustrating an example of the interior of a vehicle viewed from diagonally rear to diagonally front of the vehicle.
  • FIG. 1 is a diagram showing a schematic configuration example of a display device to which the present technology can be applied.
  • the display device 1 shown in FIG. 1 is a device that displays images and the like using light-emitting elements.
  • the light-emitting elements are, for example, LEDs (Light Emitting Diodes). LEDs include LEDs used in micro LED displays and OLEDs (Organic Light Emitting Diodes) used in organic EL (Electro-Luminescence) displays.
  • the display device 1 will be described as employing LEDs as light-emitting elements.
  • the display device 1 is, for example, a display mounted in an electronic device. Specific examples of electronic devices to which the display device 1 can be applied will be described later.
  • the display device 1 has the following component circuit blocks: an input/output unit (IO) 2, a gamma processing unit 3, a power supply processing unit 4, an interface unit (IF) 5, a timing controller (TCON) 6, a pixel unit 7, a horizontal logic unit (HLOGIC) 8, a horizontal analog unit (HANALOG) 9, a vertical logic unit (VLOGIC) 10, and a vertical analog unit (VANALOG) 11.
  • the display device 1 has these circuit blocks mounted on a substrate, for example.
  • the substrate may include a semiconductor substrate such as silicon.
  • the power supply processing unit 4 is a circuit that outputs power to drive the pixel unit 7 and is configured to include, for example, an LDO (Low Drop Out) regulator.
  • the power supply processing unit 4 is connected to the input/output unit 2 and pixel unit 7, and converts the supply power input via the input/output unit 2 into a power supply voltage to drive the pixel unit 7 and supplies it to the pixel unit 7.
  • the interface unit 5 is connected to the input/output unit 2 and timing controller 6.
  • the interface unit 5 is an interface for inputting and outputting image data, etc. to and from the outside via the input/output unit 2.
  • a high-speed interface standard such as MIPI (Mobile Industry Processor Interface) can be used as this interface.
  • the timing controller 6 controls the operation timing of each circuit block.
  • the timing controller 6 is connected to the interface unit 5, horizontal logic unit 8, horizontal analog unit 9, vertical logic unit 10, and vertical analog unit 11.
  • the timing controller 6 outputs image data input via the input/output unit 2 and interface unit 5 to the horizontal logic unit 8 based on a clock signal supplied from an oscillator unit (not shown in Figure 1) or the like, and outputs signals as needed to the horizontal logic unit 8 and horizontal analog unit 9.
  • the timing controller 6 also outputs signals as needed to the vertical logic unit 10 and vertical analog unit 11 based on the above-mentioned clock signals.
  • the pixel unit 7 has a plurality of pixels (pixel circuits) arranged in a matrix of m rows and n columns (m and n are natural numbers).
  • the pixel unit 7 is provided with pixels that represent the three primary colors of R (red), G (green), and B (blue), for example, and expresses a color image.
  • R red
  • G green
  • B blue
  • the color expression of the image is not limited to this, and it may also be configured to express, for example, a monochrome (black and white) image. Specific examples of the pixel configuration and operation will be described later.
  • the pixel section 7 also has signal lines that extend along the column direction of the pixel array, and control lines that extend along the row direction of the pixel array.
  • a signal line is provided for each pixel column, and a control line is provided for each pixel row.
  • the signal lines are each connected to the output terminal of the corresponding column of the horizontal analog section 9 and to the pixel group of the corresponding column.
  • the control lines are each connected to the output terminal of the corresponding row of the vertical analog section 11 and to the pixel group of the corresponding row.
  • the horizontal logic unit 8 and horizontal analog unit 9 make up the horizontal driver.
  • the horizontal driver can be configured, for example, as a RAMPDAC circuit that uses a ramp waveform analog signal to generate the pixel signals to be output to the signal lines.
  • the horizontal driver is not limited to this, and can also be configured, for example, as a voltage follower circuit that has a voltage follower circuit in the output section to the signal line.
  • the horizontal logic unit 8 distributes the image data input from the timing controller 6 to each signal line.
  • the horizontal analog unit 9 converts the distributed image data into gamma-corrected pixel signals and outputs them to the corresponding signal lines of the pixel unit 7.
  • the vertical logic unit 10 and vertical analog unit 11 make up the vertical driver.
  • the vertical driver can be configured, for example, as a shift register-type circuit having a shift register circuit in the signal input section.
  • the vertical driver is not limited to this and may also be configured, for example, as an address decoder-type circuit having an address decoder in the signal input section.
  • the vertical logic unit 10 generates shift signals for each pixel row from signals input from the timing controller 6.
  • the vertical analog unit 11 uses these shift signals to generate control signals that drive control lines and output them to the pixel unit 7.
  • This technology relates to power supply control of circuit blocks that make up the display device 1, such as the timing controller 6, horizontal logic unit 8, and vertical logic unit 10.
  • Fig. 2 is a diagram showing an example of the configuration of main power supply paths of a display device 1A in the comparative example.
  • the display device 1A in Fig. 2 includes the above-described input/output unit 2, gamma processing unit 3, power supply processing unit 4, interface unit 5, timing controller 6, pixel unit 7, horizontal logic unit 8, horizontal analog unit 9, vertical logic unit 10, and vertical analog unit 11.
  • the display device 1A has an oscillator 12.
  • the oscillator 12 is composed of, for example, an oscillator, and generates the clock signal described above.
  • the oscillator 12 is connected to the timing controller 6, and the clock signal generated by the oscillator 12 is output to the timing controller 6.
  • the timing controller 6 has a CLK+EN control unit 211, a timing generator 22, a signal processing unit 23, and a register 24.
  • the circuit blocks of the CLK+EN control unit 211, the timing generator 22, the signal processing unit 23, and the register 24 are each connected to the gamma processing unit 3, the power supply processing unit 4, the interface unit 5, the horizontal logic unit 8, the horizontal analog unit 9, the vertical logic unit 10, and the vertical analog unit 11.
  • the horizontal logic unit 8 is connected to the horizontal analog unit 9, and the vertical logic unit 10 is connected to the vertical analog unit 11.
  • the CLK+EN control unit 211 controls the clock signals and various enable signals used appropriately in each circuit block.
  • the CLK+EN control unit 211 outputs the clock signal output by the oscillator unit 12 to a predetermined circuit block.
  • the CLK+EN control unit 211 also generates various enable signals and outputs them to a predetermined circuit block.
  • the timing generator 22 controls the operation timing of each circuit block.
  • the timing generator 22 generates signals such as start pulses and outputs them to a predetermined circuit block.
  • the signal processing unit 23 performs signal processing on image data input via the interface unit 5 and outputs the processed image data to the horizontal logic unit 8. This signal processing includes, for example, resolution conversion processing and interpolation of color information for each pixel.
  • the register 24 inputs and outputs data to the signal processing unit 23 via buffers 30 and 31, and stores information processed by the signal processing unit 23.
  • the display device 1A has power supply lines VDD1IF and VSSIF, power supply lines VDD1 and VSSD, power supply lines VDD2 and VSSA, and power supply lines VCCP and Vcath.
  • Power supply lines VDD1IF and VSSIF are connected to the interface unit 5 and apply a predetermined power supply voltage to the interface unit 5.
  • Power supply lines VDD1 and VSSD are connected to the interface unit 5, oscillator unit 12, CLK+EN control unit 211, timing generator 22, signal processing unit 23, register 24, horizontal logic unit 8, and vertical logic unit 10, and apply a predetermined power supply voltage to each connection block.
  • Power supply lines VDD2 and VSSA are connected to the oscillator unit 12, horizontal analog unit 9, vertical analog unit 11, gamma processing unit 3, and power supply processing unit 4, and apply a predetermined power supply voltage to each connection block.
  • the power supply line VCCP and power supply line Vcath are connected to the pixel unit 7 and apply a predetermined power supply voltage to the pixel unit 7.
  • the display device 1A is capable of standby operation, which pauses display by the pixel unit 7.
  • This standby state caused by standby operation is a state in which the pixel unit 7 is on standby so that it can immediately display.
  • power supply voltage is constantly applied to each circuit block, so even during standby, standby current occurs in each circuit block due to leakage current.
  • the arrows in Figure 2 represent the main standby current generated during standby. As semiconductor process generations advance, this standby current becomes more pronounced. As semiconductor processes become more miniaturized, an increase in onboard logic can be expected, but this increase in leakage current also leads to an increase in standby power. Increased standby power has a significant impact on battery life, particularly in mobile products. Therefore, the following embodiments aim to suppress this leakage power.
  • First embodiment 3 is a diagram showing an example of the configuration of main power supply paths of the display device 1 according to the first embodiment.
  • the display device 1 shown in FIG. 3 includes an input/output unit 2 (not shown in FIG. 3), a gamma processing unit 3, a power supply processing unit 4, an interface unit 5, a timing controller 6, a pixel unit 7, a horizontal logic unit 8, a horizontal analog unit 9, a vertical logic unit 10, a vertical analog unit 11, and an oscillator unit 12.
  • the oscillator unit 12 is connected to the timing controller 6, and a clock signal generated by the oscillator unit 12 is output to the timing controller 6.
  • the timing controller 6 has a CLK+EN control unit 21, a timing generator 22, a signal processing unit 23, and a register 24.
  • the circuit blocks of the CLK+EN control unit 21, timing generator 22, signal processing unit 23 (IN), and register 24 are connected to the interface unit 5, horizontal analog unit 9, vertical analog unit 11, gamma processing unit 3, and power supply processing unit 4, respectively.
  • the signal processing unit 23 (OUT) is connected to the register 24 via the control circuit 50a, and the register 24 is connected to the signal processing unit 23 via a buffer 31.
  • the signal processing unit 23 (OUT) is connected to the horizontal logic unit 8 (IN) and the vertical logic unit 10 (IN), and is also connected to the horizontal analog unit 9 via a control circuit 50b.
  • the horizontal logic unit 8 (OUT) is connected to the horizontal analog unit 9 via a control circuit 50c, and the vertical logic unit 10 (OUT) is connected to the vertical analog unit 11 via a control circuit 50d.
  • the control circuits 50a to 50d will be described later.
  • the CLK+EN control unit 21 controls the clock signals and various enable signals used appropriately in each circuit block.
  • the CLK+EN control unit 21 outputs the clock signal output by the oscillator unit 12 to a specified circuit block.
  • the CLK+EN control unit 21 also generates various enable signals and outputs them to a specified circuit block. Note that the CLK+EN control unit 21 differs from the CLK+EN control unit 211 of the comparative example in that it generates and outputs signals used for the power supply control described above.
  • the timing generator 22 controls the operation timing of each circuit block.
  • the timing generator 22 generates signals such as start pulses and outputs them to specified circuit blocks.
  • the signal processing unit 23 performs signal processing on image data input via the interface unit 5, and outputs the processed image data to the horizontal logic unit 8.
  • the register 24 inputs and outputs signals to and from the signal processing unit 23, and stores information processed by the signal processing unit 23.
  • the power supply lines VDD1 and VSSD are connected to the interface unit 5, oscillator unit 12, CLK+EN control unit 21, timing generator 22, signal processing unit 23, register 24, horizontal logic unit 8, and vertical logic unit 10, and apply a predetermined power supply voltage (specifically, the power supply voltage for digital circuits) to each connection block.
  • a predetermined power supply voltage specifically, the power supply voltage for digital circuits
  • the power supply line VDD1 is connected to the signal processing unit 23 via the switch circuit 40a, and the power supply voltage is applied to the signal processing unit 23 when the switch circuit 40a is on (conductive state), but not when the switch circuit 40a is off (non-conductive state).
  • the power supply line VDD1 is connected to the horizontal logic unit 8 via the switch circuit 40b, and the power supply voltage is applied to the horizontal logic unit 8 when the switch circuit 40b is on (conductive state), but not when the switch circuit 40b is off (non-conductive state). Furthermore, the power supply line VDD1 is connected to the vertical logic unit 10 via a switch circuit 40c. When the switch circuit 40c is on (conductive), a power supply voltage is applied to the vertical logic unit 10, and when the switch circuit 40c is off (non-conductive), no power supply voltage is applied. The potential of the power supply line VDD1 is higher than that of the power supply line VSSD.
  • the display device 1 is capable of standby operation, and during standby, the gamma processing unit 3, power supply processing unit 4, pixel unit 7, horizontal logic unit 8, horizontal analog unit 9, vertical logic unit 10, vertical analog unit 11, and signal processing unit 23 of the timing controller 6 are circuit blocks that do not need to be operated.
  • the signal processing unit 23, horizontal logic unit 8, and vertical logic unit 10 are circuit blocks in the logic area that contain logic circuits, memory, etc., have large circuit scales, and have high leakage currents. Therefore, in this embodiment, the signal processing unit 23, horizontal logic unit 8, and vertical logic unit 10 are circuit blocks that are subject to power control (first circuit blocks), and power control is performed by the above-mentioned switch circuits 40a to 40c. Note that, as with the comparative example, all circuit blocks other than the signal processing unit 23, horizontal logic unit 8, and vertical logic unit 10 are always powered on (second circuit blocks).
  • the CLK+EN control unit 21 functions as a switch control unit that controls the switch circuit 40a.
  • the CLK+EN control unit 21 generates an XNOSIG_STATE signal as an enable signal to control each switch 41(1) to 41(n) and outputs it to the control terminal of each switch 41(1) to 41(n).
  • the CLK+EN control unit 21 sets the XNOSIG_STATE signal to, for example, a high level to turn on each switch 41(1) to 41(n).
  • the CLK+EN control unit 21 sets the XNOSIG_STATE signal to, for example, a low level to turn off each switch 41(1) to 41(n).
  • Whether or not the device is in standby mode can be determined, for example, by an external input signal (e.g., a standby instruction signal) via the input/output unit 2 and the interface unit 5.
  • the CLK+EN control unit 21 not only controls the switch circuit 40a depending on whether it is in standby mode, but also whether the circuit block being powered on needs to be operated.
  • the CLK+EN control unit 21 turns on each of the switches 41(1) to 41(n) by setting the XNOSIG_STATE signal, for example, to high level.
  • the CLK+EN control unit 21 turns off each of the switches 41(1) to 41(n) by setting the XNOSIG_STATE signal, for example, to low level.
  • the XNOSIG_STATE signal output from the CLK+EN control unit 21 is buffered and delayed by buffers 42(1) to 42(n) and output sequentially to switches 41(1) to 41(n).
  • switches 41(1) to 41(n) switch their conduction state (on/off state) sequentially in response to the XNOSIG_STATE signal.
  • switches 41(1) to 41(n) can be turned on in stages during startup, thereby suppressing peak current.
  • the order in which the switches are switched is not particularly limited, but, for example, switching from the upstream operating circuit first can be used to ensure smooth startup.
  • the numerical values n (n is a natural number) of switches 41(1) to 41(n) and buffers 42(1) to 42(n), and the delay amounts in each buffer 42(1) to 42(n) are appropriately designed in advance according to the circuit scale of signal processing unit 23.
  • appropriately designed switch circuits 40b and 40c are also used.
  • the CLK+EN control unit 21 generates the XNOSIG_STATE signal as an enable signal to control each switch 41(1) to 41(n) and outputs it to the control terminal of each switch 41(1) to 41(n).
  • the CLK+EN control unit 21 is also connected to the clock input terminals of each flip-flop 43(1) to 43(n) and outputs a clock signal to each clock input terminal.
  • the XNOSIG_STATE signal output from the CLK+EN control unit 21 is synchronized with the clock signal by the flip-flops 43(1) to 43(n) and output sequentially to the switches 41(1) to 41(n).
  • the switches 41(1) to 41(n) are switched between conductive states (on/off states) sequentially in response to the XNOSIG_STATE signal.
  • the processing delay of flip-flops 43(1) to 43(n) can be used to control switches 41(1) to 41(n) in a time-division manner.
  • the delay can be managed using a clock signal, and peak current can be suppressed by gradually turning on switches 41(1) to 41(n) when signal processing unit 23 is started.
  • FIG. 6 is a diagram illustrating the layout of switch circuits 40a to 40c. As shown in FIG. 6, switch circuits 40a to 40c are provided between the power supply line VDD1 and a circuit block (referred to as a power cutoff circuit block in the figure) that is a power supply control target. This creates a virtual VDD between the power supply line VDD1 and each of the power supply control target circuit blocks.
  • a circuit block referred to as a power cutoff circuit block in the figure
  • switch circuits 40a to 40c are header-type switches capable of cutting off connection to the power supply line VDD1 on the power supply side (high-potential side) of the power supply path, they are compatible with a twin-well structure of a P-type semiconductor substrate (PSUB: P-Substrate) as shown in the figure. Therefore, in the case of these switch circuits 40a to 40c, for example, manufacturing efficiency can be improved by using a PSUB twin-well structure for the substrate and configuring switch circuits 40a to 40c with P-type transistors, as shown in the figure.
  • PSUB P-Substrate
  • Example of control circuit configuration 7 is a diagram showing an example of the configuration of the control circuit 50a described above.
  • the power gating compatible logic 23a in FIG. 7 is a circuit of the signal processing unit 23 whose power supply is controlled by the switch circuit 40a, and the always-on logic 24a is a circuit of the register 24 to which power is always supplied. Note that while the control circuit 50a provided between the signal processing unit 23 and the register 24 will be described here, the control circuits 50b to 50d have the same configuration.
  • power gating-enabled logic 23a may output an undefined signal to always-on logic 24a when the power is off, and always-on logic 24a may be affected by this undefined signal.
  • Control circuit 50a uses a logic gate to avoid this undefined output.
  • control circuit 50a can be configured, for example, by providing an AND element 51 between the wiring connecting the power gating-enabled logic 23a (OUT) and the always-on logic 24a.
  • one input of the AND element 51 is connected to the XNOSIG_STATE signal output terminal of the CLK+EN control unit 21, and the other input is connected to the power gating-enabled logic 23a (OUT).
  • the output of the AND element 51 is also connected to the always-on logic 24a.
  • the control circuit 50a provides a flip-flop 52 between the wiring connecting the power gating-enabled logic 23a (OUT) and the always-on logic 24a.
  • the input of the flip-flop 52 is connected to the power gating-enabled logic 23a (OUT), and the output is connected to the always-on logic 24a.
  • the input of the flip-flop 53 is connected to the XNOSIG_STATE signal output terminal of the CLK+EN control unit 21, and the output is connected to the clock input terminal of the flip-flop 52.
  • the clock input terminal of the flip-flop 53 is then connected to the clock signal output terminal of the CLK+EN control unit 21.
  • the switch circuit 40a when the switch circuit 40a is on, the signal from the power gating-enabled logic 23a (OUT) is output to the always-on logic 24a, but is not output when the switch circuit 40a is off. This prevents undefined output propagation when the power is off.
  • Using flip-flops 52 as the control circuits 50a-50d makes it possible to reduce the influence of coupling between other circuits, such as the power supply/GND (low-potential power supply) and other signals. Note that if the logic gates described above are used as the control circuits 50a-50d, the circuit area can be made smaller than when flip-flops 52 are used.
  • Second embodiment In the first embodiment described above, a configuration was described in which leakage current is suppressed by cutting off the power supply voltage to logic with large gate sizes during standby. However, if necessary, it is also possible to cut off the power supply voltage to analog blocks during standby or when operation is not required, thereby suppressing leakage current.
  • FIG. 9 is a diagram showing an example configuration of a display device 1 according to a second embodiment of the present technology.
  • the gamma processing unit 3, power supply processing unit 4, horizontal analog unit 9, and vertical analog unit 11 are blocks that do not need to operate in standby mode. Therefore, in this embodiment, the following configuration is used to perform power control on the gamma processing unit 3, power supply processing unit 4, horizontal analog unit 9, and vertical analog unit 11 as blocks subject to power control.
  • power supply line VDD2 and power supply line VSSA are connected to the oscillator unit 12, horizontal analog unit 9, vertical analog unit 11, gamma processing unit 3, and power supply processing unit 4, and apply a predetermined power supply voltage (specifically, the power supply voltage for the analog circuits) to each connection block.
  • power supply line VDD2 is connected to the horizontal analog unit 9 via switch circuit 40d, and the power supply voltage is applied to the horizontal analog unit 9 when switch circuit 40d is on (conductive state), and the power supply voltage is not applied when switch circuit 40d is off (non-conductive state).
  • power supply line VDD2 is connected to the vertical analog unit 11 via switch circuit 40e, and the power supply voltage is applied to the vertical analog unit 11 when switch circuit 40e is on (conductive state), and the power supply voltage is not applied when switch circuit 40e is off (non-conductive state). Furthermore, power supply line VDD2 is connected to gamma processing unit 3 via switch circuit 40f. When switch circuit 40f is on (conductive), power supply voltage is applied to gamma processing unit 3, and when switch circuit 40f is off (non-conductive), power supply voltage is not applied. Furthermore, power supply line VDD2 is connected to power supply processing unit 4 via switch circuit 40g.
  • switch circuit 40g When switch circuit 40g is on (conductive), power supply voltage is applied to power supply processing unit 4, and when switch circuit 40g is off (non-conductive), power supply voltage is not applied.
  • Switch circuits 40d to 40g are similar to switch circuits 40a to 40c described above.
  • the switch circuits 40a to 40c are arranged on the power supply line VDD1 side, that is, on the power supply side, but the switch circuits 40a to 40c may be arranged on the power supply line VSSD side, that is, on the GND side.
  • FIG 10 is a diagram illustrating the layout of switch circuits 40a to 40c in this embodiment.
  • switch circuits 40a to 40c may be provided between the power supply control target circuit block (represented as a power supply cutoff circuit block in the figure) and the power supply line VSSD.
  • the power supply line VSSD may be connected to the signal processing unit 23 via switch circuit 40a, to the horizontal logic unit 8 via switch circuit 40b, and to the vertical logic unit 10 via switch circuit 40c. This creates a virtual VSS between the power supply line VSSD and each power supply control target circuit block.
  • the switch circuits 40a to 40c are provided in the internal power supply path of the display device 1 to cut off the power supplied to each power supply control target block during standby. However, this power cut-off may also be performed on the external power supply side of the display device 1.
  • FIG. 11 shows an example configuration of a display device 1 according to a fourth embodiment of the present technology. Note that FIG. 11 describes the power supply circuits for the power gating-enabled logic 23a of the signal processing unit 23 and the always-on logic 24a of the register 24, but the other circuit blocks have similar configurations.
  • the external power supply (external VDD1 power supply) 60 is an external power supply for the display device 1 connected to the display device 1 via the input/output unit 2 (not shown in Figure 11).
  • the external power supply 60 supplies power via the always-on power line VDD1 to the always-on logic 24a of the register 24 via the input/output unit 2.
  • the external power supply 60 is connected to the CLK+EN control unit 21 via the input/output unit 2, and the CLK+EN control unit 21 outputs an XNOSIG_STATE signal to the external power supply 60. This signal output can be performed, for example, by providing a control terminal in the input/output unit 2 that controls the external power supply 60.
  • the external power supply 60 supplies power to the power gating-compatible logic 23a of the signal processing unit 23 via the power supply control power line VDD1.
  • the XNOSIG_STATE signal is at a high level, power is supplied to the power gating compatible logic 23a (power on), and when it is at a low level, power to the power gating compatible logic 23a is cut off (power off).
  • power supply control is performed by an external power supply of the display device 1, but power supply control may also be performed by an internal power supply of the display device 1.
  • FIG. 12 shows an example configuration of a display device 1 according to a fifth embodiment of the present technology. Note that FIG. 12 describes the power supply circuits for the power gating-enabled logic 23a of the signal processing unit 23 and the always-on logic 24a of the register 24, but the other circuit blocks have similar configurations.
  • the internal power supply (internally generated VDD1 power supply) 70 is a chip internal power supply (power supply block) provided inside the display device 1.
  • the internal power supply 70 supplies power to the always-on logic 24a of the register 24 via the always-on power line VDD1.
  • the internal power supply 70 is connected to the CLK+EN control unit 21, which outputs an XNOSIG_STATE signal to the internal power supply 70.
  • the internal power supply 70 supplies power to the power gating-compatible logic 23a of the signal processing unit 23 via the power control power line VDD1.
  • the power gating-compatible logic 23a power on
  • power to the power gating-compatible logic 23a is cut off (power off).
  • Fig. 13 is a diagram for explaining a configuration for dissipating leakage current between pixels.
  • Fig. 13A shows a plan view of a pixel
  • Fig. 13B is a diagram showing an example of a configuration for dissipating leakage current between pixels.
  • R denotes a pixel from which red wavelength light is obtained
  • G denotes a pixel from which green wavelength light is obtained
  • B denotes a pixel from which blue wavelength light is obtained.
  • An insulating film 80 is provided between each pixel.
  • the insulating film 80 is made of an insulator such as silicon oxide (SiOx).
  • FIG. 14 is a diagram showing an example configuration of a display device 1 according to a sixth embodiment of the present technology.
  • a switch circuit 81 is provided between the insulating film 80 between each pixel in the pixel section 7 and the power line VSIO, forming a virtual VISO.
  • the switch circuit 81 is capable of cutting off the power supply in response to an ISOEN signal serving as an enable signal.
  • the switch circuit 81 corresponds to the switch circuits 40a to 40c in the first embodiment, and the ISOEN signal corresponds to the XNOSIG_STATE signal in the first embodiment.
  • the power supply is controlled by a circuit block that applies an insulation voltage to the insulating film 80 that insulates the pixels, acting as the first circuit block.
  • the switch circuit 81 is controlled to be on when contrast needs to be increased (for example, when light emission is not desired, such as in black display) in response to the ISOEN signal, and is controlled to be off during standby or when increased contrast is not required.
  • This display device 1 can also reduce standby power consumption.
  • FIG 15 is a conceptual diagram illustrating an example of the configuration of a substrate to which this technology can be applied.
  • Substrate P shown in the lower part of Figure 15, has a structure in which an oxide semiconductor is layered on a silicon (Si) substrate.
  • the silicon substrate contains, for example, amorphous silicon or polycrystalline silicon.
  • the oxide semiconductor contains, for example, indium gallium zinc oxide (IGZO), and forms a TFT (Thin Film Transistor) layer.
  • IGZO indium gallium zinc oxide
  • TFT Thin Film Transistor
  • Pixel transistors are formed in the pixel region of the oxide semiconductor layer.
  • the area of the oxide semiconductor layer other than the pixel region is a dummy region in which dummy patterns are formed.
  • High-voltage transistors are formed in the pixel region of the silicon substrate, and low-voltage transistors are formed in the area other than the pixel region as a logic region.
  • the logic region is, for example, an area where logic blocks driven by a power supply voltage for digital circuits are arranged. This technology can also be applied, for example, to a display device having a substrate P with such a structure.
  • Example of pixel circuit configuration The following describes an example of the configuration of the pixel (pixel circuit) included in the pixel section 7 of the display device 1. Note that the following example of the configuration is merely an example and does not exclude other configurations.
  • Pixel PIX has a capacitor C01, transistors MN02 and MN03, and a light-emitting element EL.
  • Transistors MN02 and MN03 are N-type MOSFETs (Metal Oxide Semiconductor Field Effect Transistors).
  • the gate of transistor MN02 is connected to a control line WSL, its drain is connected to a signal line SGL, and its source is connected to the gate of transistor MN03 and capacitor C01.
  • One end of capacitor C01 is connected to the source of transistor MN02 and the gate of transistor MN03, and the other end is connected to the source of transistor MN03 and the anode of light-emitting element EL.
  • the gate of transistor MN03 is connected to the source of transistor MN02 and one end of capacitor C01, its drain is connected to the power supply line VCCP, and its source is connected to the other end of capacitor C01 and the anode of light-emitting element EL.
  • the anode of the light-emitting element EL is connected to the source of the transistor MN03 and the other end of the capacitor C01, and the cathode is connected to the power supply line Vcath.
  • the voltage of the power supply line VCCP is appropriately switched between a first voltage and a second voltage lower than the first voltage.
  • pixel PIX when transistor MN02 is turned on, the voltage across capacitor C01 is set based on the pixel signal supplied from signal line SGL.
  • transistor MN03 passes a current corresponding to the voltage across capacitor C01 through light-emitting element EL.
  • the light-emitting element EL emits light based on the current supplied from transistor MN03.
  • pixel PIX emits light at a brightness corresponding to the pixel signal. Note that during the period when the voltage of power supply line VCCP is the second voltage, the light-emitting element EL is extinguished.
  • (Second configuration example) 18 shows another example of the configuration of pixel PIX.
  • This pixel PIX has capacitors C11 and C12, transistors MP12 to MP15, and a light-emitting element EL.
  • Transistors MP12 to MP15 are P-type MOSFETs.
  • the gate of transistor MP12 is connected to a control line WSL, its source is connected to a signal line SGL, and its drain is connected to the gate of transistor MP14 and capacitor C12.
  • One end of capacitor C11 is connected to a power supply line VCCP, and the other end is connected to capacitor C12, the drain of transistor MP13, and the source of transistor MP14.
  • capacitor C12 is connected to the other end of capacitor C11, the drain of transistor MP13, and the source of transistor MP14, and the other end is connected to the drain of transistor MP12 and the gate of transistor MP14.
  • the gate of transistor MP13 is connected to the control line DSL, the source is connected to the power supply line VCCP, and the drain is connected to the source of transistor MP14, the other end of capacitor C11, and one end of capacitor C12.
  • the gate of transistor MP14 is connected to the drain of transistor MP12 and the other end of capacitor C12, the source is connected to the drain of transistor MP13, the other end of capacitor C11, and one end of capacitor C12, and the drain is connected to the anode of the light-emitting element EL and the source of transistor MP15.
  • the gate of transistor MP15 is connected to the control line AZSL, the source is connected to the drain of transistor MP14 and the anode of the light-emitting element EL, and the drain is connected to the power supply line VSS.
  • the anode of the light-emitting element EL is connected to the drain of transistor MP14 and the source of transistor MP15, and the cathode is connected to the power supply line Vcath.
  • Transistor MP13 when transistor MP12 is turned on, the voltage across capacitor C12 is set based on the pixel signal supplied from signal line SGL.
  • Transistor MP13 turns on and off based on the signal on control line DSL. While transistor MP13 is on, transistor MP14 passes a current to the light-emitting element EL that corresponds to the voltage across capacitor C12. The light-emitting element EL emits light based on the current supplied from transistor MP14. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal.
  • Transistor MP15 turns on and off based on the signal on control line AZSL. While transistor MP15 is on, the anode voltage of the light-emitting element EL is initialized by being set to the voltage of the power supply line VSS.
  • transistors MP12 to MP15 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MP12 and MP15 may be a transistor using an oxide semiconductor.
  • LTPS low temperature polycrystalline silicon
  • FIG. 19 shows another example of the configuration of pixel PIX.
  • This pixel PIX has a capacitor C21, transistors MN22 to MN25, and a light-emitting element EL.
  • Transistors MN22 to MN25 are N-type MOSFETs.
  • the gate of transistor MN22 is connected to a control line WSL, the drain is connected to a signal line SGL, and the source is connected to the gate of transistor MN24 and capacitor C21.
  • One end of capacitor C21 is connected to the source of transistor MN22 and the gate of transistor MN24, and the other end is connected to the source of transistor MN24, the drain of transistor MN25, and the anode of light-emitting element EL.
  • the gate of transistor MN23 is connected to a control line DSL, the drain is connected to a power supply line VCCP, and the source is connected to the drain of transistor MN24.
  • the gate of transistor MN24 is connected to the source of transistor MN22 and one end of capacitor C21, the drain is connected to the source of transistor MN23, the source is connected to the other end of capacitor C21, the drain of transistor MN25, and the anode of light-emitting element EL.
  • the gate of transistor MN25 is connected to control line AZSL, the drain is connected to the source of transistor MN24, the other end of capacitor C21, and the anode of light-emitting element EL, and the source is connected to power supply line VSS.
  • the anode of light-emitting element EL is connected to the source of transistor MN24, the drain of transistor MN25, and the other end of capacitor C21, and the cathode is connected to power supply line Vcath.
  • Transistor MN23 turns on and off based on the signal on control line DSL. While transistor MN23 is on, transistor MN24 passes a current to light-emitting element EL that corresponds to the voltage across capacitor C21. The light-emitting element EL emits light based on the current supplied from transistor MN24. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal.
  • Transistor MN25 turns on and off based on the signal on control line AZSL. While transistor MN25 is on, the anode voltage of light-emitting element EL is initialized by being set to the voltage of power supply line VSS.
  • transistors MN22 to MN25 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MN22 and MN25 may be a transistor using an oxide semiconductor.
  • LTPS low temperature polycrystalline silicon
  • FIG. 20 shows another example of the configuration of pixel PIX.
  • This pixel PIX has a capacitor C31, transistors MP32 to MP36, and a light-emitting element EL.
  • Transistors MP32 to MP36 are P-type MOSFETs.
  • the gate of transistor MP32 is connected to a control line WSL, its source is connected to a signal line SGL, and its drain is connected to the gate of transistor MP33, the drain of transistor MP34, and capacitor C31.
  • One end of capacitor C31 is connected to a power supply line VCCP, and the other end is connected to the drain of transistor MP32, the gate of transistor MP33, and the drain of transistor MP34.
  • the gate of transistor MP33 is connected to the drain of transistor MP32, the drain of transistor MP34, and the other end of capacitor C31, its source is connected to the power supply line VCCP, and its drain is connected to the sources of transistor MP34 and transistor MP35.
  • the gate of transistor MP34 is connected to control line AZSL1, its source is connected to the drain of transistor MP33 and the source of transistor MP35, and its drain is connected to the drain of transistor MP32, the gate of transistor MP33, and the other end of capacitor C31.
  • the gate of transistor MP35 is connected to control line DSL, its source is connected to the drain of transistor MP33 and the source of transistor MP34, and its drain is connected to the source of transistor MP36 and the anode of light-emitting element EL.
  • the gate of transistor MP36 is connected to control line AZSL2, its source is connected to the drain of transistor MP35 and the anode of light-emitting element EL, and its drain is connected to power supply line VSS.
  • the anode of light-emitting element EL is connected to the drain of transistor MP35 and the source of transistor MP36, and its cathode is connected to power supply line Vcath.
  • Transistor MP35 turns on and off based on the signal on control line DSL. While transistor MP35 is on, transistor MP33 passes a current corresponding to the voltage across capacitor C31 through light-emitting element EL. The light-emitting element EL emits light based on the current supplied from transistor MP33. In this way, pixel PIX emits light at a brightness corresponding to the pixel signal.
  • Transistor MP34 turns on and off based on the signal on control line AZSL1. While transistor MP34 is on, the drain and gate of transistor MP33 are connected to each other.
  • Transistor MP36 turns on and off based on the signal on control line AZSL2. While transistor MP36 is on, the anode voltage of light-emitting element EL is initialized by being set to the voltage of power supply line VSS.
  • transistors MP32 to MP36 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MP32, MP34, and MP36 may be a transistor using an oxide semiconductor.
  • LTPS low temperature polycrystalline silicon
  • Pixel PIX has a capacitor C41, transistors MP42 to MP46, and a light-emitting element EL.
  • Transistors MP42 to MP46 are P-type MOSFETs.
  • the gate of transistor MP42 is connected to control line WSL1, its source is connected to signal line SGL2, and its drain is connected to the gate of transistor MP43 and capacitor C41.
  • One end of capacitor C41 is connected to power supply line VCCP, and the other end is connected to the drain of transistor MP42 and the gate of transistor MP43.
  • the gate of transistor MP43 is connected to the drain of transistor MP42 and the other end of capacitor C41, its source is connected to power supply line VCCP, and its drain is connected to the sources of transistors MP44 and MP45.
  • the gate of transistor MP44 is connected to control line AZSL1, its source is connected to the drain of transistor MP43 and the source of transistor MP45, and its drain is connected to signal line SGL2.
  • the gate of transistor MP45 is connected to control line DSL, its source is connected to the drain of transistor MP43 and the source of transistor MP44, and its drain is connected to the source of transistor MP46 and the anode of light-emitting element EL.
  • the gate of transistor MP46 is connected to control line AZSL2, its source is connected to the drain of transistor MP45 and the anode of light-emitting element EL, and its drain is connected to power supply line VSS.
  • the anode of light-emitting element EL is connected to the drain of transistor MP45 and the source of transistor MP46, and its cathode is connected to power supply line Vcath.
  • Transistor MP45 turns on and off based on the signal on control line DSL. While transistor MP45 is on, transistor MP43 passes a current to the light-emitting element EL that corresponds to the voltage across capacitor C41. The light-emitting element EL emits light based on the current supplied from transistor MP43. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal. Transistor MP44 turns on and off based on the signal on control line AZSL1.
  • transistor MP44 While transistor MP44 is on, the drain of transistor MP43 and signal line SGL2 are connected to each other. Transistor MP46 turns on and off based on the signal on control line AZSL2. While transistor MP46 is on, the anode voltage of the light-emitting element EL is initialized by being set to the voltage of the power supply line VSS.
  • transistors MP42 to MP46 and MP49 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MP42, MP46 and MP49 may be a transistor using an oxide semiconductor.
  • LTPS low temperature polycrystalline silicon
  • (Sixth Configuration Example) 22 shows another example of the configuration of the pixel PIX.
  • a plurality of pixels PIX are arranged in a matrix in a display area 100, and the display area 100 is provided between a first control unit 91 and a second control unit 92.
  • the second control unit 92 has a transmission gate TG72, a transistor MP73, and a capacitor C82.
  • the transistor MP73 is a P-type MOSFET.
  • the input terminal of the transmission gate TG72 is connected to the other end of the signal line 93a, and the output terminal is connected to the drain of the transistor MP73 and one end of the capacitor C82.
  • the gate of the transistor MP73 is connected to the control line REFL, the source is connected to the power supply line Vref, and the drain is connected to the output terminal of the transmission gate TG72 and one end of the capacitor C82.
  • One end of the capacitor C82 is connected to the output terminal of the transmission gate TG72 and the drain of the transistor MP73, and the other end is connected to one end of the signal line 93b.
  • Pixel PIX has a capacitor C132, transistors MP121 to MP125, and a light-emitting element EL.
  • Transistors MP121 to MP125 are P-type MOSFETs.
  • the gate of transistor MP122 is connected to control line WSL, its source is connected to signal line 93b, and its drain is connected to the gate of transistor MP121 and capacitor C132.
  • One end of capacitor C132 is connected to power supply line Vel, and the other end is connected to the drain of transistor MP122 and the gate of transistor MP121.
  • the gate of transistor MP121 is connected to the drain of transistor MP122 and the other end of capacitor C132, its source is connected to power supply line Vel, and its drain is connected to the sources of transistors MP123 and MP124.
  • the gate of transistor MP123 is connected to control line AZSL, its source is connected to the drain of transistor MP121 and the source of transistor MP124, and its drain is connected to signal line 93b.
  • the gate of transistor MP124 is connected to control line DSL, its source is connected to the drain of transistor MP121 and the source of transistor MP123, and its drain is connected to the drain of transistor MP125 and the anode of light-emitting element EL.
  • the gate of transistor MP125 is connected to control line AZSL, its source is connected to power supply line Vorst, and its drain is connected to the drain of transistor MP124 and the anode of light-emitting element EL.
  • the anode of light-emitting element EL is connected to the drains of transistor MP124 and transistor MP125, and its cathode is connected to power supply line Vcath.
  • Transistor MP124 turns on and off based on the signal on control line DSL. While transistor MP124 is on, transistor MP121 passes a current to light-emitting element EL that corresponds to the voltage across capacitor C132. The light-emitting element EL emits light based on the current supplied from transistor MP121. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal.
  • Transistors MP123 and MP125 turn on and off based on the signal on control line AZSL.
  • transistor MP123 While transistor MP123 is on, the drain of transistor MP121 and the source of transistor MP124 are connected to signal line 93b.
  • the anode voltage of light-emitting element EL is initialized by being set to the voltage of power supply line Vorst.
  • transistor MP50 turns on and off based on the signal on control line INIL
  • transistor MP51 turns on and off based on the signal on control line ELL
  • transistor MP73 turns on and off based on the signal on control line REFL.
  • signal line 93b is set to the voltage of power supply line Vini
  • transistor MP51 when transistor MP51 is in the ON state, signal line 93b is set to the voltage of power supply line Vel.
  • transistor MP73 When transistor MP73 is in the ON state, one end of capacitor C82 is initialized by being set to the voltage of power supply line Vref.
  • transistors MP121 to MP125, MP50, and MP51 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MP122 and MP125 may be a transistor using an oxide semiconductor.
  • LTPS low temperature polycrystalline silicon
  • FIG. 23 shows another example of the configuration of pixel PIX.
  • This pixel PIX has a capacitor C51, transistors MP52 to MP60, and a light-emitting element EL.
  • Transistors MP52 to MP60 are P-type MOSFETs.
  • the gate of transistor MP52 is connected to a control line WSL, its source is connected to a signal line SGL, and its drain is connected to the drain of transistor MP53 and the source of transistor MP54.
  • the gate of transistor MP53 is connected to a control line DSL, its source is connected to a power supply line VCCP, and its drain is connected to the drain of transistor MP52 and the source of transistor MP54.
  • Transistor MP56 has a gate connected to control line AZSL1, a source connected to the drain of transistor MP55, and a drain connected to power supply line VSS.
  • Transistor MP57 has a gate connected to control line WSL, a drain connected to the gate of transistor MP54, the source of transistor MP55, and the other end of capacitor C51, and a source connected to the drain of transistor MP58.
  • the gate of transistor MP58 is connected to the control line WSL, the drain is connected to the source of transistor MP57, and the source is connected to the drain of transistor MP54 and the source of transistor MP59.
  • the gate of transistor MP59 is connected to the control line DSL, the source is connected to the drain of transistor MP54 and the source of transistor MP58, and the drain is connected to the source of transistor MP60 and the anode of the light-emitting element EL.
  • the gate of transistor MP60 is connected to the control line AZSL2, the source is connected to the drain of transistor MP59 and the anode of the light-emitting element EL, and the drain is connected to the power supply line VSS.
  • the anode of the light-emitting element EL is connected to the drain of transistor MP59 and the source of transistor MP60, and the cathode is connected to the power supply line Vcath.
  • transistors MP52, MP54, MP58, and MP57 are turned on, and the voltage across capacitor C51 is set based on the pixel signal supplied from signal line SGL.
  • Transistors MP53 and MP59 are turned on and off based on the signal on control line DSL. While transistors MP53 and MP59 are on, transistor MP54 passes a current corresponding to the voltage across capacitor C51 through light-emitting element EL. The light-emitting element EL emits light based on the current supplied from transistor MP54. In this way, pixel PIX emits light at a brightness corresponding to the pixel signal.
  • Transistors MP55 and MP56 are turned on and off based on the signal on control line AZSL1.
  • transistor MP55 and MP56 While transistors MP55 and MP56 are on, the gate voltage of transistor MP54 is initialized by being set to the voltage of power supply line VSS. Transistor MP60 is turned on and off based on the signal on control line AZSL2. While transistor MP60 is in the on state, the anode voltage of the light-emitting element EL is initialized by being set to the voltage of the power supply line VSS.
  • (Eighth Configuration Example) 24 shows another example of the configuration of the pixel PIX.
  • the signal on the control line WSNL and the signal on the control line WSPL are mutually inverted signals.
  • Pixel PIX has capacitors C61 and C62, transistors MN63, MP64, MN65 to MN67, and a light-emitting element EL.
  • Transistors MN63, MN65 to MN67 are N-type MOSFETs
  • transistor MP64 is a P-type MOSFET.
  • the gate of transistor MN63 is connected to control line WSNL, the drain is connected to signal line SGL and the source of transistor MP64, and the source is connected to the drain of transistor MP64, capacitors C61 and C62, and the gate of transistor MN65.
  • the gate of transistor MP64 is connected to control line WSPL, the source is connected to signal line SGL and the drain of transistor MN63, and the drain is connected to the source of transistor MN63, capacitors C61 and C62, and the gate of transistor MN65.
  • the capacitor C61 is configured, for example, using a MOM (Metal Oxide Metal) capacitor, and one end is connected to the source of the transistor MN63, the drain of the transistor MP64, the capacitor C62, and the gate of the transistor MN65, and the other end is connected to the power supply line VSS2.
  • the capacitor C61 may be configured, for example, using a MOS capacitor or a MIM (Metal Insulator Metal) capacitor.
  • the capacitor C62 is configured, for example, using a MOS capacitor, and one end is connected to the source of the transistor MN63, the drain of the transistor MP64, one end of the capacitor C61, and the gate of the transistor MN65, and the other end is connected to the power supply line VSS2.
  • the capacitor C62 may be configured, for example, using a MOM capacitor or a MIM capacitor.
  • the other end of the capacitor C62 may be connected to the power supply line VSS3 (not shown).
  • the gate of transistor MN65 is connected to the source of transistor MN63, the drain of transistor MP64, and one end of capacitors C61 and C62, its drain is connected to the power supply line VCCP, and its source is connected to the drains of transistors MN66 and MN67.
  • the gate of transistor MN66 is connected to control line AZL, its drain is connected to the source of transistor MN65 and the drain of transistor MN67, and its source is connected to power supply line VSS1.
  • the gate of transistor MN67 is connected to control line DSL, its drain is connected to the source of transistor MN65 and the drain of transistor MN66, and its source is connected to the anode of light-emitting element EL.
  • the anode of light-emitting element EL is connected to the source of transistor MN67, and its cathode is connected to the power supply line Vcath. Note that transistor MN67 and control line DSL may be omitted, and the source of transistor MN65 may be connected to the drain of transistor MN66 and the anode of light-emitting element EL.
  • Transistor MN67 turns on and off based on the signal on control line DSL. While transistor MN67 is on, transistor MN65 passes a current to light-emitting element EL that corresponds to the voltage across capacitors C61 and C62. The light-emitting element EL emits light based on the current supplied from transistor MP65. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal.
  • Transistor MN66 may be turned on and off based on the signal on control line AZL. Transistor MN66 may also function as a resistor element having a resistance value that corresponds to the signal on control line AZL. In this case, transistors MN65 and MN66 form a so-called source follower circuit.
  • transistors MN63, MP64, MN65 to MN67 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MN63, MP64, and MN66 may be a transistor using an oxide semiconductor.
  • LTPS low temperature polycrystalline silicon
  • (Ninth Configuration Example) 25 shows another example of the configuration of pixel PIX.
  • This pixel PIX has a capacitor C71, transistors MN72 to MN77, and a light-emitting element EL.
  • Transistors MN72 to MN77 are N-type MOSFETs.
  • the gate of transistor MN72 is connected to a control line WSL, the drain is connected to a signal line SGL, and the source is connected to the source of transistor MN74 and the drain of transistor MN75.
  • One end of capacitor C71 is connected to the gate of transistor MN74 and the source of transistor MN76, and the other end is connected to the drain of transistor MN77, the source of transistor MN75, and the anode of light-emitting element EL.
  • the gate of transistor MN73 is connected to control line DSL1, the drain is connected to a power supply line VCCP, and the source is connected to the drain of transistor MN74 and the drain of transistor MN76.
  • the gate of transistor MN74 is connected to the source of transistor MN76 and one end of capacitor C71, the drain is connected to the source of transistor MN73 and the drain of transistor MN76, and the source is connected to the source of transistor MN72 and the drain of transistor MN75.
  • the gate of transistor MN75 is connected to control line DSL2, the drain is connected to the source of transistor MN72 and the source of transistor MN74, and the source is connected to the other end of capacitor C71, the drain of transistor MN77, and the anode of light-emitting element EL.
  • the gate of transistor MN76 is connected to control line AZSL, the drain is connected to the source of transistor MN73 and the drain of transistor MN74, and the source is connected to the gate of transistor MN74 and one end of capacitor C71.
  • the gate of transistor MN77 is connected to control line AZSL, the drain is connected to the other end of capacitor C71, the source of transistor MN75, and the anode of light-emitting element EL, and the source is connected to power supply line VSS.
  • the anode of the light emitting element EL is connected to the source of the transistor MN75, the drain of the transistor MN77 and the other end of the capacitor C71, and the cathode is connected to the power supply line Vcath.
  • transistors MN72, MN74, and MN76 are turned on, and the voltage across capacitor C71 is set based on the pixel signal supplied from signal line SGL.
  • Transistor MN73 turns on and off based on the signal on control line DSL1
  • transistor MN75 turns on and off based on the signal on control line DSL2. While transistors MN73 and MN75 are on, transistor MN74 passes a current to light-emitting element EL that corresponds to the voltage across capacitor C71.
  • Light-emitting element EL emits light based on the current supplied from transistor MN74. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal.
  • Transistor MN77 turns on and off based on the signal on control line AZSL. While transistor MN77 is on, the anode voltage of light-emitting element EL is initialized by being set to the voltage of power supply line VSS.
  • transistors MN72 to MN77 may be transistors using low temperature polycrystalline silicon (LTPS).
  • Transistor MN76 may also be a transistor using an oxide semiconductor.
  • circuit blocks subject to power control and the circuit blocks that are always powered on are merely illustrative and can be changed as appropriate depending on the circuit blocks that make up the display device 1.
  • the constituent units of the circuit blocks can also be changed as appropriate.
  • the XNOSIG_STATE signal and ISOEN signal described above are not limited to one type each, and there can be multiple types. This allows for fine-grained power control, such as power control for logic and analog circuits, for each circuit block, or for each display setting mode. Leakage power can be reduced by turning off the power not only during standby but also when various circuit blocks do not need to operate.
  • this technology can be applied to a variety of displays.
  • This technology can be applied to display panels such as SXRD (Silicon X-tal Reflective Display: registered trademark) used in projectors, etc., and phase modulation panels that use SLM (Spatial Light Modulator) for displaying holograms.
  • This technology can also be applied to panels such as LCOS (Liquid crystal on silicon; LCoS is a trademark) and HTPS (High Temperature Poly-Silicon).
  • LCOS Liquid crystal on silicon
  • LCoS is a trademark
  • HTPS High Temperature Poly-Silicon
  • (Application example 1) 26 shows an example of the appearance of a head-mounted display 110.
  • the head-mounted display 110 has, for example, ear hooks 112 for wearing on the user's head on both sides of a glasses-shaped display unit 111.
  • the techniques according to the above-described embodiments and the like can be applied to such a head-mounted display 110.
  • FIG. 27 shows an example of the appearance of another head-mounted display 120.
  • the head-mounted display 120 is a see-through head-mounted display having a main body 121, an arm 122, and a lens barrel 123.
  • This head-mounted display 120 is attached to eyeglasses 128.
  • the main body 121 has a control board and a display unit for controlling the operation of the head-mounted display 120.
  • the display unit emits image light of a display image.
  • the arm 122 connects the main body 121 to the lens barrel 123 and supports the lens barrel 123.
  • the lens barrel 123 projects the image light supplied from the main body 121 via the arm 122 toward the user's eyes via lenses 129 of the eyeglasses 128.
  • the techniques according to the above-described embodiments and the like can be applied to such a head-mounted display 120.
  • the head-mounted display 120 is a so-called light guide plate type head-mounted display, but is not limited to this and may be, for example, a so-called birdbath type head-mounted display.
  • This birdbath type head-mounted display includes, for example, a beam splitter and a partially transparent mirror.
  • the beam splitter outputs light encoded with image information toward the mirror, and the mirror reflects the light toward the user's eyes.
  • Both the beam splitter and the partially transparent mirror are partially transparent. This allows light from the surrounding environment to reach the user's eyes.
  • FIG. 28A and 28B show an example of the appearance of a digital still camera 130, with FIG. 28A showing a front view and FIG. 28B showing a rear view.
  • This digital still camera 130 is an interchangeable-lens single-lens reflex camera and includes a camera body 131, a photographing lens unit 132, a grip 133, a monitor 134, and an electronic viewfinder 135.
  • the photographing lens unit 132 is an interchangeable lens unit and is provided near the center of the front of the camera body 131.
  • the grip 133 is provided on the left side of the front of the camera body 131, and is held by the photographer.
  • the monitor 134 is provided on the left side of the center of the back of the camera body 131.
  • the electronic viewfinder 135 is provided above the monitor 134 on the back of the camera body 131. By looking through this electronic viewfinder 135, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 132 and determine the composition.
  • the techniques according to the above-described embodiments and the like can be applied to the electronic viewfinder 135.
  • (Application Example 4) 29 shows an example of the appearance of a television device 140.
  • the television device 140 has an image display screen unit 141 including a front panel 142 and a filter glass 143.
  • the techniques according to the above-described embodiments and the like can be applied to this image display screen unit 141.
  • the smartphone 150 has a display unit 151 that displays various information and an operation unit 152 that includes buttons and the like that accept operation inputs from a user.
  • the techniques according to the above-described embodiments and the like can be applied to this display unit 151.
  • FIG. 31A and 31B show an example configuration of a vehicle to which the technology of the present disclosure is applied, where FIG. 31A shows an example of the interior of the vehicle as seen from the rear of vehicle 200, and FIG. 31B shows an example of the interior of the vehicle as seen from the left rear of vehicle 200.
  • the vehicle in Figures 31A and 31B has a center display 201, a console display 202, a head-up display 203, a digital rearview mirror 204, a steering wheel display 205, and a rear entertainment display 206.
  • the center display 201 is disposed on the dashboard 261 in a position facing the driver's seat 262 and passenger seat 263. While FIG. 31A shows an example of a horizontally elongated center display 201 extending from the driver's seat 262 side to the passenger seat 263 side, the screen size and location of the center display 201 are not limited to this.
  • the center display 201 is capable of displaying information detected by various sensors. As a specific example, the center display 201 can display images captured by an image sensor, distance images to obstacles in front of and to the sides of the vehicle measured by a ToF sensor, and the body temperature of occupants detected by an infrared sensor.
  • the center display 201 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication/identification-related information, and entertainment-related information.
  • Safety-related information is information based on sensor detection results, such as detection of drowsiness, distraction, tampering by children in the vehicle, whether seat belts are fastened, and whether a passenger has been abandoned.
  • Operation-related information is information about gestures related to passenger operations detected using sensors. Gestures may include operations of various equipment within the vehicle, such as operations of air conditioning equipment, navigation equipment, AV (Audio-Visual) equipment, and lighting equipment.
  • Life logs include life logs of all passengers. For example, life logs include records of the behavior of each passenger. By acquiring and saving life logs, it is possible to determine the condition of passengers at the time of an accident.
  • Health-related information includes the body temperature of passengers detected using a temperature sensor and information about the passenger's health condition estimated based on the detected body temperature. Alternatively, information about the passenger's health condition may be estimated based on the passenger's face captured by an image sensor. Information about the passenger's health condition may also be estimated based on the passenger's responses obtained by conversation with the passenger using an automated voice.
  • Authentication/identification-related information includes information such as the keyless entry function that uses sensors to perform facial recognition, and the function that automatically adjusts seat height and position using facial recognition.
  • Entertainment-related information includes information on AV device operation by occupants detected by sensors, and information on content to be displayed that is appropriate for occupants detected and recognized by sensors.
  • the console display 202 can be used to display life log information, for example.
  • the console display 202 is located near the shift lever 265 on the center console 264 between the driver's seat 262 and the passenger seat 263.
  • the console display 202 can also display information detected by various sensors.
  • the console display 202 may also display an image of the area around the vehicle captured by an image sensor, or an image showing the distance to obstacles around the vehicle.
  • the head-up display 203 is virtually displayed behind the windshield 266 in front of the driver's seat 262.
  • the head-up display 203 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication/identification-related information, and entertainment-related information. Because the head-up display 203 is often virtually positioned in front of the driver's seat 262, it is suitable for displaying information directly related to vehicle operation, such as vehicle speed, remaining fuel, and remaining battery charge.
  • the digital rearview mirror 204 can not only display the view behind the vehicle, but also the status of rear seat passengers, and can therefore be used, for example, to display life log information of rear seat passengers.
  • the steering wheel display 205 is located near the center of the vehicle's steering wheel 267.
  • the steering wheel display 205 can be used to display, for example, at least one of safety-related information, operation-related information, life log, health-related information, authentication/identification-related information, and entertainment-related information.
  • the steering wheel display 205 is located close to the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, and for displaying information related to the operation of AV equipment, air conditioning equipment, etc.
  • the rear entertainment display 206 is attached to the back of the driver's seat 262 and passenger seat 263, and is intended for viewing by rear seat passengers.
  • the rear entertainment display 206 can be used to display, for example, at least one of safety-related information, operation-related information, life logs, health-related information, authentication/identification-related information, and entertainment-related information.
  • the rear entertainment display 206 may, for example, display information relating to the operation of AV equipment or air conditioning equipment, or may display the body temperature of the rear seat passengers measured by a temperature sensor.
  • center display 201 console display 202, head-up display 203, digital rearview mirror 204, steering wheel display 205, and rear entertainment display 206.
  • the present technology can also be configured as follows. (1) It has a plurality of circuit blocks that operate during display operation, The display device, wherein the plurality of circuit blocks includes a first circuit block whose power supply is controlled to be turned off during standby. (2) a switch provided between a power supply line of the power supply and the first circuit block; and a switch control unit that controls the switch to be turned off during the standby state and when the operation of the first circuit block is not required. (3) A plurality of the switches; and a delay circuit that turns on the plurality of switches in a stepwise manner. (4) The display device according to (3), wherein the delay circuit is configured by a buffer. (5) The display device according to (3), wherein the delay circuit is configured by a flip-flop.
  • the plurality of circuit blocks includes a second circuit block that operates during the standby state;
  • the display device according to any one of (1) to (5), further comprising a control circuit in a signal transmission path from the first circuit block to the second circuit block, the control circuit controlling an output signal of the first circuit block during standby.
  • the control circuit is configured by a logic gate.
  • the control circuit is configured by a flip-flop.
  • (9) a power supply path for supplying the power from an external power supply to the first circuit block;
  • the display device according to any one of (1), (6) to (9), wherein the internal power supply is turned off during the standby state and when the operation of the first circuit block is not required.
  • (11) a plurality of pixels each having a light-emitting element;
  • the display device according to any one of (1) to (10), wherein the first circuit block includes a logic unit that drives the pixels, or a signal processing unit that performs signal processing on image data output to the logic unit.
  • (12) The display device according to any one of (2) to (8) and (11), wherein the power supply line is a power supply line on a high potential side in a power supply path of the power supply.
  • the display device according to any one of (2) to (8) and (11), wherein the power supply line is a power supply line on a low potential side in a power supply path of the power supply.
  • the power supply line is a power supply line on a low potential side in a power supply path of the power supply.
  • the first circuit block is a circuit block that applies an insulating voltage to an insulator that insulates the pixels from each other.
  • the switch is formed using an oxide semiconductor transistor.
  • An electronic device having the display device according to any one of (1) to (15).

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Abstract

The purpose of the present invention is to provide a display device and an electronic apparatus that make it possible to suppress leakage power, for example. Provided is a display device having a plurality of circuit blocks that operate at the time of display operation, the plurality of circuit blocks having a first circuit block for which a power supply is controlled to be off at the time of standby. The display device includes, for example, a switch provided between a power supply line of the power supply and the first circuit block, and a control unit for controlling the switch to be off when the standby state and the operation of the first circuit block are unnecessary.

Description

表示装置および電子機器Display devices and electronic devices

 本技術は、表示装置および電子機器に関する。 This technology relates to display devices and electronic devices.

 表示装置の電力削減技術が知られている。例えば、下記の特許文献1には、ディスプレイIF回路のレジスタを不揮発性メモリで構成して電源再起動後のレジスタアクセス回数を減らすことで、ディスプレイIF回路の低消費電力化を図る技術が開示されている。また、特許文献2には、電源オン時にゲート波形の波形調整処理を行い、電源オフ時に波形調整処理を行わないことで、電源オフ時の画素への電圧印加抑制を図る技術について開示されている。 Technologies for reducing power consumption in display devices are known. For example, Patent Document 1 below discloses a technology that reduces the power consumption of a display IF circuit by configuring the registers of the display IF circuit with non-volatile memory and reducing the number of register accesses after restarting the power supply. Furthermore, Patent Document 2 discloses a technology that performs waveform adjustment processing on the gate waveform when the power is turned on and does not perform waveform adjustment processing when the power is turned off, thereby suppressing the voltage applied to pixels when the power is off.

 一方、特許文献3には、マイクロプロセッサのパワーゲーティングに関する技術として、ブロック間に電源遮断時回路の入力を固定する回路を挿入し、電源停止時も出力を保持させることにより、誤動作や面積増加を抑制しつつ消費電力の低減を図る技術について開示されている。 Meanwhile, Patent Document 3 discloses a technology related to microprocessor power gating, which involves inserting a circuit between blocks to fix the input of the circuit when power is cut off, thereby maintaining the output even when power is stopped, thereby reducing power consumption while suppressing malfunctions and increases in area.

特開2023-153768号公報JP 2023-153768 A 特開2015-197484号公報Japanese Patent Application Laid-Open No. 2015-197484 特開2012-094171号公報JP 2012-094171 A

 ところで、半導体のプロセス世代が進むにつれてトランジスタ単体のリーク電流は増大傾向にある。また、半導体プロセスの微細化が進み搭載ロジックが増大すると、その分、リーク電流が増大する。 Incidentally, as semiconductor process generations advance, the leakage current of individual transistors tends to increase. Furthermore, as semiconductor processes become more miniaturized and the amount of logic incorporated increases, the leakage current also increases accordingly.

 本技術は、例えば、リーク電力を抑制することができる表示装置および電子機器を提供することを目的の一つとする。 One of the objectives of this technology is to provide, for example, display devices and electronic devices that can suppress leakage power.

 本技術は、例えば、
 表示動作時に動作する複数の回路ブロックを有し、
 前記複数の回路ブロックは、スタンバイ時に電源がオフに制御される第1の回路ブロックを有する
 表示装置である。
This technology is, for example,
It has a plurality of circuit blocks that operate during display operation,
The display device includes a first circuit block whose power supply is controlled to be turned off during standby.

 本技術は、例えば、
 本技術の表示装置を有する電子機器である。
This technology is, for example,
An electronic device having a display device according to the present technology.

図1は、本技術を適用可能な表示装置の概略構成例を示す図である。FIG. 1 is a diagram showing a schematic configuration example of a display device to which the present technology can be applied. 図2は、比較例における表示装置の主要な電源経路の構成例を示す図である。FIG. 2 is a diagram showing an example of the configuration of main power supply paths in a display device according to a comparative example. 図3は、第1の実施の形態に係る表示装置の主要な電源経路の構成例を示す図である。FIG. 3 is a diagram showing an example of the configuration of main power supply paths of the display device according to the first embodiment. 図4は、スイッチ回路の構成例を示す図である。FIG. 4 is a diagram illustrating an example of the configuration of a switch circuit. 図5は、スイッチ回路の他の構成例を示す図である。FIG. 5 is a diagram showing another example of the configuration of the switch circuit. 図6は、スイッチ回路のレイアウトについて説明する図である。FIG. 6 is a diagram illustrating the layout of the switch circuit. 図7は、制御回路の構成例を示す図である。FIG. 7 is a diagram illustrating an example of the configuration of the control circuit. 図8は、制御回路の他の構成例を示す図である。FIG. 8 is a diagram showing another example of the configuration of the control circuit. 図9は、第2の実施の形態に係る表示装置の構成例を示す図である。FIG. 9 is a diagram illustrating an example of the configuration of a display device according to the second embodiment. 図10は、第3の実施の形態におけるスイッチ回路のレイアウトについて説明する図である。FIG. 10 is a diagram illustrating the layout of the switch circuit according to the third embodiment. 図11は、第4の実施の形態に係る表示装置の構成例を示す図である。FIG. 11 is a diagram illustrating an example of the configuration of a display device according to the fourth embodiment. 図12は、第5の実施の形態に係る表示装置の構成例を示す図である。FIG. 12 is a diagram illustrating an example of the configuration of a display device according to the fifth embodiment. 図13Aは、画素の平面図を示し、図13Bは、画素間のリーク電流を逃がす構成例を示す図である。FIG. 13A shows a plan view of a pixel, and FIG. 13B shows an example of a configuration for dissipating leakage current between pixels. 図14は、第6の実施の形態に係る表示装置の構成例を示す図である。FIG. 14 is a diagram illustrating an example of the configuration of a display device according to the sixth embodiment. 図15は、本技術を適用可能な基板の構成例について説明する概念図である。FIG. 15 is a conceptual diagram illustrating an example of the configuration of a substrate to which the present technology can be applied. 図16は、第7の実施の形態に係る表示装置の構成例を示す図である。FIG. 16 is a diagram illustrating an example of the configuration of a display device according to the seventh embodiment. 図17は、画素回路の一構成例を示す図である。FIG. 17 is a diagram showing an example of the configuration of a pixel circuit. 図18は、画素回路の一構成例を示す図である。FIG. 18 is a diagram showing an example of the configuration of a pixel circuit. 図19は、画素回路の一構成例を示す図である。FIG. 19 is a diagram showing an example of the configuration of a pixel circuit. 図20は、画素回路の一構成例を示す図である。FIG. 20 is a diagram showing an example of the configuration of a pixel circuit. 図21は、画素回路の一構成例を示す図である。FIG. 21 is a diagram showing an example of the configuration of a pixel circuit. 図22は、画素回路の一構成例を示す図である。FIG. 22 is a diagram showing an example of the configuration of a pixel circuit. 図23は、画素回路の一構成例を示す図である。FIG. 23 is a diagram showing an example of the configuration of a pixel circuit. 図24は、画素回路の一構成例を示す図である。FIG. 24 is a diagram showing an example of the configuration of a pixel circuit. 図25は、画素回路の一構成例を示す図である。FIG. 25 is a diagram showing an example of the configuration of a pixel circuit. 図26は、ヘッドマウントディスプレイの外観の一例を示す斜視図である。FIG. 26 is a perspective view showing an example of the appearance of a head-mounted display. 図27は、他のヘッドマウントディスプレイの外観の一例を示す斜視図である。FIG. 27 is a perspective view showing an example of the appearance of another head-mounted display. 図28Aは、デジタルスチルカメラの外観の一例を示す正面図である。図28Bは、デジタルスチルカメラの外観の一例を示す背面図である。28A and 28B are front and rear views showing an example of the external appearance of a digital still camera. 図29は、テレビジョン装置の外観の一例を示す斜視図である。FIG. 29 is a perspective view showing an example of the appearance of a television device. 図30は、スマートフォンの外観の一例を示す斜視図である。FIG. 30 is a perspective view showing an example of the appearance of a smartphone. 図31Aは、車両の後方から前方にかけての車両の内部の様子の一例を示す図である。図31Bは、車両の斜め後方から斜め前方にかけての車両の内部の様子の一例を示す図である。31A and 31B are diagrams illustrating an example of the interior of a vehicle viewed from the rear to the front of the vehicle, respectively, and are diagrams illustrating an example of the interior of a vehicle viewed from diagonally rear to diagonally front of the vehicle.

 以下、本技術の実施の形態等について図面を参照しながら説明する。説明は以下の順序で行う。なお、本明細書および図面において、実質的に同一の機能または構成を有するものについては同一の符号を付することにより重複説明を適宜省略する。また、各図面が示す部材の形状、大きさ、位置関係等は、説明内容に応じて誇張表現する場合があり、ハッチングや符号等を省略する場合もある。
<1.本技術の概要>
<2.第1の実施の形態>
<3.第2の実施の形態>
<4.第3の実施の形態>
<5.第4の実施の形態>
<6.第5の実施の形態>
<7.第6の実施の形態>
<8.第7の実施の形態>
<9.画素回路の構成例>
<10.変形例>
<11.適用例>
Hereinafter, embodiments of the present technology will be described with reference to the drawings. The description will be given in the following order. In this specification and the drawings, components having substantially the same functions or configurations are designated by the same reference numerals, and redundant description will be omitted as appropriate. Furthermore, the shapes, sizes, positional relationships, etc. of components shown in each drawing may be exaggerated depending on the content of the description, and hatching, reference numerals, etc. may be omitted.
<1. Overview of this technology>
2. First embodiment
3. Second embodiment
4. Third embodiment
5. Fourth embodiment
6. Fifth embodiment
7. Sixth embodiment
8. Seventh embodiment
9. Example of pixel circuit configuration
10. Modifications
<11. Application Examples>

<1.本技術の概要>
 まず、本技術を適用可能な表示装置の概要について説明する。図1は、本技術を適用可能な表示装置の概略構成例を示す図である。図1に示す表示装置1は、発光素子を用いて画像等を表示する装置である。発光素子は、例えば、LED(Light Emitting Diode)である。LEDは、マイクロLEDディスプレイに用いられるLEDや、有機EL(Electro-Luminescence)ディスプレイに用いられるOLED(Organic Light Emitting Diode)を包含する。以下、表示装置1は、発光素子としてLEDを採用しているものとして説明する。表示装置1は、例えば、電子機器に搭載されるディスプレイである。表示装置1を適用可能な電子機器の具体例については、後ほど説明する。
<1. Overview of this technology>
First, an overview of a display device to which the present technology can be applied will be described. FIG. 1 is a diagram showing a schematic configuration example of a display device to which the present technology can be applied. The display device 1 shown in FIG. 1 is a device that displays images and the like using light-emitting elements. The light-emitting elements are, for example, LEDs (Light Emitting Diodes). LEDs include LEDs used in micro LED displays and OLEDs (Organic Light Emitting Diodes) used in organic EL (Electro-Luminescence) displays. Hereinafter, the display device 1 will be described as employing LEDs as light-emitting elements. The display device 1 is, for example, a display mounted in an electronic device. Specific examples of electronic devices to which the display device 1 can be applied will be described later.

 表示装置1は、構成要素の回路ブロックとして入出力部(IO)2、ガンマ処理部3、電源処理部4、インタフェース部(IF)5、タイミングコントローラ(TCON)6、画素部7、水平ロジック部(HLOGIC)8、水平アナログ部(HANALOG)9、垂直ロジック部(VLOGIC)10および垂直アナログ部(VANALOG)11を有している。表示装置1は、例えば、これらの回路ブロックを基板に搭載する。基板は例えばシリコン等の半導体基板を含むものである。 The display device 1 has the following component circuit blocks: an input/output unit (IO) 2, a gamma processing unit 3, a power supply processing unit 4, an interface unit (IF) 5, a timing controller (TCON) 6, a pixel unit 7, a horizontal logic unit (HLOGIC) 8, a horizontal analog unit (HANALOG) 9, a vertical logic unit (VLOGIC) 10, and a vertical analog unit (VANALOG) 11. The display device 1 has these circuit blocks mounted on a substrate, for example. The substrate may include a semiconductor substrate such as silicon.

 入出力部2は、各種データ等の入出力を行うものであり、例えば、外部接続可能なFPC(Flexible printed circuits)で構成されている。入出力部2は、ガンマ処理部3、電源処理部4およびインタフェース部5と接続されている。ガンマ処理部3は、ガンマ補正処理を行うものである。ガンマ処理部3は、入出力部2および水平アナログ部9と接続されており、入出力部2を介して入力されるガンマ補正用の設定値に基づいてガンマ補正の設定を行い、水平アナログ部9から画素部7に出力される画素信号をガンマ補正されたものとする。 The input/output unit 2 inputs and outputs various types of data, and is composed of, for example, an externally connectable FPC (Flexible Printed Circuits). The input/output unit 2 is connected to the gamma processing unit 3, power supply processing unit 4, and interface unit 5. The gamma processing unit 3 performs gamma correction processing. The gamma processing unit 3 is connected to the input/output unit 2 and horizontal analog unit 9, and sets gamma correction based on the gamma correction setting values input via the input/output unit 2, and gamma-corrects the pixel signals output from the horizontal analog unit 9 to the pixel unit 7.

 電源処理部4は、画素部7の駆動用電源を出力する回路であり、例えば、LDO(Low Drop Out)レギュレータを含んで構成されている。電源処理部4は、入出力部2および画素部7と接続されており、入出力部2を介して入力される供給電源を画素部7の駆動用電源電圧に変換して画素部7に供給する。インタフェース部5は、入出力部2およびタイミングコントローラ6と接続されている。インタフェース部5は、入出力部2を介して外部との間で画像データ等を入出力するためのインタフェースである。このインタフェースとしては、例えば、MIPI(Mobile Industry Processor Interface)等の高速インタフェース規格を採用することができる。 The power supply processing unit 4 is a circuit that outputs power to drive the pixel unit 7 and is configured to include, for example, an LDO (Low Drop Out) regulator. The power supply processing unit 4 is connected to the input/output unit 2 and pixel unit 7, and converts the supply power input via the input/output unit 2 into a power supply voltage to drive the pixel unit 7 and supplies it to the pixel unit 7. The interface unit 5 is connected to the input/output unit 2 and timing controller 6. The interface unit 5 is an interface for inputting and outputting image data, etc. to and from the outside via the input/output unit 2. For example, a high-speed interface standard such as MIPI (Mobile Industry Processor Interface) can be used as this interface.

 タイミングコントローラ6は、各回路ブロックの動作タイミングを制御するものである。タイミングコントローラ6は、インタフェース部5、水平ロジック部8、水平アナログ部9、垂直ロジック部10および垂直アナログ部11と接続されている。タイミングコントローラ6は、入出力部2およびインタフェース部5を介して入力される画像データを、発振部(図1では図示略)などから供給されるクロック信号に基づいて水平ロジック部8に出力するとともに、水平ロジック部8および水平アナログ部9に必要に応じた信号を出力する。また、タイミングコントローラ6は、上述したクロック信号に基づいて垂直ロジック部10および垂直アナログ部11に必要に応じた信号を出力する。 The timing controller 6 controls the operation timing of each circuit block. The timing controller 6 is connected to the interface unit 5, horizontal logic unit 8, horizontal analog unit 9, vertical logic unit 10, and vertical analog unit 11. The timing controller 6 outputs image data input via the input/output unit 2 and interface unit 5 to the horizontal logic unit 8 based on a clock signal supplied from an oscillator unit (not shown in Figure 1) or the like, and outputs signals as needed to the horizontal logic unit 8 and horizontal analog unit 9. The timing controller 6 also outputs signals as needed to the vertical logic unit 10 and vertical analog unit 11 based on the above-mentioned clock signals.

 画素部7は、ここでは図示を省略するが、m行n列(m,nは自然数)のマトリクス状に配置された複数の画素(画素回路)を有している。画素部7には、例えば、R(赤)、G(緑)、B(青)の三原色を表す画素が設けられており、カラー画像を表現する。なお、画像の色表現は、これに限らず、例えば、モノクロ(白黒)画像を表現する構成であってもよい。画素の構成および動作の具体例については後述する。 The pixel unit 7, not shown here, has a plurality of pixels (pixel circuits) arranged in a matrix of m rows and n columns (m and n are natural numbers). The pixel unit 7 is provided with pixels that represent the three primary colors of R (red), G (green), and B (blue), for example, and expresses a color image. However, the color expression of the image is not limited to this, and it may also be configured to express, for example, a monochrome (black and white) image. Specific examples of the pixel configuration and operation will be described later.

 また、画素部7は、この画素配列の列方向に沿って延在する信号線と、画素配列の行方向に沿って延在する制御線とを有している。信号線は画素列毎に設けられており、制御線は画素行毎に設けられている。信号線は、水平アナログ部9の対応列の出力端と、対応列の画素群とにそれぞれ接続されている。制御線は、垂直アナログ部11の対応行の出力端と、対応行の画素群とにそれぞれ接続されている。 The pixel section 7 also has signal lines that extend along the column direction of the pixel array, and control lines that extend along the row direction of the pixel array. A signal line is provided for each pixel column, and a control line is provided for each pixel row. The signal lines are each connected to the output terminal of the corresponding column of the horizontal analog section 9 and to the pixel group of the corresponding column. The control lines are each connected to the output terminal of the corresponding row of the vertical analog section 11 and to the pixel group of the corresponding row.

 水平ロジック部8および水平アナログ部9は水平ドライバを構成する。水平ドライバは、例えば、信号線に出力する画素信号の生成にランプ波形のアナログ信号を用いるRAMPDAC方式の回路で構成することができる。水平ドライバは、これに限らず、例えば、信号線への出力部にボルテージフォロワ回路を有するボルテージフォロワ方式の回路などで構成されていてもよい。水平ロジック部8は、タイミングコントローラ6から入力される画像データを信号線毎に振り分ける。水平アナログ部9は、その振り分けた画像データをガンマ補正された画素信号に変換して画素部7の対応する信号線に出力する。 The horizontal logic unit 8 and horizontal analog unit 9 make up the horizontal driver. The horizontal driver can be configured, for example, as a RAMPDAC circuit that uses a ramp waveform analog signal to generate the pixel signals to be output to the signal lines. The horizontal driver is not limited to this, and can also be configured, for example, as a voltage follower circuit that has a voltage follower circuit in the output section to the signal line. The horizontal logic unit 8 distributes the image data input from the timing controller 6 to each signal line. The horizontal analog unit 9 converts the distributed image data into gamma-corrected pixel signals and outputs them to the corresponding signal lines of the pixel unit 7.

 垂直ロジック部10および垂直アナログ部11は垂直ドライバを構成する。垂直ドライバは、例えば、信号入力部にシフトレジスタ回路を有するシフトレジスタ方式の回路で構成することができる。垂直ドライバは、これに限らず、例えば、信号入力部にアドレスデコーダを有するアドレスデコーダ方式の回路などで構成されていてもよい。垂直ロジック部10は、タイミングコントローラ6から入力される信号から画素行毎のシフト信号を生成する。垂直アナログ部11は、そのシフト信号により、制御線を駆動する制御信号を生成して画素部7に出力する。 The vertical logic unit 10 and vertical analog unit 11 make up the vertical driver. The vertical driver can be configured, for example, as a shift register-type circuit having a shift register circuit in the signal input section. However, the vertical driver is not limited to this and may also be configured, for example, as an address decoder-type circuit having an address decoder in the signal input section. The vertical logic unit 10 generates shift signals for each pixel row from signals input from the timing controller 6. The vertical analog unit 11 uses these shift signals to generate control signals that drive control lines and output them to the pixel unit 7.

 本技術は、例えば、タイミングコントローラ6、水平ロジック部8および垂直ロジック部10などの表示装置1を構成する回路ブロックの電源制御に関わるものである。 This technology relates to power supply control of circuit blocks that make up the display device 1, such as the timing controller 6, horizontal logic unit 8, and vertical logic unit 10.

(比較例の表示装置の構成例)
 本技術の実施の形態に係る表示装置1の電源制御について説明する前に、比較例について説明する。図2は、比較例における表示装置1Aの主要な電源経路の構成例を示す図である。なお、図2中の表示装置1Aは、上述した入出力部2、ガンマ処理部3、電源処理部4、インタフェース部5、タイミングコントローラ6、画素部7、水平ロジック部8、水平アナログ部9、垂直ロジック部10および垂直アナログ部11を有している。
(Configuration example of a display device of a comparative example)
Before describing power supply control of a display device 1 according to an embodiment of the present technology, a comparative example will be described. Fig. 2 is a diagram showing an example of the configuration of main power supply paths of a display device 1A in the comparative example. Note that the display device 1A in Fig. 2 includes the above-described input/output unit 2, gamma processing unit 3, power supply processing unit 4, interface unit 5, timing controller 6, pixel unit 7, horizontal logic unit 8, horizontal analog unit 9, vertical logic unit 10, and vertical analog unit 11.

 表示装置1Aは、発振部12を有する。発振部12は、例えば、Oscillator(オシレータ)で構成され、上述したクロック信号を生成する。発振部12は、タイミングコントローラ6と接続されており、発振部12で生成されたクロック信号は、タイミングコントローラ6に出力される。 The display device 1A has an oscillator 12. The oscillator 12 is composed of, for example, an oscillator, and generates the clock signal described above. The oscillator 12 is connected to the timing controller 6, and the clock signal generated by the oscillator 12 is output to the timing controller 6.

 タイミングコントローラ6は、CLK+EN制御部211、タイミングジェネレータ22、信号処理部23およびレジスタ24を有している。CLK+EN制御部211、タイミングジェネレータ22、信号処理部23、レジスタ24の各回路ブロックは、それぞれガンマ処理部3、電源処理部4、インタフェース部5、水平ロジック部8、水平アナログ部9、垂直ロジック部10および垂直アナログ部11と接続されている。なお、水平ロジック部8は、水平アナログ部9と接続され、垂直ロジック部10は、垂直アナログ部11と接続されている。 The timing controller 6 has a CLK+EN control unit 211, a timing generator 22, a signal processing unit 23, and a register 24. The circuit blocks of the CLK+EN control unit 211, the timing generator 22, the signal processing unit 23, and the register 24 are each connected to the gamma processing unit 3, the power supply processing unit 4, the interface unit 5, the horizontal logic unit 8, the horizontal analog unit 9, the vertical logic unit 10, and the vertical analog unit 11. The horizontal logic unit 8 is connected to the horizontal analog unit 9, and the vertical logic unit 10 is connected to the vertical analog unit 11.

 CLK+EN制御部211は、各回路ブロックで適宜用いられるクロック信号および各種イネーブル信号を制御するものである。CLK+EN制御部211は、発振部12が出力したクロック信号を所定の回路ブロックに出力する。また、CLK+EN制御部211は、各種イネーブル信号を生成して所定の回路ブロックに出力する。タイミングジェネレータ22は、各回路ブロックの動作タイミングを制御するものである。タイミングジェネレータ22は、スタートパルスなどの信号を生成して所定の回路ブロックに出力する。信号処理部23は、インタフェース部5を介して入力される画像データに対して信号処理を施し、信号処理後の画像データを水平ロジック部8に出力する。この信号処理は、例えば、解像度の変換処理、画素毎の色情報の補完処理などである。レジスタ24は、信号処理部23との間でバッファ30,31を介して入出力を行い、信号処理部23での処理情報を記憶する。 The CLK+EN control unit 211 controls the clock signals and various enable signals used appropriately in each circuit block. The CLK+EN control unit 211 outputs the clock signal output by the oscillator unit 12 to a predetermined circuit block. The CLK+EN control unit 211 also generates various enable signals and outputs them to a predetermined circuit block. The timing generator 22 controls the operation timing of each circuit block. The timing generator 22 generates signals such as start pulses and outputs them to a predetermined circuit block. The signal processing unit 23 performs signal processing on image data input via the interface unit 5 and outputs the processed image data to the horizontal logic unit 8. This signal processing includes, for example, resolution conversion processing and interpolation of color information for each pixel. The register 24 inputs and outputs data to the signal processing unit 23 via buffers 30 and 31, and stores information processed by the signal processing unit 23.

 表示装置1Aは、電源線VDD1IFおよび電源線VSSIFと、電源線VDD1および電源線VSSDと、電源線VDD2および電源線VSSAと、電源線VCCPおよび電源線Vcathとを有している。電源線VDD1IFおよび電源線VSSIFは、インタフェース部5に接続され、インタフェース部5に所定の電源電圧を印加する。電源線VDD1および電源線VSSDは、インタフェース部5、発振部12、CLK+EN制御部211、タイミングジェネレータ22、信号処理部23、レジスタ24、水平ロジック部8および垂直ロジック部10に接続され、各接続ブロックに所定の電源電圧を印加する。電源線VDD2および電源線VSSAは、発振部12、水平アナログ部9、垂直アナログ部11、ガンマ処理部3および電源処理部4に接続され、各接続ブロックに所定の電源電圧を印加する。電源線VCCPおよび電源線Vcathは、画素部7に接続され、画素部7に所定の電源電圧を印加する。 The display device 1A has power supply lines VDD1IF and VSSIF, power supply lines VDD1 and VSSD, power supply lines VDD2 and VSSA, and power supply lines VCCP and Vcath. Power supply lines VDD1IF and VSSIF are connected to the interface unit 5 and apply a predetermined power supply voltage to the interface unit 5. Power supply lines VDD1 and VSSD are connected to the interface unit 5, oscillator unit 12, CLK+EN control unit 211, timing generator 22, signal processing unit 23, register 24, horizontal logic unit 8, and vertical logic unit 10, and apply a predetermined power supply voltage to each connection block. Power supply lines VDD2 and VSSA are connected to the oscillator unit 12, horizontal analog unit 9, vertical analog unit 11, gamma processing unit 3, and power supply processing unit 4, and apply a predetermined power supply voltage to each connection block. The power supply line VCCP and power supply line Vcath are connected to the pixel unit 7 and apply a predetermined power supply voltage to the pixel unit 7.

 表示装置1Aは、画素部7による表示を休止するスタンバイ動作に対応している。このスタンバイ動作によるスタンバイ状態は、画素部7による表示を直ちに行えるように待機している状態である。比較例の表示装置1Aでは、各回路ブロックに対して常時電源電圧が印加されているため、スタンバイ時であっても各回路ブロックにリーク電流によるスタンバイ電流が生じる。 The display device 1A is capable of standby operation, which pauses display by the pixel unit 7. This standby state caused by standby operation is a state in which the pixel unit 7 is on standby so that it can immediately display. In the display device 1A of the comparative example, power supply voltage is constantly applied to each circuit block, so even during standby, standby current occurs in each circuit block due to leakage current.

 図2中の矢印は、スタンバイ時に生じる主なスタンバイ電流を表している。半導体のプロセス世代が進むにつれ、このスタンバイ電流は顕著に発生する。半導体プロセスの微細化が進むと、その分、搭載ロジックの増大を見込めるが、このリーク電流の増大の因果関係からスタンバイ電力も増大する。スタンバイ電力の増大は、特に、モバイル製品のバッテリの持ちに大きな影響を与えることになる。そこで、以下の実施の形態では、このリーク電力の抑制を図っている。 The arrows in Figure 2 represent the main standby current generated during standby. As semiconductor process generations advance, this standby current becomes more pronounced. As semiconductor processes become more miniaturized, an increase in onboard logic can be expected, but this increase in leakage current also leads to an increase in standby power. Increased standby power has a significant impact on battery life, particularly in mobile products. Therefore, the following embodiments aim to suppress this leakage power.

<2.第1の実施の形態>
 図3は、第1の実施の形態に係る表示装置1の主要な電源経路の構成例を示す図である。図3に示す表示装置1は、入出力部2(図3では図示を省略)、ガンマ処理部3、電源処理部4、インタフェース部5、タイミングコントローラ6、画素部7、水平ロジック部8、水平アナログ部9、垂直ロジック部10および垂直アナログ部11および発振部12を有する。発振部12は、タイミングコントローラ6と接続されており、発振部12で生成されたクロック信号は、タイミングコントローラ6に出力される。
2. First embodiment
3 is a diagram showing an example of the configuration of main power supply paths of the display device 1 according to the first embodiment. The display device 1 shown in FIG. 3 includes an input/output unit 2 (not shown in FIG. 3), a gamma processing unit 3, a power supply processing unit 4, an interface unit 5, a timing controller 6, a pixel unit 7, a horizontal logic unit 8, a horizontal analog unit 9, a vertical logic unit 10, a vertical analog unit 11, and an oscillator unit 12. The oscillator unit 12 is connected to the timing controller 6, and a clock signal generated by the oscillator unit 12 is output to the timing controller 6.

 タイミングコントローラ6は、CLK+EN制御部21、タイミングジェネレータ22、信号処理部23およびレジスタ24を有している。CLK+EN制御部21、タイミングジェネレータ22、信号処理部23(IN)、レジスタ24の各回路ブロックは、それぞれインタフェース部5、水平アナログ部9、垂直アナログ部11、ガンマ処理部3および電源処理部4と接続されている。また、信号処理部23(OUT)は、制御回路50aを介してレジスタ24と接続され、レジスタ24は、バッファ31を介して信号処理部23と接続されている。 The timing controller 6 has a CLK+EN control unit 21, a timing generator 22, a signal processing unit 23, and a register 24. The circuit blocks of the CLK+EN control unit 21, timing generator 22, signal processing unit 23 (IN), and register 24 are connected to the interface unit 5, horizontal analog unit 9, vertical analog unit 11, gamma processing unit 3, and power supply processing unit 4, respectively. In addition, the signal processing unit 23 (OUT) is connected to the register 24 via the control circuit 50a, and the register 24 is connected to the signal processing unit 23 via a buffer 31.

 信号処理部23(OUT)は、水平ロジック部8(IN)および垂直ロジック部10(IN)とそれぞれ接続されるとともに、制御回路50bを介して水平アナログ部9と接続されている。水平ロジック部8(OUT)は、制御回路50cを介して水平アナログ部9と接続され、垂直ロジック部10(OUT)は、制御回路50dを介して垂直アナログ部11と接続されている。制御回路50a~50dについては後述する。 The signal processing unit 23 (OUT) is connected to the horizontal logic unit 8 (IN) and the vertical logic unit 10 (IN), and is also connected to the horizontal analog unit 9 via a control circuit 50b. The horizontal logic unit 8 (OUT) is connected to the horizontal analog unit 9 via a control circuit 50c, and the vertical logic unit 10 (OUT) is connected to the vertical analog unit 11 via a control circuit 50d. The control circuits 50a to 50d will be described later.

 CLK+EN制御部21は、各回路ブロックで適宜用いられるクロック信号および各種イネーブル信号を制御するものである。CLK+EN制御部21は、発振部12が出力したクロック信号を所定の回路ブロックに出力する。また、CLK+EN制御部21は、各種イネーブル信号を生成して所定の回路ブロックに出力する。なお、CLK+EN制御部21は、上述した電源制御に用いる信号を生成して出力する点において、比較例のCLK+EN制御部211とは相違する。 The CLK+EN control unit 21 controls the clock signals and various enable signals used appropriately in each circuit block. The CLK+EN control unit 21 outputs the clock signal output by the oscillator unit 12 to a specified circuit block. The CLK+EN control unit 21 also generates various enable signals and outputs them to a specified circuit block. Note that the CLK+EN control unit 21 differs from the CLK+EN control unit 211 of the comparative example in that it generates and outputs signals used for the power supply control described above.

 タイミングジェネレータ22は、各回路ブロックの動作タイミングを制御するものである。タイミングジェネレータ22は、スタートパルスなどの信号を生成して所定の回路ブロックに出力する。信号処理部23は、インタフェース部5を介して入力される画像データに対して信号処理を施し、信号処理後の画像データを水平ロジック部8に出力する。レジスタ24は、信号処理部23との間で信号の入出力を行い、信号処理部23での処理情報を記憶する。 The timing generator 22 controls the operation timing of each circuit block. The timing generator 22 generates signals such as start pulses and outputs them to specified circuit blocks. The signal processing unit 23 performs signal processing on image data input via the interface unit 5, and outputs the processed image data to the horizontal logic unit 8. The register 24 inputs and outputs signals to and from the signal processing unit 23, and stores information processed by the signal processing unit 23.

 表示装置1は、電源線VDD1IFおよび電源線VSSIFと、電源線VDD1および電源線VSSDと、電源線VDD2および電源線VSSAと、電源線VCCPおよび電源線Vcathとを有している。電源線VDD1IFおよび電源線VSSIFは、インタフェース部5に接続され、インタフェース部5に所定の電源電圧(具体的には、インタフェース用の電源電圧)を印加する。電源線VDD1IFの電位はVSSIFよりも高電位である。 The display device 1 has power supply lines VDD1IF and VSSIF, power supply lines VDD1 and VSSD, power supply lines VDD2 and VSSA, and power supply lines VCCP and Vcath. Power supply lines VDD1IF and VSSIF are connected to the interface unit 5 and apply a predetermined power supply voltage (specifically, the power supply voltage for the interface) to the interface unit 5. The potential of power supply line VDD1IF is higher than that of VSSIF.

 電源線VDD1および電源線VSSDは、インタフェース部5、発振部12、CLK+EN制御部21、タイミングジェネレータ22、信号処理部23、レジスタ24、水平ロジック部8および垂直ロジック部10に接続され、各接続ブロックに所定の電源電圧(具体的には、デジタル回路用の電源電圧)を印加する。ただし、電源線VDD1はスイッチ回路40aを介して信号処理部23と接続されており、信号処理部23にはスイッチ回路40aがオン(導通状態)である場合に電源電圧が印加され、スイッチ回路40aがオフ(非導通状態)である場合には電源電圧は印加されない。また、電源線VDD1はスイッチ回路40bを介して水平ロジック部8と接続されており、水平ロジック部8にはスイッチ回路40bがオン(導通状態)である場合に電源電圧が印加され、スイッチ回路40bがオフ(非導通状態)である場合には電源電圧は印加されない。さらに、電源線VDD1はスイッチ回路40cを介して垂直ロジック部10と接続されており、垂直ロジック部10にはスイッチ回路40cがオン(導通状態)である場合に電源電圧が印加され、スイッチ回路40cがオフ(非導通状態)である場合には電源電圧は印加されない。なお、電源線VDD1の電位は電源線VSSDよりも高電位である。 The power supply lines VDD1 and VSSD are connected to the interface unit 5, oscillator unit 12, CLK+EN control unit 21, timing generator 22, signal processing unit 23, register 24, horizontal logic unit 8, and vertical logic unit 10, and apply a predetermined power supply voltage (specifically, the power supply voltage for digital circuits) to each connection block. However, the power supply line VDD1 is connected to the signal processing unit 23 via the switch circuit 40a, and the power supply voltage is applied to the signal processing unit 23 when the switch circuit 40a is on (conductive state), but not when the switch circuit 40a is off (non-conductive state). Furthermore, the power supply line VDD1 is connected to the horizontal logic unit 8 via the switch circuit 40b, and the power supply voltage is applied to the horizontal logic unit 8 when the switch circuit 40b is on (conductive state), but not when the switch circuit 40b is off (non-conductive state). Furthermore, the power supply line VDD1 is connected to the vertical logic unit 10 via a switch circuit 40c. When the switch circuit 40c is on (conductive), a power supply voltage is applied to the vertical logic unit 10, and when the switch circuit 40c is off (non-conductive), no power supply voltage is applied. The potential of the power supply line VDD1 is higher than that of the power supply line VSSD.

 電源線VDD2および電源線VSSAは、発振部12、水平アナログ部9、垂直アナログ部11、ガンマ処理部3および電源処理部4に接続され、各接続ブロックに所定の電源電圧(具体的には、アナログ回路用の電源電圧)を印加する。電源線VDD2の電位は電源線VSSAよりも高電位である。電源線VCCPおよび電源線Vcathは、画素部7に接続され、画素部7に所定の電源電圧(具体的には、画素回路用の電源電圧)を印加する。電源線VCCPの電位は電源線Vcathよりも高電位である。 Power supply line VDD2 and power supply line VSSA are connected to the oscillator unit 12, horizontal analog unit 9, vertical analog unit 11, gamma processing unit 3, and power supply processing unit 4, and apply a predetermined power supply voltage (specifically, the power supply voltage for the analog circuits) to each connection block. The potential of power supply line VDD2 is higher than that of power supply line VSSA. Power supply line VCCP and power supply line Vcath are connected to the pixel unit 7, and apply a predetermined power supply voltage (specifically, the power supply voltage for the pixel circuits) to the pixel unit 7. The potential of power supply line VCCP is higher than that of power supply line Vcath.

 表示装置1は、スタンバイ動作に対応しておりスタンバイ時には、ガンマ処理部3、電源処理部4、画素部7、水平ロジック部8、水平アナログ部9、垂直ロジック部10、垂直アナログ部11およびタイミングコントローラ6の信号処理部23は、動作させる必要のない回路ブロックとなっている。その中でも、信号処理部23、水平ロジック部8および垂直ロジック部10は、ロジック回路、メモリなどを有し回路規模が大きくリーク電流が多いロジック領域の回路ブロックである。そこで本実施の形態では、信号処理部23、水平ロジック部8および垂直ロジック部10を電源制御の対象となる回路ブロック(第1の回路ブロック)とし、上述したスイッチ回路40a~40cにより電源制御を行っている。なお、信号処理部23、水平ロジック部8および垂直ロジック部10以外は、比較例と同様に常時電源オンの回路ブロック(第2の回路ブロック)となっている。 The display device 1 is capable of standby operation, and during standby, the gamma processing unit 3, power supply processing unit 4, pixel unit 7, horizontal logic unit 8, horizontal analog unit 9, vertical logic unit 10, vertical analog unit 11, and signal processing unit 23 of the timing controller 6 are circuit blocks that do not need to be operated. Among these, the signal processing unit 23, horizontal logic unit 8, and vertical logic unit 10 are circuit blocks in the logic area that contain logic circuits, memory, etc., have large circuit scales, and have high leakage currents. Therefore, in this embodiment, the signal processing unit 23, horizontal logic unit 8, and vertical logic unit 10 are circuit blocks that are subject to power control (first circuit blocks), and power control is performed by the above-mentioned switch circuits 40a to 40c. Note that, as with the comparative example, all circuit blocks other than the signal processing unit 23, horizontal logic unit 8, and vertical logic unit 10 are always powered on (second circuit blocks).

(スイッチ回路の構成例)
 図4は、スイッチ回路40aの構成例を示す図である。なお、ここでは信号処理部23に接続されるスイッチ回路40aについて説明するが、スイッチ回路40b,40cの構成についても同様である。スイッチ回路40aは、複数のスイッチ41(1)~41(n)と、複数の遅延回路をそれぞれ構成するバッファ42(1)~42(n)とを有している。スイッチ41(1)~41(n)は、例えば、トランジスタである。スイッチ41(1)~41(n)は、それぞれ一端部が電源線VDD1に接続され、他端部が信号処理部23に接続されている。スイッチ41(1)~41(n)の制御用の端子は、それぞれバッファ42(1)~42(n)を介してCLK+EN制御部21に順次接続されている。
(Example of switch circuit configuration)
FIG. 4 is a diagram showing an example of the configuration of the switch circuit 40a. While the switch circuit 40a connected to the signal processing unit 23 will be described here, the configuration of the switch circuits 40b and 40c is similar. The switch circuit 40a includes a plurality of switches 41(1) to 41(n) and buffers 42(1) to 42(n), each of which constitutes a plurality of delay circuits. The switches 41(1) to 41(n) are, for example, transistors. One end of each of the switches 41(1) to 41(n) is connected to the power supply line VDD1, and the other end is connected to the signal processing unit 23. The control terminals of the switches 41(1) to 41(n) are sequentially connected to the CLK+EN control unit 21 via the buffers 42(1) to 42(n), respectively.

 CLK+EN制御部21は、スイッチ回路40aを制御するスイッチ制御部として機能する。CLK+EN制御部21は、各スイッチ41(1)~41(n)を制御するイネーブル信号としてXNOSIG_STATE信号を生成し、各スイッチ41(1)~41(n)の制御用の端子に出力する。CLK+EN制御部21は、スタンバイ状態でない場合にXNOSIG_STATE信号を例えばハイレベルとして各スイッチ41(1)~41(n)をオンに制御する。また、CLK+EN制御部21は、スタンバイ状態である場合にXNOSIG_STATE信号を例えばローレベルとして各スイッチ41(1)~41(n)をオフに制御する。スタンバイ状態であるか否かは、例えば、入出力部2およびインタフェース部5を介した外部入力信号(例えば、スタンバイ指示信号)により判別することができる。 The CLK+EN control unit 21 functions as a switch control unit that controls the switch circuit 40a. The CLK+EN control unit 21 generates an XNOSIG_STATE signal as an enable signal to control each switch 41(1) to 41(n) and outputs it to the control terminal of each switch 41(1) to 41(n). When not in standby mode, the CLK+EN control unit 21 sets the XNOSIG_STATE signal to, for example, a high level to turn on each switch 41(1) to 41(n). When in standby mode, the CLK+EN control unit 21 sets the XNOSIG_STATE signal to, for example, a low level to turn off each switch 41(1) to 41(n). Whether or not the device is in standby mode can be determined, for example, by an external input signal (e.g., a standby instruction signal) via the input/output unit 2 and the interface unit 5.

 CLK+EN制御部21は、スタンバイ状態であるか否かに応じてスイッチ回路40aを制御するだけでなく、電源制御の対象の回路ブロックを動作させる必要があるか否かに応じてスイッチ回路40aを制御する。CLK+EN制御部21は、電源制御の対象の回路ブロックを動作させる必要がある場合にXNOSIG_STATE信号を例えばハイレベルとして各スイッチ41(1)~41(n)をオンに制御する。さらに、CLK+EN制御部21は、電源制御の対象の回路ブロックを動作させる必要がない場合にXNOSIG_STATE信号を例えばローレベルとして各スイッチ41(1)~41(n)をオフに制御する。動作させる必要があるか否かは、例えば、入出力部2およびインタフェース部5を介した外部入力信号(例えば、各種設定モードを表す信号)により判別することができる。例えば、スイッチ回路40a~40cの各々で異なるXNOSIG_STATE信号を用いることで、回路ブロック毎に電源のオンオフ制御を行うことができる。 The CLK+EN control unit 21 not only controls the switch circuit 40a depending on whether it is in standby mode, but also whether the circuit block being powered on needs to be operated. When the circuit block being powered on needs to be operated, the CLK+EN control unit 21 turns on each of the switches 41(1) to 41(n) by setting the XNOSIG_STATE signal, for example, to high level. Furthermore, when the circuit block being powered on does not need to be operated, the CLK+EN control unit 21 turns off each of the switches 41(1) to 41(n) by setting the XNOSIG_STATE signal, for example, to low level. Whether operation is required can be determined, for example, by an external input signal (e.g., a signal indicating various setting modes) via the input/output unit 2 and the interface unit 5. For example, by using a different XNOSIG_STATE signal for each of the switch circuits 40a to 40c, power on/off control can be performed for each circuit block.

 上述したバッファ接続により、CLK+EN制御部21から出力されたXNOSIG_STATE信号は、バッファ42(1)~42(n)でバッファ遅延されて順次スイッチ41(1)~41(n)に出力される。そのため、スイッチ41(1)~41(n)は、XNOSIG_STATE信号に応じて順次導通状態(オンオフ状態)が切り替わる。このように、バッファ42(1)~42(n)のバッファ遅延を使用してスイッチ41(1)~41(n)を時分割で制御することで起動時にスイッチ41(1)~41(n)を段階的にオンさせてピーク電流を抑制することができる。スイッチ切り替えの順序は、特に限定するものではないが、例えば、上流側の作動回路から順に切り替えるようにすることでスムーズに起動させることができる。なお、スイッチ41(1)~41(n)およびバッファ42(1)~42(n)の数値n(nは自然数)、各バッファ42(1)~42(n)における遅延量は、信号処理部23の回路規模などに応じて予め適切に設計されたものである。スイッチ回路40b、スイッチ回路40cについても、同様にそれぞれ適切に設計されたものを用いる。 With the buffer connections described above, the XNOSIG_STATE signal output from the CLK+EN control unit 21 is buffered and delayed by buffers 42(1) to 42(n) and output sequentially to switches 41(1) to 41(n). As a result, switches 41(1) to 41(n) switch their conduction state (on/off state) sequentially in response to the XNOSIG_STATE signal. In this way, by using the buffer delay of buffers 42(1) to 42(n) to control switches 41(1) to 41(n) in a time-division manner, switches 41(1) to 41(n) can be turned on in stages during startup, thereby suppressing peak current. The order in which the switches are switched is not particularly limited, but, for example, switching from the upstream operating circuit first can be used to ensure smooth startup. The numerical values n (n is a natural number) of switches 41(1) to 41(n) and buffers 42(1) to 42(n), and the delay amounts in each buffer 42(1) to 42(n) are appropriately designed in advance according to the circuit scale of signal processing unit 23. Similarly, appropriately designed switch circuits 40b and 40c are also used.

(スイッチ回路の他の構成例)
 スイッチ回路40a~40cは、バッファ遅延を使用するものに限らない。例えば、スイッチ回路40aは、図5に示す構成であってもよい。なお、スイッチ回路40b,40cの構成についても同様である。図5に示すスイッチ回路40aは、上述したバッファ42(1)~42(n)に代えてフリップフロップ43(1)~43(n)を有している。つまり、スイッチ回路40aは、複数のスイッチ41(1)~41(n)と、複数の遅延回路を構成するフリップフロップ43(1)~43(n)とを有している。スイッチ41(1)~41(n)は、それぞれ一端部が電源線VDD1に接続され、他端部が信号処理部23に接続されている。スイッチ41(1)~41(n)の制御用の端子は、それぞれフリップフロップ43(1)~43(n)を介してCLK+EN制御部21に順次接続されている。
(Another example of a switch circuit configuration)
The switch circuits 40a to 40c are not limited to those using buffer delay. For example, the switch circuit 40a may have the configuration shown in FIG. 5. The same applies to the switch circuits 40b and 40c. The switch circuit 40a shown in FIG. 5 has flip-flops 43(1) to 43(n) instead of the buffers 42(1) to 42(n) described above. That is, the switch circuit 40a has multiple switches 41(1) to 41(n) and flip-flops 43(1) to 43(n) constituting multiple delay circuits. One end of each of the switches 41(1) to 41(n) is connected to the power supply line VDD1, and the other end is connected to the signal processing unit 23. The control terminals of the switches 41(1) to 41(n) are sequentially connected to the CLK+EN control unit 21 via the flip-flops 43(1) to 43(n), respectively.

 CLK+EN制御部21は、各スイッチ41(1)~41(n)を制御するイネーブル信号としてXNOSIG_STATE信号を生成し、各スイッチ41(1)~41(n)の制御用の端子に出力する。また、CLK+EN制御部21は、各フリップフロップ43(1)~43(n)のクロック入力用の端子と接続されており、各クロック入力用の端子にクロック信号を出力する。これにより、CLK+EN制御部21から出力されたXNOSIG_STATE信号は、フリップフロップ43(1)~43(n)でクロック信号に同期して順次スイッチ41(1)~41(n)に出力される。そのため、スイッチ41(1)~41(n)は、XNOSIG_STATE信号に応じて順次導通状態(オンオフ状態)が切り替わる。このように、フリップフロップ43(1)~43(n)の処理遅延を使用してスイッチ41(1)~41(n)を時分割で制御してもよい。この場合、クロック信号で遅延を管理することができ、信号処理部23の起動時にスイッチ41(1)~41(n)を段階的にオンさせてピーク電流を抑制することができる。 The CLK+EN control unit 21 generates the XNOSIG_STATE signal as an enable signal to control each switch 41(1) to 41(n) and outputs it to the control terminal of each switch 41(1) to 41(n). The CLK+EN control unit 21 is also connected to the clock input terminals of each flip-flop 43(1) to 43(n) and outputs a clock signal to each clock input terminal. As a result, the XNOSIG_STATE signal output from the CLK+EN control unit 21 is synchronized with the clock signal by the flip-flops 43(1) to 43(n) and output sequentially to the switches 41(1) to 41(n). As a result, the switches 41(1) to 41(n) are switched between conductive states (on/off states) sequentially in response to the XNOSIG_STATE signal. In this way, the processing delay of flip-flops 43(1) to 43(n) can be used to control switches 41(1) to 41(n) in a time-division manner. In this case, the delay can be managed using a clock signal, and peak current can be suppressed by gradually turning on switches 41(1) to 41(n) when signal processing unit 23 is started.

(スイッチ回路のレイアウト構造例)
 図6は、スイッチ回路40a~40cのレイアウトについて説明する図である。図6に示すように、スイッチ回路40a~40cは、電源線VDD1と電源制御対象の回路ブロック(図中では電源遮断回路ブロックと表記)との間に設けられる。これにより、電源線VDD1と各電源制御対象の回路ブロックとの間に仮想VDDを形成する。このように、スイッチ回路40a~40cが電源経路における電源側(高電位側)の電源線VDD1との接続を遮断可能なヘッダ型スイッチである場合、図示するようなP型半導体基板(PSUB:P-Substrate)のツインウェル(TwinWell)構造と親和性がある。そこで、このスイッチ回路40a~40cの場合、例えば、図示するように、基板をPSUBのTwinWell構造とし、スイッチ回路40a~40cをP型のトランジスタで構成することで製造効率を高めることができる。
(Example of switch circuit layout structure)
FIG. 6 is a diagram illustrating the layout of switch circuits 40a to 40c. As shown in FIG. 6, switch circuits 40a to 40c are provided between the power supply line VDD1 and a circuit block (referred to as a power cutoff circuit block in the figure) that is a power supply control target. This creates a virtual VDD between the power supply line VDD1 and each of the power supply control target circuit blocks. In this way, when switch circuits 40a to 40c are header-type switches capable of cutting off connection to the power supply line VDD1 on the power supply side (high-potential side) of the power supply path, they are compatible with a twin-well structure of a P-type semiconductor substrate (PSUB: P-Substrate) as shown in the figure. Therefore, in the case of these switch circuits 40a to 40c, for example, manufacturing efficiency can be improved by using a PSUB twin-well structure for the substrate and configuring switch circuits 40a to 40c with P-type transistors, as shown in the figure.

(制御回路の構成例)
 図7は、上述した制御回路50aの構成例を示す図である。図7中のパワーゲーティング対応ロジック23aは、スイッチ回路40aにより電源制御される信号処理部23の回路であり、常時オンロジック24aは、常時電源が供給されるレジスタ24の回路である。なお、ここでは信号処理部23およびレジスタ24間に設けられる制御回路50aについて説明するが、制御回路50b~50dの構成も同様である。
(Example of control circuit configuration)
7 is a diagram showing an example of the configuration of the control circuit 50a described above. The power gating compatible logic 23a in FIG. 7 is a circuit of the signal processing unit 23 whose power supply is controlled by the switch circuit 40a, and the always-on logic 24a is a circuit of the register 24 to which power is always supplied. Note that while the control circuit 50a provided between the signal processing unit 23 and the register 24 will be described here, the control circuits 50b to 50d have the same configuration.

 図示するように、パワーゲーティング対応ロジック23aから常時オンロジック24aへの信号伝達経路がある場合、パワーゲーティング対応ロジック23aは、電源オフ時に常時オンロジック24aに不定信号を出力し、常時オンロジック24aがこの不定信号の影響を受ける可能性がある。制御回路50aは、この不定出力を論理ゲートにより回避するものである。 As shown in the figure, if there is a signal transmission path from power gating-enabled logic 23a to always-on logic 24a, power gating-enabled logic 23a may output an undefined signal to always-on logic 24a when the power is off, and always-on logic 24a may be affected by this undefined signal. Control circuit 50a uses a logic gate to avoid this undefined output.

 制御回路50aは、図示するように、例えば、パワーゲーティング対応ロジック23a(OUT)と常時オンロジック24aとを接続する配線間にAND素子51を設けて構成することができる。具体的には、AND素子51の一方の入力をCLK+EN制御部21のXNOSIG_STATE信号出力用の端子に接続し、他方の入力をパワーゲーティング対応ロジック23a(OUT)に接続する。また、AND素子51の出力を常時オンロジック24aに接続する。このようにパワーゲーティング対応ロジック23aから常時オンロジック24aへの信号伝達経路上にAND素子51を設けることで、スイッチ回路40aがオンの場合にはパワーゲーティング対応ロジック23a(OUT)の信号が常時オンロジック24aに出力されるが、オフの場合には出力されない。そのため、電源オフ時の出力不定伝搬を回避することができる。 As shown in the figure, the control circuit 50a can be configured, for example, by providing an AND element 51 between the wiring connecting the power gating-enabled logic 23a (OUT) and the always-on logic 24a. Specifically, one input of the AND element 51 is connected to the XNOSIG_STATE signal output terminal of the CLK+EN control unit 21, and the other input is connected to the power gating-enabled logic 23a (OUT). The output of the AND element 51 is also connected to the always-on logic 24a. By providing the AND element 51 on the signal transmission path from the power gating-enabled logic 23a to the always-on logic 24a in this way, the signal from the power gating-enabled logic 23a (OUT) is output to the always-on logic 24a when the switch circuit 40a is on, but is not output when it is off. This makes it possible to avoid undefined output propagation when the power is off.

(制御回路の他の構成例)
 制御回路50a~50dは、論理ゲートを使用するものに限らない。例えば、制御回路50aは、図8に示す構成であってもよい。制御回路50b~50dの構成も同様である。図8に示す制御回路50aは、上述したAND素子51に代えてフリップフロップ52を有しており、さらに、フリップフロップ52のイネーブラとしてフリップフロップ53を有している。
(Another example of the control circuit configuration)
The control circuits 50a to 50d are not limited to those using logic gates. For example, the control circuit 50a may have the configuration shown in FIG. 8. The control circuits 50b to 50d have a similar configuration. The control circuit 50a shown in FIG. 8 has a flip-flop 52 instead of the above-mentioned AND element 51, and further has a flip-flop 53 as an enabler for the flip-flop 52.

 パワーゲーティング対応ロジック23aから常時オンロジック24aへの信号伝達経路がある場合、制御回路50aは、例えば、パワーゲーティング対応ロジック23a(OUT)と常時オンロジック24aとを接続する配線間にフリップフロップ52を設ける。具体的には、フリップフロップ52の入力をパワーゲーティング対応ロジック23a(OUT)に接続し、出力を常時オンロジック24aに接続する。また、フリップフロップ53の入力をCLK+EN制御部21のXNOSIG_STATE信号出力用の端子に接続し、出力をフリップフロップ52のクロック入力用の端子に接続する。そして、フリップフロップ53のクロック入力用の端子をCLK+EN制御部21のクロック信号出力用の端子に接続する。これにより、スイッチ回路40aがオンの場合にはパワーゲーティング対応ロジック23a(OUT)の信号が常時オンロジック24aに出力されるが、オフの場合には出力されない。そのため、電源オフ時の出力不定伝搬を回避することができる。制御回路50a~50dとしてフリップフロップ52を用いることで電源/GND(低電位側電源)、他信号などの他の回路との間のカップリングの影響を受けにくくすることができる。なお、制御回路50a~50dとして上述した論理ゲートを用いた場合は、フリップフロップ52を用いる場合よりも回路面積を小さくすることができる。 If there is a signal transmission path from the power gating-enabled logic 23a to the always-on logic 24a, the control circuit 50a, for example, provides a flip-flop 52 between the wiring connecting the power gating-enabled logic 23a (OUT) and the always-on logic 24a. Specifically, the input of the flip-flop 52 is connected to the power gating-enabled logic 23a (OUT), and the output is connected to the always-on logic 24a. The input of the flip-flop 53 is connected to the XNOSIG_STATE signal output terminal of the CLK+EN control unit 21, and the output is connected to the clock input terminal of the flip-flop 52. The clock input terminal of the flip-flop 53 is then connected to the clock signal output terminal of the CLK+EN control unit 21. As a result, when the switch circuit 40a is on, the signal from the power gating-enabled logic 23a (OUT) is output to the always-on logic 24a, but is not output when the switch circuit 40a is off. This prevents undefined output propagation when the power is off. Using flip-flops 52 as the control circuits 50a-50d makes it possible to reduce the influence of coupling between other circuits, such as the power supply/GND (low-potential power supply) and other signals. Note that if the logic gates described above are used as the control circuits 50a-50d, the circuit area can be made smaller than when flip-flops 52 are used.

 以上説明したように、本実施の形態では、表示装置1は、表示動作時に動作する複数の回路ブロックを有し、複数の回路ブロックは、スタンバイ時および動作不要時に電源がオフに制御される信号処理部23、水平ロジック部8および垂直ロジック部10を有している。このように、スタンバイ時および動作不要時に電源がオフに制御されることで、信号処理部23、水平ロジック部8および垂直ロジック部10においては、図3に破線矢印で示すようにスタンバイ時および動作不要時にリーク電流が発生せず、リーク電力を抑制することができる。表示装置1の内部電源回路にスイッチ回路40a~40cを設けていることで、表示装置1の内部で動作完結が可能となり、きめ細かい回路ブロックの電源制御が可能である。また、外部電源での電源制御(電源オンオフ)が不要で、起動時のピーク電流の抑制が可能であり、起動の高速化を図ることができる。 As explained above, in this embodiment, the display device 1 has multiple circuit blocks that operate during display operation. These multiple circuit blocks include the signal processing unit 23, horizontal logic unit 8, and vertical logic unit 10, which are powered off during standby and when operation is not required. By powering off the signal processing unit 23, horizontal logic unit 8, and vertical logic unit 10 in this way during standby and when operation is not required, no leakage current occurs during standby or when operation is not required, as indicated by the dashed arrows in FIG. 3, in the signal processing unit 23, horizontal logic unit 8, and vertical logic unit 10, making it possible to suppress leakage power. By providing switch circuits 40a-40c in the internal power supply circuit of the display device 1, operation can be completed within the display device 1, enabling detailed power supply control of the circuit blocks. Furthermore, power supply control (power on/off) by an external power supply is not required, peak current during startup can be suppressed, and startup can be sped up.

<3.第2の実施の形態>
 上述した第1の実施の形態では、スタンバイ時にゲート規模の大きいロジックに対し、電源電圧を遮断することでリーク電流を抑制する構成について説明したが、必要に応じてスタンバイ時および動作不要時にアナログブロックに対して電源電圧を遮断しリーク電流を抑制することも可能である。
3. Second embodiment
In the first embodiment described above, a configuration was described in which leakage current is suppressed by cutting off the power supply voltage to logic with large gate sizes during standby. However, if necessary, it is also possible to cut off the power supply voltage to analog blocks during standby or when operation is not required, thereby suppressing leakage current.

 図9は、本技術の第2の実施の形態に係る表示装置1の構成例を示す図である。上述したように、ガンマ処理部3、電源処理部4、水平アナログ部9および垂直アナログ部11は、スタンバイ状態では動作させる必要のないブロックである。そこで本実施の形態では、以下の構成により、ガンマ処理部3、電源処理部4、水平アナログ部9および垂直アナログ部11についても電源制御の対象ブロックとして電源制御を行うものとしている。 FIG. 9 is a diagram showing an example configuration of a display device 1 according to a second embodiment of the present technology. As described above, the gamma processing unit 3, power supply processing unit 4, horizontal analog unit 9, and vertical analog unit 11 are blocks that do not need to operate in standby mode. Therefore, in this embodiment, the following configuration is used to perform power control on the gamma processing unit 3, power supply processing unit 4, horizontal analog unit 9, and vertical analog unit 11 as blocks subject to power control.

 図9に示すように、電源線VDD2および電源線VSSAは、発振部12、水平アナログ部9、垂直アナログ部11、ガンマ処理部3および電源処理部4に接続され、各接続ブロックに所定の電源電圧(具体的には、アナログ回路用の電源電圧)を印加する。ただし、電源線VDD2はスイッチ回路40dを介して水平アナログ部9と接続されており、水平アナログ部9にはスイッチ回路40dがオン(導通状態)である場合に電源電圧が印加され、スイッチ回路40dがオフ(非導通状態)である場合には電源電圧は印加されない。また、電源線VDD2はスイッチ回路40eを介して垂直アナログ部11と接続されており、垂直アナログ部11にはスイッチ回路40eがオン(導通状態)である場合に電源電圧が印加され、スイッチ回路40eがオフ(非導通状態)である場合には電源電圧は印加されない。さらに、電源線VDD2はスイッチ回路40fを介してガンマ処理部3と接続されており、ガンマ処理部3にはスイッチ回路40fがオン(導通状態)である場合に電源電圧が印加され、スイッチ回路40fがオフ(非導通状態)である場合には電源電圧は印加されない。また、電源線VDD2はスイッチ回路40gを介して電源処理部4と接続されており、電源処理部4にはスイッチ回路40gがオン(導通状態)である場合に電源電圧が印加され、スイッチ回路40gがオフ(非導通状態)である場合には電源電圧は印加されない。スイッチ回路40d~40gは、上述したスイッチ回路40a~40cと同様のものである。 As shown in FIG. 9, power supply line VDD2 and power supply line VSSA are connected to the oscillator unit 12, horizontal analog unit 9, vertical analog unit 11, gamma processing unit 3, and power supply processing unit 4, and apply a predetermined power supply voltage (specifically, the power supply voltage for the analog circuits) to each connection block. However, power supply line VDD2 is connected to the horizontal analog unit 9 via switch circuit 40d, and the power supply voltage is applied to the horizontal analog unit 9 when switch circuit 40d is on (conductive state), and the power supply voltage is not applied when switch circuit 40d is off (non-conductive state). Furthermore, power supply line VDD2 is connected to the vertical analog unit 11 via switch circuit 40e, and the power supply voltage is applied to the vertical analog unit 11 when switch circuit 40e is on (conductive state), and the power supply voltage is not applied when switch circuit 40e is off (non-conductive state). Furthermore, power supply line VDD2 is connected to gamma processing unit 3 via switch circuit 40f. When switch circuit 40f is on (conductive), power supply voltage is applied to gamma processing unit 3, and when switch circuit 40f is off (non-conductive), power supply voltage is not applied. Furthermore, power supply line VDD2 is connected to power supply processing unit 4 via switch circuit 40g. When switch circuit 40g is on (conductive), power supply voltage is applied to power supply processing unit 4, and when switch circuit 40g is off (non-conductive), power supply voltage is not applied. Switch circuits 40d to 40g are similar to switch circuits 40a to 40c described above.

 これにより、図9に示す表示装置1は、第1の実施の形態と同様の効果を奏するとともに、アナログブロックであるガンマ処理部3、電源処理部4、水平アナログ部9および垂直アナログ部11においても、スタンバイ時および動作不要時に電源を遮断してリーク電力を抑制することができる。 As a result, the display device 1 shown in FIG. 9 achieves the same effects as the first embodiment, and is also able to reduce leakage power by cutting off power to the analog blocks of the gamma processing unit 3, power supply processing unit 4, horizontal analog unit 9, and vertical analog unit 11 during standby or when operation is not required.

<4.第3の実施の形態>
 上述した第1の実施の形態では、スイッチ回路40a~40cを電源線VDD1側、つまり電源側に配置したが、スイッチ回路40a~40cは、電源線VSSD側、つまりGND側に配置してもよい。
4. Third embodiment
In the first embodiment described above, the switch circuits 40a to 40c are arranged on the power supply line VDD1 side, that is, on the power supply side, but the switch circuits 40a to 40c may be arranged on the power supply line VSSD side, that is, on the GND side.

 図10は、本実施の形態でのスイッチ回路40a~40cのレイアウトについて説明する図である。図10に示すように、スイッチ回路40a~40cは、電源制御対象の回路ブロック(図中では電源遮断回路ブロックと表記)と電源線VSSDとの間に設けてもよい。つまり、電源線VSSDがスイッチ回路40aを介して信号処理部23と接続され、スイッチ回路40bを介して水平ロジック部8と接続され、スイッチ回路40cを介して垂直ロジック部10と接続されていてもよい。これにより、電源線VSSDと各電源制御対象の回路ブロックとの間に仮想VSSを形成する。このように、スイッチ回路40a~40cが電源経路におけるグランド側(低電位側)の電源線VSSDとの接続を遮断可能なフッタ型スイッチである場合、図示するようなP型半導体基板(PSUB)のトリプルウェル(TripleWell)構造と親和性がある。そこで、このスイッチ回路40a~40cの場合、例えば、図示するように、基板をPSUBのTripleWell構造とし、スイッチ回路40a~40cをN型のトランジスタで構成することで製造効率を高めることができる。このように、スイッチ回路40a~40cは、レイアウト構造に応じてヘッダ型とフッタ型とを使い分けることができる。 Figure 10 is a diagram illustrating the layout of switch circuits 40a to 40c in this embodiment. As shown in Figure 10, switch circuits 40a to 40c may be provided between the power supply control target circuit block (represented as a power supply cutoff circuit block in the figure) and the power supply line VSSD. In other words, the power supply line VSSD may be connected to the signal processing unit 23 via switch circuit 40a, to the horizontal logic unit 8 via switch circuit 40b, and to the vertical logic unit 10 via switch circuit 40c. This creates a virtual VSS between the power supply line VSSD and each power supply control target circuit block. In this way, if switch circuits 40a to 40c are footer-type switches capable of cutting off connection to the power supply line VSSD on the ground side (low potential side) of the power supply path, they are compatible with the triple-well structure of a P-type semiconductor substrate (PSUB) as shown in the figure. Therefore, in the case of these switch circuits 40a-40c, for example, as shown in the figure, manufacturing efficiency can be improved by using a PSUB triple-well structure for the substrate and configuring the switch circuits 40a-40c with N-type transistors. In this way, the switch circuits 40a-40c can be used as either a header type or a footer type depending on the layout structure.

<5.第4の実施の形態>
 上述した第1の実施の形態では、表示装置1の内部電源経路に各電源制御の対象ブロックに供給される電源をスタンバイ時に遮断するスイッチ回路40a~40cを設けた。しかしながら、この電源の遮断は、表示装置1の外部電源側で行ってもよい。
5. Fourth embodiment
In the first embodiment described above, the switch circuits 40a to 40c are provided in the internal power supply path of the display device 1 to cut off the power supplied to each power supply control target block during standby. However, this power cut-off may also be performed on the external power supply side of the display device 1.

 図11は、本技術に係る第4の実施の形態に係る表示装置1の構成例を示している。なお、図11では、信号処理部23のパワーゲーティング対応ロジック23aおよびレジスタ24の常時オンロジック24aについての電源回路について説明するが、他の回路ブロックについても同様の構成である。 FIG. 11 shows an example configuration of a display device 1 according to a fourth embodiment of the present technology. Note that FIG. 11 describes the power supply circuits for the power gating-enabled logic 23a of the signal processing unit 23 and the always-on logic 24a of the register 24, but the other circuit blocks have similar configurations.

 外部電源(外部VDD1電源)60は、表示装置1と入出力部2(図11では図示略)を介して接続される表示装置1の外部電源である。外部電源60は、入出力部2を介してレジスタ24の常時オンロジック24aに常時オン用の電源線VDD1を介して電源を供給する。外部電源60は、入出力部2を介してCLK+EN制御部21と接続されており、CLK+EN制御部21は、外部電源60にXNOSIG_STATE信号を出力する。この信号出力は、例えば、入出力部2に外部電源60を制御する制御用端子を設け、その制御用端子を介して行うことができる。外部電源60は、このXNOSIG_STATE信号に応じて信号処理部23のパワーゲーティング対応ロジック23aに電源制御用の電源線VDD1を介して電源を供給する。例えば、XNOSIG_STATE信号がハイレベルの場合はパワーゲーティング対応ロジック23aに電源を供給(電源オン)し、ローレベルの場合はパワーゲーティング対応ロジック23aへの電源を遮断(電源オフ)する。 The external power supply (external VDD1 power supply) 60 is an external power supply for the display device 1 connected to the display device 1 via the input/output unit 2 (not shown in Figure 11). The external power supply 60 supplies power via the always-on power line VDD1 to the always-on logic 24a of the register 24 via the input/output unit 2. The external power supply 60 is connected to the CLK+EN control unit 21 via the input/output unit 2, and the CLK+EN control unit 21 outputs an XNOSIG_STATE signal to the external power supply 60. This signal output can be performed, for example, by providing a control terminal in the input/output unit 2 that controls the external power supply 60. In response to this XNOSIG_STATE signal, the external power supply 60 supplies power to the power gating-compatible logic 23a of the signal processing unit 23 via the power supply control power line VDD1. For example, when the XNOSIG_STATE signal is at a high level, power is supplied to the power gating compatible logic 23a (power on), and when it is at a low level, power to the power gating compatible logic 23a is cut off (power off).

 このように、表示装置1の外部電源60で電源制御する構成であっても第1の実施の形態と同様の効果を奏することができる。また、実質的な電源制御を外部電源60側で行うことにより、表示装置1側の電源制御用の回路の簡略化を図ることができる。 In this way, even with a configuration in which power is controlled by the external power supply 60 of the display device 1, the same effects as in the first embodiment can be achieved. Furthermore, by performing substantial power control on the external power supply 60 side, it is possible to simplify the power control circuitry on the display device 1 side.

<6.第5の実施の形態>
 上述した第4の実施の形態では、表示装置1の外部電源により電源制御を行ったが、電源制御は、表示装置1の内部電源で行ってもよい。
6. Fifth embodiment
In the fourth embodiment described above, power supply control is performed by an external power supply of the display device 1, but power supply control may also be performed by an internal power supply of the display device 1.

 図12は、本技術に係る第5の実施の形態に係る表示装置1の構成例を示している。なお、図12では、信号処理部23のパワーゲーティング対応ロジック23aおよびレジスタ24の常時オンロジック24aについての電源回路について説明するが、他の回路ブロックについても同様の構成である。 FIG. 12 shows an example configuration of a display device 1 according to a fifth embodiment of the present technology. Note that FIG. 12 describes the power supply circuits for the power gating-enabled logic 23a of the signal processing unit 23 and the always-on logic 24a of the register 24, but the other circuit blocks have similar configurations.

 内部電源(内部生成VDD1電源)70は、表示装置1の内部に設けられたチップ内部電源(電源ブロック)である。内部電源70は、レジスタ24の常時オンロジック24aに常時オン用の電源線VDD1を介して電源を供給する。内部電源70は、CLK+EN制御部21と接続されており、CLK+EN制御部21は、内部電源70にXNOSIG_STATE信号を出力する。内部電源70は、このXNOSIG_STATE信号に応じて信号処理部23のパワーゲーティング対応ロジック23aに電源制御用の電源線VDD1を介して電源を供給する。例えば、XNOSIG_STATE信号がハイレベルの場合はパワーゲーティング対応ロジック23aに電源を供給(電源オン)し、ローレベルの場合はパワーゲーティング対応ロジック23aへの電源を遮断(電源オフ)する。 The internal power supply (internally generated VDD1 power supply) 70 is a chip internal power supply (power supply block) provided inside the display device 1. The internal power supply 70 supplies power to the always-on logic 24a of the register 24 via the always-on power line VDD1. The internal power supply 70 is connected to the CLK+EN control unit 21, which outputs an XNOSIG_STATE signal to the internal power supply 70. In response to this XNOSIG_STATE signal, the internal power supply 70 supplies power to the power gating-compatible logic 23a of the signal processing unit 23 via the power control power line VDD1. For example, when the XNOSIG_STATE signal is high level, power is supplied to the power gating-compatible logic 23a (power on), and when it is low level, power to the power gating-compatible logic 23a is cut off (power off).

 このように、表示装置1の内部電源70で電源制御する構成であっても第1の実施の形態と同様の効果を奏することができる。また、実質的な電源制御を内部電源70で行うことにより、表示装置1の電源制御用の回路の簡略化を図ることができる。さらに、外部電源60で電源制御を行う場合に必要であった制御用端子が不要となる。 In this way, even with a configuration in which power is controlled by the internal power supply 70 of the display device 1, the same effects as in the first embodiment can be achieved. Furthermore, by performing substantial power control with the internal power supply 70, the power control circuitry of the display device 1 can be simplified. Furthermore, the control terminals that were required when power was controlled by the external power supply 60 are no longer necessary.

<7.第6の実施の形態>
 図13は、画素間におけるリーク電流を逃がす構成について説明するための図である。図13Aは、画素の平面図を示し、図13Bは、画素間のリーク電流を逃がす構成例を示す図である。図13A、図13B中の「R」は赤色波長光が得られる画素であり、「G」は緑色波長光が得られる画素であり、「B」は青色波長光が得られる画素である。各画素間には絶縁膜80が設けられている。絶縁膜80は、例えば、シリコン酸化物(SiOx)等の絶縁体で構成されている。
7. Sixth embodiment
Fig. 13 is a diagram for explaining a configuration for dissipating leakage current between pixels. Fig. 13A shows a plan view of a pixel, and Fig. 13B is a diagram showing an example of a configuration for dissipating leakage current between pixels. In Figs. 13A and 13B, "R" denotes a pixel from which red wavelength light is obtained, "G" denotes a pixel from which green wavelength light is obtained, and "B" denotes a pixel from which blue wavelength light is obtained. An insulating film 80 is provided between each pixel. The insulating film 80 is made of an insulator such as silicon oxide (SiOx).

 図13Bに示すように、画素間絶縁膜ノード配線を行い、絶縁膜80に電源線VISOによる負電源(画素アイソレーション用電源)を印加することで、隣接画素間におけるリーク電流を電極側に逃がして画素へのリーク電流の流入を防ぐことができる。本技術は回路駆動する回路ブロックだけでなく、このような特性担保用シールドなどの回路ブロックについても適用することができる。 As shown in Figure 13B, by wiring the insulating film node between pixels and applying a negative power supply (power supply for pixel isolation) to the insulating film 80 via the power supply line VISO, the leakage current between adjacent pixels can be diverted to the electrode side, preventing leakage current from flowing into the pixel. This technology can be applied not only to circuit blocks that drive circuits, but also to circuit blocks such as shields for maintaining characteristics.

 図14は、本技術の第6の実施の形態に係る表示装置1の構成例を示す図である。本実施の形態の表示装置1は、画素部7の各画素間の絶縁膜80と電源線VSIOとの間にスイッチ回路81を設けて仮想VISOを形成している。スイッチ回路81は、イネーブル信号としてのISOEN信号に応じて電源を遮断可能なものである。スイッチ回路81は、第1の実施の形態におけるスイッチ回路40a~40cに対応し、ISOEN信号は、第1の実施の形態におけるXNOSIG_STATE信号に対応する。つまり、本実施の形態では、画素間を絶縁する絶縁膜80に絶縁用電圧を印加する回路ブロックを第1の回路ブロックとして電源を制御する。スイッチ回路81は、ISOEN信号に応じてコントラストを高める必要があるとき(例えば、黒表示などで発光させたくない場合)はオンに制御され、スタンバイ時およびコントラストを高める必要がないときはオフに制御される。この表示装置1においても、スタンバイ電力を削減することができる。 14 is a diagram showing an example configuration of a display device 1 according to a sixth embodiment of the present technology. In the display device 1 of this embodiment, a switch circuit 81 is provided between the insulating film 80 between each pixel in the pixel section 7 and the power line VSIO, forming a virtual VISO. The switch circuit 81 is capable of cutting off the power supply in response to an ISOEN signal serving as an enable signal. The switch circuit 81 corresponds to the switch circuits 40a to 40c in the first embodiment, and the ISOEN signal corresponds to the XNOSIG_STATE signal in the first embodiment. In other words, in this embodiment, the power supply is controlled by a circuit block that applies an insulation voltage to the insulating film 80 that insulates the pixels, acting as the first circuit block. The switch circuit 81 is controlled to be on when contrast needs to be increased (for example, when light emission is not desired, such as in black display) in response to the ISOEN signal, and is controlled to be off during standby or when increased contrast is not required. This display device 1 can also reduce standby power consumption.

<8.第7の実施の形態)
 上述した第1の実施の形態におけるスイッチ回路40a~40cは、シリコン(Si)基板に形成する場合を想定していたが、スイッチ回路40a~40cを形成する基板は、シリコン(Si)基板に限らない。
<8. Seventh embodiment)
In the first embodiment described above, it is assumed that the switch circuits 40a to 40c are formed on a silicon (Si) substrate, but the substrate on which the switch circuits 40a to 40c are formed is not limited to a silicon (Si) substrate.

 図15は、本技術を適用可能な基板の構成例について説明する概念図である。図15の下部に示す基板Pは、シリコン(Si)基板に酸化物半導体を積層した構造を有している。シリコン基板は、例えば非晶質シリコンまたは多結晶シリコンを含む。酸化物半導体は、例えば酸化インジウムガリウム亜鉛(IGZO)を含み、TFT(Thin Film Transistor)層を形成する。 Figure 15 is a conceptual diagram illustrating an example of the configuration of a substrate to which this technology can be applied. Substrate P, shown in the lower part of Figure 15, has a structure in which an oxide semiconductor is layered on a silicon (Si) substrate. The silicon substrate contains, for example, amorphous silicon or polycrystalline silicon. The oxide semiconductor contains, for example, indium gallium zinc oxide (IGZO), and forms a TFT (Thin Film Transistor) layer.

 酸化物半導体層の画素領域には画素用トランジスタが形成されている。酸化物半導体層の画素領域以外はダミー領域となっており、ダミーパターンが形成されている。シリコン基板の画素領域には高耐圧トランジスタが形成され、画素領域以外はロジック領域として低耐圧トランジスタが形成されている。ロジック領域は、例えば、デジタル回路用の電源電圧で駆動するロジックブロックの配置領域である。本技術は、例えば、このような構造の基板Pを有する表示装置にも適用することができる。 Pixel transistors are formed in the pixel region of the oxide semiconductor layer. The area of the oxide semiconductor layer other than the pixel region is a dummy region in which dummy patterns are formed. High-voltage transistors are formed in the pixel region of the silicon substrate, and low-voltage transistors are formed in the area other than the pixel region as a logic region. The logic region is, for example, an area where logic blocks driven by a power supply voltage for digital circuits are arranged. This technology can also be applied, for example, to a display device having a substrate P with such a structure.

 図16は、本技術の第7の実施の形態に係る表示装置1の構成例を示す図である。図16に示す表示装置1は、上述した第3の実施の形態で説明したフッタ型のスイッチ回路40a~40c(図10参照)を有している。この表示装置1では、上述した基板Pのダミー領域、つまり、ロジック領域との重畳部の酸化物半導体層にパワーゲーティングスイッチであるスイッチ回路40a~40cを酸化物半導体トランジスタ、具体的にはTFTで形成する。これにより、上述した第1の実施の形態と同様の効果を奏するとともに、酸化物半導体によるリーク電流の低減効果が得られ、プロセス平坦化、プロセス特性の改善にも寄与することができる。なお、スイッチ回路40a~40cは、酸化物半導体層における画素領域の空き領域に形成してもよい。 FIG. 16 is a diagram showing an example configuration of a display device 1 according to a seventh embodiment of the present technology. The display device 1 shown in FIG. 16 has the footer-type switch circuits 40a-40c (see FIG. 10) described in the third embodiment above. In this display device 1, the switch circuits 40a-40c, which are power gating switches, are formed using oxide semiconductor transistors, specifically TFTs, in the dummy region of the substrate P described above, i.e., in the oxide semiconductor layer in the area overlapping with the logic region. This achieves the same effects as the first embodiment described above, while also reducing leakage current due to the oxide semiconductor, contributing to process planarization and improved process characteristics. The switch circuits 40a-40c may also be formed in empty areas of the pixel region in the oxide semiconductor layer.

<9.画素回路の構成例>
 以下、表示装置1の画素部7が有する画素(画素回路)の構成例について説明する。なお、以下の構成例は、あくまで例示であり、他の構成のものを排除するものではない。
9. Example of pixel circuit configuration
The following describes an example of the configuration of the pixel (pixel circuit) included in the pixel section 7 of the display device 1. Note that the following example of the configuration is merely an example and does not exclude other configurations.

(第1構成例)
 図17は、画素PIXの一構成例を表すものである。画素PIXは、キャパシタC01と、トランジスタMN02~MN03と、発光素子ELとを有している。トランジスタMN02~MN03は、N型のMOSFET(Metal Oxide Semiconductor Field Effect Transistor)である。トランジスタMN02のゲートは制御線WSLに接続され、ドレインは信号線SGLに接続され、ソースはトランジスタMN03のゲートおよびキャパシタC01に接続される。キャパシタC01の一端はトランジスタMN02のソースおよびトランジスタMN03のゲートに接続され、他端はトランジスタMN03のソースおよび発光素子ELのアノードに接続される。トランジスタMN03のゲートはトランジスタMN02のソースおよびキャパシタC01の一端に接続され、ドレインは電源線VCCPに接続され、ソースはキャパシタC01の他端および発光素子ELのアノードに接続される。発光素子ELのアノードはトランジスタMN03のソースおよびキャパシタC01の他端に接続され、カソードは電源線Vcathに接続される。電源線VCCPの電圧は、第1電圧と、第1電圧よりも低い第2電圧と、に適宜切り替わる。
(First configuration example)
17 shows an example of the configuration of pixel PIX. Pixel PIX has a capacitor C01, transistors MN02 and MN03, and a light-emitting element EL. Transistors MN02 and MN03 are N-type MOSFETs (Metal Oxide Semiconductor Field Effect Transistors). The gate of transistor MN02 is connected to a control line WSL, its drain is connected to a signal line SGL, and its source is connected to the gate of transistor MN03 and capacitor C01. One end of capacitor C01 is connected to the source of transistor MN02 and the gate of transistor MN03, and the other end is connected to the source of transistor MN03 and the anode of light-emitting element EL. The gate of transistor MN03 is connected to the source of transistor MN02 and one end of capacitor C01, its drain is connected to the power supply line VCCP, and its source is connected to the other end of capacitor C01 and the anode of light-emitting element EL. The anode of the light-emitting element EL is connected to the source of the transistor MN03 and the other end of the capacitor C01, and the cathode is connected to the power supply line Vcath. The voltage of the power supply line VCCP is appropriately switched between a first voltage and a second voltage lower than the first voltage.

 この構成により、画素PIXでは、トランジスタMN02がオン状態になることにより、信号線SGLから供給された画素信号に基づいてキャパシタC01の両端間の電圧が設定される。電源線VCCPの電圧が第1電圧である期間に、トランジスタMN03は、キャパシタC01の両端間の電圧に応じた電流を発光素子ELに流す。発光素子ELは、トランジスタMN03から供給された電流に基づいて発光する。このようにして、画素PIXは、画素信号に応じた輝度で発光する。なお、電源線VCCPの電圧が第2電圧である期間には、発光素子ELは消光する。 With this configuration, in pixel PIX, when transistor MN02 is turned on, the voltage across capacitor C01 is set based on the pixel signal supplied from signal line SGL. During the period when the voltage of power supply line VCCP is the first voltage, transistor MN03 passes a current corresponding to the voltage across capacitor C01 through light-emitting element EL. The light-emitting element EL emits light based on the current supplied from transistor MN03. In this way, pixel PIX emits light at a brightness corresponding to the pixel signal. Note that during the period when the voltage of power supply line VCCP is the second voltage, the light-emitting element EL is extinguished.

(第2構成例)
 図18は、画素PIXの他の一構成例を表すものである。この画素PIXは、キャパシタC11,C12と、トランジスタMP12~MP15と、発光素子ELとを有している。トランジスタMP12~MP15はP型のMOSFETである。トランジスタMP12のゲートは制御線WSLに接続され、ソースは信号線SGLに接続され、ドレインはトランジスタMP14のゲートおよびキャパシタC12に接続される。キャパシタC11の一端は電源線VCCPに接続され、他端はキャパシタC12、トランジスタMP13のドレイン、およびトランジスタMP14のソースに接続される。キャパシタC12の一端はキャパシタC11の他端、トランジスタMP13のドレイン、およびトランジスタMP14のソースに接続され、他端はトランジスタMP12のドレインおよびトランジスタMP14のゲートに接続される。トランジスタMP13のゲートは制御線DSLに接続され、ソースは電源線VCCPに接続され、ドレインはトランジスタMP14のソース、キャパシタC11の他端、およびキャパシタC12の一端に接続される。トランジスタMP14のゲートはトランジスタMP12のドレインおよびキャパシタC12の他端に接続され、ソースはトランジスタMP13のドレイン、キャパシタC11の他端、およびキャパシタC12の一端に接続され、ドレインは発光素子ELのアノードおよびトランジスタMP15のソースに接続される。トランジスタMP15のゲートは制御線AZSLに接続され、ソースはトランジスタMP14のドレインおよび発光素子ELのアノードに接続され、ドレインは電源線VSSに接続される。発光素子ELのアノードはトランジスタMP14のドレインおよびトランジスタMP15のソースに接続され、カソードは電源線Vcathに接続される。
(Second configuration example)
18 shows another example of the configuration of pixel PIX. This pixel PIX has capacitors C11 and C12, transistors MP12 to MP15, and a light-emitting element EL. Transistors MP12 to MP15 are P-type MOSFETs. The gate of transistor MP12 is connected to a control line WSL, its source is connected to a signal line SGL, and its drain is connected to the gate of transistor MP14 and capacitor C12. One end of capacitor C11 is connected to a power supply line VCCP, and the other end is connected to capacitor C12, the drain of transistor MP13, and the source of transistor MP14. One end of capacitor C12 is connected to the other end of capacitor C11, the drain of transistor MP13, and the source of transistor MP14, and the other end is connected to the drain of transistor MP12 and the gate of transistor MP14. The gate of transistor MP13 is connected to the control line DSL, the source is connected to the power supply line VCCP, and the drain is connected to the source of transistor MP14, the other end of capacitor C11, and one end of capacitor C12. The gate of transistor MP14 is connected to the drain of transistor MP12 and the other end of capacitor C12, the source is connected to the drain of transistor MP13, the other end of capacitor C11, and one end of capacitor C12, and the drain is connected to the anode of the light-emitting element EL and the source of transistor MP15. The gate of transistor MP15 is connected to the control line AZSL, the source is connected to the drain of transistor MP14 and the anode of the light-emitting element EL, and the drain is connected to the power supply line VSS. The anode of the light-emitting element EL is connected to the drain of transistor MP14 and the source of transistor MP15, and the cathode is connected to the power supply line Vcath.

 この構成により、画素PIXでは、トランジスタMP12がオン状態になることにより、信号線SGLから供給された画素信号に基づいてキャパシタC12の両端間の電圧が設定される。トランジスタMP13は、制御線DSLの信号に基づいてオンオフする。トランジスタMP14は、トランジスタMP13がオン状態である期間において、キャパシタC12の両端間の電圧に応じた電流を発光素子ELに流す。発光素子ELは、トランジスタMP14から供給された電流に基づいて発光する。このようにして、画素PIXは、画素信号に応じた輝度で発光する。トランジスタMP15は、制御線AZSLの信号に基づいてオンオフする。トランジスタMP15がオン状態である期間において、発光素子ELのアノードの電圧は電源線VSSの電圧に設定されることにより初期化される。 With this configuration, in pixel PIX, when transistor MP12 is turned on, the voltage across capacitor C12 is set based on the pixel signal supplied from signal line SGL. Transistor MP13 turns on and off based on the signal on control line DSL. While transistor MP13 is on, transistor MP14 passes a current to the light-emitting element EL that corresponds to the voltage across capacitor C12. The light-emitting element EL emits light based on the current supplied from transistor MP14. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal. Transistor MP15 turns on and off based on the signal on control line AZSL. While transistor MP15 is on, the anode voltage of the light-emitting element EL is initialized by being set to the voltage of the power supply line VSS.

 なお、トランジスタMP12~MP15は、低温多結晶シリコン(LTPS:Low Temperature Poly Silicon)を用いたトランジスタであってもよい。また、トランジスタMP12、MP15のうち少なくともいずれかは、酸化物半導体を用いたトランジスタであってもよい。 Note that transistors MP12 to MP15 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MP12 and MP15 may be a transistor using an oxide semiconductor.

(第3構成例)
 図19は、画素PIXの他の一構成例を表すものである。この画素PIXは、キャパシタC21と、トランジスタMN22~MN25と、発光素子ELとを有している。トランジスタMN22~MN25はN型のMOSFETである。トランジスタMN22のゲートは制御線WSLに接続され、ドレインは信号線SGLに接続され、ソースはトランジスタMN24のゲートおよびキャパシタC21に接続される。キャパシタC21の一端はトランジスタMN22のソースおよびトランジスタMN24のゲートに接続され、他端はトランジスタMN24のソース、トランジスタMN25のドレイン、および発光素子ELのアノードに接続される。トランジスタMN23のゲートは制御線DSLに接続され、ドレインは電源線VCCPに接続され、ソースはトランジスタMN24のドレインに接続される。トランジスタMN24のゲートはトランジスタMN22のソースおよびキャパシタC21の一端に接続され、ドレインはトランジスタMN23のソースに接続され、ソースはキャパシタC21の他端、トランジスタMN25のドレイン、および発光素子ELのアノードに接続される。トランジスタMN25のゲートは制御線AZSLに接続され、ドレインはトランジスタMN24のソース、キャパシタC21の他端、および発光素子ELのアノードに接続され、ソースは電源線VSSに接続される。発光素子ELのアノードはトランジスタMN24のソース、トランジスタMN25のドレインおよびキャパシタC21の他端に接続され、カソードは電源線Vcathに接続される。
(Third Configuration Example)
19 shows another example of the configuration of pixel PIX. This pixel PIX has a capacitor C21, transistors MN22 to MN25, and a light-emitting element EL. Transistors MN22 to MN25 are N-type MOSFETs. The gate of transistor MN22 is connected to a control line WSL, the drain is connected to a signal line SGL, and the source is connected to the gate of transistor MN24 and capacitor C21. One end of capacitor C21 is connected to the source of transistor MN22 and the gate of transistor MN24, and the other end is connected to the source of transistor MN24, the drain of transistor MN25, and the anode of light-emitting element EL. The gate of transistor MN23 is connected to a control line DSL, the drain is connected to a power supply line VCCP, and the source is connected to the drain of transistor MN24. The gate of transistor MN24 is connected to the source of transistor MN22 and one end of capacitor C21, the drain is connected to the source of transistor MN23, the source is connected to the other end of capacitor C21, the drain of transistor MN25, and the anode of light-emitting element EL. The gate of transistor MN25 is connected to control line AZSL, the drain is connected to the source of transistor MN24, the other end of capacitor C21, and the anode of light-emitting element EL, and the source is connected to power supply line VSS. The anode of light-emitting element EL is connected to the source of transistor MN24, the drain of transistor MN25, and the other end of capacitor C21, and the cathode is connected to power supply line Vcath.

 この構成により、画素PIXでは、トランジスタMN22がオン状態になることにより、信号線SGLから供給された画素信号に基づいてキャパシタC21の両端間の電圧が設定される。トランジスタMN23は、制御線DSLの信号に基づいてオンオフする。トランジスタMN24は、トランジスタMN23がオン状態である期間において、キャパシタC21の両端間の電圧に応じた電流を発光素子ELに流す。発光素子ELは、トランジスタMN24から供給された電流に基づいて発光する。このようにして、画素PIXは、画素信号に応じた輝度で発光する。トランジスタMN25は、制御線AZSLの信号に基づいてオンオフする。トランジスタMN25がオン状態である期間において、発光素子ELのアノードの電圧は電源線VSSの電圧に設定されることにより初期化される。 With this configuration, in pixel PIX, when transistor MN22 is turned on, the voltage across capacitor C21 is set based on the pixel signal supplied from signal line SGL. Transistor MN23 turns on and off based on the signal on control line DSL. While transistor MN23 is on, transistor MN24 passes a current to light-emitting element EL that corresponds to the voltage across capacitor C21. The light-emitting element EL emits light based on the current supplied from transistor MN24. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal. Transistor MN25 turns on and off based on the signal on control line AZSL. While transistor MN25 is on, the anode voltage of light-emitting element EL is initialized by being set to the voltage of power supply line VSS.

 なお、トランジスタMN22~MN25は、低温多結晶シリコン(LTPS:Low Temperature Poly Silicon)を用いたトランジスタであってもよい。また、トランジスタMN22、MN25のうち少なくともいずれかは、酸化物半導体を用いたトランジスタであってもよい。 Note that transistors MN22 to MN25 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MN22 and MN25 may be a transistor using an oxide semiconductor.

(第4構成例)
 図20は、画素PIXの他の一構成例を表すものである。この画素PIXは、キャパシタC31と、トランジスタMP32~MP36と、発光素子ELとを有している。トランジスタMP32~MP36はP型のMOSFETである。トランジスタMP32のゲートは制御線WSLに接続され、ソースは信号線SGLに接続され、ドレインはトランジスタMP33のゲート、トランジスタMP34のドレイン、およびキャパシタC31に接続される。キャパシタC31の一端は電源線VCCPに接続され、他端はトランジスタMP32のドレイン、トランジスタMP33のゲート、およびトランジスタMP34のドレインに接続される。トランジスタMP33のゲートはトランジスタMP32のドレイン、トランジスタMP34のドレインおよびキャパシタC31の他端に接続され、ソースは電源線VCCPに接続され、ドレインはトランジスタMP34のソースおよびトランジスタMP35のソースに接続される。トランジスタMP34のゲートは制御線AZSL1に接続され、ソースはトランジスタMP33のドレインおよびトランジスタMP35のソースに接続され、ドレインはトランジスタMP32のドレイン、トランジスタMP33のゲート、およびキャパシタC31の他端に接続される。トランジスタMP35のゲートは制御線DSLに接続され、ソースはトランジスタMP33のドレインおよびトランジスタMP34のソースに接続され、ドレインはトランジスタMP36のソースおよび発光素子ELのアノードに接続される。トランジスタMP36のゲートは制御線AZSL2に接続され、ソースはトランジスタMP35のドレインおよび発光素子ELのアノードに接続され、ドレインは電源線VSSに接続される。発光素子ELのアノードはトランジスタMP35のドレインおよびトランジスタMP36のソースに接続され、カソードは電源線Vcathに接続される。
(Fourth Configuration Example)
20 shows another example of the configuration of pixel PIX. This pixel PIX has a capacitor C31, transistors MP32 to MP36, and a light-emitting element EL. Transistors MP32 to MP36 are P-type MOSFETs. The gate of transistor MP32 is connected to a control line WSL, its source is connected to a signal line SGL, and its drain is connected to the gate of transistor MP33, the drain of transistor MP34, and capacitor C31. One end of capacitor C31 is connected to a power supply line VCCP, and the other end is connected to the drain of transistor MP32, the gate of transistor MP33, and the drain of transistor MP34. The gate of transistor MP33 is connected to the drain of transistor MP32, the drain of transistor MP34, and the other end of capacitor C31, its source is connected to the power supply line VCCP, and its drain is connected to the sources of transistor MP34 and transistor MP35. The gate of transistor MP34 is connected to control line AZSL1, its source is connected to the drain of transistor MP33 and the source of transistor MP35, and its drain is connected to the drain of transistor MP32, the gate of transistor MP33, and the other end of capacitor C31. The gate of transistor MP35 is connected to control line DSL, its source is connected to the drain of transistor MP33 and the source of transistor MP34, and its drain is connected to the source of transistor MP36 and the anode of light-emitting element EL. The gate of transistor MP36 is connected to control line AZSL2, its source is connected to the drain of transistor MP35 and the anode of light-emitting element EL, and its drain is connected to power supply line VSS. The anode of light-emitting element EL is connected to the drain of transistor MP35 and the source of transistor MP36, and its cathode is connected to power supply line Vcath.

 この構成により、画素PIXでは、トランジスタMP32がオン状態になることにより、信号線SGLから供給された画素信号に基づいてキャパシタC31の両端間の電圧が設定される。トランジスタMP35は、制御線DSLの信号に基づいてオンオフする。トランジスタMP33は、トランジスタMP35がオン状態である期間において、キャパシタC31の両端間の電圧に応じた電流を、発光素子ELに流す。発光素子ELは、トランジスタMP33から供給された電流に基づいて発光する。このようにして、画素PIXは、画素信号に応じた輝度で発光する。トランジスタMP34は、制御線AZSL1の信号に基づいてオンオフする。トランジスタMP34がオン状態である期間において、トランジスタMP33のドレインおよびゲートが互いに接続される。トランジスタMP36は、制御線AZSL2の信号に基づいてオンオフする。トランジスタMP36がオン状態になる期間において、発光素子ELのアノードの電圧は電源線VSSの電圧に設定されることにより初期化される。 With this configuration, in pixel PIX, when transistor MP32 is turned on, the voltage across capacitor C31 is set based on the pixel signal supplied from signal line SGL. Transistor MP35 turns on and off based on the signal on control line DSL. While transistor MP35 is on, transistor MP33 passes a current corresponding to the voltage across capacitor C31 through light-emitting element EL. The light-emitting element EL emits light based on the current supplied from transistor MP33. In this way, pixel PIX emits light at a brightness corresponding to the pixel signal. Transistor MP34 turns on and off based on the signal on control line AZSL1. While transistor MP34 is on, the drain and gate of transistor MP33 are connected to each other. Transistor MP36 turns on and off based on the signal on control line AZSL2. While transistor MP36 is on, the anode voltage of light-emitting element EL is initialized by being set to the voltage of power supply line VSS.

 なお、トランジスタMP32~MP36は、低温多結晶シリコン(LTPS:Low Temperature Poly Silicon)を用いたトランジスタであってもよい。また、トランジスタMP32、MP34、MP36のうち少なくともいずれかは、酸化物半導体を用いたトランジスタであってもよい。 Note that transistors MP32 to MP36 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MP32, MP34, and MP36 may be a transistor using an oxide semiconductor.

(第5構成例)
 図21は、画素PIXの他の一構成例を表すものである。キャパシタC48の一端は信号線SGL1に接続され、他端は電源線VSSに接続される。キャパシタC49の一端は信号線SGL1に接続され、他端は信号線SGL2に接続される。トランジスタMP49はP型のMOSFETであり、ゲートは制御線WSL2に接続され、ソースは信号線SGL1に接続され、ドレインは信号線SGL2に接続される。
(Fifth Configuration Example)
21 shows another example of the configuration of pixel PIX. One end of capacitor C48 is connected to signal line SGL1, and the other end is connected to power supply line VSS. One end of capacitor C49 is connected to signal line SGL1, and the other end is connected to signal line SGL2. Transistor MP49 is a P-type MOSFET, and its gate is connected to control line WSL2, its source is connected to signal line SGL1, and its drain is connected to signal line SGL2.

 画素PIXは、キャパシタC41と、トランジスタMP42~MP46と、発光素子ELとを有している。トランジスタMP42~MP46は、P型のMOSFETである。トランジスタMP42のゲートは制御線WSL1に接続され、ソースは信号線SGL2に接続され、ドレインはトランジスタMP43のゲートおよびキャパシタC41に接続される。キャパシタC41の一端は電源線VCCPに接続され、他端はトランジスタMP42のドレインおよびトランジスタMP43のゲートに接続される。トランジスタMP43のゲートはトランジスタMP42のドレインおよびキャパシタC41の他端に接続され、ソースは電源線VCCPに接続され、ドレインはトランジスタMP44、MP45のソースに接続される。トランジスタMP44のゲートは制御線AZSL1に接続され、ソースはトランジスタMP43のドレインおよびトランジスタMP45のソースに接続され、ドレインは信号線SGL2に接続される。トランジスタMP45のゲートは制御線DSLに接続され、ソースはトランジスタMP43のドレインおよびトランジスタMP44のソースに接続され、ドレインはトランジスタMP46のソースおよび発光素子ELのアノードに接続される。トランジスタMP46のゲートは制御線AZSL2に接続され、ソースはトランジスタMP45のドレインおよび発光素子ELのアノードに接続され、ドレインは電源線VSSに接続される。発光素子ELのアノードはトランジスタMP45のドレインおよびトランジスタMP46のソースに接続され、カソードは電源線Vcathに接続される。 Pixel PIX has a capacitor C41, transistors MP42 to MP46, and a light-emitting element EL. Transistors MP42 to MP46 are P-type MOSFETs. The gate of transistor MP42 is connected to control line WSL1, its source is connected to signal line SGL2, and its drain is connected to the gate of transistor MP43 and capacitor C41. One end of capacitor C41 is connected to power supply line VCCP, and the other end is connected to the drain of transistor MP42 and the gate of transistor MP43. The gate of transistor MP43 is connected to the drain of transistor MP42 and the other end of capacitor C41, its source is connected to power supply line VCCP, and its drain is connected to the sources of transistors MP44 and MP45. The gate of transistor MP44 is connected to control line AZSL1, its source is connected to the drain of transistor MP43 and the source of transistor MP45, and its drain is connected to signal line SGL2. The gate of transistor MP45 is connected to control line DSL, its source is connected to the drain of transistor MP43 and the source of transistor MP44, and its drain is connected to the source of transistor MP46 and the anode of light-emitting element EL. The gate of transistor MP46 is connected to control line AZSL2, its source is connected to the drain of transistor MP45 and the anode of light-emitting element EL, and its drain is connected to power supply line VSS. The anode of light-emitting element EL is connected to the drain of transistor MP45 and the source of transistor MP46, and its cathode is connected to power supply line Vcath.

 この構成により、画素PIXでは、トランジスタMP42がオン状態になることにより、信号線SGL1からキャパシタC49を介して供給された画素信号に基づいてキャパシタC41の両端間の電圧が設定される。トランジスタMP45は、制御線DSLの信号に基づいてオンオフする。トランジスタMP43は、トランジスタMP45がオン状態である期間において、キャパシタC41の両端間の電圧に応じた電流を発光素子ELに流す。発光素子ELは、トランジスタMP43から供給された電流に基づいて発光する。このようにして、画素PIXは、画素信号に応じた輝度で発光する。トランジスタMP44は、制御線AZSL1の信号に基づいてオンオフする。トランジスタMP44がオン状態である期間において、トランジスタMP43のドレインおよび信号線SGL2が互いに接続される。トランジスタMP46は、制御線AZSL2の信号に基づいてオンオフする。トランジスタMP46がオン状態になる期間において、発光素子ELのアノードの電圧は電源線VSSの電圧に設定されることにより初期化される。 With this configuration, in pixel PIX, when transistor MP42 is turned on, the voltage across capacitor C41 is set based on the pixel signal supplied from signal line SGL1 via capacitor C49. Transistor MP45 turns on and off based on the signal on control line DSL. While transistor MP45 is on, transistor MP43 passes a current to the light-emitting element EL that corresponds to the voltage across capacitor C41. The light-emitting element EL emits light based on the current supplied from transistor MP43. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal. Transistor MP44 turns on and off based on the signal on control line AZSL1. While transistor MP44 is on, the drain of transistor MP43 and signal line SGL2 are connected to each other. Transistor MP46 turns on and off based on the signal on control line AZSL2. While transistor MP46 is on, the anode voltage of the light-emitting element EL is initialized by being set to the voltage of the power supply line VSS.

 なお、トランジスタMP42~MP46、MP49は、低温多結晶シリコン(LTPS:Low Temperature Poly Silicon)を用いたトランジスタであってもよい。また、トランジスタMP42、MP46、MP49のうち少なくともいずれかは、酸化物半導体を用いたトランジスタであってもよい。 Note that transistors MP42 to MP46 and MP49 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MP42, MP46 and MP49 may be a transistor using an oxide semiconductor.

(第6構成例)
 図22は、画素PIXの他の一構成例を表すものである。複数の画素PIXは、表示領域100にマトリクス状に設けられ、表示領域100は、第1の制御部91と第2の制御部92の間に設けられる。
(Sixth Configuration Example)
22 shows another example of the configuration of the pixel PIX. A plurality of pixels PIX are arranged in a matrix in a display area 100, and the display area 100 is provided between a first control unit 91 and a second control unit 92.

 第1の制御部91は、トランスミッションゲートTG45、TG46と、トランジスタMP50、MP51と、キャパシタC50とを有している。トランジスタMP50、MP51は、P型のMOSFETである。トランスミッションゲートTG45の入力端には画素信号が供給され、トランスミッションゲートTG45の出力端は信号線93aの一端に接続される。トランスミッションゲートTG46の入力端は信号線93bに接続され、トランスミッションゲートTG46の出力端は電源線Vorstに接続される。キャパシタC50の一端は信号線93aに接続され、他端は電源線VSS1に接続される。トランジスタMP50のゲートは制御線INILに接続され、ソースは電源線Viniに接続され、ドレインは信号線93bに接続される。トランジスタMP51のゲートは制御線ELLに接続され、ソースは電源線Velに接続され、ドレインは信号線93bに接続される。 The first control unit 91 has transmission gates TG45 and TG46, transistors MP50 and MP51, and a capacitor C50. Transistors MP50 and MP51 are P-type MOSFETs. A pixel signal is supplied to the input terminal of transmission gate TG45, and the output terminal of transmission gate TG45 is connected to one end of signal line 93a. The input terminal of transmission gate TG46 is connected to signal line 93b, and the output terminal of transmission gate TG46 is connected to power supply line Vorst. One end of capacitor C50 is connected to signal line 93a, and the other end is connected to power supply line VSS1. The gate of transistor MP50 is connected to control line INIL, the source is connected to power supply line Vini, and the drain is connected to signal line 93b. The gate of transistor MP51 is connected to control line ELL, the source is connected to power supply line Vel, and the drain is connected to signal line 93b.

 第2の制御部92は、トランスミッションゲートTG72と、トランジスタMP73と、キャパシタC82とを有している。トランジスタMP73は、P型のMOSFETである。トランスミッションゲートTG72の入力端は信号線93aの他端に接続され、出力端はトランジスタMP73のドレインおよびキャパシタC82の一端に接続される。トランジスタMP73のゲートは制御線REFLに接続され、ソースは電源線Vrefに接続され、ドレインはトランスミッションゲートTG72の出力端およびキャパシタC82の一端に接続される。キャパシタC82の一端はトランスミッションゲートTG72の出力端およびトランジスタMP73のドレインに接続され、他端は信号線93bの一端に接続される。 The second control unit 92 has a transmission gate TG72, a transistor MP73, and a capacitor C82. The transistor MP73 is a P-type MOSFET. The input terminal of the transmission gate TG72 is connected to the other end of the signal line 93a, and the output terminal is connected to the drain of the transistor MP73 and one end of the capacitor C82. The gate of the transistor MP73 is connected to the control line REFL, the source is connected to the power supply line Vref, and the drain is connected to the output terminal of the transmission gate TG72 and one end of the capacitor C82. One end of the capacitor C82 is connected to the output terminal of the transmission gate TG72 and the drain of the transistor MP73, and the other end is connected to one end of the signal line 93b.

 画素PIXは、キャパシタC132と、トランジスタMP121~MP125と、発光素子ELとを有している。トランジスタMP121~MP125は、P型のMOSFETである。トランジスタMP122のゲートは制御線WSLに接続され、ソースは信号線93bに接続され、ドレインはトランジスタMP121のゲートおよびキャパシタC132に接続される。キャパシタC132の一端は電源線Velに接続され、他端はトランジスタMP122のドレインおよびトランジスタMP121のゲートに接続される。トランジスタMP121のゲートはトランジスタMP122のドレインおよびキャパシタC132の他端に接続され、ソースは電源線Velに接続され、ドレインはトランジスタMP123、MP124のソースに接続される。トランジスタMP123のゲートは制御線AZSLに接続され、ソースはトランジスタMP121のドレインおよびトランジスタMP124のソースに接続され、ドレインは信号線93bに接続される。トランジスタMP124のゲートは制御線DSLに接続され、ソースはトランジスタMP121のドレインおよびトランジスタMP123のソースに接続され、ドレインはトランジスタMP125のドレインおよび発光素子ELのアノードに接続される。トランジスタMP125のゲートは制御線AZSLに接続され、ソースは電源線Vorstに接続され、ドレインはトランジスタMP124のドレインおよび発光素子ELのアノードに接続される。発光素子ELのアノードはトランジスタMP124およびトランジスタMP125のドレインに接続され、カソードは電源線Vcathに接続される。 Pixel PIX has a capacitor C132, transistors MP121 to MP125, and a light-emitting element EL. Transistors MP121 to MP125 are P-type MOSFETs. The gate of transistor MP122 is connected to control line WSL, its source is connected to signal line 93b, and its drain is connected to the gate of transistor MP121 and capacitor C132. One end of capacitor C132 is connected to power supply line Vel, and the other end is connected to the drain of transistor MP122 and the gate of transistor MP121. The gate of transistor MP121 is connected to the drain of transistor MP122 and the other end of capacitor C132, its source is connected to power supply line Vel, and its drain is connected to the sources of transistors MP123 and MP124. The gate of transistor MP123 is connected to control line AZSL, its source is connected to the drain of transistor MP121 and the source of transistor MP124, and its drain is connected to signal line 93b. The gate of transistor MP124 is connected to control line DSL, its source is connected to the drain of transistor MP121 and the source of transistor MP123, and its drain is connected to the drain of transistor MP125 and the anode of light-emitting element EL. The gate of transistor MP125 is connected to control line AZSL, its source is connected to power supply line Vorst, and its drain is connected to the drain of transistor MP124 and the anode of light-emitting element EL. The anode of light-emitting element EL is connected to the drains of transistor MP124 and transistor MP125, and its cathode is connected to power supply line Vcath.

 この構成により、画素PIXでは、トランジスタMP122がオン状態になることにより、トランスミッションゲートTG45、信号線93a、トランスミッションゲートTG72、キャパシタC82および信号線93bを介して供給された画素信号に基づいてキャパシタC132の両端間の電圧が設定される。トランジスタMP124は、制御線DSLの信号に基づいてオンオフする。トランジスタMP121は、トランジスタMP124がオン状態である期間において、キャパシタC132の両端間の電圧に応じた電流を発光素子ELに流す。発光素子ELは、トランジスタMP121から供給された電流に基づいて発光する。このようにして、画素PIXは、画素信号に応じた輝度で発光する。トランジスタMP123,MP125は、制御線AZSLの信号に基づいてオンオフする。トランジスタMP123がオン状態である期間において、トランジスタMP121のドレインおよびトランジスタMP124のソースが信号線93bに接続される。トランジスタMP125がオン状態になる期間において、発光素子ELのアノードの電圧は電源線Vorstの電圧に設定されることにより初期化される。また、トランジスタMP50は、制御線INILの信号に基づいてオンオフし、トランジスタMP51は、制御線ELLの信号に基づいてオンオフし、トランジスタMP73は、制御線REFLの信号に基づいてオンオフする。トランジスタMP50がオン状態になると、信号線93bは電源線Viniの電圧に設定され、トランジスタMP51がオン状態になると、信号線93bは電源線Velの電圧に設定される。トランジスタMP73がオン状態になると、キャパシタC82の一端は電源線Vrefの電圧に設定されることにより初期化される。 With this configuration, in pixel PIX, when transistor MP122 is turned on, the voltage across capacitor C132 is set based on the pixel signal supplied via transmission gate TG45, signal line 93a, transmission gate TG72, capacitor C82, and signal line 93b. Transistor MP124 turns on and off based on the signal on control line DSL. While transistor MP124 is on, transistor MP121 passes a current to light-emitting element EL that corresponds to the voltage across capacitor C132. The light-emitting element EL emits light based on the current supplied from transistor MP121. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal. Transistors MP123 and MP125 turn on and off based on the signal on control line AZSL. While transistor MP123 is on, the drain of transistor MP121 and the source of transistor MP124 are connected to signal line 93b. During the period when transistor MP125 is in the ON state, the anode voltage of light-emitting element EL is initialized by being set to the voltage of power supply line Vorst. Furthermore, transistor MP50 turns on and off based on the signal on control line INIL, transistor MP51 turns on and off based on the signal on control line ELL, and transistor MP73 turns on and off based on the signal on control line REFL. When transistor MP50 is in the ON state, signal line 93b is set to the voltage of power supply line Vini, and when transistor MP51 is in the ON state, signal line 93b is set to the voltage of power supply line Vel. When transistor MP73 is in the ON state, one end of capacitor C82 is initialized by being set to the voltage of power supply line Vref.

 なお、トランジスタMP121~MP125、MP50、MP51は、低温多結晶シリコン(LTPS:Low Temperature Poly Silicon)を用いたトランジスタであってもよい。また、トランジスタMP122、MP125のうち少なくともいずれかは、酸化物半導体を用いたトランジスタであってもよい。 Note that transistors MP121 to MP125, MP50, and MP51 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MP122 and MP125 may be a transistor using an oxide semiconductor.

(第7構成例)
 図23は、画素PIXの他の一構成例を表すものである。この画素PIXは、キャパシタC51と、トランジスタMP52~MP60と、発光素子ELとを有している。トランジスタMP52~MP60はP型のMOSFETである。トランジスタMP52のゲートは制御線WSLに接続され、ソースは信号線SGLに接続され、ドレインはトランジスタMP53のドレインおよびトランジスタMP54のソースに接続される。トランジスタMP53のゲートは制御線DSLに接続され、ソースは電源線VCCPに接続され、ドレインはトランジスタMP52のドレインおよびトランジスタMP54のソースに接続される。トランジスタMP54のゲートはトランジスタMP55のソース、トランジスタMP57のドレイン、およびキャパシタC51に接続され、ソースはトランジスタMP52,MP53のドレインに接続され、ドレインはトランジスタMP58,MP59のソースに接続される。キャパシタC51の一端は電源線VCCPに接続され、他端はトランジスタMP54のゲート、トランジスタMP55のソース、およびトランジスタMP57のドレインに接続される。キャパシタC51は、互いに並列に接続された2つのキャパシタを含んでいてもよい。トランジスタMP55のゲートは制御線AZSL1に接続され、ソースはトランジスタMP54のゲート、トランジスタMP57のドレイン、およびキャパシタC51の他端に接続され、ドレインはトランジスタMP56のソースに接続される。トランジスタMP56のゲートは制御線AZSL1に接続され、ソースはトランジスタMP55のドレインに接続され、ドレインは電源線VSSに接続される。トランジスタMP57のゲートは制御線WSLに接続され、ドレインはトランジスタMP54のゲート、トランジスタMP55のソース、およびキャパシタC51の他端に接続され、ソースはトランジスタMP58のドレインに接続される。トランジスタMP58のゲートは制御線WSLに接続され、ドレインはトランジスタMP57のソースに接続され、ソースはトランジスタMP54のドレインおよびトランジスタMP59のソースに接続される。トランジスタMP59のゲートは制御線DSLに接続され、ソースはトランジスタMP54のドレインおよびトランジスタMP58のソースに接続され、ドレインはトランジスタMP60のソースおよび発光素子ELのアノードに接続される。トランジスタMP60のゲートは制御線AZSL2に接続され、ソースはトランジスタMP59のドレインおよび発光素子ELのアノードに接続され、ドレインは電源線VSSに接続される。発光素子ELのアノードはトランジスタMP59のドレインおよびトランジスタMP60のソースに接続され、カソードは電源線Vcathに接続される。
(Seventh Configuration Example)
23 shows another example of the configuration of pixel PIX. This pixel PIX has a capacitor C51, transistors MP52 to MP60, and a light-emitting element EL. Transistors MP52 to MP60 are P-type MOSFETs. The gate of transistor MP52 is connected to a control line WSL, its source is connected to a signal line SGL, and its drain is connected to the drain of transistor MP53 and the source of transistor MP54. The gate of transistor MP53 is connected to a control line DSL, its source is connected to a power supply line VCCP, and its drain is connected to the drain of transistor MP52 and the source of transistor MP54. The gate of transistor MP54 is connected to the source of transistor MP55, the drain of transistor MP57, and capacitor C51, its source is connected to the drains of transistors MP52 and MP53, and its drain is connected to the sources of transistors MP58 and MP59. One end of capacitor C51 is connected to the power supply line VCCP, and the other end is connected to the gate of transistor MP54, the source of transistor MP55, and the drain of transistor MP57. Capacitor C51 may include two capacitors connected in parallel. Transistor MP55 has a gate connected to control line AZSL1, a source connected to the gate of transistor MP54, the drain of transistor MP57, and the other end of capacitor C51, and a drain connected to the source of transistor MP56. Transistor MP56 has a gate connected to control line AZSL1, a source connected to the drain of transistor MP55, and a drain connected to power supply line VSS. Transistor MP57 has a gate connected to control line WSL, a drain connected to the gate of transistor MP54, the source of transistor MP55, and the other end of capacitor C51, and a source connected to the drain of transistor MP58. The gate of transistor MP58 is connected to the control line WSL, the drain is connected to the source of transistor MP57, and the source is connected to the drain of transistor MP54 and the source of transistor MP59. The gate of transistor MP59 is connected to the control line DSL, the source is connected to the drain of transistor MP54 and the source of transistor MP58, and the drain is connected to the source of transistor MP60 and the anode of the light-emitting element EL. The gate of transistor MP60 is connected to the control line AZSL2, the source is connected to the drain of transistor MP59 and the anode of the light-emitting element EL, and the drain is connected to the power supply line VSS. The anode of the light-emitting element EL is connected to the drain of transistor MP59 and the source of transistor MP60, and the cathode is connected to the power supply line Vcath.

 この構成により、画素PIXでは、トランジスタMP52,MP54,MP58,MP57がオン状態になることにより、信号線SGLから供給された画素信号に基づいてキャパシタC51の両端間の電圧が設定される。トランジスタMP53,MP59は、制御線DSLの信号に基づいてオンオフする。トランジスタMP54は、トランジスタMP53,MP59がオン状態である期間において、キャパシタC51の両端間の電圧に応じた電流を、発光素子ELに流す。発光素子ELは、トランジスタMP54から供給された電流に基づいて発光する。このようにして、画素PIXは、画素信号に応じた輝度で発光する。トランジスタMP55,MP56は、制御線AZSL1の信号に基づいてオンオフする。トランジスタMP55,MP56がオン状態である期間において、トランジスタMP54のゲートの電圧は電源線VSSの電圧に設定されることにより初期化される。トランジスタMP60は、制御線AZSL2の信号に基づいてオンオフする。トランジスタMP60がオン状態である期間において、発光素子ELのアノードの電圧は電源線VSSの電圧に設定されることにより初期化される。 With this configuration, in pixel PIX, transistors MP52, MP54, MP58, and MP57 are turned on, and the voltage across capacitor C51 is set based on the pixel signal supplied from signal line SGL. Transistors MP53 and MP59 are turned on and off based on the signal on control line DSL. While transistors MP53 and MP59 are on, transistor MP54 passes a current corresponding to the voltage across capacitor C51 through light-emitting element EL. The light-emitting element EL emits light based on the current supplied from transistor MP54. In this way, pixel PIX emits light at a brightness corresponding to the pixel signal. Transistors MP55 and MP56 are turned on and off based on the signal on control line AZSL1. While transistors MP55 and MP56 are on, the gate voltage of transistor MP54 is initialized by being set to the voltage of power supply line VSS. Transistor MP60 is turned on and off based on the signal on control line AZSL2. While transistor MP60 is in the on state, the anode voltage of the light-emitting element EL is initialized by being set to the voltage of the power supply line VSS.

 なお、トランジスタMP52~MP60は、低温多結晶シリコン(LTPS:Low Temperature Poly Silicon)を用いたトランジスタであってもよい。また、トランジスタMP55~MP58、MP60のうち少なくともいずれかは、酸化物半導体を用いたトランジスタであってもよい。 Note that transistors MP52 to MP60 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MP55 to MP58 and MP60 may be a transistor using an oxide semiconductor.

(第8構成例)
 図24は、画素PIXの他の一構成例を表すものである。制御線WSNLの信号および制御線WSPLの信号は、互いに反転した信号である。
(Eighth Configuration Example)
24 shows another example of the configuration of the pixel PIX. The signal on the control line WSNL and the signal on the control line WSPL are mutually inverted signals.

 画素PIXは、キャパシタC61,C62と、トランジスタMN63,MP64,MN65~MN67と、発光素子ELとを有している。トランジスタMN63,MN65~MN67はN型のMOSFETであり、トランジスタMP64はP型のMOSFETである。トランジスタMN63のゲートは制御線WSNLに接続され、ドレインは信号線SGLおよびトランジスタMP64のソースに接続され、ソースはトランジスタMP64のドレイン、キャパシタC61,C62、およびトランジスタMN65のゲートに接続される。トランジスタMP64のゲートは制御線WSPLに接続され、ソースは信号線SGLおよびトランジスタMN63のドレインに接続され、ドレインはトランジスタMN63のソース、キャパシタC61,C62、およびトランジスタMN65のゲートに接続される。キャパシタC61は、例えばMOM(Metal Oxide Metal)キャパシタを用いて構成され、一端はトランジスタMN63のソース、トランジスタMP64のドレイン、キャパシタC62、およびトランジスタMN65のゲートに接続され、他端は電源線VSS2に接続される。なお、キャパシタC61は、例えばMOSキャパシタやMIM(Metal Insulator Metal)キャパシタを用いて構成されてもよい。キャパシタC62は、例えばMOSキャパシタを用いて構成され、一端はトランジスタMN63のソース、トランジスタMP64のドレイン、キャパシタC61の一端、およびトランジスタMN65のゲートに接続され、他端は電源線VSS2に接続される。なお、キャパシタC62は、例えば、MOMキャパシタやMIMキャパシタを用いて構成されてもよい。また、キャパシタC62の他端は、電源線VSS3(図示省略)に接続されてもよい。トランジスタMN65のゲートはトランジスタMN63のソース、トランジスタMP64のドレイン、およびキャパシタC61,C62の一端に接続され、ドレインは電源線VCCPに接続され、ソースはトランジスタMN66,MN67のドレインに接続される。トランジスタMN66のゲートは制御線AZLに接続され、ドレインはトランジスタMN65のソースおよびトランジスタMN67のドレインに接続され、ソースは電源線VSS1に接続される。トランジスタMN67のゲートは制御線DSLに接続され、ドレインはトランジスタMN65のソースおよびトランジスタMN66のドレインに接続され、ソースは発光素子ELのアノードに接続される。発光素子ELのアノードはトランジスタMN67のソースに接続され、カソードは電源線Vcathに接続される。なお、トランジスタMN67および制御線DSLを設けず、トランジスタMN65のソースがトランジスタMN66のドレインおよび発光素子ELのアノードに接続される構成としてもよい。 Pixel PIX has capacitors C61 and C62, transistors MN63, MP64, MN65 to MN67, and a light-emitting element EL. Transistors MN63, MN65 to MN67 are N-type MOSFETs, and transistor MP64 is a P-type MOSFET. The gate of transistor MN63 is connected to control line WSNL, the drain is connected to signal line SGL and the source of transistor MP64, and the source is connected to the drain of transistor MP64, capacitors C61 and C62, and the gate of transistor MN65. The gate of transistor MP64 is connected to control line WSPL, the source is connected to signal line SGL and the drain of transistor MN63, and the drain is connected to the source of transistor MN63, capacitors C61 and C62, and the gate of transistor MN65. The capacitor C61 is configured, for example, using a MOM (Metal Oxide Metal) capacitor, and one end is connected to the source of the transistor MN63, the drain of the transistor MP64, the capacitor C62, and the gate of the transistor MN65, and the other end is connected to the power supply line VSS2. The capacitor C61 may be configured, for example, using a MOS capacitor or a MIM (Metal Insulator Metal) capacitor. The capacitor C62 is configured, for example, using a MOS capacitor, and one end is connected to the source of the transistor MN63, the drain of the transistor MP64, one end of the capacitor C61, and the gate of the transistor MN65, and the other end is connected to the power supply line VSS2. The capacitor C62 may be configured, for example, using a MOM capacitor or a MIM capacitor. The other end of the capacitor C62 may be connected to the power supply line VSS3 (not shown). The gate of transistor MN65 is connected to the source of transistor MN63, the drain of transistor MP64, and one end of capacitors C61 and C62, its drain is connected to the power supply line VCCP, and its source is connected to the drains of transistors MN66 and MN67. The gate of transistor MN66 is connected to control line AZL, its drain is connected to the source of transistor MN65 and the drain of transistor MN67, and its source is connected to power supply line VSS1. The gate of transistor MN67 is connected to control line DSL, its drain is connected to the source of transistor MN65 and the drain of transistor MN66, and its source is connected to the anode of light-emitting element EL. The anode of light-emitting element EL is connected to the source of transistor MN67, and its cathode is connected to the power supply line Vcath. Note that transistor MN67 and control line DSL may be omitted, and the source of transistor MN65 may be connected to the drain of transistor MN66 and the anode of light-emitting element EL.

 この構成により、画素PIXでは、トランジスタMN63,MP64のうちの少なくとも一方がオン状態になることにより、信号線SGLから供給された画素信号に基づいてキャパシタC61,C62の両端間の電圧が設定される。トランジスタMN67は、制御線DSLの信号に基づいてオンオフする。トランジスタMN65は、トランジスタMN67がオン状態である期間において、キャパシタC61,C62の両端間の電圧に応じた電流を、発光素子ELに流す。発光素子ELは、トランジスタMP65から供給された電流に基づいて発光する。このようにして、画素PIXは、画素信号に応じた輝度で発光する。トランジスタMN66は、制御線AZLの信号に基づいてオンオフしてもよい。また、トランジスタMN66は、制御線AZLの信号に応じた抵抗値を有する抵抗素子として機能してもよい。この場合、トランジスタMN65およびトランジスタMN66はいわゆるソースフォロワ回路を構成する。 With this configuration, in pixel PIX, when at least one of transistors MN63 and MP64 is turned on, the voltage across capacitors C61 and C62 is set based on the pixel signal supplied from signal line SGL. Transistor MN67 turns on and off based on the signal on control line DSL. While transistor MN67 is on, transistor MN65 passes a current to light-emitting element EL that corresponds to the voltage across capacitors C61 and C62. The light-emitting element EL emits light based on the current supplied from transistor MP65. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal. Transistor MN66 may be turned on and off based on the signal on control line AZL. Transistor MN66 may also function as a resistor element having a resistance value that corresponds to the signal on control line AZL. In this case, transistors MN65 and MN66 form a so-called source follower circuit.

 なお、トランジスタMN63,MP64,MN65~MN67は、低温多結晶シリコン(LTPS:Low Temperature Poly Silicon)を用いたトランジスタであってもよい。また、トランジスタMN63,MP64,MN66のうち少なくともいずれかは、酸化物半導体を用いたトランジスタであってもよい。 Note that transistors MN63, MP64, MN65 to MN67 may be transistors using low temperature polycrystalline silicon (LTPS). Furthermore, at least one of transistors MN63, MP64, and MN66 may be a transistor using an oxide semiconductor.

(第9構成例)
 図25は、画素PIXの他の一構成例を表すものである。この画素PIXは、キャパシタC71と、トランジスタMN72~MN77と、発光素子ELとを有している。トランジスタMN72~MN77はN型のMOSFETである。トランジスタMN72のゲートは制御線WSLに接続され、ドレインは信号線SGLに接続され、ソースはトランジスタMN74のソースおよびトランジスタMN75のドレインに接続される。キャパシタC71の一端はトランジスタMN74のゲートおよびトランジスタMN76のソースに接続され、他端はトランジスタMN77のドレイン、トランジスタMN75のソース、および発光素子ELのアノードに接続される。トランジスタMN73のゲートは制御線DSL1に接続され、ドレインは電源線VCCPに接続され、ソースはトランジスタMN74のドレインおよびトランジスタMN76のドレインに接続される。トランジスタMN74のゲートはトランジスタMN76のソースおよびキャパシタC71の一端に接続され、ドレインはトランジスタMN73のソースおよびトランジスタMN76のドレインに接続され、ソースはトランジスタMN72のソースおよびトランジスタMN75のドレインに接続される。トランジスタMN75のゲートは制御線DSL2に接続され、ドレインはトランジスタMN72のソースおよびトランジスタMN74のソースに接続され、ソースはキャパシタC71の他端、トランジスタMN77のドレイン、および発光素子ELのアノードに接続される。トランジスタMN76のゲートは制御線AZSLに接続され、ドレインはトランジスタMN73のソースおよびトランジスタMN74のドレインに接続され、ソースはトランジスタMN74のゲートおよびキャパシタC71の一端に接続される。トランジスタMN77のゲートは制御線AZSLに接続され、ドレインはキャパシタC71の他端、トランジスタMN75のソース、および発光素子ELのアノードに接続され、ソースは電源線VSSに接続される。発光素子ELのアノードはトランジスタMN75のソース、トランジスタMN77のドレインおよびキャパシタC71の他端に接続され、カソードは電源線Vcathに接続される。
(Ninth Configuration Example)
25 shows another example of the configuration of pixel PIX. This pixel PIX has a capacitor C71, transistors MN72 to MN77, and a light-emitting element EL. Transistors MN72 to MN77 are N-type MOSFETs. The gate of transistor MN72 is connected to a control line WSL, the drain is connected to a signal line SGL, and the source is connected to the source of transistor MN74 and the drain of transistor MN75. One end of capacitor C71 is connected to the gate of transistor MN74 and the source of transistor MN76, and the other end is connected to the drain of transistor MN77, the source of transistor MN75, and the anode of light-emitting element EL. The gate of transistor MN73 is connected to control line DSL1, the drain is connected to a power supply line VCCP, and the source is connected to the drain of transistor MN74 and the drain of transistor MN76. The gate of transistor MN74 is connected to the source of transistor MN76 and one end of capacitor C71, the drain is connected to the source of transistor MN73 and the drain of transistor MN76, and the source is connected to the source of transistor MN72 and the drain of transistor MN75. The gate of transistor MN75 is connected to control line DSL2, the drain is connected to the source of transistor MN72 and the source of transistor MN74, and the source is connected to the other end of capacitor C71, the drain of transistor MN77, and the anode of light-emitting element EL. The gate of transistor MN76 is connected to control line AZSL, the drain is connected to the source of transistor MN73 and the drain of transistor MN74, and the source is connected to the gate of transistor MN74 and one end of capacitor C71. The gate of transistor MN77 is connected to control line AZSL, the drain is connected to the other end of capacitor C71, the source of transistor MN75, and the anode of light-emitting element EL, and the source is connected to power supply line VSS. The anode of the light emitting element EL is connected to the source of the transistor MN75, the drain of the transistor MN77 and the other end of the capacitor C71, and the cathode is connected to the power supply line Vcath.

 この構成により、画素PIXでは、トランジスタMN72,MN74,MN76がオン状態になることにより、信号線SGLから供給された画素信号に基づいてキャパシタC71の両端間の電圧が設定される。トランジスタMN73は、制御線DSL1の信号に基づいてオンオフし、トランジスタMN75は、制御線DSL2の信号に基づいてオンオフする。トランジスタMN74は、トランジスタMN73,MN75がオン状態である期間において、キャパシタC71の両端間の電圧に応じた電流を発光素子ELに流す。発光素子ELは、トランジスタMN74から供給された電流に基づいて発光する。このようにして、画素PIXは、画素信号に応じた輝度で発光する。トランジスタMN77は、制御線AZSLの信号に基づいてオンオフする。トランジスタMN77がオン状態である期間において、発光素子ELのアノードの電圧は電源線VSSの電圧に設定されることにより初期化される。 With this configuration, in pixel PIX, transistors MN72, MN74, and MN76 are turned on, and the voltage across capacitor C71 is set based on the pixel signal supplied from signal line SGL. Transistor MN73 turns on and off based on the signal on control line DSL1, and transistor MN75 turns on and off based on the signal on control line DSL2. While transistors MN73 and MN75 are on, transistor MN74 passes a current to light-emitting element EL that corresponds to the voltage across capacitor C71. Light-emitting element EL emits light based on the current supplied from transistor MN74. In this way, pixel PIX emits light at a brightness that corresponds to the pixel signal. Transistor MN77 turns on and off based on the signal on control line AZSL. While transistor MN77 is on, the anode voltage of light-emitting element EL is initialized by being set to the voltage of power supply line VSS.

 なお、トランジスタMN72~MN77は、低温多結晶シリコン(LTPS:Low Temperature Poly Silicon)を用いたトランジスタであってもよい。また、トランジスタMN76は、酸化物半導体を用いたトランジスタであってもよい。 Note that transistors MN72 to MN77 may be transistors using low temperature polycrystalline silicon (LTPS). Transistor MN76 may also be a transistor using an oxide semiconductor.

<10.変形例>
 以上、本技術の実施の形態等について具体的に説明したが、本技術の内容は上述した実施の形態等に限定されるものではなく、本技術の技術的思想に基づく各種の変形が可能である。例えば、上述した実施の形態等の構成、方法、工程、材料、形状および数値等は、本技術の主旨を逸脱しない限り、互いに組み合わせることや入れ替えることが可能である。また、1つのものを2つ以上に分けることも可能であり、一部を省略することも可能である。また、本技術を適用可能であれば、上述した各構成は、適宜、削除、変更、他の構成の付加をしてもよいし、代替可能な構成に入れ替えてもよい。また、本技術は、上述した各実施の形態を、適宜、組み合わせたものであってもよい。
10. Modifications
Although the embodiments of the present technology have been specifically described above, the content of the present technology is not limited to the above-described embodiments, and various modifications based on the technical concept of the present technology are possible. For example, the configurations, methods, processes, materials, shapes, and numerical values of the above-described embodiments can be combined or substituted with each other as long as they do not deviate from the spirit of the present technology. Furthermore, one thing can be divided into two or more parts, and some parts can be omitted. Furthermore, as long as the present technology is applicable, the above-described configurations may be appropriately deleted, modified, or added with other configurations, or may be replaced with alternative configurations. Furthermore, the present technology may be an appropriate combination of the above-described embodiments.

 例えば、電源制御対象の回路ブロック、常時電源オンの回路ブロックは、あくまで例示的なものであり、表示装置1を構成する回路ブロックに応じて適宜変更が可能である。また、回路ブロックの構成単位は、適宜、変更可能である。さらに、上述したXNOSIG_STATE信号、ISOEN信号はそれぞれ1種類に限らず、複数種類あってもよい。これにより、例えば、ロジック、アナログの回路別や、回路ブロック毎、表示設定モード毎の電源制御など、きめ細かい電源制御を行うことができる。スタンバイ時だけでなく、種々の回路ブロックの動作不要時に電源をオフにしてリーク電力を抑制することができる。 For example, the circuit blocks subject to power control and the circuit blocks that are always powered on are merely illustrative and can be changed as appropriate depending on the circuit blocks that make up the display device 1. The constituent units of the circuit blocks can also be changed as appropriate. Furthermore, the XNOSIG_STATE signal and ISOEN signal described above are not limited to one type each, and there can be multiple types. This allows for fine-grained power control, such as power control for logic and analog circuits, for each circuit block, or for each display setting mode. Leakage power can be reduced by turning off the power not only during standby but also when various circuit blocks do not need to operate.

 例えば、本技術は、種々のディスプレイに適用することができる。本技術は、例えば、プロジェクタ等で使用されるSXRD(Silicon X-tal Reflective Display:登録商標)等の表示パネル、ホログラム表示させるためのSLM(Spatial Light Modulator)を用いた位相変調のパネルに適用することができる。また、本技術は、例えば、LCOS(Liquid crystal on silicon ,LCoSは商標)、HTPS(High Temperature Poly-Silicon)等のパネルに適用することができる。上述したXNOSIG_STATE信号、ISOEN信号は、入出力部2を介して外部から取得してもよい。 For example, this technology can be applied to a variety of displays. This technology can be applied to display panels such as SXRD (Silicon X-tal Reflective Display: registered trademark) used in projectors, etc., and phase modulation panels that use SLM (Spatial Light Modulator) for displaying holograms. This technology can also be applied to panels such as LCOS (Liquid crystal on silicon; LCoS is a trademark) and HTPS (High Temperature Poly-Silicon). The above-mentioned XNOSIG_STATE signal and ISOEN signal may be obtained from outside via the input/output unit 2.

<11.適用例>
 次に、上記実施の形態および変形例で説明した表示システムの適用例について説明する。
<11. Application Examples>
Next, application examples of the display systems described in the above embodiments and modifications will be described.

(適用例1)
 図26は、ヘッドマウントディスプレイ110の外観の一例を表すものである。ヘッドマウントディスプレイ110は、例えば、眼鏡形の表示部111の両側に、使用者の頭部に装着するための耳掛け部112を有する。このようなヘッドマウントディスプレイ110に、上記実施の形態等に係る技術を適用することができる。
(Application example 1)
26 shows an example of the appearance of a head-mounted display 110. The head-mounted display 110 has, for example, ear hooks 112 for wearing on the user's head on both sides of a glasses-shaped display unit 111. The techniques according to the above-described embodiments and the like can be applied to such a head-mounted display 110.

(適用例2)
 図27は、他のヘッドマウントディスプレイ120の外観の一例を表すものである。ヘッドマウントディスプレイ120は、本体部121と、アーム部122と、鏡筒部123とを有する、透過式のヘッドマウントディスプレイである。このヘッドマウントディスプレイ120は、眼鏡128に装着されている。本体部121は、ヘッドマウントディスプレイ120の動作を制御するための制御基板や表示部を有している。この表示部は、表示画像の画像光を射出する。アーム部122は、本体部121と鏡筒部123とを連結し、鏡筒部123を支持する。鏡筒部123は、本体部121からアーム部122を介して供給された画像光を、眼鏡128のレンズ129を介して、ユーザの目に向かって投射する。このようなヘッドマウントディスプレイ120に、上記実施の形態等に係る技術を適用することができる。
(Application example 2)
FIG. 27 shows an example of the appearance of another head-mounted display 120. The head-mounted display 120 is a see-through head-mounted display having a main body 121, an arm 122, and a lens barrel 123. This head-mounted display 120 is attached to eyeglasses 128. The main body 121 has a control board and a display unit for controlling the operation of the head-mounted display 120. The display unit emits image light of a display image. The arm 122 connects the main body 121 to the lens barrel 123 and supports the lens barrel 123. The lens barrel 123 projects the image light supplied from the main body 121 via the arm 122 toward the user's eyes via lenses 129 of the eyeglasses 128. The techniques according to the above-described embodiments and the like can be applied to such a head-mounted display 120.

 なお、このヘッドマウントディスプレイ120は、いわゆる導光板方式のヘッドマウントディスプレイであるが、これに限定されるものではなく、例えば、いわゆるバードバス方式のヘッドマウントディスプレイであってもよい。このバードバス方式のヘッドマウントディスプレイは、例えば、ビームスプリッタと、部分的に透明なミラーとを備えている。ビームスプリッタは、画像情報でエンコードされた光をミラーに向けて出力し、ミラーは、光をユーザの目に向かって反射させる。ビームスプリッタおよび部分的に透明なミラーの両方は、部分的に透明である。これにより、周囲環境からの光がユーザの目に到達する。 Note that the head-mounted display 120 is a so-called light guide plate type head-mounted display, but is not limited to this and may be, for example, a so-called birdbath type head-mounted display. This birdbath type head-mounted display includes, for example, a beam splitter and a partially transparent mirror. The beam splitter outputs light encoded with image information toward the mirror, and the mirror reflects the light toward the user's eyes. Both the beam splitter and the partially transparent mirror are partially transparent. This allows light from the surrounding environment to reach the user's eyes.

(適用例3)
 図28A、図28Bは、デジタルスチルカメラ130の外観の一例を表すものであり、図28Aは正面図を示し、図28Bは背面図を示す。このデジタルスチルカメラ130は、レンズ交換式一眼レフレックスタイプのカメラであり、カメラ本体部(カメラボディ)131と、撮影レンズユニット132と、グリップ部133と、モニタ134と、電子ビューファインダ135とを有する。撮影レンズユニット132は、交換式のレンズユニットであり、カメラ本体部131の正面のほぼ中央付近に設けられる。グリップ部133は、カメラ本体部131の正面の左側に設けられ、撮影者は、このグリップ部133を把持するようになっている。モニタ134は、カメラ本体部131の背面のほぼ中央よりも左側に設けられる。電子ビューファインダ135は、カメラ本体部131の背面において、モニタ134の上部に設けられる。撮影者は、この電子ビューファインダ135を覗くことにより、撮影レンズユニット132から導かれた被写体の光像を視認し、構図を決定することができる。電子ビューファインダ135に、上記実施の形態等に係る技術を適用することができる。
(Application Example 3)
28A and 28B show an example of the appearance of a digital still camera 130, with FIG. 28A showing a front view and FIG. 28B showing a rear view. This digital still camera 130 is an interchangeable-lens single-lens reflex camera and includes a camera body 131, a photographing lens unit 132, a grip 133, a monitor 134, and an electronic viewfinder 135. The photographing lens unit 132 is an interchangeable lens unit and is provided near the center of the front of the camera body 131. The grip 133 is provided on the left side of the front of the camera body 131, and is held by the photographer. The monitor 134 is provided on the left side of the center of the back of the camera body 131. The electronic viewfinder 135 is provided above the monitor 134 on the back of the camera body 131. By looking through this electronic viewfinder 135, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 132 and determine the composition. The techniques according to the above-described embodiments and the like can be applied to the electronic viewfinder 135.

(適用例4)
 図29は、テレビジョン装置140の外観の一例を表すものである。テレビジョン装置140は、フロントパネル142およびフィルターガラス143を含む映像表示画面部141を有する。この映像表示画面部141に、上記実施の形態等に係る技術を適用することができる。
(Application Example 4)
29 shows an example of the appearance of a television device 140. The television device 140 has an image display screen unit 141 including a front panel 142 and a filter glass 143. The techniques according to the above-described embodiments and the like can be applied to this image display screen unit 141.

(適用例5)
 図30は、スマートフォン150の外観の一例を表すものである。スマートフォン150は、各種情報を表示する表示部151と、ユーザによる操作入力を受け付けるボタンなどを含む操作部152とを有する。この表示部151に、上記実施の形態等に係る技術を適用することができる。
(Application Example 5)
30 shows an example of the appearance of a smartphone 150. The smartphone 150 has a display unit 151 that displays various information and an operation unit 152 that includes buttons and the like that accept operation inputs from a user. The techniques according to the above-described embodiments and the like can be applied to this display unit 151.

(適用例6)
 図31A、図31Bは、本開示の技術が適用された車両の一構成例を表すものであり、図31Aは、車両200の後部から見た車両の内部の一例を示し、図31Bは、車両200の左後方からみた車両の内部の一例を示す。
(Application Example 6)
31A and 31B show an example configuration of a vehicle to which the technology of the present disclosure is applied, where FIG. 31A shows an example of the interior of the vehicle as seen from the rear of vehicle 200, and FIG. 31B shows an example of the interior of the vehicle as seen from the left rear of vehicle 200.

 図31A、図31Bの車両は、センターディスプレイ201と、コンソールディスプレイ202と、ヘッドアップディスプレイ203と、デジタルリアミラー204と、ステアリングホイールディスプレイ205と、リアエンタテイメントディスプレイ206とを有する。 The vehicle in Figures 31A and 31B has a center display 201, a console display 202, a head-up display 203, a digital rearview mirror 204, a steering wheel display 205, and a rear entertainment display 206.

 センターディスプレイ201は、ダッシュボード261における、運転席262および助手席263に対向する場所に配置されている。図31Aでは、運転席262側から助手席263側まで延びる横長形状のセンターディスプレイ201の例を示すが、センターディスプレイ201の画面サイズや配置場所はこれに限定されるものではない。センターディスプレイ201は、種々のセンサで検知された情報を表示可能である。具体的な一例として、センターディスプレイ201には、イメージセンサで撮影した撮影画像、ToFセンサで計測された、車両前方や側方の障害物までの距離画像、赤外線センサで検出された乗員の体温などを表示可能である。センターディスプレイ201は、例えば、安全関連情報、操作関連情報、ライフログ、健康関連情報、認証/識別関連情報、及びエンタテイメント関連情報の少なくとも一つを表示するために用いることができる。 The center display 201 is disposed on the dashboard 261 in a position facing the driver's seat 262 and passenger seat 263. While FIG. 31A shows an example of a horizontally elongated center display 201 extending from the driver's seat 262 side to the passenger seat 263 side, the screen size and location of the center display 201 are not limited to this. The center display 201 is capable of displaying information detected by various sensors. As a specific example, the center display 201 can display images captured by an image sensor, distance images to obstacles in front of and to the sides of the vehicle measured by a ToF sensor, and the body temperature of occupants detected by an infrared sensor. The center display 201 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication/identification-related information, and entertainment-related information.

 安全関連情報は、センサの検出結果に基づく、居眠り検知、よそ見検知、同乗している子供のいたずら検知、シートベルト装着有無、乗員の置き去り検知などの情報である。操作関連情報は、センサを用いて検出された、乗員の操作に関するジェスチャの情報である。ジェスチャは、車両内の種々の設備の操作を含んでいてもよく、例えば、空調設備、ナビゲーション装置、AV(Audio Visual)装置、照明装置等の操作を含む。ライフログは、乗員全員のライフログを含む。例えば、ライフログは、各乗員の行動記録を含む。ライフログを取得し保存することにより、事故が生じた際、乗員がどのような状態であったかを確認できる。健康関連情報は、温度センサを用いて検出された乗員の体温や、検出された体温に基づいて推測された乗員の健康状態の情報を含む。あるいは、乗員の健康状態の情報は、イメージセンサにより撮像された乗員の顔に基づいて推測されてもよい。また、乗員の健康状態の情報は、乗員と自動音声を用いて会話を行うことにより得られた乗員の回答内容に基づいて推測されてもよい。認証/識別関連情報は、センサを用いて顔認証を行うキーレスエントリ機能や、顔識別でシート高さや位置の自動調整機能などの情報を含む。エンタテイメント関連情報は、センサにより検出された乗員によるAV装置の操作情報や、センサにより検出され認識された乗員に適した、表示すべきコンテンツの情報などを含む。 Safety-related information is information based on sensor detection results, such as detection of drowsiness, distraction, tampering by children in the vehicle, whether seat belts are fastened, and whether a passenger has been abandoned. Operation-related information is information about gestures related to passenger operations detected using sensors. Gestures may include operations of various equipment within the vehicle, such as operations of air conditioning equipment, navigation equipment, AV (Audio-Visual) equipment, and lighting equipment. Life logs include life logs of all passengers. For example, life logs include records of the behavior of each passenger. By acquiring and saving life logs, it is possible to determine the condition of passengers at the time of an accident. Health-related information includes the body temperature of passengers detected using a temperature sensor and information about the passenger's health condition estimated based on the detected body temperature. Alternatively, information about the passenger's health condition may be estimated based on the passenger's face captured by an image sensor. Information about the passenger's health condition may also be estimated based on the passenger's responses obtained by conversation with the passenger using an automated voice. Authentication/identification-related information includes information such as the keyless entry function that uses sensors to perform facial recognition, and the function that automatically adjusts seat height and position using facial recognition. Entertainment-related information includes information on AV device operation by occupants detected by sensors, and information on content to be displayed that is appropriate for occupants detected and recognized by sensors.

 コンソールディスプレイ202は、例えばライフログ情報の表示に用いることができる。コンソールディスプレイ202は、運転席262と助手席263の間のセンターコンソール264における、シフトレバー265の近くに配置されている。コンソールディスプレイ202も、種々のセンサで検知された情報を表示可能である。また、コンソールディスプレイ202は、イメージセンサで撮像された車両周辺の画像を表示してもよいし、車両周辺の障害物までの距離画像を表示してもよい。 The console display 202 can be used to display life log information, for example. The console display 202 is located near the shift lever 265 on the center console 264 between the driver's seat 262 and the passenger seat 263. The console display 202 can also display information detected by various sensors. The console display 202 may also display an image of the area around the vehicle captured by an image sensor, or an image showing the distance to obstacles around the vehicle.

 ヘッドアップディスプレイ203は、運転席262の前方のフロントガラス266の奥に仮想的に表示される。ヘッドアップディスプレイ203は、例えば、安全関連情報、操作関連情報、ライフログ、健康関連情報、認証/識別関連情報、及びエンタテイメント関連情報の少なくとも一つを表示するために用いることができる。ヘッドアップディスプレイ203は、運転席262の正面に仮想的に配置されることが多いため、車両の速度、燃料の残量、バッテリの残量などの車両の操作に直接関連する情報を表示するのに適している。 The head-up display 203 is virtually displayed behind the windshield 266 in front of the driver's seat 262. The head-up display 203 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication/identification-related information, and entertainment-related information. Because the head-up display 203 is often virtually positioned in front of the driver's seat 262, it is suitable for displaying information directly related to vehicle operation, such as vehicle speed, remaining fuel, and remaining battery charge.

 デジタルリアミラー204は、車両の後方を表示できるだけでなく、後部座席の乗員の様子も表示できるため、例えば後部座席の乗員のライフログ情報の表示に用いることができる。 The digital rearview mirror 204 can not only display the view behind the vehicle, but also the status of rear seat passengers, and can therefore be used, for example, to display life log information of rear seat passengers.

 ステアリングホイールディスプレイ205は、車両のステアリングホイール267の中心付近に配置されている。ステアリングホイールディスプレイ205は、例えば、安全関連情報、操作関連情報、ライフログ、健康関連情報、認証/識別関連情報、及びエンタテイメント関連情報の少なくとも一つを表示するために用いることができる。特に、ステアリングホイールディスプレイ205は、運転者の手の近くにあるため、運転者の体温等のライフログ情報を表示したり、AV装置や空調設備等の操作に関する情報などを表示するのに適している。 The steering wheel display 205 is located near the center of the vehicle's steering wheel 267. The steering wheel display 205 can be used to display, for example, at least one of safety-related information, operation-related information, life log, health-related information, authentication/identification-related information, and entertainment-related information. In particular, because the steering wheel display 205 is located close to the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, and for displaying information related to the operation of AV equipment, air conditioning equipment, etc.

 リアエンタテイメントディスプレイ206は、運転席262や助手席263の背面側に取り付けられており、後部座席の乗員が視聴するためのものである。リアエンタテイメントディスプレイ206は、例えば、安全関連情報、操作関連情報、ライフログ、健康関連情報、認証/識別関連情報、及びエンタテイメント関連情報の少なくとも一つを表示するために用いることができる。特に、リアエンタテイメントディスプレイ206は、後部座席の乗員の目の前にあるため、後部座席の乗員に関連する情報が表示される。リアエンタテイメントディスプレイ206は、例えば、AV装置や空調設備の操作に関する情報を表示したり、後部座席の乗員の体温等を温度センサで計測した結果を表示してもよい。 The rear entertainment display 206 is attached to the back of the driver's seat 262 and passenger seat 263, and is intended for viewing by rear seat passengers. The rear entertainment display 206 can be used to display, for example, at least one of safety-related information, operation-related information, life logs, health-related information, authentication/identification-related information, and entertainment-related information. In particular, since the rear entertainment display 206 is located directly in front of the rear seat passengers, information relevant to the rear seat passengers is displayed on the rear entertainment display 206. The rear entertainment display 206 may, for example, display information relating to the operation of AV equipment or air conditioning equipment, or may display the body temperature of the rear seat passengers measured by a temperature sensor.

 これらのセンターディスプレイ201、コンソールディスプレイ202、ヘッドアップディスプレイ203、デジタルリアミラー204、ステアリングホイールディスプレイ205、リアエンタテイメントディスプレイ206に、上記実施の形態等に係る技術を適用することができる。 The technologies relating to the above-described embodiments can be applied to the center display 201, console display 202, head-up display 203, digital rearview mirror 204, steering wheel display 205, and rear entertainment display 206.

 なお、本技術は、以下のような構成も採ることができる。
(1)
 表示動作時に動作する複数の回路ブロックを有し、
 前記複数の回路ブロックは、スタンバイ時に電源がオフに制御される第1の回路ブロックを有する
 表示装置。
(2)
 前記電源の電源線と前記第1の回路ブロックとの間に設けられたスイッチと、
 前記スイッチを、前記スタンバイ時および前記第1の回路ブロックの動作不要時にオフに制御するスイッチ制御部と
 を有する
 (1)に記載の表示装置。
(3)
 複数の前記スイッチと、
 複数の前記スイッチを段階的にオンする遅延回路と
 を有する
 (2)に記載の表示装置。
(4)
 前記遅延回路は、バッファで構成されている
 (3)に記載の表示装置。
(5)
 前記遅延回路は、フリップフロップで構成されている
 (3)に記載の表示装置。
(6)
 前記複数の回路ブロックは、前記スタンバイ時に動作する第2の回路ブロックを有し、
 前記第1の回路ブロックから前記第2の回路ブロックへの信号伝達経路に、前記スタンバイ時における前記第1の回路ブロックの出力信号を制御する制御回路を有する
 (1)~(5)のうちの何れかに記載の表示装置。
(7)
 前記制御回路は、論理ゲートで構成されている
 (6)に記載の表示装置。
(8)
 前記制御回路は、フリップフロップで構成されている
 (6)に記載の表示装置。
(9)
 外部電源から前記電源を前記第1の回路ブロックに供給する電源経路を有し、
 前記外部電源が前記スタンバイ時および前記第1の回路ブロックの動作不要時に前記電源をオフにする
 (1)、(6)~(9)のうちの何れかに記載の表示装置。
(10)
 前記第1の回路ブロックに前記電源を供給する内部電源を有し、
 前記内部電源が前記スタンバイ時および前記第1の回路ブロックの動作不要時に前記電源をオフにする
 (1)、(6)~(9)のうちの何れかに記載の表示装置。
(11)
 発光素子を有する画素を複数有し、
 前記第1の回路ブロックは、前記画素を駆動するロジック部、または、前記ロジック部に出力される画像データに信号処理を施す信号処理部を含む
 (1)~(10)のうちの何れかに記載の表示装置。
(12)
 前記電源線は、前記電源の電源経路における高電位側の電源線である
 (2)~(8)、(11)のうちの何れかに記載の表示装置。
(13)
 前記電源線は、前記電源の電源経路における低電位側の電源線である
 (2)~(8)、(11)のうちの何れかに記載の表示装置。
(14)
 発光素子を有する画素を複数有し、
 前記第1の回路ブロックは、前記画素間を絶縁する絶縁体に絶縁用電圧を印加する回路ブロックである
 (2)~(8)、(11)~(13)のうちの何れかに記載の表示装置。
(15)
 前記スイッチは、酸化物半導体トランジスタを用いて形成されたものである
 (2)~(8)、(11)~(14)のうちの何れかに記載の表示装置。
(16)
 (1)~(15)のうちの何れかに記載の表示装置
 を有する電子機器。
The present technology can also be configured as follows.
(1)
It has a plurality of circuit blocks that operate during display operation,
The display device, wherein the plurality of circuit blocks includes a first circuit block whose power supply is controlled to be turned off during standby.
(2)
a switch provided between a power supply line of the power supply and the first circuit block;
and a switch control unit that controls the switch to be turned off during the standby state and when the operation of the first circuit block is not required.
(3)
A plurality of the switches;
and a delay circuit that turns on the plurality of switches in a stepwise manner.
(4)
The display device according to (3), wherein the delay circuit is configured by a buffer.
(5)
The display device according to (3), wherein the delay circuit is configured by a flip-flop.
(6)
the plurality of circuit blocks includes a second circuit block that operates during the standby state;
The display device according to any one of (1) to (5), further comprising a control circuit in a signal transmission path from the first circuit block to the second circuit block, the control circuit controlling an output signal of the first circuit block during standby.
(7)
The display device according to (6), wherein the control circuit is configured by a logic gate.
(8)
The display device according to (6), wherein the control circuit is configured by a flip-flop.
(9)
a power supply path for supplying the power from an external power supply to the first circuit block;
The display device according to any one of (1), (6) to (9), wherein the external power supply is turned off during the standby state and when the operation of the first circuit block is not required.
(10)
an internal power supply that supplies the power to the first circuit block;
The display device according to any one of (1), (6) to (9), wherein the internal power supply is turned off during the standby state and when the operation of the first circuit block is not required.
(11)
a plurality of pixels each having a light-emitting element;
The display device according to any one of (1) to (10), wherein the first circuit block includes a logic unit that drives the pixels, or a signal processing unit that performs signal processing on image data output to the logic unit.
(12)
The display device according to any one of (2) to (8) and (11), wherein the power supply line is a power supply line on a high potential side in a power supply path of the power supply.
(13)
The display device according to any one of (2) to (8) and (11), wherein the power supply line is a power supply line on a low potential side in a power supply path of the power supply.
(14)
a plurality of pixels each having a light-emitting element;
The display device according to any one of (2) to (8) and (11) to (13), wherein the first circuit block is a circuit block that applies an insulating voltage to an insulator that insulates the pixels from each other.
(15)
The display device according to any one of (2) to (8) and (11) to (14), wherein the switch is formed using an oxide semiconductor transistor.
(16)
An electronic device having the display device according to any one of (1) to (15).

 1・・・表示装置、2・・・入出力部、3・・・ガンマ処理部、4・・・電源処理部、5・・・インタフェース部、6・・・タイミングコントローラ、7・・・画素部、8・・・水平ロジック部、9・・・水平アナログ部、10・・・垂直ロジック部、11・・・垂直アナログ部、21・・・CLK+EN制御部、22・・・タイミングジェネレータ、23・・・信号処理部、24・・・レジスタ、40a~40g,81・・・スイッチ回路、50a~50d・・・制御回路、60・・・外部電源、70・・・内部電源 1: Display device, 2: Input/output unit, 3: Gamma processing unit, 4: Power supply processing unit, 5: Interface unit, 6: Timing controller, 7: Pixel unit, 8: Horizontal logic unit, 9: Horizontal analog unit, 10: Vertical logic unit, 11: Vertical analog unit, 21: CLK+EN control unit, 22: Timing generator, 23: Signal processing unit, 24: Register, 40a-40g, 81: Switch circuit, 50a-50d: Control circuit, 60: External power supply, 70: Internal power supply

Claims (16)

 表示動作時に動作する複数の回路ブロックを有し、
 前記複数の回路ブロックは、スタンバイ時に電源がオフに制御される第1の回路ブロックを有する
 表示装置。
It has a plurality of circuit blocks that operate during display operation,
The display device, wherein the plurality of circuit blocks includes a first circuit block whose power supply is controlled to be turned off during standby.
 前記電源の電源線と前記第1の回路ブロックとの間に設けられたスイッチと、
 前記スイッチを、前記スタンバイ時および前記第1の回路ブロックの動作不要時にオフに制御するスイッチ制御部と
 を有する
 請求項1に記載の表示装置。
a switch provided between a power supply line of the power supply and the first circuit block;
The display device according to claim 1 , further comprising: a switch control unit that controls the switch to be turned off during the standby state and when the operation of the first circuit block is not required.
 複数の前記スイッチと、
 複数の前記スイッチを段階的にオンする遅延回路と
 を有する
 請求項2に記載の表示装置。
A plurality of the switches;
The display device according to claim 2 , further comprising: a delay circuit that turns on the plurality of switches in a stepwise manner.
 前記遅延回路は、バッファで構成されている
 請求項3に記載の表示装置。
The display device according to claim 3 , wherein the delay circuit is configured by a buffer.
 前記遅延回路は、フリップフロップで構成されている
 請求項3に記載の表示装置。
The display device according to claim 3 , wherein the delay circuit is configured by a flip-flop.
 前記複数の回路ブロックは、前記スタンバイ時に動作する第2の回路ブロックを有し、
 前記第1の回路ブロックから前記第2の回路ブロックへの信号伝達経路に、前記スタンバイ時における前記第1の回路ブロックの出力信号を制御する制御回路を有する
 請求項1に記載の表示装置。
the plurality of circuit blocks includes a second circuit block that operates during the standby state;
The display device according to claim 1 , further comprising a control circuit for controlling an output signal of the first circuit block during the standby state, the control circuit being provided in a signal transmission path from the first circuit block to the second circuit block.
 前記制御回路は、論理ゲートで構成されている
 請求項6に記載の表示装置。
The display device according to claim 6 , wherein the control circuit is configured with a logic gate.
 前記制御回路は、フリップフロップで構成されている
 請求項6に記載の表示装置。
The display device according to claim 6 , wherein the control circuit is configured by a flip-flop.
 外部電源から前記電源を前記第1の回路ブロックに供給する電源経路を有し、
 前記外部電源が前記スタンバイ時および前記第1の回路ブロックの動作不要時に前記電源をオフにする
 請求項1に記載の表示装置。
a power supply path for supplying the power from an external power supply to the first circuit block;
The display device according to claim 1 , wherein the external power supply is turned off during the standby state and when the operation of the first circuit block is not required.
 前記第1の回路ブロックに前記電源を供給する内部電源を有し、
 前記内部電源が前記スタンバイ時および前記第1の回路ブロックの動作不要時に前記電源をオフにする
 請求項1に記載の表示装置。
an internal power supply that supplies the power to the first circuit block;
The display device according to claim 1 , wherein the internal power supply is turned off during the standby state and when the operation of the first circuit block is not required.
 発光素子を有する画素を複数有し、
 前記第1の回路ブロックは、前記画素を駆動するロジック部、または、前記ロジック部に出力される画像データに信号処理を施す信号処理部を含む
 請求項1に記載の表示装置。
a plurality of pixels each having a light-emitting element;
The display device according to claim 1 , wherein the first circuit block includes a logic unit that drives the pixels, or a signal processing unit that performs signal processing on image data output to the logic unit.
 前記電源線は、前記電源の電源経路における高電位側の電源線である
 請求項2に記載の表示装置。
The display device according to claim 2 , wherein the power supply line is a power supply line on a high potential side in a power supply path of the power supply.
 前記電源線は、前記電源の電源経路における低電位側の電源線である
 請求項2に記載の表示装置。
The display device according to claim 2 , wherein the power supply line is a power supply line on a low potential side in a power supply path of the power supply.
 発光素子を有する画素を複数有し、
 前記第1の回路ブロックは、前記画素間を絶縁する絶縁体に絶縁用電圧を印加する回路ブロックである
 請求項2に記載の表示装置。
a plurality of pixels each having a light-emitting element;
The display device according to claim 2 , wherein the first circuit block is a circuit block that applies an insulating voltage to an insulator that insulates the pixels from each other.
 前記スイッチは、酸化物半導体トランジスタを用いて形成されたものである
 請求項2に記載の表示装置。
The display device according to claim 2 , wherein the switch is formed using an oxide semiconductor transistor.
 請求項1に記載の表示装置
 を有する電子機器。
An electronic device comprising the display device according to claim 1 .
PCT/JP2025/003126 2024-03-08 2025-01-31 Display apparatus and electronic device Pending WO2025187276A1 (en)

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