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WO2025053044A1 - Resin composition, pellets, and molded article - Google Patents

Resin composition, pellets, and molded article Download PDF

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Publication number
WO2025053044A1
WO2025053044A1 PCT/JP2024/030979 JP2024030979W WO2025053044A1 WO 2025053044 A1 WO2025053044 A1 WO 2025053044A1 JP 2024030979 W JP2024030979 W JP 2024030979W WO 2025053044 A1 WO2025053044 A1 WO 2025053044A1
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Prior art keywords
mass
resin
less
parts
resin composition
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PCT/JP2024/030979
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French (fr)
Japanese (ja)
Inventor
かりん 福原
大輔 須長
麻希子 大島
Original Assignee
グローバルポリアセタール株式会社
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Publication of WO2025053044A1 publication Critical patent/WO2025053044A1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L59/00Compositions of polyacetals; Compositions of derivatives of polyacetals
    • C08L59/04Copolyoxymethylenes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes

Definitions

  • the present invention relates to a resin composition, pellets, and molded products.
  • the present invention relates to a resin composition whose main component is polyacetal resin.
  • Polyacetal resin is a plastic having excellent mechanical properties, electrical properties, and chemical properties such as chemical resistance, and is used in a wide range of applications.
  • One of the known uses of polyacetal resin is as a sliding member.
  • Patent Document 1 discloses a polyacetal resin composition obtained by blending 99.8 to 80 parts by weight of polyacetal, 0.1 to 20 parts by weight of polyethylene wax, and 0.1 to 5 parts by weight of silicone oil.
  • the resin composition described in the above Patent Document 1 is a material with excellent sliding properties.
  • metal mold contamination during molding becomes a problem.
  • the present invention aims to solve such problems, and to provide a resin composition that can provide a molded article with excellent sliding properties and causes little mold contamination, as well as pellets and a molded article.
  • a composition comprising a polyacetal resin (A), a silicone resin (B) having a weight-average molecular weight of 800,000 or more, and a silicone oil (C) having a weight-average molecular weight of less than 100,000;
  • a resin composition wherein the mass ratio of the silicone resin (B) to the silicone oil (C), (B)/(C), is 10/90 to 90/10.
  • ⁇ 2> The resin composition according to ⁇ 1>, in which the total content of the silicone resin (B) and the silicone oil (C) is 0.5 parts by mass or more and less than 10 parts by mass per 100 parts by mass of the polyacetal resin (A).
  • ⁇ 3> The resin composition according to ⁇ 1>, wherein the total content of the silicone resin (B) and the silicone oil (C) is 0.5 parts by mass or more and less than 2 parts by mass per 100 parts by mass of the polyacetal resin (A).
  • ⁇ 4> Pellets of the resin composition according to any one of ⁇ 1> to ⁇ 3>.
  • ⁇ 5> A molded article formed from the resin composition according to any one of ⁇ 1> to ⁇ 3>.
  • ⁇ 6> A molded article formed from the pellets according to ⁇ 4>.
  • the present invention makes it possible to provide molded articles with excellent sliding properties, and resin compositions, as well as pellets and molded articles with minimal mold contamination.
  • the present embodiment is an example for explaining the present invention, and the present invention is not limited to the present embodiment.
  • the use of "to” means that the numerical values before and after it are included as the lower limit and upper limit.
  • various physical properties and characteristic values are those at 23° C. unless otherwise specified. If the measurement methods, etc. described in the standards shown in this specification vary from year to year, they will be based on the standards as of January 1, 2023, unless otherwise specified.
  • the resin composition of the present embodiment is characterized in that it contains a polyacetal resin (A), a silicone resin (B) having a weight average molecular weight of 800,000 or more, and a silicone oil (C) having a weight average molecular weight of less than 100,000, and the mass ratio of the silicone resin (B) to the silicone oil (C), (B)/(C), is 10/90 to 90/10.
  • silicone oil (C) with weight-average molecular weight of less than 100,000 is blended.That is, silicone oil (C) with weight-average molecular weight of less than 100,000 alone cannot achieve sufficient sliding properties, but by blending two kinds of silicone resins, it is possible to maintain excellent sliding properties and suppress mold contamination at the same time.
  • the resulting molded product tends to have poor delamination, but this aspect can also be suppressed by using the silicone oil (C) having a weight average molecular weight of less than 100,000 in combination.
  • silicone oil (C) having a weight average molecular weight of less than 100,000 in combination.
  • the resin composition of the present embodiment contains a polyacetal resin.
  • the polyacetal resin is not particularly limited in terms of its type, and may be a homopolymer containing only divalent oxymethylene groups as constituent units, or a copolymer containing divalent oxymethylene groups and divalent oxyalkylene groups having 2 to 6 carbon atoms as constituent units.
  • Examples of oxyalkylene groups having 2 to 6 carbon atoms include oxyethylene groups, oxypropylene groups, and oxybutylene groups.
  • the proportion of oxyalkylene groups having 2 to 6 carbon atoms in the total number of moles of oxymethylene groups and oxyalkylene groups having 2 to 6 carbon atoms is not particularly limited, but may be 0.5 to 10 mol %.
  • trioxane is usually used as the main raw material.
  • a cyclic formal or a cyclic ether can be used.
  • Specific examples of the cyclic formal include 1,3-dioxolane, 1,3-dioxane, 1,3-dioxepane, 1,3-dioxocane, 1,3,5-trioxepane, and 1,3,6-trioxocane
  • specific examples of the cyclic ether include ethylene oxide, propylene oxide, and butylene oxide.
  • 1,3-dioxolane can be used as the main raw material.
  • 1,3-dioxane can be used as the main raw material.
  • 1,3-dioxepane can be used as the main raw material.
  • the amount of hemiformal end groups, formyl end groups, and end groups unstable to heat, acid, or base is small.
  • the hemiformal end group is represented by -OCH 2 OH
  • the formyl end group is represented by -CHO.
  • the polyacetal resin used in this embodiment has a melt volume rate (MVR) measured according to ISO1133 at a temperature of 190°C and a load of 2.16 kg of preferably 0.5 cm3 /10 min or more, more preferably 0.6 cm3 /10 min or more, even more preferably 0.8 cm3 /10 min or more, even more preferably 1 cm3 /10 min or more, and even more preferably 5 cm3 /10 min or more.
  • MVR melt volume rate
  • the MVR of the polyacetal resin is preferably 20 cm3 /10 min or less, more preferably 18 cm3 /10 min or less, even more preferably 14 cm3 /10 min or less, even more preferably 10 cm3 /10 min or less, and even more preferably 8 cm3 /10 min or less.
  • polyacetal resins described in paragraphs 0018 to 0043 of JP-A-2015-074724 can be used as the polyacetal resin, the contents of which are incorporated herein by reference.
  • the polyacetal resin used in this embodiment may be a recycled product (including recovered products, material recycled products, chemical recycled products, etc.), a rejected product, or a scrap from thermoplastic resin molding.
  • the resin composition of the present embodiment preferably contains polyacetal resin in a proportion of 80 mass % or more of the resin composition, more preferably contains 85 mass % or more, even more preferably contains 90 mass % or more, still more preferably contains 93 mass % or more, even more preferably contains 95 mass % or more, and still more preferably contains 97 mass % or more.
  • all components other than the silicone resin (B) and the silicone oil (C) may be polyacetal resin.
  • the resin composition of the present embodiment may contain only one type of polyacetal resin, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
  • the resin composition of the present embodiment contains a silicone resin (B) having a weight average molecular weight of 800,000 or more.
  • a silicone resin (B) having a weight average molecular weight of 800,000 or more the sliding properties can be improved.
  • the limit PV value can be improved and the dynamic friction coefficient can be reduced.
  • the weight average molecular weight of the silicone resin (B) is preferably 850,000 or more, more preferably 900,000 or more, even more preferably 950,000 or more, and still more preferably 980,000 or more, and is preferably 2,000,000 or less, more preferably 1,800,000 or less, and even more preferably 1,500,000 or less, and may be 1,200,000 or less.
  • the molecular weight of the silicone resin (B) is measured according to the following method. Silicone in silicone resin is extracted with dichloromethane. The extracted silicone is adjusted with 0.2% by mass of toluene eluent and left at room temperature for 12 hours. Then, it is filtered with a 0.45 ⁇ m membrane filter, and the filtrate is subjected to gel permeation chromatography (GPC) measurement. When performing GPC measurement, AQCUITY APC manufactured by Waters can be used. When the resin composition of the present embodiment contains two or more types of silicone resin (B), the Mw of the silicone resin (B) is the Mw of the mixture. The same applies to the silicone oil (C).
  • GPC gel permeation chromatography
  • the silicone resin (B) used in this embodiment is preferably a polyorganosiloxane, and is preferably a compound represented by -(Si(R) 2 -O)-, where R is each independently a hydrogen atom, a hydrocarbon group, an -O-hydrocarbon group, or a hydroxyl group (with the proviso that at least one of R is a hydrocarbon group or an -O-hydrocarbon group).
  • Each R is preferably independently a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, an -O-hydrocarbon group having 1 to 6 carbon atoms, or a hydroxyl group, and is preferably a hydrogen atom, a methyl group, an ethyl group, a phenyl group, a methoxy group, an ethoxy group, a phenoxy group, or a hydroxyl group, more preferably a hydrogen atom, a methyl group, or a methoxy group, and even more preferably a hydrogen atom or a methyl group.
  • the silicone resin (B) may contain one type of —(Si(R) 2 —O)—, or two or more types of —(Si(R) 2 —O)—.
  • the silicone resin (B) used in this embodiment is preferably a non-crosslinked silicone.
  • Non-crosslinked silicones are exemplified by silicones represented by -(Si(R) 2 -O)-, where each R is independently a silicone that does not contain a structure represented by -(Si(R') 2 -O)- (each R' independently forms a crosslinked structure with another moiety). R is the same as above, and the preferred range is also the same.
  • the silicone resin (B) used in this embodiment is preferably a linear silicone.
  • An example of a linear silicone is a compound represented by -(Si(R) 2 -O)-, where each R is independently an atomic group having 12 or less carbon atoms and not containing a silicon atom. R here is the same as above, and the preferred range is also the same.
  • silicone resin (B) When compounding the silicone resin (B), it may be made into a masterbatch.
  • the resin used in the masterbatch is preferably a polyacetal resin.
  • the proportion of silicone resin (B) in the masterbatch is preferably 10% by mass or more, more preferably 30% by mass or more, and even more preferably 40% by mass or more, and is preferably 80% by mass or less, preferably 70% by mass or less, and more preferably 60% by mass or less.
  • the content of the silicone resin (B) in the resin composition of this embodiment is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, even more preferably 0.3 parts by mass or more, and even more preferably 0.4 parts by mass or more, relative to 100 parts by mass of the polyacetal resin (A), and may be 0.6 parts by mass or more depending on the application, and may be 9 parts by mass or less, more preferably 7 parts by mass or less, even more preferably 5 parts by mass or less, even more preferably 3 parts by mass or less, even more preferably 1 part by mass or less, and even more preferably 0.9 parts by mass or less, and may be 0.7 parts by mass or less depending on the application.
  • the resin composition of the present embodiment may contain only one type of silicone resin (B), or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
  • the resin composition of the present embodiment contains a silicone oil (C) having a weight-average molecular weight of less than 100,000.
  • silicone oil (C) having a weight-average molecular weight of less than 100,000 in combination with the silicone resin (B), it is possible to effectively suppress mold contamination and delamination while maintaining high slidability (particularly, the limit PV value).
  • the weight average molecular weight of the silicone oil (C) is preferably 95,000 or less, more preferably 90,000 or less, and even more preferably 85,000 or less, and is preferably 10,000 or more, more preferably 20,000 or more, and even more preferably 35,000 or more.
  • the silicone oil (C) used in this embodiment is preferably an organosiloxane, and is preferably a compound represented by -(Si(R) 2 -O)-, where each R is independently a hydrogen atom, a hydrocarbon group, an -O-hydrocarbon group, or a hydroxyl group (with the proviso that at least one of R is a hydrocarbon group or an -O-hydrocarbon group).
  • Each R is preferably independently a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, an -O-hydrocarbon group having 1 to 6 carbon atoms, or a hydroxyl group, and is preferably a hydrogen atom, a methyl group, an ethyl group, a phenyl group, a methoxy group, an ethoxy group, a phenoxy group, or a hydroxyl group, more preferably a hydrogen atom, a methyl group, or a methoxy group, and even more preferably a hydrogen atom or a methyl group.
  • the —(Si(R) 2 —O)— in the silicone oil (C) may be of one type or of two or more types.
  • silicone oil (C) When silicone oil (C) is blended, it may be made into a masterbatch.
  • the resin used in the masterbatch is preferably polyacetal resin.
  • the proportion of silicone oil (C) in the masterbatch is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 30% by mass or more, and is preferably 60% by mass or less, preferably 55% by mass or less, and more preferably 45% by mass or less.
  • the content of silicone oil (C) in the resin composition of this embodiment is preferably 0.05 parts by mass or more, more preferably 0.1 parts by mass or more, and even more preferably 0.2 parts by mass or more, relative to 100 parts by mass of polyacetal resin (A), and may be 0.3 parts by mass or more depending on the application, and may be 9 parts by mass or less, more preferably 5 parts by mass or less, even more preferably 3 parts by mass or less, even more preferably 1 part by mass or less, and even more preferably 0.6 parts by mass or less, and may be 0.4 parts by mass or less depending on the application. By making it equal to or more than the lower limit, the sliding property tends to be further improved.
  • the resin composition of the present embodiment may contain only one type of silicone oil (C), or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
  • the mass ratio of the silicone resin (B) to the silicone oil (C), that is, (B)/(C), is 10/90 to 90/10.
  • the blend ratio of the silicone resin (B) and the silicone oil (C) is preferably 15 parts by mass or more of the silicone resin (B) per 100 parts by mass of the total of the silicone resin (B) and the silicone oil (C), more preferably 20 parts by mass or more, even more preferably 30 parts by mass or more, and preferably 40 parts by mass or more.
  • it may be 51 parts by mass or more, or even 55 parts by mass or more, and is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and may be 75 parts by mass or less, or even 70 parts by mass or less, depending on the application, etc.
  • the ratio of the weight average molecular weights of the silicone resin (B) and the silicone oil (C), MwB / MwC is preferably 10 or more, and may be 20 or more, or even 40 or more, and is preferably 100 or less, and may be 50 or less, 30 or less, or even 15 or less.
  • the total content of the silicone resin (B) and the silicone oil (C) is preferably more than 0.1 parts by mass and less than 10 parts by mass with respect to 100 parts by mass of the polyacetal resin (A).
  • the sliding property tends to be improved.
  • the effect of suppressing mold contamination and delamination of molded pieces tends to be improved.
  • the total content of the silicone resin (B) and the silicone oil (C) is, relative to 100 parts by mass of the polyacetal resin (A), more preferably 0.1 parts by mass or more, even more preferably 0.11 parts by mass or more, even more preferably 0.2 parts by mass or more, even more preferably 0.3 parts by mass or more, even more preferably 0.5 parts by mass or more, even more preferably 0.8 parts by mass or more, and preferably 9 parts by mass or less, more preferably 8 parts by mass or less, even more preferably 7 parts by mass or less, even more preferably 5 parts by mass or less, even more preferably 3 parts by mass or less, even more preferably 2 parts by mass or less, and even more preferably 1.5 parts by mass or less.
  • the resin composition of this embodiment may or may not contain a silicone compound having a weight average molecular weight of 100,000 or more and less than 800,000.
  • substantially free means that the content of silicone compounds having a weight average molecular weight of 100,000 or more and less than 800,000 contained in the resin composition is less than 10% by mass of the total content of the silicone resin (B) and the silicone oil (C), preferably less than 5% by mass, more preferably less than 3% by mass, and may be less than 1% by mass.
  • the total content of the polyacetal resin (A), silicone resin (B), and silicone oil (C) in the resin composition is preferably 90% by mass or more, more preferably 95% by mass or more, even more preferably 97% by mass or more, even more preferably 98% by mass or more, even more preferably 99% by mass or more, and may be 100% by mass or less.
  • the resin composition of the present embodiment may contain known additives and fillers within the scope of the present invention.
  • additives and fillers that can be used in the present embodiment include known thermoplastic polymers other than polyacetal resins, acid-modified polymers, weathering agents, formaldehyde scavengers, inorganic particles, antioxidants (hindered amines, hindered phenols, etc.), heat stabilizers, colorants, nucleating agents, plasticizers, fluorescent brighteners, release agents, antistatic agents, ultraviolet absorbers, flame retardants, and flame retardant assistants, etc., which may be added as necessary.
  • the resin composition of the present embodiment is prepared so that the total of the polyacetal resin, the silicone resin (B), and the silicone oil (C), as well as other components that are blended as necessary, is 100 mass %.
  • the resin composition of the present embodiment preferably has excellent slidability.
  • the resin composition of the present embodiment preferably has a dynamic friction coefficient of 0.25 or less when molded into a cylindrical thrust test piece.
  • the lower limit is, for example, 0.01 or more, which is practical.
  • Such a small dynamic friction coefficient is achieved mainly by blending the silicone oil (C) with the polyacetal resin (A). The dynamic friction coefficient is measured as described in the Examples section below.
  • the resin composition of this embodiment is molded into a cylindrical thrust test piece, and when measured according to the thrust ring friction and wear test specified in JIS K7218 Method A at a contact area of 2 cm2 and a temperature of 23°C, the limit PV value (MPa cm/s) is preferably 16.0 MPa cm/s or more. There is no particular upper limit, but 50.0 MPa cm/s or less is practical. Such a high limit PV value is mainly achieved by blending the silicone resin (B) with the polyacetal resin (A). The limit PV value is measured as described in the Examples section below.
  • the resin composition of the present embodiment can be easily prepared by a known method generally used for preparing conventional thermoplastic resin compositions. For example, (1) a method of mixing all the components constituting the resin composition, feeding the mixture into an extruder and melt-kneading the mixture to obtain a pellet-shaped resin composition, (2) a method of feeding a part of the components constituting the resin composition from the main feed port of an extruder and the remaining components from the side feed port, melt-kneading the mixture to obtain a pellet-shaped resin composition, (3) a method of preparing pellets with different compositions by extrusion or the like, mixing the pellets to prepare a resin composition having a predetermined composition, etc. can be adopted.
  • the silicone resin (B) and/or the silicone oil (C) (preferably the silicone resin (B)) is made into a master batch in advance, and then melt-kneaded with the remaining components.
  • the kneading machine include a kneader, a Banbury mixer, and an extruder.
  • Kneading is preferably performed at a temperature at which the polyacetal resin melts or higher, specifically at the melting temperature of the polyacetal resin or higher (generally 180° C. or higher).
  • the molded article of the present embodiment is formed from the resin composition or pellets of the present embodiment.
  • the pellets obtained by pelletizing the resin composition of the present embodiment are molded into a molded article by various molding methods.
  • the resin composition melt-kneaded in an extruder can be directly molded into a molded article without going through pellets.
  • the shape of the molded product is not particularly limited and can be appropriately selected depending on the application and purpose of the molded product, and examples thereof include plate-like, plate-like, rod-like, sheet-like, film-like, cylindrical, annular, circular, elliptical, gear-like, polygonal, irregularly shaped, hollow, frame-like, box-like, panel-like, etc.
  • the molded product of this embodiment may be a finished product or a part.
  • the method for forming the molded product is not particularly limited, and any conventionally known molding method can be used, such as injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, hollow molding, gas-assisted hollow molding, blow molding, extrusion blow molding, IMC (in-mold coating molding), rotational molding, multi-layer molding, two-color molding, insert molding, sandwich molding, foam molding, and pressure molding.
  • any conventionally known molding method can be used, such as injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, hollow molding, gas-assisted hollow molding, blow molding, extrusion blow molding, IMC (in-mold coating molding), rotational molding, multi-layer molding, two-color molding, insert molding, sandwich molding, foam molding, and pressure molding.
  • the resin composition of the present embodiment is preferably used for forming a sliding member, and therefore, a molded article formed from the resin composition of the present embodiment is preferably used as a sliding member (sliding part).
  • the sliding members include sliding members such as gears, rotating shafts, bearings, various gears, cams, end face materials of mechanical seals, valve seats of valves, sealing members such as V-rings, rod packings, piston rings, rider rings, rotating shafts of compressors, rotating sleeves, pistons, impellers, rollers, etc., which are intended to meet the high quality demands of electric/electronic devices, office equipment, vehicles (automobiles), industrial equipment, etc.
  • the sliding member of this embodiment can be used not only with other sliding members of this embodiment, but also with other resin sliding members, fiber-reinforced resin sliding members, and ceramic or metal sliding members.
  • ⁇ Dynamic friction coefficient> The pellets obtained above were molded into cylindrical thrust test pieces using a SE-30DUZ with a screw diameter of 32 mm manufactured by Sumitomo Heavy Industries, Ltd. under conditions of a cylinder temperature of 195°C and a mold temperature of 80°C.
  • the cylindrical thrust test pieces thus obtained were subjected to a thrust type friction and wear test to measure the dynamic friction coefficient.
  • the thrust test was carried out using EFM-3-G manufactured by A&D Co., Ltd.
  • the surface pressure was increased by 5 kg every 3 minutes, from 3 kg, 5 kg, and 10 kg, and thereafter. Focusing on the kinetic friction coefficient under low surface pressure (load 3 kg, surface pressure 0.15 MPa) where differences in the kinetic friction coefficient due to the formulation tend to occur, the average value of the kinetic friction coefficient over 3 minutes was recorded and evaluated.
  • the molded article obtained from the resin composition of this embodiment had excellent sliding properties. Furthermore, mold contamination was also suppressed.

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  • Polymers & Plastics (AREA)
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Abstract

Provided are a resin composition, pellets, and a molded article. The resin composition includes a polyacetal resin (A), a silicone resin (B) having a weight-average molecular weight of 800,000 or more, and a silicone oil (C) having a weight-average molecular weight of less than 100,000, wherein the mass ratio (B)/(C) of the silicone resin (B) to the silicone oil (C) is 10/90 to 90/10.

Description

樹脂組成物、ペレット、および、成形品Resin composition, pellets, and molded products

 本発明は、樹脂組成物、ペレット、および、成形品に関する。特に、ポリアセタール樹脂を主要成分とする樹脂組成物に関する。 The present invention relates to a resin composition, pellets, and molded products. In particular, the present invention relates to a resin composition whose main component is polyacetal resin.

 ポリアセタール樹脂は、機械的性質、電気的性質、および、耐薬品性などの化学的性質に優れたプラスチックとして、広範囲の用途で使用されている。
 そして、ポリアセタール樹脂の利用形態の1つとして、摺動部材が知られている。ポリアセタール樹脂を摺動部材として用いた例としては、特許文献1には、ポリアセタール99.8~80重量部、ポリエチレンワックス0.1~20重量部、およびシリコーンオイル0.1~5重量部とを配合してなるポリアセタール樹脂組成物が開示されている。
Polyacetal resin is a plastic having excellent mechanical properties, electrical properties, and chemical properties such as chemical resistance, and is used in a wide range of applications.
One of the known uses of polyacetal resin is as a sliding member. As an example of using polyacetal resin as a sliding member, Patent Document 1 discloses a polyacetal resin composition obtained by blending 99.8 to 80 parts by weight of polyacetal, 0.1 to 20 parts by weight of polyethylene wax, and 0.1 to 5 parts by weight of silicone oil.

特開平04-224856号公報Japanese Patent Application Publication No. 04-224856

 上記特許文献1に記載の樹脂組成物は摺動性に優れた材料である。しかしながら、近年、さらに優れた摺動性が求められている。しかしながら、摺動剤の配合量が多くなると、成形時の金型汚染が問題となる。
 本発明は、かかる課題を解決することを目的とするものであって、摺動性に優れた成形品を提供可能であって、金型汚染が少ない樹脂組成物、ならびに、ペレット、および、成形品を提供することを目的とする。
The resin composition described in the above Patent Document 1 is a material with excellent sliding properties. However, in recent years, there has been a demand for even better sliding properties. However, if the amount of the sliding agent blended is large, metal mold contamination during molding becomes a problem.
The present invention aims to solve such problems, and to provide a resin composition that can provide a molded article with excellent sliding properties and causes little mold contamination, as well as pellets and a molded article.

 上記課題のもと、本発明者が検討を行った結果、ポリアセタール樹脂に対して、所定の分子量のシリコーン樹脂とシリコーンオイルを組み合わせて用いることにより、上記課題を解決しうることを見出した。
 具体的には、下記手段により、上記課題は解決された。
<1>ポリアセタール樹脂(A)と、重量平均分子量80万以上のシリコーン樹脂(B)と、重量平均分子量10万未満のシリコーンオイル(C)とを含み、
前記シリコーン樹脂(B)とシリコーンオイル(C)の質量比率である、(B)/(C)が10/90~90/10である、樹脂組成物。
<2>ポリアセタール樹脂(A)100質量部に対し、前記シリコーン樹脂(B)およびシリコーンオイル(C)の合計含有量が0.5質量部以上10質量部未満である、<1>に記載の樹脂組成物。
<3>ポリアセタール樹脂(A)100質量部に対し、前記シリコーン樹脂(B)およびシリコーンオイル(C)の合計含有量が0.5質量部以上2質量部未満である、<1>に記載の樹脂組成物。
<4><1>~<3>のいずれか1つに記載の樹脂組成物のペレット。
<5><1>~<3>のいずれか1つに記載の樹脂組成物から形成された成形品。
<6><4>に記載のペレットから形成された成形品。
In view of the above problems, the present inventors have conducted research and found that the above problems can be solved by using a silicone resin having a predetermined molecular weight in combination with a silicone oil for a polyacetal resin.
Specifically, the above problems were solved by the following means.
<1> A composition comprising a polyacetal resin (A), a silicone resin (B) having a weight-average molecular weight of 800,000 or more, and a silicone oil (C) having a weight-average molecular weight of less than 100,000;
A resin composition, wherein the mass ratio of the silicone resin (B) to the silicone oil (C), (B)/(C), is 10/90 to 90/10.
<2> The resin composition according to <1>, in which the total content of the silicone resin (B) and the silicone oil (C) is 0.5 parts by mass or more and less than 10 parts by mass per 100 parts by mass of the polyacetal resin (A).
<3> The resin composition according to <1>, wherein the total content of the silicone resin (B) and the silicone oil (C) is 0.5 parts by mass or more and less than 2 parts by mass per 100 parts by mass of the polyacetal resin (A).
<4> Pellets of the resin composition according to any one of <1> to <3>.
<5> A molded article formed from the resin composition according to any one of <1> to <3>.
<6> A molded article formed from the pellets according to <4>.

 本発明により、摺動性に優れた成形品を提供可能であって、金型汚染が少ない樹脂組成物、ならびに、ペレット、および、成形品を提供可能になった。 The present invention makes it possible to provide molded articles with excellent sliding properties, and resin compositions, as well as pellets and molded articles with minimal mold contamination.

 以下、本発明を実施するための形態(以下、単に「本実施形態」という)について詳細に説明する。なお、以下の本実施形態は、本発明を説明するための例示であり、本発明は本実施形態のみに限定されない。
 なお、本明細書において「~」とはその前後に記載される数値を下限値および上限値として含む意味で使用される。
 本明細書において、各種物性値および特性値は、特に述べない限り、23℃におけるものとする。
 本明細書で示す規格で説明される測定方法等が年度によって異なる場合、特に述べない限り、2023年1月1日時点における規格に基づくものとする。
Hereinafter, an embodiment of the present invention (hereinafter, simply referred to as the present embodiment) will be described in detail. Note that the present embodiment is an example for explaining the present invention, and the present invention is not limited to the present embodiment.
In this specification, the use of "to" means that the numerical values before and after it are included as the lower limit and upper limit.
In this specification, various physical properties and characteristic values are those at 23° C. unless otherwise specified.
If the measurement methods, etc. described in the standards shown in this specification vary from year to year, they will be based on the standards as of January 1, 2023, unless otherwise specified.

 本実施形態の樹脂組成物は、ポリアセタール樹脂(A)と、重量平均分子量80万以上のシリコーン樹脂(B)と、重量平均分子量10万未満のシリコーンオイル(C)とを含み、前記シリコーン樹脂(B)とシリコーンオイル(C)の質量比率である、(B)/(C)が10/90~90/10であることを特徴とする。このような構成とすることにより、成形時の金型汚染が少なく、摺動性に優れた成形品が提供可能になる。
 重量平均分子量80万以上のシリコーン樹脂(B)を配合すると、得られる成形品の摺動性を向上させることができる。これは、シリコーン樹脂の分子量が大きいと、ポリアセタール樹脂中での分散径が大きくなり、成形品の表面にシリコーン樹脂が出やすくなるためと推測される。
 しかしながら、分子量が大きいシリコーン樹脂を用いると成形時に金型汚染が起こりやすいことが分かった。本実施形態においては、この点を解消するため、重量平均分子量10万未満のシリコーンオイル(C)を配合している。すなわち、重量平均分子量10万未満のシリコーンオイル(C)のみでは十分な摺動性は達成できないが、2種のシリコーン樹脂をブレンドすることにより、優れた摺動性を維持しつつ、金型汚染の抑制を両立できた。
 さらに、高分子量のシリコーン樹脂を用いると、得られる成形品のデラミネーションが劣る傾向にあるが、かかる観点についても、重量平均分子量10万未満のシリコーンオイル(C)と併用することにより抑制できた。
 以下、本実施形態の詳細について説明する。
The resin composition of the present embodiment is characterized in that it contains a polyacetal resin (A), a silicone resin (B) having a weight average molecular weight of 800,000 or more, and a silicone oil (C) having a weight average molecular weight of less than 100,000, and the mass ratio of the silicone resin (B) to the silicone oil (C), (B)/(C), is 10/90 to 90/10. By adopting such a configuration, it is possible to provide a molded product with excellent sliding properties with little mold contamination during molding.
By blending a silicone resin (B) having a weight-average molecular weight of 800,000 or more, the sliding properties of the resulting molded article can be improved. This is presumably because a silicone resin with a large molecular weight has a large dispersion diameter in the polyacetal resin, which makes the silicone resin more likely to appear on the surface of the molded article.
However, it has been found that when using silicone resin with large molecular weight, mold contamination is likely to occur during molding.In this embodiment, in order to solve this problem, silicone oil (C) with weight-average molecular weight of less than 100,000 is blended.That is, silicone oil (C) with weight-average molecular weight of less than 100,000 alone cannot achieve sufficient sliding properties, but by blending two kinds of silicone resins, it is possible to maintain excellent sliding properties and suppress mold contamination at the same time.
Furthermore, when a high molecular weight silicone resin is used, the resulting molded product tends to have poor delamination, but this aspect can also be suppressed by using the silicone oil (C) having a weight average molecular weight of less than 100,000 in combination.
The details of this embodiment will be described below.

<ポリアセタール樹脂(A)>
 本実施形態の樹脂組成物は、ポリアセタール樹脂を含む。
 ポリアセタール樹脂は、その種類等、特に限定されるものではなく、2価のオキシメチレン基のみを構成単位として含むホモポリマーであっても、2価のオキシメチレン基と、炭素数が2~6の2価のオキシアルキレン基とを構成単位として含むコポリマーであってもよい。
<Polyacetal resin (A)>
The resin composition of the present embodiment contains a polyacetal resin.
The polyacetal resin is not particularly limited in terms of its type, and may be a homopolymer containing only divalent oxymethylene groups as constituent units, or a copolymer containing divalent oxymethylene groups and divalent oxyalkylene groups having 2 to 6 carbon atoms as constituent units.

 炭素数が2~6のオキシアルキレン基としては、オキシエチレン基、オキシプロピレン基、および、オキシブチレン基などが挙げられる。 Examples of oxyalkylene groups having 2 to 6 carbon atoms include oxyethylene groups, oxypropylene groups, and oxybutylene groups.

 ポリアセタール樹脂においては、オキシメチレン基および炭素数2~6のオキシアルキレン基の総モル数に占める炭素数2~6のオキシアルキレン基の割合は特に限定されるものではなく、0.5~10モル%であればよい。 In polyacetal resins, the proportion of oxyalkylene groups having 2 to 6 carbon atoms in the total number of moles of oxymethylene groups and oxyalkylene groups having 2 to 6 carbon atoms is not particularly limited, but may be 0.5 to 10 mol %.

 上記ポリアセタール樹脂を製造するためには通常、主原料としてトリオキサンが用いられる。また、ポリアセタール樹脂中に炭素数2~6のオキシアルキレン基を導入するには、環状ホルマールや環状エーテルを用いることができる。環状ホルマールの具体例としては、1,3-ジオキソラン、1,3-ジオキサン、1,3-ジオキセパン、1,3-ジオキソカン、1,3,5-トリオキセパン、1,3,6-トリオキソカンなどが挙げられ、環状エーテルの具体例としては、エチレンオキシド、プロピレンオキシドおよびブチレンオキシドなどが挙げられる。ポリアセタール樹脂中にオキシエチレン基を導入するには、主原料として、1,3-ジオキソランを用いればよく、オキシプロピレン基を導入するには、主原料として、1,3-ジオキサンを用いればよく、オキシブチレン基を導入するには、主原料として、1,3-ジオキセパンを用いればよい。なお、ポリアセタール樹脂においては、ヘミホルマール末端基量、ホルミル末端基量、熱や酸、塩基に対して不安定な末端基量が少ない方がよい。ここで、ヘミホルマール末端基とは、-OCHOHで表されるものであり、ホルミル末端基とは-CHOで表されるものである。 To produce the polyacetal resin, trioxane is usually used as the main raw material. To introduce an oxyalkylene group having 2 to 6 carbon atoms into the polyacetal resin, a cyclic formal or a cyclic ether can be used. Specific examples of the cyclic formal include 1,3-dioxolane, 1,3-dioxane, 1,3-dioxepane, 1,3-dioxocane, 1,3,5-trioxepane, and 1,3,6-trioxocane, and specific examples of the cyclic ether include ethylene oxide, propylene oxide, and butylene oxide. To introduce an oxyethylene group into the polyacetal resin, 1,3-dioxolane can be used as the main raw material. To introduce an oxypropylene group, 1,3-dioxane can be used as the main raw material. To introduce an oxybutylene group, 1,3-dioxepane can be used as the main raw material. In addition, in a polyacetal resin, it is preferable that the amount of hemiformal end groups, formyl end groups, and end groups unstable to heat, acid, or base is small. Here, the hemiformal end group is represented by -OCH 2 OH, and the formyl end group is represented by -CHO.

 本実施形態で用いるポリアセタール樹脂は、ISO1133に従い、温度190℃、荷重2.16kgの条件で測定したメルトボリュームレート(MVR)が、0.5cm/10分以上であることが好ましく、0.6cm/10分以上であることがより好ましく、0.8cm/10分以上であることがさらに好ましく、1cm/10分以上であることが一層好ましく、5cm/10分以上であることがより一層好ましい。前記下限値以上とすることにより、樹脂組成物の生産性がより向上する傾向にある。また、前記ポリアセタール樹脂のMVRは、20cm/10分以下であることが好ましく、18cm/10分以下であることがより好ましく、14cm/10分以下であることがさらに好ましく、10cm/10分以下であることが一層好ましく、8cm/10分以下であることがより一層好ましい。 The polyacetal resin used in this embodiment has a melt volume rate (MVR) measured according to ISO1133 at a temperature of 190°C and a load of 2.16 kg of preferably 0.5 cm3 /10 min or more, more preferably 0.6 cm3 /10 min or more, even more preferably 0.8 cm3 /10 min or more, even more preferably 1 cm3 /10 min or more, and even more preferably 5 cm3 /10 min or more. By setting the MVR to the lower limit or more, the productivity of the resin composition tends to be further improved. In addition, the MVR of the polyacetal resin is preferably 20 cm3 /10 min or less, more preferably 18 cm3 /10 min or less, even more preferably 14 cm3 /10 min or less, even more preferably 10 cm3 /10 min or less, and even more preferably 8 cm3 /10 min or less.

 ポリアセタール樹脂としては、上記の他、特開2015-074724号公報の段落0018~0043に記載のポリアセタール樹脂を用いることができ、これらの内容は本明細書に組み込まれる。
 本実施形態で用いるポリアセタール樹脂は、リサイクル品(回収品、マテリアルリサイクル品、ケミカルリサイクル品等を含む)、不合格品、熱可塑性樹脂成形の際の端材であってもよい。
In addition to the above, the polyacetal resins described in paragraphs 0018 to 0043 of JP-A-2015-074724 can be used as the polyacetal resin, the contents of which are incorporated herein by reference.
The polyacetal resin used in this embodiment may be a recycled product (including recovered products, material recycled products, chemical recycled products, etc.), a rejected product, or a scrap from thermoplastic resin molding.

 本実施形態の樹脂組成物は、ポリアセタール樹脂を樹脂組成物の80質量%以上の割合で含むことが好ましく、85質量%以上の割合で含むことがより好ましく、90質量%以上の割合で含むことがさらに好ましく、93質量%以上含むことが一層好ましく、95質量%以上含むことがより一層好ましく、97質量%以上含むことがさらに一層好ましく、また、シリコーン樹脂(B)およびシリコーンオイル(C)以外の成分がすべてポリアセタール樹脂であってもよい。
 本実施形態の樹脂組成物は、ポリアセタール樹脂を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合は、合計量が上記範囲となることが好ましい。
The resin composition of the present embodiment preferably contains polyacetal resin in a proportion of 80 mass % or more of the resin composition, more preferably contains 85 mass % or more, even more preferably contains 90 mass % or more, still more preferably contains 93 mass % or more, even more preferably contains 95 mass % or more, and still more preferably contains 97 mass % or more. In addition, all components other than the silicone resin (B) and the silicone oil (C) may be polyacetal resin.
The resin composition of the present embodiment may contain only one type of polyacetal resin, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

<重量平均分子量80万以上のシリコーン樹脂(B)>
 本実施形態の樹脂組成物は、重量平均分子量80万以上のシリコーン樹脂(B)を含む。重量平均分子量80万以上のシリコーン樹脂(B)を含むことにより、摺動性を向上させることができる。特に、限界PV値を向上させ、動摩擦係数を低くすることができる。
<Silicone resin (B) having a weight average molecular weight of 800,000 or more>
The resin composition of the present embodiment contains a silicone resin (B) having a weight average molecular weight of 800,000 or more. By containing a silicone resin (B) having a weight average molecular weight of 800,000 or more, the sliding properties can be improved. In particular, the limit PV value can be improved and the dynamic friction coefficient can be reduced.

 前記シリコーン樹脂(B)の重量平均分子量は、85万以上であることが好ましく、90万以上であることがより好ましく、95万以上であることがさらに好ましく、98万以上であることが一層好ましく、また、200万以下であることが好ましく、180万以下であることがより好ましく、150万以下であることがさらに好ましく、120万以下であってもよい。
 前記下限値以上とすることにより、摺動性がより向上する傾向にある。また、前記上限値以下とすることにより、金型汚染や成形片のデラミネーションの抑制効果がより向上する傾向にある。
The weight average molecular weight of the silicone resin (B) is preferably 850,000 or more, more preferably 900,000 or more, even more preferably 950,000 or more, and still more preferably 980,000 or more, and is preferably 2,000,000 or less, more preferably 1,800,000 or less, and even more preferably 1,500,000 or less, and may be 1,200,000 or less.
By setting the content to be equal to or more than the lower limit, the sliding properties tend to be improved, whereas by setting the content to be equal to or less than the upper limit, the effect of suppressing mold contamination and delamination of molded pieces tends to be improved.

 本実施形態において、シリコーン樹脂(B)の分子量は、以下の方法に従って測定される。
 シリコーン樹脂中のシリコーンをジクロロメタンで抽出する。抽出したシリコーンを0.2質量%のトルエン溶離液で調整し、室温で12時間静置する。その後、0.45μmメンブランフィルターにてろ過し、ろ液についてゲル浸透クロマトグラフィ(GPC)測定を行った。GPC測定に際し、ウォーターズ製のAQCUITY APCを使用することができる。
 本実施形態の樹脂組成物が、シリコーン樹脂(B)2種以上含む場合、シリコーン樹脂(B)のMwは、混合物のMwとする。
 シリコーンオイル(C)についても、同様である。
In this embodiment, the molecular weight of the silicone resin (B) is measured according to the following method.
Silicone in silicone resin is extracted with dichloromethane. The extracted silicone is adjusted with 0.2% by mass of toluene eluent and left at room temperature for 12 hours. Then, it is filtered with a 0.45 μm membrane filter, and the filtrate is subjected to gel permeation chromatography (GPC) measurement. When performing GPC measurement, AQCUITY APC manufactured by Waters can be used.
When the resin composition of the present embodiment contains two or more types of silicone resin (B), the Mw of the silicone resin (B) is the Mw of the mixture.
The same applies to the silicone oil (C).

 本実施形態で用いるシリコーン樹脂(B)は、ポリオルガノシロキサンであることが好ましく、-(Si(R)-O)-で表され、かつ、Rは、それぞれ独立に、水素原子、炭化水素基、-O-炭化水素基、または、水酸基である化合物が好ましい(ただし、Rの少なくとも1つは炭化水素基または-O-炭化水素基である。)。Rは、それぞれ独立に、水素原子、炭素数1~6の炭化水素基、-O-炭素数1~6の炭化水素基、または、水酸基であることが好ましく、水素原子、メチル基、エチル基、フェニル基、メトキシ基、エトキシ基、フェノキシ基、または、水酸基であることが好ましく、水素原子、メチル基またはメトキシ基であることがより好ましく、水素原子またはメチル基であることがさらに好ましい。
 シリコーン樹脂(B)における-(Si(R)-O)-は1種であってもよいし、2種以上であってもよい。
The silicone resin (B) used in this embodiment is preferably a polyorganosiloxane, and is preferably a compound represented by -(Si(R) 2 -O)-, where R is each independently a hydrogen atom, a hydrocarbon group, an -O-hydrocarbon group, or a hydroxyl group (with the proviso that at least one of R is a hydrocarbon group or an -O-hydrocarbon group). Each R is preferably independently a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, an -O-hydrocarbon group having 1 to 6 carbon atoms, or a hydroxyl group, and is preferably a hydrogen atom, a methyl group, an ethyl group, a phenyl group, a methoxy group, an ethoxy group, a phenoxy group, or a hydroxyl group, more preferably a hydrogen atom, a methyl group, or a methoxy group, and even more preferably a hydrogen atom or a methyl group.
The silicone resin (B) may contain one type of —(Si(R) 2 —O)—, or two or more types of —(Si(R) 2 —O)—.

 本実施形態で用いるシリコーン樹脂(B)は、非架橋型シリコーンであることが好ましい。非架橋型シリコーンとは、-(Si(R)-O)-で表され、かつ、Rはそれぞれ独立に、-(Si(R’)-O)-で表せる構造(R’はそれぞれ独立に、他の部位との架橋構造を形成している)を含まないシリコーンが例示される。Rは、上記と同様であり、好ましい範囲も同様である。 The silicone resin (B) used in this embodiment is preferably a non-crosslinked silicone. Non-crosslinked silicones are exemplified by silicones represented by -(Si(R) 2 -O)-, where each R is independently a silicone that does not contain a structure represented by -(Si(R') 2 -O)- (each R' independently forms a crosslinked structure with another moiety). R is the same as above, and the preferred range is also the same.

 本実施形態で用いるシリコーン樹脂(B)は、また、直鎖状シリコーンであることが好ましい。直鎖状シリコーンとは、-(Si(R)-O)-で表され、かつ、Rがそれぞれ独立に、ケイ素原子を含まない炭素数が12以下の原子団であるような化合物が例示される。ここでのRは、上記と同様であり、好ましい範囲も同様である。 The silicone resin (B) used in this embodiment is preferably a linear silicone. An example of a linear silicone is a compound represented by -(Si(R) 2 -O)-, where each R is independently an atomic group having 12 or less carbon atoms and not containing a silicon atom. R here is the same as above, and the preferred range is also the same.

 シリコーン樹脂(B)を配合するに際し、マスターバッチ化してもよい。マスターバッチに用いる樹脂としては、ポリアセタール樹脂が好ましい。また、マスターバッチにおけるシリコーン樹脂(B)の割合は、10質量%以上であることが好ましく、30質量%以上であることがより好ましく、40質量%以上であることがさらに好ましく、また、80質量%以下であることが好ましく、70質量%以下であることが好ましく、60質量%以下であることがより好ましい。 When compounding the silicone resin (B), it may be made into a masterbatch. The resin used in the masterbatch is preferably a polyacetal resin. The proportion of silicone resin (B) in the masterbatch is preferably 10% by mass or more, more preferably 30% by mass or more, and even more preferably 40% by mass or more, and is preferably 80% by mass or less, preferably 70% by mass or less, and more preferably 60% by mass or less.

 本実施形態の樹脂組成物におけるシリコーン樹脂(B)の含有量は、ポリアセタール樹脂(A)100質量部に対し、0.1質量部以上であることが好ましく、0.2質量部以上であることがより好ましく、0.3質量部以上であることがさらに好ましく、0.4質量部以上であることが一層好ましく、用途等に応じて、0.6質量部以上であってもよく、また、9質量部以下であることが好ましく、7質量部以下であることがより好ましく、5質量部以下であることがさらに好ましく、3質量部以下であることが一層好ましく、1質量部以下であることがより一層好ましく、0.9質量部以下であることがさらに一層好ましく、用途等に応じて、0.7質量部以下であってもよい。前記下限値以上とすることにより、摺動性がより向上する傾向にある。また、前記上限値以下とすることにより、金型汚染や成形片のデラミネーション抑制効果がより向上する傾向にある。
 本実施形態の樹脂組成物は、シリコーン樹脂(B)を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
The content of the silicone resin (B) in the resin composition of this embodiment is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, even more preferably 0.3 parts by mass or more, and even more preferably 0.4 parts by mass or more, relative to 100 parts by mass of the polyacetal resin (A), and may be 0.6 parts by mass or more depending on the application, and may be 9 parts by mass or less, more preferably 7 parts by mass or less, even more preferably 5 parts by mass or less, even more preferably 3 parts by mass or less, even more preferably 1 part by mass or less, and even more preferably 0.9 parts by mass or less, and may be 0.7 parts by mass or less depending on the application. By making it equal to or more than the lower limit, the sliding property tends to be further improved. Also, by making it equal to or less than the upper limit, the effect of suppressing mold contamination and delamination of molded pieces tends to be further improved.
The resin composition of the present embodiment may contain only one type of silicone resin (B), or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

<重量平均分子量10万未満のシリコーンオイル(C)>
 本実施形態の樹脂組成物は、重量平均分子量10万未満のシリコーンオイル(C)を含む。重量平均分子量10万未満のシリコーンオイル(C)を、シリコーン樹脂(B)と併用することにより、摺動性(特に、限界PV値)を高く維持しつつ、金型汚染やデラミネーションを効果的に抑制できる。
<Silicone Oil (C) with Weight Average Molecular Weight of Less than 100,000>
The resin composition of the present embodiment contains a silicone oil (C) having a weight-average molecular weight of less than 100,000. By using the silicone oil (C) having a weight-average molecular weight of less than 100,000 in combination with the silicone resin (B), it is possible to effectively suppress mold contamination and delamination while maintaining high slidability (particularly, the limit PV value).

 前記シリコーンオイル(C)の重量平均分子量は、9.5万以下であることが好ましく、9万以下であることがより好ましく、8.5万以下であることがさらに好ましく、また、1万以上であることが好ましく、2万以上であることがより好ましく、3.5万以上であることがさらに好ましい。
 前記下限値以上とすることにより、摺動性がより向上する傾向にある。また、前記上限値以下とすることにより、金型汚染や成形片のデラミネーション抑制効果がより向上する傾向にある。
The weight average molecular weight of the silicone oil (C) is preferably 95,000 or less, more preferably 90,000 or less, and even more preferably 85,000 or less, and is preferably 10,000 or more, more preferably 20,000 or more, and even more preferably 35,000 or more.
By setting the content to be equal to or more than the lower limit, the sliding properties tend to be improved, whereas by setting the content to be equal to or less than the upper limit, the effect of suppressing mold contamination and delamination of molded pieces tends to be improved.

 本実施形態で用いるシリコーンオイル(C)は、オルガノシロキサンであることが好ましく、-(Si(R)-O)-で表され、かつ、Rは、それぞれ独立に、水素原子、炭化水素基、-O-炭化水素基、または、水酸基である化合物が好ましい(ただし、Rの少なくとも1つは炭化水素基または-O-炭化水素基である。)。Rは、それぞれ独立に、水素原子、炭素数1~6の炭化水素基、-O-炭素数1~6の炭化水素基、または、水酸基であることが好ましく、水素原子、メチル基、エチル基、フェニル基、メトキシ基、エトキシ基、フェノキシ基、または、水酸基であることが好ましく、水素原子、メチル基またはメトキシ基であることがより好ましく、水素原子またはメチル基であることがさらに好ましい。
 シリコーンオイル(C)における-(Si(R)-O)-は1種であってもよいし、2種以上であってもよい。
The silicone oil (C) used in this embodiment is preferably an organosiloxane, and is preferably a compound represented by -(Si(R) 2 -O)-, where each R is independently a hydrogen atom, a hydrocarbon group, an -O-hydrocarbon group, or a hydroxyl group (with the proviso that at least one of R is a hydrocarbon group or an -O-hydrocarbon group). Each R is preferably independently a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, an -O-hydrocarbon group having 1 to 6 carbon atoms, or a hydroxyl group, and is preferably a hydrogen atom, a methyl group, an ethyl group, a phenyl group, a methoxy group, an ethoxy group, a phenoxy group, or a hydroxyl group, more preferably a hydrogen atom, a methyl group, or a methoxy group, and even more preferably a hydrogen atom or a methyl group.
The —(Si(R) 2 —O)— in the silicone oil (C) may be of one type or of two or more types.

 シリコーンオイル(C)を配合するに際し、マスターバッチ化してもよい。マスターバッチに用いる樹脂としては、ポリアセタール樹脂が好ましい。また、マスターバッチにおけるシリコーンオイル(C)の割合は、10質量%以上であることが好ましく、20質量%以上であることがより好ましく、30質量%以上であることがさらに好ましく、また、60質量%以下であることが好ましく、55質量%以下であることが好ましく、45質量%以下であることがより好ましい。 When silicone oil (C) is blended, it may be made into a masterbatch. The resin used in the masterbatch is preferably polyacetal resin. The proportion of silicone oil (C) in the masterbatch is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 30% by mass or more, and is preferably 60% by mass or less, preferably 55% by mass or less, and more preferably 45% by mass or less.

 本実施形態の樹脂組成物におけるシリコーンオイル(C)の含有量は、ポリアセタール樹脂(A)100質量部に対し、0.05質量部以上であることが好ましく、0.1質量部以上であることがより好ましく、0.2質量部以上であることがさらに好ましく、用途等に応じて、0.3質量部以上であってもよく、また、9質量部以下であることが好ましく、5質量部以下であることがより好ましく、3質量部以下であることがさらに好ましく、1質量部以下であることが一層好ましく、0.6質量部以下であることがより一層好ましく、用途等に応じて、0.4質量部以下であってもよい。前記下限値以上とすることにより、摺動性がより向上する傾向にある。また、前記上限値以下とすることにより、デラミネーション抑制効果がより向上する傾向にある。
 本実施形態の樹脂組成物は、シリコーンオイル(C)を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。
The content of silicone oil (C) in the resin composition of this embodiment is preferably 0.05 parts by mass or more, more preferably 0.1 parts by mass or more, and even more preferably 0.2 parts by mass or more, relative to 100 parts by mass of polyacetal resin (A), and may be 0.3 parts by mass or more depending on the application, and may be 9 parts by mass or less, more preferably 5 parts by mass or less, even more preferably 3 parts by mass or less, even more preferably 1 part by mass or less, and even more preferably 0.6 parts by mass or less, and may be 0.4 parts by mass or less depending on the application. By making it equal to or more than the lower limit, the sliding property tends to be further improved. Also, by making it equal to or less than the upper limit, the delamination suppression effect tends to be further improved.
The resin composition of the present embodiment may contain only one type of silicone oil (C), or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

<シリコーン樹脂(B)とシリコーンオイル(C)のブレンド>
 本実施形態の樹脂組成物は、シリコーン樹脂(B)とシリコーンオイル(C)の質量比率である、(B)/(C)が10/90~90/10である。このような構成とすることにより、摺動性の向上と金型汚染の抑制をバランスよく向上させることができる。
 前記シリコーン樹脂(B)とシリコーンオイル(C)のブレンド比は、シリコーン樹脂(B)とシリコーンオイル(C)の合計100質量部に対し、シリコーン樹脂(B)が15質量部以上であることが好ましく、20質量部以上であることがより好ましく、30質量部以上であることがさらに好ましく、40質量部以上であることが好ましく、用途等に応じて、51質量部以上であってもよく、さらには55質量部以上であってもよく、また、85質量部以下であることが好ましく、80質量部以下であることがより好ましく、用途等に応じて、75質量部以下、さらには70質量部以下であってもよい。
<Blend of Silicone Resin (B) and Silicone Oil (C)>
In the resin composition of the present embodiment, the mass ratio of the silicone resin (B) to the silicone oil (C), that is, (B)/(C), is 10/90 to 90/10. By adopting such a configuration, it is possible to improve the sliding properties and suppress the mold contamination in a well-balanced manner.
The blend ratio of the silicone resin (B) and the silicone oil (C) is preferably 15 parts by mass or more of the silicone resin (B) per 100 parts by mass of the total of the silicone resin (B) and the silicone oil (C), more preferably 20 parts by mass or more, even more preferably 30 parts by mass or more, and preferably 40 parts by mass or more. Depending on the application, etc., it may be 51 parts by mass or more, or even 55 parts by mass or more, and is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and may be 75 parts by mass or less, or even 70 parts by mass or less, depending on the application, etc.

 シリコーン樹脂(B)とシリコーンオイル(C)のそれぞれの重量平均分子量をMwB、MwCとした際のシリコーン樹脂(B)とシリコーンオイル(C)の重量平均分子量の比MwB/MwCは、10以上であることが好ましく、20以上、さらには40以上であってもよく、100以下であることが好ましく、50以下、30以下、さらには15以下であってもよい。上記範囲とすることにより、本発明の効果がより効果的に発揮される傾向にある。 When the weight average molecular weights of the silicone resin (B) and the silicone oil (C) are MwB and MwC , respectively, the ratio of the weight average molecular weights of the silicone resin (B) and the silicone oil (C), MwB / MwC , is preferably 10 or more, and may be 20 or more, or even 40 or more, and is preferably 100 or less, and may be 50 or less, 30 or less, or even 15 or less. By being in the above range, the effects of the present invention tend to be more effectively exhibited.

 本実施形態の樹脂組成物は、ポリアセタール樹脂(A)100質量部に対し、前記シリコーン樹脂(B)およびシリコーンオイル(C)の合計含有量が0.1質量部超10質量部未満であることが好ましい。前記下限値以上とすることにより、摺動性がより向上する傾向にある。また、前記上限値以下とすることにより、金型汚染や成形片のデラミネーション抑制効果がより向上する傾向にある。
 前記シリコーン樹脂(B)およびシリコーンオイル(C)の合計含有量は、ポリアセタール樹脂(A)100質量部に対し、0.1質量部以上であることがより好ましく、0.11質量部以上であることがさらに好ましく、0.2質量部以上であることが一層好ましく、0.3質量部以上であることがより一層好ましく、0.5質量部以上であることがさらに一層好ましく、0.8質量部以上であることがよりさらに一層好ましく、また、9質量部以下であることが好ましく、8質量部以下であることがより好ましく、7質量部以下であることがさらに好ましく、5質量部以下であることが一層好ましく、3質量部以下であることがより一層好ましく、2質量部以下であることがさらに一層好ましく、1.5質量部以下であることがよりさらに一層好ましい。
In the resin composition of the present embodiment, the total content of the silicone resin (B) and the silicone oil (C) is preferably more than 0.1 parts by mass and less than 10 parts by mass with respect to 100 parts by mass of the polyacetal resin (A). By making it equal to or more than the lower limit, the sliding property tends to be improved. Also, by making it equal to or less than the upper limit, the effect of suppressing mold contamination and delamination of molded pieces tends to be improved.
The total content of the silicone resin (B) and the silicone oil (C) is, relative to 100 parts by mass of the polyacetal resin (A), more preferably 0.1 parts by mass or more, even more preferably 0.11 parts by mass or more, even more preferably 0.2 parts by mass or more, even more preferably 0.3 parts by mass or more, even more preferably 0.5 parts by mass or more, even more preferably 0.8 parts by mass or more, and preferably 9 parts by mass or less, more preferably 8 parts by mass or less, even more preferably 7 parts by mass or less, even more preferably 5 parts by mass or less, even more preferably 3 parts by mass or less, even more preferably 2 parts by mass or less, and even more preferably 1.5 parts by mass or less.

 本実施形態の樹脂組成物は、重量平均分子量10万以上80万未満のシリコーン化合物を含んでいてもよいし、含んでいなくてもよい。本実施形態の一例は、重量平均分子量10万以上80万未満のシリコーン化合物を実質的に含まないことである。実質的に含まないとは、樹脂組成物に含まれる重量平均分子量10万以上80万未満のシリコーン化合物の含有量が、シリコーン樹脂(B)とシリコーンオイル(C)の合計含有量の10質量%未満であることをいい、5質量%未満であることが好ましく、3質量%未満であることがより好ましく、1質量%未満であってもよい。 The resin composition of this embodiment may or may not contain a silicone compound having a weight average molecular weight of 100,000 or more and less than 800,000. One example of this embodiment is one that is substantially free of silicone compounds having a weight average molecular weight of 100,000 or more and less than 800,000. "Substantially free" means that the content of silicone compounds having a weight average molecular weight of 100,000 or more and less than 800,000 contained in the resin composition is less than 10% by mass of the total content of the silicone resin (B) and the silicone oil (C), preferably less than 5% by mass, more preferably less than 3% by mass, and may be less than 1% by mass.

 本実施形態の樹脂組成物は、また、ポリアセタール樹脂(A)とシリコーン樹脂(B)とシリコーンオイル(C)の合計含有量が、樹脂組成物中、90質量%以上であることが好ましく、95質量%以上であることがより好ましく、97質量%以上であることがさらに好ましく、98質量%以上であることが一層好ましく、99質量%以上であることが一層好ましく、また、100質量%以下であってもよい。 In the resin composition of this embodiment, the total content of the polyacetal resin (A), silicone resin (B), and silicone oil (C) in the resin composition is preferably 90% by mass or more, more preferably 95% by mass or more, even more preferably 97% by mass or more, even more preferably 98% by mass or more, even more preferably 99% by mass or more, and may be 100% by mass or less.

<その他の成分>
 本実施形態の樹脂組成物は、本発明の目的を損なわない範囲内で、公知の添加剤や充填剤を添加してもよい。本実施形態に使用することのできる添加剤や充填剤としては、例えば、ポリアセタール樹脂以外の公知の熱可塑性ポリマー、酸変性ポリマー、耐候剤、ホルムアルデヒド捕捉剤、無機粒子、酸化防止剤(ヒンダードアミン系、ヒンダードフェノール系等)、熱安定剤、着色剤、核剤、可塑剤、蛍光増白剤、離型剤、帯電防止剤、紫外線吸収剤、難燃剤、難燃助剤等の添加剤を必要に応じて添加してもよい。
 本実施形態の樹脂組成物は、ポリアセタール樹脂、シリコーン樹脂(B)、および、シリコーンオイル(C)、ならびに、必要に応じ配合される他の成分の合計が100質量%となるように調整される。
<Other ingredients>
The resin composition of the present embodiment may contain known additives and fillers within the scope of the present invention. Examples of additives and fillers that can be used in the present embodiment include known thermoplastic polymers other than polyacetal resins, acid-modified polymers, weathering agents, formaldehyde scavengers, inorganic particles, antioxidants (hindered amines, hindered phenols, etc.), heat stabilizers, colorants, nucleating agents, plasticizers, fluorescent brighteners, release agents, antistatic agents, ultraviolet absorbers, flame retardants, and flame retardant assistants, etc., which may be added as necessary.
The resin composition of the present embodiment is prepared so that the total of the polyacetal resin, the silicone resin (B), and the silicone oil (C), as well as other components that are blended as necessary, is 100 mass %.

<樹脂組成物の物性>
 本実施形態の樹脂組成物は、摺動性に優れていることが好ましい。
 本実施形態の樹脂組成物は、円筒型スラスト試験片に成形したときの動摩擦係数が0.25以下であることが好ましい。下限値は、例えば、0.01以上が実際的である。このような小さい動摩擦係数は、主に、ポリアセタール樹脂に(A)に、シリコーンオイル(C)を配合することによって達成される。
 動摩擦係数は、後述する実施例の記載に従って測定される。
<Physical Properties of Resin Composition>
The resin composition of the present embodiment preferably has excellent slidability.
The resin composition of the present embodiment preferably has a dynamic friction coefficient of 0.25 or less when molded into a cylindrical thrust test piece. The lower limit is, for example, 0.01 or more, which is practical. Such a small dynamic friction coefficient is achieved mainly by blending the silicone oil (C) with the polyacetal resin (A).
The dynamic friction coefficient is measured as described in the Examples section below.

 本実施形態の樹脂組成物は、円筒型スラスト試験片に成形し、接触面積2cm2、温度23℃における、JIS K7218 A法に規定されるスラストリング摩擦摩耗試験に従って測定した時の、限界PV値(MPa・cm/s)が、16.0MPa・cm/s以上であることが好ましい。上限は特に定めるものではないが、50.0MPa・cm/s以下が実際的である。このような高い限界PV値は、主に、ポリアセタール樹脂に(A)に、シリコーン樹脂(B)を配合することによって達成される。
 限界PV値は、後述する実施例の記載に従って測定される。
The resin composition of this embodiment is molded into a cylindrical thrust test piece, and when measured according to the thrust ring friction and wear test specified in JIS K7218 Method A at a contact area of 2 cm2 and a temperature of 23°C, the limit PV value (MPa cm/s) is preferably 16.0 MPa cm/s or more. There is no particular upper limit, but 50.0 MPa cm/s or less is practical. Such a high limit PV value is mainly achieved by blending the silicone resin (B) with the polyacetal resin (A).
The limit PV value is measured as described in the Examples section below.

<樹脂組成物の製造方法>
 本実施形態の樹脂組成物は、従来の熱可塑性樹脂組成物の調製法として一般に用いられる公知の方法により容易に調製される。例えば、(1)樹脂組成物を構成する全成分を混合し、これを押出機に供給して溶融混練し、ペレット状の樹脂組成物を得る方法、(2)樹脂組成物を構成する成分の一部を押出機の主フィード口から、残余成分をサイドフィード口から供給して溶融混練し、ペレット状の樹脂組成物を得る方法、(3)押出し等により一旦組成の異なるペレットを調製し、そのペレットを混合して所定の組成を有する樹脂組成物に調整する方法等を採用できる。
 本実施形態においては、シリコーン樹脂(B)および/またはシリコーンオイル(C)(好ましくはシリーン樹脂(B))を、予めマスターバッチ化してから、残余成分と溶融混練することが好ましい。
 混練機は、ニーダー、バンバリーミキサー、押出機等が例示される。混合・混練の各種条件や装置についても、特に制限はなく、従来公知の任意の条件から適宜選択して決定すればよい。混練はポリアセタール樹脂が溶融する温度以上、具体的にはポリアセタール樹脂の融解温度以上(一般的には180℃以上)で行うことが好ましい。
<Method of producing resin composition>
The resin composition of the present embodiment can be easily prepared by a known method generally used for preparing conventional thermoplastic resin compositions. For example, (1) a method of mixing all the components constituting the resin composition, feeding the mixture into an extruder and melt-kneading the mixture to obtain a pellet-shaped resin composition, (2) a method of feeding a part of the components constituting the resin composition from the main feed port of an extruder and the remaining components from the side feed port, melt-kneading the mixture to obtain a pellet-shaped resin composition, (3) a method of preparing pellets with different compositions by extrusion or the like, mixing the pellets to prepare a resin composition having a predetermined composition, etc. can be adopted.
In this embodiment, it is preferable that the silicone resin (B) and/or the silicone oil (C) (preferably the silicone resin (B)) is made into a master batch in advance, and then melt-kneaded with the remaining components.
Examples of the kneading machine include a kneader, a Banbury mixer, and an extruder. There are no particular limitations on the various conditions and devices for mixing and kneading, and they may be appropriately selected from any conventionally known conditions. Kneading is preferably performed at a temperature at which the polyacetal resin melts or higher, specifically at the melting temperature of the polyacetal resin or higher (generally 180° C. or higher).

<成形品>
 本実施形態の成形品は、本実施形態の樹脂組成物ないしペレットから形成される。本実施形態の樹脂組成物をペレタイズして得られたペレットは、各種の成形法で成形して成形品とされる。またペレットを経由せずに、押出機で溶融混練された樹脂組成物を直接、成形して成形品にすることもできる。
 成形品の形状としては、特に制限はなく、成形品の用途、目的に応じて適宜選択することができ、例えば、板状、プレート状、ロッド状、シート状、フィルム状、円筒状、環状、円形状、楕円形状、歯車状、多角形形状、異形品、中空品、枠状、箱状、パネル状のもの等が挙げられる。本実施形態の成形品は、完成品であってもよいし、部品であってもよい。
<Molded products>
The molded article of the present embodiment is formed from the resin composition or pellets of the present embodiment. The pellets obtained by pelletizing the resin composition of the present embodiment are molded into a molded article by various molding methods. Alternatively, the resin composition melt-kneaded in an extruder can be directly molded into a molded article without going through pellets.
The shape of the molded product is not particularly limited and can be appropriately selected depending on the application and purpose of the molded product, and examples thereof include plate-like, plate-like, rod-like, sheet-like, film-like, cylindrical, annular, circular, elliptical, gear-like, polygonal, irregularly shaped, hollow, frame-like, box-like, panel-like, etc. The molded product of this embodiment may be a finished product or a part.

 成形品を成形する方法としては、特に制限されず、従来公知の成形法を採用でき、例えば、射出成形法、射出圧縮成形法、押出成形法、異形押出法、トランスファー成形法、中空成形法、ガスアシスト中空成形法、ブロー成形法、押出ブロー成形、IMC(インモールドコーティング成形)成形法、回転成形法、多層成形法、2色成形法、インサート成形法、サンドイッチ成形法、発泡成形法、加圧成形法等が挙げられる。 The method for forming the molded product is not particularly limited, and any conventionally known molding method can be used, such as injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, hollow molding, gas-assisted hollow molding, blow molding, extrusion blow molding, IMC (in-mold coating molding), rotational molding, multi-layer molding, two-color molding, insert molding, sandwich molding, foam molding, and pressure molding.

 本実施形態の樹脂組成物は、摺動部材形成用として好ましく用いられる。従って、本実施形態の樹脂組成物から形成された成形品は、摺動部材(摺動部品)として好ましく用いられる。
 摺動部材の具体的な例としては、電気・電子機器、事務機器、車両(自動車)、産業機器等で要求されている高品質化を目的とした、歯車、回転軸、軸受け、各種ギア、カム、メカニカルシールの端面材、バルブなどの弁座、Vリング、ロッドパッキン、ピストンリング、ライダーリング等のシール部材、圧縮機の回転軸、回転スリーブ、ピストン、インペラー、ローラー等の摺動部材が挙げられる。
The resin composition of the present embodiment is preferably used for forming a sliding member, and therefore, a molded article formed from the resin composition of the present embodiment is preferably used as a sliding member (sliding part).
Specific examples of the sliding members include sliding members such as gears, rotating shafts, bearings, various gears, cams, end face materials of mechanical seals, valve seats of valves, sealing members such as V-rings, rod packings, piston rings, rider rings, rotating shafts of compressors, rotating sleeves, pistons, impellers, rollers, etc., which are intended to meet the high quality demands of electric/electronic devices, office equipment, vehicles (automobiles), industrial equipment, etc.

 本実施形態の摺動部材は、本実施形態の摺動部材同士はもちろん、他の樹脂製摺動部材や、繊維強化樹脂摺動部材の他、セラミックスや金属製摺動部材と組み合わせた摺動部材として用いることも可能である。 The sliding member of this embodiment can be used not only with other sliding members of this embodiment, but also with other resin sliding members, fiber-reinforced resin sliding members, and ceramic or metal sliding members.

 以下に実施例を挙げて本発明をさらに具体的に説明する。以下の実施例に示す材料、使用量、割合、処理内容、処理手順等は、本発明の趣旨を逸脱しない限り、適宜、変更することができる。従って、本発明の範囲は以下に示す具体例に限定されるものではない。
 実施例で用いた測定機器等が廃番等により入手困難な場合、他の同等の性能を有する機器を用いて測定することができる。
The present invention will be described in more detail below with reference to examples. The materials, amounts, ratios, processing contents, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.
If the measuring instruments used in the examples are difficult to obtain due to discontinuation or the like, measurements can be made using other instruments with equivalent performance.

1.原料
 以下の原料を用いた。

Figure JPOXMLDOC01-appb-T000001
1. Raw materials The following raw materials were used:
Figure JPOXMLDOC01-appb-T000001

2.実施例1~6、比較例1~6
<樹脂組成物(ペレット)の製造>
 表1に示す各成分を表2に示す割合(各成分の割合は質量部である)で、川田製作所社製スーパーミキサーを用いて均一に混合した。得られた混合物をスクリュー径30mmのベント付き二軸押出機(池貝社製「PCM30」)を用いて、シリンダー温度190℃、スクリュー回転数120rpm、吐出量10kg/時間で溶融せん断混合し、樹脂組成物のペレットを製造した。
2. Examples 1 to 6 and Comparative Examples 1 to 6
<Production of Resin Composition (Pellets)>
The components shown in Table 1 were mixed uniformly in the ratios shown in Table 2 (the ratios of each component are parts by mass) using a Super Mixer manufactured by Kawada Manufacturing Co., Ltd. The resulting mixture was melt shear mixed using a vented twin-screw extruder with a screw diameter of 30 mm ("PCM30" manufactured by Ikegai Corporation) at a cylinder temperature of 190°C, a screw rotation speed of 120 rpm, and a discharge rate of 10 kg/hour to produce pellets of the resin composition.

<動摩擦係数>
 上記で得られたペレットを、スクリュー径32mmの住友重機械工業(株)製SE-30DUZを用いシリンダー温度195℃、金型温度80℃の条件で、円筒型スラスト試験片を成形した。
 得られた円筒型スラスト試験片について、スラスト式摩擦摩耗試験を行い、動摩擦係数を測定した。
 スラスト試験はエー・アンド・デー社製、EFM-3-Gを使用した。
 円筒型スラスト試験片について、ポリアセタール樹脂の試験片に対する、線速度10cm/sで3分毎に3kg、5kg、10kgと5kg以降は5kgずつ面圧力を向上させて行うスラスト式摩擦摩耗試験において、処方による動摩擦係数の差が生じやすい低面圧下(荷重3kg、面圧力0.15MPa)の動摩擦係数に着目し、3分間の動摩擦係数の平均値を記録し、評価した。
<Dynamic friction coefficient>
The pellets obtained above were molded into cylindrical thrust test pieces using a SE-30DUZ with a screw diameter of 32 mm manufactured by Sumitomo Heavy Industries, Ltd. under conditions of a cylinder temperature of 195°C and a mold temperature of 80°C.
The cylindrical thrust test pieces thus obtained were subjected to a thrust type friction and wear test to measure the dynamic friction coefficient.
The thrust test was carried out using EFM-3-G manufactured by A&D Co., Ltd.
For cylindrical thrust test pieces, in a thrust friction wear test conducted on a polyacetal resin test piece at a linear velocity of 10 cm/s, the surface pressure was increased by 5 kg every 3 minutes, from 3 kg, 5 kg, and 10 kg, and thereafter. Focusing on the kinetic friction coefficient under low surface pressure (load 3 kg, surface pressure 0.15 MPa) where differences in the kinetic friction coefficient due to the formulation tend to occur, the average value of the kinetic friction coefficient over 3 minutes was recorded and evaluated.

<限界PV値>
 上記で得られたペレットを、スクリュー径32mmのSE30DUZ(住友重機械工業社製)を用いて、シリンダー温度195℃、金型温度80℃の条件で、射出成型した円筒型スラスト試験片を用いてスラスト式摩耗試験を実施した。
 円筒型スラスト試験片について、線速度10cm/sで3分毎に3kg、5kg、10kgと5kg以降は5kgずつ面圧力を向上させて行うスラスト式摩擦摩耗試験を行い、摩擦熱により融着した1段階下の面圧力と速度の積を限界PV値(単位:MPa・cm/s)とした。
<Limit PV value>
The pellets obtained above were injection molded using an SE30DUZ (manufactured by Sumitomo Heavy Industries, Ltd.) with a screw diameter of 32 mm under conditions of a cylinder temperature of 195°C and a mold temperature of 80°C, and a thrust wear test was performed using the cylindrical thrust test pieces.
A thrust friction and wear test was conducted on the cylindrical thrust test pieces at a linear velocity of 10 cm/s, with the surface pressure being increased every 3 minutes to 3 kg, 5 kg, and 10 kg, with the surface pressure increasing by 5 kg from 5 kg onwards. The product of the surface pressure and the speed one step below at which the test pieces were fused due to frictional heat was defined as the limit PV value (unit: MPa cm/s).

<デラミネーション>
 上記で得られた樹脂組成物を、住友重機械工業(株)製SE-30DUZを用い、シリンダー温度215℃、金型温度80℃、射出速度30mm/sで成形し、40mm×100mm×2mmの試験片を作製した。
 デラミネーションは以下のとおり評価した。AおよびBが実用レベルである。
A:ゲートから3cm以下5cm未満
B:ゲートから5cm以上7cm未満
C:ゲートから7cm以上
<Delamination>
The resin composition obtained above was molded using SE-30DUZ manufactured by Sumitomo Heavy Industries, Ltd. at a cylinder temperature of 215°C, a mold temperature of 80°C, and an injection speed of 30 mm/s to prepare test pieces of 40 mm x 100 mm x 2 mm.
Delamination was evaluated as follows, with A and B being at practical levels.
A: 3cm or less, less than 5cm from the gate B: 5cm or more, less than 7cm from the gate C: 7cm or more from the gate

<金型汚染>
 上記で得られた樹脂組成物を、住友重機械工業(株)製SE7MIIの成形機を用い、シリンダー温度230℃、しずく型の金型を使用し金型温度40℃の設定で500ショット連続成形を実施した。その後の金型の状態を確認した。評価は、5人の専門家が行い、多数決で判断した。AおよびBが実用レベルである。
A:金型付着物は全くなく、金型汚染抑制効果は極めて良好
B:金型付着物は少しあるものの、金型汚染抑制効果は良好(上記Aより劣る)
C:金型付着物は多く、金型汚染抑制効果は不良(上記Bより劣る)
<Mold contamination>
The resin composition obtained above was molded continuously for 500 shots using a molding machine, SE7MII, manufactured by Sumitomo Heavy Industries, Ltd., with a cylinder temperature of 230°C and a teardrop-shaped mold set at a mold temperature of 40°C. The state of the mold was then confirmed. The evaluation was carried out by five experts, who decided by majority vote. A and B are practical levels.
A: No deposits on the mold at all, and the mold contamination suppression effect is extremely good. B: There is a small amount of deposits on the mold, but the mold contamination suppression effect is good (inferior to A above).
C: There is a lot of mold adhesion, and the mold contamination suppression effect is poor (inferior to B above)



Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002

 上記結果から明らかなとおり、本実施形態の樹脂組成物から得られた成形品は、摺動性に優れていた。さらに、金型汚染も抑制された。 As is clear from the above results, the molded article obtained from the resin composition of this embodiment had excellent sliding properties. Furthermore, mold contamination was also suppressed.

Claims (6)

ポリアセタール樹脂(A)と、重量平均分子量80万以上のシリコーン樹脂(B)と、重量平均分子量10万未満のシリコーンオイル(C)とを含み、
前記シリコーン樹脂(B)とシリコーンオイル(C)の質量比率である、(B)/(C)が10/90~90/10である、樹脂組成物。
The composition comprises a polyacetal resin (A), a silicone resin (B) having a weight-average molecular weight of 800,000 or more, and a silicone oil (C) having a weight-average molecular weight of less than 100,000,
A resin composition, wherein the mass ratio of the silicone resin (B) to the silicone oil (C), (B)/(C), is 10/90 to 90/10.
ポリアセタール樹脂(A)100質量部に対し、前記シリコーン樹脂(B)およびシリコーンオイル(C)の合計含有量が0.5質量部以上10質量部未満である、請求項1に記載の樹脂組成物。 The resin composition according to claim 1, wherein the total content of the silicone resin (B) and the silicone oil (C) is 0.5 parts by mass or more and less than 10 parts by mass per 100 parts by mass of the polyacetal resin (A). ポリアセタール樹脂(A)100質量部に対し、前記シリコーン樹脂(B)およびシリコーンオイル(C)の合計含有量が0.5質量部以上2質量部未満である、請求項1に記載の樹脂組成物。 The resin composition according to claim 1, wherein the total content of the silicone resin (B) and the silicone oil (C) is 0.5 parts by mass or more and less than 2 parts by mass per 100 parts by mass of the polyacetal resin (A). 請求項1~3のいずれか1項に記載の樹脂組成物のペレット。 Pellets of the resin composition according to any one of claims 1 to 3. 請求項1~3のいずれか1項に記載の樹脂組成物から形成された成形品。 A molded article formed from the resin composition according to any one of claims 1 to 3. 請求項4に記載のペレットから形成された成形品。 A molded article formed from the pellets according to claim 4.
PCT/JP2024/030979 2023-09-06 2024-08-29 Resin composition, pellets, and molded article WO2025053044A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50121344A (en) * 1974-03-11 1975-09-23
CN102061058A (en) * 2010-12-20 2011-05-18 四川大学 Halogen-free flame-resistant glass fiber reinforced polyformaldehyde composite material and preparation method thereof
JP2016534171A (en) * 2013-10-21 2016-11-04 ティコナ ゲゼルシャフト ミット ベシュレンクテル ハフツング Inherently low friction polyoxymethylene
CN109233190A (en) * 2018-07-27 2019-01-18 会通新材料股份有限公司 One kind exempting from rouge self-lubricating POM composite material and preparation method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50121344A (en) * 1974-03-11 1975-09-23
CN102061058A (en) * 2010-12-20 2011-05-18 四川大学 Halogen-free flame-resistant glass fiber reinforced polyformaldehyde composite material and preparation method thereof
JP2016534171A (en) * 2013-10-21 2016-11-04 ティコナ ゲゼルシャフト ミット ベシュレンクテル ハフツング Inherently low friction polyoxymethylene
CN109233190A (en) * 2018-07-27 2019-01-18 会通新材料股份有限公司 One kind exempting from rouge self-lubricating POM composite material and preparation method

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