WO2025047241A1 - Inspection method, inspection device, and method for manufacturing adherend - Google Patents

Abstract

This inspection method is performed by a processor before a step of bonding a first adherend to a second adherend by an adhesive applied to a predetermined region of the first adherend. The inspection method includes steps of: acquiring a plurality of pieces of temperature image data generated by photographing a region in time series by an imaging device; applying analysis processing to the plurality of pieces of temperature image data to generate an analysis image according to a temperature change of the region; and determining whether or not there is an adhesive satisfying a predetermined criterion in the region on the basis of the analysis image.

Description

Inspection method, inspection device, and method for manufacturing bonded article

This disclosure relates to an inspection method, an inspection device, and a method for manufacturing adhesive objects.

Patent Document 1 discloses a method for post-weld inspection of a laser welded portion created by irradiating a laser onto the surface of an object to be inspected. The inspection method of Patent Document 1 has a first process in which the laser welded portion, which has been cooled to the ambient temperature after welding, is imaged with an infrared camera, and the difference in brightness in the obtained infrared image is regarded as an index representing the difference in infrared emissivity of the surface of the object to be inspected, to detect the welded portion area, and a second process in which the quality of the weld is judged based on the brightness value of the infrared image within the welded portion area.

Patent No. 4140218

The technology in Patent Document 1 is a technology that inspects laser welds after welding has already been completed, and cannot prevent welding defects from occurring.

This disclosure provides an inspection method, an inspection device, and a method for manufacturing adhesives that make it easier to prevent the occurrence of defective products.

An inspection method according to one aspect of the present disclosure is an inspection method performed by a processor prior to a step of adhering a first adherend to a second adherend by an adhesive applied to a predetermined region of the first adherend, the inspection method comprising:
A step of acquiring a plurality of temperature image data generated by photographing an area in time series with an imaging device;
performing an analysis process on the plurality of temperature image data to generate an analysis image corresponding to a temperature change in the region;
determining whether or not there is an adhesive in the region that meets a predetermined criterion based on the analysis image;
Includes.

A manufacturing method according to one aspect of the present disclosure is a method for manufacturing an adherend, the method including a front-end process and a back-end process of adhering a first adherend to a second adherend with an adhesive applied to a predetermined region of the first adherend, the method comprising the steps of:
The front end process is
A step of acquiring a plurality of temperature image data generated by photographing an area in time series with an imaging device;
performing an analysis process on the plurality of temperature image data to generate an analysis image corresponding to a temperature change in the region;
and determining whether or not there is an adhesive in the region that meets a predetermined criterion based on the analysis image;
A subsequent step includes adhering the first adherend to a second adherend with the adhesive to produce an adhesive if the processor determines that there is adhesive within the region that meets the predetermined criteria.

A manufacturing apparatus according to one aspect of the present disclosure is an inspection apparatus that performs an inspection prior to a step of adhering a first adherend to a second adherend with an adhesive applied to a predetermined region of the first adherend, the inspection apparatus comprising:
an input unit for acquiring a plurality of pieces of temperature image data generated by an image capturing device capturing images of an area in time series;
a processor for analyzing the image;
The processor
Analyzing the plurality of pieces of temperature image data to generate an analysis image corresponding to the temperature change of the area;
Based on the analysis image, it is determined whether or not there is an adhesive in the region that meets a predetermined criterion.

This disclosure makes it easier to prevent the occurrence of defective products.

FIG. 1 is a block diagram showing a configuration example of an inspection system according to a first embodiment. FIG. 2 is a block diagram showing a configuration example of the inspection device shown in FIG. A graph showing the temperature change over time of the workpiece components when the workpiece is flash heated. Graph showing the spectrum of a xenon lamp and the transmittance characteristics of glass, a primer, and a urethane adhesive. 1 is a flowchart illustrating an example of an operation of an inspection device. Schematic diagram illustrating a temperature image 1 is a flowchart illustrating details of a pass/fail determination process according to the first embodiment; Schematic diagram illustrating a difference image 11 is a flowchart illustrating a quality determination process according to the second embodiment. Schematic diagram illustrating a phase image A flowchart showing a method for manufacturing a bonded article according to the third embodiment.

Below, the embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of already well-known matters or duplicate explanation of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the inventors provide the attached drawings and the following explanation to enable those skilled in the art to fully understand the present disclosure, and do not intend for them to limit the subject matter described in the claims.

The following describes the inspection system according to the embodiment with reference to the drawings.

[1. First embodiment]
[1-1. Configuration]
[1-1-1. Configuration of inspection system]
1 is a block diagram showing a configuration example of an inspection system 1 according to a first embodiment of the present disclosure. The inspection system 1 includes an inspection device 10, an infrared camera 17, an excitation source 18, a control box 15, a power source 16, and an alarm device 19.

The inspection system 1 can non-destructively detect the condition of the workpiece 90 by using an active thermography method in which the workpiece 90 to be inspected is heated by applying excitation energy and temperature images are taken. For example, the inspection system 1 applies excitation energy to the workpiece 90 by the excitation source 18, and takes temperature images in a time series using the infrared camera 17.

The condition of the workpiece 90 includes information about the structure of the workpiece 90, such as external or internal features and defects. The workpiece 90 includes a substrate 91, which is an example of a first adherend, a primer 92 applied to the surface of the substrate 91, and an adhesive 93 applied on the primer 92. The substrate 91 is, for example, glass. The adhesive 93 is, for example, a urethane-based adhesive. The substrate 91 is adhered to the second adherend by the primer 92 and the adhesive 93 in a post-process performed after inspection by the inspection system 1. The inspection system 1 inspects the condition of the workpiece 90 before adhesion, for example, whether the primer 92 and the adhesive 93 have been applied to the substrate 91 without any defects.

The infrared camera 17 captures an image of an area including at least a portion of the workpiece 90 in a time series to generate multiple temperature image data. The infrared camera 17 includes an infrared sensor that detects infrared rays having a wavelength of, for example, 3 μm to 15 μm. The frame rate of the infrared camera 17 is, for example, 50 Hz (or 50 fps), but is not limited to this.

The excitation source 18 is an example of a heating device capable of heating the workpiece 90. The excitation source 18 is, for example, a xenon lamp, a laser light source, a vibrator that generates ultrasonic waves, or a coil that generates electromagnetic induction, but is not limited to these, and may be any energy source capable of radiating energy. The excitation source 18 can perform flash heating (pulse heating) by emitting a flash of light, or step heating by heating in steps, on the workpiece 90. The wavelength band of the light emitted by the excitation source 18 may be the same as or different from the wavelength band of infrared light that can be detected by the infrared camera 17. Although two excitation sources 18 are illustrated in FIG. 1, the number of excitation sources 18 is not limited to this, and may be one, or three or more.

The power supply 16 supplies power to the infrared camera 17 and the excitation source 18. The control box 15 includes a control circuit that controls the power supply 16 based on a control signal from the inspection device 10. The control box 15 may control the light emission method, light emission cycle, light emission time, etc. of the excitation source 18.

The notification device 19 notifies the outside. For example, the notification device 19 is controlled by the inspection device 10, and notifies the user of information indicating the detection result of the condition of the work 90. The notification device 19 may include a visual notification device such as a light source such as an LED, a display, or an indicator. The notification device 19 may also include an auditory notification device such as a speaker.

[1-1-2. Configuration of inspection device]
Fig. 2 is a block diagram showing an example of the configuration of the inspection device 10 in Fig. 1. The inspection device 10 includes a processor 11, a storage device 12, and an interface 13.

The processor 11 is composed of a CPU, an MPU, etc., and controls the entire inspection device 10 by executing various programs stored in the storage device 12. The processor 11 controls the excitation source 18 via the control box 15, for example, to start and stop the heating output of the excitation source 18. The processor 11 also controls the shooting operations of the infrared camera 17, such as starting and stopping shooting. The processor 11 also analyzes the temperature image data stored in the storage device 12 and detects the state of the workpiece 90, as described below.

The storage device 12 is a recording medium that records various information including data and programs necessary to realize the functions of the inspection device 10. The storage device 12 is realized, for example, by a semiconductor storage device such as a flash memory or a solid state drive (SSD), a magnetic storage device such as a hard disk drive (HDD), or other recording media, either alone or in combination. The storage device 12 is not limited to an internal storage device installed in the same housing as the processor 11, but may be, for example, an external storage device or a NAS (network-attached storage) type storage device. The storage device 12 may include volatile memory such as SRAM or DRAM.

The interface 13 connects the inspection device 10 to external devices such as the infrared camera 17, the control box 15, the alarm device 19, and the excitation source 18. The interface 13 may be a communication circuit that performs data communication according to an existing wired communication standard or wireless communication standard.

The interface 13 is an example of an input section that connects the inspection device 10 and the infrared camera 17 in order to input information such as temperature image data from the infrared camera 17 to the inspection device 10. The interface 13 is also an example of an output section that connects the inspection device 10 to external devices such as the control box 15, the alarm device 19, and the excitation source 18 in order to output information such as control signals from the processor 11 to the external devices. Such input and output sections may be integrated as an input/output interface 13 as shown in FIG. 2, or may be realized as multiple interface circuits.

[1-2. Operation]
[1-2-1. Overall operation]
The operation of the inspection device 10 will be described below. The processor 11 of the inspection device 10 according to this embodiment controls the excitation source 18 via the control box 15 so as to start heating the workpiece 90 and stop the heating a predetermined time (e.g., 60 milliseconds) after the start of heating. The infrared camera 17 starts photographing the workpiece 90 when heating starts or before heating, and continues photographing until a predetermined period of time has elapsed even after heating stops.

The substrate 91, primer 92, and adhesive 93 have different thermal property values. This results in differences in the measured values of the temperature change rate during heating (how they heat up) and the temperature change rate after heating is stopped (how they cool down) between the substrate 91, primer 92, and adhesive 93. Here, the thermal property values are physical property values related to heat, such as thermal conductivity, thermal diffusivity, reflectance, transmittance, and absorptance.

Figure 3 is a graph showing the change over time in temperature of the components of workpiece 90 when workpiece 90, which is made up of glass (an example of substrate 91), primer 92, and urethane-based adhesive 93, is flash-heated. Because there are differences in the thermal property values of substrate 91, primer 92, and adhesive 93, differences appear in the temperatures and temperature change rates of substrate 91, primer 92, and adhesive 93 after heating is stopped, especially immediately after, as shown in Figure 3. Also, as shown in Figure 3, differences appear in the temperatures and temperature change rates of substrate 91, primer 92, and adhesive 93 by 0.2 seconds after heating starts (t = 0), so inspection device 10 can complete the process described below within several tens of seconds, for example, 0.2 to several seconds, based on the start of heating.

Figure 4 is a graph showing the spectrum of a xenon lamp, which is an example of an excitation source 18, and the transmittance characteristics of glass (an example of a substrate 91), a primer 92, and a urethane-based adhesive 93. In the graph of Figure 4, the vertical axis on the left represents relative intensity, and the spectrum showing the relative intensity of the xenon lamp is shown by a dashed line. Also, in the graph of Figure 4, the vertical axis on the right represents transmittance, and the transmittance characteristics of glass, primer 92, and adhesive 93 are shown by a solid line, a long dashed line, and a dashed dotted line, respectively.

As shown in the graph in Figure 4, the transmittance characteristics of the glass, primer 92, and adhesive 93 are different from one another, so as shown in Figure 3, differences appear in the temperature and temperature change rate of the glass, primer 92, and adhesive 93 after heating is stopped, especially immediately afterwards.

Therefore, by analyzing the temperature image data of the workpiece 90, it is possible to distinguish between the portions of the substrate 91, the primer 92, and the adhesive 93 in the temperature image.

FIG. 5 is a flowchart illustrating the operation of the inspection device 10. Each process shown in this flow is executed by, for example, the processor 11 of the inspection device 10.

The processor 11 acquires temperature image data from the infrared camera 17 (S1). The acquired temperature image data is stored in the storage device 12. In step S1, or before step S1, the processor 11 controls the excitation source 18 via the control box 15 to start heating the workpiece 90.

FIG. 6 is a schematic diagram illustrating a temperature image 30 represented by the temperature image data acquired in step S1. The temperature image 30 in FIG. 6 is a temperature image of a workpiece 90 in which a primer is applied to a glass plate, and a urethane adhesive is applied on top of the primer. In the temperature image 30, the adhesive extends in the left-right direction. A scale placed for measurement purposes is shown above the adhesive on the paper surface of FIG. 6.

Returning to FIG. 5, after step S1, the processor 11 executes a quality determination process S2 to determine whether the condition of the workpiece 90 is defective. Details of the quality determination process S2 will be described later.

If the processor 11 determines that there is a defective condition as a result of the pass/fail determination process S2 (Yes in S3), it causes the alarm device 19 to perform an alarm operation (S4). This allows the user to know that there is a defect in the workpiece 90. The alarm operation includes, for example, emitting a warning sound from a speaker, or turning on or blinking a light source such as an LED. Alternatively, the processor 11 may display information indicating that there is a joint defect on a display, which is an example of the alarm device 19.

If it is determined in step S3 that there is no poor condition (No in S3), and after step S4, the processor 11 displays information indicating the analysis results, the determination results, etc. on a display, which is an example of the alarm device 19 (S5).

Then, the processor 11 stores information indicating the analysis results, the determination results, etc. in the storage device 12 (S6). The information stored in the storage device 12 is used, for example, in a later process to determine whether or not to bond the substrate 91, which is the first adherend, to a second adherend. For example, if the condition of the workpiece 90 is poor, the user may not perform the later process and may reapply the primer 92 and/or adhesive 93 to the substrate 91. The user may remove the primer 92 and/or adhesive 93 from the substrate 91 and reapply new primer 92 and/or adhesive 93.

As described above, the processor 11 can complete the process (pre-process) of FIG. 5 within several tens of seconds, for example, 0.2 to several seconds, from the start of heating. Therefore, the pre-process is completed before the adhesive 93 hardens, and the post-process can be performed to bond the substrate 91 to the second adherend to produce an adhered product. Also, in the pre-process, the heating time of the workpiece 90 is short (for example, after 60 milliseconds) as described above, so the temperature of the adhesive 93 is not increased more than necessary, and the pre-process can be completed before the adhesive 93 hardens due to the temperature increase.

[1-2-2. Quality Judgment Processing]
FIG. 7 is a flowchart illustrating the details of the pass/fail determination process S2 shown in FIG.

In FIG. 7, first, the processor 11 determines one of the temperature image data acquired in the temperature image acquisition process S1 as a reference frame (reference temperature image data) (S201).

The reference frame is, for example, temperature image data generated by photographing the photographed area before heating of the workpiece 90 begins. Alternatively, the reference frame may be temperature image data generated by photographing the photographed area after a sufficient amount of time has passed since heating was stopped. In these cases, the reference frame is temperature image data generated by photographing the photographed area at or near the point when the temperature of the photographed area (workpiece 90) is at its lowest.

In another example, the reference frame may be temperature image data (temperature peak image) generated by photographing the photographed area when heating of the workpiece 90 is stopped or immediately before that. In this case, the reference frame is temperature image data generated by photographing the photographed area at or near the time when the temperature of the photographed area is the highest.

After step S201, the processor 11 calculates the difference between each of the multiple temperature image data acquired in step S1 and the reference frame determined in step S201 to generate multiple difference images (S202). Figure 8 is a schematic diagram illustrating an example of the difference image 31.

When there are multiple substances with different thermal properties in the photographed area, differences arise in the measured values such as the rate of temperature change during heating and after heating has stopped (see FIG. 3). By using a difference image 31 between the temperature image data acquired during heating or after heating has stopped and the reference frame, the temperature changes of the substrate 91, primer 92, and adhesive 93 during heating or after heating has stopped and when the reference frame was photographed can be determined. Therefore, in step S206 described below, the substrate 91, primer 92, and adhesive 93 can be accurately detected in the difference image based on the difference between the respective temperature changes of the substrate 91, primer 92, and adhesive 93.

When the difference image 31 in FIG. 8 is an image generated by subtracting the reference frame captured before heating started from the temperature image data captured immediately after heating stopped, the substrate 91, primer 92, and adhesive 93 can be detected more accurately in the difference image. This is because there is less noise compared to when using temperature image data captured during heating, when the temperature changes rapidly.

Returning to FIG. 7, processor 11 extracts a maximum contrast image having the maximum contrast from the multiple difference images generated in step S202 (S203). Alternatively, processor 11 may extract a group of images having contrast equal to or greater than a predetermined threshold, and determine one of the group of images as the maximum contrast image. For example, processor 11 determines difference image 31 in FIG. 8 as the maximum contrast image.

Then, the processor 11 applies filter processing to the maximum contrast image extracted in step S203 (S204). The filter processing is, for example, image processing such as local equalization (smoothing) filter processing, high-pass filter processing, low-pass filter processing, etc. The filter processing may include processing for adjusting a tone curve. The processor 11 performs processing such as edge emphasis, shading adjustment, and contrast adjustment through filter processing.

Then, the processor 11 performs binarization processing on the image after the filtering processing in step S204 (S205).

The processor 11 uses the binary image obtained in step S205 to determine whether the condition of the workpiece 90 is poor (S206).

In this embodiment, the quality determination process S206 includes distinguishing and detecting the base material 91, primer 92, and adhesive 93.

The binarization process S205 may be performed multiple times to distinguish and detect three or more materials. For example, the processor 11 performs a first binarization process, and distinguishes between the substrate 91 and the primer 92 using the image that has been subjected to the first binarization process. For example, the processor 11 determines that black (e.g., pixel value "0") areas in the image are the substrate 91, and white (e.g., pixel value "1") areas are the primer 92. The processor 11 then performs a second binarization process, for example by increasing the contrast ratio of the primer 92 and the adhesive 93, and distinguishes between the primer 92 and the adhesive 93 using the image that has been subjected to the second binarization process.

In this embodiment, in the pass/fail determination process S206, if the processor 11 detects that the primer 92 has not been applied, it determines that the condition of the workpiece 90 is poor. For example, the processor 11 detects that the primer 92 has not been applied if there is a portion within a specified region where the primer 92 has not been applied. Alternatively, the processor 11 detects that the primer 92 has not been applied if the ratio of the area of the portion within a specified region where the primer 92 has been applied to the area of the specified region is less than a specified threshold. Information indicating the specified region in the temperature image or binary image is stored in advance in, for example, the storage device 12.

In this embodiment, the area of a certain region is the area of that region that can be measured on an image, and is expressed, for example, by the number of pixels that represent that region.

In the pass/fail determination process S206, for example, the processor 11 determines whether or not there is adhesive 93 that meets a predetermined criterion within a predetermined area, and if there is no adhesive 93 that meets the predetermined criterion, it determines that the condition of the workpiece 90 is poor. For example, if the processor 11 detects that the adhesive 93 is not properly positioned on the primer 92, it determines that the predetermined criterion is not met and that the condition of the workpiece 90 is poor. For example, if the contact area between the primer 92 and the adhesive 93 is less than a predetermined threshold, the processor 11 determines that the condition of the workpiece 90 is poor.

Alternatively, or in addition to these, the processor 11 determines that the condition of the workpiece 90 is poor if the adhesive 93 is placed in a location where there is no primer 92, for example, directly on the substrate 91. The processor 11 determines that the condition of the workpiece 90 is poor if the ratio of the area of the adhesive 93 placed in a location where there is no primer 92 to the area of the adhesive 93 placed on the primer 92 is equal to or greater than a predetermined threshold value.

Alternatively, or in addition to these, if the processor 11 detects a predetermined amount or more of voids in the adhesive 93 or between the adhesive 93 and the primer 92, it determines that the condition of the workpiece 90 is poor. Alternatively, or in addition to these, the processor 11 determines that the condition of the workpiece 90 is poor if the adhesive 93 has a predetermined number or more of scratches or cuts.

Alternatively, or in addition to these, the processor 11 determines that the condition of the workpiece 90 is poor if the ratio of the area occupied by the adhesive 93 in a specified region to the area of the specified region is less than a specified threshold. The processor 11 may also determine that the condition of the workpiece 90 is poor if there is even one pixel in a specified region on the image where there is no adhesive 93.

Alternatively, or in addition, the processor 11 determines that the condition of the workpiece 90 is poor if the width of the adhesive 93 is less than a predetermined threshold width.

Alternatively, or in addition, the processor 11 determines that the condition of the workpiece 90 is poor if the ratio of the width of the portion of the specified area that is occupied by the adhesive 93 to the width of the specified area is less than a predetermined threshold value.

Instead of step S206, a person such as a user may determine whether the condition of the workpiece 90 is poor based on the image after the binarization process.

[1-3. Effects, etc.]
As described above, the inspection method according to the present embodiment is performed by the processor 11 before a post-process in which the substrate 91, which is an example of a first adherend, is bonded to a second adherend by the adhesive 93 applied to a predetermined region of the substrate 91. This inspection method includes a step (S1) of acquiring a plurality of temperature image data generated by chronologically photographing the predetermined region with an infrared camera 17, which is an example of an imaging device, a step (S201 to S205) of performing an analysis process on the plurality of temperature image data to generate an analysis image corresponding to a temperature change in the photographed region, and a step (S206) of determining whether or not there is an adhesive 93 that satisfies a predetermined criterion in the predetermined region based on the analysis image.

This inspection method makes it possible to determine whether or not there is adhesive 93 that meets a predetermined standard before the subsequent process of bonding the substrate 91 to a second adherend, making it easier to prevent the occurrence of defective products. This improves the yield of the bonded product produced in the subsequent process, and reduces the occurrence of situations in which components such as the substrate 91 must be discarded. This makes it possible to reduce the manufacturing cost of the bonded product.

The workpiece 90 may further include a primer 92 sandwiched between the base material 91 and the adhesive 93. In this case, the step of determining whether or not there is adhesive 93 that meets a predetermined standard within the predetermined area includes detecting whether or not the primer 92 has been applied to the predetermined area based on the analysis image. With this configuration, it is possible to detect whether or not the primer 92 has been applied to the predetermined area before the subsequent process, making it easier to prevent the occurrence of defective products.

In the above case, when the processor 11 detects that the primer 92 has been applied to a predetermined area, it may measure the contact area between the adhesive 93 and the primer 92, and if the contact area is less than a predetermined threshold, it may determine that the condition of the workpiece 90 is defective. If the contact area is equal to or greater than a predetermined threshold, the processor 11 may determine that the condition of the workpiece 90 is not defective (is a good product). This configuration also makes it easier to prevent the occurrence of defective products.

The step of determining whether or not there is adhesive 93 that satisfies the predetermined criteria may include determining that there is adhesive 93 that satisfies the predetermined criteria when the ratio of the area of the adhesive 93 in the predetermined region to the area of the predetermined region is less than a predetermined threshold value.

The step of detecting the substrate 91 and the adhesive 93 may include detecting the substrate 91 and the adhesive 93 based on a difference between a temperature change of the substrate 91 and a temperature change of the adhesive 93.

The step of generating an analysis image may include generating an analysis image based on the difference between each of the multiple temperature image data and reference temperature image data generated by photographing the photographing area.

This inspection method may further include a step of heating the first adherend and the adhesive with an excitation source 18, which is an example of a heating device, while the image is being captured by the infrared camera. The reference temperature image data may be information generated by capturing an image of the capture area before heating by the excitation source 18 starts or when heating is stopped.

This inspection method may also include causing the notification device 19 to notify information indicating the detection results of the base material 91 and the adhesive 93 (S4). This allows the user to know the detection results before the subsequent process.

[2. Second embodiment]
In the second embodiment, the processor 11 executes the process of FIG. 5 by executing a quality determination process S2a using a discrete Fourier transform in place of the quality determination process S2 using the difference method.

In FIG. 9, first, the processor 11 acquires the analysis time and the set frequency for the discrete Fourier transform (S211). The analysis time and the set frequency are inputted, for example, by the user and stored in advance in the storage device 12. The analysis time includes, for example, the analysis start time and the analysis end time. Alternatively, instead of the analysis time, the processor 11 may acquire setting information regarding which frames after the start of shooting are to be used for analysis (for example, the 11th to 100th frames, or all frames from the 9th frame onwards).

Then, the processor 11 determines the analysis start frame (start frame) based on the analysis time acquired in step S211 (S212). The start frame is, for example, temperature image data generated by photographing the imaging area when, immediately after, or immediately before heating is stopped in step S2106. In this case, the start frame is temperature image data (temperature peak image) generated by photographing the imaging area at or near the point when the temperature of the imaging area is the highest.

Next, the processor 11 performs a discrete Fourier transform on the temperature image data captured within the analysis time after the capture of the start frame (S213) and extracts a phase image showing the phase characteristics at the set frequency (S214).

FIG. 10 is a schematic diagram illustrating a phase image 32 obtained in step S214. Although the phase image 32 in FIG. 10 mainly shows the surface structure of the workpiece 90, the phase image in this embodiment is not limited to this. For example, in the pass/fail determination process S2a, by adjusting the set frequency, it is possible to obtain a phase image that shows the internal structure of the adhesive 93, the application state of the primer 92 below the adhesive 93, etc.

Returning to FIG. 9, the processor 11 performs filter processing on the phase image extracted in step S214 (S215). The filter processing is, for example, local equalization (smoothing) filter processing, high-pass filter processing, or low-pass filter processing. The filter processing may include a process for adjusting a tone curve. The filter processing may also include a background removal process. The processor 11 performs processes such as edge emphasis, shading adjustment, and contrast adjustment through the filter processing.

The processor 11 performs binarization processing on the image after the filtering processing in step S215 (S216).

The processor 11 uses the binarized image obtained in step S216 to determine whether the condition of the workpiece 90 is defective (S217). The quality determination process S217 may be the same as the quality determination process S206 in FIG. 7.

3. Third embodiment
Fig. 11 is a flow chart showing a method for manufacturing a bonded article according to the third embodiment. The manufacturing method of Fig. 11 includes the temperature image acquisition process S1 and the pass/fail judgment process S2 of the first embodiment as pre-processes (first processes). The manufacturing method of Fig. 11 includes a post-process S301 of manufacturing a bonded article by bonding a first adherend and a second adherend when the processor judges that there is no state defect in step S3 as a result of the pass/fail judgment process S2 (No in S3). Note that when the processor judges that there is a state defect in step S3 (No in S3), the flow of Fig. 11 is ended without performing the post-process.

After step S3, steps S4 to S6 in FIG. 5 may be executed.

The post-process S301 is executed, for example, by the processor 11 controlling a bonding device. Alternatively, the post-process S301 may be executed manually by a user who has confirmed the results of the pre-process.

According to the manufacturing method of this embodiment, it is possible to detect whether the condition of at least one of the substrate 91 and the adhesive 93 is defective before the subsequent process of adhering the substrate 91, which is an example of a first adherend, to a second adherend, making it easier to prevent the production of defective products. This improves the yield of the bonded product manufactured in the subsequent process, and reduces the occurrence of situations in which components such as the substrate 91 have to be discarded. This makes it possible to reduce the manufacturing cost of the bonded product.

4. Other embodiments
As described above, the embodiment has been described as an example of the technology in the present disclosure. However, the technology in the present disclosure is not limited to this, and can be applied to embodiments in which modifications, substitutions, additions, omissions, etc. are appropriately performed. In addition, it is also possible to combine the components described in the above embodiment to form a new embodiment. Therefore, other embodiments will be exemplified below.

In the first embodiment, an example has been described in which the pass/fail determination process S2 includes the filter process S204 and the binarization process S205. However, the processor 11 only needs to be able to determine whether the condition of the work 90 is defective, and at least one of the filter process S204 and the binarization process S205 may be omitted.

Similarly, in embodiment 2, at least one of the filtering process S215 and the binarization process S216 may be omitted.

In the second embodiment, an example is described in which a phase image is extracted by performing a discrete Fourier transform on a temperature image, but the present disclosure is not limited to this. For example, the processor 11 may extract a phase image by performing a Fourier transform instead of a discrete Fourier transform.

In the second embodiment, an example has been described in which a phase image is extracted by performing a discrete Fourier transform on a temperature image, but what is extracted by the discrete Fourier transform is not limited to a phase image. For example, the processor 11 may extract at least one of an amplitude image showing the amplitude characteristics of the data after the discrete Fourier transform, a real part image showing the real part of the data after the discrete Fourier transform, which is a complex number, an imaginary part image showing the imaginary part, and a phase image.

5. Example of embodiment
The following provides examples of aspects of the present disclosure.

<Aspect 1>
1. A method of inspection performed by a processor prior to a step of adhering a first substrate to a second substrate with an adhesive applied to a predetermined area of the first substrate, the method comprising:
acquiring a plurality of temperature image data generated by an imaging device photographing the region in time series;
performing an analysis process on the plurality of temperature image data to generate an analysis image corresponding to a temperature change in the region;
determining whether the adhesive that satisfies a predetermined criterion is present in the region based on the analysis image;
4. A method for testing comprising:

<Aspect 2>
2. The inspection method according to claim 1, further comprising detecting whether or not a primer has been applied to the region based on the analysis image.

<Aspect 3>
if the processor detects that a primer has been applied to the area, measuring a contact area between the adhesive and the primer;
If the contact area is less than a predetermined first threshold, the condition of the first adherend is determined to be poor;
If the contact area is equal to or larger than the first threshold value, the condition of the first adherend is determined to be not defective.
The inspection method according to aspect 2.

<Aspect 4>
The inspection method according to any one of aspects 1 to 3, wherein the step of determining whether or not there is an adhesive that satisfies the criterion includes determining that there is no adhesive that satisfies the criterion when a ratio of an area occupied by the adhesive in the region to an area of the region is less than a predetermined threshold value, or when a width of the adhesive is less than a predetermined threshold width.

<Aspect 5>
Aspect 5. The inspection method according to any one of aspects 1 to 4, wherein the step of detecting the first adherend and the adhesive includes detecting the first adherend and the adhesive based on a difference between a temperature change of the first adherend and a temperature change of the adhesive.

<Aspect 6>
The step of generating the analysis image includes generating the analysis image based on a difference between each of the plurality of temperature image data and a reference temperature image data generated by photographing the region.

<Aspect 7>
The method further includes a step of heating the first adherend and the adhesive by a heating device while the imaging device is imaging the first adherend and the adhesive,
The inspection method according to aspect 6, wherein the reference temperature image data is information generated by photographing the area before heating by the heating device is started or stopped.

<Aspect 8>
The inspection method according to any one of aspects 1 to 5, wherein the step of generating the analysis image includes performing a discrete Fourier transform or a Fourier transform on the plurality of temperature image data to generate the analysis image.

<Aspect 9>
9. The inspection method according to claim 8, wherein the analysis image is a phase image at a predetermined frequency of the plurality of temperature image data that have been subjected to a discrete Fourier transform or a Fourier transform.

<Aspect 10>
The inspection method according to aspect 1, further comprising causing an alarm device to notify information indicating a detection result of the first adherend and the adhesive.

<Aspect 11>
A step of carrying out the inspection method according to any one of aspects 1 to 10 as a pre-process;
When the processor determines that the adhesive that satisfies a predetermined criterion is present in the region, a post-process is performed in which the first adherend is bonded to the second adherend by the adhesive to produce an adhered article;
A method for producing the bonded article comprising the steps of:

<Aspect 12>
An inspection apparatus for inspecting a first adherend before a step of adhering a first adherend to a second adherend by an adhesive applied to a predetermined region of the first adherend, comprising:
an input unit for acquiring a plurality of pieces of temperature image data generated by an image capturing device capturing images of the region in time series;
a processor for analyzing the image;
The processor,
performing an analysis process on the plurality of temperature image data to generate an analysis image corresponding to a temperature change in the region;
determining whether the adhesive that satisfies a predetermined criterion is present in the region based on the analysis image;
Inspection equipment.

This disclosure is applicable to inspection methods, inspection devices, and manufacturing methods for adhesive objects.

REFERENCE SIGNS LIST 1 Inspection system 10 Inspection device 11 Processor 12 Storage device 13 Interface (input section)
15 Control box 16 Power supply 17 Infrared camera (photography device)
18 Excitation source (heating device)
19 Notification device 30 Temperature image 31 Difference image 32 Phase image 90 Workpiece 91 Base material (first adherend)
92 Primer 93 Adhesive

Claims (12)

1. A method of inspection performed by a processor prior to a step of adhering a first substrate to a second substrate with an adhesive applied to a predetermined area of the first substrate, the method comprising:
acquiring a plurality of temperature image data generated by an imaging device photographing the region in time series;
performing an analysis process on the plurality of temperature image data to generate an analysis image corresponding to a temperature change in the region;
determining whether the adhesive that satisfies a predetermined criterion is present in the region based on the analysis image;
4. A method for testing comprising: The inspection method according to claim 1, further comprising detecting whether or not a primer has been applied to the region based on the analysis image. if the processor detects that a primer has been applied to the area, measuring a contact area between the adhesive and the primer;
If the contact area is less than a predetermined threshold, the condition of the first adherend is determined to be poor;
If the contact area is equal to or greater than the threshold value, the condition of the first adherend is determined to be not defective.
The inspection method according to claim 2. The inspection method according to claim 1, wherein the step of determining whether or not there is an adhesive that satisfies the criterion includes determining that there is no adhesive that satisfies the criterion when the ratio of the area of the region occupied by the adhesive to the area of the region is less than a predetermined threshold value, or when the width of the adhesive is less than a predetermined threshold width. The inspection method according to claim 1, wherein the step of detecting the first adherend and the adhesive includes detecting the first adherend and the adhesive based on a difference between a temperature change of the first adherend and a temperature change of the adhesive. The inspection method according to claim 1, wherein the step of generating the analysis image includes generating the analysis image based on a difference between each of the plurality of temperature image data and a reference temperature image data generated by photographing the area. The method further includes a step of heating the first adherend and the adhesive by a heating device while the imaging device is imaging the first adherend and the adhesive,
The inspection method according to claim 6 , wherein the reference temperature image data is information generated by photographing the area before heating by the heating device is started or stopped. The inspection method according to claim 1, wherein the step of generating the analysis image includes performing a discrete Fourier transform or a Fourier transform on the multiple temperature image data to generate the analysis image. The inspection method according to claim 8, wherein the analysis image is a phase image at a predetermined frequency of the plurality of temperature image data that have been subjected to a discrete Fourier transform or a Fourier transform. The inspection method according to claim 1, further comprising causing an alarm device to notify information indicating the detection results of the first adherend and the adhesive. A step of performing the inspection method according to any one of claims 1 to 10 as a pre-process;
When the processor determines that the adhesive that satisfies a predetermined criterion is present in the region, a post-process is performed in which the first adherend is bonded to the second adherend by the adhesive to produce an adhered article;
A method for producing the bonded article comprising the steps of: An inspection apparatus for inspecting a first adherend before a step of adhering a first adherend to a second adherend by an adhesive applied to a predetermined region of the first adherend, comprising:
an input unit for acquiring a plurality of pieces of temperature image data generated by an image capturing device capturing images of the region in time series;
a processor for analyzing the image;
The processor,
performing an analysis process on the plurality of temperature image data to generate an analysis image corresponding to a temperature change in the region;
determining whether the adhesive that satisfies a predetermined criterion is present in the region based on the analysis image;
Inspection equipment.

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