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WO2025002382A1 - Frame mechanism and processing apparatus - Google Patents

Frame mechanism and processing apparatus Download PDF

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Publication number
WO2025002382A1
WO2025002382A1 PCT/CN2024/102480 CN2024102480W WO2025002382A1 WO 2025002382 A1 WO2025002382 A1 WO 2025002382A1 CN 2024102480 W CN2024102480 W CN 2024102480W WO 2025002382 A1 WO2025002382 A1 WO 2025002382A1
Authority
WO
WIPO (PCT)
Prior art keywords
detection
detection structure
frame
conductive member
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/102480
Other languages
French (fr)
Chinese (zh)
Inventor
刘意
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Makeblock Co Ltd
Original Assignee
Makeblock Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202421460298.XU external-priority patent/CN222818183U/en
Application filed by Makeblock Co Ltd filed Critical Makeblock Co Ltd
Publication of WO2025002382A1 publication Critical patent/WO2025002382A1/en
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring

Definitions

  • the present application relates to the technical field of processing equipment, and in particular to a frame mechanism and processing equipment using the frame mechanism.
  • the frame structure of the processing equipment usually includes a main housing and a carrier, wherein the main housing is used to accommodate the processing device, and the carrier is used to detachably cover the main housing.
  • the carrier may tilt, causing the workpiece placed on the carrier to tilt, thereby causing laser processing errors and affecting the processing quality of the workpiece.
  • the main purpose of the present application is to provide a frame mechanism, which aims to detect whether the load-bearing platform is installed in place.
  • the frame mechanism proposed in this application includes:
  • a main housing the main housing being used to accommodate the processing device
  • a heightening frame is used to raise the main housing, the heightening frame is provided with a receiving cavity, the receiving cavity has a first cavity opening and a second cavity opening which are arranged opposite to each other, and the first cavity opening is connected with the main housing;
  • a carrying platform which is detachably mounted on the heightening frame and can cover the second cavity
  • a detection component comprising a control board, a first detection structure and a second detection structure, the first detection structure and the second detection structure are electrically connected to the control board respectively;
  • the supporting platform when the supporting platform is installed on the height-enhancing frame, the supporting platform can conduct the first detection structure and the second detection structure.
  • the support platform is made of conductive material.
  • the first detection structure includes a first detection line
  • the second detection structure includes a second detection line
  • the first detection line and the second detection line are electrically connected to the control board respectively;
  • the carrying platform When the carrying platform is connected to the heightening frame, the carrying platform can conduct the first detection line and the second detection line.
  • the first detection structure further includes a first conductive member
  • the second detection structure further includes a second conductive member
  • the first conductive member is connected to one end of the first detection line away from the control board, the second conductive member is connected to one end of the second detection line away from the control board, and the first conductive member and the second conductive member are arranged at intervals;
  • the supporting platform When the supporting platform is connected to the heightening frame, the supporting platform can conduct electricity between the first conducting member and the second conducting member.
  • the detection assembly further includes a first contact member and a second contact member, wherein the first contact member and the second contact member are configured to be mounted on the carrier platform;
  • the first contact member and the second contact member are connected to the first detection structure and the second detection structure respectively.
  • the support platform when the support platform is installed on the elevated frame, the support platform contacts the first contact piece and the second contact piece to conduct the first contact piece and the second contact piece.
  • first contact member and the second contact member pass through the supporting platform and are threadedly connected to the first detection structure and the second detection structure respectively.
  • the supporting platform when the supporting platform is installed on the heightened frame, the supporting platform contacts the first detection structure and the second detection structure to conduct the first detection structure and the second detection structure.
  • the first detection structure and the second detection structure are provided on the heightening frame, and the heightening frame is detachably connected to the main housing;
  • the control board is arranged on the main housing, and the detection assembly further comprises a first connection structure and a second connection structure, wherein the first connection structure and the second connection structure are respectively electrically connected to the control board;
  • the first detection structure and the second detection structure are electrically connected to the first connection structure and the second connection structure, respectively.
  • the first detection structure includes a resistor, and the heightened frame and the support platform are selectively connected to the main housing;
  • the carrying platform When the carrying platform is connected to the main housing, the carrying platform can conduct the first connection structure and the second connection structure.
  • the detection assembly further includes a first contact member and a second contact member, wherein the first contact member and the second contact member are configured to be mounted on the carrier platform;
  • the first contact member and the second contact member are connected to the first detection structure and the second detection structure respectively;
  • the first contact piece and the second contact piece are connected to the first connecting structure and the second connecting structure respectively.
  • the first connection structure includes a first connection line
  • the second connection structure includes a second connection line
  • the first connection line and the second connection line are electrically connected to the control board respectively;
  • the first detection structure and the second detection structure are electrically connected to the first connection line and the second connection line respectively.
  • the first connection structure further includes a first conductive member
  • the second connection structure further includes a second conductive member
  • the first conductive member is connected to one end of the first connecting line away from the control board, the second conductive member is connected to one end of the second connecting line away from the control board, and the first conductive member and the second conductive member are spaced apart;
  • the first detection structure and the second detection structure are electrically connected to the first conductive member and the second conductive member respectively.
  • the detection component further includes a third contact and a fourth contact, the third contact is configured to connect the first conductive member and the first detection structure, and the fourth contact is configured to connect the second conductive member and the second detection structure.
  • the third contact member passes through the first conductive member and is threadedly connected to the first detection structure
  • the fourth contact member passes through the second conductive member and is threadedly connected to the second detection structure.
  • the first detection structure includes a first detection line and a first electrical connection member connected to each other
  • the second detection structure includes a second detection line and a second electrical connection member connected to each other
  • the first electrical connector and the second electrical connector are electrically connected to the first connection structure and the second connection structure respectively, and the supporting platform can conduct the first detection line and the second detection line.
  • the heightening frame has a first surface, the first cavity passes through the first surface, and the first detection structure is electrically connected to one end of the first connection structure and the second detection structure is electrically connected to one end of the second connection structure and is disposed on the first surface;
  • the main housing has a second surface facing the first surface, and one end of the first connection structure electrically connected to the first detection structure and one end of the second connection structure electrically connected to the second detection structure are arranged on the second surface.
  • the number of the first detection structures is at least two.
  • the heightening frame includes an inner panel, a mounting plate and an outer panel, the inner panel enclosing the accommodating cavity;
  • the mounting plate is connected to the inner panel and is arranged around the periphery of the first cavity opening, and the mounting plate is connected to the main housing;
  • the outer panel is connected to the mounting plate and is spaced around the outer side of the inner panel, and at least part of the first detection structure and the second detection structure are arranged in the space enclosed by the outer panel, the mounting plate and the inner panel.
  • the present application also proposes a processing device, comprising the frame mechanism as described above.
  • the main housing of the frame mechanism is provided with a processing space and a take-in and put-out port connected to the processing space
  • the main housing and the frame mechanism further include a cover plate, the cover plate can open and cover the take-in and put-out port, and the first cavity of the heightened frame is connected to the processing space;
  • the processing equipment further includes a track device and a processing device, wherein the track device is arranged in the processing space, the processing device is connected to the track device, and the track device is configured to drive the processing device to move.
  • the processing equipment is a laser processing equipment.
  • the installation state of the load-bearing platform covered on the heightened frame can be detected through the detection component.
  • the load-bearing platform can conduct the first detection structure and the second detection structure in the detection component, so that when the control board in the detection component outputs an electrical signal through the first detection structure, it can be transmitted to the second detection structure through the conduction of the load-bearing platform, and then transmitted back to the control board through the second detection structure.
  • the control board detects that the circuit formed by the first detection structure and the second detection structure is conducted, it can be determined that the load-bearing platform is installed in place.
  • the setting of the detection component realizes the detection of the installation of the load-bearing platform, so that the processing device in the processing equipment can process the workpiece more accurately, thereby improving the processing quality of the workpiece by the processing equipment.
  • FIG1 is a schematic structural diagram of a processing device with an elevated frame according to an embodiment of the present application.
  • FIG2 is a schematic diagram of the structure of the processing equipment in FIG1 without the heightening frame
  • FIG3 is a schematic diagram of an exploded structure of the processing equipment in FIG2 ;
  • FIG4 is a schematic structural diagram of a frame mechanism of the processing equipment in FIG1 ;
  • FIG8 is a structural schematic diagram of the frame mechanism in FIG4 from another perspective
  • FIG11 is a partial enlarged view of point D in FIG10 ;
  • FIG13 is a schematic diagram of a partial structure of the frame mechanism in FIG4 from another perspective
  • FIG14 is an exploded structural diagram of a partial structure of the frame mechanism in FIG4 ;
  • connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • fixation can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • the present application proposes a frame mechanism 100, which is applied to a processing device 1000.
  • the processing device 1000 can be a laser processing device to realize laser cutting or laser engraving of a workpiece.
  • the processing device 1000 can also be a tool processing device that uses a blade for cutting or a drill for drilling. Therefore, the present application does not limit the specific type of the processing device 1000 used by the frame mechanism 100.
  • the processing device 1000 can also include a track device 300 and a processing device 400, the track device 300 is arranged in the main housing 10 of the frame mechanism 100, and the processing device 400 is connected to the track device 300. It is configured to drive the processing device 400 to move so as to realize mobile processing of the workpiece.
  • the track device 300 can include a conveyor belt and a pulley, and the processing device 400 can be installed on the conveyor belt.
  • the track device 300 can also include a screw rod and a slide seat, and the processing device 400 can be installed on the slide seat. It can be seen that the present application does not limit the structure of the track device 300, as long as it can be used to drive the structural device to move.
  • the frame mechanism 100 includes a main housing 10, a heightening frame 20, a supporting platform 30 and a detection component 40.
  • the main housing 10 is used to accommodate the processing device 400; the main housing 10 is used to raise the main housing 10, and the heightening frame 20 is provided with a accommodating cavity 21, and the accommodating cavity 21 has a first cavity opening 211 and a second cavity opening 213 which are arranged opposite to each other, and the first cavity opening 211 is connected to the main housing 10; the supporting platform 30 can be detachably installed and connected to the heightening frame 20, and can cover the second cavity opening 213; the detection component 40 includes a control board 40A, a first detection structure 40B and a second detection structure 40B, and the first detection structure 40B and the second detection structure 40B are respectively electrically connected to the control board 40A; wherein, when the supporting platform 30 is in a state of being connected to the heightening frame 20, the supporting platform 30 can conduct the first detection structure 40B and the second detection structure 40B.
  • the main housing 10 may be formed with a processing space 10a, and the processing device 400 introduced above may be installed and accommodated through the processing space 10a.
  • the processing equipment 1000 is a laser processing equipment
  • the processing device 400 may be a laser head.
  • the processing device 400 may be a tool module. Therefore, the type of the processing device 400 may be determined by the type of the processing equipment 1000.
  • the main housing 10 may be a rectangular shell, or a square shell, or a circular shell. The present application does not limit the specific shape of the main housing 10.
  • the lower end of the main housing 10 may be open so that it can be connected to the elevated frame 20 for raising it.
  • the raising frame 20 can be installed at the lower end of the main housing 10 to raise the main housing 10, and is connected to the opening at the lower end of the main housing 10 through the first cavity 211, thereby expanding the processing space 10a of the main housing 10 through the accommodating cavity 21 of the raising frame 20.
  • the accommodating cavity 21 of the raising frame 20 can be a cavity of any shape such as a square cavity, a rectangular cavity or a circular cavity.
  • the raising frame 20 can be formed by a plurality of plates or a plurality of columns, and the present application does not limit the structural type of the raising frame 20.
  • the connection between the raising frame 20 and the main housing 10 can be a detachable connection, or a fixed connection, and the present application does not limit the connection method between the raising frame 20 and the main housing 10.
  • the carrier platform 30 can be used to cover the lower end of the heightened frame 20 to cover the second cavity 213 of the accommodating cavity 21, and then enclose the heightened frame 20 and the main housing 10 to form a closed space for the processing device 400 to process, so as to improve the safety of the processing equipment 1000 when processing the workpiece.
  • the carrier platform 30 can be connected to the heightened frame 20 by any detachable connection method such as screw connection, snap connection or magnetic connection.
  • the material of the carrier platform 30 can be a conductive material, for example: metal such as copper or aluminum or other conductive materials.
  • the conduction of the first detection structure 40B and the second detection structure 40C by the carrier platform 30 can be that when the carrier platform 30 is installed on the heightened frame 20, the carrier platform 30 contacts the first detection structure 40B and the second detection structure 40C, thereby realizing that the carrier platform 30 directly conducts the first detection structure 40B and the second detection structure 40C.
  • the support platform 30 can also be connected to the first detection structure 40B through an additionally arranged first contact member 50 as described below, and to the second detection structure 40C through a second contact member 60, thereby achieving indirect connection between the first detection structure 40B and the second detection structure 40C.
  • the detection component 40 can be used to transmit electrical signals.
  • the control board 40A can transmit electrical signals
  • the first detection structure 40B can be used to receive the electrical signals output by the control board 40A, and then transmit them to the carrier 30, and then transmit them to the second detection component 43 after the carrier 30, and then transmit them to the control board 40A through the second detection structure 40C, so that the control board 40A, the first detection structure 40B, the carrier 30 and the second detection structure 40C are connected into a loop. Therefore, this Whether the carrier 30 is installed in place determines whether the circuit is conductive. When the carrier 30 is installed in place, the control board 40A can detect that the circuit is conductive through the second detection structure 40C.
  • the control board 40A can control the alarm in the processing equipment 1000 to sound an alarm to remind the worker that the carrier 30 is not installed in place.
  • the control board 40A can be set on the main housing 10, and of course it can also be set on the heightening frame 20.
  • the control board 40A can be used only for electrical connection with the first detection structure 40B and the second detection structure 40C, and can also be further electrically connected to the processing device 400 to control the processing device 400 to process the workpiece.
  • first detection structure 40B and the second detection structure 40C may include the first detection line 41 and the second detection line 43 respectively as described below, and of course, they may also include conductive metal sheets, columns or blocks, etc. It can be seen that the present application does not limit the structural type of the first detection structure 40B and the second detection structure 40C, and it is sufficient that they can be connected to the control board 40A and the support platform 30 to form a loop.
  • first detection structure 40B and the second detection structure 40C can be installed on the heightening frame 20, and of course, they can also be installed on the main housing 10. The present application does not limit the installation position of the first detection structure 40B and the second detection structure 40C.
  • the installation state of the carrier 30 covered on the heightening frame 20 can be detected through the detection component 10.
  • the carrier 30 can conduct the first detection structure 40B and the second detection structure 40C in the detection component 40, so that when the control board 40A in the detection component 40 outputs an electrical signal through the first detection structure 40B, it can be transmitted to the second detection structure 40C through the conduction of the carrier 30, and then transmitted back to the control board 40A through the second detection structure 40C.
  • the control board 40A detects that the circuit formed by the first detection structure 40B and the second detection structure 40C is connected, it can be determined that the carrier 30 is installed in place.
  • the first detection structure 40B and the second detection structure 40C are disconnected, and it can be determined that the carrier 30 is not installed in place. Therefore, the setting of the detection component 40 realizes the detection of the installation of the carrier 30, so that the processing device 400 in the processing equipment 1000 can detect the processing error caused by the tilted position of the carrier 30 when processing the workpiece, thereby improving the processing quality of the workpiece by the processing equipment 1000.
  • the processing equipment 1000 is a laser processing equipment
  • the possibility of laser leakage can be reduced, which is conducive to improving the safety of the use of the processing equipment 1000.
  • the processing space 10a in the main housing 10 is expanded through the accommodating cavity 21 in the heightening frame 20, so as to accommodate and process workpieces with larger sizes. Therefore, the setting of the heightening frame 20 reduces the possibility that the workpiece with larger sizes in the upper and lower directions cannot be processed due to the shortage of the processing space 10a in the main housing 10, thereby improving the applicability of the processing equipment 1000 to the workpiece.
  • the first detection structure 40B includes a first detection line 41
  • the second detection structure 40C includes a second detection line 43.
  • the first detection line 41 and the second detection line 43 are electrically connected to the control board 40A, respectively; when the supporting platform 30 is in a state connected to the heightening frame 20, the supporting platform 30 can conduct the first detection line 41 and the second detection line 43.
  • the first detection structure 40B and the second detection structure 40C are configured to include a first detection line 41 and a second detection line 43 respectively, so that they can be arranged in a bent manner, thereby facilitating the arrangement of the first detection structure 40B and the second detection structure 40C.
  • the first detection structure 40B also includes a first conductive member 22 (which can be made of a metal material with conductive properties or other materials), and the second detection structure 40C also includes a second conductive member 23 (which can be made of a metal material with conductive properties or other materials); the first conductive member 22 is connected to an end of the first detection line 41 away from the control board 40A, and the second conductive member 23 is connected to an end of the second detection line 43 away from the control board 40A, and the first conductive member 22 and the second conductive member 23 are arranged at intervals; when the supporting platform 30 is in a state connected to the heightening frame 20, the supporting platform 30 can conduct the first conductive member 22 and the second conductive member 23.
  • the first conductive member 22 and the second conductive member 23 are arranged. Since the first conductive member 22 and the second conductive member 23 have a larger area than the first detection line 41 and the second detection line 43, when the carrier 30 is connected to the heightened frame 20, it is convenient for the carrier 30 to conduct the first conductive member 22 and the second conductive member 23. In particular, when the carrier 30 is installed on the heightened frame 20, the carrier 30 can be in contact with the first conductive member 22 and the second conductive member 23, so that the carrier 30 directly conducts the first conductive member 22 and the second conductive member 23. Of course, the carrier 30 can also be indirectly connected to the first conductive member 22 and the second conductive member 23 through the first contact member 50 and the second contact member 60 as described below. In addition, the first conductive member 22 and the second conductive member 23 can be any shape structure such as a plate structure, a block structure or a column structure.
  • the detection component 40 also includes a first contact member 50 and a second contact member 60.
  • the first contact member 50 and the second contact member 60 are configured to be installed on the supporting platform 30 and are respectively connected to the first detection structure 40B and the second detection structure 40C.
  • the first contact member 50 and the second contact member 60 can be used to respectively realize the connection with the first detection structure 40B and the second detection structure 40C.
  • the first contact member 50 and the second contact member 60 are respectively connected to the first detection structure 40B and the second detection structure 40C, it is beneficial to improve the stability of the electrical connection between the carrier 30 and the detection assembly 40.
  • connection method of the first contact member 50 and the first detection structure 40B, and the connection method of the second contact member 60 and the second detection structure 40C can be a threaded connection as described below, of course, it can also be a snap connection or a plug connection, etc., and the present application does not limit the connection method of the first contact member 50 and the first detection structure 40B, and the connection method of the second contact member 60 and the second detection structure 40C.
  • the first contact member 50 and the second contact member 60 and the carrier 30 can be a separate setting, of course, it can also be an integrated structure, and the present application does not limit the installation method of the first contact member 50 and the second contact member 60 on the carrier 30.
  • the first detection structure 40B and the second detection structure 40C may be installed on the elevated frame 20.
  • the connection between the first contact member 50 and the first detection structure 40B, and the connection between the second contact member 60 and the second detection structure 40C can also improve the stability of the installation of the support platform 30 on the elevated frame 20.
  • the first detection structure 40B and the second detection structure 40C respectively include the first conductive member 22 and the second conductive member 23 as described above
  • the first contact member 50 and the second contact member 60 may be connected to the first conductive member 22 and the second conductive member 23, respectively.
  • first contact member 50 and the second contact member 60 pass through the support platform 30 and are respectively threadedly connected to the first detection structure 40B and the second detection structure 40C.
  • the heightened frame 20 has a first surface 20a, the first cavity 211 passes through the first surface 20a, the first detection structure 40B is electrically connected to one end of the first connection structure 40D, and the second detection structure 40C is electrically connected to one end of the second connection structure 40E and is arranged on the first surface 20a;
  • the main housing 10 has a second surface 10c facing the first surface 20a, the first connection structure 40D is electrically connected to one end of the first detection structure 40B, and the second connection structure 40E is electrically connected to one end of the second detection structure 40C and is arranged on the second surface 10c.
  • the first connecting structure 40D includes a first connecting line 45
  • the second connecting structure 40E includes a second connecting line 47
  • the first connecting line 45 and the second connecting line 47 are electrically connected to the control board 40A respectively; when the heightened frame 20 is in a state connected to the main housing 10, the first detection structure 40B and the second detection structure 40C are electrically connected to the first connecting line 45 and the second connecting line 47 respectively.
  • the first connection structure 40D also includes a first conductive member 13 (which can be made of a metal material with conductive properties or other materials), and the second connection structure 40E also includes a second conductive member 15 (which can be made of a metal material with conductive properties or other materials); the first conductive member 13 is connected to an end of the first connection line 45 away from the control board 40A, and the second conductive member 15 is connected to an end of the second connection line 47 away from the control board 40A, and the first conductive member 13 and the second conductive member 15 are arranged at intervals; when the heightening frame 20 is in a state connected to the main housing 10, the first detection structure 40B and the second detection structure 40C are electrically connected to the first conductive member 13 and the second conductive member 15, respectively.
  • the first conductive member 13 and the second conductive member 15 are arranged so that they can be easily connected to the first detection structure 40B and the second detection structure 40C on the heightening frame 20 because the first conductive member 13 and the second conductive member 15 have a larger area than the first connecting line 45 and the second connecting line 47.
  • the first detection structure 40B and the second detection structure 40C can be directly connected to the first conductive member 13 and the second conductive member 15, respectively, or indirectly connected to the third contact member 70 and the fourth contact member 80 as described below.
  • the first conductive member 13 and the second conductive member 15 can be any shape structure such as a plate structure, a block structure or a column structure.
  • the detection component 40 also includes a third contact member 70 and a fourth contact member 80.
  • the third contact member 70 is configured to connect the first conductive member 13 and the first detection structure 40B
  • the fourth contact member 80 is configured to connect the second conductive member 15 and the second detection structure 40C.
  • the third contact member 70 and the fourth contact member 80 can be used to respectively realize the connection with the first detection structure 40B and the second detection structure 40C.
  • the connection method between the third contact member 70 and the first detection structure 40B, and the connection method between the fourth contact member 80 and the second detection structure 40C can be a threaded connection as described below, of course, it can also be a snap connection or a plug connection, etc.
  • This application does not limit the connection method between the third contact member 70 and the first detection structure 40B, and the connection method between the fourth contact member 80 and the second detection structure 40C.
  • the third contact member 70 and the fourth contact member 80 may be separately provided with the main housing 10 , or may be an integrated structure.
  • the present application does not limit the installation method of the third contact member 70 and the fourth contact member 80 on the main housing 10 .
  • the third contact member 70 passes through the first conductive member 13 and is threadedly connected to the first detection structure 40B; the fourth contact member 80 passes through the second conductive member 15 and is threadedly connected to the second detection structure 40C.
  • the first detection structure 40B may also include a first electrical connector 24 and a second electrical connector 25, which may be connected to the first detection line 41 and the second detection line 43 at one end away from the carrier 30, respectively.
  • the third contact 70 may be connected to the first electrical connector 24 after passing through the first conductive member 13
  • the fourth contact 80 may be connected to the second electrical connector 25 after passing through the second conductive member 15.
  • the first electrical connector 24 and the second electrical connector 25 may be any shape structure such as a column, a block or a plate.
  • first electrical connector 24 and the second electrical connector 25 may be embedded in the heightening frame 20.
  • first electrical connector 24 and the second electrical connector 25 may be interference fit in the heightening frame 20.
  • it can also be used as an insert to follow the heightening frame 20 through integral injection molding to improve the stability of the connection.
  • the first detection structure 40B includes a resistor 411, and the heightening frame 20 and the supporting platform 30 can be selectively connected to the main housing 10; when the supporting platform 30 is connected to the main housing 10, the supporting platform 30 can conduct the first connection structure 40D and the second connection structure 40E.
  • the frame mechanism 100 can have two assembly states.
  • the first assembly state is: as shown in Figures 1 and 4, the heightened frame 20 is connected to the main housing 10, and the support platform 30 is connected to the heightened frame 20.
  • the second assembly state is: as shown in Figures 2 and 15, the heightened frame 20 is not installed, and the support platform 30 is directly connected to the main housing 10. Therefore, when the heightened frame 20 is not needed, the heightened frame 20 can be disassembled and removed, which is beneficial to further processing the applicability of the equipment 1000 to workpieces of different height sizes.
  • the first detection structure 40B includes a resistor 411 having a resistor 411
  • the main housing 10 has a first detection structure 40B having a first detection structure 40B having a second detection structure 40B having a first ...
  • a first connection structure 40D and a second connection structure 40E are provided.
  • the rack mechanism 100 needs to adopt the second assembly state, after the carrier 30 is installed in place on the main housing 10, the circuit formed by the control board 40A, the first connection structure 40D, the carrier 30 and the second connection structure 40E is connected, so that the control board 40A can detect the electrical signal of the circuit conduction through the second connection structure 40E, thereby judging that the carrier 30 is installed in place.
  • the first detection structure 40B with the resistor 411 is no longer present in the circuit at this time, the current detected by the control board 40A through the second connection structure 40E is different from the current when the first detection member 41 is present in the circuit, thereby judging that the heightening frame 20 is not installed in place.
  • the detection of the installation position of the carrier 30 and the detection of the installation position of the heightening frame 20 can be realized at the same time, thereby improving the detection function of the detection component 40, so as to further improve the safety of the subsequent processing equipment 1000 during processing.
  • the resistor 411 can be set on the first detection line 41 as described above.
  • the first contact member 50 and the second contact member 60 are configured to be installed on the supporting platform 30, and are respectively connected to the first detection structure 40B and the second detection structure 40C; when the supporting platform 30 is connected to the main housing 10, the first contact member 50 and the second contact member 60 are configured to be installed on the supporting platform 30, and are respectively connected to the first connection structure 40D and the second connection structure 40E.
  • the first contact member 50 and the second contact member 60 can be inserted to respectively realize electrical connection with the first detection structure 40B and the second detection structure 40C.
  • the carrier 30 is not installed on the heightened frame 20 and is directly installed on the main housing 10, the first contact member 50 and the second contact member 60 can be inserted to respectively realize electrical connection with the first connection structure 40D and the second connection structure 40E.
  • the carrier 30 is electrically connected through the first contact member 50 and the second contact member 60, so that the same structure is adopted, which is conducive to improving the convenience of installation of the carrier 30 in the first assembly state and the second assembly state.
  • the first connection structure 40D and the second connection structure 40E respectively include the first conductive member 13 and the second conductive member 15 as described above.
  • the first contact member 50 and the second contact member 60 can be connected to the first conductive member 13 and the second conductive member 15 respectively.
  • the first detection structure 40B and the second detection structure 40C respectively include the first conductive member 22 and the second conductive member 23 .
  • the support platform 30 is connected to the elevated frame 20
  • the first contact member 50 and the second contact member 60 can be connected to the first conductive member 22 and the second conductive member 23 , respectively.
  • one end of the first detection line 41 away from the first electrical connector 24 is detachably connected to the first conductive member 22 via a screw connection.
  • the first detection line 41 is connected to the first conductive member 22 through a screw connection, and the screw connection has the advantages of being simple and reliable, thereby facilitating the stability of the connection between the two and the convenience of assembly.
  • the first detection line 41 can be directly extended between the screw connection and the first conductive member 22 by the end, and of course, a ring can be formed at the end of the first detection member 41, and the ring is sleeved on the outside of the screw connection to improve the stability of its clamping.
  • the end of the first detection line 41 away from the first conductive member 22 can also be detachably connected to the first electrical connection member 24 through a screw connection.
  • the first detection line 41 can be directly extended between the screw connection member and the first electrical connection line 24 by the end, and of course, the end of the first detection line 41 can also form a loop, which is sleeved on the outside of the screw connection to help improve the stability of its clamping.
  • the end of the second detection line 43 away from the second electrical connector 25 can also be detachably connected to the second conductive member 23 through a screw connection.
  • the second detection line 43 can be directly extended between the screw connection and the second conductive member 23 by the end, and of course, a ring can be formed at the end of the second detection member 43, and the ring is sleeved on the outside of the screw connection to improve the stability of its clamping.
  • the end of the second detection line 43 away from the second conductive member 23 can also be detachably connected to the second electrical connector 25 through a screw connector.
  • the second detection line 43 can be directly extended between the screw connector and the second electrical connector 25 by the end, and of course, a ring can be formed at the end of the second detection line 43, and the ring is sleeved on the outside of the screw connector to improve the stability of its clamping.
  • the first conductive member 22 can also be detachably connected to the heightening frame 20 through a screw connection to improve the stability and convenience of the connection to the first conductive member 22 .
  • the second conductive member 23 can also be detachably connected to the heightening frame 20 through a screw connection to improve the stability and convenience of the connection of the second conductive member 23 .
  • the first conductive member 13 may also be detachably connected to the main housing 10 via a screw connection to improve the stability and convenience of the connection to the first conductive member 13 .
  • the second conductive member 15 can also be detachably connected to the main housing 10 via a screw connection to improve the stability and convenience of the connection to the second conductive member 15 .
  • the end of the first connecting line 45 away from the control board 40A can also be detachably connected to the first conductive member 13 through a screw connection.
  • the first connecting line 45 can be directly extended between the screw connection and the first conductive member 13 by the end, and of course, the end of the first connecting line 45 can also form a ring, which is sleeved on the outside of the screw connection to help improve the stability of its clamping.
  • the end of the second connecting wire 47 away from the control board 40A can also be detachably connected to the second conductive member 15 through a screw connection.
  • the second connecting wire 47 can be directly extended between the screw connection and the second conductive member 15 by the end, and of course, a ring can be formed at the end of the second connecting member 47, and the ring is sleeved on the outside of the screw connection to help improve the stability of its clamping.
  • the first conductive member 13 and the second conductive member 15 are wrapped with an insulating sleeve 17 on their outer sides.
  • an insulating sleeve 17 is provided outside the first conductive member 13 and the second conductive member 15, so that the electrical conduction between the first conductive member 13 and the second conductive member 15 and the main housing 10 can be isolated, thereby facilitating improving the safety of the processing equipment 1000 during use.
  • the number of the first detection structures 40B is at least two.
  • the number of the first detection members 41 may be at least two, so that the control board 40A can perform in-situ detection on the carrier 30 through at least two loops. At this time, even if one loop is damaged, it can be installed in place through another loop for detection, which is conducive to improving the accuracy of in-situ detection of the carrier 30, so as to improve the safety of subsequent processing equipment 1000.
  • the number of the first detection structure 40B can be two, three or more, and the number of the corresponding first connection structures 40D can also be two, three or more.
  • the number of the second detection structure 40C can be one, that is, at least two first detection members 41 can share a second detection member 43 as a loop.
  • the number of the second detection structure 40C can also be set corresponding to the number of the first detection structure 40B.
  • the heightened frame 20 includes an inner panel 26, a mounting plate 27, and an outer panel 28.
  • the inner panel 26 encloses the accommodating cavity 21.
  • the mounting plate 27 is connected to the inner panel 26 and is arranged around the periphery of the first cavity 211.
  • the mounting plate 27 is connected to the main housing 10.
  • the enclosure plate 28 is connected to the mounting plate 27 and surrounds the outer side of the inner enclosure plate 26 at intervals. At least part of the first detection structure 40B and the second detection structure 40C are arranged in the space enclosed by the outer enclosure plate 28, the mounting plate 27 and the inner enclosure plate 26.
  • the heightened frame 20 includes an inner panel 26, a mounting plate 27, and an outer panel 28, so that the heightened frame 20 can have a larger contact area through the mounting plate 27, thereby facilitating the convenience of connection with the main housing 10 and the stability of support.
  • the inner panel 26, the mounting plate 27, and the outer panel 28 can also enclose a space to conceal at least part of the first detection structure 40B and the second detection structure 40C to improve the protection effect thereof.
  • the present application also proposes a processing device 1000, which includes a frame mechanism 100.
  • the specific structure of the frame mechanism 100 refers to the above embodiment. Since the present processing device 1000 adopts all the technical solutions of all the above embodiments, it at least has all the effects brought by the technical solutions of the above embodiments, which will not be described one by one here.
  • the processing device 1000 can be a laser processing device to achieve cutting or engraving of the workpiece.
  • the processing device 1000 can also be a tool processing device that uses a tool for cutting, or a tool processing device that uses a drill bit for drilling.
  • the present application does not limit the specific type of the processing device 1000.
  • the main housing 10 of the frame mechanism 100 is provided with a processing space 10a and a pick-up and release port 10b connected to the processing space 10a
  • the frame mechanism 100 further includes a cover plate 90, the cover plate 90 can open and cover the pick-up and release port 10b, and the first cavity 211 of the heightened frame 20 is connected to the processing space 10a
  • the processing equipment 1000 further includes a track device 300 and a processing device 400, the track device 300 is provided in the processing space 10a, the processing device 400 is connected to the track device 300, and the track device 300 is configured to drive the processing device 400 to move.
  • the track device 300 drives the processing device 400 to move, so as to facilitate the mobile processing of the workpiece, and the provision of the pick-up and release port 10b and the cover plate 90 facilitates the pick-up and placement of the workpiece.

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Abstract

A frame mechanism (100) and a processing apparatus (1000). The frame mechanism (100) comprises a main housing (10), a heightening frame (20), a bearing platform (30) and a detection assembly (40). The main housing (10) is configured to accommodate a processing device (400); the heightening frame (20) is configured to heighten the main housing (10), an accommodating cavity (21) is provided in the heightening frame (20), the accommodating cavity (21) has a first cavity opening (211) and a second cavity opening (213) which are arranged opposite each other, and the first cavity opening (211) is in communication with the main housing (10); the bearing platform (30) is detachably connected to the heightening frame (20) and can cover the second cavity opening (213); the detection assembly (40) comprises a control panel (40A), a first detection structure (40B) and a second detection structure (40B), each of the first detection structure (40B) and the second detection structure (40B) being electrically connected to the control panel (40A); and when the bearing platform (30) is in a state of being connected to the heightening frame (20), the bearing platform (30) can conduct the first detection structure (40B) and the second detection structure (40B). The solution can achieve detection on the in-place installation of the bearing platform, so as to accurately process various parts of a processed workpiece and thus improve the processing quality of the processed workpiece.

Description

机架机构和加工设备Rack structure and processing equipment

相关申请Related Applications

本申请要求于2023年6月29日申请的、申请号为202321693190.0的中国专利申请的优先权,以及2024年6月21日申请的、申请号为202421460298.X的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims priority to Chinese patent application No. 202321693190.0 filed on June 29, 2023, and priority to Chinese patent application No. 202421460298.X filed on June 21, 2024, the entire contents of which are incorporated by reference into this application.

技术领域Technical Field

本申请涉及加工设备技术领域,特别涉及一种机架机构和应用该机架机构的加工设备。The present application relates to the technical field of processing equipment, and in particular to a frame mechanism and processing equipment using the frame mechanism.

背景技术Background Art

目前,加工设备的机架机构通常包括有主机壳和承载台,主机壳用于容置加工装置,承载台用于可拆卸地盖合于主机壳。此时,若是承载台未安装到位,可能会出现承载台发生倾斜而使得放置在承载台上的待加工件随之发生倾斜,进而导致激光加工误差而影响了加工件的加工质量。At present, the frame structure of the processing equipment usually includes a main housing and a carrier, wherein the main housing is used to accommodate the processing device, and the carrier is used to detachably cover the main housing. At this time, if the carrier is not installed in place, the carrier may tilt, causing the workpiece placed on the carrier to tilt, thereby causing laser processing errors and affecting the processing quality of the workpiece.

申请内容Application Contents

本申请的主要目的是提供一种机架机构,旨在实现对承载台的安装到位进行检测。The main purpose of the present application is to provide a frame mechanism, which aims to detect whether the load-bearing platform is installed in place.

为实现上述目的,本申请提出的机架机构包括:To achieve the above purpose, the frame mechanism proposed in this application includes:

主机壳,所述主机壳用于容置加工装置;A main housing, the main housing being used to accommodate the processing device;

增高架,所述增高架用于垫高所述主机壳,所述增高架设有容纳腔,所述容纳腔具有呈相对设置的第一腔口和第二腔口,所述第一腔口连通所述主机壳;A heightening frame, the heightening frame is used to raise the main housing, the heightening frame is provided with a receiving cavity, the receiving cavity has a first cavity opening and a second cavity opening which are arranged opposite to each other, and the first cavity opening is connected with the main housing;

承载台,所述承载台可拆卸地安装于所述增高架,并可封盖所述第二腔口;以及a carrying platform, which is detachably mounted on the heightening frame and can cover the second cavity; and

检测组件,所述检测组件包括控制板、第一检测结构以及第二检测结构,第一检测结构和第二检测结构分别电性连接所述控制板;A detection component, the detection component comprising a control board, a first detection structure and a second detection structure, the first detection structure and the second detection structure are electrically connected to the control board respectively;

其中,在所述承载台处于安装于所述增高架的状态下,所述承载台能够导通所述第一检测结构和所述第二检测结构。Wherein, when the supporting platform is installed on the height-enhancing frame, the supporting platform can conduct the first detection structure and the second detection structure.

在一实施例中,所述承载台的材质为导电材料。In one embodiment, the support platform is made of conductive material.

在一实施例中,所述第一检测结构包括第一检测线,所述第二检测结构包括第二检测线,所述第一检测线和所述第二检测线分别电性连接于所述控制板;In one embodiment, the first detection structure includes a first detection line, the second detection structure includes a second detection line, and the first detection line and the second detection line are electrically connected to the control board respectively;

在所述承载台处于连接于所述增高架的状态下,所述承载台能够导通所述第一检测线和第二检测线。When the carrying platform is connected to the heightening frame, the carrying platform can conduct the first detection line and the second detection line.

在一实施例中,所述第一检测结构还包括第一导通件,所述第二检测结构还包括第二导通件;In one embodiment, the first detection structure further includes a first conductive member, and the second detection structure further includes a second conductive member;

所述第一导通件连接于所述第一检测线远离所述控制板的一端,所述第二导通件连接于所述第二检测线远离所述控制板的一端,且所述第一导通件和所述第二导通件间隔设置;The first conductive member is connected to one end of the first detection line away from the control board, the second conductive member is connected to one end of the second detection line away from the control board, and the first conductive member and the second conductive member are arranged at intervals;

在所述承载台处于连接于所述增高架的状态下,所述承载台能够导通所述第一导通件和所述第二导通件。When the supporting platform is connected to the heightening frame, the supporting platform can conduct electricity between the first conducting member and the second conducting member.

在一实施例中,所述检测组件还包括第一接触件和第二接触件,所述第一接触件和所述第二接触件被配置为安装于所述承载台;In one embodiment, the detection assembly further includes a first contact member and a second contact member, wherein the first contact member and the second contact member are configured to be mounted on the carrier platform;

在所述承载台处于安装于所述增高架的状态下,第一接触件和第二接触件分别与所述第一检测结构和所述第二检测结构连接。When the supporting platform is installed on the height-enhancing frame, the first contact member and the second contact member are connected to the first detection structure and the second detection structure respectively.

在一实施例中,在所述承载台处于安装于所述增高架的状态下,所述承载台与第一接触件和第二接触件接触,以导通所述第一接触件和第二接触件。In one embodiment, when the support platform is installed on the elevated frame, the support platform contacts the first contact piece and the second contact piece to conduct the first contact piece and the second contact piece.

在一实施例中,所述第一接触件和所述第二接触件穿过所述承载台,并分别与所述第一检测结构和所述第二检测结构螺纹连接。In one embodiment, the first contact member and the second contact member pass through the supporting platform and are threadedly connected to the first detection structure and the second detection structure respectively.

在一实施例中,在所述承载台处于安装于所述增高架的状态下,所述承载台与所述第一检测结构和第二检测结构接触,以导通所述第一检测结构和第二检测结构。In one embodiment, when the supporting platform is installed on the heightened frame, the supporting platform contacts the first detection structure and the second detection structure to conduct the first detection structure and the second detection structure.

在一实施例中,所述第一检测结构和所述第二检测结构设于所述增高架,所述增高架可拆卸地连接于所述主机壳;In one embodiment, the first detection structure and the second detection structure are provided on the heightening frame, and the heightening frame is detachably connected to the main housing;

所述控制板设于所述主机壳,所述检测组件还包括第一连接结构和第二连接结构,所述第一连接结构和第二连接结构分别电性连接于所述控制板;The control board is arranged on the main housing, and the detection assembly further comprises a first connection structure and a second connection structure, wherein the first connection structure and the second connection structure are respectively electrically connected to the control board;

在所述增高架处于连接于所述主机壳的状态下,所述第一检测结构和所述第二检测结构分别电性连接于所述第一连接结构和所述第二连接结构。When the height-enhancing frame is connected to the main housing, the first detection structure and the second detection structure are electrically connected to the first connection structure and the second connection structure, respectively.

在一实施例中,所述第一检测结构包括电阻,所述增高架和所述承载台可选择地连接于所述主机壳;In one embodiment, the first detection structure includes a resistor, and the heightened frame and the support platform are selectively connected to the main housing;

在所述承载台处于连接于所述主机壳的状态下,所述承载台能够导通所述第一连接结构和所述第二连接结构。When the carrying platform is connected to the main housing, the carrying platform can conduct the first connection structure and the second connection structure.

在一实施例中,所述检测组件还包括第一接触件和第二接触件,所述第一接触件和所述第二接触件被配置为安装于所述承载台;In one embodiment, the detection assembly further includes a first contact member and a second contact member, wherein the first contact member and the second contact member are configured to be mounted on the carrier platform;

其中,在所述承载台处于连接于所述增高架的状态下,所述第一接触件和所述第二接触件分别与所述第一检测结构和所述第二检测结构连接;Wherein, when the supporting platform is connected to the heightening frame, the first contact member and the second contact member are connected to the first detection structure and the second detection structure respectively;

在所述承载台处于连接于所述主机壳的状态下,所述第一接触件和所述第二接触件分别与所述第一连接结构和所述第二连接结构连接。When the supporting platform is connected to the main housing, the first contact piece and the second contact piece are connected to the first connecting structure and the second connecting structure respectively.

在一实施例中,所述第一连接结构包括第一连接线,所述第二连接结构包括第二连接线,所述第一连接线和所述第二连接线分别电性连接于所述控制板;In one embodiment, the first connection structure includes a first connection line, the second connection structure includes a second connection line, and the first connection line and the second connection line are electrically connected to the control board respectively;

在所述增高架处于连接于所述主机壳的状态下,所述第一检测结构和所述第二检测结构分别电性连接于所述第一连接线和所述第二连接线。When the heightening frame is connected to the main housing, the first detection structure and the second detection structure are electrically connected to the first connection line and the second connection line respectively.

在一实施例中,所述第一连接结构还包括第一导电件,所述第二连接结构还包括第二导电件;In one embodiment, the first connection structure further includes a first conductive member, and the second connection structure further includes a second conductive member;

所述第一导电件连接于所述第一连接线远离所述控制板的一端,所述第二导电件连接于所述第二连接线远离所述控制板的一端,且所述第一导电件和所述第二导电件间隔设置;The first conductive member is connected to one end of the first connecting line away from the control board, the second conductive member is connected to one end of the second connecting line away from the control board, and the first conductive member and the second conductive member are spaced apart;

在所述增高架处于连接于所述主机壳的状态下,所述第一检测结构和所述第二检测结构分别电性连接于所述第一导电件和所述第二导电件。 When the heightening frame is connected to the main housing, the first detection structure and the second detection structure are electrically connected to the first conductive member and the second conductive member respectively.

在一实施例中,所述检测组件还包括第三接触件和第四接触件,所述第三接触件被配置为连接所述第一导电件和所述第一检测结构,所述第四接触件被配置为连接第二导电件和所述第二检测结构。In one embodiment, the detection component further includes a third contact and a fourth contact, the third contact is configured to connect the first conductive member and the first detection structure, and the fourth contact is configured to connect the second conductive member and the second detection structure.

在一实施例中,所述第三接触件穿过所述第一导电件,并与所述第一检测结构螺纹连接;In one embodiment, the third contact member passes through the first conductive member and is threadedly connected to the first detection structure;

所述第四接触件穿过所述第二导电件,并与所述第二检测结构螺纹连接。The fourth contact member passes through the second conductive member and is threadedly connected to the second detection structure.

在一实施例中,所述第一检测结构包括相连接的第一检测线和第一电连接件,所述第二检测结构包括相连接的第二检测线和第二电连接件;In one embodiment, the first detection structure includes a first detection line and a first electrical connection member connected to each other, and the second detection structure includes a second detection line and a second electrical connection member connected to each other;

第一电连接件和所述第二电连接件分别电性连接于所述第一连接结构和所述第二连接结构,所述承载台能够导通所述第一检测线和第二检测线。The first electrical connector and the second electrical connector are electrically connected to the first connection structure and the second connection structure respectively, and the supporting platform can conduct the first detection line and the second detection line.

在一实施例中,所述增高架具有第一表面,所述第一腔口贯穿所述第一表面,所述第一检测结构电性连接于所述第一连接结构的一端和所述第二检测结构电性连接于所述第二连接结构的一端设于所述第一表面;In one embodiment, the heightening frame has a first surface, the first cavity passes through the first surface, and the first detection structure is electrically connected to one end of the first connection structure and the second detection structure is electrically connected to one end of the second connection structure and is disposed on the first surface;

所述主机壳具有朝向所述第一表面的第二表面,所述第一连接结构电性连接于所述第一检测结构的一端和所述第二连接结构电性连接于所述第二检测结构的一端设于所述第二表面。The main housing has a second surface facing the first surface, and one end of the first connection structure electrically connected to the first detection structure and one end of the second connection structure electrically connected to the second detection structure are arranged on the second surface.

在一实施例中,所述第一检测结构的数量为至少两个。In one embodiment, the number of the first detection structures is at least two.

在一实施例中,所述增高架包括内围板、安装板以及外围板,所述内围板围合形成所述容纳腔;所述安装板连接于所述内围板,并沿所述第一腔口的周缘环绕设置,所述安装板连接于所述主机壳;所述外围板连接于所述安装板,并间隔环绕于所述内围板的外侧,所述第一检测结构和所述第二检测结构的至少部分设于所述外围板、所述安装板以及所述内围板围合形成的空间内。In one embodiment, the heightening frame includes an inner panel, a mounting plate and an outer panel, the inner panel enclosing the accommodating cavity; the mounting plate is connected to the inner panel and is arranged around the periphery of the first cavity opening, and the mounting plate is connected to the main housing; the outer panel is connected to the mounting plate and is spaced around the outer side of the inner panel, and at least part of the first detection structure and the second detection structure are arranged in the space enclosed by the outer panel, the mounting plate and the inner panel.

本申请还提出一种加工设备,包括如上所述的机架机构。The present application also proposes a processing device, comprising the frame mechanism as described above.

在一实施例中,所述机架机构的所述主机壳设有加工空间和连通所述加工空间取放口,所述主机壳所述机架机构还包括盖板,所述盖板可打开和封盖所述取放口,所述增高架的所述第一腔口连通所述加工空间;In one embodiment, the main housing of the frame mechanism is provided with a processing space and a take-in and put-out port connected to the processing space, the main housing and the frame mechanism further include a cover plate, the cover plate can open and cover the take-in and put-out port, and the first cavity of the heightened frame is connected to the processing space;

所述加工设备还包括轨道装置和加工装置,所述轨道装置设于所述加工空间内,所述加工装置连接于所述轨道装置,所述轨道装置被配置为驱动所述加工装置移动。The processing equipment further includes a track device and a processing device, wherein the track device is arranged in the processing space, the processing device is connected to the track device, and the track device is configured to drive the processing device to move.

在一实施例中,所述加工设备为激光加工设备。In one embodiment, the processing equipment is a laser processing equipment.

本申请的技术方案的机架机构在应用于加工设备中时,通过检测组件可以对封盖于增高架上的承载台的安装状态进行检测。具体而言,在承载台安装于增高架上时,承载台可以导通检测组件中的第一检测结构和第二检测结构,使得检测组件中的控制板在通过第一检测结构输出电信号时,可以经过承载台的导通而传递到第二检测结构,并通过该第二检测结构再传递回控制板。此时,控制板在检测到第一检测结构和第二检测结构所构成电路导通时,即可判断出承载台安装到位。反之,在承载台安装到位时,第一检测结构和第二检测结构之间处于断开,即可判断出承载台未安装到位。因此,该检测组件的设置实现了对承载台的安装到位的检测,以便加工设备中的加工装置可以对加工件的更准确加工,从而提高加工设备对加工件的加工质量。When the frame mechanism of the technical solution of the present application is applied to processing equipment, the installation state of the load-bearing platform covered on the heightened frame can be detected through the detection component. Specifically, when the load-bearing platform is installed on the heightened frame, the load-bearing platform can conduct the first detection structure and the second detection structure in the detection component, so that when the control board in the detection component outputs an electrical signal through the first detection structure, it can be transmitted to the second detection structure through the conduction of the load-bearing platform, and then transmitted back to the control board through the second detection structure. At this time, when the control board detects that the circuit formed by the first detection structure and the second detection structure is conducted, it can be determined that the load-bearing platform is installed in place. Conversely, when the load-bearing platform is installed in place, the first detection structure and the second detection structure are disconnected, and it can be determined that the load-bearing platform is not installed in place. Therefore, the setting of the detection component realizes the detection of the installation of the load-bearing platform, so that the processing device in the processing equipment can process the workpiece more accurately, thereby improving the processing quality of the workpiece by the processing equipment.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

图1为本申请一实施例加工设备带有增高架的结构示意图;FIG1 is a schematic structural diagram of a processing device with an elevated frame according to an embodiment of the present application;

图2为图1中加工设备去掉增高架的结构示意图;FIG2 is a schematic diagram of the structure of the processing equipment in FIG1 without the heightening frame;

图3为图2中加工设备的一爆炸结构示意图;FIG3 is a schematic diagram of an exploded structure of the processing equipment in FIG2 ;

图4为图1中加工设备的机架机构的结构示意图;FIG4 is a schematic structural diagram of a frame mechanism of the processing equipment in FIG1 ;

图5为图4中A处的局部放大图;FIG5 is a partial enlarged view of point A in FIG4 ;

图6为图4中机架机构的另一视角的结构示意图;FIG6 is a schematic structural diagram of the frame mechanism in FIG4 from another perspective;

图7为图6中B处的局部放大图;FIG7 is a partial enlarged view of point B in FIG6;

图8为图4中机架机构的又一视角的结构示意图;FIG8 is a structural schematic diagram of the frame mechanism in FIG4 from another perspective;

图9为图8中C处的局部放大图;FIG9 is a partial enlarged view of point C in FIG8 ;

图10为图4中机架机构的一剖面示意图;FIG10 is a cross-sectional schematic diagram of the frame mechanism in FIG4 ;

图11为图10中的D处的局部放大图;FIG11 is a partial enlarged view of point D in FIG10 ;

图12为图4中机架机构的一局部结构的一视角示意图;FIG12 is a schematic diagram of a partial structure of the frame mechanism in FIG4 from a perspective;

图13为图4中机架机构的一局部结构的另一视角示意图;FIG13 is a schematic diagram of a partial structure of the frame mechanism in FIG4 from another perspective;

图14为图4中机架机构的一局部结构的爆炸结构示意图;FIG14 is an exploded structural diagram of a partial structure of the frame mechanism in FIG4 ;

图15为本申请机架机构的承载台安装于主机壳的状态示意图。FIG. 15 is a schematic diagram showing a state where the support platform of the rack mechanism of the present application is installed on the main housing.

附图标号说明:

Description of Figure Numbers:

本申请目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings.

具体实施方式DETAILED DESCRIPTION

下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请的一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

需要说明,本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

在本申请中,除非另有明确的规定和限定,术语“连接”、“固定”等应做广义理解,例如,“固定”可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

另外,在本申请中涉及“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外,全文中出现的“和/或”的含义为,包括三个并列的方案,以“A和/或B为例”,包括A方案,或B方案,或A和B同时满足的方案。另外,各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本申请要求的保护范围之内。In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and/or" appearing in the full text is to include three parallel solutions. Taking "A and/or B as an example", it includes solution A, or solution B, or a solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

请结合参考图1至图3,本申请提出一种机架机构100,应用于加工设备1000。该加工设备1000可以为激光加工设备,以实现对工件进行激光切割加工或者激光雕刻加工等。当然,该加工设备1000也可以为采用刀片进行切割,或者是采用钻头进行打孔的刀具加工设备。因此,本申请对机架机构100所应用的加工设备1000的具体类型不作限定。进一步地,加工设备1000还可以包括有轨道装置300和加工装置400,轨道装置300设于机架机构100的主机壳10内,加工装置400连接于轨道装置300。被配置为驱动加工装置400移动,以便实现对工件进行移动加工。其中,轨道装置300可以是包括输送带和带轮,此时加工装置400可以安装于输送带。当然,轨道装置300也可以是包括丝杆和滑座,此时加工装置400可以安装于滑座。可见,本申请对轨道装置300的结构不作限定,能够用于驱动架构装置进行移动即可。Please refer to Figures 1 to 3. The present application proposes a frame mechanism 100, which is applied to a processing device 1000. The processing device 1000 can be a laser processing device to realize laser cutting or laser engraving of a workpiece. Of course, the processing device 1000 can also be a tool processing device that uses a blade for cutting or a drill for drilling. Therefore, the present application does not limit the specific type of the processing device 1000 used by the frame mechanism 100. Further, the processing device 1000 can also include a track device 300 and a processing device 400, the track device 300 is arranged in the main housing 10 of the frame mechanism 100, and the processing device 400 is connected to the track device 300. It is configured to drive the processing device 400 to move so as to realize mobile processing of the workpiece. Among them, the track device 300 can include a conveyor belt and a pulley, and the processing device 400 can be installed on the conveyor belt. Of course, the track device 300 can also include a screw rod and a slide seat, and the processing device 400 can be installed on the slide seat. It can be seen that the present application does not limit the structure of the track device 300, as long as it can be used to drive the structural device to move.

接下来以实施例对本申请所提出的机架机构100的结构进行解释和说明,请结合参考图4至图14,在本申请的一实施例中,该机架机构100包括主机壳10、增高架20、承载台30以及检测组件40。主机壳10用于容置加工装置400;主机壳10用于垫高主机壳10,增高架20设有容纳腔21,容纳腔21具有呈相对设置的第一腔口211和第二腔口213,第一腔口211连通于主机壳10;承载台30可拆安装连接于增高架20,并可封盖第二腔口213;检测组件40包括控制板40A、第一检测结构40B以及第二检测结构40B,第一检测结构40B和第二检测结构40B分别电性连接于控制板40A;其中,在承载台30处于连接于增高架20的状态下,承载台30能够导通第一检测结构40B和第二检测结构40B。Next, the structure of the frame mechanism 100 proposed in the present application is explained and illustrated by an embodiment. Please refer to Figures 4 to 14. In an embodiment of the present application, the frame mechanism 100 includes a main housing 10, a heightening frame 20, a supporting platform 30 and a detection component 40. The main housing 10 is used to accommodate the processing device 400; the main housing 10 is used to raise the main housing 10, and the heightening frame 20 is provided with a accommodating cavity 21, and the accommodating cavity 21 has a first cavity opening 211 and a second cavity opening 213 which are arranged opposite to each other, and the first cavity opening 211 is connected to the main housing 10; the supporting platform 30 can be detachably installed and connected to the heightening frame 20, and can cover the second cavity opening 213; the detection component 40 includes a control board 40A, a first detection structure 40B and a second detection structure 40B, and the first detection structure 40B and the second detection structure 40B are respectively electrically connected to the control board 40A; wherein, when the supporting platform 30 is in a state of being connected to the heightening frame 20, the supporting platform 30 can conduct the first detection structure 40B and the second detection structure 40B.

主机壳10,可以形成有加工空间10a,并通过该加工空间10a来安装容置上文所介绍的加工装置400。其中,在加工设备1000为激光加工设备时,该加工装置400可以为激光头。在激光设备为刀具加工设备时,该加工装置400可以为刀具模组。因此,加工装置400的类型可以由加工设备1000的类型来决定。另外,主机壳10可以为长方形壳体,当然也可以为正方形壳体,亦或者是圆形壳体。本申请对主机壳10的具体形状不作限定。此外,主机壳10的下端可以呈开口设置,以便可以和对其进行垫高的增高架20进行连通。The main housing 10 may be formed with a processing space 10a, and the processing device 400 introduced above may be installed and accommodated through the processing space 10a. Specifically, when the processing equipment 1000 is a laser processing equipment, the processing device 400 may be a laser head. When the laser equipment is a tool processing equipment, the processing device 400 may be a tool module. Therefore, the type of the processing device 400 may be determined by the type of the processing equipment 1000. In addition, the main housing 10 may be a rectangular shell, or a square shell, or a circular shell. The present application does not limit the specific shape of the main housing 10. In addition, the lower end of the main housing 10 may be open so that it can be connected to the elevated frame 20 for raising it.

增高架20,可以安装在主机壳10的下端,以用于垫高主机壳10,并通过第一腔口211和主机壳10下端的开口连通,进而通过增高架20的容纳腔21对主机壳10的加工空间10a起到扩容作用。其中,增高架20的容纳腔21的可以为正方形腔体、长方形腔体或者圆形腔体的任意形状的腔体。另外,增高架20可以为多个板体围合形成,亦或者是多个柱体围合形成,本申请对增高架20的结构类型也不作限定。而增高架20和主机壳10之间的连接可以为可拆卸连接,当然也可以为固定连接,本申请对增高架20和主机壳10之间的连接方式不作限定。The raising frame 20 can be installed at the lower end of the main housing 10 to raise the main housing 10, and is connected to the opening at the lower end of the main housing 10 through the first cavity 211, thereby expanding the processing space 10a of the main housing 10 through the accommodating cavity 21 of the raising frame 20. Among them, the accommodating cavity 21 of the raising frame 20 can be a cavity of any shape such as a square cavity, a rectangular cavity or a circular cavity. In addition, the raising frame 20 can be formed by a plurality of plates or a plurality of columns, and the present application does not limit the structural type of the raising frame 20. The connection between the raising frame 20 and the main housing 10 can be a detachable connection, or a fixed connection, and the present application does not limit the connection method between the raising frame 20 and the main housing 10.

承载台30,可以用于盖合于增高架20的下端,以封盖容纳腔21的第二腔口213,进而与增高架20和主机壳10围合形成供加工装置400进行加工的封闭的空间,以提高加工设备1000对工件进行加工时的安全性。其中,承载台30可以是采用螺钉连接,卡扣连接或者磁吸连接等任意可拆卸连接方式实现和增高架20进行连接。另外,承载台30的材质可以为导电材料,例如:铜或者铝等金属或者其他可导电地材料。此外,承载台30对第一检测结构40B和所述第二检测结构40C的导通,可以是在承载台30处于安装于增高架20的状态下,承载台30与第一检测结构40B和第二检测结构40C接触,进而实现承载台30直接导通第一检测结构40B和第二检测结构40C。当然,本申请不限于此,于其他实施例中,承载台30也可以是如下文所介绍的通过额外设置的第一接触件50来接触导通承载台30和通第一检测结构40B,以及通过第二接触件60来接触导通承载台30和通第二检测结构40C,进而实现承载台30间接导通第一检测结构40B和第二检测结构40C。The carrier platform 30 can be used to cover the lower end of the heightened frame 20 to cover the second cavity 213 of the accommodating cavity 21, and then enclose the heightened frame 20 and the main housing 10 to form a closed space for the processing device 400 to process, so as to improve the safety of the processing equipment 1000 when processing the workpiece. Among them, the carrier platform 30 can be connected to the heightened frame 20 by any detachable connection method such as screw connection, snap connection or magnetic connection. In addition, the material of the carrier platform 30 can be a conductive material, for example: metal such as copper or aluminum or other conductive materials. In addition, the conduction of the first detection structure 40B and the second detection structure 40C by the carrier platform 30 can be that when the carrier platform 30 is installed on the heightened frame 20, the carrier platform 30 contacts the first detection structure 40B and the second detection structure 40C, thereby realizing that the carrier platform 30 directly conducts the first detection structure 40B and the second detection structure 40C. Of course, the present application is not limited to this. In other embodiments, the support platform 30 can also be connected to the first detection structure 40B through an additionally arranged first contact member 50 as described below, and to the second detection structure 40C through a second contact member 60, thereby achieving indirect connection between the first detection structure 40B and the second detection structure 40C.

检测组件40,可以用于传输电信号。具体而言,控制板40A可以电信号,第一检测结构40B可以用于接收控制板40A输出的电信号,之后传递到承载台30,并经承载台30后传递到第二检测件43,之后通过第二检测结构40C再传递到控制板40A,从而实现控制板40A、第一检测结构40B、承载台30以及第二检测结构40C连接成一个回路。因此,此 时承载台30的安装到位与否,决定了该回路是否导通。在承载台30安装到位时,控制板40A通过第二检测结构40C可以检测到回路导通。而在承载台30未安装到位时,第一检测结构40B和第二检测结构40C处于断开,控制板40A通过第二检测结构40C无法检测到回路导通。此时,控制板40A可以控制加工设备1000中的报警器发出警报,以提示工人承载台30未安装到位。另外,控制板40A可以是设置在主机壳10上,当然也可以是设置在增高架20上。此外,该控制板40A可以是仅用于与第一检测结构40B和第二检测结构40C电性连接,还可以是进一步地和加工装置400进行电性连接,以控制加工装置400对工件进行加工。另外,第一检测结构40B和第二检测结构40C可以是如下文所介绍的分别包括第一检测线41和第二检测线43,当然也可以是分别包括能够导电的金属片体、柱体或者块体等。可见,本申请对第一检测结构40B和第二检测结构40C的结构类型不作限定,能够与控制板40A以及承载台30连通形成回路即可。此外,第一检测结构40B和第二检测结构40C可以是安装在增高架20上,当然也可以是安装主机壳10上,本申请对第一检测结构40B和第二检测结构40C的安装位置也不作限定。The detection component 40 can be used to transmit electrical signals. Specifically, the control board 40A can transmit electrical signals, and the first detection structure 40B can be used to receive the electrical signals output by the control board 40A, and then transmit them to the carrier 30, and then transmit them to the second detection component 43 after the carrier 30, and then transmit them to the control board 40A through the second detection structure 40C, so that the control board 40A, the first detection structure 40B, the carrier 30 and the second detection structure 40C are connected into a loop. Therefore, this Whether the carrier 30 is installed in place determines whether the circuit is conductive. When the carrier 30 is installed in place, the control board 40A can detect that the circuit is conductive through the second detection structure 40C. When the carrier 30 is not installed in place, the first detection structure 40B and the second detection structure 40C are disconnected, and the control board 40A cannot detect that the circuit is conductive through the second detection structure 40C. At this time, the control board 40A can control the alarm in the processing equipment 1000 to sound an alarm to remind the worker that the carrier 30 is not installed in place. In addition, the control board 40A can be set on the main housing 10, and of course it can also be set on the heightening frame 20. In addition, the control board 40A can be used only for electrical connection with the first detection structure 40B and the second detection structure 40C, and can also be further electrically connected to the processing device 400 to control the processing device 400 to process the workpiece. In addition, the first detection structure 40B and the second detection structure 40C may include the first detection line 41 and the second detection line 43 respectively as described below, and of course, they may also include conductive metal sheets, columns or blocks, etc. It can be seen that the present application does not limit the structural type of the first detection structure 40B and the second detection structure 40C, and it is sufficient that they can be connected to the control board 40A and the support platform 30 to form a loop. In addition, the first detection structure 40B and the second detection structure 40C can be installed on the heightening frame 20, and of course, they can also be installed on the main housing 10. The present application does not limit the installation position of the first detection structure 40B and the second detection structure 40C.

本申请的技术方案的机架机构100在应用于加工设备1000中时,通过检测组件10可以对封盖于增高架20上的承载台30的安装状态进行检测。具体而言,在承载台30安装于增高架20上时,承载台30可以导通检测组件40中的第一检测结构40B和第二检测结构40C,使得检测组件40中的控制板40A在通过第一检测结构40B输出电信号时,可以经过承载台30的导通而传递到第二检测结构40C,并通过该第二检测结构40C再传递回控制板40A。此时,控制板40A在检测到第一检测结构40B和第二检测结构40C所构成电路导通时,即可判断出承载台30安装到位。反之,在承载台30安装到位时,第一检测结构40B和第二检测结构40C之间处于断开,即可判断出承载台30未安装到位。因此,该检测组件40的设置实现了对承载台30的安装到位的检测,以使得加工设备1000中的加工装置400对加工件加工时因所承载的承载台30位置倾斜导致的加工误差,从而提高加工设备1000对加工件的加工质量。同时,在加工设备1000为激光加工设备时,还可以降低激光外漏的可能,从而有利于提高加工设备1000使用的安全性。另外,由于增高架20的第一腔口和主机壳10内加工空间10a连通,使得通过增高架20内的容纳腔21对主机壳10内的加工空间10a起到了扩容作用,以便对具有更大尺寸的工件进行容置加工。因此,该增高架20的设置降低了因为主机壳10内的加工空间10a的不足,而导致无法对在上下方向具有较大尺寸的加工件进行加工的可能,从而提高了加工设备1000对加工件的适用性。When the frame mechanism 100 of the technical solution of the present application is applied to the processing equipment 1000, the installation state of the carrier 30 covered on the heightening frame 20 can be detected through the detection component 10. Specifically, when the carrier 30 is installed on the heightening frame 20, the carrier 30 can conduct the first detection structure 40B and the second detection structure 40C in the detection component 40, so that when the control board 40A in the detection component 40 outputs an electrical signal through the first detection structure 40B, it can be transmitted to the second detection structure 40C through the conduction of the carrier 30, and then transmitted back to the control board 40A through the second detection structure 40C. At this time, when the control board 40A detects that the circuit formed by the first detection structure 40B and the second detection structure 40C is connected, it can be determined that the carrier 30 is installed in place. On the contrary, when the carrier 30 is installed in place, the first detection structure 40B and the second detection structure 40C are disconnected, and it can be determined that the carrier 30 is not installed in place. Therefore, the setting of the detection component 40 realizes the detection of the installation of the carrier 30, so that the processing device 400 in the processing equipment 1000 can detect the processing error caused by the tilted position of the carrier 30 when processing the workpiece, thereby improving the processing quality of the workpiece by the processing equipment 1000. At the same time, when the processing equipment 1000 is a laser processing equipment, the possibility of laser leakage can be reduced, which is conducive to improving the safety of the use of the processing equipment 1000. In addition, since the first cavity of the heightening frame 20 is connected to the processing space 10a in the main housing 10, the processing space 10a in the main housing 10 is expanded through the accommodating cavity 21 in the heightening frame 20, so as to accommodate and process workpieces with larger sizes. Therefore, the setting of the heightening frame 20 reduces the possibility that the workpiece with larger sizes in the upper and lower directions cannot be processed due to the shortage of the processing space 10a in the main housing 10, thereby improving the applicability of the processing equipment 1000 to the workpiece.

请结合参考图10至图13,以及图15,在本申请的一实施例中,第一检测结构40B包括第一检测线41,第二检测结构40C包括第二检测线43,第一检测线41和第二检测线43分别电性连接于控制板40A;在承载台30处于连接于增高架20的状态下,承载台30能够导通第一检测线41和第二检测线43。Please refer to Figures 10 to 13, and Figure 15. In one embodiment of the present application, the first detection structure 40B includes a first detection line 41, and the second detection structure 40C includes a second detection line 43. The first detection line 41 and the second detection line 43 are electrically connected to the control board 40A, respectively; when the supporting platform 30 is in a state connected to the heightening frame 20, the supporting platform 30 can conduct the first detection line 41 and the second detection line 43.

在本实施例中,将第一检测结构40B和第二检测结构40C设置为分别包括第一检测线41和第二检测线43,使其可以进行弯折布置,进而有利于提高对第一检测结构40B和第二检测结构40C进行布置的便利性。In this embodiment, the first detection structure 40B and the second detection structure 40C are configured to include a first detection line 41 and a second detection line 43 respectively, so that they can be arranged in a bent manner, thereby facilitating the arrangement of the first detection structure 40B and the second detection structure 40C.

请结合参考图10至图15,在本申请的一实施例中,第一检测结构40B还包括第一导通件22(可以为具有导电性能的金属材质或者其他材质制备),第二检测结构40C还包括第二导通件23(可以为具有导电性能的金属材质或者其他材质制备);第一导通件22连接于第一检测线41远离控制板40A的一端,第二导通件23连接于第二检测线43远离控制板40A的一端,且第一导通件22和第二导通件23间隔设置;在承载台30处于连接于增高架20的状态下,承载台30能够导通第一导通件22和第二导通件23。Please refer to Figures 10 to 15. In one embodiment of the present application, the first detection structure 40B also includes a first conductive member 22 (which can be made of a metal material with conductive properties or other materials), and the second detection structure 40C also includes a second conductive member 23 (which can be made of a metal material with conductive properties or other materials); the first conductive member 22 is connected to an end of the first detection line 41 away from the control board 40A, and the second conductive member 23 is connected to an end of the second detection line 43 away from the control board 40A, and the first conductive member 22 and the second conductive member 23 are arranged at intervals; when the supporting platform 30 is in a state connected to the heightening frame 20, the supporting platform 30 can conduct the first conductive member 22 and the second conductive member 23.

在本实施例中,第一导通件22和第二导通件23的设置,由于第一导通件22和第二导通件23相较于第一检测线41和第二检测线43具有更大的面积,因此在承载台30在处于连接于增高架20的状态下,方便承载台30导通第一导通件22和所述第二导通件23。其中,在承载台30处于安装于增高架20的状态下,承载台30可以是与第一导通件22和第二导通件23接触,以直接承载台30直接导通第一导通件22和第二导通件23。当然,承载台30也可以是如下文所介绍的分别通过第一接触件50和第二接触件60与第一导通件22和第二导通件23进行间接的导通。另外,第一导通件22和第二导通件23可以为板体结构、块体结构或者柱体结构等任意形状结构。In this embodiment, the first conductive member 22 and the second conductive member 23 are arranged. Since the first conductive member 22 and the second conductive member 23 have a larger area than the first detection line 41 and the second detection line 43, when the carrier 30 is connected to the heightened frame 20, it is convenient for the carrier 30 to conduct the first conductive member 22 and the second conductive member 23. In particular, when the carrier 30 is installed on the heightened frame 20, the carrier 30 can be in contact with the first conductive member 22 and the second conductive member 23, so that the carrier 30 directly conducts the first conductive member 22 and the second conductive member 23. Of course, the carrier 30 can also be indirectly connected to the first conductive member 22 and the second conductive member 23 through the first contact member 50 and the second contact member 60 as described below. In addition, the first conductive member 22 and the second conductive member 23 can be any shape structure such as a plate structure, a block structure or a column structure.

请结合参考图10至图13,以及图15,在本申请的一实施例中,检测组件40还包括第一接触件50和第二接触件60,第一接触件50和第二接触件60被配置为安装于承载台30,并分别与第一检测结构40B和第二检测结构40C连接。Please refer to Figures 10 to 13, and Figure 15. In one embodiment of the present application, the detection component 40 also includes a first contact member 50 and a second contact member 60. The first contact member 50 and the second contact member 60 are configured to be installed on the supporting platform 30 and are respectively connected to the first detection structure 40B and the second detection structure 40C.

在本实施例中,在承载台30安装于增高架20时,可以通过第一接触件50和第二接触件60来分别实现与第一检测结构40B和第二检测结构40C连接。此时,由于第一接触件50和第二接触件60分别与第一检测结构40B和第二检测结构40C具有连接关系,进而有利于提高承载台30与检测组件40之间电性连接的稳定性。其中,第一接触件50与第一检测结构40B的连接方式,以及第二接触件60与第二检测结构40C的连接方式可以是如下文所介绍的螺纹连接,当然也可以是卡扣连接或者插接连接等,本申请对第一接触件50与第一检测结构40B的连接方式,以及第二接触件60与第二检测结构40C的连接方式不作出限定。而第一接触件50和第二接触件60与承载台30可以是分体设置,当然也可以是一体结构,本申请对第一接触件50和第二接触件60在承载台30上的安装方式也不作限定。另外,在一些实施例中,可以将第一检测结构40B和第二检测结构40C安装在增高架20上。此时,通过第一接触件50和第一检测结构40B的连接,以及第二接触件60和第二检测结构40C的连接,还可以提高承载台30在增高架20上安装的稳定性。此外,在第一检测结构40B和第二检测结构40C如上文所介绍的分别包括有第一导通件22和第二导通件23时,第一接触件50和第二接触件60可以分别连接于第一导通件22和第二导通件23。In this embodiment, when the carrier 30 is installed on the heightening frame 20, the first contact member 50 and the second contact member 60 can be used to respectively realize the connection with the first detection structure 40B and the second detection structure 40C. At this time, since the first contact member 50 and the second contact member 60 are respectively connected to the first detection structure 40B and the second detection structure 40C, it is beneficial to improve the stability of the electrical connection between the carrier 30 and the detection assembly 40. Among them, the connection method of the first contact member 50 and the first detection structure 40B, and the connection method of the second contact member 60 and the second detection structure 40C can be a threaded connection as described below, of course, it can also be a snap connection or a plug connection, etc., and the present application does not limit the connection method of the first contact member 50 and the first detection structure 40B, and the connection method of the second contact member 60 and the second detection structure 40C. The first contact member 50 and the second contact member 60 and the carrier 30 can be a separate setting, of course, it can also be an integrated structure, and the present application does not limit the installation method of the first contact member 50 and the second contact member 60 on the carrier 30. In addition, in some embodiments, the first detection structure 40B and the second detection structure 40C may be installed on the elevated frame 20. At this time, the connection between the first contact member 50 and the first detection structure 40B, and the connection between the second contact member 60 and the second detection structure 40C, can also improve the stability of the installation of the support platform 30 on the elevated frame 20. In addition, when the first detection structure 40B and the second detection structure 40C respectively include the first conductive member 22 and the second conductive member 23 as described above, the first contact member 50 and the second contact member 60 may be connected to the first conductive member 22 and the second conductive member 23, respectively.

请结合参考图10至图13,以及图15,在本申请的一实施例中,第一接触件50和第二接触件60穿过承载台30,并分别与第一检测结构40B和第二检测结构40C螺纹连接。Please refer to FIGS. 10 to 13 and 15 . In one embodiment of the present application, the first contact member 50 and the second contact member 60 pass through the support platform 30 and are respectively threadedly connected to the first detection structure 40B and the second detection structure 40C.

在本实施例中,将第一接触件50和第二接触件60进行穿设安装,同时分别与第一检测结构40B和第二检测结构40C进行螺纹连接,可以使得该第一接触件50和第二接触件60的安装过程均较为简单,从而有利于提高承载台30与检测组件40之间电性连接的便利性,同时提高承载台30与检测组件40之间电性连接的稳定性。其中,需要说明的是,承载台30可以是直接通过第一接触件50和第二接触件60实现在增高架20上的机械连接。当然,该承载台30也可以是在此基础上通过额外的螺钉或者卡扣等连接结构进一步地连接于增高架20,从而再次提高承载台30安装的稳定性。亦或者是,于其他实施例中,在未设置有第一接触件50和第二接触件60时,承载台30在安装到位后直接与第一检测结构40B和第二检测结构40C进行抵接导通也是可以的。In this embodiment, the first contact member 50 and the second contact member 60 are installed through the threading, and are respectively connected to the first detection structure 40B and the second detection structure 40C by threading, so that the installation process of the first contact member 50 and the second contact member 60 is relatively simple, which is conducive to improving the convenience of the electrical connection between the carrier 30 and the detection component 40, and at the same time improving the stability of the electrical connection between the carrier 30 and the detection component 40. It should be noted that the carrier 30 can be directly connected to the heightening frame 20 through the first contact member 50 and the second contact member 60. Of course, the carrier 30 can also be further connected to the heightening frame 20 on this basis through additional screws or buckles and other connecting structures, so as to further improve the stability of the installation of the carrier 30. Or, in other embodiments, when the first contact member 50 and the second contact member 60 are not provided, it is also possible for the carrier 30 to directly contact and conduct with the first detection structure 40B and the second detection structure 40C after being installed in place.

请结合参考图10至图15,第一检测结构40B和第二检测结构40C设于增高架20,增高架20可拆卸地安装于主机壳10;控制板40A设于主机壳10,检测组件40还包括第一连接结构40D和第二连接结构40E,第一连接结构40D和第二连接结构40E分别电性连接于控制板40A;在增高架20处于连接于主机壳10的状态下,第一检测结构40B和第二检测结构40C分别电性连接于第一连接结构40D和第二连接结构40E。 Please refer to Figures 10 to 15. The first detection structure 40B and the second detection structure 40C are arranged on the height-enhancing frame 20, and the height-enhancing frame 20 is detachably installed on the main housing 10; the control board 40A is arranged on the main housing 10, and the detection component 40 also includes a first connection structure 40D and a second connection structure 40E, and the first connection structure 40D and the second connection structure 40E are electrically connected to the control board 40A respectively; when the height-enhancing frame 20 is in a state of being connected to the main housing 10, the first detection structure 40B and the second detection structure 40C are electrically connected to the first connection structure 40D and the second connection structure 40E respectively.

在本实施例中,将增高架20可拆卸地连接于主机壳10,使得增高架20可以从主机壳10进行拆装,提高使用和维修的便利性。进一步地括第一连接结构40D和第二连接结构40E的设置,则方便增高架20和主机壳10之间进行可分离的电性连接。其中,增高架20和主机壳10可以是采用螺钉连接、磁吸连接或者卡扣连接等任意可拆卸连接方式。而第一连接结构40D和第二连接结构40E可以是如下文所介绍的分别包括第一连接线45和第二连接线47,当然也可以是分别包括能够导电的金属片体、柱体或者块体等。可见,本申请对第一连接结构40D和第二连接结构40E的结构类型不作限定,In this embodiment, the heightening frame 20 is detachably connected to the main housing 10, so that the heightening frame 20 can be disassembled and assembled from the main housing 10, thereby improving the convenience of use and maintenance. Further, the provision of the first connecting structure 40D and the second connecting structure 40E facilitates the detachable electrical connection between the heightening frame 20 and the main housing 10. Among them, the heightening frame 20 and the main housing 10 can be connected in any detachable manner such as screw connection, magnetic connection or snap connection. The first connecting structure 40D and the second connecting structure 40E can be respectively including the first connecting line 45 and the second connecting line 47 as described below, and of course, can also be respectively including conductive metal sheets, columns or blocks. It can be seen that the present application does not limit the structural type of the first connecting structure 40D and the second connecting structure 40E.

请结合参考图6、图7、图10以及图11,在本申请的一实施例中,增高架20具有第一表面20a,第一腔口211贯穿第一表面20a,第一检测结构40B电性连接于第一连接结构40D的一端和第二检测结构40C电性连接于第二连接结构40E的一端设于第一表面20a;主机壳10具有朝向第一表面20a的第二表面10c,第一连接结构40D电性连接于第一检测结构40B的一端和第二连接结构40E电性连接于第二检测结构40C的一端设于第二表面10c。Please refer to Figures 6, 7, 10 and 11. In one embodiment of the present application, the heightened frame 20 has a first surface 20a, the first cavity 211 passes through the first surface 20a, the first detection structure 40B is electrically connected to one end of the first connection structure 40D, and the second detection structure 40C is electrically connected to one end of the second connection structure 40E and is arranged on the first surface 20a; the main housing 10 has a second surface 10c facing the first surface 20a, the first connection structure 40D is electrically connected to one end of the first detection structure 40B, and the second connection structure 40E is electrically connected to one end of the second detection structure 40C and is arranged on the second surface 10c.

在本实施例中,第一表面20a可以为增高架20的上表面,第二表面10c可以为主机壳10的下表面,使得在将主机壳10安装在增高架20上端时,第一连接结构40D和第二连接结构40E可以与第一检测结构40B和第二检测结构40C较好的相对,进而提高对二者对接的便利性。In this embodiment, the first surface 20a can be the upper surface of the height-enhancing frame 20, and the second surface 10c can be the lower surface of the main housing 10, so that when the main housing 10 is installed on the upper end of the height-enhancing frame 20, the first connecting structure 40D and the second connecting structure 40E can be better opposite to the first detection structure 40B and the second detection structure 40C, thereby improving the convenience of docking the two.

请结合参考图6和图7,以及图10至图14,在本申请的一实施例中,第一连接结构40D包括第一连接线45,第二连接结构40E包括第二连接线47,第一连接线45和第二连接线47分别电性连接于控制板40A;在增高架20处于连接于主机壳10的状态下,第一检测结构40B和第二检测结构40C分别电性连接于第一连接线45和第二连接线47。Please refer to Figures 6 and 7, as well as Figures 10 to 14. In one embodiment of the present application, the first connecting structure 40D includes a first connecting line 45, the second connecting structure 40E includes a second connecting line 47, and the first connecting line 45 and the second connecting line 47 are electrically connected to the control board 40A respectively; when the heightened frame 20 is in a state connected to the main housing 10, the first detection structure 40B and the second detection structure 40C are electrically connected to the first connecting line 45 and the second connecting line 47 respectively.

在本实施例中,将第一连接结构40D和第二连接结构40E设置为分别包括第一连接线45和第二连接线47,使其可以进行弯折布置,进而有利于提高对其主机壳10安装布置的便利性。In this embodiment, the first connection structure 40D and the second connection structure 40E are configured to include a first connection line 45 and a second connection line 47 respectively, so that they can be bent and arranged, thereby facilitating the installation and arrangement of the main housing 10.

请结合参考图6和图7,以及图10至图14,在本申请的一实施例中,第一连接结构40D还包括第一导电件13(可以为具有导电性能的金属材质或者其他材质制备),第二连接结构40E还包括第二导电件15(可以为具有导电性能的金属材质或者其他材质制备);第一导电件13连接于第一连接线45远离控制板40A的一端,第二导电件15连接于第二连接线47远离控制板40A的一端,且第一导电件13和第二导电件15间隔设置;在增高架20处于连接于主机壳10的状态下,第一检测结构40B和第二检测结构40C分别电性连接于第一导电件13和第二导电件15。Please refer to Figures 6 and 7, as well as Figures 10 to 14. In one embodiment of the present application, the first connection structure 40D also includes a first conductive member 13 (which can be made of a metal material with conductive properties or other materials), and the second connection structure 40E also includes a second conductive member 15 (which can be made of a metal material with conductive properties or other materials); the first conductive member 13 is connected to an end of the first connection line 45 away from the control board 40A, and the second conductive member 15 is connected to an end of the second connection line 47 away from the control board 40A, and the first conductive member 13 and the second conductive member 15 are arranged at intervals; when the heightening frame 20 is in a state connected to the main housing 10, the first detection structure 40B and the second detection structure 40C are electrically connected to the first conductive member 13 and the second conductive member 15, respectively.

在本实施例中,第一导电件13和第二导电件15的设置,由于第一导电件13和第二导电件15相较于第一连接线45和第二连接线47具有更大的面积,因此可以方便与增高架20上的第一检测结构40B和第二检测结构40C进行导通。其中,第一检测结构40B和第二检测结构40C可以是分别与第一导电件13和第二导电件15直接接触导通,当然也可以是如下文所介绍的第三接触件70和第四接触件80进行间接的导通。另外,第一导电件13和第二导电件15可以为板体结构、块体结构或者柱体结构等任意形状结构。In this embodiment, the first conductive member 13 and the second conductive member 15 are arranged so that they can be easily connected to the first detection structure 40B and the second detection structure 40C on the heightening frame 20 because the first conductive member 13 and the second conductive member 15 have a larger area than the first connecting line 45 and the second connecting line 47. The first detection structure 40B and the second detection structure 40C can be directly connected to the first conductive member 13 and the second conductive member 15, respectively, or indirectly connected to the third contact member 70 and the fourth contact member 80 as described below. In addition, the first conductive member 13 and the second conductive member 15 can be any shape structure such as a plate structure, a block structure or a column structure.

请结合参考图6和图7,以及图10至图14,在本申请的一实施例中,检测组件40还包括第三接触件70和第四接触件80,第三接触件70被配置为连接第一导电件13和第一检测结构40B,第四接触件80被配置为连接第二导电件15和第二检测结构40C。Please refer to Figures 6 and 7, as well as Figures 10 to 14. In one embodiment of the present application, the detection component 40 also includes a third contact member 70 and a fourth contact member 80. The third contact member 70 is configured to connect the first conductive member 13 and the first detection structure 40B, and the fourth contact member 80 is configured to connect the second conductive member 15 and the second detection structure 40C.

在本实施例中,可以通过第三接触件70和第四接触件80来分别实现与第一检测结构40B和第二检测结构40C连接。此时,由于第三接触件70和第四接触件80分别与第一检测结构40B和第二检测结构40C具有连接关系,进而有利于提高第一连接结构40D与第一检测结构40B,以及第二连接结构40E与第二检测结构40C之间电性连接的稳定性。其中,第三接触件70与第一检测结构40B的连接方式,以及第四接触件80与第二检测结构40C的连接方式可以是如下文所介绍的螺纹连接,当然也可以是卡扣连接或者插接连接等,本申请对第三接触件70与第一检测结构40B的连接方式,以及第四接触件80与第二检测结构40C的连接方式不作出限定。而第三接触件70和第四接触件80与主机壳10可以是分体设置,当然也可以是一体结构,本申请对第三接触件70和第四接触件80主机壳10上的安装方式也不作限定。In this embodiment, the third contact member 70 and the fourth contact member 80 can be used to respectively realize the connection with the first detection structure 40B and the second detection structure 40C. At this time, since the third contact member 70 and the fourth contact member 80 are respectively connected to the first detection structure 40B and the second detection structure 40C, it is beneficial to improve the stability of the electrical connection between the first connection structure 40D and the first detection structure 40B, and the second connection structure 40E and the second detection structure 40C. Among them, the connection method between the third contact member 70 and the first detection structure 40B, and the connection method between the fourth contact member 80 and the second detection structure 40C can be a threaded connection as described below, of course, it can also be a snap connection or a plug connection, etc. This application does not limit the connection method between the third contact member 70 and the first detection structure 40B, and the connection method between the fourth contact member 80 and the second detection structure 40C. The third contact member 70 and the fourth contact member 80 may be separately provided with the main housing 10 , or may be an integrated structure. The present application does not limit the installation method of the third contact member 70 and the fourth contact member 80 on the main housing 10 .

请结合参考图10至图14,在本申请的一实施例中,第三接触件70穿过第一导电件13,并与第一检测结构40B螺纹连接;第四接触件80穿过第二导电件15,并与第二检测结构40C螺纹连接。Please refer to Figures 10 to 14. In one embodiment of the present application, the third contact member 70 passes through the first conductive member 13 and is threadedly connected to the first detection structure 40B; the fourth contact member 80 passes through the second conductive member 15 and is threadedly connected to the second detection structure 40C.

在本实施例中,将第三接触件70和第四接触件80进行穿设安装,同时分别与第一检测结构40B和第二检测结构40C进行螺纹连接,可以使得该第三接触件70和第四接触件80的安装过程均较为简单,从而有利于提高第一连接结构40D与第一检测结构40B,以及第二连接结构40E与第二检测结构40C之间电性连接的便利性和稳定性。其中,需要说明的是,主机壳10可以是直接通过第三接触件70和第四接触件80实现在增高架20上的机械连接。当然,该主机壳10也可以是在此基础上通过额外的螺钉或者卡扣等连接结构进一步地连接于增高架20,从而再次提高主机壳10在增高架20上安装的稳定性。另外,在第一连接结构40D和第二连接结构40E如上文所介绍的分别包括有第一导电件13和第二导电件15时,第三接触件70和第四接触件80可以分别连接第一导电件13与第一检测结构40B,以及第二导电件15与第二检测结构40C。当然,本申请不限于此于其他实施例中,在未设置有第三接触件70和第四接触件80时,主机壳10在增高架20上安装到位后,第一连接结构40D与第一检测结构40B,以及第二连接结构40E与第二检测结构40C分别直接进行抵接导通也是可以的。In this embodiment, the third contact member 70 and the fourth contact member 80 are installed by threading, and are respectively connected to the first detection structure 40B and the second detection structure 40C by threading, so that the installation process of the third contact member 70 and the fourth contact member 80 is relatively simple, which is conducive to improving the convenience and stability of the electrical connection between the first connection structure 40D and the first detection structure 40B, and the second connection structure 40E and the second detection structure 40C. It should be noted that the main housing 10 can be directly mechanically connected to the heightening frame 20 through the third contact member 70 and the fourth contact member 80. Of course, the main housing 10 can also be further connected to the heightening frame 20 on this basis through additional screws or buckles and other connecting structures, thereby further improving the stability of the main housing 10 installed on the heightening frame 20. In addition, when the first connection structure 40D and the second connection structure 40E respectively include the first conductive member 13 and the second conductive member 15 as described above, the third contact member 70 and the fourth contact member 80 can respectively connect the first conductive member 13 and the first detection structure 40B, and the second conductive member 15 and the second detection structure 40C. Of course, the present application is not limited to other embodiments. When the third contact member 70 and the fourth contact member 80 are not provided, after the main housing 10 is installed in place on the heightening frame 20, the first connection structure 40D and the first detection structure 40B, and the second connection structure 40E and the second detection structure 40C can also be directly connected to each other.

请结合参考图10至图14,在本申请的一实施例中,为了方便第三接触件70与第一检测结构40B,以及第四接触件80与第二检测结构40C的连接,第一检测结构40B还可以包括有第一电连接件24和第二电连接件25,第一电连接件24和第二电连接件25可以分别连接在第一检测线41和第二检测线43远离承载台30的一端。此时,第三接触件70可以在穿过第一导电件13后连接于第一电连接件24,第四接触件80在穿过第二导电件15后连接于第二电连接件25。其中,第一电连接件24和第二电连接件25可以为柱体、块体或者板体等任意形状结构。另外,第一电连接件24和第二电连接件25可以嵌设在增高架20内。此时,第一电连接件24和第二电连接件25在增高架20内可以为过盈配合。当然也可以作为嵌件跟随增高架20通过一体注塑成型而提高连接的稳定性。Please refer to Figures 10 to 14. In one embodiment of the present application, in order to facilitate the connection between the third contact 70 and the first detection structure 40B, and the fourth contact 80 and the second detection structure 40C, the first detection structure 40B may also include a first electrical connector 24 and a second electrical connector 25, which may be connected to the first detection line 41 and the second detection line 43 at one end away from the carrier 30, respectively. At this time, the third contact 70 may be connected to the first electrical connector 24 after passing through the first conductive member 13, and the fourth contact 80 may be connected to the second electrical connector 25 after passing through the second conductive member 15. Among them, the first electrical connector 24 and the second electrical connector 25 may be any shape structure such as a column, a block or a plate. In addition, the first electrical connector 24 and the second electrical connector 25 may be embedded in the heightening frame 20. At this time, the first electrical connector 24 and the second electrical connector 25 may be interference fit in the heightening frame 20. Of course, it can also be used as an insert to follow the heightening frame 20 through integral injection molding to improve the stability of the connection.

请结合参考图10至图12,以及图15,在本申请的一实施例中,第一检测结构40B包括电阻411,增高架20和承载台30可选择地连接于主机壳10;在承载台30处于连接于主机壳10的状态下,承载台30能够导通第一连接结构40D和第二连接结构40E。Please refer to Figures 10 to 12, and Figure 15. In one embodiment of the present application, the first detection structure 40B includes a resistor 411, and the heightening frame 20 and the supporting platform 30 can be selectively connected to the main housing 10; when the supporting platform 30 is connected to the main housing 10, the supporting platform 30 can conduct the first connection structure 40D and the second connection structure 40E.

在本实施例中,机架机构100可以具有两种组装状态,第一组装状态为:如图1和图4所示,增高架20连接于主机壳10,承载台30连接于增高架20。第二组装状态为:如图2和图15所示,增高架20未进行安装,承载台30直接连接于主机壳10。因此,如此使得在无需采用增高架20时,可以将增高架20进行拆卸取下,从而有利于进一步加工设备1000对不同高度尺寸的工件的适用性。而进一步地,第一检测结构40B包括电阻411有电阻411,同时主机壳10上 设置有第一连接结构40D和第二连接结构40E。如此使得在机架机构100需要采用第一组装状态时,在承载台30于增高架20上安装到位后,控制板40A、第一连接结构40D、第一检测结构40B、承载台30、第二检测结构40C以及第二连接结构40E所构成的回路导通,使得控制板40A通过第二连接结构40E可以检测到回路导通的电信号,从而判断承载台30安装到位。同时,因为第一检测结构40B包括电阻411,使得控制板40A可以检测到对应该电阻411值的电流的大小,进而判断出增高架20的安装到位。而在机架机构100需要采用第二组装状态时,在承载台30于主机壳10上安装到位后,控制板40A、第一连接结构40D、承载台30以及第二连接结构40E所构成的回路导通,使得控制板40A通过第二连接结构40E可以检测到回路导通的电信号,从而判断承载台30安装到位。同时,由于此时回路中不再具有带有电阻411的第一检测结构40B,使得控制板40A通过第二连接结构40E所检测到的电流大小不同于回路中具有第一检测件41时的电流大小,从而判断增高架20未安装到位。因此,此时可以同时实现对承载台30的安装到位检测,以及对增高架20的安装到位检测,从而提高了检测组件40的检测功能,以便进一步地提高后续加工设备1000在加工时的安全性。其中,电阻411可以设置在如上文所介绍的第一检测线41上。In this embodiment, the frame mechanism 100 can have two assembly states. The first assembly state is: as shown in Figures 1 and 4, the heightened frame 20 is connected to the main housing 10, and the support platform 30 is connected to the heightened frame 20. The second assembly state is: as shown in Figures 2 and 15, the heightened frame 20 is not installed, and the support platform 30 is directly connected to the main housing 10. Therefore, when the heightened frame 20 is not needed, the heightened frame 20 can be disassembled and removed, which is beneficial to further processing the applicability of the equipment 1000 to workpieces of different height sizes. Furthermore, the first detection structure 40B includes a resistor 411 having a resistor 411, and the main housing 10 has a first detection structure 40B having a first detection structure 40B having a second detection structure 40B having a first ... A first connection structure 40D and a second connection structure 40E are provided. In this way, when the rack mechanism 100 needs to adopt the first assembly state, after the load-bearing platform 30 is installed in place on the heightening frame 20, the circuit formed by the control board 40A, the first connection structure 40D, the first detection structure 40B, the load-bearing platform 30, the second detection structure 40C and the second connection structure 40E is connected, so that the control board 40A can detect the electrical signal of the circuit conduction through the second connection structure 40E, thereby judging that the load-bearing platform 30 is installed in place. At the same time, because the first detection structure 40B includes a resistor 411, the control board 40A can detect the magnitude of the current corresponding to the value of the resistor 411, thereby judging that the heightening frame 20 is installed in place. When the rack mechanism 100 needs to adopt the second assembly state, after the carrier 30 is installed in place on the main housing 10, the circuit formed by the control board 40A, the first connection structure 40D, the carrier 30 and the second connection structure 40E is connected, so that the control board 40A can detect the electrical signal of the circuit conduction through the second connection structure 40E, thereby judging that the carrier 30 is installed in place. At the same time, since the first detection structure 40B with the resistor 411 is no longer present in the circuit at this time, the current detected by the control board 40A through the second connection structure 40E is different from the current when the first detection member 41 is present in the circuit, thereby judging that the heightening frame 20 is not installed in place. Therefore, at this time, the detection of the installation position of the carrier 30 and the detection of the installation position of the heightening frame 20 can be realized at the same time, thereby improving the detection function of the detection component 40, so as to further improve the safety of the subsequent processing equipment 1000 during processing. Among them, the resistor 411 can be set on the first detection line 41 as described above.

请结合参考图10至图13,以及图15,在本申请的一实施例中,在增高架20处于连接于主机壳10的状态下,第一接触件50和第二接触件60被配置为安装于承载台30,并分别连接于第一检测结构40B和第二检测结构40C;在承载台30处于连接于主机壳10的情况下,第一接触件50和第二接触件60被配置为安装于承载台30,并分别连接于第一连接结构40D和第二连接结构40E连接。Please refer to Figures 10 to 13, and Figure 15. In one embodiment of the present application, when the height-enhancing frame 20 is connected to the main housing 10, the first contact member 50 and the second contact member 60 are configured to be installed on the supporting platform 30, and are respectively connected to the first detection structure 40B and the second detection structure 40C; when the supporting platform 30 is connected to the main housing 10, the first contact member 50 and the second contact member 60 are configured to be installed on the supporting platform 30, and are respectively connected to the first connection structure 40D and the second connection structure 40E.

在本实施例中,在承载台30安装于增高架20时,可以通过穿设第一接触件50和第二接触件60来分别实现与第一检测结构40B和第二检测结构40C电性连接。在未安装于增高架20,将承载台30直接安装于主机壳10时,可以通过穿设第一接触件50和第二接触件60来分别实现与第一连接结构40D和第二连接结构40E电性连接。此时,均是通过第一接触件50和第二接触件60来将承载台30进行电性连接的,使得采用了相同的结构,进而有利于提高对承载台30在第一组装状态和第二组装状态下的安装的便利性。其中,在第一连接结构40D和第二连接结构40E如上文所介绍的分别包括第一导电件13和第二导电件15,在承载台30处于连接于主机壳10的情况下,第一接触件50和第二接触件60可以分别连接于第一导电件13和第二导电件15。在第一检测结构40B和第二检测结构40C如上文所介绍的分别包括第一导通件22和第二导通件23,在承载台30处于连接增高架20的情况下,第一接触件50和第二接触件60可以分别连接于第一导通件22和第二导通件23。In this embodiment, when the carrier 30 is installed on the heightened frame 20, the first contact member 50 and the second contact member 60 can be inserted to respectively realize electrical connection with the first detection structure 40B and the second detection structure 40C. When the carrier 30 is not installed on the heightened frame 20 and is directly installed on the main housing 10, the first contact member 50 and the second contact member 60 can be inserted to respectively realize electrical connection with the first connection structure 40D and the second connection structure 40E. At this time, the carrier 30 is electrically connected through the first contact member 50 and the second contact member 60, so that the same structure is adopted, which is conducive to improving the convenience of installation of the carrier 30 in the first assembly state and the second assembly state. Among them, the first connection structure 40D and the second connection structure 40E respectively include the first conductive member 13 and the second conductive member 15 as described above. When the carrier 30 is connected to the main housing 10, the first contact member 50 and the second contact member 60 can be connected to the first conductive member 13 and the second conductive member 15 respectively. As described above, the first detection structure 40B and the second detection structure 40C respectively include the first conductive member 22 and the second conductive member 23 . When the support platform 30 is connected to the elevated frame 20 , the first contact member 50 and the second contact member 60 can be connected to the first conductive member 22 and the second conductive member 23 , respectively.

请结合参考图10至图13,在本申请的一实施例中,第一检测线41远离第一电连接件24的一端通过螺接件可拆卸地连接于第一导通件22。Please refer to FIGS. 10 to 13 . In one embodiment of the present application, one end of the first detection line 41 away from the first electrical connector 24 is detachably connected to the first conductive member 22 via a screw connection.

在本实施例中,将第一检测线41通过螺接件连接于第一导通件22,而螺钉连接具有简单、可靠的优点,从而有利于提高两者连接的稳定性和组装的便利性。此时,第一检测线41可以是由端部直接伸入到螺接件和第一导通件22之间,当然也可以在第一检测件41的端部形成套环,通过该套环套设在螺接件的外侧而有利于提高对其夹持的稳定性。In this embodiment, the first detection line 41 is connected to the first conductive member 22 through a screw connection, and the screw connection has the advantages of being simple and reliable, thereby facilitating the stability of the connection between the two and the convenience of assembly. At this time, the first detection line 41 can be directly extended between the screw connection and the first conductive member 22 by the end, and of course, a ring can be formed at the end of the first detection member 41, and the ring is sleeved on the outside of the screw connection to improve the stability of its clamping.

同样的,请结合参考图10至图14,第一检测线41远离第一导通件22的一端也可以通过螺接件可拆卸地连接于第一电连接件24。此时,第一检测线41可以是由端部直接伸入到螺接件和第一电连接线24之间,当然也可以第一检测线41的端部形成套环,通过该套环套设在螺接件的外侧而有利于提高对其夹持的稳定性。Similarly, please refer to Figures 10 to 14, the end of the first detection line 41 away from the first conductive member 22 can also be detachably connected to the first electrical connection member 24 through a screw connection. At this time, the first detection line 41 can be directly extended between the screw connection member and the first electrical connection line 24 by the end, and of course, the end of the first detection line 41 can also form a loop, which is sleeved on the outside of the screw connection to help improve the stability of its clamping.

同样的,请结合参考图10至图13,第二检测线43远离第二电连接件25的一端也可以通过螺接件可拆卸地连接于第二导通件23。此时,第二检测线43可以是由端部直接伸入到螺接件和第二导通件23之间,当然也可以在第二检测件43的端部形成套环,通过该套环套设在螺接件的外侧而有利于提高对其夹持的稳定性。Similarly, please refer to Figures 10 to 13, the end of the second detection line 43 away from the second electrical connector 25 can also be detachably connected to the second conductive member 23 through a screw connection. At this time, the second detection line 43 can be directly extended between the screw connection and the second conductive member 23 by the end, and of course, a ring can be formed at the end of the second detection member 43, and the ring is sleeved on the outside of the screw connection to improve the stability of its clamping.

同样的,请结合参考图10至图13,第二检测线43远离第二导通件23的一端也可以通过螺接件可拆卸地连接于第二电连接件25。此时,第二检测线43可以是由端部直接伸入到螺接件和第二电连接件25之间,当然也可以在第二检测线43的端部形成套环,通过该套环套设在螺接件的外侧而有利于提高对其夹持的稳定性。Similarly, please refer to Figures 10 to 13, the end of the second detection line 43 away from the second conductive member 23 can also be detachably connected to the second electrical connector 25 through a screw connector. At this time, the second detection line 43 can be directly extended between the screw connector and the second electrical connector 25 by the end, and of course, a ring can be formed at the end of the second detection line 43, and the ring is sleeved on the outside of the screw connector to improve the stability of its clamping.

同样的,请结合参考图8至图11,第一导通件22也可以通过螺接件可拆卸地连接于增高架20,以提高对第一导通件22连接的稳定性和便利性。Similarly, please refer to FIG. 8 to FIG. 11 , the first conductive member 22 can also be detachably connected to the heightening frame 20 through a screw connection to improve the stability and convenience of the connection to the first conductive member 22 .

同样的,请结合参考图8至图11,第二导通件23也可以通过螺接件可拆卸地连接于增高架20,以提高对第二导通件23连接的稳定性和便利性。Similarly, please refer to FIG. 8 to FIG. 11 , the second conductive member 23 can also be detachably connected to the heightening frame 20 through a screw connection to improve the stability and convenience of the connection of the second conductive member 23 .

同样的,请结合参考图10和图11,第一导电件13也可以通过螺接件可拆卸地连接于主机壳10,以提高对第一导电件13连接的稳定性和便利性。Similarly, please refer to FIG. 10 and FIG. 11 , the first conductive member 13 may also be detachably connected to the main housing 10 via a screw connection to improve the stability and convenience of the connection to the first conductive member 13 .

同样的,请结合参考图8和图11,第二导电件15也可以通过螺接件可拆卸地连接于主机壳10,以提高对第二导电件15连接的稳定性和便利性。Similarly, please refer to FIG. 8 and FIG. 11 , the second conductive member 15 can also be detachably connected to the main housing 10 via a screw connection to improve the stability and convenience of the connection to the second conductive member 15 .

同样的,请结合参考图10至图12,以及图14,第一连接线45远离控制板40A的一端也可以通过螺接件可拆卸地连接于第一导电件13。此时,第一连接线45可以是由端部直接伸入到螺接件和第一导电件13之间,当然也可以第一连接线45的端部形成套环,通过该套环套设在螺接件的外侧而有利于提高对其夹持的稳定性。Similarly, please refer to Figures 10 to 12 and Figure 14, the end of the first connecting line 45 away from the control board 40A can also be detachably connected to the first conductive member 13 through a screw connection. At this time, the first connecting line 45 can be directly extended between the screw connection and the first conductive member 13 by the end, and of course, the end of the first connecting line 45 can also form a ring, which is sleeved on the outside of the screw connection to help improve the stability of its clamping.

同样的,请结合参考图10至图12,以及图14,第二连接线47远离控制板40A的一端也可以通过螺接件可拆卸地连接于第二导电件15。此时,第二连接线47可以是由端部直接伸入到螺接件和第二导电件15之间,当然也可以在第二连接件47的端部形成套环,通过该套环套设在螺接件的外侧而有利于提高对其夹持的稳定性。Similarly, please refer to Figures 10 to 12 and Figure 14, the end of the second connecting wire 47 away from the control board 40A can also be detachably connected to the second conductive member 15 through a screw connection. At this time, the second connecting wire 47 can be directly extended between the screw connection and the second conductive member 15 by the end, and of course, a ring can be formed at the end of the second connecting member 47, and the ring is sleeved on the outside of the screw connection to help improve the stability of its clamping.

请参考图14,在本申请的一实施例中,第一导电件13和第二导电件15的外侧包裹有绝缘套17。Please refer to FIG. 14 . In one embodiment of the present application, the first conductive member 13 and the second conductive member 15 are wrapped with an insulating sleeve 17 on their outer sides.

在本实施例中,于第一导电件13和第二导电件15外侧设置有绝缘套17,使得可以隔离第一导电件13和第二导电件15与主机壳10之间的电性导通,从而有利于提高加工设备1000在使用过程中的安全性。In this embodiment, an insulating sleeve 17 is provided outside the first conductive member 13 and the second conductive member 15, so that the electrical conduction between the first conductive member 13 and the second conductive member 15 and the main housing 10 can be isolated, thereby facilitating improving the safety of the processing equipment 1000 during use.

请结合参考图10至图12,在本申请的一实施例中,第一检测结构40B的数量为至少两个。Please refer to FIG. 10 to FIG. 12 . In one embodiment of the present application, the number of the first detection structures 40B is at least two.

在本实施例中,第一检测件41的数量可以为至少两个,使得控制板40A可以通过至少两个回路对承载台30进行在位检测。此时,即便一个回路发生损坏,还可以通过另一个回路进行安装到位检测,从而有利于提高对承载台30在位检测的准确性,以便提高后续加工设备1000使用的安全性。其中,第一检测结构40B的数量可以为两个,三个或者更多个,而对应设置的第一连接结构40D的数量也可以均为两个,三个或者更多个。此时,第二检测结构40C的数量可以为一个,也即至少两个第一检测件41可以共用一个第二检测件43作为回路。当然,该第二检测结构40C的数量也可以对应第一检测结构40B的数量进行设置。In the present embodiment, the number of the first detection members 41 may be at least two, so that the control board 40A can perform in-situ detection on the carrier 30 through at least two loops. At this time, even if one loop is damaged, it can be installed in place through another loop for detection, which is conducive to improving the accuracy of in-situ detection of the carrier 30, so as to improve the safety of subsequent processing equipment 1000. Among them, the number of the first detection structure 40B can be two, three or more, and the number of the corresponding first connection structures 40D can also be two, three or more. At this time, the number of the second detection structure 40C can be one, that is, at least two first detection members 41 can share a second detection member 43 as a loop. Of course, the number of the second detection structure 40C can also be set corresponding to the number of the first detection structure 40B.

请结合参考图8至图11,在本申请的一实施例中,增高架20包括内围板26、安装板27以及外围板28,内围板26围合形成容纳腔21;安装板27连接于内围板26,并沿第一腔口211的周缘环绕设置,安装板27连接于主机壳10;外 围板28连接于安装板27,并间隔环绕于内围板26的外侧,第一检测结构40B和第二检测结构40C的至少部分设于外围板28、安装板27以及内围板26围合形成的空间内。Please refer to Figures 8 to 11. In one embodiment of the present application, the heightened frame 20 includes an inner panel 26, a mounting plate 27, and an outer panel 28. The inner panel 26 encloses the accommodating cavity 21. The mounting plate 27 is connected to the inner panel 26 and is arranged around the periphery of the first cavity 211. The mounting plate 27 is connected to the main housing 10. The enclosure plate 28 is connected to the mounting plate 27 and surrounds the outer side of the inner enclosure plate 26 at intervals. At least part of the first detection structure 40B and the second detection structure 40C are arranged in the space enclosed by the outer enclosure plate 28, the mounting plate 27 and the inner enclosure plate 26.

在本实施例中,增高架20包括内围板26、安装板27以及外围板28,使得增高架20通过安装板27可以具有较大的接触面积,从而有利于提高对主机壳10连接的便利性和支撑的稳定性。同时,通过内围板26、安装板27以及外围板28还可以围合形成空间,以便对第一检测结构40B和第二检测结构40C的至少部分进行隐藏式设置而提高对其的防护效果。In this embodiment, the heightened frame 20 includes an inner panel 26, a mounting plate 27, and an outer panel 28, so that the heightened frame 20 can have a larger contact area through the mounting plate 27, thereby facilitating the convenience of connection with the main housing 10 and the stability of support. At the same time, the inner panel 26, the mounting plate 27, and the outer panel 28 can also enclose a space to conceal at least part of the first detection structure 40B and the second detection structure 40C to improve the protection effect thereof.

请结合参考图1至图5,本申请还提出一种加工设备1000,该加工设备1000包括机架机构100,该机架机构100的具体结构参照上述实施例,由于本加工设备1000采用了上述所有实施例的全部技术方案,因此至少具有上述实施例的技术方案所带来的所有效果,在此不再一一赘述。其中,该加工设备1000可以为激光加工设备,以实现对工件进行切割加工或者雕刻加工等。当然,该加工设备1000也可以为采用刀具进行切割,或者是采用钻头进行打孔的刀具加工设备,本申请对加工设备1000的具体类型不作限定。Please refer to Figures 1 to 5. The present application also proposes a processing device 1000, which includes a frame mechanism 100. The specific structure of the frame mechanism 100 refers to the above embodiment. Since the present processing device 1000 adopts all the technical solutions of all the above embodiments, it at least has all the effects brought by the technical solutions of the above embodiments, which will not be described one by one here. Among them, the processing device 1000 can be a laser processing device to achieve cutting or engraving of the workpiece. Of course, the processing device 1000 can also be a tool processing device that uses a tool for cutting, or a tool processing device that uses a drill bit for drilling. The present application does not limit the specific type of the processing device 1000.

进一步地,机架机构100的主机壳10设有加工空间10a和连通加工空间10a的取放口10b,机架机构100还包括盖板90,盖板90可打开和封盖取放口10b,增高架20的第一腔口211连通加工空间10a;加工设备1000还包括轨道装置300和加工装置400,轨道装置300设于加工空间10a内,加工装置400连接于轨道装置300,轨道装置300被配置为驱动加工装置400移动。如此通过轨道装置300驱动加工装置400移动,方便实现对加工件进行移动加工,而取放口10b和盖板90的设置,则方便取放加工件。Furthermore, the main housing 10 of the frame mechanism 100 is provided with a processing space 10a and a pick-up and release port 10b connected to the processing space 10a, the frame mechanism 100 further includes a cover plate 90, the cover plate 90 can open and cover the pick-up and release port 10b, and the first cavity 211 of the heightened frame 20 is connected to the processing space 10a; the processing equipment 1000 further includes a track device 300 and a processing device 400, the track device 300 is provided in the processing space 10a, the processing device 400 is connected to the track device 300, and the track device 300 is configured to drive the processing device 400 to move. In this way, the track device 300 drives the processing device 400 to move, so as to facilitate the mobile processing of the workpiece, and the provision of the pick-up and release port 10b and the cover plate 90 facilitates the pick-up and placement of the workpiece.

以上所述仅为本申请的可选实施例,并非因此限制本申请的专利范围,凡是在本申请的发明构思下,利用本申请说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。 The above description is only an optional embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application specification and drawings under the inventive concept of the present application, or directly/indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims (22)

一种机架机构,其中,包括:A rack mechanism, comprising: 主机壳,所述主机壳用于容置加工装置;A main housing, the main housing being used to accommodate the processing device; 增高架,所述增高架用于垫高所述主机壳,所述增高架设有容纳腔,所述容纳腔具有呈相对设置的第一腔口和第二腔口,所述第一腔口连通所述主机壳;A heightening frame, the heightening frame is used to raise the main housing, the heightening frame is provided with a receiving cavity, the receiving cavity has a first cavity opening and a second cavity opening which are arranged opposite to each other, and the first cavity opening is connected with the main housing; 承载台,所述承载台可拆卸地安装于所述增高架,并可封盖所述第二腔口;以及a carrying platform, which is detachably mounted on the heightening frame and can cover the second cavity; and 检测组件,所述检测组件包括控制板、第一检测结构以及第二检测结构,第一检测结构和第二检测结构分别电性连接所述控制板;A detection component, the detection component comprising a control board, a first detection structure and a second detection structure, the first detection structure and the second detection structure are electrically connected to the control board respectively; 其中,在所述承载台处于安装于所述增高架的状态下,所述承载台能够导通所述第一检测结构和所述第二检测结构。Wherein, when the supporting platform is installed on the height-enhancing frame, the supporting platform can conduct the first detection structure and the second detection structure. 如权利要求1所述的机架机构,其中,所述承载台的材质为导电材料。The frame mechanism according to claim 1, wherein the support platform is made of a conductive material. 如权利要求1所述的机架机构,其中,所述第一检测结构包括第一检测线,所述第二检测结构包括第二检测线,所述第一检测线和所述第二检测线分别电性连接于所述控制板;The rack mechanism according to claim 1, wherein the first detection structure comprises a first detection line, the second detection structure comprises a second detection line, and the first detection line and the second detection line are electrically connected to the control board respectively; 在所述承载台处于连接于所述增高架的状态下,所述承载台能够导通所述第一检测线和第二检测线。When the carrying platform is connected to the heightening frame, the carrying platform can conduct the first detection line and the second detection line. 如权利要求3所述的机架机构,其中,所述第一检测结构还包括第一导通件,所述第二检测结构还包括第二导通件;The rack mechanism according to claim 3, wherein the first detection structure further comprises a first conductive member, and the second detection structure further comprises a second conductive member; 所述第一导通件连接于所述第一检测线远离所述控制板的一端,所述第二导通件连接于所述第二检测线远离所述控制板的一端,且所述第一导通件和所述第二导通件间隔设置;The first conductive member is connected to one end of the first detection line away from the control board, the second conductive member is connected to one end of the second detection line away from the control board, and the first conductive member and the second conductive member are arranged at intervals; 在所述承载台处于连接于所述增高架的状态下,所述承载台能够导通所述第一导通件和所述第二导通件。When the supporting platform is connected to the heightening frame, the supporting platform can conduct electricity between the first conducting member and the second conducting member. 如权利要求1所述的机架机构,其中,所述检测组件还包括第一接触件和第二接触件,所述第一接触件和所述第二接触件被配置为安装于所述承载台;The rack mechanism according to claim 1, wherein the detection assembly further comprises a first contact member and a second contact member, the first contact member and the second contact member being configured to be mounted on the carrier platform; 在所述承载台处于安装于所述增高架的状态下,第一接触件和第二接触件分别与所述第一检测结构和所述第二检测结构连接。When the supporting platform is installed on the height-enhancing frame, the first contact member and the second contact member are connected to the first detection structure and the second detection structure respectively. 如权利要求5所述的机架机构,其中,在所述承载台处于安装于所述增高架的状态下,所述承载台与第一接触件和第二接触件接触,以导通所述第一接触件和第二接触件。The rack mechanism according to claim 5, wherein, when the carrier is in a state of being mounted on the elevated frame, the carrier contacts the first contact piece and the second contact piece to conduct the first contact piece and the second contact piece. 如权利要求5所述的机架机构,其中,所述第一接触件和所述第二接触件穿过所述承载台,并分别与所述第一检测结构和所述第二检测结构螺纹连接。The frame mechanism according to claim 5, wherein the first contact member and the second contact member pass through the carrier platform and are threadedly connected to the first detection structure and the second detection structure respectively. 如权利要求1所述的机架机构,其中,在所述承载台处于安装于所述增高架的状态下,所述承载台与所述第一检测结构和第二检测结构接触,以导通所述第一检测结构和第二检测结构。The frame mechanism according to claim 1, wherein, when the bearing platform is installed on the heightened frame, the bearing platform contacts the first detection structure and the second detection structure to conduct the first detection structure and the second detection structure. 如权利要求1至8中任意一项所述的机架机构,其中,所述第一检测结构和所述第二检测结构设于所述增高架,所述增高架可拆卸地连接于所述主机壳;The rack mechanism according to any one of claims 1 to 8, wherein the first detection structure and the second detection structure are provided on the heightened frame, and the heightened frame is detachably connected to the main housing; 所述控制板设于所述主机壳,所述检测组件还包括第一连接结构和第二连接结构,所述第一连接结构和第二连接结构分别电性连接于所述控制板;The control board is arranged on the main housing, and the detection assembly further comprises a first connection structure and a second connection structure, wherein the first connection structure and the second connection structure are respectively electrically connected to the control board; 在所述增高架处于连接于所述主机壳的状态下,所述第一检测结构和所述第二检测结构分别电性连接于所述第一连接结构和所述第二连接结构。When the height-enhancing frame is connected to the main housing, the first detection structure and the second detection structure are electrically connected to the first connection structure and the second connection structure, respectively. 如权利要求9所述的机架机构,其中,所述第一检测结构包括电阻,所述增高架和所述承载台可选择地连接于所述主机壳;The rack mechanism of claim 9, wherein the first detection structure comprises a resistor, and the heightened rack and the support platform are selectively connectable to the main housing; 在所述承载台处于连接于所述主机壳的状态下,所述承载台能够导通所述第一连接结构和所述第二连接结构。When the carrying platform is connected to the main housing, the carrying platform can conduct the first connection structure and the second connection structure. 如权利要求10所述的机架机构,其中,所述检测组件还包括第一接触件和第二接触件,所述第一接触件和所述第二接触件被配置为安装于所述承载台;The rack mechanism according to claim 10, wherein the detection assembly further comprises a first contact member and a second contact member, the first contact member and the second contact member being configured to be mounted on the carrier platform; 其中,在所述承载台处于连接于所述增高架的状态下,所述第一接触件和所述第二接触件分别与所述第一检测结构和所述第二检测结构连接;Wherein, when the supporting platform is connected to the heightening frame, the first contact member and the second contact member are connected to the first detection structure and the second detection structure respectively; 在所述承载台处于连接于所述主机壳的状态下,所述第一接触件和所述第二接触件分别与所述第一连接结构和所述第二连接结构连接。When the supporting platform is connected to the main housing, the first contact piece and the second contact piece are connected to the first connecting structure and the second connecting structure respectively. 如权利要求9所述的机架机构,其中,所述第一连接结构包括第一连接线,所述第二连接结构包括第二连接线,所述第一连接线和所述第二连接线分别电性连接于所述控制板;The rack mechanism according to claim 9, wherein the first connection structure comprises a first connection line, the second connection structure comprises a second connection line, and the first connection line and the second connection line are electrically connected to the control board respectively; 在所述增高架处于连接于所述主机壳的状态下,所述第一检测结构和所述第二检测结构分别电性连接于所述第一连接线和所述第二连接线。When the heightening frame is connected to the main housing, the first detection structure and the second detection structure are electrically connected to the first connection line and the second connection line respectively. 如权利要求12所述的机架机构,其中,所述第一连接结构还包括第一导电件,所述第二连接结构还包括第二导电件;The frame mechanism according to claim 12, wherein the first connection structure further comprises a first conductive member, and the second connection structure further comprises a second conductive member; 所述第一导电件连接于所述第一连接线远离所述控制板的一端,所述第二导电件连接于所述第二连接线远离所述控制板的一端,且所述第一导电件和所述第二导电件间隔设置; The first conductive member is connected to one end of the first connecting line away from the control board, the second conductive member is connected to one end of the second connecting line away from the control board, and the first conductive member and the second conductive member are spaced apart; 在所述增高架处于连接于所述主机壳的状态下,所述第一检测结构和所述第二检测结构分别电性连接于所述第一导电件和所述第二导电件。When the heightening frame is connected to the main housing, the first detection structure and the second detection structure are electrically connected to the first conductive member and the second conductive member respectively. 如权利要求9所述的机架机构,其中,所述检测组件还包括第三接触件和第四接触件,所述第三接触件被配置为连接所述第一导电件和所述第一检测结构,所述第四接触件被配置为连接第二导电件和所述第二检测结构。The rack mechanism of claim 9, wherein the detection assembly further comprises a third contact and a fourth contact, the third contact being configured to connect the first conductive member and the first detection structure, and the fourth contact being configured to connect the second conductive member and the second detection structure. 如权利要求14所述的机架机构,其中,所述第三接触件穿过所述第一导电件,并与所述第一检测结构螺纹连接;The rack mechanism according to claim 14, wherein the third contact member passes through the first conductive member and is threadedly connected to the first detection structure; 所述第四接触件穿过所述第二导电件,并与所述第二检测结构螺纹连接。The fourth contact member passes through the second conductive member and is threadedly connected to the second detection structure. 如权利要求9所述的机架机构,其中,所述第一检测结构包括相连接的第一检测线和第一电连接件,所述第二检测结构包括相连接的第二检测线和第二电连接件;The rack mechanism of claim 9, wherein the first detection structure comprises a first detection line and a first electrical connector connected thereto, and the second detection structure comprises a second detection line and a second electrical connector connected thereto; 第一电连接件和所述第二电连接件分别电性连接于所述第一连接结构和所述第二连接结构,所述承载台能够导通所述第一检测线和第二检测线。The first electrical connector and the second electrical connector are electrically connected to the first connection structure and the second connection structure respectively, and the supporting platform can conduct the first detection line and the second detection line. 如权利要求9所述的机架机构,其中,所述增高架具有第一表面,所述第一腔口贯穿所述第一表面,所述第一检测结构电性连接于所述第一连接结构的一端和所述第二检测结构电性连接于所述第二连接结构的一端设于所述第一表面;The rack mechanism according to claim 9, wherein the heightened frame has a first surface, the first cavity passes through the first surface, and the first detection structure is electrically connected to one end of the first connection structure and the second detection structure is electrically connected to one end of the second connection structure and is disposed on the first surface; 所述主机壳具有朝向所述第一表面的第二表面,所述第一连接结构电性连接于所述第一检测结构的一端和所述第二连接结构电性连接于所述第二检测结构的一端设于所述第二表面。The main housing has a second surface facing the first surface, and one end of the first connection structure electrically connected to the first detection structure and one end of the second connection structure electrically connected to the second detection structure are arranged on the second surface. 如权利要求1所述的机架机构,其中,所述第一检测结构的数量为至少两个。The frame mechanism according to claim 1, wherein the number of the first detection structures is at least two. 如权利要求1所述的机架机构,其中,所述增高架包括内围板、安装板以及外围板,所述内围板围合形成所述容纳腔;所述安装板连接于所述内围板,并沿所述第一腔口的周缘环绕设置,所述安装板连接于所述主机壳;所述外围板连接于所述安装板,并间隔环绕于所述内围板的外侧,所述第一检测结构和所述第二检测结构的至少部分设于所述外围板、所述安装板以及所述内围板围合形成的空间内。The frame mechanism according to claim 1, wherein the heightened frame comprises an inner panel, a mounting plate and an outer panel, the inner panel encloses the accommodating cavity; the mounting plate is connected to the inner panel and is arranged around the periphery of the first cavity opening, and the mounting plate is connected to the main housing; the outer panel is connected to the mounting plate and is spaced around the outer side of the inner panel, and at least part of the first detection structure and the second detection structure are arranged in a space enclosed by the outer panel, the mounting plate and the inner panel. 一种加工设备,其中,包括如权利要求1至19中任意一项所述的机架机构。A processing equipment, comprising a frame mechanism as described in any one of claims 1 to 19. 如权利要求20所述的加工设备,其中,所述机架机构的所述主机壳设有加工空间和连通所述加工空间的取放口,所述机架机构还包括盖板,所述盖板可打开和封盖所述取放口,所述增高架中的所述第一腔口连通所述加工空间;所述加工设备还包括轨道装置和加工装置,所述轨道装置设于所述加工空间内,所述加工装置连接于所述轨道装置,所述轨道装置被配置为驱动所述加工装置移动。The processing equipment as claimed in claim 20, wherein the main housing of the frame mechanism is provided with a processing space and a pick-up and release port connected to the processing space, the frame mechanism further includes a cover plate, the cover plate can open and cover the pick-up and release port, the first cavity in the heightened frame is connected to the processing space; the processing equipment further includes a track device and a processing device, the track device is provided in the processing space, the processing device is connected to the track device, and the track device is configured to drive the processing device to move. 如权利要求20所述的加工设备,其中,所述加工设备为激光加工设备。 The processing equipment according to claim 20, wherein the processing equipment is a laser processing equipment.
PCT/CN2024/102480 2023-06-29 2024-06-28 Frame mechanism and processing apparatus Pending WO2025002382A1 (en)

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CN202421460298.XU CN222818183U (en) 2023-06-29 2024-06-21 Rack mechanism and processing equipment

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