WO2024246771A1

WO2024246771A1 - A lighting device

Info

Publication number: WO2024246771A1
Application number: PCT/IB2024/055215
Authority: WO
Inventors: Shirish Devidas Deshpande
Original assignee: Shirish Devidas Deshpande
Priority date: 2023-05-29
Filing date: 2024-05-29
Publication date: 2024-12-05

Abstract

The present disclosure provides a lighting device (200) The lighting device (200) includes a printed circuit board (PCB) (180) and at least one light source (110) mounted on the PCB (180). Further, a space between a lens (120) and the PCB (180) forms a frontal heat cavity (150). Furthermore, the lighting device (200) includes the rear heat sink (160) mounted on the rear side. Moreover, the rear heat sink is provided with at least one hole (161). Also, one or more heat conducting element (140) are configured to conduct heat from the frontal heat cavity (150) to the atmosphere. In addition, a first end (141) of the each of the one or more heat conducting element (140) being disposed within the frontal heat cavity (150) through the at least one hole (161), and a second end (142) is provided with an entrapment (190) exposed to atmosphere.

Description

A LIGHTING DEVICE

CROSS-REFERENCE TO RELATED APPLICATIONS AND PRIORITY

The present application claims priority from the Indian provisional application number 202321037079 filed on May 29^th 2023.

FIELD OF INVENTION

The present subject matter described herein, in general, relates to a lighting device. More particularly, the present subject matter relates to a thermal management apparatus for lighting devices.

BACKGROUND OF THE INVENTION

Thermal management is crucial for optimum performance of electric or electronic devices. In general, the current lighting technology such as LEDs has revolutionized the lighting industry by offering significant advantages over traditional lighting sources. The present lighting devices facilitates enhanced energy efficiency, extended lifespan, and superior performance in a variety of applications. However, despite these benefits, LEDs are not immune to certain limitations and challenges, particularly those associated with prolonged exposure to heat. The heating of LEDs over extended periods presents several critical issues that impact their performance, longevity, and safety. The maximum temperature should not cross a certain limit to avoid damage to the electronic devices such as LED.

Now, particularly focusing on lighting devices a huge amount energy is lost in form of heat energy within the lighting unit. Therefore, to dissipate this heat, heat sinks are used in the lighting device assemblies. Further, in conventional practice the heat accumulated at the base or the rear side of the lighting device, or the PCB of the lighting device is removed. Problem with this arrangement is that the heat which is on the rear side of the lighting device gets easily dissipated but the heat from frontal side of lighting device is trapped. Thus, the thermal gradient is created where the heat at front side of the lighting device is more than the rear side of the lighting device.

The temperature of the LEDs or lighting devices varies according to the point of measurement. The junction temperature ‘Tj ’ is the LED's active region; the point at which the diode connects to the base. At junctions the electrons jump between the two semiconductors to produce photons. It is the highest temperature in the LED assembly. Next is the solderpoint temperature ‘Tsp’ which represents the transition from the active thermal path from the LED package to the soldering surfaces of the circuit board. Next is the surface temperature of the phosphorous ‘Tp’ it is defined as the temperature of the phosphorous (LES surface) surface in the LED. In addition to that ambient temperature ‘ Ta’ is measured to indicate the air temperature of any obj ect or environment where equipment is active. Generally, the maximum ‘ Tj ’ junction temperature is allowable around 120° C - 150° C. If Tj reaches beyond specified temperature, then the P-N junction breaks down and the LED dies. Therefore, it is required to keep the ‘Tj ’ within a tolerable limit. Further, ‘Tsp’ which is generally lower than the ‘Tj ’ should also be within tolerable limit.

Therefore, in such cases the heat trapped in between the LED and the lens or a frontal heat cavity must be removed. To overcome this problem an additional heat sink, known as frontal heat sink, is mounted on the front side of the lighting device, in such a way that the fins of the frontal heat sink are surrounding the light source. However, the problem with this arrangement is that the heat from the front side of the lighting device is removed but temperature of the light emitting surface of the light source (i.e. LED) is still higher than the temperature of surroundings. Further, this method is not effective to remove the heat trapped in the frontal heat cavity. Further, sometimes due to dimensional limitations it is difficult to attach at frontal heat sink in the lighting devices. Further, in prior art in order to improve the heat transfer more fins with complicated designs are used. However, this approach makes the lighting device bulky and oversize. Further, increasing the volume of the heat sink material makes no significant impact on the efficiency of the heat dissipation, but increases cost of the lighting device.

In another concern, the present solutions provide cooling provisions for lighting device but the repeated heating and cooling cycles withing the lighting device can induce thermal stress in LED components. This stress can cause material fatigue, leading to the cracking and delamination of encapsulants, and compromising the integrity of solder joints and connectors. Such mechanical failures can significantly impair the functionality and reliability of the lighting device.

In yet another concern with prolonged heating is that heat is a critical factor in the degradation of electronic components within LED lighting systems. Drivers, which provide the necessary power regulation, are particularly susceptible to heat-induced failures. Capacitors, especially electrolytic capacitors, also experience reduced operational life when exposed to elevated temperatures, leading to premature failures and increased maintenance requirements. In yet another concern with prolonged heating relates to the operational lifespan of LEDs is adversely affected by high temperatures. Accelerated aging due to prolonged heat exposure can shorten the overall life expectancy of the LED lighting device. Furthermore, LEDs emit lesser lumen at higher temperatures, resulting in increased power consumption and decreased light output. This phenomenon, known as thermal runaway, can create a feedback loop where rising temperatures lead to higher current draw, further exacerbating heat generation and potentially leading to catastrophic failure.

In general, one of the primary concerns with prolonged heating is the degradation of luminous output. Over time, exposure to high temperatures can lead to a reduction in the brightness of LEDs, a phenomenon known as luminous decay. Additionally, sustained heat can cause a colour shift in the emitted light, altering the intended lighting effect and potentially reducing the quality of illumination. Further, in outdoor applications such as street lighting or any other industrial lighting, the lighting devices are exposed to varied harsh weather conditions such as raining, storms, dust and pollution. If any of these external bodies enter into the LED then the illumination of LED lowers which lowers the quality of illumination. Further, water or ice particles inside the lighting device can create hazards such as short circuit.

In yet another concern with prolonged exposure to high temperatures can cause deformation of materials used in LED assemblies, such as plastic lenses and housings. This deformation can affect both the structural integrity and optical performance of the device. Adhesives used in the assembly may degrade, causing components to shift or detach. Additionally, lenses can acquire yellow tint or may become opaque or crack due to thermal stress, impacting light transmission and distribution.

In yet another concern with prolonged high temperatures in metal components, lead to deformation that impairs electrical connections and overall device functionality. Heat can also promote undesirable chemical reactions within the LED package or between different materials, resulting in contamination and degradation of the LED.

In yet another concern with prolonged heating relates to overheating which poses significant safety risks, including potential fire hazards if the device is not adequately designed for thermal management. High surface temperatures can also present a burn risk to users who come into contact with the lighting device. In yet another concern with prolonged heating of LEDs lead to increased maintenance and replacement costs. Frequent component failures and reduced lifespan negate some of the economic advantages of LEDs, such as their longer life compared to traditional lighting sources.

In yet another concern with prolonged heating of LEDs lead to increased maintenance and replacement costs. Frequent component failures and reduced lifespan negate some of the economic advantages of LEDs, such as their longer life compared to traditional lighting sources.

Also, the prior existing solution discloses provision of heat conducting element at the front side of the lighting device. More particularly, the heat conducting element are inserted throughout the lens or gasket provided at the front side of the lighting device. This arrangement challenges the structural integrity and strength of the lighting device. The heat conducting element in contact with the rubber like material in gasket and plastic or glass like material in the lens may undergo damage due to prolonged heat conduction by heat conducting element. Further, the heat conducting element placed at the front side of the lens may cause disturbance in the illumination. Therefore, there is need of providing heat conducting element at suitable location to ensure extraction of heat from the frontal cavity.

These problems highlight the critical need for effective thermal management solutions in lighting devices. Addressing these challenges is essential to improving the reliability, safety, and performance of LED technology, ensuring its continued adoption and success in various lighting applications.

Therefore, to overcome the existing challenges, an improved lighting device is required, which can effectively perform thermal management of lighting devices.

SUMMARY OF THE INVENTION

Before the present system (or apparatus), and its components are described, it is to be understood that this disclosure is not limited to the system and its arrangement as described, as there can be multiple possible embodiments which are not expressly illustrated in the present disclosure. It is also to be understood that the terminology used in the description is for the purpose of describing the versions or embodiments only and is not intended to limit the scope of the present application. This summary is not intended to identify essential features of the claimed subject matter nor is it intended for use in detecting or limiting the scope of the claimed subject matter In one non-limiting example embodiment, a lighting device is disclosed. Further, the lighting device discloses a printed circuit board (PCB). Furthermore, at least one light source is mounted on the PCB. Further, a gasket mounted around a periphery of the PCB is disclosed. Moreover, the lighting device includes a lens mounted on the gasket. Further, a space between the lens and the PCB forms a frontal heat cavity . In addition, the lighting device includes a rear heat sink mounted on a rear side of the PCB . Further, at least one hole in the rear heat sink is disclosed. Furthermore, the lighting device discloses one or more heat conducting element. Further, a first end of each of the one or more heat conducting dementis disposed within the frontal heat cavity, and a second end of each of the one or more heat conducting dementis exposed to atmosphere having a lower heat potential. Furthermore, the first end of the each of the one or more heat conducting element being disposed within the frontal heat cavity through the at least one hole in the rear heat sink. Moreover, the one or more heat conducting element is configured to transfer heat from the frontal heat cavity to the atmosphere having lower heat potential.

In one example embodiment, the one or more heat conducting element may include a hollow structure and is configured to extract heat from the frontal heat cavity to the atmosphere.

In another example embodiment, the lighting device may include an air pump connected to the one or more heat conducting element to facilitate heat removal from the frontal heat cavity to the atmosphere through forced convection.

In yet another example embodiment, an entrapment may be attached to the second end of the one or more heat conducting element. Further, the entrapment may include an insertion zone configured to allow insertion of the second end of the one or more heat conducting element.

In yet another example embodiment, the entrapment may include a gripping element fixed in the insertion zone and configured to allow fixation of the one or more heat conducting element. Further, the entrapment may be removable and may include a hollow structure.

In yet another example embodiment, the entrapment may include apertures configured to inhibit liquid flow into the entrapment. Further, the apertures may enable air to flow into the entrapment and configured to remove air from the entrapment. Furthermore, the apertures may be located diagonally opposite on the entrapment to enable crossflow of air trapped in the entrapment.

In yet another example embodiment, the entrapment may include an aero-dynamic shape. Further, the outer surface of the entrapment may be coated with a liquid-resistant coating. In yet another example embodiment, the first end of the one or more heat conducting element may be funnel-shaped to increase a cross-sectional area for heat transfer. Further, the second end of the one or more heat conducting element may be curved downward to prevent liquid entry.

In yet another example embodiment, the one or more heat conducting element may include a solid structure and may be configured to conduct heat from the frontal heat cavity to the atmosphere.

In yet another example embodiment, an insulating material may be provided around the periphery of the at least one hole of the rear heat sink.

In yet another example embodiment, a profile of the one or more heat conducting element may be at least one of cylindrical, helical, s-shape, u-shape, t-shape, or combination thereof. Further, the one or more heat conducting element may be made from a material selected from at least one of metal, semi-metal, alloy, ceramic, graphite, and combination thereof.

In yet another example embodiment, the rear heat sink may include a plurality of fins extending outwardly from its surface.

In yet another example embodiment, the lighting device may include one or more sensors such as a temperature sensor mounted on the PCB and configured to monitor the temperature within the frontal heat cavity. Further, the temperature sensor may be operatively connected to a control unit that adjusts the power supplied to the at least one light source based on the monitored temperature to prevent overheating.

In yet another example embodiment, the lighting device may include a wireless communication module configured to transmit operational data of the lighting device to an external device. Further, the operational data may include temperature, humidity, and light source status, enabling remote monitoring and control of the lighting device.

BRIEF DESCRIPTION OF DRAWINGS

Having thus described the invention in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein:

Figure 1 illustrates a thermal management apparatus (100), in accordance with various embodiment of the present disclosure; Figure 2A illustrates a side view of a lighting device (200), in accordance with various embodiment of the present disclosure;

Figure 2B illustrates a top view of the lighting device (200), in accordance with various embodiment of the present disclosure;

Figure 2C illustrates a front view of the lighting device (200), in accordance with various embodiment of the present disclosure; and

Figure 3 illustrates an entrapment (190), in accordance with various embodiment of the present disclosure.

It should be noted that the accompanying figures are intended to present illustrations of exemplary embodiments of the present disclosure. These figures are not intended to limit the scope of the present disclosure. It should also be noted that accompanying figures are not necessarily drawn to scale.

DETAILED DESCRIPTION

Reference throughout the specification to “various embodiments,” “some embodiments,” “one embodiment,” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases “in various embodiments,” “in some embodiments,” “in one embodiment,” or “in an embodiment” in places throughout the specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments.

The words "comprising," "having," "includes," "comprises," "containing," and "including," and other forms thereof, are intended to be equivalent in meaning and be open ended in that an item or items following any one of these words is not meant to be an exhaustive listing of such item or items or meant to be limited to only the listed item or items. It must also be noted that, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. For example, the term “an article” may include a plurality of articles unless the context clearly dictates otherwise. Although any methods similar or equivalent to those described herein can be used in the practice or testing of embodiments of the present disclosure, the exemplary methods are described. The disclosed embodiments are merely exemplary of the disclosure, which may be embodied in various forms. Various modifications to the embodiment may be readily apparent to those skilled in the art and the generic principles herein may be applied to other embodiments. However, one of ordinary skill in the art may readily recognize that the present disclosure is not intended to be limited to the embodiments illustrated but is to be accorded the widest scope consistent with the principles and features described herein. The detailed description of the invention will be described hereinafter referring to accompanied drawings.

As required, detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention, which can be embodied in various forms. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present invention in virtually any appropriately detailed structure. Further, the terms and phrases used herein are not intended to be limiting but rather to provide an understandable description of the invention.

Those with ordinary skill in the art will appreciate that the element in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some of the element in the figures may be exaggerated, relative to other element, in order to improve the understanding of the present invention. There may be additional components described in the foregoing application that are not depicted on one of the described drawings. In the event such a component is described, but not depicted in a drawing, the absence of such a drawing should not be considered as an omission of such design from the specification.

In the accompanying drawings components have been represented, showing only specific details that are pertinent for an understanding of the present invention so as not to obscure the disclosure with details that will be readily apparent to those with ordinary skill in the art having the benefit of the description herein.

In accordance with various embodiments of the present subject matter, referring to figures 1, 2A- 2C, and 3, a thermal management apparatus (100), a lighting device (200), and an entrapment (190) are disclosed. Further, the thermal management apparatus (100) discloses a rear heat sink (160), one or more heat conducting element (140) along with the entrapment (190), and a base (101). Further, the lighting device (200) includes a lens (120), a gasket (170), a printed board circuit (PCB) (180), and at least one light source (110) is also disclosed herein. In one non-limiting example embodiment, at least one light source ( 110) is mounted on the PCB (180). In addition, the gasket (170) is mounted around a periphery of the PCB (180). Further, the lighting device (200) includes the lens (120) mounted on the gasket (170). Furthermore, a space between the lens (120) and the PCB (180) forms a frontal heat cavity (150). In addition, the lighting device (200) includes the rear heat sink (160) mounted on a rear side of the PCB (180). Further, at least one hole (161) is provided in the rear heat sink. Furthermore, the lighting device (200) discloses one or more heat conducting element (140). Further, a first end (141) of each of the one or more heat conducting element (140) is disposed within the frontal heat cavity (150), and a second end (142) of each of the one or more heat conducting element (140) is exposed to an atmosphere. Furthermore, the first end (141) of the each of the one or more heat conducting element (140) being disposed within the frontal heat cavity (150) through the at least one hole ( 161 ) in the rear heat sink ( 160) . Moreover, the one or more heat conducting element is configured to transfer heat from the frontal heat cavity (150) to the atmosphere. In one example, the one or more heat conducting element (140) may be also referred as one or more heat sippers (140).

Referring to figure 2A-2C, in one example embodiment, the one or more heat conducting element

(140) may be a hollow tube. Further, the one or more heat conducting element (140) may extract heat from the frontal heat cavity (150) of the lighting device (200). Furthermore, the first end

( 141 ) of each of the one or more heat conducting element ( 140) may be inserted within the frontal heat cavity (150) via the at least one hole (161). In addition, the second end (142) of each of the one or more heat conducting element (140) may be provided with the entrapment (190) exposed to the atmosphere.

Referring to figure 1, in another example embodiment, the thermal management apparatus (100) may be disclosed. Further, the thermal management apparatus (100) may include a base (101). Furthermore, the base (101) may include a front side (101-a) and a rear side (101-b). Moreover, the front side (101-a) may be assembled with any electric or electronic device such as lighting device (200). Further, on the rear side (101-b) the rear heat sink (160) may be assembled. Furthermore, the base (101) and the rear heat sink (160) may include at least one hole (161). Further, the one or more heating conducting element (140) may be inserted into the at least one hole (161). Further, an insulating material (162) may be inserted around the one or more heat conducting element (140). Furthermore, the insulating material (162) may isolate the one or more heat conducting element ( 140) . The one or more heat conducting element ( 140) may be configured to extract heat or air from the front side (101-a) and dissipate the heat to atmosphere from the rear side of the base (101). More particularly, one or more heat conducting element (140) may transfer the heat from the frontal heat cavity (150) and dissipate the heat to the atmosphere across the rear heat sink ( 160) . In addition, the rear heat sink ( 160) may include a plurality of fins ( 163 ) extending outwardly from its surface.

In general, if the one or more heat conducting element (140) is inserted through at least one hole (161) of the rear heat sink (160) without using insulation material (162) it may result in working as similar as the rear heat sink (160). Therefore, use of insulation material (162) in at least one hole least of the rear heat sink (160) is important to differentiate the one or more heat conducting element ( 140) from the heat sinking . Moreover, the insulation material ( 162) m ay include but not limited to fiberglass, mineral wool (rock wool and slag wool), cellulose, polyurethane foam, polystyrene, spray foam, reflective insulation, aerogel, perlite and vermiculite, cotton Insulation, sheep wool, polyisocyanurate (PIR), phenolic foam, cork, and glass wool, or combination thereof.

Referring to figure 3, in yet another example embodiment, the entrapment (190) for thermal management of the lighting device (200) may be disclosed. Further, the entrapment (190) may be attached to the second end (142) of one or more heat conducting element (140) and exposed to atmosphere. Furthermore, the entrapment (190) may include a plurality of apertures (191). Further, the plurality of apertures (191) may be provided diagonally opposite to each other on the entrapment (190). Furthermore, the apertures (191) may be configured to allow air flow into the entrapment ( 190) . Moreover, the entrapment ( 190) may comprise an insertion zone ( 192) . Further, the insertion zone (192) may be configured to allow insertion of one or more heat conducting element (140). More particularly, the insertion zone (192) may allow insertion of the second end (142) of the one or more heat conducting element (140). Moreover, the entrapment (190) may include a gripping element (193). Further, the gripping element ( 193 ) may be fixed in the insertion zone (192). Furthermore, the gripping element (193) may be configured to allow fixation of one or more heat conducting element (140) with improved gripping. Further, the entrapment (190) may include a hollow structure which may facilitate a filter like functioning by restricting the entry of water droplets or dust impurities inside the one or more heat conducting element (140). Additionally, the entrapment (190) may include a removable type of attachment with the second end (142) of the one or more heat conducting element (140).

In yet another example embodiment, the entrapment ( 190) may include a fixed type of attachment with the second end (142) of the one or more heat conducting element (140). More specifically, the entrapment ( 190) and the second end ( 142) of the one or more heat conducting element ( 140) may include an integrated structure.

In an example implementation, the PCB ( 180) may be provided with the at least one light source (110) mounted on the surface. Also, the at least one light source (110) mounted on PCB (180) may be connected to the power supply unit (not shown). Further, the at least one light source (110) may be but not limited to a light emitting diode (LED), a bulb, or any other lighting element, or combination thereof. Furthermore, the PCB (180) may be surrounded by the gasket (170). Moreover, the lens (120) may be rested over the gasket (170) provided around the PCB (180).

Additionally, the space formed between the lens (120) and the PCB (180) may form the frontal heat cavity (150). Further, the frontal heat cavity (150) may contain the heat generated by the at least one light source (110). Furthermore, the lighting device (200) may be associated with the rear heat sink (160). Further, the at least one hole (161) may be created on the base (101) and the rear heat sink ( 160) . Further, the one or more heat conducting element ( 140) may be inserted into the at least one hole (161). Furthermore, the one or more heat conducting element (140) may extend from the front side (101 -a) of the base (101) to the rear side of the lens (101 -b) of the base (101) across the rear heat sink (160). More specifically, the firstend(141) of the one or more heat conducting element (140) may be inserted through the at least one hole (161) to the frontal heat cavity (150) and, the second end (142) of the one or more heat conducting element (140) may be provided with the entrapment (190) exposed to atmosphere. Therefore, one or more heat conducting element (140) may transfer the heat from the frontal heat cavity (150) and dissipate the heat to the atmosphere.

In yet another example embodiment, the one or more heat conducting element (140) may be associated with an air pump (not shown) . Further, the air pump connected to the one or more heat conducting element (140) may perform removal of heat from the frontal heat cavity (150) to atmosphere by forced convection. Further, the air pump may be situated at least one of inside or outside the lighting device (200).

In yet another example embodiment, the one or more heat conducting element (140) may operate without using any air pump. Further, the one or more heat conducting element (140) may perform removal of heat from the frontal heat cavity (150) to atmosphere by simply venting or breathing out heated air. In another example implementation, the one or more heat conducting element (140) may include a solid structure. In an example aspect, the solid structure of the one or more heat conducting element (140) may be made of a porous aluminium, aluminium, a sintered copper, a porous cold rolled steel, a sintered steel, a thermal conductive polymer, a graphite, a foam, gold, silver, or any other conductive or porous or sintered metal, semi- metals, alloys, ceramics, graphite, and polymers. Further, the solid structure may include one end outside the lens (120) having cold surface. Furthermore, the solid structure may include another end inside the lens (120) having hot surface due to heat within the frontal heat cavity (150). Further, the solid structure may conduct heat inside the frontal heat cavity (150) to the outside atmosphere based on principle that the heat energy always flows from high temperature body to lower temperature body.

In yet another example embodiment, the second end (142) of the one or more heat conducting element (140) may be slightly curved towards downward direction to avoid entering of water in the one or more heat conducting element ( 140) . In another aspect, the s econd end ( 142) of the one or more heat conducting element (140) may be a flexible end which may be twisted in any direction according to the constructional requirement of the lighting device (200).

In one example, the one or more heat conducting element (140) may include a helical structure. Further, the helical structure may ensure that no dust particle or water enters the frontal heat cavity (150). In another aspect, the second end (142) of the one or more heat conducting element (140) may be a flexible end which may be twisted in any shape according to the constructional requirement of the lighting device (200). In another example, a profile of the one or more heat conducting element (140) is at least one of cylindrical, helical, s-shape, u-shape, t-shape, or combination thereof.

In yet another example embodiment, at least one of the first end (141), and the second end (142) may be movable and configured to adjust the direction of the first end (141) and second end (142) according to requirement of the lighting device (200) . Further, at least one of the moving first end (141), or second end (142) may allow the assembly of the lighting device (200) to be in any possible direction without concern of water droplets getting into the one or more heat conducting element (140).

In another example embodiment, the entrapment (190) may have various shapes, but preferably aero-dynamic shape such as sphere, oval shape or any other to allow efficient and faster heat transfer. Further, the shape of the entrapment (190) may be configured provide enough space for movement of air venting throughout the one or more heat conducting element (140). In another aspect, the entrapment may include a flexible body made of any heat-resistant material.

In yet another example embodiment, the outer surface of the entrapment (190) may be coated with a water-resistant coating. Further, the water-resistant coating may restrict the water droplets to get accumulated on the outer surface of the entrapment (190). Furthermore, the water-resistant coating may improve the corrosion-resistance characteristics and lifespan of the entrapment (190).

In one embodiment, a plurality of lighting devices (200) may be assembled together to form an integrated lighting device module. Further, for such integrated lighting device module an integrated lens may be formed using injection moulding.

In another example embodiment, a temperature sensor may be mounted on the PCB (180). Further, the temperature sensor may be configured to monitor the temperature within the frontal heat cavity (150). Furthermore, the temperature sensor may be operatively connected to a control unit that may adjusts the power supplied to the at least one light source (110) based on the monitored temperature to prevent overheating. Further, the control unit may adjust the power by manual intervention or automatic control module. Further, the overheating detection by the temperature sensor may generate alarm in case of fire or short circuit situation.

In another example embodiment, a humidity or moisture sensor may be mounted on the PCB (180). Further, the humidity or moisture sensor may be configured to monitor the humidity or moisture within the frontal heat cavity (150) formed due to temperature difference between inside and outside of the frontal heat cavity (150). Furthermore, the humidity or moisture sensor may be operatively connected to a control unit that may adjusts the level of moisture within the frontal heat cavity (150) using any humidity or moisture evacuation means.

In another example embodiment, a wireless communication module may be configured to transmit operational data of the lighting device (200) to an external device. Further, the operational data comprises temperature, humidity, moisture and light source status such as power consumption on / off and dimming which may enable remote monitoring and control of the lighting device (200) . Furthermore, the operational data of the lighting device (200) may be shared with the cloud server. Further, the cloud server may be connected to the operational command centre. Further, the operational command centre may configure the information shared on cloud to execute command to control the lighting device (200). In one non-limiting example embodiment, the lighting device (200) may provide one or more advantages. Further, the advantages may include that the frontal heat generated by the light source inside the lens may be removed effectively. Furthermore, the life of the lighting device may be improved significantly. Further, the heat removal operation may become faster as the heat removal may be carried out from both directions rear and front. Further, formation of thermal gradient may be avoided as frontal heat may be removed simultaneously along with the rear heat sink. Moreover, the size of the rear heat sink may be minimized as an additional arrangement for thermal management is used. Further, the amount of material used for heat sink may be minimized. In addition, the protection of lighting devices from dust particles, water droplets or ice may be achieved. Also, the thermal stress causing fatigue, failure, breakage within the light source may get reduced. Further, the chances of catastrophic failure may be eliminated. Furthermore, the luminous output of the lighting device may be improved. Further, oxidation of metal component due to prolonged heating may be reduced. Furthermore, risk factors related to fire, short-circuit and safety may be eliminated. Further, maintenance cost and necessity of regular maintenance may be reduced.

Various modifications to the embodiment will be readily apparent to those skilled in the art and the generic principles herein may be applied to other embodiments. However, one of ordinary skill in the art will readily recognize that the present disclosure is not intended to be limited to the embodiments illustrated but is to be accorded the widest scope consistent with the principles and features described herein.

The foregoing description shall be interpreted as illustrative and not in any limiting sense. A person of ordinary skill in the art would understand that certain modifications could come within the scope of this disclosure.

The embodiments, examples and alternatives of the preceding paragraphs or the description and drawings, including any of their various aspects or respective individual features, may be taken independently or in any combination. Features described in connection with one embodiment are applicable to all embodiments, unless such features are incompatible.

Claims

I CLAIM:

1. A lighting device (200) comprising: a printed circuit board (PCB) (180); at least one light source (110) mounted on the PCB (180); a gasket (170) mounted around a periphery of the PCB (180); a lens (120) mounted on the gasket (170), wherein space between the lens (120) and the PCB (180) forms a frontal heat cavity (150); a rear heat sink (160) mounted on a rear side of the PCB (180); at least one hole (161) in the rear heat sink (160); and one or more heat conducting element (140), wherein first end (141) of each of the one or more heat conducting element (140) is disposed within the frontal heat cavity (150) and a second end (142) of each of the one or more heat conducting element (140) is exposed to atmosphere, wherein the first end (141) of the each of the one or more heat conducting element (140) being disposed within the frontal heat cavity (150) through the at least one hole (161) in the rear heat sink (160), wherein the one or more heat conducting element (140) configured to transfer heat from the frontal heat cavity (150) to an atmosphere.

2. The lighting device (200) as claimed in claim 1, wherein the one or more heat conducting element (140) has a hollow structure and is configured to extract heat from the frontal heat cavity (150) to the atmosphere.

3. The lighting device (200) as claimed in claim 2, further comprising an air pump connected to the one or more heat conducting element (140) to facilitate heat removal from the frontal heat cavity (150) to the atmosphere through forced convection.

4. The lighting device (200) as claimed in claim 2, wherein an entrapment (190) attached to the second end (142) of the one or more heat conducting element (140), wherein the entrapment (190) comprises an insertion zone (192) configured to allow insertion of the second end (142) of the one or more heat conducting element (140).

5. The lighting device (200) as claimed in claim 4, wherein the entrapment (190) comprises a gripping element (193) fixed in the insertion zone (192) and configured to allow fixation of the one or more heat conducting element (140), wherein the entrapment (190) is removable and has a hollow structure.

6. The lighting device (200) as claimed in claim 4, wherein the entrapment (190) comprises apertures (191) configured to inhibit liquid flow into the entrapment (190), wherein the apertures (191) enable air to flow into the entrapment ( 190) and configured to remove air from the entrapment (190), wherein the apertures (191) are located diagonally opposite on the entrapment (190) to enable crossflow of air trapped in the entrapment (190).

7. The lighting device (200) as claimed in claim 4, wherein the entrapment (190) has an aerodynamic shape, wherein an outer surface of the entrapment (190) is coated with a liquid - resistant coating.

8. The lighting device (200) as claimed in claim 2, wherein the firstend (141) of the one or more heat conducting element (140) is funnel-shaped to increase a cross-sectional area for heat transfer, and the second end (142) of the one or more heat conducting element (140) is curved downward to prevent liquid entry.

9. The lighting device (200) as claimed in claim 1, wherein the one or more heat conducting element (140) has a solid structure and is configured to conduct heat from the frontal heat cavity (140) to the atmosphere.

10. The lighting device (200) as claimed in claim 1, wherein an insulating material (162) is provided around the periphery of the at least one hole (161) of the rear heat sink (160).

11. The lighting device (200) as claimed in claim 1, wherein a profile of the one or more heat conducting element (140) is at least one of cylindrical, helical, s-shape, u-shape, t-shape, or combination thereof , wherein the one or more heat conducting element (140) are made from a material selected from at least one of metal, semi -metal, alloy, ceramic, graphite, and combination thereof.

12. The lighting device (200) as claimed in claim 1, wherein the rear heat sink (160) comprises a plurality of fins (163) extending outwardly from its surface.

13. The lighting device (200) as claimed in claim 1 , further comprising one or more sensor, wherein the one or more sensor comprises a temperature sensor mounted on the PCB (180) and configured to monitor temperature within the frontal heat cavity (150), wherein the temperature sensor is operatively connected to a control unit that adjusts power supplied to the at least one light source (110) based on the monitored temperature to prevent overheating.

14. The lighting device (200) as claimed in claim 1 , further comprising a wireles s communication module configured to transmit operational data of the lighting device (200) to an external device, wherein the operational data comprises temperature, humidity, and light source status, enabling remote monitoring and control of the lighting device.