WO2024224139A1

WO2024224139A1 - Vacuum deposition system and methods of depositing a stack of layers on a substrate

Info

Publication number: WO2024224139A1
Application number: PCT/IB2023/054294
Authority: WO
Inventors: Sebastian Gunther ZANG; Takashi ANJIKI; Jürgen Henrich; Matthias HEYMANNS; Matthias Krebs; Florian Ries
Original assignee: Applied Materials, Inc.
Priority date: 2023-04-26
Filing date: 2023-04-26
Publication date: 2024-10-31

Abstract

A vacuum deposition system (100) for processing of essentially vertically oriented substrates is described. The vacuum deposition system (100) includes a plurality of deposition chambers (150) arranged in a row along a main transport direction (T) and housing a plurality of vacuum deposition sources (155) for depositing a stack of layers including at least one organic material on the substrates, wherein a first transportation track (T1 ) and a second transportation track (T2) extend parallel to each other in the main transport direction through the plurality of deposition chambers; a carrier transport system for transporting the substrate carriers along the first transportation track past the plurality of vacuum deposition sources (155) and along the second transportation track; a first track switch module (121 ) and a second track switch module (122) for translating the substrate carriers from the first transportation track to the second transportation track, or vice versa, in a track switch direction (S) transverse to the main transport direction (T), wherein the plurality of deposition chambers (150) are arranged between the first track switch module (121 ) and the second track switch module (122); and a substrate loading chamber (111 ) with a substrate input opening (402) for inputting substrates (10) in a non-vertical orientation, and comprising an orientation actuator for changing a substrate orientation from the non-vertical orientation to an essentially vertical orientation. Further, methods of depositing a stack of layers on a substrate in any of the vacuum deposition systems described herein are provided.

Description

VACUUM DEPOSITION SYSTEM AND METHODS OF DEPOSITING A STACK OF LAYERS ON A SUBSTRATE

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a vacuum deposition system for in-line processing of essentially vertically oriented substrates. In particular, embodiments of the present disclosure relate to systems and methods of evaporating an OLED layer stack on vertically oriented substrates. Embodiments of the present disclosure further relate to systems and methods for depositing a layer stack, particularly an OLED layer stack, on a substrate in a vacuum deposition system. In particular, large-area substrates carried by substrate carriers are processed in an essentially vertical orientation in an in-line processing system according to embodiments described herein.

BACKGROUND

[0002] An organic light-emitting diode (OLED) is a light-emitting diode in which an electroluminescent layer is a film of organic compound that emits light in response to an electric current. Since OLEDs emit light directly without involving any backlight and color filters, the color gamut and viewing angles possible with OLED displays are greater than those of traditional LCD displays. Further, OLEDs can be manufactured on flexible substrates, and accordingly, OLEDs can be utilized in a variety of applications. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information. OLEDs can also be used for general space illumination. An OLED display, for example, may include one or more layers of organic material situated between two electrodes that are deposited on a substrate in a manner such as to form a matrix display panel having individually energizable pixels.

[0003] Organic materials and metallic materials are deposited on a substrate in a vacuum deposition system for OLED manufacturing. Metallic materials are employed as, for example, electrode materials or electron transport layer (ETL) materials. The materials to be deposited are evaporated in a material deposition source, and the evaporated materials are deposited on a substrate through nozzles. Metallic materials are evaporated in a material deposition source at a temperature of about 1 ,000°C or above, or of about 1 ,500°C or above.

[0004] A process for manufacturing OLED displays includes thermal evaporation of organic and/or metal materials and deposition of the materials on a substrate in a high vacuum environment. Deposition systems for depositing OLED layer stacks are typically large and complex. For example, rotation modules that can be used for substrate rotation have a large footprint and are maintenance-intensive. It would be beneficial to provide a more a compact vacuum deposition system with a reduced footprint and a reduced complexity that enables high volume OLED manufacturing.

[0005] Considering a tendency towards larger substrate sizes for display manufacturing, it would be beneficial to provide an improved system and improved method for depositing a layer stack including at least one organic material on a substrate.

SUMMARY

[0006] In light of the above, a vacuum deposition system for the in-line processing of essentially vertically oriented substrates carried by substrate carriers as well as methods of depositing a stack of layers including at least one organic material on a substrate in a vacuum deposition system are provided. Further aspects, embodiments, features and details can be derived from the dependent claims, the drawings and the specification.

[0007] According to an aspect, a vacuum deposition system for in-line processing of essentially vertically oriented substrates carried by substrate carriers is provided. The vacuum deposition system includes a plurality of deposition chambers arranged in a row along a main transport direction and housing a plurality of vacuum deposition sources for depositing a stack of layers including at least one organic material on the substrates, wherein a first transportation track and a second transportation track extend parallel to each other in the main transport direction through the plurality of deposition chambers; a carrier transport system for transporting the substrate carriers along the first transportation track past the plurality of vacuum deposition sources and along the second transportation track in opposite directions; a first track switch module and a second track switch module for translating the substrate carriers from the first transportation track to the second transportation track, or vice versa, in a track switch direction transverse to the main transport direction, wherein the plurality of deposition chambers are arranged between the first track switch module and the second track switch module, such that the substrate carriers can be transported along a closed loop through the vacuum deposition system; and a substrate loading chamber with a substrate input opening for receiving substrates in a non-vertical orientation in the vacuum deposition system, the substrate loading chamber comprising an orientation actuator for changing a substrate orientation from the non-vertical orientation to an essentially vertical orientation.

[0008] According to an aspect, a method of depositing a stack of layers including at least one organic material on a substrate in a vacuum deposition system is provided, particularly in any of the vacuum deposition systems described herein. The vacuum deposition system includes a plurality of deposition chambers arranged in a row along a main transport direction, wherein a first transportation track and a second transportation track extend parallel to each other in the main transport direction through the plurality of deposition chambers.

[0009] The method includes the following, particularly in the stated order from (a) to (g): (a) inputting a substrate in a non-vertical orientation into the vacuum deposition system, particularly into a substrate loading chamber of the vacuum deposition system, and loading the substrate onto a substrate carrier; (b) changing a substrate orientation from the non-vertical orientation to an essentially vertical orientation; (c) translating the substrate carrier carrying the substrate from the second transportation track to the first transportation track in a track switch direction, particularly in a first track switch module; (d) transporting the substrate carrier carrying the substrate in a first direction along the first transportation track through the plurality of deposition chambers past a plurality of vacuum deposition sources for depositing the stack of layers including the at least one organic material on the substrate; (e) translating the substrate carrier carrying the substrate from the first transportation track back to the second transportation track, particularly in a second track switch module; (f) changing the substrate orientation from the essentially vertical orientation to the non-vertical orientation; and (g) unloading the substrate from the substrate carrier and outputting the substrate in the non-vertical orientation from the vacuum deposition system, particularly from a substrate unloading chamber of the vacuum deposition system.

[0010] The method may further include (h): transporting the substrate carrier in a second direction opposite the first direction through the plurality of deposition chambers along the second transportation track (T2), wherein (h) can be carried out between (b) and (c) (as is schematically illustrated in FIG. 8), between (e) and (f) (as is schematically illustrated in FIG. 2), or after (g) (as is schematically illustrated in FIG. 1 ).

[0011] According to an aspect, a method of manufacturing a device in any of the vacuum deposition systems described herein is provided, particularly a substrate with an OLED layer stack, more particularly a display. The method includes inputting a substrate in the vacuum deposition system in a non-vertical orientation; changing a substrate orientation to an essentially vertical orientation; depositing a stack of layers including at least one organic material on the substrate while the substrate is in the essentially vertical orientation; changing the substrate orientation to the non-vertical orientation; and outputting the substrate from the vacuum deposition system in the non-vertical orientation.

[0012] According to an aspect, a substrate carrier for use in a vacuum deposition system is provided, particularly in a vacuum deposition system according to any of the embodiments described herein. The substrate carrier is adapted to carry a substrate through the vacuum deposition system in an essentially vertical orientation and includes a carrier body with a substrate support surface; a chucking device, particularly an electrostatic and/or magnetic chuck, for holding the substrate at the substrate support surface; and a removable deposition protection shield that at least partially surrounds the substrate support surface and that covers parts of the carrier body for preventing material deposition thereon.

[0013] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. The method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the present disclosure are also directed at methods for manufacturing devices in the described systems and using the described methods, and methods of operating the described systems. Described embodiments include method aspects for carrying out every function of the described apparatuses.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments and are described in the following:

FIG. 1 shows a schematic top view of a vacuum deposition system according to embodiments of the present disclosure;

FIG. 2 shows a schematic top view of a modified vacuum deposition system according to embodiments of the present disclosure;

FIG. 3 shows a schematic top view of a modified vacuum deposition system according to embodiments of the present disclosure;

FIG. 4 shows a perspective view of a substrate loading chamber of a vacuum deposition system according to embodiments of the present disclosure;

FIG. 5 shows a sectional view of a substrate loading chamber of a vacuum deposition system according to embodiments of the present disclosure;

FIG. 6 shows a schematic side view of a substrate carrier transported with a carrier transport system according to embodiments of the present disclosure;

FIG. 7 is a flow diagram illustrating methods of depositing a stack of layers on a substrate according to embodiments of the present disclosure; and

FIG. 8 shows a schematic top view of a vacuum deposition system according to embodiments of the present disclosure. DETAILED DESCRIPTION

[0015] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0016] Before various embodiments of the present disclosure are described in more detail, aspects with respect to some terms and expressions used herein are explained.

[0017] In the present disclosure, a "vacuum deposition system" is to be understood as a system or arrangement configured for vacuum deposition of materials on a substrate. In particular, a "vacuum deposition system" can be understood as a system configured for vacuum deposition of organic and/or metallic materials, e.g. for OLED display manufacturing.

[0018] In the present disclosure, a “deposition module” or "deposition chamber" can be understood as a vacuum chamber or vacuum chamber compartment that houses at least one deposition source configured for vacuum deposition. The term "vacuum", as used herein, can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be between 10-5 mbar and about 10-8 mbar, particularly between 10-5 mbar and 10-7 mbar. The deposition chambers are arranged in a row arrangement next to each other, particularly in a linear row setup, allowing an in-line processing of substrates. The deposition chambers can therefore also be referred to as “in-line deposition chambers”.

[0019] In the present disclosure, a "vacuum deposition source" can be understood as an arrangement configured for material deposition on a substrate in a vacuum deposition chamber, i.e. under sub-atmospheric pressure conditions. The vacuum deposition source can be an evaporation source configured for the thermal evaporation of a material. The vacuum deposition source may have one or more crucibles configured to evaporate the source material to be deposited and one or more distribution assemblies or distribution pipes configured for directing the evaporated material towards the substrate. For instance, a distribution tube or distribution pipe as described herein may provide a line source with a plurality of openings and/or nozzles which are arranged in lines along the length of the distribution tube. Accordingly, the distribution assembly can include a linear distribution showerhead, for example, having a plurality of openings (or an elongated slit) disposed therein. A showerhead as understood herein can have an enclosure, hollow space, or tube, in which the evaporated material can be provided or guided, for example from the evaporation crucible to the substrate.

[0020] A “track switch module” or simply a “track switch” may be understood as a vacuum chamber or vacuum chamber compartment with a movable support for transferring substrate carriers between different transportation tracks in a translational movement. A “rotation module” may be understood as a vacuum chamber or vacuum chamber compartment with a rotatable substrate carrier support for rotating substrate carriers around an essentially vertical rotation axis. A “substrate (un)loading module” or “substrate (un)loading chamber” may be understood as a vacuum chamber or vacuum chamber compartment configured for substrate input (or output) into (or from) the vacuum deposition system. In the substrate (un)loading module, the substrates can be loaded onto or unloaded from substrate carriers in a first orientation, and the orientation of the substrate carriers can be changed with an orientation actuator between the first orientation that is suitable for substrate (un)loading and a second orientation that is suitable for carrier transport through the vacuum system.

[0021] Embodiments described herein particularly relate to the deposition of materials, e.g. for display manufacturing, on large area substrates. According to some embodiments, large area substrates and substrate carriers supporting one or more substrates may have a size of 0.5 m² or larger, particularly of 1 m² or larger. For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 4.5, which corresponds to about 0.67 m² substrates (0.73x0.92m), GEN 5, which corresponds to about 1.4 m² substrates (1.1 m x 1.3 m), GEN 6, which corresponds to about 2.7 m² substrates (1 .5 m x 1 .8 m), GEN 7.5, which corresponds to about 4.29 m² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m² substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can be similarly implemented. According to yet further implementations, half sizes of the above- mentioned substrate generations can be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure.

[0022] According to some embodiments, which can be combined with other embodiments described herein, the substrate thickness can be from 0.1 mm to 1 .8 mm. The substrate thickness can be about 0.9 mm or less, such as 0.5 mm. The term “substrate” as used herein may particularly embrace substantially inflexible substrates, e.g., a glass plate or other substrates. However, the present disclosure is not limited thereto and the term “substrate” may also embrace flexible substrates such as a web or a foil. The term “substantially inflexible” is understood to distinguish from “flexible”. Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g., a glass plate having a thickness of 0.9 mm or less, such as 0.5 mm or less, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[0023] FIG. 1 shows a vacuum deposition system 100 for the in-line processing of substrates according to embodiments described herein, particularly an OLED manufacturing system, and more particularly an OLED manufacturing system for large area substrates. The substrates 10 to be coated can be carried through the vacuum deposition system 100 on substrate carriers 50. The substrate carriers 50 can be transported through the in-line processing system in an essentially vertically oriented state using a carrier transport system.

[0024] “Essentially vertically” as used herein refers to an orientation of the substrates (or an orientation of the substrate carriers) that corresponds to a vertical orientation or an orientation deviating from the vertical orientation by +/-20⁰ or less, e.g. +/-10⁰ or less. Such a deviation can be provided, for example, because a substrate support with some deviation from the vertical orientation may result in a more stable substrate position. Further, fewer stray particles can reach the substrate surface when the substrate is tilted forward. However, the substrate orientation, e.g., during the deposition of materials, such as organic or metallic materials, on a substrate in a high vacuum, is considered as substantially vertical, which is considered different from a horizontal substrate orientation. “Essentially horizontal” as used herein relates to an orientation that corresponds to a horizontal orientation or an orientation deviating from the horizontal orientation by +/-20⁰ or less, e.g. +/-10⁰ or less. For example, substrate carriers can be configured to hold a respective substrate, such as a glass plate, in an essentially vertically orientated state during the transport through the vacuum deposition system as well as during material deposition on the substrates. On the other hand, substrates can be inserted into the vacuum deposition system in a non-vertical orientation, which is typically an essentially horizontal orientation.

[0025] In an “in-line” processing system, the substrates are moved past (stationary) processing devices, such as (stationary) deposition sources in order to be coated with a stack of layers. In particular, the stack of layers is deposited on the substrates while the substrates are moved, particularly at a substantially constant movement speed, past the deposition sources, wherein the deposition sources may be configured to deposit different materials on the substrates, e.g. one or more metals and one or more organic materials, for coating the substrate with the stack of layers.

[0026] The vacuum deposition system 100 described herein includes a plurality of deposition chambers 150 arranged in a row along a main transport direction (T). Each deposition chamber includes a vacuum chamber that houses at least one vacuum deposition source, e.g. two vacuum deposition sources, as is schematically depicted in FIG. 1 . The plurality of vacuum deposition sources 155 are configured to deposit the stack of layers that includes at least one organic material on the substrates 10, when the substrates 10 are moved past the plurality of vacuum deposition sources 155. At least some of the vacuum deposition sources may be evaporation sources configured for the thermal evaporation of one or more materials, particularly at least one organic material for OLED manufacturing. [0027] A first transportation track T 1 and a second transportation track T2 extend parallel to each other in the main transport direction (T) through the plurality of deposition chambers 150, e.g., with a distance of 300 mm or less, particularly 150 mm or less between each other. Optionally, a separation wall may be arranged between the first transportation track T1 and the second transportation track T2 in the plurality of deposition chambers 150 for retaining the deposition material in the deposition area through which the first transportation track T1 extends.

[0028] A carrier transport system is provided for transporting the substrate carriers 50 along the first transportation track T1 past the plurality of vacuum deposition sources 155 and along the second transportation track T2 in opposite directions. In some embodiments, the first transportation track may be a forward track, and the second transportation track may be a return track on which the substrate carriers are returned to a start position of a closed loop within the vacuum deposition system.

[0029] In particular, the carrier transportation system may transport the substrate carriers 50 along the first transportation track T1 in a first direction for depositing the stack of layers on the substrates 10, and may transport the substrate carriers 50 along the second transportation track T2 in a second direction opposite to the first direction, particularly without deposition on the substrates on the second transportation track T2. Specifically, vacuum deposition sources may only be arranged next to the first transportation track T 1 for coating substrates on the first transportation track T 1 , and not next to the second transportation track T2. In some embodiments, the second transportation track T2 may be a return track for returning the substrate carriers (with or without carried substrates) back to a start position along a closed loop.

[0030] In some embodiments, which can be combined with other embodiments described herein, the carrier transport system includes a magnetic levitation system configured to magnetically carry at least a part of a carrier weight during transport, particularly a magnetic levitation system comprising actively controlled levitation magnets. The generation of small particles by frictional forces can be reduced or avoided by using a magnetic levitation system. Further, one or more drive units, e.g., one or more linear motors, may be provided for propelling the magnetically levitated substrate carriers along the first and second transportation tracks. [0031] As is schematically depicted in FIG. 1 , a first track switch module 121 and a second track switch module 122 are provided fortranslating the substrate carriers from the first transportation track T 1 to the second transportation track T2, or vice versa, in a track switch direction (S) transverse to the main transport direction (T). The plurality of deposition chambers 150 is arranged between the first track switch module 121 and the second track switch module 122 along the main transport direction (T), such that the substrate carriers can be continuously transported along a closed path (or closed loop along which the substrate carriers are repeatedly transported) through the vacuum deposition system 100. The track switch direction (S) may be a direction transverse to the main transport direction (T), particularly essentially perpendicular to the main transport direction. The track switch modules may translate the substrate carriers between the transportation paths without a rotational movement or orientation change of the substrates, particularly by linearly moving the substrate carriers in the track switch direction (S). Both the main transport direction (T) and the track switch direction (S) may be essentially horizontal directions, i.e., the substrate carrier transport is carried out horizontally throughout the system.

[0032] In particular, the first track switch module 121 may be configured to translate the substrate carriers 50 from the second transportation track T2 to the first transportation track T 1 , and the second track switch module 122 may be configured to translate the substrate carriers 50 back from the first transportation track T 1 to the second transportation T2, or vice versa, such that the substrate carriers can be transported along the closed loop, particularly along a closed loop having the shape of an elongated rectangle as viewed from above.

[0033] As is schematically depicted in FIG. 1 , the substrate carriers 50 can switch tracks from the second transportation track T2 to the first transportation track T 1 in the first track switch module 121 , can be transported in a first direction along the first transportation track T1 past the plurality of vacuum deposition sources 155 for depositing the stack of layers, can switch tracks back from the first transportation track T1 to the second transportation track T2 in the second track switch module 122, and can be transported along the second transportation track T2 in a second direction until reaching again the first track switch module 121 , where the closed loop transport sequence can start again from the beginning. The tact time of the system can be reduced and a simple transport sequence with reduced complexity can be provided. A high volume manufacturing system for manufacturing OLED layer stacks on substrates can be provided.

[0034] In at least some implementations described herein, the vacuum deposition system does not include any device or module for rotating the substrate carriers around an essentially vertical rotation axis (also generally referred to as a “rotation module”). A rotation module can be used for changing a transport direction of a vertically oriented substrate or substrate carrier and/or for turning vertically oriented substrates to face towards another side of the system, where further vacuum deposition sources may be arranged. However, even if rotation modules may facilitate the substrate transport in some applications, rotation modules are typically accompanied by a large footprint and complexity and are maintenance-intensive, such that providing a vacuum deposition system without a rotation module may be beneficial.

[0035] In some of the embodiments described herein, the substrate orientation - once vertical - may be constantly maintained during transport and deposition in the vacuum deposition system. For example, in the embodiment of FIG. 1 , the substrates 10 - once oriented vertically - continuously face towards the same lateral side of the system where the plurality of vacuum deposition sources 155 are located. Specifically, the track switch modules described herein are suitable for switching tracks without any substrate carrier rotation, such that the substrate orientation is also maintained when switching between transportation tracks.

[0036] A track switch module may include a vacuum chamber, a track switch actuator and a movable carrier support, particularly a mechanical support, arranged in the vacuum chamber. A substrate carrier can be supported on the carrier support. The track switch actuator can move the carrier support in the track switch direction (S) in a translational movement (i.e. , without carrier rotation) together with a substrate carrier supported thereon, particularly from a first position on the first transportation track to a second position on the second transportation track, or vice versa. In some embodiments, at least a part of the carrier weight may be magnetically held during a track switch movement. In other embodiments, the full substrate carrier weight is supported on the movable carrier support during a track switch movement. [0037] The vacuum deposition system 100 further includes a substrate loading chamber 111 with a substrate input opening, through which the substrates 10 can be introduced in a non-vertical orientation into the vacuum deposition system 100 from the atmospheric environment, particularly through a load lock chamber or load lock compartment. In the substrate loading chamber, the substrates 10 can be loaded onto the substrate carriers 50. The substrate loading chamber 111 includes an orientation actuator for changing a substrate orientation from the non-vertical orientation to an essentially vertical orientation. In particular, the substrates 10 can be fed through the substrate input opening into the vacuum deposition system in a non-vertical orientation, particularly in an essentially horizontal orientation, can be loaded onto substrate carriers inside the substrate loading chamber 111 , and the orientation of the substrates can be changed to essentially vertical by the orientation actuator in the substrate loading chamber 111.

[0038] In some embodiments, the vacuum deposition system may be configured to continuously maintain a constant substrate orientation during the transport from the substrate loading chamber to a substrate unloading chamber. Specifically, an orientation of the substrate carriers may be changed only by the orientation actuators for substrate loading and unloading, but, once in the essentially vertical state for transport through the vacuum deposition system, the orientation of the substrate carriers may not be changed, such that the substrate holding surface of the substrate carriers always faces in the same direction, namely in the direction where the plurality of vacuum deposition sources are arranged.

[0039] Vacuum deposition systems configured for transporting and coating vertically oriented substrates are suitable for in-line processing and are generally more compact, i.e., have a reduced footprint, as compared to horizontal coating and transport systems.

[0040] In some embodiments, the first transportation track T1 and the second transportation track T2 extend linearly (i.e., essentially along a respective straight line) through the vacuum deposition system from the first track switch module 121 to the second track switch module 122 through the plurality of deposition chambers 150. The first transportation track T1 and the second transportation track T2 may also extend linearly through the substrate loading chamber 111 and/or through a substrate unloading chamber 112, as is schematically depicted in FIG. 1. It is easier and less error-prone to transport substrate carriers along straight lines than subjecting them to repeated changes in substrate carrier direction. In particular, the closed loop along which the substrate carriers are transported may have the shape of an elongated rectangle as viewed from above, with the short rectangle sides being located in the track switch modules and extending in the track switch direction (S) and with the long rectangle sides corresponding to the first and second transportation tracks extending along the main transport direction (T).

[0041] In some embodiments, four, five or more in-line deposition chambers are arranged next to each other in a row, each deposition chamber housing at least one or more vacuum deposition sources. Two neighboring deposition chambers of the row may be arranged adjacent to each other, respectively, i.e. , without any further vacuum chamber or module being arranged between two neighboring deposition chambers. A stack of four, five, eight, ten or more layers can be deposited on the substrate during transport along the first transportation track T1 past the plurality of vacuum deposition sources 155. For example, the stack of layers may include one or more electrode layers, an electron transport layer (ETL), and at least one optically active organic layer. In some embodiments, the substrate carriers are transported past the plurality of vacuum deposition sources 155, particularly at an essentially constant velocity. Idle times or stop times can be reduced and the deposition efficiency and material utilization can be improved as may be beneficial for high volume manufacturing.

[0042] In some embodiments, the carrier transport system is configured to transport subsequent substrate carriers “edge to edge” past the plurality of vacuum deposition sources 155 on the first transportation track T1. In particular, a distance between two subsequent substrate carriers during transport past the deposition sources may be less than 10 cm, or subsequent substrate carriers may even be in contact with other (the trailing edges of the carriers contacting the front edge of the respective subsequent carrier) on the first transportation track, as is schematically depicted in FIG. 1. Transporting subsequent substrate carriers “edge to edge” past the plurality of vacuum deposition sources is beneficial, because there is no need to temporarily switch off or turn away the deposition sources in order to avoid material deposition on chamber walls. Rather, subsequent substrates can be coated essentially without any interruptions by the plurality of deposition sources. The material utilization and the tact time of the system can be further improved.

[0043] FIG. 4 is a perspective view of a substrate loading chamber 111 of a vacuum deposition system according to any of the embodiments described herein. FIG. 5 is a sectional view of the substrate loading chamber 111.

[0044] The substrate loading chamber 111 includes a vacuum chamber 401 with a substrate input opening 402 for receiving the substrates 10 in an input direction that is parallel to the track switch direction (S). In particular, the substrate input opening 402 may be adapted to receive the substrates 10 in landscape orientation. In other words, the substrates that are rectangular are inserted into the vacuum chamber with the longer side of the rectangular substrates entering the vacuum chamber 401 first (which is different from a “portrait orientation”, in which the shorter side of the rectangular substrates would enter the vacuum chamber first). The substrate input opening 402 may be an essentially horizontal slit opening configured for inserting the substrates into the vacuum chamber in a horizontal landscape orientation. The horizontal loading in a landscape orientation is counter-intuitive and would generally be avoided. However, the benefits with respect to the footprint of the system and the tact time motivate a deviation from the horizontal portrait handling.

[0045] The horizontally oriented substrates 10 can be inserted into the substrate loading chamber 111 in landscape orientation in the track switch direction (S) and can be loaded onto substrate carriers 50, as is schematically illustrated in FIG. 5. An orientation actuator is provided in the vacuum chamber 401 for changing the orientation of the substrate carrier together with the substrate supported thereon. An orientation actuator (illustrated by arrow 651 in FIG. 5) may include a support for supporting a substrate carrier 50. The carrier includes a first end 653 and a second end 655 opposing the first end 653. The support may be configured to support the substrate carrier 50 between the first end 653 and the second end 655. The orientation actuator may be configured to change the substrate orientation by moving the substrate carrier by an angle and around a pivot axis, wherein the pivot axis may extend parallel to the main transportation direction (T). As is schematically depicted in FIG. 5, the orientation actuator may tilt the substrate carrier upward into an essentially vertical orientation. After the orientation change, the substrate carrier can be positioned in an essentially vertical orientation on the second transportation track T2.

[0046] After the orientation change, the substrate carrier may be positioned on the second transportation track T2, and the substrate carried by the substrate carrier 50 may face away from the orientation actuator 651 toward the first transportation track T 1 . For coating the substrate, a track switch of the substrate carrier onto the second transportation track T2 is carried out, since the deposition sources may be arranged (only) next to the first transportation track T 1 (which can also be referred to as the “deposition track”).

[0047] Once in the essentially vertical orientation on the second transportation track T2, the substrate carriers can be transported along the second transportation track T2 out of the substrate loading chamber 111. A carrier transport into and out of the substrate loading chamber 111 along the second transportation track T2 is possible, because the substrate insertion from atmosphere into the substrate loading chamber 111 along the track switch direction (S) does not obstruct a substrate carrier transport through the substrate loading chamber 111 along the main transport direction (T), as can be seen from FIG. 4.

[0048] In some embodiments, the substrate input opening 402 is a non-vertical slit opening through which the substrates 10 can be input into the substrate loading chamber 111 , e.g., with a substrate loading robot. In some embodiments, the first and second transportation tracks T1 , T2 may extend through the substrate loading chamber 111. For example, the substrate loading chamber may have a first pair of openings 403, particularly essentially vertical slit openings, at opposing side walls 405 of the vacuum loading chamber along the first transportation track T1 , and a second pair of openings 404, particularly essentially vertical slit openings, at the opposing side walls 405 of the vacuum loading chamber along the second transportation track T2. The substrate input opening 402 for substrate insertion may be provided at another side wall 406 of the vacuum loading chamber between the opposing side walls 405, through which the first and second transportation tracks extend. [0049] With reference to FIG. 1 , the substrate loading chamber 111 may be arranged between the first track switch module 121 and the plurality of deposition chambers 150 on a first side of the plurality of deposition chambers 150, and the second track switch module 122 may be arranged on a second side of the plurality of deposition chambers 150 opposite the first side. Such a positioning of the substrate loading chamber 111 is beneficial because the substrate carriers 50 can be transported from the deposition chambers through the substrate loading chamber 111 into the first track switch module 121. The substrate carriers 50 can enter the substrate loading chamber 111 for substrate loading at one side, and the substrate carriers with loaded substrates can exit the substrate loading chamber 111 on an opposite side for switching from the second transportation track T2 to the first transportation track T1. The tact time of the system can be improved and the substrate carriers can be transported quickly and conveniently along a closed loop. Alternatively, it is also possible for the first track switch module 121 to be arranged between the substrate loading chamber 111 and the plurality of deposition chambers 150, i.e. the positions of the first track switch module and the substrate loading chamber in FIG. 1 can be switched. However, the arrangement in FIG. 1 is beneficial with respect to a reduced tact time.

[0050] In some embodiments, which can be combined with other embodiments described herein, the vacuum deposition system 100 further includes a substrate unloading chamber 112 for unloading the substrates 10 from the substrate carriers 50 and for outputting the substrates 10 in the non-vertical orientation from the vacuum deposition system, particularly in the essentially horizontal orientation. The substrate unloading chamber 112 may include an orientation actuator for changing the substrate orientation from the essentially vertical orientation to the non-vertical orientation.

[0051] In some embodiments, the substrate unloading chamber 112 has a generally similar configuration to that of the substrate loading chamber 111 that is shown in detail in FIG. 4 and FIG. 5, such that reference can be made to the above explanations in this respect. In particular, the substrate unloading chamber 112 may include a vacuum chamber 401 with a substrate output opening for outputting the substrates 10 from the vacuum deposition system in an output direction that is parallel to the track switch direction (S), particularly wherein the substrate output opening is adapted to output the substrate in landscape orientation. The substrate input direction and the substrate output direction may be opposite directions, as is schematically depicted in FIG. 1.

[0052] In some embodiments, the substrate output opening may be a non-vertical slit opening for outputting the substrates from the vacuum deposition system, particularly an essentially horizontal slit opening configured to output the substrates 10 from the vacuum deposition system 100 in landscape orientation, i.e. with the longer side of the rectangular substrates exiting the vacuum chamber first.

[0053] In some embodiments, the first transportation track T1 and the second transportation track T2 may extend linearly through both the substrate loading chamber 111 and the substrate unloading chamber 112. In particular, the substrate unloading chamber 112 may have a first pair of openings, particularly essentially vertical slit openings, at opposing side walls of the vacuum unloading chamber along the first transportation track T1 , and a second pair of openings, particularly essentially vertical slit openings, at the opposing side walls of the vacuum unloading chamber along the second transportation track T2. In some embodiments, the substrate output opening may be provided at another side wall of the vacuum unloading chamber between the opposing side walls.

[0054] In some embodiments, which can be combined with other embodiments described herein, the first transportation track T1 is provided between the second transportation track T2 and the plurality of vacuum deposition sources 155, and/or the second transportation T2 is provided between the first transportation track T1 and the openings for the substrate input and output. After loading and orientation change, the substrate carriers may be located on the second transportation track T2. Switching to the first transportation track T1 (i.e., to the “deposition track”) for substrate coating and switching back to the second transportation T2 for unloading coated substrates can be carried out in the first and second track switch modules.

[0055] In some embodiments, which can be combined with other embodiments described herein, the substrate loading chamber 111 and the first track switch module 121 are arranged on a first side of the plurality of deposition chambers 150, and the substrate unloading chamber 112 and the second track switch module 122 are arranged on a second side of the plurality of deposition chambers 150 opposite the first side. For example, the substrate unloading chamber 112 may be arranged between the second track switch module 122 and the plurality of deposition chambers 150 on the second side, and/or the substrate loading chamber 111 may be arranged between the first track switch module 121 and the plurality of deposition chambers 150 on the first side, as is depicted in FIG. 1. Such an arrangement enables an improved tact time of the system. Alternatively, the second track switch module 122 may be arranged between the substrate unloading chamber 112 and the plurality of deposition chambers 150. In the chamber arrangement of FIG. 1 , empty carriers, i.e. carriers without a loaded substrate, are returned from the substrate unloading chamber to the substrate loading chamber along the second transportation track T2 through the plurality of deposition chambers 150. Accordingly, in the embodiment of FIG. 1 , the second transportation track T2 is used as a return track for returning (empty) substrate carriers to the substrate loading chamber.

[0056] In some embodiments, which can be combined with other embodiments described herein, the carrier transport system is adapted to move the substrate carriers 50 along the first transportation track T1 past the plurality of vacuum deposition sources 155 so as to enable a deposition of a plurality of continuous layers on the substrates 10. A “continuously deposited layer” or “continuous layer” as used herein is deposited without use of a fine metal mask or shadow mask, i.e., is continuously deposited over a wide area of the substrate surface and not only locally or in a pattern defined by a mask opening structure. A “continuously deposited layer” is not necessarily uniform or flat, as the topography of a continuously deposited layer depends on the underlying topographic structure of the substrate. For example, pixels can be formed from a continuously deposited layer by previous application of a patterning layer on the substrate, followed by deposition over the patterning layer and subsequent etching of the deposited layer and/or the patterning layer for providing the pixels.

[0057] The vacuum deposition system may be configured to deposit a stack of continuous layers on the substrate, without use of a shadow mask or fine metal mask. Shadow or fine metal masks with a plurality of small holes can be used for the deposition of a plurality of pixels or other patterns on a substrate and are also referred to herein as “pixel generation masks”. Shadow masks and fine metal masks need to be aligned relative to the substrate before the deposition, such that the pixels are deposited on correct positions of the substrate. The deposition of continuous layers without a use of shadow masks or fine metal masks as provided herein reduces the complexity of the system, because no alignment between a substrate and a mask for depositing pixels or for depositing a predetermined material pattern on the substrate may be needed. Further, no mask handling, mask transport, and mask attachment may be required. In particular, vacuum deposition systems described herein may be without mask handling chambers, without mask alignment devices, without mask carriers, and/or without mask or mask carrier transportation tracks, which reduces the footprint and improves the tact rate.

[0058] In particular, the vacuum deposition system may not include any mask handling device or mask handling module, particularly no mask handling module for handling shadow masks or fine metal masks. Rather, the vacuum deposition system may be configured to provide the stack of layers on the substrate without use of a fine metal mask or shadow mask, particularly a stack of continuously deposited layers.

[0059] In some embodiments, the carrier transportation system may include a magnetic levitation system configured to magnetically carry at least a part of a substrate carrier weight during transport, particularly a magnetic levitation system with actively controlled levitation magnets. Actively controlled levitation magnets enable a controlled levitation force with a strength that depends on a measured gap distance between the substrate carrier and a stationary base of the magnetic levitation system.

[0060] In some implementations, the plurality of vacuum deposition sources 155 includes at least one evaporation source with an essentially vertically extending distribution pipe with a plurality of nozzles, particularly a vertically extending line source. In particular, a plurality of five, ten or more evaporation sources may be arranged adjacent to the first transportation track T 1 for coating the substrates with the stack of layers.

[0061] In some embodiments, the plurality of vacuum deposition sources 155 is arranged next to each other in a row on only one side of the first transportation track T1 with a distance (distance “D1” in FIG. 1 ) between two adjacent vacuum deposition sources of 200 cm or less, respectively, particularly 150 cm or less. A compact vacuum deposition system with closely arranged vacuum deposition sources can be provided.

[0062] FIG. 2 shows a schematic top view of a modified vacuum deposition system 200 according to embodiments of the present disclosure. The vacuum deposition system 200 is similar to the vacuum deposition system 100 of FIG. 1 , such that reference can be made to the above explanations, which are not repeated here. Only the differences will be discussed below.

[0063] The vacuum deposition system 200 includes the first track switch module 121 and the second track switch module 122 on opposite sides (first and second sides) of the plurality of deposition chambers 150. Further, the vacuum deposition system 200 includes a substrate loading chamber 111 and a substrate unloading chamber 112 that are both arranged on a first side of the plurality of deposition chambers 150, i.e. on the same side.

[0064] The substrate loading chamber 111 and the substrate unloading chamber 112 may be arranged directly adjacent to each other or, alternatively, at least one vacuum chamber, such as a vacuum spacer chamber, may be arranged between the substrate loading chamber 111 and the substrate unloading chamber 112. In another alternative, the substrate loading chamber 111 and the substrate unloading chamber 112 may be integrated in one single module with one single vacuum chamber.

[0065] In the embodiment that is depicted in FIG. 2 and in FIG. 8, the substrate loading chamber 111 , the substrate unloading chamber 112, and one of the first and second track switch modules are arranged on the first side of the plurality of deposition chambers 150, and the other one of the first and second track switch modules is arranged on the second side opposite the first side.

[0066] In particular, both the substrate loading chamber 111 and the substrate unloading chamber 112 may be arranged between the first track switch module 121 (or alternatively the second track switch module 122) and the plurality of deposition chambers 150 on the same side of the plurality of deposition chambers. The tact time of the system can be further improved by arranging the substrate unloading chamber 112 between the substrate loading chamber 111 and the first track switch module 121 , as is depicted in FIG. 2. In such an arrangement, after unloading a coated substrate from a substrate carrier in the substrate unloading chamber 112, a new substrate can be loaded on the substrate carrier in the substrate loading chamber 111 arranged downstream of the substrate unloading chamber 112, and the substrate carrier can then be transported into the first track switch module 121 for switching transportation tracks. Thereafter, the substrate carrier can be transported along the first transportation track T1 for coating the substrate in the deposition chambers. Accordingly, the substrate carriers can be transported (continuously) in a clockwise direction (or, alternatively, continuously in a counterclockwise direction) along the closed loop.

[0067] In some embodiments, a further vacuum chamber, such as a substrate carrier storage chamber or a substrate carrier shelf 125 may be provided, for example on the first side of the plurality of deposition chambers 150. The first transportation track T1 and/or the second transportation track T2 may extend through the first track switch module 121 into the further vacuum chamber, as is schematically depicted in FIG. 2.

[0068] In the vacuum deposition systems shown in FIG. 1 , FIG. 2 and FIG. 8, the substrate carriers can be transported “edge to edge” past the plurality of vacuum deposition sources, particularly with subsequently transported substrate carriers contacting each other, without gaps therebetween. In order to reduce a contamination of substrate carrier bodies with deposition material, the substrate carriers 50 that are used in the vacuum deposition systems described herein may include a deposition protection shield that covers and shields parts of the carrier body.

[0069] FIG. 6 is a schematic side view of a substrate carrier 50 with a deposition protection shield 55 according to embodiments described herein that is held below a carrier transport system 250 with a magnetic levitation system 251. Such a substrate carrier 50 described herein constitutes a separate aspect of the present disclosure.

[0070] The substrate carrier 50 is configured to carry a substrate in an essentially vertical orientation through the vacuum deposition system. The substrate carrier 50 includes a carrier body 52 with a substrate support surface 51 and a chucking device 57, particularly an electrostatic or magnetic chuck, for holding the substrate at the substrate support surface 51. The carrier further includes a removable deposition protection shield 55 that at least partially surrounds the substrate support surface 51 and covers parts of the carrier body for preventing material deposition thereon. In particular, the deposition protection shield 55 may cover parts of the carrier body in front of and behind the substrate support surface 51 in the main transport direction T and/or parts of the carrier body above and below the substrate support surface. Optionally, the deposition protection shield 55 can completely surround the substrate support surface 51 and can, for example, surround the substrate support surface in a frame-like manner (as is schematically depicted in FIG. 6). A deposition of material onto the carrier body during substrate coating is reduced or prevented since the carrier body is partially covered and shielded by the deposition protection shield 55.

[0071] The deposition protection shield 55 can be detached from the substrate carrier, e.g., at regular intervals, for cleaning, e.g. externally to the vacuum deposition system.

[0072] As is schematically depicted in FIG. 6, the substrate carrier 50 may optionally further include a magnetic counterpart 53, e.g., comprising a metal rail that is attractable by a magnet and/or comprising one or more permanent magnets, configured to magnetically interact with actively controlled levitation magnets 252 of a magnetic levitation system 251. The magnetic counterpart 53 may be arranged at an upper part of the substrate carrier 50, such that the substrate carrier can be (partially or entirely) magnetically held by the magnetic levitation system 251 from above. The carrier transport system 250 may further include one or more drive units 253, such as one or more linear motors, configured to propel the substrate carrier 50 along the first and second transportation tracks through the vacuum deposition system.

[0073] A deposition protection shield 55 provided on a substrate carrier 50 is removably mounted at the substrate carrier and, therefore, moves together with the substrate carrier through the vacuum deposition system and may therefore accumulate different deposition materials originating from different vacuum deposition sources. Such an accumulation of mixed materials on a surface of the substrate carrier may - depending on the deposited materials - not be beneficial in some applications. For example, there may be a risk in some applications that some materials deposited on top of each other can flake off and negatively affect the deposition process. FIG. 3 shows a vacuum deposition system that avoids an accumulation of mixed materials on surfaces of the substrate carriers, though at an increased tact time.

[0074] FIG. 3 shows a schematic top view of a modified vacuum deposition system 300 according to embodiments of the present disclosure. The vacuum deposition system 300 is similar to the vacuum deposition system 100 of FIG. 1 , such that reference can be made to the above explanations, which are not repeated here. Only the differences will be discussed below.

[0075] In the vacuum deposition system 300 of FIG. 3, the substrate carriers may be transported past the plurality of vacuum deposition sources 155 at a larger distance in order to avoid an accumulation of mixed deposition materials on surfaces of the substrate carriers.

[0076] The vacuum deposition system 300 includes a shield transportation track T3 in one or more of the deposition chambers extending between the first transportation track T1 and the plurality of vacuum deposition sources 155. The shield transportation track T3 may extend parallel to and offset from the first transportation track T1 , particularly close to the first transportation track T 1 .

[0077] At least one protection shield 201 may be movably arranged on the shield transportation track T3, and a shield actuator 202 is configured to move, by translation, the at least one protection shield 201 back and forth on the shield transportation track T3 between a first shield position and a second shield position, in order to prevent material deposition on parts of the substrate carriers while the substrate carriers move past the vacuum deposition sources.

[0078] For example, a protection shield may be assigned to one of the vacuum deposition sources and may be configured to move in front of and temporarily in synchrony with a substrate carrier, the substrate of which is coated by the associated vacuum deposition source, such that the parts of the substrate carrier that are shielded by the at least one protection shield 201 are protected from the deposition material. In some embodiments, each vacuum deposition source may have an associated protection shield configured to move back and forth on the shield transportation track T3 in front of the respective vacuum deposition source in synchrony with the respective substrate carrier movements. Once a substrate carrier has moved past one of the vacuum deposition sources together with the associated protection shield, the associated protection shield may move back to a first shield position for shielding a subsequent substrate carrier, the substrate of which is to be coated during the transport past said vacuum deposition source. A deposition of coating material on the substrate carriers can be reduced or avoided by the movable protection shields, wherein each movable protection shield only accumulates deposition material originating from one associated vacuum deposition source, such that the accumulation of mixed materials on surfaces close to the substrates can be reduced or avoided. The quality of the layer stacks can be improved.

[0079] A distance between adjacent vacuum deposition sources in the embodiment of FIG. 3 is typically larger, in order to avoid a mixed deposition of different materials on one of the protection shields. In particular, the distance between adjacent vacuum deposition sources may be larger than the width of the substrate carrier, e.g. more than 2.5 m, depending on the size of the substrates to be coated.

[0080] The plurality of vacuum deposition sources 155 may include at least one evaporation source. The evaporation source includes an evaporation crucible and an essentially vertically extending distribution pipe with a plurality of nozzles in fluid communication with the evaporation crucible. In some embodiments, which can be combined with other embodiments described herein, the evaporation source can be rotatable between a coating position in which the plurality of nozzles are directed toward the first transportation track T1 for substrate coating and an idle position in which the plurality of nozzles are directed away from the first transportation track T1 toward an idle shield.

[0081] FIG. 3 shows exemplarily an evaporation source in the coating position 156 for substrate coating and an evaporation source in the idle position 158, in which the plurality of nozzles are directed toward an idle shield 157. For example, the evaporation source can be rotated by an angle between 40° and 120°, particularly by an angle of about 90°, between the coating position 156 and the idle position 158. Specifically, the evaporation source can be rotated to the idle position 158 or maintained in the idle position 158 when no substrate to be coated is currently arranged on the first transportation track T1 in front of the evaporation source. Additionally, the evaporation source can be provided in the idle position during start-up and/or shut-down of the evaporation source, e.g. during heat-up of the source material in the evaporation crucible.

[0082] Alternatively or additionally, a shutter 159 can be provided that is movable to a position between the plurality of nozzles of the evaporation source and the first transportation track T1 for blocking vapor exiting the plurality of nozzles. Specifically, the shutter 159 can be moved to or maintained in a blocking position for blocking vapor exiting the evaporation source when no substrate to be coated is currently arranged on the first transportation track T1 in front of the evaporation source, and/or during start-up or shut-down of the evaporation source. The shutter 159 can be moved away from the blocking position in order to coat substrates arranged in front of the evaporation source on the first transportation track.

[0083] According to an aspect described herein, an evaporation source is provided. The evaporation source includes an evaporation crucible, an essentially vertically extending distribution pipe with a plurality of nozzles, and a shutter that is movable between a first position in front of the plurality of nozzles for blocking vapor exiting from the plurality of nozzles during idle times of the evaporation source and a second position in which the vapor exiting the plurality of nozzles can propagate unhindered from the nozzles into a deposition area for substrate coating. The evaporation source may include further features described herein and can be used in any of the vacuum deposition systems described herein. For example, the evaporation source may further be rotatable between a deposition position and an idle position, in which the plurality of nozzles may be directed toward an idle shield as described herein. Alternatively or additionally, the evaporation source may have an associated movable protection shield 201 as described herein that may be movable in front of the source on a shield transportation track for shielding parts of the substrate carrier from the deposition material. In some embodiments, the evaporation source may be an organic source for depositing an organic material on a substrate or a metal source for depositing a metal on a substrate. [0084] The vacuum deposition systems described herein can be used for depositing a stack of layers including at least one organic material on a substrate carried by a substrate carrier in an essentially vertical orientation.

[0085] FIG. 7 is a flow diagram that illustrates deposition methods described herein.

[0086] In box 610, a substrate is input in a non-vertical orientation, particularly in an essentially horizontal orientation, into the vacuum deposition system, and the substrate is loaded onto a substrate carrier, particularly in a vacuum loading chamber of the substrate deposition system. The substrate may be input into the vacuum loading chamber in an input direction that is parallel to the track switch direction, particularly in landscape orientation of the rectangular substrate.

[0087] In box 620, a substrate orientation is changed from the non-vertical orientation to an essentially vertical orientation, particularly with an orientation actuator that is arranged in the vacuum chamber of the substrate loading chamber. The substrate carrier carrying the substrate in the essentially vertical orientation may be arranged on the second transportation track after the orientation change. The substrate carrier can then be transported into a first track switch module along the second transportation track (particularly in a direction away from the plurality of deposition chambers).

[0088] In box 630, the substrate carrier carrying the substrate is translated from the second transportation track to the first transportation track in a track switch direction (S) in the first track switch module.

[0089] In box 640, the substrate carrier carrying the substrate is transported along the first transportation track through the plurality of deposition chambers and past a plurality of vacuum deposition sources for depositing the stack of layers, including the at least one organic material, on the substrate.

[0090] In box 650, the substrate carrier carrying the substrate is translated from the first transportation track to the second transportation track in the second track switch module. The method may proceed with either box 660 or box 660’. In particular, the substrate carrier can then be transported into a substrate unloading chamber along the second transportation track for unloading the coated substrate from the substrate carrier.

[0091] In box 660, the substrate orientation is changed from the essentially vertical orientation to the non-vertical orientation in the substrate unloading chamber.

[0092] In box 670, the substrate is unloaded from the substrate carrier in the substrate unloading chamber and is output in the non-vertical orientation from the vacuum deposition system. The substrate may be output from the substrate unloading chamber in an output direction that is parallel to the track switch direction, particularly in landscape orientation.

[0093] In box 680, the (empty) substrate carrier is transported back through the plurality of deposition chambers along the second transportation track as far as the substrate loading chamber, wherein a subsequent substrate to be coated is loaded on the substrate carrier (i.e. , the method may start again with box 610 and the closed loop transportation sequence may continue).

[0094] The method illustrated by boxes 610-680 can be carried out, for example, in the vacuum deposition system depicted in FIG. 1.

[0095] Alternatively, after the translation of the substrate carrier carrying the substrate back to the second transportation track in box 650, the method may proceed as follows:

[0096] In box 660’, the substrate carrier carrying the coated substrate is transported back through the plurality of deposition chambers along the second transportation track as far as the substrate unloading chamber (which may be arranged directly adjacent the plurality of deposition chambers, see FIG. 2).

[0097] In box 670’, the substrate orientation is changed from the essentially vertical orientation to the non-vertical orientation in the substrate unloading chamber.

[0098] In box 680’, the substrate is unloaded from the substrate carrier in the substrate unloading chamber and is output in the non-vertical orientation from the vacuum deposition system. The substrate may be output from the substrate unloading chamber in an output direction that is parallel to the track switch direction, particularly in landscape orientation.

[0099] The (empty) substrate carrier can be transported from the substrate unloading chamber into the substrate loading chamber along the second transportation path T2, where a subsequent substrate to be coated can be loaded on the substrate carrier (i. e. , the method may start again with box 610, and the closed loop transportation sequence may continue from the beginning).

[00100] The method illustrated by boxes 610-650, 660’-680’ can be carried out, for example, in the vacuum deposition system shown in FIG. 2.

[00101 ] Alternatively, as is schematically depicted in FIG. 8 that illustrates a vacuum deposition system 800 according to embodiments described herein, the method may include, particularly in the stated order: (a) inputting a substrate in a non-vertical orientation into the vacuum deposition system, particularly into a vacuum loading chamber 111 , and loading the substrate on a substrate carrier; (b) changing a substrate orientation from the non-vertical orientation to an essentially vertical orientation; (h) transporting the substrate carrier carrying the substrate along the second transportation track through the plurality of deposition chambers; (c) translating the substrate carrier carrying the substrate from the second transportation track to the first transportation track in a track switch direction, particularly in a first track switch module 121 ; (d) transporting the substrate carrier carrying the substrate along the first transportation track (T1 ) through the plurality of deposition chambers 150 and past a plurality of vacuum deposition sources 155 for depositing the stack of layers, including the at least one organic material, on the substrate; (e) translating the substrate carrier carrying the substrate from the first transportation track back to the second transportation track, particularly in a second track switch module 122; (f) changing the substrate orientation from the essentially vertical orientation to the non-vertical orientation, and (g) unloading the substrate from the substrate carrier and outputting the substrate in the non-vertical orientation from the vacuum deposition system, particularly from a vacuum unloading module 112 of the vacuum deposition system. The empty substrate carrier can then be transported from the vacuum unloading chamber 112 into the vacuum loading chamber 111 along the second transportation track (T2) for loading a subsequent substrate onto the substrate carrier, and the sequence may start again from the beginning with operation (a).

[00102] According to some of the methods described herein, the substrate carrier is transported along a closed path through the vacuum deposition system, particularly wherein the closed path is shaped like an elongated rectangle as viewed from above. The transport along the closed path can, for example, be continuously carried out in a clockwise direction, or alternatively in a counterclockwise direction.

[00103] In some implementations, the substrate is input into the vacuum deposition system at a substrate input position between one of the first and second track switch modules and the plurality of deposition chambers, and/or the substrate is output from the vacuum deposition system at a substrate output position between one of the first and second track switch modules and the plurality of deposition chambers. In particular, substrate loading chamber and the substrate unloading chamber may respectively be arranged between one of the first and second track switch modules and the plurality of deposition chambers.

[00104] For example, as is schematically depicted in FIG. 1 , the substrate is input into the vacuum deposition system at a substrate input position between the first track switch module 121 and the plurality of deposition chambers 150 on a first side of the plurality of deposition chambers, and/or the substrate is output from the vacuum deposition system at a substrate output position between the second track switch module 122 and the plurality of deposition chamber on a second side of the plurality of deposition chambers.

[00105] For example, as is schematically depicted in FIG. 2 and FIG. 8, the substrate is input into the vacuum deposition system at a substrate input position and output from the vacuum deposition position at a substrate output position which are both located between one of the first and second track switch modules and the plurality of deposition chambers, particularly close to each other. The substrate input position may be arranged downstream of the substrate output position in the transport direction along the second transport path T2. In particular, both the substrate loading chamber 111 and the substrate unloading chamber 112 may be arranged between one of the first and second track switch modules and the plurality of deposition chambers, particularly close to each other with an optional spacer chamber in between. The substrate loading chamber 111 may be arranged downstream of the substrate unloading chamber 112 in the transport direction along the second transport path T2.

[00106] For example, as is schematically depicted in FIG. 8, the substrate is input into the vacuum deposition system at a substrate input position between the second track switch module 122 and the plurality of deposition chambers 150 on a second side of the plurality of deposition chambers, and the substrate is output from the vacuum deposition system at a substrate output position between the second track switch module 122 and the plurality of deposition chambers 150 also on the second side of the plurality of deposition chambers. The substrate input position may be located between the substrate output position and the plurality of deposition chambers, such that the substrate input position is arranged downstream of the substrate output position along the second transport path. The substrate input position may correspond to the position of the substrate loading chamber 111 , and the substrate output position may correspond to the position of the substrate unloading chamber 112.

[00107] The substrate can be input into and output from the vacuum deposition system on the same side of the plurality of deposition chambers. In particular, the substrate unloading chamber and the substrate loading chamber may be arranged on the same side of the plurality of deposition chambers, particularly between one of the track switch modules and the plurality of deposition chambers on the same side of the plurality of deposition chambers.

[00108] The stack of layers that is deposited in the vacuum deposition system may be a stack of continuous layers deposited on the substrate in succession, particularly without use of a shadow mask or fine metal mask. In particular, a maskless deposition may be carried out on the substrate. The stack of layers may include at least one organic material, particularly for OLED manufacturing.

[00109] In some embodiments, the deposition methods described herein transport the vertically oriented substrate carriers without any rotation around a vertical rotation axis. In other words, the orientation of the substrate carriers - when vertical - may remain constant during transport and substrate processing. [00110] In some embodiments, subsequent substrate carriers are transported “edge to edge” past the plurality of vacuum deposition sources for depositing the stack of layers. Substrate carriers as described herein that include removable deposition protection shields are beneficially used for “edge to edge” carrier transport. A compact vacuum deposition system enabling an improved material utilization can be provided.

[00111] Alternatively or additionally, protection shields that are movable on a separate shield transportation track may be used for preventing an accumulation of mixed materials on carrier surfaces close to the substrate. Here, the substrate carriers are typically transported past the plurality of vacuum deposition sources at a larger mutual distance, in order to prevent or at least reduce a material mixing on the protection shields.

[00112] Devices such as OLED devices, can be manufactured according to methods described herein. A method of manufacturing a device, particularly in any of the vacuum deposition systems described herein, includes: inputting a substrate into the vacuum deposition system in a non-vertical orientation; changing a substrate orientation to an essentially vertical orientation; depositing a stack of layers including at least one organic material on the substrate while the substrate is in the essentially vertical orientation; changing the substrate orientation to the non-vertical orientation; and outputting the substrate from the vacuum deposition system in the non-vertical orientation.

[00113] The substrate that is input into the vacuum deposition system for being coated may include one or more structures having an upper surface of the substrate or an upper surface of an element disposed on the substrate, at least two side walls on opposite sides, and at least two overhang structures with a width to height ratio of at least 1 :2. The stack of layers may be deposited onto the upper surface and the at least two side walls.

[00114] While the foregoing is directed to some embodiments, other and further embodiments may be devised without departing from the scope, and the scope is determined by the claims that follow.

Claims

1. A vacuum deposition system (100) for processing of essentially vertically oriented substrates carried by substrate carriers (50), comprising: a plurality of deposition chambers (150) arranged in a row along a main transport direction (T) and housing a plurality of vacuum deposition sources (155) for depositing a stack of layers including at least one organic material on the substrates, wherein a first transportation track (T1 ) and a second transportation track (T2) extend parallel to each other in the main transport direction through the plurality of deposition chambers (150); a carrier transport system for transporting the substrate carriers along the first transportation track (T1) past the plurality of vacuum deposition sources (155) and along the second transportation track (T2) in opposite directions; a first track switch module (121 ) and a second track switch module (122) for translating the substrate carriers from the first transportation track (T1 ) to the second transportation track (T2), or vice versa, in a track switch direction (S) transverse to the main transport direction (T), wherein the plurality of deposition chambers (150) are arranged between the first track switch module (121) and the second track switch module (122); and a substrate loading chamber (111) with a substrate input opening (402) for receiving substrates (10) in a non-vertical orientation in the vacuum deposition system (100), the substrate loading chamber (111 ) comprising an orientation actuator (651 ) for changing a substrate orientation from the non-vertical orientation to an essentially vertical orientation.

2. The vacuum deposition system of claim 1 , wherein the substrate input opening (402) is adapted to receive the substrates in an input direction that is parallel to the track switch direction (S), particularly wherein the substrate input opening is adapted to receive the substrates in landscape orientation.

3. The vacuum deposition system of claim 1 or 2, wherein the substrate loading chamber (111 ) is arranged between the first track switch module (121 ) and the plurality of deposition chambers (150) on a first side of the plurality of deposition chambers (150), and the second track switch module (122) is arranged on a second side of the plurality of deposition chambers (150) opposite the first side.

4. The vacuum deposition system of any of claims 1 to 3, further comprising a substrate unloading chamber (112) with a substrate output opening for outputting the substrates in the non-vertical orientation from the vacuum deposition system (100), the substrate unloading chamber comprising an orientation actuator for changing the substrate orientation from the essentially vertical orientation to the non-vertical orientation.

5. The vacuum deposition system of claim 4, wherein the substrate output opening is adapted to output the substrates in landscape orientation.

6. The vacuum deposition system of claim 4 or 5, wherein the substrate loading chamber (111 ) and the first track switch module (121) are arranged on a first side of the plurality of deposition chambers (150), and the substrate unloading chamber (112) is arranged between the second track switch module (122) and the plurality of deposition chambers (150) on a second side of the plurality of deposition chambers opposite the first side.

7. The vacuum deposition system of claim 4 or 5, wherein both the substrate loading chamber (111) and the substrate unloading chamber (112) are arranged between one of the first and second track switch modules and the plurality of deposition chambers (150) on a first side of the plurality of deposition chambers, and the other one of the first and second track switch modules is arranged on a second side of the plurality of deposition chambers (150) opposite the first side.

8. The vacuum deposition system of any of claims 1 to 7, wherein the vacuum deposition system is configured to maintain a constant substrate orientation during transport from the substrate loading chamber to the substrate unloading chamber, particularly wherein the vacuum deposition system (100) does not include a rotation module for rotating the substrate carriers around a vertical rotation axis.

9. The vacuum deposition system of any of claims 1 to 8, wherein the carrier transport system (100) is adapted to move the substrate carriers (50) along the first transportation track (T1 ) past the plurality of vacuum deposition sources (150) to enable a deposition of a plurality of continuous layers on the substrates without use of a shadow mask or fine metal mask.

10. The vacuum deposition system of any of claims 1 to 9, wherein the plurality of vacuum deposition sources (150) comprise at least one evaporation source with an essentially vertically extending distribution pipe with a plurality of nozzles, the evaporation source being rotatable between a coating position (156) in which the plurality of nozzles are directed toward the first transportation track (T1 ) for substrate coating and an idle position (158) in which the plurality of nozzles are directed away from the first transportation track (T1) toward an idle shield (157).

11 . The vacuum deposition system of any of claims 1 to 9, wherein the plurality of vacuum deposition sources comprise at least one evaporation source, comprising: an essentially vertically extending distribution pipe with a plurality of nozzles; and a shutter (159) that is movable to a position between the plurality of nozzles and the first transportation track (T 1 ) for blocking vapor exiting the plurality of nozzles.

12. The vacuum deposition system of any of claims 1 to 11 , wherein the carrier transportation system comprises a magnetic levitation system (250) configured to magnetically carry at least a part of a substrate carrier weight during transport, particularly a magnetic levitation system comprising actively controlled levitation magnets (252).

13. The vacuum deposition system of any of claims 1 to 12, further comprising: a shield transportation track (T3) in one or more deposition chambers (150) between the first transportation track (T1 ) and the plurality of vacuum deposition sources (155); at least one protection shield (201) movably arranged on the shield transportation track (T3); and a shield actuator (202) configured to move, by translation, the at least one protection shield (201) back and forth between a first shield position and a second shield position on the shield transportation track (T3) for preventing material deposition on parts of the substrate carriers (50).

14. The vacuum deposition system of any of claims 1 to 13, further comprising one or more substrate carriers (50) for carrying the substrates (10) through the vacuum deposition system (100), the substrate carriers respectively comprising: a carrier body (52) with a substrate support surface (51 ); a chucking device (57) for holding a substrate (10) at the substrate support surface (51 ); and a removable deposition protection shield (55) that at least partially surrounds the substrate support surface (51 ) and covers parts of the carrier body (52) for preventing material deposition thereon.

15. The vacuum deposition system of any of claims 1 to 14, wherein the plurality of vacuum deposition sources (155) are arranged next to each other in a row only on one side of the first transportation track (T1 ) with a distance (D1 ) between two adjacent vacuum deposition sources of 200 cm or less, respectively.

16. A method of depositing a stack of layers including at least one organic material on a substrate in a vacuum deposition system comprising a plurality of deposition chambers arranged in a row along a main transport direction (T), wherein a first transportation track and a second transportation track extend parallel to each other in the main transport direction through the plurality of deposition chambers, the method comprising: (a) inputting a substrate in a non-vertical orientation into the vacuum deposition system and loading the substrate on a substrate carrier;

(b) changing a substrate orientation from the non-vertical orientation to an essentially vertical orientation;

(c) translating the substrate carrier carrying the substrate from the second transportation track to the first transportation track in a track switch direction (S) in a first track switch module;

(d) transporting the substrate carrier carrying the substrate in a first direction along the first transportation track (T1) through the plurality of deposition chambers past a plurality of vacuum deposition sources for depositing the stack of layers including the at least one organic material on the substrate;

(e) translating the substrate carrier carrying the substrate from the first transportation track (T1 ) to the second transportation track (T2) in a second track switch module;

(f) changing the substrate orientation from the essentially vertical orientation to the non-vertical orientation; and

(g) unloading the substrate from the substrate carrier and outputting the substrate in the non-vertical orientation from the vacuum deposition system.

17. The method of claim 16, further comprising:

(h) transporting the substrate carrier in a second direction opposite the first direction through the plurality of deposition chambers along the second transportation track (T2), wherein (h) is carried out between (b) and (c), between (e) and (f), or after (g).

18. The method of claim 16 or 17, wherein the substrate carrier is transported along a closed path through the vacuum deposition system, particularly wherein the closed path is shaped like an elongated rectangle as viewed from above.

19. The method of any of claims 16 to 18, wherein the substrate is input in landscape orientation into the vacuum deposition system in an input direction that is parallel to the track switch direction; and wherein the substrate is output in landscape orientation from the vacuum deposition system in an output direction that is parallel to the track switch direction.

20. The method of any of claims 16 to 19, wherein the substrate is input into the vacuum deposition system at a substrate input position between one of the first and second track switch modules and the plurality of deposition chambers; and the substrate is output from the vacuum deposition system at a substrate output position between one of the first and second track switch modules and the plurality of deposition chambers.

21. The method of any of claims 16 to 20, wherein the layers of the stack are continuously deposited on the substrate without use of a shadow mask or fine metal mask.

22. A method of manufacturing a device in the vacuum deposition system of any of claims 1 to 21 , comprising: inputting a substrate into the vacuum deposition system in a non-vertical orientation; changing a substrate orientation to an essentially vertical orientation; depositing a stack of layers including at least one organic material on the substrate while the substrate is in the essentially vertical orientation; changing the substrate orientation to the non-vertical orientation; and outputting the substrate from the vacuum deposition system in the non-vertical orientation.