WO2024198211A1 - Insertion loss calculation model construction method and apparatus, device, and storage medium - Google Patents

Abstract

The present application provides an insertion loss calculation model construction method and apparatus, a device, and a storage medium. The method comprises: acquiring a dielectric loss factor of adhesive film layers (S101); forming surface-treated metal foils on two sides of each adhesive film layer to obtain a first circuit board precursor (S102); manufacturing a first microstrip line by using the first circuit board precursor, and measuring the insertion loss of the first microstrip line (S103); substituting the insertion loss of the first microstrip line and the dielectric loss factor of the adhesive film layer into a roughness calculation model to calculate the equivalent roughness of the metal foil after surface treatment (S104); and constructing an insertion loss calculation model on the basis of the equivalent roughness of the metal foil (S105).

Description

Insertion loss calculation model construction method, device, equipment and storage medium

This application claims the priority of the Chinese patent application filed with the China Patent Office on March 31, 2023, with application number 202310341613.0, the entire contents of which are incorporated by reference into this application.

Technical Field

The present application relates to the field of communication technology, and for example, to a method, device, equipment and storage medium for constructing an insertion loss calculation model.

Background Art

During the design of circuit boards, the surface roughness of metal foil (such as copper foil) has a great impact on the insertion loss of transmission lines in high-frequency applications. How to extract and simulate the impact of roughness on insertion loss has become a hot topic in the industry.

Most of the related technologies are based on the analysis and calculation of the surface roughness of pure metal foils. However, in actual high-frequency materials, the dielectric loss factor of the dielectric layer is low, resulting in weak molecular polarity, which causes the adhesion between the metal foil and the dielectric to deteriorate. Therefore, some copper foil manufacturers need to perform surface treatment on the surface of the metal foil and add some other metals, such as nickel and chromium, to enhance the adhesion between the metal foil and the dielectric. These added metals may increase the insertion loss, which makes it impossible for the insertion loss calculation model to accurately describe the insertion loss effect of the metal foil surface, and the calculation results have large deviations.

Summary of the invention

The present application provides a method, device, equipment and storage medium for constructing an insertion loss calculation model, which can accurately describe the insertion loss effect on the surface of a metal foil and improve the accuracy of the insertion loss calculation model.

The present application provides a method for constructing an insertion loss calculation model, including:

Obtaining the dielectric loss factor of the film layer;

Forming surface-treated metal foil on both sides of the adhesive film layer to obtain a first circuit board precursor;

Using the first circuit board precursor to manufacture a first microstrip line, and measuring the insertion loss of the first microstrip line;

Substituting the insertion loss of the first microstrip line and the dielectric loss factor of the adhesive film layer into the roughness calculation model to calculate the equivalent roughness of the metal foil after surface treatment;

An insertion loss calculation model is constructed based on the equivalent roughness of the metal foil.

In one or more embodiments, obtaining the dielectric loss factor of the adhesive film layer includes:

Forming metal foil on both sides of the adhesive film layer to obtain a second circuit board precursor, wherein the surface roughness of the metal foil is known;

Using the second circuit board precursor to manufacture a second microstrip line, and measuring the insertion loss of the second microstrip line;

The insertion loss of the second microstrip line and the surface roughness of the metal foil are substituted into the roughness calculation model to infer the dielectric loss factor of the adhesive film layer.

In one or more embodiments, the insertion loss calculation model construction method further includes:

forming a film layer on both sides of the dielectric layer;

Forming metal foils on the adhesive film layers on both sides of the dielectric layer respectively to obtain a third circuit board precursor;

Making a third microstrip line using the third circuit board precursor, and measuring the insertion loss of the third microstrip line;

Substituting the insertion loss of the third microstrip line, the dielectric loss factor of the adhesive film layer and the surface roughness of the metal foil into the roughness calculation model, and inversely calculating the dielectric loss factor of the dielectric layer;

forming surface-treated metal foils on both sides of the dielectric layer to obtain a fourth circuit board precursor;

Using the fourth circuit board precursor to manufacture a fourth microstrip line, and measuring the insertion loss of the fourth microstrip line;

Substituting the insertion loss of the fourth microstrip line and the dielectric loss factor of the dielectric layer into the roughness calculation model to calculate the equivalent roughness of the metal foil after surface treatment;

An insertion loss calculation model is constructed based on the dielectric loss factor of the dielectric layer and the equivalent roughness of the metal foil after surface treatment.

In one or more embodiments, the roughness calculation model is a Hammerstad model, a hemisphere model or a Huray model.

In one or more embodiments, the metal foil is a copper foil.

The present application also provides a device for constructing an insertion loss calculation model, comprising:

A dielectric loss factor acquisition module, configured to acquire a dielectric loss factor of the adhesive film layer;

A first manufacturing module is configured to form a surface-treated metal foil on both sides of the adhesive film layer to obtain a first circuit board precursor;

A second manufacturing module is configured to manufacture a first microstrip line using the first circuit board precursor and measure the insertion loss of the first microstrip line;

An equivalent roughness calculation module is configured to substitute the insertion loss of the first microstrip line and the dielectric loss factor of the adhesive film layer into a roughness calculation model to calculate the equivalent roughness of the metal foil after surface treatment;

The insertion loss calculation model building module is configured to build an insertion loss calculation model based on the equivalent roughness of the metal foil.

The present application also provides an electronic device, including:

one or more processors;

a memory configured to store one or more programs;

When the one or more programs are executed by the one or more processors, the one or more processors implement the insertion loss calculation model construction method provided in the present application.

The present application also provides a computer-readable storage medium, in which computer-executable instructions are stored. When the computer-executable instructions are executed by a processor, they are used to implement the insertion loss calculation model construction method provided in the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a flow chart of a method for constructing an insertion loss calculation model provided in an embodiment of the present application;

FIG2 is a schematic diagram of a structure in which metal foil is formed on both sides of the adhesive film layer;

FIG3 is a schematic diagram of the structure of a microstrip line provided in an embodiment of the present application;

FIG4 is a schematic diagram of the structure of the metal foil after the surface treatment is formed on both sides of the film layer;

FIG5 is a flow chart of another method for constructing an insertion loss calculation model provided in an embodiment of the present application;

FIG6 is a schematic diagram of a structure in which a film layer is formed on both sides of a dielectric layer;

FIG7 is a schematic diagram of a structure in which metal foils are respectively formed on the adhesive film layers on both sides of the dielectric layer;

FIG8 is a schematic diagram of the structure of the metal foil after surface treatment formed on both sides of the dielectric layer;

FIG9 is a schematic diagram of the structure of an insertion loss calculation model building device provided in an embodiment of the present application;

FIG. 10 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

DETAILED DESCRIPTION

The following will describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. The described embodiments are only part of the embodiments of the present application, not all of the embodiments.

The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. The data used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not listed or inherent to these processes, methods, products or devices.

FIG1 is a flow chart of a method for constructing an insertion loss calculation model provided in an embodiment of the present application. This embodiment can be applied to extracting the equivalent roughness of a metal foil after surface treatment and constructing an insertion loss calculation model based on the equivalent roughness. In the case of an insertion loss calculation model, the method can be executed by an insertion loss calculation model construction device provided in an embodiment of the present application. The device can be implemented by software and/or hardware and is usually configured in an electronic device. As shown in FIG1, the insertion loss calculation model construction method includes the following steps.

S101, obtaining a dielectric loss factor of a film layer.

In an embodiment of the present application, the adhesive film layer can be an adhesive film used to attach the metal foil. For example, the material of the adhesive film layer can be a thermosetting acrylic adhesive film. During the application process, it is only necessary to tear off the release film on the surface, and then the metal foil can be attached to the adhesive film layer by hot pressing.

For example, the dielectric loss factor (Df) of the adhesive film layer can be a pre-known parameter, or can be calculated by the following method, which is not limited in the present embodiment. The dielectric loss factor is the ratio of the energy lost in the insulating plate in the signal line to the energy still in the line.

Illustratively, in some embodiments of the present application, obtaining the dielectric loss factor of the adhesive film layer includes the following sub-steps.

1. Forming metal foils on both sides of the adhesive film layer to obtain a second circuit board precursor, wherein the surface roughness of the metal foils is known.

FIG2 is a schematic diagram of a structure in which metal foil is formed on both sides of the adhesive film layer. As shown in FIG2 , metal foil 120 is formed on both sides of the adhesive film layer 110 to obtain a second circuit board precursor, wherein the second circuit board precursor is used to prepare a circuit board, for example, a microstrip line is prepared using the second circuit board precursor. The surface roughness of the metal foil 120 is known. Exemplarily, in the embodiment of the present application, the metal foil 120 may be a pure copper foil. In the embodiment of the present application, the metal foil 120 may be attached to the adhesive film layer 110 by hot pressing.

2. Use the second circuit board precursor to make a second microstrip line, and measure the insertion loss of the second microstrip line.

In the embodiment of the present application, the second microstrip line is made by using the second circuit board precursor. FIG3 is a schematic diagram of the structure of a microstrip line provided in the embodiment of the present application. As shown in FIG3, the microstrip line is a strip conductor (signal line) which is isolated from the ground plane by a dielectric. In the embodiment of the present application, the metal foil 120 on one side of the adhesive film layer 110 is etched to obtain a strip conductor 121, and the metal foil 120 on the other side is used as the ground plane, and the strip conductor 121 is isolated from the ground plane by the adhesive film layer 110.

After obtaining the second microstrip line, the insertion loss (insertion loss) of the second microstrip line is measured. Insertion loss is usually defined as the ratio of the power Pl received by the output port to the source power Pi of the input port, and is usually expressed in decibels (Decibel, dB). In the embodiment of the present application, an electrical signal is applied to the second microstrip line, and the ratio of the power of the electrical signal output by the second microstrip line to the power of the electrical signal input to the second microstrip line is calculated as the insertion loss of the second microstrip line.

3. Substitute the insertion loss of the second microstrip line and the surface roughness of the metal foil into the roughness calculation model to infer the dielectric loss factor of the film layer.

After measuring the insertion loss of the second microstrip line, the insertion loss of the second microstrip line and the surface roughness of the metal foil are substituted into the roughness calculation model to infer the dielectric loss factor of the film layer. Among them, the roughness calculation model can be a hammerstad model, a hemisphere model or a Huray model, which is not limited in the embodiments of the present application. Among them, the hammerstad model has a good simulation of the low roughness model. The model is based on the form of sawtooth and assumes that the signal propagates along the surface. It is not actually sawtoothed when viewed through an optical microscope. At the same time, the signal will not propagate along the sawtooth surface, but propagates along the nearest peak. Although the premise assumption is wrong, the low roughness model has a good fit, but the fit to the high roughness copper foil is poor. The hemisphere model fits better in the high frequency band, but worse in the low frequency. The Huray model is more detailed. The model uses small ball stacking to approach the actual situation and fits better.

S102, forming a surface-treated metal foil on both sides of the adhesive film layer to obtain a first circuit board precursor.

FIG4 is a schematic diagram of a structure in which a surface-treated metal foil is formed on both sides of the adhesive film layer. As shown in FIG4 , in the embodiment of the present application, the same adhesive film layer 110 as in the above is taken, and then a surface-treated metal foil 130 is formed on both sides of the adhesive film layer 110 to obtain a first circuit board precursor. Exemplarily, the surface-treated metal foil 130 can be attached to the adhesive film layer 110 by hot pressing. Exemplarily, the metal foil 130 is a metal foil obtained by surface-treating the metal foil 120, and the surface treatment may include doping, adding some other metals, such as nickel, chromium, etc., to enhance the adhesion between the metal foil and the adhesive film layer.

S103: Use the first circuit board precursor to make a first microstrip line, and measure the insertion loss of the first microstrip line.

In the embodiment of the present application, the first microstrip line is made using the first circuit board precursor, and the insertion loss of the first microstrip line is measured. The process of making the first microstrip line is similar to the process of making the second microstrip line, and the embodiment of the present application will not be repeated here.

S104, substituting the insertion loss of the first microstrip line and the dielectric loss factor of the adhesive film layer into a roughness calculation model to calculate the equivalent roughness of the metal foil after the surface treatment.

After obtaining the insertion loss of the first microstrip line, the insertion loss of the first microstrip line and the dielectric loss factor of the adhesive film layer are substituted into the roughness calculation model to calculate the equivalent roughness of the metal foil after surface treatment. The equivalent roughness is used to characterize the influence of roughness and surface treatment on the insertion loss. The roughness calculation model can be a hammerstad model, a hemisphere model or a Huray model, which is not limited in the embodiments of the present application.

S105. Construct an insertion loss calculation model based on the equivalent roughness of the metal foil.

In the embodiment of the present application, an insertion loss calculation model is constructed based on the equivalent roughness of the second metal foil. The equivalent roughness is used to characterize the influence of roughness and surface treatment on insertion loss, so that the insertion loss calculation model constructed based on the equivalent roughness of the metal foil can accurately describe the influence of the metal foil surface on insertion loss, thereby improving the accuracy of the insertion loss calculation model.

The insertion loss calculation model construction method provided in the embodiment of the present application includes: obtaining the dielectric loss factor of the adhesive film layer, forming a surface-treated metal foil on both sides of the adhesive film layer to obtain a first circuit board precursor, and using A first microstrip line is made using a first circuit board precursor, and the insertion loss of the first microstrip line is measured. The insertion loss of the first microstrip line and the dielectric loss factor of the adhesive film layer are substituted into a roughness calculation model to calculate the equivalent roughness of the metal foil after surface treatment. An insertion loss calculation model is constructed based on the equivalent roughness of the metal foil. Since the equivalent roughness is used to characterize the influence of roughness and surface treatment on the insertion loss, constructing an insertion loss calculation model based on the equivalent roughness of the metal foil can accurately describe the influence of the metal foil surface on the insertion loss, thereby improving the accuracy of the insertion loss calculation model.

FIG5 is a flow chart of another method for constructing an insertion loss calculation model provided in an embodiment of the present application. As shown in FIG5 , the method includes the following steps.

S201, obtaining a dielectric loss factor of the film layer.

In the embodiment of the present application, the dielectric loss factor of the adhesive film layer may be a pre-known parameter, or may be calculated by the method in the aforementioned embodiment, and the embodiment of the present application is not limited thereto.

S202, forming an adhesive film layer on both sides of the dielectric layer.

FIG6 is a schematic diagram of a structure in which an adhesive film layer is formed on both sides of a dielectric layer. As shown in FIG6 , an adhesive film layer 110 is formed on both sides of a dielectric layer 140. Exemplarily, the adhesive film layer 110 can be attached to the dielectric layer 140 by hot pressing. The dielectric layer 140 is a substrate of a circuit board, and its material can be a resin, for example, phenolic resin, epoxy resin, polyimide resin, polyester resin, polyphenylene ether resin, cyanate resin, polytetrafluoroethylene resin, and bismaleimide triazine resin, etc., which is not limited in the embodiments of the present application.

S203, forming metal foils on the adhesive film layers on both sides of the dielectric layer respectively to obtain a third circuit board precursor.

FIG7 is a schematic diagram of a structure in which metal foils are formed on the adhesive film layers on both sides of the dielectric layer. As shown in FIG7 , metal foils 120 are formed on the adhesive film layers 110 on both sides of the dielectric layer 140. The metal foils 120 may be pure copper foils with known surface roughness.

S204: Use the third circuit board precursor to make a third microstrip line, and measure the insertion loss of the third microstrip line.

In the embodiment of the present application, a third microstrip line is made using a third circuit board precursor, and the insertion loss of the third microstrip line is measured. The process of making the third microstrip line is similar to the process of making the second microstrip line, and the embodiment of the present application will not be repeated here.

S205 , substituting the insertion loss of the third microstrip line, the dielectric loss factor of the adhesive film layer, and the surface roughness of the metal foil into a roughness calculation model to reversely infer the dielectric loss factor of the dielectric layer.

In the embodiment of the present application, the insertion loss of the third microstrip line, the dielectric loss factor of the film layer and the surface roughness of the metal foil are substituted into the roughness calculation model to infer the dielectric loss factor of the dielectric layer. The roughness calculation model is a Hammerstad model, a hemisphere model or a Huray model, which is not limited in the embodiment of the present application.

S206, forming surface-treated metal foils on both sides of the dielectric layer to obtain a fourth circuit board precursor.

FIG8 is a schematic diagram of a structure in which a surface-treated metal foil is formed on both sides of a dielectric layer. As shown in FIG8 , in the embodiment of the present application, the same dielectric layer 140 and the surface-treated metal foil 130 as in the previous embodiment are taken, and then the surface-treated metal foil 130 is formed on both sides of the dielectric layer 140 to obtain a fourth circuit board precursor. The surface-treated metal foil 130 can be pressed onto the dielectric layer 140 by hot pressing.

S207 , using the fourth circuit board precursor to manufacture a fourth microstrip line, and measuring the insertion loss of the fourth microstrip line.

In the embodiment of the present application, a fourth microstrip line is manufactured using a fourth circuit board precursor, and the insertion loss of the fourth microstrip line is measured. The process of manufacturing the fourth microstrip line is similar to the process of manufacturing the second microstrip line, and the embodiment of the present application will not be repeated here.

S208 , substituting the insertion loss of the fourth microstrip line and the dielectric loss factor of the dielectric layer into the roughness calculation model to calculate the equivalent roughness of the metal foil after the surface treatment.

In the embodiment of the present application, after the insertion loss of the fourth microstrip line is obtained, the insertion loss of the fourth microstrip line and the dielectric loss factor of the dielectric layer are substituted into the roughness calculation model to calculate the equivalent roughness of the metal foil after surface treatment. Among them, the equivalent roughness is used to characterize the influence of roughness and surface treatment on insertion loss. The roughness calculation model is the Hammerstad model, the hemisphere model or the Huray model, which is not limited in the embodiment of the present application.

S209, constructing an insertion loss calculation model based on the dielectric loss factor of the dielectric layer and the equivalent roughness of the metal foil after surface treatment.

In the embodiment of the present application, an insertion loss calculation model is constructed based on the dielectric loss factor of the dielectric layer and the equivalent roughness of the metal foil after surface treatment.

In the insertion loss calculation model in the related art, when calculating the dielectric loss factor of the dielectric layer, the influence of the surface loss of the metal foil is not considered. However, the dielectric loss factor of the dielectric layer is often affected by the uncertainty of the metal foil surface loss factor and cannot be accurately obtained. This is because the total insertion loss is caused by factors such as the resistance of the metal foil (including skin effect), roughness, surface treatment and dielectric loss factor. The resistance of the metal foil (including skin effect) is known, and the roughness can be measured, but the other two factors are often uncertain for the circuit board factory (the method of measuring the dielectric loss factor of the dielectric layer often requires the dielectric layer to have a certain thickness and the frequency point is limited). In this way, it is impossible to accurately extract the influence of the metal foil surface treatment and the dielectric loss factor of the dielectric layer on the insertion loss, resulting in a large deviation in the insertion loss calculation model. In the embodiment of the present application, the dielectric loss factor of the dielectric layer is inferred based on the dielectric loss factor of the film layer and the surface roughness of the metal foil, and the equivalent roughness of the metal foil after surface treatment is calculated based on the dielectric loss factor of the dielectric layer. After obtaining the accurate dielectric loss factor of the dielectric layer and the equivalent roughness that characterizes the influence of roughness and surface treatment on insertion loss, an insertion loss calculation model is constructed based on the dielectric loss factor of the dielectric layer and the equivalent roughness of the metal foil after surface treatment, thereby improving the accuracy of the insertion loss calculation model.

The present application also provides a device for constructing an insertion loss calculation model. FIG. 9 is a diagram of an embodiment of the present application. A structural schematic diagram of an insertion loss calculation model construction device is provided, as shown in FIG9 , and the insertion loss calculation model construction device includes the following modules.

A dielectric loss factor acquisition module 301, configured to acquire a dielectric loss factor of the adhesive film layer;

A first manufacturing module 302 is configured to form a surface-treated metal foil on both sides of the adhesive film layer to obtain a first circuit board precursor;

A second manufacturing module 303 is configured to manufacture a first microstrip line using the first circuit board precursor and measure the insertion loss of the first microstrip line;

An equivalent roughness calculation module 304 is configured to substitute the insertion loss of the first microstrip line and the dielectric loss factor of the adhesive film layer into a roughness calculation model to calculate an equivalent roughness of the metal foil after surface treatment;

The insertion loss calculation model building module 305 is configured to build an insertion loss calculation model based on the equivalent roughness of the metal foil.

In some embodiments of the present application, the dielectric loss factor acquisition module 301 includes:

A first manufacturing unit is configured to form metal foil on both sides of the adhesive film layer to obtain a second circuit board precursor, wherein the surface roughness of the metal foil is known;

A second manufacturing unit is configured to manufacture a second microstrip line using the second circuit board precursor and measure the insertion loss of the second microstrip line;

The first loss factor calculation unit is configured to substitute the insertion loss of the second microstrip line and the surface roughness of the metal foil into a roughness calculation model to infer the dielectric loss factor of the adhesive film layer.

In some embodiments of the present application, the insertion loss calculation model building device further includes:

A third manufacturing unit is configured to form a glue film layer on both sides of the dielectric layer;

A fourth manufacturing unit is configured to form metal foils on the adhesive film layers on both sides of the dielectric layer to obtain a third circuit board precursor;

a fifth manufacturing unit, configured to manufacture a third microstrip line using the third circuit board precursor, and measure the insertion loss of the third microstrip line;

A second loss factor calculation unit is configured to substitute the insertion loss of the third microstrip line, the dielectric loss factor of the adhesive film layer and the surface roughness of the metal foil into the roughness calculation model to reversely deduce the dielectric loss factor of the dielectric layer;

A sixth manufacturing unit is configured to form a surface-treated metal foil on both sides of the dielectric layer to obtain a fourth circuit board precursor;

a seventh manufacturing unit, configured to manufacture a fourth microstrip line using the fourth circuit board precursor, and measure the insertion loss of the fourth microstrip line;

an equivalent roughness calculation unit, configured to substitute the insertion loss of the fourth microstrip line and the dielectric loss factor of the dielectric layer into the roughness calculation model to calculate the equivalent roughness of the metal foil after surface treatment;

The insertion loss calculation model building unit is configured to build an insertion loss calculation model based on the dielectric loss factor of the dielectric layer and the equivalent roughness of the metal foil after surface treatment.

In some embodiments of the present application, the roughness calculation model is a Hammerstad model, a hemisphere model or a Huray model.

In some embodiments of the present application, the metal foil is copper foil.

The above-mentioned insertion loss calculation model construction device can execute the insertion loss calculation model construction method provided in any embodiment of the present application, and has the corresponding functional modules and effects for executing the insertion loss calculation model construction method.

Figure 10 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and/or required herein.

As shown in FIG. 10 , the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform a variety of appropriate actions and processes according to the computer program stored in the ROM 12 or the computer program loaded from the storage unit 18 to the RAM 13. In the RAM 13, a variety of programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input/output (I/O) interface 15 is also connected to the bus 14.

A number of components in the electronic device 10 are connected to the I/O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information/data with other devices through a computer network such as the Internet and/or various telecommunication networks.

The processor 11 may be a variety of general and/or special processing components with processing and computing capabilities. Some examples of the processor 11 include a central processing unit (CPU), a graphics processing unit (GPU), a variety of special artificial intelligence (AI), and a variety of other processors. The processor 11 may include a plurality of processors for running machine learning model algorithms, a plurality of processors for running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor 11 executes the plurality of methods and processes described above, such as the insertion loss calculation model construction method.

In some embodiments, the insertion loss calculation model construction method may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program may be loaded and/or installed on the electronic device 10 via the ROM 12 and/or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the insertion loss calculation model construction method described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to execute the insertion loss calculation model construction method in any other appropriate manner (e.g., by means of firmware).

Various embodiments of the systems and techniques described above herein may be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard parts (ASSPs), system on chip systems (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include: being implemented in one or more computer programs that are executable and/or interpreted on a programmable system including at least one programmable processor that may be a special purpose or general purpose programmable processor that may receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

Computer programs for implementing the methods of the present application may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions/operations specified in the flow chart and/or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

In the context of this application, a computer readable storage medium may be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer readable storage medium may include an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. Alternatively, a computer readable storage medium may be a machine readable signal medium. A machine readable storage medium includes an electrical connection based on one or more wires, a portable computer disk, a hard disk, a RAM, a ROM, Erasable Programmable Read-Only Memory (EPROM), flash memory), optical fiber, compact disc read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination of the above. The storage medium can be a non-transitory storage medium.

To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a cathode ray tube (CRT) or a liquid crystal display (LCD) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: Local Area Network (LAN), Wide Area Network (WAN), blockchain network, and the Internet.

A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the respective computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and virtual private servers (VPS) services.

An embodiment of the present application further provides a computer program product, including a computer program, which, when executed by a processor, implements the insertion loss calculation model construction method provided in any embodiment of the present application.

In the process of implementing the computer program product, the computer program code for performing the operation of the present application can be written in one or more programming languages or a combination thereof, including object-oriented programming languages such as Java, Smalltalk, C++, and conventional procedural programming languages such as "C" language or similar programming languages. The program code can be completely executed on the user's computer. The program may be executed partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a LAN or WAN, or may be connected to an external computer (e.g., through the Internet using an Internet service provider).

The various forms of processes shown above can be used to reorder, add or delete steps. For example, the multiple steps recorded in this application can be executed in parallel, sequentially or in different orders, as long as the expected results of the technical solution of this application can be achieved, and this document is not limited here.

Claims (8)

A method for constructing an insertion loss calculation model, comprising: Obtaining the dielectric loss factor of the film layer; Forming surface-treated metal foil on both sides of the adhesive film layer to obtain a first circuit board precursor; Using the first circuit board precursor to manufacture a first microstrip line, and measuring the insertion loss of the first microstrip line; Substituting the insertion loss of the first microstrip line and the dielectric loss factor of the adhesive film layer into a roughness calculation model to calculate the equivalent roughness of the surface-treated metal foil; An insertion loss calculation model is constructed based on the equivalent roughness of the metal foil. The method according to claim 1, wherein obtaining the dielectric loss factor of the adhesive film layer comprises: forming metal foils on both sides of the adhesive film layer to obtain a second circuit board precursor, wherein the surface roughness of the metal foils is known; Using the second circuit board precursor to manufacture a second microstrip line, and measuring the insertion loss of the second microstrip line; The insertion loss of the second microstrip line and the surface roughness of the metal foil are substituted into the roughness calculation model to infer the dielectric loss factor of the adhesive film layer. The method according to claim 1, further comprising: forming the adhesive film layer on both sides of the dielectric layer; Forming metal foils on the adhesive film layers on both sides of the dielectric layer respectively to obtain a third circuit board precursor; Making a third microstrip line using the third circuit board precursor, and measuring the insertion loss of the third microstrip line; Substituting the insertion loss of the third microstrip line, the dielectric loss factor of the adhesive film layer and the surface roughness of the metal foil into the roughness calculation model, and inversely calculating the dielectric loss factor of the dielectric layer; forming the surface-treated metal foil on both sides of the dielectric layer to obtain a fourth circuit board precursor; Using the fourth circuit board precursor to manufacture a fourth microstrip line, and measuring the insertion loss of the fourth microstrip line; Substituting the insertion loss of the fourth microstrip line and the dielectric loss factor of the dielectric layer into the roughness calculation model to calculate the equivalent roughness of the surface-treated metal foil; The insertion loss calculation model is constructed based on the dielectric loss factor of the dielectric layer and the equivalent roughness of the surface-treated metal foil. The method according to any one of claims 1 to 3, wherein the roughness calculation model is a Hammerstad model, a hemisphere model or a Huray model. The method according to any one of claims 1 to 3, wherein the metal foil is a copper foil. A device for constructing an insertion loss calculation model, comprising: A dielectric loss factor acquisition module, configured to acquire a dielectric loss factor of the adhesive film layer; A first manufacturing module is configured to form a surface-treated metal foil on both sides of the adhesive film layer to obtain a first circuit board precursor; A second manufacturing module is configured to manufacture a first microstrip line using the first circuit board precursor and measure the insertion loss of the first microstrip line; An equivalent roughness calculation module, configured to substitute the insertion loss of the first microstrip line and the dielectric loss factor of the adhesive film layer into a roughness calculation model to calculate the equivalent roughness of the surface-treated metal foil; The insertion loss calculation model building module is configured to build an insertion loss calculation model based on the equivalent roughness of the metal foil. An electronic device, comprising: one or more processors; a memory configured to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the insertion loss calculation model construction method according to any one of claims 1 to 5. A computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are executed by a processor, they are used to implement the insertion loss calculation model construction method according to any one of claims 1 to 5.