WO2024185001A1 - Flexible conductor and electrical apparatus - Google Patents
Flexible conductor and electrical apparatus Download PDFInfo
- Publication number
- WO2024185001A1 WO2024185001A1 PCT/JP2023/008277 JP2023008277W WO2024185001A1 WO 2024185001 A1 WO2024185001 A1 WO 2024185001A1 JP 2023008277 W JP2023008277 W JP 2023008277W WO 2024185001 A1 WO2024185001 A1 WO 2024185001A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flexible conductor
- copper foils
- fastening
- copper foil
- flexible
- Prior art date
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- 239000004020 conductor Substances 0.000 title claims abstract description 128
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 99
- 239000011889 copper foil Substances 0.000 claims abstract description 90
- 238000007747 plating Methods 0.000 claims description 27
- 230000013011 mating Effects 0.000 claims description 15
- 239000010410 layer Substances 0.000 description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R35/00—Flexible or turnable line connectors, i.e. the rotation angle being limited
- H01R35/02—Flexible line connectors without frictional contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/34—Conductive members located under head of screw
Definitions
- the present disclosure relates to ultrasonically bonded flexible conductors and electrical devices including the flexible conductors.
- Prior art discloses a flexible conductor that has a conductive and flexible flexible portion formed by stacking multiple thin copper plates, and terminal portions provided at both ends of the flexible portion, and that in manufacturing this flexible conductor, the thin plates are tin-plated, and the tin plating is melted by resistance welding or the like to join the stacked thin plates (for example, Patent Document 1).
- the present disclosure has been made to solve the problems described above, and aims to provide a flexible conductor in which multiple copper foils are ultrasonically bonded, and an electrical device equipped with the flexible conductor.
- the flexible conductor disclosed herein comprises multiple copper foils stacked in the thickness direction, and the multiple copper foils are ultrasonically bonded to each other at both ends in the extension direction of the copper foil.
- the electrical device includes the above-mentioned flexible conductor, and of the first and second ends of the flexible conductor, a movable part that is fastened to the first end and a terminal to which the second end is fastened.
- the flexible conductor according to the present disclosure can provide a flexible conductor with a low electrical resistance value when current is applied, compared to conventional flexible conductors in which laminated copper foils are joined by tin plating.
- the electrical device according to the present disclosure can provide an electrical device with a low electrical resistance value.
- FIG. 1 is a schematic side view showing a state in which a switch including a flexible conductor according to a first embodiment of the present disclosure is in an open state.
- 1 is a schematic side view showing a state in which a switch including a flexible conductor according to a first embodiment of the present disclosure is closed;
- FIG. 1 is a perspective view of a flexible conductor according to a first embodiment of the present disclosure.
- FIG. 11 is a perspective view of a flexible conductor according to a second embodiment of the present disclosure.
- FIG. 11 is a perspective view of a flexible conductor according to a third embodiment of the present disclosure.
- 6 is a schematic diagram of a flexible conductor according to a third embodiment of the present disclosure, corresponding to a cross section taken along line AA' in FIG. 5.
- FIG. 1 is a schematic side view showing a state in which a switch 11 including the flexible conductor 1 in the first embodiment is in an open state, that is, a state in which a movable contact 4 and a fixed contact 5, which will be described later, are not in contact with each other.
- a part of the front surface of the vacuum interrupter 16 is omitted to show the inside of the vacuum interrupter 16.
- the switch 11 includes a flexible conductor 1, a first terminal 12 (a fixed terminal on the flexible conductor side electrically connected to the movable contact 4 via the flexible conductor 1), a driving device tip 13, a first movable part 14 (a movable part connected to the movable contact 4), a vacuum valve 16, a fixed part 17 (a movable part connected to the fixed contact 5), a second terminal 19 (a fixed terminal on the vacuum valve side electrically connected to the fixed contact 5), a bolt 20 and a nut 23 that fix the first terminal 12 and the flexible conductor 1, a bolt 21 that fixes the fixed part 17 and the second terminal 19, and a nut 22 that fixes the first movable part 14, the flexible conductor 1, and the driving device tip 13.
- the switch 11 includes the fixed contact 5 and the fixed part 17 as fixed members, and the movable contact 4 and the first movable part 14 as movable parts.
- the flexible conductor 1 includes a flexible part 38 having electrical conductivity and flexibility, a first end 32, and a second end 33.
- the first end 32 and the second end 33 are located so as to sandwich both ends of the flexible part 38.
- the first end 32 and the second end 33 may be a part on one end side or the other end side of the flexible part 38.
- the first end 32 and the second end 33 of the flexible conductor 1 are not limited to edges, etc., but may be a part excluding the flexible part 38.
- the flexible part 38 is not in the center of the flexible conductor 1 but is located off-center, one end may be the central part of the flexible conductor 1.
- the first end 32 of the flexible conductor 1 is fastened to the driving device tip 13 and the first movable part 14, for example, by a nut 22. That is, the first end 32 of the flexible conductor 1 is connected to the movable part of the switch 11. That is, the first end 32 of the flexible conductor 1 is electrically connected to the first movable part 14.
- the first end 32 of the flexible conductor 1 only needs to be connected to the first movable part 14, and does not have to be connected to the tip 13 of the driving device.
- the drive device tip 13 and the first movable part 14 are fastened together with a nut 22.
- the driving device tip 13 is connected to an external driving device (not shown).
- the driving device is driven, for example, by spring force.
- the driving device includes an insulating rod connected to the first movable part 14.
- the second end 33 of the flexible conductor 1 is fastened to the first terminal 12, for example, by a bolt 20 and a nut 23. That is, the second end 33 of the flexible conductor 1 of the switch 11 is connected to the fixed part of the switch 11. In addition, the second end 33 of the flexible conductor 1 is electrically connected to the first terminal 12.
- first end 32 and the second end 33 that are coupled to the driving device tip 13, the first movable part 14, and the first terminal 12 as the mating members do not refer only to the outer periphery or the end of the flexible conductor 1, and the part that is coupled to the mating member may be located closer to the center than the outer periphery of the flexible conductor 1.
- the fixed portion 17 and the second terminal 19 are fastened with a bolt 21. In addition, the fixed portion 17 and the second terminal 19 are electrically connected.
- FIG. 2 is a schematic side view showing the state in which the switch 11 including the flexible conductor 1 of embodiment 1 is closed, i.e., the state in which the movable contact 4 and the fixed contact 5 are in contact.
- FIG. 2 omits part of the front of the vacuum valve 16 to show the inside of the vacuum valve 16.
- the same reference numerals as in FIG. 1 indicate the same configuration, and therefore explanations are omitted.
- the movable contact 4 and the fixed contact 5 in the vacuum valve 16 are in contact.
- the electrical circuit of the switch 11 is in a closed state.
- the driving device transmits power to the driving device tip 13 to move in the direction of the arrow shown in FIG. 2.
- the driving device tip 13 When power is transmitted to the driving device tip 13, the power is transmitted to the first movable part 14 connected to the driving device tip 13.
- the flexible conductor 1 follows the movement of the first movable part 14 when the switch 11 transitions from an open state to a closed state and from a closed state to an open state.
- the switch 11 to which the flexible conductor 1 of the present invention is applied is not limited to a circuit breaker that uses a vacuum valve, but may be other electrical equipment such as a disconnector in which a fixed part and a movable part are electrically connected.
- the flexible conductor 1 can be easily adapted for use in switches and other electrical equipment having a different configuration from the switch 11 of this embodiment.
- FIG. 3 is a perspective view of the flexible conductor 1 according to embodiment 1.
- the flexible conductor 1 has multiple copper foils 41 stacked in the thickness direction.
- the multiple copper foils 41 are, for example, rectangular with long and short sides.
- the thickness of the copper foils 41 is, for example, about 0.1 mm.
- the flexible conductor 1 also includes ultrasonic joints 34, fastening surfaces 35, and fastening holes 36.
- the ultrasonic joints 34 are located at both ends of the multiple copper foils 41 in the long side direction.
- the outermost copper foil 42 has a fastening surface 35 for fastening to a mating member on a surface different from the laminated surface, i.e., when the multiple copper foils 41 are laminated, the surface different from the laminated surfaces of the two copper foils located on the outermost sides in the lamination direction.
- the fastening surface is referred to as the surface of the surface layer excluding the flexible portion 38, rather than the entire surface of the surface layer of the flexible conductor 1.
- the area where the flexible conductor 1 is fastened to the mating member may be a part of the fastening surface 35, and may be in contact with the first movable portion 14 at the fastening area 37 shown in FIG. 3, for example.
- the ultrasonic joint 34 of the flexible conductor 1 multiple stacked copper foils 41 are ultrasonically joined to each other.
- the ultrasonic joint 34 refers to the portion where multiple stacked copper foils 41 are ultrasonically joined to each other.
- the ultrasonic joints 34 are located on the fastening surface 35 at locations that correspond to the four corners of the copper foil 41.
- the x marks in Figure 3 are processing marks that occur on the conductor surface during ultrasonic bonding.
- the processing marks occur at the position clamped between the horn and anvil of the equipment that performs the ultrasonic bonding.
- Figure 3 shows a case where there are three processing marks at each of the four corners of the copper foil 41 where the ultrasonic bonding portion 34 is located, but the number of processing marks is not limited to three.
- the location of the ultrasonic joints 34 is not limited to the four corners of the copper foil 41, as long as the location does not impair the flexibility of the flexible conductor 1.
- the ultrasonic bonding portion 34 where ultrasonic bonding is performed is not limited to the outer periphery of the flexible conductor 1 as shown in FIG. 4, but may be provided in the center, such as a portion adjacent to the fastening hole 36. It may also be provided in a portion other than the fastening region 37.
- ultrasonic bonding is performed on the ultrasonic bonding portion 34 of the flexible conductor 1, ultrasonic vibrations are applied to the copper foil 41, so that adjacent copper foils 41 are bonded together and integrated.
- the ultrasonic joint 34 of the flexible conductor 1 is joined to integrate the multiple copper foils 41 in the thickness direction, so that when attaching the flexible conductor 1 to the movable part or terminal, the flexible conductor 1 can be easily electrically connected to the drive device tip 13 of the switch 11, the first movable part 14, the first terminal 12, etc., without the copper foils 41 coming apart.
- the copper foils 41 are not joined to each other. Because the copper foils 41 are not joined to each other, the copper foils 41 can bend freely, and the flexible conductor 1 can follow the movement of the first movable part 14.
- the multiple copper foils 41 of the flexible conductor 1 are preferably ultrasonically bonded to one another in the area corresponding to the fastening surface 35. It is also desirable that the ultrasonic bonded portion 34 at least partially overlaps with the area corresponding to the fastening region 37.
- the area corresponding to the fastening surface 35 refers to the area of the copper foil 41 onto which the fastening surface 35 is projected in the thickness direction of the flexible conductor 1.
- the bonding at the ultrasonic bonding portion 34 can suppress contact resistance by pressing the fastening region 37 when attaching the flexible conductor 1 in addition to the bonding by ultrasonic bonding, and can lower the electrical resistance compared to a simple ultrasonic bond.
- Ultrasonic bonding can solid-phase bond the copper foils together.
- the flexible conductor 1 according to this embodiment is bonded by ultrasonic bonding while the copper foils are still in their original state. This means that unlike methods such as spot welding, which melt the tin plating to bond the copper foils, there is no need to plate the copper foils 41 with tin or other metals for bonding.
- the electrical resistance of the flexible conductor 1 can be made lower than that of a flexible conductor connected by conventional plating. Therefore, when creating a flexible conductor with the same resistance, the number of copper foils 41 that form the flexible conductor 1 can be reduced compared to a flexible conductor that uses tin plating.
- each copper foil 41 is not plated, the process of plating the copper foil 41 can be omitted, thereby reducing manufacturing costs.
- the laminated copper foil 41 is ultrasonically bonded without a plated layer, but some layers may be bonded through a plated layer.
- the flexible conductor 1 having the fastening hole 36 makes it easier to use it in switches and other electrical equipment other than the switch 11 of this embodiment, compared to when the flexible conductor 1 does not have the fastening hole 36.
- Fastening holes 36 do not have to be provided.
- the flexible conductor 1 of embodiment 1 i.e., the flexible conductor 1 in which each layer is ultrasonically bonded to each other, the vacuum valve 16, and the switch 11 to which the vacuum valve is attached (excluding the vacuum valve 16, the flexible conductor 1, etc.).
- the ultrasonically bonded flexible conductor 1 can be manufactured by applying ultrasonic vibrations between the copper foils 41 stacked in the thickness direction. The manufacturing method of the flexible conductor 1 will be described in detail later.
- the vacuum valve 16 is attached to the switch 11, and then the flexible conductor 1 is attached to the first movable part 14 (movable electrode rod) connected to the vacuum valve 16.
- the first movable part 14 is attached to the first movable part 14 through the fastening hole 36 of the flexible conductor 1 so that the first movable part 14 passes through the fastening hole 36, and the first movable part 14 and the flexible conductor 1 are joined.
- each copper foil 41 of the flexible conductor 1 is ultrasonically bonded at the ultrasonic bonding part 34, and each copper foil 41 does not come apart, so it can be easily attached to the first movable part 14.
- the first movable part 14 and the flexible conductor 1 can be attached by fastening with a nut.
- the first movable part 14 and the flexible conductor 1 can be attached by other methods such as fitting, without being limited to fastening with a nut.
- the flexible conductor 1 is attached to the first terminal 12.
- the fastening hole of the first terminal 12 is aligned with the fastening hole 36 of the flexible conductor 1, and the flexible conductor 1 is attached by fastening the flexible conductor 1 with a nut 23 through a bolt 20.
- the method of attaching the first movable part 14 and the flexible conductor 1 is not limited to fastening with a bolt, and other methods such as fitting may also be used.
- the order of attachment is not limited to the above, and the order of attachment may be changed as appropriate, for example by previously connecting a part of the flexible conductor 1 before attaching the vacuum valve 16 to the switch 11. Also, while the method of manufacturing the switch 11 having the vacuum valve 16 has been described here, other electrical devices such as disconnectors can be manufactured in a similar manner.
- Embodiment 2 The flexible conductor 2 in the second embodiment will be described with reference to Fig. 4. Description of the same configuration as in the first embodiment will be omitted.
- Fig. 4 the same reference numerals as in Figs. 1 to 3 indicate the same or corresponding parts.
- FIG. 4 is a perspective view of the flexible conductor 2 according to the second embodiment. As shown in FIG. 4, the flexible conductor 2 of this embodiment differs from the flexible conductor 1 of the first embodiment in the position of the ultrasonic joint 34. The following will focus on the differences from the flexible conductor 1 of the first embodiment.
- the ultrasonic joint 34 is located in a range of the fastening surface 35 that includes the fastening hole 36. In other words, the ultrasonic joint 34 is included in the fastening surface 35. Note that the ultrasonic joint 34 and the fastening surface 35 may partially overlap.
- the ultrasonic joint 34 may be provided in a portion adjacent to the fastening hole 36.
- the copper foils 41 in the current path are firmly bonded together.
- the electrical resistance of the flexible conductor 2 can be reduced compared to when the copper foils 41 are fastened with bolts and nuts. Furthermore, if there is no need to reduce the electrical resistance of the flexible conductor 2, the number of copper foils 41 that form the flexible conductor 2 can be reduced.
- the x marks in Figure 4 are processing marks that occur on the conductor surface during ultrasonic bonding. After ultrasonic bonding, processing marks remain on the fastening surface 35 that is fastened to the mating member, but since the processing marks are concave, they do not affect the contact with the mating member.
- the number of processing marks is not limited to the number shown in the figure.
- the arrangement pattern of the processing marks may be, for example, arranged in a grid pattern.
- Embodiment 3 The flexible conductor 3 in the third embodiment will be described with reference to Fig. 5 and Fig. 6. Description of the same configuration as in the first embodiment will be omitted.
- Fig. 5 and Fig. 6 the same reference numerals as in Figs. 1 to 4 indicate the same or corresponding parts.
- FIG. 5 is a perspective view of the flexible conductor 3 according to the third embodiment.
- FIG. 6 is a schematic diagram of the flexible conductor 3 according to the third embodiment, corresponding to a cross section taken along line A-A' in FIG. 5.
- the flexible conductor 3 of this embodiment differs from the flexible conductor 1 of the first embodiment in that a plating layer is provided on the copper foil 42. The following will focus on the differences from the flexible conductor 1 of the first embodiment.
- the flexible conductor 3 in this embodiment is located at the outermost position among the multiple copper foils 41, and the copper foil 42 that is fastened to the mating member has a plating layer of tin or the like on the side that is fastened to the mating member.
- the plating layer may be provided over the entire side of the copper foil 42 that is fastened to the mating member, or, for example, only on the fastening surface 35.
- a plating that melts due to the frictional heat generated by ultrasonic bonding such as tin plating
- the frictional heat generated between the copper foils 41 will cause the plating to melt before bonding is completed in the solid phase, causing slippage between the copper foils. Slippage will prevent the ultrasonic vibrations from being transmitted, resulting in poor bonding.
- a plating layer may be provided on the entirety or part of the copper foil 41 located on the outermost side opposite the copper foil 42 that is fastened to the opposing member, opposite the fastening surface 35 of the copper foil 42.
- plating only to the side of the copper foil 42 that is fastened to the mating member, but a plating layer may be provided on a part of the side of the copper foil 42 that is not fastened to the mating member, or a plating layer may be provided on a part of the other copper foil 41.
- the method for manufacturing a flexible conductor according to embodiments 1 to 3 includes step 101 of stacking multiple copper foils 41 in the thickness direction, and step 102 of ultrasonically joining the multiple stacked copper foils 41 to each other at both ends in the extension direction of the stacked copper foils 41.
- step 102 of ultrasonically bonding the stacked copper foils 41 to each other may include step 102a of ultrasonically bonding the stacked copper foils 41 to each other on the fastening surface 35 of the flexible conductor.
- step 102 of ultrasonically bonding the multiple stacked copper foils 41 to each other may include step 102b of ultrasonically bonding the multiple stacked copper foils 41 to each other at the corners of the stacked copper foils 41.
- the manufacturing method of the flexible conductor according to the first to third embodiments includes step 103 of forming a plating layer on the fastening surface 35 of the copper foil 41, and step 103 of forming the plating layer may be performed before the above step 101, or between the above step 101 and the above steps 102, 102a, and 102b, or even after the above steps 102, 102a, and 102b.
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
- Non-Insulated Conductors (AREA)
- Insulated Conductors (AREA)
Abstract
Description
本開示は、超音波接合された可とう導体及び上記可とう導体を含む電気機器に関する。 The present disclosure relates to ultrasonically bonded flexible conductors and electrical devices including the flexible conductors.
従来技術では、複数枚の銅からなる薄板を積層して形成された導電性及び可とう性を有する可とう部と可とう部の両端部に設けられた端子部とを備えた可とう性導体が開示されており、この可とう性導体の製造において、薄板に錫めっきを施し、抵抗溶接加工などで錫めっきを溶融させて積層された薄板間を接合させることが開示されている(例えば、特許文献1)。 Prior art discloses a flexible conductor that has a conductive and flexible flexible portion formed by stacking multiple thin copper plates, and terminal portions provided at both ends of the flexible portion, and that in manufacturing this flexible conductor, the thin plates are tin-plated, and the tin plating is melted by resistance welding or the like to join the stacked thin plates (for example, Patent Document 1).
しかしながら、従来のように、錫めっきを溶融させて積層された銅箔間を接合させる接合では、めっき層を介して接合されるため、通電時には、銅より電気抵抗値が大きい錫めっき層に電流が流れて、錫めっきのない銅箔の可とう導体に比べて電気抵抗値が増大するといった課題があった。 However, in conventional bonding methods in which the tin plating is melted to bond stacked copper foils, bonding is performed via the plating layer. This means that when electricity is passed through the tin plating layer, current flows through the tin plating layer, which has a higher electrical resistance than copper, resulting in an issue of increased electrical resistance compared to a flexible conductor made of copper foil without tin plating.
本開示は、上記のような問題点を解決するためになされたもので、複数の銅箔が超音波接合された可とう導体及び上記可とう導体を備えた電気機器を提供することを目的とする。 The present disclosure has been made to solve the problems described above, and aims to provide a flexible conductor in which multiple copper foils are ultrasonically bonded, and an electrical device equipped with the flexible conductor.
本開示に係る可とう導体は、厚み方向に積層された複数の銅箔を備え、銅箔の延伸方向の両端部において、積層された複数の前記銅箔が互いに超音波接合されたものである。 The flexible conductor disclosed herein comprises multiple copper foils stacked in the thickness direction, and the multiple copper foils are ultrasonically bonded to each other at both ends in the extension direction of the copper foil.
また、本開示に係る電気機器は、上記の可とう導体と、可とう導体が有する第1の端部及び第2の端部のうち、第1の端部と締結される可動部と、第2の端部が締結される端子と、を備えたものである。 The electrical device according to the present disclosure includes the above-mentioned flexible conductor, and of the first and second ends of the flexible conductor, a movable part that is fastened to the first end and a terminal to which the second end is fastened.
本開示に係る可とう導体によれば、従来のように積層する銅箔間を錫めっきにより接合した可とう導体に比べ、通電時に電気抵抗値の小さい可とう導体を提供することができる。また、本開示にかかる電気機器によれば、電気抵抗値の小さい電気機器を提供することができる。 The flexible conductor according to the present disclosure can provide a flexible conductor with a low electrical resistance value when current is applied, compared to conventional flexible conductors in which laminated copper foils are joined by tin plating. In addition, the electrical device according to the present disclosure can provide an electrical device with a low electrical resistance value.
以下、本開示の実施の形態について、添付の図面を参照しながら説明する。なお、図面は模式的に示されたものであり、異なる図面にそれぞれ示されているサイズ及び位置の相互関係は、必ずしも正確に記載されたものではなく、適宜変更され得る。また、以下の説明では、同様の構成要素には同じ符号を付して図示し、それらの名称及び機能も同一又は同様のものとする。よって、それらについての詳細な説明を省略する場合がある。 Below, an embodiment of the present disclosure will be described with reference to the attached drawings. Note that the drawings are schematic, and the interrelationships of sizes and positions shown in different drawings are not necessarily described accurately and may be changed as appropriate. In the following description, similar components are illustrated with the same reference numerals, and their names and functions are the same or similar. Therefore, detailed descriptions thereof may be omitted.
実施の形態1.
実施の形態1における可とう導体1について図1、2及び3を用いて説明する。図1は実施の形態1の可とう導体1を含む開閉器11が開極している状態、すなわち後述する可動接点4と固定接点5が接触していない状態を示した側面概略図である。なお、図1では、説明の便宜上、真空バルブ16の前面の一部を省略して真空バルブ16の内部を示している。
The
図1に示すように、本実施の形態に係る開閉器11は、可とう導体1と、第1の端子12(可とう導体1を介して可動接点4に電気的に接続される可とう導体側固定端子)と、駆動装置先端13と、第1の可動部14(可動接点4に接続された可動部)と、真空バルブ16と、固定部17(固定接点5に接続された可動部)と、第2の端子19(固定接点5に電気的に接続される真空バルブ側固定端子)と、第1の端子12と可とう導体1とを固定するボルト20およびナット23と、固定部17と第2の端子19とを固定するボルト21と、第1の可動部14、可とう導体1および駆動装置先端13とを固定するナット22と、とを含む。開閉器11は、固定された部材としての固定接点5及び固定部17と、可動部としての可動接点4及び第1の可動部14とを含む。
As shown in FIG. 1, the
可とう導体1は、導電性及び可とう性を有する可とう部38と、第1の端部32と、第2の端部33とを含む。第1の端部32及び第2の端部33は、可とう部38の両端部を挟むように位置している。ここで、第1の端部32及び第2の端部33は、可とう部38の一端側あるいは他端側の部位であればよい。すなわち、可とう導体1の第1の端部32及び第2の端部33は、縁部などに限定されるものではなく、可とう部38を除いた部位であればよい。例えば、可とう部38が可とう導体1の中央ではなくて、中央から外れた位置になる場合には、一方の端部は可とう導体1の中央部位であってもよい。
The
可とう導体1の第1の端部32は、駆動装置先端13及び第1の可動部14と、例えばナット22で締結されている。すなわち、可とう導体1の第1の端部32は、開閉器11の可動部分に接続されている。すなわち、可とう導体1の第1の端部32は、第1の可動部14と電気的に接続されている。
The
なお、可とう導体1の第1の端部32は、第1の可動部14と接続されていればよく、駆動装置先端13と接続されていなくてもよい。
The
駆動装置先端13と第1の可動部14はナット22で締結されている。
The
また、駆動装置先端13は外部の図示しない駆動装置と接続されている。駆動装置は、例えば、ばねの力で駆動している。なお、駆動装置は、第1の可動部14に接続される絶縁ロッドを含む。
The
可とう導体1の第2の端部33は、第1の端子12と、例えばボルト20及びナット23で締結されている。すなわち、開閉器11の可とう導体1の第2の端部33は、開閉器11の固定部分に接続されている。また、可とう導体1の第2の端部33は、第1の端子12と電気的に接続されている。
The
なお、相手部材としての駆動装置先端13、第1の可動部14及び第1の端子12に結合される第1の端部32及び第2の端部33は、可とう導体1の外周部または端部のみを指しているわけではなく、相手部材と結合される部分は、可とう導体1の外周部よりも中央側に位置していてもよい。
In addition, the
固定部17と第2の端子19とは、ボルト21で締結されている。また、固定部17と第2の端子19は電気的に接続されている。
The
図2は実施の形態1の可とう導体1を含む開閉器11が閉極している状態、すなわち可動接点4と固定接点5が接触している状態を示した側面概略図である。なお、図2では、説明の便宜上、真空バルブ16の前面の一部を省略して真空バルブ16の内部を示している。図2において図1と同符号は同一の構成を示しているため説明を省略する。
FIG. 2 is a schematic side view showing the state in which the
図2に示すように、真空バルブ16内の可動接点4と固定接点5は接触している。すなわち、開閉器11の電路が閉極している状態である。
As shown in Figure 2, the
駆動装置によって、図2に示す矢印の方向へ移動する動力が駆動装置先端13に伝えられる。駆動装置先端13に動力が伝わることにより、駆動装置先端13と接続された第1の可動部14に動力が伝わる。
The driving device transmits power to the
第1の可動部14に駆動装置先端13から動力が伝わることによって、可動接点4は固定接点5に近づく方向に移動する。可動接点4が移動することにより、可動接点4と固定接点5は接触し、図1に示す開極した状態の開閉器11は、図2に示す閉極した状態の開閉器11へと遷移する。
When power is transmitted from the
可とう導体1は、開閉器11が開極している状態から閉極している状態に遷移するとき及び閉極している状態から開極している状態に遷移するときの第1の可動部14の動きに追従する。
The
なお、本発明の可とう導体1を適用する開閉器11は、真空バルブを適用している遮断器機に限られず、固定部と可動部とが電気的に接続される断路器などの他の電気機器であってもよい。可とう導体1は、本実施の形態の開閉器11とは異なる構成の開閉器及び他の電気機器にも容易に転用することができる。
The
図3は実施の形態1に係る可とう導体1の斜視図である。
FIG. 3 is a perspective view of the
可とう導体1は、厚み方向に積層された複数の銅箔41を備えている。複数の銅箔41は、例えば、長辺及び短辺を有した長方形である。銅箔41の厚みは例えば0.1mm程度である。
The
また、可とう導体1は、超音波接合部34と、締結面35と、締結穴36とを含む。例えば、超音波接合部34は複数の銅箔41の長辺方向の両端に位置している。
The
図3に示すように、可とう導体1に含まれる複数の銅箔41のうち、最外に位置する銅箔42は、積層されている面とは異なる表面、すなわち、複数の銅箔41を積層した際、積層方向において、最も外側に位置する2枚の銅箔の積層されている面とは異なる表面にそれぞれ相手部材と締結される締結面35を有する。以下、締結面は、可とう導体1の表面層の面全体ではなく、可とう部38を除いた表層の面を締結面と呼ぶことにする。可とう導体1が相手部材と締結される領域は締結面35の一部でもよく、例えば、図3に示す締結領域37で第1の可動部14と接していてもよい。
As shown in FIG. 3, among the
可とう導体1の超音波接合部34では、積層された複数の銅箔41が互いに超音波接合されている。超音波接合部34とは、積層された複数の銅箔41が互いに超音波接合されている部分を指す。
In the ultrasonic joint 34 of the
図3に示すように、本実施の形態に係る可とう導体1は、超音波接合部34が、締結面35のうち、銅箔41の角部である四隅に対応する箇所に位置している。
As shown in FIG. 3, in the
図3に示している×印は、超音波接合時に導体表面に発生する加工痕である。加工痕は超音波接合を行う装置のホーン及びアンビルで挟まれる位置で発生する。図3では、超音波接合部34が位置する銅箔41の四隅それぞれにおいて、加工痕が3個ずつ存在する場合を示しているが、加工痕の個数は3個であることに限られない。
The x marks in Figure 3 are processing marks that occur on the conductor surface during ultrasonic bonding. The processing marks occur at the position clamped between the horn and anvil of the equipment that performs the ultrasonic bonding. Figure 3 shows a case where there are three processing marks at each of the four corners of the
また、超音波接合部34の位置は、可とう導体1が可とう性を損なわない位置であれば、銅箔41の四隅に限られない。
Furthermore, the location of the
また、超音波接合が施される、超音波接合部34は、図4に示すように、可とう導体1の外周部に限らず、締結穴36に隣接する部位など中央部に設けるようにしてもよい。また、締結領域37以外に設けてもよい。
Furthermore, the
可とう導体1の超音波接合部34は、超音波接合を施される際に、銅箔41に超音波振動が印加されることにより、隣接する銅箔41同士が接合され一体化する。
When ultrasonic bonding is performed on the
可とう導体1の超音波接合部34が接合されて複数の銅箔41が厚み方向に一体化していることにより、可とう導体1を可動部や端子に取り付ける際に、各銅箔41をばらけさせることなく、可とう導体1を開閉器11の駆動装置先端13、第1の可動部14及び第1の端子12等と容易に電気的に接続させることができる。
The ultrasonic joint 34 of the
可とう導体1の超音波接合部34以外の部分においては、銅箔41は互いに接合されていない。銅箔41が互いに接合されていないことにより、銅箔41は自由に撓むことができ、可とう導体1は第1の可動部14の動きに追従できる。
In parts of the
可とう導体1の複数の銅箔41は、締結面35に対応する領域において互いに超音波接合されることが望ましい。また、超音波接合部34は締結領域37に対応する領域と少なくとも一部が重複することが望ましい。締結面35に対応する領域とは、銅箔41のうち、可とう導体1の厚み方向に対して締結面35が射影される領域を指す。
The multiple copper foils 41 of the
締結領域37の少なくとも一部と重複する超音波接合部34に超音波接合を施すことにより、超音波接合部34における接合は、超音波接合による接合に加え、可とう導体1の取り付け時に、締結領域37が押圧されることにより接触抵抗を抑制することができ、単に超音波接合したものに比べ、電気抵抗を低くすることができる。
By performing ultrasonic bonding on the
超音波接合は、素地の銅箔同士を固相結合することができる。本実施の形態に係る可とう導体1は、超音波接合により、素地の銅箔のまま接合させているため、スポット溶接加工などで錫めっきを溶融させて銅箔を接合する手法と異なり、接合のために各銅箔41に錫などのめっきを施す必要がない。
Ultrasonic bonding can solid-phase bond the copper foils together. The
このように、各銅箔41間の接合を銅箔より電気抵抗値が高い錫めっきを介することなく、素地の銅箔のまま銅箔同士を直接接合することで、可とう導体1の電気抵抗値を従来のようなめっきにより接続したものに比べて低くすることができる。よって、同等の抵抗値の可とう導体を作成する場合、錫めっきを用いた可とう導体に比べて可とう導体1を形成する銅箔41の枚数を減らすことができる。
In this way, by directly joining the copper foils 41 together without using tin plating, which has a higher electrical resistance than copper foil, the electrical resistance of the
また、各銅箔41にめっきが施されないことで、銅箔41にめっきを施す工程を省くことができ、製造コストを低減することができる。
In addition, since each
また、素地の銅箔をスポット溶接し、可とう導体を作成する工法もあるが、高温で銅が溶融するため、表面に酸化被膜が生成されるため、酸化被膜を除去する必要がある。超音波接合する場合は、固相状態での接合であるため、銅などの母材融点以下で接合でき、酸化被膜が生成されない。 There is also a method of spot welding the base copper foil to create a flexible conductor, but because copper melts at high temperatures, an oxide film forms on the surface, which must be removed. With ultrasonic bonding, bonding occurs in a solid state, so bonding can be done below the melting point of the base material, such as copper, and no oxide film is formed.
なお、超音波接合部34において、積層された銅箔41はめっき層を介することなく超音波接合されることが望ましいが、めっき層を介して接合された層が一部存在してもよい。
In addition, in the
図3に示すように、可とう導体1は締結面35に締結穴36を有する。可とう導体1は締結穴36で相手部材と締結される。締結される際に、ボルト20、ナット22及びナット23が用いられる。可とう導体1は締結穴36で相手部材と締結される場合、ボルトとナットとによる締結に限らず、はめ込み、溶接等の手段であっても構わない。
As shown in FIG. 3, the
可とう導体1が締結穴36を有することにより、締結穴36を有さない場合に比べ、本実施の形態の開閉器11とは異なる開閉器及び他の電気機器に転用することがさらに容易となる。
The
なお、締結穴36を設けなくてもよい。 Fastening holes 36 do not have to be provided.
次に、本実施の形態の開閉器11の製造方法について説明する。
Next, we will explain the manufacturing method of the
はじめに、実施の形態1の可とう導体1、すなわち各層が互いに超音波接合された可とう導体1、真空バルブ16、真空バルブが取り付けられる開閉器11(真空バルブ16や可とう導体1等を除く)を用意する。超音波接合された可とう導体1は、超音波振動を厚み方向に積層された銅箔41間に与えることで製造することができる。なお、可とう導体1の製造方法の詳細は後述する。
First, prepare the
次に、真空バルブ16を開閉器11に取り付け、その後、真空バルブ16と接続された第1の可動部14(可動電極棒)に可とう導体1を取り付ける。可とう導体1の締結穴36に第1の可動部14が貫通するよう、第1の可動部14に締結穴36を通して取り付け、第1の可動部14と可とう導体1とを結合すればよい。このとき、可とう導体1の各銅箔41は超音波接合部34で超音波接合されており、各銅箔41がばらけないので、容易に第1の可動部14に取り付けることができる。第1の可動部14と可とう導体1の取り付けはナットにより締結すればよい。第1の可動部14と可とう導体1の取り付けはナットによる締結に限らず、はめ込みなど他の手法で取り付けてもよい。
Next, the
次に、第1の端子12に可とう導体1を取り付ける。第1の端子12の締結穴と可とう導体1の締結穴36との位置合せをし、ボルト20を通してナット23で固定することで取り付けることができる。第1の可動部14と可とう導体1の取り付けはボルトによる締結に限らず、はめ込みなど他の手法で取り付けてもよい。
Next, the
なお、取り付けの順番は上記に限定したものではなく、真空バルブ16を開閉器11に取り付ける前に可とう導体1の一部を予め結合させておくなど取り付けの順番は適宜変更してもよい。また、ここでは真空バルブ16を有する開閉器11の製造法について説明したが、同様にして断路器などの他の電気機器を製造することができる。
The order of attachment is not limited to the above, and the order of attachment may be changed as appropriate, for example by previously connecting a part of the
実施の形態2.
実施の形態2における可とう導体2について図4を用いて説明する。実施の形態1と同様の構成については説明を省略する。また、図4において図1から3と同一の符号は同一又は相当部分を示す。
Embodiment 2.
The flexible conductor 2 in the second embodiment will be described with reference to Fig. 4. Description of the same configuration as in the first embodiment will be omitted. In Fig. 4, the same reference numerals as in Figs. 1 to 3 indicate the same or corresponding parts.
図4は実施の形態2に係る可とう導体2の斜視図である。本実施の形態の可とう導体2は、図4に示すように、超音波接合部34の位置が、実施の形態1の可とう導体1と異なる。以下、実施の形態1の可とう導体1と異なる点を中心に説明する。
FIG. 4 is a perspective view of the flexible conductor 2 according to the second embodiment. As shown in FIG. 4, the flexible conductor 2 of this embodiment differs from the
図4に示すように、本実施の形態に係る可とう導体2は、超音波接合部34が、締結面35のうち、締結穴36を含む範囲に位置している。すなわち、超音波接合部34は締結面35に含まれる。なお、超音波接合部34と締結面35とは一部が重複していてもよい。
As shown in FIG. 4, in the flexible conductor 2 according to this embodiment, the ultrasonic joint 34 is located in a range of the
このように、超音波接合部34は、締結穴36に隣接する部位に設けるようにすればよい。締結穴36に隣接する部位を超音波接合することで、可とう導体2の取り付け時に、ボルトやナットで締結される際に、押圧され、接触が強固となりより一層接触抵抗値を下げることができる。
In this way, the ultrasonic joint 34 may be provided in a portion adjacent to the
通電経路である締結穴36を含む範囲に超音波接合を施すことで、通電経路部分の銅箔41同士が強固に接合される。銅箔41同士が強固に接合されることで、可とう導体2の電気抵抗値を銅箔41をボルトやナットで締結するときよりも低下させることができる。また、可とう導体2の電気抵抗値を低くする必要がない場合は、可とう導体2を形成する銅箔41の枚数を減らすことができる。 By performing ultrasonic bonding in an area including the fastening holes 36, which are the current path, the copper foils 41 in the current path are firmly bonded together. By firmly bonding the copper foils 41 together, the electrical resistance of the flexible conductor 2 can be reduced compared to when the copper foils 41 are fastened with bolts and nuts. Furthermore, if there is no need to reduce the electrical resistance of the flexible conductor 2, the number of copper foils 41 that form the flexible conductor 2 can be reduced.
図4に示している×印は、超音波接合時に導体表面に発生する加工痕である。超音波接合後、相手部材と締結される締結面35に加工痕が残るが、加工痕は凹み形状であるため、相手部材との接触に影響を与えない。加工痕の個数は図示される個数に限られない。また、加工痕の配置パターンは例えば、格子状に配列していてもよい。
The x marks in Figure 4 are processing marks that occur on the conductor surface during ultrasonic bonding. After ultrasonic bonding, processing marks remain on the
実施の形態3.
実施の形態3における可とう導体3について図5及び図6を用いて説明する。実施の形態1と同様の構成については説明を省略する。また、図5及び図6において図1から4と同一の符号は同一又は相当部分を示す。
Embodiment 3.
The flexible conductor 3 in the third embodiment will be described with reference to Fig. 5 and Fig. 6. Description of the same configuration as in the first embodiment will be omitted. In Fig. 5 and Fig. 6, the same reference numerals as in Figs. 1 to 4 indicate the same or corresponding parts.
図5は実施の形態3に係る可とう導体3の斜視図である。図6は実施の形態3に係る可とう導体3を図5のA-A´線で矢視した断面に対応した模式図である。本実施の形態の可とう導体3は、銅箔42にめっき層が設けられている点が、実施の形態1の可とう導体1と異なる。以下、実施の形態1の可とう導体1と異なる点を中心に説明する。
FIG. 5 is a perspective view of the flexible conductor 3 according to the third embodiment. FIG. 6 is a schematic diagram of the flexible conductor 3 according to the third embodiment, corresponding to a cross section taken along line A-A' in FIG. 5. The flexible conductor 3 of this embodiment differs from the
本実施の形態に係る可とう導体3は、複数の銅箔41のうち、最外に位置し、相手部材と締結される銅箔42の、相手部材と締結される側に錫などのめっき層が設けられている。
The flexible conductor 3 in this embodiment is located at the outermost position among the multiple copper foils 41, and the
めっき層が設けられる範囲は、銅箔42が相手部材と締結される側の全体でもよいし、例えば、締結面35のみでもよい。
The plating layer may be provided over the entire side of the
素地の銅箔は長時間酸素に触れると表面に酸化被膜が生成される。酸化被膜が生成されることを防止するために、全ての銅箔にめっきを施すことが考えられる。 When bare copper foil is exposed to oxygen for a long period of time, an oxide film forms on the surface. To prevent this from happening, it is possible to plate all of the copper foil.
錫などのめっきのように超音波接合で発生する摩擦熱で溶融するめっきを使用した場合、銅箔41間に発生する摩擦熱により、固相状態での接合完了前にめっきが溶融し、銅箔間に滑りが発生する。滑りが発生することによって超音波振動が伝達されなくなり、接合不良が生じる。 If a plating that melts due to the frictional heat generated by ultrasonic bonding, such as tin plating, is used, the frictional heat generated between the copper foils 41 will cause the plating to melt before bonding is completed in the solid phase, causing slippage between the copper foils. Slippage will prevent the ultrasonic vibrations from being transmitted, resulting in poor bonding.
銅箔42の相手部材と締結される側のみ限定してめっき層を設けることにより銅箔41同士の滑りを抑制し、接合不良を生じさせない。なお、銅箔41の超音波接合部34は強固に接合されているため、他の銅箔41と接合された銅箔41には酸化被膜は生成されない。
By providing a plating layer only on the side of the
なお、銅箔41のうち、相手部材と締結される銅箔42とは反対側の最外に位置する銅箔の、銅箔42の締結面35と反対側の全体又は一部にめっき層が設けられてもよい。
In addition, a plating layer may be provided on the entirety or part of the
また、めっきを施すのは銅箔42の相手部材と締結される側のみであることが望ましいが、銅箔42の相手部材と締結されない側の一部にめっき層が設けられてもよいし、他の銅箔41の一部にめっき層が設けられてもよい。
It is also desirable to apply plating only to the side of the
めっきには、錫及び銀などから、超音波接合時の温度に対応する材料が用いられるとよい。 For plating, it is recommended to use materials such as tin and silver that are suitable for the temperature during ultrasonic bonding.
図6では、銅箔41が10枚である状態を示しているが、銅箔41の枚数は10枚であることに限られない。
In FIG. 6, ten sheets of
次に、実施の形態1から3に係る可とう導体の製造方法について説明する。実施の形態1から3に係る可とう導体の製造方法は、複数の銅箔41を厚み方向に積層するステップ101と、積層された銅箔41の延伸方向の両端部において、積層された複数の銅箔41を互いに超音波接合するステップ102とを含む。
Next, a method for manufacturing a flexible conductor according to
また、積層された複数の銅箔41を互いに超音波接合する上記ステップ102において、可とう導体の締結面35において積層された複数の銅箔41を互いに超音波接合するステップ102aを含むことができる。
Furthermore, the above step 102 of ultrasonically bonding the stacked copper foils 41 to each other may include step 102a of ultrasonically bonding the stacked copper foils 41 to each other on the
また、積層された複数の銅箔41を互いに超音波接合する上記ステップ102において、積層された銅箔41の角部において、積層された複数の銅箔41を互いに超音波接合するステップ102bを含むことができる。 Furthermore, the above step 102 of ultrasonically bonding the multiple stacked copper foils 41 to each other may include step 102b of ultrasonically bonding the multiple stacked copper foils 41 to each other at the corners of the stacked copper foils 41.
また、実施の形態1から3に係る可とう導体の製造方法は、銅箔41の締結面35にめっき層を形成するステップ103を含み、めっき層を形成するステップ103は、上記ステップ101の前でもよいし、上記ステップ101と上記ステップ102、102a及び102bとの間、さらには、上記ステップ102、102a及び102bの後に実施しても構わない。
Furthermore, the manufacturing method of the flexible conductor according to the first to third embodiments includes step 103 of forming a plating layer on the
すなわち、超音波接合された可とう導体を製作するには、超音波接合機に取り付いているホーンとアンビルで厚み方向に積層された銅箔41を挟み、圧力をかけながら銅箔41に超音波振動を伝えるようにすればよい。このようにすることで、接合界面の酸化被膜や汚れが取り除かれ、各銅箔41間の結晶粒同士が原子間距離になるまで接近し銅箔41間を接合することができる。
In other words, to produce an ultrasonically bonded flexible conductor, the
なお、本明細書で説明した上記の各実施の形態では、各構成要素の材質、材料、寸法、形状、相対的配置関係又は実施の条件等について記載している場合があるが、これらは全ての局面において例示であって、各実施の形態が記載されたものに限られることはない。よって、例示されていない無数の変形例が、各実施の形態の範囲内において想定される。例えば、任意の構成要素を変形する場合、追加する場合又は省略する場合、さらには、少なくとも1つの実施形態における少なくとも1つの構成要素を抽出し、他の実施形態の構成要素と組み合わせる場合が含まれる。 In addition, in each of the above embodiments described in this specification, the material, ingredients, dimensions, shape, relative positional relationship, implementation conditions, etc. of each component may be described, but these are examples in all aspects and each embodiment is not limited to what has been described. Therefore, countless modified examples not exemplified are expected within the scope of each embodiment. For example, this includes cases where any component is modified, added, or omitted, and even cases where at least one component in at least one embodiment is extracted and combined with a component of another embodiment.
1、2、3 可とう導体、11 開閉器、12 第1の端子、14 第1の可動部、16 真空バルブ、17 固定部、32 第1の端部、33 第2の端部、35 締結面、36 締結穴、41、42 銅箔 1, 2, 3 Flexible conductor, 11 Switch, 12 First terminal, 14 First movable part, 16 Vacuum valve, 17 Fixed part, 32 First end, 33 Second end, 35 Fastening surface, 36 Fastening hole, 41, 42 Copper foil
Claims (6)
前記銅箔の延伸方向の両端部において、積層された複数の前記銅箔が互いに超音波接合された可とう導体。 A plurality of copper foils are laminated in a thickness direction,
A flexible conductor in which a plurality of laminated copper foils are ultrasonically bonded to each other at both ends in the extending direction of the copper foils.
積層された複数の前記銅箔の間で、かつ、前記締結面に対応する領域において、複数の前記銅箔が互いに超音波接合された請求項1に記載の可とう導体。 Among the plurality of copper foils, the copper foil located at the outermost position has a fastening surface to be fastened to a mating member on a surface different from the surface on which the copper foil is laminated,
The flexible conductor according to claim 1 , wherein the plurality of laminated copper foils are ultrasonically bonded to each other between the plurality of copper foils and in the areas corresponding to the fastening surfaces.
前記可とう導体が有する第1の端部及び第2の端部のうち、前記第1の端部と締結される可動部と、
前記第2の端部が締結される端子と、
を備えた電気機器。 A flexible conductor according to any one of claims 1 to 5;
a movable part fastened to the first end of the flexible conductor; and
a terminal to which the second end is fastened; and
Electrical equipment equipped with
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JPS61176790U (en) * | 1985-04-24 | 1986-11-04 | ||
JP3002038U (en) * | 1994-03-15 | 1994-09-13 | 株式会社井上製作所 | Flexible connection terminal of thin plate superposition type |
JP2018149557A (en) * | 2017-03-10 | 2018-09-27 | 住友電装株式会社 | Manufacturing device of conductive member |
JP2021197308A (en) * | 2020-06-17 | 2021-12-27 | 矢崎総業株式会社 | Conductive structure |
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US5613751A (en) * | 1995-06-27 | 1997-03-25 | Lumitex, Inc. | Light emitting panel assemblies |
WO2021033571A1 (en) * | 2019-08-16 | 2021-02-25 | 日東電工株式会社 | Cover member and member supplying assembly provided with same |
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JPS61176790U (en) * | 1985-04-24 | 1986-11-04 | ||
JP3002038U (en) * | 1994-03-15 | 1994-09-13 | 株式会社井上製作所 | Flexible connection terminal of thin plate superposition type |
JP2018149557A (en) * | 2017-03-10 | 2018-09-27 | 住友電装株式会社 | Manufacturing device of conductive member |
JP2021197308A (en) * | 2020-06-17 | 2021-12-27 | 矢崎総業株式会社 | Conductive structure |
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