WO2024179389A1 - 扬声器模组和耳机 - Google Patents
扬声器模组和耳机 Download PDFInfo
- Publication number
- WO2024179389A1 WO2024179389A1 PCT/CN2024/078412 CN2024078412W WO2024179389A1 WO 2024179389 A1 WO2024179389 A1 WO 2024179389A1 CN 2024078412 W CN2024078412 W CN 2024078412W WO 2024179389 A1 WO2024179389 A1 WO 2024179389A1
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- WO
- WIPO (PCT)
- Prior art keywords
- frequency band
- band unit
- speaker module
- pressure relief
- channel
- Prior art date
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 230000013011 mating Effects 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000004044 response Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 2
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 2
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 210000000613 ear canal Anatomy 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Definitions
- the present application belongs to the technical field of loudspeakers, and specifically relates to a loudspeaker module and a headset.
- the speaker is a moving iron speaker or a dynamic coil speaker.
- the dynamic coil speaker has better low-frequency performance, but poor mid-high frequency performance.
- the moving iron speaker has better mid-high frequency performance, but poor low-frequency performance. That is, a speaker cannot take into account both low-frequency performance and mid-high frequency performance.
- the present application aims to provide a speaker module and a headset, which at least solves the technical problem in the related art that a speaker cannot take into account both low-frequency performance and mid-high frequency performance.
- an embodiment of the present application proposes a speaker module, comprising: a first frequency band unit, the first frequency band unit comprising: a shell, the shell is provided with a first pressure relief hole; a magnetic bracket, the shell is located on the peripheral side of the magnetic bracket, and the magnetic bracket is provided with a second pressure relief hole; and a first frequency band sound-emitting part, the first frequency band sound-emitting part is connected between the magnetic bracket and the shell, and a first chamber is enclosed between the magnetic bracket, the first frequency band sound-emitting part and the inner surface of the shell, and the first pressure relief hole and the second pressure relief hole are both connected to the first chamber; and a second frequency band unit, the second frequency band unit is arranged on the magnetic bracket, the second frequency band unit is provided with a second chamber, and one of the magnetic bracket and the second frequency band unit is provided with a sound outlet, and the sound outlet is connected to the second chamber; wherein the frequency of the first frequency band unit is less than the frequency of the second frequency band unit.
- an embodiment of the present application provides an earphone, comprising: a speaker module as in any embodiment of the first aspect.
- the speaker module includes a first frequency band unit and a second frequency band unit. That is, the speaker module includes both the first frequency band unit and the second frequency band unit, and the speaker module can ensure low-frequency performance through the first frequency band unit and can ensure mid-high frequency performance through the second frequency band unit. In other words, the speaker module takes into account both low-frequency performance and mid-high frequency performance.
- the first frequency band unit includes a shell, a magnetic bracket and a first frequency band sound-emitting part.
- the shell is located on the peripheral side of the magnetic bracket, the first frequency band sound-emitting part is connected between the shell and the magnetic bracket, and the magnetic bracket, the first frequency band sound-emitting part and the inner surface of the shell enclose a first chamber.
- the shell is provided with a first pressure relief hole, and the magnetic bracket is provided with a second pressure relief hole.
- the first pressure relief hole is communicated with the first chamber, and the second pressure relief hole is communicated with the first chamber.
- the speaker module is used for headphones
- the headphones include a shell
- the speaker module is located in the shell
- the speaker module and the inner surface of the shell enclose a front cavity and a rear cavity.
- the front cavity and the rear cavity are connected through the first pressure relief hole on the shell of the speaker module, and the second pressure relief hole on the magnetic support is connected to the rear cavity.
- the first pressure relief hole connects the front cavity and the rear cavity of the earphone.
- the first pressure relief hole has the function of pressure relief, which can prevent excessive ear pressure and reduce the discomfort caused by excessive ear pressure when the user wears the earphone.
- the second pressure relief hole connects the first chamber of the speaker module and the back chamber of the earphone.
- the gas in the first chamber can flow to the back chamber of the earphone through the second pressure relief hole.
- the second pressure relief hole has the function of pressure relief. In this way, it can effectively solve the problem that the gas in the first chamber cannot flow out in time, resulting in excessive air pressure in the first chamber causing poor bass of the speaker module, and can improve the bass reproduction effect of the speaker module.
- the second frequency band unit is arranged on a magnetic bracket, the second frequency band unit is provided with a second chamber, the magnetic bracket is provided with a sound outlet, or the second frequency band unit is provided with a sound outlet, and the second chamber is connected to the sound outlet.
- the magnetic bracket has the function of installing, fixing and accommodating the second frequency band unit. This arrangement reuses the magnetic bracket of the first frequency band unit while ensuring that the use requirements of the second frequency band unit to produce sound are met, that is, the first frequency band sound-emitting part and the second frequency band unit are placed on the same magnetic bracket at the same time, and the integrated arrangement of the first frequency band sound-emitting part and the second frequency band unit is realized in the shell of the first frequency band unit. In this way, while improving the acoustic frequency response and music playback effect of the speaker module, the occupancy rate of the speaker module to the internal space of the headset is reduced, providing more possibilities for the headset to further integrate other functional sensors.
- FIG1 is a schematic structural diagram of a speaker module according to a first embodiment of the present application.
- FIG2 is a cross-sectional view of a speaker module according to a first embodiment of the present application.
- FIG3 is a cross-sectional view of a portion of the structure of a speaker module according to the first embodiment of the present application.
- FIG4 is a schematic structural diagram of a magnetic conductive support according to a first embodiment of the present application.
- FIG5 is a schematic structural diagram of a tuning mesh according to a first embodiment of the present application.
- FIG. 6 is a cross-sectional view of a speaker module according to a second embodiment of the present application.
- 10 speaker module 100 first frequency band unit, 110 housing, 112 first pressure relief hole, 114 second annular groove, 116 terminal, 120 magnetic support, 122 second pressure relief hole, 124 first channel, 1242 annular matching section, 1244 first connecting section, 1246 second connecting section, 126 support tube, 1262 first annular groove, 128 support plate, 130 first frequency band sound-emitting part, 132 magnet, 134 magnetic conductive plate, 136 diaphragm, 138 voice coil, 140 first metal ring, 142 second metal ring, 144 tuning mesh, 150 first chamber, 200 second frequency band unit, 210 second chamber, 220 connecting part, 222 second channel, 230 connecting port, 300 sound outlet, 400 axis.
- first or “second” in the specification and claims of this application may include one or more of the features explicitly or implicitly.
- plural means two or more.
- and/or in the specification and claims means at least one of the connected objects, and the character “/” generally means that the objects connected before and after are in an “or” relationship.
- the terms “installed”, “connected”, and “connected” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components.
- installed should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components.
- the speaker module 10 includes: a first frequency band unit 100, the first frequency band unit 100 includes: a shell 110, the shell 110 is provided with a first pressure relief hole 112; a magnetic support 120, the shell 110 is located on the peripheral side of the magnetic support 120, and the magnetic support 120 is provided with a second pressure relief hole 122; and a first frequency band sounding part 130, the first frequency band sounding part 130 is connected to the magnetic support 120 and the shell
- the first frequency band unit 110 is provided between the magnetic support 120, the first frequency band sound emitting part 130 and the inner surface of the shell 110 to enclose a first chamber 150, and the first pressure relief hole 112 and the second pressure relief hole 122 are both connected to the first chamber 150; and the second frequency band unit 200, the second frequency band unit 200 is provided on the magnetic support 120, the second frequency band unit 200 is provided with a second chamber 210, and one of the magnetic support 120 and the second frequency band unit 200 is provided with a sound outlet
- the speaker module 10 includes a first frequency band unit 100 and a second frequency band unit 200. That is, the speaker module 10 includes both the first frequency band unit 100 and the second frequency band unit 200, and the speaker module 10 can ensure low-frequency performance through the first frequency band unit 100 and can ensure mid-high frequency performance through the second frequency band unit 200. In other words, the speaker module 10 takes into account both low-frequency performance and mid-high frequency performance.
- the first frequency band unit 100 includes a shell 110, a magnetic support 120 and a first frequency band sound-emitting part 130.
- the shell 110 is located on the peripheral side of the magnetic support 120, the first frequency band sound-emitting part 130 is connected between the shell 110 and the magnetic support 120, and the magnetic support 120, the first frequency band sound-emitting part 130 and the inner surface of the shell 110 enclose a first chamber 150.
- the shell 110 is provided with a first pressure relief hole 112, and the magnetic support 120 is provided with a second pressure relief hole 122.
- the first pressure relief hole 112 is connected to the first chamber 150, and the second pressure relief hole 122 is connected to the first chamber 150.
- the speaker module 10 is used for headphones
- the headphones include a housing
- the speaker module 10 is located in the housing
- the speaker module 10 and the inner surface of the housing enclose a front cavity and a rear cavity.
- the front cavity and the rear cavity are connected through the first pressure relief hole 112 on the housing 110 of the speaker module 10, and the second pressure relief hole 122 on the magnetic support 120 is connected to the rear cavity.
- the first pressure relief hole 112 connects the front cavity and the rear cavity of the earphone.
- the first pressure relief hole 112 has the function of relieving pressure, which can prevent excessive ear pressure and reduce the discomfort caused by excessive ear pressure when the user wears the earphone.
- the second pressure relief hole 122 connects the first chamber 150 of the speaker module 10 and the back chamber of the earphone.
- the gas in the first chamber 150 can flow to the back chamber of the earphone through the second pressure relief hole 122.
- the second pressure relief hole 122 has a pressure relief function. In this way, it can effectively solve the problem that the gas in the first chamber 150 cannot flow out in time, resulting in excessive air pressure in the first chamber 150 causing poor bass in the speaker module 10, and can improve the bass reproduction effect of the speaker module 10.
- the second frequency band unit 200 is arranged on the magnetic conductive bracket 120, the second frequency band unit 200 is provided with a second chamber 210, the magnetic conductive bracket 120 is provided with a sound outlet 300, or the second frequency band unit 200 is provided with a sound outlet 300, and the second chamber 210 is connected with the sound outlet 300.
- the magnetic conductive bracket 120 has the function of installing, fixing and accommodating the second frequency band unit 200.
- This setting reuses the magnetic conductive bracket 120 of the first frequency band unit 100 while ensuring that the use requirements of the second frequency band unit 200 to produce sound are met, that is, the first frequency band sound-emitting part 130 and the second frequency band unit 200 are placed on the same magnetic conductive bracket 120 at the same time, and the integrated setting of the first frequency band sound-emitting part 130 and the second frequency band unit 200 is realized in the shell 110 of the first frequency band unit 100.
- the occupancy rate of the internal space of the headset by the speaker module 10 is reduced, providing more possibilities for further integration of other functional sensors into the headset.
- the first frequency band unit 100 is a low frequency unit
- the second frequency band unit 200 is a medium and high frequency unit.
- the electronic device includes headphones.
- the electronic device can be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR device), a virtual reality device, or a headset.
- augmented reality device also known as an AR device
- virtual reality device or a headset.
- Real devices also known as VR devices
- handheld game consoles etc.
- the magnetic bracket 120 is provided with a first channel 124, the first frequency band sound emitting portion 130 is located on the peripheral side of the first channel 124, the second frequency band unit 200 is provided in the first channel 124, and a portion of the wall surface of the first channel 124 is in contact with the outer peripheral wall of the second frequency band unit 200.
- the matching structure of the magnetic support 120, the first frequency band sound emitting part 130 and the second frequency band unit 200 is further defined.
- the magnetic conductive support 120 is provided with a first channel 124 , and the first frequency band sound emitting portion 130 is located at one side of the first channel 124 , that is, the first frequency band sound emitting portion 130 is separated from the first channel 124 .
- the second frequency band unit 200 is disposed in the first channel 124 , and the first channel 124 has the functions of installing, fixing and accommodating the second frequency band unit 200 .
- the second frequency band unit 200 is located in the first channel 124 .
- a portion of the wall surface of the first channel 124 is in contact with the outer peripheral wall of the second frequency band unit 200, that is, the matching structure of the first channel 124 and the second frequency band unit 200 is further limited to increase the matching area and matching angle of the first channel 124 and the second frequency band unit 200, so that the second frequency band unit 200 and the magnetic conductive bracket 120 are firmly assembled together.
- the second frequency band unit 200 is arranged in the first channel 124, the existing space of the magnetic conductive bracket 120 is reasonably utilized, and while ensuring the firmness of the assembly of the second frequency band unit 200, the occupancy rate of the internal space of the earphone will not be increased.
- the first channel 124, the second frequency band unit 200 and the first frequency band unit 100 are all axisymmetric structures, and the axis 400 of the first channel, the axis 400 of the second frequency band unit and the axis 400 of the first frequency band unit are collinear.
- the matching structure of the magnetic support 120, the second frequency band unit 200 and the first frequency band unit 100 are all axisymmetric structures, and the axis 400 of the first channel, the axis 400 of the second frequency band unit and the axis 400 of the first frequency band unit are collinear, which is conducive to improving the space utilization rate, while ensuring the performance of the speaker module 10, it is conducive to reducing the overall size of the speaker module 10, thereby helping to reduce the occupancy rate of the internal space of the earphone.
- the second frequency band unit 200 and the first frequency band unit 100 can share a sound transmission channel, and the second frequency band unit 200 will not occupy the space outside the first frequency band unit 100, so that the volume of the speaker module 10 is small, thereby further reducing the utilization rate of the space.
- one of the first channel 124, the second frequency band unit 200 and the first frequency band unit 100 is an axisymmetric structure.
- two of the first channel 124, the second frequency band unit 200 and the first frequency band unit 100 are axisymmetric structures.
- the magnetic support 120 includes: a support tube 126, the support tube 126 is formed with a first channel 124; a support plate 128, connected to the peripheral side of the connecting tube, the support plate 128 is provided with a second pressure relief hole 122 , and the support plate 128 is used to support the first frequency band unit 100 .
- the structure of the magnetic support 120 is further defined.
- the magnetic support 120 includes a support tube 126 and a support plate 128.
- the support tube 126 is formed with a first channel 124.
- the support plate 128 is located on the peripheral side of the support tube 126, and the support plate 128 is connected to the support tube 126. It can be understood that the support plate 128 extends from the support tube 126 in a direction away from the support tube 126.
- the support plate 128 is an annular plate, and the annular plate is connected to the outer surface of the support tube 126.
- the support plate 128 has the function of supporting the first frequency band sounding part 130.
- the support tube 126 has the function of installing and fixing the second frequency band unit 200. And the matching structure of the support tube 126 and the support plate 128 can ensure the balance of vibration.
- the first frequency band sound-emitting part 130 includes: a magnet 132, which is arranged on the support plate 128, and there is a gap between the magnet 132 and the support tube 126; a magnetic conductive plate 134, which is arranged on the side of the magnet 132 away from the support plate 128, and a diaphragm 136, which is connected between the support tube 126 and the shell 110, and is located on the side of the magnetic conductive plate 134 away from the magnet 132; a voice coil 138, which is located on the peripheral side of the support tube 126, and the voice coil 138 extends from the diaphragm 136 to the gap between the magnet 132 and the support tube 126.
- the first frequency band sound emitting part 130 includes a magnet 132 , a magnetic conductive plate 134 , a diaphragm 136 and a voice coil 138 .
- the diaphragm 136 , the magnetic conductive plate 134 , the magnet 132 and the support plate 128 are arranged in sequence along the length direction of the support tube 126 .
- the voice coil 138 is located on the peripheral side of the support tube 126, and the voice coil 138 extends from the diaphragm 136 to the gap between the magnet 132 and the support tube 126, that is, the magnet 132 is located on the outside of the voice coil 138, and the magnet 132 surrounds the voice coil 138.
- the speaker module 10 is an external magnetic structure, which is conducive to saving space for accommodating the second frequency band unit 200, so that the middle part of the magnetic support 120 has more margin, and a larger volume of the second frequency band unit 200 can be accommodated.
- the magnet 132 is a ferrite magnet 132 or a neodymium iron boron magnet 132, etc., which are not listed here one by one.
- a first annular groove 1262 is provided at the end of the support tube 126, and a second annular groove 114 is provided at the shell 110.
- the first frequency band sound-emitting part 130 also includes: a first metal ring 140, which is provided in the first annular groove 1262, and the diaphragm 136 is connected to the first metal ring 140; a second metal ring 142, which is provided in the second annular groove 114, and the diaphragm 136 is connected to the second annular groove 114; a tuning mesh 144, and a tuning mesh 144 is provided at both the first pressure relief hole 112 and the second pressure relief hole 122.
- the end of the support tube 126 is provided with a first annular groove 1262
- the housing 110 is provided with a second annular groove 114
- the first frequency band sounding part 130 further includes a first metal ring 140 and a second metal ring 142.
- the first metal ring 140 is provided in the first annular groove 1262
- the second metal ring 142 is provided in the second annular groove 114.
- the first annular groove 1262 has the function of installing and fixing the first metal ring 140
- the second annular groove 114 has the function of installing and fixing the second metal ring 142.
- This arrangement can increase the matching structure and matching angle between the support tube 126 and the first metal ring 140, so that the first A metal ring 140 can be stably assembled on the support tube 126. And this arrangement can increase the matching structure and matching angle between the housing 110 and the second metal ring 142, so that the second metal ring 142 can be stably assembled on the housing 110.
- the diaphragm 136 is connected to the first metal ring 140 , and the diaphragm 136 is connected to the second metal ring 142 .
- the tuning mesh 144 is disposed at the first pressure relief hole 112 , and the tuning mesh 144 is disposed at the second pressure relief hole 122 .
- the coordinated structure of the first pressure relief hole 112 and the tuning mesh 144 can solve the problem of excessive ear pressure.
- the coordinated structure of the second pressure relief hole 122 and the tuning mesh 144 can solve the problem of poor bass.
- the diaphragm 136 is located around the sound outlet 300 .
- the matching structure of the diaphragm 136 and the sound outlet 300 is reasonably arranged, so that the diaphragm 136 is located on the peripheral side of the sound outlet 300, that is, the diaphragm 136 is arranged around the sound outlet 300.
- This arrangement makes the sound emission directions of the first frequency band unit 100 and the second frequency band unit 200 consistent. Compared with the arrangement in which the first frequency band unit 100 and the second frequency band unit 200 have reverse radiation, the investment in additional guiding structures is reduced, thereby reducing the occupancy rate of the internal space of the earphone.
- the wall of the first channel 124 includes an annular mating section 1242;
- the second frequency band unit 200 is also provided with a connecting portion 220, the connecting portion 220 is provided with a second channel 222, the second channel 222 is connected to the second chamber 210, and the annular mating section 1242 is in contact with the outer peripheral wall of the connecting portion 220; the end of the connecting portion 220 away from the first chamber 150 extends out of the first channel 124 and forms a sound outlet 300.
- the second frequency band unit 200 is further provided with a connecting portion 220, and the connecting portion 220 is provided with a second channel 222, and the first channel 124 is connected to the second channel 222.
- the end of the connecting portion 220 away from the first chamber 150 extends out of the first channel 124 and forms a sound outlet 300, that is, the second frequency band unit 200 is provided with a sound outlet 300.
- the diaphragm 136 is located on the peripheral side of the sound outlet 300.
- the wall surface of the first channel 124 includes an annular mating section 1242, which is matingly connected to the connecting portion 220. Specifically, the annular mating section 1242 is in contact with the outer peripheral wall of the connecting portion 220. This arrangement enables the magnetic bracket 120 and the second frequency band unit 200 to be firmly and securely assembled together.
- the annular mating section 1242 is fitted with the outer peripheral wall of the connecting part 220, and the first metal ring 140 is abutted against the connecting part 220.
- This arrangement realizes the coordination between the sound outlet hole of the magnetic bracket 120 and the sound outlet 300 of the second frequency band unit 200, so that the sound outlet directions of the first frequency band unit 100 and the second frequency band unit 200 are consistent.
- the investment in additional guiding structure is reduced, thereby reducing the occupancy rate of the internal space of the earphone.
- the first channel 124 includes: a first connecting section 1244, the second frequency band unit 200 is located in the first connecting section 1244, and the wall surface of the first connecting section 1244 is in contact with the outer peripheral wall of the second frequency band unit 200; a second connecting section 1246, connected to one side of the first connecting section 1244, and the second frequency band unit 200 is also provided with a connecting port 230, the connecting port 230 connects the second chamber 210 and the second connecting section 1246, and the end of the second connecting section 1246 forms a sound outlet 300.
- the first channel 124 includes a first connecting section 1244 and a second connecting section 1246.
- the connecting section 1246 is connected to one side of the first connecting section 1244.
- the second frequency band unit 200 is located in the first connecting section 1244, that is, the first connecting section 1244 has the function of accommodating and fixing the second frequency band unit 200.
- the end of the second connecting section 1246 forms a sound outlet 300, that is, the magnetic conductive bracket 120 is provided with a sound outlet 300.
- first connecting section 1244 is cooperatively connected with the second frequency band unit 200. Specifically, the wall surface of the first connecting section 1244 is in contact with the outer wall of the second frequency band unit 200. This arrangement enables the magnetic support 120 and the second frequency band unit 200 to be assembled together stably and securely.
- the wall surface of the first connecting section 1244 is in contact with the outer wall of the second frequency band unit 200, and the first metal ring 140 is in contact with the second connecting section 1246.
- This arrangement realizes the coordination between the sound outlet hole of the magnetic bracket 120 and the sound outlet 300 of the second frequency band unit 200, so that the sound outlet directions of the first frequency band unit 100 and the second frequency band unit 200 are consistent.
- the investment in additional guiding structures is reduced, thereby reducing the occupancy rate of the internal space of the earphone.
- the flow cross-sectional area of the second connecting segment 1246 gradually increases in a direction from the first connecting segment 1244 to the second connecting segment 1246 .
- the structure of the second connecting section 1246 is further defined. Specifically, the flow cross-sectional area of the second connecting section 1246 gradually increases in the direction from the first connecting section 1244 to the second connecting section 1246.
- the second connecting section 1246 is a gradually expanding structure.
- the second connecting section 1246 is sectioned along a length direction perpendicular to the second connecting section 1246. In the section, the area of the area enclosed by the contour line of the second connecting section 1246 is the flow cross-sectional area of the second connecting section 1246.
- This arrangement is conducive to increasing the space between the support tube 126 and the voice coil 138, which can improve the space utilization rate, reduce the assembly process, and improve the low-frequency response of the first frequency band unit 100.
- this structural arrangement can increase the coupling efficiency between the sound wave energy radiated by the second frequency band unit 200 and the external air medium, improve the radiation efficiency of the high-frequency unit, enhance the playback effect of the speaker module 10, and further improve the high-frequency response of the speaker module 10.
- the housing 110 is further provided with a terminal 116 , which is electrically connected to the first frequency band sound emitting part 130 ;
- the second frequency band unit 200 includes any one of the following: a moving iron, a moving coil, a piezoelectric micro-electromechanical system and a piezoelectric sheet.
- the housing 110 is further provided with a terminal 116 , which is electrically connected to the first frequency band sound emitting part 130 to provide power support for the operation of the first frequency band sound emitting part 130 .
- the types of the second frequency band unit 200 are classified, wherein the second frequency band unit 200 includes a moving iron, or the second frequency band unit 200 includes a moving coil, or the second frequency band unit 200 includes a piezoelectric micro-electromechanical system, or the second frequency band unit 200 includes a piezoelectric sheet.
- the earphones include: the speaker module 10 of any of the above embodiments.
- the earphone according to the embodiment of the present application includes the speaker module 10 of the above embodiment, it has all the beneficial effects of the above speaker module 10, which are not listed here one by one.
- the earphone further comprises: a housing, wherein the speaker module 10 is located in the housing, The group 10 and the inner surface of the housing enclose a front cavity and a rear cavity, the front cavity and the rear cavity are connected through the first pressure relief hole 112, and the second pressure relief hole 122 is connected to the rear cavity.
- the earphone also includes a shell, and the speaker module 10 is located in the shell.
- the speaker module 10 and the inner surface of the shell enclose a front cavity and a rear cavity.
- the first pressure relief hole 112 connects the front cavity and the rear cavity of the earphone.
- the first pressure relief hole 112 has a pressure relief function, which can prevent excessive ear pressure and reduce the discomfort caused by excessive ear pressure when the user wears the earphone.
- the second pressure relief hole 122 connects the first chamber 150 of the speaker module 10 and the back chamber of the earphone.
- the second pressure relief hole 122 has a pressure relief function. In this way, it can effectively solve the problem that the gas in the first chamber 150 cannot flow out in time, resulting in excessive air pressure in the first chamber 150 and causing poor bass in the speaker module 10, and can improve the bass reproduction effect of the speaker module 10.
- the shell is also provided with a pressure relief port, which is communicated with the rear cavity.
- the speaker module 10 of the present application is a coaxial integrated speaker module 10 , and the speaker module 10 includes a first frequency band unit 100 (eg, an external magnetic dynamic coil unit) and a second frequency band unit 200 .
- a first frequency band unit 100 eg, an external magnetic dynamic coil unit
- a second frequency band unit 200 e.g.
- the first frequency band unit 100 and the second frequency band unit 200 are both axially symmetrical structures.
- the first frequency band unit 100 includes a magnetic support 120 and a first frequency band sound-emitting portion 130.
- the magnetic support 120, the first frequency band sound-emitting portion 130, and the second frequency band unit 200 are all axially symmetrical structures, and the axis 400 of the magnetic support 120, the axis 400 of the first frequency band sound-emitting portion 130, and the axis 400 of the second frequency band unit 200 are collinear. While improving the acoustic frequency response and music playback effect of the speaker module 10, the occupancy rate of the internal space of the earphone is reduced, providing more possibilities for the earphone to further integrate other functional sensors.
- the magnet 132 is disposed outside the voice coil 138.
- the magnetic support 120 includes a support tube 126 and a support plate 128.
- the second frequency band unit 200 is embedded in the support tube 126.
- the second frequency band unit 200 (eg, a moving iron unit) is responsible for high frequency response and improves the high frequency performance of the speaker module 10.
- the first channel 124 is cylindrical in shape, which is convenient for matching with second frequency band units 200 of various shapes (eg, a rectangular moving iron unit, a cylindrical piezoelectric micro-electro-mechanical system).
- a second pressure relief hole 122 (the number of the second pressure relief holes 122 is one or more) is provided on the support plate 128 of the magnetic bracket 120.
- the second pressure relief hole 122 connects the first chamber 150 with the back chamber of the earphone, and is combined with the tuning mesh 144 to solve the problem of poor bass caused by excessive air pressure, thereby improving the bass reproduction effect of the speaker module 10.
- the sound outlet hole of the support tube 126 of the magnetic bracket 120 matches the sound outlet 300 of the second frequency band unit 200, so that the sound output directions of the first frequency band unit 100 and the second frequency band unit 200 are consistent. Compared with the design with reverse radiation, the additional guiding structure is reduced, thereby reducing the space occupied by the earphone.
- the terminal 116 of the first frequency band unit 100 introduces the external electrical signal into the first frequency band unit 100.
- the first pressure relief hole 112 can connect the front cavity and the rear cavity of the earphone, and at the same time, combined with the tuning mesh 144, adjust the problem of excessive ear canal sound pressure level when the earphone is worn, further improving the earphone wearing experience.
- the assembly process is simplified, the volume of the first chamber 150 is increased, the bass performance of the speaker module 10 is improved, and the space utilization of the earphone is further improved.
- the speaker module 10 includes a dynamic unit and a second frequency band unit 200.
- the second frequency band unit 200 refers to a unit responsible for reproducing the mid-high frequency signal after frequency division, and the second frequency band unit 200 includes but is not limited to a dynamic iron unit, and may also be a piezoelectric micro-electromechanical system, a planar diaphragm 136 unit, and the like.
- the shell 110 of the first frequency band unit 100 is provided with two terminals 116.
- the function of the terminal 116 is to introduce the external electrical signal into the dynamic unit of the speaker module 10 to drive the first frequency band unit 100 to make sound.
- the shell 110 is also provided with a first pressure relief hole 112 and a tuning mesh 144, the purpose of which is to connect the first chamber 150 of the speaker module 10 and the back chamber of the earphone to prevent excessive ear pressure and reduce the discomfort caused by excessive ear pressure when consumers wear earphones.
- the shape and number of the first pressure relief hole 112 can be adjusted and designed according to actual needs.
- the shell 110 is integrally formed with the terminal 116 and the first pressure relief hole 112.
- the shell 110 is integrally formed with the terminal 116 and the first pressure relief hole 112 by injection molding.
- the first frequency band unit 100 is a dynamic unit, which includes a housing 110, a first metal ring 140 (e.g., an inner copper ring), a second metal ring 142 (e.g., an outer copper ring), a diaphragm 136, a voice coil 138, a magnetic plate 134, a magnet 132, a tuning mesh 144, and a magnetic support 120.
- the dynamic unit is an external magnetic design, that is, the magnet 132 surrounds the voice coil 138.
- the moving iron unit is assembled in the first channel 124 of the magnetic support 120 and fixed by glue or other means.
- the diaphragm 136 of the dynamic unit is in the shape of a ring, the inside of the ring is glued to the inner copper ring, and the inner copper ring is fixed to the first annular groove 1262 of the magnetic support 120 to fix the inner ring part of the diaphragm 136.
- the magnetic support 120 with the sound outlet 300 and the inner copper ring are bonded and sealed by glue or foam. Its functions are: first, to make full use of the internal space of the speaker module 10 to increase the radiation area and radiation efficiency of the second frequency band unit 200; second, to prevent the radiation energy of the dynamic unit from interacting with the radiation energy of the back cavity of the earphone through the first channel 124, thereby reducing the radiation efficiency of the speaker module 10.
- the shape of the lower half of the space of the first channel 124 is cylindrical, the purpose of which is to match the second frequency band units 200 of different shapes.
- This modular design facilitates the application of different types of second frequency band units 200, such as rectangular moving iron units and cylindrical piezoelectric micro-electromechanical systems.
- the present application utilizes a rectangular moving iron unit as a tweeter component, and glues and fixes the upper surface of the moving iron unit to the magnetic support 120 to achieve the embedding of the second frequency band unit 200.
- the support plate 128 of the magnetic support 120 is provided with four second pressure relief holes 122.
- the four second pressure relief holes 122 are formed by laser drilling.
- the shape and number of the second pressure relief holes 122 can be adjusted and designed according to actual conditions.
- the second pressure relief holes 122 help the air in the first chamber 150 surrounded by the magnet 132 and the magnetic support 120 to flow to the external space, play a role in pressure relief, and solve the problem of occasional poor bass of the speaker module 10.
- the tuning mesh 144 is disposed on the support plate 128 of the magnetic support 120 and bonded with glue to cooperate with the second pressure relief hole 122 to achieve a pressure relief effect.
- the second connecting section 1246 of the first channel 124 is formed with a sound outlet 300, and the flow cross-sectional area of the second connecting section 1246 gradually increases from the first connecting section 1244 to the second connecting section 1246.
- the coupling efficiency between the sound wave energy radiated by the second frequency band unit 200 and the external air medium is increased, and the high frequency response of the speaker module 10 is further improved.
- the shape of the sound outlet 300 can be exponential, hyperbolic or catenary.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Headphones And Earphones (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
本申请公开了一种扬声器模组和耳机，其中，扬声器模组，包括：第一频段单元，第一频段单元包括：壳体，壳体设有第一泄压孔；导磁支架，壳体位于导磁支架的周侧，导磁支架设有第二泄压孔；以及第一频段发声部，第一频段发声部连接于导磁支架和壳体之间，导磁支架、第一频段发声部和壳体的内表面之间合围出第一腔室，第一泄压孔和第二泄压孔均与第一腔室连通；以及第二频段单元，第二频段单元设于导磁支架，第二频段单元设有第二腔室，导磁支架和第二频段单元中的一个设有出音口，出音口与第二腔室连通；其中，第一频段单元的频率小于第二频段单元的频率。
Description
相关申请的交叉引用
本申请要求在2023年02月27日提交中国专利局、申请号为202310170835.0，名称为“扬声器模组和耳机”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
本申请属于扬声器技术领域，具体涉及一种扬声器模组和一种耳机。
相关技术中，扬声器为动铁式扬声器或动圈式扬声器。动圈式扬声器的低频性能较好，但中高频性能较差。动铁式扬声器的中高频性能较好，但低频性能较差。也即，一个扬声器无法兼顾低频性能和中高频性能。
申请内容
本申请旨在提供一种扬声器模组和一种耳机，至少解决了相关技术中，一个扬声器无法兼顾低频性能和中高频性能的技术问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提出了一种扬声器模组，包括：第一频段单元，第一频段单元包括：壳体，壳体设有第一泄压孔；导磁支架，壳体位于导磁支架的周侧，导磁支架设有第二泄压孔；以及第一频段发声部，第一频段发声部连接于导磁支架和壳体之间，导磁支架、第一频段发声部和壳体的内表面之间合围出第一腔室，第一泄压孔和第二泄压孔均与第一腔室连通；及第二频段单元，第二频段单元设于导磁支架，第二频段单元设有第二腔室，导磁支架和第二频段单元中的一个设有出音口，出音口与第二腔室连通；其中，第一频段单元的频率小于第二频段单元的频率。
第二方面，本申请实施例提出了一种耳机，包括：如第一方面中任一实施例的扬声器模组。
在本申请的实施例中，扬声器模组包括第一频段单元和第二频段单元。也即，扬声器模组同时包括第一频段单元和第二频段单元，扬声器模组既能通过第一频段单元保证低频性能，又能够通过第二频段单元保证中高频性能。也就是说，扬声器模组兼顾了低频性能和中高频性能。
具体地，第一频段单元包括壳体、导磁支架和第一频段发声部。壳体位于导磁支架的周侧，第一频段发声部连接于壳体和导磁支架之间，且导磁支架、第一频段发声部和壳体的内表面之间合围出第一腔室。壳体设有第一泄压孔，导磁支架设有第二泄压孔。
第一泄压孔与第一腔室连通，第二泄压孔与第一腔室连通。
可以理解的是，扬声器模组用于耳机，耳机包括外壳，扬声器模组位于外壳内，扬声器模组和外壳的内表面之间合围出前腔和后腔。前腔和后腔通过扬声器模组的壳体上的第一泄压孔连通，且导磁支架上的第二泄压孔与后腔连通。
其中，第一泄压孔连通耳机的前腔和后腔，第一泄压孔具有泄压的作用，能够防止耳压过大，减少用户佩戴耳机时因为耳压过大而产生的不适感。
其中，第二泄压孔连通扬声器模组的第一腔室和耳机的后腔，当第一频段单元在外力作用下挤压第一腔室时，第一腔室内的气体可以通过第二泄压孔流动到耳机的后腔，第二泄压孔具有泄压的作用，这样，能够有效解决第一腔室内的气体不能及时外流，而导致第一腔室内的气压过大造成扬声器模组发生低音不良的问题，能够提高扬声器模组的低音重放效果。
进一步地，第二频段单元设于导磁支架，第二频段单元设有第二腔室，导磁支架设有出音口，或者第二频段单元设有出音口，第二腔室与出音口连通。导磁支架具有安装、固定和容置第二频段单元的作用。该设置在保证满足第二频段单元出音的使用需求的同时，复用了第一频段单元的导磁支架，也即，在同一导磁支架上同时放置第一频段发声部和第二频段单元，在第一频段单元的壳体内实现了第一频段发声部和第二频段单元的集成设置。这样，在提高扬声器模组声学频响和音乐重放效果的同时，降低了扬声器模组对耳机的内部空间的占用率，为耳机进一步集成其他功能传感器提供更多可能性。
本申请的附加方面和优点将在下面的描述部分中变得明显，或通过本申请的实践了解到。
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是本申请的第一个实施例的扬声器模组的结构示意图；
图2是本申请的第一个实施例的扬声器模组的剖视图；
图3是本申请的第一个实施例的扬声器模组的部分结构的剖视图；
图4是本申请的第一个实施例的导磁支架的结构示意图；
图5是本申请的第一个实施例的调音网布的结构示意图；
图6是本申请的第二个实施例的扬声器模组的剖视图。
附图标记：
图1至图6中的附图标记与部件名称之间的对应关系为：
10扬声器模组，100第一频段单元，110壳体，112第一泄压孔，114第二环形槽，116端子，120导磁支架，122第二泄压孔，124第一通道，1242环形配合段，1244第一连接段，1246第二连接段，126支撑筒，1262第一环形槽，128支撑板，
130第一频段发声部，132磁铁，134导磁板，136振膜，138音圈，140第一金属环，142第二金属环，144调音网布，150第一腔室，200第二频段单元，210第二腔室，220连接部，222第二通道，230连通口，300出音口，400轴线。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
应理解，说明书通篇中提到的“一个实施例”或“一实施例”意味着与实施例有关的特定特征、结构或特性包括在本申请的至少一个实施例中。因此，在整个说明书各处出现的“在一个实施例中”或“在一实施例中”未必一定指相同的实施例。此外，这些特定的特征、结构或特性可以任意适合的方式结合在一个或多个实施例中。
在下面的描述中阐述了很多具体细节以便于充分理解本申请，但是，本申请还可以采用其他不同于在此描述的其他方式来实施，因此，本申请的保护范围并不受下面公开的具体实施例的限制。
下面结合图1至图6描述根据本申请实施例的扬声器模组10和耳机。
如图1、图2、图3、图4和图6所示，根据本申请一些实施例的扬声器模组10，包括：第一频段单元100，第一频段单元100包括：壳体110，壳体110设有第一泄压孔112；导磁支架120，壳体110位于导磁支架120的周侧，导磁支架120设有第二泄压孔122；以及第一频段发声部130，第一频段发声部130连接于导磁支架120和壳体110之间，导磁支架120、第一频段发声部130和壳体110的内表面之间合围出第一腔室150，第一泄压孔112和第二泄压孔122均与第一腔室150连通；及第二频段单元200，第二频段单元200设于导磁支架120，第二频段单元200设有第二腔室210，导磁支架120和第二频段单元200中的一个设有出音口300，出音口300与
第二腔室210连通；其中，第一频段单元100的频率小于第二频段单元200的频率。
在该实施例中，扬声器模组10包括第一频段单元100和第二频段单元200。也即，扬声器模组10同时包括第一频段单元100和第二频段单元200，扬声器模组10既能通过第一频段单元100保证低频性能，又能够通过第二频段单元200保证中高频性能。也就是说，扬声器模组10兼顾了低频性能和中高频性能。
具体地，第一频段单元100包括壳体110、导磁支架120和第一频段发声部130。壳体110位于导磁支架120的周侧，第一频段发声部130连接于壳体110和导磁支架120之间，且导磁支架120、第一频段发声部130和壳体110的内表面之间合围出第一腔室150。壳体110设有第一泄压孔112，导磁支架120设有第二泄压孔122。第一泄压孔112与第一腔室150连通，第二泄压孔122与第一腔室150连通。
可以理解的是，扬声器模组10用于耳机，耳机包括外壳，扬声器模组10位于外壳内，扬声器模组10和外壳的内表面之间合围出前腔和后腔。前腔和后腔通过扬声器模组10的壳体110上的第一泄压孔112连通，且导磁支架120上的第二泄压孔122与后腔连通。
其中，第一泄压孔112连通耳机的前腔和后腔，第一泄压孔112具有泄压的作用，能够防止耳压过大，减少用户佩戴耳机时因为耳压过大而产生的不适感。
其中，第二泄压孔122连通扬声器模组10的第一腔室150和耳机的后腔，当第一频段单元100在外力作用下挤压第一腔室150时，第一腔室150内的气体可以通过第二泄压孔122流动到耳机的后腔，第二泄压孔122具有泄压的作用，这样，能够有效解决第一腔室150内的气体不能及时外流，而导致第一腔室150内的气压过大造成扬声器模组10发生低音不良的问题，能够提高扬声器模组10的低音重放效果。
进一步地，第二频段单元200设于导磁支架120，第二频段单元200设有第二腔室210，导磁支架120设有出音口300，或者第二频段单元200设有出音口300，第二腔室210与出音口300连通。导磁支架120具有安装、固定和容置第二频段单元200的作用。该设置在保证满足第二频段单元200出音的使用需求的同时，复用了第一频段单元100的导磁支架120，也即，在同一导磁支架120上同时放置第一频段发声部130和第二频段单元200，在第一频段单元100的壳体110内实现了第一频段发声部130和第二频段单元200的集成设置。这样，在提高扬声器模组10声学频响和音乐重放效果的同时，降低了扬声器模组10对耳机的内部空间的占用率，为耳机进一步集成其他功能传感器提供更多可能性。
可以理解的是，第一频段单元100为低频单元，第二频段单元200为中高频单元。
具体地，电子设备包括耳机。电子设备可以是手机等移动终端、可穿戴式设备、平板电脑、膝上型电脑、移动计算机、增强现实设备(又称之为AR设备)、虚拟现
实设备(又称之为VR设备)及掌上游戏机等。
在一些实施例中，如图2、图3和图6所示，导磁支架120设有第一通道124，第一频段发声部130位于第一通道124的周侧，第二频段单元200设于第一通道124，第一通道124的壁面的一部分与第二频段单元200的外周壁贴合。
在该实施例中，进一步限定导磁支架120、第一频段发声部130和第二频段单元200的配合结构。
导磁支架120设有第一通道124，第一频段发声部130位于第一通道124的一侧，也即，第一频段发声部130与第一通道124分离设置。
第二频段单元200设于第一通道124，第一通道124具有安装、固定和容置第二频段单元200的作用。
具体地，第二频段单元200的至少一部分位于第一通道124内。
可以理解的是，第一通道124的壁面的一部分与第二频段单元200的外周壁贴合，即，进一步限定了第一通道124和第二频段单元200的配合结构，以增大第一通道124和第二频段单元200的配合面积和配合角度，使得第二频段单元200与导磁支架120稳固装配在一起。
另外，由于第二频段单元200设于第一通道124，合理利用了导磁支架120的现有空间，在保证第二频段单元200装配的牢固性的同时，不会增大对耳机内部空间的占用率。
在一些实施例中，第一通道124、第二频段单元200和第一频段单元100均为轴对称结构，第一通道的轴线400、第二频段单元的轴线400和第一频段单元的轴线400共线。
在该实施例中，通过合理设置导磁支架120、第二频段单元200和第一频段单元100的配合结构，使得第一通道124、第二频段单元200和第一频段单元100均为轴对称结构，且使第一通道的轴线400、第二频段单元的轴线400和第一频段单元的轴线400共线，有利于提升空间利用率，在保证扬声器模组10的使用性能的同时，有利于降低扬声器模组10的整体外形尺寸，进而有利于降低对耳机内部空间的占用率。且使得第二频段单元200和第一频段单元100能够共用一个传音通道，第二频段单元200发生不会占用第一频段单元100外部的空间，使得扬声器模组10的体积小，进而进一步降低对空间的利用率。
在其他一些实施例中，第一通道124、第二频段单元200和第一频段单元100中的一个为轴对称结构。
在另外一些实施例中，第一通道124、第二频段单元200和第一频段单元100中的两个为轴对称结构。
在一些实施例中，如图2、图3、图4和图6所示，导磁支架120包括：支撑筒126，支撑筒126形成有第一通道124；支撑板128，连接于连接筒的周侧，支撑板
128设有第二泄压孔122，支撑板128用于支撑第一频段单元100。
在该实施例中，进一步限定导磁支架120的结构，导磁支架120包括支撑筒126和支撑板128，支撑筒126形成有第一通道124，支撑板128位于支撑筒126的周侧，且支撑板128与支撑筒126连接。可以理解为，支撑板128自支撑筒126向背离支撑筒126的方向延伸，支撑板128为环形板，环形板与支撑筒126的外表面连接。支撑板128具有支撑第一频段发声部130的作用。支撑筒126具有安装和固定第二频段单元200的作用。且支撑筒126和支撑板128的配合结构，能够保证振动的平衡性。
在一些实施例中，如图2和图6所示，第一频段发声部130包括：磁铁132，设于支撑板128上，磁铁132与支撑筒126之间具有间隙；导磁板134，设于磁铁132背离支撑板128的一侧，振膜136，连接于支撑筒126和壳体110之间，且位于导磁板134背离磁铁132的一侧；音圈138，位于支撑筒126的周侧，音圈138自振膜136延伸至磁铁132和支撑筒126之间的间隙处。
在该实施例中，第一频段发声部130包括磁铁132、导磁板134、振膜136和音圈138。
振膜136、导磁板134、磁铁132和支撑板128沿支撑筒126的长度方向依次布置。
其中，音圈138位于支撑筒126的周侧，音圈138自振膜136延伸至磁铁132和支撑筒126之间的间隙处，也即，磁铁132位于音圈138的外侧，磁铁132包围音圈138。也可以说，扬声器模组10为外磁式结构，该设置有利于节约出用于容置第二频段单元200的空间，使得导磁支架120的中间部分留出更多的余量，可以容置更大体积的第二频段单元200。
具体地，磁铁132为铁氧体磁铁132或者钕铁硼磁铁132等等，在此不一一列举。
在一些实施例中，如图2、图5和图6所示，支撑筒126的端部设有第一环形槽1262，壳体110设有第二环形槽114，第一频段发声部130还包括：第一金属环140，设于第一环形槽1262，且振膜136与第一金属环140连接；第二金属环142，设于第二环形槽114，且振膜136与第二环形槽114连接；调音网布144，第一泄压孔112和第二泄压孔122处均设有调音网布144。
在该实施例中，支撑筒126的端部设有第一环形槽1262，壳体110设有第二环形槽114，第一频段发声部130还包括第一金属环140和第二金属环142，第一金属环140设于第一环形槽1262，第二金属环142设于第二环形槽114。第一环形槽1262具有安装和固定第一金属环140的作用，第二环形槽114具有安装和固定第二金属环142的作用。
该设置能够增大支撑筒126和第一金属环140的配合结构和配合角度，使得第
一金属环140能够被稳固地装配于支撑筒126上。且该设置能够增大壳体110和第二金属环142的配合结构和配合角度，使得第二金属环142能够被稳固地装配于壳体110上。
具体地，振膜136与第一金属环140连接，且振膜136与第二金属环142连接。
其中，调音网布144设于第一泄压孔112，调音网布144设于第二泄压孔122。
第一泄压孔112和调音网布144的配合结构，能够解决耳压过大的问题。
第二泄压孔122和调音网布144的配合结构，能够解决低音不良的问题。
在一些实施例中，如图2和图6所示，振膜136位于出音口300的周侧。
在该实施例中，通过合理设置振膜136和出音口300的配合结构，使得振膜136位于出音口300的周侧，也即，振膜136围绕出音口300设置，该设置使得第一频段单元100和第二频段单元200的出声方向一致，相比于第一频段单元100和第二频段单元200具有反向辐射的设置，减小了额外的导向结构的投入，从而能够减少对耳机内部空间的占用率。
在一些实施例中，如图2和图3所示，第一通道124的壁面包括环形配合段1242；第二频段单元200还设有连接部220，连接部220设有第二通道222，第二通道222与第二腔室210连通，环形配合段1242与连接部220的外周壁贴合；连接部220背离第一腔室150的端部伸出第一通道124，并形成出音口300。
在该实施例中，第二频段单元200还设有连接部220，连接部220设有第二通道222，第一通道124和第二通道222连通。连接部220背离第一腔室150的端部伸出第一通道124，并形成出音口300，也就是说，第二频段单元200设有出音口300。振膜136位于出音口300的周侧。
进一步地，第一通道124的壁面包括环形配合段1242，环形配合段1242与连接部220配合连接，具体地，环形配合段1242与连接部220的外周壁贴合，该设置使得导磁支架120与第二频段单元200稳固且牢靠地装配在一起。
另外，环形配合段1242与连接部220的外周壁贴合，第一金属环140与连接部220抵靠，该设置实现了导磁支架120的出声孔和第二频段单元200的出音口300相配合，使得第一频段单元100和第二频段单元200的出声方向一致，相比于第一频段单元100和第二频段单元200具有反向辐射的设置，减小了额外的导向结构的投入，从而能够减少对耳机内部空间的占用率。
在一些实施例中，如图6所示，第一通道124包括：第一连接段1244，第二频段单元200位于第一连接段1244内，且第一连接段1244的壁面与第二频段单元200的外周壁贴合；第二连接段1246，连接于第一连接段1244的一侧，第二频段单元200还设有连通口230，连通口230连通第二腔室210和第二连接段1246，第二连接段1246的端部形成出音口300。
在该实施例中，第一通道124包括第一连接段1244和第二连接段1246。第二连
接段1246连接于第一连接段1244的一侧。第二频段单元200位于第一连接段1244内，也即，第一连接段1244具有容置和固定第二频段单元200的作用。第二连接段1246的端部形成出音口300，也即，导磁支架120设有出音口300。
进一步地，第一连接段1244与第二频段单元200配合连接，具体地，第一连接段1244的壁面与第二频段单元200的外周壁贴合，该设置使得导磁支架120与第二频段单元200稳固且牢靠地装配在一起。
另外，第一连接段1244的壁面与第二频段单元200的外周壁贴合，第一金属环140与第二连接段1246抵靠，该设置实现了导磁支架120的出声孔和第二频段单元200的出音口300相配合，使得第一频段单元100和第二频段单元200的出声方向一致，相比于第一频段单元100和第二频段单元200具有反向辐射的设置，减小了额外的导向结构的投入，从而能够减少对耳机内部空间的占用率。
在一些实施例中，自第一连接段1244向第二连接段1246的方向上，第二连接段1246的过流截面面积逐渐增大。
在该实施例中，进一步限定第二连接段1246的结构，具体地，自第一连接段1244向第二连接段1246的方向上，第二连接段1246的过流截面面积逐渐增大，也就是说，第二连接段1246是个渐扩的结构。其中，沿垂直于第二连接段1246的长度方向，对第二连接段1246进行截面，在截面中，第二连接段1246的轮廓线围成的区域的面积为第二连接段1246的过流截面面积。
该设置有利于增大支撑筒126和音圈138之间的空间，能够提升空间利用率，有利于减少装配工序，以及第一频段单元100的低频响应。同时，该结构设置能够增大第二频段单元200辐射的声波能量与外部空气介质的耦合效率，提升高频单元的辐射效率，增强扬声器模组10的重放效果，实现对扬声器模组10高频响应的进一步提升。
在一些实施例中，如图1所示，壳体110还设有端子116，端子116与第一频段发声部130电连接；第二频段单元200包括以下任一种：动铁、动圈、压电微机电系统及压电片。
在该实施例中，壳体110还设有端子116，端子116与第一频段发声部130电连接，为第一频段发声部130工作提供动力支持。
具体地，对第二频段单元200的类型进行划分，其中，第二频段单元200包括动铁，或者第二频段单元200包括动圈，或者第二频段单元200包括压电微机电系统，或者第二频段单元200包括压电片。
根据本申请再一些实施例的耳机，包括：上述任一实施例的扬声器模组10。
根据本申请实施例的耳机因包括上述实施例的扬声器模组10，因此具有上述扬声器模组10的全部有益效果，在此不一一陈述。
在一些实施例中，耳机，还包括：外壳，扬声器模组10位于外壳内，扬声器模
组10和外壳的内表面之间合围出前腔和后腔，前腔和后腔通过第一泄压孔112连通，第二泄压孔122与后腔连通。
在该实施例中，耳机还包括外壳，扬声器模组10位于外壳内，扬声器模组10和外壳的内表面之间合围出前腔和后腔，第一泄压孔112连通耳机的前腔和后腔，第一泄压孔112具有泄压的作用，能够防止耳压过大，减少用户佩戴耳机时因为耳压过大而产生的不适感。
第二泄压孔122连通扬声器模组10的第一腔室150和耳机的后腔，当第一频段单元100在外力作用下挤压第一腔室150时，第一腔室150内的气体可以通过第二泄压孔122流动到耳机的后腔，第二泄压孔122具有泄压的作用，这样，能够有效解决第一腔室150内的气体不能及时外流，而导致第一腔室150内的气压过大造成扬声器模组10发生低音不良的问题，能够提高扬声器模组10的低音重放效果。
具体地，外壳还设有泄压口，泄压口与后腔连通。
本申请的扬声器模组10是同轴一体式扬声器模组10，扬声器模组10包括第一频段单元100(如，外磁式动圈单元)和第二频段单元200。
第一频段单元100和第二频段单元200均为轴对称结构，第一频段单元100包括导磁支架120和第一频段发声部130，导磁支架120、第一频段发声部130和第二频段单元200均为轴对称结构，且导磁支架120的轴线400、第一频段发声部130的轴线400和第二频段单元200的轴线400共线。在提高扬声器模组10的声学频响和音乐重放效果的同时，减小对耳机的内部空间的占用率，为耳机进一步集成其他功能传感器提供更多可能性。
如图1至图5所示，磁铁132安置于音圈138外侧。导磁支架120包括支撑筒126和支撑板128，第二频段单元200内嵌入支撑筒126，第二频段单元200(如，动铁单元)负责高频响应，提升扬声器模组10的高频性能。
第一通道124的形状为圆柱形，方便与多种形状的第二频段单元200(如，长方体动铁单元、圆柱形压电微机电系统)匹配。
导磁支架120的支撑板128上设有第二泄压孔122(第二泄压孔122的数量为一个或多个)，第二泄压孔122将第一腔室150与耳机的后腔连通，同时结合调音网布144，解决气压过大导致的低音不良问题，能够提高扬声器模组10的低音重放效果。
导磁支架120的支撑筒126的出声孔与第二频段单元200的出音口300相匹配，使得第一频段单元100和第二频段单元200出声方向一致，相比具有反向辐射的设计，减少了额外的导向结构，从而减少对耳机的空间的占用。
第一频段单元100的端子116将外部电信号导入第一频段单元100。第一泄压孔112可以将耳机的前腔和后腔连通，同时结合调音网布144，调节耳机佩戴时，耳道声压级过大问题，进一步提升耳机佩戴体验。
如图6所示，通过对第二频段单元200的出音口300与导磁支架120的一体化设置，简化了装配过程，增大了第一腔室150的体积，提升了扬声器模组10的低音表现，进一步提升耳机的空间利用率。
如图2所示，扬声器模组10包括一个动圈单元和一个第二频段单元200。第二频段单元200指分频后负责中高频信号的重放单元，第二频段单元200包括但不限于动铁单元，也可以是压电微机电系统、平面振膜136单元等等。
如图1所示，第一频段单元100的壳体110设有两个端子116，端子116作用是将外部的电信号引入扬声器模组10的动圈单元，驱动第一频段单元100发声。壳体110上还设有第一泄压孔112和调音网布144，目的为连通扬声器模组10的第一腔室150和耳机的后腔，防止耳压过大，减少消费者佩戴耳机时因为耳压过大产生的不适感。第一泄压孔112的形状和数量可以根据实际需求进行调整设计。具体地，壳体110一体形成有端子116和第一泄压孔112。如，壳体110一体注塑形成端子116和第一泄压孔112。
如图2所示，第一频段单元100为动圈单元，动圈单元包括壳体110、第一金属环140(如，内铜环)、第二金属环142(如，外铜环)、振膜136、音圈138、导磁板134、磁铁132、调音网布144和导磁支架120。动圈单元为外磁式设计，即，磁铁132包围音圈138。动铁单元装配在导磁支架120的第一通道124中，通过胶水或者其他方式固定。
如图3所示，由于动圈单元的振膜136为圆环形状，圆环内部利用胶水粘合在内铜环上，同时将内铜环固定在导磁支架120的第一环形槽1262，实现振膜136的内环部分固定。通过胶水或者泡棉将设有出音口300的导磁支架120以及内铜环进行粘结与密封。其作用在于：一是充分利用扬声器模组10内部空间，增大第二频段单元200的辐射面积与辐射效率；二是防止动圈单元的辐射能量通过第一通道124与耳机的后腔的辐射能量相互作用，降低扬声器模组10的辐射效率。第一通道124的下半部空间的形状为圆柱形，目的是与不同形状的第二频段单元200匹配，这种模块化的设计方便应用不同类型的第二频段单元200，例如长方体的动铁单元，圆柱形的压电微机电系统。本申请利用长方体的动铁单元作为高音部件，通过胶水将动铁单元的上表面与导磁支架120粘合固定，实现第二频段单元200的嵌入。
如图4所示，导磁支架120的支撑板128设有四个第二泄压孔122。具体地，通过激光打孔的方式形成四个第二泄压孔122。第二泄压孔122的形状和数量可以根据实际情况调整设计。利用第二泄压孔122有助于磁铁132和导磁支架120围住的第一腔室150内的空气流动到外部空间，起到泄压作用，解决扬声器模组10偶发性低音不良的问题。
如图5所示，调音网布144设置在导磁支架120的支撑板128，通过胶水黏合，作用为与第二泄压孔122相配合，实现泄压作用。
如图6所示，第一通道124的第二连接段1246形成有出音口300，自第一连接段1244向第二连接段1246，第二连接段1246的过流截面面积逐渐增大。增大了第二频段单元200辐射的声波能量与外部空气介质的耦合效率，实现对扬声器模组10高频响应的进一步提升。出音口300形状可以是指数型，也可以是双曲型或者悬链型。
需要说明的是，本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
尽管已描述了本申请实施例的可选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，所附权利要求意欲解释为包括可选实施例以及落入本申请实施例范围的所有变更和修改。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体与另一个实体区分开来，而不一定要求或者暗示这些实体之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的物品或者终端设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种物品或者终端设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括要素的物品或者终端设备中还存在另外的相同要素。
以上对本申请所提供的技术方案进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，同时，对于本领域的一般技术人员，依据本申请的原理及实现方式，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。
Claims (13)
- 一种扬声器模组，包括：第一频段单元，所述第一频段单元包括：壳体，所述壳体设有第一泄压孔；导磁支架，所述壳体位于所述导磁支架的周侧，所述导磁支架设有第二泄压孔；以及第一频段发声部，所述第一频段发声部连接于所述导磁支架和所述壳体之间，所述导磁支架、所述第一频段发声部和所述壳体的内表面之间合围出第一腔室，所述第一泄压孔和所述第二泄压孔均与所述第一腔室连通；及第二频段单元，所述第二频段单元设于所述导磁支架，所述第二频段单元设有第二腔室，所述导磁支架和所述第二频段单元中的一个设有出音口，所述出音口与所述第二腔室连通；其中，所述第一频段单元的频率小于所述第二频段单元的频率。
- 根据权利要求1所述的扬声器模组，其中，所述导磁支架设有第一通道，所述第一频段发声部位于所述第一通道的周侧，所述第二频段单元设于所述第一通道，所述第一通道的壁面的一部分与所述第二频段单元的外周壁贴合。
- 根据权利要求2所述的扬声器模组，其中，所述第一通道、所述第二频段单元和所述第一频段单元均为轴对称结构，所述第一通道的轴线、所述第二频段单元的轴线和所述第一频段单元的轴线共线。
- 根据权利要求2或3所述的扬声器模组，其中，所述导磁支架包括：支撑筒，所述支撑筒形成有所述第一通道；支撑板，连接于所述连接筒的周侧，所述支撑板设有所述第二泄压孔，所述支撑板用于支撑所述第一频段单元。
- 根据权利要求4所述的扬声器模组，其中，所述第一频段发声部包括：磁铁，设于所述支撑板上，所述磁铁与所述支撑筒之间具有间隙；导磁板，设于所述磁铁背离所述支撑板的一侧，振膜，连接于所述支撑筒和所述壳体之间，且位于所述导磁板背离所述磁铁的一侧；音圈，位于所述支撑筒的周侧，所述音圈自所述振膜延伸至所述磁铁和所述支撑筒之间的间隙处。
- 根据权利要求5所述的扬声器模组，其中，所述支撑筒的端部设有第一环形槽，所述壳体设有第二环形槽，所述第一频段发声部还包括：第一金属环，设于所述第一环形槽，且所述振膜与所述第一金属环连接；第二金属环，设于所述第二环形槽，且所述振膜与所述第二环形槽连接；调音网布，所述第一泄压孔和所述第二泄压孔处均设有所述调音网布。
- 根据权利要求5所述的扬声器模组，其中，所述振膜位于所述出音口的周侧。
- 根据权利要求7所述的扬声器模组，其中，所述第一通道的壁面包括环形配合段；所述第二频段单元还设有连接部，所述连接部设有第二通道，所述第二通道与所述第二腔室连通，所述环形配合段与所述连接部的外周壁贴合；所述连接部背离所述第一腔室的端部伸出所述第一通道，并形成所述出音口。
- 根据权利要求7所述的扬声器模组，其中，所述第一通道包括：第一连接段，所述第二频段单元位于所述第一连接段内，且所述第一连接段的壁面与所述第二频段单元的外周壁贴合；第二连接段，连接于所述第一连接段的一侧，所述第二频段单元还设有连通口，所述连通口连通所述第二腔室和所述第二连接段，所述第二连接段的端部形成所述出音口。
- 根据权利要求9所述的扬声器模组，其中，自所述第一连接段向所述第二连接段的方向上，所述第二连接段的过流截面面积逐渐增大。
- 根据权利要求1至3中任一项所述的扬声器模组，其中，所述壳体还设有端子，所述端子与所述第一频段发声部电连接；所述第二频段单元包括以下任一种：动铁、动圈、压电微机电系统及压电片。
- 一种耳机，包括：如权利要求1至11中任一项所述的扬声器模组。
- 根据权利要求12所述的耳机，其中，还包括：外壳，所述扬声器模组位于所述外壳内，所述扬声器模组和所述外壳的内表面之间合围出前腔和后腔，所述前腔和所述后腔通过所述第一泄压孔连通，所述第二泄压孔与所述后腔连通。
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| CN108600896A (zh) * | 2018-07-21 | 2018-09-28 | 深圳市蓝禾技术有限公司 | 扬声器及耳机 |
| CN212936195U (zh) * | 2020-07-02 | 2021-04-09 | 歌尔股份有限公司 | 一种动圈式扬声器和耳机 |
| CN115314815A (zh) * | 2022-08-29 | 2022-11-08 | 歌尔科技有限公司 | 一种扬声器单体及电子设备 |
| CN115396795A (zh) * | 2021-09-17 | 2022-11-25 | 歌尔股份有限公司 | 发声装置和电子设备 |
| WO2023005759A1 (zh) * | 2021-07-30 | 2023-02-02 | 华为技术有限公司 | 扬声器及电子设备 |
| CN116347302A (zh) * | 2023-02-27 | 2023-06-27 | 维沃移动通信有限公司 | 扬声器模组和耳机 |
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| CN108449700A (zh) * | 2018-06-14 | 2018-08-24 | 深圳市蓝禾技术有限公司 | 扬声器及应用该扬声器的耳机 |
| CN108600896A (zh) * | 2018-07-21 | 2018-09-28 | 深圳市蓝禾技术有限公司 | 扬声器及耳机 |
| CN212936195U (zh) * | 2020-07-02 | 2021-04-09 | 歌尔股份有限公司 | 一种动圈式扬声器和耳机 |
| WO2023005759A1 (zh) * | 2021-07-30 | 2023-02-02 | 华为技术有限公司 | 扬声器及电子设备 |
| CN115396795A (zh) * | 2021-09-17 | 2022-11-25 | 歌尔股份有限公司 | 发声装置和电子设备 |
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| CN116347302A (zh) * | 2023-02-27 | 2023-06-27 | 维沃移动通信有限公司 | 扬声器模组和耳机 |
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