WO2024171651A1

WO2024171651A1 - Conveyance device, laser irradiating device, conveyance method, and production method for organic el display device

Info

Publication number: WO2024171651A1
Application number: PCT/JP2024/000096
Authority: WO
Inventors: 恭平藤岡; 保小田嶋
Original assignee: Ｊｓｗアクティナシステム株式会社
Priority date: 2023-02-16
Filing date: 2024-01-09
Publication date: 2024-08-22
Also published as: JP2024116774A

Abstract

A conveyance device (6) according to the present embodiment comprises: a conveyance unit that moves a substrate in a conveyance direction; and a conveyance unit that, in a plan view, moves the substrate outside an irradiation position (65). The conveyance unit has a holding mechanism which holds the substrate and a linear motor (601) which moves the holding mechanism linearly. The conveyance unit has a holding mechanism which holds the substrate, a belt (709) to which the holding mechanism is connected, a pulley (716) on which the belt (709) is installed, and an AC servo motor (711) which rotates the pulley (716).

Description

TRANSPORTATION DEVICE, LASER IRRADIATION DEVICE, TRANSPORTATION METHOD, AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY DEVICE

This disclosure relates to a conveying device, a laser irradiation device, a conveying method, and a manufacturing method for an organic EL display device.

Patent Document 1 discloses a laser irradiation device that irradiates a substrate with laser light in a line shape. This laser irradiation device includes a levitation unit that levitates the substrate, a holding mechanism that adsorbs and holds the substrate on the levitation unit, and a moving mechanism that moves the holding mechanism in the transport direction. When viewed from above, a moving mechanism is provided on each end side of the rectangular levitation unit. The four moving mechanisms transport the substrate in a circular manner.

Patent No. 6887234

It is desirable for the transport device used in such a laser irradiation device to be able to transport the substrate appropriately.

Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.

According to one embodiment, the transport device transports a substrate to irradiate the substrate with a line-shaped laser beam, and includes a levitation unit that levitates the substrate on its upper surface, a first transport unit that moves the substrate in the transport direction to change the irradiation position of the laser beam on the substrate, and a second transport unit that moves the substrate outside the irradiation position in a top view, the first transport unit having a first holding mechanism that holds the substrate and a linear motor that moves the first holding mechanism linearly in the transport direction, and the second transport unit having a second holding mechanism that holds the substrate, a belt to which the second holding mechanism is connected, a pulley around which the belt is wound, and an AC servo motor that rotates the pulley.

According to one embodiment, the transport method transports a substrate so as to irradiate the substrate with a line-shaped laser beam, and includes the steps of: (A) a levitation unit levitating the substrate on its upper surface; (B) a first transport unit moving the substrate in the transport direction to change the irradiation position of the laser beam on the substrate; and (C) a second transport unit moving the substrate outside the irradiation position in a top view, the first transport unit having a first holding mechanism for holding the substrate and a linear motor for moving the first holding mechanism linearly in the transport direction, and the second transport unit having a second holding mechanism for holding the substrate, a belt to which the second holding mechanism is connected, a pulley around which the belt is wound, and an AC servo motor for rotating the pulley.

According to one embodiment, a method for manufacturing an organic EL display device includes the steps of (s1) forming an amorphous film on a substrate, and (s2) irradiating the substrate with a line-shaped laser beam to anneal the amorphous film so as to crystallize the amorphous film and form a crystallized film, and the annealing step (s2) includes the steps of (sa) a floating unit floating the substrate on its upper surface, and (sb) a first transport unit moving the substrate in a transport direction to anneal the substrate. (sc) changing the irradiation position of the laser light, and (sc) a step of a second transport unit moving the substrate outside the irradiation position in a top view, the first transport unit having a first holding mechanism that holds the substrate and a linear motor that moves the first holding mechanism linearly in the transport direction, the second transport unit having a second holding mechanism that holds the substrate, a belt to which the second holding mechanism is connected, a pulley around which the belt is wound, and an AC servo motor that rotates the pulley.

According to one embodiment, the device includes a levitation unit that levitates the substrate on its upper surface, a laser irradiation unit that irradiates the substrate with a line-shaped laser beam, a first transport unit that moves the substrate in the transport direction to change the irradiation position of the laser beam on the substrate, and a second transport unit that moves the substrate outside the irradiation position in a top view, the first transport unit having a first holding mechanism that holds the substrate and a linear motor that moves the first holding mechanism linearly in the transport direction, and the second transport unit having a second holding mechanism that holds the substrate, a belt to which the second holding mechanism is connected, a pulley around which the belt is wound, and an AC servo motor that rotates the pulley.

According to the embodiment described above, the substrate can be transported appropriately.

FIG. 2 is a perspective view showing the overall configuration of the conveying device. FIG. 2 is an xy plan view showing a schematic configuration of the transport device. 1 is an xz plan view showing a schematic configuration of a laser irradiation device equipped with a transport device; FIG. 2 is a yz plan view showing a schematic configuration of a laser irradiation device equipped with a transport device. FIG. 2 is a top view showing a schematic configuration of a transport unit using a linear motor. FIG. 2 is a side view showing a schematic configuration of a transport unit using a linear motor. FIG. 2 is a top view showing a schematic configuration of a transport unit using an AC servo motor. FIG. 2 is a side view showing a schematic configuration of a transport unit using an AC servo motor. FIG. 2 is a perspective view showing an AC servo motor and its peripheral configuration. FIG. 4 is a side view showing a schematic diagram of an exhaust system of the transport unit. 1 is a cross-sectional view illustrating an organic EL display device manufactured in a manufacturing process of a laser irradiation system. 1A to 1C are cross-sectional views illustrating steps in a manufacturing process of an organic EL display device. 1A to 1C are cross-sectional views illustrating steps in a manufacturing process of an organic EL display device.

The following describes the transport device, transport method, and manufacturing method for an organic EL display device according to the present embodiment with reference to the drawings. The transport device and transport method are used in a laser irradiation device. In the following description, the workpiece to be irradiated with the laser is described as a glass substrate with an amorphous silicon film, but the workpiece is not particularly limited.

One example of a laser irradiation device is an excimer laser annealing device that irradiates an amorphous silicon film formed on a substrate with laser light to form a polysilicon film. Therefore, laser irradiation devices are used to manufacture TFT (Thin Film Transistor) array substrates in the manufacturing process of liquid crystal display panels and organic EL (ElectroLuminescence) display panels. In other words, laser irradiation devices are used in the manufacturing process of semiconductor devices such as TFT array substrates.

(Basic configuration of laser irradiation device)
First, the basic configurations of the laser irradiation device 1 and the transport device 6 will be described with reference to Fig. 1 to Fig. 4. Fig. 1 is a perspective view for explaining the basic configuration of the transport device 6. Fig. 2 is a top view of the transport device 6. Fig. 3 is a side view showing the configuration of the laser irradiation device 1 equipped with the transport device 6. Fig. 4 is a side view showing the configuration of the laser irradiation device 1 equipped with the transport device 6.

In the figures below, for ease of explanation, an xyz three-dimensional Cartesian coordinate system is shown where appropriate. The z direction is the vertical direction, the y direction is the direction along the linear laser spot, and the x direction is the transport direction. While transporting (scanning) in the x direction, the substrate is irradiated with linear laser light along the y direction. Additionally, the x and y directions are directions along the edges of the rectangular workpiece 66.

The levitation unit 60 is configured to eject gas from the surface of the levitation unit 60, and the gas ejected from the surface of the levitation unit 60 is sprayed onto the underside of the workpiece 66, causing the workpiece 66 to levitate. The levitation unit 60 is disposed on a stand (not shown).

Furthermore, the rectangular levitation unit 60 is divided into six regions 60a to 60f when viewed in the xy plane. Specifically, the levitation unit 60 includes a first region 60a to a fourth region 60d, an irradiation region 60e, and a monitor region 60f. The first region 60a is a rectangular region including a corner on the -x side and a corner on the +y side (the upper left corner in FIG. 2). The second region 60b is a rectangular region including a corner on the +x side and a corner on the +y side (the upper right corner in FIG. 2). The third region 60c is a rectangular region including a corner on the +x side and a corner on the -y side (the lower right corner in FIG. 2). The fourth region 60d is a rectangular region including a corner on the -x side and a corner on the -y side (the lower left corner in FIG. 2).

The irradiation area 60e is disposed between the first area 60a and the second area 60b. The irradiation area 60e is an area irradiated with the laser light. That is, the irradiation position 65 of the laser light 15 is included in the irradiation area 60e. The monitor area 60f is disposed between the third area 60c and the fourth area 60d. Therefore, the half area on the +y side of the levitation unit 60 (the upper half area in FIG. 2) is the first area 60a, the irradiation area 60e, and the second area 60b, in order from the -x side (the left side in FIG. 2). The half area on the -y side of the levitation unit 60 (the lower half area in FIG. 2) is the third area 60c, the monitor area 60f, and the fourth area 60d, in order from the +x side. As shown in Patent Document 1, the transport device 6 circulates and transports the workpiece 66 on the levitation unit 60.

In the xy plane view, the first region 60a to the fourth region 60d may have approximately the same area. In the xy plane view, the projection region 60e and the monitor region 60f may be rectangular and have approximately the same area. In this case, the first region 60a and the fourth region 60d are arranged side by side in the y direction. The second region 60b and the fourth region 60d are arranged side by side in the y direction. The projection region 60e and the monitor region 60f are arranged side by side in the y direction.

Furthermore, an alignment mechanism 69 is provided in the first region 60a. A rotation mechanism 68 is provided in the fourth region 60d. Furthermore, an auxiliary levitation unit 67 is provided outside the fourth region 60d. The auxiliary levitation units 67 are respectively disposed on the -y and -x sides of the fourth region 60d. The operations of the rotation mechanism 68, alignment mechanism 69, and auxiliary levitation unit 67 will be described later.

As shown in FIG. 1, the workpiece 66 is transported sequentially through the first region 60a to the fourth region 60d. That is, when the workpiece 66 is transported from the first region 60a in the +x direction, it passes through the irradiation region 60e and moves to the second region 60b. When passing through the irradiation region 60e, the workpiece 66 is irradiated with laser light. When the workpiece 66 is transported from the second region 60b in the -y direction, it moves to the third region 60c.

When the workpiece 66 is transported from the third region 60c in the -x direction, it passes through the monitor region 60f and moves to the fourth region 60d. In the monitor region 60f, the unevenness of the laser light irradiation is monitored. For example, in the monitor region 60f, the unevenness of the irradiation is monitored by a camera (not shown). When the workpiece 66 is transported from the fourth region 60d in the +y direction, it moves to the first region 60a.

In this way, the workpiece 66 is transported in changing directions: +x, -y, -x, +y. In other words, the workpiece 66 is transported in a circulating manner between the first region 60a to the fourth region 60d. Strictly speaking, the fourth region 60d is the loading/unloading position for the workpiece 66, so the workpiece 66 is transported in the order of the fourth region 60d, the first region 60a, the second region 60b, and the third region 60c. Of course, the loading/unloading position is not limited to the fourth region 60d.

Furthermore, the workpiece 66 may be circulated in the opposite direction. For example, the workpiece 66 may be transported in the order of the fourth region 60d, the third region 60c, the second region 60b, and the first region 60a. That is, in the plan view of FIG. 2, the transport direction may be either clockwise or counterclockwise. The transport direction may be switched as appropriate depending on the processing of the laser irradiation device 1.

As described above, in order to circulate and transport the workpiece 66, the laser irradiation device 1 is equipped with four transport units 61_1 to 61_4. The transport units 61_1 to 61_4 are provided outside the levitation unit 60, near each side of the levitation unit 60.

The levitation unit 60 has a rectangular shape when viewed in the xy plane, and each of the transport units 61_1 to 61_4 is arranged to transport the workpiece 66 along each side of the levitation unit 60. Note that each of the transport units 61_1 to 61_4 is arranged on the outside of each side of the levitation unit 60, but may also be arranged on the inside of the levitation unit 60.

Each of the transport units 61_1 to 61_4 moves the workpiece 66 in a straight line. The transport unit 61_1 moves the workpiece 66 in the +x direction. This moves the workpiece 66 from the first region 60a to the second region 60b. The transport unit 61_2 moves the workpiece 66 in the -y direction. This moves the workpiece 66 from the second region 60b to the third region 60c. The transport unit 61_3 moves the workpiece 66 in the -x direction. This moves the workpiece 66 from the third region 60c to the fourth region 60d. The transport unit 61_4 moves the workpiece 66 in the +y direction. This moves the workpiece 66 from the fourth region 60d to the first region 60a.

Specifically, the transport unit 61_1 is provided on the side of the levitation unit 60 on the +y direction side, and includes a holding mechanism 62_1 and a moving mechanism 63_1. The holding mechanism 62_1 suctions and holds the workpiece 66. The holding mechanism 62_1 can be configured using a vacuum suction mechanism equipped with a porous body. The holding mechanism 62_1 (vacuum suction mechanism) is connected to an exhaust port (not shown), which is connected to an ejector, a vacuum pump, or the like. Thus, a negative pressure for sucking gas acts on the holding mechanism 62_1, and the workpiece 66 can be held using the holding mechanism 62_1.

The holding mechanism 62_1 also has a lifting mechanism (not shown in Figs. 1 to 4) for performing the suction operation. The lifting mechanism includes, for example, an actuator such as an air cylinder or a motor. For example, the holding mechanism 62_1 lifts up to the suction position and then suctions the workpiece 66. The holding mechanism 62_1 also lowers to the standby position when suction is released.

In this embodiment, as shown in FIG. 4, the holding mechanism 62_1 holds the workpiece 66 by sucking the surface (lower surface) of the workpiece 66 opposite to the surface (upper surface) irradiated with the laser light, that is, the surface of the workpiece 66 facing the levitation unit 60. The holding mechanism 62_1 also holds the end of the workpiece 66 in the +y direction (i.e., the end perpendicular to the transport direction of the workpiece 66).

The moving mechanism 63_1 provided in the transport unit 61_1 is connected to the holding mechanism 62_1. The moving mechanism 63_1 is configured to be able to move the holding mechanism 62_1 in the transport direction (x direction). The transport unit 61_1 (holding mechanism 62_1 and moving mechanism 63_1) is provided on the end side of the levitation unit 60 in the +y direction, and the workpiece 66 is transported by the moving mechanism 63_1 moving in the transport direction while the holding mechanism 62_1 holds the workpiece 66.

As shown in FIG. 2, for example, the moving mechanism 63_1 is configured to slide the end of the levitation unit 60 in the +y direction along the +x direction. When the moving mechanism 63_1 slides the end of the levitation unit 60 in the +x direction, the workpiece 66 is transported along the x direction. At this time, the transport speed of the workpiece 66 can be controlled by controlling the moving speed of the moving mechanism 63_1. The moving mechanism 63_1 includes, for example, an actuator such as a motor and a linear guide mechanism, not shown. The configuration of the moving mechanism 63_1 will be described later.

3 and 4, the workpiece 66 is irradiated with the laser light 15. In FIG. 1 and FIG. 2, the position where the laser light 15 is irradiated is the irradiation position 65. The irradiation position 65 is a straight line extending in the y direction. For example, the laser irradiation device 1 is a laser annealing device, and in this case, an excimer laser or the like can be used for the laser irradiation unit 14. The laser irradiation unit 14 includes an optical system (not shown) such as a laser light source and a cylindrical lens. The laser light supplied from the laser light source becomes a line in the optical system (not shown) having a cylindrical lens. The workpiece 66 is irradiated with a line-shaped laser light 15 (line beam) whose focal point extends in the y direction (see FIG. 1). In other words, the irradiation position 65 on the workpiece 66 extends in a direction (y direction) perpendicular to the transport direction (x direction) of the workpiece 66.

In the transport device 6, the workpiece 66 is floated using the levitation unit 60 while the transport unit 61_1 is used to hold the underside of the workpiece 66 and transport the workpiece 66 in the transport direction. At this time, the transport unit 61_1 provided in the laser irradiation device 1 transports the workpiece 66 while holding a position that does not overlap with the irradiation position 65 in a plan view (i.e., when viewed from the z direction). In other words, as shown in FIG. 2, when the workpiece 66 is transported in the transport direction, the position where the transport unit 61_1 holds the workpiece 66 (corresponding to the position of the holding mechanism 62_1) does not overlap with the irradiation position 65.

In this way, the workpiece 66 can be transported from the first region 60a to the second region 60b by moving the moving mechanism 63_1 in the +x direction while the holding mechanism 62_1 holds the workpiece 66. The workpiece 66 passes through the irradiation region 60e during transport by the transport unit 61_1. Therefore, the laser light 15 is irradiated onto the workpiece 66 as it is transported from the first region 60a to the second region 60b.

The transport unit 61_1 moves the workpiece 66 in the x direction so as to change the irradiation position 65 of the laser light 15 on the workpiece 66. Note that the transport direction of the transport unit 61_1 is parallel to the x direction, but it may be inclined from the x direction. In other words, the transport direction may be any direction inclined from the line direction.

The transport unit 61_2 is provided on the side of the levitation unit 60 on the +x side, and includes a holding mechanism 62_2 and a moving mechanism 63_2. The moving mechanism 63_2 moves in the -y direction while the holding mechanism 62_2 holds the workpiece 66, thereby transporting the workpiece 66 from the second region 60b to the third region 60c. The moving mechanism 63_2 slides the end of the levitation unit 60 in the -y direction, transporting the workpiece 66 in the -y direction.

The transport unit 61_3 is provided on the side of the levitation unit 60 on the -y direction side, and includes a holding mechanism 62_3 and a moving mechanism 63_3. The moving mechanism 63_3 moves in the -x direction while holding the workpiece 66, thereby transporting the workpiece 66 from the third region 60c to the fourth region 60d. The workpiece 66 passes through the monitor region 60f as it is transported by the transport unit 61_3. The moving mechanism 63_3 slides the end of the levitation unit 60 along the -x direction, thereby transporting the workpiece 66 along the -x direction.

The transport unit 61_4 is provided on the side of the levitation unit 60 on the -x direction side, and includes a holding mechanism 62_4 and a moving mechanism 63_4. The moving mechanism 63_4 moves in the +y direction while the holding mechanism 62_4 holds the workpiece 66, thereby transporting the workpiece 66 from the fourth region 60d to the first region 60a. The moving mechanism 63_4 slides the end of the levitation unit 60 along the +y direction, thereby transporting the workpiece 66 along the +y direction.

The moving mechanisms 63_2, 63_3, and 63_4 move the workpiece 66 outside the irradiation position 65. In other words, the moving mechanisms 63_2, 63_3, and 63_4 move the workpiece 66 that does not overlap with the irradiation position 65. Therefore, even if the moving mechanisms 63_2, 63_3, and 63_4 move the workpiece 66, the laser light 15 is not irradiated onto the workpiece 66. The moving mechanisms 63_2, 63_3, and 63_4 each include, for example, an actuator such as a motor and a linear guide mechanism (not shown). The configurations of the moving mechanisms 63_2, 63_3, and 63_4 will be described later.

Holding mechanisms 62_2, 62_3, and 62_4 have the same configuration as holding mechanism 62_1, and adsorb the workpiece 66. Holding mechanisms 62_2 and 62_4 are arranged in a different orientation from holding mechanisms 62_1 and 62_3. More specifically, in an xy plane view, holding mechanisms 62_1 and 62_3 are rectangular with the x direction as the longitudinal direction, as shown in FIG. 2. Holding mechanisms 62_2 and 62_4 are rectangular as shown in FIG. 2, but their installation directions are different by 90°. That is, while holding mechanisms 62_1 and 62_3 have the x direction as the longitudinal direction and the y direction as the lateral direction, holding mechanisms 62_2 and 62_4 have the y direction as the longitudinal direction and the x direction as the lateral direction. Holding mechanisms 62_1 to 62_4 are arranged so that their movement direction is the longitudinal direction.

In the laser irradiation device 1, the length of the irradiation position 65 in the y direction is approximately half the length of the workpiece 66 in the y direction. Therefore, when the workpiece 66 passes the irradiation position 65, half of the area of the workpiece 66 in the y direction is irradiated with laser light. Therefore, the workpiece 66 is transported so as to circulate twice above the levitation unit 60. In this way, the laser light is irradiated onto almost the entire surface of the workpiece 66.

When the laser light is irradiated to almost the entire surface of the workpiece 66, as shown in Figs. 1 and 2, a rotation mechanism 68 is provided in the fourth region 60d of the levitation unit 60. The rotation axis of the rotation mechanism 68 is parallel to the z direction. The rotation mechanism 68 rotates the workpiece 66 by 180 degrees while holding the horizontal plane (xy plane) of the workpiece 66. That is, the workpiece 66 is transported from the first region 60a to the second region 60b using the transport unit 61_1 and irradiated with the laser light 15, and then the workpiece 66 is transported using the transport units 61_2 to 61_4 while rotating the workpiece 66 by 180 degrees using the rotation mechanism 68. Then, the workpiece 66 is transported from the region 60a to the region 60b using the transport unit 61_1 again and irradiated with the laser light 15, so that the entire surface of the workpiece 66 can be irradiated with the laser light 15.

As shown in FIG. 2, auxiliary levitation units 67 are provided outside the levitation unit 60. The auxiliary levitation units 67 are disposed on the -x and -y sides of the fourth region 60d. Similar to the levitation unit 60, the auxiliary levitation units 67 levitate the workpiece 66 by ejecting gas toward the workpiece 66.

For example, while the rotating mechanism 68 is rotating the workpiece 66, a part of the workpiece 66 protrudes from the fourth region 60d. During rotation, the auxiliary levitation unit 67 ejects gas toward the end of the workpiece 66 that protrudes from the fourth region 60d. A levitation force is generated on the part of the workpiece 66 that protrudes from the levitation unit 60. In this way, the rotating mechanism 68 can rotate the workpiece 66 without damaging it. The holding mechanism 62_4 moves between the auxiliary levitation unit 67 and the levitation unit 60.

The alignment mechanism 69, like the holding mechanism 62_1, adsorbs and holds the workpiece 66 via a porous body. The alignment mechanism 69 then adjusts the position and rotation angle of the workpiece 66. The alignment mechanism 69 performs alignment operations for the position in the x direction (hereinafter, x coordinate), the position in the y direction (hereinafter, y coordinate), and the rotation angle around the z axis (hereinafter, angle θ). For example, the position and rotation angle of the workpiece 66 may shift slightly due to the loading, transport, and rotation operations of the workpiece 66. The alignment mechanism 69 corrects the shift in position and rotation angle. This allows the irradiation position of the laser light on the workpiece 66 to be controlled with high precision.

Here, the workpiece 66 is irradiated with laser light by the transport of the transport unit 61_1. Therefore, high positional accuracy is required for the transport of the transport unit 61_1. That is, to make the irradiation intensity of the laser light uniform, the transport speed of the transport unit 61_1 needs to be constant. Alternatively, the transport height of the workpiece 66 needs to be constant during laser irradiation. On the other hand, the workpiece 66 is not irradiated with laser light during transport by the transport units 61_2, 61_3, and 61_4. High positional accuracy is not required for the transport of the transport units 61_2, 61_3, and 61_4.

Therefore, in this embodiment, a linear motor is used as the moving mechanism 63_1 of the transport unit 61_1. On the other hand, AC (alternating current) servo motors and belts are used as the moving mechanisms 63_2 to 63_4 of the transport units 61_2 to 61_4. A linear motion mechanism using a linear motor has higher positioning accuracy than a linear motion mechanism using an AC servo motor and belt. This allows the irradiation intensity of the laser light to be constant, enabling a stable process. In addition, a linear motion mechanism using an AC servo motor and belt is cheaper than a linear motion mechanism using a linear motor. The three moving mechanisms 63_2 to 63_4 can be realized with an inexpensive configuration.

(Transport unit 61_1)
The moving mechanism 63_1 of the transport unit 61_1 will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is a top view showing the configuration of the transport unit 61_1. Fig. 6 is a side view showing the schematic configuration of the transport unit 61_1.

As described above, the transport unit 61_1 includes a holding mechanism 62_1 and a moving mechanism 63_1. The moving mechanism 63_1 includes a linear motor 601, a guide mechanism 603, a base 606, and a damper 607. The linear motor 601 includes a mover 601a and a stator 601b. The holding mechanism 62_1 includes a lifting mechanism 621 and an adsorption section 622.

The base 606 is a stage that supports the guide mechanism 603 and the like. The guide mechanism 603 is fixed onto the base 606. The guide mechanism 603 is a linear guide that has a rail or the like extending along the x direction. The guide mechanism 603 may have a guide groove or the like formed therein. The guide mechanism 603 guides the linear movement of the mover 601a. In addition, a damper 607 is attached to the end of the guide mechanism 603. The damper 607 defines the moving end of the mover 601a.

For example, the stator 601b of the linear motor 601 is attached to the guide mechanism 603. The stator 601b has, for example, a permanent magnet. In other words, multiple permanent magnets are arranged along the x direction. For example, north and south poles are arranged alternately and repeatedly at regular intervals in the x direction.

The mover 601a of the linear motor 601 has an electromagnet. By controlling the current to the electromagnet, the mover 601a moves along the guide mechanism 603. The mover 601a moves linearly without contacting the guide mechanism 603. A holding mechanism 62_1 for attracting and holding the workpiece 66 is disposed above the linear motor 601.

The moving mechanism 63_1 can move the holding mechanism 62_1 in the x direction. In this way, the transport unit 61_1 uses the moving mechanism 63_1 having a linear motor 601. Therefore, the transport unit 61_1 can move the workpiece 66 with high precision. Therefore, the transport device 6 can appropriately transport the workpiece 66, thereby improving productivity.

The holding mechanism 62_1 is also provided with a lifting mechanism 621 and an adsorption unit 622. The adsorption unit 622 has a porous body for vacuum adsorbing the workpiece 66. The lifting mechanism 621 lifts and lowers the adsorption unit 622 of the holding mechanism 62_1. The lifting mechanism 621 lifts and lowers the adsorption unit 622 to transfer the workpiece 66. The lifting mechanism 621 lifts and lowers the adsorption unit 622 to transfer the workpiece 66 to the holding mechanism 62_2. The lifting mechanism 621 also lifts and lowers the adsorption unit 622 to receive the workpiece 66 from the holding mechanism 62_4.

(Transport units 61_2 to 61_4)
The transport units 61_2 to 61_4 use AC servo motors instead of linear motors. Below, the configuration of the transport unit 61_3 will be described with reference to Figs. 7 to 10, as a representative of the transport units 61_2 to 61_4. Fig. 7 is a top view showing the configuration of the transport unit 61_3. Fig. 8 is a side view showing the configuration of the transport unit 61_3. Fig. 9 is an enlarged perspective view showing the configuration of the drive section of the transport unit 61_3. Fig. 10 is an xz cross-sectional view showing a schematic diagram of the exhaust system, etc., of the transport unit 61_3.

The transport unit 61_3 includes a holding mechanism 62_3 and a moving mechanism 63_3. The moving mechanism 63_3 includes a guide mechanism 703, a movable part 704, a base 706, an AC servo motor 711, and a pulley 716. The moving mechanism 63_3 further includes a cover 715 and an exhaust flange 714. The holding mechanism 62_3 includes a lifting mechanism 721 and an adsorption part 722.

The base 706 is a stage that supports the guide mechanism 703 and the like. The guide mechanism 703 is fixed onto the base 706. The guide mechanism 703 is a linear guide that has a rail or the like extending along the x direction. The guide mechanism 703 may have a guide groove or the like. In addition, a damper 707 is attached to the end of the guide mechanism 703. The damper 707 determines the moving end of the movable part 704.

The guide mechanism 703 holds the movable part 704 so that it can slide. The guide mechanism 703 guides the linear movement of the movable part 704. The movable part 704 is attached to the upper surface of the belt 709. Furthermore, a holding mechanism 62_3 is attached above the movable part 704. The holding mechanism 62_3 is connected to the belt 709 via the movable part 704. Therefore, the holding mechanism 62_3 moves back and forth in the x direction together with the movable part 704.

Belt 709 is a timing belt or the like, and is arranged along the x direction. As shown in FIG. 10, pulleys 716 are attached to both ends of belt 709. Belt 709 is, for example, an endless belt or the like, and is formed in a ring shape when viewed in the xz plane. Two pulleys 716 are arranged inside ring-shaped belt 709. Belt 709 may be a belt other than an endless belt.

Two pulleys 716 are spaced apart in the x direction. The rotation axis of the pulley 716 is parallel to the y direction. As shown in FIG. 9, a belt 709 is looped around the pulley 716. Between the two pulleys 716, the belt 709 is parallel to the x direction. The belt 709 is, for example, a toothed belt or a flat belt. The pulley 716 is, for example, a toothed pulley or a flat pulley.

The rotating shaft 711a of the AC servo motor 711 is connected to one of the pulleys 716. When the AC servo motor 711 rotates the pulley 716, the belt 709 rotates. The movable part 704 moves in the x direction in accordance with the rotation of the belt 709. The movable part 704 slides in the x direction between the two pulleys 716. This causes the holding mechanism 62_2 to move back and forth in the x direction, so that the workpiece 66 can be transported in the -x direction.

The holding mechanism 62_3 is also provided with a lifting mechanism 721 and an adsorption unit 722. The adsorption unit 722 has a porous body for vacuum adsorbing the workpiece 66. The lifting mechanism 721 lifts and lowers the adsorption unit 722 of the holding mechanism 62_3. The lifting mechanism 721 lifts and lowers the adsorption unit 722 to transfer the workpiece 66. The lifting mechanism 721 lifts and lowers the adsorption unit 722 to receive the workpiece 66 from the holding mechanism 62_2. The lifting mechanism 721 also lifts and lowers the adsorption unit 722 to transfer the workpiece 66 to the holding mechanism 62_4.

In this way, the moving mechanism 63_2 moves the workpiece 66 using the AC servo motor 711 and the belt 709. This allows the transport device 6 to transport the workpiece 66 with an inexpensive configuration. Since the transport device 6 can transport the workpiece 66 appropriately, productivity can be improved.

The basic configuration of the moving mechanisms 63_2 and 63_4 is similar to that of the moving mechanism 63_3, so a detailed description will be omitted. The moving mechanisms 63_2 and 63_4 also use an AC servo motor 711 and a belt 709, just like the moving mechanism 63_3. The moving mechanisms 63_2 and 63_4 differ from the moving mechanism 63_3 in that the moving direction is the y direction. Therefore, it is sufficient to change the orientation of the guide mechanism 703, the belt 709, the AC servo motor 711, etc. by 90 degrees when they are installed.

As the pulley 716 rotates, dust may be generated from the contact area between the belt 709 and the pulley 716. Therefore, in this embodiment, a cover 715 is provided on the end of the belt 709 on the -x side. In other words, the contact area between the pulley 716 and the belt 709 is covered with the cover 715. As shown in FIG. 9, the cover 715 is a case that houses the rotating shaft 711a, bearings, etc. By covering the end of the belt 709 with the cover 715, contamination by dust can be prevented. Dust can be prevented from adhering to the workpiece 66.

Cover 715 has an opening 715a and an exhaust flange 714. Belt 709 is taken out from opening 715a of cover 715. Cover 715 has exhaust flange 714 on the opposite side of opening 715a. Exhaust flange 714 serves as an exhaust port connected to the internal space of cover 715. As shown in FIG. 10, exhaust flange 714 is connected to pipe 740. Here, opening 715a is located on the +x side of cover 715, and exhaust flange 714 is located on the -x side of cover 715.

As shown in FIG. 10, the piping 740 is routed to the outside of the chamber 730 of the laser irradiation device 1. The chamber 730 is disposed so as to entirely surround the transport device 6 (not shown in FIG. 10). Specifically, the piping 740 is connected to a dust collector 742 together with piping 741 from other exhaust points. The dust collector 742 serves as an exhaust mechanism that exhausts the internal space of the cover 715. The dust collector 742 exhausts the gas in the chamber 730 through the piping 740 and 741.

In this way, dust generated inside the cover 715 can be discharged to the outside of the chamber 730. This prevents contamination of the workpiece 66 and improves the productivity of the laser irradiation process.

The transport method using the transport device 6 described above includes, for example, the following steps.
(A) A step in which a levitation unit levitates the substrate on its upper surface.
(B) A step in which a first transport unit moves the substrate in a transport direction to change the irradiation position of the laser light on the substrate.
(C) A step in which a second transport unit moves the substrate outside the irradiation position in a top view.

(Organic EL display)
The semiconductor device having the polysilicon film is suitable for a TFT (Thin Film Transistor) array substrate for an organic EL (ElectroLuminescence) display. That is, the polysilicon film is used as a semiconductor layer having a source region, a channel region, and a drain region of the TFT.

Below, a configuration in which the semiconductor device according to this embodiment is applied to an organic EL display will be described. FIG. 11 is a cross-sectional view showing a simplified pixel circuit of an organic EL display. The organic EL display 300 shown in FIG. 11 is an active matrix display device in which a TFT is arranged in each pixel PX.

The organic EL display 300 includes a substrate 310, a TFT layer 311, an organic layer 312, a color filter layer 313, and a sealing substrate 314. FIG. 11 shows a top-emission organic EL display in which the sealing substrate 314 side is the viewing side. Note that the following description shows one configuration example of an organic EL display, and the present embodiment is not limited to the configuration described below. For example, the semiconductor device according to the present embodiment may be used in a bottom-emission organic EL display.

The substrate 310 is a glass substrate or a metal substrate. A TFT layer 311 is provided on the substrate 310. The TFT layer 311 has a TFT 311a arranged in each pixel PX. Furthermore, the TFT layer 311 has wiring (not shown) connected to the TFT 311a, etc. The TFT 311a and the wiring etc. constitute a pixel circuit.

An organic layer 312 is provided on the TFT layer 311. The organic layer 312 has an organic EL element 312a arranged for each pixel PX. Furthermore, the organic layer 312 is provided with partition walls 312b for separating the organic EL elements 312a between the pixels PX.

A color filter layer 313 is provided on the organic layer 312. The color filter layer 313 is provided with a color filter 313a for color display. That is, in each pixel PX, a resin layer colored R (red), G (green), or B (blue) is provided as the color filter 313a.

A sealing substrate 314 is provided on the color filter layer 313. The sealing substrate 314 is a transparent substrate such as a glass substrate, and is provided to prevent deterioration of the organic EL light-emitting element of the organic layer 312.

The current flowing through the organic EL element 312a of the organic layer 312 changes depending on the display signal supplied to the pixel circuit. Therefore, by supplying a display signal corresponding to the display image to each pixel PX, the amount of light emitted by each pixel PX can be controlled. This makes it possible to display the desired image.

In an active matrix display device such as an organic EL display, one pixel PX is provided with one or more TFTs (e.g., a switching TFT or a driving TFT). The TFT of each pixel PX is provided with a semiconductor layer having a source region, a channel region, and a drain region. The polysilicon film of this embodiment is suitable for the semiconductor layer of a TFT. In other words, by using a polysilicon film manufactured by the above manufacturing method as the semiconductor layer of a TFT array substrate, it is possible to suppress in-plane variations in TFT characteristics. Therefore, a display device with excellent display characteristics can be manufactured with high productivity.

<Semiconductor device manufacturing process>
The manufacturing method of a semiconductor device using the laser irradiation device according to the present embodiment is suitable for manufacturing a TFT array substrate. The manufacturing method of a semiconductor device having TFTs will be described with reference to Figs. 12 and 13. Figs. 12 and 13 are cross-sectional views showing the manufacturing process of a semiconductor device. In the following description, a manufacturing method of a semiconductor device having an inverted staggered type TFT will be described. Figs. 12 and 13 show the process of forming a polysilicon film in the semiconductor manufacturing method. It should be noted that the other manufacturing processes can be performed by known methods, and therefore the description will be omitted.

As shown in FIG. 12, a gate electrode 402 is formed on a glass substrate 401. A gate insulating film 403 is formed on the gate electrode 402. An amorphous silicon film 404 is formed on the gate insulating film 403. The amorphous silicon film 404 is disposed so as to overlap the gate electrode 402 with the gate insulating film 403 interposed therebetween. For example, the gate insulating film 403 and the amorphous silicon film 404 are successively formed by a CVD (Chemical Vapor Deposition) method.

Then, by irradiating the amorphous silicon film 404 with laser light L1, a polysilicon film 405 is formed as shown in FIG. 13. That is, the amorphous silicon film 404 is crystallized by the laser irradiation device 1 shown in FIG. 3 etc. As a result, a polysilicon film 405 made of crystallized silicon is formed on the gate insulating film 403. The polysilicon film 405 corresponds to the polysilicon film described above.

The method for manufacturing a semiconductor device according to this embodiment may include the following steps.
(s1) A step of forming an amorphous film on a substrate.
(s2) irradiating the substrate with a line-shaped laser beam to anneal the amorphous film so as to crystallize the amorphous film and form a crystallized film.
Then, in step s2, the above-mentioned transfer device is used to transfer the processing object 66, which will become the substrate, by another transfer method.

Furthermore, in the above description, the laser annealing apparatus according to the present embodiment has been described as irradiating an amorphous silicon film with laser light to form a polysilicon film, but it may also be irradiating an amorphous silicon film with laser light to form a microcrystalline silicon film. Furthermore, the laser light used for annealing is not limited to an excimer laser, and may be an Nd:YAG laser or the like. The method according to the present embodiment can also be applied to a laser annealing apparatus that crystallizes a thin film other than a silicon film. In other words, the method according to the present embodiment can be applied to any laser annealing apparatus that irradiates an amorphous film with laser light to form a crystallized film. The laser annealing apparatus according to the present embodiment can appropriately modify a substrate with a crystallized film.

The present invention is not limited to the above embodiment, and can be modified as appropriate without departing from the spirit of the invention.

This application claims priority based on Japanese Patent Application No. 2023-022575, filed on February 16, 2023, the entire disclosure of which is incorporated herein by reference.

REFERENCE SIGNS LIST 1 laser irradiation device 6 transport device 14 laser irradiation section 15 laser light 61_1 to 61_4 transport unit 62_1 to 62_4 holding mechanism 63_1 to 63_4 moving mechanism 60a first region 60b second region 60c third region 60d fourth region 60e irradiation region 60f monitor region 65 irradiation position 66 processing target object 67 auxiliary floating unit 68 rotation mechanism 69 alignment mechanism 300 organic EL display 311 TFT layer 311a TFT
312 organic layer 312a organic EL light emitting element 312b partition wall 313 color filter layer 313a color filter (CF)
314 Sealing substrate PX Pixel 601 Linear motor 601a Movable element 601b Stator 603 Guide mechanism 606 Base 607 Damper 621 Lifting mechanism 622 Suction portion 703 Guide mechanism 704 Movable element 706 Base 709 Belt 711 AC servo motor 714 Exhaust flange 715 Cover 716 Pulley 730 Chamber 740 Pipe 741 Pipe 742 Dust collector

Claims

A conveying device that conveys a substrate in order to irradiate the substrate with a line-shaped laser beam, comprising:
a levitation unit that levitates the substrate on its upper surface;
a first transport unit that moves the substrate in a transport direction so as to change an irradiation position of the laser light on the substrate;
a second transport unit configured to move the substrate outside the irradiation position when viewed from above,
The first conveying unit,
a first holding mechanism for holding the substrate;
a linear motor that moves the first holding mechanism linearly in a conveying direction,
The second transport unit,
a second holding mechanism for holding the substrate;
a belt to which the second retaining mechanism is connected;
A pulley around which the belt is wound;
and an AC servo motor for rotating the pulley.
a cover for covering a contact portion between the pulley and the belt;
The transport device according to claim 1 , further comprising an exhaust mechanism for exhausting the space inside the cover.
The transport device according to claim 1 or 2, wherein the second transport unit transports the substrate in a direction perpendicular to the transport direction or in a direction opposite to the transport direction.
A method for transporting a substrate in order to irradiate the substrate with a line-shaped laser beam, comprising the steps of:
(A) a levitation unit levitating the substrate on its upper surface;
(B) a first transport unit moves the substrate in a transport direction to change an irradiation position of the laser light on the substrate;
(C) a second transport unit moving the substrate outside the irradiation position in a top view,
The first conveying unit,
a first holding mechanism for holding the substrate;
a linear motor that moves the first holding mechanism linearly in a conveying direction,
The second transport unit,
a second holding mechanism for holding the substrate;
a belt to which the second retaining mechanism is connected;
A pulley around which the belt is wound;
and an AC servo motor for rotating the pulley.
a cover is provided to cover a contact portion between the pulley and the belt;
The transport method according to claim 4, further comprising the step of evacuating the space inside the cover.
The transport method according to claim 4 or 5, wherein the second transport unit transports the substrate in a direction perpendicular to the transport direction or in a direction opposite to the transport direction.
(s1) forming an amorphous film on a substrate;
(s2) irradiating the substrate with a line-shaped laser beam to anneal the amorphous film so as to crystallize the amorphous film to form a crystallized film,
The annealing step (s2) includes:
(sa) a levitation unit levitating the substrate on its upper surface;
(sb) a step in which a first transport unit moves the substrate in a transport direction in a top view to change an irradiation position of the laser light on the substrate;
(sc) a second transport unit moving the substrate outside the irradiation position in a top view,
The first conveying unit,
a first holding mechanism for holding the substrate;
a linear motor that moves the first holding mechanism linearly in a conveying direction,
The second transport unit,
a second holding mechanism for holding the substrate;
a belt to which the second retaining mechanism is connected;
A pulley around which the belt is wound;
and an AC servo motor that rotates the pulley.
a cover is provided to cover a contact portion between the pulley and the belt;
The method for manufacturing an organic electroluminescence display according to claim 7, further comprising the step of evacuating the space inside the cover.
The method for manufacturing an organic EL display according to claim 7 or 8, wherein the second transport unit transports the substrate in a direction perpendicular to the transport direction or in a direction opposite to the transport direction.
a levitation unit that levitates the substrate on its upper surface;
a laser irradiation unit that irradiates the substrate with a line-shaped laser beam;
a first transport unit that moves the substrate in a transport direction so as to change an irradiation position of the laser light on the substrate;
a second transport unit configured to move the substrate outside the irradiation position when viewed from above,
The first conveying unit,
a first holding mechanism for holding the substrate;
a linear motor that moves the first holding mechanism linearly in a conveying direction,
The second transport unit,
a second holding mechanism for holding the substrate;
a belt to which the second retaining mechanism is connected;
A pulley around which the belt is wound;
and an AC servo motor that rotates the pulley.