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WO2024126973A1 - Semiconductor pods and carriers - Google Patents

Semiconductor pods and carriers Download PDF

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Publication number
WO2024126973A1
WO2024126973A1 PCT/GB2023/053085 GB2023053085W WO2024126973A1 WO 2024126973 A1 WO2024126973 A1 WO 2024126973A1 GB 2023053085 W GB2023053085 W GB 2023053085W WO 2024126973 A1 WO2024126973 A1 WO 2024126973A1
Authority
WO
WIPO (PCT)
Prior art keywords
pod
carrier
polymer composition
polyaryletherketone
polymer
Prior art date
Application number
PCT/GB2023/053085
Other languages
French (fr)
Inventor
Minol INOUE
Masakazu Tanaka
Naoharu YOSHIDA
Original Assignee
Victrex Manufacturing Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victrex Manufacturing Limited filed Critical Victrex Manufacturing Limited
Publication of WO2024126973A1 publication Critical patent/WO2024126973A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

Definitions

  • AMC Airborne Molecular Contamination
  • PPT parts-per-trillion
  • PPB moisture of the order of parts-per-billion
  • Substrates such as semiconductor wafers or reticles, are vulnerable to AMC and moisture in the environment, which may produce contaminants on the surface of a substrate or lead to corrosion/oxidation.
  • substrates can be stored and transported in sealable containers referred to as pods.
  • an inert purge gas e.g. nitrogen can sometimes be injected into the pod to maintain a desirable conditions for substrate handling and storage.
  • Pods can protect the substrates from contaminants, moisture and other damage, both during transport between semiconductor processing equipment within a fabrication plant or from container to container e.g. for transportation to other sites.
  • Pods typically for 300 mm semiconductor wafers, are known as FOUPs, "front opening unified pods", and FOSBs, "front opening shipping boxes”.
  • Pods that are typically used for 200 mm semiconductor wafers are known as SMIFs or “standard mechanical interface” pods.
  • Pods that are suitable for semiconductor reticles are referred to as RSPs or “reticle DMIF pods”.
  • Substrates may need to be loaded into and removed from pods, e.g., during transfer of substrates from a pod to a semiconductor processing equipment or to another transport container, such as another pod, a cassette or shipping box, etc.
  • the transfer process typically occurs at a load port, which may be part of, e.g., an equipment front end module (EFEM) in semiconductor processing equipment.
  • EFEM equipment front end module
  • the door of the pod may be opened allowing a substrate-handling robot to access the interior of the pod to load or unload the substrates.
  • gas contained within the pod can be diluted by surrounding air. This can alter the atmosphere within the pod. Purge gas may be injected into the pod to reduce the effects of contamination. However, excessive use of purge gas can be expensive and may have a detrimental effect on the environment. DESCRIPTION
  • the present disclosure relates to a semiconductor pod or carrier, wherein at least part of said pod or carrier is formed from a polymer composition comprising particles of molecular sieve dispersed in a thermoplastic polymer matrix.
  • the present disclosure also relates to a polymer composition that can be used to form at least part of the pod or carrier.
  • the polymer composition comprises particles of molecular sieve dispersed in a thermoplastic polymer matrix.
  • the amount of molecular sieve in the polymer composition may be 5 to 70 weight %, preferably 10 to 40 weight % of the total weight of the polymer composition.
  • the polymer composition may also include a conductive agent, for example, carbon black.
  • the pod or carrier may be suitable for housing semiconductor substrates, for example, wafers and/or reticles.
  • the pod or carriers may be used to transfer the substrates between semiconductor processing equipment during the semiconductor fabrication process. Alternatively, the pods or carriers may be used to transport the substrates to offsite locations.
  • the pod or carrier can provide a secure and clean environment for housing, storing and/or transporting (e.g. shipping) the substrate.
  • the pod or carrier may be used to provide a clean environment to reduce the risk of airborne molecular contamination (AMC) of substrates housed within the pod or carrier.
  • AMC airborne molecular contamination
  • the pod or carrier may also reduce the risk of moisture contamination of the housed substrates.
  • the pod or carrier is formed from a polymer composition comprising molecular sieve.
  • the molecular sieve can absorb ambient moisture. This may be useful, for example, if moisture is introduced into the pod or carrier when substrates are introduced or removed from the pod or carrier.
  • absorbent materials may absorb ambient moisture effectively, it has been found that moisture may also be desorbed from many absorbent material, particularly at elevated temperatures. It has been recognised that, during the course of use, semiconductor pods and carriers can be exposed to temperatures ranging from room temperature to at least 80 degrees C (e.g. 100 degrees C or 120 degrees C), for example, as the pods are coupled to e.g. load ports and moved between semiconductor processing equipment during the semiconductor manufacturing process. It has been found that molecular sieves (e.g. zeolites) have a reduced tendency to desorb moisture even at elevated temperatures of 120 degrees C or more, for example, 150 degrees C or more. Accordingly, any moisture absorbed by the molecular sieves (e.g. zeolites) may have a higher tendency to be retained within the molecular sieve structure during the course of use of the pod or carrier.
  • temperatures ranging from room temperature to at least 80 degrees C (e.g. 100 degrees C or 120 degrees C), for example, as the pods are coupled to e.g. load ports
  • the molecular sieve is zeolite. Any suitable zeolite may be used.
  • the zeolite may be a synthetic zeolite. In some examples, an A-type zeolite may be used.
  • the zeolite may comprise any suitable cation. Examples include sodium, potassium, calcium and lithium. Preferably, the cation is potassium.
  • the zeolite may have an average pore size of 2 to 10 Angstroms, for example, 3 to 5 Angstroms. The particle size of the zeolite may be less than 0.2 mm, for example, less than 0.15 mm.
  • An example of a suitable zeolite may be zeolite available under the trademark Zeolum®, for example, Zeolum® A-3.
  • the molecular sieve may be present in the polymer composition in any suitable amount. Suitable amounts range from 5 to 70 weight %. Preferably, the molecular sieve may be present in an amount of 10 to 65 weight %. In some examples, the molecular sieve may be present in an amount of 12 to 60 weight %, preferably 15 to 40 weight % or 20 to 30 weight % of the polymer composition. The amount of molecular sieve may be selected to provide the polymer composition with adequate moisture absorbent properties. At the same time, the amount of molecular sieve may be maintained below certain thresholds to reduce the risk of particle generation and cross-contamination into the interior of the pod or carrier.
  • the weight ratio of molecular sieve to thermoplastic polymer in the polymer composition may be 5:95 to 70:30, for example, 10:90 to 65:35 or 20:80 to 30:70.
  • the zeolite may be present in the polymer composition in any suitable amount. Suitable amounts range from 5 to 70 weight %. Preferably, the zeolite may be present in an amount of 10 to 65 weight %. In some examples, the zeolite may be present in an amount of 12 to 60 weight %, preferably 15 to 40 weight % or 20 to 30 weight % of the polymer composition.
  • the weight ratio of zeolite to thermoplastic polymer in the polymer composition may be 5:95 to 70:30, for example, 10:90 to 65:35 or 20:80 to 30:70.
  • the polymer composition comprises molecular sieve dispersed in a thermoplastic polymer matrix.
  • the thermoplastic polymer may be polyaryletherketone, polyalkyleneimine (e.g. polyethyleneimine), polyimide, polyalkylene terephthalate (e.g. polyethylene terephthalate), liquid crystal polymer, polyphenylene sulphide, polyether sulphone (PES) and cycloolefin (co-)polymer.
  • the thermoplastic polymer may be a polyaryletherketone (PAEK). More preferably the polyaryletherketone (PAEK) is polyetheretherketone (PEEK).
  • the polymer composition comprises zeolite particles dispersed in a PEEK matrix.
  • Suitable polyaryl ether ketones may have repeating units of formula (I) below: where t1 and w1 are independently represent 0 or 1 and v1 represents 0, 1 or 2.
  • the polyaryletherketone suitably includes at least 90, 95 or 99 mol % of repeat unit of formula I.
  • the polyaryletherketone suitably includes at least 90, 95 or 99 weight % of repeat unit of formula I.
  • the polyaryletherketone may comprise or consist essentially of a repeat unit of formula I.
  • the polyaryletherketone may be selected from polyetheretherketone, polyetherketone, polyetherketoneetherketoneketone and polyetherketoneketone.
  • the polymer is selected from polyetherketone and polyetheretherketone.
  • the polymer is preferably polyetheretherketone (PEEK).
  • the polyaryletherketone may have a Notched Izod Impact Strength (specimen 80mm x 10mm x 4mm with a cut 0.25mm notch (Type A), tested at 23°C, in accordance with ISO180) of at least 2 kJm -2 , preferably at least 3 kJm -2 , more preferably at least 4 kJrrr 2 .
  • the Notched Izod Impact Strength measured as mentioned above, may be less than 20 kJnr 2 , suitably less than 15 KJm -2 .
  • the Notched Izod Impact Strength measured as mentioned above, may be 2 to 20 kJnr 2 , for example, 4 to 15 KJnr 2 .
  • the polyaryletherketone e.g. PEEK
  • PEEK may have a melt viscosity (MV) of 60 to 600 Pa.s (ISO 11443, 400°C), preferably 100 to 500 Pa.s.
  • the polyaryletherketone may have a tensile strength, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C at a rate of 50mm/minute of at least 20 MPa, preferably at least 60 MPa, more preferably at least 80 MPa.
  • the tensile strength is preferably in the range 80-200 MPa, more preferably in the range 80-150 MPa or 90 to 110 MPa.
  • the polyaryletherketone (e.g. PEEK) may have a tensile modulus, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C of in the range of 3 to 5 GPa, more preferably in the range 3.5 to 4.5 GPa.
  • the polyaryletherketone (e.g. PEEK) may have a tensile elongation, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C of in the range of 5 to 60%, for example 10 to 50% or 15 to 45%.
  • the polyaryletherketone may have a flexural strength, measured in accordance with IS0178 (80mm x 10mm x 4mm specimen, tested in three-point-bend at 23°C at a rate of 2mm/minute) of at least 50 MPa, preferably at least 100 MPa, more preferably at least 145 MPa.
  • the flexural strength is preferably in the range 145-200 MPa, more preferably in the range 145-190 MPa.
  • the polyaryletherketone may have a flexural modulus, measured in accordance with IS0178 (80mm x 10mm x 4mm specimen, tested in three-point-bend at 23°C at a rate of 2mm/minute) of at least 1 GPa, suitably at least 2 GPa, preferably at least 3 GPa, more preferably at least 3.5 GPa.
  • the flexural modulus is preferably in the range 3.5-4.5 GPa, more preferably in the range 4.0 to 4.5 GPa.
  • the polyaryletherketone e.g. PEEK
  • the polyaryletherketone may have a density (ISO 1183) of 1.1 to 1.5 gem -3 , for example, 1 .2 to 1 .4 gem -3 , of 1 .25 to 1.35 gem -3 .
  • the polyaryletherketone (e.g. PEEK) may have a melting point (ISO 11357) of 280 to 400 degrees C, preferably, 300 to 380 degrees C, more preferably 330 to 360 degrees C, for example, 335 to 345 degrees C.
  • ISO 11357 a melting point of 280 to 400 degrees C, preferably, 300 to 380 degrees C, more preferably 330 to 360 degrees C, for example, 335 to 345 degrees C.
  • the polyaryletherketone e.g. PEEK
  • PEEK may have a glass transition temperature (ISO 11357, onset) of 130 to 160 degrees C, preferably, 135 to 150 degrees C, more preferably 140 to 145 degrees C.
  • the polyaryletherketone may have a surface hardness of greater than 70 on the M scale, for example, greater than 80 or greater than 90.
  • the polyaryletherketone e.g. PEEK
  • a relatively high surface hardness may be desirable to reduce the risk of particle generation, for example, as a result of wear that can occur during use of the pod or carrier, e.g. as substrates are loaded and unloaded from the pod and/or carrier.
  • PEEK polymer is commercially available from Victrex Manufacturing Limited e.g. VICTREXTM PEEK 90P, 150P, 380P, 450P or 650P.
  • the polymer composition may have a tensile modulus measured in accordance with IS0527 (specimen type 1 b) tested at 23°C of in the range of 4 to 30 GPa, more preferably in the range 5 to 15 GPa.
  • the polymer composition may have a tensile elongation, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C of in the range of 0.5 to 50%, for example 0.8 to 5%.
  • the polymer composition may have a tensile strength, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C at a rate of 50mm/minute of at least 20 MPa, preferably at least 60 MPa, more preferably at least 80 MPa.
  • the tensile strength is preferably in the range 80-140 MPa, more preferably in the range 90-130 MPa.
  • the present disclosure may provide a polymer composition comprising polyetheretherketone (PEEK), and zeolite, wherein the polymer composition has a tensile modulus (ISO527) of 4 to 30 GPa and a tensile strength (ISO527) of 80 to 140 MPa.
  • the polymer composition may further include a conductive agent.
  • the conductive agent may act as an electrostatically dissipative material.
  • An example of a suitable conductive agent is carbon black. Other examples include carbon nanotubes and carbon fibre.
  • the conductive agent may be present in an amount of 0 to 40 weight % of the polymer composition.
  • the conductive agent may be present in an amount of 2 to 35 weight %, more preferably 3 to 25 weight % of the polymer composition.
  • the conductive agent is carbon black.
  • Carbon black may be present in an amount of 0 to 40 weight % of the polymer composition.
  • the carbon black may be present in an amount of 3 to 30 weight %, more preferably 5 to 20 weight % of the polymer composition.
  • the weight ratio of conductive agent to thermoplastic polymer in the polymer composition may be 0.5:95.5 to 30:70
  • the weight ratio of carbon black to thermoplastic polymer in the polymer composition may be 5:95 to 20:80.
  • a polymer composition comprising polyaryletherketone and zeolite, wherein the polymer composition has a tensile modulus (ISO527) of 4 to 30 GPa and a tensile strength (ISO527) of 80 to 140 MPa.
  • the polyaryletherketone is PEEK.
  • the polymer composition further comprises carbon black.
  • the polyaryletherketone may be present in an amount of 50 to 95 weight %.
  • Zeolite my be present in an amount of 5 to 50 weight %.
  • Carbon black may be present in an amount of 0 to 45 weight %.
  • the polymer composition may comprise polyaryletherketone in an amount of 50 to 70 weight%, zeolite in an amount of 10 to 30 weight % and carbon black in an amount of 0 to 40 weight %.
  • the polymer composition comprises polyaryletherketone (e.g. PEEK) in an amount of 50 to 60 weight %, zeolite in an amount of 20 to 30 weight % and carbon black in an amount of 10 to 30 weight %.
  • PEEK polyaryletherketone
  • zeolite in an amount of 20 to 30 weight %
  • carbon black in an amount of 10 to 30 weight %.
  • a polymer composition comprising polyetheretherketone (PEEK), zeolite and carbon black.
  • the PEEK may be present in an amount of 50 to 95 weight %.
  • Zeolite may be present in an amount of 5 to 50 weight %.
  • Carbon black may be present in an amount of 0 to 45 weight %.
  • the polymer composition may comprise PEEK in an amount of 50 to 70 weight%, zeolite in an amount of 10 to 30 weight % and carbon black in an amount of 0 to 40 weight %.
  • the polymer composition comprises PEEK in an amount of 50 to 60 weight %, zeolite in an amount of 20 to 30 weight % and carbon black in an amount of 10 to 30 weight %.
  • the polymer composition may be manufactured by known methods, for example, by melt-extrusion. Single screw and twin screw extruders may be used. The molecular sieve filler may be added from side feeders. Any suitable processing temperature may be employed. For example, processing temperatures of 350 to 425 degrees C may be used.
  • the polymer composition may be a mouldable e.g. injection mouldable composition.
  • the polymer composition may be formed into a part(s) of the pod or carrier by moulding, for example, injection moulding.
  • the polymer composition may be formed into a part of the pod or carrier by compression moulding.
  • the polymer composition may be formed into a near-net shape via extrusion or moulding first, followed by machining into a part of the pod or carrier.
  • the polymer composition may be used to form at least part of a pod or carrier suitable for semiconductor substrates, such as wafers and/or reticles.
  • the pod or carrier may be used to protect the substrates from contaminants, moisture and other damage, e.g. during substrate transportation and storage.
  • Pods typically for 300 mm semiconductor wafers, are known as FOUPs, "front opening unified pods", and FOSBs, "front opening shipping boxes”.
  • Pods that are typically used for 200 mm semiconductor wafers are known as SMIFs or “standard mechanical interface” pods.
  • Pods that are suitable for semiconductor reticles are referred to as RSPs or “reticle SMIF pods”.
  • the carrier may also be a wafer cassette, for example, those typically used for handling 200 mm semiconductor wafers.
  • the polymer composition may provide a desirable combination of properties for the manufacture of at least part of the pod or carrier.
  • the polymer composition may be used to provide the relevant part of the pod or carrier with a desirable combination of mechanical properties, chemical resistance, thermal properties and/or moisture properties.
  • the polymer composition may also be used to provide the relevant part of the pod or carrier with desirable electrical properties.
  • the polymer composition is used to form at least part of a pod, for example, a FOIIP, SMIF or wafer cassette.
  • the polymer composition may be used to form any suitable part of the pod or carrier.
  • the polymer composition contains the molecular sieve that can absorb moisture from the surroundings. This moisture may be retained up to temperatures in 120 degrees C or more, for example from 120 to 150 degrees C or more. Accordingly, the risk of moisture being released into the environment where substrates are housed within the pod or carrier may be reduced.
  • the polymer composition may be used to form an internal portion (e.g. part of the internal chamber) of the pod.
  • the pod may include wafer supports, for example, to support substrates housed within the pod.
  • the polymer composition may be used to form at least part of the wafer support(s).
  • the pod may also include retainers for retaining the wafers in position within the housing. While wafer supports may be located on sidewalls within the pod, wafer retainer(s) may be located on the inside face of the pod door.
  • the retainer(s) may include a plurality of bridge like structures that flex against the edges of substrates within the pod to provide a retention force and cushioning function.
  • the polymer composition may be used to form at least part of the wafer retainer(s) of the pod.
  • the pod may be provided with an insert that is formed of the polymer composition.
  • the insert may be housed within the pod.
  • the insert may take the form of a dummy substrate that is supported and retained by wafer support(s) and wafer retainer(s) of the pod.
  • the pod includes a sub-housing for retaining the substrates. At least part of the sub-housing may be formed of the polymer composition of the present disclosure.
  • the pod may include an inlet for introducing purge gas (e.g. nitrogen) into the pod.
  • the inlet may be formed of the polymer composition of the present disclosure.
  • Figure 1 is a schematic drawing of the apparatus used to test the samples.
  • a polypropylene bottle 10 was coupled to a source 12 of nitrogen purge gas. The flow of nitrogen through the bottle was controlled via valves 14.
  • Nitrogen purge gas was passed through the bottle 10 by opening valves 14 for 3 minutes. The valves 14 were then closed and the relative humidity within the bottle 10 measured over 24 hours.
  • Figure 2 shows how the relative humidity within the bottle 10 changes over the 24 hour period. It can be seen that the sample formed using the polymer composition of Example 1 continues to absorb moisture over the 24 hour period. In contrast, the samples formed using the polymer compositions of Comparative Examples A and B desorb moisture with time.
  • Example 2 further test samples were made using the composition of Example 1 above. However, in Example 4, the test sample was simply dried. In Example 2, the test sample was conditioned at 23 degrees C and 55-60% relative humidity (RH) for 19 hours using MgN2Oe.6H2O as a humidifying agent. In Example 3, the test sample was conditioned at 23 degrees C and 55-60% relative humidity (RH) for 4 hours using MgN2Oe.6H2O as a humidifying agent. [0061] The test samples of Examples 2, 3 and 4 were tested using the apparatus of Figure 1. The test samples were placed in the polypropylene bottle 10, together with a hygrometer 16 to measure the relative humidity within the bottle 10.
  • Nitrogen purge gas was passed through the bottle 10 by opening valves 14 for 3 minutes. The valves 14 were then closed and the relative humidity within the bottle 10 measured over 24 hours.
  • Figure 3 shows how the relative humidity within the bottle 10 changes over the 24 hour period. It can be seen that Examples 2, 3 and 4 continued to absorb moisture over the 24 hour period.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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Abstract

The invention relates to a semiconductor pod or a semiconductor carrier. At least part of said pod or carrier is formed from a polymer composition. The polymer composition comprises particles of molecular sieve dispersed in a thermoplastic polymer matrix.

Description

SEMICONDUCTOR PODS AND CARRIERS
BACKGROUND
[0001] In semiconductor manufacture, it is important to maintain substrates with a high level of cleanliness. For example, materials and processes in semiconductor manufacturing are vulnerable to Airborne Molecular Contamination (AMC) of the order of parts-per-trillion (PPT), and moisture of the order of parts-per-billion (PPB).
[0002] Substrates, such as semiconductor wafers or reticles, are vulnerable to AMC and moisture in the environment, which may produce contaminants on the surface of a substrate or lead to corrosion/oxidation. In order to maintain the particle control, chemical cleanliness and humidity control, substrates can be stored and transported in sealable containers referred to as pods. To achieve the desired levels of cleanliness and humidity within a pod, an inert purge gas e.g. nitrogen can sometimes be injected into the pod to maintain a desirable conditions for substrate handling and storage.
[0003] Pods can protect the substrates from contaminants, moisture and other damage, both during transport between semiconductor processing equipment within a fabrication plant or from container to container e.g. for transportation to other sites. Pods, typically for 300 mm semiconductor wafers, are known as FOUPs, "front opening unified pods", and FOSBs, "front opening shipping boxes". Pods that are typically used for 200 mm semiconductor wafers are known as SMIFs or “standard mechanical interface” pods. Pods that are suitable for semiconductor reticles are referred to as RSPs or “reticle DMIF pods”.
[0004] Substrates may need to be loaded into and removed from pods, e.g., during transfer of substrates from a pod to a semiconductor processing equipment or to another transport container, such as another pod, a cassette or shipping box, etc. The transfer process typically occurs at a load port, which may be part of, e.g., an equipment front end module (EFEM) in semiconductor processing equipment. Once a pod is installed in a load port, the door of the pod may be opened allowing a substrate-handling robot to access the interior of the pod to load or unload the substrates. Once the pod door is opened, however, gas contained within the pod can be diluted by surrounding air. This can alter the atmosphere within the pod. Purge gas may be injected into the pod to reduce the effects of contamination. However, excessive use of purge gas can be expensive and may have a detrimental effect on the environment. DESCRIPTION
[0005] The present disclosure relates to a semiconductor pod or carrier, wherein at least part of said pod or carrier is formed from a polymer composition comprising particles of molecular sieve dispersed in a thermoplastic polymer matrix.
[0006] The present disclosure also relates to a polymer composition that can be used to form at least part of the pod or carrier. The polymer composition comprises particles of molecular sieve dispersed in a thermoplastic polymer matrix. The amount of molecular sieve in the polymer composition may be 5 to 70 weight %, preferably 10 to 40 weight % of the total weight of the polymer composition. The polymer composition may also include a conductive agent, for example, carbon black.
[0007] The pod or carrier may be suitable for housing semiconductor substrates, for example, wafers and/or reticles. The pod or carriers may be used to transfer the substrates between semiconductor processing equipment during the semiconductor fabrication process. Alternatively, the pods or carriers may be used to transport the substrates to offsite locations.
[0008] The pod or carrier can provide a secure and clean environment for housing, storing and/or transporting (e.g. shipping) the substrate. For example, the pod or carrier may be used to provide a clean environment to reduce the risk of airborne molecular contamination (AMC) of substrates housed within the pod or carrier. The pod or carrier may also reduce the risk of moisture contamination of the housed substrates.
[0009] In the present disclosure, at least part of the pod or carrier is formed from a polymer composition comprising molecular sieve. The molecular sieve can absorb ambient moisture. This may be useful, for example, if moisture is introduced into the pod or carrier when substrates are introduced or removed from the pod or carrier.
[0010] While absorbent materials may absorb ambient moisture effectively, it has been found that moisture may also be desorbed from many absorbent material, particularly at elevated temperatures. It has been recognised that, during the course of use, semiconductor pods and carriers can be exposed to temperatures ranging from room temperature to at least 80 degrees C (e.g. 100 degrees C or 120 degrees C), for example, as the pods are coupled to e.g. load ports and moved between semiconductor processing equipment during the semiconductor manufacturing process. It has been found that molecular sieves (e.g. zeolites) have a reduced tendency to desorb moisture even at elevated temperatures of 120 degrees C or more, for example, 150 degrees C or more. Accordingly, any moisture absorbed by the molecular sieves (e.g. zeolites) may have a higher tendency to be retained within the molecular sieve structure during the course of use of the pod or carrier.
[0011] Preferably, the molecular sieve is zeolite. Any suitable zeolite may be used. The zeolite may be a synthetic zeolite. In some examples, an A-type zeolite may be used. The zeolite may comprise any suitable cation. Examples include sodium, potassium, calcium and lithium. Preferably, the cation is potassium. The zeolite may have an average pore size of 2 to 10 Angstroms, for example, 3 to 5 Angstroms. The particle size of the zeolite may be less than 0.2 mm, for example, less than 0.15 mm. An example of a suitable zeolite may be zeolite available under the trademark Zeolum®, for example, Zeolum® A-3.
[0012] The molecular sieve may be present in the polymer composition in any suitable amount. Suitable amounts range from 5 to 70 weight %. Preferably, the molecular sieve may be present in an amount of 10 to 65 weight %. In some examples, the molecular sieve may be present in an amount of 12 to 60 weight %, preferably 15 to 40 weight % or 20 to 30 weight % of the polymer composition. The amount of molecular sieve may be selected to provide the polymer composition with adequate moisture absorbent properties. At the same time, the amount of molecular sieve may be maintained below certain thresholds to reduce the risk of particle generation and cross-contamination into the interior of the pod or carrier.
[0013] The weight ratio of molecular sieve to thermoplastic polymer in the polymer composition may be 5:95 to 70:30, for example, 10:90 to 65:35 or 20:80 to 30:70.
[0014] Where the molecular sieve is a zeolite, the zeolite may be present in the polymer composition in any suitable amount. Suitable amounts range from 5 to 70 weight %. Preferably, the zeolite may be present in an amount of 10 to 65 weight %. In some examples, the zeolite may be present in an amount of 12 to 60 weight %, preferably 15 to 40 weight % or 20 to 30 weight % of the polymer composition.
[0015] Where the molecular sieve is a zeolite, the weight ratio of zeolite to thermoplastic polymer in the polymer composition may be 5:95 to 70:30, for example, 10:90 to 65:35 or 20:80 to 30:70. [0016] As noted above, the polymer composition comprises molecular sieve dispersed in a thermoplastic polymer matrix. The thermoplastic polymer may be polyaryletherketone, polyalkyleneimine (e.g. polyethyleneimine), polyimide, polyalkylene terephthalate (e.g. polyethylene terephthalate), liquid crystal polymer, polyphenylene sulphide, polyether sulphone (PES) and cycloolefin (co-)polymer. Preferably, the thermoplastic polymer may be a polyaryletherketone (PAEK). More preferably the polyaryletherketone (PAEK) is polyetheretherketone (PEEK). In a preferred embodiment, the polymer composition comprises zeolite particles dispersed in a PEEK matrix.
[0017] Suitable polyaryl ether ketones may have repeating units of formula (I) below:
Figure imgf000005_0001
where t1 and w1 are independently represent 0 or 1 and v1 represents 0, 1 or 2.
[0018] The polyaryletherketone suitably includes at least 90, 95 or 99 mol % of repeat unit of formula I. The polyaryletherketone suitably includes at least 90, 95 or 99 weight % of repeat unit of formula I.
[0019] The polyaryletherketone may comprise or consist essentially of a repeat unit of formula I. Preferred polymeric materials comprise (or consist essentially of) a said repeat unit wherein t1 =1 , v1=0 and w1=0; t1 =0, v1=0 and w1=0; t1 =0, w1 =1 , v1=2; or t1 =0, v1=1 and w1=0. More preferably, the polyaryletherketone comprises (e.g. consists essentially of) the repeat unit I, wherein t1 =1 , v1 =0 and w1 =0; or t1 =0, v1=0 and w1 =0. The most preferred polyaryletherketone comprises (especially consists essentially of) a said repeat unit wherein t1 =1 , v1=0 and w1=0.
[0020] The polyaryletherketone may be selected from polyetheretherketone, polyetherketone, polyetherketoneetherketoneketone and polyetherketoneketone. In some examples, the polymer is selected from polyetherketone and polyetheretherketone. The polymer is preferably polyetheretherketone (PEEK).
[0021] The polyaryletherketone (e.g. PEEK) may have a Notched Izod Impact Strength (specimen 80mm x 10mm x 4mm with a cut 0.25mm notch (Type A), tested at 23°C, in accordance with ISO180) of at least 2 kJm-2, preferably at least 3 kJm-2, more preferably at least 4 kJrrr2. The Notched Izod Impact Strength, measured as mentioned above, may be less than 20 kJnr2, suitably less than 15 KJm-2. The Notched Izod Impact Strength, measured as mentioned above, may be 2 to 20 kJnr2, for example, 4 to 15 KJnr2.
[0022] The polyaryletherketone (e.g. PEEK) may have a melt viscosity (MV) of 60 to 600 Pa.s (ISO 11443, 400°C), preferably 100 to 500 Pa.s.
[0023] The polyaryletherketone (e.g. PEEK) may have a tensile strength, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C at a rate of 50mm/minute of at least 20 MPa, preferably at least 60 MPa, more preferably at least 80 MPa. The tensile strength is preferably in the range 80-200 MPa, more preferably in the range 80-150 MPa or 90 to 110 MPa.
[0024] The polyaryletherketone (e.g. PEEK) may have a tensile modulus, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C of in the range of 3 to 5 GPa, more preferably in the range 3.5 to 4.5 GPa.
[0025] The polyaryletherketone (e.g. PEEK) may have a tensile elongation, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C of in the range of 5 to 60%, for example 10 to 50% or 15 to 45%.
[0026] The polyaryletherketone (e.g. PEEK) may have a flexural strength, measured in accordance with IS0178 (80mm x 10mm x 4mm specimen, tested in three-point-bend at 23°C at a rate of 2mm/minute) of at least 50 MPa, preferably at least 100 MPa, more preferably at least 145 MPa. The flexural strength is preferably in the range 145-200 MPa, more preferably in the range 145-190 MPa.
[0027] The polyaryletherketone (e.g. PEEK) may have a flexural modulus, measured in accordance with IS0178 (80mm x 10mm x 4mm specimen, tested in three-point-bend at 23°C at a rate of 2mm/minute) of at least 1 GPa, suitably at least 2 GPa, preferably at least 3 GPa, more preferably at least 3.5 GPa. The flexural modulus is preferably in the range 3.5-4.5 GPa, more preferably in the range 4.0 to 4.5 GPa. [0028] The polyaryletherketone (e.g. PEEK) may have a density (ISO 1183) of 1.1 to 1.5 gem-3, for example, 1 .2 to 1 .4 gem-3, of 1 .25 to 1.35 gem-3.
[0029] The polyaryletherketone (e.g. PEEK) may have a melting point (ISO 11357) of 280 to 400 degrees C, preferably, 300 to 380 degrees C, more preferably 330 to 360 degrees C, for example, 335 to 345 degrees C.
[0030] The polyaryletherketone (e.g. PEEK) may have a glass transition temperature (ISO 11357, onset) of 130 to 160 degrees C, preferably, 135 to 150 degrees C, more preferably 140 to 145 degrees C.
[0031] The polyaryletherketone (e.g. PEEK) may have a surface hardness of greater than 70 on the M scale, for example, greater than 80 or greater than 90. In some examples, the polyaryletherketone (e.g. PEEK) may have a surface hardness of 90 to 110 on the M scale. A relatively high surface hardness may be desirable to reduce the risk of particle generation, for example, as a result of wear that can occur during use of the pod or carrier, e.g. as substrates are loaded and unloaded from the pod and/or carrier.
[0032] An example of a suitable PEEK polymer is commercially available from Victrex Manufacturing Limited e.g. VICTREX™ PEEK 90P, 150P, 380P, 450P or 650P.
[0033] The polymer composition may have a tensile modulus measured in accordance with IS0527 (specimen type 1 b) tested at 23°C of in the range of 4 to 30 GPa, more preferably in the range 5 to 15 GPa.
[0034] The polymer composition may have a tensile elongation, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C of in the range of 0.5 to 50%, for example 0.8 to 5%.
[0035] The polymer composition may have a tensile strength, measured in accordance with IS0527 (specimen type 1 b) tested at 23°C at a rate of 50mm/minute of at least 20 MPa, preferably at least 60 MPa, more preferably at least 80 MPa. The tensile strength is preferably in the range 80-140 MPa, more preferably in the range 90-130 MPa. [0036] The present disclosure may provide a polymer composition comprising polyetheretherketone (PEEK), and zeolite, wherein the polymer composition has a tensile modulus (ISO527) of 4 to 30 GPa and a tensile strength (ISO527) of 80 to 140 MPa.
[0037] The polymer composition may further include a conductive agent. The conductive agent may act as an electrostatically dissipative material. An example of a suitable conductive agent is carbon black. Other examples include carbon nanotubes and carbon fibre.
[0038] Where present, the conductive agent may be present in an amount of 0 to 40 weight % of the polymer composition. Preferably, the conductive agent may be present in an amount of 2 to 35 weight %, more preferably 3 to 25 weight % of the polymer composition.
[0039] In some embodiments, the conductive agent is carbon black. Carbon black may be present in an amount of 0 to 40 weight % of the polymer composition. Preferably, the carbon black may be present in an amount of 3 to 30 weight %, more preferably 5 to 20 weight % of the polymer composition.
[0040] If conductive agent is present, the weight ratio of conductive agent to thermoplastic polymer in the polymer composition may be 0.5:95.5 to 30:70
[0041] Where the conductive agent is carbon black, the weight ratio of carbon black to thermoplastic polymer in the polymer composition may be 5:95 to 20:80.
[0042] In one embodiment, there is provided a polymer composition comprising polyaryletherketone and zeolite, wherein the polymer composition has a tensile modulus (ISO527) of 4 to 30 GPa and a tensile strength (ISO527) of 80 to 140 MPa. Preferably, the polyaryletherketone is PEEK. Preferably, the polymer composition further comprises carbon black. The polyaryletherketone may be present in an amount of 50 to 95 weight %. Zeolite my be present in an amount of 5 to 50 weight %. Carbon black may be present in an amount of 0 to 45 weight %. In an embodiment, the polymer composition may comprise polyaryletherketone in an amount of 50 to 70 weight%, zeolite in an amount of 10 to 30 weight % and carbon black in an amount of 0 to 40 weight %. In an embodiment, the polymer composition comprises polyaryletherketone (e.g. PEEK) in an amount of 50 to 60 weight %, zeolite in an amount of 20 to 30 weight % and carbon black in an amount of 10 to 30 weight %. [0043] In one embodiment, there is provided a polymer composition comprising polyetheretherketone (PEEK), zeolite and carbon black. The PEEK may be present in an amount of 50 to 95 weight %. Zeolite may be present in an amount of 5 to 50 weight %. Carbon black may be present in an amount of 0 to 45 weight %. In an embodiment, the polymer composition may comprise PEEK in an amount of 50 to 70 weight%, zeolite in an amount of 10 to 30 weight % and carbon black in an amount of 0 to 40 weight %. In an embodiment, the polymer composition comprises PEEK in an amount of 50 to 60 weight %, zeolite in an amount of 20 to 30 weight % and carbon black in an amount of 10 to 30 weight %.
[0044] The polymer composition may be manufactured by known methods, for example, by melt-extrusion. Single screw and twin screw extruders may be used. The molecular sieve filler may be added from side feeders. Any suitable processing temperature may be employed. For example, processing temperatures of 350 to 425 degrees C may be used.
[0045] The polymer composition may be a mouldable e.g. injection mouldable composition. The polymer composition may be formed into a part(s) of the pod or carrier by moulding, for example, injection moulding. The polymer composition may be formed into a part of the pod or carrier by compression moulding. The polymer composition may be formed into a near-net shape via extrusion or moulding first, followed by machining into a part of the pod or carrier.
[0046] The polymer composition may be used to form at least part of a pod or carrier suitable for semiconductor substrates, such as wafers and/or reticles. The pod or carrier may be used to protect the substrates from contaminants, moisture and other damage, e.g. during substrate transportation and storage. Pods, typically for 300 mm semiconductor wafers, are known as FOUPs, "front opening unified pods", and FOSBs, "front opening shipping boxes". Pods that are typically used for 200 mm semiconductor wafers are known as SMIFs or “standard mechanical interface” pods. Pods that are suitable for semiconductor reticles are referred to as RSPs or “reticle SMIF pods”. The carrier may also be a wafer cassette, for example, those typically used for handling 200 mm semiconductor wafers.
[0047] The polymer composition may provide a desirable combination of properties for the manufacture of at least part of the pod or carrier. For example, the polymer composition may be used to provide the relevant part of the pod or carrier with a desirable combination of mechanical properties, chemical resistance, thermal properties and/or moisture properties. The polymer composition may also be used to provide the relevant part of the pod or carrier with desirable electrical properties. [0048] In one example, the polymer composition is used to form at least part of a pod, for example, a FOIIP, SMIF or wafer cassette. The polymer composition may be used to form any suitable part of the pod or carrier. As mentioned above, the polymer composition contains the molecular sieve that can absorb moisture from the surroundings. This moisture may be retained up to temperatures in 120 degrees C or more, for example from 120 to 150 degrees C or more. Accordingly, the risk of moisture being released into the environment where substrates are housed within the pod or carrier may be reduced.
[0049] In one example, the polymer composition may be used to form an internal portion (e.g. part of the internal chamber) of the pod.
[0050] The pod may include wafer supports, for example, to support substrates housed within the pod. In one example, the polymer composition may be used to form at least part of the wafer support(s). The pod may also include retainers for retaining the wafers in position within the housing. While wafer supports may be located on sidewalls within the pod, wafer retainer(s) may be located on the inside face of the pod door. The retainer(s) may include a plurality of bridge like structures that flex against the edges of substrates within the pod to provide a retention force and cushioning function. The polymer composition may be used to form at least part of the wafer retainer(s) of the pod.
[0051] In some instances, the pod may be provided with an insert that is formed of the polymer composition. The insert may be housed within the pod. In one example, the insert may take the form of a dummy substrate that is supported and retained by wafer support(s) and wafer retainer(s) of the pod.
[0052] In one example, the pod includes a sub-housing for retaining the substrates. At least part of the sub-housing may be formed of the polymer composition of the present disclosure.
[0053] In some examples, the pod may include an inlet for introducing purge gas (e.g. nitrogen) into the pod. The inlet may be formed of the polymer composition of the present disclosure.
Examples
[0054] Extruded test samples were made from the following polymer compositions:
Figure imgf000011_0001
[0055] The samples were conditioned at 23 degrees C and 55-60% relative humidity (RH) for two weeks. MglXhOe.GFW was used as a humidifying agent.
[0056] Figure 1 is a schematic drawing of the apparatus used to test the samples. A polypropylene bottle 10 was coupled to a source 12 of nitrogen purge gas. The flow of nitrogen through the bottle was controlled via valves 14.
[0057] Once conditioned, the samples were placed in the polypropylene bottle 10, together with a hygrometer 16 to measure the relative humidity within the bottle 10.
[0058] Nitrogen purge gas was passed through the bottle 10 by opening valves 14 for 3 minutes. The valves 14 were then closed and the relative humidity within the bottle 10 measured over 24 hours.
[0059] Figure 2 shows how the relative humidity within the bottle 10 changes over the 24 hour period. It can be seen that the sample formed using the polymer composition of Example 1 continues to absorb moisture over the 24 hour period. In contrast, the samples formed using the polymer compositions of Comparative Examples A and B desorb moisture with time.
[0060] In these Examples, further test samples were made using the composition of Example 1 above. However, in Example 4, the test sample was simply dried. In Example 2, the test sample was conditioned at 23 degrees C and 55-60% relative humidity (RH) for 19 hours using MgN2Oe.6H2O as a humidifying agent. In Example 3, the test sample was conditioned at 23 degrees C and 55-60% relative humidity (RH) for 4 hours using MgN2Oe.6H2O as a humidifying agent. [0061] The test samples of Examples 2, 3 and 4 were tested using the apparatus of Figure 1. The test samples were placed in the polypropylene bottle 10, together with a hygrometer 16 to measure the relative humidity within the bottle 10.
[0062] Nitrogen purge gas was passed through the bottle 10 by opening valves 14 for 3 minutes. The valves 14 were then closed and the relative humidity within the bottle 10 measured over 24 hours.
[0063] Figure 3 shows how the relative humidity within the bottle 10 changes over the 24 hour period. It can be seen that Examples 2, 3 and 4 continued to absorb moisture over the 24 hour period.

Claims

Claims
1. A semiconductor pod or a semiconductor carrier, wherein at least part of said pod or carrier is formed from a polymer composition comprising particles of molecular sieve dispersed in a thermoplastic polymer matrix.
2. A pod or carrier as claimed in claim 1 , wherein the molecular sieve is zeolite.
3. A pod or carrier as claimed in any one of the preceding claims, wherein the thermoplastic polymer is selected from polyaryletherketone, polyalkyleneimine, polyimide, polyalkylene terephthalate, liquid crystal polymer, polyphenylene sulphide, polyether sulphone and cycloolefin polymer.
4. A pod or carrier as claimed in claim 3, wherein the thermoplastic polymer is selected from polyaryletherketone.
5. A pod or carrier as claimed in claim 4, wherein the polyaryletherketone is polyetheretherketone (PEEK).
6. A pod or carrier as claimed in claim 5, wherein the PEEK has a tensile strength of 90 to 110 MPa (ISO 527).
7. A pod or carrier as claimed in any one of the preceding claims, wherein the polymer composition comprises particles of zeolite dispersed in a polyetheretherketone matrix.
8. A pod or carrier as claimed in any one of the preceding claims, wherein the pod or carrier is a front opening unified pod (FOIIP), a standard mechanical interface pod (SMIF), a front opening shipping box (FOSB), a reticle standard mechanical interface pod (SMIF) or a wafer cassette.
9. A pod or carrier as claimed in any one of the preceding claims, which is a pod comprising a housing for a wafer or reticle, wherein at least an internal wall portion of the housing is formed from the polymer composition.
10. A pod or carrier as claimed in any one of the preceding claims, which is a pod comprising a housing for a wafer or reticle, wherein said housing further comprises an insert formed from said polymer composition. A pod or carrier as claimed in claim 10, wherein said insert is a dummy wafer. A pod or carrier as claimed in any one of the preceding claims, which is a pod having an inlet for the introduction of a purge gas, wherein at least a portion of the inlet is formed from the polymer composition. A pod or carrier as claimed in any one of the preceding claims, wherein the polymer composition additionally includes a conductive agent, preferably carbon black. A pod or carrier as claimed in any one of the preceding claims, wherein the polymer composition comprises 5 to 70 weight % molecular sieve. A polymer composition comprising polyaryletherketone and zeolite, wherein the polymer composition has a tensile modulus (ISO527) of 4 to 30 GPa and a tensile strength (ISO527) of 80 to 140 MPa. The polymer composition according to claim 15, wherein the polyaryletherketone is polyetheretherketone (PEEK).
PCT/GB2023/053085 2022-12-16 2023-11-29 Semiconductor pods and carriers WO2024126973A1 (en)

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GB2306169A (en) * 1995-10-13 1997-04-30 Eastman Kodak Co Molecular sieve or metal salt/polymer blends for packaging structures
US6003674A (en) * 1996-05-13 1999-12-21 Brooks; Ray Gene Method and apparatus for packing contaminant-sensitive articles and resulting package
JP2000007084A (en) * 1998-06-15 2000-01-11 Sumika Chemical Analysis Service Ltd Storage transportation container for preventing pollution
EP1388165A2 (en) * 2001-05-17 2004-02-11 Ebara Corporation Substrate transport container
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