WO2024114196A1

WO2024114196A1 - Inertial measurement unit

Info

Publication number: WO2024114196A1
Application number: PCT/CN2023/126981
Authority: WO
Inventors: 吴雾; 黄立成; 黄晓群
Original assignee: 广州导远电子科技有限公司
Priority date: 2022-12-02
Filing date: 2023-10-27
Publication date: 2024-06-06
Also published as: CN218765328U

Abstract

An inertial measurement unit (1000), relating to the technical field of inertial measurement. The inertial measurement unit (1000) comprises a box (100), a cover (200), a circuit board (300), and cushioning blocks (400); the cover (200) covers the box (100); the cover (200) and the box (100) jointly define a mounting cavity (101); an inertial measurement unit chip (500) is integrated on the circuit board (300); the circuit board (300) is arranged in the mounting cavity (101); the cushioning blocks (400) are mounted on the circuit board (300), and the cushioning blocks (400) abut against the cover (200) and the box (100) at the same time. When the cover (200) covers the box (100), the cushioning blocks (400) abut against the cover (200) and the box (100) at the same time, so that the circuit board (300) is pressed and fixed by using the pressure between the cover (200) and the box (100).

Description

An inertial measurement unit

CROSS-REFERENCE TO RELATED APPLICATIONS

The present disclosure claims priority to a Chinese patent application with application number 202223252202.4 filed with the Chinese Patent Office on December 2, 2022, and entitled “A Type of Inertial Measurement Unit,” the entire contents of which are incorporated by reference into the present disclosure.

Technical Field

The present disclosure relates to the technical field of inertial measurement, and in particular to an inertial measurement unit.

Background technique

The Inertial Measurement Unit (IMU) is a combination of a three-axis gyroscope and a three-axis accelerometer to measure the angular velocity and acceleration of an object in three-dimensional space, and use this to infer the object's attitude. It has a very important application value in navigation. In long-term application practice, it is found that the measurement results of the inertial measurement unit often have different degrees of deviation from the initial state. Some deviations will accumulate over time, which seriously affects the attitude estimation of the IMU and ultimately leads to a loss of positioning accuracy. Therefore, solving the deviation of the measurement results of the inertial measurement unit and improving the measurement accuracy are the problems that this field is committed to solving.

Application Contents

The present disclosure provides an inertial measurement unit, which can reduce the influence of long-term cumulative stress on the attitude estimation of IMU and improve positioning accuracy.

The embodiments of the present disclosure may be implemented as follows:

An embodiment of the present disclosure provides an inertial measurement unit, comprising:

Box body;

A cover body, the cover body is covered on the box body, and the cover body and the box body together define an installation chamber;

A circuit board, on which an inertial measurement unit chip is integrated, and the circuit board is disposed in the installation chamber; and

A buffer block is mounted on the circuit board and abuts against the cover body and the box body at the same time.

Optionally, the buffer block is clamped to an edge of the circuit board.

Optionally, the circuit board is a polygonal plate body, the circuit board has a plurality of corner portions, the number of the buffer blocks is multiple, and each of the corner portions is equipped with a buffer block.

Optionally, the circuit board is a rectangular plate body, the circuit board has four corner portions, the number of the buffer blocks is four, and the four buffer blocks are respectively installed at the four corner portions.

Optionally, the buffer block is provided with a snap-fitting groove, and the corner portion is snap-fitted with the snap-fitting groove.

Optionally, the corner portion is recessed toward the middle of the circuit board to form a notch, and the snap-in groove fits into the notch.

Optionally, the snap-fit groove is an L-shaped groove, a U-shaped groove or an arc-shaped groove.

Optionally, the buffer block has a first side wall and a second side wall facing away from the clamping groove, the first side wall and the second side wall are distributed at an angle, the circuit board has a first wall surface and a second wall surface, the first wall surface and the second wall surface are located on both sides of the notch;

The first side wall and the second side wall are coplanar with the first wall surface and the first wall surface respectively.

Optionally, a length of the buffer block along a thickness direction of the circuit board is greater than a thickness of the circuit board.

Optionally, the box body includes a first shell and a first boss, the first boss is connected to the first shell, the cover body covers the first shell, the cover body and the first shell jointly define the installation chamber, the first boss is located in the installation chamber, and the buffer block abuts between the first boss and the cover body.

Optionally, the cover body includes a second shell and a second boss, the second boss is connected to the second shell, the second shell covers the first shell, the second shell and the first shell jointly define the installation chamber, the second boss is located in the installation chamber, and the buffer block abuts between the first boss and the second boss.

Optionally, the first boss and the first shell are integrally formed, and the second boss and the second shell are integrally formed.

Optionally, a first fastener is provided on the first shell, and a screw matching hole is provided on the second shell, and the screw matching hole cooperates with the first fastener to fixedly connect the first shell and the second shell.

Optionally, the first shell and the second shell are snap-connected.

Optionally, the inertial measurement unit further includes a circuit board body and a processor, the circuit board body is mounted in the box body, and the processor is mounted on the circuit board body;

Wherein, the circuit board body is arranged on a side of the circuit board away from the cover body.

Optionally, the inertial measurement unit further includes a first inter-board connector and a second inter-board connector, wherein the first inter-board connector is mounted on the circuit board, the second inter-board connector is mounted on the circuit board body, and the first inter-board connector and the second inter-board connector are electrically connected.

Optionally, the inertial measurement unit further includes an external data connector, and the external data connector is mounted on the circuit board body.

Optionally, the circuit board and the circuit board body are electrically connected via a flexible circuit board or a cable.

Optionally, the inertial measurement unit further includes a circuit board body and a second fastener, the circuit board body is provided with four through holes, and the second fastener passes through the through holes to fix the circuit board body in the first shell.

Optionally, there are multiple first bosses, and the circuit board body is located between the multiple first bosses.

Optionally, the buffer block is made of rubber material.

The beneficial effects of the inertial measurement unit of the embodiment of the present disclosure include, for example:

The embodiment of the present disclosure provides an inertial measurement unit, which includes a box body, a cover body, a circuit board and a buffer block. The cover body is covered on the box body, and the cover body and the box body jointly define an installation chamber. An inertial measurement unit chip is integrated on the circuit board, and the circuit board is arranged in the installation chamber. The buffer block is installed on the circuit board, and the buffer block abuts against the cover body and the box body at the same time. Since the cover body is covered on the box body, the buffer block abuts against the cover body and the box body at the same time, and the circuit board is fixed by the pressure between the cover body and the box body. This fixing method avoids the influence of the stress generated by the screw locking during the process of fixing the circuit board with screws. Since no screw fixing is required, there is no locking stress, and the buffer block can also isolate the locking stress generated when the screws are locked on the box body and the cover, avoiding or reducing the stress of the inertial measurement unit chip transmitted to the circuit board, reducing the influence of the long-term cumulative effect of stress on the attitude estimation of the IMU, and improving the positioning accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

FIG1 is a schematic diagram of an inertial measurement unit provided in an embodiment of the present disclosure;

FIG2 is an exploded view of an inertial measurement unit provided in an embodiment of the present disclosure;

FIG3 is a first schematic diagram of a partial structure of an inertial measurement unit provided in an embodiment of the present disclosure;

FIG4 is a second schematic diagram of a partial structure of an inertial measurement unit provided in an embodiment of the present disclosure;

FIG5 is a schematic diagram of a cover body provided in an embodiment of the present disclosure;

FIG6 is a schematic diagram of a circuit board and a circuit board body provided in an embodiment of the present disclosure being electrically connected via a flexible circuit board;

FIG. 7 is a schematic diagram showing that a circuit board and a circuit board body provided in an embodiment of the present disclosure are electrically connected via a cable.

Icon: 1000- inertial measurement unit; 100- box body; 101- installation chamber; 110- first shell; 120- first boss; 200- cover body; 210- second shell; 211- screw fitting hole; 220- second boss; 300- circuit board; 310- corner; 311- notch; 312- first wall; 313- second wall; 400- buffer block; 401- snap-in groove; 410- first side wall; 420- second side wall; 500- inertial measurement unit chip; 600- circuit board body; 601- through hole; 700- processor; 800- external data connector; 10- first fastener; 20- second fastener; 30- first board connector; 40- second board connector; 50- flexible circuit board; 60- cable.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. The components of the embodiments of the present disclosure described and shown in the drawings here can be arranged and designed in various different configurations.

Therefore, the following detailed description of the embodiments of the present disclosure provided in the accompanying drawings is not intended to limit the scope of the present disclosure claimed for protection, but merely represents selected embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present disclosure.

It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition and explanation in the subsequent drawings.

In the description of the present disclosure, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when used. It is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

It should be noted that, in the absence of conflict, the features in the embodiments of the present disclosure may be combined with each other.

As described in the background technology of this disclosure, the measurement results of the inertial measurement unit often deviate from the initial state to varying degrees. Some deviations will accumulate and become larger over time, seriously affecting the posture estimation of the IMU and ultimately causing a loss of positioning accuracy.

In order to solve the problems existing in the prior art, the inventors of the present invention discovered after continuous analysis and research that the stress generated during the assembly, fitting and fixation of the inertial measurement unit is transmitted to the inertial measurement unit chip, causing stress accumulation, which is one of the reasons affecting the deviation of the measurement results of the inertial measurement unit.

Specifically, the existing inertial measurement unit assembly and mounting method usually uses screws to fix the circuit board with an integrated inertial measurement unit chip to the box of the inertial measurement unit. The stress generated when the fixing screws are tightened is transmitted to the inertial measurement unit chip through the circuit board, affecting the inertial measurement unit chip. As time accumulates, it will seriously affect the attitude calculation of the IMU, and ultimately cause the positioning to lose accuracy.

In view of this, please refer to Figures 1 to 7. The inertial measurement unit 1000 provided in the embodiment of the present disclosure can solve this problem, which will be described in detail below.

The inertial measurement unit 1000 provided in the embodiment of the present disclosure includes a box body 100 , a cover body 200 , a circuit board 300 and a buffer block 400 , wherein the cover body 200 covers the box body 100 , and the cover body 200 and the box body 100 together define an installation chamber 101 .

The circuit board 300 is integrated with an inertial measurement unit chip 500 , i.e., an IMU chip. The circuit board 300 is disposed in the installation chamber 101 . The buffer block 400 is installed on the circuit board 300 , and the buffer block 400 abuts against the cover body 200 and the box body 100 at the same time.

When the cover 200 covers the box body 100 , the buffer block 400 abuts against the cover 200 and the box body 100 at the same time, and the circuit board 300 is pressed and fixed by the pressure between the cover 200 and the box body 100 .

This fixing method avoids the influence of stress generated by screw locking during the process of fixing the circuit board 300 with screws. Since no screw fixing is required, there is no locking stress, and the buffer block 400 can also isolate the locking stress generated when the screws lock the box body 100 and the cover body 200, thereby avoiding or reducing the stress transmitted to the inertial measurement unit chip 500 on the circuit board 300, reducing the influence of the long-term cumulative effect of stress on the attitude calculation of the IMU, and improving the positioning accuracy.

Of course, the inertial measurement unit 1000 also includes a circuit board body 600, a processor 700 and an external data connector 800. The external data connector 800 is an input and output connector. The circuit board body 600 is installed in the box body 100, the processor 700 is installed on the circuit board body 600, and the external data connector 800 is installed on the circuit board body 600. It should be noted that in this embodiment, the circuit board 300 and the circuit board body 600 can both be PCBA (Printed Circuit Board Assembly) boards, that is, printed circuit boards, and the processor 700 is an MCU (Microcontroller Unit) processor, that is, a microcontroller unit.

The circuit board body 600 is disposed on a side of the circuit board 300 away from the cover body, that is, the circuit board body 600 is located at the lower side of the circuit board 300 , and the circuit board body 600 and the circuit board 300 are spaced apart.

It should be noted that, in order to facilitate the spacing between the circuit board 300 and the circuit board body 600 and to avoid the circuit board 300 squeezing the components integrated on the circuit board body 600, in the present embodiment, the box body 100 includes a first shell 110 and four first bosses 120, and the four first bosses 120 are connected to the first shell 110. Specifically, the four first bosses 120 are located on the inner wall of the first shell 110 and are spaced apart. The four first bosses 120 can be integrally formed with the first shell 110.

The cover body 200 includes a second shell 210 and four second bosses 220. The second shell 210 covers the first shell 110. The second shell 210 and the first shell 110 jointly define an installation chamber 101. The four first bosses 120 and the four second bosses 220 are all located in the installation chamber 101. The four second bosses 220 are connected to the second shell 210. Specifically, the four second bosses 220 are located on the inner wall of the second shell 210 and are distributed at intervals. The four second bosses 220 can be integrally formed with the second shell 210.

Among them, the four buffer blocks 400 abut between the four first bosses 120 and the four second bosses 220. At this time, the circuit board 300 is spaced apart from the first bosses 120 and the second bosses 220 at the same time. When the second shell 210 is covered on the first shell 110, and the first fastener 10 is tightened to fix the first shell 110 and the second shell 210, at this time, the four first bosses 120 and the four second bosses 220 abut against the four buffer blocks 400 at the same time to fix the circuit board 300.

It should be noted that, in the present embodiment, four first fasteners 10 are provided on the first shell 110 of the box body 100, and the first fasteners 10 may be screws. Four screw mating holes 211 are provided on the second shell 210, and the screw mating holes 211 cooperate with the first fasteners 10 to fix the first shell 110 and the second shell 210 in connection. Of course, in other embodiments, the second shell 210 may also be snap-connected with the first shell 110 through a snap-fit structure.

Among them, the inertial measurement unit 1000 also includes four second fasteners 20, four through holes 601 are provided on the circuit board body 600, the second fasteners 20 are screws, and the four second fasteners 20 respectively pass through the four through holes 601 to fix the circuit board body 600 in the first shell 110, and the circuit board body 600 is located between the four first bosses 120, and the circuit board body 600 is installed in the first shell 110.

In order to facilitate data transmission between the circuit board 300 and the circuit board body 600, the inertial measurement unit 1000 also includes a first board-to-board connector 30 and a second board-to-board connector 40, the first board-to-board connector 30 is mounted on the circuit board 300, the second board-to-board connector 40 is mounted on the circuit board body 600, and the first board-to-board connector 30 and the second board-to-board connector 40 are electrically connected.

Of course, in other embodiments, please refer to Figure 6, the inertial measurement unit 1000 may also include a flexible circuit board 50, which is electrically connected to the circuit board 300 and the circuit board body 600 at the same time, and the first board connector 30 and the second board connector 40 are replaced by the flexible circuit board 50.

Alternatively, please refer to Figure 7, the inertial measurement unit 1000 may also include a cable 60, which replaces the first board-to-board connector 30 and the second board-to-board connector 40. The cable 60 is electrically connected to the circuit board 300 and the circuit board body 600 at the same time to realize data transmission between the circuit board 300 and the circuit board body 600.

Specifically, in order to facilitate the installation of the buffer block 400, the buffer block 400 is snapped onto the edge of the circuit board 300. The buffer block 400 may be a flexible member, for example, made of elastic materials such as rubber, so as to isolate the transmission of stress.

It should be noted that the circuit board 300 is a polygonal plate body, that is, the shape of the circuit board 300 is a polygonal plate body structure, the circuit board 300 has a plurality of corner portions 310, the number of buffer blocks 400 is multiple, and each corner portion 310 is installed with a buffer block 400. The corner portion 310 here can be understood as a plurality of corners on the polygonal plate body.

For example, in this embodiment, the circuit board 300 is a rectangular plate body, the circuit board 300 has four corner portions 310 , ie, four right-angled corners, the number of the buffer blocks 400 is four, and the four buffer blocks 400 are respectively installed at the four corner portions 310 .

It should be noted that the length of the buffer block 400 along the thickness direction of the circuit board 300 is greater than the thickness of the circuit board 300. At this time, the circuit board 300 can be in a spaced state with the first shell 110 and the second shell 210, so that the stress is completely blocked by the four buffer blocks 400.

Here, the thickness of the circuit board 300 can be understood as the length dimension along the axial center line direction of the first fastener 10 .

In addition, the buffer block 400 is provided with a snap-fitting groove 401 , which is an L-shaped groove. The corner portion 310 and the snap-fitting groove 401 are snap-fitted to facilitate installation or removal of the buffer block 400 .

Of course, in other embodiments, the snap-in groove 401 may also be a U-shaped groove or an arc-shaped groove, etc., which may be specifically adjusted according to the shape of the corner portion 310 and will not be elaborated here.

In order to reduce the volume of the entire inertial measurement unit 1000, the corner portion 310 is recessed toward the middle of the circuit board 300 to form a notch 311, and the snap-in groove 401 is matched with the notch 311, so that the four buffer blocks 400 can be closer to the middle of the circuit board 300, thereby reducing the spatial volume requirement of the installation chamber 101, thereby reducing the volume of the entire inertial measurement unit 1000.

Of course, in other embodiments, in order to further reduce the volume of the entire inertial measurement unit 1000 , the depth of the notch 311 may be deeper, that is, the buffer block 400 may be closer to the middle of the circuit board 300 .

Among them, the buffer block 400 has a first side wall 410 and a second side wall 420 facing away from the snap-in groove 401, and the first side wall 410 and the second side wall 420 are distributed at an angle. In the present embodiment, the angle is a right angle. The circuit board 300 has a first wall surface 312 and a second wall surface 313, and the first wall surface 312 and the second wall surface 313 are located on both sides of the notch 311. The first wall surface 312 and the second wall surface 313 can be understood as the side walls of the circuit board 300 in the thickness direction. The first wall surface 312 and the second wall surface 313 are also distributed at a right angle, and the first side wall 410 and the second side wall 420 are coplanar with the first wall surface 312 and the first wall surface 312 respectively, thereby further reducing the volume of the entire inertial measurement unit 1000.

In summary, the inertial measurement unit 1000 includes a box body 100, a cover body 200, a circuit board 300 and a buffer block 400. The cover body 200 covers the box body 100, and the cover body 200 and the box body 100 jointly define an installation chamber 101. The circuit board 300 is integrated with an inertial measurement unit chip 500, and the circuit board 300 is arranged in the installation chamber 101. The buffer block 400 is installed on the circuit board 300, and the buffer block 400 abuts against the cover body 200 and the box body 100 at the same time.

When the cover 200 is covered on the box body 100, the buffer block 400 abuts against the cover 200 and the box body 100 at the same time, and uses the pressure between the cover 200 and the box body 100 to press and fix the circuit board 300. This fixing method avoids the influence of the stress generated by the screw locking during the process of fixing the circuit board 300 with screws. Since no screw fixing is required, there is no locking stress, and the buffer block 400 can also isolate the locking stress generated when the screws lock the box body 100 and the cover 200, avoiding or reducing the stress transmitted to the inertial measurement unit chip 500 on the circuit board 300, reducing the influence of the long-term cumulative effect of stress on the attitude estimation of the IMU, and improving the positioning accuracy.

And because the corner portion 310 is recessed toward the middle of the circuit board 300 to form a notch 311, the snap-in groove 401 fits into the notch 311, so that the four buffer blocks 400 can be closer to the middle of the circuit board 300, reducing the spatial volume requirement for the installation chamber 101, and thus reducing the volume of the entire inertial measurement unit 1000.

The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Industrial Applicability

In summary, the present disclosure provides an inertial measurement unit, which includes a box body, a cover body, a circuit board and a buffer block. The cover body is covered on the box body, and the cover body and the box body jointly define an installation chamber. The circuit board is integrated with an inertial measurement unit chip, and the circuit board is arranged in the installation chamber. The buffer block is installed on the circuit board, and the buffer block abuts against the cover body and the box body at the same time. When the cover body is covered on the box body, the buffer block abuts against the cover body and the box body at the same time, and the pressure between the cover body and the box body is used to press and fix the circuit board. This fixing method avoids the stress generated by the screw locking during the process of fixing the circuit board with screws. Influence, since no screws are needed to fix it, there is no locking stress, and the buffer block can also isolate the locking stress generated when the screws lock the box body and cover, avoiding or reducing the stress transmitted to the inertial measurement unit chip on the circuit board, reducing the influence of long-term cumulative stress on the attitude calculation of the IMU, and improving positioning accuracy.

Claims

An inertial measurement unit, characterized in that it comprises:

Box body (100);

a cover body (200), the cover body (200) covering the box body (100), the cover body (200) and the box body (100) jointly defining an installation chamber (101);

A circuit board (300), wherein an inertial measurement unit chip (500) is integrated on the circuit board (300), and the circuit board (300) is arranged in the installation chamber (101); and

A buffer block (400) is installed on the circuit board (300), and the buffer block (400) abuts against the cover body (200) and the box body (100) at the same time.
The inertial measurement unit according to claim 1, characterized in that the buffer block (400) is snap-connected to an edge of the circuit board (300).
The inertial measurement unit according to claim 1 or 2 is characterized in that the circuit board (300) is a polygonal plate, the circuit board (300) has a plurality of corner portions (310), the number of the buffer blocks (400) is multiple, and each of the corner portions (310) is equipped with a buffer block (400).
The inertial measurement unit according to claim 3 is characterized in that the circuit board (300) is a rectangular plate, the circuit board (300) has four corner portions (310), the number of the buffer blocks (400) is four, and the four buffer blocks (400) are respectively installed on the four corner portions (310).
The inertial measurement unit according to claim 3 or 4 is characterized in that the buffer block (400) is provided with a snap-fit groove (401), and the corner portion (310) and the snap-fit groove (401) are snap-fitted.
The inertial measurement unit according to claim 5, characterized in that the corner portion (310) is recessed toward the middle of the circuit board (300) to form a notch (311), and the snap-in groove (401) is matched with the notch (311).
The inertial measurement unit according to claim 5 or 6 is characterized in that the snap-in groove (401) is an L-shaped groove, a U-shaped groove or an arc-shaped groove.
The inertial measurement unit according to claim 6, characterized in that the buffer block (400) has a first side wall (410) and a second side wall (420) facing away from the clamping groove (401), the first side wall (410) and the second side wall (420) are distributed at an angle, the circuit board (300) has a first wall surface (312) and a second wall surface (313), and the first wall surface (312) and the second wall surface (313) are located on both sides of the notch (311);

Wherein, the first side wall (410) and the second side wall (420) are coplanar with the first wall surface (312) and the first wall surface (312) respectively.
The inertial measurement unit according to any one of claims 3 to 8, characterized in that the length of the buffer block (400) along the thickness direction of the circuit board (300) is greater than the thickness of the circuit board (300).
The inertial measurement unit according to any one of claims 1 to 9 is characterized in that the box body (100) includes a first shell (110) and a first boss (120), the first boss (120) is connected to the first shell (110), the cover body (200) covers the first shell (110), the cover body (200) and the first shell (110) jointly define the installation chamber (101), the first boss (120) is located in the installation chamber (101), and the buffer block (400) abuts between the first boss (120) and the cover body (200).
The inertial measurement unit according to claim 10 is characterized in that the cover body (200) includes a second shell (210) and a second boss (220), the second boss (220) is connected to the second shell (210), the second shell (210) covers the first shell (110), the second shell (210) and the first shell (110) jointly define the installation chamber (101), the second boss (220) is located in the installation chamber (101), and the buffer block (400) abuts between the first boss (120) and the second boss (220).
The inertial measurement unit according to claim 11, characterized in that the first boss (120) and the first shell (110) are integrally formed, and the second boss (220) and the second shell (210) are integrally formed.
The inertial measurement unit according to claim 11 or 12 is characterized in that a first fastener (10) is provided on the first shell (110), and a screw matching hole (211) is provided on the second shell (210), and the screw matching hole (211) and the first fastener (10) cooperate to fix the first shell (110) and the second shell (210) together.
The inertial measurement unit according to any one of claims 11 to 13, characterized in that the first shell (110) and the second shell (210) are snap-connected.
The inertial measurement unit according to any one of claims 1 to 14, characterized in that the inertial measurement unit further comprises a circuit board body (600) and a processor (700), the circuit board body (600) being installed in the box body (100), and the processor (700) being installed in the circuit board body (600);

Wherein, the circuit board body (600) is arranged on a side of the circuit board (300) away from the cover body (200).
The inertial measurement unit according to claim 15 is characterized in that the inertial measurement unit also includes a first inter-board connector (30) and a second inter-board connector (40), the first inter-board connector (30) is installed on the circuit board (300), the second inter-board connector (40) is installed on the circuit board body (600), and the first inter-board connector (30) and the second inter-board connector (40) are electrically connected.
The inertial measurement unit according to claim 15 or 16 is characterized in that the inertial measurement unit also includes an external data connector (800), and the external data connector (800) is installed on the circuit board body (600).
The inertial measurement unit according to any one of claims 15 to 17, characterized in that the circuit board (300) and the circuit board body (600) are electrically connected via a flexible circuit board (50) or a cable (60).
The inertial measurement unit according to any one of claims 10 to 14 is characterized in that the inertial measurement unit also includes a circuit board body (600) and a second fastener (20), the circuit board body (600) is provided with four through holes (601), and the second fastener (20) passes through the through holes (601) to fix the circuit board body (600) in the first shell (110).
The inertial measurement unit according to claim 19 is characterized in that the number of the first bosses (120) is multiple, and the circuit board body (600) is located between the multiple first bosses (120).
The inertial measurement unit according to any one of claims 1 to 20, characterized in that the buffer block (400) is made of rubber material.