WO2024094188A1 - Orthopedic implant, strain monitoring system, processing method and device, and medium - Google Patents

Abstract

The present invention relates to the technical field of medical instruments, and in particular, to an orthopedic implant, a strain monitoring system, a processing method and device, and a medium. The orthopedic implant comprises: an orthopedic implant body with biocompatibility; a radio frequency label circuit formed by in situ carbonization at a target position on the surface of the orthopedic implant body; and an encapsulation body with biocompatibility encapsulating the surface of the label circuit. Therefore, according to the present invention, positions with higher stress or positions prone to failure of a human bone anatomical structure can be acquired by biomechanical finite element simulation of the human bone anatomical structure, so as to produce sensing circuits in situ in a specific area by means of multi-degree-of-freedom laser processing, thereby endowing the orthopedic implant body with sensing and communication capabilities. Also, multi-degree-of-freedom processing is required for achieving attachment machining, and the machining path is determined on a target curved surface of the orthopedic implant body, so as to ensure that the laser optical axis is perpendicular to the curved surface in real time, and the iso-defocusing and uniform-speed scanning of lasers are achieved, thereby improving the machining efficiency.

Description

Orthopedic implants, strain monitoring systems, processing methods, equipment and media

CROSS-REFERENCE TO RELATED APPLICATIONS

The present invention is based on Chinese patent application number 202211373450.6, filed on November 4, 2022, and application number 202211373488.3, Chinese patent application number 202211373487.9, filed on November 4, 2022, Chinese patent application number 202211373486.4, filed on November 4, 2022, Chinese patent application number 202211373472.2, filed on November 4, 2022, Chinese patent application number 202211373458.2, filed on November 4, 2022, and Chinese patent application number 202211373458.2, filed on November 4, 2022, and claims the priority of the above-mentioned Chinese patent applications, the contents of the above-mentioned Chinese patent applications are hereby introduced into the present invention as a reference.

Technical Field

The present invention relates to the technical field of medical devices, and in particular to an orthopedic implant, a strain monitoring system, a processing method, a device and a medium.

Background technique

Postoperative monitoring of orthopedics has always been one of the thorny issues in the field of orthopedics. The traditional monitoring method is through X-ray films or CT (Computer Tomography). This method using medical imaging has the problems of low follow-up rate and sampling frequency. At the same time, the information provided by medical imaging is an indirect reflection of the postoperative situation of orthopedics. Especially in the early stage after orthopedics surgery, the information that can be provided is relatively limited and cannot fully reflect the status of orthopedics after surgery.

Taking postoperative healing monitoring of fractures as an example, according to strain theory, the healing tissue at the fracture ends has an obvious change in elastic modulus during the healing process. The corresponding mechanical load it shares gradually increases, and the mechanical load shared by the orthopedic implant gradually decreases, causing the corresponding mechanical response of the orthopedic implant to change. Therefore, the progress of fracture healing can be monitored by mechanical monitoring of orthopedic implants.

In the related technology, strain sensing monitoring can be used: the bone implant strain sensor device is attached to the implant body by bonding, physical fixation, etc., and the mechanical environment signal is obtained by contact strain sensing to monitor the stress and strain of the orthopedic implant. However, in the related technology, the material of the orthopedic implant is stainless steel or titanium alloy, and the matching sensor adopts semiconductor technology, the preparation process is complicated, and the cost is high, which is not conducive to promotion and application, and needs to be improved.

Summary of the invention

The present invention provides an orthopedic implant, a strain monitoring system, a processing method, a device and a medium to solve the problems in the related art that the preparation process of orthopedic implants is complicated, the cost is high, and it is not conducive to popularization and application.

The first aspect of the present invention provides an orthopedic implant, comprising: an orthopedic implant body with biocompatibility; and a radio frequency tag circuit formed by in-situ carbonization at a target position on the surface of the orthopedic implant body, wherein the radio frequency tag circuit cooperates with an external device to sense the resonance peak kurtosis and resonance frequency of the orthopedic implant when it is subjected to stress and strain. Strain monitoring is performed based on the resonance peak-peak degree and/or the resonance frequency; and a packaging body having biocompatibility is provided, wherein the packaging body packages the surface of the tag circuit.

Optionally, the shape of the RFID circuit is a square open ring, a multi-toothed open ring or a circular ring, wherein the RFID circuit detects the resonance peak kurtosis and the resonance frequency based on the ring spacing and the opening spacing of the square open ring, the multi-toothed open ring or the circular ring.

Optionally, the orthopedic implant further comprises: a multi-channel array, wherein the multi-channel array comprises a plurality of radio frequency tag circuits, each radio frequency tag circuit is distinguished by a different characteristic frequency, and is arranged at a large strain position found during a finite element simulation process to obtain the spatial distribution of stress on the bone implant.

Optionally, the orthopedic implant includes one or more of an orthopedic intervertebral fusion cage, an orthopedic intramedullary nail, a posterior approach spinal fixation rod, an orthopedic bone plate and a joint spacer.

Optionally, the material of the orthopedic implant body is polyetheretherketone, carbon fiber reinforced polyetheretherketone or a composite material of polyetheretherketone and highly cross-linked polyethylene.

A second aspect of the present invention provides a strain monitoring system, comprising an orthopedic implant as described in the above embodiment; an external device, wherein the external device obtains the resonance peak-peak degree and resonance frequency of the orthopedic implant, and performs strain monitoring based on the resonance peak-peak degree and/or the resonance frequency, wherein the external device transmits a signal to the bone implant using an antenna in vitro, and the electromagnetic wave in the signal that is consistent with the characteristic frequency of the radio frequency tag circuit will form a trough in the echo, and the characteristic frequency of the radio frequency tag circuit is obtained through the characteristic frequency at the trough, and the strain information is calculated based on the characteristic frequency.

Optionally, the external device includes an antenna and a processing terminal, wherein the antenna is connected to the processing terminal, and when the antenna is close to the radio frequency tag circuit on the orthopedic implant, the radio frequency tag circuit senses the resonance peak-peak degree and the resonance frequency, and the processing terminal analyzes the resonance peak-peak degree and/or the resonance frequency, and performs strain monitoring based on the analysis results.

A third aspect of the present invention provides a method for processing an orthopedic implant, which is used for processing the orthopedic implant described in the above embodiment, wherein the method comprises the following steps: obtaining the type of the orthopedic implant and the material of the orthopedic implant body; designing a label pattern of a radio frequency tag circuit according to the type of the orthopedic implant and the material of the orthopedic implant body, and determining the processing parameters of the orthopedic implant according to the label pattern and the material of the orthopedic implant body; performing in-situ carbonization on a target position on the surface of the orthopedic implant body according to the processing parameters to obtain a radio frequency tag circuit, and encapsulating the surface of the tag circuit using a biocompatible encapsulation body.

Optionally, the processing parameters of the orthopedic implant are determined according to the label pattern and the material of the orthopedic implant body, including: when the bone implant material is carbon fiber reinforced polyetheretherketone, nanosecond, picosecond, or femtosecond pulse laser processing with infrared, ultraviolet, or green wavelengths is adopted; when the bone implant material is polyetheretherketone, nanosecond, picosecond, or femtosecond pulse laser processing with infrared, ultraviolet, or green wavelengths is adopted; when the label pattern is a square or circular open ring, a first target processing speed and a second target processing speed are selected for carbon fiber reinforced polyetheretherketone and polyetheretherketone, respectively; when the label pattern is a toothed shape, a third target processing speed and a fourth target processing speed are selected for carbon fiber reinforced polyetheretherketone and polyetheretherketone, respectively, wherein the third target processing speed is greater than the first target processing speed, and the fourth target processing speed is greater than the second target processing speed; the resistance and the peak of the characteristic peak of the orthopedic implant during the processing are obtained according to The resistance and the kurtosis of the characteristic peak adjust processing parameters of the orthopedic implant.

Optionally, designing the label pattern of the radio frequency tag circuit according to the type of the orthopedic implant and the material of the orthopedic implant body includes: determining the stress state of the corresponding bone according to the type of the orthopedic implant; determining the characteristics of the orthopedic implant according to the material of the orthopedic implant body; and designing the label pattern of the radio frequency tag circuit according to the stress state of the bone and the characteristics of the orthopedic implant.

Optionally, designing the label pattern of the radio frequency tag circuit according to the stress state of the bone and the characteristics of the orthopedic implant includes: modeling the orthopedic implant to simulate the stress state after implantation in the human body; identifying the position where the strain force is greater than a preset value in the simulation result as the processing position of the radio frequency tag circuit; performing finite element simulation on the radio frequency tag circuit in combination with the size of the orthopedic implant, and adjusting the spacing and/or opening distance of the radio frequency tag circuit at the processing position according to the simulation results until the size and characteristic frequency of the radio frequency tag circuit meet the processing requirements of the orthopedic implant, and the characteristic peak of the radio frequency tag circuit is different from the characteristic peak of human tissue and blood.

Optionally, the in-situ carbonization is performed at the target position on the surface of the orthopedic implant body according to the processing parameters, including: planning a processing path for the surface of the orthopedic implant body; performing multi-degree-of-freedom processing according to the processing path through a laser, a focusing mirror, a multi-degree-of-freedom mechanical motion mechanism and a scanning galvanometer, wherein the scanning speed of the scanning galvanometer is greater than the movement speed of the multi-degree-of-freedom mechanical motion mechanism, the laser is focused on the surface of the orthopedic implant body through the focusing mirror, and the distance between the laser focusing plane and the area to be in-situ carbonized is controlled to achieve in-situ carbonization processing of any curved surface.

A fourth aspect of the present invention provides a processing device, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the orthopedic implant processing method as described in the above embodiment.

A fifth aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon, the program being executed by a processor to implement the orthopedic implant processing method as described in the above embodiment.

Therefore, the present invention has at least the following beneficial effects:

The embodiment of the present invention can convert a part of the surface of the orthopedic implant body into a radio frequency tag circuit with conductivity and sensing capability by in-situ carbonization. The strain force on the orthopedic implant is sensed by the radio frequency tag circuit and communicates with the outside of the body. The orthopedic implant body can be endowed with sensing and communication capabilities without destroying the original characteristics of the orthopedic implant body. Since the radio frequency tag circuit is obtained by in-situ carbonization, the bonding between the radio frequency tag circuit and the substrate is very strong, and there will be no problem of loose bonding over time, and there will be no problem of significantly increased resonant response frequency. The radio frequency tag circuit is excited by an external device, and there is no need to add circuits and power supplies to the orthopedic implant, thereby avoiding potential electrochemical reactions and not affecting perspective. The orthopedic implant body itself has biocompatibility, so there is no need to encapsulate the part other than the radio frequency tag circuit. The orthopedic implant body can be partially encapsulated using a biocompatible encapsulation body. The biocompatibility and stability of the radio frequency tag circuit are simultaneously guaranteed by partial encapsulation, effectively reducing the difficulty and cost of encapsulation. The partial encapsulation will not change the original size of the orthopedic implant, so the appearance of the orthopedic implant can be maintained without affecting surgical implantation, which is conducive to promotion and application.

Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a structural diagram of an orthopedic implant provided according to an embodiment of the present invention;

FIG2 is a schematic diagram of a tag circuit provided according to a specific embodiment of the present invention;

FIG3 is a simulation diagram of a tag circuit provided according to a specific embodiment of the present invention;

FIG4 is a physical diagram of a tag circuit and an orthopedic implant according to a specific embodiment of the present invention;

FIG5 is a simulation diagram of the relationship between conductivity and characteristic peak kurtosis according to a specific embodiment of the present invention;

FIG6 is a graph showing a characteristic peak shift curve measured according to a specific embodiment of the present invention;

FIG7 is a curve diagram showing the corresponding relationship between characteristic peaks and strains according to a specific embodiment of the present invention;

FIG8 is a diagram showing the effect of a radio frequency tag circuit on an orthopedic implant according to a specific embodiment of the present invention;

FIG9 is a simulation diagram of a multi-channel sensor array provided according to a specific embodiment of the present invention;

FIG10 is a structural diagram of a joint prosthesis provided according to a specific embodiment of the present invention;

FIG11 is a schematic diagram of an application of an orthopedic bone plate according to an embodiment of the present invention;

12 is a block diagram of a strain monitoring system according to an embodiment of the present invention;

13 is a flow chart of a method for processing an orthopedic implant according to an embodiment of the present invention;

FIG14 is a flow chart of a method for processing an orthopedic implant according to an embodiment of the present invention;

FIG. 15 is a structural diagram of a processing device according to an embodiment of the present invention.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

The orthopedic implant, strain monitoring system, processing method, equipment and medium of the embodiment of the present invention are described below with reference to the accompanying drawings. In view of the technical problems in the related art mentioned in the above background technology that the preparation process of orthopedic implants is complicated, the cost is high, and it is not conducive to the promotion and application, the present invention provides an orthopedic implant, in which a part of the surface of the orthopedic implant body can be converted into a radio frequency tag circuit with conductivity and sensing capability by in-situ carbonization. The radio frequency tag circuit senses the strain force on the orthopedic implant and communicates with the outside of the body, which can give the orthopedic implant body the ability of sensing and communication without destroying the original characteristics of the orthopedic implant body. As a result, the technical problems in the related art that the preparation process of orthopedic implants is complicated, the cost is high, and it is not conducive to the promotion and application are solved.

Specifically, FIG1 is a schematic structural diagram of an orthopedic implant provided by an embodiment of the present invention.

As shown in FIG. 1 , the orthopedic implant 10 includes an orthopedic implant body 11 , a radio frequency tag circuit 12 and a packaging body 13 .

Among them, the orthopedic implant body 11 has biocompatibility, and the radio frequency tag circuit 12 is formed by in-situ carbonization at the target position on the surface of the orthopedic implant body 11, wherein the radio frequency tag circuit 12 cooperates with external equipment to sense the resonance peak-to-peak degree and resonance frequency when the orthopedic implant is subjected to force and strain, and performs strain monitoring based on the resonance peak-to-peak degree and/or resonance frequency; the package body 13 has biocompatibility, and the package body 13 encapsulates the surface of the tag circuit 12.

It should be noted that the target position can be selected according to actual conditions, such as the stress concentration part of the orthopedic implant body 11, etc., without specific limitation; the resonance peak peak and resonance frequency belong to strain signals, and the RFID tag circuit transmits the strain signal to the external device.

It is understandable that the orthopedic implant body itself has biocompatibility, so there is no need to encapsulate the parts other than the RFID tag circuit. The orthopedic implant body can be partially encapsulated with a biocompatible package. The partial encapsulation can simultaneously ensure biocompatibility and the stability of the RFID tag circuit, effectively reducing the difficulty and cost of packaging. Partial encapsulation will not change the original size of the orthopedic implant, so the appearance of the orthopedic implant can be maintained without affecting the surgical implantation, which is conducive to promotion and application. The in-situ carbonization method can give the orthopedic implant body the ability of sensing and communication without destroying the original characteristics of the orthopedic implant body. At the same time, the bonding between the RFID tag circuit and the substrate is very strong, and there will be no problem of loose bonding over time, nor will there be a problem of a significant increase in the resonant response frequency. The RFID tag circuit is excited by an external device, and there is no need to add circuits and power supplies to the orthopedic implant, avoiding potential electrochemical reactions and not affecting perspective.

In one embodiment of the present invention, the shape of the RFID circuit 12 is a square open ring, a multi-toothed open ring or a circular ring, and the RFID circuit detects the resonance peak peak and the resonance frequency based on the ring spacing and the opening spacing of the square open ring, the multi-toothed open ring or the circular ring.

It should be noted that the RFID tag circuit detects the resonance peak peak and resonance frequency based on the ring spacing and opening spacing of a square open ring, a multi-tooth open ring or a circular ring. Among them, the open rings are mainly different in shape, resonance frequency, etc., but the specific principles are the same. Therefore, the following is specifically explained with a square open ring:

Specifically, the square open ring-shaped RFID tag circuit is shown in FIG2 , the simulation schematic diagram of the RFID tag circuit is shown in FIG3 , and FIG4 is a physical diagram of the tag circuit 10 and the polyetheretherketone implant. The RFID tag circuit detects the peak kurtosis and resonant frequency of the resonance based on the opening spacing of the square open ring or the gap between the two rings or a combination of the above two. The principle is that the square open ring can be equivalent to an LRC circuit with a specific resonance frequency. When strain is generated on the RFID tag circuit, the gap spacing will change, resulting in a change in the capacitance of the circuit and a corresponding change in the resonance frequency; at the same time, the strain of the RFID tag circuit will also cause a change in the circuit resistance, resulting in a change in the peak kurtosis KU of the detected resonance peak (that is, a change in the sharpness of the peak); therefore, when it is monitored by an antenna in the outside world, the wave at the resonance frequency in the antenna signal will be absorbed to form a trough. The position of the trough can be read by a vector network analyzer or other equipment to accurately obtain the resonance frequency of the tag circuit, and then its opening spacing or the spacing between the two rings can be known. The change in the spacing is caused by strain, so the strain information can be calculated.

In the specific detection process, since the resonance peak kurtosis and resonance frequency detected by the RFID tag circuit are different based on the ring spacing and opening spacing of different open rings, the simulation diagram of the relationship between conductivity and characteristic peak kurtosis is shown in Figure 5, and the measured characteristic peak offset curve is shown in Figure 6. In specific applications, the corresponding relationship curve between characteristic peak and strain is shown in Figure 7, and the effect of the RFID tag circuit on orthopedic implants is shown in Figure 8.

In one embodiment of the present invention, the orthopedic implant 10 may have a multi-channel array, wherein the multi-channel array contains multiple radio frequency tag circuits, each radio frequency tag circuit is distinguished by a different characteristic frequency, and is arranged at the large strain position found in the finite element simulation process to obtain the stress spatial distribution on the bone implant; the multi-channel sensor array can reduce the random measurement error of static data by associating and fusing multiple groups of measurement signal sequences, and extract more accurate and reliable Reliable information improves the speed and efficiency of information processing.

Specifically, a structure of a multi-channel array is shown in FIG9 , which includes a plurality of label circuits, each of which is distinguished by a different characteristic frequency and arranged at the large strain position found during the finite element simulation process to more accurately obtain the stress spatial distribution on the bone implant.

The specific implementation process for the large strain position found during the finite element simulation is as follows:

(1) Prepare the geometric model: Create the geometric model of the SRR (Split Ring Resonator) split ring and the two-arm spiral reading antenna according to the actual processing drawings.

(2) Define material properties: Define the corresponding material properties for the substrate and SRR open ring as PEEK and carbon, respectively. For the SRR open ring, use the parameterized conductivity value so that it can be changed in subsequent simulations. Define the material of the antenna as copper.

(3) Setting boundary conditions: Use the lumped port method to set the input and output of the antenna.

(4) Select the physics: Select the frequency domain physics of the electromagnetic field to simulate the propagation of electromagnetic waves and the response of the SRR open ring, ensuring that the appropriate electromagnetic physics equations are included in the model.

(5) Discretization mesh: Discretize the geometric model into a finite element mesh. The mesh is refined around the SRR opening ring to obtain more accurate results.

(6) Parametric sweep: Create parameters for the conductivity value of the SRR open ring and set the sweep range, for example, it can be set from 1 S/m to 80,000 S/m.

(7) Run simulation: Start the simulation process and run the simulation with different conductivity values in sequence. Each simulation will calculate the response of the SRR open ring and record the change of the characteristic frequency.

(8) Analysis and visualization: Analyze and visualize the results of each simulation, and draw the S11 echo curve to observe the changes in the characteristic peaks.

(9) It is concluded that conductivity has a significant effect on the peakness of the SRR open ring characteristic frequency. When the conductivity is greater than the preset conductivity, such as 10000 S/m, a more significant characteristic peak can be observed, which meets the actual monitoring and sensing needs.

Therefore, the embodiment of the present invention can obtain the stress concentration points or failure-prone points of the human bone anatomy based on the biomechanical finite element simulation of the human bone anatomy, so as to perform in-situ multi-degree-of-freedom laser processing of sensor circuits in specific areas.

In one embodiment of the present invention, the external device may include an antenna and a processing terminal, wherein the antenna is connected to the processing terminal, and when the antenna is close to the radio frequency tag circuit on the orthopedic implant, the resonance peak-peak degree and the resonance frequency are sensed at the radio frequency tag circuit, and the processing terminal analyzes the resonance peak-peak degree and/or the resonance frequency, and performs strain monitoring based on the analysis results.

The processing terminal may be a network vector analyzer, etc., which is not specifically limited here.

For example, when performing stress monitoring, the embodiment of the present invention can use an antenna as a receiver and connect it to a network vector analyzer. When the antenna is close to the RFID tag circuit on the orthopedic implant, a corresponding peak will appear at the resonant frequency. By analyzing the frequency, kurtosis and other information of the peak, the stress state of the orthopedic implant can be solved, thereby evaluating the bone healing condition.

Therefore, the embodiment of the present invention applies radio frequency identification technology to the mechanical state detection of bone implants, which has the advantages of passive sensing, small size, long life, good bio-identity, etc. In addition to identifying the change in the frequency of the characteristic peak of the tag, it can also identify It can distinguish the kurtosis change and has a wider range of applications. At the same time, it can also obtain more information to facilitate the next step of solution.

In one embodiment of the present invention, the package 13 can be a biocompatible and high dielectric constant material package protection made by depositing a layer of parylene by chemical vapor deposition, for example, polyparaxylene is deposited on the sensing surface by chemical deposition, vacuum evaporation, etc.

In one embodiment of the present invention, the material of the orthopedic implant body includes but is not limited to polyetheretherketone, carbon fiber reinforced polyetheretherketone or a composite material of polyetheretherketone and highly cross-linked polyethylene.

Specifically, polyetheretherketone is a polymer composed of repeating units containing one ketone bond and two ether bonds in the main chain structure. It is a special polymer material with high mechanical strength, high temperature resistance, impact resistance, flame retardancy, acid and alkali resistance, hydrolysis resistance, wear resistance, fatigue resistance, radiation resistance and good electrical properties.

Carbon fiber reinforced polyetheretherketone is a carbon fiber reinforced polyetheretherketone composite material, which concentrates the advantages of polyetheretherketone material and carbon fiber material. It is light in weight and has excellent mechanical properties, chemical corrosion resistance and biocompatibility. After being carbonized by a high-energy laser beam, this type of material can have high conductivity and stress response characteristics. The resin matrix has low electromagnetic interference, which makes it possible to directly convert orthopedic implants themselves into sensor devices.

The performance of highly cross-linked polyethylene (PE) can be greatly improved after cross-linking modification. It not only significantly improves the comprehensive properties of PE such as mechanical properties, environmental stress cracking resistance, chemical corrosion resistance, creep resistance and electrical properties, but also significantly improves the temperature resistance level.

In one embodiment of the present invention, the orthopedic implant includes one or more of an orthopedic intervertebral fusion cage, an orthopedic intramedullary nail, a posterior approach spinal fixation rod, an orthopedic bone plate, and a joint spacer.

It is understandable that the embodiments of the present invention can select different orthopedic implant body materials according to different orthopedic implants to better suit actual application scenarios.

Specifically, (1) polyetheretherketone is a thermoplastic resin with carbonyl and carboxyl groups linking aromatic rings, and highly cross-linked polyethylene is a chain polyethylene that is cross-linked into a three-dimensional structure by physical, chemical, irradiation and other methods. Carbon fiber reinforced polyetheretherketone has a higher elastic modulus and wear resistance, and is not suitable for direct use as a knee joint gasket. Highly cross-linked polyethylene has a low melting point and is difficult to carbonize due to its long chain structure. It is easy to form a molten state during laser processing, has large thermal deformation, and is non-conductive. The aromatic rings and carbonyl groups of polyetheretherketone are effectively carbonized under the high temperature of the laser to form a highly conductive network.

Therefore, the joint gasket can be made of a composite material of highly cross-linked polyethylene and polyetheretherketone, which enhances wear resistance while meeting hardness and mechanical strength requirements, and can realize laser direct processing of conductive patterns to prepare sensors. The composite material of polyetheretherketone and highly cross-linked polyethylene can combine the characteristics of the two materials, making the joint gasket easy to carbonize and having good physical properties, which can solve multiple problems of implant elastic modulus and conductive pattern preparation.

Joint gaskets can be used in joint prostheses. As shown in Figure 10, the joint prosthesis 20 includes: a first joint 21, a second joint 22 and a joint gasket 23. The joint gasket 23 in the joint prosthesis connects the first joint 21 and the second joint 23. The first joint and the second joint can be prepared by carbon fiber reinforced polyetheretherketone polymer. The outstanding characteristics of carbon fiber are high strength, high modulus and low density. It also has good fatigue resistance, excellent wear resistance and lubricity, good damping performance, good energy absorption and shock absorption performance, which can enhance the compactness of polyetheretherketone polymer, improve strength, load-bearing capacity and wear resistance, ensure its excellent performance and long service life, and enhance user experience.

Therefore, the elastic modulus of the joint prosthesis is similar to that of the bone, which reduces shielding and also enables in-situ preparation of the sensor unit. Applied to various joints of the human body, it provides patients with intelligent postoperative indicators and monitors the patient's postoperative condition in real time. It solves the problem that the related technology cannot produce joint prostheses with elastic modulus close to that of bones, resulting in a high stress shielding effect.

(2) The material of the orthopedic intervertebral fusion device can be polyetheretherketone or carbon fiber reinforced polyetheretherketone. Polyetheretherketone or carbon fiber reinforced polyetheretherketone has excellent biocompatibility and extremely high specific strength. Its surface can be modified by high-energy beam carbonization to achieve sensor etching. Taking carbon fiber reinforced polyetheretherketone as an example, carbon fiber reinforced polyetheretherketone is a carbon fiber reinforced polyetheretherketone composite material, which concentrates the advantages of polyetheretherketone material and carbon fiber material, is light in weight, and has excellent mechanical properties, chemical corrosion resistance and biocompatibility. Moreover, this type of material can have high conductivity and stress response characteristics after high-energy laser beam carbonization, and its resin matrix has low electromagnetic interference, which makes it possible to directly convert the orthopedic intervertebral fusion device itself into a sensor device.

Based on different injury locations, intervertebral fusion devices may include cervical fusion devices, posterior thoracolumbar fusion devices, lateral thoracolumbar fusion devices, lateral posterior thoracolumbar fusion devices, etc., which are orthopedic intervertebral fusion devices used to induce fusion between the upper and lower vertebrae into a whole. Therefore, it can be applicable to but not limited to cervical fusion, posterior thoracolumbar fusion, lateral thoracolumbar fusion, and lateral posterior thoracolumbar fusion surgeries, so as to achieve real-time monitoring of the surface strain caused by vertebral force during intervertebral fusion in different positions.

Specifically, intervertebral fusion devices are mainly used to treat spinal instability caused by spinal fractures and disc herniation; the intervertebral fusion device is implanted into the patient's defective spine through surgery, serving as a defective spinal prosthesis to assist the patient's spinal position in mechanical support and restore the mechanical stability of the spine; as the spinal bone defect is repaired, the intervertebral fusion device will fuse with the new bone tissue; during the process of spinal bone regeneration, changes in the stability of the intervertebral fusion device cause measurable changes in stress and strain, and the fusion process of the intervertebral fusion device can be monitored by monitoring the stress and strain of the intervertebral fusion device.

(3) The materials of orthopedic intramedullary nails, posterior approach spinal fixation rods and orthopedic plates can be carbon fiber reinforced polyetheretherketone. Carbon fiber reinforced polyetheretherketone is a carbon fiber reinforced polyetheretherketone composite material, which combines the advantages of polyetheretherketone and carbon fiber materials. It is lightweight and has excellent mechanical properties, chemical corrosion resistance and biocompatibility. After being carbonized by a high-energy laser beam, this type of material can have high conductivity and stress response characteristics, and its resin matrix has low electromagnetic interference, which makes it possible to directly convert the intramedullary nail itself, the posterior approach spinal fixation rod itself and the orthopedic plate itself into a sensor device.

Based on different fracture or injury locations, the intramedullary nail may include but is not limited to proximal femoral intramedullary nails, femoral intramedullary nails, tibial intramedullary nails, humeral intramedullary nails and other long intramedullary nails, so as to achieve real-time monitoring of the stress and strain conditions at the fracture ends at different locations.

The spinal fixation rod may include a uniaxial spinal fixation rod and/or a multiaxial spinal fixation rod, which is used for internal fixation of vertebral fractures, multiaxial and multi-segment internal fixation or minimally invasive vertebral surgery, so as to achieve real-time monitoring of the strain of the spinal fixation rod caused by spinal force during vertebral fracture healing and intervertebral fusion for different diseases.

According to different fracture injury locations and uses, as shown in Figure 11, the bone plate can be applicable to but not limited to the clavicle, proximal humerus, humeral shaft, medial and lateral distal humerus, ulna, radial shaft, distal radius, proximal femur, femoral shaft, distal femur, medial and lateral proximal tibia, tibial shaft, distal tibia, and distal fibula, and based on different plate and nail fixation principles, such as multi-angle locking, single-angle locking, dynamic compression and other schemes, the bone plate can include neutralization plates, support plates, anti-slip plates and bridging plates.

Specifically, intramedullary nails, posterior approach fixation rods and bone plates are all used for post-fracture fixation. Among them, intramedullary nails are mainly used for In the treatment of femoral shaft fractures, after the fracture site is anatomically reduced, the intramedullary nail is placed into the medullary cavity and locked with the bone screw; as the fracture heals, the proportion of the load shared by the bone increases, and the load on the intramedullary nail decreases; the posterior approach spinal fixation rod is mainly used for the treatment of vertebral fractures, usually from the back, and the fixation rod and vertebra are locked by screws to complete the anatomical fixation of the vertebral fracture position; the bone plate is mainly used for the treatment of long bone metaphyseal fractures, and the bone plate is implanted through surgery, and the bone screws are used to fix the bone plate and bone to achieve the connection of the bone plate to the broken bone. As the fracture heals, the load sharing of the bone plate decreases.

According to the orthopedic implant proposed in the embodiment of the present invention, a part of the surface of the orthopedic implant body can be converted into a radio frequency tag circuit with conductivity and sensing ability by in-situ carbonization. The strain force on the orthopedic implant is sensed by the radio frequency tag circuit and communicated with the outside of the body. The orthopedic implant body can be endowed with sensing and communication capabilities without destroying the original characteristics of the orthopedic implant body. Since the radio frequency tag circuit is obtained by in-situ carbonization, the bonding between the radio frequency tag circuit and the substrate is very strong, and there will be no problem of loose bonding over time, and there will be no problem of significantly increased resonant response frequency. The radio frequency tag circuit is excited by an external device, and there is no need to add circuits and power supplies to the orthopedic implant, thereby avoiding potential electrochemical reactions and not affecting perspective. The orthopedic implant body itself has biocompatibility, so there is no need to encapsulate the part other than the radio frequency tag circuit. The orthopedic implant body can be partially encapsulated using a biocompatible encapsulation body. The partial encapsulation simultaneously ensures biocompatibility and the stability of the radio frequency tag circuit, effectively reducing the difficulty and cost of the encapsulation. The partial encapsulation will not change the original size of the orthopedic implant, so the appearance of the orthopedic implant can be maintained without affecting surgical implantation, which is conducive to promotion and application.

Next, a strain monitoring system according to an embodiment of the present invention is described with reference to the accompanying drawings.

FIG. 12 is a block diagram of a strain monitoring system according to an embodiment of the present invention.

As shown in FIG. 12 , the strain monitoring system 30 includes an orthopedic implant 10 and an external device 31 .

Among them, the external device 31 obtains the resonance peak-to-peak degree and resonance frequency of the orthopedic implant 10, and performs strain monitoring based on the resonance peak-to-peak degree and/or resonance frequency, wherein the external device uses an antenna in vitro to transmit a signal to the bone implant, and the electromagnetic wave in the signal that is consistent with the characteristic frequency of the radio frequency tag circuit will form a trough in the echo, and the characteristic frequency of the radio frequency tag circuit is obtained through the characteristic frequency at the trough, and the strain information is calculated based on the characteristic frequency.

Specifically, the external device includes an antenna and a processing terminal, wherein the antenna is connected to the processing terminal. When the antenna is close to the radio frequency tag circuit on the orthopedic implant, the resonance peak-peak degree and resonance frequency are sensed at the radio frequency tag circuit. The processing terminal analyzes the resonance peak-peak degree and/or resonance frequency and performs strain monitoring based on the analysis results.

It should be noted that the above explanations of the orthopedic implant embodiment are also applicable to the strain monitoring system of this embodiment, and will not be repeated here.

The strain monitoring system proposed in the embodiment of the present invention is provided with the orthopedic implant of the above-mentioned embodiment, so strain monitoring can be achieved without adding circuits and power supplies to the orthopedic implant. This not only avoids potential electrochemical reactions, but also facilitates real-time detection of strain data information, and can provide technical support for achieving personalized health management of patients after surgery.

Based on the above embodiments, the present invention further proposes a method for processing an orthopedic implant, which is used for processing the orthopedic implant of the above embodiments.

FIG. 13 is a flow chart of a method for processing an orthopedic implant according to an embodiment of the present invention.

As shown in FIG13 , the processing method of the orthopedic implant comprises the following steps:

In step S101, the type of orthopedic implant and the material of the orthopedic implant body are obtained.

Among them, the types of orthopedic implants may include but are not limited to orthopedic intervertebral fusion devices, orthopedic intramedullary nails, posterior approach spinal fixation rods, orthopedic bone plates and joint gaskets; the materials of the orthopedic implant body include but are not limited to polyetheretherketone, carbon fiber reinforced polyetheretherketone or a composite material of polyetheretherketone and highly cross-linked polyethylene and other biocompatible materials.

In step S102, a label pattern of a radio frequency tag circuit is designed according to the type of the orthopedic implant and the material of the orthopedic implant body, and a processing parameter of the orthopedic implant is determined according to the label pattern and the material of the orthopedic implant body.

It can be understood that the embodiments of the present invention can comprehensively consider the type of orthopedic implant and the material of the orthopedic implant body to design the label pattern of the radio frequency tag circuit, so that the radio frequency tag circuit can better match the orthopedic implant, and determine the specific processing parameters based on the label pattern and the material of the orthopedic implant body to improve the processing accuracy.

In one embodiment of the present invention, the processing parameters of the orthopedic implant are determined according to the label pattern and the material of the orthopedic implant body, including: when the bone implant material is carbon fiber reinforced polyetheretherketone, nanosecond, picosecond, or femtosecond pulse laser processing with infrared, ultraviolet, or green wavelengths is used; when the bone implant material is polyetheretherketone, nanosecond, picosecond, or femtosecond pulse laser processing with infrared, ultraviolet, or green wavelengths is used; when the label pattern is a square or circular open ring, a first target processing speed and a second target processing speed are selected for carbon fiber reinforced polyetheretherketone and polyetheretherketone, respectively; when the label pattern is a toothed shape, a third target processing speed and a fourth target processing speed are selected for carbon fiber reinforced polyetheretherketone and polyetheretherketone, respectively, wherein the third target processing speed is greater than the first target processing speed, and the fourth target processing speed is greater than the second target processing speed; the resistance of the orthopedic implant and the kurtosis of the characteristic peak are obtained during the processing, and the processing parameters of the orthopedic implant are adjusted according to the resistance and the kurtosis of the characteristic peak.

Among them, the first target processing speed can be 50-200cm/min, the second target processing speed can be 40-100cm/min, the third target processing speed can be 10-50cm/min, and the fourth target processing speed can be 10-40cm/min. They can be selected according to actual conditions without specific limitation.

Specifically, when the bone implant material is carbon fiber reinforced polyetheretherketone, nanosecond, picosecond, or femtosecond pulse laser processing with wavelengths such as infrared, ultraviolet, or green light is used, and the processing parameters are a frequency of 60k-600kHz, a defocus distance of 0-7mm, and a processing speed of 10-200cm/min. When the bone implant material is polyetheretherketone, nanosecond, picosecond, or femtosecond pulse laser processing with wavelengths such as infrared, ultraviolet, or green light is used, and the processing parameters are a frequency of 60k-600kHz, a defocus distance of 3-10mm, and a processing speed of 10-100cm/min. When the label pattern is a square or circular open ring, because its lines are thicker, the processing speeds of 50-200cm/min and 40-100cm/min can be selected for carbon fiber reinforced polyetheretherketone and polyetheretherketone respectively to improve efficiency without affecting the conductor effect of the carbonized pattern; when the label pattern is serrated, because its lines are thinner, the processing speeds of 10-50cm/min and 10-40cm/min can be selected for carbon fiber reinforced polyetheretherketone and polyetheretherketone respectively to improve heat input, ensure the carbonization effect and the conductivity of the pattern, and then ensure the sensitivity of the label circuit when being read by the antenna.

In one embodiment of the present invention, a label pattern of a radio frequency tag circuit is designed according to the type of orthopedic implant and the material of the orthopedic implant body, including: determining the stress state of the corresponding bone according to the type of orthopedic implant; determining the characteristics of the orthopedic implant according to the material of the orthopedic implant body; and designing the label pattern of the radio frequency tag circuit according to the stress state of the bone and the characteristics of the orthopedic implant.

It is understandable that the embodiments of the present invention are different in type and material of orthopedic implants, so the application of bone The tag pattern of the RFID tag circuit designed according to the force state and the characteristics of the orthopedic implant is also different, so that the RFID tag circuit can be better matched with the orthopedic implant.

In one embodiment of the present invention, a label pattern of a radio frequency tag circuit is designed according to the stress state of the bone and the characteristics of an orthopedic implant, including: modeling the orthopedic implant to simulate the stress state after implantation into the human body; identifying the position where the strain force is greater than a preset value in the simulation result as the processing position of the radio frequency tag circuit; performing finite element simulation on the radio frequency tag circuit in combination with the size of the orthopedic implant, and adjusting the spacing and/or opening distance of the radio frequency tag circuit at the processing position according to the simulation result until the size and characteristic frequency of the radio frequency tag circuit meet the processing requirements of the orthopedic implant, and the characteristic peak of the radio frequency tag circuit is distinguished from the characteristic peak of human tissue and blood.

Among them, the preset value can be set based on actual conditions without specific limitation.

Specifically, the bone implant is first modeled in Comsol and other simulation software, and its stress state after implantation in the human body is simulated. The large strain position is selected as the processing part of the tag circuit to ensure the accuracy and reliability of strain monitoring. For bone implants of different types and materials, their elastic modulus, shape, and stress mode are different, resulting in changes in their maximum strain position. Therefore, it is necessary to simulate the strain states of different bone implants and determine the processing position of the tag circuit.

At the same time, finite element simulation of the effect of the tag circuit is carried out in combination with the size of the bone plate. It needs to meet two requirements: one is that its size is suitable for processing on bone implants, and the other is that the characteristic frequency of the processed pattern is clearly distinguishable from the characteristic peaks of human tissue and blood.

The antenna is modeled according to the size of the bone implant in simulation software such as Comsol, and the characteristic frequency simulation is performed by modifying parameters such as the ring spacing and opening distance. Finally, a tag circuit with a suitable characteristic frequency that can be processed on the bone plate is obtained.

On this basis, the embodiments of the present invention can customize sensors based on mechanical characteristics on bone implants with anatomical morphology. Since bone implants have anatomical morphology, such as the bone plate needs to adapt to the bone shape, the intervertebral fusion device needs to be close to the shape of the spine, etc., the surface is an irregular curved surface. According to the actual mechanical properties of human bones, there will be stress concentration in specific parts, so it is necessary to process stress and strain sensors in situ at this location. For bone implants with anatomical morphology, the stress concentration points are first analyzed through finite element simulation, and then the multi-degree-of-freedom laser processing technology is used to in-situ laser process the sensors at the parts to achieve the purpose of customization.

For example, since bone implants have anatomical morphology, it is necessary to obtain stress concentration points or failure-prone points of human bone anatomical morphology based on biomechanical finite element simulation of human bone anatomical morphology, so as to perform in-situ multi-degree-of-freedom laser processing sensor circuits in specific areas. Among them, orthopedic intervertebral fusion devices are mainly used to treat spinal instability caused by spinal fractures and disc herniation; since the intervertebral fusion device needs to adapt to the spine, its shape needs to be similar to the shape of the spine, and its surface is an irregular curved surface. Under different circumstances, stress concentration will exist in its specific parts. In addition, since the spine is the main axis of human movement, it is tightly surrounded and physiologically bent by multiple vertebrae, multiple joints (intervertebral "joints", facet joints), and numerous muscles and ligaments to meet the firmness and mobility (flexibility) of the spine. Its activities have three-dimensional directions (front and back, left and right, rotation) and six degrees of freedom (3 translations, 3 rotations). Therefore, it is necessary to use a multi-degree-of-freedom processing method to perform in-situ multi-degree-of-freedom laser processing sensor circuits in specific areas of the required stress concentration points or failure-prone points, so that the reader and network analyzer can receive stress signals from different radio frequency tag circuits.

In step S103, in-situ carbonization is performed on the target position on the surface of the orthopedic implant body according to the processing parameters to obtain a radio frequency tag circuit, and the surface of the tag circuit is packaged with a biocompatible packaging body.

It can be understood that after the radio frequency tag circuit is formed by in-situ carbonization in the embodiment of the present invention, since the orthopedic implant body itself has biocompatibility, there is no need to encapsulate the part other than the radio frequency tag circuit. The orthopedic implant body can be partially encapsulated using a biocompatible encapsulation body. The biocompatibility and stability of the radio frequency tag circuit are guaranteed by partial encapsulation, which effectively reduces the difficulty and cost of packaging. In addition, partial encapsulation will not change the original size of the orthopedic implant, so the appearance of the orthopedic implant can be maintained without affecting the surgical implantation, which is conducive to promotion and application.

In one embodiment of the present invention, the embodiment of the present invention performs in-situ carbonization on a target position on the surface of an orthopedic implant body according to processing parameters, including: planning a processing path for the surface of the orthopedic implant body; performing multi-degree-of-freedom processing according to the processing path through a laser, a focusing mirror, a multi-degree-of-freedom mechanical motion mechanism and a scanning galvanometer, wherein the scanning speed of the scanning galvanometer is greater than the movement speed of the multi-degree-of-freedom mechanical motion mechanism, the laser is focused on the surface of the orthopedic implant body through the focusing mirror, and the distance between the laser focusing plane and the area to be in-situ carbonized is controlled to achieve in-situ carbonization processing of any curved surface.

It should be noted that in order to achieve conformal processing, multi-degree-of-freedom processing is required. Specifically, a multi-degree-of-freedom mechanical motion mechanism can be combined with a scanning galvanometer to achieve higher processing efficiency. For processing in approximately planar areas, a scanning galvanometer with a scanning speed much faster than that of the multi-degree-of-freedom mechanical motion mechanism can be used. In areas with large surface curvature, processing is required through a scanning galvanometer combined with a mechanical motion structure. The surface trajectory is mainly planned offline through CAE (Computer Aided Engineering) path planning simulation to control the multi-degree-of-freedom mechanical equipment to achieve isotropic uniform-speed scanning of the laser on the surface and ensure that the laser optical axis is perpendicular to the surface in real time.

Specifically, the present invention can use one or more combinations of scanning galvanometers, robotic arms, multi-axis machine tools, cable-driven robots, etc. to adjust the spatial position of the laser or the position of the device to be carbonized or change the positions of both at the same time, so that the laser can be focused on any point on the surface of the device to be carbonized. The laser is focused on a certain point on the surface of the device to be carbonized through a focusing mirror, and the distance between the laser focusing mirror and the point to be carbonized is measured using a coaxial laser rangefinder, thereby controlling the distance between the laser focal plane and the surface to be carbonized during the processing.

The following will describe a method for processing an orthopedic implant through a specific embodiment, as shown in FIG14 , comprising the following steps:

(1) Design RFID tag circuits based on bone stress state and orthopedic implant characteristics;

(2) processing a label pattern of a radio frequency label circuit on the orthopedic implant body, and encapsulating the processed position of the orthopedic implant body;

(3) Place the processed orthopedic implants in the corresponding positions, such as knee cartilage prostheses, intramedullary nails, spinal fusion devices, etc., and use a reader and network analyzer in vitro to receive the stress signal of the RFID tag circuit, and post-process and medically evaluate the acquired sensor information.

Therefore, the embodiment of the present invention selects a suitable receiving antenna, and with the help of tools such as a network vector analyzer, it is possible to receive the signal of the passive bone implant sensor in vitro and resolve it to obtain the required information, thereby achieving the goal of real-time detection of the stress state during bone healing.

It should be noted that the above explanations of the orthopedic implant embodiment are also applicable to the orthopedic implant of this embodiment. The processing method will not be described here.

According to the processing method of orthopedic implants proposed in an embodiment of the present invention, a multi-degree-of-freedom laser processing method can be used to achieve carbonization processing of any curved surface, which is suitable for orthopedic implant devices with anatomical structures, thereby achieving in-situ laser processing of any area requiring carbonization processing.

FIG15 is a schematic diagram of the structure of a processing device provided by an embodiment of the present invention. The processing device may include:

Memory 1501 , processor 1502 , and a computer program stored in the memory 1501 and executable on the processor 1502 .

When the processor 1502 executes the program, the orthopedic implant processing method provided in the above embodiment is implemented.

Furthermore, the processing equipment also includes:

The communication interface 1503 is used for communication between the memory 1501 and the processor 1502 .

The memory 1501 is used to store computer programs that can be executed on the processor 1502 .

Memory 1501 may include high-speed RAM (Random Access Memory) memory, and may also include non-volatile memory, such as at least one disk storage.

If the memory 1501, the processor 1502 and the communication interface 1503 are implemented independently, the communication interface 1503, the memory 1501 and the processor 1502 can be connected to each other through a bus and communicate with each other. The bus can be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, only one thick line is used in FIG15, but it does not mean that there is only one bus or one type of bus.

Optionally, in a specific implementation, if the memory 1501, the processor 1502 and the communication interface 1503 are integrated on a chip, the memory 1501, the processor 1502 and the communication interface 1503 can communicate with each other through an internal interface.

Processor 1502 may be a CPU (Central Processing Unit), or an ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement an embodiment of the present invention.

An embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, and when the program is executed by a processor, the above-mentioned method for processing an orthopedic implant is implemented.

In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or N embodiments or examples in a suitable manner. In addition, those skilled in the art may refer to different embodiments or examples described in this specification and different embodiments or examples in detail without contradiction. features to combine and assemble.

In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "N" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or N executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present invention belong.

It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above embodiment, the N steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array, a field programmable gate array, etc.

A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims (14)

An orthopedic implant, comprising: Biocompatible orthopedic implant body; A radio frequency tag circuit formed by in-situ carbonization at a target position on the surface of the orthopedic implant body, wherein the radio frequency tag circuit cooperates with an external device to sense the resonance peak-peak degree and resonance frequency of the orthopedic implant when it is subjected to force and strain, and performs strain monitoring based on the resonance peak-peak degree and/or the resonance frequency; A biocompatible packaging body is used to package the surface of the tag circuit. The orthopedic implant according to claim 1 is characterized in that the shape of the radio frequency tag circuit is a square open ring, a multi-toothed open ring or a circular ring, wherein the radio frequency tag circuit detects the resonance peak peak and the resonance frequency based on the ring spacing and the opening spacing of the square open ring, the multi-toothed open ring or the circular ring. The orthopedic implant according to claim 2 is characterized in that it includes a multi-channel array, wherein the multi-channel array contains multiple radio frequency tag circuits, each radio frequency tag circuit is distinguished by a different characteristic frequency, and is arranged at a large strain position found during finite element simulation to obtain the spatial distribution of stress on the bone implant. The orthopedic implant according to claim 1 is characterized in that the orthopedic implant comprises one or more of an orthopedic intervertebral fusion cage, an orthopedic intramedullary nail, a posterior approach spinal fixation rod, an orthopedic bone plate and a joint spacer. The orthopedic implant according to claim 1, characterized in that the material of the orthopedic implant body is polyetheretherketone, carbon fiber reinforced polyetheretherketone or a composite material of polyetheretherketone and highly cross-linked polyethylene. A strain monitoring system, comprising: The orthopedic implant according to any one of claims 1 to 5; An external device, wherein the external device obtains the resonance peak-peak degree and the resonance frequency of the orthopedic implant, and performs strain monitoring based on the resonance peak-peak degree and/or the resonance frequency, wherein the external device transmits a signal to the bone implant using an antenna in vitro, and an electromagnetic wave in the signal that is consistent with the characteristic frequency of the radio frequency tag circuit forms a trough in the echo, and the characteristic frequency of the radio frequency tag circuit is obtained through the characteristic frequency at the trough, and the strain information is calculated based on the characteristic frequency. The strain monitoring system according to claim 6 is characterized in that the external device includes an antenna and a processing terminal, wherein the antenna is connected to the processing terminal, and when the antenna is close to the radio frequency tag circuit on the orthopedic implant, the resonant peak-to-peak degree and the resonant frequency are sensed at the radio frequency tag circuit, and the processing terminal analyzes the resonant peak-to-peak degree and/or the resonant frequency, and performs strain monitoring based on the analysis results. A method for processing an orthopedic implant, characterized in that the method is used for processing the orthopedic implant according to any one of claims 1 to 5, wherein the method comprises the following steps: Obtain the type of orthopedic implant and the material of the orthopedic implant body; Designing a label pattern of a radio frequency tag circuit according to the type of the orthopedic implant and the material of the orthopedic implant body, and determining processing parameters of the orthopedic implant according to the label pattern and the material of the orthopedic implant body; In-situ carbonization is performed on the target position on the surface of the orthopedic implant body according to the processing parameters to obtain a radio frequency tag circuit, and the surface of the tag circuit is packaged using a packaging body with biocompatibility. The method for processing an orthopedic implant according to claim 8, characterized in that the step of determining the processing parameters of the orthopedic implant according to the label pattern and the material of the orthopedic implant body comprises: When the bone implant material is carbon fiber reinforced polyetheretherketone, it is processed by nanosecond, picosecond, or femtosecond pulse laser with infrared, ultraviolet, or green wavelength; when the bone implant material is polyetheretherketone, it is processed by nanosecond, picosecond, or femtosecond pulse laser with infrared, ultraviolet, or green wavelength; When the label pattern is a square or circular open ring, the first target processing speed and the second target processing speed are selected for carbon fiber reinforced polyetheretherketone and polyetheretherketone respectively; when the label pattern is a toothed shape, the third target processing speed and the fourth target processing speed are selected for carbon fiber reinforced polyetheretherketone and polyetheretherketone respectively, wherein the third target processing speed is greater than the first target processing speed, and the fourth target processing speed is greater than the second target processing speed; The resistance and the kurtosis of the characteristic peak of the orthopedic implant during the processing are obtained, and the processing parameters of the orthopedic implant are adjusted according to the resistance and the kurtosis of the characteristic peak. The processing method of an orthopedic implant according to claim 8, characterized in that the tag pattern of the radio frequency tag circuit is designed according to the type of the orthopedic implant and the material of the orthopedic implant body, comprising: Determining the stress state of the corresponding bone according to the type of the orthopedic implant; Determining the characteristics of the orthopedic implant according to the material of the orthopedic implant body; The tag pattern of the radio frequency tag circuit is designed according to the stress state of the bone and the characteristics of the orthopedic implant. The method for processing an orthopedic implant according to claim 10, characterized in that the tag pattern of the radio frequency tag circuit is designed according to the stress state of the bone and the characteristics of the orthopedic implant, comprising: Modeling the orthopedic implant to simulate the stress state after implantation into the human body; Identify the position where the strain force in the simulation result is greater than a preset value as the processing position of the radio frequency tag circuit; Finite element simulation is performed on the radio frequency tag circuit in combination with the size of the orthopedic implant, and the spacing and/or opening distance of the radio frequency tag circuit at the processing position is adjusted according to the simulation results until the size and characteristic frequency of the radio frequency tag circuit meet the processing requirements of the orthopedic implant, and the characteristic peak of the radio frequency tag circuit is different from the characteristic peak of human tissue and blood. The method for processing an orthopedic implant according to claim 8, characterized in that the in-situ carbonization of the target position on the surface of the orthopedic implant body according to the processing parameters comprises: Planning a processing path for the surface of the orthopedic implant body; Multi-degree-of-freedom processing is performed according to the processing path through laser, focusing mirror, multi-degree-of-freedom mechanical motion mechanism and scanning galvanometer, wherein the scanning speed of the scanning galvanometer is greater than the movement speed of the multi-degree-of-freedom mechanical motion mechanism, the laser is focused on the surface of the orthopedic implant body through the focusing mirror, and the distance between the laser focusing plane and the area to be in-situ carbonized is controlled to realize in-situ carbonization processing of any curved surface. A processing device, characterized in that it includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the processing method of an orthopedic implant as described in any one of claims 8 to 12. A computer-readable storage medium having a computer program stored thereon, characterized in that the program is processed The device is executed to realize the processing method of the orthopedic implant as described in any one of claims 8 to 12.