WO2024013930A1 - Modeling system, processing system, modeling method, and processing method - Google Patents

Abstract

This modeling system comprises a modeling device that is capable of modeling a modeled article using an irradiation optical system with which the surface of an object can be irradiated with a modeling beam, a measurement device that is capable of measuring an emitted beam including at least one of the modeling beam and a guide beam, a movement device that causes the irradiation optical system and the measurement device to move relatively along a direction intersecting the optical axis of the irradiation optical system within a modeling period, and a control device that is capable of controlling the modeling device on the basis of the result of measurement of the emitted beam by the measurement device. The irradiation optical system includes a movement member that causes the emitted beam to move along a direction intersecting the optical axis of the irradiation optical system within the modeling period. The measurement device measures the emitted beam within a measurement period. The control device controls the movement member within the modeling period on the basis of the result of measuring the emitted beam within the measurement period.

Description

Molding system, processing system, modeling method and processing method

The present invention relates to the technical field of, for example, a modeling system and method that can create a shaped object on an object, and a processing system and method that can process an object.

An example of a processing system that can process objects is described in Patent Document 1. In particular, Patent Document 1 describes, as an example of a processing system, a modeling system that can create a shaped object on an object. One of the technical challenges for such processing systems is properly processing objects.

US Patent Application Publication No. 2016/0311059

According to the first aspect, the object includes an irradiation optical system capable of irradiating a modeling beam onto the surface of the object, and supplies a modeling material to a molten pool formed on the object by the modeling beam, thereby applying the modeling object to the object. a modeling device capable of modeling; a measuring device capable of measuring an emitted beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system; and a modeling period during which the modeling device forms the object. a moving device that relatively moves the irradiation optical system and the measuring device along a direction intersecting the optical axis of the irradiating optical system, and based on the measurement result of the emitted beam by the measuring device. and a control device capable of controlling the modeling apparatus, and the irradiation optical system is configured to emit light from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system during at least a part of the modeling period. The measuring device includes a moving member that moves the emitted beam on the measuring device, and the moving device moves the irradiation position of the ejected beam on the measuring device, and the moving device moves the emitted beam on the measuring device. The injection beam is measured during at least part of the measurement period during which one of the injection beams is moved, and the control device measures the injection beam during at least part of the modeling period based on the measurement result of the injection beam during the measurement period. A building system is provided that controls a moving member.

According to the second aspect, the first irradiation optical system includes a first irradiation optical system capable of irradiating the first shaping beam onto the surface of the object, and a second irradiation optical system capable of irradiating the second shaping beam onto the surface of the object; a modeling device capable of modeling a model on the object by supplying a modeling material to at least one molten pool formed by at least one of the first and second modeling beams; a first emitted beam including at least one of the first guide beams emitted from the irradiation optical system; and at least one of the second modeling beam and the second guide beam emitted from the second irradiation optical system. and a control device capable of controlling the modeling device based on a measurement result of at least one of the first and second injection beams by the measurement device. , the first irradiation optical system is configured such that an irradiation position of the first emitted beam moves on the object or on the measurement device along a direction intersecting an optical axis of the first irradiation optical system. , the second irradiation optical system includes a first deflection member that deflects the first emitted beam, and the second irradiation optical system is arranged such that the irradiation position of the second emitted beam is aligned with the second irradiation optical system on the object or on the measurement device. The control device includes a second deflection member that deflects the second emitted beam so as to move along a direction intersecting the optical axis of the system, and the control device includes a measurement result of the first emitted beam by the measurement device and the A modeling system is provided that controls at least one of the first deflection member and the second deflection member based on at least one of the measurement results of the second emitted beam by a measurement device.

According to the third aspect, the object includes an irradiation optical system capable of irradiating a modeling beam onto the surface of the object, and supplies a modeling material to a molten pool formed on the object by the modeling beam, thereby applying the modeling object to the object. a modeling device capable of modeling; a mounting member on which the object is mounted and rotatable around a rotational axis intersecting the optical axis of the irradiation optical system; a measurement device that is rotatable in a direction and capable of measuring an emitted beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system; and a measurement result of the emitted beam by the measurement device; Based on the above, there is provided a modeling system including a control device capable of controlling the modeling device.

According to the fourth aspect, the processing device includes an irradiation optical system capable of irradiating a processing beam onto the surface of an object, and a processing device capable of processing the object with the processing beam, and a processing beam emitted from the processing beam and the irradiation optical system. The irradiation optical system includes a measuring device capable of measuring an emitted beam including at least one of the guide beams, and a control device capable of controlling the processing device based on a measurement result of the ejected beam by the measuring device. includes a moving member that moves the exit beam emitted from the irradiation optical system along a direction intersecting the optical axis of the irradiation optical system, and the measuring device includes a moving member that moves the exit beam exiting from the irradiation optical system along a direction intersecting the optical axis of the irradiation optical system; A processing system is provided that measures the emitted beam during at least part of a measurement period during which the beam irradiation position is being moved.
a first irradiation optical system capable of irradiating a first processing beam onto the surface of an object; and a second irradiation optical system capable of irradiating a second processing beam onto the surface of the object; a processing device capable of processing the object with at least one of the first processing beam and the first processing beam including at least one of the first guide beam emitted from the first irradiation optical system; a measuring device capable of measuring each of a processing beam and a second emitted beam including at least one of a second guide beam emitted from the second irradiation optical system, and the first and second emitting beams by the measuring device; a control device capable of controlling the processing device based on at least one measurement result of the beam, and the first irradiation optical system is configured such that the irradiation position of the first emitted beam is on the optical axis of the first irradiation optical system. The second irradiation optical system includes a first deflection member that deflects the first emitted beam so as to move along a direction intersecting the second irradiation optical system. A processing system is provided that includes a second deflection member that deflects the second exit beam to move along a direction intersecting the optical axis of the second beam.

According to the sixth aspect, a processing device including an irradiation optical system capable of irradiating a processing beam onto a surface of an object and capable of processing the object with the processing beam; a mounting member rotatable around a rotation axis intersecting the optical axis of the system; and a mounting member arranged on the mounting member, rotatable around the rotation axis, and emitted from the processing beam and the irradiation optical system. A processing system is provided, comprising: a measuring device capable of measuring an ejected beam including at least one of the guide beams; and a control device capable of controlling the processing device based on a measurement result of the ejected beam by the measuring device. be done.

According to the seventh aspect, by supplying the modeling material to the molten pool formed on the object by the modeling beam using a modeling apparatus including an irradiation optical system capable of irradiating the modeling beam onto the surface of the object, forming a model on an object; using a measuring device to measure an emitted beam including at least one of the forming beam and a guide beam emitted from the irradiation optical system; and using the forming device. moving the irradiation optical system and the measuring device relative to each other along a direction intersecting the optical axis of the irradiation optical system during at least a part of the modeling period during which the object is modeled; moving the ejection beam emitted from the irradiation optical system along a direction intersecting the optical axis of the irradiation optical system during at least a part of the modeling period using a moving member included in the system; controlling the modeling device based on the measurement result of the beam, and measuring the injection beam includes moving the irradiation position of the injection beam on the measuring device using the moving member and Controlling the modeling device includes measuring the emitted beam during at least part of the measurement period during which at least one of the irradiation optical system and the measurement device is moved, and controlling the modeling device includes controlling the emitted beam during the measurement period. A modeling method is provided that includes controlling the moving member during at least a portion of the modeling period based on the measurement results.

According to the eighth aspect, a modeling device including a first irradiation optical system capable of irradiating a first modeling beam onto the surface of an object, and a second irradiation optical system capable of irradiating a second modeling beam onto the surface of the object. modeling a modeled object on the object by supplying a modeling material to at least one molten pool formed by at least one of the first and second modeling beams, and using a measuring device. , a first injection beam including at least one of the first modeling beam and a first guide beam emitted from the first irradiation optical system, and a first injection beam emitted from the second modeling beam and the second irradiation optical system. measuring each of the second emitted beams including at least one of the second guide beams, and using a first deflection member included in the first irradiation optical system and capable of deflecting the first emitted beam, moving the irradiation position of the first emitted beam on the object or the measuring device along a direction intersecting the optical axis of the first irradiation optical system; and the second irradiation optical system comprising: A second deflection member capable of deflecting the second emitted beam is used to direct the irradiation position of the second emitted beam to intersect the optical axis of the second irradiation optical system on the object or on the measuring device. and controlling the modeling device based on a measurement result of at least one of the first and second emitted beams, and controlling the modeling device includes moving the modeling device along a direction in which the Provided is a modeling method comprising controlling at least one of the first deflection member and the second deflection member based on at least one of a measurement result of the first injection beam and a measurement result of the second injection beam by the measuring device. be done.

According to the ninth aspect, a molten pool formed on the object by the shaping beam is formed by using a shaping apparatus including an irradiation optical system capable of irradiating the shaping beam onto the surface of the object placed on the mounting member. By supplying a modeling material, a modeled object is modeled on the object, and at least out of the modeling beam and the guide beam emitted from the irradiation optical system is measuring an emitted beam including one; rotating the mounting member around a rotation axis intersecting the optical axis of the irradiation optical system to rotate the measuring device around the rotation axis; A modeling method is provided that includes controlling the modeling apparatus based on a measurement result of an emitted beam.

According to the tenth aspect, processing the object using a processing device including an irradiation optical system capable of irradiating the processing beam onto the surface of the object, and processing the processing beam and the irradiation optical system using a measuring device. measuring the emitted beam including at least one of the guide beams emitted from the system; and using a moving member included in the irradiation optical system, the irradiation along the direction intersecting the optical axis of the irradiation optical system. The method includes moving the ejected beam emitted from the optical system and controlling the processing device based on a measurement result of the ejected beam, and measuring the ejected beam uses the moving member. A processing method is provided that includes measuring the ejected beam during at least part of a measurement period in which the irradiation position of the ejected beam is moved on the measuring device.

According to the eleventh aspect, the processing apparatus includes a first irradiation optical system capable of irradiating a first processing beam onto the surface of the object, and a second irradiation optical system capable of irradiating the second processing beam onto the surface of the object. a first processing beam including at least one of the first processing beam and a first guide beam emitted from the first irradiation optical system; and a second processing beam. and a second emitted beam including at least one of the second guide beams emitted from the second irradiation optical system; moving the irradiation position of the first emitted beam along a direction intersecting the optical axis of the first irradiation optical system using a deflectable first deflection member, and the second irradiation optical system comprising: and moving the irradiation position of the second emitted beam along a direction intersecting the optical axis of the second irradiation optical system using a second deflection member capable of deflecting the second emitted beam; A processing method is provided that includes controlling the processing apparatus based on measurement results of at least one of the first and second emitted beams.

According to the twelfth aspect, the object is processed using a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of the object placed on the mounting member; measuring an emitted beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system using a disposed measurement device; and a rotation axis intersecting the optical axis of the irradiation optical system. A processing method is provided, which includes: rotating the mounting member around the rotation axis to rotate the measurement device around the rotation axis; and controlling the processing device based on a measurement result of the injection beam. Ru.

The operation and other advantages of the present invention will become clear from the following detailed description.

FIG. 1 is a sectional view showing the appearance of the processing system of this embodiment. FIG. 2 is a sectional view showing the configuration of the processing system of this embodiment. FIG. 3 is a block diagram showing the configuration of the processing system of this embodiment. FIG. 4 is a cross-sectional view showing the configuration of the irradiation optical system. FIG. 5(a) is a plan view showing the movement trajectory of the target irradiation area within the processing unit area, and FIG. 5(b) is a plan view showing the movement trajectory of the target irradiation area on the modeling surface. . Each of FIGS. 6(a) and 6(b) is a plan view showing the movement locus of the target irradiation area within the processing unit area, and FIG. 6(c) is a plan view showing the movement locus of the target irradiation area on the modeling surface. FIG. 3 is a plan view showing a movement trajectory. FIG. 7(a) is a top view showing the configuration of the calibration unit, and FIGS. 7(b) and 7(c) are cross-sectional views showing the configuration of the calibration unit (FIG. 7(a)). AA' sectional view). FIG. 8 is a sectional view showing the calibration unit located at a non-measurement position. FIG. 9(a) is a sectional view showing the calibration unit located at the non-measurement position, and FIG. 9(b) is a sectional view showing the calibration unit located at the measurement position. Each of FIGS. 10(a) to 10(d) is a plan view showing an example of a mark formed on the calibration unit. Each of FIGS. 11(a) to 11(e) is a cross-sectional view showing a situation in which a certain area on a workpiece is irradiated with processing light and a modeling material is supplied. FIG. 12(a) is a plan view showing the target movement trajectory of the processing unit area, and FIG. 12(b) is a plan view showing the target movement trajectory of the processing unit area, and FIG. FIG. 3 is a plan view showing a linear shaped object formed on a surface. Each of FIGS. 13(a) to 13(c) is a cross-sectional view showing the process of modeling a three-dimensional structure. FIG. 14 is a sectional view showing an example of a position measuring device. FIG. 15 is a cross-sectional view showing the probe in contact with the reference surface of the calibration unit. FIG. 16 is a sectional view showing another example of the position measuring device. FIG. 17 is a plan view showing an example of a target movement locus of processing light on a search mark. FIG. 18 is a waveform diagram showing the result of receiving processing light via a search mark. FIG. 19 is a plan view showing an example of a target movement locus of processing light on a search mark. FIG. 20 is a plan view showing processing light passing across a slit mark. FIG. 21 is a waveform diagram showing the result of receiving processing light through a slit mark. FIG. 22 is a graph showing the spot diameter of processing light. FIG. 23 is a plan view showing processing light irradiated onto a pinhole mark. FIG. 24 is a waveform diagram showing the result of receiving processing light through a pinhole mark. FIG. 25 is a plan view showing the amount of deviation in the irradiation position of processing light. FIG. 26 is a plan view showing processing light applied to the slit mark. FIG. 27 is a plan view showing processing light applied to the slit mark. Each of FIGS. 28(a) and 28(b) is a waveform chart showing the result of reception of processing light through a slit mark. FIG. 29 is a cross-sectional view showing processing light applied to the first calibration unit. 30(a) and 30(b) each conceptually shows the flow of the abnormality determination operation. FIG. 31 is a cross-sectional view showing the configuration of the irradiation optical system in the first modification. FIG. 32(a) is a top view showing the configuration of the calibration unit in the first modification, and FIG. 32(b) is a sectional view showing the configuration of the calibration unit in the first modification. Each of FIGS. 33(a) and 33(b) is a cross-sectional view showing the arrangement position of the calibration unit in the second modification. Each of FIGS. 34(a) and 34(b) is a cross-sectional view showing the arrangement position of the calibration unit in the third modification.

Hereinafter, embodiments of a modeling system, a processing system, a modeling method, and a processing method will be described with reference to the drawings. Below, embodiments of a modeling system, a processing system, a modeling method, and a processing method will be described using a processing system SYS that can process a workpiece W, which is an example of an object. In particular, embodiments of a modeling system, a processing system, a modeling method, and a processing method will be described below using a processing system SYS that performs additional processing based on laser metal deposition (LMD). Additional processing based on the laser metallization welding method melts the modeling material M supplied to the workpiece W with processing light EL (that is, an energy beam in the form of light), so that the material M that is integrated with the workpiece W or the workpiece W This is an additive process that creates a model that can be separated from the original. In this case, if the processing system SYS is capable of printing a shaped object, the processing system SYS may be referred to as a printing system.

Furthermore, in the following description, the positional relationships of various components constituting the processing system SYS will be explained using an XYZ orthogonal coordinate system defined by mutually orthogonal X, Y, and Z axes. In the following explanation, for convenience of explanation, each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction within a horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction perpendicular to the horizontal plane). (and substantially in the vertical direction). Further, the rotation directions (in other words, the tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Further, the XY plane may be set in the horizontal direction. Note that the positional relationship is a concept that includes not only a positional relationship regarding at least one of the X-axis direction, Y-axis direction, and Z-axis direction, but also a positional relationship (posture relationship) regarding at least one of the θx direction, θY direction, and θZ direction. It may be.

(1) Configuration of processing system SYS
(1-1) Overall configuration of machining system SYS First, the configuration of the machining system SYS of this embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a perspective view schematically showing the appearance of the processing system SYS of this embodiment. FIG. 2 is a sectional view schematically showing the configuration of the processing system SYS of this embodiment. FIG. 3 is a system configuration diagram showing the system configuration of the processing system SYS of this embodiment.

The processing system SYS is capable of performing additional processing on the workpiece W. The processing system SYS can form a molded object that is integrated with (or is separable from) the workpiece W by performing additional processing on the workpiece W. In this case, the additional processing performed on the work W corresponds to processing that adds to the work W a shaped object that is integrated with (or separable from) the work W. Note that the modeled object in this embodiment may mean any object modeled by the processing system SYS. For example, the processing system SYS uses a three-dimensional structure (that is, a three-dimensional structure that has a size in any three-dimensional direction) as an example of a modeled object. , a structure having dimensions in the Y-axis direction and the Z-axis direction) ST can be modeled.

When the workpiece W is a stage 31 described later, the processing system SYS can perform additional processing on the stage 31. When the work W is a placed object, which is an object placed on the stage 31, the processing system SYS can perform additional processing on the placed object. The object placed on the stage 31 may be another three-dimensional structure ST (that is, an existing structure) modeled by the processing system SYS. Note that FIGS. 1 and 2 show an example in which the workpiece W is an existing structure placed on a stage 31. Further, the explanation will be continued below using an example in which the workpiece W is an existing structure placed on the stage 31.

The workpiece W may be an item that requires repair and has a defective part. In this case, the processing system SYS may perform repair processing to repair the item requiring repair by performing additional processing to form a modeled object to compensate for the missing portion. That is, the additional processing performed by the processing system SYS may include additional processing that adds a shaped object to the workpiece W to compensate for a missing portion.

As described above, the processing system SYS is capable of performing additional processing based on the laser overlay welding method. In other words, the processing system SYS can be said to be a 3D printer that processes objects using layered processing technology. Note that the layered processing technology may also be referred to as rapid prototyping, rapid manufacturing, or additive manufacturing. Note that the laser deposition welding method (LMD) may also be referred to as DED (Directed Energy Deposition).

The processing system SYS using the lamination processing technique forms a three-dimensional structure ST in which the plurality of structural layers SL are stacked by sequentially forming a plurality of structural layers SL (see FIG. 13 described later). In this case, the processing system SYS first sets the surface of the workpiece W as a modeling surface MS for actually modeling the object, and models the first structural layer SL on the modeling surface MS. After that, the processing system SYS sets the surface of the first structural layer SL as a new modeling surface MS, and models the second structural layer SL on the new modeling surface MS. Thereafter, the processing system SYS repeats the same operation to form a three-dimensional structure ST in which a plurality of structural layers SL are stacked.

The processing system SYS performs additional processing by processing the modeling material M using the processing light EL, which is an energy beam. The modeling material M is a material that can be melted by irradiation with processing light EL having a predetermined intensity or higher. As such a modeling material M, for example, at least one of a metallic material and a resinous material can be used. Examples of the metallic material include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, as the modeling material M, other materials different from metal materials and resin materials may be used. The modeling material M is a powder material. That is, the modeling material M is a powder. However, the modeling material M may not be a powder. For example, as the modeling material M, at least one of a wire-shaped modeling material and a gaseous modeling material may be used.

Similarly to the modeling material M, the workpiece W may also be an object containing a material that can be melted by irradiation with the processing light EL having a predetermined intensity or higher. The material of the work W may be the same as the modeling material M, or may be different. As the material of the workpiece W, for example, at least one of a metallic material and a resinous material can be used. Examples of the metallic material include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, as the material of the workpiece W, other materials different from the metallic material and the resinous material may be used.

In order to perform additive processing, the processing system SYS includes a material supply source 1, a processing unit 2, a stage unit 3, a light source 4, a gas supply source 5, and a control unit, as shown in FIGS. 1 to 3. 7 and a calibration unit 8. The processing unit 2 and the stage unit 3 may be housed in a chamber space 63IN inside the housing 6. In this case, the processing system SYS may perform additional processing in the chamber space 63IN. Note that the processing system SYS does not need to include at least one of the stage unit 3 and the housing 6.

A material supply source 1 supplies a modeling material M to a processing unit 2. The material supply source 1 supplies a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time to perform additional processing is supplied to the processing unit 2. do.

The processing unit 2 processes the modeling material M supplied from the material supply source 1 to create a modeled object. In order to model a modeled object, the processing unit 2 includes a processing head 21 and a head drive system 22. Further, the processing head 21 includes an irradiation optical system 211 and a plurality of material nozzles 212. However, the processing head 21 may include a plurality of irradiation optical systems 211. Processing head 21 may include a single material nozzle 212. Note that the processing head 21 may be referred to as a processing device or a modeling device.

The irradiation optical system 211 is an optical system for emitting processing light EL. Specifically, the irradiation optical system 211 is optically connected to the light source 4 that emits (generates) the processing light EL via the light transmission member 41. An example of the optical transmission member 41 is at least one of an optical fiber and a light pipe.

In the example shown in FIGS. 1 to 3, the processing system SYS includes two light sources 4 (specifically, light sources 4#1 and 4#2), and the irradiation optical system 211 includes a light transmission member 41#1. and 41#2, they are optically connected to light sources 4#1 and 4#2, respectively. The irradiation optical system 211 receives processing light EL propagating from the light source 4#1 via the light transmission member 41#1 and processing light EL propagating from the light source 4#2 via the light transmission member 41#2. and eject both. In the following explanation, when it is necessary to distinguish between the two processing lights EL emitted by the irradiation optical system 211, the processing light EL generated by the light source 4#1 may be referred to as "processing light EL" as necessary. #1", and the processing light EL generated by the light source 4#2 is called "processing light EL#2". On the other hand, unless otherwise specified, "processing light EL" means at least one of processing light EL#1 and EL#2.

However, the processing system SYS may include a single light source 4 instead of the plurality of light sources 4. The irradiation optical system 211 may emit a single processing light EL instead of emitting a plurality of processing lights EL.

The irradiation optical system 211 emits the processing light EL downward (that is, to the −Z side). A stage 31 is arranged below the irradiation optical system 211. When the work W is placed on the stage 31, the irradiation optical system 211 irradiates the molding surface MS with the emitted processing light EL. Specifically, the irradiation optical system 211 applies the processing light to a target irradiation area (target irradiation position) EA that is set on the modeling surface MS as an area where the processing light EL is irradiated (typically, focused). It is possible to irradiate with EL. In the following explanation, if it is necessary to distinguish between two target irradiation areas EA on which the irradiation optical system 211 irradiates the two processing lights EL, the irradiation optical system 211 may change the processing light EL as necessary. The target irradiation area EA where the processing light EL#1 is irradiated is referred to as the "target irradiation area EA#1", and the target irradiation area EA where the irradiation optical system 211 irradiates the processing light EL#2 is referred to as the "target irradiation area EA#2". ”. Furthermore, the state of the irradiation optical system 211 is switchable under the control of the control unit 7 between a state in which the target irradiation area EA is irradiated with the processed light EL and a state in which the target irradiation area EA is not irradiated with the processed light EL. It is. Note that the direction of the processing light EL emitted from the irradiation optical system 211 is not limited to directly below (that is, coincident with the −Z-axis direction), but may be, for example, a direction tilted by a predetermined angle with respect to the Z-axis. Good too. In other words, the third optical system 216 (or the fθ lens 2162 described below), which will be described later, is not limited to an optical system that is telecentric on the object side, but may be an optical system that is non-telecentric on the object side.

The irradiation optical system 211 may form a molten pool MP on the modeling surface MS by irradiating the processing light EL to the modeling surface MS. For example, the irradiation optical system 211 may form the molten pool MP#1 on the modeling surface MS by irradiating the processing light EL#1 onto the modeling surface MS. For example, the irradiation optical system 211 may form the molten pool MP#2 on the modeling surface MS by irradiating the processing light EL#2 onto the modeling surface MS. Molten pool MP#1 and molten pool MP#2 may be integrated. When molten pool MP#1 and molten pool MP#2 are integrated, a single molten pool MP is formed on the modeling surface MS by irradiation with processing light EL#1 and EL#2. It may be considered as Alternatively, molten pool MP#1 and molten pool MP#2 may be separated from each other. However, the molten pool MP#1 may not be formed on the modeling surface MS by the irradiation with the processing light EL#1. The molten pool MP#2 may not be formed on the modeling surface MS by the irradiation with the processing light EL#2.

The material nozzle 212 supplies (for example, injects, jets, squirts, or sprays) the modeling material M. The material nozzle 212 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixing device 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixing device 12 . The material nozzle 212 may force-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and the transport gas (that is, a pressurized gas, for example, an inert gas such as nitrogen or argon) are mixed in the mixing device 12 and then passed through the supply pipe 11. The material may be pumped through the material nozzle 212 . As a result, the material nozzle 212 supplies the modeling material M together with the transport gas. As the transport gas, for example, purge gas supplied from the gas supply source 5 is used. However, as the transport gas, a gas supplied from a gas supply source different from the gas supply source 5 may be used. In addition, although the material nozzle 212 is drawn in a tube shape in FIG. 2, the shape of the material nozzle 212 is not limited to this shape. The material nozzle 212 supplies the modeling material M downward (that is, to the -Z side). A stage 31 is arranged below the material nozzle 212. When the workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the modeling surface MS. Although the direction in which the modeling material M supplied from the material nozzle 212 is inclined at a predetermined angle (for example, an acute angle) with respect to the Z-axis direction, even if it is on the −Z side (that is, directly below) good.

In the present embodiment, the material nozzle 212 applies the modeling material M to a position where at least one of the processing lights EL#1 and EL#2 is irradiated (that is, at least one of the target irradiation areas EA#1 and EA#2). supply For this reason, the target supply area MA, which is set on the modeling surface MS as the area where the material nozzle 212 supplies the modeling material M, is configured to at least partially overlap with at least one of the target irradiation areas EA#1 and EA#2. , the material nozzle 212 and the irradiation optical systems 211#1 and 211#2 are aligned. The size of the target supply area MA may be larger than, smaller than, or the same as the size of at least one of the target irradiation areas EA#1 and EA#2.

The material nozzle 212 may supply the modeling material M to the molten pool MP. Specifically, the material nozzle 212 may supply the modeling material M to at least one of the molten pool MP#1 and the molten pool MP#2. However, the material nozzle 212 does not have to supply the modeling material M to the molten pool MP. For example, the processing system SYS melts the modeling material M from the material nozzle 212 with the processing light EL emitted from the irradiation optical system 211 before the modeling material M reaches the workpiece W, and transfers the melted modeling material M to the workpiece W. It may be attached to W.

The irradiation optical system 211 and the material nozzle 212 may be housed in a head housing 213 included in the processing head 21. The head housing 213 is a housing in which a housing space for housing the irradiation optical system 211 and the material nozzle 212 is formed. In this case, the irradiation optical system 211 and the material nozzle 212 may be housed in a housing space inside the head housing 213.

The head drive system 22 moves the processing head 21 under the control of the control unit 7. That is, the head drive system 22 moves the irradiation optical system 211 and the material nozzle 212 under the control of the control unit 7. The head drive system 22 moves the processing head 21 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction, for example. Note that the operation of moving the processing head 21 along at least one of the θX direction, θY direction, and θZ direction includes the rotational axis along the X-axis, the Y-axis, and the Z-axis. It may be considered that the operation is equivalent to rotating the processing head 21 around at least one rotation.

In the example shown in FIG. 1, the head drive system 22 moves the processing head 21 along the X-axis direction and the Z-axis direction. In this case, the head drive system 22 is attached to (or formed on) a column 221, which is a wall-shaped member extending upward along the Z-axis direction from the bed 30, which is the base of the stage unit 3, and the column 221, for example. an X guide member 222 extending along the X-axis direction; an X block member 223 attached to the X guide member 222 and movable along the X guide member 222; and a drive for moving the X block member 223. A servo motor 224 that generates a force, a Z guide member 225 that is attached to (or formed on) the X block member 223 and extends along the Z-axis direction, and a Z guide member 225 that is attached to the Z guide member 225 and extends along the Z guide member 225. The Z-block member 226 may be movable, and a servo motor 227 that generates a driving force for moving the Z-block member 226 may be provided.

The processing head 21 may be attached to the Z block member 226. Specifically, the head housing 213 of the processing head 21 may be attached to the Z block member 226. As a result, the processing head 21 moves in the X-axis direction as the X-block member 223 moves, and moves in the Z-axis direction as the Z-block member 226 moves. That is, as the position of the X block member 223 in the X-axis direction changes, the position of the processing head 21 in the X-axis direction changes, and as the position of the Z-block member 226 in the Z-axis direction changes, the position of the processing head 21 in the Z-axis direction changes. The position of the processing head 21 in is changed.

When the head drive system 22 moves the processing head 21, the relative positional relationship between the processing head 21, the stage 31, and the work W placed on the stage 31 changes. As a result, the relative positional relationship between each of the stage 31 and the workpiece W and the irradiation optical system 211 included in the processing head 21 changes. Therefore, the head drive system 22 may be considered to function as a position changing device that can change the relative positional relationship between the stage 31 and the workpiece W, and the irradiation optical system 211. The head drive system 22 may be considered to function as a moving device that can relatively move each of the stage 31 and the workpiece W and the irradiation optical system 211. The head drive system 22 may be considered to function as a moving device that can move the irradiation optical system 211 with respect to each of the stage 31 and the workpiece W. Furthermore, when the relative positional relationship between the stage 31 and the workpiece W and the processing head 21 changes, the distance between the workpiece W and each of the target irradiation areas EA#1 and EA#2 and the target supply area MA changes. Relative positions also change. In other words, the target irradiation areas EA#1 and EA#2 and the target supply area MA are arranged in the X-axis direction and the Y-axis on the surface of the workpiece W (more specifically, the modeling surface MS on which additional processing is performed). direction, along at least one of the Z-axis direction, the θX direction, the θY direction, and the θZ direction. In this case, the head drive system 22 may be considered to be moving the processing head 21 so that each of the target irradiation areas EA#1 and EA#2 and the target supply area MA moves on the modeling surface MS. .

The stage unit 3 includes a bed 30, a stage 31, and a stage drive system 32.

A workpiece W is placed on the stage 31. Specifically, the workpiece W is placed on the workpiece placement surface 311, which is one surface of the stage 31 (for example, the upper surface facing the +Z side). Therefore, the stage 31 may be referred to as a mounting member. The stage 31 can support a work W placed on the stage 31. The stage 31 may be able to hold the work W placed on the stage 31. In this case, the stage 31 may include at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, etc. to hold the workpiece W. Alternatively, the stage 31 does not need to be able to hold the work W placed on the stage 31. In this case, the work W may be placed on the stage 31 without a clamp. Further, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The above-mentioned irradiation optical system 211 emits each of the processing lights EL#1 and EL#2 during at least part of the period during which the workpiece W is placed on the stage 31. Furthermore, the material nozzle 212 described above supplies the modeling material M during at least part of the period when the work W is placed on the stage 31.

The stage drive system 32 moves the stage 31. The stage drive system 32 moves the stage 31 along at least one of the X axis, Y axis, Z axis, θX direction, θY direction, and θZ direction, for example. Note that the operation of moving the stage 31 along at least one of the θX direction, θY direction, and θZ direction includes a rotation axis along the X axis (that is, the A axis) and a rotation axis along the Y axis (that is, the B axis). This may be considered to be equivalent to the operation of rotating the stage 31 around at least one of the rotation axis (that is, the C axis) and the rotation axis along the Z axis (in other words, the C axis).

In this embodiment, the stage drive system 32 may rotate the stage 31 at least around a desired rotation axis. In particular, the stage drive system 32 may rotate the stage 31 around a rotation axis intersecting the optical axis EX of the irradiation optical system 211. In the examples shown in FIGS. 1 to 3, the optical axis EX of the irradiation optical system 211 is an axis along the Z-axis. For this reason, the stage drive system 32 may rotate the stage 31 around at least one of the A axis and the B axis.

In the example shown in FIG. 1, the stage drive system 32 moves the stage 31 along the Y-axis direction and rotates the stage 31 around the respective rotation axes of the A-axis and the C-axis. In this case, the stage drive system 32 includes, for example, a Y guide member 321 that is attached to (or formed on) the bed 30 and extends along the Y-axis direction, and a Y guide member 321 that is attached to the Y guide member 321 and extends along the Y guide member 321. a trunnion (Y block member) 322 that is movable, a servo motor 323 that generates a driving force for moving the trunnion 322, and a cradle that is attached to the trunnion 322 and that is rotatable around the A axis relative to the trunnion 322. 324 and a servo motor (not shown) that generates a driving force for rotating the cradle 324. The stage 31 may be attached to the cradle 324 so as to be rotatable around the C-axis relative to the cradle 324 using a driving force generated by a servo motor (not shown). As a result, the stage 31 moves in the Y-axis direction in accordance with the movement of the trunnion 322, rotates around the A-axis in accordance with the rotation of the cradle 324, and rotates around the C-axis.

It may be assumed that the workpiece W is placed on the stage drive system 32 that moves the stage 31 via the stage 31. For example, it may be assumed that the work W is placed on the cradle 324 to which the stage 31 is attached via the stage 31. Therefore, like the stage 31, the components of the stage drive system 32 (for example, the cradle 324) may also be referred to as mounting members.

When the stage drive system 32 moves the stage 31, the relative positional relationship between the processing head 21, the stage 31, and the workpiece W changes. As a result, the relative positional relationship between each of the stage 31 and the workpiece W and the irradiation optical system 211 included in the processing head 21 changes. Therefore, like the head drive system 22, the stage drive system 32 functions as a position change device that can change the relative positional relationship between the stage 31 and the workpiece W, and the irradiation optical system 211. It may be considered as The stage drive system 32 may be considered to function as a moving device that can relatively move each of the stage 31 and the workpiece W and the irradiation optical system 211. The stage drive system 32 may be considered to function as a moving device capable of moving each of the stage 31 and the workpiece W with respect to the irradiation optical system 211. Furthermore, when the relative positional relationship between each of the stage 31 and the workpiece W and the processing head 21 changes, the difference between each of the target irradiation areas EA#1 and EA#2 and the target supply area MA and the workpiece W changes. Relative positions also change. In other words, each of the target irradiation areas EA#1 and EA#2 and the target supply area MA is arranged in the X-axis direction, the Y-axis direction, and the Z-axis direction on the surface of the workpiece W (more specifically, the modeling surface MS). , along at least one of the θX direction, the θY direction, and the θZ direction. In this case, the stage drive system 32 may be considered to be moving the stage 31 so that each of the target irradiation areas EA#1 and EA#2 and the target supply area MA moves on the modeling surface MS.

The light source 4 emits, for example, at least one of infrared light, visible light, and ultraviolet light as processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include a plurality of pulsed lights (that is, a plurality of pulsed beams). The processing light EL may be a laser beam. In this case, the light source 4 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD). Examples of the laser light source include a fiber laser, a CO ₂ laser, a YAG laser, an excimer laser, etc. However, the processing light EL does not need to be a laser beam.The light source 4 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp). May contain.

As described above, the processing system SYS includes a plurality of light sources 4 (specifically, light sources 4#1 and 4#2). In this case, the characteristics of the processing light EL#1 emitted by the light source 4#1 and the characteristics of the processing light EL#2 emitted by the light source 4#2 may be the same. For example, the wavelength of processing light EL#1 (typically, the peak wavelength that is the wavelength at which the intensity is maximum in the wavelength band of processing light EL#1) and the wavelength of processing light EL#2 (typically, peak wavelength) may be the same. For example, the wavelength band of the processing light EL#1 (typically, the range of wavelengths where the intensity is a certain value or more) and the wavelength band of the processing light EL#2 may be the same. For example, the intensity of processing light EL#1 and the intensity of processing light EL#2 may be the same. For example, the absorption rate of the workpiece W to the processing light EL#1 (or an object whose surface is the modeling surface MS, the same applies hereinafter) may be the same as the absorption rate of the workpiece W to the processing light EL#2. . In particular, the absorption rate of the workpiece W with respect to the peak wavelength of the processing light EL#1 and the absorption rate of the workpiece W with respect to the peak wavelength of the processing light EL#2 may be the same. Alternatively, the characteristics of the processing light EL#1 emitted by the light source 4#1 and the characteristics of the processing light EL#2 emitted by the light source 4#2 may be different. For example, the wavelength (typically, peak wavelength) of processing light EL#1 and the wavelength (typically, peak wavelength) of processing light EL#2 may be different. For example, the wavelength band of processing light EL#1 and the wavelength band of processing light EL#2 may be different. For example, the intensity of processing light EL#1 and the intensity of processing light EL#2 may be different. For example, the absorption rate of the workpiece W to the processing light EL#1 and the absorption rate of the workpiece W to the processing light EL#2 may be different. In particular, the absorption rate of the workpiece W with respect to the peak wavelength of the processing light EL#1 and the absorption rate of the workpiece W with respect to the peak wavelength of the processing light EL#2 may be different.

Note that in this embodiment, an example in which the processing system SYS includes a plurality of light sources 4 is described. However, the processing system SYS does not need to include the plurality of light sources 4. The processing system SYS does not need to include a single light source 4. As an example, the processing system may include, as a single light source 4, a light source that emits (supplies) light in a wide wavelength band or multiple wavelengths. In this case, the processing system SYS may generate processing light EL#1 and processing light EL#2 having different wavelengths by wavelength-dividing the light emitted from the light source.

The gas supply source 5 is a purge gas supply source for purging the chamber space 63IN inside the housing 6. The purge gas includes an inert gas. An example of the inert gas is nitrogen gas or argon gas. The gas supply source 5 is connected to the chamber space 63IN via a supply port 62 formed in the partition member 61 of the housing 6 and a supply pipe 51 connecting the gas supply source 5 and the supply port 62. The gas supply source 5 supplies purge gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space purged with the purge gas. The purge gas supplied to the chamber space 63IN may be exhausted from an outlet (not shown) formed in the partition member 61. Note that the gas supply source 5 may be a cylinder containing an inert gas. When the inert gas is nitrogen gas, the gas supply source 5 may be a nitrogen gas generator that generates nitrogen gas using the atmosphere as a raw material.

When the processing system SYS performs additional processing in an open space instead of a closed space (chamber space 63IN), the gas supply source 5 is used to locally purge the space between the irradiation optical system 211 and the workpiece W. , purge gas may be supplied to this space. Note that even when the processing system SYS performs additional processing in the chamber space 63IN, the gas supply source 5 is used to locally purge the space between the irradiation optical system 211 and the workpiece W. A purge gas may also be supplied.

As described above, when the material nozzle 212 supplies the modeling material M together with the purge gas, the gas supply source 5 supplies the purge gas to the mixing device 12 to which the modeling material M from the material supply source 1 is supplied. good. Specifically, the gas supply source 5 may be connected to the mixing device 12 via a supply pipe 52 that connects the gas supply source 5 and the mixing device 12. As a result, the gas supply source 5 supplies purge gas to the mixing device 12 via the supply pipe 52. In this case, the modeling material M from the material supply source 1 is supplied (specifically, , pumping). That is, the gas supply source 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixing device 12, and the supply pipe 11. In that case, the material nozzle 212 supplies the modeling material M together with the purge gas for pumping the modeling material M.

The control unit 7 controls the operation of the processing system SYS. For example, the control unit 7 may control the processing unit 2 (for example, at least one of the processing head 21 and the head drive system 22) included in the processing system SYS to perform additional processing on the workpiece W. For example, the control unit 7 may control the stage unit 3 (for example, the stage drive system 32) included in the processing system SYS to perform additional processing on the workpiece W. For example, the control unit 7 may control the material supply source 1 included in the processing system SYS so as to perform additional processing on the workpiece W. For example, the control unit 7 may control the light source 4 included in the processing system SYS so as to perform additional processing on the workpiece W. For example, the control unit 7 may control the gas supply source 5 included in the processing system SYS so as to perform additional processing on the workpiece W. Note that the control unit 7 may also be referred to as a control device.

The control unit 7 may include, for example, a calculation device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, memory. The control unit 7 functions as a device that controls the operation of the machining system SYS by the arithmetic device executing a computer program. This computer program is a computer program for causing the arithmetic device to perform (that is, execute) the operation to be performed by the control unit 7, which will be described later. That is, this computer program is a computer program for causing the control unit 7 to function so as to cause the processing system SYS to perform the operations described below. The computer program executed by the arithmetic device may be recorded in a storage device (that is, a recording medium) provided in the control unit 7, or may be stored in any storage device built into the control unit 7 or externally attachable to the control unit 7. It may be recorded on a medium (for example, a hard disk or a semiconductor memory). Alternatively, the computing device may download the computer program to be executed from a device external to the control unit 7 via the network interface.

The control unit 7 may control the irradiation mode of the processing light EL by the irradiation optical system 211. The irradiation mode may include, for example, at least one of the intensity of the processing light EL, the irradiation position of the processing light EL, and the irradiation timing of the processing light EL. When the processing light EL includes a plurality of pulsed lights, the irradiation mode is, for example, the light emission time of the pulsed light, the light emission cycle of the pulsed light, and the ratio of the length of the light emission time of the pulsed light to the light emission cycle of the pulsed light. (so-called duty ratio). Furthermore, the control unit 7 may control the manner in which the processing head 21 is moved by the head drive system 22. The control unit 7 may control the manner in which the stage 31 is moved by the stage drive system 32. The movement mode may include, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing (movement timing). Furthermore, the control unit 7 may control the manner in which the modeling material M is supplied by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly the supply amount per unit time) and the supply timing (supply timing).

The control unit 7 does not need to be provided inside the processing system SYS. For example, the control unit 7 may be provided as a server or the like outside the processing system SYS. In this case, the control unit 7 and the processing system SYS may be connected via a wired and/or wireless network (or a data bus and/or a communication line). As the wired network, for example, a network using a serial bus type interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using a parallel bus interface may be used. As the wired network, a network using an interface compliant with Ethernet (registered trademark) typified by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network compliant with IEEE802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). As the wireless network, a network using infrared rays may be used. A network using optical communication may be used as the wireless network. In this case, the control unit 7 and the processing system SYS may be configured to be able to transmit and receive various information via a network. Further, the control unit 7 may be able to transmit information such as commands and control parameters to the processing system SYS via a network. The processing system SYS may include a receiving device that receives information such as commands and control parameters from the control unit 7 via the network. The processing system SYS may include a transmitter that transmits information such as commands and control parameters to the control unit 7 via the network (that is, an output device that outputs information to the control unit 7). good. Alternatively, a first control device that performs some of the processes performed by the control unit 7 is provided inside the processing system SYS, while a second control device that performs other parts of the processes performed by the control unit 7 is provided inside the processing system SYS. The control device may be provided outside the processing system SYS.

A computation model that can be constructed by machine learning may be implemented in the control unit 7 by a computation device executing a computer program. An example of a calculation model that can be constructed by machine learning is a calculation model that includes a neural network (so-called artificial intelligence (AI)). In this case, learning the computational model may include learning parameters (eg, at least one of weights and biases) of the neural network. The control unit 7 may control the operation of the processing system SYS using the calculation model. That is, the operation of controlling the operation of the processing system SYS may include the operation of controlling the operation of the processing system SYS using a calculation model. Note that the control unit 7 may be equipped with an arithmetic model that has been constructed by offline machine learning using teacher data. Further, the calculation model installed in the control unit 7 may be updated by online machine learning on the control unit 7. Alternatively, in addition to or in place of the calculation model installed in the control unit 7, the control unit 7 may use a calculation model installed in a device external to the control unit 7 (that is, a device provided outside the processing system SYS). may be used to control the operation of the processing system SYS.

The recording medium for recording the computer program executed by the control unit 7 includes CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, and DVD. - At least one of optical disks such as RW, DVD+RW and Blu-ray (registered trademark), magnetic media such as magnetic tape, magneto-optical disks, semiconductor memories such as USB memory, and any other arbitrary medium capable of storing programs is used. It's okay to be hit. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in the form of at least one of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block that is realized within the control unit 7 when the control unit 7 (that is, the computer) executes the computer program, or The control unit 7 may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit), etc., or by a combination of logical processing blocks and hardware. some elements It may also be realized in a mixed format with partial hardware modules that realize it.

The calibration unit 8 is capable of measuring at least one of the processing lights EL#1 and EL#2. For this reason, the calibration unit 8 may be referred to as a measuring device. Specifically, during at least part of the measurement period in which the calibration unit 8 measures at least one of the processing lights EL#1 and EL#2, the processing head 21 causes the calibration unit 8 to measure the processing lights EL#1 and EL#2. Irradiate at least one of #2. As a result, the calibration unit 8 can measure at least one of the processing lights EL#1 and EL#2 emitted from the processing head 21. Note that the details of the configuration of the calibration unit 8 will be described in detail later with reference to FIG. 7 and the like.

The calibration unit 8 may measure the processing light EL#1 and the processing light EL#2 at the same time. In this case, the processing head 21 may simultaneously irradiate the calibration unit 8 with the processing lights EL#1 and EL#2. The calibration unit 8 may measure the processing light EL#1 and the processing light EL#2 separately. That is, the calibration unit 8 may measure either one of the processing lights EL#1 and EL#2, and then measure the other of the processing lights EL#1 and EL#2. In this case, the processing head 21 irradiates the calibration unit 8 with one of the processing lights EL#1 and EL#2, and then irradiates the calibration unit 8 with one of the processing lights EL#1 and EL#2. may be irradiated. Alternatively, the calibration unit 8 may alternately repeat the operation of measuring the processing light EL#1 and the operation of measuring the processing light EL#2. That is, the calibration unit 8 may measure the processing lights EL#1 and EL#2 in a time-sharing manner. In this case, the processing head 21 irradiates the calibration unit 8 with one of the processing lights EL#1 and EL#2, and irradiates the calibration unit 8 with the other of the processing lights EL#1 and EL#2. The operation of irradiating the light may be repeated alternately.

Measurement information indicating the measurement result of at least one of the processing lights EL#1 and EL#2 by the calibration unit 8 is output from the calibration unit 8 to the control unit 7.

The control unit 7 may control the processing system SYS based on the measurement information. Specifically, the control unit 7 calculates the measured value of at least one of processing light EL #1 and EL #2 based on the measurement information, and controls the processing system SYS based on the calculated measurement value. Good too. As an example of the measured value, at least one of the rotation amount θz, the offset amount ΔOffx, the offset amount ΔOffy, the irradiation position deviation amount ΔIPx, the irradiation position deviation amount ΔIPx, the stroke width STx, and the stroke width STy, which will be described later, is an example of the measured value. can give. In this case, the above-mentioned measurement period may or may not include at least a part of the period during which the control unit 7 calculates the measured value of at least one of processing light EL #1 and EL #2. Good too.

The calibration unit 8 may be arranged so as to be rotatable around a desired rotation axis. In particular, the calibration unit 8 may be arranged so as to be rotatable around a rotation axis intersecting the optical axis EX of the irradiation optical system 211. In the examples shown in FIGS. 1 to 3, the optical axis EX of the irradiation optical system 211 is an axis along the Z-axis. Therefore, the calibration unit 8 may be arranged so as to be rotatable around at least one of the A-axis and the B-axis. In the example shown in FIG. 1, the calibration unit 8 is arranged in a cradle 324 of the stage drive system 32. In this case, the calibration unit 8 is rotatable around the A-axis in accordance with the rotation of the cradle 324. Alternatively, the calibration unit 8 may be placed on the stage 31. In this case, the calibration unit 8 is rotatable around the A-axis in accordance with the rotation of the stage 31 around the A-axis.

The calibration unit 8 may be arranged so as to be movable along a desired movement axis. In particular, the calibration unit 8 may be arranged so as to be movable along a movement axis intersecting the optical axis EX of the irradiation optical system 211. In the examples shown in FIGS. 1 to 3, the optical axis EX of the irradiation optical system 211 is an axis along the Z-axis. Therefore, the calibration unit 8 may be arranged so as to be movable along at least one of the X-axis direction and the Y-axis direction. In the example shown in FIG. 1, the calibration unit 8 is arranged in a cradle 324 of the stage drive system 32. In this case, the calibration unit 8 is movable along the Y-axis direction in accordance with the movement of the trunnion 322 to which the cradle 324 is attached. Alternatively, the calibration unit 8 may be placed on the stage 31. In this case, the calibration unit 8 is movable along the Y-axis direction in accordance with the movement of the stage 31 along the Y-axis direction.

In the following description, for convenience of explanation, an example will be used in which the calibration unit 8 is placed in the cradle 324. That is, the calibration unit 8 is rotatable around the A-axis that intersects with the optical axis EX of the irradiation optical system 211, and is movable along the Y-axis direction that intersects with the optical axis EX of the irradiation optical system 211. Let's explain using an example.

When the calibration unit 8 is placed in the cradle 324, the stage drive system 32 moves the calibration unit 8 in addition to the stage 31. In other words, the operation of moving the stage 31 may be considered to be equivalent to the operation of moving the calibration unit 8. In this case, when the stage drive system 32 moves the calibration unit 8, the relative positional relationship between the processing head 21 and the calibration unit 8 changes. As a result, the relative positional relationship between the calibration unit 8 and the irradiation optical system 211 included in the processing head 21 changes. Therefore, the stage drive system 32 may be considered to function as a position changing device that can change the relative positional relationship between the calibration unit 8 and the irradiation optical system 211. The stage drive system 32 may be considered to function as a moving device that can move the calibration unit 8 and the irradiation optical system 211 relative to each other. The stage drive system 32 may be considered to function as a moving device that can move the calibration unit 8 with respect to the irradiation optical system 211.

Furthermore, when the head drive system 22 moves the processing head 21 under the condition that the calibration unit 8 is placed in the cradle 324, the relative positional relationship between the processing head 21 and the calibration unit 8 changes. Therefore, like the stage drive system 32, the head drive system 22 is considered to function as a position change device that can change the relative positional relationship between the calibration unit 8 and the irradiation optical system 211. Good too. Like the stage drive system 32, the head drive system 22 may be considered to function as a moving device that can move the calibration unit 8 and the irradiation optical system 211 relative to each other. The head drive system 22 may be considered to function as a moving device that can move the irradiation optical system 211 with respect to the calibration unit 8.

When the calibration unit 8 is placed in the cradle 324, the stage drive system 32 may remove the deposits attached to the calibration unit 8 by rotating the cradle 324. The deposit may include spatter generated by scattering of the melt melted in the molten pool MP. The deposits may include fume generated by evaporation of the molten material melting in the molten pool MP. The deposit may include the modeling material M that has been melted by the processing light EL but has not reached the molten pool MP. The deposit may include the modeling material M that is not melted by the processing light EL and has not reached the molten pool MP. As a result, the calibration unit 8 can appropriately measure the processing light EL without being affected by the deposits.

However, the position where the calibration unit 8 is arranged (hereinafter referred to as the arrangement position) is not limited to the above-mentioned arrangement position. As long as the calibration unit 8 can measure at least one of the processing lights EL#1 and EL#2, the calibration unit 8 may be placed at any position.

(1-2) Configuration of the irradiation optical system 211 Next, the configuration of the irradiation optical system 211 will be described with reference to FIG. FIG. 4 is a cross-sectional view showing the configuration of the irradiation optical system 211.

As shown in FIG. 4, the irradiation optical system 211 includes a first optical system 214, a second optical system 215, and a third optical system 216. The first optical system 214 is an optical system into which the processing light EL#1 emitted from the light source 4#1 enters. The first optical system 214 is an optical system that emits processing light EL#1 emitted from the light source 4#1 toward the third optical system 216. The second optical system 215 is an optical system into which the processing light EL#2 emitted from the light source 4#2 enters. The second optical system 215 is an optical system that emits processing light EL#2 emitted from the light source 4#2 toward the third optical system 216. The third optical system 216 is an optical system into which the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 enter. The third optical system 216 is an optical system that emits processing light EL#1 emitted from the first optical system 214 and processing light EL#2 emitted from the second optical system 215 toward the modeling surface MS. . Hereinafter, the first optical system 214, the second optical system 215, and the third optical system 216 will be explained in order.

The first optical system 214 includes a collimator lens 2141, a parallel plate 2142, a power meter 2143, and a galvano scanner 2144. The galvano scanner 2144 includes a focus control optical system 2145 and a galvanometer mirror 2146. However, the first optical system 214 does not need to include at least one of the collimator lens 2141, the parallel plate 2142, the power meter 2143, and the galvano scanner 2144. The galvano scanner 2144 does not need to include at least one of the focus control optical system 2145 and the galvanometer mirror 2146.

Processing light EL#1 emitted from light source 4#1 enters collimator lens 2141. The collimator lens 2141 converts the processing light EL#1 that has entered the collimator lens 2141 into parallel light. Note that when the processed light EL#1 emitted from the light source 4#1 is parallel light (that is, the processed light EL#1 that is parallel light enters the first optical system 214), the first optical system 214 may not include the collimator lens 2141. Processing light EL#1 converted into parallel light by the collimator lens 2141 enters the parallel plate 2142. A part of the processing light EL#1 incident on the parallel plate 2142 passes through the parallel plate 2142. Another part of the processing light EL#1 that has entered the parallel plate 2142 is reflected by the parallel plate 2142.

The processing light EL#1 that has passed through the parallel plate 2142 is incident on the galvano scanner 2144. Specifically, the processing light EL#1 that has passed through the parallel plate 2142 is incident on the focus control optical system 2145 of the galvano scanner 2144.

The focus control optical system 2145 is an optical member that can change the focusing position CP of the processing light EL#1 (hereinafter referred to as "focusing position CP#1"). Specifically, the focus control optical system 2145 can change the focusing position CP#1 of the processing light EL#1 along the irradiation direction of the processing light EL#1 irradiated onto the modeling surface MS. In the example shown in FIG. 4, the irradiation direction of the processing light EL#1 irradiated onto the modeling surface MS is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2145 can change the focusing position CP#1 of the processing light EL#1 along the Z-axis direction. Furthermore, since the irradiation optical system 211 irradiates the processing light EL onto the modeling surface MS from above the workpiece W, the irradiation direction of the processing light EL#1 is directed toward the modeling surface MS (for example, the surface of the workpiece W or the structural layer SL). This is the direction that intersects with Therefore, the focus control optical system 2145 can change the focusing position CP#1 of the processing light EL#1 along the direction intersecting the modeling surface MS (for example, the surface of the workpiece W or the structural layer SL). It may be considered as The focus control optical system 2145 is capable of changing the focusing position CP#1 of the processing light EL#1 along the direction of the optical axis EX of the irradiation optical system 211 (typically the third optical system 216). It may be considered.

Note that the irradiation direction of the processing light EL#1 may mean the irradiation direction of the processing light EL#1 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the final optical member disposed closest to the modeling surface MS among the optical members constituting the third optical system 216. The final optical member may be an fθ lens 2162, which will be described later. Furthermore, when the fθ lens 2162 described below is composed of a plurality of optical members, the final optical member may be the optical member disposed closest to the modeling surface MS among the plurality of optical members configuring the fθ lens 2162. good.

The focus control optical system 2145 may include, for example, a plurality of lenses arranged along the irradiation direction of the processing light EL#1. In this case, the focus control optical system 2145 moves at least one of the plurality of lenses along its optical axis direction to change the focusing position CP#1 of the processing light EL#1. good.

When the focus control optical system 2145 changes the focusing position CP#1 of the processing light EL#1, the positional relationship between the focusing position CP#1 of the processing light EL#1 and the modeling surface MS changes. In particular, the positional relationship between the focusing position CP#1 of the processing light EL#1 and the modeling surface MS in the irradiation direction of the processing light EL#1 changes. Therefore, the focus control optical system 2145 changes the focus position CP#1 of the processing light EL#1 and the modeling surface MS by changing the focus position CP#1 of the processing light EL#1. It may be considered that the positional relationship between the

Note that, as described above, the galvano scanner 2144 does not need to include the focus control optical system 2145. Even in this case, if the positional relationship between the irradiation optical system 211 and the modeling surface MS in the irradiation direction of the processing light EL#1 changes, the condensing position of the processing light EL#1 in the irradiation direction of the processing light EL#1 The positional relationship between CP#1 and the modeling surface MS changes. Therefore, even if the galvano scanner 2144 is not equipped with the focus control optical system 2145, the processing system SYS can adjust the focus position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the The positional relationship with the surface MS can be changed. For example, the processing system SYS uses the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#1, thereby increasing the processing light EL#1 in the irradiation direction of the processing light EL#1. The positional relationship between the condensing position CP#1 and the modeling surface MS may be changed. For example, the processing system SYS uses the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#1, thereby concentrating the processing light EL#1 in the irradiation direction of the processing light EL#1. The positional relationship between optical position CP#1 and modeling surface MS may be changed.

Processing light EL#1 emitted from the focus control optical system 2145 enters the galvanometer mirror 2146. The galvanometer mirror 2146 changes the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146 by deflecting the processing light EL#1. For this reason, galvano mirror 2146 may be referred to as a deflection member. When the direction of the processing light EL#1 emitted from the galvanometer mirror 2146 is changed, the position from which the processing light EL#1 is emitted from the processing head 21 is changed. When the position from which the processing light EL#1 is emitted from the processing head 21 is changed during the modeling period in which the processing head 21 models a modeled object, the target irradiation area on the modeling surface MS is irradiated with the processing light EL#1. EA#1 moves. Alternatively, if the position at which the processing light EL#1 is emitted from the processing head 21 is changed during the measurement period in which the calibration unit 8 measures the processing light EL#1, the processing light EL#1 on the calibration unit 8 is changed. The target irradiation area EA#1 that is irradiated moves. In other words, the irradiation position on the modeling surface MS or the calibration unit 8 where the processing light EL#1 is irradiated moves.

In addition, during the modeling period during which the processing head 21 forms the object, the door of the housing 6 is opened from the time when the processing head 21 starts modeling the object (as a result, the completed object is removed from the chamber space 63IN). It may also mean a period up to the time when the data is retrieved. The modeling period is the period from the time when the processing head 21 starts irradiating the processing light EL to model the object to the time when the object is completed and the processing head 21 stops irradiating the processing light EL. It may also mean If the processing head 21 temporarily stops irradiating the processing light EL after the processing head 21 starts irradiating the processing light EL to form the object until the object is completed, the processing The period refers to the period from the time when the processing head 21 starts irradiating the processing light EL to model the object to the time when the processing head 21 temporarily stops irradiating the processing light EL. You can. If the type of modeling material M supplied by the material nozzle 212 is switched after the processing head 21 starts irradiating the processing light EL to model the object until the object is completed, the modeling period is the period from the time when the material nozzle 212 starts supplying one type of modeling material M to the time when the material nozzle 212 stops supplying one type of modeling material M in order to switch the type of modeling material M. It may also mean a period of

The galvanometer mirror 2146 includes, for example, an X-scanning mirror 2146MX, an X-scanning motor 2146AX, a Y-scanning mirror 2146MY, and a Y-scanning motor 2146AY. Processing light EL#1 emitted from the focus control optical system 2145 enters the X scanning mirror 2146MX. The X-scanning mirror 2146MX reflects the processing light EL#1 that has entered the X-scanning mirror 2146MX toward the Y-scanning mirror 2146MY. The Y scanning mirror 2146MY reflects the processing light EL#1 that has entered the Y scanning mirror 2146MY toward the third optical system 216. Note that each of the X scanning mirror 2146MX and the Y scanning mirror 2146MY may be referred to as a galvano mirror.

The X-scanning motor 2146AX swings or rotates the X-scanning mirror 2146MX around a rotation axis along the Y-axis. As a result, the angle of the X-scanning mirror 2146MX with respect to the optical path of the processing light EL#1 incident on the X-scanning mirror 2146MX is changed. In this case, the processing light EL#1 moves along the X-axis direction intersecting the optical axis EX of the irradiation optical system 211 due to the swinging or rotation of the X-scanning mirror 2146MX. As a result, the processing light EL#1 scans the modeling surface MS or the calibration unit 8 along the X-axis direction. That is, the irradiation position of the processing light EL#1 on the modeling surface MS or the calibration unit 8 changes in the X-axis direction. In other words, the target irradiation area EA#1 (that is, the irradiation position of the processing light EL#1) moves on the modeling surface MS or the calibration unit 8 along the X-axis direction.

The Y scanning motor 2146AY swings or rotates the Y scanning mirror 2146MY around a rotation axis along the X axis. As a result, the angle of the Y scanning mirror 2146MY with respect to the optical path of the processing light EL#1 incident on the Y scanning mirror 2146MY is changed. In this case, the processing light EL#1 moves along the Y-axis direction intersecting the optical axis EX of the irradiation optical system 211 due to the swinging or rotation of the Y-scanning mirror 2146MY. As a result, the processing light EL#1 scans the modeling surface MS or the calibration unit 8 along the Y-axis direction. That is, the irradiation position of the processing light EL#1 on the modeling surface MS or the calibration unit 8 changes in the Y-axis direction. In other words, the target irradiation area EA#1 (that is, the irradiation position of the processing light EL#1) moves on the modeling surface MS or on the calibration unit 8 along the Y-axis direction.

Note that since the galvano mirror 2146 is movable in the processing light EL#1 and the target irradiation area EA#1, the galvano mirror 2146 may be referred to as a moving member.

In this embodiment, the virtual area in which the galvanometer mirror 2146 moves the target irradiation area EA#1 on the modeling surface MS is referred to as a processing unit area BSA (particularly processing unit area BSA#1). In this case, the target irradiation area EA#1 may be considered to move on a surface of the modeling surface MS that overlaps with the processing unit area BSA#1. Specifically, the galvanometer mirror 2146 moves the target irradiation area EA#1 on the printing surface MS while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (that is, without changing). This area is referred to as a processing unit area BSA (particularly, processing unit area BSA#1). The processing unit area BSA#1 is a virtual area where the processing head 21 actually performs additional processing using the processing light EL#1 while the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed (in other words, , range). The processing unit area BSA#1 is a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#1 while the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed. show. The processing unit area BSA#1 indicates an area (in other words, a range) in which the target irradiation area EA#1 actually moves while the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed. Therefore, the processing unit area BSA#1 may be considered to be a virtual area determined based on the processing head 21 (in particular, the irradiation optical system 211). That is, the processing unit area BSA#1 may be considered to be a virtual area located on the modeling surface MS at a position determined based on the processing head 21 (in particular, the irradiation optical system 211). Note that the maximum area in which the galvanometer mirror 2146 can move the target irradiation area EA#1 on the printing surface MS with the positional relationship between the irradiation optical system 211 and the printing surface MS fixed is defined as the processing unit area BSA#. It may be called 1. Furthermore, the processing unit area BSA#1 is a virtual area (typical In other words, it may be regarded as a two-dimensional area).

In this case, the processing system SYS can use the galvanometer mirror 2146 to move the target irradiation area EA#1 within the processing unit area BSA#1. Therefore, the operation of deflecting the processing light EL#1 using the galvanometer mirror 2146 may be considered to be equivalent to the operation of moving the target irradiation area EA#1 within the processing unit area BSA#1. Furthermore, as described above, the molten pool MP#1 is formed by irradiating the target irradiation area EA#1 with the processing light EL#1. In this case, the processing system SYS may be considered to be moving the molten pool MP#1 within the processing unit area BSA#1 using the galvanometer mirror 2146. Therefore, the operation of deflecting the processing light EL#1 using the galvanometer mirror 2146 may be considered to be equivalent to the operation of moving the molten pool MP#1 within the processing unit area BSA#1. That is, the operation of moving the target irradiation area EA#1 within the processing unit area BSA#1 may be considered to be equivalent to the operation of moving the molten pool MP#1 within the processing unit area BSA#1.

Note that, as described above, even if at least one of the processing head 21 and the stage 31 moves, the target irradiation area EA#1 moves on the modeling surface MS. However, when at least one of processing head 21 and stage 31 moves, the relative positional relationship between galvanometer mirror 2146 and modeling surface MS changes. As a result, the processing unit area BSA#1 determined based on the processing head 21 (that is, the processing unit area BSA#1 in which the galvanometer mirror 2146 moves the target irradiation area EA#1 on the modeling surface MS) is Moving. Therefore, in this embodiment, the operation of moving at least one of the processing head 21 and the stage 31 may be considered to be equivalent to the operation of moving the processing unit area BSA#1 with respect to the modeling surface MS.

As an example of the operation of moving the target irradiation area EA#1 within the processing unit area BSA#1, as shown in FIG. In the situation where it is assumed that the target irradiation area EA#1 moves along a single scanning direction along the modeling surface MS within the processing unit area BSA#1. The processing light EL#1 may be deflected so as to. In other words, the galvanometer mirror 2146 deflects the processing light EL#1 so that the target irradiation area EA#1 moves along a single scanning direction within the coordinate system determined based on the processing unit area BSA#1. You can. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth along a single scanning direction within the processing unit area BSA#1. . In other words, the galvanometer mirror 2146 deflects the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on an axis along a single scanning direction within the processing unit area BSA#1. You can. In this case, the shape of the processing unit area BSA#1 to which the target irradiation area EA#1 moves may be a rectangular shape in which the moving direction of the target irradiation area EA#1 is the longitudinal direction.

As another example of the operation of moving the molten pool MP#1 within the processing unit area BSA#1, as shown in FIGS. 6(a) and 6(b), the galvanometer mirror 2146 is stationary (that is, not moving) on the printing surface MS, and within the processing unit area BSA#1, the target irradiation area EA#1 is located at multiple points along the printing surface MS. Processing light EL#1 may be deflected so as to move along the scanning direction. In other words, the galvano mirror 2146 deflects the processing light EL#1 so that the target irradiation area EA#1 moves along a plurality of scanning directions within a coordinate system determined based on the processing unit area BSA#1. Good too. In particular, the galvanometer mirror 2146 deflects the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth along each of a plurality of scanning directions within the processing unit area BSA#1. good. In other words, the galvanometer mirror 2146 deflects the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on the axis along each of the plurality of scanning directions within the processing unit area BSA#1. You may. In FIG. 6(a), the target irradiation area EA#1 is moved in the X-axis direction and An example of reciprocating movement along each of the Y-axis directions is shown. In this case, the shape of the processing unit area BSA#1 to which the target irradiation area EA#1 moves may be circular. In FIG. 6(b), the target irradiation area EA#1 within the processing unit area BSA#1 is An example of reciprocating movement along each of the axial direction and the Y-axis direction is shown. In this case, the shape of the processing unit area BSA#1 to which the target irradiation area EA#1 moves may be rectangular.

Note that the operation of periodically moving the target irradiation area EA#1 on the modeling surface MS as shown in FIGS. 5(a), 6(a), and 6(b) is referred to as a wobbling operation. Good too. In other words, the operation of periodically moving (in other words, deflecting) the processing light EL#1 so that the target irradiation area EA#1 periodically moves on the modeling surface MS may be referred to as a wobbling operation. .

The control unit 7 controls the processing unit area BSA#1 to move on the modeling surface MS while the target irradiation area EA#1 is being moved within the processing unit area BSA#1 using the galvanometer mirror 2146. , at least one of the processing head 21 and the stage 31 may be moved. In other words, the control unit 7 controls the processing unit area BSA#1 to move on the modeling surface MS during the period in which the target irradiation area EA#1 is moved within the processing unit area BSA#1 using the galvanometer mirror 2146. Thus, at least one of the head drive system 22 and the stage drive system 32 may be controlled.

For example, in the example shown in FIG. 5(a), the control unit 7 is configured to move the target irradiation area EA#1 within the processing unit area BSA#1 in a direction that intersects with (orthogonally to, in some cases, the scanning direction) the target irradiation area EA#1. ) At least one of the head drive system 22 and the stage drive system 32 may be controlled so that the processing unit area BSA#1 moves along the target movement trajectory MT0. Conversely, the control unit 7 moves the target irradiation area EA#1 along the scanning direction that intersects (perpendicularly, in some cases) the target movement locus MT0 of the processing unit area BSA#1 on the modeling surface MS. The galvanometer mirror 2146 may be controlled so that it moves periodically. As a result, on the modeling surface MS, the target irradiation area EA#1 may move along the movement trajectory MT#1 shown in FIG. 5(b). Specifically, the target irradiation area EA#1 may move along the scanning direction intersecting the target movement trajectory MT0 while moving along the target movement trajectory MT0 of the processing unit area BSA#1. That is, the target irradiation area EA#1 may move along a movement trajectory MT#1 having a wave shape (for example, a sine wave shape) that vibrates around the target movement trajectory MT0.

For example, in the example shown in FIG. 6(a) or FIG. 6(b), the control unit 7 moves the target irradiation area EA#1 in the processing unit area BSA#1 along the moving direction (that is, the scanning direction). The processing unit is processed along the target movement trajectory MT0 that extends along at least one of the directions that intersects (orthogonally perpendicular to) the movement direction of the target irradiation area EA#1 within the processing unit area BSA#1. At least one of the head drive system 22 and the stage drive system 32 may be controlled so that the area BSA#1 moves. Conversely, the control unit 7 controls the scanning direction along the target movement trajectory MT0 of the processing unit area BSA#1 on the modeling surface MS and the scanning direction intersecting (orthogonal to) the target movement trajectory MT0. The galvanometer mirror 2146 may be controlled so that the target irradiation area EA#1 periodically moves along each of the directions. Note that FIG. 6(c) shows the target irradiation area EA on the modeling surface MS when the processing unit area BSA#1 shown in FIG. 6(a) moves on the modeling surface MS along the target movement trajectory MT0. #1 movement trajectory MT#1 is shown.

When the processing light EL#1 is irradiated onto the modeling surface MS so that the target irradiation area EA#1 moves within the processing unit area BSA#1, a molten pool MP is formed in at least a part of the processing unit area BSA#1. #1 is formed. As a result, a modeled object is modeled within the processing unit area BSA#1. Here, as described above, the machining unit area BSA#1 is arranged in a direction intersecting the movement direction of the machining unit area BSA#1 on the modeling surface MS (specifically, the direction in which the target movement trajectory MT0 extends). This is an area with a width. In this case, a modeled object having a width along the direction intersecting the target movement trajectory MT0 of the processing unit area BSA#1 is modeled along the target movement trajectory MT0 on the modeling surface MS. For example, in the examples shown in FIGS. 5(a) and 5(b), a shaped object is formed that has a width along the X-axis direction and extends along the Y-axis direction. For example, in the examples shown in FIGS. 6(a) and 6(c), a shaped object is formed that has a width along the X-axis direction and extends along the Y-axis direction. For example, when the modeling system unit area BSA shown in FIG. 6(b) moves along the Y-axis direction, a molded object having a width along the X-axis direction and extending along the Y-axis direction is created. .

When the processing light EL#1 is irradiated onto the modeling surface MS so that the target irradiation area EA#1 moves within the processing unit area BSA#1, the processing unit area BSA#1 is exposed to the processing light EL by the galvanometer mirror 2146. #1 is scanned. Therefore, the amount of energy transmitted from the processing light EL#1 to the processing unit area BSA#1 is greater than when the processing light EL#1 is irradiated onto the modeling surface MS without using the galvano mirror 2146. However, the possibility of variation within the processing unit area BSA#1 is reduced. That is, it is possible to equalize the distribution of the amount of energy transmitted from the processing light EL#1 to the processing unit area BSA#1. As a result, the processing system SYS is able to model the object on the modeling surface MS with relatively high modeling accuracy.

However, the processing system SYS does not need to irradiate the modeling surface MS with the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area BSA#1. The processing system SYS may irradiate the modeling surface MS with the processing light EL#1 without using the galvanometer mirror 2146. In this case, the target irradiation area EA#1 may move on the modeling surface MS as at least one of the processing head 21 and the stage 31 moves.

Referring again to FIG. 4, the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. The power meter 2143 can detect the intensity of the processing light EL#1 that is incident on the power meter 2143. For this reason, power meter 2143 may be referred to as a detection device. For example, the power meter 2143 may include a light receiving element that detects the processing light EL#1 as light. Alternatively, as the intensity of processing light EL#1 increases, the amount of energy generated by processing light EL#1 increases. As a result, the amount of heat generated by the processing light EL#1 increases. Therefore, the power meter 2143 may detect the intensity of the processing light EL#1 by detecting the processing light EL#1 as heat. In this case, the power meter 2143 may include a heat detection element that detects the heat of the processing light EL#1.

As described above, the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. Therefore, the power meter 2143 detects the intensity of the processing light EL#1 reflected by the parallel plate 2142. Since the parallel plate 2142 is placed on the optical path of the processing light EL#1 between the light source 4#1 and the galvano mirror 2146, the power meter 2143 is arranged on the optical path of the processing light EL#1 between the light source 4#1 and the galvano mirror 2146. It may be assumed that the intensity of the processing light EL#1 traveling is detected. In this case, the power meter 2143 can stably detect the intensity of the processing light EL#1 without being affected by the deflection of the processing light EL#1 by the galvanometer mirror 2146. However, the arrangement position of the power meter 2143 is not limited to the example shown in FIG. 4. For example, the power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path between the galvanometer mirror 2146 and the modeling surface MS. The power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path within the galvanometer mirror 2146.

The detection result of the power meter 2143 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#1 based on the detection result of the power meter 2143 (that is, the detection result of the intensity of the processing light EL#1). For example, the control unit 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the modeling surface MS becomes a desired intensity. In order to control the intensity of the processing light EL#1, for example, the control unit 7 changes the intensity of the processing light EL#1 emitted from the light source 4#1 based on the detection result of the power meter 2143. , the light source 4#1 may be controlled. As a result, the processing system SYS can appropriately model the object on the modeling surface MS by irradiating the processing light EL#1 having an appropriate intensity onto the modeling surface MS.

As described above, the processing light EL#1 has an intensity capable of melting the modeling material M. Therefore, there is a possibility that the processing light EL#1 incident on the power meter 2143 has an intensity capable of melting the modeling material M. However, if the processing light EL#1 having an intensity capable of melting the modeling material M is incident on the power meter 2143, the power meter 2143 may be damaged by the processing light EL#1. Therefore, the processing light EL#1 having an intensity that is not high enough to damage the power meter 2143 may be incident on the power meter 2143. In other words, the first optical system 214 controls the processing light EL#1 that is incident on the power meter 2143 so that the processing light EL#1 having an intensity that is not high enough to damage the power meter 2143 is incident on the power meter 2143. The strength may be weakened.

For example, in order to weaken the intensity of the processing light EL#1 that enters the power meter 2143, the reflectance of the parallel plate 2142 for the processing light EL#1 may be set to an appropriate value. Specifically, the lower the reflectance of the parallel plate 2142 for the processing light EL#1, the lower the intensity of the processing light EL#1 that enters the power meter 2143. Therefore, the reflectance of the parallel plate 2142 is set to a value low enough to allow processing light EL#1 having an intensity that is not high enough to damage the power meter 2143 to enter the power meter 2143. May be set. For example, the reflectance of the parallel plate 2142 may be less than 10%. For example, the reflectance of the parallel plate 2142 may be less than a few percent. Raw glass may be used as the parallel flat plate 2142 with low reflectance.

For example, in order to weaken the intensity of the processed light EL#1 that enters the power meter 2143, the first optical system 214 may cause the processed light EL#1 to enter the power meter 2143 via a plurality of parallel plates 2142. good. Specifically, the processing light EL#1 that has been reflected multiple times by each of the parallel flat plates 2142 may be incident on the power meter 2143. In this case, the intensity of the processing light EL#1 reflected multiple times by the plurality of parallel flat plates 2142 is weaker than the intensity of the processing light EL#1 reflected once by one parallel plate 2142. Therefore, there is a high possibility that the processing light EL#1 having an intensity that is not high enough to damage the power meter 2143 will be incident on the power meter 2143.

The surface of the parallel plate 2142 (particularly at least one of the incident surface on which the processing light EL#1 is incident and the reflective surface on which the processing light EL#1 is reflected) may be subjected to a desired coating treatment. For example, the surface of the parallel plate 2142 may be subjected to anti-reflection coating treatment (AR).

The second optical system 215 includes a collimator lens 2151, a parallel plate 2152, a power meter 2153, and a galvano scanner 2154. The galvano scanner 2154 includes a focus control optical system 2155 and a galvanometer mirror 2156. However, the second optical system 215 does not need to include at least one of the collimator lens 2151, the parallel plate 2152, the power meter 2153, and the galvano scanner 2154. The galvano scanner 2154 does not need to include at least one of the focus control optical system 2155 and the galvanometer mirror 2156.

Processing light EL#2 emitted from light source 4#2 enters collimator lens 2151. The collimator lens 2151 converts the processing light EL#2 that has entered the collimator lens 2151 into parallel light. Note that when the processed light EL#2 emitted from the light source 4#2 is parallel light (that is, the processed light EL#2 that is parallel light enters the second optical system 215), the second optical system 215 may not include the collimator lens 2151. Processing light EL#2 converted into parallel light by the collimator lens 2151 enters the parallel plate 2152. A part of the processing light EL#2 incident on the parallel plate 2152 passes through the parallel plate 2152. Another part of the processing light EL#2 that has entered the parallel plate 2152 is reflected by the parallel plate 2152.

The processing light EL#2 that has passed through the parallel plate 2152 is incident on the galvano scanner 2154. Specifically, the processing light EL#2 that has passed through the parallel plate 2152 is incident on the focus control optical system 2155 of the galvano scanner 2154.

The focus control optical system 2155 is an optical member that can change the focusing position CP of the processing light EL#2 (hereinafter referred to as "focusing position CP#2"). Specifically, the focus control optical system 2155 can change the focusing position CP#2 of the processing light EL#2 along the irradiation direction of the processing light EL#2 that is irradiated onto the modeling surface MS. In the example shown in FIG. 4, the irradiation direction of the processing light EL#2 irradiated onto the modeling surface MS is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2155 can change the focusing position CP#2 of the processing light EL#2 along the Z-axis direction. Furthermore, since the irradiation optical system 211 irradiates the processing light EL onto the modeling surface MS from above the workpiece W, the irradiation direction of the processing light EL#2 is directed toward the modeling surface MS (for example, the surface of the workpiece W or the structural layer SL). This is the direction that intersects with Therefore, the focus control optical system 2155 can change the focusing position CP#2 of the processing light EL#2 along the direction intersecting the modeling surface MS (for example, the surface of the workpiece W or the structural layer SL). It may be considered as The focus control optical system 2155 is capable of changing the focusing position CP#2 of the processing light EL#2 along the direction of the optical axis EX of the irradiation optical system 211 (typically the third optical system 216). It may be considered.

Note that the irradiation direction of the processing light EL#2 may mean the irradiation direction of the processing light EL#2 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the final optical member disposed closest to the modeling surface MS among the optical members constituting the third optical system 216. The final optical member may be an fθ lens 2162, which will be described later. Furthermore, when the fθ lens 2162 described below is composed of a plurality of optical members, the final optical member may be the optical member disposed closest to the modeling surface MS among the plurality of optical members configuring the fθ lens 2162. good.

The focus control optical system 2155 may include, for example, a plurality of lenses arranged along the irradiation direction of the processing light EL#2. In this case, the focus control optical system 2155 may change the focusing position CP of the processing light EL#2 by moving at least one of the plurality of lenses along its optical axis direction.

When the focus control optical system 2155 changes the focusing position CP#2 of the processing light EL#2, the positional relationship between the focusing position CP#2 of the processing light EL#2 and the modeling surface MS changes. In particular, the positional relationship between the focusing position CP#2 of the processing light EL#2 and the modeling surface MS in the irradiation direction of the processing light EL#2 changes. Therefore, the focus control optical system 2155 changes the focus position CP#2 of the processing light EL#2 and the modeling surface MS by changing the focus position CP#2 of the processing light EL#2. It may be considered that the positional relationship between the two is being changed.

Focus control of the galvano scanner 2144 of the first optical system 214 Changing the focusing position CP#1 of the modeling light EL#1 along the Z-axis direction by the optical system 2145 and focus control of the galvano scanner 2154 of the second optical system 215 The change along the Z-axis direction of the focusing position CP#2 of the modeling light EL#2 by the optical system 2155 may be linked to each other. For example, the light is focused so that the position of the condensing position CP#1 of the modeling light EL#1 in the Z-axis direction and the position of the condensing position CP#2 of the modeling light EL#2 in the Z-axis direction match each other. Positions CP#1 and CP#2 may be changed along the Z-axis direction. For example, the position of the condensing position CP#1 of the modeling light EL#1 in the Z-axis direction and the position of the condensing position CP#2 of the modeling light EL#2 in the Z-axis direction are separated by a predetermined interval in the Z-axis direction. The condensing positions CP#1 and CP#2 may be changed along the Z-axis direction so that the same state is maintained. However, the focus control optical system 2145 of the galvano scanner 2144 of the first optical system 214 changes the focusing position CP#1 of the modeling light EL#1 along the Z-axis direction, and the focus control optical system 2155 changes the focusing position CP#1 of the modeling light EL#1. The change of the second condensing position CP#2 along the Z-axis direction may be performed independently of each other.

Note that, as described above, the galvano scanner 2154 does not need to include the focus control optical system 2155. Even in this case, if the positional relationship between the irradiation optical system 211 and the modeling surface MS in the irradiation direction of the processing light EL#2 changes, the condensing position of the processing light EL#2 in the irradiation direction of the processing light EL#2 The positional relationship between CP#2 and the modeling surface MS changes. Therefore, even if the galvano scanner 2154 is not equipped with the focus control optical system 2155, the processing system SYS can adjust the focus position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the The positional relationship with the surface MS can be changed. For example, the processing system SYS uses the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#2, thereby increasing the processing light EL#2 in the irradiation direction of the processing light EL#2. The positional relationship between the condensing position CP#2 and the modeling surface MS may be changed. For example, the processing system SYS uses the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#2, thereby concentrating the processing light EL#2 in the irradiation direction of the processing light EL#2. The positional relationship between optical position CP#2 and modeling surface MS may be changed.

Processing light EL#2 emitted from the focus control optical system 2155 enters the galvanometer mirror 2156. The galvano mirror 2156 changes the emission direction of the processing light EL#2 emitted from the galvano mirror 2156 by deflecting the processing light EL#2. For this reason, galvano mirror 2156 may be referred to as a deflection member. When the direction of the processing light EL#2 emitted from the galvanometer mirror 2156 is changed, the position from which the processing light EL#2 is emitted from the processing head 21 is changed. When the position from which the processing light EL#2 is emitted from the processing head 21 is changed during the modeling period in which the processing head 21 forms a modeled object, the target irradiation area on the modeling surface MS is irradiated with the processing light EL#2. EA#2 moves. Alternatively, if the position from which the processing light EL#2 is emitted from the processing head 21 is changed during the measurement period in which the calibration unit 8 measures the processing light EL#2, the processing light EL#2 on the calibration unit 8 is changed. The target irradiation area EA#2 that is irradiated moves. In other words, the irradiation position on the modeling surface MS or the calibration unit 8 where the processing light EL#2 is irradiated moves.

The galvanometer mirror 2156 includes, for example, an X-scanning mirror 2156MX, an X-scanning motor 2156AX, a Y-scanning mirror 2156MY, and a Y-scanning motor 2156AY. Processing light EL#2 emitted from the focus control optical system 2155 enters the X scanning mirror 2156MX. The X-scanning mirror 2156MX reflects the processing light EL#2 that has entered the X-scanning mirror 2156MX toward the Y-scanning mirror 2156MY. The Y scanning mirror 2156MY reflects the processing light EL#2 that has entered the Y scanning mirror 2156MY toward the third optical system 216. Note that each of the X scanning mirror 2156MX and the Y scanning mirror 2156MY may be referred to as a galvano mirror.

The X-scanning motor 2156AX swings or rotates the X-scanning mirror 2156MX around a rotation axis along the Y-axis. As a result, the angle of the X-scanning mirror 2156MX with respect to the optical path of the processing light EL#2 incident on the X-scanning mirror 2156MX is changed. In this case, the processing light EL#2 moves along the X-axis direction intersecting the optical axis EX of the irradiation optical system 211 due to the swinging or rotation of the X-scanning mirror 2156MX. As a result, the processing light EL#2 scans the modeling surface MS or the calibration unit 8 along the X-axis direction. In other words, the irradiation position of the processing light EL#2 on the modeling surface MS changes in the X-axis direction. In other words, the target irradiation area EA#2 (that is, the irradiation position of the processing light EL#2) moves on the modeling surface MS or on the calibration unit 8 along the X-axis direction.

The Y scan motor 2156AY swings or rotates the Y scan mirror 2156MY around a rotation axis along the X axis. As a result, the angle of the Y scanning mirror 2156MY with respect to the optical path of the processing light EL#2 incident on the Y scanning mirror 2156MY is changed. In this case, the processing light EL#2 moves along the Y-axis direction intersecting the optical axis EX of the irradiation optical system 211 due to the swinging or rotation of the Y-scanning mirror 2156MY. As a result, the processing light EL#2 scans the modeling surface MS or the calibration unit 8 along the Y-axis direction. That is, the irradiation position of the processing light EL#2 on the modeling surface MS changes in the Y-axis direction. That is, the target irradiation area EA#2 (that is, the irradiation position of the processing light EL#2) moves on the modeling surface MS or on the calibration unit 8 along the Y-axis direction.

Incidentally, since the galvanometer mirror 2156 is movable in the processing light EL#2 and the target irradiation area EA#2, the galvanometer mirror 2156 may be referred to as a moving member.

In this embodiment, the virtual area in which the galvano mirror 2156 moves the target irradiation area EA#2 on the modeling surface MS is referred to as a processing unit area BSA (particularly processing unit area BSA#2). In this case, the target irradiation area EA#2 may be considered to move on a surface of the modeling surface MS that overlaps with the processing unit area BSA#2. Specifically, the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (that is, without changing). This area is referred to as a processing unit area BSA (particularly, processing unit area BSA#2). The processing unit area BSA#2 is a virtual area where the processing head 21 actually performs additional processing using the processing light EL#2 while the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed (in other words, , range). The processing unit area BSA#2 is a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#2 while the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed. show. The processing unit area BSA#2 indicates an area (in other words, a range) in which the target irradiation area EA#2 actually moves while the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed. Therefore, the processing unit area BSA#2 may be considered to be a virtual area determined based on the processing head 21 (in particular, the irradiation optical system 211). That is, the processing unit area BSA#2 may be considered to be a virtual area located on the modeling surface MS at a position determined based on the processing head 21 (in particular, the irradiation optical system 211). Note that the maximum area in which the galvanometer mirror 2146 can move the target irradiation area EA#2 on the printing surface MS with the positional relationship between the irradiation optical system 211 and the printing surface MS fixed is defined as the processing unit area BSA#. It may be called 2. Furthermore, the processing unit area BSA#2 is a virtual area (typical In other words, it may be regarded as a two-dimensional area).

In this case, the processing system SYS can use the galvanometer mirror 2156 to move the target irradiation area EA#2 within the processing unit area BSA#2. Therefore, the operation of deflecting the processing light EL#2 using the galvanometer mirror 2156 may be considered to be equivalent to the operation of moving the target irradiation area EA#2 within the processing unit area BSA#2. Furthermore, as described above, the molten pool MP#2 is formed by irradiating the target irradiation area EA#2 with the processing light EL#2. In this case, the processing system SYS may be considered to be moving the molten pool MP#2 within the processing unit area BSA#2 using the galvanometer mirror 2156. Therefore, the operation of deflecting the processing light EL#2 using the galvano mirror 2156 may be considered to be equivalent to the operation of moving the molten pool MP#2 within the processing unit area BSA#2. That is, the operation of moving the target irradiation area EA#2 within the processing unit area BSA#2 may be considered to be equivalent to the operation of moving the molten pool MP#2 within the processing unit area BSA#2.

Note that, as described above, when at least one of the processing head 21 and the stage 31 moves, the target irradiation area EA#2 moves on the modeling surface MS. However, when at least one of processing head 21 and stage 31 moves, the relative positional relationship between galvanometer mirror 2146 and modeling surface MS changes. As a result, the processing unit area BSA#2 determined based on the processing head 21 (that is, the processing unit area BSA#2 in which the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS) is located on the printing surface MS. Moving. Therefore, in the present embodiment, the operation of moving at least one of the processing head 21 and the stage 31 may be considered to be equivalent to the operation of moving the processing unit area BSA#2 with respect to the modeling surface MS.

The characteristics of the processing unit area BSA#2 (for example, shape, movement mode, etc.) may be the same as the characteristics of the processing unit area BSA#1 described above. The manner of movement of the target irradiation area EA#2 within the processing unit area BSA#2 (for example, movement trajectory, etc.) is the same as the movement manner of the target irradiation area EA#1 within the processing unit area BSA#1 described above. There may be. Therefore, a detailed explanation of the characteristics of the processing unit area BSA#2 and the movement mode (for example, movement trajectory, etc.) of the target irradiation area EA#2 within the processing unit area BSA#2 will be omitted, but an example thereof is provided below. Let's briefly explain. As shown in FIG. 5(a), the galvanometer mirror 2156 controls the processing unit area BSA #2 under the assumption that the processing unit area BSA#2 is stationary (that is, not moving) on the modeling surface MS. Within #2, the processing light EL#2 may be deflected so that the target irradiation area EA#2 moves along a single scanning direction along the modeling surface MS. By moving the processing unit area BSA#2 shown in FIG. 5(a) along the target movement trajectory MT0 on the printing surface MS, the target irradiation area EA#2 on the printing surface MS is as shown in FIG. 5(b). It is also possible to move along a movement trajectory MT#2 shown in (for example, a wave-shaped movement trajectory MT#2 that vibrates around the target movement trajectory MT0). As shown in FIGS. 6(a) and 6(b), the galvano mirror 2156 operates under the assumption that the processing unit area BSA#2 is stationary (that is, not moving) on the modeling surface MS. In this case, the processing light EL#2 may be deflected so that the target irradiation area EA#2 moves along a plurality of scanning directions within the processing unit area BSA#2.

Note that the operation of periodically moving the target irradiation area EA#2 on the modeling surface MS as shown in FIGS. 5(a), 6(a), and 6(b) is referred to as a wobbling operation. Good too. In other words, the operation of periodically moving (in other words, deflecting) the processing light EL#2 so as to periodically move the target irradiation area EA#2 on the modeling surface MS may be referred to as a wobbling operation. .

Typically, the processing unit area BSA#1 and the processing unit area BSA#2 match. That is, the processing unit area BSA#1 is the same as the processing unit area BSA#2. Therefore, the galvanometer mirror 2156 may be considered to be deflecting the processing light EL#2 so that the target irradiation area EA#2 moves within the processing unit area BSA#1. The galvanometer mirror 2146 may be regarded as deflecting the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area BSA#2. However, the processing unit area BSA#1 and the processing unit area BSA#2 may be partially different. For example, a part of processing unit area BSA#1 and a part of processing unit area BSA#2 may overlap each other. Alternatively, the processing unit area BSA#1 and the processing unit area BSA#2 may not overlap. For example, processing unit area BSA#1 and processing unit area BSA#2 may be adjacent to each other.

When the processing light EL#2 is irradiated onto the modeling surface MS so that the target irradiation area EA#2 moves within the processing unit area BSA#2, a molten pool MP is formed in at least a part of the processing unit area BSA#2. #2 is formed. As a result, a modeled object is modeled within the processing unit area BSA#2. Here, as described above, the machining unit area BSA#2 is arranged in a direction intersecting the movement direction of the machining unit area BSA#2 on the modeling surface MS (specifically, the direction in which the target movement trajectory MT0 extends). This is an area with a width. In this case, a modeled object having a width along a direction intersecting the target movement trajectory MT0 of the processing unit area BSA#2 is modeled along the target movement trajectory MT0 on the modeling surface MS. For example, in the examples shown in FIGS. 5(a) and 5(b), a shaped object is formed that has a width along the X-axis direction and extends along the Y-axis direction. For example, in the examples shown in FIGS. 6(a) and 6(c), a shaped object is formed that has a width along the X-axis direction and extends along the Y-axis direction. For example, when the modeling system unit area BSA shown in FIG. 6(b) moves along the Y-axis direction, a molded object having a width along the X-axis direction and extending along the Y-axis direction is created. .

When the processing light EL#2 is irradiated onto the modeling surface MS so that the target irradiation area EA#2 moves within the processing unit area BSA#2, the processing unit area BSA#2 is exposed to the processing light EL by the galvanometer mirror 2156. #2 is scanned. Therefore, the amount of energy transmitted from the processing light EL#2 to the processing unit area BSA#2 is greater than when the processing light EL#2 is irradiated onto the modeling surface MS without using the galvanometer mirror 2156. However, the possibility of variation within the processing unit area BSA#2 is reduced. In other words, it is possible to equalize the distribution of the amount of energy transmitted from the processing light EL#2 to the processing unit area BSA#2. As a result, the processing system SYS is able to model the object on the modeling surface MS with relatively high modeling accuracy.

However, the processing system SYS does not need to irradiate the modeling surface MS with the processing light EL#2 so that the target irradiation area EA#2 moves within the processing unit area BSA#2. The processing system SYS may irradiate the modeling surface MS with the processing light EL#2 without using the galvanometer mirror 2156. In this case, the target irradiation area EA#2 may move on the modeling surface MS as at least one of the processing head 21 and the stage 31 moves.

In FIG. 4 again, the processing light EL#2 reflected by the parallel plate 2152 enters the power meter 2153. Power meter 2153 is a specific example of an electrical component used to control processing light EL#2. Specifically, the power meter 2153 can detect the intensity of the processing light EL#2 that is incident on the power meter 2153. For example, the power meter 2153 may include a light receiving element that detects the processing light EL#2 as light. Alternatively, as the intensity of processing light EL#2 increases, the amount of energy generated by processing light EL#2 increases. As a result, the amount of heat generated by the processing light EL#2 increases. Therefore, the power meter 2153 may detect the intensity of the processing light EL#2 by detecting the processing light EL#2 as heat. In this case, the power meter 2153 may include a heat detection element that detects the heat of the processing light EL#2.

As described above, the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. Therefore, the power meter 2153 detects the intensity of the processing light EL#2 reflected by the parallel plate 2152. Since the parallel plate 2152 is placed on the optical path of the processing light EL#2 between the light source 4#2 and the galvano mirror 2156, the power meter 2153 is arranged on the optical path of the processing light EL#2 between the light source 4#2 and the galvano mirror 2156. It may be assumed that the intensity of the processing light EL#2 traveling is detected. In this case, the power meter 2153 can stably detect the intensity of the processing light EL#2 without being affected by the deflection of the processing light EL#2 by the galvanometer mirror 2156. However, the arrangement position of the power meter 2153 is not limited to the example shown in FIG. 3. For example, the power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path between the galvanometer mirror 2156 and the modeling surface MS. The power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path within the galvanometer mirror 2156.

The detection result of the power meter 2153 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#2 based on the detection result of the power meter 2153 (that is, the detection result of the intensity of the processing light EL#2). For example, the control unit 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on the modeling surface MS becomes a desired intensity. In order to control the intensity of the processing light EL#2, for example, the control unit 7 changes the intensity of the processing light EL#2 emitted from the light source 4#2 based on the detection result of the power meter 2153. , the light source 4#2 may be controlled. As a result, the processing system SYS can appropriately model a model on the model surface MS by irradiating the model surface MS with the processing light EL#2 having an appropriate intensity.

As described above, the processing light EL#2 has an intensity capable of melting the modeling material M. Therefore, the processing light EL#2 that enters the power meter 2153 may have an intensity that can melt the modeling material M. However, if the processing light EL#2 having an intensity capable of melting the modeling material M is incident on the power meter 2153, the power meter 2153 may be damaged by the processing light EL#2. Therefore, the processing light EL#2 having an intensity that is not high enough to damage the power meter 2153 may be incident on the power meter 2153. In other words, the second optical system 215 controls the processing light EL#2 that is incident on the power meter 2153 so that the processing light EL#2 having an intensity that is not high enough to damage the power meter 2153 is incident on the power meter 2153. The strength may be weakened.

For example, in order to weaken the intensity of the processing light EL#2 that enters the power meter 2153, the reflectance of the parallel plate 2152 with respect to the processing light EL#2 may be set to an appropriate value. Specifically, the lower the reflectance of the parallel plate 2152 for the processing light EL#2, the lower the intensity of the processing light EL#2 that enters the power meter 2153. Therefore, the reflectance of the parallel plate 2152 is set to a value low enough to allow processing light EL#2 having an intensity that is not high enough to damage the power meter 2153 to enter the power meter 2153. May be set. For example, the reflectance of the parallel plate 2152 may be less than 10%. For example, the reflectance of the parallel plate 2152 may be less than a few percent. Raw glass may be used as the parallel flat plate 2152 with low reflectance.

For example, in order to weaken the intensity of the processed light EL#2 that enters the power meter 2153, the second optical system 215 may cause the processed light EL#2 to enter the power meter 2153 via a plurality of parallel plates 2152. good. Specifically, the processing light EL#2 reflected multiple times by the parallel flat plates 2152 may be incident on the power meter 2153. In this case, the intensity of the processing light EL#2 reflected multiple times by the plurality of parallel flat plates 2152 is weaker than the intensity of the processing light EL#2 reflected once by the single parallel plate 2152. Therefore, there is a high possibility that the processing light EL#2 having an intensity that is not high enough to damage the power meter 2153 will be incident on the power meter 2153.

A desired coating treatment may be applied to the surface of the parallel plate 2152 (particularly at least one of the incident surface on which the processing light EL#2 is incident and the reflective surface on which the processing light EL#2 is reflected). For example, the surface of the parallel plate 2152 may be subjected to anti-reflection coating treatment (AR).

The third optical system 216 includes a prism mirror 2161 and an fθ lens 2162.

Processing light EL#1 emitted from the first optical system 214 and processing light EL#2 emitted from the second optical system 215 each enter the prism mirror 2161. The prism mirror 2161 reflects each of the processing lights EL#1 and EL#2 toward the fθ lens 2162. The prism mirror 2161 reflects the processing lights EL#1 and EL#2, which are incident on the prism mirror 2161 from different directions, in the same direction (specifically, towards the fθ lens 2162).

Note that if each of the processed light EL#1 emitted from the first optical system 214 and the processed light EL#2 emitted from the second optical system 215 can directly enter the fθ lens 2162, The three-optical system 216 does not need to include the prism mirror 2161.

The fθ lens 2162 is an optical system for emitting each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 toward the modeling surface MS. That is, the fθ lens 2162 is an optical system for irradiating each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 onto the modeling surface MS. As a result, the processing lights EL#1 and EL#2 that have passed through the fθ lens 2162 are irradiated onto the modeling surface MS.

The fθ lens 2162 may be an optical element that can condense each of the processing lights EL#1 and EL#2 onto a condensing surface. In this case, the fθ lens 2162 may be referred to as a condensing optical system. The condensing surface of the fθ lens 2162 may be set, for example, on the modeling surface MS. In this case, the third optical system 216 may be considered to include a condensing optical system with a projection characteristic of fθ. However, the third optical system 216 may include a condensing optical system whose projection characteristics are different from fθ. For example, the third optical system 216 may include a condensing optical system with a projection characteristic of f·tan θ. For example, the third optical system 216 may include a condensing optical system with a projection characteristic of f·sin θ.

In this embodiment, the optical axis of the fθ lens 2162 is used as the optical axis EX of the irradiation optical system 211. As described above, since the optical axis EX of the irradiation optical system 211 is along the Z-axis, the optical axis of the fθ lens 2162 is also along the Z-axis. Therefore, the fθ lens 2162 emits each of the processing lights EL#1 and EL#2 along the Z-axis direction. In this case, the irradiation direction of processing light EL#1 and the irradiation direction of processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be in the Z-axis direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be directions along the optical axis EX of the fθ lens 2162. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may not be the same direction. The irradiation direction of processing light EL#1 and the irradiation direction of processing light EL#2 may be different directions.

(1-3) Configuration of Calibration Unit 8 Next, the configuration of the calibration unit 8 will be described with reference to FIGS. 7(a) to 7(c). 7(a) is a top view showing the configuration of the calibration unit 8, and FIG. 7(b) and FIG. 7(c) are cross-sectional views showing the configuration of the calibration unit 8 (FIG. 7(a). ) is a sectional view taken along line AA'. still,
As shown in FIGS. 7(a) to 7(c), the calibration unit 8 includes a first calibration unit 81 and a second calibration unit 82. However, the calibration unit 8 does not need to include at least one of the first calibration unit 81 and the second calibration unit 82.

The first calibration unit 81 and the second calibration unit 82 may each be arranged on the base member 80 of the calibration unit 8. Each of the first calibration unit 81 and the second calibration unit 82 may be attached to the base member 80 of the calibration unit 8. In the following description, as shown in FIGS. 7(a) to 7(c), each of the first calibration unit 81 and the second calibration unit 82 has a calibration surface that is one surface of the base member 80. The explanation will proceed using an example placed in 801.

Each of the first calibration unit 81 and the second calibration unit 82 is a measuring device that can measure at least one of the processing lights EL#1 and EL#2. In the following description, in order to simplify the description, at least one of processing light EL#1 and EL#2 will be collectively referred to as "processing light EL" as described above.

During at least part of the measurement period in which at least one of the first calibration unit 81 and the second calibration unit 82 measures the processing light EL, the processing head 21 Processing light EL is irradiated onto at least one side. For example, as shown in FIG. 7B, the processing head 21 may irradiate the first calibration unit 81 with the processing light EL during at least part of the measurement period. As a result, the first calibration unit 81 can measure the processing light EL. For example, as shown in FIG. 7C, the processing head 21 may irradiate the second calibration unit 82 with the processing light EL during at least part of the measurement period. As a result, the second calibration unit 82 can measure the processing light EL.

As shown in FIGS. 7(b) and 7(c), during at least part of the measurement period, the calibration unit 8 is configured such that the processing head 21 is in the position of the first calibration unit 81 and the second calibration unit 82. It is located at a measurement position Pos2 that can realize a state in which at least one side can be irradiated with the processing light EL.

The measurement position Pos2 may include a position that satisfies the conditions shown below. For example, as shown in FIGS. 7(b) and 7(c), when the calibration unit 8 is located at the measurement position Pos2, the measurement position Pos2 is the first calibration unit 81 and the second calibration unit 82. may include a position that satisfies the condition that at least one of them faces the processing head 21 (in particular, the irradiation optical system 211). For example, as shown in FIGS. 7(b) and 7(c), when the calibration unit 8 is located at the measurement position Pos2, the measurement position Pos2 is the first calibration unit 81 and the second calibration unit 82. may include a position that satisfies the condition that at least one of them faces the direction in which the processing head 21 (in particular, the irradiation optical system 211) is present. For example, as shown in FIGS. 7(b) and 7(c), when the calibration unit 8 is located at the measurement position Pos2, the measurement position Pos2 is the first calibration unit 81 and the second calibration unit 82. may include a position that satisfies the condition that at least one of the positions faces the +Z side. This is because, as described above, the processing head 21 emits the processing light EL traveling along the Z-axis direction toward the −Z side. For example, as shown in FIGS. 7(b) and 7(c), when the calibration unit 8 is located at the measurement position Pos2, the measurement position Pos2 is the first calibration unit 81 and the second calibration unit 82. may include a position that satisfies the condition that the calibration surface 801 on which is placed faces the +Z side. For example, as shown in FIGS. 7(b) and 7(c), the measurement position Pos2 meets the condition that the calibration surface 801 intersects the Z-axis when the calibration unit 8 is located at the measurement position Pos2. May contain positions to be filled. For example, as shown in FIGS. 7(b) and 7(c), when the calibration unit 8 is located at the measurement position Pos2, the calibration surface 801 is aligned with the optical axis EX of the irradiation optical system 211. It may also include positions that satisfy the condition of intersecting. For example, as shown in FIGS. 7(b) and 7(c), when the calibration unit 8 is located at the measurement position Pos2, the measurement position Pos2 is the first calibration unit 81 and the second calibration unit 82. may include a position that satisfies the condition that at least one of them is located on the optical path of the processing light EL. For example, as shown in FIGS. 7(b) and 7(c), when the calibration unit 8 is located at the measurement position Pos2, the measurement position Pos2 is the first calibration unit 81 and the second calibration unit 82. may include a position that satisfies the condition that at least one of them is located on the optical axis EX of the irradiation optical system 211. In this case, it can be said that the measurement position Pos2 is a position on the optical axis EX of the irradiation optical system 211.

As a result, the processing head 21 can appropriately irradiate at least one of the first calibration unit 81 and the second calibration unit 82 with the processing light EL during at least part of the measurement period. Therefore, at least one of the first calibration unit 81 and the second calibration unit 82 can appropriately measure the processing light EL during at least part of the measurement period.

On the other hand, as described above, the processing unit 2 (particularly the processing head 21) forms a shaped object on the work W by irradiating the work W with the processing light EL. For this reason, if the calibration unit 8 is located at the measurement position Pos2 during the modeling period in which the processing head 21 forms the object, the processing head 21 cannot appropriately irradiate the workpiece W with the processing light EL. there is a possibility. For this reason, the calibration unit 8 may be located at a non-measurement position Pos1 different from the measurement position Pos2 during at least part of the modeling period.

The non-measurement position Pos1 may include a position that satisfies the conditions shown below. For example, as shown in FIG. 8 showing the calibration unit 8 located at the non-measurement position Pos1, when the calibration unit 8 is located at the non-measurement position Pos1, the processing head 21 (in particular, the irradiation The optical system 211) may include a position that satisfies the condition that the calibration unit 8 cannot be irradiated with the processing light EL. For example, as shown in FIG. 8, the non-measurement position Pos1 is a position that satisfies the condition that the calibration unit 8 is not facing the processing head 21 when the calibration unit 8 is located at the non-measurement position Pos1. May contain. For example, as shown in FIG. 8, when the calibration unit 8 is located at the non-measurement position Pos1, the non-measurement position Pos1 is located at the non-measurement position Pos1. ) may include a position that satisfies the condition that the processing head 21 (in particular, the irradiation optical system 211) faces a direction different from the direction in which it exists. For example, as shown in FIG. 8, the non-measurement position Pos1 satisfies the condition that when the calibration unit 8 is located at the non-measurement position Pos1, the calibration unit 8 is not located on the optical path of the processing light EL. May contain positions to be filled. For example, as shown in FIG. 8, when the calibration unit 8 is located at the non-measurement position Pos1, the calibration unit 8 moves from the optical path of the processing light EL to the optical axis of the irradiation optical system 211. It may also include positions that satisfy the condition that they are located at separate positions along the direction intersecting EX. In this case, it can be said that the non-measurement position Pos1 is a position away from the optical axis EX of the irradiation optical system 211.

As a result, the calibration unit 8 does not interfere with the irradiation of the processing light EL onto the workpiece W during at least part of the modeling period. Therefore, the processing head 21 can appropriately irradiate the workpiece W with the processing light EL. For this reason, the processing head 21 can appropriately model the object on the workpiece W during at least part of the modeling period.

However, even if the calibration unit 8 is located at the measurement position Pos2, if the processing head 21 can appropriately irradiate the workpiece W with the processing light EL, the calibration unit 8 may be located at the measurement position Pos2 during at least part of the modeling period. The measurement unit 8 may be located at the measurement position Pos2.

The processing system SYS may move the calibration unit 8 between the non-measurement position Pos1 and the measurement position Pos2. Specifically, the processing system SYS may move the calibration unit 8 so that the calibration unit 8 is located at the non-measurement position Pos1 during at least part of the modeling period. On the other hand, the processing system SYS may move the calibration unit 8 so that the calibration unit 8 is located at the measurement position Pos2 during at least part of the measurement period.

As described above, in this embodiment, the stage drive system 32 moves the calibration unit 8. Therefore, the stage drive system 32 may move the calibration unit 8 under the control of the control unit 7 so that the calibration unit 8 is located at the non-measurement position Pos1 during at least part of the modeling period. On the other hand, the stage drive system 32 may move the calibration unit 8 under the control of the control unit 7 so that the calibration unit 8 is located at the measurement position Pos2 during at least part of the measurement period.

In this embodiment, as described above, the calibration unit 8 is placed in the cradle 324 that is rotatable around the rotation axis along the X axis (that is, the A axis). In this case, as shown in FIGS. 9A and 9B, which show the calibration unit 8 placed on the cradle 324, the calibration unit 8 is placed on the placement surface 3241, which is the side surface of the cradle 324. You can. The placement surface 3241 of the cradle 324 may be a different surface from the stage placement surface 3242 of the cradle 324 on which the stage 31 is placed.

When the calibration unit 8 is placed on the placement surface 3241 that is different from the stage placement surface 3242, the rotation of the cradle 324 around the A axis causes the calibration unit 8 to move to the non-measurement position Pos1 (FIG. 9(a)). and measurement position Pos2 (FIG. 9(b)). That is, the stage drive system 32 may move the calibration unit 8 between the non-measurement position Pos1 and the measurement position Pos2 by rotating the cradle 324 around the A-axis.

For example, as shown in FIG. 9A, the stage drive system 32 is configured such that the stage mounting surface 3242 and the workpiece mounting surface 311 are connected to the processing head 21 (in particular, the irradiation optical system 211) during at least part of the modeling period. The cradle 324 may be rotated so as to face the direction in which the cradle 324 exists (for example, the Z-axis direction). The stage drive system 32 is configured such that the stage mounting surface 3242 and the workpiece mounting surface 311 face the direction along the optical axis EX of the irradiation optical system 211 (for example, the Z-axis direction) during at least part of the modeling period. , the cradle 324 may be rotated. On the other hand, the stage drive system 32 is configured such that the arrangement surface 3241 is located in a direction different from the direction in which the processing head 21 (in particular, the irradiation optical system 211) exists (for example, in a direction along the XY plane) during at least part of the modeling period. ) The cradle 324 may be rotated so that it faces . The stage drive system 32 rotates the cradle 324 so that the arrangement surface 3241 faces a direction intersecting the optical axis EX of the irradiation optical system 211 (for example, a direction along the XY plane) during at least part of the modeling period. You may let them. As a result, the processing head 21 can appropriately irradiate the workpiece W placed on the workpiece placement surface 311 of the stage 31 with the processing light EL during at least part of the modeling period.

On the other hand, for example, as shown in FIG. 9(b), the stage drive system 32 is configured such that the arrangement surface 3241 is aligned in the direction in which the processing head 21 (in particular, the irradiation optical system 211) is present during at least part of the measurement period. For example, the cradle 324 may be rotated so as to face in the Z-axis direction. The stage drive system 32 rotates the cradle 324 so that the arrangement surface 3241 faces the direction along the optical axis EX of the irradiation optical system 211 (for example, the Z-axis direction) during at least part of the measurement period. good. On the other hand, the stage drive system 32 allows the stage mounting surface 3242 and the workpiece mounting surface 311 to move in a direction different from the direction in which the processing head 21 (in particular, the irradiation optical system 211) exists during at least part of the measurement period. For example, the cradle 324 may be rotated so as to face in a direction along the XY plane. The stage drive system 32 allows the stage mounting surface 3242 and the workpiece mounting surface 311 to move in a direction intersecting the optical axis EX of the irradiation optical system 211 (for example, a direction along the XY plane) during at least part of the measurement period. The cradle 324 may be rotated so that it is oriented. As a result, the processing head 21 can appropriately irradiate the calibration unit 8 with the processing light EL during at least part of the measurement period. Therefore, at least one of the first calibration unit 81 and the second calibration unit 82 can appropriately measure the processing light EL.

In the example shown in FIGS. 9(a) and 9(b), the arrangement surface 3241 is a surface that intersects the stage mounting surface 3242 at an angle of 90 degrees. In this case, the stage drive system 32 may move the calibration unit 8 between the non-measurement position Pos1 and the measurement position Pos2 by rotating the cradle 324 by 90 degrees. For example, the stage drive system 32 rotates the cradle 324 90 degrees clockwise around the A axis while the calibration unit 8 is located at the non-measurement position Pos1, thereby moving the calibration unit 8 to the position shown in FIG. It may be moved from the non-measurement position Pos1 shown in (a) to the measurement position Pos2 shown in FIG. 9(b). For example, the stage drive system 32 rotates the cradle 324 by 90 degrees counterclockwise around the A axis while the calibration unit 8 is located at the measurement position Pos2, thereby moving the calibration unit 8 to the position shown in FIG. It may be moved from the measurement position Pos2 shown in FIG. 9B to the non-measurement position Pos1 shown in FIG. 9A.

Note that the arrangement surface 3241 is not limited to a surface that intersects the stage placement surface 3242 at an angle of 90 degrees. The arrangement surface 3241 may be a surface that intersects the stage mounting surface 3242 at an angle different from 90 degrees.

When the calibration unit 8 is placed in the cradle 324, the stage drive system 32 rotates the cradle 324 and changes the attitude of the cradle 324, thereby adjusting the position between the non-measurement position Pos1 and the measurement position Pos2. It may be considered that the calibration unit 8 is being moved. Specifically, the stage drive system 32 sets the posture of the calibration unit 8 to a reference posture (FIG. 9(a)) that can realize a state in which the calibration unit 8 is located at the non-measurement position Pos1, and a calibration unit 8 may be considered to be changing between the state where it is located at the measurement position Pos2 and the realizable non-reference posture (FIG. 9(b)).

The reference posture of the cradle 324 may be a posture that allows the stage placement surface 3242 of the cradle 324 to be a surface along the XY plane (that is, a horizontal surface). The reference attitude of the cradle 324 may be an attitude that allows the stage placement surface 3242 of the cradle 324 to intersect (perpendicularly intersect with) the Z-axis. The reference posture of the cradle 324 may be a posture that allows the workpiece placement surface 311 of the stage 31 to be a surface along the XY plane (that is, a horizontal surface). The reference posture of the cradle 324 may be a posture that allows the workpiece placement surface 311 of the stage 31 to intersect (perpendicularly intersect with) the Z-axis. The reference attitude of the cradle 324 may be the initial attitude of the cradle 324. The reference attitude of the cradle 324 may be the initial attitude of the cradle 324 when the stage drive system 32 is powered off. The reference posture of the cradle 324 may be an initial posture of the cradle 324 that can realize a state in which the height of the workpiece mounting surface 311 of the stage 31 does not change even when the stage 31 rotates around the C-axis. .

Note that when the calibration unit 8 rotates around the rotation axis, it can be said that the attitude of the calibration unit 8 changes. In this case, the processing system SYS sets the orientation of the calibration unit 8 to the first orientation, which is the orientation of the calibration unit 8 located at the non-measurement position Pos1, and the orientation of the calibration unit 8 located at the measurement position Pos2. It may be considered that the posture has changed from the second posture.

Referring again to FIG. 7, in this embodiment, the first calibration unit 81 is a measuring device that can measure the processing light EL by receiving the processing light EL. For this reason, the first calibration unit 81 includes a light receiving device 811. The light receiving device 811 may be arranged on the base member 80 of the calibration unit 8. Specifically, the light receiving device 811 may be placed on the calibration surface 801 of the base member 80.

In this embodiment, the light receiving device 811 may be used mainly to measure the intensity of the processing light EL. In this case, the light receiving device 811 may function as a power meter that can measure the intensity of the processing light EL. For example, the light receiving device 811 may include a light receiving element that detects the processing light EL as light. Alternatively, as the intensity of the processing light EL increases, the amount of energy generated by the processing light EL increases. As a result, the amount of heat generated by the processing light EL increases. Therefore, the light receiving device 811 may detect the intensity of the processing light EL by detecting the processing light EL as heat. In this case, the light receiving device 811 may include a heat detection element that detects the heat of the processing light EL. Note that since the first calibration unit 81 includes a light receiving device 811 that measures the intensity of the processed light EL, the first calibration unit can be used as a processed light measurement device that measures the intensity or energy amount of the processed light EL. may be called.

Similarly to the first calibration unit 81, the second calibration unit 82 is also a measuring device that can measure the processing light EL by receiving the processing light EL. For this reason, the second calibration unit 82 includes a light receiving device 821. However, the second calibration unit 82 is different from the first calibration unit in that the light receiving device 821 receives the processing light EL through the aperture member 822, and the light receiving device 811 receives the processing light EL without passing through the aperture member 822. tion unit 81. For this reason, the second calibration unit 82 includes an aperture member 822 in addition to the light receiving device 821. Note that since the second calibration unit 82 includes the opening member 822 that serves as a reference for position measurement and rotation measurement, the second calibration unit 82 may be referred to as a reference member. Further, since the second calibration unit 82 measures the irradiation position of the processing light EL with respect to the aperture member 822, the second calibration unit 82 may be referred to as a processing light position measuring device.

The light receiving device 821 and the aperture member 822 may be arranged on the base member 80 of the calibration unit 8. Specifically, the light receiving device 821 and the aperture member 822 may be arranged on the calibration surface 801 of the base member 80. In the example shown in FIGS. 7A and 7B, the light receiving device 821 and the opening member 822 are arranged inside a depression 810 (that is, a recess) formed in the base member 80.

The opening member 822 is a member in which an opening 823 through which the processing light EL can pass is formed. The opening 823 can function as a through hole passing through the opening member 822. In this case, the light receiving device 821 receives the processing light EL that has passed through the opening 823. Note that the opening member 822 may also be referred to as a mask.

Since the light receiving device 821 receives the processed light EL that has passed through the aperture 823, as shown in FIG. They may be lined up along the direction. During at least part of the measurement period, the aperture 823 and the light receiving device 821 may be aligned along the optical axis EX of the irradiation optical system 211. Therefore, at the measurement position Pos2 described above, when the calibration unit 8 is located at the measurement position Pos2, the aperture 823 and the light receiving device 821 are located at least in the traveling direction of the processing light EL and the optical axis EX of the irradiation optical system 211. It may also include positions that satisfy the condition of being lined up along one side. Note that a deflection member that deflects the processed light EL may be disposed between the opening 823 and the light receiving device 821.

On the other hand, during at least part of the modeling period, the opening 823 and the light receiving device 821 do not need to be aligned along at least one of the traveling direction of the processing light EL and the optical axis EX of the irradiation optical system 211. Therefore, in the non-measurement position Pos1 described above, when the calibration unit 8 is located at the non-measurement position Pos1, the opening 823 and the light receiving device 821 may include positions that satisfy the condition that they are not lined up along at least one of the following. In particular, when the calibration unit 8 is rotatable around the rotation axis (for example, the A-axis), the aperture 823 and the light receiving device 821 are aligned with the traveling direction of the processing light EL and the optical axis EX of the irradiation optical system 211. They may be arranged along a direction that intersects at least one of them. Therefore, in the non-measurement position Pos1 described above, when the calibration unit 8 is located at the non-measurement position Pos1, the opening 823 and the light receiving device 821 may include positions that satisfy the condition of being lined up along a direction that intersects at least one of the following.

The opening 823 may have a predetermined shape in a plane along the surface of the opening member 822 (in the example shown in FIGS. 7(a) and 7(b), the XY plane). In this case, the opening 823 may form a mark (that is, a pattern) 824 having a predetermined shape corresponding to the shape of the opening 823 in a plane along the surface of the opening member 822. That is, a mark (that is, a pattern) 824 having a predetermined shape may be formed in the opening member 822 by the opening 823 having a predetermined shape.

FIG. 7 shows an example in which four different types of marks 824 are formed on the opening member 822. Specifically, FIG. 7 shows a search mark 8241 which is an example of the mark 824, a pinhole mark 8242 which is an example of the mark 824, a slit mark 8243 which is an example of the mark 824, and a mark 824 on the opening member 822. An example in which a slit mark 8244 is formed is shown.

An example of the search mark 8241 is shown in FIG. 10(a). As shown in FIG. 10(a), the search mark 8241 includes two slit-shaped openings 8231-1, two slit-shaped openings 8231-2, and one slit-shaped opening 8231-3, each of which is an opening 823. It may be formed from. Each of the two openings 8231-1 extends along the first direction (for example, the Y-axis direction) along the calibration surface 801. The two openings 8231-1 are spaced apart from each other along the second direction (for example, the X-axis direction) that extends along the calibration surface 801 and intersects the first direction. Each of the two openings 8231-2 extends along the second direction (for example, the X-axis direction). The two openings 8231-2 are spaced apart from each other along the first direction (for example, the Y-axis direction). Opening 8231-3 is located between two openings 8231-1. Opening 8231-3 is located between two openings 8231-2. The opening 8231-3 extends along a third direction that is inclined (that is, diagonally intersects) with respect to the first direction in which the opening 8231-1 extends and the second direction in which the opening 8231-2 extends.

In the example shown in FIG. 10(a), a single search mark 8241 is formed on the opening member 822. However, a plurality of search marks 8241 may be formed on the opening member 822. Note that when a plurality of search marks 8241 are formed on the opening member 822, one search mark 8241 among the plurality of search marks 8241 is located on a straight line connecting two other search marks among the plurality of search marks 8241. It may be placed at a different position. For example, when three or more search marks 8241 are formed on the opening member 822, one search mark 8241 among the three or more search marks 8241 is different from the other two search marks 8241 among the three or more search marks 8241. It may be arranged at a position different from the position on the straight line connecting.

An example of the pinhole mark 8242 is shown in FIG. 10(b). As shown in FIG. 10(b), the pinhole mark 8242 may be formed by an opening 8232 that is an opening 823 that can function as a pinhole. In the example shown in FIG. 10(b), the cross-sectional shape of the opening 8232 in the direction along the surface of the opening member 822 is circular. However, the cross-sectional shape of the opening 8232 in the direction along the surface of the opening member 822 may be different from a circular shape. For example, the cross-sectional shape of the opening 8232 in the direction along the surface of the opening member 822 may be elliptical or rectangular.

In the example shown in FIG. 10(b), a plurality of pinhole marks 8242 are formed in the opening member 822. Specifically, the aperture member 822 has a plurality of pinhole marks 8242 distributed in a matrix on the surface of the aperture member 822 . However, a single pinhole mark 8242 may be formed in the opening member 822. FIG. 10(b) shows an example in which a plurality of pinhole marks 8242 are arranged in a two-dimensional matrix arrangement pattern. However, the plurality of pinhole marks 8242 may be arranged in a different arrangement pattern from the arrangement pattern shown in FIG. 10(b). For example, the plurality of pinhole marks 8242 may be arranged in an arrangement pattern in which the plurality of pinhole marks 8242 are lined up along a circle having a predetermined radius. may be placed. For example, the plurality of pinhole marks 8242 may be arranged in an arrangement pattern in which at least two pinhole marks 8242 are arranged along each of a plurality of concentric circles having different radii from the center.

An example of the slit mark 8243 is shown in FIG. 10(c). As shown in FIG. 10(c), the slit mark 8243 is formed by an opening 8233 that is a slit-shaped opening 823 extending along the third direction (for example, the Y-axis direction) along the calibration surface 801. Good too. That is, the slit mark 8243 may be formed by a slit-shaped opening 8233 whose longitudinal direction is the third direction (for example, the Y-axis direction) along the calibration surface 801. The slit mark 8243 may be formed by a slit-shaped opening 8233 extending along the longitudinal direction intersecting the optical axis EX of the irradiation optical system 211.

In the example shown in FIG. 10(c), a single slit mark 8243 is formed in the opening member 822. However, a plurality of slit marks 8243 may be formed in the opening member 822. The slit mark 8243 of the aperture member 822 has a slit-shaped opening 823 extending along the third direction (for example, the Y-axis direction) along the calibration surface 801 and the above-mentioned third direction. A plurality of marks may be formed by lining up a plurality of marks along a fourth direction (for example, the X-axis direction) that intersects the above directions.

An example of the slit mark 8244 is shown in FIG. 10(d). As shown in FIG. 10(d), the slit mark 8244 is a slit-shaped opening extending along the calibration surface 801 and along a fourth direction (for example, the X-axis direction) that intersects with the third direction described above. 823 may be formed by an opening 8234. That is, the slit mark 8244 may be formed by a slit-shaped opening 8234 extending in a direction that intersects (perpendicular to) the direction in which the slit mark 8243 extends. The slit mark 8244 may be formed by a slit-shaped opening 8234 whose longitudinal direction is the fourth direction (for example, the X-axis direction) along the calibration surface 801. The slit mark 8244 may be formed by a slit-shaped opening 8234 extending along the longitudinal direction intersecting the optical axis EX of the irradiation optical system 211.

In the example shown in FIG. 10(d), a single slit mark 8244 is formed in the opening member 822. However, a plurality of slit marks 8244 may be formed in the opening member 822. The slit mark 8244 of the opening member 822 is formed by lining up a plurality of slit-shaped openings 823 extending along the fourth direction (for example, the X-axis direction) along the third direction (for example, the Y-axis direction). It may be a mark.

As described later, the mark 824 may be irradiated with processing light EL. In this case, the above-mentioned measurement position Pos2 is a position that satisfies the condition that the processing light EL deflected by the galvano mirror 2146 or 2156 can be irradiated onto the mark 824 when the calibration unit 8 is located at the measurement position Pos2. May contain. The measurement position Pos2 may include a position that satisfies the condition that the mark 824 is located within the scanning range of the processing light EL by the galvanometer mirror 2146 or 2156 when the calibration unit 8 is located at the measurement position Pos2. When a plurality of marks 824 are formed, the measurement position Pos2 is such that when the calibration unit 8 is located at the measurement position Pos2, a plurality of marks 824 are formed within the scanning range of the processing light EL by the galvanometer mirror 2146 or 2156. It may include positions that satisfy the condition that at least two of them are located.

Again in FIGS. 7(a) and 7(b), the light receiving device 821 can receive the processing light EL that has passed through the opening 823 of the opening member 822. The light receiving device 821 may include a light receiving element capable of receiving the processing light EL. As an example of the light receiving element, at least one of a photodetector, a CCD (Charge Coupled Device) sensor, a CMOS (Complementary Metal Oxide Semiconductor) sensor, and a sensor using an InGaAs (Indium Gallium Arsenide) element is used. I can give you one. Note that the light receiving element may also be referred to as a light receiving sensor.

The light receiving element may include only one light receiving portion capable of receiving the processing light EL. That is, a single light receiving portion may be formed on the light receiving surface of the light receiving element. Alternatively, the light receiving element may include a plurality of light receiving sections capable of receiving the processing light EL. That is, a plurality of light receiving sections may be formed on the light receiving surface of the light receiving element.

The light receiving device 821 may include a single light receiving element. In this case, the light receiving device 821 may include a single light receiving element having a single light receiving section. Alternatively, the light receiving device 821 may include a single light receiving element including a plurality of light receiving sections. Alternatively, the light receiving device 821 may include a plurality of light receiving elements. In this case, the light receiving device 821 may include a plurality of light receiving elements each having a single light receiving section. The light receiving device 821 may include a plurality of light receiving elements including a light receiving element having a single light receiving portion. The light receiving device 821 may include a plurality of light receiving elements each including a plurality of light receiving sections. The light receiving device 821 may include a plurality of light receiving elements including a light receiving element having a plurality of light receiving sections.

The light receiving device 821 may receive the processing light EL via a color filter. For example, the light receiving device 821 may receive the processed light EL through a first color filter that cuts light components with wavelengths of green light and blue light and allows light components with a wavelength of red light to pass through. For example, the light receiving device 821 may receive the processed light EL through a second color filter that cuts light components with wavelengths of red light and blue light and allows light components with a wavelength of green light to pass through. For example, the light receiving device 821 may receive the processed light EL through a third color filter that cuts light components with wavelengths of red light and green light and allows light components with a wavelength of blue light to pass through.

When the light receiving device 821 receives the processed light EL through a color filter, the control unit 7 may specify the wavelength of the processed light EL based on the light reception result of the light receiving device 821. For example, the control unit 7 may determine whether the wavelength of the processing light EL is the wavelength of red light based on the light reception result of the light receiving device 821. For example, the control unit 7 may determine whether the wavelength of the processed light EL is the wavelength of green light based on the light reception result of the light receiving device 821. For example, the control unit 7 may determine whether the wavelength of the processed light EL is the wavelength of blue light based on the light reception result of the light receiving device 821. In this case, the control unit 7 may determine whether the calibration unit 8 is measuring the processing light EL#1 generated by the light source 4#1 based on the result of specifying the wavelength of the processing light EL. . The control unit 7 may determine whether the calibration unit 8 is measuring the processing light EL#2 generated by the light source 4#2, based on the result of specifying the wavelength of the processing light EL.

Here, as described above, the processing light EL has an intensity capable of melting the modeling material M. Therefore, the processing light EL incident on the light receiving device 821 may have an intensity capable of melting the modeling material M. However, when processing light EL having an intensity capable of melting the modeling material M enters the light receiving device 821, there is a possibility that the light receiving device 821 is damaged by the processing light EL. Therefore, processing light EL having an intensity that is not high enough to damage the light receiving device 821 may be incident on the light receiving device 821. In other words, the second calibration unit 82 adjusts the intensity of the processed light EL that enters the light receiving device 821 so that the processed light EL having an intensity that is not high enough to damage the light receiving device 821 enters the light receiving device 821. You can weaken it.

For example, the second calibration unit 82 may include an attenuation filter 825 that can attenuate the intensity of the processing light EL. An example of the attenuation filter 825 is a neutral density filter (ND). In this case, the light receiving device 821 may receive the processed light EL that has passed through the attenuation filter 825. Furthermore, the aperture member 822 may be irradiated with the processing light EL that has passed through the attenuation filter 825. As a result, not only damage to the light receiving device 821 but also damage to the aperture member 822 can be prevented.

Further, in order to prevent damage to the opening member 822, the opening member 822 may be formed using a material that is not easily affected by the heat transmitted from the processing light EL. For example, the opening member 822 may be formed using a metal material such as copper. In this case, the attenuation filter 825 may be installed between the aperture member 822 and the light receiving device 821.

Alternatively, for example, the control unit 7 controls the light source 4 so that the intensity of the processing light EL during at least part of the measurement period is weaker than the intensity of the processing light EL during at least part of the modeling period. The intensity of the processing light EL emitted from 4 may be controlled. In particular, the control unit 7 controls the light source 4 so that the intensity of the processed light EL during at least a part of the measurement period is low enough not to damage the light receiving device 821 and the aperture member 822. The intensity of the emitted processing light EL may be controlled. Even in this case, damage to the light receiving device 821 and the aperture member 822 due to the processing light EL can be prevented.

The light reception information indicating the result of reception of the processed light EL by the light receiving device 821 is outputted from the calibration unit 8 to the control unit 7 as at least part of the measurement information indicating the measurement result of the processed light EL by the calibration unit 8. For example, the light reception information indicating the reception result of processed light EL#1 by the light receiving device 821 is transmitted from the calibration unit 8 to the control unit as at least part of the measurement information indicating the measurement result of processed light EL#1 by the calibration unit 8. 7 is output. For example, the light reception information indicating the reception result of processed light EL#2 by the light receiving device 821 is transmitted from the calibration unit 8 to the control unit as at least part of the measurement information indicating the measurement result of processed light EL#2 by the calibration unit 8. 7 is output.

The control unit 7 may control the processing system SYS based on the measurement information output from the calibration unit 8. In particular, the control unit 7 may control the processing system SYS based on measurement information acquired during at least a part of the measurement period described above during at least part of the printing period in which the processing head 21 forms the object. good. For example, the control unit 7 may control the processing unit 2 (for example, at least one of the processing head 21 and the head drive system 22) included in the processing system SYS based on the measurement information. In particular, as will be described in detail later, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 included in the processing head 21 based on the measurement information. For example, the control unit 7 may control the stage unit 3 (for example, the stage drive system 32) included in the processing system SYS based on the measurement information. For example, the control unit 7 may control the light source 4 included in the processing system SYS based on the measurement information.

As an example, as described above, the measurement information indicates the measurement result of the processing light EL#1. In this case, the control unit 7 may control the irradiation mode of the processing light EL#1 based on measurement information indicating the measurement result of the processing light EL#1. In other words, the control unit 7 may control an irradiation mode changing device capable of changing the irradiation mode of the processing light EL#1 based on measurement information indicating the measurement result of the processing light EL#1. For example, as an example of the irradiation mode of the processing light EL#1, as described above, at least one of the intensity of the processing light EL#1, the irradiation position of the processing light EL#1, and the irradiation timing of the processing light EL#1 can be mentioned. . In this case, an example of an irradiation mode changing device that can change the irradiation mode of the processing light EL#1 is a light source 4#1 that can change the intensity of the processing light EL#1. Another example of an irradiation mode changing device that can change the irradiation mode of processing light EL#1 is to change the irradiation position of processing light EL#1 (specifically, the position of target irradiation area EA#1 on the modeling surface MS). ), a galvanometer mirror 2146, a head drive system 22, and a stage drive system 32, which can change the speed.

As another example, as described above, the measurement information indicates the measurement result of processing light EL#2. In this case, the control unit 7 may control the irradiation mode of the processing light EL#2 based on measurement information indicating the measurement result of the processing light EL#2. In other words, the control unit 7 may control an irradiation mode changing device capable of changing the irradiation mode of the processing light EL#2 based on measurement information indicating the measurement result of the processing light EL#2. For example, as described above, as an example of the irradiation mode of the processing light EL#2, there is at least one of the intensity of the processing light EL#2, the irradiation position of the processing light EL#2, and the irradiation timing of the processing light EL#2. . In this case, an example of an irradiation mode changing device that can change the irradiation mode of the processing light EL#2 is a light source 4#2 that can change the intensity of the processing light EL#2. Another example of an irradiation mode changing device that can change the irradiation mode of processing light EL#2 is to change the irradiation position of processing light EL#2 (specifically, the position of target irradiation area EA#2 on the modeling surface MS). ), a galvanometer mirror 2156, a head drive system 22, and a stage drive system 32, which can change the speed.

However, the control unit 7 may control the irradiation mode of the processing light EL#2 based on measurement information indicating the measurement result of the processing light EL#1. In other words, the control unit 7 may control an irradiation mode changing device capable of changing the irradiation mode of the processing light EL#2 based on measurement information indicating the measurement result of the processing light EL#1. The control unit 7 may control the irradiation mode of the processing light EL#1 based on measurement information indicating the measurement result of the processing light EL#2. In other words, the control unit 7 may control an irradiation mode changing device capable of changing the irradiation mode of the processing light EL#1 based on measurement information indicating the measurement result of the processing light EL#2.

Alternatively, the control unit 7 may control the irradiation mode of the processing light EL#1 based on measurement information indicating both the measurement results of the processing light EL#1 and the measurement results of the processing light EL#2. The control unit 7 may control the irradiation mode of the processing light EL#2 based on measurement information indicating both the measurement results of the processing light EL#1 and the measurement results of the processing light EL#2.

(2) Operation of processing system SYS Next, the operation of processing system SYS will be explained.

(2-1) Additional machining operation performed by the machining system SYS First, the additional machining (additional machining operation) that the machining system SYS performs on the workpiece W will be described. The additional processing performed on the workpiece W corresponds to an operation of forming a formed object such that a formed object integrated with the workpiece W (or separable from it) is added to the workpiece W. In the following, for convenience of explanation, additional processing for forming a three-dimensional structure ST, which is a modeled object having a desired shape, will be described. As described above, the processing system SYS forms the three-dimensional structure ST by performing additional processing based on the laser overlay welding method. Therefore, the processing system SYS may model the three-dimensional structure ST by performing existing additional processing based on the laser overlay welding method. Hereinafter, an example of the operation of modeling the three-dimensional structure ST using the laser overlay welding method will be briefly described.

The processing system SYS forms the three-dimensional structure ST on the workpiece W based on three-dimensional model data (in other words, three-dimensional model information) of the three-dimensional structure ST to be formed. As the three-dimensional model data, measurement data of a three-dimensional object measured by at least one of a measuring device provided within the processing system SYS and a three-dimensional shape measuring machine provided separately from the processing system SYS may be used. In order to model the three-dimensional structure ST, the processing system SYS sequentially models, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the processing system SYS sequentially shapes a plurality of structural layers SL one by one based on data on the plurality of layers obtained by cutting the three-dimensional model of the three-dimensional structure ST into rounds along the Z-axis direction. To go. As a result, a three-dimensional structure ST, which is a layered structure in which a plurality of structural layers SL are stacked, is modeled. Note that the structural layer SL does not necessarily have to be a shaped object having a layered shape. Hereinafter, a flow of operations for modeling a three-dimensional structure ST by sequentially modeling a plurality of structural layers SL one by one will be described.

First, the operation of forming each structural layer SL will be described with reference to FIGS. 11(a) to 11(e). In the processing system SYS, under the control of the control unit 7, processing unit areas BSA#1 and BSA#2 are set in desired areas on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the structured layer SL that has been modeled. At least one of the processing head 21 and the stage 31 is moved so that the processing head 21 and the stage 31 are moved. After that, the irradiation optical system 211 irradiates the processing unit areas BSA#1 and BSA#2 with processing lights EL#1 and EL#2, respectively. At this time, condensing positions CP#1 and CP#2 at which processing lights EL#1#1 and EL#2 are condensed, respectively, in the Z-axis direction may coincide with the modeling surface MS. Alternatively, the focusing positions CP#1 and CP#2 at which the processing lights EL#1#1 and EL#2 are focused, respectively, in the Z-axis direction may be located outside the modeling surface MS. As a result, as shown in FIG. 11(a), molten pools MP#1 and MP#2 are formed on the modeling surface MS irradiated with the processing beams EL#1 and EL#2, respectively. Further, as shown in FIG. 11(b), the processing system SYS supplies the modeling material M from the material nozzle 212 under the control of the control unit 7. As a result, the modeling material M is supplied to each of the molten pools MP#1 and MP#2. The modeling material M supplied to the molten pool MP#1 is melted by the processing light EL#1 that is irradiated to the molten pool MP#1. Similarly, the modeling material M supplied to the molten pool MP#2 is melted by the processing light EL#2 that is irradiated to the molten pool MP#2.

Further, the irradiation optical system 211 uses galvano mirrors 2146 and 2156 to move target irradiation areas EA#1 and EA#2 within processing unit areas BSA#1 and BSA#2, respectively. That is, the irradiation optical system 211 scans the processing unit areas BSA#1 and BSA#2 with the processing light beams EL#1 and EL#2, respectively, using the galvanometer mirrors 2146 and 2156, respectively. When the processing light EL#1 is no longer irradiated to the molten pool MP#1 due to the movement of the target irradiation area EA#1, the modeling material M melted in the molten pool MP#1 is cooled and solidified (that is, solidified). do. Similarly, when the processing light EL#2 stops irradiating the molten pool MP#2 with the movement of the target irradiation area EA#2, the modeling material M melted in the molten pool MP#2 is cooled and solidified (i.e. , coagulation). Furthermore, as the target irradiation areas EA#1 and EA#2 move, the molten pools MP#1 and MP#2 also move. As a result, as shown in FIG. 11(c), within the processing unit areas BSA#1 and BSA#2 where the molten pools MP#1 and MP#2 move, a modeled object made of the solidified modeling material M is It is deposited on the modeling surface MS.

In addition, in FIG. 11(c), for convenience of explanation, a modeled object is composed of a modeling material M solidified in the processing unit area BSA#1, and a modeled object is composed of a modeling material M solidified in the processing unit area BSA#2. The model is physically separated from the model. However, the modeled object made of the solidified modeling material M in the processing unit area BSA#1 and the modeled object made of the solidified modeling material M in the processing unit area BSA#2 may be integrated. . In particular, when the processing unit areas BSA#1 and BSA#2 match (or partially overlap), the modeling made of the solidified modeling material M within the processing unit area BSA#1 The object and the modeled object made of the model material M solidified within the processing unit area BSA#2 may be integrated.

During the period when the target irradiation areas EA#1 and EA#2 are moving within the processing unit areas BSA#1 and BSA#2, the processing system SYS moves the processing unit areas BSA#1 and BSA on the modeling surface MS. At least one of the processing head 21 and the stage 31 may be moved so that #2 is moved. The processing system SYS may relatively move the irradiation optical system 211 of the processing head 21 and the workpiece W so that the processing unit areas BSA#1 and BSA#2 move on the modeling surface MS. In other words, the processing system SYS moves the target irradiation areas EA#1 and EA#2 within the processing unit areas BSA#1 and BSA#2, and moves the processing unit areas BSA#1 and BSA on the modeling surface MS. Movement #2 may be performed in parallel.

Alternatively, during the period when the target irradiation areas EA#1 and EA#2 are moving within the processing unit areas BSA#1 and BSA#2, respectively, the processing system SYS moves the processing unit area BSA#1 on the modeling surface MS. It is not necessary to move the processing head 21 and the stage 31 so that BSA #2 does not move. In this case, after the additional processing (that is, modeling) is completed within the processing unit areas BSA#1 and BSA#2, the processing system SYS moves the processing unit areas BSA#1 and BSA#1 to another area on the modeling surface MS. At least one of the processing head 21 and the stage 31 may be moved so that BSA #2 is set. In other words, the processing system SYS moves the processing unit areas BSA#1 and BSA#2 on the modeling surface MS after additional processing (that is, modeling) is completed within the processing unit areas BSA#1 and BSA#2. Thus, at least one of the processing head 21 and the stage 31 may be moved. In this case, the machining system SYS selects the area where machining unit areas BSA#1 and BSA#2 have already been set on the printing surface MS (that is, the area where additional machining has already been performed), and the machining unit area BSA#1 and BSA#2 on the printing surface MS. At least one of the processing head 21 and the stage 31 may be moved so that the areas BSA#1 and BSA#2 are adjacent to the newly set area (that is, the area where additional processing will now be performed). In particular, the machining system SYS has an area where machining unit areas BSA#1 and BSA#2 have already been set on the printing surface MS, and a newly set machining unit area BSA#1 and BSA#2 on the printing surface MS. At least one of the processing head 21 and the stage 31 may be moved so that the regions do not overlap. However, the machining system SYS is configured so that the machining unit areas BSA#1 and BSA#2 are already set on the printing surface MS, and the machining unit areas BSA#1 and BSA#2 are newly set on the printing surface MS. At least one of the processing head 21 and the stage 31 may be moved so that the regions partially overlap with each other.

The processing system SYS forms a molten pool MP#1 by irradiating the processing light EL#1 within the processing unit area BSA#1, and forms a molten pool MP by irradiating the processing light EL#2 within the processing unit area BSA#2. A series of modeling processes including forming #2, supplying the modeling material M to the molten pools MP#1 and MP#2, melting the supplied modeling material M, and solidifying the melted modeling material M are shown in FIG. 11(d). ), the process is repeated while moving the processing unit areas BSA#1 and BSA#2 along the target movement trajectory MT0 on the modeling surface MS. In this case, as each of the processing unit areas BSA#1 and BSA#2 moves, a modeled object having a width along the direction intersecting the target movement trajectory MT0 is modeled on the modeling surface MS. For example, when each of processing unit areas BSA#1 and BSA#2 moves as shown in FIGS. 5(a) and 5(b), it has a width along the X-axis direction and a width along the Y-axis direction. A modeled object extending along the line is modeled. For example, when each of processing unit areas BSA#1 and BSA#2 moves as shown in FIGS. 6(a) and 6(c), it has a width along the X-axis direction and a width along the Y-axis direction. A modeled object extending along the line is modeled.

As a result, as shown in FIG. 11(e), a structural layer SL corresponding to a modeled object, which is an aggregate of the melted and then solidified modeling material M, is modeled on the model surface MS. In other words, a structural layer SL corresponding to a collection of objects formed on the modeling surface MS is formed in a pattern according to the target movement locus MT0 of the processing unit areas BSA#1 and BSA#2. That is, in plan view, the structural layer SL is formed having a shape according to the target movement trajectory MT0 of the processing unit areas BSA#1 and BSA#2.

Note that if the target irradiation area EA#1 is set in an area where it is not desired to form a modeled object, the processing system SYS does not need to irradiate the target irradiation area EA#1 with the processing light EL#1. Alternatively, the processing system SYS may irradiate the target irradiation area EA#1 with the processing light EL#1 and stop supplying the modeling material M. Alternatively, the processing system SYS may supply the modeling material M to the target irradiation area EA#1, and may also irradiate the target irradiation area EA#1 with the processing light EL#1 having an intensity that does not produce the molten pool MP. The same is true when the target irradiation area EA#2 is set in an area where it is not desired to model a modeled object.

The target movement trajectory MT0 of each of the machining unit areas BSA#1 and BSA#2 may be referred to as a machining path (in other words, a tool path). In this case, the control unit 7 causes each of the machining unit areas BSA#1 and BSA#2 to move toward the target movement on the modeling surface MS based on the path information indicating the target movement trajectory MT0 (that is, the path information indicating the machining path). At least one of the processing head 21 and the stage 31 may be moved so as to move along the trajectory MT0.

In addition to indicating the target movement trajectory MT0, the path information may also include information regarding the target value of the width of the object (hereinafter referred to as "target width"). Note that the target width may also be referred to as line width or bead width. Specifically, as described above, as the machining unit areas BSA#1 and BSA#2 move along the target movement trajectory MT0, on the modeling surface MS there are A model having a width along the model is modeled on the model surface MS. For example, as shown in FIG. 12(a), when each of the processing unit areas BSA#1 and BSA#2 moves along the Y-axis direction, as shown in FIG. 12(b), the modeling surface MS A linear shaped object having a width along the X-axis direction and extending along the Y-axis direction is formed on the top. Note that the above-described structural layer SL corresponds to an aggregate of linear shaped objects shown in FIG. 12(b). In this case, the path information may include information regarding the target value (that is, the target width) of the width D of the linear shaped object, as shown in FIG. 12(b). That is, the path information may include information regarding the width of a linear object (that is, a line) to be formed on the modeling surface MS. Note that information regarding the target width of a linear object (that is, information regarding the width of a line to be formed) may be referred to as line width information.

In this case, the control unit 7 controls the galvanometer mirrors 2146 and 2156 so that the target irradiation areas EA#1 and EA#2 move within the processing unit areas BSA#1 and BSA#2, respectively, based on the line width information. Each may be controlled. For example, the control unit 7 may control the galvano mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 move periodically within the width of the line indicated by the line width information. That is, the control unit 7 may control the galvanometer mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 do not deviate outside the width of the line indicated by the line width information. In other words, the control unit 7 controls the galvano mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 move periodically inside the target width of the model indicated by the line width information. Good too. That is, the control unit 7 may control the galvano mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 do not deviate outside the target width of the object indicated by the line width information.

As a result, molten pools MP#1 and MP#2 also move periodically within the width of the line indicated by the line width information. In other words, molten pools MP#1 and MP#2 do not deviate outside the width of the line indicated by the line width information. In other words, molten pools MP#1 and MP#2 periodically move inside the target width of the model indicated by the line width information. In other words, molten pools MP#1 and MP#2 do not deviate outside the target width of the model indicated by the line width information. Therefore, the processing system SYS can appropriately model a linear object having the target width indicated by the line width information.

Note that the target movement trajectory MT0 (processing path or tool path) of each of the processing unit areas BSA#1 and BSA#2 may be a trajectory in the XY plane as shown in FIG. 12. The silent movement trajectory MT0 may be a trajectory in the XYZ space (a trajectory in which the position in the Z direction also changes when the position in the X direction and/or the Y direction changes).

The processing system SYS repeatedly performs operations for modeling such a structural layer SL based on three-dimensional model data under the control of the control unit 7. Specifically, first, before performing an operation for modeling the structural layer SL, the control unit 7 slices the three-dimensional model data at a stacking pitch to create slice data. The processing system SYS performs an operation for modeling the first structural layer SL#1 on the modeling surface MS corresponding to the surface of the work W based on the slice data corresponding to the structural layer SL#1. Specifically, the control unit 7 acquires path information for modeling the first structural layer SL#1, which is generated based on the slice data corresponding to the structural layer SL#1. Note that the control unit 7 may generate the path information after or before the processing system SYS starts additional processing. Thereafter, the control unit 7 controls the processing unit 2 and the stage unit 3 to model the first structural layer SL#1 based on the path information. As a result, a structural layer SL#1 is formed on the modeling surface MS, as shown in FIG. 13(a). After that, the processing system SYS sets the surface (that is, the upper surface) of the structural layer SL#1 as a new modeling surface MS, and then builds the second structural layer SL#2 on the new modeling surface MS. do. In order to model the structural layer SL#2, the control unit 7 first operates at least one of the head drive system 22 and the stage drive system 32 so that the processing head 21 moves along the Z-axis relative to the stage 31. Control. Specifically, the control unit 7 controls at least one of the head drive system 22 and the stage drive system 32 so that the processing unit areas BSA#1 and BSA#2 are located on the surface of the structural layer SL#1 (that is, on the new surface of the structural layer SL#1). The processing head 21 is moved toward the +Z side and/or the stage 31 is moved toward the −Z side so as to be set on the modeling surface MS). Thereafter, under the control of the control unit 7, the processing system SYS creates a model on the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2 in an operation similar to that for modeling the structural layer SL#1. A structural layer SL#2 is formed. As a result, the structural layer SL#2 is formed as shown in FIG. 13(b). Thereafter, similar operations are repeated until all structural layers SL constituting the three-dimensional structure ST to be modeled on the workpiece W are modeled. As a result, as shown in FIG. 13(c), a three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked.

(2-2) Calibration Operation Next, the calibration operation performed by the processing system SYS will be explained. The calibration operation is an operation for calibrating the processing system SYS. In particular, the calibration operation is an operation of calibrating the processing system SYS using the calibration unit 8. Below, as an example of the calibration operation, an operation of calibrating the irradiation mode of the processing light EL using the calibration unit 8 will be described.

The processing system SYS may perform a calibration operation before the processing unit 2 starts modeling the object. The processing system SYS may perform a calibration operation after the processing unit 2 finishes modeling the object. The processing system SYS may perform a calibration operation after the processing unit 2 starts modeling the object and before the processing unit 2 finishes modeling the object. In this case, the processing system SYS may temporarily stop the modeling of the object and then perform the calibration operation, if necessary.

The irradiation mode of the processing light EL may change depending on the elapsed time after the processing system SYS starts operating. In this case, the processing system SYS may perform the calibration operation when a certain period of time has passed since the processing system SYS started operating. The processing system SYS may perform a calibration operation every time a certain period of time has elapsed since the processing system SYS started operating.

The irradiation mode of the processing light EL may vary depending on the temperature of the chamber space 63IN where the workpiece W is irradiated with the processing light EL. In this case, the processing system SYS may perform a calibration operation when the temperature of the chamber space 63IN fluctuates by a predetermined first temperature or more. The processing system SYS may perform a calibration operation when the temperature of the chamber space 63IN exceeds a predetermined first allowable upper limit. The processing system SYS may perform a calibration operation when the temperature of the chamber space 63IN falls below a predetermined first allowable lower limit.

In this case, a first temperature measuring device for measuring the temperature of the chamber space 63IN may be arranged in the chamber space 63IN. For example, a single first temperature measuring device may be placed in the chamber space 63IN. For example, a plurality of first temperature measuring devices may be arranged at a plurality of locations within the chamber space 63IN. The first temperature measuring device may be connected to the control unit 7. The measurement results of the first temperature measuring device may be output to the control unit 7.

The irradiation mode of the processing light EL may vary depending on the temperature of at least one of the galvano mirrors 2146 and 2156, which can change the irradiation position of the processing light EL, which is an example of the irradiation mode of the processing light EL. In this case, the processing system SYS may perform a calibration operation when the temperature of at least one of the galvanometer mirrors 2146 and 2156 fluctuates by a predetermined second temperature or more. Processing system SYS may perform a calibration operation when the temperature of at least one of galvano mirrors 2146 and 2156 exceeds a predetermined second allowable upper limit. The processing system SYS may perform a calibration operation when the temperature of at least one of the galvanometer mirrors 2146 and 2156 falls below a predetermined second allowable lower limit.

In this case, a second temperature measuring device for measuring the temperature of at least one of the galvano mirrors 2146 and 2156 may be arranged within the irradiation optical system 211. For example, a single second temperature measuring device may be arranged in the irradiation optical system 211. For example, a plurality of second temperature measurement devices may be arranged at a plurality of locations within the irradiation optical system 211, respectively. As an example, a second temperature measuring device for measuring the temperature of the galvano mirror 2146 is arranged in the first optical system 214, and a second temperature measuring device for measuring the temperature of the galvano mirror 2156 is arranged in the second optical system 214. may be located within system 215. Alternatively, if it is assumed that the temperature fluctuations of the galvano mirror 2146 and the temperature fluctuations of the galvano mirror 2156 are of the same degree, the second temperature measuring device can detect either the first optical system 214 or the second optical system 215. It may be placed inside one of the two. Further, the second temperature measuring device disposed within the first optical system 214 may measure the temperature of at least one of the X scanning motor 2146AX and the Y scanning motor 2146AY of the galvanometer mirror 2146. If it is assumed that the temperature fluctuations of the X scanning motor 2146AX and the temperature fluctuations of the Y scanning motor 2146AY are the same, the second temperature measuring device disposed within the first optical system 214 The temperature of either one of the Y scanning motor 2146AY and the Y scanning motor 2146AY may be measured. Similarly, the temperature measuring device disposed within the second optical system 215 may measure the temperature of at least one of the X scanning motor 2156AX and the Y scanning motor 2156AY of the galvanometer mirror 2156. If it is assumed that the temperature fluctuations of the X scanning motor 2156AX and the temperature fluctuations of the Y scanning motor 2156AY are the same, the second temperature measuring device disposed within the second optical system 215 The temperature of either one of the Y scanning motor 2156AY and the Y scanning motor 2156AY may be measured. The second temperature measuring device may be connected to the control unit 7. The measurement results of the second temperature measuring device may be output to the control unit 7.

(2-2-1) Position measurement operation The processing system SYS may perform a position measurement operation as at least a part of the calibration operation. The position measurement operation is an operation for measuring the position of the calibration unit 8. In particular, the position measurement operation is an operation for measuring the positions of the first calibration unit 81 and the second calibration unit 82.

A position measuring device 23 may be attached to the processing head 21 in order to perform the position measuring operation. The position measuring device 23 may be attached to the processing head 21 so as to be removable from the processing head 21. In this case, the position measuring device 23 is attached to the processing head 21 during at least part of the period when the position measuring operation is performed, and the position measuring device 23 is attached to the processing head 21 during the period when the position measuring operation is not performed. May be removed. Alternatively, the position measuring device 23 may be attached to the processing head 21 at all times. The position measuring device 23 may be movable with respect to the processing head 21.

An example of the position measuring device 23 is shown in FIG. As shown in FIG. 14, a position measuring device 23a including a probe 231 may be used as the position measuring device 23. In this case, the position measuring device 23a may measure the position of the calibration unit 8 by bringing the probe 231 into contact with the calibration unit 8. In particular, the position measuring device 23a may measure the position of the calibration unit 8 by bringing the tip P of the probe 231 into contact with the calibration unit 8.

The position measuring device 23 is attached to the processing head 21 so that information regarding the relative positional relationship between the tip P of the probe 231 and the processing position of the processing head 21 is known to the control unit 7. The processing position of the processing head 21 is, for example, an intersection position where at least one of the processing lights EL#1 and EL#2 emitted from the irradiation optical system 211 and the modeling material M supplied from the material nozzle 212 intersect. Good too. The processing position of the processing head 21 may be an offset position having a known positional relationship with respect to the intersection position.

In order to measure the position of the calibration unit 8 using the position measuring device 23a including the probe 231, the head drive system 22, under the control of the control unit 7, moves the probe 231 so that it comes into contact with the calibration unit 8. The processing head 21 to which the position measuring device 23a is attached may be moved. For example, as shown in FIG. 15, the head drive system 22 may move the processing head 21 so that the probe 231 contacts the reference surface 800 of the calibration unit 8. In particular, as shown in FIG. 15, the head drive system 22 may move the processing head 21 so that the probe 231 sequentially contacts each of the plurality of reference surfaces 800.

The reference surface 800 is a surface that satisfies the condition that information regarding the positional relationship between each of the first calibration unit 81 and the second calibration unit 82 and the reference surface 800 is information known to the control unit 7. In the example shown in FIG. 15, a calibration surface 801 of the base member 80 on which the first calibration unit 81 and the second calibration unit 82 are arranged, and a side surface 802 of the base member 80 that is different from the calibration surface 801, respectively. is used as the reference plane 800.

In addition to or instead of the head drive system 22 moving the processing head 21, the stage drive system 32 performs calibration under the control of the control unit 7 so that the probe 231 comes into contact with the calibration unit 8. Unit 8 may be moved.

When the probe 231 contacts the reference surface 800, a head position measuring device (not shown) included in the processing unit 2 may measure the position of the processing head 21 in the head coordinate system. The head position measuring device may measure the position of the processing head 21 using, for example, at least one of a laser interferometer and an encoder. The head coordinate system is a three-dimensional coordinate system used to control the position of the processing head 21.

Further, when the probe 231 contacts the reference surface 800, a stage position measuring device (not shown) included in the processing unit 2 may measure the position of the stage 31 in the stage coordinate system. The stage position measuring device may measure the position of the stage 31 using, for example, at least one of a laser interferometer and an encoder. The stage coordinate system is a three-dimensional coordinate system used to control the position of the stage 31.

Thereafter, the control unit 7 may calculate the position of the calibration unit 8 in the head coordinate system based on the measurement result of the position of the processing head 21. Specifically, as described above, since information regarding the relative positional relationship between the processing position of the processing head 21 and the tip P of the probe 231 is known to the control unit 7, the control unit 7 Based on the measurement result of the position of 21, the position of the probe 231 in the head coordinate system at the time when the probe 231 contacts the reference surface 800 can be calculated. Since the probe 231 is in contact with the reference surface 800, the position of the probe 231 in the head coordinate system at the time when the probe 231 is in contact with the reference surface 800 is substantially the same as the position at the time when the probe 231 is in contact with the reference surface 800. This is equivalent to the position of the reference plane 800 in the head coordinate system at . Furthermore, as described above, since the information regarding the positional relationship between each of the first calibration unit 81 and the second calibration unit 82 and the reference plane 800 is known information to the control unit 7, the control unit 7 , the respective positions of the first calibration unit 81 and the second calibration unit 82 in the head coordinate system can be calculated based on the calculation result of the position of the reference plane 800.

Further, the control unit 7 may calculate the position of the calibration unit 8 in the stage coordinate system based on the measurement result of the position of the stage 31. Specifically, the information regarding the mounting position of the calibration unit 8 is information known to the control unit 7 as a premise. That is, information regarding the relative positional relationship between the stage 31 and the calibration unit 8 is information known to the control unit 7. In this case, the control unit 7 can calculate the position of the calibration unit 8 in the stage coordinate system at the time when the probe 231 contacts the reference surface 800 based on the measurement result of the position of the stage 31.

In this way, the control unit 7 can calculate the position of the calibration unit 8 in each of the head coordinate system and the stage coordinate system at the time when the probe 231 contacts the reference surface 800. Thereafter, the processing system SYS may perform a later-described calibration operation based on the position of the calibration unit 8 measured (calculated) by the position measurement operation.

Note that, as shown in FIG. 16 showing another example of the position measuring device 23, the processing system SYS each transmits measurement light ML to the calibration unit 8 in addition to or in place of the position measuring device 23a provided with the probe 231. A position measuring device 23b including a plurality of irradiation devices 232 capable of irradiating and an imaging device 233 capable of capturing a plurality of beam spots formed on the calibration unit 8 by a plurality of measurement lights ML is used as the position measuring device 23. You can. Here, the position measuring device 23b may be referred to as a non-contact position measuring device 23b or an optical position measuring device 23b. The plurality of measurement lights ML intersect with each other at predetermined intersecting positions below the processing head 21 . Therefore, when the reference plane 800 of the calibration unit 8 is located at the intersection position, the plurality of measurement lights ML intersect on the reference plane 800. As a result, the plurality of measurement lights ML form a single beam spot on the reference plane 800. On the other hand, when the reference plane 800 is not located at the intersection position, the plurality of measurement lights ML do not intersect on the reference plane 800. As a result, the plural measurement lights ML each form a plurality of beam spots on the reference plane 800. Therefore, when a plurality of measurement lights ML form a single beam spot on the reference plane 800, the reference plane 800 is located at an intersection position determined based on the processing head 21. . In other words, the position of the reference plane 800 can be specified. Therefore, the control unit 7 can measure the position of the calibration unit 8 using such a position measuring device 23b.

Note that the position measuring device 23b is not limited to a device that measures the position of the calibration unit 8 using the method described above. For example, the position measuring device 23b measures the position of the calibration unit 8 using at least one of a pattern projection method, a light cutting method, a time-of-flight method, an interferometric method, a stereo method, an astigmatism method, etc. Any possible measurement device may be used.

(2-2-2) Rotational Calibration Operation The processing system SYS may perform a rotational calibration operation as at least a part of the calibration operation.

The rotational calibration operation may include a first rotational calibration operation that calculates the amount of rotation of the actual movement trajectory AMT of the processing light EL#1 with respect to the target movement trajectory TMT of the processing light EL#1. In particular, the rotational calibration operation is performed by adjusting the rotational axis (for example, the Z axis) of the actual movement trajectory AMT of processing light EL#1 relative to the target movement trajectory TMT of processing light EL#1 along the traveling direction of processing light EL#1. The first rotational calibration operation may include a first rotational calibration operation for calculating a rotational amount θz around the rotational axis (along the rotational axis). The target movement trajectory TMT is an ideal trajectory for the galvanometer mirror 2146 to move the processing light EL#1 (specifically, the irradiation position of the processing light EL#1, and the target irradiation area EA#1) on the modeling surface MS. In other words, it shows a designed movement trajectory. The actual movement trajectory is the movement in which the galvanometer mirror 2146 actually moves the processing light EL#1 (specifically, the irradiation position of the processing light EL#1, and the target irradiation area EA#1) on the modeling surface MS. Show the trajectory. In particular, the actual movement trajectory AMT is such that the galvano mirror 2146 uses the processing light based on a galvano control signal for controlling the galvano mirror 2146 to move the processing light EL#1 on the modeling surface MS along the target movement trajectory TMT. The actual movement locus of processing light EL#1 when EL#1 is actually moved is shown.

The rotational calibration operation may include a second rotational calibration operation that calculates the amount of rotation of the actual movement trajectory AMT of the processing light EL#2 with respect to the target movement trajectory TMT of the processing light EL#2. The target movement trajectory TMT is an ideal trajectory for the galvano mirror 2156 to move the processing light EL#2 (specifically, the irradiation position of the processing light EL#2, and the target irradiation area EA#2) on the modeling surface MS. In other words, it shows a designed movement trajectory. The actual movement trajectory is the movement in which the galvano mirror 2156 actually moves the processing light EL#2 (specifically, the irradiation position of the processing light EL#2, and the target irradiation area EA#2) on the modeling surface MS. Show the trajectory. In particular, the actual movement trajectory AMT is such that the galvano mirror 2156 uses the processing light based on a galvano control signal for controlling the galvano mirror 2156 to move the processing light EL#2 on the modeling surface MS along the target movement trajectory TMT. The actual movement locus of processing light EL#2 when EL#2 is actually moved is shown.

Hereinafter, the first rotational calibration operation will be specifically explained. However, the processing system SYS may perform the second rotational calibration operation by performing the same operation as the first rotational calibration operation. Specifically, in the following explanation regarding the first rotational calibration operation, the words "first", "galvano mirror 2146", and "#1" are replaced with "second", "galvano mirror 2156", and "#1", respectively. #2", it can be used as an explanation regarding the second rotational calibration operation.

The processing system SYS uses the second calibration unit 82 included in the calibration unit 8 to perform a first rotational calibration operation. In particular, the processing system SYS uses the search mark 8241 formed on the opening member 822 of the second calibration unit 82 to perform the first rotational calibration operation.

Specifically, the control unit 7 controls the processing head 21 so as to irradiate the search mark 8241 with the processing light EL#1. In order to irradiate the search mark 8241 with the processing light EL#1, the control unit 7 first activates a galvanometer for moving the processing light EL#1 on the aperture member 822 along the target movement trajectory TMT that crosses the search mark 8241. Generate control signals. An example of the target movement trajectory TMT used in the first rotational calibration operation is shown in FIG. As shown in FIG. 17, the target movement trajectory TMT is a linear movement along the X-axis direction in which two slit-shaped openings 8231-1 and one slit-shaped opening 8231-3 forming the search mark 8241 are lined up. It may be a trajectory. In particular, the target movement trajectory TMT may be perpendicular to each of the two slit-shaped openings 8231-1.

However, even if the target movement trajectory TMT is a linear movement trajectory along the Y-axis direction in which two slit-shaped openings 8231-2 and one slit-shaped opening 8231-3 forming the search mark 8241 are lined up, good. In particular, the target movement trajectory TMT may be orthogonal to each of the two slit-shaped openings 8231-2. In the following description, in order to simplify the description, the target movement trajectory TMT will be expressed as the The explanation will proceed using an example of a linear movement trajectory along a direction.

After that, the control unit 7 controls the galvano mirror 2146 based on the generated galvano control signal. As a result, the galvanometer mirror 2146 moves the processing light EL#1 on the aperture member 822. That is, the galvanometer mirror 2146 moves the processing light EL#1 so as to cross the search mark 8241 formed on the aperture member 822, as shown in FIG.

As a result, the light receiving device 821 receives the processing light EL#1 that has passed through the search mark 8241. That is, the light receiving device 821 receives the processing light EL#1 that has passed through each of the two slit-shaped openings 8231-1 and one slit-shaped opening 8231-3 that form the search mark 8241. Specifically, the light receiving device 821 receives the processed light EL#1 that has passed through one of the two slit-shaped openings 8231-1, and then receives the processed light EL#1 that has passed through the slit-shaped opening 8231-3. After that, processing light EL#1 that has passed through the other of the two slit-shaped openings 8231-1 is received. Therefore, as shown in FIG. 18, which is a graph showing the reception result of the processed light EL#1 by the light receiving device 821, the light receiving device 821 detects the processed light EL#1 that has passed through one of the two slit-shaped openings 8231-1. 1, a pulse waveform P2 corresponding to the processing light EL#1 that has passed through the slit-shaped opening 8231-3, and a processing light EL# that has passed through the other of the two slit-shaped openings 8231-1. Light reception information indicating, as a light reception result, a light reception signal including a pulse signal in which pulse waveforms P3 corresponding to 1 and 1 appear in order is output as at least part of the measurement information. Note that, as shown in FIG. 18, the time during which the pulse waveforms P1 to P3 appear is substantially equivalent to the position in the X-axis direction of the processing light EL#1 irradiated to the search mark 8241.

Thereafter, the control unit 7 calculates the rotation amount θz of the actual movement trajectory AMT with respect to the target movement trajectory TMT based on the light reception information. In this embodiment, the control unit 7 sets the distance obtained by multiplying the time between the pulse waveform P1 and the pulse waveform P2 by the moving speed of the processing light EL#1 as L1, and sets the distance between the pulse waveform P2 and the pulse waveform P3 as L1. When L2 is the distance obtained by multiplying the time between by the moving speed of processing light EL#1, and L is the distance between the two slit-shaped openings 8231-1, θz= The rotation amount θz may be calculated using the formula cos ⁻¹ (L/(L1+L2)).

After the rotation amount θz is calculated, the control unit 7 may calibrate (in other words, control, adjust, or change) the irradiation mode of the processing light EL#1 based on the calculated rotation amount θz. For example, when controlling the galvano mirror 2146 to move the processing light EL#1, the control unit 7 may control the galvano mirror 2146 so that the calculated rotation amount θz becomes zero. That is, the control unit 7 may generate a galvano control signal that controls the galvano mirror 2146 so that the calculated rotation amount θz becomes zero. For example, the control unit 7 may control the galvanometer mirror 2146 so that the rotation amount θz becomes zero during at least a portion of the modeling period. For example, the control unit 7 may control the galvanometer mirror 2146 so that the rotation amount θz becomes zero during at least a portion of the measurement period. As a result, the control unit 7 controls the galvanometer so that even if the rotation amount θz calculated by the rotation calibration operation is not zero, the processing light EL moves in the same way as when the rotation amount θz is zero. Mirror 2146 can be controlled. In other words, the galvanometer mirror 2146 can move the processing light EL#1 while canceling out the influence of the rotation amount θz. Therefore, compared to the case where the rotational calibration operation is not performed, the galvanometer mirror 2146 can move the processing light EL#1 with high accuracy without being affected by the rotational amount θz.

(2-2-3) Offset Calibration Operation The processing system SYS may perform an offset calibration operation as at least a part of the calibration operation. The offset calibration operation includes a first offset calibration operation that calculates an offset amount (in other words, a parallel movement amount) of the actual movement trajectory AMT of the processing light EL#1 with respect to the target movement trajectory TMT of the processing light EL#1. You can stay there. The offset calibration operation may include a second offset calibration operation that calculates an offset amount of the actual movement trajectory AMT of the processing light EL#2 with respect to the target movement trajectory TMT of the processing light EL#2.

The first offset calibration operation will be specifically explained below. However, the processing system SYS may perform the second offset calibration operation by performing the same operation as the first offset calibration operation. Specifically, in the following explanation regarding the first offset calibration operation, the words "first", "galvano mirror 2146", and "#1" are replaced with "second", "galvano mirror 2156", and "#1", respectively. #2", it can be used as an explanation regarding the second offset calibration operation.

The processing system SYS uses the second calibration unit 82 included in the calibration unit 8 to perform a first offset calibration operation. In particular, the processing system SYS uses the search mark 8241 formed on the opening member 822 of the second calibration unit 82 to perform the first offset calibration operation.

Specifically, the control unit 7 controls the processing head 21 so as to irradiate the search mark 8241 with the processing light EL#1. In order to irradiate the search mark 8241 with the processing light EL#1, the control unit 7 first installs a galvanometer for moving the processing light EL#1 on the aperture member 822 along the target movement trajectory TMT that crosses the search mark 8241. Generate control signals. Note that an example of the target movement trajectory TMT used in the first offset calibration operation is shown in FIG. As shown in FIG. 19, the target movement trajectory TMT is a linear movement along the X-axis direction in which two slit-shaped openings 8231-1 and one slit-shaped opening 8231-3 forming the search mark 8241 are lined up. It may be a trajectory. In particular, the target movement trajectory TMT may be perpendicular to each of the two slit-shaped openings 8231-1. Furthermore, the target movement trajectory TMT may pass through the center point of each of the two slit-shaped openings 8231-1 in the Y-axis direction. Furthermore, the distance in the X-axis direction between the starting point SP of the target movement trajectory TMT and one of the two slit-shaped openings 8231-1 is the distance between the end point EP of the target movement trajectory TMT and the two slit-shaped openings 8231-1. It may be the same as the distance in the X-axis direction between them and the other one.

However, even if the target movement trajectory TMT is a linear movement trajectory along the Y-axis direction in which two slit-shaped openings 8231-2 and one slit-shaped opening 8231-3 forming the search mark 8241 are lined up, good. In particular, the target movement trajectory TMT may be orthogonal to each of the two slit-shaped openings 8231-2. Furthermore, the target movement trajectory TMT may pass through the center point of each of the two slit-shaped openings 8231-2 in the X-axis direction. Furthermore, the distance in the Y-axis direction between the starting point SP of the target movement trajectory TMT and one of the two slit-shaped openings 8231-2 is the distance between the end point EP of the target movement trajectory TMT and the two slit-shaped openings 8231-2. It may be the same as the distance in the Y-axis direction between the two and the other one. In the following description, in order to simplify the description, the target movement trajectory TMT will be expressed as the The explanation will proceed using an example of a linear movement trajectory along a direction.

After that, the control unit 7 controls the galvano mirror 2146 based on the generated galvano control signal. As a result, the galvanometer mirror 2146 moves the processing light EL#1 on the aperture member 822. That is, the galvanometer mirror 2146 moves the processing light EL#1 so as to cross the search mark 8241 formed on the aperture member 822, as shown in FIG.

At this time, the control unit 7 may control the galvanometer mirror 2146 while the irradiation mode of the processing light EL#1 is calibrated based on the rotation amount θz described above. That is, the control unit 7 may generate a galvano control signal such that the rotation amount θz described above becomes zero, and may control the galvano mirror 2146 based on the generated galvano control signal. For this reason, the processing system SYS may perform the offset calibration operation after performing the rotational calibration operation.

As a result, the light receiving device 821 receives the processing light EL#1 that has passed through the search mark 8241. In other words, as shown in FIG. 18, the light receiving device 821 detects the pulse waveform P1 corresponding to the processing light EL#1 that has passed through one of the two slit-shaped apertures 8231-1 and the slit-shaped aperture 8231-3. A light reception signal including a pulse signal in which a pulse waveform P2 corresponding to the processed light EL#1 that has passed through and a pulse waveform P3 that corresponds to the processed light EL#1 that has passed through the other of the two slit-shaped openings 8231-1 appear in order. Light reception information indicating the light reception result as at least a part of the measurement information is output.

Thereafter, the control unit 7 calculates the offset amount of the actual movement trajectory AMT with respect to the target movement trajectory TMT based on the light reception information. For example, the control unit 7 may calculate the offset amount ΔOffx in the X-axis direction of the actual movement trajectory AMT with respect to the target movement trajectory TMT, as shown in FIG. For example, the control unit 7 may calculate the offset amount ΔOffy in the Y-axis direction of the actual movement trajectory AMT with respect to the target movement trajectory TMT, as shown in FIG. In this embodiment, the control unit 7 calculates the distance obtained by multiplying the time from when the galvanometer mirror 2146 starts moving the processing light EL#1 until the pulse waveform P1 appears by the moving speed of the processing light EL#1. Let L0 be the distance obtained by multiplying the time from when the pulse waveform P3 appears until the galvano mirror 2146 finishes moving the processing light EL#1 by the moving speed of the processing light EL#1, and If the angle at which the slit-shaped opening 8231-2 intersects the slit-shaped opening 8231-3 (that is, the angle at which the opening 8231-2 intersects the X-axis) is φ, then ΔOffx=tanφ×(L2-L1) The offset amount ΔOffx may be calculated using the formula: /2. The control unit 7 may calculate the offset amount ΔOffy using the formula ΔOffy=(L3−L0)/2.

After the offset amount is calculated, the control unit 7 may calibrate (in other words, control, adjust, or change) the irradiation mode of the processing light EL#1 based on the calculated offset amount. For example, when controlling the galvano mirror 2146 to move the processing light EL#1, the control unit 7 may control the galvano mirror 2146 so that at least one of the offset amounts ΔOffx and ΔOffy becomes zero. That is, the control unit 7 may generate a galvano control signal that controls the galvano mirror 2146 so that at least one of the offset amounts ΔOffx and ΔOffy becomes zero. For example, the control unit 7 may control the galvanometer mirror 2146 so that at least one of the offset amounts ΔOffx and ΔOffy becomes zero during at least part of the modeling period. For example, the control unit 7 may control the galvanometer mirror 2146 so that at least one of the offset amounts ΔOffx and ΔOffy becomes zero during at least part of the measurement period. As a result, even if at least one of the offset amounts ΔOffx and ΔOffy calculated by the offset calibration operation is not zero, the control unit 7 performs the same operation as when at least one of the offset amounts ΔOffx and ΔOffy is zero. The galvanometer mirror 2146 can be controlled so that the processing light EL moves. In other words, the galvanometer mirror 2146 can move the processing light EL#1 while canceling out the influence of at least one of the offset amounts ΔOffx and ΔOffy. Therefore, compared to the case where the offset calibration operation is not performed, the galvanometer mirror 2146 can move the processing light EL#1 with high accuracy without being affected by at least one of the offset amounts ΔOffx and ΔOffy. .

Note that the processing system SYS may perform the offset calibration operation simultaneously with the rotational calibration operation described above. For example, the processing system SYS calculates the offset amounts ΔOffx and ΔOffy to be calculated by the offset calibration operation and the rotation amount θz to be calculated by the rotation calibration operation based on the reception result of the processing light EL by the calibration unit 8. It may be calculated. In this case, the processing system SYS performs an operation of irradiating the search mark 8241 with the processing light EL to perform an offset calibration operation and an operation of irradiating the search mark 8241 with the processing light EL to perform the rotation calibration operation. They do not have to be done separately.

(2-2-4) Focus calibration operation The processing system SYS may perform a focus calibration operation as at least a part of the calibration operation.

The processing system SYS may perform a focus calibration operation after performing the above-described rotational calibration operation and offset calibration operation. That is, the processing system SYS may perform the focus calibration operation in a state where the irradiation mode of the processing lights EL#1 and EL#2 is calibrated based on the rotation amount and the offset amount. However, the processing system SYS may perform a focus calibration operation before performing at least one of the rotational calibration operation and the offset calibration operation described above.

The focus calibration operation may include a first focus calibration operation for calculating the best focus position of the processing light EL#1. The best focus position of processing light EL#1 may mean a position where the amount of defocus of processing light EL#1 is minimum. The best focus position of the processing light EL#1 may mean a position where the processing light EL#1 is most converged along the traveling direction of the processing light EL#1.

The focus calibration operation may include a second focus calibration operation for calculating the best focus position of the processing light EL#2. The best focus position of processing light EL#2 may mean a position where the amount of defocus of processing light EL#2 is minimum. The best focus position of the processing light EL#2 may mean a position where the processing light EL#2 is most converged along the traveling direction of the processing light EL#1.

The first focus calibration operation will be described below. However, the processing system SYS may perform the second focus calibration operation by performing the same operation as the first focus calibration operation. Specifically, in the following explanation regarding the first focus calibration operation, the words "first", "galvano mirror 2146", and "#1" are replaced with "second", "galvano mirror 2156", and "#1", respectively. #2", it can be used as an explanation regarding the second focus calibration operation.

The processing system SYS uses the second calibration unit 82 included in the calibration unit 8 to perform a first focus calibration operation. In particular, the processing system SYS uses the slit mark 8243 or 8244 formed on the opening member 822 of the second calibration unit 82 to perform the first focus calibration operation.

Specifically, the processing system SYS irradiates the slit mark 8243 or 8244 with the processing light EL#1. In this case, the processing system SYS may move the processing light EL#1 relative to the slit mark 8243 or 8244 so that the processing light EL#1 crosses the slit mark 8243 or 8244. In particular, the processing system SYS applies the processing light EL#1 to the slit mark 8243 or 8244 so that the processing light EL#1 crosses the slit mark 8243 or 8244 along the direction intersecting the longitudinal direction of the slit mark 8243 or 8244. 1 may be moved relatively. For example, as shown in FIG. 20 showing the processing light EL#1 irradiated onto the slit mark 8243, the processing system SYS emits the processing light along the X-axis direction intersecting the slit mark 8243 with the Y-axis direction being the longitudinal direction. Processing light EL#1 may be moved relative to slit mark 8243 so that EL#1 crosses slit mark 8243. Alternatively, the processing system SYS directs the processing light EL #1 to the slit mark 8244 so that the processing light EL #1 crosses the slit mark 8244 along the Y-axis direction that intersects the slit mark 8244 with the X-axis direction being the longitudinal direction. #1 may be moved relatively.

The processing system SYS may move the processing light EL#1 relative to the slit mark 8243 or 8244 by moving the stage 31 using the stage drive system 32. The processing system SYS may move the processing light EL#1 relative to the slit mark 8243 or 8244 by moving the processing head 21 using the head drive system 22. The processing system SYS may move the processing light EL#1 relative to the slit mark 8243 or 8244 by deflecting the processing light EL#1 using the galvanometer mirror 2146.

As a result, the light receiving device 821 receives the processing light EL#1 that has passed through the slit mark 8243 or 8244. Therefore, as shown in FIG. 21, which is a graph showing the reception result of the processed light EL#1 by the light receiving device 821, the processed light EL#1 is inserted into the opening 8233 or 8234 forming the slit mark 8243 or 8244. The intensity of the processing light EL during the period when at least a part of the processing light EL is irradiated to the opening 8233 or 8234 is greater than the intensity of the processing light EL #1 during the period when the processing light EL #1 is not irradiated to the opening 8233 or 8234. Light reception information indicating a light reception signal indicating this as a light reception result is output as at least a part of the measurement information.

Note that the time (light reception timing) on the horizontal axis in FIG. 21 is substantially equivalent to the amount of movement of the processing light EL#1 with respect to the slit mark 8243 or 8244. When moving the processing light EL#1 relative to the slit mark 8243 or 8244 by moving the stage 31, the amount of movement of the processing light EL#1 relative to the slit mark 8243 or 8244 is the same as that of the stage 31. It may be considered to be equivalent to the amount of movement. When processing light EL#1 is moved relative to slit mark 8243 or 8244 by moving processing head 21, the amount of movement of processing light EL#1 relative to slit mark 8243 or 8244 is It may be considered that the amount of movement is equivalent to 21. When processing light EL#1 is moved relative to slit mark 8243 or 8244 by deflecting processing light EL#1, the amount of movement of processing light EL#1 relative to slit mark 8243 or 8244 is as follows. It may be considered that it is equivalent to the amount of deflection of the processing light EL#1 (that is, the amount of rotation of the galvanometer mirror 2146).

Thereafter, the control unit 7 calculates the spot diameter, which is the size of the beam spot formed by the processing light EL#1 on the aperture member 822, based on the light reception information. Specifically, the control unit 7 may calculate the time during which the intensity of the processed light EL#1 is higher than a predetermined intensity based on the light reception information. That is, the control unit 7 may calculate the time during which at least a portion of the processing light EL#1 is irradiated to the opening 8233 or 8234 forming the slit mark 8243 or 8244 based on the light reception information. The predetermined intensity may be set based on the peak intensity in the intensity distribution of the processing light EL. For example, the predetermined intensity may be set to an intensity obtained by multiplying the peak intensity by K (K is a variable representing a real number greater than 0 and less than 1). An example of the variable K is 1/e ² (here, e means Napier's number) when the processing light EL#1 is a Gaussian beam. Another example of the variable K is 0.135 when the processing light EL#1 is a Gaussian beam. Thereafter, the control unit 7 may calculate the spot diameter of the processing light EL#1 based on the calculated time and the moving speed of the processing light EL#1 with respect to the slit mark 8243 or 8244. For example, the control unit 7 may calculate a value obtained by multiplying the calculated time by the moving speed of the processing light EL#1 with respect to the slit mark 8243 or 8244 as the spot diameter of the processing light EL#1.

The processing system SYS performs the operation of irradiating the slit mark 8243 or 8244 with the processing light EL#1 and calculating the spot diameter of the processing light EL#1 in the traveling direction of the processing light EL#1 (for example, the Z-axis direction). The process is repeated while changing the distance between the processing head 21 (in particular, the irradiation optical system 211) and the calibration unit 8. In other words, the processing system SYS performs the operation of irradiating the slit mark 8243 or 8244 with the processing light EL#1 and calculating the spot diameter of the processing light EL#1 in the traveling direction of the processing light EL#1 (for example, in the Z-axis direction). ) is repeated while changing the position (Z position) of the processing head 21 (in particular, the irradiation optical system 211) with respect to the calibration unit 8. As a result, the control unit 7 calculates a plurality of spot diameters, each corresponding to a different Z position of the processing head 21, as shown in FIG.

After that, the control unit 7 calculates the best focus position of the processing light EL#1 based on the plurality of spot diameters. For example, the control unit 7 may specify the minimum spot diameter among the plurality of spot diameters, and may specify the Z position of the processing head 21 corresponding to the specified minimum spot diameter. Alternatively, for example, the control unit 7 calculates an interpolation curve for interpolating a plurality of spot diameters, calculates a minimum spot diameter based on the interpolation curve, and calculates a minimum spot diameter corresponding to the calculated minimum spot diameter based on the interpolation curve. The Z position of the processing head 21 may also be specified. Thereafter, the control unit 7 may calculate the best focus position based on the specified Z position. Specifically, the control unit 7 determines the position of the calibration unit 8 (especially the slit mark 8243 or 8244) when the processing head 21 is located at the specified Z position based on the defocus amount of the processing light EL#1. It may be calculated as the minimum best focus position.

After the best focus position is calculated, the control unit 7 may calibrate (in other words, control, adjust, or change) the irradiation mode of the processing light EL#1 based on the calculated best focus position. For example, the control unit 7 may control the movement of at least one of the processing head 21 and the stage 31 based on the best focus position. For example, the control unit 7 moves at least one of the processing head 21 and the stage 31 so that the best focus position is set on the printing surface MS or near the printing surface MS during at least part of the printing period. Good too. For example, the control unit 7 moves at least one of the processing head 21 and the stage 31 so that the best focus position is set on or near the calibration surface 801 during at least part of the measurement period. You may let them. As a result, the control unit 7 can irradiate each of the modeling surface MS and the calibration unit 8 with the processing light EL#1 having an appropriate amount of defocus compared to the case where the focus calibration operation is not performed. .

(2-2-5) Distortion Calibration Operation The processing system SYS may perform a distortion calibration operation as at least a part of the calibration operation.

The processing system SYS may perform the distortion calibration operation after performing the above-described rotational calibration operation, offset calibration operation, and focus calibration operation. That is, the processing system SYS may perform the distortion calibration operation in a state where the irradiation mode of the processing lights EL#1 and EL#2 is calibrated based on the amount of rotation, the amount of offset, and the best focus position. However, the processing system SYS may perform a distortion calibration operation before performing at least one of the above-described rotational calibration operation, offset calibration operation, and focus calibration operation.

The distortion calibration operation is performed between the designed irradiation position of the processing light EL#1 indicated by the galvano control signal and the actual irradiation position of the processing light EL#1 deflected by the galvano mirror 2146 based on the galvano control signal. The first distortion calibration operation may include a first distortion calibration operation for calculating the amount of deviation. In particular, the first distortion calibration operation is performed in a shot area (for example, a processing unit area BSA# 1) may include an operation of calculating the amount of deviation between the designed irradiation position of processing light EL#1 and the actual irradiation position of processing light EL#1.

The distortion calibration operation is performed between the designed irradiation position of the processing light EL#2 indicated by the galvano control signal and the actual irradiation position of the processing light EL#2 deflected by the galvano mirror 2156 based on the galvano control signal. The second distortion calibration operation may include a second distortion calibration operation for calculating the amount of deviation. In particular, the second distortion calibration operation is performed in a shot area (for example, a processing unit area BSA# 2) may include an operation of calculating the amount of deviation between the designed irradiation position of processing light EL#2 and the actual irradiation position of processing light EL#2.

The first distortion calibration operation will be specifically explained below. However, the processing system SYS may perform the second distortion calibration operation by performing the same operation as the first distortion calibration operation. Specifically, in the following explanation regarding the first distortion calibration operation, the words "first," "galvano mirror 2146," and "#1" are replaced with "second," "galvano mirror 2156," and "#1," respectively. #2", it can be used as an explanation regarding the second distortion calibration operation.

In the following explanation, the amount of deviation between the designed irradiation position of processing light EL#1 and the actual irradiation position of processing light EL#1 will be referred to as the irradiation position of processing light EL#1. This is called the amount of deviation.

The processing system SYS uses the second calibration unit 82 included in the calibration unit 8 to perform a first rotational calibration operation. In particular, the processing system SYS uses the plurality of pinhole marks 8242 formed in the opening member 822 of the second calibration unit 82 to perform the first distortion calibration operation.

Specifically, the control unit 7 controls the processing head 21 so as to sequentially irradiate the plurality of pinhole marks 8242 with the processing light EL#1. At this time, the processing head 21 (irradiation optical system 211) and the second calibration unit 82 may remain stationary. In order to sequentially irradiate the plurality of pinhole marks 8242 with the processing light EL#1, the control unit 7 first controls the galvano mirror 2146 to sequentially irradiate the plurality of pinhole marks 8242 with the processing light EL#1. Generate galvo control signals for In particular, the control unit 7 controls the galvanometer mirror 2146 so that the processing light EL#1 scans each pinhole mark 8242, as shown in FIG. A galvano control signal may be generated for this purpose. In other words, the control unit 7 controls the operation of moving the processing light EL#1 in one direction (for example, the Y-axis direction) at the position where each pinhole mark 8242 is formed, in addition to A galvano control signal may be generated to repeatedly control the galvanometer mirror 2146 while changing the irradiation position of the processing light EL#1 in the direction (for example, the X-axis direction). The control unit 7 controls the operation of moving the target irradiation area EA#1 in one direction (for example, the Y-axis direction) at the position where each pinhole mark 8242 is formed, and the operation of moving the target irradiation area EA#1 in one direction (for example, the Y-axis direction) in another direction that intersects with the one direction. A galvano control signal for controlling the galvano mirror 2146 may be generated repeatedly while changing the position of the target irradiation area EA#1.

As mentioned above, the first distortion calibration operation may include an operation of calculating the irradiation position deviation amount of processing light EL#1 at each position within the shot area (for example, processing unit area BSA#1). As I said. In this case, the plurality of pinhole marks 8242 may be formed in the opening member 822 so that the plurality of pinhole marks 8242 are included in the shot area. As a result, the processing system SYS deflects the processing light EL#1 using the galvanometer mirror 2146 while fixing the positional relationship between the irradiation optical system 211 and the calibration unit 8, thereby creating a plurality of pinhole marks 8242. The processing light EL#1 can be sequentially irradiated to the processing light EL#1. That is, the processing system SYS can sequentially irradiate the processing light EL#1 onto a plurality of pinhole marks 8242 formed at a plurality of different positions within the shot area.

After that, the control unit 7 controls the galvano mirror 2146 based on the generated galvano control signal. As a result, the galvanometer mirror 2146 moves the processing light EL#1 on the aperture member 822 so as to sequentially irradiate the plurality of pinhole marks 8242 with the processing light EL#1. In other words, as shown in FIG. 23, the galvanometer mirror 2146 performs an operation of moving the processing light EL#1 so as to scan each pinhole mark 8242, so that the plurality of pinhole marks 8242 are sequentially scanned by the processing light EL#1. Repeat as desired.

As a result, the light receiving device 821 receives the processing light EL#1 that has passed through each pinhole mark 8242. As shown in FIG. 24, which is a graph showing the reception results of processed light EL#1 by the light receiving device 821, the light receiving device 821 detects that the processed light EL#1 is not irradiated onto the openings 8232 forming each pinhole mark 8242. A light reception signal indicating that the intensity of the processing light EL#1 during the period in which at least a part of the processing light EL is irradiated to the aperture 8232 is greater than the intensity of the processing light EL#1 during the period. Light reception information indicating the light reception result as at least a part of the measurement information is output.

After that, the control unit 7 calculates the irradiation position deviation amount of the processing light EL#1 based on the light reception information. Specifically, since the processing light EL#1 scans each pinhole mark 8242, the time (light reception timing) on the horizontal axis in FIG. The actual irradiation position of EL #1 is indirectly shown. Therefore, the light reception information includes information regarding the actual irradiation position of the processing light EL#1. That is, as shown in FIG. 24, the actual light reception result of processing light EL#1 indicated by the light reception information indicates the actual irradiation position of processing light EL#1. Furthermore, as described above, at the position where each pinhole mark 8242 is formed, the operation of moving the processing light EL#1 in one direction (for example, the Y-axis direction) causes the operation of moving the processing light EL#1 in one direction (for example, the Y-axis direction) to This is repeated while changing the irradiation position of the processing light EL#1 in the direction (for example, the X-axis direction). In this case, the light reception information includes information regarding the actual irradiation position of the processing light EL#1 in each of the X-axis direction and the Y-axis direction. That is, as shown in FIG. 24, the actual light reception result of the processing light EL#1 indicated by the light reception information indicates the actual irradiation position of the processing light EL#1 in each of the X-axis direction and the Y-axis direction. Therefore, the control unit 7 can calculate the actual irradiation position of the processing light EL#1 in each of the X-axis direction and the Y-axis direction based on the light reception information. On the other hand, the designed irradiation positions of the processing light EL#1 in the X-axis direction and the Y-axis direction are information known to the control unit 7. This is because the control unit 7 generates a galvano control signal for controlling the galvanometer mirror 2146 so as to irradiate the designed irradiation position with the processing light EL#1. As a result, the control unit 7 determines the difference between the actual irradiation position of the processing light EL#1 calculated based on the received light information and the designed irradiation position of the processing light EL#1 used to generate the galvano control signal. The difference between the two can be calculated. That is, the control unit 7 can calculate the irradiation position shift amount of the processing light EL#1 based on the light reception information. For example, as shown in FIG. 24, the control unit 7 may calculate the irradiation position deviation amount ΔIPx of the processing light EL#1 in the X-axis direction. For example, as shown in FIG. 24, the control unit 7 may calculate the irradiation position deviation amount ΔIPy of the processing light EL#1 in the Y-axis direction.

As shown in FIG. 25, the control unit 7 may calculate the amount of irradiation position deviation of the processing light EL#1 at the position where each of the plurality of pinhole marks 8242 is formed. In particular, when the pinhole mark 8242 is included in the shot area as described above, the control unit 7 calculates the amount of irradiation position deviation of the processing light EL#1 at each of a plurality of different positions within the shot area. Good too.

After the amount of deviation in the irradiation position of the processing light EL#1 is calculated, the control unit 7 calibrates (in other words, controls and adjusts) the irradiation mode of the processing light EL#1 based on the calculated amount of deviation in the irradiation position. or change). For example, the control unit 7 may control the galvanometer mirror 2146 based on the calculated irradiation position shift amount. For example, the control unit 7 may generate a galvano control signal that controls the galvano mirror 2146 so that the amount of deviation in the irradiation position of the processing light EL#1 becomes zero. That is, the control unit 7 may generate a galvano control signal that controls the galvano mirror 2146 so that the designed irradiation position is irradiated with the processing light EL#1. For example, the control unit 7 may generate a galvano control signal that controls the galvano mirror 2146 so that the amount of deviation in the irradiation position of the processing light EL#1 becomes zero during at least part of the modeling period. For example, the control unit 7 may generate a galvano control signal that controls the galvano mirror 2146 so that the amount of deviation in the irradiation position of the processing light EL#1 becomes zero during at least part of the measurement period. For example, the control unit 7 may generate a galvano control signal to control the galvano mirror 2146 so that the irradiation position deviation amount ΔIPx of the processing light EL#1 in the X-axis direction becomes zero. For example, the control unit 7 generates a galvano control signal that controls the galvano mirror 2146 so that the irradiation position deviation amount ΔIPx of the processing light EL#1 in the X-axis direction becomes zero at each of a plurality of positions in the shot area. You may. For example, the control unit 7 may generate a galvano control signal that controls the galvano mirror 2146 so that the irradiation position deviation amount ΔIPy of the processing light EL#1 in the Y-axis direction becomes zero. For example, the control unit 7 generates a galvano control signal that controls the galvano mirror 2146 so that the irradiation position deviation amount ΔIPy of the processing light EL#1 in the Y-axis direction becomes zero at each of a plurality of positions in the shot area. You may. As a result, even if the irradiation position deviation amount of the processing light EL#1 calculated by the distortion calibration operation is not zero, the control unit 7 controls the processing light EL#1 when the irradiation position deviation amount is zero. The galvanometer mirror 2146 can be controlled so that the processing light EL is irradiated to the same position as that irradiated by the processing light EL. In other words, the galvano mirror 2146 can deflect the processing light EL#1 while canceling out the influence of the amount of irradiation position shift. Therefore, compared to the case where the distortion calibration operation is not performed, the galvanometer mirror 2146 can deflect the processing light EL#1 with high accuracy without being affected by the amount of irradiation position shift.

Note that when both the first distortion calibration operation and the second distortion calibration operation are performed, the control unit 7 controls the actual irradiation position of the processing light EL#1 and the actual irradiation position of the processing light EL#2. Both the location and location can be calculated. In particular, the control unit 7 can calculate both the actual irradiation position of the processing light EL#1 and the actual irradiation position of the processing light EL#2 at each of a plurality of positions within the shot area. In this case, the control unit 7 controls at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of the processing light EL#1 is set to a position corresponding to the actual irradiation position of the processing light EL#2. May be controlled. For example, the control unit 7 adjusts the actual irradiation position of the processing light EL#1 at the first position within the shot area to a position corresponding to the actual irradiation position of the processing light EL#2 at the first position within the shot area. At least one of galvanometer mirrors 2146 and 2156 may be controlled to be set. For example, the control unit 7 may be configured such that the actual irradiation position of the processing light EL#1 at a second position different from the first position within the shot area is the actual irradiation position of the processing light EL#2 at the second position within the shot area. At least one of the galvanometer mirrors 2146 and 2156 may be controlled so that it is set to a position corresponding to the position. Alternatively, the control unit 7 controls at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of the processing light EL#2 is set to a position corresponding to the actual irradiation position of the processing light EL#1. You may. For example, the control unit 7 adjusts the actual irradiation position of the processing light EL#2 at the first position within the shot area to a position corresponding to the actual irradiation position of the processing light EL#1 at the first position within the shot area. At least one of galvanometer mirrors 2146 and 2156 may be controlled to be set. For example, the control unit 7 adjusts the actual irradiation position of the processing light EL#2 at the second position within the shot area to a position corresponding to the actual irradiation position of the processing light EL#1 at the second position within the shot area. At least one of galvanometer mirrors 2146 and 2156 may be controlled to be set.

The control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 so that the actual irradiation position of the processing light EL#2 overlaps with the actual irradiation position of the processing light EL#1. For example, the control unit 7 controls the processing light such that the actual irradiation position of the processing light EL#2 at the first position within the shot area overlaps with the actual irradiation position of the processing light EL#1 at the first position within the shot area. At least one of galvanometer mirrors 2146 and 2156 may be controlled. For example, the control unit 7 controls the processing light so that the actual irradiation position of the processing light EL#2 at the second position within the shot area overlaps with the actual irradiation position of the processing light EL#1 at the second position within the shot area. At least one of galvanometer mirrors 2146 and 2156 may be controlled. As a result, the processing system SYS can irradiate both processing lights EL#1 and EL#2 to the same position.

The processing system SYS may calculate the response delay of the galvano mirror 2146 in a state where the irradiation mode of the processing light EL#1 is calibrated based on the amount of deviation in the irradiation position of the processing light EL#1. The state in which the irradiation mode of processing light EL#1 is calibrated based on the amount of deviation in the irradiation position of processing light EL#1 is the galvano control that controls the galvanometer mirror 2146 to irradiate processing light EL#1 to one position. It may also mean a state in which when a signal is input to the galvano mirror 2146, the processing light EL#1 via the galvano mirror 2146 is actually irradiated to one position. In addition, the response delay of the galvano mirror 2146 is caused by the fact that the galvano control signal that controls the galvano mirror 2146 to irradiate the processing light EL#1 to the first position is input to the galvano mirror 2146, and then the processing is actually performed at the first position. It may also mean the time required until the light EL#1 is irradiated. In this case, the processing system SYS moves at least one of the processing head 21 and the stage 31 so that the one pinhole mark 8242 is located at the one position, and irradiates the processing light EL#1 to the one pinhole mark 8242. You may. Thereafter, the control unit 7 determines the time during which the pinhole mark 8242 was irradiated with the processing light EL#1, based on the light reception information indicating the reception result of the processing light EL#1, so that the processing light EL#1 actually returns to the first position. 1 may be calculated as the irradiation time. Thereafter, the control unit 7 may calculate the response delay of the galvano mirror 2146 based on the time during which the pinhole mark 8242 is irradiated with the processing light EL#1. After the response delay of the galvano mirror 2146 is calculated, the control unit 7 may control the galvano mirror 2146 so that the response delay becomes zero (or a desired value).

Similarly, the processing system SYS calibrates the irradiation mode of the processing light EL#2 based on the amount of irradiation position deviation of the processing light EL#2 by performing the same operation as the operation to calculate the response delay of the galvanometer mirror 2146. The response delay of the galvanometer mirror 2156 may be calculated in this state. After the response delay of the galvano mirror 2156 is calculated, the control unit 7 may control the galvano mirror 2156 so that the response delay becomes zero (or a desired value).

(2-2-6) Stroke Calibration Operation The processing system SYS may perform a stroke calibration operation as at least a part of the calibration operation.

The processing system SYS may perform a stroke calibration operation after performing the above-described rotation calibration operation, offset calibration operation, focus calibration operation, and distortion calibration operation. In other words, the processing system SYS performs the stroke calibration operation in a state where the irradiation mode of the processing lights EL#1 and EL#2 is calibrated based on the rotation amount, offset amount, best focus position, and irradiation position deviation amount. You can. However, the processing system SYS may perform a stroke calibration operation before performing at least one of the above-described rotation calibration operation, offset calibration operation, focus calibration operation, and distortion calibration operation.

The stroke calibration operation may include a first stroke calibration operation for calculating the stroke width (that is, the stroke amount) of the movement of the processing light EL#1 by the galvanometer mirror 2146 on the modeling surface MS. In particular, the stroke width of the movement of the processing light EL#1 may mean the amplitude of the reciprocating movement of the processing light EL#1. Note that the stroke width of the movement of the processing light EL#1 may be considered to be equivalent to the stroke width of the movement of the target irradiation area EA#1 that is irradiated with the processing light EL#1. The stroke width of the movement of the processing light EL#1 may be considered to be equivalent to the stroke width of the movement of the irradiation position of the processing light EL#1.

The stroke calibration operation may include a second stroke calibration operation for calculating the stroke width (that is, the stroke amount) of the movement of the processing light EL#2 on the modeling surface MS by the galvanometer mirror 2156. The stroke width of the movement of the processing light EL#2 may mean the amplitude of the reciprocating movement of the processing light EL#2. Note that the stroke width of the movement of the processing light EL#2 may be considered to be equivalent to the stroke width of the movement of the target irradiation area EA#2 that is irradiated with the processing light EL#2. The stroke width of the movement of the processing light EL#2 may be considered to be equivalent to the stroke width of the movement of the irradiation position of the processing light EL#2.

The first stroke calibration operation will be specifically explained below. However, the processing system SYS may perform the second stroke calibration operation by performing the same operation as the first stroke calibration operation. Specifically, in the following explanation regarding the first stroke calibration operation, the words "first", "galvano mirror 2146", and "#1" are replaced with "second", "galvano mirror 2156", and "#1", respectively. #2", it can be used as an explanation regarding the second stroke calibration operation.

The processing system SYS uses the second calibration unit 82 included in the calibration unit 8 to perform a first stroke calibration operation. In particular, the processing system SYS uses at least one of the slit marks 8243 and 8244 formed on the opening member 822 of the second calibration unit 82 to perform the first stroke calibration operation. In the following description, for convenience of explanation, an example will be described in which the processing system SYS performs the first stroke calibration operation using both the slit marks 8243 and 8244. In this case, the processing system SYS performs the first stroke calibration operation by irradiating each of the slit marks 8243 and 8244 with the processing light EL#1. The processing system SYS irradiates one of the slit marks 8243 and 8244 with the processing light EL #1 during the first period of the measurement period, and then irradiates the slit mark 8243 and 8244 during the second period of the measurement period. The first stroke calibration operation may be performed by irradiating the processing light EL#1 to the other one of the rays 8244. However, the processing system SYS irradiates either one of the slit marks 8243 and 8244 with the processing light EL#1 while not irradiating the other of the slit marks 8243 and 8244 with the processing light EL#1. A one-stroke calibration operation may also be performed.

When irradiating each of the slit marks 8243 and 8244 with the processing light EL#1, the control unit 7 shows the processing light EL#1 that is irradiated on each of the slit marks 8243 and 8244 as shown in FIGS. The galvanometer mirror 2146 is controlled so that the irradiation position of the processing light EL#1 (that is, the target irradiation area EA#1) moves on the surface of the aperture member 822. In particular, the control unit 7 controls the galvanometer mirror 2146 so that the processing light EL#1 moves back and forth on the surface of the aperture member 822. For example, the control unit 7 may control the galvanometer mirror 2146 so that the processing light EL#1 moves back and forth on the surface of the aperture member 822 within a target stroke width range. In this case, during at least part of the period during which the processing light EL#1 moves on the surface of the aperture member 822, the processing light EL#1 actually irradiates each of the slit marks 8243 and 8244.

When irradiating each of the slit marks 8243 and 8244 with the processing light EL#1, the control unit 7 further controls the processing head 21 (particularly the irradiation optical system 211) and the calibration, as shown in FIGS. 26 and 27. At least one of the head drive system 22 and the stage drive system 32 is controlled so that at least one of the units 8 moves. In particular, the control unit 7 allows one of the processing head 21 (in particular, the irradiation optical system 211) and the calibration unit 8 to At least one of the head drive system 22 and the stage drive system 32 is controlled so that the head drive system 22 and the stage drive system 32 are moved. For example, the control unit 7 may control the head drive system 22 so that the processing head 21 (in particular, the irradiation optical system 211) moves relative to the calibration unit 8. The control unit 7 may control the stage drive system 32 so that the calibration unit 8 moves relative to the processing head 21 (in particular, the irradiation optical system 211). Note that the control unit 7 may control the head drive system 21 and the stage drive system 32 so that both the processing head 21 and the calibration unit 8 move.

The control unit 7 controls the galvano mirror 2146, the head drive system 22, and the stage drive so that the processing light EL#1 reciprocating on the aperture member 822 by the galvano mirror 2146 crosses each of the slit marks 8243 and 8244. At least one of the systems 32 may be controlled. That is, the control unit 7 controls at least the galvano mirror 2146, the head drive system 22, and the stage drive system 32 so that the processing light EL#1 crosses each of the openings 8233 and 8234 forming the slit marks 8243 and 8244, respectively. Either one may be controlled.

In particular, the control unit 7 controls the galvano mirror 2146 and the head drive so that the processing light EL#1 crosses the slit mark 8243 along a direction intersecting the longitudinal direction of the slit mark 8243 (that is, the longitudinal direction of the opening 8233). At least one of the system 22 and the stage drive system 32 may be controlled. In the example shown in FIG. 26, the longitudinal direction of the slit mark 8243 is the X-axis direction. Therefore, as shown in FIG. 26, the control unit 7 controls the galvano mirror 2146, the head drive system 22, and the stage drive system 32 so that the processing light EL#1 crosses the slit mark 8243 along the Y-axis direction. At least one of them may be controlled.

In this case, as shown in FIG. 26, the moving direction of the irradiation position of the processing light EL#1 by the galvano mirror 2146 may be a direction intersecting the longitudinal direction of the slit mark 8243. That is, the galvano mirror 2146 may move the irradiation position of the processing light EL#1 along a direction (for example, the Y-axis direction) that intersects the longitudinal direction of the slit mark 8243. Furthermore, the movement direction of at least one of the processing head 21 (in particular, the irradiation optical system 211) and the calibration unit 8 by at least one of the head drive system 22 and the stage drive system 32 is determined by the irradiation of the processing light EL#1 by the galvanometer mirror 2146. It may be the same as the moving direction of the position. In other words, at least one of the head drive system 22 and the stage drive system 32 moves the processing head 21 and the caliber along the direction (typically perpendicular direction, for example, the Y-axis direction) that intersects the longitudinal direction of the slit mark 8243. At least one of the application units 8 may be moved. Note that in this embodiment, since the stage drive system 32 can move the calibration unit 8 in the Y-axis direction, the stage drive system 32 can move the calibration unit 8 in the direction intersecting the longitudinal direction of the slit mark 8243 (typical The calibration unit 8 may be moved along a direction (for example, the Y-axis direction) perpendicular to the above. In this case, as shown in FIG. 26, the control unit 7 can calculate the stroke width STy of movement of the processing light EL#1 in the Y-axis direction.

Similarly, the control unit 7 controls the galvanometer mirror 2146 and the head so that the processing light EL#1 crosses the slit mark 8244 along the longitudinal direction of the slit mark 8244 (that is, the longitudinal direction of the opening 8234). At least one of the drive system 22 and the stage drive system 32 may be controlled. In the example shown in FIG. 27, the longitudinal direction of the slit mark 8244 is the Y-axis direction. Therefore, as shown in FIG. 27, the control unit 7 controls the galvano mirror 2146, the head drive system 22, and the stage drive system 32 so that the processing light EL#1 crosses the slit mark 8244 along the X-axis direction. At least one of them may be controlled.

In this case, as shown in FIG. 27, the moving direction of the irradiation position of the processing light EL#1 by the galvanometer mirror 2146 may be a direction intersecting the longitudinal direction of the slit mark 8244. In other words, the galvano mirror 2146 may move the irradiation position of the processing light EL#1 along a direction intersecting the longitudinal direction of the slit mark 8244 (typically a perpendicular direction, for example, the X-axis direction). Furthermore, the movement direction of at least one of the processing head 21 (in particular, the irradiation optical system 211) and the calibration unit 8 by at least one of the head drive system 22 and the stage drive system 32 is determined by the irradiation of the processing light EL#1 by the galvanometer mirror 2146. It may be the same as the moving direction of the position. In other words, at least one of the head drive system 22 and the stage drive system 32 moves the processing head 21 and the caliber along the direction intersecting the longitudinal direction of the slit mark 8244 (typically orthogonal direction, for example, the X-axis direction). At least one of the application units 8 may be moved. Note that in this embodiment, since the head drive system 22 can move the processing head 21 in the X-axis direction, the head drive system 22 can move the processing head 21 in the The processing head 21 may be moved along the axial direction). In this case, as shown in FIG. 27, the control unit 7 can calculate the stroke width STx of movement of the processing light EL#1 in the X-axis direction.

The moving speed of the irradiation position of the processing light EL#1 by the galvano mirror 2146 is determined by the movement speed of the processing head 21 (in particular, the irradiation optical system 211) and the calibration unit 8 by at least one of the head drive system 22 and the stage drive system 32. It may be different from the movement speed. Typically, the moving speed of the irradiation position of the processing light EL#1 may be faster than the moving speed of at least one of the processing head 21 (particularly the irradiation optical system 211) and the calibration unit 8. For example, the movement speed of the irradiation position of the processing light EL#1 may be several times to more than ten times the movement speed of at least one of the processing head 21 (particularly the irradiation optical system 211) and the calibration unit 8. As a result, the processing light EL#1 is irradiated onto the slit mark 8243 (that is, the opening 8233) at each position in the area where the processing light EL#1 moves back and forth, making it possible to appropriately calculate the stroke width. .

As a result, the light receiving device 821 receives the processed light EL#1 that has passed through each of the slit marks 8243 and 8244 that move with respect to the irradiation optical system 211. As shown in FIG. 28(a), which is a graph showing the reception result of the processed light EL#1 that has passed through the slit mark 8243 by the light receiving device 821, the light receiving device 821 detects that the processed light EL#1 constitutes the slit mark 8243. Compared to the intensity of processing light EL#1 during a period in which the opening 8233 is not irradiated, the intensity of processing light EL#1 during a period in which at least a portion of the processing light EL is irradiated onto the aperture 8233 is greater. Light reception information indicating a light reception signal indicating that the light reception result is a light reception result is output as at least a part of the measurement information. Furthermore, as shown in FIG. 28(b), which is a graph showing the reception result of the processed light EL#1 that has passed through the slit mark 8244 by the light receiving device 821, the light receiving device 821 detects that the processed light EL#1 has passed through the slit mark 8244. Compared to the intensity of processing light EL#1 during a period in which the constituent apertures 8234 are not irradiated, the intensity of processing light EL#1 during a period in which at least a part of the processing light EL is irradiated onto the opening 8234 is Light reception information indicating a light reception result indicating that the light reception signal has increased is output as at least part of the measurement information.

Note that the time (light reception timing) on the horizontal axis in FIG. 28(a) is substantially equivalent to the amount of movement of the calibration unit 8 in the Y-axis direction. The time (light reception timing) on the horizontal axis in FIG. 28(b) is substantially equivalent to the amount of movement of the processing head 21 in the X-axis direction (that is, the amount of movement of the irradiation optical system 211).

After that, the control unit 7 calculates the stroke amount of movement of the processing light EL#1 based on the light reception information.

For example, as shown in FIG. 28(a), the control unit 7 moves the processing light EL#1 in the Y-axis direction based on light reception information indicating the reception result of the processing light EL#1 that has passed through the slit mark 8243. The stroke amount STy may be calculated. Specifically, the control unit 7 may calculate the time during which the intensity of the processing light EL#1 is higher than a predetermined intensity based on the light reception information. In particular, as shown in FIG. 28(a), the control unit 7 may calculate the time period during which the intensity of the processing light EL#1 is maintained at its peak intensity based on the light reception information. Thereafter, the control unit 7 may calculate the stroke width STy of the movement of the processing light EL#1 based on the calculated time and the movement speed of the calibration unit 8 in the Y-axis direction. For example, the control unit 7 may calculate a value obtained by multiplying the calculated time by the moving speed of the calibration unit 8 as the stroke width STy.

For example, as shown in FIG. 28(b), the control unit 7 moves the processing light EL#1 in the The stroke amount STx may be calculated. Specifically, the control unit 7 may calculate the time during which the intensity of the processed light EL#1 is higher than a predetermined intensity based on the light reception information. In particular, as shown in FIG. 28(b), the control unit 7 may calculate the time period during which the intensity of the processed light EL#1 is maintained at its peak intensity based on the light reception information. Thereafter, the control unit 7 may calculate the stroke width STx of the movement of the processing light EL#1 based on the calculated time and the moving speed of the processing head 21 in the X-axis direction. For example, the control unit 7 may calculate a value obtained by multiplying the calculated time by the moving speed of the processing head 21 as the stroke width STx.

After the stroke width is calculated, the control unit 7 may calibrate (in other words, control, adjust, or change) the irradiation mode of the processing light EL#1 based on the calculated stroke width. For example, the control unit 7 may control the movement of at least one of the processing head 21 and the stage 31 based on the stroke widths STx and STy. For example, the control unit 7 may control the galvanometer mirror 2146 so that the stroke width STx becomes a desired first width during at least part of the modeling period. For example, the control unit 7 may control the galvanometer mirror 2146 so that the stroke width STy becomes a desired second width during at least part of the modeling period. For example, the control unit 7 may control the galvanometer mirror 2146 so that the stroke width STx becomes a desired third width during at least part of the measurement period. For example, the control unit 7 may control the galvanometer mirror 2146 so that the stroke width STy becomes a desired fourth width during at least part of the measurement period.

(2-2-7) Intensity Calibration Operation The processing system SYS may perform an intensity calibration operation as at least a part of the calibration operation. The intensity calibration operation may include a first intensity calibration operation that calculates the intensity of the processing light EL#1. The intensity calibration operation may include a second intensity calibration operation that calculates the intensity of the processing light EL#2.

Hereinafter, the first intensity calibration operation will be specifically explained. However, the processing system SYS may perform the second intensity calibration operation by performing the same operation as the first intensity calibration operation. Specifically, in the following explanation regarding the first intensity calibration operation, the words "first" and "#1" are replaced with the words "second" and "#2", respectively. It can be used as an explanation regarding the intensity calibration operation.

The processing system SYS uses the first calibration unit 81 included in the calibration unit 8 to perform a first intensity calibration operation. Specifically, as shown in FIG. 29 showing the first calibration unit 81, the processing system SYS irradiates the light receiving device 811 of the first calibration unit 81 with processing light EL#1. Light reception information indicating the result of reception of processed light EL#1 by the light receiving device 811 is output to the control unit 7 as at least part of the measurement information.

After that, the control unit 7 calculates the intensity of the processing light EL#1 based on the light reception information. Thereafter, the control unit 7 may calibrate (in other words, control, adjust, or change) the intensity of the processing light EL#1 based on the calculated intensity. For example, the control unit 7 may calibrate the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the modeling surface MS becomes a desired intensity. In order to control the intensity of the processing light EL#1, for example, the control unit 7 controls the light source 4 to change the intensity of the processing light EL#1 emitted from the light source 4#1 based on the calculated intensity. #1 may also be controlled. As a result, the processing system SYS can appropriately model the object on the modeling surface MS by irradiating the processing light EL#1 having an appropriate intensity onto the modeling surface MS.

As described above, the processing light EL#1 has an intensity capable of melting the modeling material M. Therefore, the processing light EL#1 entering the light receiving device 811 may have an intensity capable of melting the modeling material M. However, if the processing light EL#1 having an intensity capable of melting the modeling material M enters the light receiving device 811, the light receiving device 811 may be damaged by the processing light EL#1. Therefore, the processing system SYS may irradiate the light receiving device 811 with the processing light EL#1 in a defocused state. In this case, as the defocus amount of the processing light EL#1 increases, the intensity of the processing light EL#1 per unit area becomes weaker, so the processing system SYS can appropriately prevent damage to the light receiving device 811. . On the other hand, even if the processing light EL#1 in a defocused state is irradiated onto the light receiving device 811, the total amount of the processing light EL#1 irradiating the light receiving device 811 does not change. Therefore, even if the processed light EL#1 in a defocused state is irradiated onto the light receiving device 811, the control unit 7 can appropriately calculate the intensity of the processed light EL#1 based on the received light information. .

Note that the processing system SYS may perform the first intensity calibration operation and the second intensity calibration operation simultaneously.

(2-3) Other operations using calibration unit 8
(2-3-1) Power meter calibration operation The processing system SYS uses the calibration unit 8 to perform a power meter calibration operation for calibrating at least one of the power meters 2143 and 2153 included in the irradiation optical system 211. Good too.

Specifically, the control unit 7 may control the processing system SYS to irradiate the processing light EL#1 to the light receiving device 811 of the first calibration unit 81. Thereafter, the control unit 7 may calculate the intensity of the processing light EL#1 based on the light reception information. In parallel, the control unit 7 may calculate the intensity of the processing light EL#1 based on the detection result of the power meter 2143. After that, the control unit 7 may repeat the same operation while changing the intensity of the processing light EL#1.

Thereafter, the control unit 7 determines that the tendency of change in the intensity of the processing light EL#1 calculated based on the detection result of the power meter 2143 is the intensity of the processing light EL#1 calculated based on the light reception result of the light receiving device 811. It may be determined whether or not the change tendency is the same as that of . The change tendency of the intensity of processed light EL#1 calculated based on the detection result of the power meter 2143 is the same as the change tendency of the intensity of processed light EL#1 calculated based on the light reception result of the light receiving device 811. In this case, the power meter 2143 may be deemed to be appropriately detecting the intensity of the processing light EL#1. In this case, the control unit 7 does not need to calibrate the power meter 2143. On the other hand, the change tendency of the intensity of processed light EL#1 calculated based on the detection result of the power meter 2143 is the same as the change tendency of the intensity of processed light EL#1 calculated based on the light reception result of the light receiving device 811. If they are not the same, it may be considered that a detection error may have occurred in the power meter 2143. In this case, the control unit 7 determines that the tendency of change in the intensity of the processing light EL#1 calculated based on the detection result of the power meter 2143 is different from that of the processing light EL#1 calculated based on the light reception result of the light receiving device 811. The power meter 2143 may be calibrated to match the intensity change trend. For example, the control unit 7 calculates a correction value for correcting the intensity of processed light EL#1 calculated based on the detection result of the power meter 2143, and adds the calculated correction value to the calculated intensity. , the power meter 2143 may be calibrated. As a result, the control unit 7 can more accurately calculate the intensity of the processing light EL#1 based on the detection result of the power meter 2143, compared to the case where the power meter calibration operation is not performed.

Similarly, the control unit 7 may control the processing system SYS to irradiate the processing light EL#2 to the light receiving device 811 of the first calibration unit 81. After that, the control unit 7 may calculate the intensity of the processing light EL#2 based on the light reception information. In parallel, the control unit 7 may calculate the intensity of the processing light EL#2 based on the detection result of the power meter 2153. After that, the control unit 7 may repeat the same operation while changing the intensity of the processing light EL#2.

Thereafter, the control unit 7 determines that the change tendency of the intensity of the processing light EL#2 calculated based on the detection result of the power meter 2153 is the intensity of the processing light EL#2 calculated based on the light reception result of the light receiving device 811. It may be determined whether or not the change tendency is the same as that of . The change tendency of the intensity of processed light EL#2 calculated based on the detection result of the power meter 2153 is the same as the change tendency of the intensity of processed light EL#2 calculated based on the light reception result of the light receiving device 811. In this case, the power meter 2153 may be deemed to be appropriately detecting the intensity of the processing light EL#2. In this case, the control unit 7 does not need to calibrate the power meter 2153. On the other hand, the change tendency of the intensity of processed light EL#2 calculated based on the detection result of the power meter 2153 is the same as the change tendency of the intensity of processed light EL#2 calculated based on the light reception result of the light receiving device 811. If they are not the same, it may be considered that a detection error may have occurred in the power meter 2153. In this case, the control unit 7 determines that the tendency of change in the intensity of the processing light EL#2 calculated based on the detection result of the power meter 2153 is different from that of the processing light EL#2 calculated based on the light reception result of the light receiving device 811. The power meter 2153 may be calibrated to match the intensity change trend. For example, the control unit 7 calculates a correction value for correcting the intensity of processed light EL#2 calculated based on the detection result of the power meter 2153, and adds the calculated correction value to the calculated intensity. , the power meter 2153 may be calibrated. As a result, the control unit 7 can more accurately calculate the intensity of the processing light EL#2 based on the detection result of the power meter 2153, compared to the case where the power meter calibration operation is not performed.

(2-3-2) Abnormality determination operation The processing system SYS may use the calibration unit 8 to perform an abnormality determination operation to determine whether or not an abnormality has occurred in the processing system SYS. In the following, as an example of the abnormality determination operation, the calibration unit 8 is used to determine whether an abnormality has occurred in at least one of the power meter 2143, the power meter 2153, the light source 4#1, and the light source 4#2. The operation will be explained.

Specifically, the control unit 7 may control the processing system SYS to irradiate the processing light EL#1 to the light receiving device 811 of the first calibration unit 81. In this case, the control unit 7 may control the light source 4#1 to emit the processing light EL#1 with a predetermined intensity. Thereafter, the control unit 7 may calculate the intensity of the processing light EL#1 based on the light reception information. In parallel, the control unit 7 may calculate the intensity of the processing light EL#1 based on the detection result of the power meter 2143.

Furthermore, the control unit 7 may control the processing system SYS to irradiate the processing light EL#2 to the light receiving device 811 of the first calibration unit 81. In this case, the control unit 7 may control the light source 4#2 to emit the processing light EL#2 with a predetermined intensity. After that, the control unit 7 may calculate the intensity of the processing light EL#2 based on the light reception information. In parallel, the control unit 7 may calculate the intensity of the processing light EL#2 based on the detection result of the power meter 2153.

Thereafter, the control unit 7 may determine whether the intensity of the processing light EL#1 calculated based on the detection result of the power meter 2143 is abnormal. Further, the control unit 7 may determine whether the intensity of the processed light EL#1 calculated based on the light reception result of the light receiving device 811 is abnormal. For example, it is assumed that the control unit 7 calculates the calculated intensity of the processing light EL#1 and a situation in which the light source 4#1 is controlled to emit the processing light EL#1 with a predetermined intensity. It may be determined that the calculated intensity of the processing light EL#1 is abnormal when the error with the intensity of the processing light EL#1 is equal to or greater than a first tolerance.

It is determined that the intensity of processed light EL#1 calculated based on the detection result of the power meter 2143 is abnormal, and the intensity of processed light EL#1 calculated based on the light reception result of the light receiving device 811 is abnormal. In this case, it is assumed that both the detection result of the power meter 2143 and the light reception result of the light receiving device 811 (that is, the measurement result of the calibration unit 8) are abnormal. In this case, the control unit 7 may determine that an abnormality has occurred in the light source 4#1, as shown in FIG. 30(a). This is because it is assumed that the possibility that an abnormality occurs in both the power meter 2143 and the light receiving device 811 at the same time is lower than the possibility that an abnormality occurs in the light source 4#1. On the other hand, the intensity of processed light EL#1 calculated based on the detection result of the power meter 2143 is abnormal, while the intensity of processed light EL#1 calculated based on the light reception result of the light receiving device 811 is abnormal. If it is determined that it is not (that is, normal), the detection result of the power meter 2143 is abnormal, while the light reception result of the light receiving device 811 (that is, the measurement result of the calibration unit 8) is not abnormal ( In other words, it is assumed to be normal). In this case, the control unit 7 may determine that an abnormality has occurred in the power meter 2143, as shown in FIG. 30(b). On the other hand, if the intensity of the processed light EL #1 calculated based on the detection result of the power meter 2143 is not abnormal (that is, normal), and the intensity of the processed light EL #1 calculated based on the light reception result of the light receiving device 811 is If it is determined that the intensity of EL #1 is not abnormal (that is, normal), both the detection result of the power meter 2143 and the light reception result of the light receiving device 811 (that is, the measurement result of the calibration unit 8) are It is assumed that there is no abnormality (that is, it is normal). In this case, the control unit 7 may determine that there is no abnormality in the light source 4 #1 and the power meter 2143.Similarly, the control unit 7 may determine that there is no abnormality in the light source 4#1 and the power meter 2143. It may be determined whether the intensity of EL #2 is abnormal. Furthermore, the control unit 7 may determine whether the intensity of the processed light EL#2 calculated based on the light reception result of the light receiving device 811 is abnormal. For example, it is assumed that the control unit 7 calculates the calculated intensity of the processing light EL#2 and a situation in which the light source 4#2 is controlled to emit the processing light EL#2 with a predetermined intensity. It may be determined that the calculated intensity of processing light EL#2 is abnormal when the error with the intensity of processing light EL#2 is equal to or greater than a second tolerance.

It is determined that the intensity of processed light EL#2 calculated based on the detection result of the power meter 2153 is abnormal, and the intensity of processed light EL#2 calculated based on the light reception result of the light receiving device 811 is abnormal. In this case, it is assumed that both the detection result of the power meter 2153 and the light reception result of the light receiving device 811 (that is, the measurement result of the calibration unit 8) are abnormal. In this case, the control unit 7 may determine that an abnormality has occurred in the light source 4#2, as shown in FIG. 30(a). This is because it is assumed that the possibility that an abnormality occurs in both the power meter 2153 and the light receiving device 811 at the same time is lower than the possibility that an abnormality occurs in the light source 4#2. On the other hand, the intensity of processed light EL#2 calculated based on the detection result of the power meter 2153 is abnormal, while the intensity of processed light EL#2 calculated based on the light reception result of the light receiving device 811 is abnormal. If it is determined that it is not (that is, normal), the detection result of the power meter 2153 is abnormal, while the light reception result of the light receiving device 811 (that is, the measurement result of the calibration unit 8) is not abnormal ( In other words, it is assumed to be normal). In this case, the control unit 7 may determine that an abnormality has occurred in the power meter 2153, as shown in FIG. 30(b). On the other hand, if the intensity of the processing light EL #2 calculated based on the detection result of the power meter 2153 is not an abnormal value (that is, it is normal), and the processing light intensity is calculated based on the light reception result of the light receiving device 811. When it is determined that the intensity of light EL #2 is not an abnormal value (that is, normal), the detection result of the power meter 2153 and the light reception result of the light receiving device 811 (that is, the measurement result of the calibration unit 8) are It is assumed that both are not abnormal (ie, normal). In this case, the control unit 7 may determine that there is no abnormality in the light source 4 #2 and the power meter 2153.

In this way, the processing system SYS uses at least one of the power meter 2143, the power meter 2153, the light source 4#1, and the light source 4#2 based on the measurement results of the processing lights EL#1 and EL#2 by the calibration unit 8. It is possible to appropriately determine whether or not an abnormality has occurred.

(3) Technical effects of processing system SYS As explained above, processing system SYS can use the calibration unit 8 to perform a calibration operation for calibrating the irradiation mode of processing light EL. As a result, the processing system SYS can irradiate the modeling surface MS with the processing light EL whose irradiation mode is appropriately calibrated. For this reason, the processing system SYS can appropriately model a model on the model surface MS. For example, compared to the case where no calibration operation is performed, the processing system SYS is able to form a molded object having a target shape with high accuracy.

As an example, the processing system SYS can perform a rotational calibration operation. Therefore, the processing system SYS can use the galvanometer mirrors 2146 and 2156 to move the irradiation positions of the processing lights EL#1 and EL#2 with high accuracy while offsetting the rotation amount θz.

As another example, the processing system SYS can perform an offset calibration operation. For this reason, the processing system SYS uses galvanometer mirrors 2146 and 2156 to accurately move the irradiation positions of processing lights EL#1 and EL#2, respectively, while offsetting the influence of at least one of the offset amounts ΔOffx and ΔOffy. be able to.

As another example, the processing system SYS can perform a focus calibration operation. Therefore, the processing system SYS can irradiate the modeling surface MS with the processing lights EL#1 and EL#2 having appropriate defocus amounts.

As another example, the processing system SYS can perform a distortion calibration operation. For this reason, the processing system SYS uses galvano mirrors 2146 and 2156 to irradiate processing lights EL#1 and EL#2 to desired positions, respectively, while canceling out the influence of at least one of the irradiation position deviation amounts ΔIPx and ΔIPy. can do.

As another example, the processing system SYS can perform a stroke calibration operation. Therefore, the processing system SYS can use the galvanometer mirrors 2146 and 2156 to reciprocate the processing lights EL#1 and EL#2 within a desired stroke width range. In other words, the processing system SYS controls the galvano mirrors 2146 and 2156 so that the processing lights EL#1 and EL#2 move back and forth within the desired stroke width ranges within the processing unit areas BSA#1 and BSA#2, respectively. can do. In other words, the processing system SYS uses the galvanometer mirror 2146 and 2156 can be controlled.

Furthermore, in this embodiment, the calibration unit 8 is arranged in a cradle 324 that is rotatable around the rotation axis. Therefore, by rotating the cradle 324, the processing system SYS can move the calibration unit 8 between the above-mentioned non-measurement position Pos1 and measurement position Pos2. For this reason, the processing system SYS irradiates the processing light EL#1 and EL#2 to the printing surface MS during at least a part of the printing period, and also irradiates the processing light EL#1 to the calibration unit 8 during at least a part of the measurement period. and EL#2 can be irradiated.

In addition, when the calibration unit 8 is rotatable around the rotation axis, as shown in FIG. As described above, the arrangement surface 3241 of the system 32 may face in a direction intersecting the Z-axis direction, which is the direction of gravity. In this case, the calibration surface 801 on which the first calibration unit 81 and the second calibration unit 82 are arranged also faces in a direction intersecting the Z-axis direction, which is the direction of gravity. As a result, the possibility that the modeling material M supplied from the material nozzle 212 during the modeling period will be deposited on the first calibration unit 81 and the second calibration unit 82 is reduced. Therefore, when the calibration unit 8 measures the processing lights EL#1 and EL#2 during at least part of the measurement period, the processing system SYS reduces the influence of the modeling material M deposited on the calibration unit 8. be able to.

Furthermore, even if the modeling material M is deposited on the first calibration unit 81 and the second calibration unit 82, the processing system SYS rotates the calibration unit 8 to relatively remove the deposited modeling material M. Can be easily removed. Therefore, even if the modeling material M is deposited on the first calibration unit 81 and the second calibration unit 82, the processing system SYS is unable to reduce the influence of the modeling material M deposited on the calibration unit 8. can. Note that the processing system SYS blows gas onto the modeling material M deposited on the first calibration unit 81 and the second calibration unit 82 to calibrate the modeling material M deposited on the first calibration unit 81 and the second calibration unit 82. The molding material M may be removed.

(4) Modification Next, a modification of the processing system SYS will be described.

(4-1) First Modification First, a first modification of the processing system SYS will be described. In the following description, the first modification of the processing system SYS will be referred to as a processing system SYSa. The processing system SYSa differs from the processing system SYS described above in that it includes a processing unit 2a instead of the processing unit 2. Other characteristics of the processing system SYSa may be the same as other characteristics of the processing system SYS. The processing unit 2a differs from the processing unit 2 described above in that it includes a processing head 21a instead of the processing head 21. Other features of the processing unit 2a may be the same as other features of the processing unit 2. The processing head 21a differs from the processing head 21 described above in that it includes an irradiation optical system 211a instead of the irradiation optical system 211. Other features of the processing head 21a may be the same as other features of the processing head 21. Therefore, the configuration of the irradiation optical system 211a in the first modification will be described below with reference to FIG. 31. FIG. 31 is a cross-sectional view showing the configuration of the irradiation optical system 211a in the first modification.

As shown in FIG. 31, the irradiation optical system 211a differs from the irradiation optical system 211 in that it includes a beam splitter 2142a and a beam splitter 2152a. Other features of the irradiation optical system 211a may be the same as other features of the irradiation optical system 211.

The beam splitter 2142a is placed on the optical path of the processing light EL#1 in the first optical system 214. In the example shown in FIG. 31, the beam splitter 2142a is arranged on the optical path of the processing light EL#1 between the parallel plate 2142 and the galvano scanner 2144. However, the arrangement position of the beam splitter 2142a is not limited to the example shown in FIG. 31.

Guide light GL#1 emitted from light source 4a#1 included in processing system SYSa enters beam splitter 2142a. The characteristics of the guide light GL#1 are different from the characteristics of the processing light EL#1. For example, the wavelength (typically, the peak wavelength) of the guide light GL#1 may be different from the wavelength (typically, the peak wavelength) of the processing light EL#1. For example, the wavelength band of the guide light GL#1 may be different from the wavelength band of the processing light EL#1. For example, the intensity of guide light GL#1 may be different from the intensity of processing light EL#1. Typically, the intensity of guide light GL#1 may be weaker than the intensity of processing light EL#1. However, the characteristics of the guide light GL#1 may be the same as the characteristics of the processing light EL#1.

The processing light EL#1 that has passed through the parallel plate 2142 is further incident on the beam splitter 2142a. The beam splitter 2142a functions as an ejection optical system that ejects each of the processing light EL#1 and the guide light GL#1 toward the galvano scanner 2144. Specifically, processing light EL#1 passes through beam splitter 2142a. Guide light GL#1 is reflected by beam splitter 2142a. The processing light EL#1 that has passed through the beam splitter 2142a is irradiated onto the modeling surface MS and the calibration unit 8, respectively, via the galvano scanner 2144 and the third optical system 216, as described above. The guide light GL#1 reflected by the beam splitter 2142a is also irradiated onto the modeling surface MS and the calibration unit 8 via the galvano scanner 2144 and the third optical system 216, similarly to the processing light EL#1. .

In the first modification, the calibration unit 8 may measure the guide light GL#1 in addition to or instead of measuring the processing light EL#1. In this case, the processing system SYSa uses the measurement results of the guide light GL#1 by the calibration unit 8 in addition to or instead of the measurement results of the processing light EL#1 by the calibration unit 8. The irradiation mode may be calibrated. In other words, in addition to or instead of irradiating the calibration unit 8 with the processing light EL#1, the processing system SYS irradiates the calibration unit 8 with the guide light GL#1. At least one of the above-described rotational calibration operation, offset calibration operation, focus calibration operation, distortion calibration operation, and stroke calibration operation may be performed to configure the irradiation mode.

However, if the characteristics (especially the wavelength) of the guide light GL#1 and the characteristics (especially the wavelength) of the processing light EL#1 are different, chromatic aberration may occur in the first optical system 214 and the third optical system. There is sex. Specifically, the focusing position of processing light EL#1 and the focusing position of guide light GL#1 are aligned in the irradiation direction of processing light EL#1 and guide light GL#1 (in FIG. 31, the Z-axis direction). It may shift along the That is, axial chromatic aberration or longitudinal chromatic aberration may occur. Furthermore, the position of the beam spot formed by the processing light EL#1 on the modeling surface MS or the calibration unit 8 is the same as the position of the beam spot formed by the guide light GL#1 on the modeling surface MS or the calibration unit 8. There is a possibility that it will not. That is, lateral chromatic aberration or lateral chromatic aberration may occur. Therefore, in this case, the control unit 7 uses the measurement result of the guide light GL#1 and the shift amount of the guide light GL#1 due to chromatic aberration (for example, at least in the X-axis direction, Y-axis direction, and Z-axis direction). The irradiation mode of the processing light EL#1 may be calibrated based on the amount of shift along one direction. As a result, the control unit 7 controls the irradiation mode of the processing light EL#1 using the measurement results of the guide light GL#1 having characteristics (especially wavelength) different from those of the processing light EL#1. Even when calibrating the irradiation mode of processing light EL#1, the irradiation mode of processing light EL#1 should be appropriately calibrated in the same way as when calibrating the irradiation mode of processing light EL#1 using the measurement results of processing light EL#1. I can do it.

Subsequently, the beam splitter 2152a is placed on the optical path of the processing light EL#2 in the second optical system 215. In the example shown in FIG. 31, the beam splitter 2152a is arranged on the optical path of the processing light EL#1 between the parallel plate 2152 and the galvano scanner 2154. However, the arrangement position of the beam splitter 2152a is not limited to the example shown in FIG. 31.

Guide light GL#2 emitted from light source 4a#2 included in processing system SYSa enters beam splitter 2152a. The characteristics of guide light GL#2 are different from those of processing light EL#2. For example, the wavelength (typically, the peak wavelength) of the guide light GL#2 may be different from the wavelength (typically, the peak wavelength) of the processing light EL#2. For example, the wavelength band of the guide light GL#2 may be different from the wavelength band of the processing light EL#2. For example, the intensity of guide light GL#2 may be different from the intensity of processing light EL#2. However, the characteristics of the guide light GL#2 may be the same as the characteristics of the processing light EL#2.

Further, the processing light EL#1 that has passed through the parallel plate 2152 is incident on the beam splitter 2152a. The beam splitter 2152a functions as an exit optical system that outputs each of the processing light EL#2 and the guide light GL#2 toward the galvano scanner 2154. Specifically, processing light EL#2 passes through beam splitter 2152a. Guide light GL#2 is reflected by beam splitter 2152a. The processing light EL#2 that has passed through the beam splitter 2152a is irradiated onto the modeling surface MS and the calibration unit 8, respectively, via the galvano scanner 2154 and the third optical system 216, as described above. The guide light GL#2 reflected by the beam splitter 2152a is also irradiated onto the modeling surface MS and the calibration unit 8, respectively, via the galvano scanner 2154 and the third optical system 216, similarly to the processing light EL#2. .

In the first modification, the calibration unit 8 may measure the guide light GL#2 in addition to or instead of measuring the processing light EL#2. In this case, the processing system SYSa uses the measurement results of the guide light GL#2 by the calibration unit 8 in addition to or instead of the measurement results of the processing light EL#2 by the calibration unit 8. The irradiation mode may be calibrated. In other words, in addition to or instead of irradiating the calibration unit 8 with the processing light EL#2, the processing system SYS irradiates the calibration unit 8 with the guide light GL#2. At least one of the above-described rotational calibration operation, offset calibration operation, focus calibration operation, distortion calibration operation, and stroke calibration operation may be performed to configure the irradiation mode.

However, if the characteristics (especially the wavelength) of the guide light GL#2 and the characteristics (especially the wavelength) of the processing light EL#2 are different, chromatic aberration may occur in the second optical system 215 and the third optical system. There is sex. Specifically, the focusing position of processing light EL#2 and the focusing position of guide light GL#2 are aligned in the irradiation direction of processing light EL#2 and guide light GL#2 (in FIG. 31, the Z-axis direction). It may shift along the That is, axial chromatic aberration or longitudinal chromatic aberration may occur. Furthermore, the position of the beam spot formed by the processing light EL#2 on the modeling surface MS or the calibration unit 8 is the same as the position of the beam spot formed on the modeling surface MS or the calibration unit 8 by the guide light GL#2. There is a possibility that it will not. That is, lateral chromatic aberration or lateral chromatic aberration may occur. Therefore, in this case, the control unit 7 uses the measurement result of the guide light GL#2 and the shift amount of the guide light GL#2 due to chromatic aberration (for example, at least in the X-axis direction, Y-axis direction, and Z-axis direction). The irradiation mode of the processing light EL#2 may be calibrated based on the amount of shift along one line. As a result, the control unit 7 controls the irradiation mode of the processing light EL#2 using the measurement results of the guide light GL#2 having characteristics (especially wavelength) different from those of the processing light EL#2. Even when calibrating the irradiation mode of processing light EL#2, the irradiation mode of processing light EL#2 should be appropriately calibrated, as in the case of calibrating the irradiation mode of processing light EL#2 using the measurement results of processing light EL#2. I can do it.

The calibration unit 8 may measure the guide lights GL#1 and GL#2 using the second calibration unit 82 for measuring the processing lights EL#1 and EL#2. Alternatively, in the first modification, the processing system SYSa may include a calibration unit 8a instead of the calibration unit 8. The calibration unit 8a measures guide lights GL#1 and GL#2 in comparison with the calibration unit 8, as shown in FIGS. 32(a) and 32(b) showing the configuration of the calibration unit 8a. It differs in that it includes a third calibration unit 83a for calibrating. In this case, the calibration unit 8a may measure the guide lights GL#1 and GL#2 using the third calibration unit 83a.

The third calibration unit 83a may include a light receiving device 831a and an aperture member 832a, as shown in FIGS. 32(a) and 32(b). The light receiving device 831a may be the same as the light receiving device 821 described above. The opening member 832a may include a glass substrate 8321a.

A damping film 8322a is formed on the glass substrate 8321a. An opening 833a is formed in the damping film 8322a. The attenuation film 8322a is a member capable of attenuating each of the guide lights GL#1 and GL#2 that are incident on the attenuation film 8322a. The damping film 8322a may include, for example, a chromium film or a chromium oxide film. In this case, each of the guide lights GL#1 and GL#2 irradiated onto the third calibration unit 83a enters the light receiving device 831a mainly through the opening 833a. Note that when each of the guide lights GL#1 and GL#2 is incident on the attenuation film 8322a, each of the guide lights GL#1 and GL#2 attenuated by the attenuation film 8322a is received via the attenuation film 8322a. The guide lights GL#1 and GL#2 may be incident on the light receiving device 831a, or each of the guide lights GL#1 and GL#2 may be blocked by the attenuation film 8322a so that each of the guide lights GL#1 and GL#2 does not enter the light receiving device 831a. You can. Therefore, the attenuation film 8322a may be referred to as a light shielding film.

In addition, as mentioned above, when the intensity of guide lights GL#1 and GL#2 is lower than the intensity of processing light EL#1 and processing light EL#2, the intensity of guide lights GL#1 and GL#2 is lower than that of processing light EL#1 and processing light EL#2. Compared to the case where the intensities of processing light EL#1 and processing light EL#2 are the same, the glass substrate 8321a, attenuation film 8322a, etc. may be damaged due to the irradiation of guide light GL#1 and GL#2. sex becomes lower. Therefore, even if the aperture member 832a includes the glass substrate 8321a and the attenuation film 8322a, there is a low possibility that the aperture member 832a will be damaged due to the irradiation of the guide lights GL#1 and GL#2. However, if there is a possibility that the aperture member 832a is damaged due to the irradiation of the guide lights GL#1 and GL#2, the third calibration unit 83a uses the above-mentioned copper or the like instead of the aperture member 832a. The opening member 822 may be formed using a metal material.

Like the opening 823 described above, the opening 833a has a predetermined shape in a plane along the surface of the opening member 832a (in the example shown in FIGS. 32(a) and 32(b), the XY plane). You can. In this case, the opening 833a may form a mark (that is, a pattern) 834a having a predetermined shape corresponding to the shape of the opening 833a within a plane along the surface of the opening member 832a. FIG. 32(b) shows an example in which four different types of marks 834a are formed on the opening member 832a. Specifically, FIG. 32(b) shows a search mark 8341a, which is an example of a mark 834a, a pinhole mark 8342a, which is an example of the mark 834a, and a slit mark 8343a, which is an example of the mark 834a, on the opening member 832a. , and a slit mark 8344a, which is an example of the mark 834a, are shown. Note that the characteristics of the search mark 8341a, pinhole mark 8342a, slit mark 8343a, and slit mark 8344a may be the same as those of the above-mentioned search mark 8241, pinhole mark 8242, slit mark 8243, and slit mark 8244, respectively. good.

In this way, in the first modification, the processing system SYSa uses the measurement results of the guide lights GL#1 and GL#2 by the calibration unit 8 to determine the irradiation mode of the processing lights EL#1 and EL#2, respectively. can be calibrated. Therefore, the processing system SYS can enjoy the same effects as the processing system SYS.

(4-2) Second Modification In the above description, the calibration unit 8 is arranged on the arrangement surface 3241 that is the side surface of the cradle 324 of the stage drive system 32. On the other hand, in the second modification, as shown in FIGS. 33(a) and 33(b) showing the arrangement position of the calibration unit 8 in the second modification, the calibration unit 8 It may be arranged on the arrangement surface 3243 which is the bottom surface of the cradle 324. The placement surface 3243 may be the surface of the cradle 324 on the opposite side of the stage placement surface 3242 on which the stage 31 is placed.

In this case as well, as shown in FIGS. 33(a) and 33(b), the processing system SYS moves the calibration unit 8 between the non-measurement position Pos1 and the measurement position Pos2 by rotating the cradle 324. It can be moved with . Specifically, the stage drive system 32 can move the calibration unit 8 between the non-measurement position Pos1 and the measurement position Pos2 by rotating the cradle 324 by 180 degrees. For this reason, the processing system SYS irradiates the processing light EL#1 and EL#2 to the printing surface MS during at least a part of the printing period, and also irradiates the processing light EL#1 to the calibration unit 8 during at least a part of the measurement period. and EL#2 can be irradiated.

In addition, when the calibration unit 8 is placed on the placement surface 3243 which is the bottom surface of the cradle 324, the calibration unit 8 is placed downward during at least part of the printing period, as shown in FIG. 33(a). facing. Therefore, the possibility that the modeling material M supplied from the material nozzle 212 during the modeling period will be deposited on the first calibration unit 81 and the second calibration unit 82 becomes even lower. Therefore, when the calibration unit 8 measures the processing lights EL#1 and EL#2 during at least part of the measurement period, the processing system SYS reduces the influence of the modeling material M deposited on the calibration unit 8. be able to.

(4-3) Third Modification In the above description, the calibration unit 8 is arranged in the stage drive system 32 (particularly in the cradle 324). On the other hand, in the third modification, the calibration unit 8 is located below the cradle 324, as shown in FIGS. 34(a) and 34(b) showing the arrangement position of the calibration unit 8 in the third modification. It may be arranged on the member where it is located. In the example shown in FIGS. 34(a) and 34(b), the calibration unit 8 is disposed on the trunnion 322 located below the cradle 324. In particular, in the example shown in FIGS. 34(a) and 34(b), the calibration unit 8 is arranged on the upper surface of the trunnion 322.

In this case, as shown in FIGS. 34(a) and 34(b), the processing system SYS rotates the cradle 324 so that the processing head 21 can process the state of the calibration unit 8 into the calibration unit 8. It is also possible to switch between a state in which the processing head 21 can irradiate the processing light EL to the calibration unit 8 and a state in which the processing head 21 cannot irradiate the processing light EL to the calibration unit 8.

For example, FIG. 34A shows an example in which the calibration unit 8 is in a state in which the processing head 21 cannot irradiate the processing light EL to the calibration unit 8 during at least part of the modeling period. In this case, the stage 31 may be located between the processing head 21 (in particular, the irradiation optical system 211) and the calibration unit 8. As a result, while the processing head 21 can irradiate the workpiece W with the processing light EL, it does not irradiate the calibration unit 8 with the processing light EL. This is because the processing light EL emitted from the processing head 21 is irradiated onto the workpiece W placed on the stage 31 before reaching the calibration unit 8.

On the other hand, FIG. 34(b) shows an example in which the calibration unit 8 is in a state in which the processing head 21 can irradiate the processing light EL to the calibration unit 8 during at least part of the measurement period. There is. In this case, by rotating the cradle 324, even if the stage 31 is located at a position away from the optical path of the processing light EL between the processing head 21 (in particular, the irradiation optical system 211) and the calibration unit 8. good. As a result, the processing head 21 can irradiate the calibration unit 8 with the processing light EL.

In such a third modification, the stage 31 exists between the processing head 21 and the calibration unit 8 during the modeling period. Therefore, the possibility that the modeling material M supplied from the processing head 21 to the workpiece W will be deposited on the calibration unit 8 becomes even lower. Therefore, when the calibration unit 8 measures the processing lights EL#1 and EL#2 during at least part of the measurement period, the processing system SYS reduces the influence of the modeling material M deposited on the calibration unit 8. be able to.

Note that FIGS. 34(a) and 34(b) show an example in which the calibration unit 8 is placed directly below the cradle 324. However, the calibration unit 8 may be placed at a position away from the position immediately below the cradle 324 along at least one of the X-axis direction and the Y-axis direction. Even in this case, since the processing head 21 is movable, the processing head 21 can irradiate the calibration unit 8 with the processing light EL during at least part of the measurement period.

(4-4) Other Modifications In the above description, the irradiation optical system 211 uses the galvanometer mirror 2146 to move the irradiation position of the processing light EL#1 on the modeling surface MS and the calibration unit 8. . However, the irradiation optical system 211 moves the irradiation position of the processing light EL#1 on the modeling surface MS and the calibration unit 8 by using a parallel plate rotatable around a predetermined rotation axis instead of the galvano mirror 2146. You may let them. In this case, the irradiation optical system 211 changes the incident angle of the processing light EL#1 with respect to the parallel plate by rotating the parallel plate by a desired angle. The irradiation position of EL#1 may be moved. Incidentally, such a parallel plate may be referred to as a harbing. An example of a parallel plate called a harbing is described in JP-A No. 2005-140979. Although a detailed explanation will be omitted, the irradiation optical system 211 uses a parallel flat plate rotatable around a predetermined rotation axis in place of the galvano mirror 2156 to emit processing light onto the modeling surface MS and the calibration unit 8. The irradiation position of EL#2 may be moved.

The calibration unit 8 may be detachably attached to any member within the processing system SYS. For example, the calibration unit 8 may be detachably attached to the arrangement surface 3241 that is a side surface of the cradle 324. For example, the calibration unit 8 may be detachably attached to the arrangement surface 3243 that is the bottom surface of the cradle 324. For example, the calibration unit 8 may be detachably attached to the workpiece mounting surface 311, which is the upper surface of the stage 31. For example, the calibration unit 8 may be removably attached to the surface (typically, the top surface) of the trunnion 322. Alternatively, the calibration unit 8 may be fixed to any member within the processing system SYS.

When the calibration unit 8 is removable to any member in the processing system SYS, an attachment/detachment device capable of attaching and detaching the calibration unit 8 attaches the calibration unit 8 to any member in the processing system SYS, Additionally, the calibration unit 8 may be removed from any member within the processing system SYS. For example, the attachment/detachment device may attach the calibration unit 8 to any member within the processing system SYS during at least part of the measurement period. For example, the attachment/detachment device may detach the calibration unit 8 from any member within the processing system SYS during at least part of the modeling period. An automatic tool changer (ATC) of a machine tool may be used as the attachment/detachment device to which the calibration unit 8 can be attached/detached.

In the above description, the processing unit 2 melts the modeling material M by irradiating the modeling material M with the processing light EL. However, the processing unit 2 may melt the modeling material M by irradiating the modeling material M with an arbitrary energy beam. Examples of arbitrary energy beams include at least one of charged particle beams and electromagnetic waves. Examples of charged particle beams include at least one of electron beams and ion beams.

In the above description, the processing unit 2 shapes the three-dimensional structure ST by performing additional processing based on the laser overlay welding method. However, the processing unit 2 may model the three-dimensional structure ST by performing additional processing based on other methods capable of modeling the three-dimensional structure ST. Examples of other methods capable of manufacturing the three-dimensional structure ST include powder bed fusion methods such as powder sintering additive manufacturing method (SLS: Selective Laser Sintering), and binder jetting method. At least one of the following methods may be used: binder jetting, material jetting, stereolithography, and laser metal fusion (LMF).

The processing system SYS may perform both addition processing and removal processing. For example, the processing system SYS performs additional processing using one of processing lights EL#1 and EL#2, and performs removal processing using the other of processing lights EL#1 and EL#2. Good too. In this case, the processing system SYS can perform addition processing and removal processing simultaneously. Note that if the processing system SYS does not need to perform the addition processing and the removal processing at the same time, the processing system SYS may perform the addition processing and the removal processing using the same processing light EL.

In addition to at least one of the addition processing and the removal processing, the processing system SYS reduces the flatness of the surface of the workpiece W (or the object formed on the workpiece W) processed by the addition processing or the removal processing. , to reduce surface roughness, or to make the surface close to a flat surface). For example, the processing system SYS performs at least one of addition processing and removal processing using one of the processing lights EL#1 and EL#2, and also uses the other of the processing lights EL#1 and EL#2. You may also perform remelt processing. In this case, the processing system SYS can simultaneously perform at least one of the addition processing and the removal processing, and the remelt processing. Note that if the processing system SYS does not need to perform at least one of the addition processing and removal processing and the remelt processing at the same time, the processing system SYS can perform at least one of the addition processing and removal processing using the same processing light EL. and remelt processing may be performed.

The processing unit 2 (particularly the processing head 21) described above may be attached to a robot. The robot may typically be an articulated robot. For example, the processing unit 2 (particularly the processing head 21) may be attached to a welding robot for performing welding. For example, the processing unit 2 (particularly the processing head 21) may be attached to a self-propelled mobile robot.

(5) Additional Notes Regarding the embodiments described above, the following additional notes will be further described.
[Additional note 1]
a modeling device including an irradiation optical system capable of irradiating a modeling beam onto the surface of an object, and capable of modeling a modeled object on the object by supplying a modeling material to a molten pool formed on the object by the modeling beam;
a measuring device capable of measuring an emitted beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system;
a moving device that relatively moves the irradiation optical system and the measuring device along a direction intersecting the optical axis of the irradiation optical system during at least part of a modeling period during which the modeling device models the object;
a control device capable of controlling the modeling device based on a measurement result of the injection beam by the measurement device;
The irradiation optical system includes a moving member that moves the emitted beam emitted from the irradiation optical system along a direction intersecting the optical axis of the irradiation optical system during at least a part of the modeling period,
The measurement device includes at least part of a measurement period in which the moving member moves the irradiation position of the emitted beam on the measurement device and the movement device moves at least one of the irradiation optical system and the measurement device. , measuring the emitted beam;
The modeling system, wherein the control device controls the movable member during at least part of the modeling period based on a measurement result of the injection beam during the measurement period.
[Additional note 2]
The modeling system according to appendix 1, wherein the measuring device is capable of measuring a width by which the movable member moves the irradiation position of the emitted beam.
[Additional note 3]
The modeling system according to supplementary note 1 or 2, wherein the control device controls the moving device during at least part of the modeling period based on the measurement result of the emitted beam during the measurement period.
[Additional note 4]
The modeling system according to any one of Supplementary Notes 1 to 3, wherein the moving device moves the irradiation optical system with respect to the measuring device.
[Additional note 5]
The modeling system according to any one of Supplementary Notes 1 to 4, wherein the moving device moves the measuring device with respect to the irradiation optical system.
[Additional note 6]
The modeling system according to any one of Supplementary Notes 1 to 5, wherein the moving device moves the measuring device and the irradiation optical system.
[Additional note 7]
The movable member includes a deflection member that deflects the emitted beam so that the emitted beam moves along a direction intersecting the optical axis of the irradiation optical system. modeling system.
[Additional note 8]
The modeling system according to any one of Supplementary Notes 1 to 7, wherein the moving member includes at least one of a galvano mirror and a parallel plate.
[Additional note 9]
The modeling according to any one of Supplementary Notes 1 to 8, wherein the moving speed of the irradiation position of the emitted beam is different from the moving speed of at least one of the irradiation optical system and the measuring device during at least a part of the measurement period. system.
[Additional note 10]
The modeling system according to appendix 9, wherein the moving speed of the irradiation position of the emitted beam is faster than the moving speed of at least one of the irradiation optical system and the measuring device during at least a part of the measurement period.
[Additional note 11]
According to any one of Supplementary Notes 1 to 10, the direction of movement of the irradiation position of the emitted beam is the same as the direction of movement of at least one of the irradiation optical system and the measurement device during at least part of the measurement period. modeling system.
[Additional note 12]
The measurement device includes an aperture member formed with an aperture extending along a longitudinal direction intersecting the optical axis of the irradiation optical system,
During at least a portion of the measurement period, the movable member is configured to irradiate the ejected beam along a direction intersecting the longitudinal direction so that the ejected beam crosses the opening along the direction intersecting the longitudinal direction. The modeling system according to any one of Supplementary Notes 1 to 11, wherein the moving device moves at least one of the irradiation optical system and the measuring device along a direction intersecting the longitudinal direction.
[Additional note 13]
The measuring device includes a light receiving device that receives the emitted beam through the aperture,
The modeling system according to appendix 12, wherein the measurement result of the emitted beam by the measuring device includes the result of reception of the ejected beam by the light receiving device.
[Additional note 14]
In a first period of the measurement period, the moving member moves the irradiation position of the emitted beam along a first direction intersecting the optical axis of the irradiation optical system, and the moving device: moving at least one of the irradiation optical system and the measurement device along the first direction,
In a second period of the measurement period, the moving member moves the irradiation position of the emitted beam along a second direction that intersects with the optical axis of the irradiation optical system and intersects with the first direction. , and the moving device moves at least one of the irradiation optical system and the measuring device along the second direction.
[Additional note 15]
The measurement device includes a first aperture extending along a third direction intersecting each of the optical axis of the irradiation optical system and the first direction, and a first aperture extending along a third direction intersecting each of the optical axis of the irradiation optical system and the second direction. an opening member formed with a second opening extending along a fourth direction;
In the first period, the moving member moves the irradiation position of the ejected beam along the first direction so that the ejected beam crosses the first aperture along the first direction,
In the second period, the moving member moves the irradiation position of the emitted beam along the second direction so that the emitted beam crosses the second aperture along the second direction. The printing system described.
[Additional note 16]
The measurement device includes a light receiving device that receives the emitted beam through the first aperture during the first period and receives the emitted beam through the second aperture during the second period,
The modeling system according to appendix 15, wherein the measurement result of the emitted beam by the measuring device includes the result of reception of the ejected beam by the light receiving device.
[Additional note 17]
17. The modeling system according to any one of Supplementary Notes 1 to 16, wherein the moving member reciprocates the irradiation position of the emitted beam on the measuring device during at least part of the measurement period.
[Additional note 18]
The control device calculates a stroke width in which the irradiation position of the injection beam reciprocates on the measurement device based on the measurement results of the injection beam during the measurement period, The modeling system according to appendix 17, wherein the moving member is controlled based on the calculated stroke width.
[Additional note 19]
During at least a portion of the modeling period, the moving member reciprocates the irradiation position of the injection beam on the object;
The control device controls the moving member so that a stroke width in which the irradiation position of the injection beam reciprocates on the object becomes a desired width based on the calculated stroke width during at least a part of the modeling period. The modeling system according to appendix 18.
[Additional note 20]
a first irradiation optical system capable of irradiating a first shaping beam onto the surface of an object; and a second irradiation optical system capable of irradiating a second shaping beam onto the surface of the object; a modeling device capable of modeling a modeled object on the object by supplying a modeling material to at least one molten pool formed by at least one;
a first injection beam including at least one of the first modeling beam and a first guide beam emitted from the first irradiation optical system; and a first emission beam emitted from the second modeling beam and the second irradiation optical system. a second exit beam including at least one of the two guide beams;
a control device capable of controlling the modeling device based on a measurement result of at least one of the first and second emitted beams by the measurement device;
The first irradiation optical system is configured such that the irradiation position of the first emitted beam moves on the object or on the measurement device along a direction intersecting the optical axis of the first irradiation optical system. a first deflection member that deflects the first exit beam;
The second irradiation optical system is configured such that the irradiation position of the second emitted beam moves on the object or on the measurement device along a direction intersecting the optical axis of the second irradiation optical system. a second deflection member that deflects the second emitted beam;
The control device controls at least one of the first deflection member and the second deflection member based on at least one of the measurement result of the first emitted beam by the measurement device and the measurement result of the second emitted beam by the measurement device. A modeling system that controls one side.
[Additional note 21]
The modeling system according to appendix 20, wherein the measuring device includes one light receiving sensor having one light receiving section.
[Additional note 22]
The modeling system according to appendix 20, wherein the measuring device includes one light receiving sensor having a plurality of light receiving sections.
[Additional note 23]
The modeling device, during at least part of the modeling period in which the modeling device models the object, along a direction intersecting at least one of the optical axis of the first irradiation optical system and the second irradiation optical system, The modeling system according to any one of Supplementary Notes 20 to 22, further comprising a moving device that relatively moves at least one of the first irradiation optical system and the second irradiation optical system and the measurement device.
[Additional note 24]
The modeling system according to attachment 23, wherein the control device controls the moving device based on at least one of a measurement result of the first injection beam by the measurement device and a measurement result of the second injection beam by the measurement device. .
[Additional note 25]
The control device controls the moving device so that a shaped object is formed on the object along a target trajectory based on path information,
The path information includes line width information,
The control device is configured to periodically move at least one of the irradiation position of the first injection beam and the irradiation position of the second injection beam inside the width of the line to be modeled based on the line width information. The modeling system according to attachment 23 or 24, wherein at least one of the first deflection member and the second deflection member is controlled.
[Additional note 26]
The modeling device is capable of forming a first molten pool by the first injection beam, and is capable of forming a second molten pool different from the first molten pool by the second injection beam. The modeling system according to any one of the items.
[Additional note 27]
27. The modeling system according to any one of attachments 20 to 26, wherein the modeling device is capable of forming one molten pool using the first injection beam and the second injection beam.
[Additional note 28]
The modeling system according to any one of appendices 20 to 27, wherein the measurement result includes information regarding the irradiation position of the first injection beam and the irradiation position of the second injection beam.
[Additional note 29]
The control device adjusts the irradiation position of the first shaping beam on the object and the irradiation position of the second shaping beam on the object based on the measurement results of the first and second injection beams by the measuring device. 29. The modeling system according to any one of appendices 20 to 28, wherein the first and second deflection members are controlled so as to be set at positions determined depending on the irradiation position.
[Additional note 30]
The control device adjusts the irradiation position of the first shaping beam on the object and the irradiation position of the second shaping beam on the object based on the measurement results of the first and second injection beams by the measuring device. The modeling system according to any one of appendices 20 to 29, wherein the first and second deflection members are controlled so as to overlap at the irradiation position.
[Additional note 31]
The first irradiation optical system includes a first detection device capable of detecting the intensity of the first emitted beam,
The second irradiation optical system includes a second detection device capable of detecting the intensity of the second emitted beam,
Supplementary Note 20: The control device is capable of determining whether an abnormality has occurred in at least one of the first and second detection devices based on the measurement results of the first and second emitted beams by the measurement device. 30. The modeling system according to any one of 30 to 30.
[Additional note 32]
The control device controls the first detection device when the measurement result of the first injection beam by the measurement device is normal while the measurement result of the first injection beam by the first detection device is abnormal. It is determined that an abnormality has occurred,
The control device controls the second detection device when the measurement result of the second injection beam by the measurement device is normal while the measurement result of the second injection beam by the second detection device is abnormal. The modeling system according to appendix 31, which determines that an abnormality has occurred.
[Additional note 33]
The modeling system includes a first light source capable of generating the first emitted beam, a second light source capable of generating the second emitted beam,
Supplementary Note 31: The control device is capable of determining whether an abnormality has occurred in either one of the first and second light sources based on the measurement results of the first and second emitted beams by the measurement device. Or the modeling system according to 32.
[Additional note 34]
The control device is configured to detect an abnormality in the first light source when both a measurement result of the first emitted beam by the measuring device and a measurement result of the first emitted beam by the first detection device are abnormal. It is determined that
The control device is configured to detect an abnormality in the second light source when both a measurement result of the second emitted beam by the measuring device and a measurement result of the second emitted beam by the second detection device are abnormal. The modeling system described in Appendix 33.
[Additional note 35]
The measuring device includes an aperture member in which an aperture is formed, and a light receiving device that receives at least one of the first and second emitted beams through the aperture,
The measurement result of the first emitted beam by the measuring device includes the result of reception of the first emitted beam by the light receiving device,
35. The modeling system according to any one of appendices 20 to 34, wherein the measurement result of the second emitted beam by the measuring device includes the result of light reception of the second emitted beam by the light receiving device.
[Appendix 36]
The modeling system according to any one of Supplementary Notes 20 to 35, wherein the wavelength of the first modeling beam is different from the wavelength of the second modeling beam.
[Additional note 37]
a modeling device including an irradiation optical system capable of irradiating a modeling beam onto the surface of an object, and capable of modeling a modeled object on the object by supplying a modeling material to a molten pool formed on the object by the modeling beam;
a mounting member on which the object is mounted and rotatable around a rotation axis intersecting the optical axis of the irradiation optical system;
a measurement device that is disposed on the mounting member, is rotatable around the rotation axis, and is capable of measuring an emitted beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system; ,
and a control device capable of controlling the modeling device based on a measurement result of the injection beam by the measurement device.
[Appendix 38]
The control device is capable of changing the position of the measuring device from a first position to a second position by rotating the mounting member,
The modeling device is capable of printing a model on the object when the measuring device is at the first position,
The modeling system according to attachment 37, wherein the measuring device is capable of measuring the emitted beam when the measuring device is at the second position.
[Additional note 39]
The control device is capable of controlling the mounting member so that it assumes a reference attitude and an attitude different from the reference attitude,
The modeling device is capable of irradiating the object placed on the mounting member in the reference posture with the modeling beam,
The modeling system according to attachment 37 or 38, wherein the measuring device placed on the placement member in a posture different from the reference posture is capable of measuring the emitted beam.
[Additional note 40]
The measuring device is arranged on the arrangement surface of the mounting member,
According to any one of Supplementary Notes 37 to 39, the placement surface faces a direction different from a direction in which the irradiation optical system exists during at least a part of the modeling period during which the modeling device models the object. modeling system.
[Additional note 41]
The measuring device is arranged on the arrangement surface of the mounting member,
The modeling system according to any one of Supplementary Notes 37 to 40, wherein the arrangement surface faces a direction intersecting the optical axis during at least a part of the modeling period in which the modeling device models the object.
[Additional note 42]
The measuring device is arranged on the arrangement surface of the mounting member,
42. The modeling system according to any one of Supplementary Notes 37 to 41, wherein the arrangement surface faces a direction in which the irradiation optical system exists during at least part of a measurement period in which the measurement device measures the emitted beam.
[Additional note 43]
The measuring device is arranged on the arrangement surface of the mounting member,
The modeling system according to any one of appendices 37 to 42, wherein the arrangement surface faces a direction along the optical axis during at least part of a measurement period in which the measurement device measures the emitted beam.
[Additional note 44]
The measuring device includes an aperture member in which an aperture is formed, and a light receiving device that receives at least one of the emitted beams through the aperture,
During at least a part of the modeling period during which the modeling device models the object, the opening and the light receiving device are aligned in a direction intersecting the optical axis;
44. The modeling system according to any one of appendices 37 to 43, wherein the aperture and the light receiving device are aligned along the optical axis during at least part of a measurement period during which the measurement device measures the emitted beam.
[Additional note 45]
The measuring device is moved by rotation of the mounting member between a first position where the irradiation optical system can irradiate the exit beam and a second position where the irradiation optical system cannot irradiate the exit beam. The modeling system according to any one of Supplementary Notes 37 to 44.
[Additional note 46]
The modeling according to any one of appendices 37 to 45, wherein the measuring device moves between a first position on the optical axis and a second position away from the optical axis by rotation of the mounting member. system.
[Additional note 47]
The measuring device is located at the second position during at least a part of the modeling period during which the modeling device models the object,
The modeling system according to attachment 45 or 46, wherein the measuring device is located at the first position during at least part of a measurement period during which the measuring device measures the emitted beam.
[Additional note 48]
The modeling system according to any one of appendices 37 to 47, wherein the modeling system removes deposits attached to the measuring device by rotating the mounting member.
[Additional note 49]
a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of an object, and capable of processing the object with the processing beam;
a measuring device capable of measuring an emitted beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system;
a control device capable of controlling the processing device based on a measurement result of the injection beam by the measurement device;
The irradiation optical system includes a moving member that moves the emitted beam emitted from the irradiation optical system along a direction intersecting the optical axis of the irradiation optical system,
The measuring device measures the ejected beam during at least part of a measurement period in which the movable member moves the irradiation position of the ejected beam on the measuring device.
[Additional note 50]
a first irradiation optical system capable of irradiating a first processing beam onto the surface of an object; and a second irradiation optical system capable of irradiating a second processing beam onto the surface of the object; a processing device capable of processing the object with at least one;
a first exit beam including at least one of the first processing beam and a first guide beam exiting from the first irradiation optical system; and a first exit beam including at least one of the first processing beam and a first guide beam exiting from the first irradiation optical system; a second injection beam including at least one of the two guide beams;
a control device capable of controlling the processing device based on a measurement result of at least one of the first and second emitted beams by the measurement device;
The first irradiation optical system includes a first deflection member that deflects the first emitted beam so that the irradiation position of the first emitted beam moves along a direction intersecting the optical axis of the first irradiation optical system. including;
The second irradiation optical system includes a second deflection member that deflects the second emitted beam so that the irradiation position of the second emitted beam moves along a direction intersecting the optical axis of the second irradiation optical system. Including processing system.
[Additional note 51]
a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of an object, and capable of processing the object with the processing beam;
a mounting member on which the object is mounted and rotatable around a rotation axis intersecting the optical axis of the irradiation optical system;
a measuring device disposed on the mounting member, rotatable around the rotation axis, and capable of measuring an emitted beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system; ,
A processing system comprising: a control device capable of controlling the processing device based on a measurement result of the injection beam by the measurement device.
[Additional note 52]
A modeling device including an irradiation optical system capable of irradiating a modeling beam onto the surface of the object is used to supply a modeling material to a molten pool formed on the object by the modeling beam, thereby modeling a modeled object on the object. and,
measuring an emitted beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system using a measuring device;
Relative movement of the irradiation optical system and the measuring device along a direction intersecting an optical axis of the irradiation optical system during at least part of a modeling period during which the object is modeled using the modeling device. and,
using a moving member included in the irradiation optical system to move the emitted beam emitted from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system during at least a part of the modeling period; ,
controlling the modeling device based on the measurement results of the injection beam;
Measuring the emitted beam includes moving the irradiation position of the ejected beam on the measuring device using the moving member and moving at least one of the irradiation optical system and the measuring device at least during a measurement period. In part, measuring the exit beam;
Controlling the modeling apparatus includes controlling the moving member during at least a portion of the modeling period based on a measurement result of the injection beam during the measurement period.
[Additional note 53]
The first and Modeling a model on the object by supplying a model material to at least one molten pool formed by at least one of the second model beams;
A first injection beam including at least one of the first shaping beam and a first guide beam emitted from the first irradiation optical system, the second shaping beam and the second irradiation optical system using a measuring device. measuring each of the second emitted beams including at least one of the second guide beams emitted from the system;
Using a first deflection member that is included in the first irradiation optical system and is capable of deflecting the first emitted beam, the irradiation position of the first emitted beam is adjusted to the first emitted beam on the object or on the measuring device. moving along a direction intersecting the optical axis of the irradiation optical system;
Using a second deflection member included in the second irradiation optical system and capable of deflecting the second emitted beam, the irradiation position of the second emitted beam is adjusted to the second emitted beam on the object or on the measuring device. moving along a direction intersecting the optical axis of the irradiation optical system;
controlling the modeling device based on a measurement result of at least one of the first and second injection beams,
Controlling the modeling device includes controlling at least one of the first deflection member and the second deflection member based on at least one of the measurement result of the first injection beam and the measurement result of the second injection beam by the measuring device. A printing method that involves controlling one side.
[Additional note 54]
Supplying a modeling material to a molten pool formed on the object by the modeling beam using a modeling device including an irradiation optical system capable of irradiating the modeling beam onto the surface of the object placed on the mounting member, forming a model on the object;
measuring an emitted beam including at least one of the modeling beam and the guide beam emitted from the irradiation optical system using a measuring device disposed on the mounting member;
rotating the mounting member around a rotation axis intersecting the optical axis of the irradiation optical system, and rotating the measurement device around the rotation axis;
A modeling method comprising: controlling the modeling apparatus based on a measurement result of the injection beam.
[Additional note 55]
Processing the object using a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of the object;
using a measurement device to measure an emitted beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system;
using a moving member included in the irradiation optical system, moving the emitted beam emitted from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system;
controlling the processing device based on the measurement result of the injection beam;
Measuring the ejected beam includes measuring the ejected beam during at least part of a measurement period in which the irradiation position of the ejected beam is moved on the measuring device using the moving member. .
[Additional note 56]
Processing the object using a processing device including a first irradiation optical system capable of irradiating the surface of the object with a first processing beam and a second irradiation optical system capable of irradiating the surface of the object with a second processing beam. to do and
a first exit beam including at least one of the first processing beam and a first guide beam exiting from the first irradiation optical system; and a first exit beam including at least one of the first processing beam and a first guide beam exiting from the first irradiation optical system; and a second exit beam including at least one of the two guide beams;
Using a first deflection member included in the first irradiation optical system and capable of deflecting the first emitted beam, the irradiation position of the first emitted beam is directed in a direction intersecting the optical axis of the first irradiation optical system. moving along;
Using a second deflection member included in the second irradiation optical system and capable of deflecting the second emitted beam, the irradiation position of the second emitted beam is directed in a direction intersecting the optical axis of the second irradiation optical system. moving along;
A processing method comprising: controlling the processing device based on a measurement result of at least one of the first and second emitted beams.
[Additional note 57]
Processing the object placed on the mounting member using a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of the object;
measuring an emitted beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system using a measuring device disposed on the mounting member;
rotating the mounting member around a rotation axis intersecting the optical axis of the irradiation optical system, and rotating the measurement device around the rotation axis;
A processing method comprising: controlling the processing device based on a measurement result of the injection beam.

At least some of the constituent features of each of the above-described embodiments can be combined as appropriate with at least some of the other constituent features of each of the above-described embodiments. Some of the constituent elements of each embodiment described above may not be used. In addition, to the extent permitted by law, the disclosures of all published publications and US patents cited in each of the above-mentioned embodiments are incorporated into the description of the main text.

The present invention is not limited to the embodiments described above, and can be modified as appropriate within the scope of the invention as understood from the claims and the entire specification. Processing systems, modeling methods, and processing methods are also included within the technical scope of the present invention.

SYS Processing system 2 Processing unit 21 Processing head 211 Irradiation optical system 2146, 2156 Galvano mirror 2143, 2153 Power meter 212 Material nozzle 22 Head drive system 3 Stage unit 31 Stage 32 Stage drive system 324 Cradle 8 Calibration unit 81 First calibration Unit 811 Light receiving device 82 Second calibration unit 821 Light receiving device 822 Opening member 823 Opening 824 Mark W Work MS Modeling surface EL Processing light EA Target irradiation area BSA Processing unit area MP Molten pool

Claims (57)

a modeling device including an irradiation optical system capable of irradiating a modeling beam onto the surface of an object, and capable of modeling a modeled object on the object by supplying a modeling material to a molten pool formed on the object by the modeling beam;
a measuring device capable of measuring an emitted beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system;
a moving device that relatively moves the irradiation optical system and the measuring device along a direction intersecting the optical axis of the irradiation optical system during at least part of a modeling period during which the modeling device models the object;
a control device capable of controlling the modeling device based on a measurement result of the injection beam by the measurement device;
The irradiation optical system includes a moving member that moves the emitted beam emitted from the irradiation optical system along a direction intersecting the optical axis of the irradiation optical system during at least a part of the modeling period,
The measurement device includes at least part of a measurement period in which the moving member moves the irradiation position of the emitted beam on the measurement device and the movement device moves at least one of the irradiation optical system and the measurement device. , measuring the emitted beam;
The modeling system, wherein the control device controls the movable member during at least part of the modeling period based on a measurement result of the injection beam during the measurement period. The modeling system according to claim 1, wherein the measuring device is capable of measuring a width by which the movable member moves the irradiation position of the emitted beam. The modeling system according to claim 1 or 2, wherein the control device controls the moving device during at least part of the modeling period based on a measurement result of the emitted beam during the measurement period. The modeling system according to any one of claims 1 to 3, wherein the moving device moves the irradiation optical system with respect to the measuring device. The modeling system according to any one of claims 1 to 4, wherein the moving device moves the measuring device with respect to the irradiation optical system. The modeling system according to any one of claims 1 to 5, wherein the moving device moves the measuring device and the irradiation optical system. The moving member includes a deflection member that deflects the emitted beam so that the emitted beam moves along a direction intersecting the optical axis of the irradiation optical system. modeling system. The modeling system according to any one of claims 1 to 7, wherein the moving member includes at least one of a galvanometer mirror and a parallel plate. 9. The moving speed of the irradiation position of the emitted beam is different from the moving speed of at least one of the irradiation optical system and the measuring device during at least a part of the measurement period. modeling system. 10. The modeling system according to claim 9, wherein during at least a portion of the measurement period, a moving speed of the irradiation position of the emitted beam is faster than a moving speed of at least one of the irradiation optical system and the measuring device. According to any one of claims 1 to 10, the direction of movement of the irradiation position of the emitted beam is the same as the direction of movement of at least one of the irradiation optical system and the measurement device during at least a part of the measurement period. The printing system described. The measurement device includes an aperture member formed with an aperture extending along a longitudinal direction intersecting the optical axis of the irradiation optical system,
During at least a portion of the measurement period, the movable member is configured to irradiate the ejected beam along a direction intersecting the longitudinal direction so that the ejected beam crosses the opening along the direction intersecting the longitudinal direction. The modeling system according to any one of claims 1 to 11, wherein the position is moved, and the moving device moves at least one of the irradiation optical system and the measuring device along a direction intersecting the longitudinal direction. The measuring device includes a light receiving device that receives the emitted beam through the aperture,
The modeling system according to claim 12, wherein the measurement result of the emitted beam by the measuring device includes a result of reception of the emitted beam by the light receiving device. In a first period of the measurement period, the moving member moves the irradiation position of the emitted beam along a first direction intersecting the optical axis of the irradiation optical system, and the moving device: moving at least one of the irradiation optical system and the measurement device along the first direction,
In a second period of the measurement period, the moving member moves the irradiation position of the emitted beam along a second direction that intersects with the optical axis of the irradiation optical system and intersects with the first direction. 14. The modeling system according to claim 1, wherein the moving device moves at least one of the irradiation optical system and the measuring device along the second direction. The measurement device includes a first aperture extending along a third direction intersecting each of the optical axis of the irradiation optical system and the first direction, and a first aperture extending along a third direction intersecting each of the optical axis of the irradiation optical system and the second direction. an opening member formed with a second opening extending along a fourth direction;
In the first period, the moving member moves the irradiation position of the ejected beam along the first direction so that the ejected beam crosses the first aperture along the first direction,
In the second period, the moving member moves the irradiation position of the emitted beam along the second direction so that the emitted beam crosses the second aperture along the second direction. The modeling system described in . The measurement device includes a light receiving device that receives the emitted beam through the first aperture during the first period and receives the emitted beam through the second aperture during the second period,
The modeling system according to claim 15, wherein the measurement result of the emitted beam by the measuring device includes a result of reception of the emitted beam by the light receiving device. The modeling system according to any one of claims 1 to 16, wherein the moving member reciprocates the irradiation position of the emitted beam on the measuring device during at least part of the measuring period. The control device calculates a stroke width in which the irradiation position of the injection beam reciprocates on the measurement device based on the measurement results of the injection beam during the measurement period, The modeling system according to claim 17, wherein the moving member is controlled based on the calculated stroke width. During at least a portion of the modeling period, the moving member reciprocates the irradiation position of the injection beam on the object;
The control device controls the moving member so that a stroke width in which the irradiation position of the injection beam reciprocates on the object becomes a desired width based on the calculated stroke width during at least a part of the modeling period. The modeling system according to claim 18. a first irradiation optical system capable of irradiating a first shaping beam onto the surface of an object; and a second irradiation optical system capable of irradiating a second shaping beam onto the surface of the object; a modeling device capable of modeling a modeled object on the object by supplying a modeling material to at least one molten pool formed by at least one;
a first injection beam including at least one of the first modeling beam and a first guide beam emitted from the first irradiation optical system; and a first emission beam emitted from the second modeling beam and the second irradiation optical system. a second exit beam including at least one of the two guide beams;
a control device capable of controlling the modeling device based on a measurement result of at least one of the first and second emitted beams by the measurement device;
The first irradiation optical system is configured such that the irradiation position of the first emitted beam moves on the object or on the measurement device along a direction intersecting the optical axis of the first irradiation optical system. a first deflection member that deflects the first exit beam;
The second irradiation optical system is configured such that the irradiation position of the second emitted beam moves on the object or on the measurement device along a direction intersecting the optical axis of the second irradiation optical system. a second deflection member that deflects the second emitted beam;
The control device controls at least one of the first deflection member and the second deflection member based on at least one of the measurement result of the first emitted beam by the measurement device and the measurement result of the second emitted beam by the measurement device. A printing system that controls one side. The modeling system according to claim 20, wherein the measuring device includes one light receiving sensor having one light receiving section. The modeling system according to claim 20, wherein the measuring device includes one light receiving sensor having a plurality of light receiving sections. The modeling device, during at least part of the modeling period in which the modeling device models the object, along a direction intersecting at least one of the optical axis of the first irradiation optical system and the second irradiation optical system, The modeling system according to any one of claims 20 to 22, further comprising a moving device that relatively moves at least one of the first irradiation optical system and the second irradiation optical system and the measuring device. The modeling according to claim 23, wherein the control device controls the moving device based on at least one of a measurement result of the first injection beam by the measurement device and a measurement result of the second injection beam by the measurement device. system. The control device controls the moving device so that a shaped object is formed on the object along a target trajectory based on path information,
The path information includes line width information,
The control device is configured to periodically move at least one of the irradiation position of the first injection beam and the irradiation position of the second injection beam inside the width of the line to be modeled based on the line width information. The modeling system according to claim 23 or 24, wherein at least one of the first deflection member and the second deflection member is controlled. The modeling device is capable of forming a first molten pool with the first injection beam, and is capable of forming a second molten pool different from the first molten pool with the second injection beam. The modeling system according to any one of the above. The modeling system according to any one of claims 20 to 26, wherein the modeling device is capable of forming one molten pool using the first injection beam and the second injection beam. The modeling system according to any one of claims 20 to 27, wherein the measurement result includes information regarding the irradiation position of the first injection beam and the irradiation position of the second injection beam. The control device adjusts the irradiation position of the first shaping beam on the object and the irradiation position of the second shaping beam on the object based on the measurement results of the first and second injection beams by the measuring device. The modeling system according to any one of claims 20 to 28, wherein the first and second deflection members are controlled so as to be set at positions determined depending on the irradiation position. The control device adjusts the irradiation position of the first shaping beam on the object and the irradiation position of the second shaping beam on the object based on the measurement results of the first and second injection beams by the measuring device. The modeling system according to any one of claims 20 to 29, wherein the first and second deflection members are controlled so as to overlap at the irradiation position. The first irradiation optical system includes a first detection device capable of detecting the intensity of the first emitted beam,
The second irradiation optical system includes a second detection device capable of detecting the intensity of the second emitted beam,
The control device is capable of determining whether or not an abnormality has occurred in at least one of the first and second detection devices based on measurement results of the first and second emitted beams by the measurement device. 31. The modeling system according to any one of 20 to 30. The control device controls the first detection device when the measurement result of the first injection beam by the measurement device is normal while the measurement result of the first injection beam by the first detection device is abnormal. It is determined that an abnormality has occurred,
The control device controls the second detection device when the measurement result of the second injection beam by the measurement device is normal while the measurement result of the second injection beam by the second detection device is abnormal. The modeling system according to claim 31, wherein it is determined that an abnormality has occurred. The modeling system includes a first light source capable of generating the first emitted beam, a second light source capable of generating the second emitted beam,
The control device is capable of determining whether an abnormality has occurred in either one of the first and second light sources based on the measurement results of the first and second emitted beams by the measurement device. 33. The modeling system according to 31 or 32. The control device is configured to detect an abnormality in the first light source when both a measurement result of the first emitted beam by the measuring device and a measurement result of the first emitted beam by the first detection device are abnormal. It is determined that
The control device is configured to detect an abnormality in the second light source when both a measurement result of the second emitted beam by the measuring device and a measurement result of the second emitted beam by the second detection device are abnormal. 34. The modeling system according to claim 33. The measuring device includes an aperture member in which an aperture is formed, and a light receiving device that receives at least one of the first and second emitted beams through the aperture,
The measurement result of the first emitted beam by the measuring device includes the result of reception of the first emitted beam by the light receiving device,
The modeling system according to any one of claims 20 to 34, wherein the measurement result of the second emitted beam by the measuring device includes the result of light reception of the second emitted beam by the light receiving device. The modeling system according to any one of claims 20 to 35, wherein the wavelength of the first shaping beam is different from the wavelength of the second shaping beam. a modeling device including an irradiation optical system capable of irradiating a modeling beam onto the surface of an object, and capable of modeling a modeled object on the object by supplying a modeling material to a molten pool formed on the object by the modeling beam;
a mounting member on which the object is mounted and rotatable around a rotation axis intersecting the optical axis of the irradiation optical system;
a measurement device that is disposed on the mounting member, is rotatable around the rotation axis, and is capable of measuring an emitted beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system; ,
and a control device capable of controlling the modeling device based on a measurement result of the injection beam by the measurement device. The control device is capable of changing the position of the measuring device from a first position to a second position by rotating the mounting member,
The modeling device is capable of printing a model on the object when the measuring device is at the first position,
The modeling system according to claim 37, wherein the measuring device is capable of measuring the emitted beam when the measuring device is at the second position. The control device is capable of controlling the mounting member so that it assumes a reference attitude and an attitude different from the reference attitude,
The modeling device is capable of irradiating the object placed on the mounting member in the reference posture with the modeling beam,
The modeling system according to claim 37 or 38, wherein the measuring device arranged on the mounting member in a posture different from the reference posture is capable of measuring the emitted beam. The measuring device is arranged on the arrangement surface of the mounting member,
40. The arrangement surface faces a direction different from a direction in which the irradiation optical system exists during at least part of a modeling period during which the modeling device models the object. The printing system described. The measuring device is arranged on the arrangement surface of the mounting member,
The modeling system according to any one of claims 37 to 40, wherein the arrangement surface faces a direction intersecting the optical axis during at least part of a modeling period in which the modeling device models the object. The measuring device is arranged on the arrangement surface of the mounting member,
The modeling system according to any one of claims 37 to 41, wherein the arrangement surface faces a direction in which the irradiation optical system exists during at least part of a measurement period in which the measurement device measures the emitted beam. . The measuring device is arranged on the arrangement surface of the mounting member,
The modeling system according to any one of claims 37 to 42, wherein the arrangement surface faces a direction along the optical axis during at least part of a measurement period during which the measurement device measures the emitted beam. The measuring device includes an aperture member in which an aperture is formed, and a light receiving device that receives at least one of the emitted beams through the aperture,
During at least a part of the modeling period during which the modeling device models the object, the opening and the light receiving device are aligned in a direction intersecting the optical axis;
The modeling system according to any one of claims 37 to 43, wherein the opening and the light receiving device are aligned along the optical axis during at least part of a measurement period in which the measurement device measures the emitted beam. The measuring device is moved by rotation of the mounting member between a first position where the irradiation optical system can irradiate the exit beam and a second position where the irradiation optical system cannot irradiate the exit beam. The modeling system according to any one of claims 37 to 44. 46. The measuring device moves between a first position on the optical axis and a second position away from the optical axis by rotation of the mounting member. modeling system. The measuring device is located at the second position during at least a part of the modeling period during which the modeling device models the object,
The modeling system according to claim 45 or 46, wherein the measuring device is located at the first position during at least part of a measurement period during which the measuring device measures the emitted beam. The modeling system according to any one of claims 37 to 47, wherein the modeling system removes deposits attached to the measuring device by rotating the mounting member. a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of an object, and capable of processing the object with the processing beam;
a measuring device capable of measuring an emitted beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system;
a control device capable of controlling the processing device based on a measurement result of the injection beam by the measurement device;
The irradiation optical system includes a moving member that moves the emitted beam emitted from the irradiation optical system along a direction intersecting the optical axis of the irradiation optical system,
The measuring device measures the ejected beam during at least part of a measurement period in which the movable member moves the irradiation position of the ejected beam on the measuring device. a first irradiation optical system capable of irradiating a first processing beam onto the surface of an object; and a second irradiation optical system capable of irradiating a second processing beam onto the surface of the object; a processing device capable of processing the object with at least one;
a first exit beam including at least one of the first processing beam and a first guide beam exiting from the first irradiation optical system; and a first exit beam including at least one of the first processing beam and a first guide beam exiting from the first irradiation optical system; a second exit beam including at least one of the two guide beams;
a control device capable of controlling the processing device based on a measurement result of at least one of the first and second emitted beams by the measurement device;
The first irradiation optical system includes a first deflection member that deflects the first emitted beam so that the irradiation position of the first emitted beam moves along a direction intersecting the optical axis of the first irradiation optical system. including;
The second irradiation optical system includes a second deflection member that deflects the second emitted beam so that the irradiation position of the second emitted beam moves along a direction intersecting the optical axis of the second irradiation optical system. Including processing system. a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of an object, and capable of processing the object with the processing beam;
a mounting member on which the object is mounted and rotatable around a rotation axis intersecting the optical axis of the irradiation optical system;
a measuring device disposed on the mounting member, rotatable around the rotation axis, and capable of measuring an emitted beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system; ,
A processing system comprising: a control device capable of controlling the processing device based on a measurement result of the injection beam by the measurement device. A modeling device including an irradiation optical system capable of irradiating a modeling beam onto the surface of the object is used to supply a modeling material to a molten pool formed on the object by the modeling beam, thereby modeling a modeled object on the object. and,
measuring an emitted beam including at least one of the modeling beam and a guide beam emitted from the irradiation optical system using a measuring device;
Relative movement of the irradiation optical system and the measuring device along a direction intersecting an optical axis of the irradiation optical system during at least part of a modeling period during which the object is modeled using the modeling device. and,
using a moving member included in the irradiation optical system to move the emitted beam emitted from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system during at least a part of the modeling period; ,
controlling the modeling device based on the measurement results of the injection beam;
Measuring the emitted beam includes moving the irradiation position of the ejected beam on the measuring device using the moving member and moving at least one of the irradiation optical system and the measuring device at least during a measurement period. In part, measuring the exit beam;
Controlling the modeling apparatus includes controlling the moving member during at least a portion of the modeling period based on a measurement result of the injection beam during the measurement period. The first and Modeling a model on the object by supplying a model material to at least one molten pool formed by at least one of the second model beams;
A first injection beam including at least one of the first shaping beam and a first guide beam emitted from the first irradiation optical system, the second shaping beam and the second irradiation optical system using a measuring device. measuring each of the second emitted beams including at least one of the second guide beams emitted from the system;
Using a first deflection member that is included in the first irradiation optical system and is capable of deflecting the first emitted beam, the irradiation position of the first emitted beam is adjusted to the first emitted beam on the object or on the measuring device. moving along a direction intersecting the optical axis of the irradiation optical system;
Using a second deflection member included in the second irradiation optical system and capable of deflecting the second emitted beam, the irradiation position of the second emitted beam is adjusted to the second emitted beam on the object or on the measuring device. moving along a direction intersecting the optical axis of the irradiation optical system;
controlling the modeling device based on a measurement result of at least one of the first and second injection beams,
Controlling the modeling device includes controlling at least one of the first deflection member and the second deflection member based on at least one of the measurement result of the first injection beam and the measurement result of the second injection beam by the measuring device. A printing method that involves controlling one side. Supplying a modeling material to a molten pool formed on the object by the modeling beam using a modeling device including an irradiation optical system capable of irradiating the modeling beam onto the surface of the object placed on the mounting member, forming a model on the object;
measuring an emitted beam including at least one of the modeling beam and the guide beam emitted from the irradiation optical system using a measuring device disposed on the mounting member;
rotating the mounting member around a rotation axis intersecting the optical axis of the irradiation optical system, and rotating the measurement device around the rotation axis;
A modeling method comprising: controlling the modeling apparatus based on a measurement result of the injection beam. Processing the object using a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of the object;
using a measurement device to measure an emitted beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system;
using a moving member included in the irradiation optical system, moving the emitted beam emitted from the irradiation optical system along a direction intersecting an optical axis of the irradiation optical system;
controlling the processing device based on the measurement result of the injection beam;
Measuring the ejected beam includes measuring the ejected beam during at least part of a measurement period in which the irradiation position of the ejected beam is moved on the measuring device using the moving member. . Processing the object using a processing device including a first irradiation optical system capable of irradiating the surface of the object with a first processing beam and a second irradiation optical system capable of irradiating the surface of the object with a second processing beam. to do and
a first exit beam including at least one of the first processing beam and a first guide beam exiting from the first irradiation optical system; and a first exit beam including at least one of the first processing beam and a first guide beam exiting from the first irradiation optical system; and a second exit beam including at least one of the two guide beams;
Using a first deflection member included in the first irradiation optical system and capable of deflecting the first emitted beam, the irradiation position of the first emitted beam is directed in a direction intersecting the optical axis of the first irradiation optical system. moving along the
Using a second deflection member included in the second irradiation optical system and capable of deflecting the second emitted beam, the irradiation position of the second emitted beam is directed in a direction intersecting the optical axis of the second irradiation optical system. moving along the
A processing method comprising: controlling the processing device based on a measurement result of at least one of the first and second emitted beams. Processing the object placed on the mounting member using a processing device including an irradiation optical system capable of irradiating a processing beam onto the surface of the object;
measuring an emitted beam including at least one of the processing beam and a guide beam emitted from the irradiation optical system using a measuring device disposed on the mounting member;
rotating the mounting member around a rotation axis intersecting the optical axis of the irradiation optical system, and rotating the measurement device around the rotation axis;
A processing method comprising: controlling the processing device based on a measurement result of the injection beam.

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