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WO2023284709A1 - 扬声器模组及电子设备 - Google Patents

扬声器模组及电子设备 Download PDF

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Publication number
WO2023284709A1
WO2023284709A1 PCT/CN2022/105074 CN2022105074W WO2023284709A1 WO 2023284709 A1 WO2023284709 A1 WO 2023284709A1 CN 2022105074 W CN2022105074 W CN 2022105074W WO 2023284709 A1 WO2023284709 A1 WO 2023284709A1
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WO
WIPO (PCT)
Prior art keywords
side wall
leakage hole
speaker module
tube
bass
Prior art date
Application number
PCT/CN2022/105074
Other languages
English (en)
French (fr)
Inventor
蒋国珠
龙立锋
Original Assignee
维沃移动通信有限公司
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Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2023284709A1 publication Critical patent/WO2023284709A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities

Definitions

  • the application belongs to the technical field of electronic products, and in particular relates to a loudspeaker module and electronic equipment.
  • the speaker of the electronic device has the problem of poor low-frequency effect.
  • the present application aims to provide a loudspeaker module and electronic equipment, which can solve the problem of poor low-frequency effect in the loudspeaker of the electronic equipment in the related art.
  • the embodiment of the present application proposes a speaker module, including a casing, a sound generating component and a bass booster tube, the sound generating component is the sound generating structure of the speaker module, and the sound generating component is at least partially located in the In the casing, and the rear sound cavity of the speaker module is formed between the sound-generating component and the casing, the casing is provided with a first leakage hole and a second leakage hole, and the bass booster tube is arranged on In the housing, one end of the bass enhancement tube communicates with the rear sound cavity, and the other end of the bass enhancement tube communicates with the outside world through the first leakage hole; the rear sound cavity also communicates with the second cavity through the second The leakage hole communicates with the outside world;
  • the first leakage hole is provided with a first damping structure
  • the second leakage hole is provided with a second damping structure
  • the embodiment of the present application provides an electronic device, including the speaker module described in the first aspect.
  • the bass booster tube that is, the bass booster tube is set between the rear sound cavity and the first leakage hole, that is, a bass booster channel is formed between the rear sound cavity and the first leakage hole, and makes The audio signal passing through the bass enhancement tube can resonate in the bass enhancement tube, thereby achieving the purpose of improving the low frequency effect of the speaker module.
  • FIG. 1 is one of the structural schematic diagrams of an electronic device including a speaker module provided by an embodiment of the present application;
  • Fig. 2 is the second structural schematic diagram of an electronic device including a speaker module provided by an embodiment of the present application
  • Fig. 3 is the third structural schematic diagram of an electronic device including a speaker module provided by an embodiment of the present application.
  • Fig. 4 is the fourth schematic structural view of an electronic device including a speaker module provided by an embodiment of the present application.
  • Fig. 5 is an equivalent circuit diagram of the speaker module provided by the embodiment of the present application.
  • Fig. 6 is an audio diagram of the speaker module provided by the embodiment of the present application.
  • Fig. 7 is the EQ debugging diagram of the loudspeaker module provided by the embodiment of the present application.
  • Fig. 8 is a sound pressure curve diagram of the speaker module provided by the embodiment of the present application.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.
  • the embodiment of the present application provides a speaker module
  • the speaker module includes a housing 10, a sound component 20 and a bass enhancement tube 30,
  • the sound component 20 is the sound structure of the speaker module, and the sound
  • the component 20 is at least partly located in the casing 10, and a rear sound cavity 40 of the speaker module is formed between the sound-generating component 20 and the casing 10.
  • the casing 10 is provided with a first leakage hole 11 and a second leakage hole 12, and the bass is enhanced.
  • the tube 30 is arranged in the casing 10, one end of the bass booster tube 30 communicates with the rear sound cavity 40, and the other end of the bass booster tube 30 communicates with the outside through the first leak hole 11; the rear sound cavity 40 also passes through the second leak hole 12 communicate with the outside world;
  • first leakage hole 11 is provided with a first damping structure
  • second leakage hole 12 is provided with a second damping structure
  • the bass booster tube 30 by arranging the bass booster tube 30, that is, the bass booster tube 30 is set between the rear sound chamber 40 and the first leak hole 11, that is, a bass booster channel is formed between the rear sound cavity 40 and the first leak hole 11 , and make the audio signal passing through the bass enhancement tube 30 resonate in the bass enhancement tube 30, thereby achieving the purpose of improving the low frequency effect of the speaker module.
  • the sound generating component 20 includes structures such as a voice coil, a diaphragm, and a magnetic circuit system, which are used to output sound signals of the speaker module.
  • the bass enhancement tube 30, the second leakage hole 12 and the second damping structure can form an additional acoustic impedance, thereby reducing the resonance frequency of the speaker module.
  • the equivalent diameter and length of the bass booster tube 30 can be reasonably set, and the sound resistance of the first damping structure and the second damping structure can be set reasonably, so as to bring a large increase in sound conformity in the low frequency band, and then reduce the loudspeaker mode.
  • the resonant frequency of the group can be reasonably set, and the sound resistance of the first damping structure and the second damping structure can be set reasonably, so as to bring a large increase in sound conformity in the low frequency band, and then reduce the loudspeaker mode.
  • the audio signal in the rear sound cavity 40 will be divided into two paths, one path passes through the bass enhancement tube 30, and resonance occurs in the bass enhancement tube 30, and the resonated audio signal will flow out through the first damping structure of the first leakage hole 11 , and the first damping structure will reduce the leaked sound pressure level; therefore, while enhancing the sound signal through the bass booster tube 30, it can also reduce the resonance of the housing 10 and avoid the strong vibration of the housing 10; the other audio signal
  • the flow of the second damping structure passes through the second leakage hole 12, and the second damping structure plays a role of tuning.
  • first damping structure and the second damping structure in this application can be damping mesh or mesh cloth; moreover, the damping mesh or mesh cloth with relatively sparse mesh can be selected to form the first damping structure and the second damping structure. damping structure, and achieve the purpose of reducing the sound resistance of the first damping structure and the second damping structure.
  • M a1 is the equivalent sound quality of bass booster tube 30, and C b1 is the equivalent sound compliance of bass booster tube 30, and R a1 is The acoustic resistance of the first damping structure and the acoustic mass of the first leakage hole 11 are negligible, and Ma2 and R a2 are respectively the acoustic mass of the second leaking hole 12 and the acoustic resistance of the second damping structure.
  • the bass booster tube 30 can form a composite modulus, and can achieve greater additional compliance by reasonably adjusting the above parameters, thereby achieving the purpose of improving the low-frequency effect of the speaker module.
  • curve 1 represents the audio curve of the speaker module provided by the present application
  • curve 2 represents the audio curve of a conventional speaker module
  • curve 3 represents the debugging target curve, that is, the target audio curve of the speaker module.
  • curve 1 and curve 3 basically coincide completely, that is, the audio curve of the speaker module provided by this application is close to the debugging target curve; while there is a curve between curve 2 and curve 3 Fault, that is, there is a fault between the audio curve of the conventional speaker module and the debugging target curve. It can be seen that the speaker module works at low frequency
  • the low-frequency effect shown by the speaker module provided by the application is better than the low-frequency effect shown by the conventional speaker module, and is close to the target low-frequency effect, that is, the speaker module provided by the application can be Achieve better low frequency effect.
  • the bass booster tube 30 is enhanced in the rear sound cavity 40, it is equivalent to adding a composite modulus in the rear sound cavity 40, and the positive compliance produced by the bass booster tube 30 in the low frequency range can reduce the rear sound.
  • the overall compliance of the cavity 40 can reduce the resonant frequency of the speaker module and lower the low frequency.
  • the speaker module provided by the present application has a low-frequency boost of 10 dB, a deep low-frequency dive, smooth low-intermediate frequencies, and better overall performance.
  • curve 4 is an equalizer (Equalizer, EQ) debugging curve of a conventional speaker module
  • curve 5 is an EQ debugging curve of a speaker module provided by the present application. It can be seen that when the speaker module works at a low frequency (100Hz-500Hz), the speaker module in this application can be set with a smaller EQ gain to improve the low frequency effect of the speaker module.
  • curve 6 is the back sound pressure curve of the open speaker
  • curve 7 is the sound pressure curve of the second leakage hole 12 of the speaker module of the present application
  • curve 8 is the first leakage hole 11 of the speaker module sound pressure curve.
  • the speaker module when the speaker module is applied to electronic devices such as mobile phones, by arranging the bass booster tube 30 in the speaker module, not only can the equivalent volume of the low frequency of the speaker module be improved, but also the battery capacity of the electronic device can be reduced.
  • the vibration feeling of the cover is improved, and the interactive experience of the user in the process of using the speaker module is improved.
  • the housing 10 includes a bottom plate and a side wall, the bottom plate and the side wall surround to form a cavity, and the sound generating component 20 is at least partly located in the cavity, and the part of the cavity except for accommodating the sound generating component 20 forms a rear sound cavity 40.
  • the bottom plate and the side wall may be an integral structure.
  • the bass enhancement tube 30 includes a tube wall and a cover plate, the tube wall is a side plate extending from the bottom plate toward the direction of the sound generating assembly 20, the cover plate is covered on the tube wall, and the tube wall, the cover plate and some
  • the bottom plate surrounds a bass enhancement channel forming a bass enhancement tube 30 , one end of the bass enhancement channel communicates with the rear sound chamber 40 , and the other end of the bass enhancement channel communicates with the outside through the first leak hole 11 .
  • the occupied space required by the bass enhancement tube 30 in the rear sound chamber 40 can be reduced.
  • the pipe wall and the bottom plate may be of an integral structure, which can improve the stability of the connection between the bass enhancement pipe 30 and the casing 10 .
  • cover plate can be sealed on the tube wall so that the tube wall, cover plate and part of the bottom plate surround the bass enhancement channel forming the bass enhancement tube 30 .
  • cover plate can be prepared from materials such as thermoplastic polyester.
  • part of the side wall can also be used as part of the tube wall of the bass enhancement tube 30 .
  • the first leakage hole 11 is provided on the first side wall of the housing 10
  • the second leakage hole 12 is provided on the second side wall of the housing 10
  • first side wall is adjacent to the second side wall, or the first side wall and the second side wall are opposite to each other.
  • the distance between the first leakage hole 11 and the second leakage hole 12 can be increased, and further The purpose of improving the low-frequency sound quality of the speaker is achieved.
  • the first leakage hole 11 is located at the end of the first side wall away from the second side wall, and the passage of the bass enhancement tube is parallel to the first side wall.
  • first leakage hole 11 and the second leakage hole 12 are arranged diagonally.
  • first leak hole 11 can also be set on the bottom plate, and the second leak hole 12 can be set on the side wall, as long as the design requirements for the distance between the first leak hole 11 and the second leak hole 12 can be met. That's it.
  • the tube wall of the bass booster tube 30 can form a curved bass booster channel along the side wall of the housing 10 , thereby increasing the effective length of the bass booster tube and enhancing the bass processing effect of the bass booster tube 30 .
  • An embodiment of the present application also provides an electronic device, including the above speaker module.
  • the electronic equipment also includes a mainboard bracket, and a part of the mainboard bracket forms the housing of the speaker module, so as to further reduce the required installation space of the speaker module in the electronic equipment.
  • the electronic device can be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA) etc.
  • UMPC ultra-mobile personal computer
  • PDA personal digital assistant
  • the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
  • each functional unit in each embodiment of the present disclosure may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)

Abstract

本申请公开了一种扬声器模组及电子设备，该扬声器模组包括壳体、发声组件和低音增强管，所述发声组件为所述扬声器模组的发声结构，所述发声组件至少部分位于所述壳体内，且所述发声组件和所述壳体之间形成有所述扬声器模组的后音腔，所述壳体设有第一泄露孔和第二泄露孔，所述低音增强管设于所述壳体内，所述低音增强管的一端与所述后音腔连通，所述低音增强管的另一端通过所述第一泄露孔与外界连通；所述后音腔还通过所述第二泄露孔与外界连通；其中，所述第一泄露孔内设有第一阻尼结构，所述第二泄露孔内设有第二阻尼结构。

Description

扬声器模组及电子设备
相关申请的交叉引用
本申请要求在2021年07月15日提交中国专利局、申请号为“202110801711.9”、名称为“扬声器模组及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请属于电子产品技术领域，具体涉及一种扬声器模组及电子设备。
背景技术
随着技术的发展，用户对手机等电子设备的音频性能的追求在不断提升，尤其是电子设备的扬声器的低频效果。然而，由于电子设备上集成的功能组件越来越多，比如堆叠在主板区域的摄像头、架板、后摄组件、传感器等多种关键器件，使得电子设备没有足够的空间来增加扬声器的后腔的大小，进而导致扬声器难以获得良好的低频效果。
可见，相关技术中，电子设备的扬声器存在低频效果差的问题。
发明内容
本申请旨在提供一种扬声器模组及电子设备，能够解决相关技术中，电子设备的扬声器存在的低频效果差的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提出了一种扬声器模组，包括壳体、发声组件和低音增强管，所述发声组件为所述扬声器模组的发声结构，所述发声组件至少部分位于所述壳体内，且所述发声组件和所述壳体之间形成有所述扬声器模组的后音腔，所述壳体设有第一泄露孔和第二泄露孔，所述低音增强管设于所述壳体内，所述低音增强管的一端与所述后音腔连通，所述低音增强管的另一端通过所述第一泄露孔与外界连通；所述 后音腔还通过所述第二泄露孔与外界连通；
其中，所述第一泄露孔内设有第一阻尼结构，所述第二泄露孔内设有第二阻尼结构。
第二方面，本申请实施例提出了一种电子设备，包括第一方面所述的扬声器模组。
在本申请的实施例中，通过设置低音增强管，即在后音腔和第一泄露孔之间设置低音增强管，即在后音腔和第一泄露孔之间形成低音增强通道，并使得经过低音增强管的音频信号，可以在低音增强管内发生共振，进而达到提升扬声器模组的低频效果的目的。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是本申请实施例提供的包括扬声器模组的电子设备的结构示意图之一；
图2是本申请实施例提供的包括扬声器模组的电子设备的结构示意图之二；
图3是本申请实施例提供的包括扬声器模组的电子设备的结构示意图之三；
图4是本申请实施例提供的包括扬声器模组的电子设备的结构示意图之四；
图5是本申请实施例提供的扬声器模组的等效电路图；
图6是本申请实施例提供的扬声器模组的音频图；
图7是本申请实施例提供的扬声器模组的EQ调试图；
图8是本申请实施例提供的扬声器模组的声压曲线图。
具体实施例
下面将详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
如图1至图8所示，本申请实施例提供一种扬声器模组，该扬声器模组包括壳体10、发声组件20和低音增强管30，发声组件20为扬声器模组的发声结构，发声组件20至少部分位于壳体10内，且发声组件20和壳体10之间形成有扬声器模组的后音腔40，壳体10设有第一泄露孔11和第二泄露孔12，低音增强管30设于壳体10内，低音增强管30的一端与后音腔40连通，低音增强管30的另一端通过第一泄露孔11与外界连通；后音腔40还通过第二泄露孔12与外界连通；
其中，第一泄露孔11内设有第一阻尼结构，第二泄露孔12内设有第 二阻尼结构。
本实施方式中，通过设置低音增强管30，即在后音腔40和第一泄露孔11之间设置低音增强管30，即在后音腔40和第一泄露孔11之间形成低音增强通道，并使得经过低音增强管30的音频信号，可以在低音增强管30内发生共振，进而达到提升扬声器模组的低频效果的目的。
其中，发声组件20包括音圈、振膜、磁路系统等结构，其用于输出扬声器模组的声音信号。
可以理解的是，低音增强管30、第二泄露孔12和第二阻尼结构可以形成一个附加声阻抗，进而降低扬声器模组的谐振频率。其中，可以通过合理设置低音增强管30的等效直径、长度，以及合理设置第一阻尼结构、第二阻尼结构的声阻，以便在低频段带来声顺的大幅提升，进而达到降低扬声器模组的谐振频率。
而且，后音腔40内的音频信号会分成两路，一路经过低音增强管30，并在低音增强管30内发生共振，共振后的音频信号会经第一泄露孔11的第一阻尼结构流出，且第一阻尼结构会减少泄露出去的声压级；因此在通过低音增强管30增强声音信号的同时，还能减少壳体10的共振，避免壳体10产生强烈振感；另一路音频信号经过第二泄露孔12的第二阻尼结构流程，且第二阻尼结构起到调音的作用。
需要注意的是，本申请中的第一阻尼结构和第二阻尼结构可以是阻尼网或者网布；而且，可以选用网孔较为稀疏的阻尼网或网布，以形成第一阻尼结构和第二阻尼结构，并达到降低第一阻尼结构和第二阻尼结构的声阻的目的。
如图5所示的本申请的扬声器模组的后音腔的等效电路图，M a1为低音增强管30的等效声质量，C b1为低音增强管30的等效声顺，R a1为第一阻尼结构的声阻，且第一泄露孔11的声质量可忽略，M a2和R a2分别为第二泄露孔12的声质量和第二阻尼结构的声阻。其中，低音增强管30可以形成一个复合模量，并可以通过合理调整上述参数实现较大的附加声 顺，进而达到提升扬声器模组的低频效果的目的。
在扬声器模组可实现的结构的典型尺寸如表1所示的情况下，可以表1中的尺寸对应的结构导入仿真模型中进行仿真，并得到相应的结果。
变量 M a1 R a2 C b2 M a2 R a1
数值(国标单位) 0.5e 3 6.2e 3 1.5e -4 0.4e 3 10e -3
表1
其中，将表1中的参数变量导入仿真模型中进行仿真，可以得到如图6所示的仿真结果。如图6所示，曲线1表示本申请提供的扬声器模组的音频曲线，曲线2表示常规的扬声器模组的音频曲线，曲线3表示调试目标曲线，即扬声器模组目标音频曲线。
如图6所示，在频率处于100Hz～500Hz的情况下，曲线1和曲线3基本完全重合，即本申请提供的扬声器模组的音频曲线接近调试目标曲线；而曲线2与曲线3之间存在断层，即常规的扬声器模组的音频曲线与调试目标曲线之间存在断层。可见，在扬声器模组工作在低频
(100Hz～500Hz)的情况下，本申请提供的扬声器模组表现出的低频效果优于常规的扬声器模组表现出的低频效果，并接近于目标低频效果，即本申请提供的扬声器模组可以达到较优的低频效果。
而且，在后音腔40中增强低音增强管30后，相当于在后音腔40增加了一处复合模量，且低音增强管30在低频段产生的正顺性，能够起到降低后音腔40整体顺性，并可以实现降低扬声器模组的谐振频率及拉低低频的作用。而且，相对于同腔体大小的扬声器方案，本申请提供的扬声器模组的低频提升达10dB，低频下潜极深，且低中频较为平滑，总体性能较好。
如图7所示，曲线4为常规的扬声器模组的均衡器(Equalizer，EQ)调试曲线，曲线5为本申请提供的扬声器模组的EQ调试曲线。可见，在扬声器模组工作在低频(100Hz～500Hz)的情况下，本申请中的扬声器模组可以设置较小的EQ增益，以便改善扬声器模组的低频效果。
如图8所示，曲线6为开放式扬声器的背部声压曲线，曲线7为本申请的扬声器模组的第二泄露孔12的声压曲线，曲线8为扬声器模组的第一泄露孔11的声压曲线。可见，本申请中扬声器模组的低音增强管可在实现提升扬声器模组的低频的等效容积的情况下，对与扬声器模组关联的其他部件的振动影响较小，有效的提升用户在使用扬声器模组过程中的互动体验。
比如，在扬声器模组应用在手机等电子设备上的情况下，通过在扬声器模组中设置低音增强管30，不仅可以实现提升扬声器模组的低频的等效容积，还可以降低电子设备的电池盖的震感，并提升了用户在使用扬声器模组过程中的互动体验。
可选地，壳体10包括底板和侧壁，底板和侧壁围设形成一腔体，且发声组件20至少部分位于该腔体内，腔体的除去容置发声组件20的部分形成后音腔40。
其中，底板和侧壁可以是一体结构。
可选地，低音增强管30包括管壁和盖板，管壁为自底板的朝向发声组件20的方向延伸形成的侧板，盖板盖设于管壁上，且管壁、盖板及部分底板围设形成低音增强管30的低音增强通道，低音增强通道的一端与后音腔40连通，低音增强通道的另一端通过第一泄露孔11与外界连通。
本实施方式中，通过在底板上形成低音增强通道，可以降低低音增强管30在后音腔40所需的占用空间。
一些实施方式中，管壁和底板可以是一体结构，这样可以提升低音增强管30与壳体10的连接的稳定性。
另外，盖板可以通过密封的形式盖设于管壁上，以使管壁、盖板及部分底板围设形成低音增强管30的低音增强通道。其中，盖板可以由热塑性聚酯等材料制备得到。
其中，为进一步降低低音增强管30在后音腔40中的占用空间，还可以将部分侧壁充当低音增强管30的部分管壁。
可选地，第一泄露孔11设于壳体10的第一侧壁上，第二泄露孔12设于壳体10的第二侧壁上；
其中，第一侧壁与第二侧壁相邻设置，或者，第一侧壁和第二侧壁相对设置。
本实施方式中，通过将第一泄露孔11和第二泄露孔12设于壳体10的不同的侧壁上，可以增大第一泄露孔11和第二泄露孔12之间的间距，进而达到提升扬声器的低频音质的目的。
在第一侧壁和第二侧壁相邻设置的情况下，第一泄露孔11位于第一侧壁的远离第二侧壁的一端，且低音增强管通道平行于第一侧壁。
在第一侧壁和第二侧壁相对设置的情况下，第一泄露孔11和第二泄露孔12呈对角设置。
在另一些实施方式中，第一泄露孔11还可以设于底板上，第二泄露孔12设于侧壁上，只要能够满足第一泄露孔11和第二泄露孔12之间的间距设计要求即可。
如图4所示，低音增强管30的管壁可以沿壳体10的侧壁形成弯曲的低音增强通道，进而增加低音增强管的有效长度，进而增强低音增强管30的低音处理效果。
本申请实施例还提供一种电子设备，包括上述扬声器模组。
需要说明的是，上述扬声器模组实施例的实现方式同样适应于该电子设备的实施例中，并能达到相同的技术效果，在此不再赘述。
而且，电子设备还包括主板支架，且部分主板支架形成扬声器模组的壳体，以进一步降低扬声器模组在电子设备内所需的安装空间。
其中，电子设备可以是为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性 实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本公开各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。

Claims (10)

  1. 一种扬声器模组，其中，包括壳体、发声组件和低音增强管，所述发声组件为所述扬声器模组的发声结构，所述发声组件至少部分位于所述壳体内，且所述发声组件和所述壳体之间形成有所述扬声器模组的后音腔，所述壳体设有第一泄露孔和第二泄露孔，所述低音增强管设于所述壳体内，所述低音增强管的一端与所述后音腔连通，所述低音增强管的另一端通过所述第一泄露孔与外界连通；所述后音腔还通过所述第二泄露孔与外界连通；
    其中，所述第一泄露孔内设有第一阻尼结构，所述第二泄露孔内设有第二阻尼结构。
  2. 根据权利要求1所述的扬声器模组，其中，所述壳体包括底板和侧壁，所述底板和所述侧壁围设形成一腔体，且所述发声组件至少部分位于所述腔体内，所述腔体的除去容置所述发声组件的部分形成所述后音腔。
  3. 根据权利要求2所述的扬声器模组，其中，所述低音增强管包括管壁和盖板，所述管壁为自所述底板的朝向所述发声组件的方向延伸形成的侧板，所述盖板盖设于所述管壁上，且所述管壁、所述盖板及部分所述底板围设形成所述低音增强管的低音增强通道，所述低音增强通道的一端与所述后音腔连通，所述低音增强通道的另一端通过所述第一泄露孔与外界连通。
  4. 根据权利要求3所述的扬声器模组，其中，所述第一泄露孔设于所述壳体的第一侧壁上，所述第二泄露孔设于所述壳体的第二侧壁上；
    其中，所述第一侧壁与所述第二侧壁相邻设置，或者，所述第一侧壁和所述第二侧壁相对设置。
  5. 根据权利要求4所述的扬声器模组，其中，在所述第一侧壁和所述第二侧壁相邻设置的情况下，所述第一泄露孔位于所述第一侧壁的远 离所述第二侧壁的一端，且所述低音增强通道平行于所述第一侧壁。
  6. 根据权利要求4所述的扬声器模组，其中，在所述第一侧壁和所述第二侧壁相对设置的情况下，所述第一泄露孔和所述第二泄露孔呈对角设置。
  7. 根据权利要求3所述扬声器模组，其中，所述第一泄露孔设于所述底板上，所述第二泄露孔设于所述侧壁上。
  8. 根据权利要求3至7中任一项所述的扬声器模组，其中，所述管壁和所述底板为一体结构。
  9. 一种电子设备，其中，包括如权利要求1至8中任一项所述的扬声器模组。
  10. 根据权利要求9所述的电子设备，其中，所述电子设备还包括主板支架，且部分所述主板支架形成所述扬声器模组的壳体。
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Publication number Priority date Publication date Assignee Title
CN113452825A (zh) * 2021-07-15 2021-09-28 维沃移动通信有限公司 扬声器模组及电子设备
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150172800A1 (en) * 2013-12-13 2015-06-18 Apple Inc. Earbud with membrane based acoustic mass loading
CN108055601A (zh) * 2017-11-20 2018-05-18 瑞声科技(新加坡)有限公司 扬声器箱
CN109618257A (zh) * 2018-10-26 2019-04-12 歌尔股份有限公司 一种耳塞
CN213522322U (zh) * 2020-11-12 2021-06-22 天键电声股份有限公司 一种抑制后腔空气共振的头戴式耳机
CN113452825A (zh) * 2021-07-15 2021-09-28 维沃移动通信有限公司 扬声器模组及电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104244130B (zh) * 2014-09-05 2018-05-22 歌尔股份有限公司 一种耳机
CN106254994B (zh) * 2016-09-27 2023-04-07 歌尔股份有限公司 耳机
CN207732946U (zh) * 2018-01-31 2018-08-14 歌尔科技有限公司 一种低音管可调耳机
CN108566600B (zh) * 2018-04-27 2021-10-08 歌尔股份有限公司 一种发声装置以及电子设备
CN208581337U (zh) * 2018-06-14 2019-03-05 歌尔科技有限公司 一种耳机

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150172800A1 (en) * 2013-12-13 2015-06-18 Apple Inc. Earbud with membrane based acoustic mass loading
CN108055601A (zh) * 2017-11-20 2018-05-18 瑞声科技(新加坡)有限公司 扬声器箱
CN109618257A (zh) * 2018-10-26 2019-04-12 歌尔股份有限公司 一种耳塞
CN213522322U (zh) * 2020-11-12 2021-06-22 天键电声股份有限公司 一种抑制后腔空气共振的头戴式耳机
CN113452825A (zh) * 2021-07-15 2021-09-28 维沃移动通信有限公司 扬声器模组及电子设备

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