WO2023276850A1 - 圧電振動デバイス製造装置及び圧電振動デバイスの製造方法 - Google Patents
圧電振動デバイス製造装置及び圧電振動デバイスの製造方法 Download PDFInfo
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- WO2023276850A1 WO2023276850A1 PCT/JP2022/025115 JP2022025115W WO2023276850A1 WO 2023276850 A1 WO2023276850 A1 WO 2023276850A1 JP 2022025115 W JP2022025115 W JP 2022025115W WO 2023276850 A1 WO2023276850 A1 WO 2023276850A1
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- supply
- holding member
- piezoelectric element
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- suction
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 180
- 230000007246 mechanism Effects 0.000 claims abstract description 119
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- 239000013078 crystal Substances 0.000 description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
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- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
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- 230000014509 gene expression Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Definitions
- the present invention relates to a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method.
- a piezoelectric vibration device includes, for example, a crystal oscillator using a crystal vibrating piece.
- the crystal oscillator has a crystal vibrating piece that is a piezoelectric element, and a holding member that holds the crystal vibrating piece.
- the crystal vibrating piece is held in the box-shaped holding member made of an insulating material such as ceramic.
- the crystal resonator is hermetically sealed in a state in which the electrodes of the crystal resonator element and the electrodes in the holding member are joined.
- the piezoelectric element and the holding member are supplied to a piezoelectric vibration device manufacturing apparatus that manufactures such a piezoelectric vibration device.
- the piezoelectric vibration device manufacturing apparatus arranges the piezoelectric element supplied by a transfer device such as a suction head in the holding member coated with the bonding material.
- the piezoelectric element must be arranged in the holding member so that the portion other than the electrodes does not come into contact with the holding member. Therefore, there is known a piezoelectric vibration device manufacturing apparatus in which the piezoelectric element positioned with respect to the transfer device is arranged in the holding member.
- Japanese Unexamined Patent Application Publication No. 2002-101003 discloses an element component mounting apparatus that positions the supplied element component and then mounts the element component on an element mounting member wafer.
- the element component mounting apparatus described in Patent Document 1 includes a tray for temporarily placing the plurality of element components in order to position them.
- the tray has a plurality of recesses for temporarily placing the element parts.
- the wall surface of the recess is exposed on the opening side of the recess while being inclined in the depth direction.
- the element part put into the recess slides on the wall surface of the recess and is placed on the bottom surface of the recess.
- the element part is positioned on the bottom surface of the recess by the wall surface of the recess.
- the device component mounting apparatus transfers the plurality of device components positioned on the bottom surfaces of the plurality of recesses onto the device mounting member wafer. Thereby, the device component mounting apparatus can place the plurality of device components at predetermined positions on the device mounting member wafer in predetermined directions.
- the element component mounting device transports the plurality of supplied element components to the tray by means of suction movement means, and positions them on the tray. Further, the device component mounting apparatus sucks the plurality of device components positioned on the tray by the suction portion of the suction moving means and transfers them onto the device mounting member wafer. Therefore, there is a possibility that the positions and orientations of the plurality of element parts are shifted with respect to the positions positioned on the tray when being sucked. Further, the recess of the tray has a bottom surface with a size that creates a gap between the wall surface and the element component located on the bottom surface in order to arrange the element component in the recess. Therefore, there is a possibility that the position and orientation of the element parts are shifted with respect to the tray by the amount of the gap generated between the wall surface and the element parts positioned on the bottom surface.
- An object of the present invention is to provide a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method that can arrange a plurality of piezoelectric elements in predetermined positions and in predetermined orientations on a plurality of holding members.
- the inventors of the present invention have developed a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method capable of arranging a plurality of piezoelectric elements in a predetermined position and in a predetermined orientation on a plurality of holding members without increasing the tact time. was considered. As a result of intensive studies, the present inventors came up with the following configuration.
- a piezoelectric vibration device manufacturing apparatus includes at least a piezoelectric element and a holding member that holds the piezoelectric element, and a piezoelectric vibration device in which the piezoelectric element is bonded to the holding member with a bonding material.
- a piezoelectric vibration device manufacturing apparatus for manufacturing a device includes at least a piezoelectric element and a holding member that holds the piezoelectric element, and a piezoelectric vibration device in which the piezoelectric element is bonded to the holding member with a bonding material.
- a piezoelectric vibration device manufacturing apparatus is equipped with a plurality of suction heads for sucking the piezoelectric elements one by one, and the plurality of suction heads, and a plurality of the holding heads from a piezoelectric element supply position to which the plurality of piezoelectric elements are supplied. and a suction head moving device for simultaneously reciprocating the plurality of suction heads to a holding member supply position to which the member is supplied.
- the suction head includes a suction nozzle for sucking the piezoelectric element, a suction head horizontal movement mechanism for moving the suction nozzle in a horizontal direction, a suction head vertical movement mechanism for moving the suction nozzle in a vertical direction, and the a suction head rotary movement mechanism for moving the suction nozzle in a rotational direction around the vertical axis.
- the plurality of suction heads respectively absorb the piezoelectric elements supplied to the piezoelectric element supply position by the plurality of suction nozzles.
- the plurality of suction heads are moved from the piezoelectric element supply position to the holding member supply position by the suction head moving device.
- At least one of the suction head horizontal movement mechanism, the suction head vertical movement mechanism, and the suction head rotation movement mechanism includes information about the positions of the plurality of piezoelectric elements sucked by the plurality of suction nozzles and the The plurality of piezoelectric elements sucked by the plurality of suction nozzles are arranged at positions where they can be placed on the corresponding holding members based on the information about the positions of the plurality of holding members supplied to the holding member supply position. are adjusted independently of each other.
- the plurality of suction heads suck the piezoelectric elements with their respective suction nozzles, and convey the plurality of piezoelectric elements.
- the suction head uses information about the positions of the plurality of sucked piezoelectric elements and information about the positions of the plurality of holding members on which the plurality of sucked piezoelectric elements are arranged, respectively. Adjust each nozzle position independently and individually.
- the plurality of suction heads are arranged so that the positions of the plurality of piezoelectric elements that are being sucked correspond to the horizontal and vertical positions of the holding member, taking into consideration the displacement during suction. can be adjusted individually.
- the plurality of suction heads individually adjust the positions of the suction nozzles based on the information on the positions of the piezoelectric elements and the information on the positions of the holding members, which are numerical data. Therefore, the piezoelectric vibration device manufacturing apparatus does not need to temporarily place the piezoelectric element for alignment. Therefore, it is possible to dispose a plurality of piezoelectric elements in a predetermined position and in a predetermined orientation on each of the plurality of holding members without increasing the tact time.
- the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration.
- a piezoelectric vibration device manufacturing apparatus is equipped with a plurality of supply heads that respectively supply the bonding material to the holding member, and the plurality of supply heads. and a supply head moving device that simultaneously reciprocates the plurality of supply heads.
- the supply head includes a supply device that supplies the bonding material, a supply head horizontal movement mechanism that horizontally moves the supply device, and a supply head vertical movement mechanism that vertically moves the supply device. have.
- the plurality of supply heads are moved from the standby position to the holding member supply position by the supply head moving device. At least one of the supply head horizontal movement mechanism and the supply head vertical movement mechanism moves the plurality of supply devices to the The positions of the supply devices are independently adjusted so that the bonding material can be supplied to each of the plurality of holding members.
- the plurality of supply heads adjust the position of the supply device independently and individually so as to correspond to the horizontal and vertical positions of the holding member.
- the supply device can discharge the bonding material to a predetermined position on the holding member.
- the plurality of supply heads independently and individually adjust the positions of the supply devices based on the acquired numerical data regarding the positions of the plurality of holding members. Therefore, the piezoelectric vibration device manufacturing apparatus does not need to align the holding member with the supply device. Therefore, the bonding material can be arranged at predetermined positions of the plurality of holding members without increasing the tact time.
- the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined directions.
- the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration.
- the plurality of supply heads independently and individually supply the bonding material from the plurality of supply devices to the plurality of holding members at the holding member supply position.
- the plurality of suction heads independently and individually arrange the piezoelectric elements sucked by the plurality of suction nozzles on the plurality of holding members to which the bonding material is supplied. do.
- the plurality of supply heads independently and individually adjust the horizontal and vertical positions of the plurality of supply devices based on information regarding the positions of the holding members.
- the plurality of supply devices independently and individually supply the bonding material to predetermined positions of the plurality of holding members. Accordingly, the plurality of supply devices can discharge the bonding material to predetermined positions on the plurality of holding members while taking into consideration variations in the positions of the plurality of holding members.
- the plurality of suction heads independently and individually adjust the horizontal and vertical positions of the plurality of suction nozzles based on the information about the positions of the piezoelectric elements and the information about the positions of the holding members.
- the plurality of suction nozzles independently and individually arrange the piezoelectric elements at predetermined positions of the plurality of holding members.
- the suction head can dispose the piezoelectric element on the holding member while taking into consideration variations in the shape of the holding member. Therefore, it is possible to dispose a plurality of piezoelectric elements in a predetermined position and in a predetermined orientation on each of the plurality of holding members without increasing the tact time.
- the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration.
- the plurality of supply heads can simultaneously adjust the position of each of the supply devices by at least one of the horizontal movement mechanism for the supply heads or the vertical movement mechanism for the supply heads. Further, the positions of the respective suction nozzles of the plurality of suction heads can be simultaneously adjusted by at least one of the suction head horizontal movement mechanism, the suction head vertical movement mechanism, and the suction head rotary movement mechanism. is.
- the piezoelectric vibration device manufacturing apparatus simultaneously adjusts the positions of the plurality of suction heads and the plurality of supply heads by the respective moving mechanisms.
- the time required to adjust the positions of the suction head and the plurality of supply heads is reduced. Therefore, the supply material can be supplied to each of the predetermined positions of the plurality of holding members without increasing the tact time.
- the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration.
- the piezoelectric vibration device manufacturing apparatus is a piezoelectric element position measuring apparatus that measures, as information about the positions of the piezoelectric elements, the horizontal positions of the plurality of piezoelectric elements sucked by the plurality of suction heads and the orientations of the piezoelectric elements. and a holding member position measuring device for measuring the horizontal and vertical positions of the plurality of holding members supplied to the holding member supply position as information on the positions of the holding members.
- the piezoelectric element position measuring device measures the horizontal position of the piezoelectric element and the orientation of the piezoelectric element while each of the plurality of suction nozzles suctions the piezoelectric element. That is, the piezoelectric element position measuring device measures the displacement of each of the plurality of piezoelectric elements sucked by the sucking nozzle. Further, the holding member position measuring device measures the position of each of the plurality of holding members supplied to the holding member supply position not only in the horizontal direction but also in the vertical direction. Therefore, the holding member position measuring device independently and individually adjusts the vertical positions of the piezoelectric elements arranged on the plurality of holding members based on the vertical positions of the corresponding holding members. can be done. Therefore, it is possible to dispose a plurality of piezoelectric elements in a predetermined position and in a predetermined orientation on each of the plurality of holding members without increasing the tact time.
- a method for manufacturing a piezoelectric vibration device includes at least a piezoelectric element and a holding member that holds the piezoelectric element, and the piezoelectric element is joined to the holding member by the joining material.
- a method for manufacturing a piezoelectric vibration device includes at least a piezoelectric element and a holding member that holds the piezoelectric element, and the piezoelectric element is joined to the holding member by the joining material.
- a method for manufacturing a piezoelectric vibration device includes a piezoelectric element supplying step of supplying a plurality of the piezoelectric elements to a piezoelectric element supplying position, a piezoelectric element positioning step of positioning the plurality of piezoelectric elements at the piezoelectric element supplying position, and a plurality of holding positions.
- a piezoelectric element position adjusting step of independently and individually adjusting the positions of the piezoelectric elements.
- the method for manufacturing the piezoelectric vibration device includes: based on the information about the position of the holding member and the information about the position of the piezoelectric element acquired during transportation in the piezoelectric element transportation step, the plurality of piezoelectric elements and a piezoelectric element position adjusting step for adjusting the positions of the piezoelectric elements independently and individually.
- the information about the positions of the piezoelectric elements includes information about the positions in consideration of the orientations of the plurality of piezoelectric elements during transportation. As a result, it is not necessary to additionally provide a step of positioning the posture of the piezoelectric element by temporary placement or the like after the piezoelectric element transfer step. Therefore, it is possible to dispose a plurality of piezoelectric elements in a predetermined position and in a predetermined orientation on each of the plurality of holding members without increasing the tact time.
- the method of manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration.
- the bonding material supply position adjusting step the bonding material supply position is individually adjusted according to the position of the holding member. Moreover, since the supply positions of the bonding members are individually adjusted based on the information about the positions of the plurality of holding members, which is the acquired numerical data, there is no need to perform individual positioning or the like for each of the holding members. Therefore, it is possible to dispose a plurality of piezoelectric elements in a predetermined position and in a predetermined orientation on each of the plurality of holding members without increasing the tact time.
- the method of manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration.
- a method for manufacturing a piezoelectric vibration device comprises: a bonding material supply step of supplying the bonding material to each of the plurality of holding members at the holding member supply position; and a piezoelectric element bonding step of respectively arranging the plurality of piezoelectric elements conveyed to a supply position on the plurality of holding members to which the bonding material is supplied.
- the bonding material supply positions of the plurality of holding members are adjusted based on the information regarding the positions of the plurality of holding members.
- the arrangement positions of the plurality of piezoelectric elements on the plurality of holding members are adjusted based on the information on the positions of the piezoelectric elements and the information on the positions of the holding members. Therefore, a plurality of piezoelectric elements can be arranged on the plurality of holding members in predetermined positions and in predetermined orientations.
- the method of manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration.
- the bonding material supply position adjusting step is a process of simultaneously adjusting positions at which the bonding material is supplied to the plurality of holding members.
- the piezoelectric element position adjusting step is a step of simultaneously adjusting the positions of the plurality of piezoelectric elements so that they can be arranged on the holding member.
- the piezoelectric element position adjustment step the arrangement positions of the plurality of piezoelectric elements are adjusted simultaneously, and in the bonding material supply position adjustment step, the plurality of bonding member supply positions are adjusted simultaneously. Therefore, regardless of the number of piezoelectric elements arranged on the holding member, the time required to adjust the arrangement positions of the plurality of piezoelectric elements and the supply position of the bonding material can be reduced. Therefore, the material can be supplied to the predetermined positions of the plurality of holding members without increasing the tact time.
- a plurality of piezoelectric elements can be arranged on a plurality of holding members in predetermined positions and in predetermined directions without increasing the tact time.
- the method of manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration. a piezoelectric element position information obtaining step of obtaining information about horizontal positions and orientations of the plurality of piezoelectric elements conveyed from the piezoelectric element supply position to the holding member supply position; and the holding member supply position. and a holding member position information acquisition step of acquiring information on the horizontal and vertical positions of the plurality of holding members supplied to the apparatus.
- the piezoelectric element position information acquiring step the horizontal positions and orientations of the plurality of piezoelectric elements in the piezoelectric element transporting step are measured. That is, in the piezoelectric element position information obtaining step, the posture of the sucked piezoelectric element is measured.
- the positions of the plurality of holding members are measured not only in the horizontal direction but also in the vertical direction. , can be independently and individually adjusted based on the vertical position of the corresponding retaining member. Therefore, it is possible to dispose a plurality of piezoelectric elements in a predetermined position and in a predetermined orientation on each of the plurality of holding members without increasing the tact time.
- a piezoelectric vibration device means an electronic component having a piezoelectric element that converts force applied to a piezoelectric body into voltage, or converts voltage applied to a piezoelectric body into force.
- Piezoelectric vibration devices include crystal resonators, crystal oscillators, and the like. Piezoelectric vibration devices are used in oscillation circuits, filter circuits, actuators, sensors, and the like.
- a piezoelectric element means a piezoelectric body that converts applied force into voltage or converts applied voltage into force.
- the piezoelectric element is a plate-like crystal vibrating piece obtained by cutting crystal in a specific direction.
- a piezoelectric element has electrodes formed by vapor deposition, sputtering, or the like.
- the holding member is a container made of an insulating material for holding the piezoelectric element.
- the holding member is a ceramic housing in this embodiment.
- the holding member has an electrode electrically connected to the piezoelectric element therein.
- the holding member has a recess in which the piezoelectric element can be arranged.
- the bonding material means a conductive material that bonds the piezoelectric element to the holding container.
- the bonding material is, for example, solder, adhesive, or the like.
- the bonding material is a thermosetting adhesive in this embodiment.
- relative distance means the distance between the centers of the parts.
- positional information refers to the X-, Y-, Z-, and ⁇ -direction coordinates of a specific point on a target device, part, etc., with an arbitrary point on the piezoelectric vibration device manufacturing device as the origin. means.
- the coordinates in this embodiment are a coordinate system with an arbitrary point in the piezoelectric vibration device manufacturing apparatus as the origin.
- a plurality of piezoelectric elements can be arranged on a plurality of holding members in predetermined positions and in predetermined orientations without increasing the tact time.
- FIG. 1 is a plan view showing an outline of the overall configuration of a piezoelectric vibration device manufacturing apparatus according to Embodiment 1 of the present invention.
- 2A is a plan view showing a plurality of piezoelectric elements and a tray supplied to the piezoelectric vibration device manufacturing apparatus according to Embodiment 1 of the present invention;
- FIG. 2B is a plan view schematically showing a plurality of holding members supplied to the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention;
- FIG. 3 is a plan view showing an outline of the overall configuration of a plurality of suction heads that the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention has. 4 is a view in the direction of arrow A in FIG. 3.
- FIG. 5 is a side view showing an outline of the overall configuration of a plurality of supply heads that the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention has.
- FIG. 6 is a block diagram showing the control configuration of the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.
- FIG. 7 is a plan view schematically showing a state in which a plurality of suction heads of the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention have conveyed the piezoelectric element to the holding member supply position.
- FIG. 8 is a plan view schematically showing a state in which the positions of the suction nozzles are adjusted by a plurality of suction heads of the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.
- FIG. 9 is a flowchart of a method for manufacturing a piezoelectric vibration device according to an embodiment of the invention.
- FIG. 10 shows a piezoelectric vibration device manufacturing apparatus in a holding member position information acquisition step, a piezoelectric element supply step, a holding member supply step, a piezoelectric element positioning step, and a holding member positioning step in a method for manufacturing a piezoelectric vibration device according to an embodiment of the present invention.
- FIG. 11 is a plan view showing the operating state of the piezoelectric vibration device manufacturing apparatus in the bonding material supply position adjustment process and the bonding material supply process in the piezoelectric vibration device manufacturing method according to the embodiment of the present invention.
- FIG. 10 shows a piezoelectric vibration device manufacturing apparatus in a holding member position information acquisition step, a piezoelectric element supply step, a holding member supply step, a piezoelectric element positioning step, and a holding member positioning step in a method for manufacturing a
- FIG. 12 shows the operating state of the piezoelectric vibration device manufacturing apparatus in the piezoelectric element transfer step, the piezoelectric element position information acquisition step, the piezoelectric element position adjustment step, and the piezoelectric element bonding step in the piezoelectric vibration device manufacturing method according to the embodiment of the present invention. It is a plan view showing.
- FIG. 13 is a plan view showing the configuration of a piezoelectric vibration device manufacturing line including the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.
- FIG. 14 is a block diagram showing a control configuration of a piezoelectric vibration device manufacturing line including the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.
- the direction in which the piezoelectric element P is transported to the piezoelectric element supply position Sp is defined as the "X direction”.
- a direction orthogonal to the X direction and in which the piezoelectric element P is conveyed from the piezoelectric element supply position Sp to the holding member supply position Sh is defined as the "Y direction”.
- a direction perpendicular to the X direction and the Y direction is defined as a “Z direction”.
- the direction of rotation around the axis extending in the Z direction is defined as the ⁇ direction.
- the X direction and the Y direction are directions on the horizontal plane.
- the Z direction is the vertical direction. However, this definition of direction is not intended to limit the orientation of the piezoelectric vibration device manufacturing apparatus 1 during use.
- fixed are not limited to cases where members are directly fixed to each other, but also other It also includes the case where it is fixed via a member. That is, in the following description, expressions such as fixing include meanings such as direct and indirect fixing between members.
- FIG. 1 is a plan view schematically showing the overall configuration of a piezoelectric vibration device manufacturing apparatus 1 according to Embodiment 1 of the present invention.
- FIG. 2A is a plan view showing a plurality of piezoelectric elements P and a tray T supplied to the piezoelectric vibration device manufacturing apparatus 1.
- FIG. 2B is a plan view schematically showing a plurality of holding members H supplied to the piezoelectric vibration device manufacturing apparatus 1.
- FIG. FIG. 3 is a plan view showing an outline of the overall configuration of a plurality of suction heads 20 that the piezoelectric vibration device manufacturing apparatus 1 has.
- 4 is a view in the direction of arrow A in FIG. 3.
- FIG. FIG. 5 is a side view schematically showing the overall configuration of the multiple supply heads 30 of the piezoelectric vibration device manufacturing apparatus 1.
- FIG. 6 is a block diagram showing the control configuration of the piezoelectric vibration device manufacturing apparatus 1. As shown in FIG.
- the piezoelectric vibration device manufacturing apparatus 1 includes a pedestal 2, a piezoelectric element supply device 10, a holding member supply device 11, a suction head moving device 12, a supply head moving device 13, a camera as a piezoelectric element position measuring device. 14 , a laser measuring device 15 as a holding member position measuring device, a control device 16 , a suction head 20 and a supply head 30 .
- each device is arranged on a mounting surface which is a horizontal surface of the pedestal 2.
- the piezoelectric vibration device manufacturing apparatus 1 is supplied with a plurality of piezoelectric elements P and a plurality of holding members H from a supply line (not shown).
- the tray T which is a container for the piezoelectric elements P, is provided with a plurality of recesses C in which the piezoelectric elements P are arranged.
- the recess C is rectangular in plan view.
- a group of a plurality of concave portions C provided in the X direction at intervals of Px are arranged in the Y direction at intervals of Py.
- a plurality of recesses C are arranged in a matrix at intervals of Px in the X direction and at intervals of Py in the Y direction.
- the piezoelectric elements P are positioned within the recesses C of the tray T, respectively.
- the intervals Px and Py between the adjacent recesses C are the intervals between the centers (intersection points of diagonal lines) of the recesses C which are rectangular in plan view.
- a plurality of holding members H are supplied to the piezoelectric vibration device manufacturing apparatus 1 while maintaining their relative distances.
- a group of holding members H aligned in the X direction at intervals Px are aligned in the Y direction at intervals Py.
- the plurality of holding members H are arranged in a matrix at intervals of Px in the X direction and at intervals of Py in the Y direction.
- the plurality of holding members H are formed in a sheet shape that is connected to each other.
- the plurality of sheet-shaped holding members H are positioned so as to correspond to the X-direction spacing Px and the Y-direction spacing Py of the recesses C, respectively.
- the holding member H has, for example, a rectangular shape in plan view.
- the holding member H is configured, for example, to have a long side of 2.0 mm and a short side of 1.6 mm. Further, the holding member H is configured to have, for example, a long side of 1.6 mm and a short side of 1.2 mm. Further, the holding member H is configured to have a long side of 1.2 mm and a short side of 1.0 mm, for example.
- the size of the sheet formed by connecting the plurality of holding members to each other is the same regardless of the size of the holding member H. As shown in FIG. That is, the sheet differs in the number of holding members H included in the sheet according to the size of the holding member H. FIG. With this configuration, the piezoelectric vibration device manufacturing apparatus 1 does not need to replace the suction head moving device 12, the supply head moving device 13, etc., which will be described later, even if the size of the holding member H is changed.
- the piezoelectric element supply device 10 conveys a tray T containing a plurality of piezoelectric elements P to a piezoelectric element supply position Sp, and at the piezoelectric element supply position Sp, the piezoelectric elements P to be supplied are transported. It is a positioning device that determines the position.
- the piezoelectric element supply device 10 is a uniaxial linear motion unit having a servomotor as an actuator and a ball screw unit as a linear motion mechanism.
- the piezoelectric element supply device 10 is arranged on the pedestal 2 with the direction in which the piezoelectric elements P are conveyed as viewed in the vertical direction being the X direction.
- the piezoelectric element supply device 10 has a tray mounting portion 10a on which the tray T is mounted.
- the piezoelectric element supply device 10 can move the tray mounting portion 10a to any position within the operating range according to the amount of rotation of the servomotor.
- the tray T is supplied from an external supply line (not shown) to the tray mounting portion 10a at the piezoelectric element standby position Wp.
- the tray T placed on the tray placement portion 10a can be transported to the piezoelectric element supply position Sp.
- the piezoelectric element supply position Sp in the piezoelectric element supply device 10 is determined in advance.
- the piezoelectric element supply device 10 places the piezoelectric element P to be supplied on the tray. Based on the position on the placement portion 10a, the stop position of the tray placement portion 10a is determined for each piezoelectric element P to be supplied. The piezoelectric element supply device 10 positions the piezoelectric element P to be supplied to the piezoelectric element supply position Sp based on the stop position determined for each piezoelectric element P to be supplied.
- the holding member supply device 11 is a device that conveys a plurality of holding members H connected in a sheet shape to the holding member supply position Sh and positions the holding member H to be supplied at the holding member supply position Sh.
- the holding member supply device 11 is a uniaxial linear motion unit having a servomotor as an actuator and a ball screw unit or the like as a linear motion mechanism.
- the holding member supply device 11 is arranged on the pedestal 2 with the direction of conveying the holding member H as viewed in the vertical direction being the X direction.
- the holding member supply device 11 is arranged at a position adjacent to the piezoelectric element supply device 10 on the pedestal 2 .
- the holding member supply device 11 has a holding member placing portion 11a on which a plurality of holding members H are placed.
- the holding member supply device 11 can move the holding member mounting portion 11a to any position within the operating range according to the amount of rotation of the servomotor.
- a plurality of holding members H are supplied from an external supply line (not shown) to the holding member mounting portion 11a at the holding member standby position Wh.
- the holding member supply device 11 can transport a plurality of holding members H placed on the holding member placement portion 11a to the holding member supply position Sh. Note that the holding member supply position Sh in the holding member supply device 11 is determined in advance.
- the holding member supply device 11 holds the holding member H to be supplied in order to position the holding member H at an arbitrary position among the plurality of holding members H arranged in a sheet shape at the holding member supply position Sh. Based on the position on the member mounting portion 11a, the stop position of the holding member mounting portion 11a is determined for each holding member H to be supplied. The holding member supply device 11 positions the holding member H to be supplied to the holding member supply position Sh based on the stop position determined for each holding member H to be supplied.
- the suction head moving device 12 is a device that moves a plurality of suction heads 20 simultaneously.
- the suction head moving device 12 is a one-axis linear motion unit having a servomotor as an actuator and a ball screw unit as a linear motion mechanism.
- the suction head moving device 12 is arranged on the pedestal 2 with the Y direction being the direction in which the plurality of suction heads 20 are conveyed when viewed in the vertical direction.
- the suction head moving device 12 is positioned above the piezoelectric element supply device 10 and the holding member supply device 11 in the vertical direction (Z direction).
- the suction head moving device 12 has a suction head placement section 12a on which a plurality of suction heads 20 are placed.
- the suction head mounting portion 12a has a horizontal mounting surface on which the plurality of suction heads 20 are mounted.
- the suction head moving device 12 can move the suction head placement section 12a to any position within the operating range according to the amount of rotation of the servomotor.
- the suction head moving device 12 reciprocates the plurality of suction heads 20 mounted on the mounting surface of the suction head mounting portion 12a from the piezoelectric element supply position Sp to the holding member supply position Sh.
- the suction head moving device 12 moves each piezoelectric element P to be supplied based on the position of the piezoelectric element P to be supplied on the tray mounting portion 10a. , the stop position of the suction head mounting portion 12a is determined. Similarly, the suction head moving device 12 moves the plurality of suction heads 20 to the holding member supply position Sh based on the position of the holding member H to be supplied on the holding member placement portion 11a. A stop position of the suction head mounting portion 12a is determined for each holding member H. As shown in FIG.
- the supply head moving device 13 is a device that moves a plurality of supply heads 30 simultaneously.
- the supply head moving device 13 is a uniaxial linear motion unit having a servomotor as an actuator and a ball screw unit or the like as a linear motion mechanism.
- the supply head moving device 13 is arranged on the pedestal 2 with the Y direction being the direction in which the plurality of supply heads 30 are conveyed when viewed in the vertical direction.
- the supply head moving device 13 is positioned above the holding member supply device 11 in the vertical direction (Z direction).
- the supply head moving device 13 has a supply head mounting portion 13a on which a plurality of supply heads 30 are mounted.
- the supply head mounting portion 13a has a horizontal mounting surface on which the plurality of supply heads 30 are mounted.
- the supply head moving device 13 can move the supply head placement section 13a to any position within the operating range according to the amount of rotation of the servomotor.
- the supply head moving device 13 can transport the plurality of supply heads 30 mounted on the supply head mounting portion 13a from the standby position W to the holding member supply position Sh.
- the supply head moving device 13 moves the holding member H to be supplied based on the position of the holding member H to be supplied on the holding member mounting portion 11a.
- a stop position of the supply head mounting portion 13a is determined for each member H. As shown in FIG.
- the suction head 20 is a device that sucks the piezoelectric element P with a suction nozzle 28 and arranges it in the concave portion of the holding member H.
- the suction head 20 includes a suction head horizontal movement mechanism 21 , a suction head vertical movement mechanism 24 , a suction head rotational movement mechanism 26 , and a suction nozzle 28 .
- the suction head horizontal movement mechanism 21 includes a plate-like first suction head moving member 22 that moves in a first direction, and a plate-like second suction head moving member 22 that moves in a second direction different from the first direction. and a moving member 23 .
- the suction head first moving member 22 is movable in the first direction by a stepping motor and a cam mechanism, which are actuators.
- the second suction head moving member 23 is movable in the second direction by a stepping motor and a cam mechanism, which are actuators.
- the suction head first moving member 22 is arranged on the suction head mounting portion 12 a of the suction head moving device 12 . At this time, the first suction head moving member 22 is arranged so that the first direction, which is the moving direction, is the X direction in the horizontal direction when viewed in the vertical direction. As a result, the first suction head moving member 22 can move in the X direction in the horizontal direction with respect to the suction head mounting portion 12a.
- the second suction head moving member 23 is arranged on the first suction head moving member 22 .
- the second suction head moving member 23 is arranged such that the second direction, which is the moving direction, is the Y direction orthogonal to the X direction in the horizontal direction when viewed in the vertical direction.
- the second suction head moving member 23 can move in the Y direction orthogonal to the X direction in the horizontal direction with respect to the first suction head moving member 22 .
- the suction head first moving member 22 can move the suction head second moving member 23 in the X direction in the horizontal direction with respect to the suction head mounting portion 12a. is.
- the suction head horizontal movement mechanism 21 can move the second suction head moving member 23 with respect to the first suction head moving member 22 in the Y direction orthogonal to the X direction in the horizontal direction.
- the suction head horizontal moving mechanism 21 can move the second suction head moving member 23 with respect to the suction head mounting portion 12a in the X direction in the horizontal direction and in the Y direction orthogonal to the X direction.
- the suction head vertical movement mechanism 24 includes a plate-like suction head third movement member 25 that moves in a direction perpendicular to the first direction and the second direction, which are the moving directions of the suction head horizontal movement mechanism 21 .
- the suction head third moving member 25 can be moved in the third direction by a servomotor as an actuator and a ball screw unit as a linear motion mechanism.
- the suction head third moving member 25 is mounted on the suction head second moving member 23 . At this time, the suction head third moving member 25 is arranged so that the third movement direction is the Z direction. As a result, the third suction head moving member 25 can move in the X direction and the Y direction in the horizontal direction with respect to the suction head mounting portion 12a, and in the Z direction, which is the vertical direction.
- the suction head rotary movement mechanism 26 has a cylindrical suction head fourth moving member 27 that moves (rotates) around an axis extending in a third direction, which is the movement direction of the suction head vertical movement mechanism 24 .
- the fourth suction head moving member 27 can be moved in the rotational direction by a stepping motor or the like, which is an actuator.
- the suction head fourth moving member 27 is mounted on the suction head rotary movement mechanism 26 . At this time, the suction head fourth moving member 27 is arranged so that the third direction, which is the rotation axis, is the Z direction. That is, the suction head fourth moving member 27 is rotatable in the ⁇ direction, which is the direction of rotation about the vertical axis. As a result, the fourth suction head moving member 27 can move in the X direction and the Y direction in the horizontal direction with respect to the suction head mounting portion 12a, can move in the Z direction which is the vertical direction, and can rotate in the ⁇ direction. It is possible.
- the suction nozzle 28 is a nozzle that sucks the piezoelectric element P in the concave portion C of the tray T.
- the suction nozzle 28 is mounted on the fourth moving member 27 for suction head.
- the suction nozzle 28 is arranged at the lower end portion of the fourth moving member 27 for suction head.
- the suction nozzle 28 has a lower end shape capable of sucking the piezoelectric element P.
- the suction nozzle 28 has a suction hole at its lower end. The suction nozzle 28 sucks the piezoelectric element P by reducing the pressure inside the suction hole to a negative pressure in a state where the suction hole is blocked by the piezoelectric element P. As shown in FIG.
- the suction nozzle 28 arranged on the fourth suction head moving member 27 is movable in the X direction and the Y direction in the horizontal direction with respect to the suction head mounting portion 12a, and is movable in the Z direction, which is the vertical direction. It is rotatable in the ⁇ direction.
- the suction head horizontal movement mechanism 21, the suction head vertical movement mechanism 24, and the suction head rotary movement mechanism 26, which constitute the suction head 20, each have a servomotor as an actuator for each movement direction.
- the suction head horizontal movement mechanism 21, the suction head vertical movement mechanism 24, and the suction head rotary movement mechanism 26 are not configured to be interlocked with each other. That is, the suction head horizontal movement mechanism 21, the suction head vertical movement mechanism 24, and the suction head rotary movement mechanism 26 can move independently of each other in their respective movement directions.
- the piezoelectric vibration device manufacturing apparatus 1 has a plurality of suction heads 20.
- the piezoelectric vibration device manufacturing apparatus 1 has four suction heads 20, for example.
- the four suction heads 20 are mounted on the suction head mounting portion 12 a of the suction head moving device 12 .
- the four suction heads 20 can be simultaneously moved between the piezoelectric element supply position Sp and the holding member supply position Sh by the suction head moving device 12 .
- the movable parts of the four suction heads 20 are not connected to each other. That is, the suction nozzles 28 of the four suction heads 20 are independently movable in the X direction, Y direction, Z direction and ⁇ direction while being mounted on the suction head mounting portion 12a.
- Two suction heads 20 are arranged side by side in the X direction. Two suction heads 20 are arranged side by side in the X direction, and one suction head 20 is arranged side by side in the Y direction. That is, the four suction heads 20 are arranged in a matrix in the X direction and the Y direction.
- the suction nozzles 28 of the suction head 20 arranged in the X direction are arranged at an interval of A times, which is an integral multiple of the interval Px between the recess C provided on the tray T and the sheet-shaped holding member H. .
- the suction nozzles 28 of the suction head 20 arranged in the Y direction are arranged so as to be spaced B times, which is an integral multiple of the space Py between the recess C provided on the tray T and the sheet-like holding member H. .
- the four suction heads 20 can each suck one piezoelectric element P positioned on the tray T with each suction nozzle 28 at the piezoelectric element supply position Sp.
- the four suction heads 20 have an arbitrarily selected piezoelectric element P, an A-th piezoelectric element P in the X direction from the arbitrarily selected piezoelectric element P, and an Ath piezoelectric element P from the arbitrarily selected piezoelectric element P in the Y direction. It is possible to suck the Bth piezoelectric element P and the Ath piezoelectric element P in the X direction and the Bth piezoelectric element P in the Y direction from the arbitrarily selected piezoelectric element P, respectively.
- the four suction heads 20 can arrange the piezoelectric elements P sucked by the respective suction nozzles 28 one by one in the recess of the holding member H at the holding member supply position Sh.
- the four suction heads 20 include an arbitrarily selected holding member H, an A-th holding member H in the X direction from the arbitrarily selected holding member H, and an Ath holding member H in the Y direction from the arbitrarily selected holding member H. From the B-th holding member H and the arbitrarily selected holding member H, the A-th holding member H in the X direction and the B-th holding member H in the Y direction can be sucked.
- the supply head 30 is a device that supplies the bonding material into the concave portions of the plurality of sheet-like holding members H. As shown in FIG. The supply head 30 has a supply head horizontal movement mechanism 31 , a supply head vertical movement mechanism 34 , and a supply device 36 .
- the supply head horizontal movement mechanism 31 has a first supply head moving member 32 that moves in a first direction and a second supply head moving member 33 that moves in a second direction different from the first direction. .
- the supply head first moving member 32 is movable in the first direction by a stepping motor and a cam mechanism, which are actuators.
- the supply head second moving member 33 is movable in the second direction by a stepping motor and a cam mechanism, which are actuators.
- the supply head first moving member 32 is arranged on the supply head mounting portion 13 a of the supply head moving device 13 . At this time, the first moving member 32 for the supply head is arranged so that the first direction, which is the moving direction, is the X direction when viewed in the vertical direction. As a result, the first supply head moving member 32 can move in the X direction in the horizontal direction with respect to the supply head mounting portion 13a.
- the second supply head moving member 33 is arranged on the first supply head moving member 32 .
- the second supply head moving member 33 is arranged such that the second direction, which is the moving direction, is the Y direction orthogonal to the X direction in the horizontal direction when viewed in the vertical direction. Thereby, the second supply head moving member 33 can move in the Y direction in the horizontal direction with respect to the first supply head moving member 32 .
- the supply head first movement member 32 can move the supply head second movement member 33 in the X direction in the horizontal direction with respect to the supply head mounting portion 13a. is.
- the supply head horizontal movement mechanism 31 can move the second supply head movement member 33 with respect to the first supply head movement member 32 in the Y direction orthogonal to the X direction in the horizontal direction. That is, the supply head horizontal movement mechanism 31 can move the second supply head moving member 33 with respect to the supply head mounting portion 13a in the X direction in the horizontal direction and in the Y direction orthogonal to the X direction.
- the supply head vertical movement mechanism 34 includes a plate-shaped third supply head movement member 35 that moves in a direction perpendicular to the first direction and the second direction, which are the movement directions of the supply head horizontal movement mechanism 31 .
- the third supply head moving member 35 can be moved in the third direction by a servomotor as an actuator and a ball screw unit as a linear motion mechanism.
- the third supply head moving member 35 is arranged on the second supply head moving member 33 . At this time, the third supply head moving member 35 is arranged so that the third direction, which is the moving direction, is the Z direction. As a result, the third supply head moving member 35 can move in the horizontal X and Y directions and in the vertical Z direction with respect to the supply head mounting portion 13a.
- the supply device 36 is a device that supplies the bonding material into the concave portion of the holding member H in which the piezoelectric element P is arranged.
- the supply device 36 is a discharge device that discharges a predetermined amount of conductive adhesive in this embodiment.
- the supply device 36 is arranged on the third moving member 35 for the supply head.
- the supply device 36 has a discharge nozzle 36a having a shape capable of supplying the bonding material into the concave portion of the holding member H below in the vertical direction (Z direction).
- the supply device 36 discharges the bonding material downward in the vertical direction (Z direction) from the discharge nozzle 36a when viewed in the horizontal direction. Further, the discharge nozzle 36a is configured to be movable in the Z direction when it contacts the holding member H from the Z direction.
- the supply device 36 mounted on the third supply head moving member 35 is movable in the X direction and the Y direction in the horizontal direction with respect to the supply head mounting portion 13a, and is movable in the Z direction, which is
- the supply device 36 also has a cooling device 36b.
- the cooling device 36b is composed of a Peltier element, which is a semiconductor thermoelectric element, and an air-cooling fan for cooling the Peltier element.
- the cooling device 36b is positioned near the discharge nozzle 36a.
- the cooling device 36b maintains the temperature of the bonding material in the supply device 36 at an appropriate temperature. As a result, since the viscosity of the bonding material inside the supply device 36 is maintained within a certain range, clogging of the bonding material in the discharge nozzle 36a can be suppressed.
- the supply device 36 also has a contact sensor (not shown) that detects the position of the discharge nozzle 36a in the Z direction.
- the contact sensor is a sensor that detects movement of the ejection nozzle 36a in the Z direction. Therefore, the contact sensor can detect that the tip of the ejection nozzle 36a contacts the holding member H.
- the control device 16 which will be described later, controls the supply device 36 with the position of the third supply head moving member 35 when the contact sensor detects contact between the discharge nozzle 36a and the holding member H as the zero point.
- the contact sensor is arranged closer to the supply device 36 than the Z-direction guide device (not shown) of the third supply head moving member 35 .
- the contact sensor is arranged on the Z-axis of the discharge nozzle 36a.
- the supply head horizontal movement mechanism 31 and the supply head vertical movement mechanism 34 that constitute the supply head 30 have servo motors as actuators for each movement direction. Further, the supply head horizontal movement mechanism 31 and the supply head vertical movement mechanism 34 are not configured to be interlocked with each other. That is, the supply head horizontal movement mechanism 31 and the supply head vertical movement mechanism 34 can move independently of each other.
- the piezoelectric vibration device manufacturing apparatus 1 has multiple supply heads 30 .
- the piezoelectric vibration device manufacturing apparatus 1 has four supply heads 30, for example.
- the four supply heads 30 are arranged on the supply head placement section 13 a of the supply head moving device 13 . Thereby, the four supply heads 30 are configured to be simultaneously movable between the standby position W and the holding member supply position Sh by the supply head moving device 13 .
- the movable parts of the four supply heads 30 are not connected to each other. That is, the supply devices 36 of the four supply heads 30 are independently movable in the X direction, the Y direction, and the Z direction while being mounted on the supply head mounting portion 13a.
- Two supply heads 30 are arranged side by side in the X direction.
- two supply heads 30 are arranged side by side in the X direction, and one supply head 30 is arranged side by side in the Y direction. That is, the four supply heads 30 are arranged in a matrix in the X direction and the Y direction.
- the ejection nozzles 36a of the supply device 36 of the supply head 30 arranged in the X direction are arranged at intervals of A times, which is an integral multiple of the interval Px of the sheet-shaped holding members H.
- the ejection nozzles 36a of the supply device 36 of the supply head 30 arranged in the Y direction are arranged at intervals of B times, which is an integer multiple of the interval Py of the sheet-like holding members H.
- a confirmation camera 37 for confirming the application diameter of the bonding material dumped by the supply device 36 is mounted on the supply head mounting portion 13a. Further, at a waiting position W described later, below the supply device 36, a dumping unit 38 is arranged for the feeding device 36 to dump balls.
- the four supply heads 30 are moved by the supply head moving device 13 and the supply head horizontal movement mechanism 31 when supplying the bonding material to the holding member H at the holding member supply position Sh.
- the bonding material can be supplied to the holding member H by each supply device 36 without moving the position of .
- the four supply heads 30 include an arbitrarily selected holding member H, an A-th holding member H from the arbitrarily selected holding member H in the X direction, and an Ath holding member H from the arbitrarily selected holding member H in the Y direction.
- the bonding material can be supplied from the B-th holding member H and the arbitrarily selected holding member H to the A-th holding member H in the X direction and the B-th holding member H in the Y direction.
- the camera 14 which is a piezoelectric element position measuring device, is a camera that measures the positions of the piezoelectric elements P sucked by the four suction nozzles 28 with respect to the suction head 20.
- FIG. The camera 14 is located on the pedestal 2 and below the suction head moving device 12 in the vertical direction.
- the camera 14 is arranged at a position overlapping the suction head 20 moved by the suction head moving device 12 when viewed in the vertical direction.
- the camera 14 is installed so as to photograph vertically upward. Thereby, the camera 14 can photograph the suction head 20 moved by the suction head moving device 12 and the piezoelectric elements P that the suction head 20 is sucking from below the suction head 20 . That is, the camera 14 can capture images for measuring the positions of the piezoelectric elements P sucked by the four suction nozzles 28 with respect to the suction head 20 .
- the laser measuring device 15 which is a holding member position measuring device, is a measuring device that measures the shape including the positions of a plurality of holding members H connected in a sheet shape.
- the laser measuring device 15 is located on the pedestal 2 and above the holding member supply device 11 in the vertical direction. Further, the laser measuring device 15 is arranged at a position overlapping the sheet-shaped holding member H conveyed by the holding member supplying device 11 when viewed in the vertical direction. Also, the laser measuring device 15 is installed so as to irradiate the laser downward in the vertical direction. Thereby, the laser measuring device 15 can measure the sheet-shaped holding member H supplied to the holding member supply device 11 from above the holding member H.
- the laser measuring device 15 can three-dimensionally measure the shape based on the shape, position, and thickness information of each part in the vertical direction of each of the plurality of holding members H connected in a sheet shape.
- the laser measuring device 15 is configured to be rotatable and horizontally movable so as to match the position and degree of rotation of each holding member H in the horizontal direction. Thereby, the shape including the position of the holding member can be measured more accurately by laser scanning.
- the control device 16 includes a piezoelectric element supply device 10, a holding member supply device 11, a suction head moving device 12, a supply head moving device 13, a suction head 20, a supply head 30, a camera 14, and a laser measuring device. 15 is controlled.
- the control device 16 is substantially connected with a CPU, a ROM, a RAM, and the like via a bus. Alternatively, the control device 16 may be configured by a one-chip LSI or the like.
- the control device 16 stores various programs and data for controlling the operation of each actuator, camera 14 and laser measuring device 15 and for processing image data.
- the control device 16 is electrically connected to each servo motor of the piezoelectric element supply device 10, the holding member supply device 11, the suction head moving device 12, and the supply head moving device 13, and can be controlled independently of each other. Further, the control device 16 is electrically connected to the servo motors of the suction head horizontal movement mechanism 21, the suction head vertical movement mechanism 24, and the suction head rotation movement mechanism 26 of the suction head 20, and each of them is independently and individually controlled. Controllable. The control device 16 can also control an electromagnetic valve for switching suction of the suction head 20 (not shown). The control device 16 is electrically connected to the servo motors of the supply head horizontal movement mechanism 31 and the supply head vertical movement mechanism 34, and can be controlled independently of each other. Also, the control device 16 is electrically connected to the four supply devices 36 and can be controlled independently of each other.
- the control device 16 is electrically connected to the camera 14 and can control the camera 14 . Also, the control device 16 can acquire an image captured by the camera 14 . Also, the control device 16 is electrically connected to the laser measurement device 15 and can control the laser measurement device 15 . In addition, the control device 16 can obtain measurement values of the positions and shapes of the plurality of holding members H measured by the laser measurement device 15 .
- the piezoelectric vibration device manufacturing apparatus 1 configured in this manner has a plurality of suction heads 20 each capable of independently and individually moving suction nozzles 28 in the X, Y, Z, and ⁇ directions. Furthermore, the piezoelectric vibration device manufacturing apparatus 1 can independently control the positions of the suction nozzles 28 in the plurality of suction heads 20 . In addition, the piezoelectric vibration device manufacturing apparatus 1 has a plurality of supply heads 30 capable of independently and individually moving the bonding material supply device 36 in the X direction, the Y direction and the Z direction. Furthermore, the piezoelectric vibration device manufacturing apparatus 1 can independently and individually control the positions of the supply devices 36 in the plurality of supply heads 30 .
- the suction nozzles 28 of the four suction heads 20 are spaced A times the space Px in the X direction and B times the space Py in the Y direction. Therefore, the first suction head 20 among the four suction heads 20 is the first piezoelectric element housed in the recess C at an arbitrary position among the plurality of recesses C on the tray T housing the piezoelectric element P. Adsorb P1. Of the four suction heads 20, the second suction head 20 sucks the second piezoelectric element P2 housed in the recess C that is A adjacent in the X direction from the recess C housing the first piezoelectric element P1. .
- the third suction head 20 sucks the third piezoelectric element P3 housed in the recess C that is B adjacent in the Y direction from the recess C housing the first piezoelectric element P1. .
- the fourth suction head 20 is housed in a recess C which is A in the X direction and B in the Y direction from the recess C housing the first piezoelectric element P1. The piezoelectric element P4 is sucked.
- the piezoelectric element P housed in the recess C adjacent in the X direction from the recess C housing the first piezoelectric element P1, the first The piezoelectric element P accommodated in the concave portion C adjacent in the X direction from the concave portion C in which the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 are respectively accommodated is sucked. It is sucked as the target piezoelectric element P.
- the four suction heads 20 are arranged in a plurality of recesses C on the tray T from the recesses C housing the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3 and the fourth piezoelectric element P4. From the range up to (A ⁇ 1) adjacent recesses C in the X direction and the recesses C housing the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 The piezoelectric elements P housed in the recesses C included in the four areas surrounded by the range up to the (B ⁇ 1) adjacent recesses C in the Y direction are respectively sucked.
- the first suction head 20 sucks the piezoelectric element P within the first piezoelectric element region Rp1 including the recess C in which the first piezoelectric element P1 is accommodated.
- the second suction head 20 sucks the piezoelectric element P within the second piezoelectric element region Rp2 including the recess C in which the second piezoelectric element P2 is accommodated.
- the third suction head 20 sucks the piezoelectric element P within the third piezoelectric element region Rp3 including the recess C in which the third piezoelectric element P3 is accommodated.
- the fourth suction head 20 sucks the piezoelectric element P within the fourth piezoelectric element region Rp4 including the recess C in which the fourth piezoelectric element P4 is accommodated. In this manner, each of the suction heads 20 sucks the piezoelectric elements P included in the regions of the same shape in the number corresponding to the number of the suction heads 20 .
- the second suction head 20 sucking the second piezoelectric element P2 is placed in the concave portion of the second holding member H2, which is the holding member H adjacent to the first holding member H1 in the X direction by A pieces. to place.
- the third suction head 20 sucking the third piezoelectric element P3 is placed in the concave portion of the third holding member H3, which is the holding member H adjacent to the first holding member H1 by B pieces in the Y direction. to place.
- the fourth suction head 20 sucking the fourth piezoelectric element P4 is placed in the concave portion of the fourth holding member H4, which is the holding member H adjacent to A in the X direction and B in the Y direction from the first holding member H1.
- a fourth piezoelectric element P4 is arranged.
- each holding member H holds the piezoelectric element P.
- the piezoelectric element P When the piezoelectric element P is arranged on the holding member H adjacent in the X direction from the first holding member H1 on which the first piezoelectric element P1 is arranged, the four suction heads 20 are arranged in the first holding member H1 and the second holding member.
- the piezoelectric element P is arranged on the holding member H that is adjacent in the X direction from H2, the third holding member H3, and the fourth holding member H4.
- the piezoelectric element P When the piezoelectric element P is arranged in the concave portion of the holding member H adjacent in the Y direction from the first holding member H1 in which the first piezoelectric element P1 is arranged, the four suction heads 20 are arranged in the first holding member H1, the The piezoelectric element P is arranged in the concave portion of the holding member H which is adjacent in the Y direction from the second holding member H2, the third holding member H3 and the fourth holding member H4.
- the four suction heads 20 are arranged in the X direction from the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4 in the plurality of holding members H connected in a sheet shape.
- the piezoelectric elements P are arranged in the recesses of the holding member H included in the four regions surrounded by the range up to the adjacent holding member H, respectively. That is, the first suction head 20 arranges the first piezoelectric element P1 in the concave portion of the holding member H within the first holding member region Rh1 including the first holding member H1.
- the second suction head 20 arranges the second piezoelectric element P2 in the concave portion of the holding member H within the second holding member region Rh2 including the second holding member H2.
- the third suction head 20 arranges the third piezoelectric element P3 in the concave portion of the holding member H within the third holding member region Rh3 including the third holding member H3.
- the fourth suction head 20 arranges the fourth piezoelectric elements P4 in the recesses of the holding member H in the fourth holding member region Rh4 including the fourth holding member H4. In this way, each of the suction heads 20 arranges the piezoelectric elements P in the concave portions of the holding member H included in the regions of the same shape in the number corresponding to the number of the suction heads 20 .
- the piezoelectric element P sucked by the suction head 20 from the concave portion C at an arbitrary position in the first piezoelectric element region Rp1 is moved to the first piezoelectric element P in which the sucked piezoelectric element P is accommodated in the first holding member region Rh1.
- the first holding member region Rh1 and the first piezoelectric element region Rp1 have the same shape.
- the second holding member region Rh2 and the second piezoelectric element region Rp2 have the same shape.
- the third holding member region Rh3 and the third piezoelectric element region Rp3 have the same shape.
- the fourth holding member region Rh4 and the fourth piezoelectric element region Rp4 have the same shape. That is, the arrangement of the holding members H in the first holding member region Rh1 to the fourth holding member region Rh4 is the same as the arrangement of the piezoelectric elements P in the first piezoelectric element region Rp1 to the fourth piezoelectric element region Rp4.
- FIG. 7 is a plan view schematically showing a state in which the plurality of suction heads 20 of the piezoelectric vibration device manufacturing apparatus 1 convey the piezoelectric element P to the holding member supply position Sh.
- FIG. 8 is a plan view schematically showing a state in which the positions of the suction nozzles 28 of the plurality of suction heads 20 of the piezoelectric vibration device manufacturing apparatus 1 are adjusted.
- the control device 16 provides information on the position of the holding member supply device 11, information on the position of the suction head moving device 12, information on the position of the supply head moving device 13, information on the position of the camera 14, and information on the position of the laser measuring device 15. , information on the position of the suction head 20 and information on the position of the supply head 30 .
- the control device 16 measures the shape of a plurality of sheet-like holding members H conveyed by the holding member supply device 11 using the laser measuring device 15 . At this time, the control device 16 acquires the measured values of the shapes of the plurality of sheet-like holding members H measured by the laser measuring device 15 . After acquiring the measured value of the shape of the holding member H, the control device 16 causes the holding member supply device 11 to convey the plurality of sheet-like holding members H to the holding member supply position Sh.
- the control device 16 calculates the measured values of the holding members H based on the acquired measurement values of the holding members H and the conveying positions of the holding members H in the holding member supply device 11 when the laser measuring device 15 measured the holding members H.
- H(n) (x0, y0, z0, ⁇ 0) which are coordinate values for the center position in the X, Y, and Z directions and the ⁇ direction, which is the orientation of the longitudinal direction, are calculated.
- (n) is the number of the holding member H.
- the control device 16 stores H(n) (x0n, y0n, z0n, ⁇ 0n), which are the measured coordinate values of the holding member H, as information Ih regarding the position of the holding member H.
- the control device 16 selects the first piezoelectric element P1 to the fourth piezoelectric element P4 among the plurality of holding members H based on the bonding order of the piezoelectric elements P predetermined in the plurality of holding members H.
- the holding member supply device 11 is controlled so that the first holding member H1 to the fourth holding member H4 are conveyed to the holding member supply position Sh.
- the control device 16 calculates coordinate values H1 (x11, y11, z11, ⁇ 11) at the holding member supply position Sh of the first holding member H1 to the fourth holding member H4. , H2 (x12, y12, z12, ⁇ 12), H3 (x13, y13, z13, ⁇ 13), H4 (x14, y14, z14, ⁇ 14).
- the control device 16 operates the suction head moving device 12 so that the four suction heads 20 that have respectively suctioned the four piezoelectric elements P from the first piezoelectric element P1 to the fourth piezoelectric element P4 are transported to the holding member supply position Sh. Control.
- the control device 16 controls the camera 14 so as to photograph the first to fourth piezoelectric elements P1 to P4 sucked by the sucking nozzles 28 of the four sucking heads 20 from below.
- the control device 16 acquires the image captured by the camera 14.
- the control device 16 detects the suction head 20 and the first to fourth piezoelectric elements P1 to P4 sucked by the suction nozzle 28 from the acquired image.
- the control device 16 determines the detected suction head 20 and the first to fourth piezoelectric elements P1 to P4 sucked by the suction nozzle 28, and the transfer position of the suction head 20 in the suction head moving device 12 when the image is captured.
- coordinate values P1 (x01, y01, ⁇ 01), P2 (x02, y02, ⁇ 02), P3 (x03, y03, ⁇ 03), and P4 (x04, y04, ⁇ 04) are calculated respectively.
- the control device 16 controls coordinate values H1 (x11, y11, ⁇ 11), H2 (x12, y12) in the X direction, Y direction, and ⁇ direction at the holding member supply position Sh from the first holding member H1 to the fourth holding member H4.
- the first to fourth piezoelectric elements P1 to P4 sucked by the suction nozzle 28 at the holding member supply position Sh Information on the position of the piezoelectric element P is calculated by calculating coordinate values P1 (x11, y11, ⁇ 11), P2 (x12, y12, ⁇ 12), P3 (x13, y13, ⁇ 13), and P4 (x14, y14, ⁇ 14). Store as Ip.
- the control device 16 converts P1 (x11, y11, ⁇ 11), which is the coordinate value of the first piezoelectric element P1 at the holding member supply position Sh, to H1, which is the coordinate value of the corresponding first holding member H1 at the holding member supply position Sh.
- control device 16 controls the coordinate values P2 (x12, y12, ⁇ 12), P3 (x13, y13, ⁇ 13), P4 of the second piezoelectric element P2 to the fourth piezoelectric element P4 at the holding member supply position Sh.
- the control device 16 controls the calculated adjustment amounts of the four suction nozzles 28 in the X, Y, and ⁇ directions and the movement amounts in the Z direction Ap1 (x11, y11, z11, ⁇ 11), Based on Ap2 (x11, y11, z11, ⁇ 11), Ap3 (x13, y13, z13, ⁇ 13), and Ap4 (x14, y14, z14, ⁇ 14), the horizontal position and inclination of the suction nozzle 28 are determined by the suction head 20 In order to adjust each of the suction heads 20 independently and individually, the suction head horizontal movement mechanism 21 and the suction head rotary movement mechanism 26 of each suction head 20 are controlled.
- the control device 16 controls the respective It controls the vertical movement mechanism 24 for the suction head of the suction head 20 . That is, based on the information Ip about the position of the piezoelectric element P and the information Ih about the position of the holding member H, the control device 16 adjusts the position of the suction nozzle 28 by adjusting the suction head horizontal position of each suction head 20 . At least one of the moving mechanism 21, the vertical moving mechanism 24 for the suction head, and the rotary moving mechanism 26 for the suction head is controlled.
- the control device 16 controls the supply head moving device 13 to transport the four supply heads 30 to the holding member supply position Sh.
- the control device 16 receives information about the position of the supply head 30 and coordinate values H1 (x11, y11, z11, ⁇ 11), H2 (x12 , y12, z12, ⁇ 12), H3 (x13, y13, z13, ⁇ 13), and H4 (x14, y14, z14, ⁇ 14) are the coordinate values of the four discharge nozzles 36a at the holding member supply position Sh.
- J1 (x11, y11), J2 (x12, y12), J3 (x13, y13), and J4 (x14, y14) are calculated and stored as information about the position of the bonding material.
- the control device 16 converts J1 (x11, y11), which is the coordinate value at the holding member supply position Sh of one of the four supply devices 36, to the coordinate value at the holding member supply position Sh of the corresponding first holding member H1.
- Aj1 (x11, y11, z11) which is the amount of adjustment in the X, Y, and ⁇ directions and the amount of movement in the Z direction of the discharge nozzle 36a necessary to match H1 (x11, y11, z11, ⁇ 11). do.
- the controller 16 sets coordinate values J2 (x12, y12), J3 (x13, y13), and J4 (x14, y14) at the holding member supply position Sh of the other three discharge nozzles 36a to H2 (x12, y12, z12, ⁇ 12), H3 (x13, y13, z13, ⁇ 13), H4 (x14, Aj2 (x12, y12, z12) and Aj3 (x13, y13, z13), which are the amount of adjustment in the X and Y directions and the amount of movement in the Z direction of the ejection nozzle 36a necessary to match the ejection nozzle 36a with y14, z14, ⁇ 14). , Aj4(x14, y14, z14).
- the controller 16 controls the calculated adjustment amounts of the four suction nozzles 28 in the X, Y, and ⁇ directions and the movement amounts in the Z direction, Aj1 (x11, y11, z11), Aj2 (x12, y12, z12), Based on Aj3 (x13, y13, z13) and Aj4 (x14, y14, z14), in order to adjust the horizontal position of the ejection nozzle 36a independently for each supply head 30, each supply head 30 to control the supply head horizontal movement mechanism 31 of .
- control device 16 controls each supply head 30 based on Aj1 (x11, y11, z11), Aj2 (x12, y12, z12), Aj3 (x13, y13, z13), and Aj4 (x14, y14, z14).
- the supply head vertical movement mechanism 34 of each supply head 30 is controlled. That is, based on the information Ip about the position of the piezoelectric element P and the information Ih about the position of the holding member H, the control device 16 adjusts the position of each of the supply heads 30 to adjust the position of the supply head 30 . At least one of the moving mechanism 31 and the supply head vertical moving mechanism 34 is controlled.
- FIG. 9 is a flowchart of the piezoelectric element mounting step S100 included in the manufacturing method of the piezoelectric vibration device.
- FIG. 10 shows the operation of the piezoelectric vibration device manufacturing apparatus 1 in the holding member position information acquiring step S110, the piezoelectric element supplying step S120, the holding member supplying step S125, the piezoelectric element positioning step S130, and the holding member positioning step S135 in the piezoelectric element mounting step S100. It is a top view which shows a state.
- FIG. 10 shows the operation of the piezoelectric vibration device manufacturing apparatus 1 in the holding member position information acquiring step S110, the piezoelectric element supplying step S120, the holding member supplying step S125, the piezoelectric element positioning step S130, and the holding member positioning step S135 in the piezoelectric element mounting step S100. It is a top view which shows a state.
- FIG. 10 shows the operation of the piezoelectric vibration device manufacturing apparatus 1 in the holding member position information acquiring step
- FIG. 11 is a plan view showing the operating state of the piezoelectric vibration device manufacturing apparatus 1 in the bonding material supply position adjustment step S140 and the bonding material supply step S150 in the piezoelectric element mounting step S100.
- FIG. 12 is a plan view showing the operating state of the piezoelectric vibration device manufacturing apparatus 1 in the piezoelectric element transfer step S160, the piezoelectric element position information acquisition step S170, the piezoelectric element position adjustment step S180, and the piezoelectric element bonding step S190 in the piezoelectric element mounting step S100. is.
- the piezoelectric element mounting step S100 includes a holding member position information acquiring step S110, a piezoelectric element supplying step S120, a holding member supplying step S125, a piezoelectric element positioning step S130, and a holding member positioning step S135. , a bonding material supply position adjusting step S140, a bonding material supplying step S150, a piezoelectric element transporting step S160, a piezoelectric element position information acquiring step S170, a piezoelectric element position adjusting step S180, and a piezoelectric element bonding step S190. ing.
- the piezoelectric element supplying apparatus 10 is supplied with a tray T containing a plurality of piezoelectric elements P on the tray mounting portion 10a from an external supply line (not shown). Further, in the holding member supply device 11, a plurality of sheet-like holding members H are supplied from an external supply line (not shown) to the holding member mounting portion 11a (see FIG. 1).
- the holding member position information acquisition step S110 is a step of acquiring information Ih regarding the positions of the plurality of holding members H.
- the laser measurement device 15 measures the shapes of the plurality of holding members H while moving the plurality of holding members H by the holding member supply device 11 .
- Laser measurement device 15 transmits the measured values to control device 16 .
- the piezoelectric element mounting step S100 proceeds to the piezoelectric element supplying step S120 after the holding member position information acquisition step S110 is completed.
- the piezoelectric element supplying step S120 is a step of supplying the piezoelectric element P to be mounted on the holding member H among the plurality of piezoelectric elements P accommodated in the tray T to the piezoelectric element supplying position Sp.
- the piezoelectric element supply device 10 piezoelectrically feeds a target piezoelectric element P out of the plurality of piezoelectric elements P accommodated in the tray T on the tray mounting portion 10a by the tray mounting portion 10a.
- the substrate is transported from the element standby position Wp to the transport reference position of the piezoelectric element supply position Sp.
- the piezoelectric element mounting step S100 proceeds to the holding member supply step S125.
- the holding member supply step S125 is a step of supplying the holding member H on which the piezoelectric element P is arranged among the plurality of holding members H to the holding member supply position Sh.
- the holding member supply device 11 moves the target holding member H out of the plurality of holding members H on the holding member placement portion 11a from the holding member standby position Wh by the holding member placement portion 11a. It is transported to the transport reference position of the holding member supply position Sh.
- the piezoelectric element mounting step S100 proceeds to the piezoelectric element positioning step S130.
- the piezoelectric element positioning step S130 is a step of positioning the piezoelectric element P to be joined to the holding member H among the plurality of piezoelectric elements P transported to the transport reference position of the piezoelectric element supply position Sp.
- the piezoelectric element supply device 10 moves a target piezoelectric element P out of a plurality of piezoelectric elements P accommodated in a tray T at a transfer reference position of the piezoelectric element supply position Sp to the piezoelectric element supply position Sp by the tray mounting portion 10a. position.
- the piezoelectric element mounting step S100 proceeds to the holding member positioning step S135.
- the holding member positioning step S135 is a step of positioning the holding member H to which the piezoelectric element P is to be joined among the plurality of holding members H transported to the transport reference position of the holding member supply position Sh.
- the holding member supply device 11 positions the target holding member H among the plurality of holding members H at the conveyance reference position of the holding member supply position Sh by the holding member placement portion 11a at the holding member supply position Sh.
- the piezoelectric element mounting step S100 proceeds to the bonding material supply position adjusting step S140.
- the bonding material supply position adjusting step S140 is a process of adjusting the position of the supply device 36 that supplies the bonding material.
- the supply head moving device 13 transports the supply head 30 from the standby position W to the holding member supply position Sh.
- the supply head horizontal movement mechanism 31 of each supply head 30 moves the ejection nozzle 36a in the horizontal direction based on the adjustment amount of the ejection nozzle 36a of each supply device 36 calculated by the control device 16 in the X direction and the Y direction.
- the position is individually adjusted for each delivery head 30 independently.
- the piezoelectric element mounting step S100 proceeds to the bonding material supply step S150 after the bonding material supply position adjustment step S140 is completed.
- the bonding material supplying step S150 is a step of supplying the bonding material into the concave portion of the holding member H.
- the supply head vertical movement mechanism 34 of each supply head 30 moves the supply head 30 based on the movement amount in the Z direction of the ejection nozzle 36a of each supply device 36 calculated by the control device 16. Each time, the supply device 36 is independently moved vertically downward.
- the supply device 36 supplies the bonding material into the concave portion of the holding member H.
- the supply head vertical movement mechanism 34 of each supply head 30 moves the supply device 36 vertically upward when the supply of the bonding material is completed.
- the supply head moving device 13 conveys the supply head 30 from the holding member supply position Sh to the standby position W.
- the piezoelectric element mounting step S100 proceeds to the piezoelectric element transporting step S160 after the bonding material supply step S150 is completed.
- the piezoelectric element transfer step S160 is a step of transferring the piezoelectric element P to be placed on the holding member H from the piezoelectric element standby position Wp to the holding member supply position Sh.
- the vertical movement mechanism 24 for the suction head of each suction head 20 moves the suction nozzle 28 vertically downward at the piezoelectric element supply position Sp.
- Each suction head 20 sucks the piezoelectric element P from the tray T with the suction nozzle 28 .
- the suction head vertical movement mechanism 24 of each suction head 20 moves the suction nozzle 28 vertically upward at the piezoelectric element supply position Sp.
- the suction head moving device 12 conveys the suction head 20 to the holding member supply position Sh.
- the piezoelectric element mounting step S100 proceeds to the piezoelectric element position information acquiring step S170.
- the piezoelectric element position information acquisition step S170 is a process of acquiring information Ip regarding the position of the piezoelectric element P that has been sucked.
- the camera 14 photographs the suction head 20 being transported by the suction head moving device 12 and the piezoelectric element P sucked by the suction nozzle 28 .
- Camera 14 transmits the captured image to control device 16 .
- the piezoelectric element mounting step S100 proceeds to the piezoelectric element position adjusting step S180.
- the piezoelectric element position adjustment step S180 is a step of adjusting the position of the suction nozzle 28.
- the suction head horizontal movement mechanism 21 and the suction head rotary movement mechanism 26 of each suction head 20 move in the X direction, Y direction and ⁇ direction of each suction nozzle 28 calculated by the controller 16.
- the horizontal position and orientation of the suction nozzle 28 are individually adjusted for each suction head 20 based on the adjustment amount of the direction (see FIGS. 7 and 8).
- the piezoelectric element mounting step S100 proceeds to the piezoelectric element bonding step S190 after the piezoelectric element position adjustment step S180 is completed.
- the piezoelectric element bonding step S190 is a step of arranging the piezoelectric element P in the recess of the holding member H supplied with the bonding material, and bonding the piezoelectric element P and the holding member H together.
- the suction head vertical movement mechanism 24 of each suction head 20 moves the suction nozzle of each suction head 20 based on the amount of movement of each suction nozzle 28 in the Z direction calculated by the control device 16. 28 are individually moved vertically downward. As a result, the piezoelectric element P is bonded to the holding member H via the bonding material.
- Each suction head 20 releases the piezoelectric element P from the suction nozzle 28 .
- the suction head vertical movement mechanism 24 of each suction head 20 moves the supply device 36 vertically upward.
- the suction head moving device 12 conveys the suction head 20 to the piezoelectric element supply position Sp.
- the piezoelectric element mounting step S100 proceeds to the piezoelectric element positioning step S130 after the piezoelectric element bonding step S190 is completed.
- the piezoelectric element bonding step S190 when the piezoelectric elements P are bonded to all the holding members H, the plurality of holding members H to which the piezoelectric elements P are respectively bonded are moved from the holding member supply position Sh to the holding member waiting position Wh. transport to Further, information Ih regarding the positions of the plurality of holding members H is acquired by the laser measuring device 15 in order to confirm the mounting state of the piezoelectric elements P on the plurality of holding members H that have been conveyed.
- the piezoelectric vibrating device manufacturing apparatus 1 configured in this way is supplied in a state in which a plurality of piezoelectric elements P are arranged in a matrix while maintaining relative distances from each other. Similarly, a plurality of holding members H are supplied in a state of being arranged in a matrix while maintaining relative distances from each other. Thereby, the piezoelectric vibration device manufacturing apparatus 1 can acquire the information Ip about the positions of the plurality of piezoelectric elements P sucked by the suction head 20 and the information Ih about the positions of the holding members H at the same time.
- the piezoelectric vibration device manufacturing apparatus 1 extracts the suction nozzles 28 in the X direction based on the information about the positions of the plurality of piezoelectric elements P sucked by the suction head 20 and the information Ih about the positions of the holding members H. , Y direction and .theta.
- the plurality of suction heads 20 can individually adjust the positions of the plurality of piezoelectric elements P that are suctioned by the suction heads 20 according to the position of the holding member H.
- the suction head 20 can arrange the piezoelectric element P in the concave portion of the holding member H while considering variations in the shape of the holding member H.
- the positions of the suction nozzles 28 of the plurality of suction heads 20 can be individually adjusted based on the information Ip regarding the position of the piezoelectric element P and the information Ih regarding the position of the holding member H, which are numerical data. There is no need to perform temporary placement, etc.
- the plurality of supply heads 30 independently and individually adjust the position to supply the bonding material according to the position of the holding member H by the supply head horizontal movement mechanism 31 and the supply head vertical movement mechanism 34 . Moreover, since the plurality of supply heads 30 can individually adjust the position of the supply device 36 by acquiring the information Ih regarding the position of the holding member H, which is numerical data, the positioning of the holding member H can be performed. No need.
- the laser measuring device 15 measures not only the horizontal position but also the vertical position of the plurality of holding members H supplied to the holding member supply position Sh. Therefore, the vertical positions of the piezoelectric elements P respectively arranged on the plurality of holding members H can be independently and individually adjusted according to the vertical positions of the holding members H. FIG. Therefore, the plurality of piezoelectric elements P can be arranged in the plurality of recesses of the holding members H at predetermined positions and in predetermined directions with high accuracy without increasing the tact time.
- the plurality of piezoelectric elements P are arranged.
- a piezoelectric element position adjustment step S180 is provided for adjusting the positions independently of each other.
- the camera 14 simultaneously photographs the piezoelectric element P and the suction nozzle 28 sucked by the suction nozzle 28 of the suction head 20 . Therefore, the information Ip regarding the position of the piezoelectric element P takes into consideration the displacement of the piezoelectric element P with respect to the plurality of suction nozzles 28 .
- the bonding material supply position adjusting step S140 individually adjusts the bonding material supply position based on the information Ih regarding the position of the holding member H, which is numerical data. Therefore, the method for manufacturing a piezoelectric vibration device does not require individual alignment or the like for each holding member H. As shown in FIG. Therefore, the plurality of piezoelectric elements P can be arranged in the recesses of the plurality of holding members H at predetermined positions and in predetermined directions without increasing the tact time.
- FIG. 13 is a plan view showing the configuration of a piezoelectric vibration device manufacturing line 100 including the piezoelectric vibration device manufacturing apparatus 1.
- FIG. 14 is a block diagram showing a control configuration of a piezoelectric vibration device manufacturing line 100 including the piezoelectric vibration device manufacturing apparatus 1.
- a part of the piezoelectric vibration device manufacturing line 100 in this embodiment is a mounting section 110 for mounting the piezoelectric element P on the holding member H.
- the mounting unit 110 includes a tray T containing a plurality of piezoelectric elements P, a conveying device for conveying a plurality of holding members H arranged in a sheet shape, and a plurality of piezoelectric vibration device manufacturing apparatuses 1 . and
- the mounting unit 110 is composed of a robot moving device 111, a supply table 112, a transfer robot 113, and four piezoelectric vibration device manufacturing apparatuses 1, which are transfer devices.
- the mounting section 110 is controlled by the line control device 120 (see FIG. 14) of the piezoelectric vibration device manufacturing line 100 .
- the robot moving device 111 and the transfer robot 113 transfer the tray T containing a plurality of piezoelectric elements P to the piezoelectric element supply devices 10 of the four piezoelectric vibration device manufacturing apparatuses 1, respectively. Further, the robot moving device 111 and the transport robot 113 transport the plurality of holding members H arranged in a sheet shape to the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 . Further, the robot moving device 111 and the transfer robot 113 collect the sheet-shaped holding members H to which the piezoelectric elements P are joined from the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 .
- the robot moving device 111 is a device that moves the transfer robot 113.
- the robot transfer device is a linear motion unit of one axis, which includes, for example, a servomotor as an actuator and a ball screw unit as a linear motion mechanism.
- a transfer robot 113 is mounted on the movable portion of the robot moving device 111 .
- the robot moving device 111 is installed with the Y direction being the direction in which the transfer robot 113 is moved when viewed in the Z direction. Therefore, the robot moving device 111 is configured to be able to move the transfer robot 113 to any position in the Y direction.
- the supply table 112 is a table on which a tray T containing a plurality of piezoelectric elements P and a sheet-like holding member H are stored.
- the tray T containing the piezoelectric element P and the sheet-shaped holding member H are supplied to the supply table 112 by a supply device (not shown) in an upstream process or by an operator.
- the supply table 112 is arranged at the end of the robot moving device 111 .
- the transfer robot 113 supplies the tray T containing the piezoelectric elements P to the piezoelectric element supply device 10 of the piezoelectric vibration device manufacturing apparatus 1 . Further, the conveying robot 113 supplies the sheet-shaped holding member H to the holding member supply device 11 of the piezoelectric vibration device manufacturing apparatus 1 .
- the transfer robot 113 is, for example, a horizontal articulated robot (SCARA robot) having two arms.
- SCARA robot horizontal articulated robot
- the transfer robot 113 is mounted on the movable portion of the robot moving device 111 . Therefore, the transfer robot 113 is configured to be movable to any position in the Y direction by the robot moving device 111 when viewed in the Z direction. When viewed in the vertical direction, the transfer robot 113 has one side (X+ direction side) and the other side (X
- the tray T and the sheet-like holding member H are movable in the negative direction).
- the four piezoelectric vibration device manufacturing apparatuses 1 independently bond the piezoelectric element P to the holding member H. Two of the four piezoelectric vibration device manufacturing apparatuses 1 are arranged on one side of the robot moving apparatus 111 when viewed in the vertical direction. Also, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged side by side in the Y direction. At this time, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged so that the moving direction (Y direction) of the suction head moving device 12 is parallel to the moving direction of the robot moving device 111 .
- the piezoelectric element standby position Wp in the piezoelectric element supply apparatus 10 and the holding member standby position Wh in the holding member supply apparatus 11 are located on the robot moving apparatus 111 side and within the movable range of the transfer robot 113. arranged to be located within
- the other two piezoelectric vibration device manufacturing apparatuses 1 out of the four piezoelectric vibration device manufacturing apparatuses 1 are arranged on the other side of the robot moving apparatus 111 when viewed in the vertical direction. Also, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged side by side in the Y direction. At this time, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged so that the moving direction (Y direction) of the suction head moving device 12 is parallel to the moving direction of the robot moving device 111 .
- the piezoelectric element standby position Wp in the piezoelectric element supply apparatus 10 and the holding member standby position Wh in the holding member supply apparatus 11 are located on the robot moving apparatus 111 side and within the movable range of the transfer robot 113. arranged to be located within
- the mounting unit 110 configured in this manner moves the trays T stored on the supply table 112 to the piezoelectric element standby positions Wp of the piezoelectric element supply apparatuses 10 of the four piezoelectric vibration device manufacturing apparatuses 1 by the transfer robot 113 . supply is possible. Further, the mounting unit 110 supplies the sheet-like holding members H stored on the supply table 112 by the transport robot 113 to the holding member standby positions Wh of the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 . It is possible.
- the mounting unit 110 collects the sheet-like holding members H each accommodating the piezoelectric element P from the holding member standby positions Wh in the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 by the conveying robot 113 . It is possible.
- the mounting unit 110 is configured to be able to supply the sheet-shaped holding member H collected by the transport robot 113 to a bonding agent curing furnace (not shown) on the downstream side.
- At least one of the four piezoelectric vibration device manufacturing apparatuses 1 of the mounting section 110 receives a control signal regarding production start from the line control device 120 of the piezoelectric vibration device manufacturing line 100. Then, we started manufacturing piezoelectric vibration devices. Note that the line control device 120 determines the number of piezoelectric vibration device manufacturing apparatuses 1 to be operated based on the production volume of piezoelectric element devices.
- the piezoelectric vibration device manufacturing apparatus 1 in operation outputs a supply signal for the piezoelectric element P to the line control device 120, for example, when the piezoelectric element P needs to be supplied.
- the line control device 120 acquires the supply signal of the piezoelectric element P
- the line control device 120 outputs a control signal for supplying the piezoelectric element P to the conveying device.
- the robot moving device 111 and the transfer robot 113 supply the tray T containing a plurality of piezoelectric elements P from the supply table 112 to the piezoelectric element standby position Wp in the piezoelectric element supply device 10 of the piezoelectric vibration device manufacturing apparatus 1 .
- the tray T containing the piezoelectric element P is discharged from the line control device 120.
- the line control device 120 acquires the ejection signal of the tray T containing the piezoelectric elements P
- the line control device 120 sends a control signal to the robot moving device 111 and the transfer robot 113 to discharge the tray T containing the piezoelectric elements P.
- the robot moving device 111 and the transfer robot 113 collect the tray T containing the piezoelectric element P from the holding member standby position Wh in the holding member supply device 11 of the piezoelectric vibration device manufacturing apparatus 1, and place it in a bonding agent curing furnace (not shown). supply to
- the piezoelectric vibration device manufacturing line 100 can flexibly cope with the production volume of piezoelectric vibration devices by combining a plurality of piezoelectric vibration device manufacturing apparatuses 1 .
- the piezoelectric vibration device manufacturing apparatus 1 has four suction heads 20 and four supply heads 30 .
- the piezoelectric vibration device manufacturing apparatus 1 only needs to have a plurality of suction heads 20 and supply heads 30 .
- the plurality of supply heads 30 may be configured so that the positions of the respective supply devices 36 can be adjusted simultaneously. Further, the plurality of suction heads 20 may be configured so that the positions of the respective suction nozzles 28 can be adjusted simultaneously. This reduces the time required to adjust the positions of the plurality of suction heads 20 and the plurality of supply heads 30 regardless of the number of suction heads 20 and supply heads 30 .
- the piezoelectric vibration device manufacturing apparatus 1 measures the position of the piezoelectric element P with respect to the suction head 20 from the image captured by the camera 14 as the piezoelectric element position measuring device.
- the piezoelectric element position measuring device may be any device that can measure the position of the piezoelectric element sucked by the sucking nozzle.
- the piezoelectric element position measuring device may be, for example, a laser measuring device or the like.
- the camera 14 is arranged on the pedestal 2 .
- the camera may be mounted on the suction head.
- the piezoelectric vibration device manufacturing apparatus 1 calculates the positions of the plurality of holding members H from the measured values measured by the laser measuring device 15 as the holding member position measuring device.
- the holding member position measuring device may be any device that can measure the shapes of a plurality of holding members.
- the holding member position measuring device may be a camera or the like.
- the suction head moving device 12 is composed of a single-axis linear motion unit.
- the suction head moving device may be any device that can move the suction head from the piezoelectric element supply position to the holding member supply position.
- the suction head moving device may be, for example, a horizontal articulated robot or a vertical articulated robot. The same applies to the piezoelectric element supply device and the holding member supply device.
- the piezoelectric vibration device manufacturing apparatus 1 supplies a plurality of holding members H to the holding member supply position Sh by one holding member supply device 11 .
- the piezoelectric vibration device manufacturing apparatus may have a plurality of holding member supply apparatuses.
- the piezoelectric vibrating device manufacturing apparatus has a plurality of holding member supply apparatuses, so that while one holding member supply apparatus is discharging the plurality of holding members in which the piezoelectric elements have been completely arranged, the other holding member supply apparatus supplies the holding members. Piezoelectric elements can be arranged on a plurality of holding members.
- the tray T has a recess C for housing the piezoelectric element P.
- the tray T can be supplied in a state in which a plurality of piezoelectric elements are arranged in a matrix.
- the plurality of holding members H supplied to the piezoelectric vibration device manufacturing apparatus 1 are connected in a sheet shape.
- the plurality of holding members can be supplied in a state of being arranged in a matrix.
- a plurality of holding members may be housed in trays having a plurality of recesses arranged in a matrix, for example.
- the piezoelectric element supplying device 10 the holding member supplying device 11, the suction head moving device 12, the supply head moving device 13, the horizontal moving mechanism 21 for the suction head of the suction head 20, and the vertical moving mechanism for the suction head 24 and the rotary movement mechanism 26 for the suction head, the horizontal movement mechanism 31 for the supply head of the supply head 30, and the vertical movement mechanism 34 for the supply head of the supply head 30 are 1-axis direct-acting units using a servomotor as an actuator, but are not limited thereto. No.
- the piezoelectric element supplying device 10, the holding member supplying device 11, the suction head moving device 12, the supply head moving device 13, the moving mechanism of the suction head 20, and the moving mechanism of the supply head 30 are configured to be able to control the amount of movement of a linear motor or the like. I wish I had.
- the laser measuring device 15 is configured to be rotatable and horizontally movable so as to match the position and degree of rotation of each holding member H in the horizontal direction.
- the laser measuring device may be configured to be movable only in the Y direction. In this case, the holding member is moved in the X direction by the holding member feeder. Therefore, the laser measuring device can measure the shape of the sheet-shaped holding member.
- the laser measuring device may be fixed and only the holding member may be moved in the X and Y directions by the holding member supplying device.
- the holding member H is a housing having a recess in which the piezoelectric element P can be arranged.
- the holding member H has a piezoelectric element P arranged in a recess.
- the holding member may be a flat plate-like member that does not have a concave portion in which the piezoelectric element can be arranged.
- the holding member has a piezoelectric element arranged on the plane of the flat plate member. In this case, the holding member is covered by a lid member (deep-drawn cap structure) having a recess.
- the mounting section 110 has four piezoelectric vibration device manufacturing apparatuses 1 .
- the mounting section may have one or more and three or less piezoelectric vibration device manufacturing apparatuses.
- the mounting section may have five or more piezoelectric vibration device manufacturing apparatuses.
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Abstract
Description
本明細書において、圧電振動デバイスとは、圧電体に加えられた力を電圧に変換し、または圧電体に印加された電圧を力に変換する圧電素子を有する電子部品を意味する。圧電振動デバイスには、水晶振動子、水晶発振器等が含まれる。圧電振動デバイスは、発振回路、フィルタ回路、アクチュエータ、センサ等に使用される。
本明細書において、圧電素子とは、加えられた力を電圧に変換し、または印加された電圧を力に変換する圧電体を意味する。圧電素子は、本実施形態において、水晶を特定の方向で切り出した板状の水晶振動片である。圧電素子は、蒸着、スパッタリング等により成膜された電極を有する。
本明細書において、保持部材とは、圧電素子を保持するための絶縁体からなる容器である。保持部材は、本実施形態においてセラミックス製の筐体である。保持部材は、内部に圧電素子と電気的に接続される電極を有する。保持部材は、内部に圧電素子を配置可能な凹部を有している。
本明細書において、接合材とは、圧電素子を保持容器に接合する導電性の材料を意味する。接合材は、例えば、はんだ、接着材等である。接合材は、本実施形態において、熱硬化性の接着剤である。
本明細書において、相対距離とは、部品の中心同士の距離を意味する。
本明細書において、位置に関する情報とは、圧電振動デバイス製造装置における任意の点を原点として、対象となる装置、部品等における特定の点のX方向、Y方向、Z方向及びθ方向の座標を意味する。本実施形態における座標は、圧電振動デバイス製造装置における任意の点を原点とする座標系である。
<圧電振動デバイス製造装置の全体構成>
図1から図6を用いて、本発明の圧電振動デバイスを製造する装置である圧電振動デバイス製造装置の実施形態1である圧電振動デバイス製造装置1について説明する。図1は、本発明の実施形態1に係る圧電振動デバイス製造装置1の全体構成の概略を示す平面図である。図2Aは、圧電振動デバイス製造装置1に供給される複数の圧電素子PとトレイTとを示す平面図である。図2Bは、圧電振動デバイス製造装置1に供給される複数の保持部材Hの概略を示す平面図である。図3は、圧電振動デバイス製造装置1が有する複数の吸着ヘッド20の全体構成の概略を示す平面図である。図4は、図3におけるA矢視図である。図5は、圧電振動デバイス製造装置1が有する複数の供給ヘッド30の全体構成の概略を示す側面図である。図6は、圧電振動デバイス製造装置1の制御構成を示すブロック図である。
次に、図2A及び図2Bを用いて本発明の圧電振動デバイス製造装置1の4つの吸着ヘッド20が吸着する圧電素子PのトレイT上における位置と、圧電素子Pが配置される保持部材Hの位置とについて説明する。
次に、図1、図7及び図8を用いて本発明の圧電振動デバイス製造装置1の吸着ヘッド20における吸着ノズル28の位置調整について説明する。図7は、圧電振動デバイス製造装置1の複数の吸着ヘッド20が保持部材供給位置Shに圧電素子Pを搬送した状態の概略を示す平面図である。図8は、圧電振動デバイス製造装置1の複数の吸着ヘッド20が吸着ノズル28の位置を調整した状態の概略を示す平面図である。
次に、本発明の圧電振動デバイス製造装置1の供給ヘッド30における吐出ノズル36aの位置調整について説明する。
<圧電振動デバイス製造装置の組み合わせ>
次に、図13と図14とを用いて、本発明の圧電振動デバイス製造装置1を含む実施形態2である圧電振動デバイス製造ライン100の一部について説明する。図13は、圧電振動デバイス製造装置1を含む圧電振動デバイス製造ライン100の構成を示す平面図である。図14は、圧電振動デバイス製造装置1を含む圧電振動デバイス製造ライン100の制御構成を示すブロック図である。本実施形態における圧電振動デバイス製造ライン100の一部は、保持部材Hに圧電素子Pを搭載する搭載部110である。
なお、上述の実施形態において、圧電振動デバイス製造装置1は、4つの吸着ヘッド20及び4つの供給ヘッド30を有している。しかしながら、圧電振動デバイス製造装置1は、吸着ヘッド20及び供給ヘッド30をそれぞれ複数有していればよい。
2 架台
10 圧電素子供給装置
10a トレイ載置部
11 保持部材供給装置
11a 保持部材載置部
12 吸着ヘッド移動装置
12a 吸着ヘッド載置部
13 供給ヘッド移動装置
13a 供給ヘッド載置部
14 カメラ
15 レーザ測定装置
16 制御装置
20 吸着ヘッド
21 吸着ヘッド用水平移動機構
22 吸着ヘッド用第1移動部材
23 吸着ヘッド用第2移動部材
24 吸着ヘッド用鉛直移動機構
25 吸着ヘッド用第3移動部材
26 吸着ヘッド用回転移動機構
27 吸着ヘッド用第4移動部材
28 吸着ノズル
30 供給ヘッド
31 供給ヘッド用水平移動機構
32 供給ヘッド用第1移動部材
33 供給ヘッド用第2移動部材
34 供給ヘッド用鉛直移動機構
35 供給ヘッド用第3移動部材
36 供給装置
36a 吐出ノズル
36b 冷却装置
36c 接触センサ
100 圧電振動デバイス製造ライン
110 搭載部
111 ロボット移動装置
112 供給台
113 搬送用ロボット
120 ライン制御装置
P 圧電素子
P1 第1圧電素子
P2 第2圧電素子
P3 第3圧電素子
P4 第4圧電素子
H 保持部材
H1 第1保持部材
H2 第2保持部材
H3 第3保持部材
H4 第4保持部材
Ip 圧電素子の位置に関する情報
Ih 保持部材の位置に関する情報
C 凹部
Claims (12)
- 圧電素子と、
前記圧電素子を保持する保持部材と、を少なくとも有し、
前記保持部材において前記圧電素子が接合材によって接合される圧電振動デバイスを製造するための圧電振動デバイス製造装置であって、
前記圧電素子をそれぞれ一つずつ吸着する複数の吸着ヘッドと、
前記複数の吸着ヘッドを搭載し、複数の前記圧電素子が供給される圧電素子供給位置から複数の前記保持部材が供給される保持部材供給位置までの間において、前記複数の吸着ヘッドを同時に往復移動させる吸着ヘッド移動装置と、を有し、
前記吸着ヘッドは、
前記圧電素子を吸着する吸着ノズルと、
前記吸着ノズルを水平方向に移動させる吸着ヘッド用水平移動機構と、
前記吸着ノズルを鉛直方向に移動させる吸着ヘッド用鉛直移動機構と、
前記吸着ノズルを鉛直軸まわりの回転方向に移動させる吸着ヘッド用回転移動機構と、
を有し、
複数の前記吸着ヘッドは、
前記圧電素子供給位置において複数の前記吸着ノズルによって前記圧電素子供給位置に供給された前記圧電素子をそれぞれ吸着し、前記吸着ヘッド移動装置によって前記圧電素子供給位置から前記保持部材供給位置まで移動され、
前記吸着ヘッド用水平移動機構、前記吸着ヘッド用鉛直移動機構、または前記吸着ヘッド用回転移動機構のうち少なくとも一つは、
複数の前記吸着ノズルがそれぞれ吸着した複数の前記圧電素子の位置に関する情報と前記保持部材供給位置に供給された複数の前記保持部材の位置に関する情報とに基づいて、複数の前記吸着ノズルがそれぞれ吸着している前記圧電素子を、対応する前記保持部材にそれぞれ配置可能なように前記吸着ノズルの位置をそれぞれ独立して個別に調整する、
圧電振動デバイス製造装置。 - 請求項1に記載の圧電振動デバイス製造装置において、
前記接合材を前記保持部材にそれぞれ供給する複数の供給ヘッドと、
前記複数の供給ヘッドを搭載し、前記複数の供給ヘッドの待機位置から前記保持部材供給位置までの間において、前記複数の供給ヘッドを同時に往復移動させる供給ヘッド移動装置と、を有し、
前記供給ヘッドは、
前記接合材を供給する供給装置と、
前記供給装置を水平方向に移動させる供給ヘッド用水平移動機構と、
前記供給装置を鉛直方向に移動させる供給ヘッド用鉛直移動機構と、を有し、
複数の前記供給ヘッドは、
前記供給ヘッド移動装置によって前記待機位置から前記保持部材供給位置まで移動され、
前記供給ヘッド用水平移動機構または供給ヘッド用鉛直移動機構のうち少なくとも一つは、
前記保持部材供給位置に供給された複数の前記保持部材の位置に関する情報に基づいて、複数の前記供給装置が前記接合材を複数の前記保持部材にそれぞれ供給可能なように前記供給装置の位置をそれぞれ独立して個別に調整する、
圧電振動デバイス製造装置。 - 請求項2に記載の圧電振動デバイス製造装置において、
複数の前記供給ヘッドは、
前記保持部材供給位置において、複数の前記供給装置によって前記接合材を複数の前記保持部材にそれぞれ独立して個別に供給し、
複数の前記吸着ヘッドは、
前記保持部材供給位置において、複数の前記吸着ノズルがそれぞれ吸着している前記圧電素子を前記接合材が供給されている複数の前記保持部材にそれぞれ独立して個別に配置する、
圧電振動デバイス製造装置。 - 請求項2から請求項3のいずれか一項に記載の圧電振動デバイス製造装置において、
前記複数の供給ヘッドは、
それぞれの前記供給装置の位置を前記供給ヘッド用水平移動機構または前記供給ヘッド用鉛直移動機構の少なくともに一つによって、同時に調整可能である、
圧電振動デバイス製造装置。 - 請求項1に記載の圧電振動デバイス製造装置において、
複数の前記吸着ヘッドは、
それぞれの前記吸着ノズルの位置を前記吸着ヘッド用水平移動機構、前記吸着ヘッド用鉛直移動機構、または前記吸着ヘッド用回転移動機構の少なくとも一つによって、同時に調整可能である、
圧電振動デバイス製造装置。 - 請求項1に記載の圧電振動デバイス製造装置において、
前記圧電素子の位置に関する情報として、複数の前記吸着ヘッドがそれぞれ吸着した複数の前記圧電素子の水平方向の位置及び前記圧電素子の向きをそれぞれ測定する圧電素子位置測定装置と、
前記保持部材の位置に関する情報として、前記保持部材供給位置に供給される複数の前記保持部材の水平方向及び鉛直方向の位置をそれぞれ測定する保持部材位置測定装置と、を有する、
圧電振動デバイス製造装置。 - 圧電素子と、
前記圧電素子を保持する保持部材と、を少なくとも有し、
前記保持部材に前記圧電素子が接合材によって接合される圧電振動デバイスの製造方法であって、
複数の前記圧電素子を圧電素子供給位置に供給する圧電素子供給工程と、
複数の前記圧電素子を圧電素子供給位置に位置決めする圧電素子位置決め工程と、
複数の前記保持部材を保持部材供給位置に供給する保持部材供給工程と、
複数の前記保持部材を保持部材供給位置に位置決めする保持部材位置決め工程と、
圧電素子供給位置に位置決めされた複数の前記圧電素子を前記圧電素子供給位置から前記保持部材供給位置まで搬送する圧電素子搬送工程と、
前記圧電素子供給位置から前記保持部材供給位置まで搬送される複数の前記圧電素子の位置に関する情報と前記保持部材供給位置に位置決めされた前記保持部材の位置に関する情報とに基づいて、前記圧電素子供給位置から前記保持部材供給位置まで搬送される複数の前記圧電素子を対応する前記保持部材にそれぞれ配置可能なように、複数の前記圧電素子の位置をそれぞれ独立して個別に調整する圧電素子位置調整工程と、を有する、
圧電振動デバイスの製造方法。 - 請求項7に記載の圧電振動デバイスの製造方法において、
前記保持部材供給位置において、前記保持部材供給位置に供給された前記保持部材の位置に関する情報に基づいて、前記保持部材に供給する前記接合材の供給位置を調整する接合材供給位置調整工程と、
を有する、
圧電振動デバイスの製造方法。 - 請求項8に記載の圧電振動デバイスの製造方法において、
前記保持部材供給位置において、複数の前記保持部材に前記接合材をそれぞれ供給する接合材供給工程と、
前記保持部材供給位置において、前記圧電素子供給位置から前記保持部材供給位置まで搬送される複数の前記圧電素子を前記接合材が供給されている複数の前記保持部材にそれぞれ配置する圧電素子接合工程と、を有する、
圧電振動デバイスの製造方法。 - 請求項8から請求項9のいずれか一項に記載の圧電振動デバイスの製造方法において、
前記接合材供給位置調整工程は、
複数の前記保持部材に前記接合材を供給する位置をそれぞれ同時に調整する工程である、
圧電振動デバイスの製造方法。 - 請求項7に記載の圧電振動デバイスの製造方法において、
前記圧電素子位置調整工程は、
前記複数の圧電素子の位置を前記保持部材にそれぞれ配置可能なようにそれぞれ同時に調整する工程である、
圧電振動デバイスの製造方法。 - 請求項7に記載の圧電振動デバイスの製造方法において、
前記圧電素子供給位置から前記保持部材供給位置まで搬送される複数の前記圧電素子の水平方向の位置及び前記圧電素子の向きに関する情報をそれぞれ取得する圧電素子位置情報取得工程と、
前記保持部材供給位置に供給される複数の前記保持部材の水平方向及び鉛直方向の位置に関する情報をそれぞれ取得する保持部材位置情報取得工程と、を有する、
圧電振動デバイスの製造方法。
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