WO2023169673A1

WO2023169673A1 - Optoelectronic package and method for manufactuiring an optoelectronic package

Info

Publication number: WO2023169673A1
Application number: PCT/EP2022/056082
Authority: WO
Inventors: Seong Tak KOAY; Adelene NG
Original assignee: Ams-Osram International Gmbh
Priority date: 2022-03-09
Filing date: 2022-03-09
Publication date: 2023-09-14

Abstract

The invention concerns an optoelectronic package comprising at least a first optoelectronic component configured to emit light of a first wavelength at least through an upper surface side of the first optoelectronic component during use of the first optoelectronic component, the first optoelectronic component comprising a first contact area on the upper surface side and a second contact area on a bottom surface side opposite the upper surface side. The optoelectronic package further comprises a molding material laterally surrounding the first optoelectronic component, a first isolating layer covering at least a portion of the bottom surface side, a first contact pad arranged on the first isolating layer, a second contact pad arranged on the second contact area, and a first conducting path extending from the first contact area to the first contact pad along a first side surface of the optoelectronic package. The first conducting path is thereby embedded at least partially into the molding material such that the first conducting path and the molding material are substantially flush and/or form a planar surface along the first side surface.

Description

OPTOELECTRONIC PACKAGE AND METHOD FOR MANUFACTUIRING AN OPTOELECTRONIC

PACKAGE

The present invention concerns an optoelectronic package with at least one optoelectronic component configured to emit light during use of the optoelectronic component as well as a method for manufacturing at least a first and a second optoelectronic package.

Background

There is package size limitation for all optoelectronic packages having two contact pads for electrically contacting the optoelectronic packages on the same surface side (Flip-Chip) of the optoelectronic packages when using optoelectronic components having a first contact area on an upper surface side and a second contact area on an opposing bottom surface side of the optoelectronic component. This is, as known methods for wiring (bond wires, contact vias, ...) within the optoelectronic package to each connect one of the contact areas of the optoelectronic component to the contact pads of the optoelectronic package, to provide both contact pads on the same surface side of the optoelectronic package, are rather space consuming. In particular known wiring methods to connect a contact area on an upper surface side of the optoelectronic component with a contact pad on an opposing surface side of the optoelectronic package may thereby be rather space consuming.

The object of the invention is thus to counteract at least one of the aforementioned problems and to provide an improved optoelectronic package. It is a further object of the invention to provide a method for manufacturing a respective optoelectronic package.

Summary

This and other requirements are met by an optoelectronic package having the features of claim 1 and a method for manufacturing at least a first and a second optoelectronic package having the features of claim 11. Embodiments and further developments of the invention are described in the dependent claims . The concept, the inventors propose, is to provide a compact optoelectronic package like the size of a flip chip device comprising one or more optoelectronic components having contact areas on opposing surface sides of the optoelectronic component. The one or more optoelectronic components can in particular be of the form of an unhoused die configured to emit light of a desired wavelength when powered. The optoelectronic component(s) is/are surrounded by a molding material covering at least side surfaces of the same. The idea is to use a combined bottom surface of the die and the molding material to provide a first and a second contact pad, the first contact pad being connected to the upper surface side of the optoelectronic component via a conducting path and the second contact pad being connected to the bottom surface side of the optoelectronic component for powering the optoelectronic component. The conducting path is thereby embedded in the molding material such that it is substantially flush with the molding material along a side surface of the optoelectronic package which results in particular from the later described manufacturing method. The package sidewall can thus be utilized to create a circuit path from the upper surface side to the bottom surface side. With this a very compact optoelectronic package can be provided.

In one aspect, an optoelectronic package comprises at least a first optoelectronic component configured to emit light of a first wavelength at least through an upper surface side of the first optoelectronic component during use of the first optoelectronic component. The first optoelectronic component comprises a first contact area on the upper surface side and a second contact area on a bottom surface side opposite the upper surface side. The optoelectronic package further comprises a molding material laterally surrounding the first optoelectronic component, a first isolating layer covering at least a portion of the bottom surface side, a first contact pad arranged on the first isolating layer, a second contact pad arranged on the second contact area, and a first conducting path extending from the first contact area to the first contact pad along a first side surface of the optoelectronic package. The first conducting path is embedded at least partially into the molding material such that the first conducting path and the molding material are substantially flush and/or form a planar surface along the first side surface.

The optoelectronic component may thereby be of the form of a light emitting element and in particular a light emitting diode (LED). The light emitting diode may emit light of a desired wavelength when connected to a respective supply voltage. In particular the light emitting diode may generate the emitted light within an active region and emit it through the upper and bottom surface side as well as through side surfaces of the optoelectronic component. Such an optoelectronic component may also be called an unhoused die configured to emit light of a desired wavelength during use of the optoelectronic component. The die comprises a first contact area on the upper surface side and a second contact area on a bottom surface side opposite the upper surface side via which the die can be powered.

The molding material can be any molding material known in the art. The molding material can for example comprise silicone and/or epoxy or may for example be a reinforced plastic. The molding material can for example be at least partially be transparent to the light emitted from the optoelectronic component, but may also be light absorbing or even reflective for the light emitted from the optoelectronic component.

The molding material latterly surrounds the optoelectronic component such that at least side surfaces of the optoelectronic component connecting the upper surface side and the bottom surface side with each other are covered by the molding material. The upper surface side may in some aspects however remain free of the molding material, to ensure that a light outcoupling of the light generated in the optoelectronic component at least through the upper surface side is not disturbed. In addition, the molding material may in some aspects be substantially flush with the bottom surface side and thus the bottom surface side remains free of the molding material, to ensure that an electrical contacting of the optoelectronic component is not disturbed.

The isolating layer may comprise an electrically isolating material, such as for example a ceramic or a plastic, arranged in trough holes between the optoelectronic elements. The isolating layer can on the one hand for example serve as an electrical isolation between the bottom surface side of the optoelectronic component and between the first contact pad and on the other hand provide a good heat dissipation path from the optoelectronic component to the first contact pad. In addition, isolating layer can for example serve as a reflective and/or light absorbing medium arranged on at least a portion of the bottom surface side to absorb or reflect light which would without the isolating layer emerge through the contacting portion of the bottom surface.

The first conducting path extending from the first contact area to the first contact pad along a first side surface of the optoelectronic package is in particular embedded at least partially into the molding material such that the first conducting path and the molding material are substantially flush and/or form a planar surface along the first side surface. Along a side surface of the optoelectronic package the first conducting path and the molding material thus together form an even surface.

In some aspects, the first conducting path extending from the first contact area to the first contact pad along a first side surface of the optoelectronic package is however embedded into the molding material such that the first conducting path is partially embedded into the molding material and partially protrudes the molding material.

In some aspects, the first side surface is formed at least by the molding material, the first conducting path and optionally the first isolating layer. In some aspects, the first side surface is formed by the molding material, the first conducting path and optionally the first isolating layer only.

In some aspects, a bottom surface side of the first contact pad opposite the isolating layer and a bottom surface side of the second contact pad opposite the second contact area are arranged in a same plane. The bottom surface side of the first and second contact pad may thus be flush with each other. It is thus easier to place the optoelectronic package on a desired target substrate. The existing second contact area of the optoelectronic component can by the second contact pad in particular be extended to the level of the first isolating layer and the first contact pad on the first isolating layer to have an even contacting surface of the optoelectronic package. The contact pads can thereby be generated using for example a copper plating process.

In some aspects, the optoelectronic package further comprises a second, third, or more optoelectronic components each configured to emit light of a second, third or other wavelength at least through an upper surface side of the respective optoelectronic component during use. The optoelectronic component(s) each comprise a first contact area on the upper surface side of the optoelectronic component and a second contact area on a bottom surface side of the optoelectronic component opposite the upper surface side of the optoelectronic component. The optoelectronic component(s) are arranged distant to the first optoelectronic component and to each other and are each laterally surrounded by the filling material.

The optoelectronic components may for example emit light of the same wavelength, light of slightly different wavelengths, or light of different wavelengths. Light of different wavelengths may thereby originate from different material systems used for the optoelectronic components, different bandgaps in the respective active region of the optoelectronic components or due to a light converter material arranged on at least some of the optoelectronic components.

In some aspects, the second contact pad is arranged on the second contact areas of the first optoelectronic component, the second optoelectronic component and further optoelectronic components if present thus electrically connecting the second contact areas. In some aspects the second contact pad is arranged on the second contact areas of all optoelectronic components present in the optoelectronic package, however it may also be that a first second contact pad is arranged on a first number of second contact areas of a first number of optoelectronic components and a second contact pad is arranged on a second number of contact areas of a second number of optoelectronic components etc.. In some aspects, the optoelectronic package further comprises a second isolating layer covering at least a portion of the bottom surface side of the second optoelectronic component, a third contact pad arranged on the second isolating layer, and a second conducting path extending from the first contact area of the second optoelectronic component to the third contact pad along a second side surface of the optoelectronic package. The second conducting path is thereby embedded at least partially into the molding material such that the second conducting path and the molding material are substantially flush and/or form a planar surface along the second side surface.

In case of further optoelectronic components the optoelectronic package can comprise the same number of further isolating layers, further contact pads and further conducting paths each arranged and connected to each other and the further optoelectronic component in the same way as described for the first and second optoelectronic component.

In some aspects, the upper surface side of the first optoelectronic component, the upper surface side of the second optoelectronic component, and the upper surface side(s) of further optoelectronic component(s), if present, are arranged in a same plane. The optoelectronic package may thus comprise an substantially planar/even upper surface side.

In some aspects, the molding material is substantially flush with the second contact pad along at least one further side surface of the optoelectronic package and/or forms an substantially planar/even surface with the second contact pad along the at least one further side surface.

It is also proposed a method for manufacturing an optoelectronic package and in particular at least a first and a second optoelectronic package comprising the steps:

Providing at least a first and a second optoelectronic component, the first and the second optoelectronic component each being configured to emit light at least through an upper surface side of the optoelectronic component during use of the optoelectronic component, and the first and second optoelectronic component each comprising a first contact area on the upper surface side and a second contact area on a bottom surface side opposite the upper surface side;

Laterally surrounding the first and the second optoelectronic component with a molding material;

Providing a structured isolating layer on the bottom surface side of the first and the second optoelectronic component such that at least a portion of each the bottom surface side of the first and the second optoelectronic component is covered by the structured isolating layer;

Creating an opening between the first and the second optoelectronic component through the molding material, and in some aspects also through the structured isolating layer;

Providing a first structured electrically conductive material layer with at least a first region arranged on at least the second contact areas of the first and second optoelectronic component (forming a later second contact pad) and a second region, electrically isolated from the first region and the first and second optoelectronic component, arranged on the structured isolating layer (forming a later first contact pad) and extending into the opening (forming a fist portion of a later conducting path);

Providing a second structured electrically conductive material layer electrically connecting the second region of the first structured electrically conductive material layer with the first contact areas of the of the first and second optoelectronic component (forming a second portion of a later conducting path);

Separating the first and the second optoelectronic package along the opening.

In some aspects, the step of providing structured isolating layer comprises a spray coating of for example a ceramic material to create isolation pads on the bottom surface sides of the optoelectronic components.

In some aspects, during the step of laterally surrounding the first and the second optoelectronic component the first and second optoelectronic component are arranged on a first temporary carrier layer with each the bottom surface side facing the first temporary carrier layer. The first temporary carrier layer can therefore comprise a sticky surface, by which the first and second optoelectronic component are temporary attached/fixed to the first temporary carrier layer.

In some aspects, the method further comprises a step of removing the first temporary carrier layer and providing a second temporary carrier layer facing the upper surface side of the first and second optoelectronic component. The step of removing the first temporary carrier layer and providing the second temporary carrier layer may be carried out after the step of laterally surrounding the optoelectronic components and in particular after the molding material has been cured.

In some aspects, the step of providing the structured isolating layer takes place after the step of removing the first temporary carrier layer and providing the second temporary carrier layer. The structured isolating layer can in particular be provided on the surface, which was in contact with the first temporary carrier layer before its removal. The structured isolating layer is in particular be provided on the bottom surface side of the first and the second optoelectronic component such that at least a first portion of each bottom surface side of the first and the second optoelectronic component is covered by the structured isolating layer. The structured isolating layer can thereby also extend onto the moldig material and cover portions of the molding material as well. However, a second portion of each bottom surface side of the first and the second optoelectronic component remains free from the structured isolating layer. Onto this second portions first regions of the first structured electrically conductive material layer may in a later step be provided.

In some aspects, the method further comprises a step of removing the second temporary carrier layer and providing a third temporary carrier layer facing the first structured electrically conductive material layer. The step of removing the second temporary carrier layer and providing a third temporary carrier layer may thus be performed after the step of providing the first structured electrically conductive material layer. In some aspects, the step of providing the second structured electrically conductive material layer takes place after the step of removing the second temporary carrier layer and providing the third temporary carrier layer. The second structured electrically conductive material layer can in particular be provided on the surface, which was in contact with the second temporary carrier layer before its removal.

In some aspects, the step of separating the first and the second optoelectronic package comprises a step of removal of the third temporary carrier layer, in particular after a step of separating the first and the second optoelectronic package by sawing a gap in-between them.

In some aspects, the step of separating the first and the second optoelectronic package comprises a step of sawing through the first and second structured electrically conductive material layer, the molding material and optionally through the structured isolating layer along the opening. The step of sawing causes a planar side surface of the first and second optoelectronic package comprising portions of the first and second structured electrically conductive material layer, portions of the molding material and optionally portions of the structured isolating layer.

In some aspects, the method further comprises a step of providing a structured dielectric layer between the second structured electrically conductive material layer and the molding material and/or the first and second optoelectronic component, in particular to prevent a short within the optoelectronic packages.

In some aspects, the optoelectronic packages and the method for manufacturing an optoelectronic package can be applicable to single chip or multi-chip device packages. Various layouts (size/shape/arrangements) of the optoelectronic components and the molding material, as well as various anode/cathode contact pads combinations (common cathode, common anode, individual pads, etc) are conceivable and can be chosen with regard to the desired use of the optoelectronic package. The described optoelectronic package as well as the described method for manufacturing an optoelectronic package and in particular a first and a second optoelectronic packages can provide at least one of the following advantageous:

- Feasibility to create any bottom pad layout for different applications

- a simplified process flow

- Copper and ceramic which adheres directly to the optoelectronic components provide an excellent thermal performance

- Eliminates reliability weakness of wire connections

Brief description of the drawings

In the following, embodiments of the invention will be explained in more detail with reference to the accompanying drawings. It is shown schematically in

Fig. 1A to ID different views of an optoelectronic package according to some aspects of the invention,

Fig. 2A to 2H different views of further embodiments of an optoelectronic package according to some aspects of the invention, and

Fig. 3A to 3J steps of a method for manufacturing at least a first and a second optoelectronic package according to some aspects of the invention.

Detailed description

The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the disclosure are shown. The disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness. Like reference characters refer to like elements throughout the description. The drawings are not necessarily to scale and certain features may be exaggerated in order to better illustrate and explain the exemplary embodiments of the present disclosure.

Figs. 1A to ID show different views of an optoelectronic package 1 according to some aspects of the invention. Figure 1A shows an isometric view, Fig. IB a side view, Fig. 10 a top view and Fig. ID a bottom view. The optoelectronic package 1 comprises an optoelectronic component 2 surrounded by a molding material 3 such that side surfaces of the optoelectronic component 2 are covered by the molding material 3, but an upper surface side U2 and a bottom surface side B2 remain free of the molding material 3. The molding material 3 is thus forming a ring around the optoelectronic component 2.

The optoelectronic component 2 is configured to emit light of a first wavelength at least through the upper surface side U₂ during use of the optoelectronic component 2 and comprises a first contact area Cl₂ on the upper surface side U2 and a second contact area C22 on the bottom surface side B2 via which the optoelectronic component 2 can be powered.

A portion and in the exemplary embodiment half of the bottom surface side B2 is covered by a first isolating layer 4 providing an electrical isolation of half of the second contact area C22 on the bottom surface side B₂ . On the first isolating layer 4, a first contact pad 5a is arranged 4a and electrically isolated from the second contact area C2₂ while on the second contact area 022, a second contact pad 5b is arranged being electrically connected to the second contact area 022. These two contact pads 5a, 5b serve as electrical contact surfaces to provide electric power to the optoelectronic package 1.

The optoelectronic package 1 further comprises a first conducting path 6 extending from the first contact area Cl₂ to the first contact pad 5a along a first side surface Sa of the optoelectronic package 1. The first conducting path 6 is thereby embedded into the molding material 3 such that the first conducting path 6 and the molding material 3 are substantially flush and form a planar surface along the first side surface Sa. This planar/flush side surface Sa results in particular due to the manufacturing method described in the following as several optoelectronic packages 1 are separated along the side surface Sa.

The first conducting path 6 is in form of a conductive track of a conductive material electrically contacting the first contact area CI2, extending from the first contact area Cl₂ along the side surface Sa of the optoelectronic package, and electrically contacting the first contact pad 5a.

In the exemplary embodiment the molding material 3 is flush with the bottom surface side B₂ together forming a bottom surface side of the optoelectronic package 1. Half of the bottom surface side of the optoelectronic package 1 is thereby covered with the first isolating layer 4 and the other half is covered by the second contact pad 5b. The first contact pad 5a again covers only a portion of the first isolating layer 4 and in particular is arranged on the first isolating layer 4 distant to the second contact pad 5b so that the two contact pads are electrically isolated from each other. Bottom surfaces of the first and the second contact pad opposite the optoelectronic component 2 are arranged in the same plane, so that the optoelectronic package can be placed onto a target substrate without being tilted.

The molding material 3 and the second contact pad 5b are in addition substantially flush along a further side surface Sc of the optoelectronic package 1. This again results in particular due to the manufacturing method described in the following as several optoelectronic packages 1 are separated along the further side surface Sc as well.

Figures 2A to 2H show different views of further embodiments of an optoelectronic package 1. Figure 2A shows a side view, Fig. 2B, 2D and 2F a top view and Fig. 2C, 2E, 2G and 2H a bottom view. The optoelectronic package 1 comprises not only one but four optoelectronic components 2a, 2b, 2c, 2d arranged in a 2 x 2 matrix distant from each other. The number four is however only exemplarily and any number of optoelectronic components may be possible depending on the desired use. The optoelectronic components 2a, 2b, 2c, 2d are surrounded by molding material 3 such that side surfaces of the optoelectronic components 2a, 2b, 2c, 2d are covered by the molding material 3, but upper surface sides U_2a, U_2b, U_2c, U_2d and bottom surface sides B_2a, B_2b, B_2c, B_2d remain free of the molding material 3. The molding material 3 is thus forming a grid around and between the optoelectronic components 2a, 2b, 2c, 2d. The optoelectronic components 2a, 2b, 2c, 2d are each configured to emit light of the same wavelength or of different wavelengths at least through the upper surface sides U_2a, U_2b, U_2c, U_2d during use of the optoelectronic components. The optoelectronic components 2a, 2b, 2c, 2d comprise a first contact area C1_2a, C1_2b, C1_2c, C1_2d on the upper surface sides and a second contact area C2_2a, C2_2b, C2_2c, C2_2d on the bottom surface sides via which the optoelectronic components can be powered. The molding material 3 is flush with the bottom surface sides B_2a, B_2b, B_2c, B_2d together forming a bottom surface side of the optoelectronic package 1. According to the embodiment shown in Figs. 2A to 2C, two strips of the bottom surface side of the optoelectronic package 1 along side surfaces Sa and Sb of the optoelectronic packages 1 are covered with a first isolating layer 4a and a second isolating layer 4b. A middle strip between the two side strips is covered by the second contact pad 5b. This results in that approximately each half of the bottom surface sides B_2a, B_2b, B_2c, B_2d of the optoelectronic components 2a, 2b, 2c, 2d is covered by the first or second isolating layer 4a, 4b and the other half is covered by the second contact pad 5b. A first contact pad 5a, a third contact pad 5c, a fourth contact pad 5d, and a fifth contact pad 5e are arranged on the first or second isolating layer 4a, 4b covering each a portion of the first and second isolating layer 4a, 4b and are in particular arranged on the first and second isolating layer 4a, 4b distant to the second contact pad 5b and distant to each other so that they are all electrically isolated from each other. Bottom surfaces of the contact pads opposite the optoelectronic components are arranged in the same plane, so that the optoelectronic package can be placed onto a target substrate without being tilted. A first conducting path 6a extends from the first contact area C1_2a to the first contact pad 5a along first side surface Sa of the optoelectronic package 1. The first conducting path 6 is thereby embedded into the molding material 3 such that the first conducting path 6a and the molding material 3 are substantially flush and form a planar surface along the first side surface Sa. A second conducting path 6b extends from the first contact area C12b to the third contact pad 5c along second side surface Sb of the optoelectronic package 1, which is opposite the first side surface Sa. The second conducting path 6b is thereby embedded into the molding material 3 such that the second conducting path 6b and the molding material 3 are substantially flush and form a planar surface along the second side surface Sb. A third conducting path 6c extends from the first contact area C12c to the fourth contact pad 5d again along first side surface Sa of the optoelectronic package 1. The third conducting path 6c is thereby embedded into the molding material 3 such that the third conducting path 6c and the molding material 3 are substantially flush and together with the first conducting path 6a form a planar surface along the first side surface Sa. A fourth conducting path 6d extends from the first contact area C12d to the fifth contact pad 5e along second side surface Sb of the optoelectronic package 1. The fourth conducting path 6d is thereby embedded into the molding material 3 such that the fourth conducting path 6d and the molding material 3 are substantially flush and together with the second conducting path 6b form a planar surface along the second side surface Sb.

The molding material 3 and the second contact pad 5b are in addition substantially flush along a further side surface Sc of the optoelectronic package 1.

The dimensions of the conducting paths 6a, 6b, 6c, 6d can thereby be varied and the can on the one hand be thicker and on the other hand be wider so that they at least approximately cover the whole first and second side surface with just a small spacing inbetween to electrically isolate them from each other. The conducting paths 6a, 6b, 6c, 6d can also be arranged each on one of the four side surfaces of the optoelectronic package 1.

According to the embodiment shown in Figs. 2D and 2E the bottom surface side of the optoelectronic package 1 is covered with a first isolating layer 4 leaving openings for a second, a third, a fourth and a fifth contact pad 5b, 5c, 5d, 5e. The second, third, fourth and fifth contact pad 5b, 5c, 5d, 5e are each arranged on and connected to a second contact area C2_2a, C2₂b, C2_2c, C2₂d on the bottom surface sides of the optoelectronic components.

A first contact pad 5a is arranged on the first isolating layer 4 covering a portion of the first isolating layer 4 and is in particular arranged on the first isolating layer 4 distant to the second, third, fourth and fifth contact pad 5b, 5c, 5d, 5e, in particular between the second, third, fourth and fifth contact pad 5b, 5c, 5d, 5e, electrically isolated from them. Bottom surfaces of the contact pads opposite the optoelectronic components are arranged in the same plane, so that the optoelectronic package can be placed onto a target substrate without being tilted.

A first conducting path 6a extends from the first contact area Cl_2a to the first contact pad 5a along first side surface Sa of the optoelectronic package 1. The first conducting path 6a is thereby embedded into the molding material 3 such that the first conducting path 6a and the molding material 3 are substantially flush and form a planar surface along the first side surface Sa. A second, third and fourth conducting path 6b, 6c, 6d extends from the first contact areas Cl_2b, Cl₂c, Cl_2d to the first contact pad 5a each along another side surface of the optoelectronic package 1. The conducting paths 6b, 6c, 6d are thereby embedded into the molding material 3 such that the conducting paths and the molding material 3 are substantially flush and form a planar surface along the side surfaces.

Figures 2F and 2G show a further embodiment in which the bottom surface side of the optoelectronic package 1 is again covered with a first isolating layer 4 leaving openings for a second, a third, a fourth and a fifth contact pad 5b, 5c, 5d, 5e. The second, third, fourth and fifth contact pad 5b, 5c, 5d, 5e are each arranged on and connected to a second contact area C2_2a, C2₂b, C2_2c, C2₂d on the bottom surface sides of the optoelectronic components. The first contact pad 5a is however arranged on the first isolating layer 4 in the form of a strip covering a centre portion of the first isolating layer 4 and is in particular arranged on the first isolating layer 4 distant to the second, third, fourth and fifth contact pad 5b, 5c, 5d, 5e, in particular between the second, third, fourth and fifth contact pad 5b, 5c, 5d, 5e, electrically isolated from them. Bottom surfaces of the contact pads opposite the optoelectronic components are arranged in the same plane, so that the optoelectronic package can be placed onto a target substrate without being tilted.

As explained for Figures 2D and 2E, a first, second, third and fourth conducting path 6a, 6b, 6c, 6d extends from the first contact areas C12a, C12b, C12c, C12d to the first contact pad 5a along two opposing side surfaces of the optoelectronic package 1. The conducting paths 6a, 6b, 6c, 6d are thereby embedded into the molding material 3 such that the conducting paths and the molding material 3 are substantially flush and form a planar surface along the side surfaces.

Fig. 2H shows a further embodiment in which the bottom surface side of the optoelectronic package 1 is again covered with a first isolating layer 4 leaving an opening for a second contact pad 5b in the middle of the bottom surface side of the optoelectronic package 1. The second contact pad 5b is arranged on and connected to second contact areas C2_2a, C2₂b, C2_2c, C2₂d on the bottom surface sides of the optoelectronic components.

The first contact pad 5a is arranged on the first isolating layer 4 in the form of a frame covering an edge portion of the first isolating layer 4 and is in particular arranged on the first isolating layer 4 distant to the second contact pad 5b in particular surrounding the second contact pad 5b electrically isolated from it. Bottom surfaces of the contact pads opposite the optoelectronic components are arranged in the same plane, so that the optoelectronic package can be placed onto a target substrate without being tilted.

As explained for Figures 2D and 2E, as well as 2F and 2G a first, second, third and fourth conducting path 6a, 6b, 6c, 6d extends from the first contact areas C12a, C12b, C12c, C12d to the first contact pad 5a along different or two oposing side surfaces of the optoelectronic package 1. The conducting paths 6a, 6b, 6c, 6d are thereby embedded into the molding material 3 such that the conducting paths and the molding material 3 are substantially flush and form a planar surface along the side surfaces.

Figures 3A to 3J show steps of a method for manufacturing at least a first and a second optoelectronic package la, lb. In a first step, as shown in Fig. 3A, optoelectronic components 2a, 2b are therefore provided on a first temporary carrier layer 10a. In the embodiment shown exemplarily eight optoelectronic components are provided on the first temporary carrier layer 10a, however indicated by the half optoelectronic component on the left side of the drawing, it can also be more optoelectronic components. In the embodiment shown, two optoelectronic components 2a, 2b may form a later optoelectronic package. The number of optoelectronic components forming a package may however differ and can for example also increase with a higher number of optoelectronic components arranged in the direction into the drawing plane.

The optoelectronic components 2a, 2b are each configured to emit light at least through an upper surface side U_2a, U₂b of the optoelectronic components during use. In the example shown, first optoelectronic components 2a may be configured to emit light of a different wavelength than second optoelectronic components 2b. In addition, the optoelectronic components 2a, 2b each comprise a first contact area Cl_2a, Cl₂b on the upper surface side U_2a, U₂b and a second contact area C2_2a, C2₂b on a bottom surface side B_2a, B₂b opposite the upper surface side U_2a, U₂b. The optoelectronic components 2a, 2b are arranged on the first temporary carrier layer 10a with each the bottom surface side B_2a, B₂b facing the first temporary carrier layer 10a. The first temporary carrier layer 10a can therefore comprise a sticky surface, by which the optoelectronic components 2a, 2b are temporary attached/fixed to the first temporary carrier layer 10a.

In a second step, as shown in Fig. 3B, the optoelectronic components 2a, 2b are laterally surrounded with a molding material 3. This step can comprise for example a film assisted molding process using a material like silicone and/or epoxy. The optoelectronic components 2a, 2b are surrounded with the molding material 3 in such a way that side surfaces of the optoelectronic components 2a, 2b are covered by the molding material but upper surface sides U2a, thb and bottom surface sides B2a, B_2b of the optoelectronic components remain free of the molding material 3. The bottom surface sides B2a, B2b can in particular remain free as they are in contact with the first temporary carrier layer 10a during the molding process whereas the upper surface sides U_2a, U₂b can remain free by adjusting the amount of molding material that is used.

In a further step, as shown in Fig. 3C, the first temporary carrier layer 10a is removed and a second temporary carrier layer 10b facing the upper surface sides U2a, tkb of the optoelectronic components 2a, 2b is provided. This step can for example correspond to a first re-lamination step. The step of removing the first temporary carrier layer and providing the second temporary carrier layer may in particular be carried out after the molding material 3 has been cured.

In a fourth step, as shown in Fig. 3D, a structured isolating layer 4 is provided on the bottom surface sides B2a, B2b of the optoelectronic components 2a, 2b. The structured isolating layer 4 is arranged on the bottom surface sides B2a, B2b such that at least a first portion of each the bottom surface sides B2a, B2b of the optoelectronic components is covered by a portion of the structured isolating layer 4. However, a second portion of each bottom surface sides B_2a, B₂b of the optoelectronic components remain free from the structured isolating layer 4. The structured isolating layer 4 and in particular the portions of the structured isolating layer 4 can thereby also extend onto the moldig material 3 and cover portions of the molding material 3 as well. The step of providing the structured isolating layer 4 can for example comprise a spray coating of for example a ceramic material to create isolation pads on the bottom surface sides B_2a, B₂b of the optoelectronic components.

In a fifth step, as shown in Fig. 3E, openings 7 are created between first and second optoelectronic components 2a, 2b and in particular between first and second optoelectronic components 2a, 2b of later different optoelectronic packages. The openings 7 extend through the molding material 3, and in case of the structured isolating layer 4 extending into regions of the openings 7 also through the structured isolating layer 4. The creation of the openings 7 is thereby a first preparation step of separating units which will later form individual optoelectronic packages. The openings can be generated by for example sawing, etching or removal through laser light.

In a sixth step, as shown in Fig. 3F, a first structured electrically conductive material layer 8 is provided onto the upper surface side U2a, U2b as well as into the openings 7. The first structured electrically conductive material layer 8 comprises first regions 8a arranged on the second contact areas C22a, C22b of the optoelectronic components (forming later second contact pads) and second regions 8b, electrically isolated from the first regions 8a and the optoelectronic components 2a, 2b, on the structured isolating layer 4 (forming later first contact pads) and extending into the openings 7 (forming fist portions of later conducting paths). The step of providing the first structured electrically conductive material layer 8 may for example comprise a copper (Cu) plating and patterning (Photoresist, Lithography, Development).

In a seventh step, as shown in Fig. 3G, the second temporary carrier layer 10b is removed and a third temporary carrier 10c layer facing the first structured electrically conductive material layer 8 is provided. This step can for example correspond to a second re-lamination step.

In an optional eight step, as shown in Fig. 3H, a structured dielectric layer 11 is provided on the molding material 3 in areas adjacent to the first contact areas C12a, C12b- The structured dielectric layer 11 can in the later optoelectronic packages serve as an electrical isolation between the optoelectronic components and the first contact pad and/or the conducting paths. In addition, or alternatively the structured dielectric layer 11 can serve as a levelling of the area on which in a later step a second structured electrically conductive material layer is provided.

In a nineth step, as shown in Fig. 31, a second structured electrically conductive material layer 9 is provided on the first contact areas C12a, C12b, on the openings 7, as well as on intermediate areas between the first contact areas C12a, C12b and the openings 7. The second structured electrically conductive material layer 9 comprises areas each electrically connecting the first contact areas C12a, C12b and the second regions 8b of the first structured electrically conductive material layer 8 (forming second portions of later conducting paths).

In a tenth step, as shown in Fig. 3J, optoelectronic packages la, lb are separated and the third temporary carrier layer 10c is removed. The optoelectronic packages la, lb are separated along the openings by for example a step of sawing through the first and second structured electrically conductive material layer 8, 9, the molding material 3 and in case of the structured isolating layer 4 extending into regions adjacent to the openings 7 also through the structured isolating layer 4. Due to a separation along the openings 7, material of the first and second structured electrically conductive material layer 8, 9 remains on both sides of the cutting line which in the final optoelectronic packages leads to the conducting paths being embedded in the molding material 3 and forming a planar surface with the molding material 3 along a side surface of optoelectronic packages. The side surfaces of the optoelectronic packages therefore comprise portions of the first and second structured electrically conductive material layer, portions of the molding material and optionally portions of the structured isolating layer.

LIST OF REFERENCES

1, la, lb optoelectronic package

2, 2a, 2b, 2c, 2d optoelectronic component

3 molding material

4, 4a, 4b isolating layer

5a, 5b, 5c, 5d, 5e contact pad

6, 6a, 6b, 6c, 6d conducting path

7 opening

8, 9 structured electrically conductive material layer

8a, 8b region

10a, 10b, 10c temporary carrier layer

11 dielectric layer

Cl₂, Cl_2a, Cl_2b, Cl_2c, Cl_2d first contact area

C2₂, C2_2a, C2_2b, C2_2C, C2_2d second contact area

U₂, U_2a, U_2b, U_2c, U_2d upper surface side

B₂, B_2a, B_2b, B_2C, B_2d bottom surface side

Sa, Sb, Sc side surface

Claims

1. An optoelectronic package (1) comprising at least a first optoelectronic component (2, 2a) configured to emit light of a first wavelength at least through an upper surface side (U₂, U_2a) of the first optoelectronic component (2, 2a) during use of the first optoelectronic component (2, 2a), the first optoelectronic component (2, 2a) comprising a first contact area (Cl₂, Cl_2a) on the upper surface side (U₂, U_2a) and a second contact area (C2₂, C2_2a) on a bottom surface side (B₂, B_2a) opposite the upper surface side (U₂, U_2a); a molding material (3) laterally surrounding the first optoelectronic component (2, 2a); a first isolating layer (4, 4a) covering at least a portion of the bottom surface side (B₂, B_2a); a first contact pad (5a) arranged on the first isolating layer (4, 4a); a second contact pad (5b) arranged on the second contact area (C2₂, C2_2a); and a first conducting path (6, 6a) extending from the first contact area (Cl₂, Cl_2a) to the first contact pad (5) along a first side surface (Sa) of the optoelectronic package (1) and being embedded at least partially into the molding material (3) such that the first conducting path (6, 6a) and the molding material (3) are substantially flush and/or form a planar surface along the first side surface (Sa).

2. The optoelectronic package according to claim 1, wherein the upper surface side (U₂, U_2a) remains free of the molding material (3).

3. The optoelectronic package according to claim 1 or 2, wherein the molding material (3) is substantially flush with the bottom surface side (B₂, B_2a).

4. The optoelectronic package according to any one of the preceding claims, wherein a bottom surface side of the first contact pad (5a) opposite the first isolating layer (4, 4a) and a bottom surface side of the second contact pad (5b) opposite the second contact area (C22, C22a) are arranged in a same plane. The optoelectronic package according to any one of the preceding claims, wherein the first side surface (Sa) is formed at least by the molding material (3), the first conducting path (6, 6a) and the first isolating layer (4, 4a). The optoelectronic package according to any one of the preceding claims, further comprising a second optoelectronic component (2b) configured to emit light of a second wavelength at least through an upper surface side (ttb) of the second optoelectronic component (2b) during use of the second optoelectronic component (2b), the second optoelectronic component (2b) comprising a first contact area (Cl₂b) on the upper surface side (U₂b) of the second optoelectronic component (2b) and a second contact area (C2₂b) on a bottom surface side (B2b) of the second optoelectronic component (2b) opposite the upper surface side (tkb) of the second optoelectronic component (2b), wherein the second optoelectronic component (2b) is arranged distant to the first optoelectronic component (2a) and is laterally surrounded by the filling material (3). The optoelectronic package according to claim 6, wherein the second contact pad (5b) is arranged on the second contact area (C22a) of the first optoelectronic component (2a) and on the second contact area (C22b) of the second optoelectronic component (2b). The optoelectronic package according to claim 6 or 7, further comprising a second isolating layer (4b) covering at least a portion of the bottom surface side (B₂b) of the second optoelectronic component (2b); a third contact pad (5c) arranged on the second isolating layer (4b); and a second conducting path (6b) extending from the first contact area (C12b) of the second optoelectronic component (2b) to the third contact pad (5c) along a second side surface (Sb) of the optoelectronic package (1) and being embedded at least partially into the molding material (3) such that the second conducting path (6b) and the molding material (3) are substantially flush along the second side surface (Sb). The optoelectronic package according to any one of the claims 6 to 8, wherein the upper surface side (U_2a) of the first optoelectronic component (2a) and the upper surface side (U₂b) of the second optoelectronic component (2b) are arranged in a same plane. The optoelectronic package according to any one of the preceding claims, wherein the molding material (3) is substantially flush with the second contact pad (5b) along a further side surface (Sc) of the optoelectronic package (1). A method for manufacturing at least a first and a second optoelectronic package (la, lb) comprising the steps:

Providing at least a first and a second optoelectronic component (2a, 2b), the first and the second optoelectronic component (2a, 2b) each being configured to emit light at least through an upper surface side (U_2a, U_2b) of the optoelectronic component (2a, 2b) during use of the optoelectronic component (2a, 2b), and the first and second optoelectronic component (2a, 2b) each comprising a first contact area (Cl_2a, Cl₂b) on the upper surface side (U_2a, U₂b) and a second contact area (C2_2a, C2₂b) on a bottom surface side (B_2a, B₂b) opposite the upper surface side (U_2a, U_2b);

Laterally surrounding the first and the second optoelectronic component (2a, 2b) with a molding material (3);

Providing a structured isolating layer (4) on the bottom surface side (B_2a, B₂b) of the first and the second optoelectronic component (2a, 2b) such that at least a portion of the bottom surface side (B_2a, B₂b) of the first and the second optoelectronic component (2a, 2b) is covered by the structured isolating layer (5); Creating an opening (7) through the molding material (3) between the first and the second optoelectronic component (2a, 2b);

Providing a first structured electrically conductive material layer (8) with at least a first region (8a) arranged on at least the second contact areas (C2_2a, C2_2b) of the first and second optoelectronic component (2a, 2b) and a second region (8b), electrically isolated from the first region (8a) and the first and second optoelectronic component (2a, 2b), arranged on the structured isolating layer (4) and extending into the opening (7);

Providing a second structured electrically conductive material layer (9) electrically connecting the second region (8b) of the first structured electrically conductive material layer (8) with the first contact areas (Cl_2a, Cl₂b) of the first and second optoelectronic component (2a, 2b);

Separating the first and the second optoelectronic package (la, lb) along the opening (7). The method according to claim 11, wherein during the step of laterally surrounding the first and the second optoelectronic component (2a, 2b) the first and second optoelectronic component (2a, 2b) are arranged on a first temporary carrier layer (10a) with each the bottom surface side (B_2a, B_2b) facing the first temporary carrier layer (10a). The method according to claim 12, further comprising a step of removing the first temporary carrier layer (10a) and providing a second temporary carrier layer (10b) facing the upper surface side (U_2a, U₂b) of the first and second optoelectronic component (2a, 2b). The method according to claim 13, wherein the step of providing the structured isolating layer (4) takes place after the step of providing the second temporary carrier layer (10b). The method according to claim 14, further comprising a step of removing the second temporary carrier layer (10b) and providing a third temporary carrier layer (10c) facing the first structured electrically conductive material layer (8). The method according to claim 15, wherein the step of providing the second structured electrically conductive material layer (9) takes place after the step of providing the third temporary carrier layer (10c). The method according to claim 16, wherein the step of separating the first and the second optoelectronic package (la, lb) comprises a step of removing the third temporary carrier layer (10c). The method according to any one of claims 11 to 17, further comprising a step of providing a structured dielectric layer (11) on the molding material (4) and/or the first and second optoelectronic component (2a, 2b). The method according to any one of claims 11 to 18, wherein the step of separating the first and the second optoelectronic package (la, lb) comprises a step of sawing through the first and second structured electrically conductive material layer (8, 9) and the molding material (3) along the opening (7).