WO2023098122A1 - Method for generating parameterized bonding data on basis of bonding wire model, and medium and device - Google Patents

Abstract

Provided in the present invention are a method for generating parameterized bonding data on the basis of a bonding wire model, and a medium and a device. The method for generating parameterized bonding data on the basis of a bonding wire model comprises: acquiring a matching parameter in an integrated circuit design file; according to the matching parameter, screening a bonding wire model library to select a bonding wire model, which falls within a preset matching range; performing interference simulation checking on the bonding wire model, which is selected by means of screening; and generating parameterized bonding data by using the bonding wire model, which passes the interference simulation checking. According to the present invention, a manual operation is replaced with data learning and optimization determination, such that the working efficiency and quality are greatly improved, thereby further reducing the production costs of an enterprise.

Description

Method, medium and device for generating parameterized bonding data based on bonding wire model technical field

The invention belongs to the technical field of integrated circuit packaging and relates to a method for generating bonding data, in particular to a method, medium and equipment for generating parameterized bonding data based on a bonding wire model.

Background technique

With the development of electronic products such as mobile phones and notebook computers towards miniaturization, portability, ultra-thinness, multimedia and low-cost to meet the needs of the public, high-density, high-performance, high-reliability and low-cost packaging forms and their assembly Technology has developed rapidly accordingly. Among them, wire bonding technology has been widely used in the field of modern semiconductor industry as a key process of integrated circuit packaging. Its main purpose is to realize the electrical connection between the chip and the external circuit, and between the chip and the chip. With the development of systematization and integration of device packaging, there are more and more bonding wires inside the package, so the package bonding procedure required in manufacturing becomes very important.

At present, most packaging and bonding programs in the industry use the method of manually setting various parameters. On the one hand, the efficiency of this method is too low, on the other hand, the accuracy and adaptability are too poor, and it depends more on experience. In addition, in the prior art, there is a method of automatically generating a bonding program through formula calculation using the bonding point coordinate data. This method also has some problems in practical applications: for example, when some objective conditions of the bonding equipment change, due to the Computationally generated bonding data cannot achieve precise adaptation changes, resulting in reduced accuracy of bonding data. Among them, changes in objective conditions refer to changes in the scope of work, work patterns, and so on. For example, the working range is the change of the working head. Different equipment has different working modes. Some equipment has one working mode, some equipment has two working modes, and some equipment has three working modes.

Therefore, how to provide a method, medium and equipment for generating parametric bonding data based on the bonding wire model, so as to solve the defects that the prior art cannot replace manual operation to generate parametric bonding data with high accuracy, has become an issue in the art. Technologists urgently need to solve technical problems.

Contents of the invention

In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a method, medium and equipment for generating parameterized bonding data based on the bonding wire model, which is used to solve the problem that the prior art cannot replace manual operation to generate less accurate data. Highly parameterized bonded data problems.

In order to achieve the above purpose and other related purposes, the present invention provides a method for generating parameterized bonding data based on a bonding wire model, characterized in that the method for generating parameterized bonding data based on a bonding wire model includes : Obtain the matching parameters in the integrated circuit design file; according to the matching parameters, screen the bonding wire models that meet the preset matching range from the bonding wire model library; perform interference simulation check on the screened bonding wire models; use Generate parametric bonding data from bond wire models checked by interference simulations.

In order to achieve the above object and other related objects, another aspect of the present invention provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the above-mentioned parameterization based on the bonding wire model is realized. Method for binding data.

To achieve the above object and other related objects, the last aspect of the present invention provides an electronic device, including: a processor and a memory; the memory is used to store computer programs, and the processor is used to execute the computer programs stored in the memory, The electronic device is made to execute the method for generating parameterized bonding data based on the bonding wire model.

As mentioned above, the method, medium and equipment for generating parameterized bonding data based on the bonding wire model according to the present invention have the following beneficial effects:

In the present invention, the bonding wire model is screened from the bonding wire model library by using the matching parameters of the design file, and the parameterized bonding data is generated after the interference simulation check is performed on the bonding wire model, and then the parameterized bonding data is imported into different bonding wires. Bonding equipment for different bonding scenarios. The present invention uses data learning and optimization judgment to replace manual operation, which greatly improves work efficiency and quality, thereby further reducing the production cost of the enterprise. On the one hand, it improves the shortcomings of manual operation, such as low efficiency, poor accuracy and adaptability, and more dependence on experience. On the other hand, compared with the existing bonding program generation method, the bonding equipment When certain objective conditions or environments of the system change, precise adaptive changes can be achieved, thereby improving the accuracy of bonding data.

Description of drawings

FIG. 1 shows a schematic flowchart of an embodiment of a method for generating parameterized bonding data based on a bonding wire model of the present invention.

FIG. 2 is a schematic diagram of wire bonding in an embodiment of the method for generating parameterized bonding data based on a bonding wire model of the present invention.

FIG. 3 is a schematic flowchart of another embodiment of the method for generating parameterized bonding data based on the bonding wire model of the present invention.

FIG. 4 shows an iterative flowchart of model library optimization in an embodiment of the method for generating parameterized bonding data based on the bonding wire model of the present invention.

FIG. 5 shows a flow chart of generating bonding data in an embodiment of the method for generating parameterized bonding data based on a bonding wire model of the present invention.

FIG. 6 is a schematic diagram of interference simulation in an embodiment of the method for generating parameterized bonding data based on the bonding wire model of the present invention.

FIG. 7 is a schematic view showing the structural connection of the electronic device of the present invention in an embodiment.

Component designation description

7 Electronic equipment

71 processor

72 memory

S10～S15 Steps

Detailed ways

Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic ideas of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and number of components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual implementation, and the component layout type may also be more complicated.

The method, medium and equipment for generating parameterized bonding data based on the bonding wire model of the present invention use data learning and optimization judgment to replace manual operations, greatly improving work efficiency and quality, thereby further reducing production costs of enterprises.

The principle and implementation of a method, medium and equipment for generating parameterized bonding data based on a bonding wire model in this embodiment will be described in detail below in conjunction with FIGS. 1 to 7, so that those skilled in the art do not need creative work Understand the method, medium and device for generating parameterized bonding data based on the bonding wire model in this embodiment.

Please refer to FIG. 1 , which shows a schematic flowchart of a method for generating parameterized bonding data based on a bonding wire model in an embodiment of the present invention. As shown in Figure 1, the method for generating parameterized bonding data based on the bonding wire model specifically includes the following steps:

S11. Obtain matching parameters in the integrated circuit design file.

In one embodiment, the matching parameters include: the height difference between the first pad and the second pad, the length of the line between the projected points of the first pad and the second pad on the horizontal plane, and the bonding Wire type and bond wire diameter.

In another embodiment, the matching parameters further include: pad parameters.

Specifically, the design files include but are not limited to: Allegro SIP design files, Mentor Expedition PCB design files or bonding point files (dxf, dwg, txt) etc.

根据装配方式确定第一焊盘D1的高度z，第二焊盘D2的高度z1，进而得到第一焊盘D1和第二焊盘D2之间的高度差z-z1。 Please refer to FIG. 2 , which shows a schematic view of wire bonding in an embodiment of the method for generating parameterized bonding data based on the bonding wire model of the present invention. As shown in Figure 2, according to the coordinates (x, y) of the first pad D1 and the coordinates (x1, y1) of the second pad D2, the projection points of the first pad D1 and the second pad D2 on the horizontal plane are calculated The length of the line between

The height z of the first pad D1 and the height z1 of the second pad D2 are determined according to the assembly method, and then the height difference z-z1 between the first pad D1 and the second pad D2 is obtained.

It should be noted that when point P and point P1 represent pads, L represents the length of the line between the projected points on the horizontal plane. When points P and P1 represent bonding points, z-z1 represents the height difference between the first bonding point D1' and the second bonding point D2', and L represents the length of the line between the projected points on the horizontal plane.

S12, according to the matching parameters, screen the bonding wire models meeting the preset matching range from the bonding wire model library.

Specifically, the matching parameters that will be obtained: the height difference between the first pad D1 and the second pad D2 (can be extracted, if not, it needs to be set), the first pad D1 and the second pad D2 are on the horizontal plane The length of the connection between the projection points, the type of the bonding wire, and the diameter of the bonding wire are used as the associated conditions. According to the preset matching range ±5%, the corresponding bonding wire model is automatically screened out in the bonding wire model library.

It should be noted that ±5% is one of the implementations of the preset matching range, and other reasonably set numerical ranges other than ±5% are also within the protection scope of the present invention.

In one embodiment, after step S12 and before step S13, the method for generating parameterized bonding data based on the bonding wire model further includes: analyzing the quantity of the selected bonding wire models.

In response to the number being one, the step of performing interference simulation check on the screened bonding wire model is performed.

In response to the number being at least two, using priority parameters to determine a preferred bonding wire model, and performing an interference simulation check on the preferred bonding wire model; the priority parameters include: at least one of frequency of use, update time, or set priority A sort of.

Specifically, if the priority parameter is frequency of use, select the bonding wire model with the highest frequency of use as the preferred bonding wire model; if the priority parameter is update time, select the bonding wire model with the latest update time as the preferred bonding wire model. A preferred bonding wire model; if the priority level is set as priority, then the bonding wire model with the highest priority level is selected as the preferred bonding wire model.

In response to the quantity being zero, a new bond wire model is created. Specifically, the creation method may be manual creation or model algorithm creation.

S13 , performing an interference simulation check on the screened bonding wire model.

In one embodiment, S13 specifically includes the following steps:

(1) Obtain the simplified model of the bonding wire according to the parameters of the arc trajectory, and obtain the simplified trajectory of the bonding wire according to the simplified model. By simplifying the trajectory of the bonding wire, it can be judged whether the height of the frame package and the highest point of the bonding wire meet the standard and whether the spacing between the bonding wires meets the minimum spacing requirement.

(2) Judging whether the simplified trajectory of the bonding wire satisfies the bonding wire diameter that the spacing between the bonding wires is greater than or equal to twice the bonding wire diameter, the height limit is less than or equal to the preset package height, and the size of the pad is greater than or equal to the bonding wire 4 times the diameter, the arc length is less than or equal to 100 times the diameter of the bonding wire, and special inspections for the double-wire bonding process during double-wire bonding. Specifically, the specific inspection process of the double-wire bonding process is: judge whether the bonding wire is double-wire bonding according to the number of coordinates on the same pad, and when the number of coordinates on the same pad is greater than 1, it can be identified as There is a double-wire bonding, if there is a double-wire bonding, for the special inspection of the double-wire bonding process, the two bonding wires are taken as a whole to judge whether the distance between the adjacent bonding wires is within the range within; no special inspection for double-wire bonding process is required if no double-wire bonding is present.

(3) If yes, it is determined that the interference simulation check is passed; if not, the interference simulation check is performed on another bonding wire model.

Specifically, if each parameter determined based on the simplified trajectory of the bonding wire is within a corresponding range, it is determined that the interference simulation check is passed, and the bonding wire model passed the interference simulation check is further used to generate parameterized bonding data.

If at least one parameter is not within the range, perform an interference simulation check on another bonding wire model; if only one bonding wire model is screened out before the interference simulation check, and at least one of each parameter is out of range after the simulation interference check Within the corresponding range, an alarm is sent and an abnormal report is output to inform relevant personnel that no bonding wire model that can be used to output parameterized bonding data has been found.

S14, generating parameterized bonding data using the bonding wire model checked by the interference simulation. The parameterized bonding data can be imported into different types of bonding equipment for use in different bonding scenarios. Among them, different bonding scenarios refer to different materials (specifically, different materials and diameters of bonding wires), different requirements for bonding accuracy, and so on.

Please refer to FIG. 3 , which is a schematic flowchart of another embodiment of the method for generating parameterized bonding data based on the bonding wire model of the present invention. As shown in FIG. 3, in one embodiment, before step S11, the method for generating parameterized bonding data based on the bonding wire model further includes:

S10, creating a bonding wire model library. Specifically include the following steps:

(1) Extract characteristic parameters and machine parameters from the bonding program.

Specifically, the characteristic parameters include: the height difference between the first bonding point and the second bonding point, the length of the line between the projection points of the first bonding point and the second bonding point on the horizontal plane, the type of bonding line, Bonding wire diameter, pad parameters corresponding to the first bonding point and the second bonding point.

It should be noted that, in different embodiments, the pad parameters may not be used as a necessary condition for screening and matching the bonding wire model.

以及第一键合点和第二键合点之间的高度差z-z1。 In practical applications, the bonding program contains coordinate parameters. Combined with Figure 2, according to the coordinates of the first bonding point (x, y, z) and the second bonding point (x1, y1, z1), calculate the first bond The length of the line between the projection point of the joint point and the second bonding point on the horizontal plane

and the height difference z-z1 between the first bonding point and the second bonding point.

The machine parameters include: ultrasonic mode, power, bonding time, bonding pressure, bonding temperature, solder ball size of the first bonding point; ultrasonic mode, power, bonding time, bonding pressure, bonding temperature; and arc trajectory parameters.

(2) Generating a bonding wire model according to the characteristic parameters and the machine parameters. Specifically, according to the characteristic parameters and machine parameters of each pair of bonding points, a bonding wire model corresponding to the pair of bonding points can be generated.

(3) Creating the bonding wire model library based on the generated bonding wire model.

Furthermore, priority parameters can also be extracted in the bonding program. For example, the frequency of use of each machine parameter, the update time of each machine parameter, or the preferred priority level, etc., any parameter value that can represent the priority order. In different embodiments, each priority parameter can be used in combination, or used alone.

In practical applications, one feature parameter in the bonding wire model library may correspond to multiple machine parameters, and the machine parameters are selected according to the preset priority parameters. For example: if the pre-set priority parameter is frequency priority, then directly select the machine parameter with the highest frequency of use; or if the pre-set priority parameter is update time, then directly select the machine parameter with the latest update time; or select the preferred priority level as priority, Then directly select the machine parameters with the highest priority.

Please refer to FIG. 4 , which shows an iterative flowchart of model library optimization in an embodiment of the method for generating parameterized bonding data based on the bonding wire model of the present invention. As shown in FIG. 4, in one embodiment, after step S14, the method for generating parameterized bonding data based on the bonding wire model further includes:

S15, based on the characteristic parameters of the produced bonding program, screen the bonding wire model meeting the preset matching range from the bonding wire model library, and update the machine parameters of the screened bonding wire model; and/or according to the welding The disk parameters update the machine parameters and feature parameters of the screened bonding wire model. In practical applications, the following process changes and pad parameters are updated:

Objectively speaking, specifically, because the parameters of the bonding machine will be continuously revised during the production process due to technological changes such as equipment upgrades and welding materials upgrades, it is necessary to continuously iterate the bonding wire model library. First determine a bonding program that has been produced, extract the characteristic parameters, filter the bonding wire model that meets the preset range in the bonding wire model library according to the characteristic parameters, and update the bonding machine in the searched bonding wire model parameter. Among them, the upgrading of welding materials refers to the change of the composition or proportion of the bonding wire material; the bonding program that has been produced indicates that it has already been used in production.

From a subjective point of view, in practice, the parameters of the parameterized bonding data output by the interference simulation of this scheme can be returned to the bonding wire model library to update the parameters after the trial production verification in actual production. The machine parameters and characteristic parameters of the bonding wire model; for the parameters that do not need to be adjusted after trial production verification in actual production, return to the bonding wire model library to update its use frequency.

Specifically, for pad parameters, if the searched bonding wire model already contains pad parameters (pad material and pad pattern shape), or the bonding program contains pad parameters, then update the above changed All bonding machine parameters and characteristic parameters. If the searched bonding wire model and bonding program do not contain pad parameters (pad material and pad pattern shape), find the corresponding design file, obtain the pad parameters, and add them to the corresponding In the bonding characteristic parameters, update all the bonding machine parameters and characteristic parameters that have changed.

Please refer to FIG. 5 , which shows a flow chart of generating bonding data in an embodiment of the method for generating parameterized bonding data based on the bonding wire model of the present invention. As shown in FIG. 5 , taking K&S equipment as an example, the specific implementation process of generating parameterized bonding data based on the bonding wire model in the present invention will be described.

First, based on the pad information in the design file, the matching parameters are extracted.

Read the Bonding data in the SiP (System In a Package, system-in-package) design file (SiP design file is one of the integrated circuit design files), and obtain the first pad information of each bonding wire from the Bonding data And the second pad information, the pad information includes: component name, pin name, pad center coordinates (X, Y coordinates), pad pattern shape and pad height. Among them, pad height: Calculate the cumulative height according to the component type, component physical size and vertical assembly method as the pad height; calculate the distance between the projection points on the horizontal plane of the pad through the pad coordinates and pad height of each pair of solder joints. The length L of the connecting line and the height difference of the pad. The unit of unmarked data in the following data is μm.

For the first pair of solder joints:

(1) First pad information: component name: DIE2, pin name: P2, pad pattern shape: 90*90um, pad coordinates (4800.0, 7206.0). DIE2 is a chip, thickness: 90, assembly method is stacking, and the height of the first pad is obtained: 180.

(2) Second pad information: component name: DIE1, pin name: P1, pad pattern shape: 90*90um, pad coordinates (4800.0, 7911.0). DIE1 is a chip, thickness: 90, assembly method is stacking, and the height of the second pad is obtained: 90.

Extract matching parameters as follows:

(3) The height difference between the first pad D1 and the second pad D2=180−90=90.

(4) The length L of the line between the projected points of the first pad D1 and the second pad D2 on the horizontal plane is expressed as:

(5) Set the bonding wire type: gold alloy, bonding wire diameter 0.8mil (20.32μm).

(6) The parameters of the pad are that the material of the pad is nickel gold, and the shape of the pad pattern is 90*90.

Then, use the matching parameters to search for a match in the bonding wire model library to obtain the bonding wire model in association.

The height difference between the first pad and the second pad: 90, the length of the line between the projected points of the first pad and the second pad on the horizontal plane L = 705.0, bonding wire type: gold alloy, bonding Wire diameter: 0.8mil (20.32μm) is used as a condition to search in the bonding wire model library according to the matching range ±5%, and two bonding wire models are obtained as follows:

The characteristic parameters of the first bonding wire model are: height difference 90; length of the line between projected points on the horizontal plane 705.0; bonding wire type: gold alloy, bonding wire diameter 0.8mil, (20.32μm); the first Bonding point pad parameters: pad material is nickel gold, pad pattern shape: 90*90; second bonding point pad parameters: pad material is nickel gold, pad pattern shape: 90*90.

The machine parameters of the first bonding line model are: bonding parameters of the first bonding point: ultrasonic mode: power mode; power output 400mW; bonding time: 7ms; bonding pressure: 35g; bonding temperature: 240°C; Ball size: 48.8um. Bonding parameters of the second bonding point: ultrasonic mode: power mode; power output 400mW; bonding time: 6ms; bonding pressure: 85g; bonding temperature: 240°C. The arc trajectory parameters of the current machine are: a. Arc: standard arc; b. Neck height: 3mil; c. Reverse shift: 3mil; d. Reverse shift angle: 90°, etc.

Priority parameters of the first bonding wire model: highest frequency of use: 50, parameter update time 2021-10-2016:00.

The characteristic parameters of the second bonding wire model are: the height difference is 90; the length of the line between the projected points on the horizontal plane is 705.0; the obtained bonding wire type: gold alloy, bonding wire diameter 0.8mil, (20.32μm); Pad parameters of the first bonding point: None; Pad parameters of the second bonding point: None. Furthermore, the second bonding wire model has no pad parameters, therefore, the pad parameters in the first pair of pad matching parameters can be filled to the second bonding wire during subsequent optimization iterations of the bonding wire model library In the pad parameters of the model, the update of the second bonding wire model is realized.

The machine parameters of the second bonding line model are: bonding parameters of the first bonding point: ultrasonic mode: power mode; power output 400mW; bonding time: 7ms; bonding pressure: 37g; bonding temperature: 240°C; Ball size: 49.0um. Bonding parameters of the second bonding point: ultrasonic mode: power mode; power output 400mW; bonding time: 6ms; bonding pressure: 85g; bonding temperature: 240°C. The arc trajectory parameters of the current machine are: a. Arc: standard arc; b. Neck height: 3mil; c. Reverse shift: 3mil; d. Reverse shift angle: 90°, etc.

The priority parameters of the second bonding wire model are: the highest frequency of use: 45, and the parameter update time is 2021-9-209:00.

If the priority parameter is set in advance to use frequency first, the first bonding wire model has a usage frequency of up to 50, and the second bonding wire model has a usage frequency of up to 45, then select the first bonding wire model as the bonding wire model M1.

For the second pair of solder joints:

(1) First pad information: component name: DIE2, pin name: P2, pad pattern shape: 85*85um, pad coordinates (4930.0, 7206.0). DIE2 is a chip, thickness: 90, assembly method is stacking, and the height of the first pad is obtained: 180.

(2) Second pad information: component name: DIE1, pin name: P1, pad pattern shape: 85*85um, pad coordinates (4890.0, 7911.0), DIE1 is chip thickness: 90, assembly method is stacking, Get the height of the second pad: 90.

Extract matching parameters as follows:

(3) The height difference between the first pad D1 and the second pad D2=180−90=90.

(4) The length L of the line between the projected points of the first pad D1 and the second pad D2 on the horizontal plane is expressed as:

(5) Set the bonding wire type: gold alloy, bonding wire diameter 0.8mil (20.32μm).

(6) The pad parameter is nickel gold, and the pad pattern shape is 85*85.

Then, use the matching parameters to search for a match in the bonding wire model library to obtain the bonding wire model in association.

The height difference between the first pad and the second pad: 90, the length of the line between the projected points of the first pad and the second pad on the horizontal plane L = 706.1, the type of bonding wire: gold alloy, bonding Wire diameter: 0.8mil (20.32μm) is used as a condition to search in the bonding wire model library according to the matching range ±5%, and only one bonding wire model is obtained as follows:

The characteristic parameters of this bonding wire model are: height difference 90; length of connection line between projected points on the horizontal plane 706.1; bonding wire type: gold alloy, bonding wire diameter 0.8mil, (20.32μm); first bond Joint pad parameters: pad material is nickel gold, pad pattern shape: 85*85; second bonding point pad parameters: pad material is nickel gold, pad pattern shape: 85*85.

The machine parameters of this bonding wire model are: bonding parameters of the first bonding point: ultrasonic mode: power mode; power output 400mW; bonding time: 7ms; bonding pressure: 35g; bonding temperature: 240°C; Size: 48.8um. Bonding parameters of the second bonding point: ultrasonic mode: power mode; power output 400mW; bonding time: 6ms; bonding pressure: 85g; bonding temperature: 240°C. The arc trajectory parameters of the current machine are: a. Arc: standard arc; b. Neck height: 3mil; c. Reverse shift: 3mil; d. Reverse shift angle: 90°, etc.

The priority parameters of this bonding wire model are: the highest frequency of use: 100, and the parameter update time is 2021-10-2016:02.

Because only one bonding model is screened out for this pair of solder joints, this bonding wire model is directly used as the bonding wire model M2.

The bonding wire model matching operation of subsequent pairs of solder points is performed one by one until all pairs of solder points are matched.

Then, check the interference simulation.

Please refer to FIG. 6 , which shows a schematic diagram of interference simulation in an embodiment of the method for generating parameterized bonding data based on the bonding wire model of the present invention. As shown in Figure 6, the simplified model of the bonding wire can be obtained according to the arc shape, wire diameter height and reverse displacement in the parameters of the wire arc trajectory, and the simplified trajectory of the bonding wire can be obtained by simulation according to the simplified model. The shape is a standard arc as an example. According to the above, the simplified model of the bonding line is: the first trajectory STEP1 (0, b), the second trajectory STEP2 (c, c), the third trajectory STEP3 (c*2 , 0), taking STEP1 as an example, the abscissa is the horizontal displacement of this section of the track, and the ordinate is the vertical displacement of this section of the track; the fourth section of the track is a straight line from STEP3 to the second bonding point.

The simplified trajectory of the bonding wire can be obtained according to the arc as a standard arc, the height of the wire diameter as 3mil (75μm) and the reverse shift of 3mil (75μm): the first trajectory STEP1 (0.0, 75.0), the second trajectory STEP2 (75.0, 75.0), the third track STEP3 (150.0, 0.0).

The following is based on whether the spacing between bonding wires is greater than or equal to twice the diameter of the bonding wire, the height limit is less than or equal to the preset package height, the size of the pad is greater than or equal to 4 times the diameter of the bonding wire, and the arc length is less than or equal to the bonding 100 times the wire diameter for interference simulation check.

(1) Perform interference simulation check on the spacing between bonding wires, as follows:

Obtain each key point of the space curve corresponding to the trajectory according to the simplified trajectory, and determine the line segment corresponding to the simplified trajectory according to the key point. The algorithm for the shortest distance between two line segments in space is: calculate the length of the common perpendicular between the two line segments (1 value), the vertical distance from each endpoint to another line segment (4 values), the distance between the four endpoints (4 values), a total of 9 values are obtained, among which the smallest value is selected as the space The minimum distance between two line segments in . After calculation, the shortest distance between two bonding wires is 90°.

From the above example of paired solder joint matching, it can be seen that the diameter of the bonding wire is 20.32 μm, and the shortest distance between two bonding wires is 90 greater than twice the diameter of the bonding wire: 20.32*2=40.64, so the distance between the bonding wires Spacing simulation check passed.

(2) Perform interference simulation check on the height limit, as follows:

The judgment standard is whether the highest point of the bonding wire is less than or equal to the preset package height; the package height can be obtained according to the device type and design standard: 900μm.

According to the data of STEP1, STEP2, and STEP3 respectively, determine the arc height (H): STEP1 (0.0, 75.0), STEP2 (75.0, 75.0), STEP3 (150.0, 0.0), calculate the arc height, that is, add the vertical displacement value (This example is calculated based on the first bonding point): 75.0+75.0+0.0=150.

The highest point of the bonding wire is: frame base 300 + first bonding point height 180 + arc height 150 + bonding wire radius 10.16 = 640.16, which is less than the package height of 900, that is, the height limit simulation check has passed.

(3) Perform interference simulation check on the pad size, as follows:

The pad size of the bonding wire model M1 is 90*90, and 4 times the diameter of the bonding wire is 20.32*4=81.28, satisfying that the size of the pad is greater than 4 times the diameter of the bonding wire.

The pad size of the bonding wire model M2 is 85*85, and 4 times the diameter of the bonding wire is 20.32*4=81.28, satisfying that the size of the pad is greater than 4 times the diameter of the bonding wire.

Therefore, the pad size simulation check of the bonding wire model M1 and the bonding wire model M2 passes.

(4) Perform interference simulation check on the arc length, as follows:

The criterion for judging is whether the arc length is less than or equal to 100 times the diameter of the bonding wire.

The height difference between the first pad D1 and the second pad D2 = 180-90 = 90 (H1), the projected length on the horizontal plane = 705 (L), STEP1 (0.0, 75.0), STEP2 (75.0, 75.0), STEP3(150.0, 0.0), according to the corresponding coordinates of STEP1, STEP2, STEP3, the arc length corresponding to these three trajectories is calculated as:

The bonding wire length corresponding to STEP4 of the bonding wire model M1 is:

The bonding wire length corresponding to STEP4 of the bonding wire model M2 is:

Therefore, the total arc length of the bonding wire model M1=331.1+536.7=867.8;

The total arc length of the bonding wire model M2=331.1+537.6=868.7.

From the above example of paired solder joint matching, it can be seen that the diameter of the bonding wire is 20.32 μm. Through analysis and comparison, the arc length (867.8) of the bonding wire model M1 and the arc length (868.7) of the bonding wire model M2 are both less than or equal to the diameter of the bonding wire. 100 times (20.32*100=2032), so the arc length simulation check is passed.

It should be noted that, since the examples cited in this solution are all single bonding wires, the interference simulation inspection of the double-wire bonding process is not involved.

Finally, generate and output parameterized bonding data based on the bonding wire model checked by interference simulation, and import different bonding equipment for use in different bonding scenarios. Generate parameterized bonding data based on the bonding wire model after the interference simulation check, and convert the format of the bonding data according to the bonding data format required by the current equipment. After the format conversion is completed, import the current bonding equipment to generate a bonding program for current production. The different bonding scenarios include but are not limited to: different materials (bonding wire materials), different bonding precision requirements, and the like.

Based on the bonding wire model passed the interference simulation check, corresponding parameterized bonding data is generated, the parameterized bonding data being: the coordinates and machine parameters of the bonding point corresponding to the bonding wire model passed the simulation check. Manage the parameterized bonding data in a list to form the parameterized bonding data table in Table 1.

Table 1 Parameterized bonding data table

The scope of protection of the method for generating parameterized bonding data based on the bonding wire model described in the present invention is not limited to the execution order of the steps listed in this embodiment. The solutions implemented by replacement are all included in the protection scope of the present invention.

This embodiment provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the method for generating parameterized bonding data based on a bonding wire model is realized.

Those of ordinary skill in the art can understand that all or part of the steps for implementing the above method embodiments can be completed by hardware related to computer programs. The aforementioned computer program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above-mentioned method embodiments; and the aforementioned computer-readable storage medium includes: ROM, RAM, magnetic disk or optical disk and other computer storage media that can store program codes.

Please refer to FIG. 7 , which is a schematic structural connection diagram of an electronic device of the present invention in an embodiment. As shown in FIG. 7 , this embodiment provides an electronic device 7, which specifically includes: a processor 71 and a memory 72; the memory 72 is used to store a computer program, and the processor 71 is used to execute the program stored in the memory 72. A computer program, so that the electronic device 7 executes each step of the method for generating parameterized bonding data based on the bonding wire model.

Above-mentioned processor 71 can be general-purpose processor, comprises central processing unit (Central Processing Unit, be called for short CPU), network processor (Network Processor, be called for short NP) etc.; Can also be Digital Signal Processing (Digital Signal Processing, be called for short DSP) ), Application Specific Integrated Circuit (ASIC for short), Field Programmable Gate Array (Field Programmable Gate Array, FPGA for short) or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components.

The above-mentioned memory 72 may include a random access memory (Random Access Memory, RAM for short), and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

In practical applications, the electronic device may include memory, storage controller, one or more processing units (CPU), peripheral interface, RF circuit, audio circuit, speaker, microphone, input/output (I/O) Computers with all or some components of subsystems, displays, other output or control devices, and external ports; said computers include, but are not limited to, computers such as desktops, laptops, tablets, smartphones, Personal Digital Assistants , referred to as PDA) and other personal computers, the electronic device can also be a server, and the server can be arranged on one or more physical servers according to various factors such as functions and loads, or can be composed of distributed or centralized server clusters The cloud server configured is not limited in this embodiment.

In summary, the method, medium and equipment for generating parameterized bonding data based on the bonding wire model in the present invention use the matching parameters of the design file to screen the bonding wire model from the bonding wire model library, and After the model is checked for interference simulation, parametric bonding data is generated, and then the parametric bonding data is imported into different bonding equipment for use in different bonding scenarios. The present invention uses data learning and optimization judgment to replace manual operation, which greatly improves work efficiency and quality, thereby further reducing the production cost of the enterprise. On the one hand, it improves the shortcomings of manual operation, such as low efficiency, poor accuracy and adaptability, and more dependence on experience. On the other hand, compared with the existing bonding program generation method, the bonding equipment When certain objective conditions or environments of the system change, precise adaptive changes can be achieved, thereby improving the accuracy of bonding data. The invention effectively overcomes various shortcomings in the prior art and has high industrial application value.

The above-mentioned embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed in the present invention should still be covered by the claims of the present invention.

Claims (10)

A method for generating parameterized bonding data based on a bonding wire model, characterized in that the method for generating parameterized bonding data based on a bonding wire model comprises: Obtain the matching parameters in the IC design file; According to the matching parameters, the bonding wire models meeting the preset matching range are screened from the bonding wire model library; Perform interference simulation check on the screened bonding wire model; Generate parametric bonding data using bond wire models checked by interferometric simulations. The method for generating parameterized bonding data based on a bonding wire model according to claim 1, characterized in that: The matching parameters include: the height difference between the first pad and the second pad, the length of the line between the projection points of the first pad and the second pad on the horizontal plane, the type of bonding wire and the bonding wire diameter. The method for generating parameterized bonding data based on a bonding wire model according to claim 1, characterized in that, according to the matching parameters, the bonding wire model library that meets the preset matching range is screened After the step of the wire model, before the interference simulation check is performed on the screened bonding wire model, the method for generating parameterized bonding data based on the bonding wire model further includes: Analyze the number of bond wire models screened out; In response to the number being one, performing a step of performing interference simulation check on the screened bonding wire model; In response to the number being at least two, using priority parameters to determine a preferred bonding wire model, and performing an interference simulation check on the preferred bonding wire model; the priority parameters include: at least one of frequency of use, update time, or set priority A sort of; In response to the quantity being zero, a new bond wire model is created. The method for generating parameterized bonding data based on a bonding wire model according to claim 3, wherein the step of determining a preferred bonding wire model using priority parameters comprises: If the priority parameter is frequency of use, then selecting the bonding wire model with the highest frequency of use as the preferred bonding wire model; If the priority parameter is update time, then select the bonding wire model with the latest update time as the preferred bonding wire model; If the priority level is set as priority, the bonding wire model with the highest priority level is selected as the preferred bonding wire model. The method for generating parameterized bonding data based on a bonding wire model according to claim 1, wherein the step of performing interference simulation check on the screened bonding wire model includes: Obtaining a simplified model of the bonding wire according to the arc trajectory parameters, and obtaining a simplified trajectory of the bonding wire according to the simplified model; Judging whether the simplified trajectory of the bonding wires satisfies at the same time that the distance between the bonding wires is greater than or equal to twice the diameter of the bonding wire, the height limit is less than or equal to the preset package height, and the size of the pad is greater than or equal to 4 times the diameter of the bonding wire. times, the arc length is less than or equal to 100 times the diameter of the bonding wire, and the special inspection for the double-wire bonding process during double-wire bonding; If yes, it is determined that the interference simulation check is passed; if not, the interference simulation check is performed on another bonding wire model. The method for generating parameterized bonding data based on a bonding wire model according to any one of claims 1 to 5, wherein, before the step of obtaining the matching parameters in the integrated circuit design file, the bond-based Methods for generating parametric bonding data from the bondline model also include: Extract characteristic parameters and machine parameters from the bonding program; generating a bonding wire model according to the characteristic parameters and the machine parameters; The bond wire model library is created based on the generated bond wire models. The method for generating parameterized bonding data based on a bonding wire model according to claim 6, characterized in that: The characteristic parameters include: the height difference between the first bonding point and the second bonding point, the length of the line between the projection points of the first bonding point and the second bonding point on the horizontal plane, the type of bonding line, the bonding line Diameter, pad parameters corresponding to the first bonding point and the second bonding point; The machine parameters include: ultrasonic mode, power, bonding time, bonding pressure, bonding temperature, solder ball size of the first bonding point; ultrasonic mode, power, bonding time, bonding pressure, bonding temperature; and arc trajectory parameters. The method for generating parameterized bonding data based on a bonding wire model according to claim 6, wherein after said step of generating parameterized bonding data using a bonding wire model checked by interference simulation, said The method of generating parametric bonding data based on the bonding wire model also includes: Based on the characteristic parameters of the produced bonding program, the bonding wire model meeting the preset matching range is screened from the bonding wire model library, and the machine parameters of the screened bonding wire model are updated; and/or according to the pad parameters Update the machine parameters and feature parameters of the screened bond wire models. A computer-readable storage medium, on which a computer program is stored, characterized in that, when the computer program is executed by a processor, the parameterized bond generation based on the bonding wire model described in any one of claims 1 to 8 is realized. data method. An electronic device, characterized in that it includes: a processor and a memory; The memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the electronic device executes the parameter generation based on the bonding wire model according to any one of claims 1 to 8 A way to chemically bond data.

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