WO2023015692A1 - 一种电池保护电路板及其焊接方法 - Google Patents
一种电池保护电路板及其焊接方法 Download PDFInfo
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- WO2023015692A1 WO2023015692A1 PCT/CN2021/121085 CN2021121085W WO2023015692A1 WO 2023015692 A1 WO2023015692 A1 WO 2023015692A1 CN 2021121085 W CN2021121085 W CN 2021121085W WO 2023015692 A1 WO2023015692 A1 WO 2023015692A1
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- battery protection
- board
- area
- welded
- copper paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the invention relates to the field of battery protection, in particular to a battery protection circuit board and a welding method thereof.
- the battery protection board is an integrated circuit board that protects the rechargeable battery.
- the protection function of the battery is usually completed by the protection circuit board and other current devices. It is necessary to monitor the battery accurately at all times in the environment of -40°C to +85°C.
- the voltage and the current of the charge-discharge circuit can control the on-off of the current circuit in real time.
- the so-called battery protection refers to overcharge protection, over discharge protection, overcurrent, short circuit protection and ultra-high temperature charge and discharge protection.
- the battery protection board is the safety guarantee of the mobile phone battery and even the entire mobile phone. With the commercialization of 5G, users have brought faster Internet experience and more smart applications, and the hardware cost of mobile phones has gradually increased.
- the battery protection circuit board mostly uses a combination of soft and hard boards, that is, the battery protection circuit board is divided into a hard board area connected to the battery, and a soft board area that can be bent freely.
- the connector design of the soft board area is the same as that of a mobile phone connected.
- the battery protection board is the safety guarantee of the mobile phone battery and even the entire mobile phone. Therefore, mobile phone manufacturers and battery module manufacturers attach great importance to the high reliability of battery protection boards.
- the present application proposes a battery protection circuit board and its welding method to improve the reliability of the battery protection circuit board.
- the battery protection circuit board includes a battery protection hard board and a battery protection soft board, including: manufacturing the battery protection hard board and the battery protection soft board respectively The area to be welded; copper paste is made on the area to be welded; the area to be welded on the battery protection hard board and the area to be welded on the battery protection soft board are connected by copper paste bonding.
- the steps of making the area to be welded on the battery protection hard board and the battery protection soft board respectively include: respectively opening grooves in the vertical direction of the battery protection hard board and the battery protection soft board to form the area to be welded;
- the steps of making copper paste in the area include: making copper paste in the groove.
- the step of connecting the area to be welded on the battery protection hard board and the area to be welded on the battery protection soft board through copper paste bonding includes: bonding the copper paste on the battery protection hard board to the copper on the battery protection soft board through a heating process.
- the paste forms a bonding connection in the vertical direction.
- the step of making copper paste on the area to be welded includes: making an adhesive layer around the groove.
- the steps of making the area to be welded on the battery protection hard board and the battery protection soft board respectively also includes: making an adhesive layer on the non-welding area of the battery protection hard board and the battery protection soft board; The step of connecting the area to be welded and the area to be welded of the battery protection flexible board through copper paste bonding, further comprising: bonding the non-welded area of the battery protection hard board to the non-welded area of the battery protection soft board through an adhesive layer .
- the battery protection rigid board includes a multi-layer PCB board.
- the application also provides a battery protection circuit board
- the battery protection circuit board includes a battery protection hard board and a battery protection soft board; the area to be welded on the battery protection hard board and the area to be welded on the battery protection soft board With copper paste, the non-welding area of the battery protection hard board and the non-welding area of the battery protection soft board are made with an adhesive layer, and the to-be-welded area of the battery protection hard board and the to-be-welded area of the battery protection soft board are bonded by copper paste For connection, the non-welded areas of the battery protection hard board and the battery protection soft board are bonded by an adhesive layer.
- the copper paste on the battery protection hard board is perpendicular to the battery protection hard board
- the copper paste on the battery protection soft board is vertical to the battery protection soft board
- the battery protection hard board and the battery protection soft board are bonded in the vertical direction through the copper paste connect.
- the battery protection hard board includes a multi-layer PCB board; the battery protection hard board is also provided with through holes, and the through holes penetrate the battery protection hard board.
- the battery protection flexible board includes a flexible substrate and multi-layer PCB boards located on both sides of the flexible substrate.
- the beneficial effect of the application is: by opening grooves on the battery protection hard board and the battery protection soft board, forming areas to be welded and areas not to be welded, making copper paste on the area to be welded, and making an adhesive layer on the non-welded area , so that the area to be welded of the battery protection hard board and the area to be welded of the battery protection soft board are connected by copper paste bonding, and the non-welded area of the battery protection hard board and the non-welded area of the battery protection soft board are bonded by an adhesive layer connection, so as to improve the reliability of the battery protection hard board and battery protection soft board through the welding area limitation of solder paste welding and the circuit failure caused by soldering voids. Soldering is performed through copper paste, and the non-welding area is bonded through an adhesive layer, which increases the welding area of the battery protection hard board and battery protection soft board, and improves the reliability problem.
- FIG. 1 is a schematic flow diagram of an embodiment of a welding method for a battery protection circuit board in the present application
- FIG. 2 is a schematic structural diagram of an embodiment of a battery protection hard board of the present application
- Fig. 3 is a schematic structural diagram of an embodiment of the battery protection soft board of the present application.
- Fig. 4 is a structural schematic diagram of another embodiment of the welding method of the battery protection circuit board of the present application.
- FIG. 5 is a schematic structural diagram of an embodiment of a battery protection circuit board of the present application.
- the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.
- FIG. 1 is a schematic flowchart of an embodiment of a welding method for a battery protection circuit board of the present application.
- the battery protection circuit board includes a battery protection hard board and a battery protection soft board, including:
- Step S11 Make areas to be welded on the battery protection hard board and the battery protection soft board respectively.
- the battery protection hard board and the battery protection soft board can be made by PCB boards respectively, which are two independent boards, and the battery protection hard board and the battery protection soft board are welded together by welding.
- the battery protection hard board and the battery protection soft board are partially overlapped, and two parts of the battery protection circuit board (the battery protection hard board and the battery protection soft board) can be manufactured at the same time.
- the battery protection hard board includes a multi-layer PCB board, and a via hole is provided on the battery protection hard board, and the via hole runs through the battery protection hard board.
- a structural schematic diagram of an embodiment of a hard board wherein the battery protection hard board includes at least a first copper layer L1, a second copper layer L2, a third copper layer L3 and a fourth copper layer L4, the first copper layer L1 and the second copper layer A PP resin layer is provided between the layers L2, a substrate layer is provided between the second copper layer L2 and the third copper layer L3, the substrate layer is the core layer of the battery protection hard board, the third copper layer L3 and the fourth copper layer L4 A PP resin layer is arranged between them.
- the first copper layer L1 and the second copper layer L2 are arranged symmetrically with the third copper layer L3 and the fourth copper layer L4, and their thicknesses are all the same.
- the first copper layer L1 and the second copper layer L2 and the third copper layer L3 and the fourth copper layer L4 may be arranged asymmetrically, which is not limited herein.
- the battery protection rigid board is further provided with a via T, and the conduction hole T penetrates through the first copper layer L1 , the second copper layer L2 , the third copper layer L3 and the fourth copper layer L4 of the battery protection rigid board.
- the battery protection flexible board includes a flexible substrate and copper layers and covering layers on both sides of the flexible substrate.
- FIG. 3 is a schematic structural diagram of an embodiment of the battery protection flexible board of the present application.
- the battery protection soft board includes a flexible substrate F, and a first copper layer F1 and a second copper layer F2 located on opposite sides of the flexible substrate F, on the side of the first copper layer F1 and the second copper layer F2 away from the flexible substrate F Covering layers C1 and C2 are also arranged on the surface, and the covering layers C1 and C2 may be the same or different, and the covering layers C1 and C2 may include a soft board protective adhesive layer.
- the steps to make the area to be soldered on the battery protection hard board and battery protection soft board include:
- Grooves are provided on the vertical direction of the battery protection hard board and grooves are provided on the vertical direction of the battery protection soft board to form areas to be welded.
- Step S12 making copper paste on the area to be soldered.
- copper paste is poured into the groove in step S12 to fill up the groove, and the copper paste is cooled to form a copper paste.
- copper paste is a substance that is liquid at high temperature and turns into paste after cooling.
- Step S13 Connect the area to be welded of the battery protection hard board and the area to be welded of the battery protection soft board through copper paste bonding.
- the copper paste of the battery protection hard board and the copper paste of the battery protection soft board are aligned, and then the copper paste of the battery protection hard board and the copper paste of the battery protection soft board undergo a bonding reaction through a heating process, so that The copper paste of the battery protection hard board and the copper paste of the battery protection soft board form a connection in the vertical direction.
- the beneficial effect of this embodiment is: by making the area to be welded on the battery protection hard board and the battery protection soft board respectively, and making copper paste on the rest to be welded, the area to be welded on the battery protection hard board and the battery protection soft board to be welded
- the welding area is connected by copper paste bonding, so that the battery protection hard board and the battery protection soft board can be interconnected and conducted through copper paste in the direction perpendicular to the board surface, so as to replace the traditional solder paste soldering method and improve the solder paste Long-term reliability problems such as circuit failure (CFA) caused by solder voids caused by soldering.
- CFA circuit failure
- FIG. 4 is a schematic structural diagram of another embodiment of the welding method for a battery protection circuit board of the present application. As shown in Figure 4, including:
- Step S21 making areas to be welded on the battery protection hard board and the battery protection soft board respectively.
- Step S22 Make copper paste on the area to be welded, and make an adhesive layer on the non-welding area of the battery protection hard board and the battery protection soft board.
- copper paste is poured into the groove to form a copper paste, and an adhesive layer is formed around the groove.
- Step S23 Connect the to-be-welded area of the battery protection hard board and the to-be-welded area of the battery protection soft board through copper paste bonding, and connect the non-welding area of the battery protection hard board and the non-welding area of the battery protection soft board through adhesive layer bonding.
- the beneficial effects of this embodiment are: by opening grooves on the battery protection hard board and the battery protection soft board, the area to be welded and the area not to be welded are formed, copper paste is made on the area to be welded, and adhesive glue is made on the non-welded area layer, so that the area to be welded of the battery protection hard board and the area to be welded of the battery protection soft board are connected by copper paste bonding, and the non-welded area of the battery protection hard board and the non-welded area of the battery protection soft board are connected by an adhesive layer Bonding, so as to improve the reliability of the battery protection hard board and the battery protection soft board through the welding area limitation of solder paste and the circuit failure caused by the welding void.
- the battery protection hard board and the battery protection soft board to be welded
- the area is welded by copper paste, and the non-welded area is bonded by an adhesive layer, which increases the welding area of the battery protection hard board and battery protection soft board, and improves the reliability problem.
- the present application also provides a structure of a battery protection circuit board, as shown in FIG. 5 , which is a schematic structural diagram of an embodiment of the battery protection circuit board of the present application.
- the battery protection circuit board includes a battery protection hard board 1 and a battery protection soft board 2. Copper paste is made on the to-be-welded area 11 of the battery protection hard board 1 and the to-be-welded area 21 of the battery protection soft board 2, and the battery protection hard board 1 An adhesive layer is made on the non-welding area 12 and the non-welding area 22 of the battery protection soft board 2, so that the to-be-welded area 11 of the battery protection hard board 1 and the to-be-welded area 21 of the battery protection soft board 2 pass through the copper paste bond The non-welding area 12 of the battery protection hard board 1 and the non-welding area 22 of the battery protection soft board 2 are bonded by an adhesive layer.
- the battery protection hard board includes a multi-layer PCB board, specifically including a first copper layer L1, a second copper layer L2, a third copper layer L3 and a fourth copper layer L4, and the connection between the first copper layer L1 and the second copper layer L2
- a PP resin layer is arranged between them, a substrate layer is arranged between the second copper layer L2 and the third copper layer L3, the substrate layer is the core layer of the battery protection hard board, and a substrate layer is arranged between the third copper layer L3 and the fourth copper layer L4
- the first copper layer L1 and the second copper layer L2 are arranged symmetrically with the third copper layer L3 and the fourth copper layer L4, and their thicknesses are all the same.
- the first The copper layer L1 and the second copper layer L2 and the third copper layer L3 and the fourth copper layer L4 may be arranged asymmetrically, which is not limited herein.
- the battery protection hard board is also provided with a conduction hole T, and the conduction hole T penetrates the first copper layer L1, the second copper layer L2, the third copper layer L3 and the fourth copper layer L4 of the battery protection hard board,
- the via hole T is also filled with resin.
- Covering layers P1 and P2 are also provided on opposite sides of the battery protection hard board 1 , and grooves are formed on the cover layer P2 on the side of the battery protection hard board 1 close to the battery protection soft board 2 to form a region 11 to be welded.
- the battery protection soft board includes a flexible substrate F, and a first copper layer F1 and a second copper layer F2 located on opposite sides of the flexible substrate F, on the side of the first copper layer F1 and the second copper layer F2 away from the flexible substrate F
- Covering layers C1 and C2 are also arranged on the surface, and the covering layers C1 and C2 may include a soft board protective adhesive layer. Grooves are formed on the cover layer P1 of the battery protection soft board 2 close to the battery protection hard board 1 to form a region 21 to be welded.
- the beneficial effects of this embodiment are: by opening grooves on the battery protection hard board and the battery protection soft board, the area to be welded and the area not to be welded are formed, copper paste is made on the area to be welded, and adhesive glue is made on the non-welded area layer, so that the area to be welded of the battery protection hard board and the area to be welded of the battery protection soft board are connected by copper paste bonding, and the non-welded area of the battery protection hard board and the non-welded area of the battery protection soft board are connected by an adhesive layer Bonding, so as to improve the reliability of the battery protection hard board and the battery protection soft board through the welding area limitation of solder paste and the circuit failure caused by the welding void.
- the battery protection hard board and the battery protection soft board to be welded
- the area is welded by copper paste, and the non-welded area is bonded by an adhesive layer, which increases the welding area of the battery protection hard board and battery protection soft board, and improves the reliability problem.
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Abstract
本申请公开了一种电池保护电路板及其焊接方法，其中，电池保护电路板的焊接方法包括：分别在所述电池保护硬板和所述电池保护软板上制作待焊接区域；在所述待焊接区域制作铜膏；将所述电池保护硬板的待焊接区域和所述电池保护软板的待焊接区域通过所述铜膏键合连接。通过上述方法，改善通过锡膏焊接带来的焊接空洞导致的电路不通等长期可靠性问题。
Description
本发明涉及电池保护领域，特别是涉及一种电池保护电路板及其焊接方法。
电池保护板是针对可充电电池起保护作用的集成电路板，电池的保护功能通常由保护电路板和其它电流器件协同完成，需要在-40℃至+85℃的环境下时刻准确的监视电芯的电压和充放回路的电流，即时控制电流回路的通断。所谓电池保护，即为过充保护、过放保护、过流、短路保护以及超高温充放电保护。电池保护板是手机电池乃至整台手机的安全保障。随着5G的商用，为用户带来了更快的上网体验及更多的智能应用，手机的硬件成本逐步提高。体现在电池模组方面，电池保护电路板多采用软硬结合板，即电池保护电路板分为连接电池的硬板区域，以及可以自由弯折的软板区域，软板区域设计连接器同手机相连。
电池保护板是手机电池乃至整台手机的安全保障。因此，各手机厂商和电池模组厂商尤为重视电池保护板的高可靠性。
为了规避软板与硬板用锡膏焊接带来的CAF(焊锡空洞)等长期可靠性风险，现在主流厂商多采用软硬结合板的方式制作电池保护电路板，而软硬结合板的成本相较于软板与硬板焊接的成本高，从而限制了大部分低成本厂商的发展。
【发明内容】
本申请提出了一种电池保护电路板以其焊接方法，以提高电池保护电路板的可靠性。
为解决上述技术问题，本申请提供了一种电池保护电路板的焊接方法，电池保护电路板包括电池保护硬板和电池保护软板，包括：分别在电池保护硬板和电池保护软板上制作待焊接区域；在待焊接区域制作铜膏；将电池保护硬板的待焊接区域和电池保护软板的待焊接区域通过铜膏键合连接。
其中，分别在电池保护硬板和电池保护软板上制作待焊接区域的步骤，包括：分别在电池保护硬板和电池保护软板的垂直方向上开设凹槽，形成待焊接 区域；在待焊接区域制作铜膏的步骤，包括：在凹槽内制作铜膏。
其中，将电池保护硬板的待焊接区域和电池保护软板的待焊接区域通过铜膏键合连接的步骤，包括：通过加热工艺将电池保护硬板的铜膏与电池保护软板上的铜膏在垂直方向上形成键合连接。
其中，在待焊接区域制作铜膏的步骤，包括：在凹槽周围制作粘接胶层。
其中，分别在电池保护硬板和电池保护软板上制作待焊接区域的步骤之后，还包括：在电池保护硬板和电池保护软板的非焊接区域制作粘接胶层；将电池保护硬板的待焊接区域和电池保护软板的待焊接区域通过铜膏键合连接的步骤，还包括：将电池保护硬板的非焊接区域与电池保护软板的非焊接区域通过粘接胶层粘接。
其中，电池保护硬板包括多层PCB板。
为了解决上述技术问题，本申请还提供一种电池保护电路板，电池保护电路板包括电池保护硬板和电池保护软板；电池保护硬板的待焊接区域和电池保护软板的待焊接区域制作有铜膏，电池保护硬板的非焊接区域和电池保护软板的非焊接区域制作有粘接胶层，电池保护硬板的待焊接区域与电池保护软板的待焊接区域通过铜膏键合连接，电池保护硬板和电池保护软板的非焊接区域通过粘接胶层粘接。
其中，电池保护硬板上的铜膏垂直于电池保护硬板，电池保护软板上的铜膏垂直与电池保护软板，电池保护硬板和电池保护软板通过铜膏在垂直方向上键合连接。
其中，电池保护硬板包括多层PCB板；电池保护硬板上还设置有通孔，通孔贯穿电池保护硬板。
其中，电池保护软板包括柔性基板和位于柔性基板两侧的多层PCB板。
本申请的有益效果是：通过在电池保护硬板和电池保护软板上开设凹槽，形成待焊接区域和非待焊接区域，在待焊接区域制作铜膏，在非焊接区域制作粘接胶层，从而使电池保护硬板的待焊接区域和电池保护软板的待焊接区域通过铜膏键合连接，电池保护硬板的非焊接区域和电池保护软板的非焊接区域通过粘接胶层粘接，从而改善电池保护硬板和电池保护软板通过锡膏焊接的焊接面积限制和焊接空洞导致的电路不通的可靠性问题，本申请中通过电池保护硬板和电池保护软板的待焊接区域通过铜膏进行焊接，非焊接区域通过粘接胶层进行粘接，增加了电池保护硬板和电池保护软板焊接的面积，改善了可靠性问 题。
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请电池保护电路板的焊接方法一实施方式的流程示意图；
图2为本申请电池保护硬板一实施方式的结构示意图；
图3为本申请电池保护软板一实施方式的结构示意图；
图4为本申请电池保护电路板的焊接方法另一实施方式的结构示意图；
图5为本申请电池保护电路板一实施方式的结构示意图。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本申请实施例中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请。在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上文清楚地表示其他含义，“多种”一般包含至少两种，但是不排除包含至少一种的情况。
应当理解，本文中使用的术语“和/或”仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
应当理解，本文中使用的术语“包括”、“包含”或者其他任何变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者 设备中还存在另外的相同要素。
需要说明，若本发明实施例中有涉及方向性指示(诸如上、下、左、右、前、后……)，则该方向性指示仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的每一个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
本申请提供一种电池保护电路板的焊接方法，具体请参阅图1，图1为本申请电池保护电路板的焊接方法一实施方式的流程示意图。如图1所示，其中，电池保护电路板包括电池保护硬板和电池保护软板，包括：
步骤S11：分别在电池保护硬板和电池保护软板上制作待焊接区域。
在本实施例中，电池保护硬板和电池保护软板可以分别通过PCB板制作，是两个独立的板件，通过焊接的方式将电池保护硬板和电池保护软板焊接在一起。在其它软硬结合板的实施例中，电池保护硬板和电池保护软板有部分重叠，可同时制作电池保护电路板的两个部分(电池保护硬板和电池保护软板)。
其中，电池保护硬板包括多层PCB板，电池保护硬板上还设置有导通孔，该导通孔贯穿电池保护硬板，其具体结构如图2所示，图2为本申请电池保护硬板一实施方式的结构示意图，其中，电池保护硬板至少包括第一铜层L1、第二铜层L2、第三铜层L3以及第四铜层L4，第一铜层L1与第二铜层L2之间设置有PP树脂层，第二铜层L2和第三铜层L3之间设置有基板层，基板层为电池保护硬板的核心层，第三铜层L3和第四铜层L4之间设置有PP树脂层，在本实施例中，第一铜层L1和第二铜层L2与第三铜层L3和第四铜层L4对称设置，其厚度均相同，在其它实施例中，第一铜层L1和第二铜层L2与第三铜层L3和第四铜层L4可以不对称设置，在此不作限定。其中，电池保护硬板中还设置有导通孔T，该导通孔T贯穿电池保护硬板的第一铜层L1、第二铜层L2、第三铜层L3以及第四铜层L4。
其中，电池保护软板包括柔性基板以及柔性基板两侧的铜层和覆盖层，具体请进一步参阅图3，图3为本申请电池保护软板一实施方式的结构示意图。电 池保护软板包括柔性基板F，和位于柔性基板F的相对两侧的第一铜层F1和第二铜层F2，在第一铜层F1和第二铜层F2远离柔性基板F的一侧表面上还设置有覆盖层C1和C2，覆盖层C1和C2可以相同也可以不同，覆盖层C1和C2可以包括软板保护胶层。
在电池保护硬板和电池保护软板上制作待焊接区域的步骤包括：
在电池保护硬板的垂直方向上开设凹槽和在电池保护软板的垂直方向上开设凹槽，以形成待焊接区域。
步骤S12：在待焊接区域制作铜膏。
具体地，在步骤S12中的凹槽内灌设铜浆以填满凹槽，使铜浆冷却形成铜膏。其中，铜膏是一种在高温下呈液态，冷却后变成膏体的物质。
步骤S13：将电池保护硬板的待焊接区域和电池保护软板的待焊接区域通过铜膏键合连接。
具体地，将电池保护硬板的铜膏和电池保护软板的铜膏对位处理，然后通过加热工艺使电池保护硬板的铜膏和电池保护软板上的铜膏发生键合反应，使电池保护硬板的铜膏和电池保护软板的铜膏在垂直方向上形成连接。
本实施例的有益效果是：通过分别在电池保护硬板和电池保护软板上制作待焊接区域，在待焊接其余制作铜膏，将电池保护硬板的待焊接区域和电池保护软板的待焊接区域通过铜膏键合连接，从而使电池保护硬板和电池保护软板在与板面垂直方向上通过铜膏实现互联导通，以代替传统的通过锡膏焊接的方式，改善通过锡膏焊接带来的焊接空洞导致的电路不通(CFA)等长期可靠性问题。
本申请还提供另一种电池保护电路板的焊接方法，请参阅图4，图4为本申请电池保护电路板的焊接方法另一实施方式的结构示意图。如图4所示，包括：
步骤S21：分别在电池保护硬板和电池保护软板上制作待焊接区域。
在电池保护硬板的与板面的垂直方向上开设凹槽，形成电池保护硬板的待焊接区域，凹槽周围为电池保护硬板的非焊接区域；在电池保护软板的垂直方向上开设凹槽形成电池保护软板的待焊接区域和非焊接区域。
步骤S22：在待焊接区域制作铜膏，在电池保护硬板和电池保护软板的非焊接区域制作粘接胶层。
具体地，在凹槽内灌设铜浆形成铜膏，在凹槽的周围制作粘接胶层。
步骤S23：将电池保护硬板的待焊接区域和电池保护软板的待焊接区域通过 铜膏键合连接，将电池保护硬板的非焊接区域和电池保护软板的非焊接区域通过粘接胶层粘接。
将电池保护硬板的铜膏和电池保护软板的铜膏对位，电池保护硬板的粘接胶层和电池保护软板的粘接胶层对位，使电池保护硬板上的铜膏和电池保护软板上的铜膏键合连接，电池保护硬板上的粘接胶层和电池保护软板上的粘接胶层粘接。
本实施例的有益效果是：通过在电池保护硬板和电池保护软板上开设凹槽，形成待焊接区域和非待焊接区域，在待焊接区域制作铜膏，在非焊接区域制作粘接胶层，从而使电池保护硬板的待焊接区域和电池保护软板的待焊接区域通过铜膏键合连接，电池保护硬板的非焊接区域和电池保护软板的非焊接区域通过粘接胶层粘接，从而改善电池保护硬板和电池保护软板通过锡膏焊接的焊接面积限制和焊接空洞导致的电路不通的可靠性问题，本申请中通过电池保护硬板和电池保护软板的待焊接区域通过铜膏进行焊接，非焊接区域通过粘接胶层进行粘接，增加了电池保护硬板和电池保护软板焊接的面积，改善了可靠性问题。
本申请还提供一种电池保护电路板的结构，如图5所示，图5为本申请电池保护电路板一实施方式的结构示意图。
电池保护电路板包括电池保护硬板1和电池保护软板2，电池保护硬板1的待焊接区域11和电池保护软板2的待焊接区域21上制作有铜膏，电池保护硬板1的非焊接区域12和电池保护软板2的非焊接区域22上制作有粘接胶层，以使电池保护硬板1的待焊接区域11和电池保护软板2的待焊接区域21通过铜膏键合连接，电池保护硬板1的非焊接区域12和电池保护软板2的非焊接区域22通过粘接胶层粘接。
其中，电池保护硬板包括多层PCB板，具体包括第一铜层L1、第二铜层L2、第三铜层L3以及第四铜层L4，第一铜层L1与第二铜层L2之间设置有PP树脂层，第二铜层L2和第三铜层L3之间设置有基板层，基板层为电池保护硬板的核心层，第三铜层L3和第四铜层L4之间设置有PP树脂层，在本实施例中，第一铜层L1和第二铜层L2与第三铜层L3和第四铜层L4对称设置，其厚度均相同，在其它实施例中，第一铜层L1和第二铜层L2与第三铜层L3和第四铜层L4可以不对称设置，在此不作限定。其中，电池保护硬板中还设置有导通孔T，该导通孔T贯穿电池保护硬板的第一铜层L1、第二铜层L2、第三铜层L3以及 第四铜层L4，导通孔T内还填充有树脂。电池保护硬板1的相对两侧还设置有覆盖层P1和P2，在电池保护硬板1靠近电池保护软板2的一侧覆盖层P2上开设凹槽形成待焊接区域11。
电池保护软板包括柔性基板F，和位于柔性基板F的相对两侧的第一铜层F1和第二铜层F2，在第一铜层F1和第二铜层F2远离柔性基板F的一侧表面上还设置有覆盖层C1和C2，覆盖层C1和C2可以包括软板保护胶层。在电池保护软板2靠近电池保护硬板1的一侧的覆盖层P1上开设有凹槽形成待焊接区域21。
本实施例的有益效果是：通过在电池保护硬板和电池保护软板上开设凹槽，形成待焊接区域和非待焊接区域，在待焊接区域制作铜膏，在非焊接区域制作粘接胶层，从而使电池保护硬板的待焊接区域和电池保护软板的待焊接区域通过铜膏键合连接，电池保护硬板的非焊接区域和电池保护软板的非焊接区域通过粘接胶层粘接，从而改善电池保护硬板和电池保护软板通过锡膏焊接的焊接面积限制和焊接空洞导致的电路不通的可靠性问题，本申请中通过电池保护硬板和电池保护软板的待焊接区域通过铜膏进行焊接，非焊接区域通过粘接胶层进行粘接，增加了电池保护硬板和电池保护软板焊接的面积，改善了可靠性问题。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。
Claims (10)
- 一种电池保护电路板的焊接方法，所述电池保护电路板包括电池保护硬板和电池保护软板，其特征在于，包括：分别在所述电池保护硬板和所述电池保护软板上制作待焊接区域；在所述待焊接区域制作铜膏；将所述电池保护硬板的待焊接区域和所述电池保护软板的待焊接区域通过所述铜膏键合连接。
- 根据权利要求1所述的焊接方法，其特征在于，所述分别在所述电池保护硬板和所述电池保护软板上制作待焊接区域的步骤，包括：分别在所述电池保护硬板和所述电池保护软板的垂直方向上开设凹槽，形成所述待焊接区域；所述在所述待焊接区域制作铜膏的步骤，包括：在所述凹槽内制作所述铜膏。
- 根据权利要求2所述的焊接方法，其特征在于，所述将所述电池保护硬板的待焊接区域和所述电池保护软板的待焊接区域通过所述铜膏键合连接的步骤，包括：通过加热工艺将所述电池保护硬板的铜膏与所述电池保护软板上的铜膏在垂直方向上形成键合连接。
- 根据权利要求2所述的焊接方法，其特征在于，所述在所述待焊接区域制作铜膏的步骤，包括：在所述凹槽周围制作粘接胶层。
- 根据权利要求1所述的焊接方法，其特征在于，所述分别在所述电池保护硬板和所述电池保护软板上制作待焊接区域的步骤之后，还包括：在所述电池保护硬板和所述电池保护软板的非焊接区域制作粘接胶层；所述将所述电池保护硬板的待焊接区域和所述电池保护软板的待焊接区域通过所述铜膏键合连接的步骤，还包括：将电池保护硬板的非焊接区域与所述电池保护软板的非焊接区域通过所述粘接胶层粘接。
- 根据权利要求1所述的焊接方法，其特征在于，所述电池保护软板包括 柔性基板。
- 一种电池保护电路板，其特征在于，所述电池保护电路板包括电池保护硬板和电池保护软板；所述电池保护硬板的待焊接区域和所述电池保护软板的待焊接区域制作有铜膏，所述电池保护硬板的非焊接区域和所述电池保护软板的非焊接区域制作有粘接胶层，所述电池保护硬板的待焊接区域与所述电池保护软板的待焊接区域通过所述铜膏键合连接，所述电池保护硬板和所述电池保护软板的非焊接区域通过所述粘接胶层粘接。
- 根据权利要求7所述的电池保护电路板，其特征在于，所述电池保护硬板上的铜膏垂直于所述电池保护硬板，所述电池保护软板上的铜膏垂直与所述电池保护软板，所述电池保护硬板和所述电池保护软板通过所述铜膏在垂直方向上键合连接。
- 根据权利要求7所述的电池保护电路板，其特征在于，所述电池保护硬板包括多层PCB板；所述电池保护硬板上还设置有通孔，所述通孔贯穿所述电池保护硬板。
- 根据权利要求7所述的电池保护电路板，其特征在于，所述电池保护软板包括柔性基板和位于所述柔性基板两侧的多层PCB板。
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| CN106961808B (zh) * | 2017-02-20 | 2019-09-10 | 宁波华远电子科技有限公司 | 下沉式高密度互连板的制作方法 |
| CN208891098U (zh) * | 2018-05-25 | 2019-05-21 | 红板（江西）有限公司 | 一种快速充电设备电池保护多层挠性电路板 |
| CN113038738A (zh) * | 2021-01-27 | 2021-06-25 | 红板（江西）有限公司 | 厚铜软硬结合板填胶工艺 |
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2021
- 2021-08-12 CN CN202110926126.1A patent/CN115942640A/zh active Pending
- 2021-09-27 WO PCT/CN2021/121085 patent/WO2023015692A1/zh active Application Filing
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| JPH0832195A (ja) * | 1994-07-11 | 1996-02-02 | Nippondenso Co Ltd | 複合プリント基板の接続構造 |
| CN1551712A (zh) * | 2003-05-19 | 2004-12-01 | 松下电器产业株式会社 | 电子电路的连接结构及其连接方法 |
| CN102933042A (zh) * | 2012-10-17 | 2013-02-13 | 无锡江南计算技术研究所 | 软硬结合板凹槽区软板防粘胶方法 |
| CN110012622A (zh) * | 2019-04-11 | 2019-07-12 | 信丰迅捷兴电路科技有限公司 | 一种软板区焊盘激光开窗的软硬结合板制作方法 |
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