WO2022210158A1

WO2022210158A1 - Cover tape for packaging electronic component and electronic component package

Info

Publication number: WO2022210158A1
Application number: PCT/JP2022/013482
Authority: WO
Inventors: 皓基阿部; 啓太山口; 祥司上村
Original assignee: 住友ベークライト株式会社
Priority date: 2021-03-31
Filing date: 2022-03-23
Publication date: 2022-10-06
Also published as: JP2023055870A; TW202306855A

Abstract

Cover tape for packaging an electronic component according to the present invention has a base material layer (1), an intermediate layer (2), and a sealant layer (3) in the given order. The sealant layer (3) contains an (A) adhesive resin. The glass transition temperature of the (A) adhesive resin is greater than 60°C and not more than 120°C. The sealant layer has tack strength at 60°C of 0 N/cm² to 5.0 N/cm², inclusive.

Description

Electronic component packaging cover tape and electronic component package

The present invention relates to a cover tape for electronic component packaging and an electronic component package.

Conventionally, electronic components such as transistors, diodes, capacitors, and piezoelectric element resistors are manufactured at the manufacturing sites of electronic devices by: (i) first, a carrier tape in which pockets capable of accommodating electronic components are continuously formed; It is housed in a package consisting of a cover tape that seals the carrier tape and is heat-sealed, and (ii) after that, it is surface-mounted on an electronic circuit board or the like while being wound on a reel made of paper or plastic. It is transported to the work area where it is to be performed. After peeling off the cover tape of the package in the working area, the electronic component is taken out from the pocket formed in the carrier tape and surface-mounted on an electronic circuit board or the like.

In particular, various studies have been conducted on the adhesiveness and peelability of the cover tape. For example, Patent Literature 1 discloses making the peelability appropriate by focusing on the peel resistance force ratio α between the maximum value and the minimum value of the peel resistance force between the carrier tape and the cover tape.

JP 2017-171393 A

In the step of peeling the cover tape from the carrier tape, if the peel strength, which is the strength required to peel the cover tape from the carrier tape, is too high, the carrier tape vibrates when the cover tape is peeled off, and the electronic component is damaged. may pop out of the storage pocket. On the other hand, if the adhesive strength between the carrier tape and the cover tape is low, the cover tape may peel off during transportation of the package, and the packed electronic components may drop. For this reason, the cover tape is required to have sufficient adhesive strength to the carrier tape and at the same time to be peelable so as to be successfully peeled off from the carrier tape in the mounting process.
Moreover, in the process of transporting the package consisting of the carrier tape and the cover tape to the work area where the surface mounting is performed, the environment may be high temperature and high humidity. In addition, since the package is wound on a reel, a certain amount of pressure is applied to the carrier tape and the cover tape, and the carrier tape and the cover tape are in a state of bonding even in areas where they are not heat-sealed. Also, there is a problem that the carrier tape and the cover tape are not smoothly peeled off in the mounting process. Therefore, the cover tape is required to have the property that the non-heat-sealed portion of the carrier tape does not adhere to the carrier tape even when a certain pressure is applied in a high-temperature, high-humidity environment.

The present invention provides a cover tape that can be adhered to a carrier tape with an appropriate adhesive strength and that is reduced in sticking at a portion where the carrier tape and the cover tape are not heat-sealed, that is, "adhesion to the carrier tape. One of the objects is to provide a cover tape having a good balance between "adhesion resistance" and "adhesion resistance" to the carrier tape.

Upon investigation, the inventor found that the above problems could be solved by using a resin having a glass transition temperature within a specific range for the sealant layer of the cover tape. As a result, the present invention has been completed.

The present invention is as follows.
a substrate layer;
an intermediate layer;
a sealant layer;
A cover tape for electronic component packaging having in this order,
The sealant layer contains (A) an adhesive resin,
The (A) adhesive resin has a glass transition temperature measured according to <Method for measuring glass transition temperature> below, which is higher than 60° C. and not higher than 120° C.,
A cover tape for packaging electronic components, wherein the sealant layer has a tack force of 0 N/cm ² or more and 5.0 N/cm ² or less, as measured by <tack force measurement method> hereinafter.
<Method for measuring glass transition temperature>
The glass transition temperature (° C.) of the (A) adhesive resin is measured using a differential scanning calorimeter (DSC), and the temperature is raised from 0° C. to 200° C. at a temperature rising condition of 10° C./min, under nitrogen atmosphere conditions. Measured at
<Method for measuring tack force>
A stainless steel material with a contact area of 20 mm ² is pressed against the sealant layer of the electronic component packaging cover tape at a contact speed of 30 mm / min, held at a measurement temperature of 60 ° C and a contact load of 25 N for 20 seconds, and then at a speed of 600 mm / min. The measured value of the load per unit area when peeling off is defined as the tack force (N/cm ² ) at 60°C.

Moreover, this invention is the following.
a carrier tape in which electronic components are housed in recesses;
and the above electronic component packaging cover tape,
An electronic component packaging body in which the sealant layer side is adhered to the carrier tape so as to seal the electronic component.

According to the present invention, there is provided a cover tape for packaging electronic components that has a good balance between adhesiveness and adhesion resistance.

BRIEF DESCRIPTION OF THE DRAWINGS It is the figure which represented typically an example of the cover tape for electronic component packaging of this embodiment. It is a figure which shows an example of the state which adhere|attached (heat-sealed) the cover tape for electronic component packaging to the carrier tape. FIG. 4 is a diagram for explaining the shape of the seal iron used in the "adhesion resistance test";

Embodiments of the present invention will be described below with reference to the drawings. In all drawings, the same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted as appropriate. Also, the drawings are schematic diagrams and do not correspond to actual dimensional ratios.

The notation "acrylic" in this specification represents a concept that includes both acrylic and methacrylic.

<Cover tape for packaging electronic components>
FIG. 1 schematically shows an example of the electronic component packaging cover tape of the present embodiment.
The electronic component packaging cover tape of the present embodiment comprises a base layer 1, an intermediate layer 2, and a sealant layer 3 in this order.
In the electronic component packaging cover tape 10, the sealant layer 3 is usually adhered to the carrier tape. In other words, the upper surface side in FIG. 1 is normally adhered to the carrier tape.
Also, each layer may be composed of a plurality of layers.
In addition, the sealant layer 3 contains (A) an adhesive resin, and the glass transition temperature of the (A) adhesive resin measured by a predetermined method is higher than 60° C. and 120° C. or lower.
Furthermore, the tack force of the sealant layer 3 measured by a predetermined method is 0 N/cm ² or more and 5.0 N/cm ² or less.
Thereby, in the cover tape for electronic component packaging of this embodiment, the adhesiveness and adhesion resistance between the cover tape and the carrier tape can be well balanced.

Although the details of the mechanism by which the electronic component packaging cover tape 10 has an excellent balance between adhesion and adhesion resistance are not clear, by using (A) an adhesive resin having a glass transition temperature of greater than 60° C., the cover tape and The resin is in a vitreous state even in a normal temperature environment or an environment in which the carrier tape is adhered to form a package, and adhesion resistance can be improved while suppressing adhesiveness. In addition, by using (A) adhesive resin having a glass transition temperature of 120 ° C. or less, the resin softens near the heat sealing temperature, so that good adhesion between the cover tape and the carrier tape can be imparted. it is conceivable that.
The upper limit of the glass transition temperature is preferably 118° C. or lower, more preferably 116° C. or lower, and even more preferably 114° C. or lower.

<Other layers>
The electronic component packaging cover tape 10 may have an adhesive layer (not shown) between each layer. This adhesive layer can improve the adhesiveness between the layers.
Examples of materials for forming the adhesive layer include urethane-based adhesive resins for dry lamination and adhesive resins for anchor coats. A combination of a polyester composition such as polyester polyol or polyether polyol and an isocyanate compound is preferred.
Further, layers other than the adhesive layer may be provided as other layers. As other layers, for example, a layer for improving the strength of the entire film, a water vapor barrier layer, and the like may be provided.

<Base material layer>
The base material layer 1 must have mechanical strength to withstand external forces applied during processing of the electronic component packaging cover tape 10, heat sealing to a carrier tape, use, etc., and heat resistance to withstand heat during heat sealing. For example, films processed from various materials can be used.

Specific examples of the material forming the base material layer 1 include ester-based resins, amide-based resins, olefin-based resins, acrylate-based resins, methacrylate-based resins, imide-based resins, carbonate-based resins, and ABS resins. Among these, ester-based resins and olefin-based resins are preferable as the material constituting the base material layer 1 . In particular, polyethylene terephthalate and polyethylene are preferred because they can improve mechanical strength. Further, when an amide resin is selected as the material constituting the base material layer 1, it is preferable to use nylon, which can improve mechanical strength and flexibility.

The form of the film used to form the base material layer 1 may be a stretched film or a uniaxially or biaxially stretched film. From the viewpoint of improving the mechanical strength of the cover tape for electronic component packaging, it is preferably a film stretched uniaxially or biaxially.

The substrate layer 1 may be formed of a single-layer film containing the materials described above, or may be formed using a multi-layer film containing the materials described above in each layer.
The base layer 1 may contain an antistatic agent from the viewpoint of reducing the amount of charge generated when the carrier tape is peeled off. In addition, an antistatic layer may be provided as one of the substrate layers. The surface of the base layer 1 containing an antistatic agent or the surface of the antistatic layer is formed by stacking a plurality of packages when electronic components are accommodated and transported in a package consisting of a carrier tape and a cover tape 10 for packaging electronic components. In the case of transporting the package, it has the possibility of coming into contact with the bottom surface of the carrier tape of the package stacked thereon.

The thickness of the base material layer 1 is, for example, 6 μm or more, preferably 7 μm or more, and more preferably 8 μm or more. Further, the thickness of the base material layer 1 is, for example, 35 μm or less, preferably 33 μm or less, more preferably 30 μm or less. If the thickness of the base material layer 1 is equal to or less than the above upper limit, the rigidity of the cover tape for electronic component packaging does not become too high, and even if torsional stress is applied to the carrier tape after sealing, the electronic component packaging can be used. The possibility that the cover tape 10 will follow the deformation of the carrier tape and peel off can be reduced. Further, when the thickness of the base material layer 1 is at least the above lower limit value, the mechanical strength of the electronic component packaging cover tape 10 becomes suitable, and the electronic component packaging cover tape 10 can be peeled off from the carrier tape at high speed. Even in this case, it is possible to reduce the possibility that the electronic component packaging cover tape 10 will break.
In addition, the substrate layer 1 may have a two-layer structure of a first substrate layer and a second substrate layer, or a three-layer or more structure having additional layers. In this case, the material used for the base material layer 1 can be used, for example. As for the thickness, it is preferable that the total thickness of the first base material layer, the second base material layer, etc. is the "thickness of the base material layer 1".

<Middle layer>
The intermediate layer 2 is a layer provided for the purpose of imparting cushioning properties to the electronic component packaging cover tape 10 according to the present embodiment. This can improve the adhesion between the electronic component packaging cover tape 10 and the carrier tape at the time of sealing.

The material of the intermediate layer 2 is not particularly limited as long as it can impart cushioning properties to the cover tape 10 for packaging electronic components. One or two or more selected from resins, cyclic olefin resins, and copolymers thereof may be mentioned. Among these, polyacrylic acid derivatives, polyacrylic ester derivatives, olefinic resins and cyclic olefinic resins are preferred, olefinic resins are more preferred, and ethylene-based resins are even more preferred, from the viewpoint of performance balance.

The thickness of the intermediate layer 2 is typically 10 μm or more and 50 μm or less, preferably 15 μm or more and 45 μm or less, from the viewpoint of further improving the adhesion between the electronic component packaging cover tape 10 and the carrier tape at the time of sealing.

<Sealant layer>
The sealant layer 3 is a layer that contains (A) an adhesive resin and is provided on the surface of the intermediate layer 2 opposite to the surface in contact with the substrate layer 1 . The sealant layer 3 is usually in contact with the carrier tape when the electronic component packaging cover tape 10 is sealed (for example, heat-sealed) to the carrier tape.
Usually, the sealant layer 3 has a heat-sealing property, is adhered to a carrier tape, and exhibits an easy peeling property so that it can be easily peeled off during use.

Specific examples of the (A) adhesive resin material of the sealant layer 3 include one or more selected from acrylic resins, styrene resins, olefin resins, urethane resins and ester resins, and these and the like. Among these, from the viewpoint of good dissolution or dispersion of the antistatic agent, it is preferable to include at least one of styrene-based resins, acrylic-based resins and ester-based resins.
Specific examples of styrene resins include polystyrene, styrene/butadiene copolymer (SB), styrene/butadiene/styrene block copolymer (SBS), styrene/ethylene/butadiene/styrene block copolymer (SEBS), styrene・Isoprene-styrene block copolymer (SIS), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-methyl (meth)acrylate copolymer, hydrogenated styrene block copolymer, impact resistance Polystyrene (HIPS; High Impact Polystyrene), general-purpose polystyrene resin (GPPS; General Purpose Polystyrene), and the like. You may use these in combination of 2 or more types.
Among these, it is preferable to use a styrene-butadiene copolymer (SB) from the viewpoint of high transparency and improved adhesion resistance and peel strength in a well-balanced manner. , acrylic acid, methacrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, acrylic esters such as 2-ethylhexyl acrylate; methacrylic esters such as methyl methacrylate, ethyl methacrylate, butyl methacrylate; acrylonitrile, It is a resin composed of monomers such as methacrylonitrile and acrylamide. As the constituent monomers of the acrylic resin, one or more of these examples can be included. Moreover, as a constituent monomer of the acrylic resin, a monomer other than those exemplified may be further included. Derivatives of these monomers may also be used.
Ester-based resins are obtained by condensation polymerization of alcohol components (typically diols) and carboxylic acid components (typically dicarboxylic acids). Specific examples of alcohol components include ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2, 3-butanediol, 2,2-dimethyl-1,3-propanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,12- Chain or branched aliphatic diols such as dodecanediol, hydrogenated bisphenol A [2,2-bis(4-hydroxycyclohexyl)propane], hydrogenated bisphenol A alkylene oxide having 2 to 4 carbon atoms (average addition mole number 2 or more and 12 or less) trihydric or higher polyhydric alcohols such as alicyclic diols such as adducts, glycerin, pentaerythritol, trimethylolpropane and sorbitol. One or more of these alcohol components may be used.
Examples of carboxylic acid components include oxalic acid, malonic acid, maleic acid, fumaric acid, citraconic acid, itaconic acid, glutaconic acid, succinic acid, adipic acid, sebacic acid, dodecanedioic acid, azelaic acid, dodecylsuccinic acid, and dodecenylsuccinic acid. acids, chain or branched aliphatic dicarboxylic acids such as octenylsuccinic acid, trivalent or higher polyvalent carboxylic acids such as trimellitic acid or its anhydride, aromatic dicarboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid aromatic dicarboxylic acids acid and the like. One or more of these carboxylic acid components may be used.

Using a differential scanning calorimeter (DSC), the temperature of the (A) adhesive resin of the sealant layer 3 was increased from 0° C. to 200° C. at a temperature rising condition of 10° C./min, and measured under nitrogen atmosphere conditions. The glass transition temperature (°C) is higher than 60°C and 120°C or lower, preferably 118°C or lower, more preferably 116°C or lower, and still more preferably 114°C or lower. By setting the glass transition temperature within the above range, the 60° C. tack force of the cover tape for electronic component packaging can be set to an appropriate range. When the tape is stored in a state where the cover tape and the carrier tape are not adhered by heat sealing, adhesion between the cover tape and the carrier tape can be suppressed.

Furthermore, since the glass transition temperature (°C) of the (A) adhesive resin of the sealant layer 3 is higher than 60°C, the package consisting of the cover tape for packaging electronic components and the carrier tape can be heated at a high temperature of around 60°C or Even when stored in a high-humidity environment for a certain period of time, the rate of change over time of the peel strength of the cover tape for electronic component packaging to the carrier tape, when compared to the initial value (immediately after heat sealing), tends to fall within a predetermined range. This is because the glass transition temperature (°C) of the adhesive resin of the sealant layer 3 is higher than 60°C even when stored in a high-temperature environment of about 60°C, so that the adhesive resin maintains a glass state. This is thought to be because The lower limit of the glass transition temperature may be, for example, higher than 90°C, 91°C or higher, 95°C or higher, or 100°C or higher.
By having such properties, the package consisting of the carrier tape and the cover tape has a good balance of adhesiveness and peelability to the carrier tape while being transported to the work area where surface mounting is performed, and even after transporting. It is possible to suppress the occurrence of defects such as the cover tape being peeled off during transportation and the electronic components housed in the package falling, and the cover tape not being successfully peeled off from the carrier tape in the mounting process. can be done.

The sealant layer 3 can further contain (B) an antistatic agent from the viewpoint of reducing the surface resistance value of the sealant layer 3 to suppress the generation of static electricity associated with peeling and maintaining sealing properties. In the sealant layer 3, (B) an antistatic agent is preferably dissolved or dispersed in (A) the adhesive resin. That is, preferably, the compatibility between (A) the adhesive resin and (B) the antistatic agent is good, and the (B) antistatic agent is contained in the (A) adhesive resin as the matrix resin in the sealant layer 3 It is evenly distributed throughout. As a mode of dissolution or dispersion, (B) the antistatic agent is dissolved in (A) the adhesive resin via a solvent, and (B) the antistatic agent is dissolved in water in (A) the adhesive resin. A dispersed mode is mentioned, which differs depending on the properties of (A) the adhesive resin and (B) the antistatic agent.
Specific examples of the (B) antistatic agent include antimony-doped tin, conductive polymers (eg, polythiophene and polythiophene derivatives), phosphorus-doped tin, fluorine-doped tin, and carbon nanotubes. (A) good compatibility with the adhesive resin, etc., (B) the antistatic agent is one or more selected from the group consisting of antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide and a conductive polymer. preferably included.

Examples of conductive polymers such as polythiophene and polythiophene derivatives include polythiophene, poly(3,4)-ethylenedioxythiophene, and poly(3-thiophene-β-ethanesulfonic acid). Among these, poly-3,4-ethylenedioxythiophene or a derivative thereof is preferred from the viewpoint of maintaining better antistatic properties and sealing properties.

The sealant layer 3 may contain, as other additives, a dispersant for improving the dispersibility of the antistatic agent, silica sol, a leveling agent, a conductive aid, and the like.

The thickness of the sealant layer 3 is typically preferably 0.02 μm or more and 20 μm or less, more preferably 0.03 μm or more and 15 μm or less, from the viewpoint of suitably performing the sealing work and the peeling work.

The thickness of the electronic component packaging cover tape according to the present embodiment is preferably 40 μm or more and 65 μm or less, more preferably 45 μm or more and 60 μm or less, from the viewpoint of the balance between film strength and handling.

The characteristics of the electronic component packaging cover tape according to the present embodiment will be described below.

In the electronic component packaging cover tape according to the present embodiment, the tack force of the sealant layer 3 was measured by pressing a stainless steel material with a contact area of 20 mm ² against the sealant layer 3 of the cover tape at a contact speed of 30 mm/min, and measuring the temperature at 60. °C, a contact load of 25 N for 20 seconds, and then peeling off at a rate of 600 mm/min.
At this time, the tack force of the sealant layer 3 at 60° C. is 5.0 N/cm ² or less, preferably 4.5 N/cm ² or less, more preferably 4.0 N, from the viewpoint of adhesion resistance. / cm ² or less. That is, by designing the cover tape so that the tack force of the sealant layer 3 is sufficiently small at a temperature lower than the heat sealing temperature of 60° C., good adhesion resistance can be obtained.
The lower limit of the tack force at 60° C. is not limited, but is, for example, 0 N/cm ² or more, specifically 0.01 N/cm ² or more.

The electronic component packaging cover tape according to the present embodiment has good "adhesion resistance" to the carrier tape. That is, the electronic component packaging cover tape and the carrier tape according to the present embodiment are prevented from sticking to each other at the portions not heat-sealed.
This "adhesion resistance" can be quantified by the following <adhesion resistance test>. In other words, a cover tape with better performance can be manufactured by designing the cover tape using the length of the adhesion mark measured in the following <adhesion resistance test> as a design indicator.

<Adhesion resistance test>
In the electronic component packaging cover tape according to the present embodiment, the electronic component packaging cover tape has a width of 10.0 mm, and the sealant layer side of the cover tape and the uneven surface with a width of 8.0 mm The irregular surface side of a polystyrene film having an average surface roughness (Ra) of 0.25 μm is overlapped to obtain a sample. A sealing iron with a U-shaped cross section, with a grounding portion width of 0.5 mm, length of 32.0 mm, and weight of 46.0 g was placed on the upper surface of the cover tape of the sample, under the conditions of 60°C and 90% RH. for 24 hours. After standing still, the presence or absence of adhesion between the polystyrene film and the electronic component packaging cover tape is evaluated based on adhesion marks on the polystyrene film. Specifically, in the adhesion traces on the polystyrene film, the dimension in the length direction of the polystyrene film is measured as the length of the adhesion traces on the polystyrene film. The length of the adhesive marks left on the polystyrene film is preferably 15 mm or less, more preferably 13 mm or less, and still more preferably 11 mm or less. Although there is no lower limit to the length of the adhesive trace on the polystyrene film, it is, for example, 0 mm or more.
Incidentally, the sealing iron having the shape and size as described above is available from, for example, Tokyo Weld Co., Ltd., which is a sealing machine manufacturer.

By designing the electronic component packaging cover tape so that the length of the adhesive marks is 15 mm or less, the electronic component packaging cover tape and the carrier tape are bonded together to form a package, wound on a reel and stored. In addition, adhesion between the cover tape and the carrier tape can be further suppressed at locations other than the heat-sealed portion. That is, the adhesion resistance can be further improved.

The electronic component packaging cover tape according to the present embodiment has good adhesiveness to the carrier tape (heat-sealing property with the carrier tape). This can be quantified by, for example, the following <heat seal test>. In other words, by designing the cover tape using the peel strength obtained by the following <heat seal test> as a design indicator, it is possible to manufacture a cover tape having better adhesion to the carrier tape.

<Heat seal test>
The electronic component packaging cover tape has a width of 5.5 mm, and the sealant layer side of the electronic component packaging cover tape and the uneven surface with a width of 8 mm have an average surface roughness (Ra) of 0.25 μm. A polystyrene film was laminated to the uneven surface side, and a double-edged iron with a width of 0.4 mm and a length of 28 mm was used to seal at a temperature of 180 ° C., a load of 5 kgf, a sealing time of 60 ms, and a carrier. The sample is heat-sealed under the condition of a tape feed pitch of 4 mm.
Using this sample, a peel test is performed under the conditions of a peel speed of 300 mm/min, a measurement temperature of 25° C., and a peel angle of 170°. The lower limit of the peel strength in this test is preferably 0.2N or more, more preferably 0.22N or more, still more preferably 0.23N or more. Also, the upper limit of the peel strength is preferably 0.9N or less, more preferably 0.8N or less, and still more preferably 0.7N or less. By setting the peel strength within the above range, it is possible to further improve the balance between adhesiveness and peelability to the carrier tape.

<Peel strength when stored in a 60°C environment after the heat seal test>
The peel strength when the package consisting of the electronic component cover tape and the carrier tape is stored at a high temperature will be described.
After storing the sample obtained in the above <heat seal test> at 60°C for 30 days, the 170°C peel strength is measured in the same manner as in the above <heat seal test>. At this time, the lower limit of the peel strength is preferably 0.10 N or more, more preferably 0.11 N or more, and still more preferably 0.12 N or more. Also, the upper limit of the peel strength is preferably 1.35 N or less, more preferably 1.20 N or less, and even more preferably 1.05 N or less.
By setting the peel strength within the above range, the balance between the adhesiveness and peelability to the carrier tape is further improved even when the package in which the carrier tape and the cover tape are bonded together is transported, stored, etc. be able to.

<Peel strength when stored in an environment of 60°C and 90% RH after the heat seal test>
The peel strength when the package consisting of the electronic component cover tape and the carrier tape is stored at high temperature and high humidity will be described.
After storing the sample obtained in the above <heat seal test> at 60°C and 90% RH for 30 days, the 170°C peel strength is measured in the same manner as in the above <heat seal test>. At this time, the lower limit of the peel strength is preferably 0.10 N or more, more preferably 0.11 N or more, and still more preferably 0.12 N or more. Also, the upper limit of the peel strength is preferably 1.35 N or less, more preferably 1.20 N or less, and even more preferably 1.05 N or less.
By setting the peel strength within the above range, the balance between the adhesiveness and peelability to the carrier tape is further improved even when the package in which the carrier tape and the cover tape are bonded together is transported, stored, etc. be able to.

<Change rate of peel strength after storage in 60°C environment after heat seal test>
A quantification of changes over time when a package consisting of an electronic component cover tape and a carrier tape is stored at a high temperature will be described.
The 170° C. peel strength (that is, the peel strength immediately after heat sealing) measured in the above-mentioned <heat seal test> is defined as P, and the above-mentioned <peel strength after storage in a 60° C. environment after the heat seal test> is measured. P1 is the 170°C peel strength. The absolute value of the rate of change in peel strength after storage at 60 ° C. relative to the initial value of peel strength immediately after heat sealing (|((P1−P)/P)×100|) (%) is preferably It is 50% or less, more preferably 40% or less, and still more preferably 35% or less. The lower limit of the absolute value of the rate of change in peel strength is not particularly limited, but is, for example, 0% or more.
By setting this rate of change within the above range, even when the package in which the carrier tape and the cover tape are bonded together is transported, stored, etc., the balance between adhesion and peelability to the carrier tape is further improved. be able to.

<Change rate of peel strength after storage in 60° C. 90% RH environment after heat seal test>
A description will be given of the quantification of changes over time when a package consisting of the electronic component cover tape and the carrier tape is stored at high temperature and high humidity.
The 170° C. peel strength (that is, the peel strength immediately after heat sealing) measured in the above-mentioned <heat seal test> is defined as P, and the above-mentioned <peel strength after storage in a 60° C. 90% RH environment after the heat seal test>. P2 is the 170° C. peel strength measured at . The absolute value of the rate of change in peel strength after storage at 60 ° C. relative to the initial value of peel strength immediately after heat sealing (|((P2−P)/P)×100|) (%) is preferably It is 50% or less, more preferably 40% or less, and still more preferably 35% or less. The lower limit of the absolute value of the rate of change in peel strength is not particularly limited, but is, for example, 0% or more.
By setting this rate of change within the above range, even when the package in which the carrier tape and the cover tape are bonded together is transported, stored, etc., the balance between adhesion and peelability to the carrier tape is further improved. be able to.

The surface resistance value of the surface of the substrate layer of the cover tape for packaging electronic parts according to the present embodiment, measured at 25° C. and 50% RH, is preferably 1.0×10 ³ Ω or more, more preferably 1.0×10 3 Ω or more. 0×10 ⁴ Ω or more, more preferably 1.0×10 ⁵ Ω or more, preferably 1.0×10 ¹³ Ω or less, more preferably 1.0×10 ¹² Ω or less , and more preferably 1.0×10 ¹¹ Ω or less. By setting the surface resistance value of the base layer of the cover tape for packaging electronic parts within the above range, static electricity generated by various factors can be efficiently released to the outside.
The surface of the base layer refers to the exposed surface side of the base layer of the cover tape for packaging electronic components (that is, the surface of the base layer that is not in contact with the intermediate layer).

The surface resistance value of the surface of the sealant layer of the electronic component packaging cover tape according to the present embodiment measured at 25° C. and 50% RH is preferably 1.0×10 ³ Ω or more, more preferably 1 0×10 ⁴ Ω or more, more preferably 1.0×10 ⁵ Ω or more, preferably 1.0×10 ¹² Ω or less, more preferably 1.0×10 ¹¹ Ω or less , and more preferably 1.0×10 ¹⁰ Ω or less. By setting the surface resistance value on the surface of the sealant layer measured at 25 ° C. and 50% RH of the cover tape for electronic component packaging within the above range, electronic component packaging that is more excellent in antistatic properties associated with peeling of the carrier tape. can be used as a cover tape for
The surface of the sealant layer refers to the exposed surface side of the sealant layer in the electronic component packaging cover tape (that is, the surface of the sealant layer that is not in contact with the intermediate layer).

The total light transmittance of the electronic component packaging cover tape according to the present embodiment when measured with a light source D65 in accordance with JIS K 7361-1 (1997) is preferably 70% or more, more preferably 75% or more. , more preferably 80% or more, preferably 95% or less, more preferably 94% or less, still more preferably 93% or less. By doing so, in the package 100 composed of the electronic component packaging cover tape 10 and the carrier tape, the transparency is such that it is possible to inspect whether or not the electronic components are correctly accommodated in the pockets of the carrier tape. can be given. That is, by setting the total light transmittance of the electronic component packaging cover tape to be equal to or higher than the above lower limit value, the electronic components housed inside the packaging body 100 composed of the electronic component packaging cover tape 10 and the carrier tape are allowed to pass through the packaging. It becomes possible to visually confirm from the outside of the body 100 .

The external haze of the cover tape for packaging electronic components according to the present embodiment, as measured with a light source D65 in accordance with JIS K 7136 (2000), is preferably 5% or more, more preferably 6% or more, and most preferably 7%. % or more, preferably 50% or less, more preferably 45% or less, and most preferably 40% or less. By setting the external haze of the electronic component packaging cover tape to the above upper limit value or less, the electronic components are correctly accommodated in the pockets of the carrier tape in the package composed of the electronic component packaging cover tape 10 and the carrier tape. It is possible to provide transparency to the extent that it is possible to inspect whether or not there is.

In this embodiment, for example, the types, properties and blending amounts of each component contained in the base material layer 1, the intermediate layer 2, and the sealant layer 3 constituting the cover tape for packaging electronic components, the method for producing the cover tape for packaging electronic components, etc. By appropriately selecting the conditions, it becomes possible to control the tack force at 60° C. of the cover tape for packaging electronic parts.
In addition, in this embodiment, in addition to using (A) an adhesive resin having a glass transition temperature within a specific range for the sealant layer 3, by devising other conditions, the polystyrene film and cover tape are not required. It is possible to control one or more of the surface resistance value of the base material layer 1, the surface resistance value of the sealant layer 3, the total light transmittance, and the external haze. As a result, in the cover tape for electronic component packaging, when the cover tape and carrier tape are adhered together to form a package, adhesion between the cover tape and the carrier tape occurs at locations other than the heat-sealed portion during transportation. can be suppressed, static electricity at the time of peeling can be suppressed, and transparency to the extent that the electronic component can be visually recognized from the outside can be imparted.

<Method for producing electronic component packaging cover tape>
An example of the method for manufacturing the electronic component packaging cover tape according to the present embodiment will be described.
First, the intermediate layer 2 is formed on the surface of the base material layer 1 . The intermediate layer 2 can be formed by, for example, an extrusion lamination method or a dry lamination method. Next, the sealant layer 3 is formed on the intermediate layer 2 by preparing a sealant layer coating liquid using a predetermined material, applying it by a coating method and drying it, or laminating it by an extrusion lamination method.
As a method for preparing the sealant layer coating liquid, (A) a method of mixing an aqueous dispersion of an adhesive resin and (B) an aqueous dispersion of an antistatic agent, (A) an adhesive resin and (B) an electrostatic A method of mixing the inhibitor with a solvent can be mentioned. Either method is selected according to the types of (A) the adhesive resin and (B) the antistatic agent.

In addition, when forming the adhesive layer described above, the material for the adhesive layer may be applied to the surface of the target layer by a conventionally known coating method.

The electronic component packaging cover tape according to the present embodiment can be used as a package by sticking it on a carrier tape. That is, it includes a carrier tape having a plurality of storage portions for storing electronic components, the electronic components stored in the storage portions, and the electronic component packaging cover tape arranged to cover the storage portions. A package is preferred.
With such a package, the generation of static electricity can be suppressed, and the electronic components stored in the storage section can be more reliably protected from static electricity.

<Electronic component package>
An electronic component package can be obtained from the electronic component packaging cover tape of the present embodiment described above and the carrier tape in which the electronic components are accommodated in the recesses. This will be described with reference to FIG.

In FIG. 2, the electronic component packaging cover tape 10 is used as a cover material for a band-shaped carrier tape 20 having continuously provided recessed pockets 21 corresponding to the shape of the electronic component.
Specifically, the electronic component packaging cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20 . Hereinafter, the structure obtained by bonding the electronic component packaging cover tape 10 and the carrier tape 20 together will be referred to as an electronic component package 100 .

Electronic component package 100 can be produced, for example, by the following procedure.
First, electronic components are accommodated in the pocket 21 of the carrier tape 20 .
Next, the electronic component packaging cover tape 10 is adhered to the surface of the carrier tape 20 by heat sealing so as to cover the entire opening of the pocket 21 of the carrier tape 20 . At this time, the sealant layer 3 of the electronic component packaging cover tape 10 is brought into contact with the carrier tape 20 (that is, the heat is applied so that the “back surface” of the electronic component packaging cover tape 10 in FIG. sealing).
The specific method and conditions for heat sealing are not particularly limited as long as the electronic component packaging cover tape 10 adheres to the carrier tape 20 sufficiently strongly. Typically, a known heat sealing machine can be used at a temperature of 100 to 240° C., a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.

As described above, a structure (electronic component package 100) in which electronic components are hermetically housed is obtained.
This structure (electronic component package 100) is, for example, wound on a reel, and then transported to a work area for mounting electronic components on an electronic circuit board or the like. The reel material can be metal, paper, plastic, or the like.

After the electronic component package 100 is conveyed to the work area, the electronic component packaging cover tape 10 is peeled off from the carrier tape 20, and the contained electronic components are taken out.

The electronic components housed in the electronic component package 100 are not particularly limited. Examples include semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, electrodes, and other general parts used in the manufacture of electrical and electronic equipment.

Although the embodiments of the present invention have been described in detail above, these are examples of the present invention. Also, various configurations other than the above can be adopted. Also, the present invention is not limited to the above-described embodiments.

Embodiments of the present invention will be described in detail based on Examples and Comparative Examples, but the present invention is not limited to these.

Each constituent material of the sealant layer shown in Tables 1 and 2 is as follows.
(adhesive resin)
・ Resin 1: styrene resin ("L8900" manufactured by Asahi Kasei Corporation)
・Resin 2: Ester-based resin (“Elytel KA-3556” manufactured by Unitika Ltd.)
・ Resin 3: acrylic resin ("MB-2660" manufactured by Mitsubishi Chemical Corporation)
・ Resin 4: Acrylic resin (“US-1071” manufactured by Seiko PMC)
・ Resin 5: Acrylic resin (“B-811” manufactured by Kusumoto Chemicals Co., Ltd.)
・ Resin 6: styrene resin ("L1432" manufactured by Asahi Kasei Corporation)
・ Resin 7: Acrylic resin ("VSC6828w" manufactured by Daicel Allnex)
・ Resin 8: Ester-based resin ("Elitel KA-0134" manufactured by Unitika Co., Ltd.)
・ Resin 9: Acrylic resin ("X-310" manufactured by Seiko PMC)
・ Resin 10: Acrylic resin ("TE-1048" manufactured by Seiko PMC)
(Antistatic agent)
・ Antistatic agent 1: antimony-doped tin oxide ("T-1" manufactured by Mitsubishi Materials Corporation)
Antistatic agent 2: Polythiophene derivative (PEDOT:PSS) ("Clevios P1000" manufactured by Heraeus)
・ Antistatic agent 3: Polythiophene derivative ("Seprugida SAS-16" manufactured by Shin-Etsu Polymer Co., Ltd.)

<Example 1>
A 12 μm-thick antistatic polyethylene terephthalate (PET) film (“E7455” manufactured by Toyobo Co., Ltd.) was wet-coated with an anchor coating agent by gravure coating to a thickness of 4 μm, and dried at 100°C. Thereafter, low-density polyethylene ("Sumikasen L705", 37 µm thick, manufactured by Sumitomo Chemical Co., Ltd.) was extrusion-laminated, and cooled with a cooling roll (surface temperature: 20°C). In this way, a laminated film consisting of a substrate layer and an intermediate layer was produced.

A film having a thickness of 0.5 μm was formed on the intermediate layer side surface of the obtained laminated film by a gravure coating method using the ingredients shown in Table 1. A sealant layer was thus provided.
Tables 1 and 2 show the thickness of the entire cover tape.

<Examples 2 to 6 and Comparative Examples 1 to 5>
According to the formulations shown in Tables 1 and 2, a cover tape for packaging electronic components was produced in the same manner as in Example 1.

<Glass transition temperature>
For the adhesive resins used in Examples and Comparative Examples, a differential scanning calorimeter (DSC) (manufactured by Hitachi High-Tech Science Co., Ltd., "DSC7000X") was used to heat from 0°C to 200°C at a temperature increase of 10°C/min. and the glass transition temperature (°C) was measured under nitrogen atmosphere conditions.

<Tack force at 60°C>
A stainless steel material (SUS304) with a contact area of 20 mm ² is pressed against the sealant layer of the cover tape at a contact speed of 30 mm / min, held at a measurement temperature of 60 ° C and a contact load of 25 N for 20 seconds, and then peeled off at a speed of 600 mm / min. The load per unit area was measured using a tack tester TAC0-1000 manufactured by RHESCA, and defined as tack force (N/cm ² ) at 60°C. The above stainless steel material is attached to the tacking tester.

<Adhesion resistance test> (measurement of the length of adhesion marks)
The cover tape for electronic component packaging obtained above was made to have a width of 10.0 mm, and the sealant layer side of the cover tape and the uneven surface having a width of 8.0 mm had an average surface roughness (Ra) of A 0.25 μm polystyrene film (“CEL-E980A” manufactured by Sumitomo Bakelite Co., Ltd.) was superimposed on the uneven surface side to obtain a sample.
The sample was placed on a flat surface with the cover tape side up. Then, on the upper surface of the cover tape, a sealing trowel with a U-shaped cross-section having a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g was placed on the top surface of the cover tape, and the temperature was 60°C and 90% RH. I left it for 24 hours. For reference, the shape of the seal iron used here is shown in FIG. In FIG. 3, a=0.5 mm, b=32.0 mm and c=3.1 mm.
After that, the length of the adhesion mark (glossy) on the polystyrene film in the length direction of the polystyrene film was measured as the length of the adhesion mark on the polystyrene film. Incidentally, the "length of the adhesion traces" means the total length of the respective adhesion traces when the adhesion traces are observed intermittently (intermittently).
It can be said that the shorter the adhesion trace, the less the portion of the cover tape that is not heat-sealed to the carrier tape is adhered to the carrier tape (unintended adhesion).

<Heat seal test: 170° peel strength against polystyrene film>
Each electronic component packaging cover tape obtained above was made to have a width of 5.5 mm, and the sealant layer side of the electronic component packaging cover tape and the average surface roughness (Ra ) of 0.25 μm (“CEL-E980A” manufactured by Sumitomo Bakelite Co., Ltd.) was superimposed on the irregular surface side. Using a double-edged iron with a single edge width of 0.4 mm and a length of 28 mm, the overlapping was sealed at a temperature of 180 ° C., a load of 5 kgf, a sealing time of 60 milliseconds, and a carrier tape feeding pitch of 4 mm in two rows.・The sample was heat-sealed using a heat-sealing machine (“TWA-6621” manufactured by Tokyo Weld Co., Ltd.) under the condition of hitting 7 times. Using the obtained sample, the peel strength (N) immediately after heat sealing of the cover tape for packaging electronic parts to the polystyrene film was measured. The peel strength was measured using a peel tester (“PTS-5000” manufactured by EPI) under the conditions of a peel speed of 300 mm/min, a peel angle of 170°, and a measurement temperature of 25°C. Results are shown in Tables 1 and 2.
In addition, the surface roughness (Ra) of the polystyrene film is measured according to JIS B for the portion of the polystyrene film used above that is attached to the electronic component packaging cover tape before being attached to the electronic component packaging cover tape. 0601 (2001), using a surface roughness measuring instrument ("SJ-210" manufactured by Mitutoyo).

<Test in which samples after heat sealing are stored at 60°C and at 60°C and 90% RH: 170° peel strength against polystyrene film>
The samples obtained in the above <Heat seal test: 170° peel strength to polystyrene film> were placed in a 60 ° C. (0% RH to 20% RH) environment or a 60 ° C. 90% RH environment for 30 days. °C storage sample and 60 °C 90% RH storage sample. Using a sample stored at 60 ° C. and a sample stored at 60 ° C. 90% RH, the 170 ° peel strength (N) was measured under the same conditions as described in the above <Heat seal test: 170 ° peel strength for polystyrene film>. , respectively, were P1(N) and P2(N). P(N) was defined as the peel strength (N) immediately after heat-sealing the cover tape for electronic component packaging to the polystyrene film. From the values of P, P1, and P2, the rate of change (absolute value) of the 170° peel strength after storage at 60°C and the 170° peel strength after storage at 60°C and 90% RH are calculated by the following formulas (1) and (2). The rate of change (absolute value) of was calculated.
Rate of change (absolute value) (%) from the initial peel strength after storage at 60° C. for 30 days: |((P1−P)/P)×100| (1)
Rate of change (absolute value) (%) from the initial peel strength after storage at 60° C. and 90% RH for 30 days: |((P2−P)/P)×100| (2)
The values of |((P1−P)/P)×100| and |((P2−P)/P)×100| are shown in Tables 1 and 2.

<Surface resistance value of base material layer>
The surface resistance value (Ω) on the surface of the substrate layer of the cover tape for electronic component packaging obtained above was measured at 25 ° C.50 using a surface resistance measuring instrument manufactured by SIMCO (“ST-3” manufactured by SIMCO). Measured under %RH environment. Table 1 shows the results.
For example, "5.E+10" in Example 1 in Tables 1 and 2 represents "5×10 ¹⁰ ".

<Surface resistance value of sealant layer>
The surface resistance value (Ω) on the surface of the sealant layer of the electronic component packaging cover tape obtained above was measured using a surface resistance measuring instrument manufactured by SIMCO ("ST-3" manufactured by SIMCO) at 25 ° C. and 50%. Measured under RH environment. Table 1 shows the results.
For example, "1.E+07" in Example 1 in Tables 1 and 2 represents "1×10 ⁷ ".

<Total light transmittance>
The total light transmittance (%) of the cover tape for electronic component packaging obtained above was measured in accordance with JIS K 7361-1 (1997) using a Haze Meter NDH 2000 manufactured by Nippon Denshoku Kogyo Co., Ltd. under a light source of D65. Measured at Results are shown in Tables 1 and 2.

<External Haze>
The external haze (%) of the electronic component packaging cover tape obtained above was measured according to JIS K 7136 (2000) using a Haze Meter NDH 2000 manufactured by Nihon Denshoku Kogyo Co., Ltd. with a light source D65. . Results are shown in Tables 1 and 2.

In Examples 1 to 6, the adhesion resistance evaluated by the adhesion resistance test (adhesion trace length) is good, and the heat seal strength evaluated by the 170 ° peel strength against the polystyrene film is suitable. A cover tape for packaging parts was obtained. Moreover, in Examples 1 to 6, the rate of change over time in peel strength after storage at 60° C. and after storage at 60° C. and 90% RH was small.
On the other hand, in Comparative Examples 1 to 5, the glass transition temperature of (A) the adhesive resin was 60° C. or lower or higher than 120° C., and thus the results were inferior to those of the Examples. In addition, in Comparative Examples 1 to 5, the rate of change over time in peel strength after storage at 60°C and after storage at 60°C and 90% RH was large.

This application is Japanese application No. 2021-060188 filed on March 31, 2021, Japanese application No. 2021-112596 filed on July 7, 2021 and filed on October 22, 2021 The priority based on Japanese Patent Application No. 2021-172916 filed is claimed, and the entire disclosure thereof is incorporated herein.

1 base layer 2 intermediate layer 3 sealant layer 10 cover tape 20 carrier tape 21 pocket 100 electronic component package

Claims

a substrate layer;
an intermediate layer;
a sealant layer;
A cover tape for electronic component packaging having in this order,
The sealant layer contains (A) an adhesive resin,
The (A) adhesive resin has a glass transition temperature measured according to <Method for measuring glass transition temperature> below, which is higher than 60° C. and not higher than 120° C.,
A cover tape for packaging electronic components, wherein the sealant layer has a tack force of 0 N/cm 2 or more and 5.0 N/cm 2 or less, as measured by <tack force measurement method> hereinafter.
<Method for measuring glass transition temperature>
The glass transition temperature (° C.) of the (A) adhesive resin is measured using a differential scanning calorimeter (DSC), and the temperature is raised from 0° C. to 200° C. at a temperature rising condition of 10° C./min, under nitrogen atmosphere conditions. Measured at
<Method for measuring tack force>
A stainless steel material with a contact area of 20 mm 2 is pressed against the sealant layer of the electronic component packaging cover tape at a contact speed of 30 mm / min, held at a measurement temperature of 60 ° C and a contact load of 25 N for 20 seconds, and then at a speed of 600 mm / min. The measured value of the load per unit area when peeling off is defined as the tack force (N/cm 2 ) at 60°C.
The electronic component packaging cover tape according to claim 1,
The (A) adhesive resin of the sealant layer contains at least one of styrene resin, acrylic resin and ester resin.
The electronic component packaging cover tape according to claim 1 or 2,
The cover tape for electronic component packaging, wherein the sealant layer further contains (B) an antistatic agent.
The electronic component packaging cover tape according to claim 3,
The cover tape for packaging electronic components, wherein the (B) antistatic agent contains one or more selected from the group consisting of antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide, and a conductive polymer.
The electronic component packaging cover tape according to any one of claims 1 to 4,
A cover tape for packaging electronic components, wherein the intermediate layer contains one or more resins selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, olefinic resins and cyclic olefinic resins.
The electronic component packaging cover tape according to any one of claims 1 to 5,
1. A cover tape for packaging electronic parts, wherein the length of an adhesive mark left on a polystyrene film is 0 mm or more and 15 mm or less when evaluated in the <adhesion resistance test> below.
<Adhesion resistance test>
The cover tape for packaging electronic components has a width of 10.0 mm, and the average surface roughness (Ra) of the uneven surface of the sealant layer side of the cover tape and the width of 8.0 mm is 0.25 μm. The uneven surface side of the polystyrene film is overlapped to obtain a sample. A sealing iron having a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g is placed on the upper surface of the cover tape of the sample, and allowed to stand at 60° C. and 90% RH for 24 hours. After standing, the length of the adhesive trace on the polystyrene film is measured as the length of the adhesive trace on the polystyrene film in the longitudinal direction of the polystyrene film.
The electronic component packaging cover tape according to any one of claims 1 to 6,
A cover tape for packaging electronic components, wherein the surface resistance of the substrate layer measured at 25° C. and 50% RH is 1.0×10 3 Ω or more and 1.0×10 13 Ω or less.
The electronic component packaging cover tape according to any one of claims 1 to 7,
A cover tape for packaging electronic parts, wherein the sealant layer has a surface resistance value of 1.0×10 3 Ω or more and 1.0×10 12 Ω or less measured at 25° C. and 50% RH.
The electronic component packaging cover tape according to any one of claims 1 to 8,
A cover tape for packaging electronic parts, having a total light transmittance of 70% or more and 95% or less as measured by a light source D65, according to JIS K 7361-1 (1997).
The electronic component packaging cover tape according to any one of claims 1 to 9,
A cover tape for packaging electronic components, having an external haze of 5% or more and 50% or less as measured with a light source D65 in accordance with JIS K 7136 (2000).
a carrier tape in which electronic components are housed in recesses;
and the electronic component packaging cover tape according to any one of claims 1 to 10,
An electronic component packaging body in which the sealant layer side is adhered to the carrier tape so as to seal the electronic component.