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WO2022206508A1 - 数据线及电子设备 - Google Patents

数据线及电子设备 Download PDF

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Publication number
WO2022206508A1
WO2022206508A1 PCT/CN2022/082472 CN2022082472W WO2022206508A1 WO 2022206508 A1 WO2022206508 A1 WO 2022206508A1 CN 2022082472 W CN2022082472 W CN 2022082472W WO 2022206508 A1 WO2022206508 A1 WO 2022206508A1
Authority
WO
WIPO (PCT)
Prior art keywords
aluminum foil
wire
connector
signal
data line
Prior art date
Application number
PCT/CN2022/082472
Other languages
English (en)
French (fr)
Inventor
聂东平
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to EP22778691.0A priority Critical patent/EP4318821A4/en
Publication of WO2022206508A1 publication Critical patent/WO2022206508A1/zh
Priority to US18/373,958 priority patent/US20240030657A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/0045—Cable-harnesses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6592—Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the present application belongs to the field of communication technologies, and in particular relates to a data cable and an electronic device.
  • RE Radiated Emission
  • the commonly used material for charging cables is metal braiding or winding to shield the external RE radiation of the internal signal cables.
  • RE includes magnetic field radiation and electric field radiation.
  • the prior art wiring methods include:
  • the outer braid is open to the Type C end, and the outer braid can only be short-circuited by the aluminum foil and the ground wire, and the contact is unstable, which is easy to cause antenna effects and make the RE radiation not meet the standard;
  • the Type C terminal is opened, the characteristic impedance suddenly changes, resulting in a significant increase in the peak value of the data line between 150M and 200M, the RE performance of the data line becomes worse, and the frequency point shifts significantly after the data line is shortened;
  • This kind of wiring needs to rely on the outer braid as the loop return, and it needs to be short-circuited with the inner wire after indirect contact with the aluminum foil by the braid, and the ground wire impedance is unstable during use.
  • the purpose of the embodiments of the present application is to provide a data cable and an electronic device, which can solve the problem of burning ports caused by internal and external braiding of the data cable in the prior art or the problem that the RE radiation does not meet the standard.
  • an embodiment of the present application provides an A-type male (AM) connector, a Type C connector, a connecting wire, and at least one capacitor;
  • AM A-type male
  • the two ends of the connecting line are respectively electrically connected with the AM connector and the Type C connector;
  • the connecting line includes:
  • An aluminum foil for shielding electromagnetic waves, an accommodation space is formed on the inner side of the aluminum foil;
  • the power line is used to provide power
  • the signal line is used to transmit Universal Serial Bus (USB) signals
  • the inner line is arranged between the two signal lines, and the two signal lines
  • the wire and the inner side of the aluminum foil are respectively connected, and the inner wire is used to provide a return flow for the power supply and a reference ground for the signal wire
  • the outer ground wire is connected to the outer side of the aluminum foil and the metal shell of the AM connector
  • the at least one capacitor is arranged between the metal shell of the Type C connector and the ground wire of the connecting wire, and is used to introduce electromagnetic waves coupled on the metal shell of the Type C connector to the ground wire; wherein,
  • the ground wire of the connecting wire includes: the internal wire or the external ground wire.
  • an embodiment of the present application further provides an electronic device, including an electronic device body and the above-mentioned data cable;
  • the data line is electrically connected to the electronic device body in a detachable manner.
  • the short circuit between the outer braid and the metal shell of the Type C end is cancelled to reduce the risk of burning the port, and the capacitance is simultaneously increased between the metal shell and the ground wire, so that the high-frequency signal radiated on the metal shell can be well grounded , reduce the amount of external radiation; change the outer braid to the inner wire, which simplifies the wire manufacturing process and reduces the antenna effect caused by the discontinuous impedance of the wire caused by the ungrounded outer braid.
  • the inner wire is added between the signal wires to ensure Each signal line has a complete reference ground when transmitting high-frequency signals, which reduces the fluctuation of the characteristic impedance of the bare wire signal line and improves the characteristic impedance tolerance of the process signal line.
  • the large area can reduce the outward radiation of signals. When the wire is bent or bent, the characteristic impedance will not change greatly, which ensures the RE performance of the data line.
  • FIG. 1 shows a schematic structural diagram of a connection line included in a data line provided by an embodiment of the present application
  • FIG. 2 shows a schematic diagram of an aluminum foil structure of a connecting line included in a data line provided in an embodiment of the present application
  • FIG 3 shows one of the schematic diagrams of the PCB of the Type C connector included in the data line provided by the embodiment of the present application
  • FIG. 5 shows a schematic diagram of a connection of a data line provided by an embodiment of the present application
  • FIG. 6 shows an exploded view of a data line provided by an embodiment of the present application.
  • first, second and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the present application can be practiced in sequences other than those illustrated or described herein, and distinguish between “first”, “second”, etc.
  • the objects are usually of one type, and the number of objects is not limited.
  • the first object may be one or more than one.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the associated objects are in an "or” relationship.
  • An embodiment of the present application provides a data line, including an AM connector, a Type C connector, a connecting line, and at least one capacitor;
  • the two ends of the connecting wire are respectively electrically connected with the AM connector and the Type C connector, as shown in Figure 1, the connecting wire includes:
  • An aluminum foil 1 for shielding electromagnetic waves, an accommodation space is formed on the inner side of the aluminum foil 1;
  • the power line 2 is used to provide power
  • the signal line 3 is used to transmit USB signals
  • the inner wire 4 is arranged between the two signal wires 3 and is connected to the two signal wires 3 and the inner side of the aluminum foil 1 respectively.
  • the inner wire 4 is used to provide a return flow for the power supply and a reference ground for the signal wire. ;
  • the external ground wire 5 is connected to the outside of the aluminum foil 1 and to the metal shell of the AM connector.
  • the external ground wire is used to conduct the grounding of the metal shell of the AM end and introduce the radiated electromagnetic waves on the aluminum foil 1 to the grounding.
  • At least one capacitor 8 is arranged between the metal shell of the Type C connector and the ground wire of the connecting wire; it is used to introduce electromagnetic waves coupled on the metal shell of the Type C connector into to the ground wire to reduce the external radiation of electromagnetic signals coupled to the outer metal shell of the Type C connector in the processing area and the Printed Circuit Board (PCB).
  • the ground wire of the connecting wire includes: an internal wire or an external ground wire.
  • the capacitor is a high-frequency filter capacitor. As shown in Figure 5, cancel the short circuit between the outer braid and the metal shell of the Type C end to reduce the risk of burning the port. At the same time, add a high-frequency filter capacitor between the metal shell and the ground wire, and use high-frequency grounding to make the radiation on the metal shell high.
  • the frequency signal can be well grounded to reduce the amount of external radiation.
  • the aluminum foil 1 can reduce the electromagnetic waves radiated to the outside when the signal lines 3 (D+/D-) transmit signals, and at the same time make the connection between the outer ground wire and the inner wire.
  • the above two inner wires are bare ground wires.
  • the braiding is changed to a bare ground wire, which simplifies the wire manufacturing process and reduces the antenna effect caused by the discontinuous impedance of the wire caused by the ungrounded outer winding.
  • a bare ground wire is added between the signal wires (this part The cost of bare ground is lower than that of external braiding), ensuring that each signal line has a complete reference ground when transmitting high-frequency signals, reducing the fluctuation of the characteristic impedance of the bare wire signal line, and the characteristic impedance tolerance of the process signal line is improved by ⁇ 10ohm It is ⁇ 5ohm. Because there are two bare ground wires in the middle, the cross-sectional area is large, which can reduce the signal radiating outward. When the wire is bent or bent, the characteristic impedance will not change greatly, which ensures the RE of the data cable. performance.
  • the connecting line further includes:
  • the nylon rope 6 arranged in the accommodating space inside the aluminum foil is used to fill the gap between the wires in the accommodating space.
  • the arrangement of the nylon rope 6 can ensure that the wire is round, and at the same time increase the tensile and sway resistance of the wire.
  • the outer braid is changed to the inner wire, which simplifies the manufacturing process and reduces the cost.
  • the inner wire can be directly welded on the PCB, so that the connection of the inner wire is stable and the ground wire impedance instability caused by poor contact is avoided.
  • the signal wire has a better reference ground, reducing the electromagnetic signal on the aluminum foil and the outer ground wire, so that the electromagnetic wave is mainly conducted between the signal wire and the inner wire. It avoids the antenna effect caused by the impedance mismatch caused by the open circuit of the outer braid and the metal shell of the Type C end, and enhances the external radiation of the data line.
  • the aluminum foil is a double-sided aluminum foil or a multi-sided aluminum foil.
  • the single-layer aluminum foil is changed to double-layer aluminum foil (or multi-layer aluminum foil), as shown in Figure 2, to reduce the ability of electromagnetic waves to pass through the first layer of aluminum foil due to the large transmission of external radiation, the multi-layer structure can be used.
  • the second layer of aluminum foil can attenuate most of the radiated electromagnetic waves, thereby reducing the external radiation of the entire wire harness.
  • the thickness of different layers of aluminum foil is determined according to the frequency of different electromagnetic waves. For example, according to USB2.0, the radiation point of RE transmission can be around 150M and 250M, the calculated adhesion depth is around 7um, and the aluminum foil can be selected to be larger than 7um. It is reasonable to use multi-layer aluminum foil and appropriate thickness to avoid the problem caused by aluminum foil. The wire is too hard and the hand feel is not good, and the external radiation of electromagnetic waves is minimized.
  • the single-sided aluminum foil is changed to double-layer aluminum foil or multi-layer aluminum foil, the adhesion depth is calculated according to the signal frequency, the thickness of the aluminum foil is optimized, and the external radiation of internal high-frequency signals is reduced.
  • the embodiment of the present application also optimizes the corresponding PCB design, reduces the impedance mismatch problem caused by processing by optimizing the PCB, and reduces the radiation caused by signal reflection.
  • the Type C connector includes: a printed circuit board PCB 7, and the PCB includes:
  • the PCB includes: a top layer, at least one connection layer and a ground layer;
  • the area corresponding to the signal port in the first connection layer is a wall void area
  • the first connection layer is a connection layer adjacent to the top layer.
  • the first connection layer includes:
  • a groove is formed between the first area and the second area, the orthographic projection of the signal port on the first connection layer is located in the groove, and the groove is formed to be connected to the groove.
  • connection layer 2 Inner Layer 2
  • signal line port (D+/D-) pad of the top layer Due to the large area of the pad, the characteristic impedance of the welding area will be reduced, the influence of the process on the characteristic impedance will be minimized, and the characteristic impedance of the wire connector, processing area, and wire area will be guaranteed.
  • the continuity of the signal is reduced, the reflection caused by the impedance mismatch is reduced, the signal radiation is reduced, and the RE performance is improved.
  • Figure 6 shows an exploded view of the data line provided by the embodiment of the present application, which specifically includes:
  • the metal shell 10 of the AM end increases the pressure resistance and electromagnetic shielding of the connector, and reduces the external radiation of internal electromagnetic signals
  • AM end outer mold 20 protect the inner mold from waterproof and dustproof from entering the interior;
  • Type C end SR inner mold 30, increase the anti-swing ability of the wire
  • Type C end inner mold 40 to protect internal solder joints and prevent water vapor from entering;
  • AM end rubber core and terminal 50 are used for signal connection and power connection;
  • AM end inner mold 60 to protect internal solder joints and prevent water vapor from entering
  • AM end SR inner mold 70 increase the anti-swing ability of the wire
  • Type C end outer mold 80 protect the inner mold from waterproof and dustproof from entering the interior;
  • the wire 90 provides connection for the connectors at both ends;
  • the copper foil 100 is used to wrap the reversed external ground wire, so that the AM riveting claw rives the external ground wire to short-circuit the AM and the external ground wire;
  • Type C end metal shell 110 Type C end left and right metal shells, increase the pressure resistance of Type C connector and shield electromagnetic signals;
  • Type C end PCB board 120 connector wire and connector
  • Resistor 130 pull-up 56K ⁇ resistor, used to communicate with the mobile phone and identify the wire;
  • Capacitor 140 filter capacitor, connect the metal shell to GND to reduce the electromagnetic wave radiated by the Type C metal shell;
  • UV glue 150 protects the solder joints, increases the tensile strength of the wire and prevents moisture from entering the solder joints and causing tin migration.
  • the braiding is changed to a bare ground wire, which simplifies the wire manufacturing process, optimizes the overall cost of the data wire, and reduces the antenna effect caused by the discontinuous impedance of the wire caused by the ungrounded external winding.
  • the bare ground wire is added (the cost of this part of the bare ground is lower than that of the outer braid), to ensure that each signal wire has a complete reference ground when transmitting high-frequency signals, reducing the fluctuation of the characteristic impedance of the bare wire signal wire, and the process signal
  • the characteristic impedance tolerance of the wire is improved from ⁇ 10ohm to ⁇ 5ohm.
  • the cross-sectional area is large, which can reduce the signal radiating outward.
  • the characteristic impedance will not be large.
  • the change of the data line ensures the RE performance of the data line; at the same time, the risk of burning the port caused by the grounding of the metal shell is reduced.
  • At least one embodiment of the present application further provides an electronic device, including an electronic device body and the above-mentioned data cable;
  • the data line is electrically connected to the electronic device body in a detachable manner.
  • the power supply terminal charges the electronic device body through the data line, or other devices read the stored data of the electronic device body through the data line.

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Abstract

一种数据线，包括AM连接器、Type C连接器、连接线以及至少一个电容（8）；连接线的两端分别与AM连接器和Type C连接器电连接，该连接线包括：用于屏蔽电磁波的铝箔（1），铝箔（1）的内侧形成有容置空间；设置于铝箔（1）内侧容置空间的两根电源线（2）、两根信号线（3）以及两根内地线（4）；设置于铝箔（1）外侧的外地线（5）；其中，电源线（2）用于提供电源，信号线（3）用于传输USB信号；内地线（4）设置于两根信号线（3）之间，与两根信号线（3）以及铝箔（1）内侧分别连接，内地线（4）用于为电源提供回流以及为信号线（3）提供参考地；外地线（5）与铝箔（1）外侧连接以及AM连接器的金属壳连接；至少一个电容（8）用于将耦合在Type C连接器的金属壳上的电磁波引入到地线上。该数据线减少了端口被烧风险，降低对外辐射量，简化线材制造工艺，减少了天线效应，缩小了信号线特性阻抗的波动，改善了信号线的特性阻抗公差。还涉及一种电子设备。

Description

数据线及电子设备
相关申请的交叉引用
本申请主张在2021年3月30日在中国提交的中国专利申请号No.202110340687.3的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于通信技术领域，具体涉及一种数据线及电子设备。
背景技术
随着电子科技的发展，电线传输信号的频率越来越高，对辐射发射(Radiated Emission，RE)的要求日益严格。当前充电线常用的材料是金属编织或者缠绕来屏蔽内部信号线对外的RE辐射。其中，RE包括磁场辐射、电场辐射。现有技术的接线方式包括：
在实现本申请过程中，发明人发现现有技术中至少存在如下问题：
1.外编织与Type C端金属壳短路容易引起烧端口问题；
2.外编织与Type C端开路，外编织只能靠铝箔与地线短路，接触不稳定，容易引发天线效应，使RE辐射不符合标准；例如，Type C端外编织通过铝箔与内地短路，在Type C端开路后，特性阻抗发生突变导致数据线在150M-200M之间峰值增加明显，数据线RE性能变差，数据线变短后频点明显后移；
3.此种接线需要靠外编织作为回路回流，需要靠编织通过铝箔间接接触后与内地线短路，在使用时候地线阻抗不稳定。
发明内容
本申请实施例的目的是提供一种数据线及电子设备，能够解决现有技术的数据线中外编织引起的烧端口问题或RE辐射不符合标准的问题。
第一方面，本申请实施例提供了包括A型公头(AM)连接器、Type C连接器、连接线以及至少一个电容；
其中，所述连接线的两端分别与AM连接器和Type C连接器电连接；所述连接线包括：
用于屏蔽电磁波的铝箔，所述铝箔的内侧形成有容置空间；
设置于所述铝箔内侧容置空间的两根电源线、两根信号线以及两根内地线；
设置于所述铝箔外侧的外地线；
其中，所述电源线用于提供电源，所述信号线用于传输通用串行总线(Universal Serial Bus，USB)信号；所述内地线设置于所述两根信号线之间，与两根信号线以及所述铝箔内侧分别连接，所述内地线用于为电源提供回流以及为信号线提供参考地；所述外地线与所述铝箔外侧连接以及AM连接器的金属壳连接；
所述至少一个电容设置于所述Type C连接器的金属壳和所述连接线的地线之间，用于将耦合在Type C连接器的金属壳上的电磁波引入到地线上；其中，所述连接线的地线包括：所述内地线或所述外地线。
第二方面，本申请实施例还提供一种电子设备，包括电子设备本体以及如上所述的数据线；
其中，所述数据线与所述电子设备本体可拆卸的电连接。
在本申请实施例中，取消外编织与Type C端的金属壳短路，减少烧端口风险，同步在金属壳和地线之间增加电容，让辐射在金属壳上的高频信号能够很好的接地，减少对外辐射量；将外编织改为内地线，在简化线材制造工艺同时减少外编织不接地引起线材断的阻抗不连续而引发的天线效应，同时在信号线之间增加了内地线，保证每一根信号线传输高频信号时都有完整的参考地，缩小了裸线信号线特性阻抗的波动，改善了制程信号线的特性阻抗公差，因连接线内部有两根内地线，横截面积大，可以减少信号向外辐射，在线材发生弯折或者弯曲时，特性阻抗不会发生较大的变化，保证了数据线的RE性能。
附图说明
图1表示本申请实施例提供的数据线包括的连接线的结构示意图；
图2表示本申请实施例提供的数据线包括的连接线的铝箔结构示意图；
图3表示本申请实施例提供的数据线包括的Type C连接器的PCB示意图之一；
图4表示本申请实施例提供的数据线包括的Type C连接器的PCB示意图之二；
图5表示本申请实施例提供的数据线的连接示意图；
图6表示本申请实施例提供的数据线的爆炸图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的数据线进行详细地说明。
本申请实施例提供一种数据线，包括AM连接器、Type C连接器、连接线以及至少一个电容；
其中，所述连接线的两端分别与AM连接器和Type C连接器电连接，如图1所示，所述连接线包括：
用于屏蔽电磁波的铝箔1，所述铝箔1的内侧形成有容置空间；
设置于所述铝箔1内侧容置空间的两根电源线2、两根信号线3以及两根内地线4；
设置于所述铝箔1外侧的外地线5；
其中，所述电源线2用于提供电源，所述信号线3用于传输USB信号；
所述内地线4设置于所述两根信号线3之间，与两根信号线3以及所述铝箔1内侧分别连接，所述内地线4用于为电源提供回流以及为信号线提供参考地；
所述外地线5与所述铝箔1外侧连接以及AM连接器的金属壳连接。外地线用作导通AM端金属壳接地及把铝箔1上的辐射电磁波导入接地。
其中，如图4所示，至少一个电容8设置于所述Type C连接器的金属壳和所述连接线的地线之间；用于将耦合在Type C连接器的金属壳上的电磁波引入到地线上，减少加工区域及印制线路板(Printed Circuit Board，PCB)上耦合到Type C连接器的外金属壳上的电磁信号对外辐射。其中，所述连接线的地线包括：内地线或外地线。
其中，所述电容为高频滤波电容。如图5所示，取消外编织与Type C端金属壳短路，减少烧端口风险，同步在金属壳和地线之间增加高频滤波电容，采用高频接地，让辐射在金属壳上的高频信号能够很好的接地，减少对外辐射量。
本申请实施例中，铝箔1能够减少信号线3(D+/D-)传输信号时向外辐射电磁波，同时让外地线和内地线之间导通。
作为一个可选实施例，上述两根内地线为裸地线。
本申请实施例将编织改为裸地线，在简化线材制造工艺同时减少外缠绕不接地引起线材断的阻抗不连续而引发的天线效应，同时在信号线之间增加了裸地线(此部分裸地成本要低于外编织)，保证每一根信号线传输高频信号时都有完整的参考地，缩小了裸线信号线特性阻抗的波动，制程信号线的特性阻抗公差由±10ohm改善为±5ohm，因中间有两根裸地线，横截面积大，可以减少信号向外辐射，在线材发生弯折或者弯曲时，特性阻抗不会发生较大的变化，保证了数据线的RE性能。
作为一个可选实施例，如图1所示，所述连接线还包括：
设置于所述铝箔内侧容置空间的尼龙绳6，用于填充所述容置空间内线材间的间隙。尼龙绳6的设置能够保证线材呈圆形，同时增加线材的抗拉能 力及抗摇摆能力。
本申请实施例将外编织改为内地线，简化了制程工艺，同时降低了成本，同时内地线可以直接焊接在PCB上，使内地线连接稳定，避免了因接触不良引起的地线阻抗不稳定；且通过在信号线之间增加内地线，让信号线有更好的参考地，减少铝箔和外地线上的电磁信号，让电磁波主要在信号线和内地线之间传导。避免了外编织与Type C端金属壳断路引发的阻抗不匹配而产生的天线效应使数据线对外辐射增强。
在本申请的至少一个实施例中，所述铝箔为双面铝箔或多面铝箔。
本申请实施例中，将单层铝箔改为双层铝箔(或者多层铝箔)，如图2所示，减少电磁波穿过首层铝箔因透射对外辐射较大的能力，采用多层结构可以使用首层铝箔被穿透后，第二层铝箔可以衰减辐射出去的大部分电磁波，从而减少整个线束的对外辐射量，根据不同电磁波的频率决定不同层铝箔厚度。例如，按照USB2.0传输RE的辐射点在150M和250M左右可以，计算趋附深度在7um左右，铝箔选用大于7um即可，合理的使用多层铝箔和合适的厚度，既避免因铝箔过后引起的线材太硬手感不好，又最大化减少了电磁波对外辐射。
本申请实施例将单面铝箔改为双层铝箔或多层铝箔，根据信号频率计算趋附深度，优化了铝箔厚度，减少内部高频信号对外辐射。
作为一个可选实施例，基于上述连接线的结构，本申请实施例还优化对应的PCB设计，通过优化PCB来减少因加工带来的阻抗不匹配问题，减少了信号反射引发的辐射。即所述Type C连接器包括：印制电路板PCB 7，所述PCB包括：
与两根内地线分别对应的两个接地端口GND；
与两根信号线分别对应的两个信号端口D+/D-；以及，
与两根电源线分别对应的两个电源端口Vbus。
作为一个可选实施例，所述PCB包括：顶层、至少一个连接层以及地层；
其中，第一连接层中与所述信号端口对应的区域为壁空区域，所述第一连接层为与所述顶层相邻的连接层。
在本申请的至少一个实施例中，所述第一连接层包括：
与所述电源端口对应的第一区域；
与所述接地端口对应的第二区域；
其中，所述第一区域与所述第二区域之间形成有凹槽，所述信号端口在所述第一连接层上的正投影位于所述凹槽内，所述凹槽形成为与所述信号端口对应的壁空区域。
在顶层的信号线端口(D+/D-)焊盘下面的连接层2(Inner Layer 2)对应的方框区域做避空设计，通过提高D+/D-焊盘与地层的距离来提高焊盘区域的特性阻抗，来补偿D+/D-因焊盘面积大，焊接后会降低焊接区域的特性阻抗，最大程度减少制程对特性阻抗的影响，保证线材连接器、加工区、和线材区域特性阻抗的连续性，减少信号因阻抗不匹配而引发的反射，减少了信号辐射，提升了RE性能。
如图6所示为本申请实施例提供的数据线的爆炸图，具体包括：
AM端金属壳10，增加连接器抗压能力及电磁屏蔽，减少内部电磁信号向外辐射；
AM端外模20，保护内模防水防尘进入内部；
Type C端SR内模30，增加线材抗摇摆能力；
Type C端内模40，保护内部焊点及防止水汽进入；
AM端胶芯及端子50，用于信号连接及电源连接；
AM端内模60，保护内部焊点及防止水汽进入；
AM端SR内模70，增加线材抗摇摆能力；
Type C端外模80，保护内模防水防尘进入内部；
线材90，为两端连接器提供连接；
铜箔100，用于缠绕反折的外地线，让AM铆爪铆压外地线上，使AM与外地线短路；
Type C端金属壳110，Type C端左右金属壳，增加Type C连接器的抗压力及屏蔽电磁信号；
Type C端PCB板120，连接器线材和连接器；
电阻130，上拉56KΩ电阻，用于和手机端通信，识别线材；
电容140：滤波电容，连接金属壳点GND，减少Type C金属壳对外辐射 电磁波；
UV胶150，保护焊接焊点，增加线材抗拉能力及防止水汽进入焊点位置导致锡迁移。
综上，本申请实施例将编织改为裸地线，简化线材制造工艺，优化数据线总体成本，同时减少外缠绕不接地引起线材断的阻抗不连续而引发的天线效应，同时在信号线之间增加了裸地线(此部分裸地成本要低于外编织)，保证每一根信号线传输高频信号时都有完整的参考地，缩小了裸线信号线特性阻抗的波动，制程信号线的特性阻抗公差由±10ohm改善为±5ohm，因中间有两根裸地线，横截面积大，可以减少信号向外辐射，在线材发生弯折或者弯曲时，特性阻抗不会发生较大的变化，保证了数据线的RE性能；同时减少了金属壳接地带来的烧端口风险。
本申请的至少一个实施例还提供一种电子设备，包括电子设备本体以及如上所述的数据线；
其中，所述数据线与所述电子设备本体可拆卸的电连接。
例如，电子设备本体与数据线电连接的情况下，电源端通过数据线为电子设备本体充电，或者，其他设备通过数据线读取电子设备本体的存储数据。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通 过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如只读存储器(Read-Only Memory，ROM)/随机存取存储器(Random Access Memory，RAM)、磁碟、光盘)中，包括若干指令用以使得一台终端(可以是手机，计算机，服务器，空调器，或者网络设备等)执行本申请各个实施例所述的方法。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (9)

  1. 一种数据线，包括AM连接器、Type C连接器、连接线以及至少一个电容；
    其中，所述连接线的两端分别与AM连接器和Type C连接器电连接；所述连接线包括：
    用于屏蔽电磁波的铝箔，所述铝箔的内侧形成有容置空间；
    设置于所述铝箔内侧容置空间的两根电源线、两根信号线以及两根内地线；
    设置于所述铝箔外侧的外地线；
    其中，所述电源线用于提供电源，所述信号线用于传输USB信号；所述内地线设置于所述两根信号线之间，与两根信号线以及所述铝箔内侧分别连接，所述内地线用于为电源提供回流以及为信号线提供参考地；所述外地线与所述铝箔外侧连接以及AM连接器的金属壳连接；
    所述至少一个电容设置于所述Type C连接器的金属壳和所述连接线的地线之间，用于将耦合在Type C连接器的金属壳上的电磁波引入到地线上；其中，所述连接线的地线包括：所述内地线或所述外地线。
  2. 根据权利要求1所述的数据线，其中，所述铝箔为双层铝箔或多层铝箔。
  3. 根据权利要求1所述的数据线，其中，所述Type C连接器包括：印制电路板PCB，所述PCB包括：
    与两根内地线分别对应的两个接地端口；
    与两根信号线分别对应的两个信号端口；以及，
    与两根电源线分别对应的两个电源端口。
  4. 根据权利要求3所述的数据线，其中，所述PCB包括：顶层、至少一个连接层以及地层；
    其中，第一连接层中与所述信号端口对应的区域为壁空区域，所述第一连接层为与所述顶层相邻的连接层。
  5. 根据权利要求4所述的数据线，其中，所述第一连接层包括：
    与所述电源端口对应的第一区域；
    与所述接地端口对应的第二区域；
    其中，所述第一区域与所述第二区域之间形成有凹槽，所述信号端口在所述第一连接层上的正投影位于所述凹槽内，所述凹槽形成为与所述信号端口对应的壁空区域。
  6. 根据权利要求1所述的数据线，其中，所述电容为高频滤波电容。
  7. 根据权利要求1所述的数据线，其中，所述连接线还包括：
    设置于所述铝箔内侧容置空间的尼龙绳，用于填充所述容置空间内线材间的间隙。
  8. 根据权利要求1所述的数据线，其中，所述内地线为裸地线。
  9. 一种电子设备，包括电子设备本体以及如权利要求1-8任一项所述的数据线；
    其中，所述数据线与所述电子设备本体可拆卸的电连接。
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CN113067212A (zh) 2021-07-02

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