[go: up one dir, main page]

WO2022111133A1 - 气压传感组件及其封装方法 - Google Patents

气压传感组件及其封装方法 Download PDF

Info

Publication number
WO2022111133A1
WO2022111133A1 PCT/CN2021/124546 CN2021124546W WO2022111133A1 WO 2022111133 A1 WO2022111133 A1 WO 2022111133A1 CN 2021124546 W CN2021124546 W CN 2021124546W WO 2022111133 A1 WO2022111133 A1 WO 2022111133A1
Authority
WO
WIPO (PCT)
Prior art keywords
air pressure
pressure sensor
sensor chip
chip
substrate
Prior art date
Application number
PCT/CN2021/124546
Other languages
English (en)
French (fr)
Inventor
李向光
方华斌
田峻瑜
Original Assignee
潍坊歌尔微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2022111133A1 publication Critical patent/WO2022111133A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits

Definitions

  • the present application relates to the technical field of sensors, and in particular, to an air pressure sensing component and a packaging method thereof.
  • Air pressure (differential pressure, gauge pressure) sensors have been widely used in medical, industrial and other fields, and some wearable products have also begun to use this product for health monitoring (such as blood pressure measurement).
  • health monitoring such as blood pressure measurement.
  • the main purpose of the present application is to provide an air pressure sensing assembly and a packaging method thereof, aiming to obtain an air pressure sensing assembly that is resistant to environmental corrosion and high-speed impact.
  • an air pressure sensing assembly comprising:
  • the substrate is provided with air holes;
  • an air pressure sensor chip mounted on the substrate and disposed corresponding to the air hole, the side of the air pressure sensor chip facing the air hole is the first side, and the side away from the air hole is the second side;
  • first side and the second side are provided with encapsulant.
  • the substrate is further provided with a casing surrounding the periphery of the air hole at the air pressure sensor chip;
  • the gap between the air pressure sensor chip and the casing is filled with encapsulant.
  • the air pressure sensor chip includes:
  • a support enclosure is arranged on the side of the chip main body facing the air hole, and is supported on the substrate and is arranged around the air hole, the support enclosure and the chip main body define a relationship with the air hole.
  • the air holes are opposite and communicate with each other in a cavity, and the cavity is filled with the packaging glue.
  • the encapsulant is silicone gel.
  • an ASIC chip is further mounted on the substrate, and the ASIC chip is electrically connected to the air pressure sensor chip and the substrate.
  • the substrate is further provided with a casing surrounding the periphery of the air hole at the air pressure sensor chip;
  • the gap between the air pressure sensor chip and the housing is filled with encapsulant
  • An ASIC chip is also mounted on the substrate, and the ASIC chip is arranged in the casing and wrapped by the encapsulant.
  • the present application provides a packaging method for an air pressure sensing component, comprising the following steps:
  • an air pressure sensor chip is provided, the air pressure sensor chip has a first side and a second side, and an encapsulant is provided on the first side of the air pressure sensor chip;
  • the substrate is provided with air holes
  • An encapsulant is provided on the second side of the air pressure sensor chip.
  • the air pressure sensor chip includes a chip body and a support enclosure, the support enclosure is disposed on a side of the chip body facing the air hole, and the support enclosure is defined by the chip body. Outgoing a cavity opposite and communicating with the air hole;
  • the step of disposing the encapsulant on the first side of the air pressure sensor chip includes:
  • a first UV film is provided, and the adhesive side of the first UV film is set up;
  • Vacuum defoaming is performed on the encapsulant.
  • the step of disposing the encapsulant on the second side of the air pressure sensor chip includes:
  • a casing is provided, and the casing is arranged in a cylindrical shape;
  • the second side of the air pressure sensor chip and the space between the air pressure sensor chip and the casing are filled with encapsulant.
  • the air pressure sensor chip includes a chip body and a support enclosure, and the support enclosure is provided on a side of the chip body facing the air hole;
  • the step of installing the first side of the air pressure sensor chip toward the substrate, so that the first side of the air pressure sensor chip corresponds to the air hole on the substrate includes:
  • the support enclosure and the annular rubber ring are pasted and fixed.
  • a first UV film is provided, the adhesive surface of the first UV film is set up, and the second side of the air pressure sensor chip is bonded to the first UV film, so that the the first side of the air pressure sensor chip is placed upward;
  • the step of turning over the air pressure sensing chip with the encapsulation glue so that the first side of the air pressure sensing chip with the encapsulation glue is placed down includes:
  • a second UV film is provided, and the second UV film is correspondingly placed above the first UV film, so that the adhesive surface of the second UV film is bonded to the support enclosure;
  • the first UV film is irradiated with ultraviolet rays, so that the first UV film is separated from the support enclosure.
  • the protection of both sides of the sensor chip is realized, so that the sensor chip can be resistant to environmental corrosion and resistant to environmental corrosion. High-speed impact, and enhance product reliability.
  • FIG. 1 is a schematic structural diagram of an embodiment of an air pressure sensing assembly provided by the present application
  • FIG. 2 is a schematic structural diagram of the first side of the air pressure sensor chip in FIG. 1 with encapsulation glue;
  • FIG. 3 is a schematic structural diagram of the air pressure sensor chip in FIG. 1 being adhered to the first UV film;
  • FIG. 4 is a schematic structural diagram of the first side of the air pressure sensor chip in FIG. 1 filled with encapsulant;
  • FIG. 5 is a schematic structural diagram of the molding of the first side encapsulant of the air pressure sensor chip in FIG. 4;
  • FIG. 6 is a schematic structural diagram of the second side of the air pressure sensor chip in FIG. 4 being adhered to the second UV film;
  • FIG. 7 is a schematic flowchart of an embodiment of a method for packaging an air pressure sensing component provided by the present application.
  • FIG. 8 is a schematic flowchart of filling the encapsulant on the first side of the air pressure sensor chip in FIG. 7;
  • FIG. 9 is a schematic flow chart of installing the first side of the air pressure sensor chip on the substrate in FIG. 7;
  • FIG. 10 is a schematic flowchart of inverting the air pressure sensor chip in FIG. 9 so that the first side faces downward;
  • FIG. 11 is a schematic flowchart of filling the encapsulant on the second side of the air pressure sensor chip in FIG. 7 .
  • the directional indication is only used to explain the relative positional relationship, motion, etc. between the various components under a certain posture. If the specific posture changes , the directional indication changes accordingly.
  • Air pressure (differential pressure, gauge pressure) sensors have been widely used in medical, industrial and other fields, and some wearable products have also begun to use this product for health monitoring (such as blood pressure measurement).
  • health monitoring such as blood pressure measurement.
  • FIGS. 1 to 2 are schematic structural diagrams of an embodiment of the air pressure sensing assembly provided by the present application
  • FIGS. 3 to 6 are the air pressure sensing assembly provided by the present application.
  • the packaging process flow chart of the component FIG. 7 to FIG. 11 are schematic flowcharts of an embodiment of the packaging method of the air pressure sensor component provided by the present application.
  • the air pressure sensor assembly 100 includes a substrate 1 and an air pressure sensor chip 2 , the substrate 1 is provided with an air hole 11 therethrough, and the air pressure sensor chip 2 is mounted on the substrate 1 and corresponding to the air hole 11, the side of the air pressure sensor chip 2 facing the air hole 11 is the first side, and the side away from the air hole 11 is the second side, wherein the first side, And the second side is provided with encapsulation glue a.
  • the first side and the second side of the sensor chip 2 are connected to each other. protection, making it resistant to environmental corrosion, high-speed impact, and enhancing product reliability.
  • the substrate 1 is further provided with a casing 3 surrounding the air hole 11 at the air pressure sensor chip 2 .
  • the gap between them is filled with encapsulation glue a, which realizes encapsulation of the second side of the air pressure sensor chip 2 .
  • the air pressure sensor chip 2 includes a chip body 21 and a support enclosure 22 .
  • the support enclosure 22 is provided on the side of the chip body 21 facing the air hole 11 and supported on the substrate 1 .
  • the support enclosure 22 and the chip body 21 define a cavity b opposite to the air hole 11 and in communication with the air hole 11.
  • the cavity b is filled with The encapsulation glue a realizes the encapsulation of the first side of the air pressure sensor chip 2 .
  • the material of the encapsulant a is silicon gel, and in this way, the elasticity of the silicon gel can be used to reduce the impact of high-speed impact and avoid air pressure sensing. Chip 2 is directly exposed to the environment to avoid being corroded by the environment.
  • An ASIC chip 4 is also mounted on the substrate 1 , and the ASIC chip 4 is electrically connected to the air pressure sensor chip 2 and the substrate 1 , so that the air pressure sensor chip 2 is connected to the air pressure sensor chip 2 through the ASIC chip 4 .
  • the electrical signal sent out is processed.
  • the air pressure sensor can be connected to the air pressure sensor by wire bonding or solder ball planting.
  • the electrical signals of the chip 2 and the ASIC chip 4 are introduced into the substrate 1 .
  • the ASIC chip 4 can also be electrically connected to the air pressure sensor chip 2 and the substrate 1 through conductive wires. This application does not limit this.
  • the substrate 1 is further provided with a casing 3 surrounding the air hole 11 at the air pressure sensor chip 2 .
  • the air pressure sensor chip 2 is connected to the casing 3 .
  • the gap between 3 is filled with encapsulation glue a
  • the substrate 1 is also mounted with an ASIC chip 4
  • the ASIC chip 4 is arranged in the housing 3 and is wrapped by the encapsulation glue a, in this way, it can also be Protecting the ASIC chip 4 prevents the ASIC chip 4 from being directly exposed to the environment, improves the environmental corrosion resistance of the ASIC chip 4, and makes the air pressure sensing assembly 100 compact in structure.
  • the present application also proposes a packaging method for an air pressure sensing component, and the packaging method is used to obtain an air pressure sensing component that is resistant to environmental corrosion and high-speed impact.
  • 3 to 6 are flowcharts of the packaging process of the air pressure sensing component provided by the present application
  • FIGS. 7 to 11 are schematic flowcharts of an embodiment of the packaging method of the air pressure sensor component provided by the present application.
  • the packaging method of the air pressure sensing component includes:
  • Step S10 providing an air pressure sensor chip 2, the air pressure sensor chip 2 has a first side and a second side, and an encapsulation glue a is provided on the first side of the air pressure sensor chip 2;
  • Step S20 providing a substrate 1, and the substrate 1 is provided with air holes 11 therethrough;
  • Step S30 installing the first side of the air pressure sensor chip 2 toward the substrate 1 , so that the first side of the air pressure sensor chip 2 is disposed corresponding to the air hole 11 on the substrate 1 ;
  • step S40 packaging glue a is provided on the second side of the air pressure sensor chip 2 .
  • the first side of the air pressure sensor chip 2 is provided with a packaging glue a to realize the packaging of the first side of the air pressure sensor chip 2, and then the air pressure sensor chip 2 is packaged.
  • the first side of the air pressure sensor chip 2 is mounted toward the substrate 1, so that the first side of the air pressure sensor chip 2 corresponds to the air hole 11 on the substrate 1, so that the first side of the air pressure sensor chip 2 can pass through the air hole 11.
  • the package protection on both sides of the chip 2 makes it resistant to environmental corrosion, high-speed impact, and enhances the reliability of the product.
  • the material of the substrate 1 may be FR4, BT, ceramics, etc., which is not limited in this application.
  • the air pressure sensor chip 2 includes a chip body 21 and a support enclosure 22 , and the support enclosure 22 is provided on the chip body 21 facing the air hole 11 .
  • the support enclosure 22 and the chip body 21 define a cavity b that is opposite to and communicated with the air hole 11 , and the first side of the air pressure sensor chip 2 is provided with an encapsulant a. Steps include:
  • Step S101 providing a first UV film d, and setting the adhesive surface of the first UV film d upward;
  • Step S102 adhering the second side of the air pressure sensor chip 2 to the first UV film d, so that the first side of the air pressure sensor chip 2 is placed upward;
  • Step S103 filling the encapsulation glue a into the cavity b;
  • Step S104 vacuum degassing the encapsulant a.
  • the second side of the air pressure sensor chip 2 is bonded to the first UV film d, so that the air pressure sensor
  • the first side of the chip 2 is placed upward, which is convenient for filling the cavity b formed on the first side of the air pressure sensor chip 2 with the encapsulant a, so that the surface of the encapsulant a formed is parallel to the bottom of the cavity b,
  • vacuum defoaming the encapsulant a air bubbles remaining in the encapsulant a are removed, and the molding quality of the encapsulant a is improved.
  • the air pressure sensor chip 2 includes a chip body 21 and a support enclosure 22 , and the support enclosure 22 is provided on the side of the chip body 21 facing the air hole 11 , so
  • the step of installing the first side of the air pressure sensor chip 2 toward the substrate 1 so that the first side of the air pressure sensor chip 2 corresponds to the air hole 11 on the substrate 1 includes:
  • Step S301 turning the air pressure sensing chip 2 with the encapsulation glue a so that the first side of the air pressure sensing chip 2 with the encapsulation glue a is placed downward;
  • Step S302 applying glue around the periphery of the air hole 11 on the substrate 1 to form an annular rubber ring c;
  • Step S303 pasting and fixing the support enclosure 22 and the annular rubber ring c.
  • the air pressure sensor chip 2 with the packaging glue a is turned over, so that the air pressure sensor chip 2 with the packaging glue a is turned over.
  • the air pressure sensor chip 2 is placed with the first side facing down, and glue is applied on the substrate 1 around the periphery of the air hole 11 to form an annular rubber ring c, and the support enclosure 22 is pasted with the annular rubber ring c By fixing, the operation of mounting the air pressure sensor chip 2 on the substrate 1 is realized.
  • the air pressure sensor chip 2 seals the support enclosure 22 and the substrate 1 through the annular rubber ring c, so that the sensing sensitivity of the air pressure sensor chip 2 is improved. it is good.
  • a first UV film d is provided, the bonding surface of the first UV film d is set up, and the second side of the air pressure sensor chip 2 is bonded On the first UV film d, the first side of the air pressure sensor chip 2 is placed upward, and the air pressure sensor chip 2 with the encapsulant a is turned over, so that the air pressure sensor chip 2 with the encapsulant a is turned over.
  • the steps of placing the air pressure sensor chip 2 with the first side facing down include:
  • Step S3011 providing a second UV film e, and placing the second UV film e above the first UV film d, so that the adhesive surface of the second UV film e is adhered to the support enclosure 22. catch;
  • Step S3012 adjusting the positions of the first UV film d and the second UV film e, so that the first UV film d is located above the second UV film e;
  • Step S3013 irradiating the first UV film d with ultraviolet rays, so that the first UV film d is separated from the supporting enclosure 22 .
  • the second UV film e is correspondingly placed above the first UV film d, so that the adhesive surface of the second UV film e is bonded to the support enclosure 22, and by adjusting the The positions of the first UV film d and the second UV film e are such that the first UV film d is located above the second UV film e, and the air pressure sensor chip with the encapsulation glue a is realized at this time.
  • the second UV film e Perform ultraviolet irradiation to separate the air pressure sensor chip 2 with the encapsulation glue a from the second UV film e, so as to facilitate the acquisition of the air pressure sensor chip 2 with the encapsulation glue a.
  • the step of providing the encapsulant a on the second side of the air pressure sensor chip 2 includes:
  • Step S401 providing a casing 3, and the casing 3 is arranged in a cylindrical shape;
  • Step S402 enclosing the casing 3 around the peripheral side of the air pressure sensor chip 2 with the encapsulation glue a and fixing it on the substrate 1;
  • Step S403 filling the second side of the air pressure sensor chip 2 and the space between the air pressure sensor chip and the housing 3 with encapsulant a.
  • the casing 3 surrounds the peripheral side of the air pressure sensor chip 2 with the encapsulant a and is fixed on the substrate 1 , and the second side of the air pressure sensor chip 2 and the air pressure are fixed to the substrate 1 .
  • Encapsulation glue a is filled between the sensor chip and the casing 3 , thereby realizing the encapsulation of the second side of the air pressure sensor chip, and the operation is simple.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

本申请公开了一种气压传感组件及其封装方法，气压传感组件包括基板和气压传感芯片，基板上贯设有气孔，气压传感芯片，安装于基板且对应气孔设置，气压传感芯片朝向气孔的一侧为第一侧，背离气孔的一侧为第二侧，其中，第一侧、以及第二侧均设置有封装胶。

Description

气压传感组件及其封装方法
本申请要求于2020年11月30日申请的、申请号为202011385556.9的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及传感器技术领域，特别涉及一种气压传感组件及其封装方法。
 背景技术
气压（差压，表压）传感器目前已广泛应用在医疗、工业等领域，且目前有部分可穿戴产品也开始使用该产品用于健康监测（如测量血压）。为了保证器件在复杂场景下的高可靠性，亟需利用一种封装方法以得到一种够耐环境腐蚀、耐高速冲击的气压传感组件。
 技术问题
本申请的主要目的是提供一种气压传感组件及其封装方法，旨在可得到耐环境腐蚀、耐高速冲击的气压传感组件。
 技术解决方案
为实现上述目的，本申请提供一种气压传感组件，包括：
基板，所述基板上贯设有气孔；以及，
气压传感芯片，安装于所述基板且对应所述气孔设置，所述气压传感芯片朝向所述气孔的一侧为第一侧，背离所述气孔的一侧为第二侧；
其中，所述第一侧、以及所述第二侧均设置有封装胶。
在一实施例中，所述基板上在所述气压传感芯片处还设置有围设在所述气孔的外围的壳体；
所述气压传感芯片与所述壳体之间的间隙填充有封装胶。
在一实施例中，所述气压传感芯片包括：
芯片主体；
支撑围挡，设于所述芯片主体朝向所述气孔的一侧，且支撑在所述基板上且围设在所述气孔的周侧，所述支撑围挡与所述芯片主体限定出与所述气孔相对且连通的容腔，所述容腔内填充有所述封装胶。
在一实施例中，所述封装胶为硅凝胶。
在一实施例中，所述基板上还安装有ASIC芯片，所述ASIC芯片与所述气压传感芯片和所述基板电连接。
在一实施例中，所述基板上在所述气压传感芯片处还设置有围设在所述气孔的外围的壳体；
所述气压传感芯片与所述壳体之间的间隙填充有封装胶；
所述基板上还安装有ASIC芯片，所述ASIC芯片设于所述壳体内且被所述封装胶包裹。
为实现上述目的，本申请提供一种气压传感组件的封装方法，包括以下步骤：
提供气压传感芯片，所述气压传感芯片具有第一侧和第二侧，在所述气压传感芯片的第一侧设有封装胶；
提供基板，所述基板上贯设有气孔；
将所述气压传感芯片的第一侧朝向所述基板安装，使得所述气压传感芯片的第一侧对应所述基板上的气孔设置；
在所述气压传感芯片的第二侧设有封装胶。
在一实施例中，所述气压传感芯片包括芯片主体和支撑围挡，所述支撑围挡设于所述芯片主体朝向所述气孔的一侧，所述支撑围挡与所述芯片主体限定出与所述气孔相对且连通的容腔；
所述在所述气压传感芯片的第一侧设有封装胶的步骤包括：
提供第一UV膜，将所述第一UV膜的粘接面朝上设置；
将所述气压传感芯片的第二侧粘接于所述第一UV膜，使得所述气压传感芯片的第一侧朝上放置；
向所述容腔内填充封装胶；
对所述封装胶进行真空脱泡。
在一实施例中，所述在所述气压传感芯片的第二侧设有封装胶的步骤包括：
提供一壳体，所述壳体呈筒状设置；
将壳体围设所述带有封装胶的气压传感芯片的周侧且固定于所述基板；
对所述气压传感芯片的第二侧以及所述气压传感器芯片与所述壳体之间均填充封装胶。
在一实施例中，所述气压传感芯片包括芯片主体和支撑围挡，所述支撑围挡设于所述芯片主体朝向所述气孔的一侧；
所述将所述气压传感芯片的第一侧朝向所述基板安装，使得所述气压传感芯片的第一侧对应所述基板上的气孔设置的步骤包括：
翻转所述带有封装胶的气压传感芯片，使得所述带有封装胶的气压传感芯片的第一侧朝下放置；
在所述基板上绕着所述气孔周缘进行涂胶，以形成环形胶圈；
将所述支撑围挡与所述环形胶圈粘贴固定。
在一实施例中，提供第一UV膜，将所述第一UV膜的粘接面朝上设置，将所述气压传感芯片的第二侧粘接于所述第一UV膜，使得所述气压传感芯片的第一侧朝上放置；
所述翻转所述带有封装胶的气压传感芯片，使得所述带有封装胶的气压传感芯片的第一侧朝下放置的步骤包括：
提供第二UV膜，将所述第二UV膜对应放置于所述第一UV膜上方，使得所述第二UV膜的粘接面与所述支撑围挡粘接；
调整所述第一UV膜和所述第二UV膜的位置，使得所述第一UV膜位于所述第二UV膜上方；
对所述第一UV膜进行紫外线照射，使得所述第一UV膜与所述支撑围挡分离。
 有益效果
在本申请提供的技术方案中，通过在所述气压传感芯片的第一侧和第二侧设置封装胶，实现了对所述传感器芯片的两侧的保护，使其能够耐环境腐蚀、耐高速冲击，且增强产品的可靠性。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请提供的气压传感组件的一实施例的结构示意图；
图2为图1中气压传感芯片第一侧设置封装胶的结构示意图；
图3为图1中的气压传感芯片粘接于第一UV膜上的结构示意图；
图4为图1中的气压传感芯片的第一侧填充封装胶的结构示意图；
图5为图4中的气压传感芯片的第一侧封装胶成型的结构示意图；
图6为图4中的气压传感芯片的第二侧粘接于第二UV膜上的结构示意图；
图7为本申请提供的气压传感组件封装方法一实施例的流程示意图；
图8为图7中在气压传感芯片的第一侧填充封装胶的流程示意图；
图9为图7中将气压传感芯片的第一侧安装于基板的流程示意图；
图10为图9中的将气压传感芯片进行翻转使得第一侧朝下设置的流程示意图；
图11为图7中在气压传感芯片的第二侧填充封装胶的流程示意图。
附图标号说明：
标号 名称 标号 名称
100 气压传感组件 4 ASIC芯片
1 基板 a 封装胶
11 气孔 b 容腔
2 气压传感芯片 c 环形胶圈
21 芯片主体 d 第一UV膜
22 支撑围挡 e 第二UV膜
3 壳体    
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，若本申请实施例中有涉及方向性指示，则该方向性指示仅用于解释在某一特定姿态下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
气压（差压，表压）传感器目前已广泛应用在医疗、工业等领域，且目前有部分可穿戴产品也开始使用该产品用于健康监测（如测量血压）。为了保证器件在复杂场景下的高可靠性，亟需利用一种封装方法以得到一种够耐环境腐蚀、耐高速冲击的气压传感组件。
本申请提供一种气压传感组件及其封装方法，其中，图1至图2为本申请提供的气压传感组件一实施例的结构示意图，图3至图6为本申请提供的气压传感组件的封装工艺流程图，图7至图11为本申请提供的气压传感组件封装方法一实施例的流程示意图。
请一并参阅图1至图2，所述气压传感组件100包括基板1和气压传感芯片2，所述基板1上贯设有气孔11，所述气压传感芯片2安装于所述基板1且对应所述气孔11设置，所述气压传感芯片2朝向所述气孔11的一侧为第一侧，背离所述气孔11的一侧为第二侧，其中，所述第一侧、以及所述第二侧均设置有封装胶a。
在本申请提供的技术方案中，通过在所述气压传感芯片2的第一侧和所述第二侧设置封装胶a，实现了对所述传感器芯片2的第一侧和第二侧的保护，使其能够耐环境腐蚀、耐高速冲击，且增强产品的可靠性。
具体地，所述基板1上在所述气压传感芯片2处还设置有围设在所述气孔11的外围的壳体3，通过在所述气压传感芯片2与所述壳体3之间的间隙填充有封装胶a，实现了对所述气压传感芯片2的第二侧的封装。
参照图2，所述气压传感芯片2包括芯片主体21和支撑围挡22，所述支撑围挡22设于所述芯片主体21朝向所述气孔11的一侧，且支撑在所述基板1上且围设在所述气孔11的周侧，所述支撑围挡22与所述芯片主体21限定出与所述气孔11相对且连通的容腔b，通过在所述容腔b内填充有所述封装胶a，实现了对所述气压传感芯片2的第一侧的封装。
需要说明的是，在本申请的实施例中，所述封装胶a的材质为硅凝胶，如此设置，利用所述硅凝胶的弹性很好地减小高速冲击的影响，避免气压传感芯片2直接暴露在环境中，避免被环境腐蚀。
所述基板1上还安装有ASIC芯片4，所述ASIC芯片4与所述气压传感芯片2和所述基板1电连接，如此设置，通过所述ASIC芯片4对所述气压传感芯片2发出的电信号进行处理。
需要说明的是，所述ASIC芯片4与所述气压传感芯片2和所述基板1电连接的方式有多种，例如可通过打线的方式或者植锡球的方式将所述气压传感芯片2、所述ASIC芯片4的电信号引入到基板1中。在此需要注意的是，由于引脚朝向的问题，有时需要在所述气压传感芯片2、所述ASIC芯片4中设置金属化通孔，通过该金属化通孔可以改变芯片引脚的朝向，当然，所述ASIC芯片4与所述气压传感芯片2和所述基板1还可以通过导电线实现电连接。本申请对此不作限定。
参照图1和图2，所述基板1上在所述气压传感芯片2处还设置有围设在所述气孔11的外围的壳体3，所述气压传感芯片2与所述壳体3之间的间隙填充有封装胶a，所述基板1上还安装有ASIC芯片4，所述ASIC芯片4设于所述壳体3内且被所述封装胶a包裹，如此设置，同样可以对所述ASIC芯片4进行保护，避免所述ASIC芯片4直接暴露在环境中，提高了所述ASIC芯片4的耐环境腐蚀能力，使得所述气压传感组件100结构紧凑。
本申请还提出一种气压传感组件的封装方法，利用该封装方法以得到一种耐环境腐蚀、耐高速冲击的气压传感组件。图3至图6为本申请提供的气压传感组件的封装工艺流程图，图7至图11为本申请提供的气压传感组件封装方法一实施例的流程示意图。
请参见图7，本申请提供的技术方案中，所述气压传感组件的封装方法包括：
步骤S10、提供气压传感芯片2，所述气压传感芯片2具有第一侧和第二侧，在所述气压传感芯片2的第一侧设有封装胶a；
步骤S20、提供基板1，所述基板1上贯设有气孔11；
步骤S30、将所述气压传感芯片2的第一侧朝向所述基板1安装，使得所述气压传感芯片2的第一侧对应所述基板1上的气孔11设置；
步骤S40、在所述气压传感芯片2的第二侧设有封装胶a。
上述封装方法中，首先在所述气压传感芯片2的第一侧设有封装胶a，实现了对所述气压传感芯片2的第一侧的封装，然后将所述气压传感芯片2的第一侧朝向所述基板1安装，使得所述气压传感芯片2的第一侧对应所述基板1上的气孔11，使得所述气压传感芯片2的第一侧能够通过所述气孔11感受气压，最后在所述气压传感芯片2的第二侧设有封装胶a，从而实现所述气压传感芯片2的第二侧的封装，通过该封装方法实现了所述气压传感芯片2两侧的封装保护，使其能够耐环境腐蚀、耐高速冲击，且增强产品的可靠性。
需要说明的是，所述基板1的材质可以是FR4、BT或陶瓷等，本申请对此不作限定。
具体地，请参见图3至图5及图8，所述气压传感芯片2包括芯片主体21和支撑围挡22，所述支撑围挡22设于所述芯片主体21朝向所述气孔11的一侧，所述支撑围挡22与所述芯片主体21限定出与所述气孔11相对且连通的容腔b，所述在所述气压传感芯片2的第一侧设有封装胶a的步骤包括：
步骤S101、提供第一UV膜d，将所述第一UV膜d的粘接面朝上设置；
步骤S102、将所述气压传感芯片2的第二侧粘接于所述第一UV膜d，使得所述气压传感芯片2的第一侧朝上放置；
步骤S103、向所述容腔b内填充封装胶a；
步骤S104、对所述封装胶a进行真空脱泡。
上述封装方法，通过将所述第一UV膜d的粘接面朝上设置，将所述气压传感芯片2的第二侧粘接于所述第一UV膜d，使得所述气压传感芯片2的第一侧朝上放置，便于向形成于所述气压传感芯片2第一侧的容腔b内填充封装胶a，使得形成的封装胶a面与所述容腔b底部平行，通过对所述封装胶a进行真空脱泡，以去除封装胶a内残留的气泡，提高封装胶a成型质量。
具体地，参照图6及图9，所述气压传感芯片2包括芯片主体21和支撑围挡22，所述支撑围挡22设于所述芯片主体21朝向所述气孔11的一侧，所述将所述气压传感芯片2的第一侧朝向所述基板1安装，使得所述气压传感芯片2的第一侧对应所述基板1上的气孔11设置的步骤包括：
步骤S301、翻转所述带有封装胶a的气压传感芯片2，使得所述带有封装胶a的气压传感芯片2的第一侧朝下放置；
步骤S302、在所述基板1上绕着所述气孔11周缘进行涂胶，以形成环形胶圈c；
步骤S303、将所述支撑围挡22与所述环形胶圈c粘贴固定。
上述封装方法，在所述将所述气压传感芯片2的第一侧设有封装胶a后，翻转所述带有封装胶a的气压传感芯片2，使得所述带有封装胶a的气压传感芯片2的第一侧朝下放置，在所述基板1上绕着所述气孔11周缘进行涂胶形成环形胶圈c，将所述支撑围挡22与所述环形胶圈c粘贴固定，实现了将所述气压传感芯片2安装于所述基板1的操作。
需要说明的是，所述气压传感芯片2通过所述环形胶圈c将所述支撑围挡22与所述基板1实现密封安装，如此提高了所述气压传感芯片2的感应灵敏度，效果好。
进一步地，参照图5、图6及图10，提供第一UV膜d，将所述第一UV膜d的粘接面朝上设置，将所述气压传感芯片2的第二侧粘接于所述第一UV膜d，使得所述气压传感芯片2的第一侧朝上放置，所述翻转所述带有封装胶a的气压传感芯片2，使得所述带有封装胶a的气压传感芯片2的第一侧朝下放置的步骤包括：
步骤S3011、提供第二UV膜e，将所述第二UV膜e对应放置于所述第一UV膜d上方，使得所述第二UV膜e的粘接面与所述支撑围挡22粘接；
步骤S3012、调整所述第一UV膜d和所述第二UV膜e的位置，使得所述第一UV膜d位于所述第二UV膜e上方；
步骤S3013、对所述第一UV膜d进行紫外线照射，使得所述第一UV膜d与所述支撑围挡22分离。
上述封装方法，将所述第二UV膜e对应放置于所述第一UV膜d上方，使得所述第二UV膜e的粘接面与所述支撑围挡22粘接，通过调整所述第一UV膜d和所述第二UV膜e的位置，使得所述第一UV膜d位于所述第二UV膜e上方，此时实现了所述带有封装胶a的气压传感芯片2的翻转，使得所述带有封装胶a的气压传感芯片2的第一侧朝下设置，然后对所述第一UV膜d进行紫外线照射，使得所述第一UV膜d与所述支撑围挡22分离，使得所述带有封装胶a的气压传感芯片2粘接于所述第二UV膜e。
需要说明的是，当需要将粘接于所述第二UV膜e的所述带有封装胶a的气压传感芯片2进行第二侧设有封装胶a，可以对所述第二UV膜e进行紫外线照射，以将所述带有封装胶a的气压传感芯片2与所述第二UV膜e分离，便于所述带有封装胶a的气压传感芯片2的获取。
具体地，参照图11，所述在所述气压传感芯片2的第二侧设有封装胶a的步骤包括：
步骤S401、提供一壳体3，所述壳体3呈筒状设置；
步骤S402、将壳体3围设所述带有封装胶a的气压传感芯片2的周侧且固定于所述基板1；
步骤S403、对所述气压传感芯片2的第二侧以及所述气压传感器芯片与所述壳体3之间均填充封装胶a。
上述封装方法，将壳体3围设所述带有封装胶a的气压传感芯片2的周侧且固定于所述基板1，对所述气压传感芯片2的第二侧以及所述气压传感器芯片与所述壳体3之间均填充封装胶a，从而实现了对所述气压传感器芯片的第二侧的封装，操作简单。
需要说明的是，实现所述壳体3固定于所述基板1的方法有多种，比如，用锡膏或环氧胶将外壳黏贴在基板1上，如此设置，参照简单，且本申请对此不作限定。
以上所述仅为本申请的在一实施例中实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (11)

  1. 一种气压传感组件，其中，所述气压传感组件包括：
    基板，所述基板上贯设有气孔；以及，
    气压传感芯片，安装于所述基板且对应所述气孔设置，所述气压传感芯片朝向所述气孔的一侧为第一侧，背离所述气孔的一侧为第二侧；
    其中，所述第一侧、以及所述第二侧均设置有封装胶。
  2. 根据权利要求1所述的气压传感组件，其中，所述基板上在所述气压传感芯片处还设置有围设在所述气孔的外围的壳体；
    所述气压传感芯片与所述壳体之间的间隙填充有封装胶。
  3. 根据权利要求1所述的气压传感组件，其中，所述气压传感芯片包括：
    芯片主体；
    支撑围挡，设于所述芯片主体朝向所述气孔的一侧，且支撑在所述基板上且围设在所述气孔的周侧，所述支撑围挡与所述芯片主体限定出与所述气孔相对且连通的容腔，所述容腔内填充有所述封装胶。
  4. 根据权利要求1所述的气压传感组件，其中，所述封装胶为硅凝胶。
  5. 根据权利要求1所述的气压传感组件，其中，所述基板上还安装有ASIC芯片，所述ASIC芯片与所述气压传感芯片和所述基板电连接。
  6. 根据权利要求5所述的气压传感组件，其中，所述基板上在所述气压传感芯片处还设置有围设在所述气孔的外围的壳体；
    所述气压传感芯片与所述壳体之间的间隙填充有封装胶；
    所述基板上还安装有ASIC芯片，所述ASIC芯片设于所述壳体内且被所述封装胶包裹。
  7. 一种气压传感组件的封装方法，其中，所述方法包括以下步骤：
    提供气压传感芯片，所述气压传感芯片具有第一侧和第二侧，在所述气压传感芯片的第一侧设有封装胶；
    提供基板，所述基板上贯设有气孔；
    将所述气压传感芯片的第一侧朝向所述基板安装，使得所述气压传感芯片的第一侧对应所述基板上的气孔设置；
    在所述气压传感芯片的第二侧设有封装胶。
  8. 根据权利要求7所述的气压传感组件的封装方法，其中，所述气压传感芯片包括芯片主体和支撑围挡，所述支撑围挡设于所述芯片主体朝向所述气孔的一侧，所述支撑围挡与所述芯片主体限定出与所述气孔相对且连通的容腔；
    所述在所述气压传感芯片的第一侧设有封装胶的步骤包括：
    提供第一UV膜，将所述第一UV膜的粘接面朝上设置；
    将所述气压传感芯片的第二侧粘接于所述第一UV膜，使得所述气压传感芯片的第一侧朝上放置；
    向所述容腔内填充封装胶；
    对所述封装胶进行真空脱泡。
  9. 根据权利要求7所述的气压传感组件的封装方法，其中，所述在所述气压传感芯片的第二侧设有封装胶的步骤包括：
    提供一壳体，所述壳体呈筒状设置；
    将壳体围设所述带有封装胶的气压传感芯片的周侧且固定于所述基板；
    对所述气压传感芯片的第二侧以及所述气压传感器芯片与所述壳体之间均填充封装胶。
  10. 根据权利要求7所述的气压传感组件的封装方法，其中，所述气压传感芯片包括芯片主体和支撑围挡，所述支撑围挡设于所述芯片主体朝向所述气孔的一侧；
    所述将所述气压传感芯片的第一侧朝向所述基板安装，使得所述气压传感芯片的第一侧对应所述基板上的气孔设置的步骤包括：
    翻转所述带有封装胶的气压传感芯片，使得所述带有封装胶的气压传感芯片的第一侧朝下放置；
    在所述基板上绕着所述气孔周缘进行涂胶，以形成环形胶圈；
    将所述支撑围挡与所述环形胶圈粘贴固定。
  11. 根据权利要求10所述的气压传感组件的封装方法，其中，提供第一UV膜，将所述第一UV膜的粘接面朝上设置，将所述气压传感芯片的第二侧粘接于所述第一UV膜，使得所述气压传感芯片的第一侧朝上放置；
    所述翻转所述带有封装胶的气压传感芯片，使得所述带有封装胶的气压传感芯片的第一侧朝下放置的步骤包括：
    提供第二UV膜，将所述第二UV膜对应放置于所述第一UV膜上方，使得所述第二UV膜的粘接面与所述支撑围挡粘接；
    调整所述第一UV膜和所述第二UV膜的位置，使得所述第一UV膜位于所述第二UV膜上方；
    对所述第一UV膜进行紫外线照射，使得所述第一UV膜与所述支撑围挡分离。
PCT/CN2021/124546 2020-11-30 2021-10-19 气压传感组件及其封装方法 WO2022111133A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011385556.9 2020-11-30
CN202011385556.9A CN112490200A (zh) 2020-11-30 2020-11-30 气压传感组件及其封装方法

Publications (1)

Publication Number Publication Date
WO2022111133A1 true WO2022111133A1 (zh) 2022-06-02

Family

ID=74938575

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/124546 WO2022111133A1 (zh) 2020-11-30 2021-10-19 气压传感组件及其封装方法

Country Status (2)

Country Link
CN (1) CN112490200A (zh)
WO (1) WO2022111133A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112490200A (zh) * 2020-11-30 2021-03-12 潍坊歌尔微电子有限公司 气压传感组件及其封装方法
CN113654694B (zh) * 2021-10-20 2022-01-18 山东汉芯科技有限公司 压力传感器芯片封装系统及其封装方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120270354A1 (en) * 2011-04-21 2012-10-25 Freescale Semiconductor, Inc. Methods for fabricating sensor device package using a sealing structure
CN208860520U (zh) * 2018-10-26 2019-05-14 歌尔科技有限公司 一种压差传感器装置
CN209402727U (zh) * 2018-12-20 2019-09-17 歌尔科技有限公司 多功能传感器
CN209400124U (zh) * 2018-12-20 2019-09-17 歌尔科技有限公司 压力传感器芯片及设置有该芯片的多功能传感器
CN110631759A (zh) * 2019-09-29 2019-12-31 苏州敏芯微电子技术股份有限公司 差压传感器封装结构及电子设备
CN112490200A (zh) * 2020-11-30 2021-03-12 潍坊歌尔微电子有限公司 气压传感组件及其封装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005046008B4 (de) * 2005-09-26 2007-05-24 Infineon Technologies Ag Halbleitersensorbauteil mit Sensorchip und Verfahren zur Herstellung desselben
US20160297671A1 (en) * 2015-04-13 2016-10-13 Epcos Ag MEMS Sensor Component
CN110072437B (zh) * 2016-12-13 2022-04-08 阿莫生命科学有限公司 贴片型传感器模块
CN209017322U (zh) * 2018-12-24 2019-06-21 歌尔科技有限公司 芯片的封装结构、麦克风及电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120270354A1 (en) * 2011-04-21 2012-10-25 Freescale Semiconductor, Inc. Methods for fabricating sensor device package using a sealing structure
CN208860520U (zh) * 2018-10-26 2019-05-14 歌尔科技有限公司 一种压差传感器装置
CN209402727U (zh) * 2018-12-20 2019-09-17 歌尔科技有限公司 多功能传感器
CN209400124U (zh) * 2018-12-20 2019-09-17 歌尔科技有限公司 压力传感器芯片及设置有该芯片的多功能传感器
CN110631759A (zh) * 2019-09-29 2019-12-31 苏州敏芯微电子技术股份有限公司 差压传感器封装结构及电子设备
CN112490200A (zh) * 2020-11-30 2021-03-12 潍坊歌尔微电子有限公司 气压传感组件及其封装方法

Also Published As

Publication number Publication date
CN112490200A (zh) 2021-03-12

Similar Documents

Publication Publication Date Title
CN107742630B (zh) 影像感测器封装结构
CN100587430C (zh) 一种基于基板的硅压阻式压力传感器封装结构
TWI327357B (en) Mems microphone package and method thereof
US8104356B2 (en) Pressure sensing device package and manufacturing method thereof
US9986354B2 (en) Pre-mold for a microphone assembly and method of producing the same
US9324586B2 (en) Chip-packaging module for a chip and a method for forming a chip-packaging module
US20030042615A1 (en) Stacked microelectronic devices and methods of fabricating same
US20140210019A1 (en) Low-cost package for integrated mems sensors
CN101620022B (zh) 压力感测元件封装及其制作方法
WO2022111133A1 (zh) 气压传感组件及其封装方法
CN204461670U (zh) 一种压力传感器封装结构
WO2022111132A1 (zh) 传感器封装结构及差压传感器
JP2011191079A (ja) 角速度検出装置
CN111115552A (zh) 一种mems传感器混合集成封装结构及封装方法
CN107036740A (zh) 一种微传感器封装结构及其制作工艺
US10985131B2 (en) Microelectronic device having protected connections and manufacturing process thereof
TW201532205A (zh) 微機電晶片封裝及其製造方法
JP2003163341A (ja) 固体撮像装置
CN101150889B (zh) 微机电麦克风封装结构及其方法
CN111510835B (zh) 固传导mems麦克风的封装结构、制造方法及移动终端
CN116573605A (zh) Mems压力传感器的封装方法及封装结构
TW200527690A (en) Optical semiconductor package and method for manufacturing the same
CN204518073U (zh) 立体声阵列式微机电麦克风封装结构
US9013014B2 (en) Chip package and a method of manufacturing the same
US20200152482A1 (en) Semiconductor device and method for producing the semiconductor device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21896635

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21896635

Country of ref document: EP

Kind code of ref document: A1