WO2022050917A1 - Soldered adapter modulation structure - Google Patents
Soldered adapter modulation structure Download PDFInfo
- Publication number
- WO2022050917A1 WO2022050917A1 PCT/TR2021/050602 TR2021050602W WO2022050917A1 WO 2022050917 A1 WO2022050917 A1 WO 2022050917A1 TR 2021050602 W TR2021050602 W TR 2021050602W WO 2022050917 A1 WO2022050917 A1 WO 2022050917A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sub
- cables
- soldered
- order
- mechanical
- Prior art date
Links
- 238000005476 soldering Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229920006324 polyoxymethylene Polymers 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 239000004809 Teflon Substances 0.000 claims description 2
- 229920006362 Teflon® Polymers 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- -1 polyoxymethylene Polymers 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000009021 linear effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000009022 nonlinear effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/026—Transitions between lines of the same kind and shape, but with different dimensions between coaxial lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/02—Connectors or connections adapted for particular applications for antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
- H01R24/42—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches
- H01R24/44—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising impedance matching means
Definitions
- Invention relates to one-to-one solder adapter passing structure used in communication applications covering GSM2-3G-4G LTE bands.
- the invention particularly relates to an structure connecting two RF cables by soldering method inside same bath at S band without terminating connector and without use of adapter.
- Base station antenna comprises antenna located at various distances onto a reflector, phase shifter and PCB card (divider, diplexer, filter etc.) members.
- Mechanical interconnection housings can be used instead of cables terminated with RF connector for mounting of the antenna members. Number of members used in mechanical interconnection housing connector and/or adapter interconnections is high.
- PIM Passive Intermodulation Distortion/ Passive Intermodulation
- the invention aims to disclose a structure having different technical features providing a new solution.
- Primary aim of the invention is to provide low PIM value inside the system by joining two RF cables by use of soldering method.
- Aim of the invention is to provide higher performance indication of the system by one-to-one soldering and thus improvement in terms of productivity.
- the invention is a mechanic structure wherein at least two cables are connected by soldering method and used in communication applications containing GSM2-3G-4G LTE bands and comprises a sub-base wherein all surfaces are soldered upon passing cables through therein, covering cable screens by forming a structure in form C in convenient depth, a top structure where all center pins of said cables are soldered in order to provide center pin transmission, an intermediate structure between substructure and top structure in order to provide electrical insulation between metal substructure and top structure and PIM insulation therein.
- Figure 1 is view showing soldering of RF cable onto chassis in the related art.
- Figure 2 is view of mechanic structure of the invention
- Figure 3 is a view showing insulating part embodied in a manner to wrap other mechanical structures.
- Subject of the invention in general is a one-to-one soldered mechanic modulation structure used in base station antennas and all mechanical structure comprises a sub-structure (1), top structure (2) and intermediate structure (3) and all located inside an insulating part (4).
- a sub-structure (1) of detail similar to C grasping cable screens and providing meeting of required criteria of conductivity.
- Said C shape structure is designed in a manner to be integrated to entire embodiment.
- sub-structure (1) A space of convenient depth is provided inside sub-structure (1) in order to provide full compatibility of mechanic structure to cable screen of chassis in terms of conductivity
- Said sub-structure (1) is manufactured by means of preferably aluminium compressing casting method.
- Center pins of cables are soldered to top structure (2) by help of metal part such as copper, phospho-bronze etc. having high electrical conductivity and thus center pin transmission is provided.
- cables are passed over the structure with hole (C detail) inside sub-structure (1) and all surfaces of cables can be soldered.
- Intermediate structure (3) is provided to achieve electrical insulation between metal substructure (1) and top structure (2).
- Intermediate structure (3) is made from a material such as good insulating and also high melting temperature such as Teflon etc. Intermediate structure (3) also has positive effects for PIM insulation.
- Insulating part (4) entirely wraps sub-structure (1), top structure (2) and intermediate structure (3) and is the part wherein said structures (1 , 2, 3) are located. Thus contact with other metals inside the antenna is prevented.
- Said insulating part (4) is made from preferably Polyoxymethylene (POM) material. Electrical insulation on RF line is enhanced by means of cavities formed on side walls of the sub-structure (1 ). Thus loss of going in between and reflection losses are recovered. Reflection losses are also recovered by use of different sizes on top structure (2).
- POM Polyoxymethylene
Landscapes
- Details Of Aerials (AREA)
Abstract
The invention particularly relates to a structure connecting two RF cables by soldering method inside same bath at S band without terminating connector and without use of adapter.
Description
Soldered Adapter Modulation Structure
The Field of the Invention
Invention relates to one-to-one solder adapter passing structure used in communication applications covering GSM2-3G-4G LTE bands.
The invention particularly relates to an structure connecting two RF cables by soldering method inside same bath at S band without terminating connector and without use of adapter.
Background of the Invention
Base station antenna comprises antenna located at various distances onto a reflector, phase shifter and PCB card (divider, diplexer, filter etc.) members. Mechanical interconnection housings can be used instead of cables terminated with RF connector for mounting of the antenna members. Number of members used in mechanical interconnection housing connector and/or adapter interconnections is high.
Interactions of mechanical members generally cause non-linear actions (loose cable connections, dirty connectors etc.). Inter-modulation occurring when two or more signals pass through a passive device having non-linear features is called PIM (Passive Intermodulation Distortion/ Passive Intermodulation). PIM particularly may cause interference between mechanical embodiments. This reduces receiver accuracy or completely prevents communication. For that reason, need to provide low PIM value is essential. However, in the present related art, low PIM value can not be provided because of use of connector and/or adapter for RF cables connection.
Following test parameters of antennas used in GSM2-3G-4G LTE bands are the most critical design parameters.
• S parameters (Interference Loss-S21 and Reflection Loss-S11)
• PIM (Passive Intermodulation Distortion)
Particularly, problems experienced during production process negatively affect the criteria required in those two parameters. In the present application of the related art, on the mechanic chassis RF cable is passed through hole on the chassis and soldered to chassis wall. Center pins are also soldered inside chassis. This case causes chassis failure to have earth due to inconvenient soldering and results in reduction in conductivity. This causes low PIM values in measurements and undesired VSWR issues (see Figure 1 ).
During search of the related art application numbered CN209088179U is encountered. The application relates to a cable assembly providing location of radio frequency cable by spiral cavity. Since assembly is made by means of mechanic modulation structures, low PIM value cannot be achieved on the system.
As a result, due to above-described disadvantages and inadequacy of existing solutions it has been necessary to make development in the related art.
Aim of the Invention
Differently from the existing related art, the invention aims to disclose a structure having different technical features providing a new solution.
Primary aim of the invention is to provide low PIM value inside the system by joining two RF cables by use of soldering method.
Aim of the invention is to provide higher performance indication of the system by one-to-one soldering and thus improvement in terms of productivity.
In order to achieve aims described above, the invention is a mechanic structure wherein at least two cables are connected by soldering method and used in communication applications containing GSM2-3G-4G LTE bands and comprises a sub-base wherein all surfaces are soldered upon passing cables through therein, covering cable screens by forming a structure in form C in convenient depth, a top structure where all center pins of said cables are soldered in order to provide center pin transmission, an intermediate structure between substructure and top structure in order to provide electrical insulation between metal substructure and top structure and PIM insulation therein.
The structural and characteristics features of the invention and all advantages will be understood better in detailed descriptions with the figures given below and with reference to the figures, and therefore, the assessment should be made taking into account the said figures and detailed explanations.
Description of Figures
Figure 1 is view showing soldering of RF cable onto chassis in the related art.
Figure 2 is view of mechanic structure of the invention,
Figure 3 is a view showing insulating part embodied in a manner to wrap other mechanical structures.
The drawings are not necessarily to be scaled and the details not necessary for understanding the present invention might have been neglected. In addition, the components
which are equivalent to great extent at least or have equivalent functions at least have been assigned the same number.
Description of Part References
1 . Sub-structure
2. Top structure
3. Intermediate structure
4. Insulating part
Detailed Description of the Invention
In this detailed description, the preferred embodiments of the invention have been described in a manner not forming any restrictive effect and only for purpose of better understanding of the matter.
Subject of the invention in general is a one-to-one soldered mechanic modulation structure used in base station antennas and all mechanical structure comprises a sub-structure (1), top structure (2) and intermediate structure (3) and all located inside an insulating part (4). In order to enable cables to complete RF path, a sub-structure (1) of detail similar to C grasping cable screens and providing meeting of required criteria of conductivity. Said C shape structure is designed in a manner to be integrated to entire embodiment.
A space of convenient depth is provided inside sub-structure (1) in order to provide full compatibility of mechanic structure to cable screen of chassis in terms of conductivity, Said sub-structure (1) is manufactured by means of preferably aluminium compressing casting method. Center pins of cables are soldered to top structure (2) by help of metal part such as copper, phospho-bronze etc. having high electrical conductivity and thus center pin transmission is provided. Thus cables are passed over the structure with hole (C detail) inside sub-structure (1) and all surfaces of cables can be soldered.
Intermediate structure (3) is provided to achieve electrical insulation between metal substructure (1) and top structure (2). Intermediate structure (3) is made from a material such as good insulating and also high melting temperature such as Teflon etc. Intermediate structure (3) also has positive effects for PIM insulation.
Insulating part (4) entirely wraps sub-structure (1), top structure (2) and intermediate structure (3) and is the part wherein said structures (1 , 2, 3) are located. Thus contact with other metals inside the antenna is prevented. Said insulating part (4) is made from preferably Polyoxymethylene (POM) material.
Electrical insulation on RF line is enhanced by means of cavities formed on side walls of the sub-structure (1 ). Thus loss of going in between and reflection losses are recovered. Reflection losses are also recovered by use of different sizes on top structure (2).
Claims
5
CLAIMS A mechanic structure wherein at least two cables are connected by soldering method and used in communication applications containing GSM2-3G-4G LTE bands and characterized by comprising
• a sub-structure (1 ) wherein all surfaces are soldered upon passing cables through therein, covering cable screens by forming a structure in form C in convenient depth,
• a top structure (2) where all center pins of said cables are soldered in order to provide center pin transmission,
• an intermediate structure (3) between the sub-structure (1) and the top structure (2) in order to provide electrical and PIM insulation between metal sub-structure (1) and top structure (2). The mechanical structure according to claim 1 and characterized by comprising an insulating part (4) entirely wrapping sub-structure (1), top structure (2) and intermediate structure (3) and the insulating part wherein said structures (1 , 2, 3) are located. The mechanical structure according to claim 2 and characterized by comprising an insulating part (4) made from polyoxymethylene (POM) material. The mechanical structure according to claim 1 and characterized by comprising an intermediate structure (3) made from a material having high melting temperature such as teflon etc. The mechanical structure according to claim 1 and characterized by comprising a substructure (1) having cavities on side walls in order to enhance electrical conductivity on RF line. The mechanical structure according to claim 1 and characterized by comprising a top structure (2) with different side lengths in order to prevent reflection losses.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TR202013828 | 2020-09-01 | ||
| TR2020/13828 TR202013828Y (en) | 2020-09-01 | Soldered Adapter Transition Configuration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022050917A1 true WO2022050917A1 (en) | 2022-03-10 |
Family
ID=80491371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/TR2021/050602 WO2022050917A1 (en) | 2020-09-01 | 2021-06-15 | Soldered adapter modulation structure |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2022050917A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106887762A (en) * | 2017-03-31 | 2017-06-23 | 贵州航天电子科技有限公司 | A kind of radio frequency co-axial cable subassembly |
| CN110994293A (en) * | 2019-12-19 | 2020-04-10 | 北京无线电计量测试研究所 | Flexible cable assembly |
| WO2020095783A1 (en) * | 2018-11-06 | 2020-05-14 | Ａｇｃ株式会社 | Coaxial connector and substrate equipped with coaxial connector |
-
2021
- 2021-06-15 WO PCT/TR2021/050602 patent/WO2022050917A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106887762A (en) * | 2017-03-31 | 2017-06-23 | 贵州航天电子科技有限公司 | A kind of radio frequency co-axial cable subassembly |
| WO2020095783A1 (en) * | 2018-11-06 | 2020-05-14 | Ａｇｃ株式会社 | Coaxial connector and substrate equipped with coaxial connector |
| CN110994293A (en) * | 2019-12-19 | 2020-04-10 | 北京无线电计量测试研究所 | Flexible cable assembly |
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