WO2021217418A1

WO2021217418A1 - Light-emitting module and ar glasses

Info

Publication number: WO2021217418A1
Application number: PCT/CN2020/087503
Authority: WO
Inventors: 张礼冠; 吴模信; 田舒韵; 田雨洪
Original assignee: 南昌欧菲显示科技有限公司
Priority date: 2020-04-28
Filing date: 2020-04-28
Publication date: 2021-11-04

Abstract

A light-emitting module (13) and AR glasses (10). The light-emitting module (13) comprises a substrate (100), a circuit layer (200), an insulating layer (300), light-emitting elements (400) and an anti-oxidation layer (500). The substrate (100) is used for providing support, the circuit layer (200) is arranged on one side of the substrate (100), connecting pins (210) are arranged on the circuit layer (200), the insulating layer (300) covers the sides of the circuit layer (200) away from the substrate (100), window areas (310) are provided in the positions of the insulating layer (300) corresponding to the connecting pins (210) so that the connecting pins (210) are exposed outside the insulating layer (300), the light-emitting elements (400) are electrically connected to the connecting pins (210), and the anti-oxidation layer (500) at least covers the outside of the connecting pins (210) and the outside of the light-emitting elements (400) in the window areas (310). The connecting pins (210) in the window areas (310) of the light-emitting module (13) can be isolated from outside air without dead angles, preventing the connecting pins (210) exposed out of the insulating layer (300) in the window areas (310) from being oxidized, and thereby guaranteeing the reliability of an electrical connection between the light-emitting elements (400) and the connecting pins (210), ensuring normal light emitting and improving the reliability and accuracy of a camera (11) of the AR glasses (10) in eyeball tracking.

Description

Light-emitting module and AR glasses

Technical field

The present invention relates to the technical field of light-emitting modules, in particular to a light-emitting module and AR glasses.

Background technique

Traditional light-emitting modules generally include a circuit layer, an insulating layer and light-emitting elements. The insulating layer covers the circuit layer to protect the circuits in the circuit layer. The insulating layer is usually provided with a window area so that the window area corresponds to the circuit layer It is exposed outside the insulating layer to form a copper pin for electrical communication with the light-emitting element. However, the copper pins exposed outside the insulating layer are easily oxidized by air, which in turn causes the electrical connection between the copper pins and the light-emitting element to fail.

Summary of the invention

According to various embodiments of the present application, a light emitting module and AR glasses are provided.

The light-emitting module of the present application includes a substrate, a circuit layer, an insulating layer, a light-emitting element, and an anti-oxidation layer. The substrate is used to provide support; the circuit layer is provided on one side of the substrate, and the circuit layer is provided There are connecting pins; the insulating layer covers the side of the circuit layer away from the substrate, and the insulating layer is provided with a window area corresponding to the position of the connecting pins, so that the connecting pins are exposed to the outside of the insulating layer; the light-emitting element and the connecting pins Electrical connection; an anti-oxidation layer covering at least the outside of the connecting pin and the light-emitting element in the window area. In the light-emitting module of the present application, an anti-oxidation layer is provided on the connecting pins of the window area of the light-emitting module and the outside of the light-emitting element, so that the connecting pins of the window area of the light-emitting module can be isolated from the outside air without a dead angle, and the window area is prevented from being exposed to the outside air. The connecting pins of the insulating layer are oxidized.

In one embodiment, the anti-oxidation layer includes a side portion and a top; the side portion covers the side of the connecting leg and the light-emitting element, and the bottom of the side portion extends to abut the substrate for The sides of the window area prevent the connecting pins from being oxidized; the top part covers the surface of the light-emitting element away from the substrate to prevent the connecting pins from being oxidized from above the window area. In this way, by rationally setting the structure of the anti-oxidation layer, the anti-oxidation layer can cover the connecting pins of the window area and the outside of the light-emitting element without dead angles, thereby better preventing the connecting pins of the window area exposed to the insulating layer from being oxidized.

In one embodiment, the anti-oxidation layer covers the entire window area or two or more adjacent window areas. In this way, it is convenient to install the anti-oxidation layer and improve the processing efficiency of the optical module.

In one embodiment, the material of the anti-oxidation layer is a waterproof glue layer. The anti-oxidation layer made of waterproof adhesive layer can make the anti-oxidation layer tightly cover the connecting pins, the solder paste and the sides of the light-emitting element, and the light-emitting surface of the light-emitting element, so that the connecting pins in the window area exposed to the air are isolated from the air Open, the water vapor and oxygen in the air can not enter from the waterproof adhesive layer, to achieve the purpose of preventing the connecting feet from being oxidized.

In an embodiment, the waterproof adhesive layer is sprayed on the connecting pins and the outside of the light emitting element in the window area, and the thickness of the waterproof adhesive layer ranges from 1 μm to 100 μm. The spraying setting method makes it easier to control the thickness of the waterproof adhesive layer, making the thickness of the waterproof adhesive layer more uniform, and can achieve precise spraying according to the specific shapes and positions of the connecting pins, solder paste and light-emitting elements in the window area. In addition, by reasonably setting the thickness range of the waterproof adhesive layer, it is possible to avoid excessively thick light-emitting modules on the basis of convenient processing.

In one embodiment, the anti-oxidation layer is a blanking film. The blanking film can not only isolate the connecting pins in the window area from the outside air, but also has an optical effect, so that the circuit structure in the circuit layer of the light-emitting module is not obvious. In addition, the blanking film also has a visual antireflection function And high penetration, improve the optical effect and visual performance of the light-emitting module.

In one embodiment, the thickness of the blanking film ranges from 10 nm to 100 nm. By reasonably setting the thickness range of the blanking film, it is possible to avoid excessively thick light-emitting modules on the basis of convenient processing.

In one embodiment, the anti-oxidation layer is a hydrophobic film, an anti-fingerprint film or an anti-fouling film. Hydrophobic film, anti-fingerprint film or anti-fouling film, AF film or AS film mainly uses vacuum coating technology to deposit organic fluoride materials on the outer surface of the window area of the light-emitting module, so that the connecting pins in the window area are in phase with the outside air. isolation. In addition, the AF film or the AS film also makes the outer surface of the light-emitting module waterproof, oil-proof, scratch-proof, anti-fingerprint, anti-pollution, and easy to clean.

In one embodiment, the thickness of the hydrophobic film, anti-fingerprint film or anti-fouling film ranges from 1 nm to 100 nm. By reasonably setting the thickness range of the hydrophobic film, the anti-fingerprint film, or the anti-fouling film, it is possible to prevent the light-emitting module from being too thick on the basis of convenient processing.

In one embodiment, the substrate includes a base layer and a hard coating layer, the circuit layer is disposed on the hard coating layer, and the hardness of the hard coating layer is greater than the hardness of the base layer. By providing the hard coat layer, the hardness of the substrate can be increased, so that the substrate can better carry the circuit layer and protect the circuit layer.

In one embodiment, the thickness of the base layer ranges from 20 μm to 200 μm, and the thickness of the hard coat layer ranges from 1 μm to 3 μm. By reasonably setting the thickness range of the base layer and the hard coating layer, it is possible to prevent the light-emitting module from being too thick on the basis of convenient processing.

In one embodiment, the thickness of the insulating layer is greater than the thickness of the circuit layer. Therefore, it can be ensured that the insulating layer covers the surface of the circuit layer to protect the circuit structure in the circuit layer.

In one embodiment, the thickness of the circuit layer is 2 μm, and the thickness of the insulating layer is 3 μm-10 μm. By reasonably setting the thickness range of the circuit layer and the insulating layer, it is possible to prevent the light-emitting module from being too thick on the basis of convenient processing.

This application also proposes an AR glasses, including a camera, an AR lens, and any of the light-emitting modules described above. The light-emitting module is disposed on the inner surface of the AR lens, and the light-emitting surface of the light-emitting element is away from the light-emitting surface. In the AR lens, the light-emitting element is used to emit infrared light, so that the camera can perform eye tracking.

In the AR glasses of the present application, an anti-oxidation layer is provided on the connecting pins of the window area of the light-emitting module and the outside of the light-emitting element, so that the connecting pins of the window area of the light-emitting module can be isolated from the outside air without dead angles, and the window area is prevented from being exposed to the insulation The connecting pins of the layer are oxidized, so as to ensure the reliability of the electrical connection between the light-emitting element and the connecting pins, to ensure that the light-emitting element can emit light normally, and to improve the reliability and accuracy of the camera of the AR glasses for eye tracking.

In one embodiment, the anti-oxidation layer is made of a transparent material, the substrate of the light-emitting module is a transparent substrate, and the side of the substrate away from the circuit layer is pasted on the inner side of the AR lens through a transparent optical glue . Therefore, it is possible to prevent the optical module from blocking the AR lens.

In one embodiment, the surface of the AR lens facing away from the substrate is provided with an optical antireflection coating; or, the surface of the anti-oxidation layer facing away from the substrate is provided with an optical antireflection coating; or, the outer surface of the AR lens is provided with an optical antireflection coating. Both the surface and the surface of the anti-oxidation layer away from the substrate are provided with an optical antireflection film. When both the outer surface of the AR lens and the surface of the anti-oxidation layer facing away from the substrate are provided with an optical antireflection coating, to show the difference, the outer surface of the AR lens is provided with a first optical antireflection coating on the surface facing away from the substrate A second optical antireflection film is provided on the surface of the anti-oxidation layer facing away from the substrate. Therefore, the intensity of light reflected from the outer surface or inner surface of the AR lens can be reduced, and the intensity of light transmitted by the outer surface or inner surface of the AR lens can be increased.

In an embodiment, the area of the light-emitting surface of the light-emitting element ranges from 1*10 ^-8

m

^{2 to} 100*10 ^-8 m ² . By reasonably setting the area range of the light-emitting surface of the light-emitting element, on the basis of convenient processing, it is possible to prevent the light-emitting element from being too large, blocking the AR lens or affecting the external appearance of the AR glasses.

The details of one or more embodiments of the present application are set forth in the following drawings and description. Other features, purposes and advantages of this application will become apparent from the description, drawings and claims.

Description of the drawings

In order to better describe and illustrate the embodiments and/or examples of those inventions disclosed herein, one or more drawings may be referred to. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the currently described embodiments and/or examples, and the best mode of these inventions currently understood.

FIG. 1 is a schematic diagram of the structure of AR glasses provided by an embodiment of the present invention.

2 is a schematic diagram of a structure in which an anti-oxidation layer of a light-emitting module is covered between window regions according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of the structure after the anti-oxidation layer of the light-emitting module is covered on the window area according to an embodiment of the present invention.

FIG. 4 is a schematic structural view of the anti-oxidation layer of the light-emitting module covering two adjacent window areas according to an embodiment of the present invention.

FIG. 5 is a schematic diagram of the structure after the anti-oxidation layer of the light-emitting module is covered on the window area according to another embodiment of the present invention.

FIG. 6 is a schematic diagram of a structure after the anti-oxidation layer of the light-emitting module covers the entire window area according to another embodiment of the present invention.

FIG. 7 is a schematic structural diagram of a light-emitting module provided by another embodiment of the present invention with an anti-oxidation layer covering two adjacent window regions.

FIG. 8 is a schematic diagram of the structure of the insulating layer before opening the window area in the manufacturing process of the light-emitting module according to an embodiment of the present invention.

FIG. 9 is a schematic diagram of a structure after a window area is opened in the insulating layer during the manufacturing process of the light-emitting module according to an embodiment of the present invention.

FIG. 10 is a schematic diagram of the structure after the light-emitting element and the connecting pin are connected in the manufacturing process of the light-emitting module according to an embodiment of the present invention.

FIG. 11 is a schematic diagram of the connection relationship between the light-emitting module and the AR lens provided by an embodiment of the present invention.

Reference signs:

AR glasses 10, camera 11, AR lens 12, light-emitting module 13; transparent optical glue 14, first optical antireflection film 15, second optical antireflection film 16; substrate 100, base layer 110, hard coat layer 120, circuit layer 200, the connecting pin 210, the insulating layer 300, the window area 310, the light-emitting element 400, the anti-oxidation layer 500, the side portion 510, the top portion 520, the solder paste 600, the mask 700, and the light-transmitting hole 710.

Detailed ways

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or a central element may also be present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or an intermediate element may be present at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only, and are not meant to be the only embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terminology used in the specification of the present invention herein is only for the purpose of describing specific embodiments, and is not intended to limit the present invention. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

The present invention provides a light-emitting module 13 and AR glasses 10. As shown in FIG. 1, the AR glasses 10 include a camera 11, an AR lens 12, and a light-emitting module 13. The light-emitting module 13 is disposed on the inner surface of the AR lens 12. The inner surface of the AR lens 12 refers to the side surface close to the user's eyes, and the light-emitting module 13 is used to emit infrared light to the user's eyes, so that the camera 11 can perform eye tracking. In one embodiment, the structure of the light-emitting module 13 of the present invention is shown in FIG. 2 and FIG. The hardness of the circuit layer 200 is used to provide support; the circuit layer 200 is provided on one side of the substrate 100, and the circuit layer 200 is provided with connecting pins 210; the insulating layer 300 covers the side of the circuit layer 200 away from the substrate 100 to protect the circuit layer 200. The insulating layer 300 is provided with a window area 310 at a position corresponding to the connecting pin 210, so that the connecting pin 210 is exposed to the outside of the insulating layer 300. The light-emitting surface of the element 400 is located on the side away from the substrate 100; the anti-oxidation layer 500 is used to cover the connecting pins 210 in the window area 310 and the outside of the light-emitting element 400 to prevent the window area 310 from being exposed to the connecting pins 210 outside the insulating layer 300. The air is oxidized. The structure before the anti-oxidation layer 500 covers the window area 310 is shown in FIG. 2, and the structure after the anti-oxidation layer 500 covers the window area 310 is shown in FIG. 3. In one embodiment, in order to prevent the anti-oxidation layer 500 from adversely affecting the light-emitting effect of the light-emitting element 400, the anti-oxidation layer 500 is made of a transparent material.

As can be seen from Figures 2 and 3, the anti-oxidation layer 500 includes a side portion 510 and a top portion 520. The side portion 510 and the top portion 520 enclose a receiving cavity 530, and the side portion 510 is used from the side of the window area 310 While preventing the connecting pin 210 from being oxidized by the air, the top 520 is used to prevent the connecting pin 210 from being oxidized by the air from above the window area 310. As shown in FIG. 3, the side portion 510 is located between the insulating layer 300 of the window area 310, the connection pin 210, and the solder paste 600, and covers the side of the connection pin 210, the solder paste 600, and the light-emitting element 400, and the side portion The bottom of the 510 abuts the substrate 100, the top 520 covers the light-emitting surface of the light-emitting element 400, and the connecting pins 210, the solder paste 600 and the light-emitting element 400 are all located in the receiving cavity 530. In a specific embodiment, the material light-emitting element 400 is a light-emitting diode, the circuit layer 200 is made of copper material, and the thickness of the circuit layer 200 and the connecting pin 210 are equal. The insulating layer 300 covers the surface of the circuit layer 200, and the thickness of the insulating layer 300 is greater than the thickness of the circuit layer 200. In a specific embodiment, the thickness of the circuit layer 200 and the connecting pin 210 are both 2 μm, and the thickness of the insulating layer 300 is 3 μm-10 μm.

In the embodiment shown in FIG. 3, the anti-oxidation layer 500 may be a waterproof glue layer, which is disposed in the window area 310 of the insulating layer 300 by spraying. The spray setting method makes it easier to control the thickness of the waterproof adhesive layer, making the thickness of the waterproof adhesive layer more uniform, and can achieve precision according to the specific shapes and positions of the connecting pins 210, the solder paste 600 and the light-emitting element 400 in the window area 310 Spraying. As shown in FIG. 3, the spraying method can make the waterproof glue layer closely adhere to the connecting pin 210, the solder paste 600 and the sides of the light-emitting element 400 and the light-emitting surface of the light-emitting element 400, exposing the window area 310 to the air The connecting leg 210 is isolated from the air, and water vapor and oxygen in the air cannot enter from the waterproof adhesive layer, achieving the purpose of preventing the connecting leg 210 from being oxidized. In addition, in one embodiment, in order to facilitate spraying and improve spraying efficiency, as shown in FIG. 4, the anti-oxidation layer 500 formed by the waterproof glue layer can also closely adhere to the outer surface of the entire window area 310 of the light-emitting module 13 or even the opposite. It is adjacent to the outer surface of two or more window regions 310.

In a specific embodiment, the thickness of the anti-oxidation layer 500 formed by the waterproof adhesive layer can be controlled within the range of 1 μm-100 μm by using a spraying process. In a preferred embodiment, the waterproof adhesive layer is a transparent waterproof adhesive layer. Since it is transparent, it will not affect the light emission of the light-emitting element 400. In addition, the transparent waterproof adhesive layer may be waterproof, such as pertex 8106TDS or BTL-523-50. Waterproof adhesive layer with better transparency.

In another embodiment, the anti-oxidation layer 500 may be a blanking film with a smaller thickness, as shown in FIG. 5. The blanking film can not only isolate the connecting pins 210 in the window area 310 from the outside air, but also has an optical effect, so that the circuit structure in the circuit layer 200 of the light-emitting module 13 is not obvious. In addition, the blanking film also has The visual anti-reflection function and high penetration improve the optical effect and visual performance of the light-emitting module 13. In some application scenarios, the light emitting module 13 of the present invention is arranged on the inner surface of the AR lens 12 of the AR glasses 10. Therefore, the use of the optical antireflection and high penetration of the blanking film can make the AR lens 12 anti-reflective and highly transparent. The penetration can be clearer with the AR lens 12.

In a specific embodiment, the thickness of the blanking film ranges from 10 nm to 100 nm. The blanking film includes a niobium pentoxide film disposed on the outer surface of the window region 310 of the light-emitting module 13 and a niobium pentoxide film disposed on the niobium pentoxide film. The silicon dioxide film, the niobium pentoxide film and the silicon dioxide film can be formed on the outer surface of the window area 310 of the light-emitting module 13 by low-temperature magnetron sputtering. The low-temperature magnetron sputtering method can be used to precisely control the pentoxide pentoxide. The thickness of the two niobium film and the silicon dioxide film, and then the thickness of the blanking film is precisely controlled. In addition, it should be noted that the present invention is not limited to the blanking film including the niobium pentoxide film and the silicon dioxide film. In other embodiments, other known or later blanking films can also be used. As long as the technical problems mentioned in the present invention can be solved and the purpose of the invention can be achieved.

In addition, as shown in FIG. 5, the anti-oxidation layer 500 formed by the blanking film closely adheres to the outer surface of the window area 310 of the light-emitting module 13, and because the thickness of the blanking film is small, the outer contour of the blanking film The external contours formed by the connecting pins 210 of the window area 310 of the light-emitting module 13, the solder paste 600 and the light-emitting element 400 are the same. In addition, similar to the embodiment shown in FIG. 3, in FIG. 5, the anti-oxidation layer 500 formed by the blanking film also includes a side portion 510 and a top portion 520. To prevent the connecting pin 210 from being oxidized by the air, the top 520 is used to prevent the connecting pin 210 from being oxidized by the air from above the window area 310. As shown in FIG. 5, the side portion 510 closely covers the connecting pin 210, the solder paste 600 and the sides of the light-emitting element 400, and the bottom of the side portion 510 extends to abut the substrate 100, and the top 520 closely covers the light-emitting element. 400 luminous surface. In one embodiment, in order to facilitate the provision of a blanking film on the outer surface of the window area 310 of the light-emitting module 13, the anti-oxidation layer 500 composed of the blanking film may also cover the entire outer surface of the window area 310 of the light-emitting module 13, such as As shown in FIG. 6; or, covering the outer surface of two or more adjacent window regions 310 of the light-emitting module 13, as shown in FIG. 7.

In another embodiment, the anti-oxidation layer 500 may also be a hydrophobic film, an anti-fingerprint film or an anti-fouling film, wherein the hydrophobic film or the anti-fingerprint film is referred to as AF film, and the anti-fouling film is referred to as AS film. The AF film or AS film mainly deposits the organic fluoride material on the outer surface of the window area 310 of the light-emitting module 13 through a vacuum coating technology, so that the connecting pins 210 in the window area 310 are isolated from the outside air. In addition, the AF film or the AS film also makes the outer surface of the light-emitting module 13 waterproof, oil-proof, scratch-proof, fingerprint-proof, pollution-proof, and easy to clean. In some application scenarios, the light-emitting module 13 of the present invention is arranged on the inner surface of the AR lens 12 of the AR glasses 10. Therefore, the AF film or AS film is used for waterproof, oil-proof, scratch-proof, fingerprint-proof, pollution-proof and easy to clean. Such functions can prevent the AR lens 12 from being contaminated by fingerprints and dirt.

In addition, it should be noted that the thickness of the anti-oxidation layer 500 composed of an AF film or an AS film is also relatively thin, with a thickness ranging from 1 nm to 100 nm, which is similar to the thickness of the anti-oxidation layer 500 composed of a blanking film. Therefore, the structure of the anti-oxidation layer 500 composed of AF film or AS film that closely covers the outer surface of the window region 310 of the light-emitting module 13 can also be as shown in FIGS. 5-7. That is, the anti-oxidation layer 500 composed of an AF film or an AS film is closely attached to the outer surface of the window area 310 of the light-emitting module 13, and because the thickness of the AF film or the AS film is small, the outer contour of the AF film or the AS film The external contours formed by the connecting pins 210 of the window area 310 of the light-emitting module 13, the solder paste 600 and the light-emitting element 400 are the same. In addition, as shown in FIG. 5, the anti-oxidation layer 500 composed of an AF film or an AS film also includes a side portion 510 and a top portion 520. The side portion 510 is used to prevent the connecting pin 210 from being oxidized by the air from the side of the window area 310. , The top 520 is used to prevent the connecting pin 210 from being oxidized by air from above the window area 310. As shown in FIG. 5, in the anti-oxidation layer 500 composed of AF film or AS film, the side portion 510 tightly covers the side of the connecting pin 210, the solder paste 600 and the side of the light-emitting element 400, and the bottom of the side portion 510 extends to In contact with the substrate 100, the top 520 closely covers the light-emitting surface of the light-emitting element 400. In one embodiment, in order to facilitate the provision of an AF film or an AS film on the outer surface of the window area 310 of the light-emitting module 13, the anti-oxidation layer 500 composed of the AF film or the AS film may also cover the entire window area 310 of the light-emitting module 13 The outer surface is shown in FIG. 6; or, it covers the outer surface of two or more adjacent window regions 310 of the light-emitting module 13, as shown in FIG.

In addition, it should be noted that the substrate 100 of the light-emitting module 13 of the present invention does not necessarily have a single-layer structure, but may also have a multi-layer structure. Specifically, in some embodiments, as shown in FIG. 2, the substrate 100 includes a base layer 110 and a hard coat layer 120. The hard coating layer 120 is formed on one side surface of the base layer 110, and the circuit layer 200 is formed on a side surface of the hard coating layer 120 away from the base layer 110. In addition, the hardness of the hard coat layer 120 is greater than the hardness of the base layer 110. The hard coat layer 120 can increase the hardness of the substrate 100 so that the substrate 100 can better carry the circuit layer 200 and protect the circuit layer 200. More specifically, in some embodiments, a polyethylene terephthalate (PET) film is used as the base layer 110, and the hard coat layer 120 is made of an ultraviolet curing resin. Both the PET film and the ultraviolet curable resin are transparent materials, which will not affect the light transmittance of the light emitting module 13. Further, in some embodiments, the ultraviolet curable resin is spin-coated to form a thin film on the base layer 110, and then ultraviolet light is irradiated to cure the ultraviolet curable resin to form the hard coat layer 120. Since both the PET film and the ultraviolet curable resin are insulating materials, the substrate 100 made therefrom will not interfere with the electrical performance of the circuit layer 200. Of course, there are other options for the material and manufacturing process of the substrate 100, as long as the substrate 100 can ensure the carrying effect of the circuit layer 200 and does not affect the electrical performance of the circuit layer 200. In addition, in some embodiments, the thickness of the base layer 110 is between 20 um and 200 um, and the thickness of the hard coating layer 120 is 1 um.

In addition, in one embodiment, the manufacturing process of the light-emitting module 13 is as follows: firstly, a window area 310 is formed at the position of the insulating layer 300 corresponding to the connecting pin 210 so that the connecting pin 210 is exposed outside the insulating layer 300. As shown in FIG. 8, the insulating layer 300 is made of a photoresist material, and after being exposed to ultraviolet light, the solubility in the developing solution will change. In the embodiment shown in FIG. 8, the insulating layer 300 is made of a positive photoresist material, that is, the material of the insulating layer 300 has a certain hardness before exposure, and the part irradiated by ultraviolet light will be softened and not The exposed part is hard and will not be dissolved in the developing solution, and the part irradiated with ultraviolet light is softened, so that it can be dissolved in the developing solution. As shown in FIG. 8, a mask 700 is provided above the insulating layer 300, and a light-transmitting hole 710 is provided on the mask 700 at a position corresponding to the connecting pin 210. The remaining parts are shaded so that external ultraviolet light can pass through The light-transmitting hole 710 irradiates the protective film, so that the insulating layer 300 under the light-transmitting hole 710 is softened, and other positions of the insulating layer 300 do not receive ultraviolet light and still have a certain degree of hardness. Then, the exposed insulating layer 300 is developed, so that a part of the insulating layer 300 corresponding to the connecting pin 210 is dissolved in the developing solution, and the developed structure is shown in FIG. 9. The connecting pin 210 is exposed outside the insulating layer 300 to facilitate electrical connection with the light-emitting element 400. Then, the light-emitting element 400 is soldered on the side of the connecting leg 210 away from the substrate 100 through the solder paste 600, as shown in FIG. 10. Finally, the anti-oxidation layer 500 covers the connecting pins 210 in the window area 310 and the outside of the light emitting element 400 to prevent the connecting pins 210 in the window area 310 from being oxidized, as shown in any one of FIGS. 3-7.

In addition, in one embodiment, the light-emitting module 13 of the present invention is applied to AR glasses 10. As shown in FIG. 1, the AR glasses 10 include a camera 11, an AR lens 12, and a light-emitting module 13. The inner surface of the AR lens 12. The inner surface of the AR lens 12 refers to a side surface close to the user's eyes. The light-emitting module 13 is used to emit infrared light to the user's eyes, so that the camera 11 can perform eye tracking. The connection relationship between the light-emitting module 13 and the AR lens 12 is shown in FIG. 11. The substrate 100 of the light-emitting module 13 is a transparent substrate 100, and the side of the substrate 100 away from the circuit layer 200 is pasted into the AR lens 12 through a transparent optical glue 14. surface. In addition, in order to prevent the optical module from blocking the AR lens 12, the anti-oxidation layer 500 of the optical module is made of a transparent material. In addition, in the embodiment shown in FIG. 11, the outer surface of the AR lens 12 is provided with a first optical antireflection coating 15 (Optical AR Coating, AR film for short) to reduce the intensity of light reflected on the outer surface of the AR lens 12. Thereby, the intensity of the transmitted light on the outer surface of the AR lens 12 is increased, and the image of the optical system is clearer. In addition, in one embodiment, as shown in FIG. 11, a second optical antireflection film 16 may be provided on the surface of the anti-oxidation layer 500 away from the substrate 100 to reduce the intensity of the reflected light from the inner surface of the AR lens 12, thereby increasing The intensity of the transmitted light on the inner surface of the AR lens 12. It is understandable that, in other embodiments, an optical antireflection film may be provided only on the outer surface of the AR lens 12, or only an optical antireflection film may be provided on the surface of the anti-oxidation layer 500 away from the substrate.

In addition, in one embodiment, the surface of the light-emitting element 400 facing away from the substrate 100 is a light-emitting surface, and the area of the light-emitting surface of the light-emitting element 400 ranges from 1*10 ^-8

m

^{2 to} 100*10 ^-8 m ² , specifically, The light emitting surface of the light emitting element 400 is rectangular, the length is 0.4mm-0.6mm, and the width is 0.2mm-0.4mm. More specifically, the light-emitting element has a length of 0.5 mm and a width of 0.3 mm. More than two light-emitting elements 400 are provided on a single AR lens 12, which emit infrared light to the user's eyes from different directions, so that the camera 11 can perform eye tracking more accurately. More specifically, more than six light-emitting elements 400 are provided on a single AR lens 12.

In the light-emitting module 13 and AR glasses 10 of the present invention, an anti-oxidation layer 500 is provided on the connecting pin 210 of the window area 310 of the light-emitting module 13 and the outside of the light-emitting element 400, so that the window area 310 of the light-emitting module 13 can be connected without a dead angle. The pin 210 is isolated from the outside air to prevent the connecting pin 210 of the window area 310 exposed to the insulating layer 300 from being oxidized, thereby ensuring the reliability of the electrical connection between the light-emitting element 400 and the connecting pin 210, ensuring that the light-emitting element 400 can emit light normally, and improving The reliability and accuracy of the camera 11 of the AR glasses 10 during eye tracking.

The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, All should be considered as the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and their description is relatively specific and detailed, but they should not be understood as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims. Although the preferred embodiments of the present invention are described in detail above, it should be understood that many variations and modifications of the basic inventive concept described here that are obvious to those skilled in the art fall within the present invention defined by the appended claims. Within the spirit and scope.

Claims

A light-emitting module, characterized in that it comprises:

Substrate, used to provide support;

The circuit layer is arranged on one side of the substrate, and the circuit layer is provided with connecting pins;

An insulating layer covers the side of the circuit layer away from the substrate, and the insulating layer is provided with a window area corresponding to the position of the connecting pin, so that the connecting pin is exposed to the outside of the insulating layer;

The light-emitting element is electrically connected to the connecting pin; and

The anti-oxidation layer at least covers the connecting pins of the window area and the outside of the light-emitting element.
The light-emitting module according to claim 1, wherein the anti-oxidation layer includes a side portion and a top; the side portion covers the side of the connecting leg and the light-emitting element, and the bottom of the side portion extends To abut with the substrate, it is used to prevent the connecting pins from being oxidized from the side of the window area; the top covering the surface of the light-emitting element away from the substrate is used to prevent the connecting pins from being oxidized from above the window area.
The light-emitting module according to claim 1 or 2, wherein the anti-oxidation layer covers the entire window area or two or more adjacent window areas.
The light emitting module according to claim 1 or 2, wherein the anti-oxidation layer is a waterproof glue layer.
The light-emitting module according to claim 4, wherein the waterproof adhesive layer is sprayed on the connecting pins and the outside of the light-emitting element in the window area, and the thickness of the waterproof adhesive layer ranges from 1 μm to 100 μm. .
The light-emitting module according to any one of claims 1 or 2 or 5, wherein the anti-oxidation layer is a blanking film.
7. The light emitting module of claim 6, wherein the thickness of the blanking film ranges from 10 nm to 100 nm.
The light-emitting module according to any one of claims 1 or 2 or 5 or 7, wherein the anti-oxidation layer is a hydrophobic film, an anti-fingerprint film or an anti-fouling film.
The light-emitting module according to claim 8, wherein the thickness of the hydrophobic film, the anti-fingerprint film or the anti-fouling film is in the range of 1 nm-100 nm.
The light-emitting module according to any one of claims 1 or 2 or 5 or 7 or 9, wherein the substrate comprises a base layer and a hard coating layer, the circuit layer is disposed on the hard coating layer, and The hardness of the hard coating layer is greater than the hardness of the base layer.
The light emitting module of claim 10, wherein the thickness of the base layer is in the range of 20 μm to 200 μm, and the thickness of the hard coating layer is in the range of 1 μm to 3 μm.
The light emitting module according to any one of claims 1 or 2 or 5 or 7 or 9 or 11, wherein the thickness of the insulating layer is greater than the thickness of the circuit layer.
The light-emitting module according to claim 12, wherein the thickness of the circuit layer is 2 μm, and the thickness of the insulating layer is 3 μm-10 μm.
An AR glasses, comprising a camera, an AR lens and the light-emitting module according to any one of claims 1-13, the light-emitting module is arranged on the inner surface of the AR lens, and the light-emitting element The light-emitting surface is away from the AR lens, and the light-emitting element is used to emit infrared light, so that the camera can perform eye tracking.
The AR glasses according to claim 14, wherein the anti-oxidation layer is made of a transparent material, the substrate of the light-emitting module is a transparent substrate, and the side of the substrate away from the circuit layer is glued by transparent optical adhesive. Attached to the inner side of the AR lens.
The AR glasses according to claim 14 or 15, wherein an optical antireflection film is provided on the outer surface of the AR lens facing away from the substrate; or, the surface of the anti-oxidation layer away from the substrate is provided with an optical antireflection film. Film; or, the outer surface of the AR lens and the surface of the anti-oxidation layer facing away from the substrate are provided with an optical antireflection film.
The AR glasses according to claim 14 or 15, wherein the area of the light-emitting surface of the light-emitting element ranges from 1*10-8m2-100*10-8m2.
The AR glasses according to claim 17, wherein the light-emitting surface of the light-emitting element is rectangular, with a length of 0.4mm-0.6mm, and a width of 0.2mm-0.4mm.
The AR glasses according to claim 14, wherein more than two light-emitting elements are provided on a single AR lens, and the light-emitting elements are used to emit infrared light to the user's eyes from different directions.