WO2021040527A1

WO2021040527A1 - Method and devices designed for the cultivation of mushrooms

Info

Publication number: WO2021040527A1
Application number: PCT/NL2020/050536
Authority: WO
Inventors: Johannes Antonius Peter Maria KOOPMANS
Original assignee: Holding J Koopmans BV
Current assignee: Holding J Koopmans BV
Priority date: 2019-08-30
Filing date: 2020-08-31
Publication date: 2021-03-04
Anticipated expiration: 2022-02-28
Also published as: NL2023740B1

Abstract

The present invention relates to a method for growing mushrooms, comprising the stages of a) composing a column-shaped substrate pack (10) with a central shaft, and a post (4) which extends through the shaft, wherein the substrate pack (10) is composed on a holder (1) formed by a carrier element (2) with a bearing surface (3) for the substrate pack (10), and a post (4) which is perpendicularly connected thereto; wherein the holder (1) is passed into a column-shaped mold from below and the mold is then filled from above with substrate which is preferably compacted with an auger (25); wherein, during composition of the substrate pack (10), the holder (1) with the substrate is moved downwards and when leaving the mold, the film is arranged around the substrate pack (10) in the form of a tubular film; b) placing the substrate pack (10) in a cultivation space; and c) allowing a cultivation process to take place; and wherein the method furthermore comprises the following step: measuring and/or controlling, at least during step c), the air flow through the central shaft. The invention furthermore relates to a substrate pack (10) and to a device for composing the substrate pack (10).

Description

METHOD AND DEVICES DESIGNED FOR THE CULTIVATION OF MUSHROOMS

Description

According to a first aspect, the present invention relates to a method for growing mushrooms.

A method for growing mushrooms is known by means of which mushrooms can be grown in a reasonably efficient manner by composing a substrate pack comprising mycelium-enriched substrate on a holder formed by a carrier element with a bearing surface for the substrate pack, and a post which is connected to and extends at an angle to, for example perpendicular to, the bearing surface, and which is preferably upright. The substrate pack remains connected to the holder during the cultivation process.

German patent application DE 24 52 039 A1 describes a method for cultivating mushrooms, wherein a substrate pack is composed, wherein a sleeve composed of two mutually hingeably connected, dimensionally stable tube parts is placed loose on a bottom element with a post which is perpendicular thereto. The sleeve is filled with substrate comprising cut straw containing mycelium. After a cultivating stage, the sleeve is removed and the substrate body, with a diameter of 70 cm, is unsupported. When the sleeve is removed, mushrooms can grow from the substrate. The shaft is provided with holes for aeration, watering, fertilization and temperature increase of the substrate. A pipe with holes may be inserted in the shaft, wherein the holes are either aligned with the holes in the shaft or closed off by rotation or displacement.

The method according to the present invention is based on the production of mushrooms on bags and packs of substrate, by controlling the climate in the substrate. The shaft in the column-shaped substrate pack from DE 24 52 039 ensures an improved air flow through the substrate and a more uniform temperature in the substrate.

An improved form of the method described is known.

It is now an object of present invention to provide an improvement of the above known methods.

According to a first aspect, the present invention provides a method as claimed in claim 1. In such a way, it is possible to compose a substrate pack for mushroom cultivation in an efficient and automatable way, which is suitable for targeted control of the climate conditions in the substrate packer during the various stages of colonization of the mycelium and the growth of mushrooms. By actively intervening in the respective climate conditions, for example by actively influencing the temperature and the relative moisture in the substrate, the respective conditions can be optimized for a good heating up and growth of mycelium and development of fruit bodies, the object of the present invention is achieved. The substrate pack is influenced from the inside, from the core, instead of by means of regulating the climate from the outside. This method is much more effective and energy-efficient, because it is not necessary to control the climate of the entire space in which the substrate pack is situated in order to control the climate in the substrate pack.

In a preferred embodiment according to the present invention, the method comprises arranging a temperature sensor and/or a moisture sensor in or on the substrate pack and, at least during step c), measuring and controlling a flow of fluid through the central hollow shaft. The fluid is usually air, preferably from the spatial environment of the substrate pack. But the fluid may also be a gas or liquid, to which end the post is connected to a gas or liquid supply. To this end, fluid-control means are preferably provided which measure and/or influence the flow of fluid through the central hollow shaft of the substrate pack in a controlled manner. These fluid-control means may be sensors, such as a temperature sensor or a moisture sensor, flow- promoting means, such as a fan, and flow-limiting means, such as a sealing cap for the shaft/Fluid-control means may stimulate or hamper the chimney effect, depending on the situation in which heat is ideally discharged or in which heat is preferably not discharged, respectively. The present invention provides a method for cooling the substrate, but in a certain cultivation stage and/or under certain circumstances, it may be desirable to increase the temperature of the substrate pack. Heating also falls under the term ‘controlling’ the climate in the substrate pack.

The temperature sensors and/or moisture sensors may be situated in the central hollow shaft for an indirect measurement, but a direct measurement of temperature and or moisture via a sensor in the substrate itself is also conceivable. This makes it possible to measure and/or adjust the flow of fluid through the shaft during the cultivation process in a targeted manner in order to optimize the temperature and/or the degree of moisture in the substrate. The optimum flow of fluid may vary throughout the course of the cultivation process. The term “during” in this document should be interpreted broadly, unless the term has been explicitly defined differently, and comprises both “during an entire stage” and “only during a part of a stage”.

To this end, according to a second aspect, the present invention provides a holder as claimed in claim 4, suitable for use in the first aspect of the present invention. It should be noted that the position of the fluid control means in or on the holder partly depends on the function of the respective fluid control means. Thus, various fluid control means may be arranged in the shaft via the holder, in which case the gradient of a relevant parameter (such as for example atmospheric humidity and temperature) in the shaft can be made clearer in order to then influence the flow of fluid through parts of the hollow shaft of the substrate pack in a more specifically controlled way. It is for example conceivable to provide fluid control means, such as for example temperature sensors, at the inflow and outflow openings of the hollow shaft. It should expressly be noted that the terms “post” and “column” seem to suggest a vertical orientation. However, this is only a preferred orientation, but a column does not have to be upright, certainly not during the entire process.

In an alternative or additional embodiment, the invention provides a system configured in order to control, or at least to a significant degree regulate, at least during step c) the climate in the substrate pack by means of measuring and/or influencing the flow of fluid through the hollow shaft in a controlled way. To this end, the system preferably comprises fluid control means configured to cooperate with the holder according to the present invention. Preferably, the fluid control means, for example one or more fans, are in flow communication with the hollow shaft of one or more holders.

As the post has a fixed, preferably vertical, orientation with respect to the carrier element connected thereto and is thus assembled to form a stable holder, the holder with the substrate pack which is being and, at a later point in time, has been, formed, is much more suitable for machine handling during the cultivation process, and thus ultimately also for automation stages than the known bag with separate post. Thus, the holder and the method according to the first and second aspect of the invention, respectively, each and in particular in combination, provides the possibility of improved efficiency compared to the known system, as will be explained below in more detail, thereby achieving the intended object. Preferably, a hollow post is used which is provided with an air- and moisture-impermeable wall. A chimney effect can easily be produced in a hollow post, as a result of which excess heat and any excess moisture can quickly be discharged from the substrate pack. An air- and/or moisture-permeable wall of the holder facilitates transportation of air and/or heat from the substrate pack in the hollow post. However, it has been found that even better results can be achieved using a post with a wall which does not allow air to pass through, but does conduct heat. Heat from the substrate pack is then passed through the wall of the post, resulting in fluid which is present in the hollow post heating up and rising. Moisture which is passed in the direction of the post with the air flow condensates on the outer wall of the post and runs off in a downward direction via the post.

In order for the post to provide satisfactory support to the substrate, it is preferred if the substrate adjoins the post. However, it is also possible for the shaft of the substrate pack to have a larger diameter than the diameter of the post, thus making it easier for air and/or moisture to move upwards or downwards, respectively, along the outer wall of the post. In addition, in case the substrate does not closely adjoin the wall of the post, there is the risk that air which has collected near the post exerts an insulating effect, which may reduce the effect of the invention.

The mushroom production may be optimized further by providing a control unit which controls the flow of fluid through the cavity of the substrate pack. This is preferably done on the basis of the value for the temperature and/or atmospheric humidity which is fed back by the at least one sensor.

The shaft, or at least the post which extends through the shaft, is optionally closable by a closure means and may be closed during the cultivation stage. If the shaft is closed off, for example at the top side, the chimney effect is inhibited. As a result thereof, the substrate pack is cooled and dehumidified to a lesser degree and the temperature in the substrate pack is higher than when the shaft would be fully open. In this stage of the cultivation process, this benefits the development of the fruit bodies. When the underside of the shaft is closed, there is still a slight chimney effect, but to a lesser degree than is the case with a fully open shaft. A closed post may also, for example, be used to fill it with a warm medium, for example water, in order to heat up the substrate.

According to the first aspect of the present invention, a substrate pack for use with the method is preferably composed by, in step a), passing the holder in a column-shaped, such as a cylindrical, mold from below and then filling the mold from above with substrate which is preferably compacted using an auger. In this case, it is possible that the post sinks while composing the substrate pack or that the mold moves upwards while composing the substrate pack. As a result of the predictable orientation of the holder and the use of a mold, the substrate pack can be composed efficiently and so as to have fixed dimensions. Uniformity increases predictability and thus also the controllability of the mushroom production.

During composition of the substrate pack, the substrate pack is moved downwards and when it leaves the mold, a tubular film is preferably arranged around the substrate pack. The tubular film thus holds the substrate together and keeps the substrate pack in shape. It will be clear that the orientation with respect to the fixed surroundings may differ, for example by composing the substrate pack “upside down” by pushing it up from a mold and tilting the substrate pack 180 degrees. Such a method is considered to fall within the scope of protection which is sought.

If auger pressure control means are provided when composing the substrate pack which control the pressure which the auger exerts on the substrate, it is in addition possible to regulate the composition, such as the degree of compaction of the substrate in the substrate pack across the height of the substrate pack, preferably making it uniform. This is not only advantageous with a view to uniform growth of mushrooms, but also for the air flow through the substrate pack. The auger pressure control means which controls the pressure which the auger exerts on the substrate additionally provides the possibility of improving the uniformity of the various substrate packs.

According to a third aspect of the invention, when composing the substrate pack, a distance-measuring device and a weight- or force-measuring device are provided in the method, wherein the distance-measuring device directly or indirectly and continuously or discontinuously measures the current height of the substrate pack when composing the substrate pack and wherein the weight- or force measuring means measure the current weight or the current force, respectively, which acts on the carrier element during composition of the substrate pack and corresponding to the distance-measuring device, and wherein the results of the two measurements are passed back to actuating means of the auger in order to actuate the auger for composing a substrate pack having a substantially uniform density of the substrate across the height of the substrate pack. This uniform density has the advantage that the climate inside the substrate, at least in the height direction of the substrate (parallel to the longitudinal axis) is more constant than with a less uniform distribution. After all, at locations where the density is higher, there is less space for air to flow through and it is assumed that more heat will be generated, at least the temperature will be higher than at locations with a lower density.

According to a fourth aspect, the present invention intends to provide a substrate pack by means of which the process of growing mushrooms can be performed in a more efficient manner. According to the invention, this is achieved by means of a substrate pack composed according to a method of claim 1. The advantages of such a substrate pack correspond to the advantages discussed in relation to the first aspect of the invention.

It is preferred if the vapor-permeable film is made of a perforated plastic, preferably biodegradable plastic. After it has been provided around the substrate, perforations may be cut into the plastic to provide space for the mushrooms growing out of the substrate. The perforated film may serve for exchanging gas, for example air, between the substrate and the environment. Incidentally, the perforations in the plastic are preferably so small that the plastic film acts as a kind of filter, as a result of which competing fungi are kept out of the substrate.

A substrate pack that is composed during the mushroom production according to the present method typically has a height of 2 meters and a diameter of 40 cm. The shaft has a diameter of 10 cm. However, the invention may be used equally well with substrate packs having different dimensions, for example wherein the substrate pack has a height which is between 100 and 250 cm, preferably between 150 and 225 cm, has an outer diameter which is in the range from 25 to 60 cm, preferably between 30 and 50 cm, and the shaft has a diameter which is in the range from 3 to 20 cm, preferably from 5 to 15 cm.

Furthermore, for various reasons, a cylindrical shape is preferred. Such a shape results in a uniform thickness of the substrate pack, measured from the axis or the shaft. But the invention may also be carried out using substrate packs having a different cross-sectional shape, as has already been described above.

According to a fifth aspect, the present invention relates to a composing device for composing a substrate pack, the device comprising a frame, a vertical column-shaped mold which is connected to the frame, an auger, for example in the form of a hollow screw, a holder conveyor configured to convey holders for substrate packs to underneath the mold, a substrate pack conveyor configured to carry away the holder with the substrate pack from underneath the mold after a substrate pack has been composed, wherein the holder conveyor and the mold are arranged in such a way that there is sufficient space between the holder conveyor and the mold to allow the holders to pass, a lift for moving a holder from the holder conveyor in the mold upwards and downwards, and a substrate conveyor for supplying the substrate to a location above the mold and introducing it in the mold. The composing device preferably comprises a control device configured to control the movement of the holder before and after composing and the movement and the weight of the auger. The holder conveyor and the substrate conveyor may be parts of an integral holder-and-substrate conveyor, wherein the holder can, for example, be taken from the conveyor for composing a substrate pack, and can be placed on the same conveyor after composing in order for the holder with substrate to be transported onwards.

Preferably, the composing device comprises a weight- or force measuring device which measures the current weight, respectively the current force which acts on the carrier element while the substrate pack is being composed. The result of the measurement may be used to control the pressure of the auger when composing the substrate pack.

The composing device preferably comprises a distance-measuring device which directly or indirectly and continuously or discontinuously measures the current height of the substrate pack during composition of the substrate pack. The results of the distance-measuring device may also be used for adjusting the composition process, for example the pressure of the auger.

Preferably, the composing device comprises a tubular film device which, in use, creates a tubular film which serves as a covering for a substrate pack which is being composed during composition of the substrate pack. Preferably, the tubular film device comprises or cooperates with a welding device which is described further in this document and is defined in the claims.

The present invention furthermore relates to sealing a flat film to form a tubular film. To this end, a known method uses sealing bars. With the known method, the film is supplied intermittently, that is to say it is supplied over a certain distance. The distance corresponds to the length of a sealing bar. Then, the supply is stopped and flat film is transformed into tubular film by means of the sealing bar. This cycle is repeated. In the packaging industry, welding devices and methods are known for welding a flat film to form a tubular film. An elongate flat film is supplied to a filling device. This takes place in stages, the film in each case being transported over a distance which corresponds to the height of a packaging to be formed, following which the transport is temporarily interrupted, that is to say the supply of film is stopped. In this case, the film is folded prior to being welded to form a tubular film in such a way that the two side edges come into contact with each other, for example overlap each other. The folded film passes two opposite arranged sealing bars, whose length substantially corresponds to the length (height) of packaging to be formed, and the side edges of the film which are in contact with each other are welded to each other by the sealing bars while transportation is paused. Usually, a double transverse weld is also provided across the width of the film at the same time. The bottom transverse weld closes off the tubular film at the top side of a packaging which was filled in an earlier step and the top transverse weld forms the closed underside of a packaging to be filled in a next step. Transportation of the tubular film is then resumed again over a distance which corresponds to the length of a packaging, with the newly formed tube with sides and bottom side which have been welded together being filled with a product to be packed. In the subsequent welding step, the top side of the packaging is sealed by welding.

Such a welding device and method are used to package relatively small amounts of product which is reliably supplied, that is to say evenly metered. The device and method are used to package foods, such as sweets or animal feed, at high speeds. However, the device and method are less suitable for producing relatively long packagings, that is to say packagings in which a longitudinal weld has to be provided along a relatively great distance during production. The expression “the length of a packaging” as used in this document is understood to mean the distance in the longitudinal direction of the film. Relatively long packagings require relatively long sealing bars, in which case the problems in correctly orienting the film between the sealing bars increase more than directly proportional as the length of the sealing bars increases. Also, the method is less suitable if the supply of product to be packaged is not constant, in the sense that the time period between two interruptions in the supply of film and the welding of the film depends on the feed rate of the material to be packaged varies. According to a sixth aspect, the present invention aims to provide a method which is more suitable than the known method for manufacturing relatively long packagings and/or which is particularly suitable for producing a weld, depending on the feed rate of the film, in particular a long uninterrupted weld. As a result whereof a flat film to be welded passes the welding element at varying speed. According to the present invention, this object is achieved by means of a method in which it is possible for a welding element to substantially continuously is in contact with the film to be welded and in which the welding the element welds the film together when the film passes the welding element. As a result thereof, an uninterrupted weld can be provided along a great distance. Preferably, a speed sensor is provided for detecting the conveying speed in order to adjust to the varying speed. This may be done directly or indirectly and therefore the speed sensor does not have to be fixedly connected to the welding device. Furthermore, means are provided which are suitable to vary the heat supply to the welding element in dependence of the detected conveying speed of the film. In this way, in use, the temperature is adapted to the time period during which the film is in contact with the welding element when passing the welding element in order to provide a reliable weld. It is conceivable that a higher temperature is required in case the contact period of the film with the welding element is shortened and vice versa. The temperature is thus set on the basis of decelerations and accelerations in the conveying speed of the film.

It will be clear that it is also possible to supply two flat films instead of one flat film, the two flat films being welded to each other on either side by means of welding elements. It is also possible to weld three or more flat films made of the same material or of different materials to each other.

In a preferred embodiment according to the invention, the film is supplied at varying speed, with the feed rate of the film being measured and the heating, and thus the temperature, of the welding element being controlled in dependence of the feed rate. In this way, the welding speed can be made to depend on a previous or later step in a process.

The welding element is preferably a hot controlled roller over which the film to be welded runs. A mating running surface is then provided, in which case the film moves between the hot roller and the mating running surface.

Optionally, the supply of the film is interrupted to apply a transverse weld, which may be applied by means of a transverse bar which is oriented perpendicular to the longitudinal direction of the film. Alternatively, it is possible for the supply of the film not to be interrupted and to move the transverse sealing bar concomitantly with the film at the current feed rate of the film when applying the transverse weld.

According to a seventh aspect, the present invention relates to a welding device for welding films together which are in contact with each other.

International patent application WO 2012/055414 A1 discloses a welding device in which a roller with a cylindrical surface rotates about an axis. Means press the contacting part of two layers of material to be welded together against the surface of the roller. Conveying means convey the material to be welded past the roller at a constant speed. On the circumference of the roller, a welding surface is provided which is heated locally to a temperature close to the melting temperature of the material to be welded. The transfer of heat to the welding surface can quickly be interrupted and the welding surface can be cooled down, so that the welding surface can remain in contact with the material to be welded when the conveying operation is interrupted. This prevents material which remains in contact with the welding surface during the interruption of the conveying operation, i.e. stationary, from melting.

According to the seventh aspect, it is an object of the present invention to provide a welding device which is more suitable than the known welding device to produce relatively long packagings from flat film in which the supply speed of the film to be welded varies or at least may vary. According to the present invention, this object is achieved by a welding device for welding parts of flat film which are in contact with each other, for example overlap each other, and which comprises the following:

- a welding roller provided with a welding element on the running surface which is provided with a welding element over at least substantially the entire circumference of the welding roller,

- a mating running surface which is situated opposite the running surface of the welding roller,

- control means for controlling the heating of the welding element,

- a supply device which, in use, supplies an elongate flat film to the welding device, wherein two side edges of the film are conveyed while they are in contact with each other and between the running surface of the welding roller and the mating running surface,

- a speed sensor suitable for measuring the feed rate of the film, and - drive means which drive the welding roller in dependence of the feed rate of the film.

The welding device is configured to adjust the temperature of the welding element on the basis of the results from the speed sensor in order to weld together two parts of flat film which are in contact with each other and pass between the running surface and the mating running surface.

The advantages of such a welding device have already been mentioned above. By measuring the feed rate of the flat film, the temperature of the welding element can be adjusted to the current feed rate. It is preferable if the device comprises cooling means, or at least a supply device for cooling means, configured to cool down the welding element, preferably quickly, if desired.

In case of a relatively quick to abrupt deceleration of the conveying speed, the cooling means may be used to quickly lower the temperature of the welding element, if desired also of the running surface, in order to prevent melt-through of the film in such situations. Sometimes, a cooling element does not cool down sufficiently quickly of its own accord when heating of the welding element is interrupted. In this way, it is also possible to prevent the film from not welding together reliably, or not at all, at a high feed rate.

In a preferred embodiment of the invention, the welding device comprises cooling means which are controllable by the control device and with which the welding element can actively be cooled. The cooling means make it possible to cool down the welding element quickly when there is a quick drop in the feed rate and thus to prevent melt-through of the film.

A simple embodiment therefor provides for the cooling means to comprise fluid ducts which extend through the welding roller towards the running surface and through which a cooling fluid can be passed to the running surface. If, in addition, ducts are provided for discharging cooling fluid which has been used for cooling down the welding element, a quick circulation of cooling fluid in the welding roller is possible. In dependence of the feed rate of the film and the temperature of the welding element, coolant can be passed to the cooling element. Insulating means may be provided in a supply duct for cooling fluid in order to prevent heat exchange with (the supply duct in) the welding roller while cooling fluid is being supplied. This improves the controllability of the cooling process. Preferably, the welding element comprises a welding wire which is wound around the running surface of the welding roller, the welding wire preferably having two ends which are connected to a voltage supply. In this way, it is possible to heat a welding wire in a simple manner, for example by means of sliding contacts.

If a sensor suitable for measuring the feed rate of the film is provided or is communicatively connected to the control means, the temperature of the welding element can be adjusted or readjusted in dependence of a by the respective feed rate sensor output. The feed rate of the film may be measured directly, but also indirectly, for example through the speed of the welding roller which is driven by the passing film.

It is preferred if the welding device is provided with, or is communicatively connected to, a sensor suitable for measuring the current temperature of the cooling element. A temperature recorded by the temperature sensor can be passed on to the control means and be used by the control means for adjusting or readjusting the temperature of the welding element. If desired, the result of a measurement performed by the temperature sensor may be readjusted to adjust the feed rate of the film, and optionally a supply of material to be introduced into the packaging to be composed. For example, if, for certain reasons, the temperature of the welding element is not sufficiently high, the respective speed may be reduced in order to prevent producing bad welds.

In order to prevent the risk of unintended sticking of the film to the welding roller and/or the mating running surface, it is preferred if anti-stick material is provided on the running surface and the mating running surface, respectively.

The device is preferably suitable for use in a packaging machine by means of which packagings are made from a flat film and the packagings are filled during their manufacture with a product which can be poured or introduced in a partly formed packaging. With known devices, a partly formed packaging has a front panel, a rear panel, a welded bottom, a folded side edge and a completely sealed side edge (or two folded side edges and a completely sealed seam on the rear panel or alternatively two sealed side edges). In the present invention, the weld seam can be produced during filling of the packaging.

The device is furthermore preferably suitable for use with the method and/or the system for growing mushrooms as described above.

The invention will be explained by means of the attached drawing, in which: Fig. 1 shows a perspective view of a holder according to the present invention;

Fig. 2 shows a perspective view of a substrate pack according to the present invention;

Fig. 3 shows a perspective view of a system for composing a substrate pack according to the present invention; and

Fig. 4 shows a welding roller of a welding device according to the present invention.

Fig. 1 shows a holder 1 according to the present invention, wherein the holder 1 comprises a carrier element 2 with a bearing surface 3 for carrying a substrate pack (not shown), and a post 4 which is connected to and extends at right angles to the bearing surface 3. In this exemplary embodiment, the post 4 is configured as a hollow post. The carrier element 2 is designed so that the bearing surface 3 and thus a bottom end of the hollow post 4 is situated at some distance A from a surface on which the holder 1 will be or is placed. This distance A is chosen in such a way that drawing in air (illustrated in Fig. 1 by arrows P1) as a cooling medium or fluid by means of the intermediate space 6 created by the carrier element 2 towards the bottom end of the hollow post 4 is made possible. The air drawn in by the hollow post 4 is then passed through the hollow post 4 (and therefore post 4) and leaves the holder via the top end 8 of the hollow post 4.

Although not shown in Fig. 1 , the post 4 may be provided with openings, for example in the wall of the hollow post 4, to be able to better regulate the temperature and moisture of the substrate pack to be carried by the holder 1 (not shown in Fig. 1). However, a closed wall is preferred. The temperature and moisture of the substrate pack to be carried by the holder 1 are regulated in any case by means of the fluid control means according to the present invention. Such a fluid control means, for example air-control means, is preferably in the form of a cover 9 shown near the upper end of the hollow post 4. Near the underside of the post 4, a plug 7 is shown by means of which the bottom side of the hollow post 4 can be closed off. Cover 9 is provided in order to be able to close off or open up the top end 8 of the hollow post 4 in order to thus inhibit or promote the sucking action of air. A temperature sensor 12 and a moisture sensor 13 are shown diagrammatically at the upper end 8 of the hollow post which, in use, measure the temperature and the moisture content, respectively, of the flow of fluid which passes the sensors 12, 13. The cover 9 has a shape, the central part 9b of which corresponds to the shape of the upper end 8 of the hollow post 4, about which central part 9b a flange 9a extends. In use, the central part 9b closes off the hollow inside of the hollow post 4, whereas the flange 9a closes off any clearance between the hollow post 4 and the shaft 5 formed by the inner wall of the substrate material (not shown in Fig. 1). If the cover 9 has been fitted on a substrate pack, the cover 9 blocks, or at least impedes, an air flow through the shaft, both through the hollow post 4 and through a possible space between the substrate and the post 4.

Fig. 2 illustrates a substrate pack 10 according to the present invention. The holder 1 from Fig. 1 can partly be recognized herein, with the hollow post 4 (and thus also the central shaft, that is to say the central hollow space in the substrate material 11 through which the hollow post 4 extends) being completely surrounded or delimited, respectively, by substrate material 11. In this exemplary embodiment, the substrate material 11 closely adjoins the hollow post 4, as a result of which the creation of an air flow between the shaft 5 and the hollow post 4 is prevented as much as possible. In Fig. 2, the substrate material 11 has the shape of a cylinder, but other embodiments are also conceivable. The substrate material is covered in gas- permeable film (not shown).

When using a substrate pack, that is to say during colonizing of the mycelium and during growth of mushrooms, heat is generated in the substrate material 11 , leading to a rise in temperature in the substrate material 11. This results in air in the shaft 5 of the substrate material 11 , that is to say in the hollow post 4 and/or between the substrate material 11 and the post 4 heats up with respect to the air in the environment due to heat being extracted from the substrate material 11. When using air as a fluid, as is the case in this exemplary embodiment, the hotter air rises and the air pressure in the shaft 5 drops. As a result thereof, air situated under the shaft 5 is drawn into the shaft 5 and the drawn-in air will also heat up in the shaft.

The draft which is generated in this way and which is indicated here by arrows P1 , P2 can be stimulated or inhibited in an artificial manner by means of air control means, which may comprise the passive temperature sensor 12 and/or the moisture sensor 13. Temperature and/or moisture sensors may alternatively or additionally be incorporated at defined positions in the substrate material 11. In such a case, the temperature and the moisture in the substrate material 11 can be measured directly instead of indirectly on the basis of an air flow through the hollow post 4. Measuring the temperature and moisture content, sending the information to a remote control device and actuating active air control means, such as for example a fan, is well-known as such and will not be described in detail in this document.

The measurement results of the temperature sensors 12 and moisture sensors 13 can be sent to a control device (not shown) and be processed there. On the basis of the measurement results, measures may be taken, optionally by the control device, to influence the flow of fluid through the shaft 5. This may be effected by means of active air control means, such as a fan (not shown) which blows air into the shaft or draws air from the shaft just above the shaft or a stop, such as cover 9, at the top side or plug 7 at the bottom side of the hollow post 5 which inhibits or even blocks such an air flow.

Fig. 3 shows a system 20 for composing a substrate pack 10 according to the present invention. The system 20 as illustrated in Fig. 3 has already formed a substrate pack 10 which has been placed on a holder conveyor 21 , such as rails.

The system 20 comprises a device 22 for composing a substrate pack 10 comprising a frame 23, a vertical column-shaped hollow mold 24 which is connected to the frame 23 and is shown partly in cut-away view in Fig. 3 for a clear explanation. In Fig. 3, the mold 24 is attached to the frame 23 in a fixed position. It is also conceivable to also allow the mold 24 to be attached to the frame 23 so as to be movable to and fro (preferably in a vertical direction).

The device 22 furthermore comprises an auger 25 in the form of a hollow screw which is situated in the mold 24. The substrate material 11 is supplied via the cavity and is pressed down by the bottom side 25a of the screw when the screw rotates. It should be noted that the mold 24 is placed in such a manner that the holder conveyor 21 is configured to convey holders 1 for substrate packs 10 until they are underneath the mold 24 and carry the substrate pack 10 away from underneath the mold 24 after a substrate pack 10 has been composed.

The device 22 from Fig. 3 furthermore comprises a lift 26 for moving a holder 1 up and down along the frame 23 from the holder conveyor 21 in the mold 24. In addition, the device 22 is furthermore provided with a substrate conveyor 27 for supplying substrate material 11 to be formed into a substrate pack to a funnel 28 above the mold 24 and pouring it in the mold 24.

A weighing sensor 38 is provided on the lift 26 on which the substrate pack bears and measures the weight of the substrate pack which forms during filling. In addition, a composite distance sensor 29a, 29b is provided by means of which the position of the bearing surface 3 of a holder 1 at 29b with respect to a reference position at 29a is determined. This distance increases during composition of a substrate pack. On the basis of the measurement results of, on the one hand, the distance measured by the measuring sensor and, on the other hand, the weight measured by the weighing sensor, it is possible to deduce if a homogenous filling, or compaction, of the substrate pack is maintained during the composition of a substrate pack.

A welding device 30 is attached to the frame 23 and is described in more detail below with reference to Fig. 4. A roll 42 of plastic film is placed on two cylinders 41 a, 41 b which are optionally driven in rotation. The film serves to surround a substrate pack 10 which has been composed by the device, so that the substrate pack 10a is held together.

Below, the operation of the system 20 will be explained. When the device 22 has deposited a composed substrate pack 10 on the holder conveyor 21 , it is carried away to a processing space for further heating up and growth of mycelium and mushrooms, respectively. Subsequently, the holder conveyor 21 takes an empty holder 1 to the lift 26 which holder 1 is raised by the lift 26 until the bearing surface 3 of the carrier element 2 comes into contact with, or at least comes close to the bottom end of the mold 24. In this case, by means of carrying brackets which carry the holders 1 during vertical displacement of the holders 1 , the lift 26 may pass the rails of the holder conveyor via vertical slots (not shown) which are provided in the holder conveyor 21 to this end and keep a path free for the carrying brackets. Although the mold is shown in cut-away form here, the wall of the mold 24 is continuous on all sides. Thereafter, substrate material is supplied via substrate conveyor 27 and poured into the funnel 39. Through the conveying section of the helical auger 25, the substrate material drops from the funnel onto the bearing surface 3 of the holder 1. By rotationally driving the helical auger 25 with gear transmission 39, the bottom side 25a of the auger pushes down onto the substrate material. At the same time, the lift 26 is moved downwards. The weight of the substrate material gathered on the bearing surface and the pressure of the auger is detected by the weighing sensor. The position of the bearing surface 3 of the holder 1 The control device (not shown) is programmed to control the movement of the lift 26 on the basis of the data from the distance sensors 29a, 29b and the weighing sensor 38, for the purpose of achieving a density of the substrate 11 in the substrate pack 10 which is being composed which is as uniform as possible.

Moving the lift downwards also causes a tubular film to be fitted around the substrate pack 10. Moving the flat film and the lift 26 down is synchronized by the control device. In this way, the film is pulled down at the end, past the welding device 30, to beyond the bottom end of the mold 24 and, in use, to beyond the bearing surface 3 of the holder 1 , so that no substrate 11 , or as little as possible, can leak out on the bottom side during and after the composition of the substrate pack. Alternatively, the flat film is attracted by the running surface 33 (see Fig. 4) by means of friction and unrolled from the roll of flat film 42. The film unrolls from the roll of flat film 42 and is passed to the mold 24 in order to wind itself around the mold 24. Two sides of the flat film are made to overlap with each other (alternatively their end sides can be brought into contact with each other) and moved past the welding device 30. The welding device 30 welds the sides of the flat film together, thus forming a tubular film which is arranged around the substrate pack where the substrate pack which is being formed leaves the mold 24 together with the holder 1. Subsequently, the substrate pack 10 is placed on the holder conveyor and the above stages are repeated with the next holder 1.

Fig. 4 shows a part of the welding device 30 for use with the present invention and shows a welding roller 31 with a welding element 32 which is wound around the running surface 33 of the welding roller 31. Carbon brushes 34 are provided for the power supply of the welding element 32. In addition to the welding element 32, two insulating zones 35 are provided on the running surface which insulate the welding element 32 from the rest of the running surface 33. Still further outwards, cooling holes 36 are provided on either side across the running surface 33, which connected, via a cooling duct 37 via a hollow axle 43, to an integrated cooling medium reservoir 40 which is provided with an air supply 41. The wiring required for the control unit also runs through the hollow axle 43.

The welding roller 31 is driven in rotation by means of a gear transmission 42 which is connected to a control device, as will be described below, and wherein a gear wheel 42a which is driven via a drive motor 44 transfers a rotating movement onto the hollow axle 43 via a gear wheel 42b which is connected to the hollow axle 43. The hollow axle 43 is mounted in two bearing blocks 44. Collars 45 are provided on one of the bearing blocks 44 to ensure good positioning of the welding roller 31.

In use, two or more film layers are passed between the running surface

33 of the welding roller 31 and a mating running surface (not shown here). The mating running surface may be designed in different ways. The main concern is that it provides counterpressure to the welding roller 31 during sealing and that no heat, or only a small amount, is dissipated by the mating running surface during welding. To this end, a static plastic surface is provided on the outside of the mold 24 in this exemplary embodiment. This may be compact so as to prevent the mating running surface from forming an obstruction for the tube to be formed from the film. The passing film is heated to a desired temperature by the welding element 32, at which the overlapping film layers melt together. This method is known per se. By means of the welding device according to the present invention, the temperature of the welding element 32, or at least of heat which is transferred to the film, can be influenced quickly. On the one hand by (quickly) heating up the welding element 32 by means of the carbon brushes

34 and wiring. On the other hand by passing cooling medium from the reservoir 40, via the hollow axle 43 and the duct 37, to the cooling holes 36 for quick cooling. A sensor (not shown) measures the speed at which the film to be welded passes the welding roller 31. The welding roller 31 is driven by means of the control device (not shown), so that the running surface 33, and thus also the welding element 32, has at least substantially the same speed as the passing film. When the speed of the film and the welding element 32 increases, the temperature of the welding element 32 is increased (if desired). If, however, the feed rate of the film to be welded decreases, possibly to a standstill, then the temperature of the welding element 32 is lowered (if desired) and the film is cooled down if necessary by the cooling medium in order to prevent melt-through of the film. In this way, the welding element 32 is able both to heat up quickly and cool down quickly, as a result of which the speed of the film can be varied to a much greater extent than has been the case with welding devices for film which have been known hitherto.

The person skilled in the art of film-welding can determine the desired temperature on the basis of the film material to be welded and the speed of the film, that is to say a temperature (range) at which the passing overlapping film layers are melted together, but at which the film does not suffer melt-through. A device as described in this document may also be used for other purposes than for welding of tubular film for compost columns. In fact, it offers producers, for example in the packaging industry, the possibility to look at the packaging process from a different point of view. Until now, if a supply of product to be packaged was originally irregular, measures had to be taken in the supply line to make the supply more regular. Such measures may lead to a loss in packaging capacity or to undesired buffers in the packaging line. Such measures are not necessary with the welding device according to the present invention.

Only a few embodiments of the present invention have been described in the figures and the description. However, many variants and modifications which may or may not be obvious at this point in time are conceivable without departing from the scope of protection of the present invention which is only limited by the attached claims.

Claims

1. A method for growing mushrooms, comprising the following stages: a) composing a substrate pack comprising an amount of mycelium- enriched substrate and a covering of vapor-permeable film which delimits the substrate, wherein the substrate pack substantially has the shape of a column, such as a cylinder, with a central shaft and a post which extends through the shaft; wherein the substrate pack is composed on a holder formed by a carrier element with a bearing surface for the substrate pack, and the post which is connected to and extends at right angles to the bearing surface; wherein the holder is passed into a column-shaped mold from below and the mold is then filled from above with substrate which is preferably compacted with an auger; wherein, during composition of the substrate pack, the holder with the substrate is moved downwards and when leaving the mold, the film is arranged around the substrate pack in the form of a tubular film; b) placing the substrate pack with the post in a cultivation space; and c) allowing a process of colonizing of the mycelium and causing mushrooms to grow through the vapor-permeable film on the outer circumference of the substrate pack and harvesting mushrooms during this process, wherein the substrate conditions prevailing in the substrate pack are actively influenced.

2. The method as claimed in claim 1 , comprising the step of arranging a temperature sensor and/or a moisture sensor in or on the substrate pack and, at least during step c), measuring and controlling the flow of fluid through the central shaft on the basis of the measured value for the temperature and/or relative atmospheric humidity.

3. The method as claimed in claim 1 or 2, wherein, in step a), a flat film is formed into the tubular film.

4. A holder evidently intended for use with a substrate pack with the method according to one of the preceding claims, wherein the holder is formed by a carrier element with a bearing surface for a substrate pack, and a post made of heat- conducting material, preferably metal, which is connected to and extends at right angles to the bearing surface, and wherein the post comprises a hollow post, characterized in that the holder is provided with fluid-measuring and -control means, configured to measure and actively influence the substrate conditions prevailing in the substrate pack.

5. The holder as claimed in claim 4, wherein the post is provided with an air- and moisture impermeable wall.

6. The holder as claimed in claim 4 or 5, wherein the hollow post is closable and is or will be closed during the cultivation stage.

7. A substrate pack, comprising an amount of mycelium-enriched substrate and a covering of vapor-permeable tubular film which delimits the substrate, wherein the substrate pack substantially has the shape of a column with a central shaft, and a post which extends through the shaft, wherein the substrate is carried by a carrier element of a holder formed by the carrier element with a bearing surface for the substrate pack, and wherein the carrier is connected to and extends at right angles to the bearing surface.

8. The substrate pack as claimed in claim 7, made by means of a method according to step a) from claim 1.

9. The substrate pack as claimed in claim 7 or 8, wherein the vapor- permeable film is made of perforated plastic.

10. The substrate pack as claimed in one or more of claims 7-9, wherein the holder is closely surrounded by the substrate.

11. The substrate pack as claimed in one of claims 7-10, wherein the substrate pack has a height of between 100 and 250 cm, preferably between 150 and 225 cm, has an outer diameter which is in the range from 25 to 60 cm, preferably between 30 and 50 cm, and the shaft has a diameter which is in the range from 3 to 20 cm, preferably from 5 to 15 cm.

12. A composing device for composing a substrate pack as claimed in one of claims 7-11 for a method as claimed in one of claims 1-3, the device comprising:

- a frame,

- a vertical column-shaped mold which is connected to the frame,

- an auger,

- a holder conveyor configured to convey holders for substrate packs to underneath the mold,

- a substrate pack conveyor configured to carry away the holder with the substrate pack from underneath the mold after a substrate pack has been composed, - wherein the holder conveyor and the mold are arranged in such a way that there is sufficient space between the first conveyor and the mold to allow the holders to pass,

- a lift for moving a holder from the holder conveyor in the mold upwards and downwards, and

- a substrate conveyor for supplying the substrate to a location above the mold and introducing it in the mold.

13. The device as claimed in claim 12, comprising a weight- or force measuring device which measures the current weight or the current force, respectively, which acts on the carrier element during composition of the substrate pack.

14. The device as claimed in claim 12 or 13, comprising a distance measuring device which directly or indirectly and continuously or discontinuously measures the current height of the substrate pack during composition of the substrate pack.

15. The device as claimed in one or more of claims 12 to 14, comprising a tubular film-device which, in use, creates a tubular film which serves as a covering for a substrate pack which is being composed during composition of the substrate pack.

16. A welding device for welding parts of flat film which are in contact with each other, and which comprises the following:

- a welding roller provided with a welding element on the running surface, wherein the welding element extends over at least substantially the entire circumference of the welding roller,

- control means for controlling the heating of the welding element,

- a supply device which, in use, supplies an elongate flat film to the welding device, wherein two side edges of the film are made to be in contact with each other, for example so as to overlap, between the running surface of the welding roller and the mating running surface,

- a speed sensor suitable for measuring the feed rate of the film, and

- drive means which drive the welding roller in dependence of the feed rate of the film, wherein the welding device is configured to adjust the temperature of the welding element on the basis of the results from the speed sensor in order to weld together two parts of flat film which are in contact with each other and pass between the running surface and the mating running surface.

17. The welding device as claimed in claim 16, comprising cooling means which are controllable by the control device and with which the welding element can actively be cooled.

18. The welding device as claimed in claim 17, wherein the cooling means comprise fluid ducts which extend through the welding roller towards the running surface and through which a cooling fluid can be passed to the running surface,

- wherein a temperature sensor suitable for measuring the current temperature of the welding element on the running surface is provided on or near the welding device.