WO2020244525A1

WO2020244525A1 - Electronic device housing and electronic device

Info

Publication number: WO2020244525A1
Application number: PCT/CN2020/094044
Authority: WO
Inventors: 卢国建; 乔爱国; 赖奕佳
Original assignee: 芯海科技（深圳）股份有限公司
Priority date: 2019-06-06
Filing date: 2020-06-03
Publication date: 2020-12-10
Also published as: CN210324142U

Abstract

Provided is an electronic device housing, comprising a housing body (20), and also comprising a sensor (10) coated on the surface of the housing body (20); the sensor (10) comprises a force-sensitive sensing layer (11), the force-sensitive sensing layer (11) comprising a force-sensitive resistor (lll) and a conductive pattern (ll2), the conductive pattern (112) being electrically connected to the force-sensitive resistor (111) and a measurement chip. By means of coating the sensor (10) on the surface of a housing body (20), the sensor (10) comprising a force-sensitive sensing layer (11), the force-sensitive sensing layer (11) comprising a force-sensitive resistor (lll) and a conductive pattern (ll2), and the conductive pattern (112) being electrically connected to the force-sensitive resistor (111) and a measurement chip, the combination of the sensor (10) and the electronic device is caused to be more stable and have a larger contact area, and be highly reliable.

Description

Electronic equipment casing and electronic equipment

Technical field

The invention belongs to the field of sensing, and particularly relates to an electronic device casing and an electronic device.

Background technique

At present, pressure sensors are beginning to be widely applied to various electronic devices, such as mobile phones and smart watches.

Generally, there are two types of pressure sensors according to the preparation process, one is MEMS (Micro-Electro Mechanical System (Micro-Electro-Mechanical System) sensor, MEMS sensor, due to the use of microelectronics and micro-mechanical processing technology, the contact area with the pressure contact surface is relatively small, resulting in relatively small deformation of the MEMS sensor. Therefore, the MEMS sensor and electronic equipment need to be assembled with silica gel Fix it, otherwise the signal will be too weak and affect the detection due to the small contact surface between the sensor and the mobile phone. The other is to make the force sensitive resistor on the FPC or PCB board. For example, when the force-sensitive resistor is made on the FPC or PCB board, it is necessary to manually glue the FPC or PCB board and the mobile phone with 3M glue during assembly. There is a position shift during the bonding process, and the corners cannot be bonded. Problems, resulting in low production yield. It can be seen that the above two sensor processing processes are relatively cumbersome and both have certain reliability problems.

technical problem

In order to solve the above-mentioned problems, the present invention provides an electronic device casing and an electronic device containing the electronic device casing. The electronic device casing coats the sensor on the surface of the casing body, so that the combination of the sensor and the electronic device is more stable and The contact area is larger and the reliability is high.

Technical solutions

An electronic equipment housing, the electronic equipment housing includes a housing body, the electronic equipment housing further includes a sensor coated on the surface of the housing body, the sensor includes a force-sensitive sensing layer, the The force sensitive sensing layer includes a force sensitive resistor and a conductive pattern, and the conductive pattern is electrically connected with the force sensitive resistor and the measuring chip.

The present invention directly coats the sensor on the housing body of the electronic device housing instead of fixing it with external silica gel or 3M glue, so the combination of the sensor and the electronic device is more stable and the contact area is larger, thereby improving the reliability of the sensor . The force-sensitive sensing layer of the sensor is composed of a force-sensitive resistor and a conductive pattern, with a simple structure and strong practicability.

Further, the conductive pattern includes a metal circuit pattern and a capacitor plate pattern. Both the metal circuit pattern and the capacitor plate pattern are electrically connected to the measurement chip, and the metal circuit pattern is also electrically connected to the force sensitive resistor.

Further, the conductive pattern is a metal circuit pattern, and the metal circuit pattern is electrically connected to the measurement chip.

Further, the conductive pattern is a capacitive plate pattern, and the capacitive plate pattern is electrically connected to the measuring chip; the sensor further includes a first insulating layer and a circuit layer sequentially coated on one side of the force-sensitive sensing layer A via hole is opened on the first insulating layer, the circuit layer is connected to the force sensitive resistor through the via hole, and the circuit layer is also electrically connected to the measurement chip.

Further, the sensor further includes a second insulating layer, and the second insulating layer is coated on a side of the force-sensitive sensing layer away from the housing body.

Further, the sensor further includes a metal shielding layer and a third insulating layer, the third insulating layer and the metal shielding layer are sequentially coated on one side of the force-sensitive sensing layer, and the metal shielding layer is grounded .

Further, the sensor is arranged on the inner surface or the outer surface of the housing.

Further, the housing includes a frame, and the sensor is arranged on the inner surface or the outer surface of the frame.

The present invention also provides an electronic device. The electronic device includes an internal processing circuit. The electronic device also includes an electronic device housing. The internal processing circuit is placed in a cavity enclosed by the electronic device housing. The coated sensor is electrically connected with the internal processing circuit.

Further, the electronic device is a mobile terminal, wearable device, automotive electronic device, household appliance, earphone or electronic scale.

Beneficial effect

The electronic device housing provided by the present invention, by coating the sensor on the surface of the housing body, the sensor includes a force sensitive sensing layer, the force sensitive sensing layer includes a force sensitive resistor and a conductive pattern, the conductive pattern and the force sensitive resistor and The electrical connection of the measurement chip. Since the sensor is directly coated on the housing body of the electronic device housing without being fixed by external silicone or 3M glue, the combination of the sensor and the electronic device is more stable and the contact area is larger, which can improve the reliability of the sensor. The force-sensitive sensing layer of the sensor is composed of a force-sensitive resistor and a conductive pattern, with a simple structure and strong practicability.

Description of the drawings

FIG. 1 is a schematic structural diagram of an electronic device housing provided by an embodiment of the present invention.

Fig. 2a is a schematic structural diagram of an electronic device housing provided by another embodiment of the present invention.

Figure 2b is a schematic structural diagram of an electronic device housing provided by another embodiment of the present invention.

Fig. 3a is a schematic structural diagram of an electronic device housing provided by another embodiment of the present invention.

Fig. 3b is a schematic structural diagram of an electronic device housing provided by another embodiment of the present invention.

Fig. 3c is a schematic structural diagram of an electronic device housing provided by another embodiment of the present invention.

Figure 3d is a schematic structural diagram of an electronic device housing provided by another embodiment of the present invention.

Fig. 3e is a schematic structural diagram of an electronic device housing provided by another embodiment of the present invention.

Fig. 3f is a schematic structural diagram of an electronic device housing provided by another embodiment of the present invention.

Embodiments of the invention

In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

In one embodiment, an electronic device housing is provided. As shown in Figure 1, the electronic device housing includes a housing body 20 and a sensor 10 coated on the surface of the housing body. The sensor 10 includes a force-sensitive sensing layer 11 that includes a force-sensitive The resistor 111 and the conductive pattern 112 are electrically connected to the force sensitive resistor 111 and the measuring chip (not shown).

In the present invention, the force-sensitive sensing layer 11 includes a force-sensitive resistor 111 and a conductive pattern 112 connecting the force-sensitive resistor 111 and the measuring chip. Wherein, the number of force sensitive resistors 111 can be one or more. The force sensitive resistor 111 can be prepared by coating a force sensitive material on the surface of the housing body. When the user applies pressure on the surface of the housing of the electronic device, the resistance value of the force sensitive resistor 111 changes due to the deformation. The measuring chip is connected to the force sensitive resistor 111 through the conductive pattern 112, so that the resistance change of the force sensitive resistor 111 can be detected, and the pressure value on the surface of the electronic device casing can be obtained.

Optionally, the measuring chip is an internal measuring chip, that is, the measuring chip is arranged on the housing body. Alternatively, the measurement chip is an external measurement chip, that is, the measurement chip is arranged outside the casing body, for example, in the internal processing circuit of the electronic device contained in the electronic device casing.

Alternatively, the housing body may be made of insulating material or conductive material. If the housing body is made of insulating material, the sensor 10 can be directly coated on the surface of the housing body. If the housing body is made of conductive material, there is at least one insulating layer between the sensor 10 and the housing body.

In one embodiment, the conductive pattern 112 includes a metal circuit pattern (not shown) and a capacitor plate pattern (not shown). Both the metal circuit pattern and the capacitor plate pattern are electrically connected to the measuring chip, and the metal circuit pattern is also connected to the measuring chip. The force sensitive resistor 111 is electrically connected. Among them, the metal circuit pattern is used as a wiring to connect the force-sensitive resistor to the measurement chip, and the capacitive plate pattern is used as a plate of the capacitor. When the user touches the housing of the electronic device, the capacitive plate pattern forms a coupling with the user's finger Capacitance, so as to realize capacitive touch sensing and detect the position of the user's touch.

In one embodiment, the conductive pattern 112 is a metal circuit pattern, and the metal circuit pattern is electrically connected to the measurement chip. The metal circuit pattern connects the force sensitive resistor with the measuring chip.

In an embodiment, when the conductive pattern 112 is a metal circuit pattern, the sensor 10 further includes a capacitor plate layer and a fourth insulating layer. The capacitor plate layer is made of conductive material, such as metal or indium tin oxide. The fourth insulating layer and the capacitor plate layer are sequentially arranged on one side of the force sensitive sensing layer. For example, it is arranged between the force-sensitive sensing layer and the casing body, or arranged on a side of the force-sensitive sensing layer away from the casing body. When the user touches the housing of the electronic device, a coupling capacitor is formed between the capacitor plate layer and the user's finger, thereby realizing capacitive touch sensing and detecting the position touched by the user.

In one embodiment, the conductive pattern 112 is a capacitor plate pattern, and the capacitor plate pattern is electrically connected to the measurement chip. At this time, as shown in FIGS. 2a and 2b, the sensor further includes a first insulating layer 12 and a circuit layer 13 which are sequentially coated on one side of the force-sensitive sensing layer, and the first insulating layer is provided with A hole (not shown in the figure), the circuit layer is connected to the force sensitive resistor through the via hole, and the circuit layer is also electrically connected to the measurement chip. The circuit layer capacitor plate is connected with the measuring chip.

Wherein, as shown in FIG. 2a, the first insulating layer 12 and the circuit layer 13 may be disposed on a side of the force-sensitive sensing layer 11 away from the housing body 20. Alternatively, as shown in FIG. 2b, the first insulating layer 12 and the circuit layer 13 may be disposed on a side surface of the force-sensitive sensing layer 11 close to the housing body 20.

When the conductive pattern 112 is a capacitive plate pattern, when the user uses the electronic device housing and touches the electronic device housing, a coupling capacitor is formed between the capacitive plate layer and the user's finger, thereby realizing capacitive touch sensing and detecting the position touched by the user. The sensor in the electronic device is a hybrid sensor that combines a pressure sensor and a capacitive sensor. The hybrid sensor combines a pressure sensor and a capacitance sensor, and simultaneously realizes pressure detection and capacitance sensing detection, and has high reliability and strong practicability.

In an embodiment, the sensor 10 further includes a second insulating layer 14, and the second insulating layer 14 is coated on a side of the force-sensitive sensing layer 11 away from the housing body 20. Or, when the sensor 10 includes a first insulating layer 12 and a circuit layer 13, and the first insulating layer 12 and the circuit layer 13 are sequentially arranged on a side of the force-sensitive sensing layer 11 away from the housing body 20, the second insulating layer 14 is coated on a side of the circuit layer 13 away from the first insulating layer 12. In this way, when the sensor 10 is coated on the inner surface of the electronic device housing, the second insulating layer 14 can isolate the sensor 10 from the processing circuit inside the electronic device housing to prevent short circuits. When the sensor 10 is coated on the outer surface of the electronic device housing, the second insulating layer 14 can isolate the sensor 10 from contact with the human body to prevent short circuit when the user touches it. In addition, when the conductive pattern is a capacitive plate pattern, or when the conductive pattern includes a capacitive plate pattern, or when the sensor 10 further includes a capacitive plate layer, the second insulating layer 14 can be used as a gap between the user's finger and the capacitive plate. The insulating medium between the user's finger and the capacitor plate forms a coupling capacitor, thereby achieving capacitive touch sensing.

In an embodiment, as shown in FIGS. 3a to 3f, the sensor 10 further includes a metal shielding layer 15 and a third insulating layer 14, and the metal shielding layer 15 is grounded. Wherein, as shown in FIGS. 3a to 3d, the third insulating layer 14 and the metal shielding layer 15 are sequentially coated on one side of the force-sensitive sensing layer 11, or, as shown in FIG. 3e or FIG. 3f , The third insulating layer 14 and the metal shielding layer 15 are sequentially coated on one side of the circuit layer 13 away from the first insulating layer 12. Among them, the metal shielding layer can be connected to a preset ground terminal to achieve grounding. For example, the metal shielding layer can be connected to the ground terminal in the measurement chip. The metal shielding layer eliminates the accumulated electrostatic charge to achieve the shielding effect of anti-static interference.

In a specific application, the pressure sensor may include one or more force-sensitive resistors 111, and these force-sensitive resistors 111 are spread across the coated surface by coating. For example, the pressure sensor may include a single force-sensitive resistor, and the two ends of the force-sensitive resistor are connected to the measuring chip through a conductive pattern; another example, the pressure sensor may include two force-sensitive resistors 111, which are connected in series to form Wheatstone half-bridge, the connecting wire of the two force-sensitive resistors leads to the output terminal of the Wheatstone half-bridge and connects to the measurement chip; another example, the pressure sensor may include four force-sensitive resistors that constitute the Wheatstone full bridge, The two output ends of the Wheatstone full bridge are connected to the measurement chip.

In one embodiment, one or more sensors may be coated on the housing of the electronic device. The one or more sensors can be coated on the inner surface or the outer surface of the electronic device housing. Alternatively, the housing body includes a frame, and the one or more sensors are coated on the inner surface and the outer surface of the frame. The inner surface refers to one or more surfaces facing the internal processing circuit of the electronic device. The outer surface refers to one or more surfaces facing away from the internal processing circuit of the electronic device.

In one embodiment, the electronic device is a mobile terminal, wearable device, automotive electronic device, household appliance, headset, or electronic scale. Among them, mobile terminals include but are not limited to: mobile phones, notebook computers, tablet computers, electronic paper book readers, handheld computers, POS machines, etc. Wearable devices include but are not limited to electronic bracelets, electronic watches, smart clothing, etc. Car electronic equipment includes but is not limited to car navigation equipment, car audio entertainment equipment, car instrument display equipment, etc. Household appliances include but are not limited to refrigerators, rice cookers, washing machines, air conditioners, smart toilets, etc. Electronic scales include but are not limited to kitchen scales, weight scales, body fat scales, etc.

The preferred embodiments of the present invention are listed above, which are not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. .

Industrial applicability

In the electronic device housing provided in the present invention, the sensor is coated on the surface of the housing body. The sensor includes a force sensitive sensing layer. The force sensitive sensing layer includes a force sensitive resistor and a conductive pattern. The conductive pattern and the force sensitive resistor And the measurement chip is electrically connected. Since the sensor is directly coated on the housing body of the electronic device housing without being fixed by external silica gel or 3M glue, the combination of the sensor and the electronic device is more stable, the contact area is larger, and the reliability is high. Therefore, it has industrial applicability.

Claims

An electronic device housing includes a housing body and a sensor coated on the surface of the housing body. The sensor includes a force-sensitive sensing layer that includes a force-sensitive resistor and a conductive pattern , The conductive pattern is electrically connected with the force sensitive resistor and the measuring chip.
The electronic device housing according to claim 1, wherein the conductive pattern comprises a metal circuit pattern and a capacitor plate pattern, and both the metal circuit pattern and the capacitor plate pattern are electrically connected to the measurement chip, so The metal circuit pattern is also electrically connected to the force sensitive resistor.
4. The electronic device housing of claim 1, wherein the conductive pattern is a metal circuit pattern, and the metal circuit pattern is electrically connected to the measurement chip.
The electronic device housing according to claim 1, wherein the conductive pattern is a capacitive plate pattern, and the capacitive plate pattern is electrically connected to the measurement chip; the sensor further includes a A first insulating layer and a circuit layer on one side of the force-sensitive sensing layer, the first insulating layer is provided with a via hole, the circuit layer is connected to the force-sensitive resistor through the via hole, and the circuit layer is also It is electrically connected with the measuring chip.
The electronic device housing according to any one of claims 1 to 4, wherein the sensor further comprises a second insulating layer, and the second insulating layer is coated on the force-sensitive sensing layer away from the housing One side of the body.
The electronic device housing according to any one of claims 1 to 4, wherein the sensor further comprises a metal shielding layer and a third insulating layer, and the third insulating layer and the metal shielding layer are sequentially coated On one side of the force-sensitive sensing layer, the metal shielding layer is grounded.
The electronic device housing according to any one of claims 1 to 6, wherein the sensor is provided on an inner surface or an outer surface of the housing.
7. The electronic device housing of any one of claims 1 to 6, wherein the housing includes a frame, and the sensor is disposed on an inner surface or an outer surface of the frame.
An electronic device, the electronic device includes an internal processing circuit, the electronic device further includes the electronic device housing according to any one of claims 1-8, the internal processing circuit is placed in the electronic device In the cavity formed by the enclosure, the sensor coated on the electronic device housing is electrically connected to the internal processing circuit.
The electronic device according to claim 9, wherein the electronic device is a mobile terminal, a wearable device, an automobile electronic device, a household appliance, a headset, or an electronic scale.