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WO2020238212A1 - 一种散热装置及处理器 - Google Patents

一种散热装置及处理器 Download PDF

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Publication number
WO2020238212A1
WO2020238212A1 PCT/CN2019/130742 CN2019130742W WO2020238212A1 WO 2020238212 A1 WO2020238212 A1 WO 2020238212A1 CN 2019130742 W CN2019130742 W CN 2019130742W WO 2020238212 A1 WO2020238212 A1 WO 2020238212A1
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WO
WIPO (PCT)
Prior art keywords
condenser
tank
heat dissipation
liquid medium
veneer
Prior art date
Application number
PCT/CN2019/130742
Other languages
English (en)
French (fr)
Inventor
贾晖
李霁阳
王超
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP19931052.5A priority Critical patent/EP3968744A4/en
Publication of WO2020238212A1 publication Critical patent/WO2020238212A1/zh
Priority to US17/538,881 priority patent/US20220087050A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Definitions

  • This application relates to the field of communication technology, and in particular to a heat dissipation device and a processor.
  • Liquid cooling technology provides a new solution for the heat dissipation of electronic devices with high heat flux due to its efficient heat dissipation efficiency, and has been applied in data centers, servers and other fields.
  • the more commonly used method in the prior art is to use immersion liquid cooling technology.
  • the immersion liquid cooling is a form of liquid cooling technology.
  • the equipment is immersed in liquid, and the heat of the equipment is transferred to the liquid through direct contact with the liquid. go.
  • all veneers 2 are immersed in the same tank 1.
  • the tank 1 is filled with a working fluid with a low boiling point and easy to phase change. After the plate 2 heats up, it absorbs the heat and becomes a gas, and automatically rises under the action of buoyancy. After encountering the condenser 3 on the top of the tank 1 (above the liquid level), it condenses into a liquid under the action of cooling and then drops again by gravity Return to tank 1 to form a heat dissipation cycle.
  • a two-phase working fluid with a low boiling point is used, but this medium is too volatile, and requires a relatively high sealing design of the tank 1, which is difficult to implement in an actual working environment.
  • the present application provides a heat dissipation device and a processor, which are used to improve the heat dissipation effect of the heat dissipation device on a single board.
  • a heat dissipation device is provided.
  • the heat dissipation device is used to dissipate heat from a veneer.
  • the heat dissipation device specifically includes an immersion tank containing a liquid medium.
  • the veneer is radiated.
  • the heat dissipation device further includes a condenser immersed in the liquid medium, and the liquid medium is dissipated through the provided condenser. After the veneer heats up, the heat heat heats the liquid medium near the veneer.
  • the density of the liquid medium decreases and floats upward after being heated. After the hot liquid medium contacts the condenser, the heat is transferred to the condenser. After the temperature of the liquid medium decreases, the density increases again. Sink, then sink to the bottom of the tank. In this way, using the relationship between the density and temperature of the liquid medium, a "natural convection" cycle will be formed, which will continuously transfer the heat of the veneer to the condenser in the immersion tank through the liquid medium in the immersion tank as a medium. After that, the condenser takes the heat away and dissipates the heat through the refrigeration device connected with it and used for heat exchange to the condenser.
  • the heat is directly taken away by the reflow of the liquid medium due to the temperature, which reduces the sealing requirements for the heat dissipation device and at the same time ensures the heat dissipation effect of the veneer.
  • the immersion tank When the immersion tank is specifically set, the immersion tank includes two parts, one part is a tank body for containing liquid medium, and the other part is a cover body connected with the tank body.
  • the cover When the cover is specifically set up, a separate structure from the tank can be used, or a rotating connection between the cover and the tank can be used.
  • the connection through the pipeline in the specific connection, includes the liquid inlet pipe and the liquid outlet pipe that penetrate the tank body, wherein the liquid inlet pipe and the condenser
  • the liquid inlet is connected, the liquid outlet pipe is communicated with the liquid outlet of the condenser, and the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the refrigeration device.
  • the liquid in the condenser and the refrigerating device flows back through the liquid inlet pipe and the liquid outlet pipe to perform heat dissipation.
  • the number of condensers can be set according to needs, either one condenser in one immersion tank or multiple condensers in one immersion tank can be used.
  • the number of condensers is two or more, and the liquid inlets of the two or more condensers are connected in parallel on the liquid inlet pipe, and the two Or the liquid outlets of more than two condensers are connected in parallel on the liquid outlet pipe.
  • one condenser can be used to correspond to one single plate, or one condenser can be used to correspond to two or more single plates, and the layout can be made according to actual heat dissipation requirements during specific settings.
  • the tank is provided with a groove for fixing the veneer. Thereby it is convenient to fix the veneer.
  • the number can be one or two or more than two.
  • each condenser corresponding to the embodiment of the present application is located above the corresponding tank, and each condenser corresponds to at least one Tank.
  • each condenser is rotatably connected with the tank body, and when the condenser is rotated to the first set position, the condenser avoids the The opening of the tank.
  • the position of the condenser can be changed.
  • the condenser can be rotated to avoid the notch to facilitate the insertion of the veneer.
  • the immersion tank includes a tank body and a cover connected to the immersion tank; and each condenser is fixedly connected to the cover of the immersion tank.
  • each condenser is fixedly connected to the cover of the immersion tank.
  • the refrigeration device is an outdoor dry cooler/cooling tower, or an indoor chiller.
  • the refrigeration device can also be an air-cooled heat dissipation module or a natural heat dissipation module.
  • the condenser may also be an immersion tank, and the refrigerator is an external water source.
  • the immersion tank is immersed in the water source, such as immersed in a river, lake, or other external water source.
  • a processor in a second aspect, includes the heat dissipation device described in any one of the above and a single board inserted in the heat dissipation device. After the veneer heats up, the heat heats the liquid medium near the veneer. The density of the liquid medium decreases and floats upward after being heated. After the hot liquid medium contacts the condenser, the heat is transferred to the condenser. After the temperature of the liquid medium decreases, the density increases again. Sink, then sink to the bottom of the tank.
  • Fig. 1 is a schematic structural diagram of a immersion liquid-cooled heat sink in the prior art
  • Figure 2 is a schematic structural diagram of an immersion tank provided by an embodiment of the application.
  • Figure 3 is a schematic diagram of the immersion tank provided by an embodiment of the application when it is opened;
  • FIG. 4 is a corresponding schematic diagram of a condenser and a veneer provided by an embodiment of the application;
  • FIG. 5 is a corresponding schematic diagram of a condenser and a veneer provided by an embodiment of the application
  • Fig. 6 is a schematic diagram of parallel connection of condensers provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of parallel connection of condensers provided by an embodiment of the application.
  • Fig. 8 is a schematic diagram of cooperation between a refrigeration device and a condenser provided by an embodiment of the application;
  • FIG. 9 is a schematic diagram of cooperation between a refrigeration device and a condenser provided by an embodiment of the application.
  • FIG. 10 is a schematic diagram of cooperation between a refrigeration device and a condenser provided by an embodiment of the application;
  • FIG. 11 is a schematic structural diagram of another heat dissipation device provided by an embodiment of the application.
  • the heat dissipation device is used for heat dissipation of the single board 30.
  • the single board 30 in the processor will produce A large amount of heat, in order to ensure the normal operation of the single board 30, the single board 30 needs to be dissipated. Therefore, an embodiment of the present application provides a heat sink for dissipating the single board 30.
  • FIG. 1 shows a structure of a heat dissipation device provided by an embodiment of the present application.
  • the heat dissipation device provided in the embodiment of the present application includes an immersion tank 10, and the immersion tank 10 is used to carry a liquid medium and a veneer 30.
  • the immersion tank 10 includes two parts, one part is a tank body 12 for containing liquid medium and a veneer 30, and the other part is a cover body 11 connected with the tank body 12.
  • the tank body 12 When the tank body 12 is specifically arranged, the tank body 12 has a cylindrical structure, such as a rectangular parallelepiped, circular, elliptical, or other shape.
  • an opening is provided on the tank body 12, and the liquid medium and the veneer 30 can be put into the tank body 12 through the opening.
  • the liquid medium can be selected from different media, such as water, oil or other liquid media.
  • the veneer 30 When carrying the veneer 30, the veneer 30 is placed in the tank 12 and immersed in the liquid medium. In order to make the veneer 30 maintain a stable posture in the liquid medium.
  • the tank 12 is provided with a tank for fixing the veneer 30.
  • the tank 12 When the veneer 30 is put into the tank 12, the tank 12 is directly inserted into the tank for fixing, and the veneer 30 is clamped and fixed by the side wall of the tank.
  • a buckle can be provided in the groove, and the veneer 30 can be fixed by the buckle.
  • the buckle When the buckle is used, the buckle can be arranged on the side wall of the groove body, and the single board 30 is fixed in the groove by the engagement between the buckle and the single board 30. Since the buckle is a relatively common engaging structure, its specific structure and specific engagement with the single board 30 are not described in detail here.
  • the number of veneers 30 can be determined according to actual needs. Either one veneer 30 can be provided in the tank 12, or two or more veneers 30 can be provided.
  • the number of slots provided corresponds to the number of veneers 30, therefore, the number of slots can also be one or two or more.
  • the two or more tanks are arranged in an array, such as in one row or multiple rows.
  • the structure shown in FIG. 2 is taken as an example for description.
  • Six veneers 30 are arranged in the tank 12 shown in FIG. 2, and the six veneers 30 are arranged in a single row, and the arrangement direction of the veneers 30 is parallel to the surface of the liquid medium.
  • FIG. 2 only shows a specific arrangement of the single boards 30, and the number of the single boards 30 provided in the embodiment of the present application is not limited to six, and other numbers, such as five or seven, can also be used.
  • the veneers 30 of different numbers such as ten, etc. are specifically arranged, they can also be arranged in two rows, three rows, or four rows according to the space in the tank 12 in different rows. Since the specific arrangement of the veneer 30 is defined by the arrangement of the slots, when the veneer 30 can be arranged in different ways, the arrangement of the corresponding slots can also be set in a different arrangement.
  • each surface of the veneer 30 is arranged in contact with the liquid medium, so that the heat generated by the veneer 30 can be absorbed by the liquid medium as soon as possible.
  • the immersion tank 10 further includes a cover 11 covering the opening of the tank 12.
  • a cover body 11 When the cover body 11 is specifically provided, a separate structure from the tank body 12 may be adopted, or a rotational connection between the cover body 11 and the tank body 12 may be adopted.
  • the cover 11 and the tank 12 can be connected by a threaded connection or a buckle connection, so that the cover 11 is covered on the opening of the tank 12 and fixed.
  • the cover 11 covers the opening of the tank 12.
  • the lid 11 and the can 12 may be sealed or unsealed.
  • a sealing gasket can be set on the lid 11, When the body 11 covers the opening of the can body 12, it is sealed by a gasket.
  • the cover 11 can be opened to expose the opening of the tank 12, so that the veneer 30 can be put into the tank 12 for fixing.
  • the condenser 20 immersed in the liquid medium is also provided, and the condenser 20 is used to dissipate the liquid medium.
  • the liquid medium can continuously absorb the heat of the veneer 30. It can be seen from the above description that heat is first transferred to the liquid medium through the veneer 30 and then transferred to the condenser 20 through the liquid medium. In the entire heat transfer process, the heat of the veneer 30 first heats the liquid medium near the veneer 30, and the liquid medium increases in temperature after absorbing the heat, and the density of the liquid medium decreases.
  • the liquid medium far away from the veneer 30 has a relatively low temperature and a higher density. Therefore, the liquid medium with a higher temperature will rise, that is, the liquid medium located around the veneer 30 will rise.
  • the condenser 20 When the condenser 20 is installed to dissipate the liquid medium, it needs to cool the hot liquid medium. Therefore, when the condenser 20 is installed, the condenser 20 is located above the veneer 30, which corresponds to the structure of the immersion tank 10 , That is, the condenser 20 is located above the tank. As a result, the rising liquid medium can pass through the condenser 20 for heat dissipation as soon as possible. It can be seen from the above description that the liquid medium forms a closed loop flow due to the temperature difference during the entire heat dissipation process.
  • the entire flow process is shown by the arrow in Figure 2:
  • the liquid medium around the veneer 30 increases in heat absorption temperature,
  • the liquid medium after absorbing heat starts to float up, the liquid medium far away from the veneer 30 is filled around the veneer 30 to continue to dissipate the veneer 30, and the liquid medium after absorbing heat continues to float and contact the condenser 20, and passes through the condenser 20 Perform heat exchange.
  • the temperature of the liquid medium decreases and the density increases, so that it begins to sink.
  • the flow of the liquid medium away from the veneer 30 toward the veneer 30 will also cause the cooled liquid medium to begin to sink, thereby forming an annular flow process from bottom to top and from top to bottom as a whole.
  • each condenser 20 corresponding to the embodiment of the present application absorbs heat, the condenser 20 needs to be located above the veneer 30. Therefore, each condenser 20 corresponding to the embodiment of the present application is located at the corresponding Above the tank, and each condenser 20 corresponds to at least one tank.
  • the condenser 20 when the veneer 30 is working, the condenser 20 needs to be located above the veneer 30 to cool the liquid medium after the veneer 30 is heated, but the veneer 30 is placed in the tank.
  • the condenser 20 When the condenser 20 is inside, the condenser 20 needs to be removed so that the baffle can be inserted into the tank in the tank 12. Therefore, when the condenser 20 is set, the condenser 20 needs to be in two different states: When inserting 30, the condenser 20 needs to be removed to expose the socket of the slot body. After the single board 30 is inserted, the condenser 20 needs to be located above the single board 30 to dissipate heat from the single board 30.
  • each condenser 20 can be rotatably connected to the tank 12 and can be locked at different setting positions. For example, when the condenser 20 rotates to the first set position, the condenser 20 avoids the opening of the tank body; and when the condenser 20 rotates to the second set position, the condenser 20 blocks the opening of the tank body.
  • the condenser 20 is rotatably connected with the tank 12
  • one end of the condenser 20 is rotatably connected with the side wall of the tank 12 through the damping shaft. At this time, the condenser 20 is rotated to the first set position and the second set position.
  • each condenser 20 is fixedly connected to the cover 11 of the immersion tank 10.
  • the cover 11 is detachably connected to the tank 12 in the manner described above.
  • the condenser 20 can avoid the opening of the slot body.
  • the condenser 20 is fixed on the side of the cover 11 facing the tank 12, and when the cover 11 is opened, the condenser 20 rotates together with the cover 11 , Thus avoiding the opening of the slot body and facilitating the insertion of the veneer 30.
  • the condenser 20 rotates together with the cover 11 and is located above the veneer 30.
  • the condenser 20 When the condenser 20 is fixed on the cover 11, the condenser 20 can be connected to the cover 11 through a bracket, so that the condenser 20 can be immersed in the liquid medium when the cover 11 and the tank 12 are connected. It should be understood that the manner in which the condenser 20 avoids the opening of the tank body listed above is only a specific example, and the adjustment of the condenser 20 can also be achieved through other connection methods. For example, the adjustment of the condenser can also be achieved by using a connecting rod assembly. 20 is in a different position.
  • an embodiment of the present application also provides a refrigeration device 60, and the condenser 20 is connected to and used for The refrigeration device 60 that exchanges heat for the condenser 20 takes the heat away and dissipates it.
  • the condenser 20 is connected to the refrigerating device 60, different methods can be used. As shown in FIGS. 6 and 7, the condenser 20 and the refrigerating device 60 are connected by a pipe. During the specific connection, the side wall of the tank 12 is provided with a liquid inlet pipe 40 and a liquid outlet pipe 50.
  • the liquid inlet pipe 40 is connected to the liquid inlet of the condenser 20, and the liquid outlet pipe 50 is connected to the condenser 20.
  • the liquid outlet is connected, and the liquid inlet pipe 40 and the liquid outlet pipe 50 are respectively communicated with the refrigeration device 60. Therefore, the liquid in the condenser 20 and the refrigerating device 60 flows back through the liquid inlet pipe 40 and the liquid outlet pipe 50 for heat dissipation.
  • the number of condensers 20 is two or more, the liquid inlets of two or more condensers 20 are connected in parallel on the liquid inlet pipe 40, and the liquid outlets of two or more condensers 20 are connected in parallel On the outlet pipe 50.
  • the number of condensers 20 can be set to different numbers according to needs, such as 3, 4, 6 and other different numbers.
  • the number of condensers 20 is 16, and 16 condensers 20 are connected in parallel on the liquid inlet pipe 40 and the liquid outlet pipe 50.
  • the number of condensers 20 shown in FIG. 7 is three, and three condensers 20 are connected in parallel on the liquid inlet pipe 40 and the liquid outlet pipe 50.
  • the liquid inlet pipe 40 and the liquid outlet pipe 50 are specifically arranged, it is not limited to the liquid inlet pipe 40 and the liquid outlet pipe 50 shown in FIG. 6 being penetrated on the side wall of the tank 12. Other methods may also be adopted.
  • the condenser 20 and the cover 11 are fixedly connected, the liquid inlet pipe 40 and the liquid outlet pipe 50 are respectively threaded on the cover 11.
  • the refrigerating device 60 can adopt different refrigerating devices 60.
  • the refrigeration device 60 shown in Fig. 8 is an air-cooled heat dissipation module.
  • the air-cooled heat dissipation module includes a fan 61, and a pipe is provided inside for circulating single-phase medium, and a pump is provided on the pipe. Drive single-phase media to circulate.
  • the two ends of the pipe are respectively connected with the inlet pipe 40 and the outlet pipe 50 to form a loop with the pipe inside the condenser 20.
  • the single medium in the condenser 20 flows into the air-cooled heat dissipation module after absorbing heat and passes through the fan 61 The temperature is lowered, and then flows back to the condenser 20.
  • the pipeline is a two-phase working medium, which circulates naturally under the action of gravity.
  • the medium in the condenser 20 undergoes a phase change after absorbing heat, such as changing from a liquid state to a gas state, and the gaseous medium enters the refrigeration device 60, and the phase becomes liquid after being cooled by the fan 61, and the liquid medium returns to The condenser 20.
  • the refrigeration device 60 shown in FIG. 9 is a natural heat dissipation module.
  • the natural heat dissipation module does not contain a fan 61.
  • the other structure is similar to the structure shown in FIG. 8, and the internal pipe connection and heat dissipation mode can be referred to the above figure.
  • the only difference between the method in FIG. 8 and FIG. 8 is that the cooling by the fan 61 in FIG. 8 is changed to cooling the medium through natural heat dissipation.
  • the refrigeration device 60 may also adopt different structures such as an outdoor dry cooler/cooling tower, or an indoor chiller to cool the condenser 20.
  • the condenser 20 may also be an immersion tank 10
  • the refrigerator is an external Water source.
  • the heat absorbed by the liquid medium in the immersion tank 10 is transferred to the immersion tank 10, and the immersion tank 10 is immersed in a water source, such as immersed in rivers, lakes and other external water sources, or indoor cold water sources, through the outside world
  • the water source absorbs the heat of the immersion tank 10 to achieve the effect of dissipating heat from the veneer 30.
  • each immersion tank 10 can also be provided with a veneer 30, as shown in FIG. 11, each immersion tank A single plate 30 is provided in 10, that is, there is a one-to-one correspondence between the immersion tank 10 and the single plate 30, and the condenser 20 in the immersion tank 10 is connected to an external refrigeration device 60 through a pipe.
  • multiple veneers 30 correspond to multiple immersion tanks 10, and the heat dissipation effect of the veneers 30 can also be achieved.
  • the immersion tank 10 When the immersion tank 10 is specifically installed, no matter whether the immersion tank 10 and the veneer 30 are arranged in a one-to-one manner, or in a one-to-many manner. When the liquid medium absorbs heat, the volume of the liquid medium will increase. At this time, the pressure in the immersion tank 10 may be too high. Therefore, a safety valve is set on the immersion tank 10 to avoid safety accidents caused by excessive pressure in the immersion tank 10.
  • an embodiment of the present application also provides a processor, which includes any one of the above-mentioned heat dissipation devices, and a single board 30 inserted in the heat dissipation device.
  • a processor which includes any one of the above-mentioned heat dissipation devices, and a single board 30 inserted in the heat dissipation device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请提供了一种散热装置及处理器，该散热装置包括一个浸没罐，该浸没罐容纳有液态介质，在使用时，单板浸没在液态介质中，通过液态介质的吸热对单板进行散热。还包括浸泡在液态介质中的冷凝器，通过设置的该冷凝器对液态介质进行散热。通过浸没罐内的液态介质作为媒介将单板热量传递给浸没罐内的冷凝器。之后冷凝器再通过与其连接并用于给冷凝器热交换的制冷装置，将热量带走散热出去。通过上述描述可以看出，在上述实施例中直接通过液态介质的由于温度形成回流将热量带走，由于液态介质没有相变，从而降低了对散热装置的密封要求，同时保证了对单板的散热效果。

Description

一种散热装置及处理器
相关申请的交叉引用
本申请要求在2019年05月31日提交中国专利局、申请号为201910469769.0、申请名称为“一种散热装置及处理器”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到通信技术领域，尤其涉及到一种散热装置及处理器。
背景技术
随着电子元器件集成度提高，芯片的功耗密度也越来越大,传统的风冷散热方式已经不能满足日益增长的散热需求。液体冷却技术以其高效的散热效率为高热流密度电子器件散热提供了新的解决方案，并已经在数据中心,服务器等领域展开应用。
现有技术中比较常用的方式是采用浸没液冷技术，该浸没液冷是液体冷却技术中的一种形式，就是将设备浸泡在液体中，通过与液体直接接触将设备热量传递给液体并带走。在具体设置时，如图1所示，将所有单板2浸没在同一个罐1中，罐1内填充的是一种沸点较低容易相变的工质，这类工质液体遇到单板2发热后，吸收热量变成了气体，在浮升力作用下自动上浮，遇到罐1顶(液面以上)的冷凝器3后，在冷却的作用下凝结成液体再重新依靠重力滴落回罐1内，形成散热循环。但是采用低沸点的两相工质，但是这种介质挥发性太强，要求罐1子的密封设计比较高，在实际工作环境中比较难以实施。
发明内容
本申请提供了一种散热装置及处理器，用以提高散热装置对单板的散热效果。
第一方面，提供了一种散热装置，该散热装置用于对单板进行散热，在具体设置该散热装置时，其具体包括一个浸没罐，该浸没罐容纳有液态介质，该液态介质用于对单板进行散热，在使用时，单板浸没在液态介质中，通过液态介质的吸热对单板进行散热。此外，为了降低吸热后的液态介质，该散热装置还包括浸泡在所述液态介质中的冷凝器，通过设置的该冷凝器对液态介质进行散热。单板发热后，热量加热单板附近的液态介质，液态介质在受热后密度减小并向上浮，热的液态介质与冷凝器接触后热量传递给冷凝器，液态介质温度降低后密度增大再次下沉，又沉入罐底。这样利用液体介质的密度与温度的变化关系，会形成一个“自然对流”的循环，将会源源不断的通过浸没罐内的液态介质作为媒介将单板热量传递给浸没罐内的冷凝器。之后冷凝器再通过与其连接并用于给所述冷凝器热交换的制冷装置，将热量带走散热出去。通过上述描述可以看出，在上述实施例中直接通过液态介质的由于温度形成回流将热量带走，降低了对散热装置的密封要求，同时保证了对单板的散热效果。
在具体设置浸没罐时，该浸没罐包括两部分，一部分为用于盛放液态介质的罐体，另一部分为与所述罐体连接的盖体。在具体设置该盖体时，可以采用与罐体为分体结构的方 式，也可以采用盖体与罐体之间转动连接。
在冷凝器与制冷装置连接时，通过管道进行的连接，在具体连接时，包括穿设在所述罐体的进液管以及出液管，其中，所述进液管与所述冷凝器的进液口连通，所述出液管与所述冷凝器的出液口连通，且所述进液管及所述出液管分别与所述制冷装置连通。通过进液管以及出液管将冷凝器与制冷装置内的液体流动形成回流，以进行散热。
在具体设置该冷凝器时，该冷凝器的个数可以根据需要进行设置，既可以采用一个浸没罐内设置有一个冷凝器，也可以采用一个浸没罐内设置有多个冷凝器。如在一个具体的实施方案中，冷凝器的个数为两个或两个以上，且所述两个或两个以上冷凝器的进液口并联在所述进液管上，所述两个或两个以上冷凝器的出液口并联在所述出液管上。
在冷凝器与单板对应时，可以采用一个冷凝器对应一个单板，也可以采用一个冷凝器对应两个或两个以上单板，在具体设置时可以根据实际的散热要求进行布局。
在单板固定在罐体内时，可以采用不同的方式进行设置。如在一个具体的实施方案中，该罐体内设置有用于固定所述单板的槽体。从而方便固定单板。
在具体设置上述的槽体时，其个数可以采用一个或者两个或两个以上。在一个具体的可实施方案中，槽体为两个或两个以上，且所述两个或两个以上槽体阵列排列。
由上述描述可以看出，在冷凝器吸热时，需要冷凝器位于单板的上方，因此本申请实施例对应的每个冷凝器位于对应的槽体的上方，且每个冷凝器至少对应一个槽体。
在具体设置该冷凝器时，可以采用不同的设置方式，如每个冷凝器与所述罐体转动连接，且在所述冷凝器转动到第一设定位置时，所述冷凝器避让所述槽体的开口。通过将冷凝器采用转动的方式与罐体连接，从而可以改变冷凝器的位置，在安装单板时，可以通过转动冷凝器避让槽口，方便单板的插入。
当然，除了上述方式外，还可以采用其他的方式，如所述浸没罐包括罐体以及与所述浸没罐连接的盖体；且每个冷凝器与所述浸没罐的盖体固定连接。通过将冷凝器固定在盖体上，在将盖子取下时，槽体的槽口可以直接外露，方便固定单板。
在具体设置上述制冷装置时，可以采用不同的装置，如制冷装置为室外干冷器/冷却塔，或者室内的冷水机组。
此外，该制冷装置还可以为风冷散热模块或自然散热模块。
除了上述列举的技术方案外，该冷凝器还可以是浸没罐，而制冷器为外界水源，此时，浸没罐浸泡在水源中，如浸泡在河流、湖泊等自外界水源中。
第二方面，提供了一种处理器，该处理器包括上述任一项所述的散热装置，以及插设在所述散热装置内的单板。单板发热后，热量加热单板附近的液态介质，液态介质在受热后密度减小并向上浮，热的液态介质与冷凝器接触后热量传递给冷凝器，液态介质温度降低后密度增大再次下沉，又沉入罐底。这样利用液体介质的密度与温度的变化关系，会形成一个“自然对流”的循环，将会源源不断的通过浸没罐内的液态介质作为媒介将单板热量传递给浸没罐内的冷凝器。之后冷凝器再通过与其连接并用于给所述冷凝器热交换的制冷装置，将热量带走散热出去。通过上述描述可以看出，在上述实施例中直接通过液态介质的由于温度形成回流将热量带走，降低了对散热装置的密封要求，同时保证了对单板的散热效果。
附图说明
图1为现有技术中的浸没液冷散热装置的结构示意图；
图2为本申请实施例提供的浸没罐的结构示意图；
图3为本申请实施例提供的浸没罐打开时的示意图；
图4为本申请实施例提供的冷凝器与单板的对应示意图；
图5为本申请实施例提供的冷凝器与单板的对应示意图；
图6为本申请实施例提供的冷凝器的并联示意图；
图7为本申请实施例提供的冷凝器的并联示意图；
图8为本申请实施例提供的制冷装置与冷凝器的配合示意图；
图9为本申请实施例提供的制冷装置与冷凝器的配合示意图；
图10为本申请实施例提供的制冷装置与冷凝器的配合示意图；
图11为本申请实施例提供的另一种散热装置的结构示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的散热装置，首先说明一下其应用场景，该散热装置用于对单板30的散热，在处理器工作时，该处理器中的单板30在工作时会产生大量的热量，为了保证单板30正常的工作，需要对单板30进行散热，因此本申请实施例提供了一种散热装置对单板30进行散热。
首先参考图1，图1示出了本申请实施例提供的一种散热装置的结构。在本申请实施例提供的散热装置包括一个浸没罐10，该浸没罐10用于承载液态介质以及单板30。其结构如图1中所示，该浸没罐10包括两部分，一部分为用于盛放液态介质以及单板30的罐体12，另一部分为与所述罐体12连接的盖体11。在具体设置该罐体12时，该罐体12为一个筒状结构，如采用长方体形、圆形、椭圆形或者其他形状的筒体结构。在盛放液态介质时，罐体12上设置有一个开口，通过开口可以将液态介质以及单板30放入到罐体12中。该液态介质可以选用不同的介质，如水、油或者其他的液态介质。
在承载单板30时，该单板30放置在罐体12内，并浸没在液态介质中。为了使得单板30在液态介质中保持稳定的姿态。在单板30固定在罐体12内时，可以采用不同的方式进行设置。如在一个具体的实施方案中，该罐体12内设置有用于固定单板30的槽体。在单板30放入到罐体12内时，直接将罐体12插入到槽体内进行固定，通过槽体的侧壁将单板30卡装固定。或者可以在槽体内设置卡扣，通过卡扣将单板30进行固定。在采用卡扣时，可以将卡扣设置在槽体的侧壁上，通过该卡扣与单板30之间的卡合将单板30固定在卡槽内。由于卡扣为比较常见的卡合结构，因此在此不详细赘述其具体结构以及与单板30的具体卡合情况。
在放置单板30时，单板30的个数可以根据实际的需要而定，既可以采用在罐体12内设置一个单板30，也可以设置两个或两个以上的单板30。而设置的槽体与单板30的个数一一对应，因此，槽体的个数也可以为一个或者两个或两个以上。在采用两个或两个以上槽体时，两个或两个以上槽体阵列排列，如采用一排排列，或者采用多排排列的方式设 置槽体。为了方便理解本申请实施例提供的单板30的设置方式，以图2中所示的结构为例进行说明。在图2中所示的罐体12内设置了六个单板30，且六个单板30单排排列，且单板30的排列方向平行于液态介质的表面。当然，图2仅仅示出了一种具体的单板30的排列方式，本申请实施例提供的单板30的个数不仅限于六个，也可以采用其他的个数，如五个、七个、十个等不同的个数的单板30，在具体排列时，也可以根据罐体12内的空间设置成两排、三排或者四排等不同的排数。由于单板30的具体排列方式是通过槽体的排列方式限定的，因此在单板30可以采用不同的排列方式时，对应的槽体的排列方式也可以采用不同的排列方式进行设定。
继续参考图2，在单板30固定在槽体内时，为了使得单板30的热量尽快的通过液态介质散发出去，因此设置的单板30各个面均与液态介质接触，类似于单板30悬浮在液态介质中，以增大液态介质与单板30的接触面积，提高散热的效果。当然除了图2所示的单板30的放置方式外，还可以采用其他的方式，如单板30的底部与罐体12的底部接触，而其他面与液态介质接触也是可以达到散热的效果的。或者采用其他的放置方式将单板30固定在罐体12内。但是在一个具体的实施方案中，采用单板30的各个面均与液态介质接触的方式设置，以使得单板30产生的热量能够尽快通过液态介质吸收。
为了封堵罐体12上的开口，该浸没罐10还包括一个盖体11，该盖体11覆盖在罐体12的开口处。在具体设置盖体11时，可以采用与罐体12为分体结构的方式，也可以采用盖体11与罐体12之间转动连接。如在采用分体结构时，该盖体11与罐体12之间可以通过螺纹连接或者通过卡扣的方式连接，从而将盖体11覆盖在罐体12的开口处并固定。如图3中所示，在采用转动连接时，该盖体11与罐体12一端转动连接，而另一端通过卡扣进行固定。在卡扣扣合时，盖体11覆盖在罐体12的开口处。在盖体11覆盖在罐体12的开口处时，盖体11与罐体12之间也可以密封也可以不密封，如在采用密封时，可以通过在盖体11上设置密封垫，在盖体11覆盖在罐体12的开口处时，通过密封垫进行密封。
当然无论盖体11与罐体12之间采用哪种方式，盖体11均可以被打开以使得罐体12的开口外露，从而可以将单板30放入到罐体12内进行固定。
在本申请实施例提供的散热结构中对单板30散热时，除了上述提到的液态介质外，还设置了浸没在液态介质中的冷凝器20，该冷凝器20用于对液态介质进行散热，从而使得液态介质能够不断的吸附单板30的热量。由上述描述可以看出，热量在传递时首先通过单板30传递到液态介质，之后再通过液态介质传递给冷凝器20。在整个热传递的过程中，单板30的热量首先加热单板30附近的液态介质，而液态介质在吸收热量后温度升高，并且液态介质的密度减小。而远离单板30的液态介质相对来说温度相低，密度比较大，因此温度升高的液态介质会上升，即位于单板30周围的液态介质会上升。而设置的冷凝器20在给液态介质进行散热时，需要对热的液态介质进行降温，因此在设置冷凝器20时，冷凝器20位于单板30的上方，对应到浸没罐10的结构来说，就是冷凝器20位于槽体的上方。从而使得上升的液态介质能够尽快通过冷凝器20进行散热。由上述描述可以看出，液态介质在整个散热过程中由于温度的差异形成一个闭环的流动，整个流动的过程如图2中箭头所示：处于单板30周围的液态介质吸热温度升高，吸热后的液态介质开始上浮，远离单板30的液态介质填充到单板30周围继续对单板30进行散热，而吸热后的液态介质继续上浮并与冷凝器20接触，并通过冷凝器20进行换热，换热后的液态介质温度降低、密度增大，从而开始下沉。同时，远离单板30的液态介质朝向单板30流动也会带动降温 后的液态介质开始下沉，从而整体形成由下到上并由上到下的一个环形的流动过程。
在具体的冷凝器20与单板30进行对应时，可以采用一个冷凝器20对应一个单板30，也可以采用一个冷凝器20对应两个或两个以上单板30，在具体设置时可以根据实际的散热要求进行布局。如图2中所示，图2中示出了一个冷凝器20对应一个单板30；而在如图4中出了一个单板30对应两个单板30的设置方式，此外，图5中示出了一个冷凝器20对应三个单板30时的设置方式。当然应当理解的是上述图2、图4及图5仅仅示例了一些具体的可实施方式，在本申请实施例提供的冷凝器20对应的单板30情况不仅限于上述的描述方式，还可以根据需要采用其他的不同的方式进行对应。但是无论采用哪种对应方式，在本申请实施例提供的冷凝器20在吸热时，需要将冷凝器20位于单板30的上方，因此本申请实施例对应的每个冷凝器20位于对应的槽体的上方，且每个冷凝器20至少对应一个槽体。
如图2及图3所示，在单板30工作时，需要冷凝器20位于单板30的上方，以对单板30加热后的液态介质进行降温，但是在单板30放入到罐体12内时，需要将冷凝器20移开，以便于将挡板插入到罐体12内的槽体中，因此在设置冷凝器20时需要冷凝器20可以处于两种不同的状态：在单板30插入时需要将冷凝器20移开以露出槽体的插口，在单板30插入后，冷凝器20需要位于单板30的上方以对单板30进行散热。因此在本申请实施例提供的冷凝器20在设置时，可以采用每个冷凝器20与罐体12转动连接并可锁定在不同的设定位置。如在冷凝器20转动到第一设定位置时，冷凝器20避让槽体的开口；而冷凝器20转动到第二设定位置时，冷凝器20遮挡槽体的开口。在冷凝器20与罐体12转动连接时，冷凝器20的一端通过阻尼轴与罐体12的侧壁转动连接，此时，冷凝器20转动到第一设定位置以及第二设定位置时，可以通过阻尼轴的阻尼效果实现锁定。当然还可以采用现有技术中常见的卡扣与卡槽的配合实现对冷凝器20的锁定。如转轴与冷凝器20固定连接，而转轴上设置卡槽，且在穿设转轴的轴孔中设置弹性凸起，通过弹性凸起与卡槽的配合实现对冷凝器20在不同设定位置的锁定。当然除了上述冷凝器20与罐体12转动连接的方式外，还可以采用其他的方式。如每个冷凝器20与浸没罐10的盖体11固定连接。该盖体11采用上述描述的方式与罐体12可拆卸的连接。但是无论采用哪种连接方式，在盖体11从罐体12上取下时，冷凝器20均可以避让开槽体的开口。如图3中所示，在盖体11与罐体12转动连接时，冷凝器20固定在盖体11朝向罐体12的一面，在盖体11打开时，冷凝器20跟随盖体11一起转动，从而避让开了槽体的开口，方便单板30插入。在盖体11盖在罐体12上时，冷凝器20跟随盖体11一起转动，并位于单板30的上方。在采用冷凝器20固定在盖体11上时，可以通过支架将冷凝器20与盖体11连接，以便于在盖体11与罐体12连接时，冷凝器20能够浸没在液态介质中。应当理解的是，上述列举的冷凝器20避让槽体的开口的方式仅仅为一个具体的示例，还可通过其他的连接方式实现冷凝器20的调整，如采用连杆组件也可以实现调整冷凝器20处于不同的位置。
在冷凝器20对液态介质进行散热时，冷凝器20的温度也会上升，为了能够持续的进行散热，在本申请实施例还提供了一个制冷装置60，设置的冷凝器20通过与其连接并用于给冷凝器20热交换的制冷装置60将热量带走散热出去。在具体实现冷凝器20与制冷装置60连接时，可以采用不同的方式。如图6及图7所示，冷凝器20与制冷装置60通过管道连接。在具体连接时，罐体12的侧壁上穿设有进液管40以及出液管50，其中，进液管40与冷凝器20的进液口连通，而出液管50与冷凝器20的出液口连通，且进液管40 及出液管50分别与制冷装置60连通。从而通过进液管40以及出液管50将冷凝器20与制冷装置60内的液体流动形成回流，以进行散热。在冷凝器20的个数为两个或两个以上，两个或两个以上冷凝器20的进液口并联在进液管40上，两个或两个以上冷凝器20的出液口并联在出液管50上。其中冷凝器20的个数可以根据需要设置不同给的个数，如3个、4个、6个等不同的个数。在图6中冷凝器20的个数为16个，且16个冷凝器20并联在进液管40以及出液管50上。而图7中示出的冷凝器20的个数为3且，且3个冷凝器20并联在了进液管40以及出液管50上。在具体设置进液管40以及出液管50时，不仅限于图6中所示的进液管40及出液管50穿设在罐体12的侧壁。还可以采用其他的方式，如在冷凝器20与盖体11固定连接时，进液管40及出液管50分别穿设在盖体11上。
在具体设置制冷装置60时，该制冷装置60可以采用不同的制冷装置60。如图8所示，图8示出的制冷装置60为风冷散热模块，该风冷散热模块包括一个风扇61，且其中内部设置有管道用于流通单相介质，并且管道上设置了泵来驱动单相介质流通。管道的两端分别与进液管40以及出液管50连通，以与冷凝器20内部的管道形成一个回路，冷凝器20内的单项介质在吸热后流入到风冷散热模块内通过风扇61进行降温，之后再流回到冷凝器20中。或者还可以采用管道是两相工质，在重力作用下自然循环。此时，冷凝器20内的介质吸热后发生相变，如由液态变成气态，而气态的介质进入到制冷装置60中，通过风扇61降温后相变成液态，液态的介质再次回流到冷凝器20中。
当然除了图8所示的结构外，还可以采用如图9所示的结构。图9中示出的制冷装置60为自然散热模块，该自然散热模块内不含风扇61，其他的结构与图8所示的结构相近似，其内部的管道连接方式以及散热方式可以参考上述图8中的方式，与图8唯一的区别在于将图8中的通过风扇61降温变成了通过自然散热的方式对介质进行降温。
除了图8及图9所示的结构外，制冷装置60还可以采用室外干冷器/冷却塔，或者室内的冷水机组等不同的结构对冷凝器20进行降温。
对于本申请实施例提供的冷凝器20以及制冷装置60除了上述的描述结构外，还可以采用其他的结构方式，如图10所示，冷凝器20还可以是浸没罐10，而制冷器为外界水源。此时浸没罐10内的液态介质吸收的热量传递给浸没罐10，并且通过将浸没罐10浸泡在水源中，如浸泡在河流、湖泊等自外界水源中，或者室内的冷水源中，通过外界水源吸收浸没罐10的热量，进而达到对单板30进行散热的效果。
在上述示例时，均是以一个浸没罐10内设置有多个单板30的方式进行的描述，但是该浸没罐10还可以设置一个单板30，如图11中所示，每个浸没罐10内设置一个单板30，即浸没罐10与单板30之间一一对应，且浸没罐10内的冷凝器20通过管道与外部的制冷装置60进行连接。在图11所示的结构中，多个单板30对应多个浸没罐10，同样可以实现对单板30的散热效果。
在具体设置浸没罐10时，无论采用浸没罐10与单板30一对一的方式设置，还是采用一对多的方式设置。当液态介质在吸收热量时，会造成液态介质的体积增大，此时可能会造成浸没罐10内的压力过大。因此在浸没罐10上设置了一个安全阀，避免浸没罐10内的压力过大造成安全事故。
此外，本申请实施例还提供了一种处理器，该处理器包括上述任一项的散热装置，以及插设在散热装置内的单板30。单板30发热后，热量加热单板30附近的液态介质，液态介质在受热后密度减小并向上浮，热的液态介质与冷凝器20接触后热量传递给冷凝器20， 液态介质温度降低后密度增大再次下沉，又沉入罐底。这样利用液体介质的密度与温度的变化关系，会形成一个“自然对流”的循环，将会源源不断的通过浸没罐10内的液态介质作为媒介将单板30热量传递给浸没罐10内的冷凝器20。之后冷凝器20再通过与其连接并用于给冷凝器20热交换的制冷装置60，将热量带走散热出去。通过上述描述可以看出，在上述实施例中直接通过液态介质的由于温度形成回流将热量带走，降低了对散热装置的密封要求，同时保证了对单板30的散热效果。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (12)

  1. 一种散热装置，其特征在于，包括：浸没罐；设置在所述浸没罐内并用于浸泡单板并对所述单板散热的液态介质；还包括浸泡在所述液态介质中的冷凝器；还包括与所述冷凝器连接并用于给所述冷凝器热交换的制冷装置。
  2. 根据权利要求1所述的散热装置，其特征在于，所述浸没罐包括罐体以及与所述罐体连接的盖体。
  3. 根据权利要求2所述的散热装置，其特征在于，还包括穿设在所述浸没罐的进液管以及出液管，其中，所述进液管与所述冷凝器的进液口连通，所述出液管与所述冷凝器的出液口连通，且所述进液管及所述出液管分别与所述制冷装置连通。
  4. 根据权利要求3所述的散热装置，其特征在于，所述冷凝器的个数至少为一个，且在所述冷凝器的个数为两个或两个以上时，且所述两个或两个以上的冷凝器的进液口并联在所述进液管上，所述两个或两个以上的冷凝器的出液口并联在所述出液管上。
  5. 根据权利要求3所述的散热装置，其特征在于，所述浸没罐内设置有用于固定所述单板的槽体。
  6. 根据权利要求5所述的散热装置，其特征在于，所述槽体的个数为至少一个，且在所述槽体为两个或两个以上时，且所述两个或两个以上的槽体阵列排列。
  7. 根据权利要求5所述的散热装置，其特征在于，每个冷凝器至少对应一个槽体，且每个冷凝器位于对应的槽体的上方。
  8. 根据权利要求7所述的散热装置，其特征在于，每个冷凝器与所述浸没罐转动连接，且在所述冷凝器转动到第一设定位置时，所述冷凝器避让所述槽体的开口。
  9. 根据权利要求7所述的散热装置，其特征在于，所述浸没罐包括罐体以及与所述罐体连接的盖体；且每个冷凝器与所述浸没罐的盖体固定连接。
  10. 根据权利要求3所述的散热装置，其特征在于，所述制冷装置为室外干冷器/冷却塔，或者室内的冷水机组。
  11. 根据权利要求1～7任一项所述的散热装置，其特征在于，所述制冷装置为风冷散热模块或自然散热模块。
  12. 一种处理器，其特征在于，包括如权利要求1～11任一项所述的散热装置，以及插设在所述散热装置内的单板。
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