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WO2020224777A1 - Dissipateur thermique - Google Patents

Dissipateur thermique Download PDF

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Publication number
WO2020224777A1
WO2020224777A1 PCT/EP2019/061849 EP2019061849W WO2020224777A1 WO 2020224777 A1 WO2020224777 A1 WO 2020224777A1 EP 2019061849 W EP2019061849 W EP 2019061849W WO 2020224777 A1 WO2020224777 A1 WO 2020224777A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
cooling
cooling fins
heat
components
Prior art date
Application number
PCT/EP2019/061849
Other languages
German (de)
English (en)
Inventor
David DÖRING
Günter EBNER
Gerald Franz Giering
Klaus WÜRFLINGER
Marcus ZELLER
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to PCT/EP2019/061849 priority Critical patent/WO2020224777A1/fr
Priority to DE212019000499.7U priority patent/DE212019000499U1/de
Publication of WO2020224777A1 publication Critical patent/WO2020224777A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Definitions

  • the invention relates to a heat sink for cooling an electronic component.
  • the invention also relates to an arrangement with a plurality of heat sinks and a method for cooling an electronic component.
  • Power electronic components can heat up during operation. If the resulting heat is a certain
  • the invention is based on the object of specifying a heat sink with which heat can be dissipated from an electronic component quickly and reliably.
  • this object is achieved by a
  • Heat sink according to the independent claim Advantageous embodiments of the heat sink are specified in the dependent claims.
  • a heat sink for cooling an electronic component having a cylindrical core on which a
  • a plurality of radially extending cooling fins are arranged, the cooling fins one in the axial direction
  • a cooling fluid can both the outer surface of the
  • This heat sink is particularly suitable for cooling an essentially circular-cylindrical electronic component. It is a
  • the recess is in particular designed as a channel or as a through opening.
  • the recess extends axially
  • the recess is perpendicular to the axial direction on all sides from the material of the cooling fins or from the
  • the cooling fins can also be referred to as cooling fins.
  • the cooling body can be designed such that the recess forms a through opening, in particular a through opening extending in the axial direction.
  • the cooling ribs advantageously have the recess in the axial direction. As a result, the cooling fluid can flow through the recess in the axial direction.
  • the cooling body can be designed in such a way that the cooling ribs have a surface which is flat in the axial direction.
  • the cooling fins are therefore in particular not twisted in themselves. This results in a comparatively low flow resistance for the cooling fluid, so that the cooling fluid has good contact with the
  • the heat sink can be designed in such a way that the cooling fins each have a substantially cuboid outer contour. Such cooling fins have a relatively large surface.
  • the heat sink can be designed in such a way that the cooling ribs are frame-shaped cooling ribs (which form the recess
  • the cooling fins thus have a frame-shaped cross-sectional area in the axial direction, which the
  • the cooling body can be designed in such a way that the cooling ribs have two parallel strips in the radial direction as a cross-sectional area which form the recess
  • the heat sink can also be designed so that the
  • Has cross-sectional area and / or the recess has a rectangular cross-sectional area in the radial direction
  • the variants of the cooling body described above have a simple geometric shape so that the cooling fluid can flow through them and around them.
  • the heat sink can also be designed so that the
  • Cooling fins are evenly distributed around the circumference of the core (around).
  • the heat sink can be designed in such a way that the radial extension of the cooling ribs is greater than the axial extension
  • the cooling fins have a comparatively large surface area and are able to quickly remove the heat generated from the core of the heat sink
  • the cooling body can be designed in such a way that the axial extent of the cooling fins is greater than the tangential extent of the cooling fins.
  • the heat sink can also be designed in such a way that the axial extension of the cooling ribs (essentially) corresponds to the axial extension of the core. This also results in a large surface area for the cooling fins.
  • the outer diameter of the heat sink can be approximately
  • the heat sink can also be designed in such a way that the core has a flat base surface and / or a flat top surface
  • the core has, in particular a flat circular base and / or a flat circular top surface.
  • the core can be a circular cylinder-shaped core, the base surface and top surface of which are arranged parallel to one another. Good thermal contact with the electronic component to be cooled can advantageously be established on the flat base surface and / or the flat top surface.
  • Heat sinks according to one of the variants described above and with several electronic components, in which the heat sinks and the components are arranged alternately.
  • the components and the heat sinks form an electrical series circuit.
  • Such an arrangement is also referred to as a stack structure or a stack structure.
  • the arrangement is particularly advantageous at high voltages, because the electrical series connection of the components enables a high dielectric strength to be achieved.
  • the arrangement can also be designed so that the
  • Components are each arranged between the cylindrical cores of two heat sinks.
  • the components are in particular in contact with the base surface or the top surface of the respective core.
  • the components can in particular be circular cylindrical components, for example
  • Heat sinks are arranged along a common axis of rotation.
  • the arrangement can also be designed so that the
  • Heat sink and the components are braced against each other.
  • the heat sinks and the components then in particular form a tensioning association.
  • the respective heat sinks can exert great tension forces on the components arranged between the cores be transmitted.
  • the arrangement can also be designed such that in the case of two (axially) successive heat sinks, the cooling fins of the two heat sinks are arranged offset to one another. In the case of two successive heat sinks, the
  • the cooling fins of the two heat sinks are not axially aligned
  • the arrangement can also be designed in such a way that two successive heat sinks rotate through an angle of rotation
  • the two successive heat sinks are arranged rotated against each other.
  • two successive heat sinks can be arranged rotated relative to one another by the same angle of rotation. This results in a uniform distribution of the cooling fins on the arrangement.
  • the angle of rotation represents a circumferential angle.
  • the two successive heat sinks are around the
  • Circumferential angle arranged rotated against each other.
  • a method for cooling an electronic component by means of at least one is also disclosed.
  • This method can take place in such a way that several components connected electrically in series are cooled, with one of the components between two of the heat sinks
  • the heat sink, the arrangement and the Procedures have the same or similar
  • Figure 1 shows an embodiment of a
  • FIG. 2 shows a detail of the exemplary heat sink
  • FIG. 3 shows an embodiment of the heat sink with an electronic component and in
  • FIG. 4 shows an arrangement with several heat sinks and several electronic components.
  • a heat sink 1 is shown as an example. This is a rotationally symmetrical one
  • Heat sink the axis of rotation 3 runs centrally through a core 6 of the cooling body 1.
  • a plurality of cooling fins 9 are arranged on the circumference of the cylindrical core 6.
  • Cooling fins 9 extend radially away from the core 6. In the axial direction (that is, in the direction of the axis of rotation 3), the cooling ribs each have a recess 12. This recess 12 can best be seen in the cooling rib facing directly towards the viewer. In the exemplary embodiment, the recess forms a through opening 12 in the
  • Cooling rib 9. This through opening 12 extends in the axial direction through the cooling rib 9.
  • the surface of the cooling fin 9, and thus the surface of the cooling body 1, is enlarged by the recess 12.
  • a cooling fluid can in particular not only be applied to the outer contour / outer surface flow past the cooling fin, but also through the
  • the heat sink is particularly suitable for a liquid cooling fluid
  • the heat sink can also be used with a gaseous cooling fluid (for example with air).
  • the cooling fluid preferably flows in the direction of
  • Axis of rotation 3 (axial) past and through the heat sink and thus absorbs the heat from the heat sink.
  • the cooling fins 9 each have a substantially
  • the cooling fins are designed as frame-shaped cooling fins, so the cooling fins 9 each frame the recess 12. In the axial direction, the cooling fins thus have a
  • the cooling ribs have two parallel strips as a cross-sectional area; these strips delimit the recess 12.
  • the recess 12 has in
  • Embodiment has a rectangular cross-sectional area in the axial direction and a rectangular cross-sectional area in the radial direction.
  • the cooling fins 9 are arranged uniformly around the circumference of the core 6.
  • the radial extent of the cooling ribs is greater than the axial extent of the cooling ribs (in the exemplary embodiment the cooling ribs extend axially in the vertical direction). This makes it possible to quickly remove heat from the core of the heat sink in the radial direction
  • the axial extension of the cooling ribs corresponds in the exemplary embodiment to the axial extension of the core.
  • the cooling fins and the core have the same height.
  • the outer diameter of the heat sink 1 is approximately at least three times as large as the diameter of the core 6.
  • the outer The diameter of the heat sink 1 should be between three and five times as large as the diameter of the core 6.
  • the core 6 has a flat base and a flat
  • Top surface (in the embodiment, only the flat top surface of the core 6 can be seen). This is a flat circular base and a flat
  • the core in the example is a
  • FIG. 2 a section of the heat sink 1 is shown in a semi-transparent illustration.
  • FIG. 2 shows only the cylindrical core 6 and a single cooling fin 9 of the cooling body 1.
  • the base surface 203, the top surface 206 and the jacket surface 209 of the cylindrical core 6 can be clearly seen.
  • the jacket surface 209 describes the circumference of the cylindrical core 6.
  • the individual surfaces are on the jacket surface 209
  • Cooling fins 9 arranged.
  • Top surface 206 are each configured as a flat base surface and a flat top surface.
  • the base 203 and the circular top surface 206 are arranged parallel to one another.
  • the base area 203 and the top area 206 each represent a contact area for one of the electronic components, which by means of the
  • the radial extension 212 of the individual cooling fins 9 is greater than the axial extension 215 of the cooling fins.
  • the maximum radial extension 212 of the cooling fins 9 is greater than the maximum axial extension 215 of the cooling fins 9.
  • the axial extension 215 of the cooling fins 9 corresponds to the axial extension of the core 6. In other words, the individual cooling fins are as high as the core 6. The axial extension 215 of the cooling fins 9 is greater than that
  • the cooling ribs Due to the configuration described above, the cooling ribs has a large surface, so that by means of the cooling fins a large amount of heat from the core 6 (and thus from the electronic
  • Component can be discharged.
  • the heat sink 1 is electrically conductive. It consists of a metal, for example copper or aluminum. Thus, the heat sink has both a good electrical
  • cooling ribs 9 have a surface 221 which is flat in the axial direction.
  • the (inner) surface of the recess 12 is also flat in the axial direction.
  • the surfaces mentioned are also in radial
  • the heat sink 1 is shown with an electronic component 303 arranged on the heat sink.
  • the electronic component 303 is a circular-cylindrical component 303; this design is also referred to as a disk cell.
  • the component 303 lies on the core 6 of the
  • FIG. 4 shows an exemplary embodiment of an arrangement 400 with a plurality of heat sinks 1 a, 1 b, 1 c,... Ln and a plurality of electronic components 303a, 303b, 303c, ... 303 (n-1).
  • the electrical components 303a, 303b, ... 303 (n-1) are each arranged between the individual heat sinks la, lb, ... ln and are largely covered by the cooling fins of the heat sinks 1 in the illustration in FIG. As a result, the components 303 are not or barely visible in FIG.
  • An electronic component is arranged between each two heat sinks.
  • the heat sinks and the electronic components are therefore arranged alternately. For example, between the first heat sink la and the second
  • Heat sink lb the first electronic component 303a
  • the second electronic component 303b is arranged between the second heat sink lb and the third heat sink lc, etc.
  • Components 303a, 303b, 303c, ... 303 (n-1) form one
  • the components 303 are each between the cylindrical cores 6 of two
  • the heat sinks 1 and the components 303 are mechanically braced against one another.
  • the heat sinks 1 and the components 303 in particular form a tensioning association.
  • the clamping device itself is not shown in FIG. 4 for reasons of clarity.
  • the cooling fins 9 are arranged offset from one another.
  • the cooling fins of the heat sink la are arranged offset from the cooling fins of the heat sink lb.
  • the cooling fins of the heat sinks la and lb are therefore not aligned with one another in the axial direction.
  • two successive heat sinks are arranged rotated relative to one another by an angle of rotation / circumferential angle; two successive heat sinks arranged rotated against each other by the same angle of rotation / circumferential angle.
  • Rotation angle / circumference angle 5.625 ° corresponds to half the angle between two adjacent ones
  • Cooling fins of a heat sink It follows from this that the third heat sink lc is again aligned identically to the first heat sink la. In other words, the cooling fins of the third heat sink lc are aligned identically to the
  • Cooling fins of the first heat sink la With a staggered arrangement of the cooling fins, there is advantageously only a low flow resistance, in particular with viscous cooling fluids.
  • the cooling fluid flowing through the arrangement is shown schematically by means of vertical arrows pointing from bottom to top. It can be seen here that the cooling fluid can flow straight through the recesses 12 of the cooling fins 9, this is symbolized by straight arrows. In addition, the coolant can also flow around the individual cooling fins 9, which is achieved through the
  • cooling fluid flows in the axial direction (which is shown in FIG.
  • the representation in FIG. 4 corresponds to the vertical direction) through the arrangement 400 and past the arrangement 400.
  • the heat sink, arrangement and procedure are
  • Components can be connected in series (stack structure) and electrically insulated by means of a liquid insulating medium (for example a synthetic ester).
  • a liquid insulating medium for example a synthetic ester.
  • This Liquid insulating medium can advantageously be used at the same time as a liquid cooling fluid, since such liquid insulating media often also have a high specific heat capacity and are therefore also suitable as cooling fluid.
  • This cooling fluid flows past the electronic components (“stack”) connected in series and cools the components. This cooling can take place particularly effectively by means of the described heat sink and the described arrangement.
  • a high cooling effect is achieved by means of cooling ribs that are planar / flat in the axial direction and have a comparatively large surface. These cooling fins are attached to the cylindrical core 6.
  • the core 6 allows sufficient
  • the cooling fins run around the entire (circular) circumference of the
  • the outer surface of the cylinder core 6 is arranged so that the outer surface is evenly provided with cooling fins.
  • Cooling fins can be arranged at a distance of 11.25 °.
  • the cooling fins are hollowed out in the axial direction, thereby increasing the effective surface of the individual cooling fins and the cooling fins flow through them internally with the cooling fluid (in particular, the liquid
  • Isolation medium is) enabled.
  • a slight rotation of the successive cooling bodies of the arrangement against one another has the advantage that the flow of the cooling fluid through the arrangement is improved.
  • the solution described makes it possible to cool the electronic components easily and inexpensively (robust solution). Further measures, such as targeted cooling of individual electronic components (for example with cooling channels arranged in the components) can advantageously be dispensed with.
  • the heat sink, the arrangement and the method can be

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dissipateur thermique (1) pour le refroidissement d'un composant électronique (303). Le dissipateur thermique (1) présente un noyau cylindrique (6) sur lequel sont disposées une pluralité d'ailettes de refroidissement (9) s'étendant radialement. Les ailettes de refroidissement (9) présentent un évidement (12) dans la direction axiale (3).
PCT/EP2019/061849 2019-05-08 2019-05-08 Dissipateur thermique WO2020224777A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/EP2019/061849 WO2020224777A1 (fr) 2019-05-08 2019-05-08 Dissipateur thermique
DE212019000499.7U DE212019000499U1 (de) 2019-05-08 2019-05-08 Kühlkörper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2019/061849 WO2020224777A1 (fr) 2019-05-08 2019-05-08 Dissipateur thermique

Publications (1)

Publication Number Publication Date
WO2020224777A1 true WO2020224777A1 (fr) 2020-11-12

Family

ID=66685561

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/061849 WO2020224777A1 (fr) 2019-05-08 2019-05-08 Dissipateur thermique

Country Status (2)

Country Link
DE (1) DE212019000499U1 (fr)
WO (1) WO2020224777A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230189479A1 (en) * 2021-12-15 2023-06-15 Dell Products L.P. Staggered multi-layer heat exchanger

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2413179A (en) * 1943-09-20 1946-12-24 Westinghouse Electric Corp Radiator
FR1369122A (fr) * 1962-09-06 1964-08-07 Ckd Praha Narodni Podnik Installation de bloc redresseur semi-conducteur
FR1570698A (fr) * 1967-04-25 1969-06-13
EP1081760A2 (fr) * 1999-08-30 2001-03-07 Molex Incorporated Assemblage de refroidissement
EP1117284A2 (fr) * 2000-01-11 2001-07-18 Molex Incorporated Dispositif de retenue pour radiateur, radiateur utilisant ce dispositif
US20030048608A1 (en) * 2001-09-10 2003-03-13 Intel Corporation Radial folded fin heat sinks and methods of making and using same
EP3018709A1 (fr) * 2014-11-04 2016-05-11 SEMIKRON Elektronik GmbH & Co. KG Dispositif de convertisseur

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2413179A (en) * 1943-09-20 1946-12-24 Westinghouse Electric Corp Radiator
FR1369122A (fr) * 1962-09-06 1964-08-07 Ckd Praha Narodni Podnik Installation de bloc redresseur semi-conducteur
FR1570698A (fr) * 1967-04-25 1969-06-13
EP1081760A2 (fr) * 1999-08-30 2001-03-07 Molex Incorporated Assemblage de refroidissement
EP1117284A2 (fr) * 2000-01-11 2001-07-18 Molex Incorporated Dispositif de retenue pour radiateur, radiateur utilisant ce dispositif
US20030048608A1 (en) * 2001-09-10 2003-03-13 Intel Corporation Radial folded fin heat sinks and methods of making and using same
EP3018709A1 (fr) * 2014-11-04 2016-05-11 SEMIKRON Elektronik GmbH & Co. KG Dispositif de convertisseur

Also Published As

Publication number Publication date
DE212019000499U1 (de) 2022-01-12

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