WO2020149127A1 - Laminate manufacturing method and laminate manufacturing device - Google Patents

Abstract

The present invention improves positioning accuracy when a substrate is additionally laminated onto a laminate. This laminate manufacturing method comprises a step for laminating a second substrate onto a first substrate, and a step for laminating a third substrate onto the second substrate laminated on the first substrate, wherein, in the step for laminating the third substrate onto the second substrate, the third substrate is positioned on the basis of the position of the first substrate. The laminate manufacturing method also comprises a step for laminating a second substrate onto a laminate in which a plurality of substrates including a first substrate are laminated, and a step for laminating a third substrate onto the second substrate laminated on the laminate, wherein, in the step for laminating the third substrate onto the second substrate, the third substrate is positioned on the basis of the position of at least the first substrate among the plurality of substrates of the laminate.

Description

Laminated body manufacturing method and laminated body manufacturing apparatus

The present invention relates to a laminated body manufacturing method and a laminated body manufacturing apparatus.

There is a method of manufacturing a laminated body by laminating three or more substrates (for example, refer to Patent Document 1). Substrates that are not adjacent to each other in this laminate may be electrically connected by TSV (Through-Silicon-Via).
Patent Document 1 International Publication No. 2013-011970

However, when stacking three or more substrates while positioning them sequentially, errors that occur each time they are stacked accumulate, making it difficult to electrically connect by TSV.

The first aspect of the present invention includes the steps of laminating the second substrate on the first substrate and laminating the third substrate on the second substrate laminated on the first substrate. In the step of stacking the third substrate on the second substrate, a laminated body manufacturing method for positioning the third substrate based on the position of the first substrate is provided.

In the second aspect of the present invention, the step of stacking the second substrate on the stacked body in which the plurality of substrates including the first substrate are stacked, and the step of stacking the third substrate on the second substrate stacked in the stacked body Stacking the substrates, and positioning the third substrate based on the position of at least the first substrate of the plurality of substrates of the stack in the stacking of the third substrate on the second substrate. A method for manufacturing a laminated body is provided.

According to a third aspect of the present invention, there is provided a method of laminating a second substrate on a laminated body in which a plurality of substrates are laminated, which is a substrate other than the substrate on which the second substrate is laminated. A method for manufacturing a laminate is provided that positions a second substrate based on a position.

In a fourth aspect of the present invention, including a step of stacking a second substrate on a stacked body in which a plurality of substrates are stacked, based on the position of the substrate of the plurality of substrates, which has the highest required accuracy for positioning, A method of making a laminate is provided for positioning a second substrate.

A fifth aspect of the present invention is a laminated body manufacturing apparatus for manufacturing a laminated body by laminating a third substrate on a second substrate laminated on a first substrate. There is provided a laminated body manufacturing apparatus including a positioning unit that positions the third substrate based on the position of the substrate, and a bonding unit that bonds the positioned third substrate to the second substrate.

In a sixth aspect of the present invention, a third substrate is laminated on a second substrate laminated on a laminated body in which a plurality of substrates including a first substrate are laminated to manufacture a laminated body. A laminated body manufacturing apparatus, comprising: a positioning unit that positions the third substrate based on the position of the first substrate; and a bonding unit that bonds the positioned third substrate to the second substrate. A body manufacturing apparatus is provided.

According to a seventh aspect of the present invention, there is provided a laminated body manufacturing apparatus for laminating a second substrate on a laminated body in which a plurality of substrates are laminated, the position of the substrate having the highest required accuracy for positioning among the plurality of substrates. Based on the above, there is provided a laminated body manufacturing apparatus including a positioning unit that positions the second substrate and a joining unit that joins the positioned second substrate to the laminated body.

In an eighth aspect of the present invention, a step of laminating a third substrate on a second substrate laminated on the first substrate, and a step of penetrating at least the third substrate to form the first substrate, the second substrate Forming a through electrode for electrically coupling a substrate and a connection region arranged on a plurality of substrates of the third substrate, wherein the through electrode in the third substrate is formed in the step of forming the through electrode. A method for manufacturing a laminate is provided, in which the position of an electrode is determined based on the position of a first substrate.

In a ninth aspect of the present invention, a step of laminating a second substrate on a laminated body in which a plurality of substrates including a first substrate are laminated, and a step of forming a third substrate on the second substrate laminated in the laminated body. A step of stacking the substrates, and a step of penetrating at least the third substrate and electrically coupling the connection regions arranged on a plurality of the first substrate, the second substrate, and the third substrate. And a step of forming an electrode. In the step of forming a through electrode, a method for manufacturing a stacked body is provided, in which the position of the through electrode in the third substrate is determined based on the position of the first substrate.

In a tenth aspect of the present invention, a step of stacking a plurality of substrates and forming a penetrating electrode that penetrates at least one of the plurality of substrates and electrically couples connection regions arranged on the plurality of substrates. In the step of forming the through electrode, the step of forming the through electrode includes a step of forming the through electrode, and based on the position of the substrate having the highest required accuracy for positioning, the method for manufacturing the stacked body is provided.

The above summary of the invention does not enumerate all the features of the present invention. A sub-combination of these feature groups can also be an invention.

It is a schematic diagram of the substrate laminating apparatus 100. 3 is a schematic plan view of a substrate 210. FIG. It is a schematic cross-sectional view of a joint portion 300. 6 is a flowchart showing an operation procedure of the joining section 300. FIG. 9 is a schematic cross-sectional view showing the operation of the joint portion 300. FIG. 9 is a schematic cross-sectional view showing the operation of the joint portion 300. FIG. 9 is a schematic cross-sectional view showing the operation of the joint portion 300. It is a flow chart showing a procedure in the case of producing layered product 230. It is a figure explaining the positioning method in the laminated body 230. It is a figure explaining the positioning method in the laminated body 230. 6 is a flowchart showing a method of forming a through electrode 801. 7 is a flowchart showing a procedure for positioning the through electrode 801. It is a figure explaining the positioning method of the penetration electrode 801. FIG. 6 is a schematic cross-sectional view of a laminated body 230 having a through electrode 801. It is a figure explaining the positioning method of the penetration electrode 801. FIG. 6 is a schematic cross-sectional view of a laminated body 230 having a through electrode 801. It is a figure explaining the positioning method of the penetration electrode 801. FIG. 6 is a schematic cross-sectional view of a laminated body 230 having a through electrode 801.

The present invention will be described below through embodiments of the invention. The following embodiments do not limit the claimed invention. Not all combinations of the features described in the embodiments are essential to the invention.

FIG. 1 is a schematic plan view of the substrate stacking apparatus 100. The substrate stacking apparatus 100 includes a casing 110, substrate cassettes 120 and 130 arranged outside the casing 110, and a control unit 150, a transfer unit 140 arranged inside the casing 110, a joining unit 300, and a holder. A stocker 400, a pre-aligner 500, and an activation device 900 are provided.

The substrate 210 stacked in the substrate stacking apparatus 100 includes a semiconductor wafer such as a silicon single crystal wafer and a compound semiconductor wafer, and may include a glass substrate, a sapphire substrate, etc. other than the semiconductor wafer. In addition, the laminated body 230 is formed by joining a plurality of substrates 210, and in the following examples, a joined body of two or more layers of the substrates 210 is referred to as a laminated body 230. Therefore, in the process of manufacturing the stacked body 230 including three or more sheets, a temporary stacked body having a smaller number of stacked layers than the stacked body 230 may be formed.

Further, stacking the substrates 210 means bringing the main surfaces of the plurality of substrates 210 into contact with each other, but does not necessarily mean that the relative positions of the substrates 210 are fixed by bonding or the like. In addition, “stack” may be used synonymously with “stack”. On the other hand, joining the substrates 210 means stacking a plurality of substrates 210 and fixing their relative positions by hydrogen bonding, van der Waals bonding, covalent bonding, or the like.

Further, prior to joining the substrates 210, the substrates 210 to be laminated are aligned with the substrate 210 to be laminated or the temporary laminate. In particular, when stacking the substrates 210 on which electronic circuits and the like are formed, after the stacking, electrical connection between the circuits of the substrate 210 to be stacked and the circuits of the substrate 210 to be stacked or the circuits of the temporary stacked body is formed. Are aligned so that

Next, each component of the substrate stacking apparatus 100 will be described. The substrate cassettes 120 and 130 can be individually attached to and detached from the housing 110. One of the substrate cassettes 120 accommodates the substrate 210 or the laminated body 230 to be joined. The other substrate cassette 130 accommodates a laminated body 230 formed by joining the substrates 210 or a laminated body 230 formed by joining the substrates 210 and the laminated body 230.

The transfer unit 140 moves the single substrate 210, the single substrate holder 220, and the stacked body 230 inside the housing 110. In addition, the transfer unit 140 may transfer the substrate 210 or the substrate holder 220 holding the stacked body 230.

The control unit 150 individually controls the operation of each unit of the substrate laminating apparatus 100 and also controls the cooperation between the units in a centralized manner. In addition, the control unit 150 may receive a user's instruction from the outside and may instruct the joining unit 300 to perform a procedure for stacking the substrates 210 and the like. Further, the control unit 150 may include a user interface such as a display unit that displays the operating state of the substrate stacking apparatus 100 toward the outside.

The bonding section 300 has a pair of stages facing each other, and positions the substrate 210 or the laminated body 230 held on each of the stages relative to each other. That is, the joint part 300 plays a role as a positioning part. Here, the holding includes a state in which a force is applied to the substrate 210 or the like to regulate the movement of the substrate 210. Further, the holding may restrict not only the movement of the substrate 210 but also the deformation. Further, releasing the holding includes removing the force acting on the substrate 210 for the purpose of holding the substrate 210.

Positioning also includes arranging the substrate 210 or the laminated body 230 so that an electrical connection to another laminated substrate or the like can be formed. It also includes that the structure of the substrate 210 or the laminated body 230 is arranged to perform the intended function.

The joining portion 300 joins the positioned substrates 210 by bringing them into contact with each other to form a laminated body 230. In addition, the bonding unit 300 bonds the other substrate 210 to the stacked body 230 to form the stacked body 230. Details of the joint 300 will be described later with reference to FIGS. 3 to 7.

The substrate laminating apparatus 100 uses the substrate holder 220 when handling the substrate 210 and the laminated body 230 inside. The substrate holder 220 is made of a hard material such as alumina ceramics and has a holding mechanism such as a vacuum chuck or an electrostatic chuck. The substrate holder 220 uses a holding mechanism to adsorb the substrate 210 or the laminated body 230, and protects the thin and fragile substrate 210 and the like against external impacts and the like.

Further, the substrate holder 220 maintains the shape by imitating the substrate 210 or the laminated body 230 by the holding mechanism so as to follow the shape of the holding surface of the substrate holder 220. Thereby, the flat state of the substrate 210, the laminated body 230, or the like can be maintained, or the slightly warped state can be maintained.

The unused substrate holder 220 is housed in the holder stocker 400 arranged inside the substrate stacking apparatus 100, and is not taken out of the substrate stacking apparatus 100 except for maintenance and replacement. This prevents dust from adhering and prevents the substrate holder 220 itself from being damaged.

The pre-aligner 500 cooperates with the transfer unit 140 to hold the substrate 210 or the laminated body 230 on the substrate holder 220. The pre-aligner 500 is also used when separating the stacked body 230 carried out from the bonding portion 300 from the substrate holder 220.

The activation device 900 activates or cleans the bonding surface of the substrate 210 or the laminated body 230 to be bonded at the bonding portion 300 before the substrate 210 or the laminated body 230 is carried into the bonding portion 300. Here, activation of the substrate 210 means that when the bonding surface of the substrate 210 comes into contact with the bonding surface of another substrate 210, hydrogen bond, van der Waals bond, covalent bond, or the like is generated, and solidification occurs without melting. Including the case where the bonding surface of at least one of the substrates is processed so as to be brought into a phase bonded state. That is, activation includes making dangling bonds (unbonded hands) on the surface of the substrate 210 to facilitate the formation of bonds.

More specifically, in the activation device 900, for example, oxygen gas which is a processing gas is excited in a reduced pressure atmosphere to generate plasma, and oxygen ions are applied to the bonding surfaces of the two substrates. For example, when the substrate is a substrate in which a SiO film is formed on Si, this irradiation of oxygen ions breaks the SiO bond on the substrate surface to be the bonding surface during stacking, resulting in a dangling bond of Si and O. It is formed. Forming such dangling bonds on the surface of the substrate may be referred to as activation.

When a substrate with dangling bonds formed is exposed to the atmosphere, for example, moisture in the air bonds to the dangling bonds and the substrate surface is covered with hydroxyl groups (OH groups). The surface of the substrate is in a state where it is likely to bond with water molecules, that is, a state where it is easily hydrophilized. That is, as a result of activation, the surface of the substrate is likely to become hydrophilic. Further, in solid-phase bonding, the presence of impurities such as oxides at the bonding interface and defects at the bonding interface affect the bonding strength. Therefore, the cleaning of the joint surface may be regarded as a part of activation.

As a method of activating the substrate 210, radical irradiation by DC plasma, RF plasma, MW excited plasma, sputter etching using an inert gas, irradiation of ion beam, high-speed atomic beam, etc. can be exemplified. Further, activation by ultraviolet irradiation, ozone asher, etc. can be exemplified. Further, a chemical cleaning process using a liquid or gas etchant can be exemplified.

Further, the activation of the substrate 210 may be performed by using a hydrophilization device (not shown) to apply pure water or the like to the surface of the substrate 210, which is a bonding surface, to hydrophilize the surface of the substrate 210. By this hydrophilization, the surface of the substrate 210 is in a state in which OH groups are attached, that is, in a state terminated with OH groups. Note that the activation device 900 may be arranged inside the bonding portion 300 to activate or clean the substrate 210 or the stacked body 230 immediately before bonding.

FIG. 2 is a schematic plan view showing an example of the substrate 210. The substrate 210 has scribe lines 217, marks 600, and circuit areas 219. A plurality of marks 600 and circuit areas 219 are provided on the surface of the substrate 210, respectively.

The mark 600 is an example of a structure formed on the surface of the substrate 210, and in the illustrated example, the mark 600 is arranged so as to overlap the scribe lines 217 arranged between the circuit regions 219. As for the mark 600, at least some of the marks 600 are used as an index when positioning the substrate 210 with another substrate 210 or the stacked body 230.

The mark 600 includes a structure used as an index when measuring the relative position in the surface direction with respect to the structure formed on the substrate 210. The mark 600 may be formed as a part of an element or a wiring. Further, the mark 600 may be formed for the purpose of being used as an index, such as a patterned metal layer. Further, the mark 600 is formed not only by a metal layer deposited on the surface of the substrate, but also by a protrusion, a ridge, a step, a groove, a hole, etc. formed by processing the substrate 210 or the laminated body 230 itself. Can be.

Each of the circuit regions 219 includes structures such as elements, wirings, and protective films formed by photolithography technology or the like. Further, the circuit area 219 is also provided with a connecting portion such as a pad or a bump which serves as a connecting terminal when the substrate 210 is electrically connected to another substrate 210, a lead frame or the like. Further, in the circuit region 219, a through electrode may be further provided after the laminated body 230 is formed.

FIG. 3 is a schematic cross-sectional view showing the structure of the joint 300, and shows a state immediately after two substrates 210 are loaded into the joint 300. Here, the case where the substrates 210 are bonded at the bonding portion 300 will be described as an example, but one or both of the bonding targets may be the stacked body 230.

The joining unit 300 includes a frame body 310, a fixed stage 321, and a moving stage 341. The frame 310 has a top plate 311 and a bottom plate 313 which are each horizontal. The fixed stage 321 is fixed downward on the lower surface of the top plate 311 in the drawing, and has a holding mechanism capable of holding the substrate holder 222 holding the substrate 210. The substrate holder 222 held by the fixed stage 321 is carried into the bonding portion 300 so that the bonding surface of the substrate 210 faces downward in the figure, and is also held downward by the fixed stage 321.

In the illustrated example, the substrate holder 222 held by the fixed stage 321 has a shape in which the center of the suction surface for sucking the substrate 210 is raised. As a result, the substrate 210 sucked and held by the substrate holder 222 is also held in a state in which the center thereof protrudes downward in the drawing, following the shape of the holding surface of the substrate holder 222.

On the lower surface of the top plate 311 in the figure, a microscope 322 fixed downward in the figure is arranged beside the fixed stage 321. The microscope 322 can observe the upper surface of the other substrate 210 mounted on the moving stage 341 arranged so as to face the fixed stage 321.

An X-direction drive unit 331, a Y-direction drive unit 332, and a moving stage 341 are stacked and arranged on the upper surface of the bottom plate 313 of the frame 310 in the figure. A substrate holder 220 holding a substrate 210 is held on the upper surface of the moving stage 341 in the figure. In the illustrated example, the substrate holder 220 has a flat suction surface, and the substrate 210 held by the substrate holder 220 is held in a flat state.

The X-direction drive unit 331 moves in parallel with the bottom plate 313 in the direction indicated by the arrow X in the figure. The Y-direction drive unit 332 moves on the X-direction drive unit 331 in parallel with the bottom plate 313 in the direction indicated by the arrow Y in the figure. By combining the operations of the X-direction driving unit 331 and the Y-direction driving unit 332, the moving stage 341 moves two-dimensionally in parallel with the bottom plate 313.

A Z-direction driving unit 333 is further arranged between the Y-direction driving unit 332 and the moving stage 341. The Z-direction drive unit 333 moves the moving stage 341 with respect to the Y-direction drive unit 332 in a direction shown by an arrow Z and perpendicular to the bottom plate 313. As a result, the moving stage 341 is moved up and down. The amount of movement of the moving stage 341 by the X-direction driving unit 331, the Y-direction driving unit 332, and the Z-direction driving unit 333 is controlled with high accuracy using an interferometer or the like.

A microscope 342 is mounted on the upper surface of the Y-direction drive unit 332 in the figure, beside the moving stage 341. The microscope 342 moves together with the Y-direction driving unit 332 to observe the lower surface of the substrate 210 held by the fixed stage 321 and facing downward. The microscopes 322 and 342 each include a light source that emits light that illuminates the mark 600 provided on the substrate 210. The operations of the X-direction drive unit 331, the Y-direction drive unit 332, and the Z-direction drive unit 333 are controlled by the control unit 150.

Note that the control unit 150 pre-calibrates the relative positions of the microscope 322 and the microscope 342 prior to stacking the substrates 210. The calibration of the microscope 322 and the microscope 342 can be performed by, for example, focusing the microscope 322 and the microscope 342 on a common focus F and observing each other. The common standard index may be observed with the microscope 322 and the microscope 342.

FIG. 4 is a flow chart showing a procedure for performing one-time joining using the joining unit 300. Here, an example in which the two substrates 210 are bonded to each other will be described, but one or both of the stacked objects may be the stacked body 230. Further, when the substrates 210 are stacked, the substrates 210 having the same structure may be bonded to each other, or the substrates 210 having different structures may be stacked.

First, the control unit 150 instructs the transfer unit 140 to carry in the two substrates 210 to be stacked into the activation device 900, and activate the bonding surfaces of the substrates 210 (step S101). .. The surface of the activated substrate 210 is brought into a state of being joined by contact without inclusions such as an adhesive agent and processing such as welding and pressure bonding.

The control unit 150 sequentially loads the substrates 210 activated by the activation device 900 into the bonding unit 300 (step S102). Next, as shown in FIG. 5, the control unit 150 uses the microscopes 322 and 342 and the moving stage 341 to measure the position of the mark 600 on the substrate 210 (step S103). That is, since the fixed position of the microscope 322 and the initial position of the microscope 342 are known, it is necessary to move the substrate 210 by moving the moving stage 341 to place the mark 600 at a specific position in the field of view of the microscopes 322, 342. Thus, the absolute position of the mark 600 is measured.

Next, the control unit 150 calculates the relative position of the substrate 210 based on the position of the mark 600 acquired in step S103 (step S104). Further, the control unit 150 calculates the amount of movement of the moving stage 341 required when positioning the substrate 210 based on the calculated relative position of the substrate 210.

The amount of movement required for positioning is, for example, EGA (enhanced global alignment method) performed for each substrate using the mark 600 to calculate the amount of deviation from the design value for each substrate, and the movement stage 341 in the x direction, It is calculated as a movement amount in the y direction and a rotation angle θ. In this way, the control unit 150 becomes ready to position the substrate 210 based on the specified position of the mark 600. The amount of movement required for positioning may be calculated by another known method. For example, the positions of the corresponding marks 600 between the pair of substrates 210 are directly compared to determine the amount of positional deviation between the marks 600. It may be detected and calculated based on this.

Next, the control unit 150 moves the moving stage 341 based on the relative position previously calculated in step S104, and positions the substrates 210 relative to each other as shown in FIG. 6 (step S105). Further, as shown in FIG. 7, the controller 150 operates the Z-direction driver 333 to raise the moving stage 341.

As a result, the substrate 210 rises, and eventually the substrate 210 held by the fixed stage 321 comes into contact with a part of the substrate 210 held by the moving stage 341 in a part of the region protruding downward. The substrate 210 whose surface has been activated is joined by a hydrogen bond, a Van der Waals bond, a covalent bond, or the like in a part of the contacted region. Further, the bonded region is enlarged by the suction force of the substrate 210 itself, and eventually bonded over substantially the entire surface of the substrate 210 (step S106), thereby forming a stacked body 230 in which two substrates 210 are stacked and bonded.

The laminated body 230 formed in this way is carried out from the joint part 300 (step S107). Further, the stacked body 230 is separated from the substrate holder 220 and then housed in the substrate cassette 130.

Note that when the two substrates 210 are hydrogen-bonded by mutual contact, the stacked body 230 is formed and then carried into a heating device such as an annealing furnace to be heated, whereby covalent bonding between the substrates 210 is performed. May be generated. Thereby, the bonding strength between the substrates 210 can be improved.

Next, the control unit 150 checks whether or not there is no substrate 210 to be stacked from the substrate cassette 120 (step S108). When the substrate 210 to be stacked remains (step S108: NO), the control unit 150 returns the procedure to step S101 and repeats a series of stacking procedures from steps S101 to S108. When it is determined in step S108 that there are no more substrates 210 to be stacked (step S108: YES), the control unit 150 ends the control of the bonding unit 300.

In the above example, the fixed stage 321 was made to hold the substrate holder 222 having a suction surface with a raised central portion. However, the substrate holder 222 may be held by the moving stage 341. Further, the suction surface of the substrate holder 222 used for the purpose of bringing a part of the bonding surface of the substrate 210 into contact with each other may have a shape having a curved surface as a whole, or may have a local protrusion. Alternatively, the substrate 210 may be made convex by pressing the substrate 210 with another member penetrating the substrate holder 222 and partially contact the opposing substrate 210.

FIG. 8 is a flowchart showing a procedure for manufacturing a laminated body 230 having three or more layers by using the joining portion 300. The same steps as those in the stacking of the substrate 210 shown in FIG. 4 are designated by the same reference numerals, and the duplicated description will be omitted.

First, the control unit 150 instructs the transport unit 140 to sequentially carry in the substrate 210 to be stacked and the stacked body 230 manufactured by stacking two or more substrates 210 into the activation device 900. The surfaces to be joined in each of the laminated body 230 and the substrate 210 are activated (step S101). The surfaces of the activated laminated body 230 and the substrate 210 are brought into contact with each other by contact without inclusions such as an adhesive, and without processing such as welding and pressure bonding.

Next, the control unit 150 carries the laminated body 230 into the joining unit 300 as one of the objects to be laminated (step S201). Next, the control unit 150 selects the mark 600 to be used for this stacking from the marks 600 included in the stacked body 230 carried in at step S201 (step S202). It should be noted that the mark 600 to be used may be selected after the laminated body 230 is loaded into the joining part 300, or the mark 600 selected in advance before being loaded into the joining part 300 may be designated. The selection of the mark 600 will be described later.

Next, the control unit 150 measures the position of the mark selected to be used among the marks 600 of the laminated body 230 (step S203). The control unit 150 holds the measurement result. Then, the substrate 210 is positioned with respect to the stacked body 230 by the same steps as step S102 to step S106 shown in FIG. 4, and the stacked body 230 having an increased number of layers is manufactured.

In addition, the control unit 150, after the stacked body 230 having the increased number of layers by stacking is once carried out from the bonding section 300 (step S107), determines whether or not there are other stacked bodies 230 and substrates 210 to be stacked. Check (step S108). When the stacked body 230 and the substrate 210 remain (step S108: NO), the control unit 150 returns the procedure to step S101, and repeats the series of steps S101 to S108.

When it is determined in step S108 that there is no more substrate 210 to be stacked (step S108: YES), the control unit 150 ends the control of the bonding unit 300. However, when there is a plan to stack another stacked body 230 or substrate 210 on the stacked body 230 having the increased number of layers in the procedure shown in FIG. 8, the control unit 150 measures and holds in step S203. The information regarding the position of the mark 600 being processed may be retained and reused in the next stacking.

The laminated body 230 in which the number of layers formed by laminating the laminated body 230 and the substrate 210 is increased may further be laminated with another substrate 210 or the laminated body 230. However, when the bonding between the stacked body 230 and the substrate 210 is hydrogen-bonded, as in the case where two substrates 210 are stacked each time they are stacked, they are carried into a heating device such as an annealing furnace and heated. By doing so, a covalent bond is generated between the substrates 210 and the bonding strength can be improved. In addition, after each stack, a post-treatment process such as a thinning process by polishing, a wiring layer forming process, or a surface flattening process is performed on either of the stacked body 230 and the substrate 210 that are already stacked. May be.

As described above, the substrate stacking apparatus 100 can be used to manufacture the laminated body 230 in which three or more substrates are laminated. As the laminate 230 having three or more layers, for example, an imaging device formed by laminating a CIS (Cmos-Image-Sensor) substrate, a LOGIC substrate, and a DRAM (Dynamic-Random-Access-Memory) substrate can be exemplified.

FIG. 9 is a diagram for explaining the positioning method in step S105 of the procedure shown in FIG. The illustrated laminated body 230 is formed by laminating a plurality of substrates 211, 212, 213 and 214, each of which corresponds to the substrate 210.

More specifically, in the laminated body 230, first, the two substrates 211 and 212 are laminated to form the laminated body 231, and then the substrate 213 is laminated to the laminated body 231 to form the laminated body 232. The substrate 214 is repeatedly formed by stacking. Marks 601, 602, 603, and 604 are provided on each of the substrates 211, 212, 213, and 214. The substrates 211, 212, 213, 214 are positioned based on the positions of the marks 601, 602, 603, 604.

In the illustrated example, each of the substrates 212, 213, and 214 is positioned with reference to the mark 601 of the substrate 211 located at the bottom layer in the drawing as a positioning reference. In other words, in the illustrated laminated body 230, the lowermost substrate 211 in the drawing is first laminated with the other substrate 212.

As a result, since all of the substrates 212, 213, and 214 are positioned with the position of the mark 601 on the substrate 211 as a reference, not only the substrates located immediately below each other, but also other substrates that are not adjacent to each other. The substrate is also positioned with a certain accuracy. Therefore, for example, even when the positioning error component has a common tendency, the positional deviation of the upper-layer substrate 214 with respect to the lower-layer substrate 211 is prevented from increasing due to stacking.

In the joining part 300, the position of the mark 601 is measured when the lowermost substrate 211 or the laminated body 230 is carried in, and the measurement result is held by the control part 150, as in step S203 shown in FIG. Has been done. Therefore, the control unit 150 may measure the position of the mark 601 on the substrate 211 and position the other substrates 213 and 214 even after the other substrates 212, 213, and 214 are stacked on the substrate 211.

Further, as shown in FIG. 9, the marks 601, 602, 603, 604 are arranged at different positions in the plane direction of the substrates 211, 212, 213, 214. Accordingly, even after the substrates 213 and 214 are stacked, the position of the lower layer mark 601 can be measured without being obstructed by the upper layer marks 602, 603, and 604.

Note that, for example, the position of the mark 601 on the substrate 211 on the lower layer can be measured through the substrate 212 by illumination with visible light when the substrate 212 and the like on the upper layer are thin. Further, even when the upper substrate 212 is not thinned, or even when the plurality of substrates 212, 213, 214 overlap and cannot transmit visible light, for example, by illuminating the mark 601 with infrared rays, The position of the mark 601 in the lower layer can be measured through the substrates 212, 213, and 214 stacked on the substrate 211. That is, the light source that detects at least the position of the stacked body 230 of the microscopes 322 and 342 emits light that passes through the substrates stacked on the substrate 211.

Further, in the substrates 211, 212, 213, and 214, when the base substrate side is the back surface and the surface on which elements, circuits, etc. are formed is the front surface, when the substrate 210 or the stacked body 230 is stacked, the front and back directions are Not all are in line. Therefore, in some cases, all of the marks 601, 602, 603, and 604 formed on the surfaces of the substrates 211, 212, 213, and 214 are located inside the stacked body 230. However, even in such a case, if the substrate 214 located on the surface of the laminated body 230 is thinned, at least the position of the mark 604 on the substrate 214 can be measured by illumination with visible light. Further, the positions of the marks 602 and 603, which are located on the inner side and located in the deep part where visible light does not pass, can be measured by illumination with infrared rays or the like.

FIG. 10 is a diagram illustrating another method for positioning the upper-layer substrates 213 and 214 in the stacked body 230. In the illustrated example, the control unit 150 stores an error that occurs when the substrate 212 is stacked on the substrate 211. The error includes the relative positions of the marks 601 and 602 corresponding to each other between the substrate 211 and the substrate 212. When the substrate 213 is positioned, the position of the mark 602 on the substrate 212 forming the uppermost layer of the stacked body 231 is measured, and the error stored by the control unit is added to the position of the mark 602 measured as the correction amount. , The substrate 213 is positioned with respect to the mark 602 on the substrate 212. Thereby, the substrate 213 can be aligned with the substrate 212 via the mark 602 of the substrate 212 with the position of the mark 601 of the substrate 211 as a reference.

In addition, even when the control unit 150 holds the error of the substrate 213 with respect to the substrate 212 after the substrates 213 are joined and the substrates 214 are laminated, the mark 603 located on the surface of the laminated body 232 was measured. The error can be corrected above to position the substrate 214. By repeating such a procedure, the initial positioning accuracy can be maintained even when the number of stacked layers of the stacked body 230 increases.

FIG. 11 is a flow chart showing the process of forming the through electrode. The through electrode is formed for the purpose of electrically interconnecting the connection regions formed on the plurality of substrates 211, 212, 213, and 214 forming the stacked body 230. First, through holes are formed from the surface of the substrate 211, 212, 213, 214 in the direction intersecting the surfaces of the substrates 211, 212, 213, and 214 forming the stack 230 (step S301).

Next, the inside of the formed through hole is covered with an insulating layer that insulates the substrate 214, which is a semiconductor, from the metal forming the through electrode (step S302). Prior to forming the insulating layer, a layer of nitride or the like may be formed to prevent copper from diffusing into the substrate 214.

Next, after covering the entire surface of the substrate 214 including the inside and outside of the through hole with a plating layer made of a conductive material such as metal, the surface of the substrate 214 is polished to remove the plating layer outside the through hole (step S303). Thus, the metal remaining inside the through hole forms a through electrode penetrating the substrate 214 in the thickness direction.

In the above-described through electrode forming process, by forming through holes that penetrate the lower-layer substrates 213 and 212, the through-electrodes can reach the lower-layer substrates 211, 212, and 213. Therefore, by providing the connection terminals to the substrates 211, 212, 213 and 214 at the positions where the penetration electrodes penetrate the substrates 212, 213 and 214, the penetration electrodes and the circuits on the substrates 211, 212, 213 and 214 are electrically connected. Of the plurality of substrates 211, 212, 213, and 214 to form an electronic circuit having a three-dimensional structure. In addition, a semiconductor device having more functions can be formed by combining substrates having different manufacturing processes.

FIG. 12 is a flowchart showing a procedure for positioning the position of the through electrode on the surface of the laminated body 230. Steps which are the same as those of the manufacturing process of the laminated body 230 shown in FIGS. 4 and 8 are denoted by the same reference numerals, and duplicate description is omitted.

The control unit 150 measures the positions of the marks 601, 602, 603, and 604 in the process of manufacturing the laminated body 230 having three or more layers from step S101 to step S108 (step S103). When steps S101 to S106 in the joint 300 are completed, the manufactured laminated body 230 is unloaded from the joint 300 (step S107) and sent to the post-treatment process (step S401). Here, the post-treatment process is a post-treatment such as an annealing treatment for the stacked body 230, a thinning process by polishing, a wiring layer forming process, and a surface flattening process, as described above with respect to the process shown in FIG. Including steps. The through electrode is formed on the stacked body 230 that has undergone the post-treatment process.

The formation of the through electrode starts from the step of forming the through hole at the position where the through electrode is formed, as described above with reference to FIG. Here, inside the stacked body 230, the connection region including the pattern formed of the conductive material and provided on each of the substrates 211, 212, 213, and 214 is not necessarily arranged at the designed position. Therefore, the substrates 211, 212, 213, and 214 are not necessarily arranged at the same position in the surface direction. Therefore, in step S301 of forming the through electrode, the device used for forming the through hole so that the through electrode comes into contact with the plurality of connection regions of the substrates 211, 212, 213, 214 to be connected, For example, the exposure apparatus in the photolithography equipment determines the position where the through hole is arranged on the surface of the uppermost substrate 214.

In this embodiment, the position of the through electrode is determined based on the relationship between the positions of the marks 601, 602, 603, 604 and the connection area. Information necessary for calculating the positions of the through holes can be collected in the process of determining the positions of the substrates 211, 212, 213, and 214 to form the laminated body 230 at the joint portion 300. That is, the control unit 150 of the joining unit 300 measures the positions of the marks 601, 602, 603, and 604 in step S103 described above.

Further, the relative positions of the marks 601, 602, 603, 604 and the connection regions 701, 702, 703, 704 on each of the substrates 211, 212, 213, 214 are determined at the design stage of the substrates 211, 212, 213, 214. Is understood in. Further, the relative position does not substantially change regardless of the process for each of the substrates 211, 212, 213, and 214. Therefore, the control unit 150 of the joining unit 300 transmits information regarding the positions of the marks 601, 602, 603, and 604 to the exposure apparatus (step S402), and the exposure apparatus uses the information acquired from the joining unit 300. Based on this, the relative positions of the marks 601, 602, 603, 604 can be grasped.

Next, the exposure apparatus measures the position of the mark 604 of the substrate 214 located on the surface of the stacked body 230 (step S403), and thus the marks of the other substrates 211, 212, and 213 located inside the stacked body 230 are measured. The positions of 601, 602, and 603 are calculated (step S404). Further, the exposure apparatus determines the position where the penetrating electrode is arranged based on the positions of the marks 601, 602, 603, 604 (step S405).

The positions of the connection regions 701, 702, 703, 704 may be measured instead of the positions of the marks 601, 602, 603. Further, the connection regions 701, 702, 703, 704 themselves may be used as the marks 601, 602, 603 for measuring the positions of the substrates 211, 212, 213, 214.

FIG. 13 is a diagram showing one of methods for determining the position of the through electrode 801 in the laminated body 230. The plurality of substrates 211, 212, 213, and 214 forming the stacked body 230 have a plurality of connection regions 701, 702, 703, and 704, respectively, and have different required accuracy for positioning the through electrode 801.

In the illustrated example, the board 213 having a large number of connection areas 703 has high accuracy required for positioning. Further, the substrates 211 and 212 having a small number of connection regions 701 and 702 indicate that the required accuracy for positioning is low.

When determining the position of the through electrode 801 in the stacked body 230 as described above, the positioning of the through electrode 801 with a high required accuracy for positioning is emphasized rather than the positioning with respect to the substrates 211 and 212 with a low required accuracy for positioning. The position of the electrode 801 is determined. More specifically, when the through electrode 801 is to be positioned, of the connection regions 701, 702, 703, and 704 of each of the substrates 211, 212, 213, and 214, all the connection regions to which the through electrode 801 should be connected. The position of the through electrode 801 is calculated by performing statistical processing such as enhanced global alignment for the position of each connection region 701, 702, 703, 704 so that the error of the through electrode 801 is minimized.

In this way, when there is a difference in the required accuracy for positioning the substrates 211, 212, 213, and 214, the respective substrates 211, 212, 213, and 214 are weighted according to the required precision and statistical processing is executed. May be. As a result, the position of the through electrode 801 can be calculated with high accuracy for the substrate 213 with high required accuracy and with low accuracy for the substrates 211, 212 with low required accuracy. As a result, it is possible to satisfy the required accuracy for each of the substrates 211, 212, 213, and 214 while reducing the load of the resource used when calculating the position.

The positions of the marks 601, 602, 603, and 604 have already been measured by the control unit 150. Further, the positions of the marks 601, 602, 603, 604 on each of the substrates 211, 212, 213, 214 and the relative positions of the connection regions 701, 702, 703, 704 are the same as those of the substrates 211, 212, 213, 214. It is known from the time of design. Therefore, the exposure apparatus or the like that obtains these pieces of information measures the position of the mark 604 of the substrate 214 located on the surface of the stacked body 230 to thereby obtain the connection regions 701 and 702 of the other substrates 211, 212, and 213. , 703 can be grasped. Thereby, in the exposure apparatus, the position of the through electrode 801 can be calculated by individually weighting each of the substrates 211, 212, 213, and 214.

Further, the weighting according to the required accuracy of each of the substrates 211, 212, 213, and 214 is made more remarkable, and the position of the connection region 701 on the substrate 211 having the lowest required accuracy is excluded from the target of the above statistical processing. However, there are cases where it does not matter. In this case, the resources for executing the processing can be concentrated on the processing of the substrate 213 with high required accuracy.

FIG. 14 shows a state in which the through electrode 801 is formed at the position determined as described above. As shown in the figure, since the through electrode 801 is positioned by emphasizing not the substrate 214 located on the surface of the laminated body 230 but the substrate 213 having a high required accuracy for positioning, the strict required accuracy of the substrate 213 is satisfied, and the laminated body is satisfied. The yield of 230 as a semiconductor device is improved.

The above method can also be applied to the case where the laminated body 230 is a laminated body of two substrates. That is, the through electrode 801 may be positioned based on the position of the one of the two substrates forming the stacked body 230 that has the higher required accuracy.

FIG. 15 is a diagram showing another method of positioning the through electrode 801 in the laminated body 230. Each of the plurality of substrates 211, 212, 213, and 214 forming the stack 230 has marks 601, 602, 603, and 604, respectively, and connection regions 701, 702, 703, and 704.

As described above, the positions of the marks 601, 602, 603, 604 on the substrates 211, 212, 213, 214 have already been measured by the control unit 150. Further, the positions of the marks 601, 602, 603, 604 on each of the substrates 211, 212, 213, 214 and the relative positions of the connection regions 701, 702, 703, 704 are the same as those of the substrates 211, 212, 213, 214. It is known from the time of design.

Therefore, the exposure apparatus or the like that obtains these pieces of information measures the positions of the marks 604 on the substrate 214 located on the surface of the laminated body 230 to obtain the substrates 211, 212 that do not appear on the surface of the laminated body 230. The positions of the marks 601 602 603 of 213 can be grasped. Further, from the positions of the marks 601, 602, 603, 604, the respective gravity center positions G ₁ , G ₂ , G ₃ , G _{4 of} the marks 601, 602, 603, 604 can be known. By calculating the position of the center of gravity G ₀ with respect to all of the connection regions 701, 702, 703, and 704 using these center of gravity positions G ₁ , G ₂ , G ₃ , and G ₄ , the penetration is performed based on the position of the center of gravity G _0. The position of the electrode 801 can be determined.

That is, the center of gravity for the entire marks 601, 602, 603, 604 is calculated from the centers of gravity G ₁ , G ₂ , G ₃ , G ₄ of the marks 601, 602, 603, 604 of the respective substrates 211, 212, 213, 214. To do. The positions shifted from the connection region 704 of the uppermost layer substrate 214 by the shift amount from the mark 604 of the uppermost layer substrate 214 to the center of gravity of the whole are connected regions 701, 702 of the stacked substrates 211, 212, 213, 214. , 703, 704 as the center of gravity G ₀ .

In the laminated body 230, each of the substrates 212, 213 and 214 is positioned with reference to the position of the mark 601 on the substrate 211. In this case, the substrates 211, 212, 213, and 214 are aligned so that the through electrode 801 passing through the center of gravity G ₀ of the entire connection region contacts the connection region of each substrate. In other words, the positioning accuracy of the stacked substrates 212, 213, and 214 with respect to the substrate 211, that is, the allowable range of the positional deviation, the diameter or width of the through electrode 801, and the shape of the connection regions 701, 702, 703, and 704. Based on the width and the space and the intervals of the connection regions 701, 702, 703, and 704 on the substrates 211, 212, 213, and 214, the through electrode 801 passing through the center of gravity G ₀ of the entire connection region of each substrate is provided with the accuracy. Determine to contact the connection area.

The substrates 212, 213, and 214 are positioned and stacked on the substrate 211 with the above accuracy. As a result, in the stacked body 230, by arranging the position of the through electrode 801 at the center of gravity G ₀ of the entire connection region, the through electrode 801 is connected to at least a part of the connection regions 701, 702, 703, 704.

FIG. 16 shows a state in which the through electrode 801 is formed at the position determined as described above. As illustrated, since the through electrode 801 is positioned at the center of gravity of the connection regions 701, 702, 703, and 704 connected to the through electrode 801 instead of the substrate 214 located on the surface of the stacked body 230, all the connection regions 701 are formed. , 702, 703, 704 are connected to the through electrode 801. As a result, the yield of the stacked body 230 as a semiconductor device is improved.

FIG. 17 is a diagram showing still another method of positioning the through electrode 801 in the laminated body 230. Each of the plurality of substrates 211, 212, 213, and 214 forming the stack 230 has marks 601, 602, 603, and 604, respectively, and connection regions 701, 702, 703, and 704. The through electrode 801 is required to be connected to all the connection regions 701, 702, 703, 704 provided on the substrates 211, 212, 213, 214.

However, in the laminated body 230, the connection regions 701 and 704 of the lowermost substrate 211 and the uppermost substrate 214 and the connection regions 702 and 703 of the intermediate two-layered substrates 212 and 213 do not overlap at all. Therefore, in the laminated body 230, the connection regions 701 and 704 and the connection regions 702 and 703 are formed at positions spaced apart from each other in the plane direction with the interval B.

Here, the control unit 150 grasps the positions of the marks 601, 602, and 603 of the substrates 211, 212, and 213 that do not appear on the surface of the laminated body 230, and thus the substrates 212 and 213 located inside the laminated body 230. The positions of the connection areas 702 and 703 can be individually grasped. As a result, the position of the through electrode 801 can be calculated by individually weighting each of the substrates 211, 212, 213, and 214.

On the other hand, in the stacking direction of the substrates 211, 212, 213, and 214, the control unit 150, on the condition that a part of all the connection regions 701, 702, 703, and 704 and the through electrode 801 overlap each other, The position of the electrode 801 is determined. FIG. 18 is a diagram showing a laminated body 230 including the through electrode 801 formed at the determined position. As illustrated, all of the connection regions 701, 702, 703, and 704 that are separated in the plane direction are connected to the through electrode 801. Also in this embodiment, the diameter or width of the through electrode 801, the shape and width of the connection regions 701, 702, 703, 704, and the connection regions 701, 702, 703, 704 on the substrates 211, 212, 213, 214. The substrates 211, 212, 213, and 214 are aligned so that the through electrodes 801 come into contact with the connection regions 701, 702, 703, and 704 based on the intervals.

Although the present invention has been described using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is apparent to those skilled in the art that various modifications and improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

In the above example, the center of gravity G ₀ for the entire connection regions 701, 702, 703, 704 was calculated from the positions of the marks 601, 602, 603, 604, but from the positions of the marks 601, 602, 603, 604, or The center of gravity of each of the connection regions 701, 702, 703, 704 is calculated from the positions of the connection regions 701, 702, 703, 704, and the center of gravity G ₀ for the entire connection regions 701, 702, 703, 704 is calculated based on this. It may be calculated.

Further, in the above-described example, when positioning the substrates 213 and 214 of the third layer or more, when positioning, the substrate 211, 212 to be stacked is the uppermost layer in the figure, and the substrate 213 is directly stacked. The substrates 213 and 214 are positioned with reference to the mark 601 of the substrate 211, which is the lowest layer in the figure and has a surface on which one substrate is not laminated with the other substrate, instead of the substrate 212. However, the substrates 213 and 214 to be stacked may be positioned with reference to the mark 602 of the substrate 212, which is the second lowest layer in the drawing, other than the substrate 211 of the lowermost layer.

In particular, for example, when the board 213, which is the third layer from the bottom in the drawing in the stack 230, is electrically connected to the boards 211 and 212, when the board 213 is stacked on the stack 231, The substrate 213 may be positioned based on the positions of the marks 601 and 602 on both the substrate 211 and the substrate 212. In this case, the relative position between the mark 601 on the substrate 211 and the mark 602 on the substrate 212 is stored in advance, and the stored relative position and the laminated body are stored with respect to the temporary laminated body 231 formed by the substrates 211 and 212. The substrate 213 may be positioned based on the position of the mark on the substrate 213 with the position of the mark 602 measured on the surface of the substrate 231 as a reference.

Further, in the case where the substrate 214, which is the fourth layer from the bottom in the drawing in the stacked body 230, is electrically connected to any of the plurality of substrates 211, 212, and 213 forming the stacked body 232. When stacked on the substrate 232, the substrate 214 may be positioned with reference to the mark of the electrically connected substrate. Further, when electrically connecting the substrate 214, which is the fourth layer, to two or more substrates out of the plurality of substrates 211, 212, and 213 forming the laminated body 232. When stacking, the substrates 214 may be positioned with reference to the respective marks of the two or more substrates. In this case, the relative position between the mark of the substrate forming the uppermost layer of the laminated body on which the substrate 214 is laminated and the mark of the substrate electrically connected to the substrate 214 is stored, and the relative position is measured. The substrate 214 may be positioned based on the position of the mark on the uppermost layer substrate and the position of the mark on the substrate 214.

As described above, in the alignment between the substrates electrically connected via the through electrode 801 and the like, the laminate 230 is electrically connected not in the lowermost substrate 211 in the drawing, but in the laminate 230. The marks 602 and 603 on the substrates 212 and 213 may be used as a reference. Thereby, in the laminated body 230, good electrical connection between the substrates can be obtained.

The joining unit 300 may position the next substrate 214 to be stacked based on the position of the substrate that has the highest required accuracy for positioning among the plurality of substrates 211, 212, and 213 that form the stacked body 232. In this case, among the plurality of substrates 211, 212, and 213 forming the laminated body 232, the substrate 214 to be laminated next may be positioned with reference to the mark of the substrate having the highest required accuracy for positioning. An example of a board having a high required accuracy for positioning is a board having a large number of connection regions to be connected to another board, as shown in FIG. Another example of the board having a high required accuracy for positioning is a board having a small connection area to be connected to another board.

When stacking a plurality of substrates with different required accuracy, it is preferable to join the boards with the highest required accuracy in order from the plurality of stacked boards. Every time the substrates are stacked, strain is accumulated in the entire stack. Therefore, it may be difficult to position the laminated body in which the number of laminated layers of the substrate is already large and the strain is accumulated, with the accuracy required by the highly demanded substrate. On the other hand, even in a laminated body in which the number of laminated substrates has already increased and strain has accumulated, it may be possible to perform positioning with the required precision if the substrate has a low required precision. Therefore, it is preferable that the substrates with high required accuracy have a small strain accumulation, that is, they are stacked in the earliest possible order. Further, when laminating a plurality of laminated bodies in which the plurality of substrates are laminated in order from the highest demanded accuracy, the substrates having the highest required accuracy among the plurality of substrates constituting each laminated body are faced to each other and aligned, Preferably.

The board laminating apparatus 100 may be provided with a joint capable of performing highly accurate lamination and a joint having a lower precision than the joint. Alternatively, a substrate laminating apparatus having a joining portion capable of highly accurate laminating and a substrate laminating apparatus having a joining portion having a lower joining accuracy may be used. As a result, high-accuracy joints are used to stack substrates with high required accuracy, and low-precision joints are used to stack substrates with low required accuracy.

Further, in the above-described example, the through electrode 801 is connected to all the connection regions 701, 702, 703, 704 of the four stacked substrates 211, 212, 213, 214. However, when connecting the connection regions of three or less of the stacked substrates 211, 212, 213, and 214 with the through electrode 801 or the like, each of the plurality of substrates having the connection region connected by the through electrode 801 is connected. The center of gravity of each connection region or each mark is calculated from the position of the mark or based on the position of each of the plurality of connection regions to be connected, and based on this, the center of gravity G for the entire connection region to be connected is calculated. You may calculate ₀ .

The execution order of each process such as the operation, procedure, step, and step in the devices, systems, programs, and methods shown in the claims, the description, and the drawings is "preceding" or "prior to". It should be noted that the output of the previous process can be realized in any order unless it is used in the subsequent process. Even if the description of the claims, the description, and the operation flow in the drawings is made by using “first,” “next,” etc. for convenience, it means that it is essential to carry out in this order. is not.

100 substrate stacking device, 110 housing, 120, 130 substrate cassette, 140 transport unit, 150 control unit, 210, 211, 212, 213, 214 substrate, 217 scribe line, 219 circuit area, 220, 222 substrate holder, 230, 231, 232 laminate, 300 joint, 310 frame, 311 top plate, 313 bottom plate, 321, fixed stage, 322, 342 microscope, 331 X-direction drive unit, 332 Y-direction drive unit, 333 Z-direction drive unit, 341 movement Stage, 400 holder stocker, 500 pre-aligner, 600, 601, 602, 603, 604 mark, 701, 702, 703, 704 connection area, 801, penetrating electrode, 900 activation device

Claims (23)

Stacking a second substrate on the first substrate;
Stacking a third substrate on the second substrate stacked on the first substrate;
Including
A method of manufacturing a laminate, wherein, in the step of stacking the third substrate on the second substrate, the third substrate is positioned based on the position of the first substrate. Stacking a second substrate on a stacked body in which a plurality of substrates including a first substrate are stacked,
Stacking a third substrate on the second substrate stacked on the stack;
Including
Laminate manufacturing for positioning the third substrate based on at least the position of the first substrate among the plurality of substrates of the laminate in the step of stacking the third substrate on the second substrate. Method. The said 1st board|substrate is a board|substrate which comprises a lowermost layer, when the board|substrate with which the said 2nd board|substrate is laminated among the said several board|substrate of the said laminated body is made into the uppermost layer. Body manufacturing method. The laminate manufacturing method according to claim 2 or 3, further comprising positioning the third substrate with respect to a substrate in which a relative position with respect to the first substrate is stored among the plurality of substrates of the laminate. Method. The method for manufacturing a laminate according to any one of claims 1 to 4, further comprising a step of electrically connecting the third substrate to the first substrate. A method for laminating a second substrate on a laminated body in which a plurality of substrates are laminated,
A laminated body manufacturing method for positioning the second substrate based on the position of a substrate other than the substrate on which the second substrate is laminated among the plurality of substrates. Laminating a second substrate on a laminate of a plurality of substrates,
A method for manufacturing a laminate, wherein the second substrate is positioned based on the position of the substrate having the highest accuracy required for positioning among the plurality of substrates. A laminated body manufacturing apparatus for manufacturing a laminated body by laminating a third substrate on a second substrate laminated on a first substrate, comprising:
A positioning unit that positions the third substrate based on the position of the first substrate;
A joint for joining the positioned third substrate to the second substrate;
A laminated body manufacturing apparatus including. A laminated body manufacturing apparatus for manufacturing a laminated body by laminating a third substrate on a second substrate laminated on a laminated body in which a plurality of substrates including a first substrate are laminated,
A positioning unit that positions the third substrate based on the position of the first substrate;
A joint for joining the positioned third substrate to the second substrate;
A laminated body manufacturing apparatus including. The positioning unit further includes a detection unit that detects a mark provided on the first substrate, and the detection unit includes a light source that emits light that can pass through the substrates stacked on the first substrate. The laminated body manufacturing apparatus according to claim 8. The said positioning part positions the said 3rd board|substrate with respect to the said 2nd board|substrate based on the relative position of the said 2nd board|substrate with respect to the position of the said 1st board recorded previously. The laminated body manufacturing apparatus according to any one of claims. A laminated body manufacturing apparatus for laminating a second substrate on a laminated body in which a plurality of substrates are laminated,
A positioning unit that positions the second board based on the position of the board having the highest required accuracy for positioning among the plurality of boards;
A joint for joining the positioned second substrate to the laminate,
A laminated body manufacturing apparatus including. Stacking a third substrate on the second substrate stacked on the first substrate;
Forming a penetrating electrode that penetrates at least the third substrate and electrically couples the connection regions arranged on a plurality of the first substrate, the second substrate, and the third substrate. Stage
Including
A method of manufacturing a laminate, wherein, in the step of forming the through electrode, the position of the through electrode on the third substrate is determined based on the position of the first substrate. Stacking a second substrate on a stacked body in which a plurality of substrates including a first substrate are stacked,
Stacking a third substrate on the second substrate stacked on the stack;
Forming a penetrating electrode that penetrates at least the third substrate and electrically couples the connection regions arranged on a plurality of the first substrate, the second substrate, and the third substrate. Stage
Including
A method of manufacturing a laminate, wherein, in the step of forming the through electrode, the position of the through electrode on the third substrate is determined based on the position of the first substrate. The laminated body manufacturing method according to claim 13 or 14, wherein the position of the through electrode on the third substrate is determined based on the center of gravity of the connection regions arranged on the plurality of substrates connected to the through electrode. .. The error of the position of the through electrode with respect to each of the position specified based on the mark arranged on the first substrate and the position specified based on the mark arranged on the second substrate is statistically minimum. The method for manufacturing a laminated body according to claim 13 or 14, further comprising the step of positioning the through electrode at a position where Weighting is applied to the position designated based on the mark arranged on the first substrate and the position designated based on the mark arranged to the second substrate based on the required accuracy for each mark. 17. The method for manufacturing a laminated body according to claim 16, further comprising the step of calculating a position where the error of the position of the through electrode with respect to the position of each mark is statistically minimized. Stacking a plurality of substrates,
Forming at least one through electrode penetrating at least one of the plurality of substrates and electrically coupling connection regions arranged on the plurality of substrates;
Including
A method for manufacturing a laminate, wherein, in the step of forming the through electrode, the position of the through electrode is determined based on the position of the substrate having the highest required accuracy for positioning among the plurality of substrates. The position of the through electrode, in the stacking direction of the plurality of substrates, provided that a part of all the connection regions connected to the through electrode and the through electrode are overlapped with each other, The method for manufacturing a laminate according to claim 18, wherein the position is determined. The laminated body manufacturing method according to claim 7 or 18, wherein among the plurality of substrates, the substrate having the largest number of connection regions connected to other substrates is the substrate having the highest required accuracy. The method for manufacturing a laminated body according to claim 7 or 18, wherein, of the plurality of substrates, a substrate having a smallest connection region size to be connected to another substrate is a substrate having the highest required accuracy. The laminated body manufacturing apparatus according to claim 12, wherein among the plurality of substrates, the substrate having the largest number of connection regions connected to other substrates is the substrate having the highest required accuracy. The laminated body manufacturing apparatus according to claim 12, wherein among the plurality of substrates, the substrate having the smallest size of the connection region to be connected to another substrate is the substrate having the highest required accuracy.

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