WO2019157307A1 - Solution-based additive manufacturing - Google Patents
Solution-based additive manufacturing Download PDFInfo
- Publication number
- WO2019157307A1 WO2019157307A1 PCT/US2019/017248 US2019017248W WO2019157307A1 WO 2019157307 A1 WO2019157307 A1 WO 2019157307A1 US 2019017248 W US2019017248 W US 2019017248W WO 2019157307 A1 WO2019157307 A1 WO 2019157307A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ink
- volatile solvent
- compound
- solvent compound
- polymer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 57
- 239000000654 additive Substances 0.000 title claims abstract description 55
- 230000000996 additive effect Effects 0.000 title claims abstract description 54
- 150000001875 compounds Chemical class 0.000 claims abstract description 275
- 239000002904 solvent Substances 0.000 claims abstract description 189
- 229920000642 polymer Polymers 0.000 claims abstract description 188
- 238000000034 method Methods 0.000 claims abstract description 132
- 239000007788 liquid Substances 0.000 claims abstract description 51
- 239000007787 solid Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims description 63
- 238000001704 evaporation Methods 0.000 claims description 60
- 230000008859 change Effects 0.000 claims description 42
- 230000008020 evaporation Effects 0.000 claims description 38
- 239000012456 homogeneous solution Substances 0.000 claims description 38
- 239000010935 stainless steel Substances 0.000 claims description 12
- 229910001220 stainless steel Inorganic materials 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000011247 coating layer Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 5
- 238000009738 saturating Methods 0.000 claims description 5
- 239000013557 residual solvent Substances 0.000 claims description 4
- 238000000137 annealing Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 239000000976 ink Substances 0.000 abstract description 240
- 239000000203 mixture Substances 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 9
- 229920001002 functional polymer Polymers 0.000 abstract description 3
- 230000007704 transition Effects 0.000 abstract description 2
- 239000012071 phase Substances 0.000 description 82
- -1 polyoxymethylene Polymers 0.000 description 36
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 26
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 18
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 13
- 238000010587 phase diagram Methods 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229920002554 vinyl polymer Polymers 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 229920002301 cellulose acetate Polymers 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 238000001330 spinodal decomposition reaction Methods 0.000 description 4
- 238000010146 3D printing Methods 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 229940113088 dimethylacetamide Drugs 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000006193 liquid solution Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920002480 polybenzimidazole Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000013316 polymer of intrinsic microporosity Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920001021 polysulfide Polymers 0.000 description 2
- 239000005077 polysulfide Substances 0.000 description 2
- 150000008117 polysulfides Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- DQEFEBPAPFSJLV-UHFFFAOYSA-N Cellulose propionate Chemical compound CCC(=O)OCC1OC(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C1OC1C(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C(COC(=O)CC)O1 DQEFEBPAPFSJLV-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004801 Chlorinated PVC Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- 229920000965 Duroplast Polymers 0.000 description 1
- 239000004638 Duroplast Substances 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229920006169 Perfluoroelastomer Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920002732 Polyanhydride Polymers 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 229920000398 Thiolyte Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000005130 benzoxazines Chemical class 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 229920001222 biopolymer Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 229920006218 cellulose propionate Polymers 0.000 description 1
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920005558 epichlorohydrin rubber Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 229920005555 halobutyl Polymers 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- ZRKSVHFXTRFQFL-UHFFFAOYSA-N isocyanomethane Chemical compound C[N+]#[C-] ZRKSVHFXTRFQFL-UHFFFAOYSA-N 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- DUWWHGPELOTTOE-UHFFFAOYSA-N n-(5-chloro-2,4-dimethoxyphenyl)-3-oxobutanamide Chemical compound COC1=CC(OC)=C(NC(=O)CC(C)=O)C=C1Cl DUWWHGPELOTTOE-UHFFFAOYSA-N 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 229920000247 superabsorbent polymer Polymers 0.000 description 1
- 239000004583 superabsorbent polymers (SAPs) Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/36—Inkjet printing inks based on non-aqueous solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/14—Printing inks based on carbohydrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/364—Conditioning of environment
- B29C64/371—Conditioning of environment using an environment other than air, e.g. inert gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/02—Thermal after-treatment
- B29C2071/022—Annealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/227—Driving means
- B29C64/236—Driving means for motion in a direction within the plane of a layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/245—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/307—Handling of material to be used in additive manufacturing
- B29C64/321—Feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/35—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2001/00—Use of cellulose, modified cellulose or cellulose derivatives, e.g. viscose, as moulding material
- B29K2001/08—Cellulose derivatives
- B29K2001/12—Cellulose acetate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
- B29K2079/085—Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
Definitions
- the present disclosure relates generally to additive manufacturing techniques and methods of improving the same. Particularly, embodiments of the present disclosure relate to solution-based additive manufacturing techniques for creating polymer structures.
- Additive manufacturing techniques such as 3D printing have revolutionized manufacturing because these techniques can produce complex structures that are difficult or near impossible to create using traditional manufacturing methods.
- Additive manufacturing has found wide industrial use in emerging areas of innovation, such as microfluidic devices, structured biomaterials, improved composite materials, and high-strength materials.
- a critical limitation of existing and emerging additive manufacturing techniques is the narrow range of polymers that can be processed. For instance, current methods require specific polymers such as thermoplastic polymers with moderate melting points, or polymers which must be photopolymerized or photocross-linked.
- a wide range of functionally innovative polymers therefore, are left without the ability to be used in additive manufacturing. Improved additive manufacturing techniques to process advanced functional polymers are desirable.
- the present invention relates to systems and method for additive manufacturing.
- An exemplary embodiment of the present invention provides a method of additive manufacturing.
- the method can comprise providing an ink and depositing, through an air gap and onto a substrate, the ink to create an extruded polymer structure.
- the ink can comprise a polymer, a volatile solvent compound, and a nonsolvent compound.
- the method can further comprise evaporating at least a portion of the volatile solvent compound.
- the at least a portion of the volatile solvent compound can be 20% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the at least a portion of the volatile solvent compound is 15% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the at least a portion of the volatile solvent compound is 10% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the at least a portion of the volatile solvent compound is 5% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the at least a portion of the volatile solvent compound is 3% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the at least a portion of the volatile solvent compound is 2% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the at least a portion of the volatile solvent compound is 1% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the at least a portion of the volatile solvent compound is at least 0.1% of the volatile solvent compound by weight based on total weight of the ink.
- the at least a portion of the volatile solvent compound is at least 0.3% of the volatile solvent compound by weight based on total weight of the ink.
- the at least a portion of the volatile solvent compound is at least 0.5% of the volatile solvent compound by weight based on total weight of the ink.
- the at least a portion of the volatile solvent compound is at least 0.7% of the volatile solvent compound by weight based on total weight of the ink.
- the at least a portion of the volatile solvent compound is at least 0.9% of the volatile solvent compound by weight based on total weight of the ink.
- the method can further comprise washing, with one or more nonsolvent compounds, the extruded polymer structure.
- the method can further comprise drying, at low temperature, the extruded polymer structure to remove residual solvent.
- the depositing can occur through a pneumatic micronozzle.
- the method can further comprise coating the substrate with a coating layer comprising the polymer to enhance binding between the extruded polymer structure and the substrate.
- the substrate can comprise a plate comprising the polymer.
- the method can further comprise injecting, using a vapor nozzle, a vapor comprising the volatile solvent compound to a shell substantially surrounding the nozzle and the air gap.
- the method can further comprise saturating, with the vapor comprising the volatile solvent compound, the atmosphere in the shell substantially surrounding the nozzle and the air gap such that the evaporation of the volatile solvent compound from the ink is slowed.
- the method can further comprise saturating, with the vapor comprising the volatile solvent compound, the atmosphere surrounding the extruded polymer structure to slow the evaporation of the volatile solvent compound.
- the method can further comprise moving, laterally in an x-direction and a y-direction, the substrate.
- the method can further comprise moving, vertically in a z-direction, the nozzle.
- the method can further comprise controlling, by adjusting the movement speed of the substrate, the diameter of the ink extrusion on the substrate.
- the method can further comprise layering, by adjusting the vertical height of the nozzle, two or more layers on the substrate to create the extruded polymer structure.
- the method can further comprise pressurizing the ink.
- the method can further comprise cutting, off from the substrate, the extruded polymer structure.
- the method can further comprise immersing the substrate and the extruded polymer structure in a water bath after printing a 3D structure.
- the nonsolvent compound can comprise a volatile nonsolvent compound.
- the method can further comprise evaporating at least a portion of the volatile nonsolvent compound.
- the method can further comprise immersing the extruded polymer structure in a bath comprising a plasticizing nonsolvent compound.
- the method can further comprise annealing, in a vacuum oven, the extruded polymer structure.
- the printer can comprise an ink holding container, an ink nozzle configured to attach to the ink holding container, a vapor nozzle, and a moving stage for a substrate.
- a distance between the ink nozzle and the moving stage can comprises an air gap substantially surrounded by a control volume shell.
- the vapor nozzle can be configured to provide a feed into the control volume shell.
- the moving stage can be configured to move laterally in an x-direction and a y-direction.
- the ink holding container and the ink nozzle can be configured to move vertically in a z-direction.
- the vapor nozzle can be configured to control a vapor concentration of a volatile solvent compound in the control volume shell.
- the vapor nozzle can be configured to saturate the control volume shell with the vapor comprising the volatile solvent compound.
- the moving stage can be configured to detachably attach to a substrate.
- the vapor nozzle can be further configured to saturate the substrate with the vapor comprising the volatile solvent.
- the ink holding container and the ink nozzle comprise stainless steel.
- the printer can further comprise one or more stepper motors attached to the moving stage and ink nozzle and configured with a predetermined step angle to move the moving stage and ink nozzle.
- the printer can further comprise one or more controllers attached to the one or more stepper motors and configured to control the moving stage and the ink nozzle.
- the one or more controllers can be configured to adjust the movement speed of the moving stage to control the diameter of the ink extrusion on the substrate.
- the one or more controllers can be configured to move the moving stage laterally.
- the one or more controllers can be configured to move the ink holding container and the ink nozzle vertically.
- the printer can further comprise a coating layer on the substrate comprising a polymer to enhance binding capabilities of the substrate.
- the substrate can comprise a plate comprising a polymer.
- the ink can comprise a polymer, a volatile solvent compound, and a nonsolvent compound.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 20% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the Hildebrand solubility parameters of the polymer and volatile solvent compound can have a difference of 3.6 MPal/2 or less.
- the Relative Energy Difference calculated from the Hansen solubility parameters of the polymer and the nonsolvent compound can be 1 or greater.
- the volatile solvent compound can have a vapor pressure greater than the nonsolvent compound.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 15% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 10% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 5% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 3% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 2% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 1% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.1% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.3% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.5% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.7% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.9% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 10% or greater by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 15% or greater by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 20% or greater by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 25% or greater by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 30% or greater by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 40% or greater by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 50% or greater by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 1% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 1% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.9% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.8% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.7% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.6% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.5% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.4% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.3% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.2% or less by weight based on total weight of the ink to form a homogeneous solution.
- the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.1% or less by weight based on total weight of the ink to form a homogeneous solution.
- Fig. 1 shows a ternary phase diagram with homogeneous and nonhomogeneous regions and an ideal ink composition according to some embodiments of a ternary ink solution for additive manufacturing
- Fig. 2 shows a ternary phase diagram with homogenous and nonhomogeneous regions according to some embodiments of a ternary ink solution for additive manufacturing that can undergo spinodal decomposition;
- FIG. 3A illustrates a rendering of an exemplary embodiment of a 3D direct ink writing printer for a ternary ink solution
- Fig. 3B illustrates a cross-sectional view of an exemplary embodiment of a 3D direct ink writing printer for a ternary ink solution
- FIG. 4 is a flowchart of an exemplary method for additive manufacturing using a ternary ink solution
- FIG. 5 is a flowchart of an exemplary method for additive manufacturing using a ternary ink solution
- FIG. 6 is a flowchart of an exemplary method for additive manufacturing using a ternary ink solution
- Fig. 7A is an optical photograph of some embodiments of an extruded polymer structure printed from a ternary ink solution wherein the scale bars represent lmm.
- Fig. 7B is a Scanning Electron Microscope (SEM) image of an exemplary embodiment of an extruded polymer structure printed from a ternary ink solution.
- Inks used for additive manufacturing have the ability to phase change from a liquid ink phase to a solid phase once extruded in a 3D structure.
- SLA utilizes polymers which can melt easily to form a liquid ink and solidify at room temperature, while FDM used light activation to solidify the polymeric structures.
- Attention is turned to multicomponent solutions such as ternary solutions comprising at least: a polymer, a volatile solvent compound, and a nonsolvent compound.
- the multicomponent solution can comprise at least one polymer, at least one volatile solvent compound, and at least one nonsolvent compound.
- the solution can further comprise additives such as multipole polymers, volatile nonsolvent compounds inhibitors, etc.
- the aforementioned solution can comprise the three components in such a ratio that the polymer is substantially dissolved in the solution to create a liquid ink phase.
- the volatile solvent compound After extruding the ink onto a substrate, the volatile solvent compound begins to evaporate spontaneously, which drives a phase inversion from a liquid ink phase to a solid phase. As the solution solidifies, the extruded 3D polymeric structure is created on the substrate.
- Such an embodiment can provide the ability to use any desired polymer in 3D printing, so long as appropriate volatile solvent and nonsolvent compounds are selected. This is due to the spinodal decomposition of a ternary solution.
- additive manufacturing devices for printing the presently disclosed ink, such as a direct ink writing 3D printer. Because the presently disclosed multicomponent ink is able to evaporate the volatile solvent compound and solidify spontaneously, measures must be taken to ensure the ink does not solidify before reaching the substrate. Consequently, the presently disclosed 3D printer can provide an additional vapor nozzle and control volume shell. The vapor nozzle can then inject a vapor comprising the volatile solvent compound to the control volume shell. Such an embodiment would saturate the atmosphere surrounding the ink and prevent or slow the evaporation of the volatile solvent compound from the ink until the solution reaches the substrate. The vapor nozzle can further be configured to saturate the atmosphere around the substrate to better control the rate of evaporation of the volatile solvent compound from the ink once printed. Also disclosed herein are methods of additive manufacturing utilizing the same.
- the ternary ink solution can comprise a polymer, a volatile solvent compound, and a nonsolvent compound.
- a polymer can include, but are not limited to, biopolymers, inorganic polymers, organic polymers, conductive polymers, copolymers, fluoropolymers, polyterpenes, phenolic resins, polyanhydrides, polyketones, polyesters, polyimides (such as Matrimid 5218 or 6FDA-DAM), polyolefins, rubbers, silicones, silicone rubbers, superabsorbent polymers, synthetic rubbers, vinyl polymers, or a combination thereof.
- polystyrene can include, but are not limited to, polyester resin, polyurethanes, polyurea, vulcanized rubber, bakelite, duroplast, urea formaldehyde, melamine resin, diallyl phthalate, epoxy resin, benzoxazines, polyimides, bismaleimides, cyanate esters, furan resins, silicone resins, thiolyte, vinyl ester, acrylic, polymethyl methacrylate, acrylonitrile butadiene styrene, chlorinated polyvinyl chloride, nylon, polylactic acid, polybenzimidazole, polycarbonate, polyether sulfone, polyoxymethylene, polyether ether ketone, polyethylene, polyphenylene sulfide, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene fluoride, polytetrafluoroethylene, polyisoprene, polybutadiene, chloroprene, butyl rubber
- suitable polymers useable include substituted or unsubstituted polymers and may be selected from polysulfones; poly(styrenes), including styrene-containing copolymers such as acrylonitrilestyrene copolymers, styrene-butadiene copolymers and styrene-vinylbenzylhabde copolymers; polycarbonates; cellulosic polymers, such as cellulose acetate-butyrate, cellulose propionate, ethyl cellulose, methyl cellulose, nitrocellulose, etc.; polyamides and polyimides, including aryl polyamides and aryl polyimides; polyethers; polyetherimides; polyetherketones; polyethersulfones; poly(arylene oxides) such as poly(phenylene oxide) and poly(xylene oxide); poly(esteramide-diisocyanate); polyurethanes; polyesters (including polyarylates), such
- volatile refers to a substance which can vaporize readily from a liquid to a vapor at room temperature and atmospheric conditions.
- the volatile solvent compound can be selected such that the vapor pressure of the volatile solvent compound is greater than the vapor pressure of the nonsolvent compound.
- the volatile solvent compound can be any substance able to dissolve substantially dissolve the polymer to create a liquid solution at room temperature and pressure. Suitable examples of a volatile solvent can include, but are not limited to, nonpolar solvents, polar aprotic solvents, polar protic solvents, water- miscible solvents, or a combination thereof.
- solvents there are many examples of appropriate solvents known to one of ordinary skill in the art, but suitable examples can include, but are not limited to, acetaldehyde, acetic acid, acetone, acetonitrile, butanediol, butoxyethanol, butyric acid, diethanolamine, diethylenetriamine, dimethyl acetamide (DMAc), dimethylformamide (DMF), dimethoxy ethane, dimethyl sulfoxide (DMSO), dioxane, ethanol, ethylamine, ethylene glycol, formic acid, furfuryl alcohol, glycerol, methanol, methyl diethanolamine, methyl isocyanide, N-methyl-2-pyrrolidone (NMP), propanol, propanediol, propanoic acid, propylene glycol, pyridine, tetrahydrofuran (THF), triethylene glycol, dimethyl hydrazine, hydrazine, hydrofluoric acid, hydrogen
- the volatile solvent compound can be selected from any substance able to dissolve the desired polymer at room temperature and pressure with a vapor pressure greater than the nonsolvent compound.
- the weight ratio of the volatile solvent compound can be present in an amount such that the polymer dissolves at the additive manufacturing operating conditions in an amount of 10% or greater (e.g., 15% or greater, 20% or greater, 25% or greater, 30% or greater, 35% or greater, 40% or greater, 45% or greater, 50% or greater, or 55% or greater) by weight based on total weight of the ink to form a homogeneous solution.
- the Hildebrand solubility parameters can be determined for the polymer and the volatile solvent compound. In some embodiments, the Hildebrand solubility parameters of the polymer and the volatile solvent compound can have a difference of 3.6 MPal/2 or less. As would be appreciated by one of ordinary skill in the art, such an embodiment would provide a volatile solvent compound which would be able to dissolve the polymer to create a substantially homogeneous solution.
- the term“nonsolvent” refers to a substance which is substantially unable to dissolve the polymer at room temperature and pressure.
- the volatile solvent compound and nonsolvent compound are selected to construct a desired ternary solution with a specific polymer.
- the ternary ink solution can comprise a polymer of intrinsic micro porosity 1 (PIM-l) as the polymer, tetrahydrofuran (THF) as the volatile solvent compound, and dimethylacetamide (DMAc) as the nonsolvent compound.
- PIM-l intrinsic micro porosity 1
- THF tetrahydrofuran
- DMAc dimethylacetamide
- THF can be selected as the volatile solvent compound due to its ability to dissolve PIM-l
- DMAc can be selected as the nonsolvent compound due to its lower vapor pressure than THF and inability to dissolve PIM-l.
- the combination of the three substances can form a ternary ink solution.
- the weight ratio of the nonsolvent compound is present in an amount such that the polymer dissolves at the additive manufacturing operating conditions in an amount of 1% or less (e.g., 0.9% or less, 0.8% or less, 0.7% or less, 0.6% or less, 0.5% or less, 0.4% or less, 0.3% or less, 0.2% or less, or 0.1% or less) by weight based on total weight of the ink to form a homogeneous solution.
- the Hansen solubility parameters can be determined for the polymer and the volatile solvent compound.
- the Relative Energy Difference calculated form the Hansen solubility parameters of the polymer and the nonsolvent compound can be 1 or greater. As would be appreciated by one of ordinary skill in the art, such an embodiment would provide a nonsolvent compound which would be unable to dissolve the polymer.
- the polymer, the volatile solvent compound, and the nonsolvent compound in the ink can be present in any suitable amount to confer a desirable property to the ink.
- the ternary phase diagram of the ternary ink solution can provide guidance for the phase inversion process.
- the ternary phase diagram can be constructed using the three components of the ternary system, as shown in Fig. 1. As would be appreciated by one of ordinary skill in the art, such an embodiment would provide a ternary phase diagram comprising a homogenous region, a nonhomogeneous region, and a binodal curve. In such an embodiment, the ink is selected to begin as a stable liquid solution in the homogenous region.
- the relative polymer concentration increases driving the solution composition across the binodal line into the nonhomogeneous region, creating an unstable solution.
- the solution is thermodynamically unstable in the homogenous region, the solution undergoes a phase inversion to a more thermodynamically stable configuration comprising a solidified polymer-rich phase, and a liquid polymer-lean phase.
- This phase inversion process can alternatively be called spinodal decomposition.
- the solidified polymer-rich phase provides the extruded polymeric structure and can be further dried to evaporate any remaining solvent or nonsolvent compound.
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation at the additive manufacturing operating conditions of 25% or less (e.g., 24% or less, 23% or less, 22% or less, 21% or less, 20% or less, 19% or less, 18% or less, 17% or less, 16% or less, 15% or less, 14% or less, 13% or less, 12% or less, 11% or less, 10% or less, 9% or less, 8% or less, 7% or less, 6% or less, 5% or less, 4% or less, 3% or less, 2% or less, or 1% or less) of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- 25% or less e.g., 24% or less, 23% or less, 22% or less, 21% or less, 20% or less, 19% or less, 18% or less, 17% or
- the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation at the additive manufacturing operating conditions of 0.1% or greater (e.g., 0.2 % or greater, 0.3% or greater, 0.4% or greater, 0.5% or greater, 0.6% or greater, 0.7% or greater, 0.8% or greater, 0.9% or greater, 1% or greater, 5% or greater, 10% or greater, 15% or greater, 20% or greater, or 25% or greater) of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
- 0.1% or greater e.g., 0.2 % or greater, 0.3% or greater, 0.4% or greater, 0.5% or greater, 0.6% or greater, 0.7% or greater, 0.8% or greater, 0.9% or greater, 1% or greater, 5% or greater, 10% or greater, 15% or greater, 20% or greater, or 25% or greater
- the binodal line can be determined by using the cloud-point technique. While the cloud-point technique is known by one of ordinary skill in the art, an exemplary method for performing the cloud-point technique can be found in Kosuri et al. (Kosuri, M. R., Koros, W. I, Journal of Membrane Science, 2008, 320, 65). Such an embodiment would provide for minimal weight loss during the phase change from a liquid ink to a solid printed structure. As shown in Fig. 2, a first composition is selected for the ternary ink solution. Evaporation of the volatile solvent compound drives the solution composition into the nonhomogeneous region where spinodal decomposition occurs. The solution then phase-inverts into a polymer-rich phase and a polymer-lean phase, as desired.
- the methods of solution-based additive manufacturing disclosed herein can comprise a direct ink writing printer for printing a ternary ink solution.
- the printer can comprise an ink holding container, an ink nozzle configured to attach to the ink holding container, a vapor nozzle, and a moving stage for a substrate.
- the moving stage can be configured to detachably attach to a substrate.
- the distance between the ink nozzle and the moving stage can comprise an air gap substantially surrounded by a control volume shell.
- the control volume shell can comprise a cylindrical shell with an opening for receiving a vapor nozzle.
- the control volume shell can comprise any hollow shape to substantially surround the ink nozzle and air gap, including but not limited to, cylindrical, conical, rectangular, frusto-conical, elliptical, or any combination thereof.
- the printer can comprise an ink holding container 310, an ink nozzle 320, a vapor nozzle 330, a moving stage for a substrate 340, and a control volume shell 350 configured to substantially surround the air gap between the ink nozzle and the substrate.
- the vapor nozzle 330 can provide a feed of vapor comprising the volatile solvent compound to the control volume shell 350.
- such an embodiment would provide the user control over the atmosphere surrounding the ink in the air gap during the printing process to adjust the rate of evaporation of the volatile solvent compound from the ink.
- control over the atmosphere surrounding the extruded ink is desired in order to better control the solidification properties and other properties of the extruded structure.
- properties can include, but are not limited to, structural integrity, microporosity, macroporosity, flexural strength, tensile strength, density, viscosity, and the like.
- the control volume shell 350 can further be configured to provide the vapor feed to the atmosphere substantially surrounding the substrate. Such an embodiment would provide further control over the rate of evaporation of the volatile solvent compound and the properties of the extruded polymer structure.
- the vapor nozzle 330 can provide a saturated atmosphere to the control volume shell 350 and/or the atmosphere surrounding the substrate 340.
- the ink nozzle 320 and ink holding container 310 can comprise a metal.
- a metal can include, but are not limited to, iron alloys, stainless steel, steel, cast iron, aluminum, titanium, copper, magnesium, bronze, brass, alloys, and the like.
- the moving stage 340 can be configured to move laterally.
- the moving stage 340 can be configured to move in an x-direction and a y-direction.
- the moving stage 340 can be configured to move forwards, backwards, and sideways.
- the ink nozzle 320 and ink holding container 310 can be configured to move vertically.
- the ink nozzle 320 can be configured to move in a z-direction.
- the printer can further comprise one or more stepper motors attached to the moving stage 340 and/or ink nozzle 320.
- the printer can further comprise one or more controllers attached to the one or more stepper motors configured to control the moving stage 340 and the ink nozzle 320.
- the substrate can comprise a plate comprising a coating layer comprising the desired polymer.
- the coating layer can comprise a separate polymer than the desired polymer.
- Suitable examples of materials for a substrate plate can include, but are not limited to, glass, metal, steel, stainless steel, plastic, polymer, brass or a combination thereof.
- the method can comprise the steps of providing an ink comprising a polymer, a volatile solvent compound, and a nonsolvent compound, and depositing the ink through an air gap and onto a substrate to create an extruded polymer structure.
- the method can further comprise evaporating the volatile solvent compound.
- the method can further comprise drying the extruded polymer structure at a low temperature to remove residual solvent.
- the method can further comprise washing the extruded polymer structure with two or more nonsolvent compounds.
- the method can further comprise extruding the ink through a nozzle or a pneumatic micronozzle. In some embodiments, the method can further comprise coating the substrate with a coating layer comprising the polymer to enhance binding between the extruded polymer structure and the substrate. In some embodiments, the substrate can comprise a plate comprise the polymer to enhance binding. In some embodiments, the method can further comprise injecting a vapor comprising the volatile solvent compound to a shell substantially surrounding the nozzle and the air gap using a vapor nozzle. In some embodiments, the method can further comprise saturating the atmosphere in the shell or around the extruded polymer structure such that the evaporation of the volatile solvent compound from the ink is slowed.
- the method can further comprise moving the substrate laterally and moving the nozzle vertically. In some embodiments, the method can further comprise controlling the diameter of the ink extrusion by adjusting the movement speed of the substrate. In some embodiments, the method can further comprise layering two or more layers on the substrate by adjusting the vertical height of the nozzle to create the extruded polymer structure. In some embodiments, the method can further comprise pressurizing the ink. In some embodiments, the method can further comprise cutting the extruded polymer structure off from the substrate. In some embodiments, the method can further comprise immersing the substrate and extruded polymer structure from additive manufacturing in a water bath. In some embodiments, the nonsolvent compound can comprise a volatile nonsolvent compound.
- the evaporating can further comprise evaporating the volatile nonsolvent compound.
- the method can further comprise immersing the extruded polymer structure in a bath comprising a plasticizing nonsolvent compound.
- the method can further comprise annealing the extruded polymer structure in a vacuum oven.
- the additive manufacturing operating conditions can be selected to confer a desirable property to the ink and/or the extruded polymer structure.
- the operating temperature of the additive manufacturing process can be 20 °C or greater (e.g., 25 °C or greater, 30 °C or greater, 35 °C or greater, 40 °C or greater, 45 °C or greater, 50 °C or greater, 55 °C or greater, 60 °C or greater, 65 °C or greater, 70 °C or greater, 75 °C or greater, 80 °C or greater, 85 °C or greater, 90 °C or greater, 95 °C or greater, or 100 °C or greater).
- the operating temperature of the additive manufacturing process can be 100 °C or less (e.g., 20 °C or less, 25 °C or less, 30 °C or less, 35 °C or less, 40 °C or less, 45 °C or less, 50 °C or less, 55 °C or less, 60 °C or less, 65 °C or less, 70 °C or less, 75 °C or less, 80 °C or less, 85 °C or less, 90 °C or less, or 95 °C or less).
- 100 °C or less e.g., 20 °C or less, 25 °C or less, 30 °C or less, 35 °C or less, 40 °C or less, 45 °C or less, 50 °C or less, 55 °C or less, 60 °C or less, 65 °C or less, 70 °C or less, 75 °C or less, 80 °C or less, 85 °C or less, 90 °C or less,
- the operating temperature of the additive manufacturing process can be from 20 °C to 100 °C (e.g., from 20 °C to 25 °C, from 25 °C to 30 °C, from 30 °C to 35 °C, from 35 °C to 40 °C, from 40 °C to 45 °C, from 45 °C to 50 °C, from 50 °C to 55 °C, from 55 °C to 60 °C, from 60 °C to 65 °C, from 65 °C to 70 °C, from 70 °C to 75 °C, from 75 °C to 80 °C, from 80 °C to 85 °C, from 85 °C to 90 °C, from 90 °C to 95 °C, or from 95 °C to 100 °C).
- 20 °C to 25 °C from 25 °C to 30 °C, from 30 °C to 35 °C, from 35 °C to 40 °C, from 40 °C to 45
- the operating temperature of the additive manufacturing process can be 200 °C or less. In some embodiments, the operating temperature of the additive manufacturing process can be 0 °C or greater. In some embodiments, the operating temperature of the additive manufacturing process can be from 0 °C to 200 °C. In some embodiments, the operating pressure of the additive manufacturing process can be 0.9 atm or greater (e.g., 1 atm or greater, 1.5 atm or greater, 2 atm or greater, 3 atm or greater, 4 atm or greater, 5 atm or greater, 6 atm or greater, 7 atm or greater, 8 atm or greater, 9 atm or greater, 10 atm or greater, 11 atm or greater, 12 atm or greater, or 13 atm or greater).
- the operating pressure of the additive manufacturing process can be 0.9 atm or greater (e.g., 1 atm or greater, 1.5 atm or greater, 2 atm or greater, 3 atm or greater, 4 atm or greater, 5 atm or greater, 6 atm or greater, 7 atm or greater, 8 atm
- the operating pressure of the additive manufacturing process can be 14 atm or less (e.g., 13 atm or less, 12 atm or less, 11 atm or less, 10 atm or less, 9 atm or less, 8 atm or less, 7 atm or less, 6 atm or less, 5 atm or less, 4 atm or less, 3 atm or less, 2 atm or less, 1.5 atm or less, or 1 atm or less).
- a desired polymer for printing (Matrimid 5218) was purchased from Ribelin. The polymer powders were dried overnight under vacuum at 120 °C. All solvents were anhydrous and purchased from either Sigma Aldrich or Alfa Aesar and used as received. The cloud-point technique was used to determine the binodal boundary of the ternary phase diagram as would be known by one of ordinary skill in the art. Tetrahydrofuran (THF) is chosen as the volatile solvent compound due to its high volatility and ability to dissolve Matrimid 5218. Water is selected as the nonsolvent compound due to its abundance and small environmental impact.
- THF Tetrahydrofuran
- a ternary ink is prepared comprising 30% Matrimid 5218, 68% THF, and 2% water, by weight.
- a cartesian 3D printer was built to process ternary inks. The printer comprises a stainless-steel ink container, a coaxial dual-channel micronozzle for the ink, and a cartesian moving substrate. The ternary ink is prepared in the container, and the container is sealed via Swagelok fittings and placed onto a rotating roller to cure (10 rpm, 80 °C) for at least 3 days.
- the ink is extruded through a stainless- steel needle (inner diameter of 311 microns) by pressurizing the interior of the container (100 kPa) using a compressed nitrogen gas cylinder.
- the ink is printed at a linear speed of 10 mm/s.
- a glass plate coated with a thin Matrimid 5218 film is used as the substrate.
- the ink is printed in a THF-saturated atmosphere using the vapor nozzle.
- a desired polymer for printing (Matrimid 5218) was purchased from Ribelin. The polymer powders were dried overnight under vacuum at 120 °C. All solvents were anhydrous and purchased from either Sigma Aldrich or Alfa Aesar and used as received. The cloud-point technique was used to determine the binodal boundary of the ternary phase diagram as would be known by one of ordinary skill in the art. Toluene is selected as the nonsolvent compound to enlarge the nonhomogeneous region of the ternary phase diagram. A ternary ink is prepared comprising 30% Matrimid 5218, 50% THF, and 20% toluene, by weight. A cartesian 3D printer was built to process ternary inks.
- the printer comprises a stainless-steel ink container, a coaxial dual-channel micronozzle for the ink, and a cartesian moving substrate.
- the ternary ink is prepared in the container, and the container is sealed via Swagelok fittings and placed onto a rotating roller to cure (10 rpm, 80 °C) for at least 3 days.
- the ink is extruded through a stainless- steel needle (inner diameter of 311 microns) by pressurizing the interior of the container (100 kPa) using a compressed nitrogen gas cylinder.
- the ink is printed at a linear speed of 10 mm/s.
- a glass plate coated with a thin Matrimid 5218 film is used as the substrate.
- the ink is printed in a THF-saturated atmosphere using the vapor nozzle.
- An extruded polymer structure is prepared using the method from Example 2.
- the polymer scaffold is then immersed into a 75% dimethylformamide (DMF), 25% water, by weight, solution (24 hours at 25 °C).
- the wet scaffold is then wiped and dried in a vacuum oven (85 kPa vacuum, 120 °C, 24 hours). This method is able to significantly tune the porosity of the extruded polymer structure.
- DMF dimethylformamide
- a desired polymer for printing was synthesized using techniques known to one of ordinary skill in the art and as outlined in Jue et al. (Jue, M. L., McKay, C. S., McCool, B. A., Finn, M., Lively, R. P., Macromolecules, 2015, 48, 5780). After synthesis, the PIM-l was washed with dimethylformamide (DMF) and methanol sequentially to remove unreacted monomers and oligomers. The PIM-l was then vacuum dried overnight at 80 °C to remove residual solvents. All solvents were purchased from Sigma Aldrich or Alfa Aesar and used as received.
- DMF dimethylformamide
- a ternary ink solution is prepared using tetrahydrofuran (THF) as the volatile solvent compound and dimethyl acetamide (DMAc) as the nonsolvent compound.
- THF tetrahydrofuran
- DMAc dimethyl acetamide
- the composition of the ink was prepared to be in a 10:23: 17 PIM-l :THF:DMAc ratio, by weight.
- a cartesian 3D printer was built to process ternary inks. The printer comprises a stainless-steel ink container, a coaxial dual channel micronozzle for the ink, and a cartesian moving substrate.
- the ternary ink is prepared in the container, and the container is sealed via Swagelok fittings and placed onto a rotating roller to cure (10 rpm, 50 °C) for at least 12 hours.
- the ink is extruded through a stainless-steel needle (inner diameter of 311 microns) by pressurizing the interior of the container (350-1300 kPa) using a compressed nitrogen gas cylinder.
- the ink is printed at a linear speed of 10 mm/s.
- the ink is printed in a THF-saturated atmosphere using the vapor nozzle.
- a desired polymer for printing was obtained. All solvents were purchased from Sigma Aldrich or Alfa Aesar and used as received. The cloud-point technique was used to determine the binodal boundary of the ternary phase diagram as would be known by one of ordinary skill in the art.
- a ternary ink solution was prepared using acetone as the volatile solvent compound and water as the nonsolvent compound. The composition of the ink was prepared to be in a 23:52:25 CA: acetone: water ratio, by weight.
- a cartesian 3D printer was built to process ternary inks. The printer comprises a stainless-steel ink container, a coaxial dual-channel micronozzle for the ink, and a cartesian moving substrate.
- the ternary ink is prepared in the container, and the container is sealed via Swagelok fittings and placed onto a rotating roller to cure (10 rpm, 50 °C) for at least 12 hours.
- the ink is extruded through a stainless-steel needle (inner diameter of 311 microns) by pressurizing the interior of the container (350-1300 kPa) using a compressed nitrogen gas cylinder.
- the ink is printed at a linear speed of 10 mm/s.
- the ink is printed in an acetone-saturated atmosphere using the vapor nozzle.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Molecular Biology (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Disclosed herein are solution-based additive manufacturing inks comprising a polymer, a volatile solvent compound, and a nonsolvent compound. With current additive manufacturing techniques, a wide range of functionally innovative polymers are left without the ability to be used in additive manufacturing. Improved additive manufacturing techniques to process advanced functional polymers are desirable. The disclosed ink is operable to render any chosen polymer useable in additive manufacturing methods. The composition of the disclosed ink allows for a phase inversion to occur to transition the ink from a liquid ink to a solid manufactured structure. Also disclosed herein are devices for additive manufacturing of the ink and methods for making the same.
Description
SOLUTION-BASED ADDITIVE MANUFACTURING
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit, under 35 U.S.C. § 119(e), of United States Provisional Patent Application No. 62/627,835, filed 8 February 2018, entitled“SOLUTION- BASED 3D PRINTING,” the entire contents and substance of which is incorporated herein by reference in its entirety as if fully set forth below.
FIELD OF THE DISCLOSURE
[0002] The present disclosure relates generally to additive manufacturing techniques and methods of improving the same. Particularly, embodiments of the present disclosure relate to solution-based additive manufacturing techniques for creating polymer structures.
BACKGROUND
[0003] Additive manufacturing techniques such as 3D printing have revolutionized manufacturing because these techniques can produce complex structures that are difficult or near impossible to create using traditional manufacturing methods. Additive manufacturing has found wide industrial use in emerging areas of innovation, such as microfluidic devices, structured biomaterials, improved composite materials, and high-strength materials. A critical limitation of existing and emerging additive manufacturing techniques is the narrow range of polymers that can be processed. For instance, current methods require specific polymers such as thermoplastic polymers with moderate melting points, or polymers which must be photopolymerized or photocross-linked. A wide range of functionally innovative polymers, therefore, are left without the ability to be used in additive manufacturing. Improved additive manufacturing techniques to process advanced functional polymers are desirable.
[0004] What is needed, therefore, is an additive manufacturing technique capable of transition any desired polymer solution from a liquid ink phase to a solid printed phase without the need to limit the polymer selection based on the melting points or photoreactivity of the polymer. Embodiments of the present disclosure address this need as well as other needs that will become apparent upon reading the description below in conjunction with the drawings.
BRIEF SUMMARY OF THE INVENTION
[0005] The present invention relates to systems and method for additive manufacturing. An exemplary embodiment of the present invention provides a method of additive manufacturing. The method can comprise providing an ink and depositing, through an air gap and onto a substrate, the ink to create an extruded polymer structure. The ink can comprise a polymer, a volatile solvent compound, and a nonsolvent compound.
[0006] In any of the embodiments disclosed herein, the method can further comprise evaporating at least a portion of the volatile solvent compound.
[0007] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound can be 20% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0008] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is 15% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0009] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is 10% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0010] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is 5% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0011] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is 3% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0012] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is 2% or less of the volatile solvent compound by weight based on total weight of the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0013] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is 1% or less of the volatile solvent compound by weight based on total weight of
the ink, and the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0014] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is at least 0.1% of the volatile solvent compound by weight based on total weight of the ink.
[0015] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is at least 0.3% of the volatile solvent compound by weight based on total weight of the ink.
[0016] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is at least 0.5% of the volatile solvent compound by weight based on total weight of the ink.
[0017] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is at least 0.7% of the volatile solvent compound by weight based on total weight of the ink.
[0018] In any of the embodiments disclosed herein, the at least a portion of the volatile solvent compound is at least 0.9% of the volatile solvent compound by weight based on total weight of the ink.
[0019] In any of the embodiments disclosed herein, the method can further comprise washing, with one or more nonsolvent compounds, the extruded polymer structure.
[0020] In any of the embodiments disclosed herein, the method can further comprise drying, at low temperature, the extruded polymer structure to remove residual solvent.
[0021] In any of the embodiments disclosed herein, the depositing can occur through a pneumatic micronozzle.
[0022] In any of the embodiments disclosed herein, the method can further comprise coating the substrate with a coating layer comprising the polymer to enhance binding between the extruded polymer structure and the substrate.
[0023] In any of the embodiments disclosed herein, the substrate can comprise a plate comprising the polymer.
[0024] In any of the embodiments disclosed herein, the method can further comprise injecting, using a vapor nozzle, a vapor comprising the volatile solvent compound to a shell substantially surrounding the nozzle and the air gap.
[0025] In any of the embodiments disclosed herein, the method can further comprise saturating, with the vapor comprising the volatile solvent compound, the atmosphere in the
shell substantially surrounding the nozzle and the air gap such that the evaporation of the volatile solvent compound from the ink is slowed.
[0026] In any of the embodiments disclosed herein, the method can further comprise saturating, with the vapor comprising the volatile solvent compound, the atmosphere surrounding the extruded polymer structure to slow the evaporation of the volatile solvent compound.
[0027] In any of the embodiments disclosed herein, the method can further comprise moving, laterally in an x-direction and a y-direction, the substrate.
[0028] In any of the embodiments disclosed herein, the method can further comprise moving, vertically in a z-direction, the nozzle.
[0029] In any of the embodiments disclosed herein, the method can further comprise controlling, by adjusting the movement speed of the substrate, the diameter of the ink extrusion on the substrate.
[0030] In any of the embodiments disclosed herein, the method can further comprise layering, by adjusting the vertical height of the nozzle, two or more layers on the substrate to create the extruded polymer structure.
[0031] In any of the embodiments disclosed herein, the method can further comprise pressurizing the ink.
[0032] In any of the embodiments disclosed herein, the method can further comprise cutting, off from the substrate, the extruded polymer structure.
[0033] In any of the embodiments disclosed herein, the method can further comprise immersing the substrate and the extruded polymer structure in a water bath after printing a 3D structure.
[0034] In any of the embodiments disclosed herein, the nonsolvent compound can comprise a volatile nonsolvent compound.
[0035] In any of the embodiments disclosed herein, the method can further comprise evaporating at least a portion of the volatile nonsolvent compound.
[0036] In any of the embodiments disclosed herein, the method can further comprise immersing the extruded polymer structure in a bath comprising a plasticizing nonsolvent compound.
[0037] In any of the embodiments disclosed herein, the method can further comprise annealing, in a vacuum oven, the extruded polymer structure.
[0038] Another embodiment of the present invention provides a three-dimensional direct ink writing printer for additive manufacturing. The printer can comprise an ink holding container,
an ink nozzle configured to attach to the ink holding container, a vapor nozzle, and a moving stage for a substrate. A distance between the ink nozzle and the moving stage can comprises an air gap substantially surrounded by a control volume shell. The vapor nozzle can be configured to provide a feed into the control volume shell.
[0039] In any of the embodiments disclosed herein, the moving stage can be configured to move laterally in an x-direction and a y-direction.
[0040] In any of the embodiments disclosed herein, the ink holding container and the ink nozzle can be configured to move vertically in a z-direction.
[0041] In any of the embodiments disclosed herein, the vapor nozzle can be configured to control a vapor concentration of a volatile solvent compound in the control volume shell.
[0042] In any of the embodiments disclosed herein, the vapor nozzle can be configured to saturate the control volume shell with the vapor comprising the volatile solvent compound.
[0043] In any of the embodiments disclosed herein, the moving stage can be configured to detachably attach to a substrate.
[0044] In any of the embodiments disclosed herein, the vapor nozzle can be further configured to saturate the substrate with the vapor comprising the volatile solvent.
[0045] In any of the embodiments disclosed herein, the ink holding container and the ink nozzle comprise stainless steel.
[0046] In any of the embodiments disclosed herein, the printer can further comprise one or more stepper motors attached to the moving stage and ink nozzle and configured with a predetermined step angle to move the moving stage and ink nozzle.
[0047] In any of the embodiments disclosed herein, the printer can further comprise one or more controllers attached to the one or more stepper motors and configured to control the moving stage and the ink nozzle.
[0048] In any of the embodiments disclosed herein, the one or more controllers can be configured to adjust the movement speed of the moving stage to control the diameter of the ink extrusion on the substrate.
[0049] In any of the embodiments disclosed herein, the one or more controllers can be configured to move the moving stage laterally.
[0050] In any of the embodiments disclosed herein, the one or more controllers can be configured to move the ink holding container and the ink nozzle vertically.
[0051] In any of the embodiments disclosed herein, the printer can further comprise a coating layer on the substrate comprising a polymer to enhance binding capabilities of the substrate.
[0052] In any of the embodiments disclosed herein, the substrate can comprise a plate comprising a polymer.
[0053] Another embodiment of the present invention provides a solution-based polymeric ink for additive manufacturing. The ink can comprise a polymer, a volatile solvent compound, and a nonsolvent compound. The weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 20% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0054] In any of the embodiments disclosed herein, the Hildebrand solubility parameters of the polymer and volatile solvent compound can have a difference of 3.6 MPal/2 or less.
[0055] In any of the embodiments disclosed herein, the Relative Energy Difference calculated from the Hansen solubility parameters of the polymer and the nonsolvent compound can be 1 or greater.
[0056] In any of the embodiments disclosed herein, the volatile solvent compound can have a vapor pressure greater than the nonsolvent compound.
[0057] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 15% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0058] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 10% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0059] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 5% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0060] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 3% or less of the volatile solvent compound by weight based
on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0061] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 2% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0062] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of 1% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0063] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.1% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0064] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.3% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0065] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.5% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0066] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.7% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0067] In any of the embodiments disclosed herein, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound can be present in an amount such that
evaporation, at 23°C and 1 atm, of at least 0.9% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
[0068] In any of the embodiments disclosed herein, the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 10% or greater by weight based on total weight of the ink to form a homogeneous solution.
[0069] In any of the embodiments disclosed herein, the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 15% or greater by weight based on total weight of the ink to form a homogeneous solution.
[0070] In any of the embodiments disclosed herein, the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 20% or greater by weight based on total weight of the ink to form a homogeneous solution.
[0071] In any of the embodiments disclosed herein, the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 25% or greater by weight based on total weight of the ink to form a homogeneous solution.
[0072] In any of the embodiments disclosed herein, the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 30% or greater by weight based on total weight of the ink to form a homogeneous solution.
[0073] In any of the embodiments disclosed herein, the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 40% or greater by weight based on total weight of the ink to form a homogeneous solution.
[0074] In any of the embodiments disclosed herein, the weight ratio of the volatile solvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 50% or greater by weight based on total weight of the ink to form a homogeneous solution.
[0075] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the
polymer is dissolved in an amount of 1% or less by weight based on total weight of the ink to form a homogeneous solution.
[0076] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 1% or less by weight based on total weight of the ink to form a homogeneous solution.
[0077] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.9% or less by weight based on total weight of the ink to form a homogeneous solution.
[0078] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.8% or less by weight based on total weight of the ink to form a homogeneous solution.
[0079] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.7% or less by weight based on total weight of the ink to form a homogeneous solution.
[0080] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.6% or less by weight based on total weight of the ink to form a homogeneous solution.
[0081] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.5% or less by weight based on total weight of the ink to form a homogeneous solution.
[0082] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.4% or less by weight based on total weight of the ink to form a homogeneous solution.
[0083] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.3% or less by weight based on total weight of the ink to form a homogeneous solution.
[0084] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.2% or less by weight based on total weight of the ink to form a homogeneous solution.
[0085] In any of the embodiments disclosed herein, wherein the weight ratio of the nonsolvent compound can be present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.1% or less by weight based on total weight of the ink to form a homogeneous solution.
[0086] These and other aspects of the present invention are described in the Detailed Description of the Invention below and the accompanying figures. Other aspects and features of embodiments of the present invention will become apparent to those of ordinary skill in the art upon reviewing the following description of specific, exemplary embodiments of the present invention in concert with the figures. While features of the present invention may be discussed relative to certain embodiments and figures, all embodiments of the present invention can include one or more of the features discussed herein. Further, while one or more embodiments may be discussed as having certain advantageous features, one or more of such features may also be used with the various embodiments of the invention discussed herein. In similar fashion, while exemplary embodiments may be discussed below as device, system, or method embodiments, it is to be understood that such exemplary embodiments can be implemented in various devices, systems, and methods of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0087] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate multiple embodiments of the presently disclosed subject matter and serve to explain the principles of the presently disclosed subject matter. The drawings are not intended to limit the scope of the presently disclosed subject matter in any manner.
[0088] Fig. 1 shows a ternary phase diagram with homogeneous and nonhomogeneous regions and an ideal ink composition according to some embodiments of a ternary ink solution for additive manufacturing;
[0089] Fig. 2 shows a ternary phase diagram with homogenous and nonhomogeneous regions according to some embodiments of a ternary ink solution for additive manufacturing that can undergo spinodal decomposition;
[0090] Fig. 3A illustrates a rendering of an exemplary embodiment of a 3D direct ink writing printer for a ternary ink solution;
[0091] Fig. 3B illustrates a cross-sectional view of an exemplary embodiment of a 3D direct ink writing printer for a ternary ink solution;
[0092] Fig. 4 is a flowchart of an exemplary method for additive manufacturing using a ternary ink solution;
[0093] Fig. 5 is a flowchart of an exemplary method for additive manufacturing using a ternary ink solution;
[0094] Fig. 6 is a flowchart of an exemplary method for additive manufacturing using a ternary ink solution;
[0095] Fig. 7A is an optical photograph of some embodiments of an extruded polymer structure printed from a ternary ink solution wherein the scale bars represent lmm.
[0096] Fig. 7B is a Scanning Electron Microscope (SEM) image of an exemplary embodiment of an extruded polymer structure printed from a ternary ink solution.
DETAILED DESCRIPTION
[0097] Although certain embodiments of the disclosure are explained in detail, it is to be understood that other embodiments are contemplated. Accordingly, it is not intended that the disclosure is limited in its scope to the details of construction and arrangement of components set forth in the following description or illustrated in the drawings. Other embodiments of the disclosure are capable of being practiced or carried out in various ways. Also, in describing the embodiments, specific terminology will be resorted to for the sake of clarity. It is intended that each term contemplates its broadest meaning as understood by those skilled in the art and includes all technical equivalents which operate in a similar manner to accomplish a similar purpose.
[0098] Herein, the use of terms such as“having,”“has,”“including,” or“includes” are open- ended and are intended to have the same meaning as terms such as“comprising” or“comprises” and not preclude the presence of other structure, material, or acts. Similarly, though the use of terms such as“can” or“may” are intended to be open-ended and to reflect that structure, material, or acts are not necessary, the failure to use such terms is not intended to reflect that structure, material, or acts are essential. To the extent that structure, material, or acts are presently considered to be essential, they are identified as such.
[0099] By“comprising” or“containing” or“including” is meant that at least the named compound, element, particle, or method step is present in the composition or article or method, but does not exclude the presence of other compounds, materials, particles, method steps, even
if the other such compounds, material, particles, method steps have the same function as what is named.
[0100] It is also to be understood that the mention of one or more method steps does not preclude the presence of additional method steps or intervening method steps between those steps expressly identified.
[0101] The components described hereinafter as making up various elements of the disclosure are intended to be illustrative and not restrictive. Many suitable components that would perform the same or similar functions as the components described herein are intended to be embraced within the scope of the disclosure. Such other components not described herein can include, but are not limited to, for example, similar components that are developed after development of the presently disclosed subject matter.
[0102] As described above, a problem with current additive manufacturing techniques is the limitations of polymers that can be manufactured. While techniques exist for additive manufacturing such as 3D printing, stereolithography (SLA), and fused deposition modeling (FDM), these techniques are limited in the polymers that can be used due to the need for polymers with moderate melting points, or polymers that can be photopolymerized or photocross-linked. Many advanced functional polymers exist and would provide technological innovations if the ability to manufacture said polymers existed, but most polymers are incompatible with traditional methods. Polymers such as cellulose derivatives, polyimides, or microporous ladder polymers have exciting application in additive manufacturing but cannot be used due to incompatibility with SLA and FDM. These polymers have potential to be used in additive manufacturing in many industries, such as nanofibers, antiballistic clothing, flexible electronic devices, bioengineering devices, and membranes. Developing solution-based additive manufacturing techniques able to print any desired polymer would greatly extend the design space and capabilities of polymer-based devices and structures.
[0103] Disclosed herein is a polymeric solution-based ink for additive manufacturing. Inks used for additive manufacturing have the ability to phase change from a liquid ink phase to a solid phase once extruded in a 3D structure. SLA utilizes polymers which can melt easily to form a liquid ink and solidify at room temperature, while FDM used light activation to solidify the polymeric structures. Attention is turned to multicomponent solutions such as ternary solutions comprising at least: a polymer, a volatile solvent compound, and a nonsolvent compound. In some embodiments, the multicomponent solution can comprise at least one polymer, at least one volatile solvent compound, and at least one nonsolvent compound. In some embodiments, the solution can further comprise additives such as multipole polymers,
volatile nonsolvent compounds inhibitors, etc. The aforementioned solution can comprise the three components in such a ratio that the polymer is substantially dissolved in the solution to create a liquid ink phase. After extruding the ink onto a substrate, the volatile solvent compound begins to evaporate spontaneously, which drives a phase inversion from a liquid ink phase to a solid phase. As the solution solidifies, the extruded 3D polymeric structure is created on the substrate. Such an embodiment can provide the ability to use any desired polymer in 3D printing, so long as appropriate volatile solvent and nonsolvent compounds are selected. This is due to the spinodal decomposition of a ternary solution. Selecting an ink composition such that evaporation of a small amount of the volatile solvent compound will drive the solution composition into the unstable region of phase equilibria will cause a phase inversion of the solution to create a solid polymer-rich phase. In other words, the evaporation of the volatile solvent compound causes the liquid ink solution to be unstable, and, in an effort to become more stable, drives the solidification of the polymer.
[0104] Also disclosed herein are additive manufacturing devices for printing the presently disclosed ink, such as a direct ink writing 3D printer. Because the presently disclosed multicomponent ink is able to evaporate the volatile solvent compound and solidify spontaneously, measures must be taken to ensure the ink does not solidify before reaching the substrate. Consequently, the presently disclosed 3D printer can provide an additional vapor nozzle and control volume shell. The vapor nozzle can then inject a vapor comprising the volatile solvent compound to the control volume shell. Such an embodiment would saturate the atmosphere surrounding the ink and prevent or slow the evaporation of the volatile solvent compound from the ink until the solution reaches the substrate. The vapor nozzle can further be configured to saturate the atmosphere around the substrate to better control the rate of evaporation of the volatile solvent compound from the ink once printed. Also disclosed herein are methods of additive manufacturing utilizing the same.
[0105] Disclosed herein are methods of solution-based additive manufacturing comprising a ternary ink solution. In some embodiments, the ternary ink solution can comprise a polymer, a volatile solvent compound, and a nonsolvent compound. Suitable examples of a polymer can include, but are not limited to, biopolymers, inorganic polymers, organic polymers, conductive polymers, copolymers, fluoropolymers, polyterpenes, phenolic resins, polyanhydrides, polyketones, polyesters, polyimides (such as Matrimid 5218 or 6FDA-DAM), polyolefins, rubbers, silicones, silicone rubbers, superabsorbent polymers, synthetic rubbers, vinyl polymers, or a combination thereof. Other suitable examples of the polymer can include, but are not limited to, polyester resin, polyurethanes, polyurea, vulcanized rubber, bakelite,
duroplast, urea formaldehyde, melamine resin, diallyl phthalate, epoxy resin, benzoxazines, polyimides, bismaleimides, cyanate esters, furan resins, silicone resins, thiolyte, vinyl ester, acrylic, polymethyl methacrylate, acrylonitrile butadiene styrene, chlorinated polyvinyl chloride, nylon, polylactic acid, polybenzimidazole, polycarbonate, polyether sulfone, polyoxymethylene, polyether ether ketone, polyethylene, polyphenylene sulfide, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene fluoride, polytetrafluoroethylene, polyisoprene, polybutadiene, chloroprene, butyl rubber, halogenated butyl rubber, styrene butadiene, nitrile rubber, halogenated nitrile rubber, ethylene propylene rubber, ethylene propylene diene rubber, epichlorohydrin rubber, polyacrybc rubber, silicone rubber, fluorosibcone, fluoroelastomers, perfluoroelastomers, polyether block amides, chlorosulfonated polyethylene, ethylene vinyl acetate, thermoplastic elastomers, polysulfide rubber, cellulose acetate (CA), polymer of intrinsic micro porosity 1 (PIM-l), or a combination thereof. Additional examples of suitable polymers useable include substituted or unsubstituted polymers and may be selected from polysulfones; poly(styrenes), including styrene-containing copolymers such as acrylonitrilestyrene copolymers, styrene-butadiene copolymers and styrene-vinylbenzylhabde copolymers; polycarbonates; cellulosic polymers, such as cellulose acetate-butyrate, cellulose propionate, ethyl cellulose, methyl cellulose, nitrocellulose, etc.; polyamides and polyimides, including aryl polyamides and aryl polyimides; polyethers; polyetherimides; polyetherketones; polyethersulfones; poly(arylene oxides) such as poly(phenylene oxide) and poly(xylene oxide); poly(esteramide-diisocyanate); polyurethanes; polyesters (including polyarylates), such as polyethylene terephthalate, poly(alkyl methacrylates), poly(acrylates), poly(phenylene terephthalate), etc.; polypyrrolones; polysulfides; polymers from monomers having alpha-olefmic unsaturation other than mentioned above such as poly (ethylene), poly (propylene), poly(butene-l), poly (4-methyl pentene-l), polyvinyls, e.g., poly(vinyl chloride), poly(vinyl fluoride), poly(vinybdene chloride), poly(vinybdene fluoride), poly(vinyl alcohol), poly(vinyl esters) such as poly(vinyl acetate) and poly(vinyl propionate), poly(vinyl pyridines), poly(vinyl pyrrobdones), poly(vinyl ethers), poly(vinyl ketones), poly(vinyl aldehydes) such as poly(vinyl formal) and poly(vinyl butyral), poly(vinyl amides), poly(vinyl amines), poly(vinyl urethanes), poly(vinyl ureas), poly(vinyl phosphates), and poly(vinyl sulfates); polyallyls; poly(benzobenzimidazole); polyhydrazides; polyoxadiazoles; polytriazoles; poly (benzimidazole); polycarbodiimides; polyphosphazines; etc., and interpolymers and the like. As would be appreciated by one of ordinary skill in the art, the presently disclosed ink can be compatible with any known and/or
future polymers so long as the volatile solvent compound and nonsolvent compound are selected correctly.
[0106] As used herein, the term“volatile” refers to a substance which can vaporize readily from a liquid to a vapor at room temperature and atmospheric conditions. The volatile solvent compound can be selected such that the vapor pressure of the volatile solvent compound is greater than the vapor pressure of the nonsolvent compound. The volatile solvent compound can be any substance able to dissolve substantially dissolve the polymer to create a liquid solution at room temperature and pressure. Suitable examples of a volatile solvent can include, but are not limited to, nonpolar solvents, polar aprotic solvents, polar protic solvents, water- miscible solvents, or a combination thereof. There are many examples of appropriate solvents known to one of ordinary skill in the art, but suitable examples can include, but are not limited to, acetaldehyde, acetic acid, acetone, acetonitrile, butanediol, butoxyethanol, butyric acid, diethanolamine, diethylenetriamine, dimethyl acetamide (DMAc), dimethylformamide (DMF), dimethoxy ethane, dimethyl sulfoxide (DMSO), dioxane, ethanol, ethylamine, ethylene glycol, formic acid, furfuryl alcohol, glycerol, methanol, methyl diethanolamine, methyl isocyanide, N-methyl-2-pyrrolidone (NMP), propanol, propanediol, propanoic acid, propylene glycol, pyridine, tetrahydrofuran (THF), triethylene glycol, dimethyl hydrazine, hydrazine, hydrofluoric acid, hydrogen peroxide, nitric acid, sulfuric acid, pentane, cyclopentane, hexane, cyclohexane, benzene, toluene, chloroform, diethyl ether, dichloromethane, or a combination thereof. As would be appreciated by one of ordinary skill in the art, the volatile solvent compound can be selected from any substance able to dissolve the desired polymer at room temperature and pressure with a vapor pressure greater than the nonsolvent compound. In some embodiments, the weight ratio of the volatile solvent compound can be present in an amount such that the polymer dissolves at the additive manufacturing operating conditions in an amount of 10% or greater (e.g., 15% or greater, 20% or greater, 25% or greater, 30% or greater, 35% or greater, 40% or greater, 45% or greater, 50% or greater, or 55% or greater) by weight based on total weight of the ink to form a homogeneous solution. There exist many methods for determining level of solubility of the polymer in the volatile solvent compound and the nonsolvent compound. In some embodiments, the Hildebrand solubility parameters can be determined for the polymer and the volatile solvent compound. In some embodiments, the Hildebrand solubility parameters of the polymer and the volatile solvent compound can have a difference of 3.6 MPal/2 or less. As would be appreciated by one of ordinary skill in the art, such an embodiment would provide a
volatile solvent compound which would be able to dissolve the polymer to create a substantially homogeneous solution.
[0107] As used herein, the term“nonsolvent” refers to a substance which is substantially unable to dissolve the polymer at room temperature and pressure. In some embodiments, the volatile solvent compound and nonsolvent compound are selected to construct a desired ternary solution with a specific polymer. For instance, the ternary ink solution can comprise a polymer of intrinsic micro porosity 1 (PIM-l) as the polymer, tetrahydrofuran (THF) as the volatile solvent compound, and dimethylacetamide (DMAc) as the nonsolvent compound. In other words, for a desired printing polymer of PIM-l, THF can be selected as the volatile solvent compound due to its ability to dissolve PIM-l, and DMAc can be selected as the nonsolvent compound due to its lower vapor pressure than THF and inability to dissolve PIM-l. The combination of the three substances can form a ternary ink solution. In some embodiments, the weight ratio of the nonsolvent compound is present in an amount such that the polymer dissolves at the additive manufacturing operating conditions in an amount of 1% or less (e.g., 0.9% or less, 0.8% or less, 0.7% or less, 0.6% or less, 0.5% or less, 0.4% or less, 0.3% or less, 0.2% or less, or 0.1% or less) by weight based on total weight of the ink to form a homogeneous solution. In some embodiments, the Hansen solubility parameters can be determined for the polymer and the volatile solvent compound. In some embodiments, the Relative Energy Difference calculated form the Hansen solubility parameters of the polymer and the nonsolvent compound can be 1 or greater. As would be appreciated by one of ordinary skill in the art, such an embodiment would provide a nonsolvent compound which would be unable to dissolve the polymer.
[0108] In some embodiments, the polymer, the volatile solvent compound, and the nonsolvent compound in the ink can be present in any suitable amount to confer a desirable property to the ink. When selecting a volatile solvent compound and nonsolvent compound for the desired polymer, the ternary phase diagram of the ternary ink solution can provide guidance for the phase inversion process. The ternary phase diagram can be constructed using the three components of the ternary system, as shown in Fig. 1. As would be appreciated by one of ordinary skill in the art, such an embodiment would provide a ternary phase diagram comprising a homogenous region, a nonhomogeneous region, and a binodal curve. In such an embodiment, the ink is selected to begin as a stable liquid solution in the homogenous region. As the volatile solvent compound evaporates, the relative polymer concentration increases driving the solution composition across the binodal line into the nonhomogeneous region, creating an unstable solution. Because the solution is thermodynamically unstable in the
homogenous region, the solution undergoes a phase inversion to a more thermodynamically stable configuration comprising a solidified polymer-rich phase, and a liquid polymer-lean phase. This phase inversion process can alternatively be called spinodal decomposition. The solidified polymer-rich phase provides the extruded polymeric structure and can be further dried to evaporate any remaining solvent or nonsolvent compound. In some embodiments, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation at the additive manufacturing operating conditions of 25% or less (e.g., 24% or less, 23% or less, 22% or less, 21% or less, 20% or less, 19% or less, 18% or less, 17% or less, 16% or less, 15% or less, 14% or less, 13% or less, 12% or less, 11% or less, 10% or less, 9% or less, 8% or less, 7% or less, 6% or less, 5% or less, 4% or less, 3% or less, 2% or less, or 1% or less) of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase. In some embodiments, the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation at the additive manufacturing operating conditions of 0.1% or greater (e.g., 0.2 % or greater, 0.3% or greater, 0.4% or greater, 0.5% or greater, 0.6% or greater, 0.7% or greater, 0.8% or greater, 0.9% or greater, 1% or greater, 5% or greater, 10% or greater, 15% or greater, 20% or greater, or 25% or greater) of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase. As would be appreciated by one of ordinary skill in the art, once the ternary solution is selected, the binodal line can be determined by using the cloud-point technique. While the cloud-point technique is known by one of ordinary skill in the art, an exemplary method for performing the cloud-point technique can be found in Kosuri et al. (Kosuri, M. R., Koros, W. I, Journal of Membrane Science, 2008, 320, 65). Such an embodiment would provide for minimal weight loss during the phase change from a liquid ink to a solid printed structure. As shown in Fig. 2, a first composition is selected for the ternary ink solution. Evaporation of the volatile solvent compound drives the solution composition into the nonhomogeneous region where spinodal decomposition occurs. The solution then phase-inverts into a polymer-rich phase and a polymer-lean phase, as desired.
[0109] The methods of solution-based additive manufacturing disclosed herein can comprise a direct ink writing printer for printing a ternary ink solution. In some embodiments, the printer can comprise an ink holding container, an ink nozzle configured to attach to the ink holding container, a vapor nozzle, and a moving stage for a substrate. In some embodiments, the moving stage can be configured to detachably attach to a substrate. In some embodiments, the
distance between the ink nozzle and the moving stage can comprise an air gap substantially surrounded by a control volume shell. For instance, the control volume shell can comprise a cylindrical shell with an opening for receiving a vapor nozzle. The control volume shell can comprise any hollow shape to substantially surround the ink nozzle and air gap, including but not limited to, cylindrical, conical, rectangular, frusto-conical, elliptical, or any combination thereof.
[0110] As shown in Figs. 3A-B, the printer can comprise an ink holding container 310, an ink nozzle 320, a vapor nozzle 330, a moving stage for a substrate 340, and a control volume shell 350 configured to substantially surround the air gap between the ink nozzle and the substrate. In some embodiments, the vapor nozzle 330 can provide a feed of vapor comprising the volatile solvent compound to the control volume shell 350. As would be appreciated by one of ordinary skill in the art, such an embodiment would provide the user control over the atmosphere surrounding the ink in the air gap during the printing process to adjust the rate of evaporation of the volatile solvent compound from the ink. Due to the nature of the volatile solvent compound evaporating from the liquid ink to create a solid extruded polymer structure, control over the atmosphere surrounding the extruded ink is desired in order to better control the solidification properties and other properties of the extruded structure. Such properties can include, but are not limited to, structural integrity, microporosity, macroporosity, flexural strength, tensile strength, density, viscosity, and the like. In some embodiments, the control volume shell 350 can further be configured to provide the vapor feed to the atmosphere substantially surrounding the substrate. Such an embodiment would provide further control over the rate of evaporation of the volatile solvent compound and the properties of the extruded polymer structure. In some embodiments, the vapor nozzle 330 can provide a saturated atmosphere to the control volume shell 350 and/or the atmosphere surrounding the substrate 340.
[0111] In some embodiments, the ink nozzle 320 and ink holding container 310 can comprise a metal. Suitable examples of a metal can include, but are not limited to, iron alloys, stainless steel, steel, cast iron, aluminum, titanium, copper, magnesium, bronze, brass, alloys, and the like.
[0112] In some embodiments, the moving stage 340 can be configured to move laterally. For instance, the moving stage 340 can be configured to move in an x-direction and a y-direction. In other words, the moving stage 340 can be configured to move forwards, backwards, and sideways. In some embodiments, the ink nozzle 320 and ink holding container 310 can be configured to move vertically. For instance, the ink nozzle 320 can be configured to move in a
z-direction. In some embodiments, the printer can further comprise one or more stepper motors attached to the moving stage 340 and/or ink nozzle 320. As would be appreciated by one of ordinary skill in the art, such an embodiment would provide the moving stage 340 the ability to step in an x-direction and a y-direction and the ink nozzle 320 the ability to step in a z- direction. In some embodiments, the printer can further comprise one or more controllers attached to the one or more stepper motors configured to control the moving stage 340 and the ink nozzle 320.
[0113] In some embodiments, the substrate can comprise a plate comprising a coating layer comprising the desired polymer. In some embodiments, the coating layer can comprise a separate polymer than the desired polymer. As would be appreciated by one of ordinary skill in the art, such an embodiment would provide for improved adhesion and bonding between the extruded polymer structure and the substrate. Suitable examples of materials for a substrate plate can include, but are not limited to, glass, metal, steel, stainless steel, plastic, polymer, brass or a combination thereof.
[0114] Also disclosed herein are methods of solution-based additive manufacturing comprising a ternary ink solution and a direct ink writing printer. In some embodiments, the method can comprise the steps of providing an ink comprising a polymer, a volatile solvent compound, and a nonsolvent compound, and depositing the ink through an air gap and onto a substrate to create an extruded polymer structure. In some embodiments, the method can further comprise evaporating the volatile solvent compound. In some embodiments, the method can further comprise drying the extruded polymer structure at a low temperature to remove residual solvent. In some embodiments, the method can further comprise washing the extruded polymer structure with two or more nonsolvent compounds. In some embodiments, the method can further comprise extruding the ink through a nozzle or a pneumatic micronozzle. In some embodiments, the method can further comprise coating the substrate with a coating layer comprising the polymer to enhance binding between the extruded polymer structure and the substrate. In some embodiments, the substrate can comprise a plate comprise the polymer to enhance binding. In some embodiments, the method can further comprise injecting a vapor comprising the volatile solvent compound to a shell substantially surrounding the nozzle and the air gap using a vapor nozzle. In some embodiments, the method can further comprise saturating the atmosphere in the shell or around the extruded polymer structure such that the evaporation of the volatile solvent compound from the ink is slowed. In some embodiments, the method can further comprise moving the substrate laterally and moving the nozzle vertically. In some embodiments, the method can further comprise controlling the diameter of
the ink extrusion by adjusting the movement speed of the substrate. In some embodiments, the method can further comprise layering two or more layers on the substrate by adjusting the vertical height of the nozzle to create the extruded polymer structure. In some embodiments, the method can further comprise pressurizing the ink. In some embodiments, the method can further comprise cutting the extruded polymer structure off from the substrate. In some embodiments, the method can further comprise immersing the substrate and extruded polymer structure from additive manufacturing in a water bath. In some embodiments, the nonsolvent compound can comprise a volatile nonsolvent compound. In some embodiments, the evaporating can further comprise evaporating the volatile nonsolvent compound. In some embodiments, the method can further comprise immersing the extruded polymer structure in a bath comprising a plasticizing nonsolvent compound. In some embodiments, the method can further comprise annealing the extruded polymer structure in a vacuum oven.
[0115] In some embodiments, the additive manufacturing operating conditions can be selected to confer a desirable property to the ink and/or the extruded polymer structure. In some embodiments, the operating temperature of the additive manufacturing process can be 20 °C or greater (e.g., 25 °C or greater, 30 °C or greater, 35 °C or greater, 40 °C or greater, 45 °C or greater, 50 °C or greater, 55 °C or greater, 60 °C or greater, 65 °C or greater, 70 °C or greater, 75 °C or greater, 80 °C or greater, 85 °C or greater, 90 °C or greater, 95 °C or greater, or 100 °C or greater). In some embodiments, the operating temperature of the additive manufacturing process can be 100 °C or less (e.g., 20 °C or less, 25 °C or less, 30 °C or less, 35 °C or less, 40 °C or less, 45 °C or less, 50 °C or less, 55 °C or less, 60 °C or less, 65 °C or less, 70 °C or less, 75 °C or less, 80 °C or less, 85 °C or less, 90 °C or less, or 95 °C or less). In some embodiments, the operating temperature of the additive manufacturing process can be from 20 °C to 100 °C (e.g., from 20 °C to 25 °C, from 25 °C to 30 °C, from 30 °C to 35 °C, from 35 °C to 40 °C, from 40 °C to 45 °C, from 45 °C to 50 °C, from 50 °C to 55 °C, from 55 °C to 60 °C, from 60 °C to 65 °C, from 65 °C to 70 °C, from 70 °C to 75 °C, from 75 °C to 80 °C, from 80 °C to 85 °C, from 85 °C to 90 °C, from 90 °C to 95 °C, or from 95 °C to 100 °C). In some embodiments, the operating temperature of the additive manufacturing process can be 200 °C or less. In some embodiments, the operating temperature of the additive manufacturing process can be 0 °C or greater. In some embodiments, the operating temperature of the additive manufacturing process can be from 0 °C to 200 °C. In some embodiments, the operating pressure of the additive manufacturing process can be 0.9 atm or greater (e.g., 1 atm or greater, 1.5 atm or greater, 2 atm or greater, 3 atm or greater, 4 atm or greater, 5 atm or greater, 6 atm or greater, 7 atm or greater, 8 atm or greater, 9 atm or greater, 10 atm or greater, 11 atm or greater, 12 atm or
greater, or 13 atm or greater). In some embodiments, the operating pressure of the additive manufacturing process can be 14 atm or less (e.g., 13 atm or less, 12 atm or less, 11 atm or less, 10 atm or less, 9 atm or less, 8 atm or less, 7 atm or less, 6 atm or less, 5 atm or less, 4 atm or less, 3 atm or less, 2 atm or less, 1.5 atm or less, or 1 atm or less).
[0116] Reference will now be made in detail to exemplary embodiments of the disclosed technology, examples of which are illustrated in the accompanying drawings and disclosed herein. Wherever convenient, the same references numbers will be used throughout the drawings to refer to the same or like parts.
EXAMPLES
[0117] The following examples are provided by way of illustration but not by way of limitation.
Example 1
Methods
[0118] A desired polymer for printing (Matrimid 5218) was purchased from Ribelin. The polymer powders were dried overnight under vacuum at 120 °C. All solvents were anhydrous and purchased from either Sigma Aldrich or Alfa Aesar and used as received. The cloud-point technique was used to determine the binodal boundary of the ternary phase diagram as would be known by one of ordinary skill in the art. Tetrahydrofuran (THF) is chosen as the volatile solvent compound due to its high volatility and ability to dissolve Matrimid 5218. Water is selected as the nonsolvent compound due to its abundance and small environmental impact. After determining the binodal boundary on the ternary phase diagram, a ternary ink is prepared comprising 30% Matrimid 5218, 68% THF, and 2% water, by weight. A cartesian 3D printer was built to process ternary inks. The printer comprises a stainless-steel ink container, a coaxial dual-channel micronozzle for the ink, and a cartesian moving substrate. The ternary ink is prepared in the container, and the container is sealed via Swagelok fittings and placed onto a rotating roller to cure (10 rpm, 80 °C) for at least 3 days. The ink is extruded through a stainless- steel needle (inner diameter of 311 microns) by pressurizing the interior of the container (100 kPa) using a compressed nitrogen gas cylinder. The ink is printed at a linear speed of 10 mm/s. A glass plate coated with a thin Matrimid 5218 film is used as the substrate. The ink is printed in a THF-saturated atmosphere using the vapor nozzle.
Example 2
Methods
[0119] A desired polymer for printing (Matrimid 5218) was purchased from Ribelin. The polymer powders were dried overnight under vacuum at 120 °C. All solvents were anhydrous and purchased from either Sigma Aldrich or Alfa Aesar and used as received. The cloud-point technique was used to determine the binodal boundary of the ternary phase diagram as would be known by one of ordinary skill in the art. Toluene is selected as the nonsolvent compound to enlarge the nonhomogeneous region of the ternary phase diagram. A ternary ink is prepared comprising 30% Matrimid 5218, 50% THF, and 20% toluene, by weight. A cartesian 3D printer was built to process ternary inks. The printer comprises a stainless-steel ink container, a coaxial dual-channel micronozzle for the ink, and a cartesian moving substrate. The ternary ink is prepared in the container, and the container is sealed via Swagelok fittings and placed onto a rotating roller to cure (10 rpm, 80 °C) for at least 3 days. The ink is extruded through a stainless- steel needle (inner diameter of 311 microns) by pressurizing the interior of the container (100 kPa) using a compressed nitrogen gas cylinder. The ink is printed at a linear speed of 10 mm/s. A glass plate coated with a thin Matrimid 5218 film is used as the substrate. The ink is printed in a THF-saturated atmosphere using the vapor nozzle.
Example 3
Methods
[0120] An extruded polymer structure is prepared using the method from Example 2. The polymer scaffold is then immersed into a 75% dimethylformamide (DMF), 25% water, by weight, solution (24 hours at 25 °C). The wet scaffold is then wiped and dried in a vacuum oven (85 kPa vacuum, 120 °C, 24 hours). This method is able to significantly tune the porosity of the extruded polymer structure.
Example 4
Methods
[0121] A desired polymer for printing (PIM-l) was synthesized using techniques known to one of ordinary skill in the art and as outlined in Jue et al. (Jue, M. L., McKay, C. S., McCool, B. A., Finn, M., Lively, R. P., Macromolecules, 2015, 48, 5780). After synthesis, the PIM-l was washed with dimethylformamide (DMF) and methanol sequentially to remove unreacted monomers and oligomers. The PIM-l was then vacuum dried overnight at 80 °C to remove residual solvents. All solvents were purchased from Sigma Aldrich or Alfa Aesar and used as
received. The cloud-point technique was used to determine the binodal boundary of the ternary phase diagram as would be known by one of ordinary skill in the art. A ternary ink solution is prepared using tetrahydrofuran (THF) as the volatile solvent compound and dimethyl acetamide (DMAc) as the nonsolvent compound. The composition of the ink was prepared to be in a 10:23: 17 PIM-l :THF:DMAc ratio, by weight. A cartesian 3D printer was built to process ternary inks. The printer comprises a stainless-steel ink container, a coaxial dual channel micronozzle for the ink, and a cartesian moving substrate. The ternary ink is prepared in the container, and the container is sealed via Swagelok fittings and placed onto a rotating roller to cure (10 rpm, 50 °C) for at least 12 hours. The ink is extruded through a stainless-steel needle (inner diameter of 311 microns) by pressurizing the interior of the container (350-1300 kPa) using a compressed nitrogen gas cylinder. The ink is printed at a linear speed of 10 mm/s. The ink is printed in a THF-saturated atmosphere using the vapor nozzle.
Example 5
Methods
[0122] A desired polymer for printing, cellulose acetate (CA), was obtained. All solvents were purchased from Sigma Aldrich or Alfa Aesar and used as received. The cloud-point technique was used to determine the binodal boundary of the ternary phase diagram as would be known by one of ordinary skill in the art. A ternary ink solution was prepared using acetone as the volatile solvent compound and water as the nonsolvent compound. The composition of the ink was prepared to be in a 23:52:25 CA: acetone: water ratio, by weight. A cartesian 3D printer was built to process ternary inks. The printer comprises a stainless-steel ink container, a coaxial dual-channel micronozzle for the ink, and a cartesian moving substrate. The ternary ink is prepared in the container, and the container is sealed via Swagelok fittings and placed onto a rotating roller to cure (10 rpm, 50 °C) for at least 12 hours. The ink is extruded through a stainless-steel needle (inner diameter of 311 microns) by pressurizing the interior of the container (350-1300 kPa) using a compressed nitrogen gas cylinder. The ink is printed at a linear speed of 10 mm/s. The ink is printed in an acetone-saturated atmosphere using the vapor nozzle.
[0123] While the present disclosure has been described in connection with a plurality of exemplary aspects, as illustrated in the various figures and discussed above, it is understood that other similar aspects can be used or modifications and additions can be made to the described aspects for performing the same function of the present disclosure without deviating therefrom. For example, in various aspects of the disclosure, methods and compositions were
described according to aspects of the presently disclosed subject matter. However, other equivalent methods or composition to these described aspects are also contemplated by the teachings herein. Therefore, the present disclosure should not be limited to any single aspect, but rather construed in breadth and scope in accordance with the appended claims.
Claims
1. A method of additive manufacturing, the method comprising:
providing an ink, comprising:
a polymer,
a volatile solvent compound, and
a nonsolvent compound; and
depositing, through an air gap and onto a substrate, the ink to create an extruded polymer structure.
2. The method of Claim 1, further comprising evaporating at least a portion of the volatile solvent compound.
3. The method of Claim 2, wherein the at least a portion of the volatile solvent compound is 20% or less of the volatile solvent compound by weight based on total weight of the ink, and wherein the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
4. The method of Claim 2, wherein the at least a portion of the volatile solvent compound is 15% or less of the volatile solvent compound by weight based on total weight of the ink, and wherein the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
5. The method of Claim 2, wherein the at least a portion of the volatile solvent compound is 10% or less of the volatile solvent compound by weight based on total weight of the ink, and wherein the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
6. The method of Claim 2, wherein the at least a portion of the volatile solvent compound is 5% or less of the volatile solvent compound by weight based on total weight of the ink, and wherein the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
7. The method of Claim 2, wherein the at least a portion of the volatile solvent compound is 3% or less of the volatile solvent compound by weight based on total weight of the ink, and wherein the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
8. The method of Claim 2, wherein the at least a portion of the volatile solvent compound is 2% or less of the volatile solvent compound by weight based on total weight of the ink, and wherein the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
9. The method of Claim 2, wherein the at least a portion of the volatile solvent compound is 1% or less of the volatile solvent compound by weight based on total weight of the ink, and wherein the evaporating causes a phase change in the ink from a liquid ink phase to a solid extruded phase.
10. The method of any of Claims 3-9, wherein the at least a portion of the volatile solvent compound is at least 0.1% of the volatile solvent compound by weight based on total weight of the ink.
11. The method of any of Claims 3-9, wherein the at least a portion of the volatile solvent compound is at least 0.3% of the volatile solvent compound by weight based on total weight of the ink.
12. The method of any of Claims 3-9, wherein the at least a portion of the volatile solvent compound is at least 0.5% of the volatile solvent compound by weight based on total weight of the ink.
13. The method of any of Claims 3-9, wherein the at least a portion of the volatile solvent compound is at least 0.7% of the volatile solvent compound by weight based on total weight of the ink.
14. The method of any of Claims 3-9, wherein the at least a portion of the volatile solvent compound is at least 0.9% of the volatile solvent compound by weight based on total weight of the ink.
15. The method of any of Claims 1-14, further comprising washing, with one or more nonsolvent compounds, the extruded polymer structure.
16. The method of Claim 15, further comprising drying, at low temperature, the extruded polymer structure to remove residual solvent.
17. The method of any of Claims 1-16, wherein the depositing occurs with a pneumatic micronozzle.
18. The method of any of Claims 1-12, further comprising coating the substrate with a coating layer comprising the polymer to enhance binding between the extruded polymer structure and the substrate.
19. The method of any of Claims 1-18, wherein the substrate comprises a plate comprising the polymer.
20. The method of any of Claims 1-19, further comprising injecting, using a vapor nozzle, a vapor comprising the volatile solvent compound to a shell substantially surrounding the nozzle and the air gap.
21. The method of Claim 20, further comprising saturating, with the vapor comprising the volatile solvent compound, an atmosphere in the shell substantially surrounding the nozzle and the air gap such that the evaporation of the volatile solvent compound from the ink is slowed.
22. The method of any of Claims 20-21, further comprising saturating, with the vapor comprising the volatile solvent compound, an atmosphere surrounding the extruded polymer structure to slow the evaporation of the volatile solvent compound.
23. The method of any of Claims 1-22, further comprising moving, laterally in an x- direction and a y-direction, the substrate.
24. The method of any of Claims 1-23, further comprising moving, vertically in a z- direction, the nozzle.
25. The method of any of Claims 23-24, further comprising controlling, by adjusting the movement speed of the substrate, the diameter of the ink extrusion on the substrate.
26. The method of any of Claims 23-24, further comprising layering, by adjusting the vertical height of the nozzle, two or more layers on the substrate to create the extruded polymer structure.
27. The method of any of Claims 1-26, further comprising pressurizing the ink.
28. The method of any of Claims 1-27, further comprising cutting, off from the substrate, the extruded polymer structure.
29. The method of any of Claims 1-28, further comprising immersing the substrate and the extruded polymer structure in a water bath after printing a 3D structure.
30. The method of any of Claims 1-29, wherein the nonsolvent compound comprises a volatile nonsolvent compound.
31. The method of Claim 30, further comprising evaporating at least a portion of the volatile nonsolvent compound.
32. The method of any of Claims 1-31, further comprising immersing the extruded polymer structure in a bath comprising a plasticizing nonsolvent compound.
33. The method of any of Claims 1-32, further comprising annealing, in a vacuum oven, the extruded polymer structure.
34. A three-dimensional direct ink writing printer for additive manufacturing, the printer comprising:
an ink holding container;
an ink nozzle configured to attach to the ink holding container;
a vapor nozzle; and
a moving stage for a substrate;
wherein a distance between the ink nozzle and the moving stage comprises an air gap substantially surrounded by a control volume shell, and wherein the vapor nozzle is configured to provide a feed into the control volume shell.
35. The printer of Claim 34, wherein the moving stage is configured to move laterally in an x-direction and a y-direction.
36. The printer of any of Claims 34-35, wherein the ink holding container and the ink nozzle are configured to move vertically in a z-direction.
37. The printer of any of Claims 34-36, wherein the vapor nozzle is configured to control a vapor concentration of a volatile solvent compound in the control volume shell.
38. The printer of any of Claims 34-37, wherein the vapor nozzle is configured to saturate the control volume shell with the vapor comprising the volatile solvent compound.
39. The printer of any of Claims 34-38, wherein the moving stage is configured to detachably attach to a substrate.
40. The printer of any of Claims 34-39, wherein the vapor nozzle is further configured to saturate the substrate with the vapor comprising the volatile solvent.
41. The printer of any of Claims 34-40, wherein the ink holding container and the ink nozzle comprise stainless steel.
42. The printer of any of Claims 34-41, further comprising one or more stepper motors attached to the moving stage and ink nozzle and configured with a predetermined step angle to move the moving stage and ink nozzle.
43. The printer of Claim 42, further comprising one or more controllers attached to the one or more stepper motors and configured to control the moving stage and the ink nozzle.
44. The printer of any of Claims 42-43, wherein the one or more controllers are configured to adjust the movement speed of the moving stage to control the diameter of the ink extrusion on the substrate.
45. The printer of any of Claims 42-44, wherein the one or more controllers are configured to move the moving stage laterally.
46. The method of any of Claims 42-45, wherein the one or more controllers are configured to move the ink holding container and the ink nozzle vertically.
47. The printer of any of Claims 44-46, further comprising a coating layer on the substrate comprising a polymer to enhance binding capabilities of the substrate.
48. The printer of any of Claims 44-47, wherein the substrate comprises a plate comprising a polymer.
49. A solution-based polymeric ink for additive manufacturing, the ink comprising:
a polymer;
a volatile solvent compound; and
a nonsolvent compound;
wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of 20% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
50. The ink of Claim 49, wherein the Hildebrand solubility parameters of the polymer and volatile solvent compound have a difference of 3.6 MPa1/2 or less.
51. The ink of any of Claims 49-50, wherein the Relative Energy Difference calculated from the Hansen solubility parameters of the polymer and the nonsolvent compound is 1 or greater.
52. The ink of any of Claims 49-51, wherein the volatile solvent compound has a vapor pressure greater than the nonsolvent compound.
53. The ink of any of Claims 49-52, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of 15% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
54. The ink of any of Claims 49-52, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of 10% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
55. The ink of any of Claims 49-52, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of 5% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
56. The ink of any of Claims 49-52, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of 3% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
57. The ink of any of Claims 49-52, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of 2% or less of the volatile solvent compound by weight based on total
weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
58. The ink of any of Claims 49-52, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of 1% or less of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
59. The ink of any of Claims 49-58, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.1% of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
60. The ink of any of Claims 49-58, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.3% of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
61. The ink of any of Claims 49-58, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.5% of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
62. The ink of any of Claims 49-58, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.7% of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
63. The ink of any of Claims 49-58, wherein the weight ratios of the polymer, volatile solvent compound, and nonsolvent compound are present in an amount such that evaporation, at 23°C and 1 atm, of at least 0.9% of the volatile solvent compound by weight based on total weight of the ink results in a phase change in the ink from a liquid ink phase to a solid extruded phase.
64. The ink of any of Claims 49-63, wherein the weight ratio of the volatile solvent compound is present in an amount such that, when the ink is at 23 °C and 1 atm, the polymer is dissolved in an amount of 10% or greater by weight based on total weight of the ink to form a homogeneous solution.
65. The ink of any of Claims 49-63, wherein the weight ratio of the volatile solvent compound is present in an amount such that, when the ink is at 23 °C and 1 atm, the polymer is dissolved in an amount of 15% or greater by weight based on total weight of the ink to form a homogeneous solution.
66. The ink of any of Claims 49-63, wherein the weight ratio of the volatile solvent compound is present in an amount such that, when the ink is at 23 °C and 1 atm, the polymer is dissolved in an amount of 20% or greater by weight based on total weight of the ink to form a homogeneous solution.
67. The ink of any of Claims 49-63, wherein the weight ratio of the volatile solvent compound is present in an amount such that, when the ink is at 23 °C and 1 atm, the polymer is dissolved in an amount of 25% or greater by weight based on total weight of the ink to form a homogeneous solution.
68. The ink of any of Claims 49-63, wherein the weight ratio of the volatile solvent compound is present in an amount such that, when the ink is at 23 °C and 1 atm, the polymer is dissolved in an amount of 30% or greater by weight based on total weight of the ink to form a homogeneous solution.
69. The ink of any of Claims 49-63, wherein the weight ratio of the volatile solvent compound is present in an amount such that, when the ink is at 23 °C and 1 atm, the polymer is
dissolved in an amount of 40% or greater by weight based on total weight of the ink to form a homogeneous solution.
70. The ink of any of Claims 49-63, wherein the weight ratio of the volatile solvent compound is present in an amount such that, when the ink is at 23 °C and 1 atm, the polymer is dissolved in an amount of 50% or greater by weight based on total weight of the ink to form a homogeneous solution.
71. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 1% or less by weight based on total weight of the ink to form a homogeneous solution.
72. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.9% or less by weight based on total weight of the ink to form a homogeneous solution.
73. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.8% or less by weight based on total weight of the ink to form a homogeneous solution.
74. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.7% or less by weight based on total weight of the ink to form a homogeneous solution.
75. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.6% or less by weight based on total weight of the ink to form a homogeneous solution.
76. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.5% or less by weight based on total weight of the ink to form a homogeneous solution.
77. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.4% or less by weight based on total weight of the ink to form a homogeneous solution.
78. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.3% or less by weight based on total weight of the ink to form a homogeneous solution.
79. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.2% or less by weight based on total weight of the ink to form a homogeneous solution.
80. The ink of any of Claims 49-70, wherein the weight ratio of the nonsolvent compound is present in an amount such that, when the ink is at 23°C and 1 atm, the polymer is dissolved in an amount of 0.1 % or less by weight based on total weight of the ink to form a homogeneous solution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/967,808 US11485869B2 (en) | 2018-02-08 | 2019-02-08 | Solution-based additive manufacturing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862627835P | 2018-02-08 | 2018-02-08 | |
US62/627,835 | 2018-02-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019157307A1 true WO2019157307A1 (en) | 2019-08-15 |
Family
ID=67548479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2019/017248 WO2019157307A1 (en) | 2018-02-08 | 2019-02-08 | Solution-based additive manufacturing |
Country Status (2)
Country | Link |
---|---|
US (1) | US11485869B2 (en) |
WO (1) | WO2019157307A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11986993B2 (en) | 2020-07-02 | 2024-05-21 | The Regents Of The University Of Michigan | Methods for forming three-dimensional polymeric articles |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022272000A1 (en) * | 2021-06-23 | 2022-12-29 | Virginia Tech Intellectual Properties, Inc. | Methods of additive manufacturing by direct ink writing of emulsion compositions |
WO2024015821A2 (en) * | 2022-07-12 | 2024-01-18 | Robert Sappington | Apparatus and methods for manufacturing products containing sequestered carbon |
WO2024155523A1 (en) | 2023-01-18 | 2024-07-25 | ExxonMobil Technology and Engineering Company | Co2 sorption with oxidation resistant amines |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1218031A (en) * | 1967-08-04 | 1971-01-06 | Columbia Ribbon & Carbon | Self-supporting transfer elements and processes for making self-supporting transfer elements |
US5929877A (en) * | 1995-06-19 | 1999-07-27 | Franoctyp-Postalia Ag & Co. | Method and arrangement for maintaining the nozzles of an ink print head clean by forming a solvent-enriched microclimate in an antechamber containing the nozzles |
US6139574A (en) * | 1993-10-18 | 2000-10-31 | Children's Medical Center Corporation | Vascularized tissue regeneration matrices formed by solid free form fabrication techniques |
US6344497B1 (en) * | 1996-10-01 | 2002-02-05 | Avecia Limited | Aqueous ink compositions |
US20060014847A1 (en) * | 2002-10-29 | 2006-01-19 | Eytan Cohen | Infrared curable ink compositions |
US20160039120A1 (en) * | 2013-03-14 | 2016-02-11 | Stratasys Ltd. | Polymer based molds and methods of manufacturing there of |
US20160096324A1 (en) * | 2010-10-27 | 2016-04-07 | File2Part, Inc. | Process and apparatus for fabrication of three-dimensional objects |
US20170260418A1 (en) * | 2016-03-08 | 2017-09-14 | 3D Systems, Incorporated | Non-Isocyanate Polyurethane Inks for 3D Printing |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003900180A0 (en) * | 2003-01-16 | 2003-01-30 | Silverbrook Research Pty Ltd | Method and apparatus (dam001) |
AU2010282551C1 (en) * | 2009-08-11 | 2014-08-21 | Glaxosmithkline Llc | Device for dispensing a fluid onto a target and method |
US11007705B2 (en) * | 2015-02-13 | 2021-05-18 | University Of Florida Research Foundation, Inc. | High speed 3D printing system for wound and tissue replacement |
US11198178B2 (en) * | 2017-08-16 | 2021-12-14 | Polyvalor, Limited Partnership | Metal 3D printing method and metallic 3D printed materials |
-
2019
- 2019-02-08 WO PCT/US2019/017248 patent/WO2019157307A1/en active Application Filing
- 2019-02-08 US US16/967,808 patent/US11485869B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1218031A (en) * | 1967-08-04 | 1971-01-06 | Columbia Ribbon & Carbon | Self-supporting transfer elements and processes for making self-supporting transfer elements |
US6139574A (en) * | 1993-10-18 | 2000-10-31 | Children's Medical Center Corporation | Vascularized tissue regeneration matrices formed by solid free form fabrication techniques |
US5929877A (en) * | 1995-06-19 | 1999-07-27 | Franoctyp-Postalia Ag & Co. | Method and arrangement for maintaining the nozzles of an ink print head clean by forming a solvent-enriched microclimate in an antechamber containing the nozzles |
US6344497B1 (en) * | 1996-10-01 | 2002-02-05 | Avecia Limited | Aqueous ink compositions |
US20060014847A1 (en) * | 2002-10-29 | 2006-01-19 | Eytan Cohen | Infrared curable ink compositions |
US20160096324A1 (en) * | 2010-10-27 | 2016-04-07 | File2Part, Inc. | Process and apparatus for fabrication of three-dimensional objects |
US20160039120A1 (en) * | 2013-03-14 | 2016-02-11 | Stratasys Ltd. | Polymer based molds and methods of manufacturing there of |
US20170260418A1 (en) * | 2016-03-08 | 2017-09-14 | 3D Systems, Incorporated | Non-Isocyanate Polyurethane Inks for 3D Printing |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11986993B2 (en) | 2020-07-02 | 2024-05-21 | The Regents Of The University Of Michigan | Methods for forming three-dimensional polymeric articles |
Also Published As
Publication number | Publication date |
---|---|
US11485869B2 (en) | 2022-11-01 |
US20210040343A1 (en) | 2021-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11485869B2 (en) | Solution-based additive manufacturing | |
US12214318B2 (en) | Molecularly-mixed composite membranes and methods for making the same | |
KR910001901B1 (en) | Coating method of high permeability composite cavity fiber membrane | |
CN108136344B (en) | Composite separation membrane | |
US20170197371A1 (en) | Method and apparatus for making a composite | |
KR101714621B1 (en) | Preparation Method for Free Standing Polymer Film with Through-pore Structured Micropores | |
TWI771312B (en) | Porous membranes | |
WO1990012638A1 (en) | Method of producing modified porous membrane | |
CN105339078A (en) | Method for producing polyimide membranes | |
JP5578300B1 (en) | Composite separation membrane | |
KR102062104B1 (en) | Method for producing a hollow fiber carbon membrane | |
JP6698827B2 (en) | Solvent system containing a mixture of dimethyl sulfoxide and at least one lactone | |
Yang et al. | Green fabrication of PVDF superhydrophobic membranes using a green solvent triethyl phosphate (TEP) for membrane distillation | |
Zhou et al. | Improving bonding strength between a hydrophilic coating layer and poly (ethylene terephthalate) braid for preparing mechanically stable braid‐reinforced hollow fiber membranes | |
Adams et al. | The influence of solvent properties on the performance of polysulfone/β‐cyclodextrin polyurethane mixed‐matrix membranes | |
Hou et al. | Facile fabrication and characterization of aliphatic polyketone (PK) micro/nano fiber membranes via electrospinning and a post treatment process | |
KR102456816B1 (en) | Integral asymmetric, isoporous block copolymer membrane with planar sheet geometry | |
KR20130060737A (en) | Porous separation membrane and preparation method thereof | |
WO2017112724A1 (en) | Tunable hollow poly (vinylidene difluoride) microspheres | |
KR102560826B1 (en) | Polymer membrane with pores made by gas pressure | |
Askari et al. | Parametric optimization of poly (ether sulfone) electrospun membrane for effective oil/water separation | |
WO2017052185A1 (en) | Method for producing polymer filtration membrane and polymer filtration membrane | |
JP2010163498A (en) | Polyimide-based resin porous film or coating and method for producing the same | |
KR102598527B1 (en) | Manufacturing Apparatus for electrolyte membrane preventing discoloration, and manufacturing methods for electrolyte membrane using the same | |
US11865573B2 (en) | Slurry for electrostatic spray deposition and method for forming coating film using same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19751693 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 19751693 Country of ref document: EP Kind code of ref document: A1 |