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WO2019095500A1 - 一种显示面板以及显示器 - Google Patents

一种显示面板以及显示器 Download PDF

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Publication number
WO2019095500A1
WO2019095500A1 PCT/CN2017/117357 CN2017117357W WO2019095500A1 WO 2019095500 A1 WO2019095500 A1 WO 2019095500A1 CN 2017117357 W CN2017117357 W CN 2017117357W WO 2019095500 A1 WO2019095500 A1 WO 2019095500A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
glass substrate
display panel
driving chip
Prior art date
Application number
PCT/CN2017/117357
Other languages
English (en)
French (fr)
Inventor
金羽锋
许神贤
周明忠
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US15/744,274 priority Critical patent/US10917970B2/en
Publication of WO2019095500A1 publication Critical patent/WO2019095500A1/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display panel and a display.
  • a television application can be placed on a table, embedded in a wall, or on a glass door, and the like. For example, from the beginning of the floor-standing TV to the common wall-mounted TV.
  • the thickness of the display has become particularly important.
  • the trend of display will be to maintain high definition while reducing the thickness, giving consumers a better consumer experience.
  • the present invention provides a display panel and a display to solve the problem of excessive thickness of the display panel of the prior art.
  • the present invention provides a display panel including a glass substrate, a driving chip, and a flexible circuit board; wherein the driving chip is electrically connected to the flexible circuit board, and the driving chip and the flexible circuit board are collectively disposed on the glass substrate
  • the driving chip is disposed on the flexible circuit board by a COF process;
  • the display panel includes a plurality of driving chips, the glass substrate includes a sub-area, the sub-area area is 5% to 20% of the area of the glass substrate, and the plurality of driving chip arrays are in the sub-area .
  • the present invention further provides a display panel including a glass substrate, a driving chip, and a flexible circuit board; wherein the driving chip is electrically connected to the flexible circuit board, and the driving chip and the flexible circuit board are collectively disposed on the glass On the substrate.
  • the present invention provides a display including a control circuit board and a display panel, the display panel including a glass substrate, a driving chip, and a flexible circuit board; wherein the driving chip is electrically connected to the flexible circuit board, and the driving chip and The flexible circuit boards are collectively disposed on the glass substrate; the control circuit board is connected to the flexible circuit board to be electrically connected to the driving chip through the flexible circuit board.
  • the display panel includes a glass substrate, a driving chip, and a flexible circuit board; wherein the driving chip is electrically connected to the flexible circuit board; the driving chip and the flexible circuit board are collectively disposed on the glass substrate, and the driving chip can be directly connected to the control through the flexible circuit board.
  • the thickness of the display panel is the sum of the thickness of the glass substrate, the thickness of the driving chip, and the thickness of the flexible circuit board, and the thickness is small, thereby realizing the slimness of the display panel and reducing the thickness of the display.
  • FIG. 1 is a schematic structural view of an embodiment of a display panel of the present application.
  • FIG. 2 is a side view showing the structure of the display panel of FIG. 1;
  • FIG. 3 is a schematic structural view of another embodiment of the display panel of the present application.
  • FIG. 4 is a side view showing the structure of the display panel of FIG. 3;
  • FIG. 5 is a schematic structural view of still another embodiment of the display panel of the present application.
  • Figure 6 is a side view showing the structure of the display panel of Figure 5;
  • FIG. 7 is a schematic structural view of an embodiment of a display of the present application.
  • the display panel in the present application includes a glass substrate, a driving chip, and a flexible circuit board.
  • the driving chip is electrically connected to the flexible circuit board, and the external control circuit is connected to the flexible circuit board, and the display of the display panel is driven by the driving chip.
  • the driving chip and the flexible circuit board are disposed on the glass substrate in a stacked manner, that is, the driving chip is disposed on the flexible circuit board, and the flexible circuit board is disposed on the glass substrate; or the driving chip is disposed on the glass substrate, and the flexible circuit board is covered The driving chip is disposed on the glass substrate.
  • FIG. 1 and FIG. 2 is a schematic structural view of an embodiment of the display panel shown in FIG. 1 .
  • the display panel 100 of the present embodiment includes a glass substrate 11, a driving chip 12, and a flexible circuit board 13.
  • the driving chip 12 is disposed on the glass substrate 11 by a COG process
  • the flexible circuit board 13 is disposed on the driving chip 12 and the glass substrate 11.
  • COG Chip On Glass
  • the driving chip 12 is formed on the glass substrate 11 by a COG process, and then the flexible circuit board 13 and the glass substrate 11 are bonded to realize electrical connection between the flexible circuit board 13 and the driving chip 12.
  • the flexible circuit board 13 is electrically connected to the driving chip 12 and needs to be electrically connected to an external control circuit board. Therefore, the flexible circuit board 13 includes a main body portion 131 disposed on the glass substrate 11 and a connecting portion 132 extending from the glass substrate 11. The portion 131 is electrically connected to the driving chip 12, and the connecting portion 132 is for electrically connecting to an external control circuit board.
  • the display panel 100 includes a plurality of driving chips 12, and the plurality of driving chips 12 are arranged on one side of the glass substrate 11. As shown in FIG. 1, a plurality of driving chips 12 are arranged on the bottom side of the glass substrate 11, A column driving line for driving the display panel 100 is also provided with a driving chip on the side of the glass substrate 11, which is not shown.
  • the driving chip 12 is disposed on the glass substrate 11 by the COG process, and the electrical connection directly to the external control circuit board is realized through the flexible circuit board 13, that is, the driving chip 12 does not need to pass through the printed circuit board and the connector. Connect to an external control board.
  • the thickness of the entire display panel that is, the sum of the thicknesses of the driving chip and the flexible circuit board is smaller than the sum of the thicknesses of the printed circuit board and the connector, and the thickness of the driving chip is about 0.7 mm, which is flexible.
  • the thickness of the circuit board is about 0.1 mm, and the thickness of the printed circuit board is about 1 mm, and the thickness of the connector is greater than 1 mm. Therefore, the display panel of this embodiment can realize a slimmer design.
  • FIG. 3 is a schematic structural view of another embodiment of the display panel of the present application, and FIG. A schematic side view of a display panel embodiment is shown.
  • the display panel 200 of the present embodiment includes a glass substrate 21, a driving chip 22, and a flexible circuit 23.
  • the flexible circuit board 23 is disposed on the glass substrate 21, and the driving chip 22 is disposed on the flexible circuit board 23 by a COF process.
  • COF Chip On The film process is a process in which a chip is directly packaged on a flexible circuit board. Similar to the COG process, the driving chip 22 in this embodiment also realizes the connection with the flexible circuit board 23 through the ACF conductive paste.
  • the flexible circuit board 23 is first bonded to the glass substrate 21, and then the driving chip 22 is formed on the flexible circuit board 23 by a COF process, and is electrically connected to the flexible circuit board 23.
  • the flexible circuit board 23 of the present embodiment also includes a main body portion 231 and a connecting portion 232, which is similar to the embodiment shown in FIG. 1; and the display panel 200 includes a plurality of driving chips 22 arranged on one side of the glass substrate 21, and FIG.
  • the illustrated embodiment is similar and will not be described again here.
  • the flexible circuit board 23 and the glass substrate 21 are first subjected to a bonding operation, and then the driving chip 22 is disposed on the flexible circuit board 23 by a COF process.
  • the driving chip 22 and the flexible circuit board 23 are required to be performed. Alignment operation. Therefore, the accuracy of the flexible circuit board 23 is high in this embodiment.
  • the driving chip 12 of FIG. 1 performs the COG process
  • the alignment operation is performed on the glass substrate 11, and the flexible circuit board 13 is bonded to the correct position with the glass substrate 11 as a reference.
  • the electrical connection with the driver chip 12 is realized, and its structure does not require a high-precision design, so the embodiment shown in FIG. 3 requires higher precision for the flexible circuit board.
  • the display panel in this embodiment is similar to the case shown in FIG. 1, and the thickness thereof is the sum of the thicknesses of the driving chip and the flexible circuit board, so that the thin and light design can be realized.
  • FIG. 5 is a schematic structural view of another embodiment of the display panel of the present application
  • FIG. 6 is a schematic side view of the embodiment of the display panel of FIG.
  • the display panel 300 includes a glass substrate 31, a driving chip 32, and a flexible circuit board 33.
  • the relationship between the three is similar to that of the embodiment shown in FIG. 3, that is, the flexible circuit board 33 is disposed on the glass substrate.
  • the driving chip 32 is disposed on the flexible circuit board 33 by the COF process, and the same portions of the two embodiments will not be described again.
  • the glass substrate 31 of the display panel 300 includes a sub-region 311.
  • the plurality of driving chips 32 are not disposed on one side of the glass substrate 31, but are disposed in the sub-region 311.
  • the array is disposed in the sub-area 311.
  • the area of the sub-area 311 is 5% to 20% of the area of the glass substrate 31.
  • the driving chips 32 of the display panel 300 are collectively disposed. Therefore, when the plurality of driving chips 32 are dissipated, the display panel 300 is disposed.
  • the heat dissipation module 34 is disposed to simultaneously dissipate heat from the plurality of driving chips 32.
  • the glass substrate 31 of the display panel 300 may also be provided with a plurality of sub-areas 311.
  • the plurality of chips 32 are respectively disposed in a plurality of sub-regions 311 in a group to avoid the case where the flexible circuit board 33 is too complicated to be routed.
  • Each of the sub-areas 311 in the corresponding display panel 300 is provided with a heat dissipation module 34.
  • the display panel can also realize the slim and light design, and at the same time, the driving chip can be arranged in a centralized manner to realize heat dissipation conveniently.
  • FIG. 7 is a schematic structural diagram of an embodiment of the display of the present application.
  • the display 400 of the present embodiment includes a control circuit board 41 and a display panel 42, and the display panel 42 includes a glass substrate 421, a driving chip 422, and a flexible circuit board 423.
  • the driving chip 422 and the flexible circuit board 423 are disposed together on the glass substrate 421, and the control circuit board 41 is connected to the flexible circuit board 423 to be electrically connected to the driving chip 422 through the flexible circuit board 423.
  • control circuit board 41 is a printed circuit board, and the control circuit board 41 can be connected to the flexible circuit board 423 through a connector.
  • the control circuit board 41 can also be connected to the flexible circuit board 423 through a soft and hard bonding process. No additional connectors are needed at the time.
  • the display panel 42 in this embodiment may be the display panel 100/200/300 of the above embodiment, that is, the driving chip 422 may be disposed on the glass substrate 421 by a COG process, and the flexible circuit board 423 is disposed on the driving chip 422 and the glass substrate 421.
  • the flexible circuit board 423 is disposed on the glass substrate 421, and the driving chip 422 is disposed on the flexible circuit board 423 by a COF process.
  • the display panel 42 shown in FIG. 7 adopts the structure of the display panel 200.
  • the display panel used in the display of this embodiment can realize a slim and light design, and thus the display can also reduce the thickness.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Thermal Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

一种显示面板（100）以及显示器（400），显示面板（100）包括玻璃基板（11）、驱动芯片（12）以及柔性电路板（13）；其中，驱动芯片（12）电连接柔性电路板（13），且驱动芯片（12）和柔性电路板（13）共同设置于玻璃基板（11）上。采用上述结构的显示面板（100）可以有效降低显示器（400）的厚度。

Description

一种显示面板以及显示器
【技术领域】
本发明涉及显示技术领域，特别是涉及一种显示面板以及显示器。
【背景技术】
近年来，电视等显示器的发展日新月异，在显示器普及度越来越高的同时，如今的消费者对显示器的要求也越来越高。例如，电视的应用可以放置于桌子上，嵌入墙壁上，或者玻璃门上等等。例如，从一开始的落地式电视发展到如今常见的挂壁式电视。
要满足消费者的需求，显示器的厚度变得尤为重要，将来的显示器发展趋势会是在保持高清晰度的同时，厚度也会不断降低，给到消费者更好的消费体验。
【发明内容】
本发明提供一种显示面板以及显示器以解决现有技术的显示面板厚度过大的问题。
为解决上述技术问题，本发明提出一种显示面板，该显示面板包括玻璃基板、驱动芯片以及柔性电路板；其中，驱动芯片电连接柔性电路板，且驱动芯片和柔性电路板共同设置于玻璃基板上，驱动芯片通过COF工艺设置于柔性电路板上；显示面板包括多个驱动芯片，玻璃基板包括子区域，子区域面积为玻璃基板面积的5%~20%，多个驱动芯片阵列于子区域。
为解决上述技术问题，本发明又提出一种显示面板，该显示面板包括玻璃基板、驱动芯片以及柔性电路板；其中，驱动芯片电连接柔性电路板，且驱动芯片和柔性电路板共同设置于玻璃基板上。
为解决上述技术问题，本发明提出一种显示器，该显示器包括控制电路板以及显示面板，显示面板包括玻璃基板、驱动芯片以及柔性电路板；其中，驱动芯片电连接柔性电路板，且驱动芯片和柔性电路板共同设置于玻璃基板上；控制电路板连接柔性电路板，以通过柔性电路板与驱动芯片电连接。
本申请中，显示面板包括玻璃基板、驱动芯片以及柔性电路板；其中驱动芯片电连接柔性电路板；驱动芯片和柔性电路板共同设置于玻璃基板上，驱动芯片可通过柔性电路板直接连接于控制电路板等外部设备，显示面板的厚度为玻璃基板厚度、驱动芯片厚度及柔性电路板厚度之和，厚度较小，实现了显示面板的轻薄化，降低了显示器的厚度。
【附图说明】
图1是本申请显示面板一实施例的结构示意图；
图2是图1所示显示面板实施例的侧面结构示意图；
图3是本申请显示面板另一实施例的结构示意图；
图4是图3所示显示面板实施例的侧面结构示意图；
图5是本申请显示面板又一实施例的结构示意图；
图6是图5所示显示面板实施例的侧面结构示意图；
图7是本申请显示器一实施例的结构示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。可以理解的是，此处所描述的具体实施例仅用于解释本申请，而非对本申请的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与本申请相关的部分而非全部结构。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中显示面板包括玻璃基板、驱动芯片和柔性电路板。其中，驱动芯片电连接柔性电路板，外部的控制电路连接到柔性电路板，通过驱动芯片驱动显示面板的显示。
驱动芯片和柔性电路板采用层叠的方式共同设置于玻璃基板上，即驱动芯片设置于柔性电路板上，柔性电路板再设置于玻璃基板上；或者驱动芯片设置于玻璃基板上，柔性电路板覆盖驱动芯片设置于玻璃基板上。
上述两种层叠方式通过不同工艺实现，对于驱动芯片设置于玻璃基板上，柔性电路板覆盖驱动芯片设置于玻璃基板上的情况，请参阅图1和图2，图1是本申请显示面板第一实施例的结构示意图，图2是图1所示显示面板实施例的侧面结构示意图。
本实施例显示面板100包括玻璃基板11、驱动芯片12和柔性电路板13。其中，驱动芯片12通过COG工艺设置于玻璃基板11上，柔性电路板13则设置于驱动芯片12和玻璃基板11上。
COG（Chip On Glass）工艺即将芯片直接bonding在玻璃上的工艺。本实施例中首先将ACF导电胶设置在玻璃基板11上，然后将驱动芯片12与玻璃基板11进行对位，导电胶位于驱动芯片12与玻璃基板11之间，通过热压头将驱动芯片12与玻璃基板bonding在一起。
驱动芯片12通过COG工艺形成于玻璃基板11后，然后再将柔性电路板13与玻璃基板11进行bonding，以实现柔性电路板13与驱动芯片12的电连接。
柔性电路板13与驱动芯片12电连接，还需与外部的控制电路板电连接，因而柔性电路板13包括设置于玻璃基板11上的主体部131和伸出于玻璃基板11的连接部132，主体部131与驱动芯片12电连接，连接部132用于与外部的控制电路板电连接。
在本实施例中，显示面板100包括多个驱动芯片12，多个驱动芯片12排列于玻璃基板11的一边，图1中所示，多个驱动芯片12排列设置于玻璃基板11的底边，用于驱动显示面板100的列驱动线，相应的在在玻璃基板11的侧边也设置有驱动芯片，图中不示出。
本实施例中通过COG工艺将驱动芯片12设置在玻璃基板11上，并通过柔性电路板13实现直接与外部控制电路板的电连接，即驱动芯片12无需通过印制电路板及连接器的方式与外部控制电路板连接。相应的本实施例中整个显示面板的厚度即驱动芯片和柔性电路板的厚度之和，相较于印制电路板和连接器的厚度之和更小，驱动芯片的厚度约为0.7mm，柔性电路板的厚度约为0.1mm，而印制电路板的厚度约为1mm，连接器厚度大于1mm，因而，本实施例显示面板能够实现更轻薄化的设计。
对于驱动芯片设置于柔性电路板上，柔性电路板再设置于玻璃基板上的情况请参阅图3和图4，图3是本申请显示面板另一实施例的结构示意图，图4是图3所示显示面板实施例的侧面结构示意图。
本实施例显示面板200包括玻璃基板21、驱动芯片22和柔性电路23。其中，柔性电路板23设置在玻璃基板21上，驱动芯片22通过COF工艺设置于柔性电路板23上。
COF（Chip On Film）工艺即将芯片直接封装在柔性电路板上的工艺。与COG工艺类似，本实施例中驱动芯片22也是通过ACF导电胶实现与柔性电路板23的连接。
本实施例中首先将柔性电路板23与玻璃基板21进行bonding，然后再将驱动芯片22通过COF工艺形成于柔性电路板23上，并与柔性电路板23电连接。
本实施例柔性电路板23也包括主体部231和连接部232，与图1所示实施例类似；并且显示面板200中包括多个驱动芯片22，排列设置在玻璃基板21的一边，与图1所示实施例类似，在此不再赘述。
本实施例中首先将柔性电路板23与玻璃基板21进行bonding操作，然后将驱动芯片22通过COF工艺设置于柔性电路板23上，由于COF工艺中，需要将驱动芯片22与柔性电路板23进行对位操作。因此本实施例对于柔性电路板23的精度要求较高。
相较于图1所示实施例的情况，图1中驱动芯片12进行COG工艺时在玻璃基板11上进行了对位操作，柔性电路板13以玻璃基板11为基准bonding于正确的位置即可实现与驱动芯片12的电连接，其本身结构无需高精度设计，因而图3所示实施例对于柔性电路板的精度要求更高。
本实施例中显示面板与图1所示情况类似，其厚度即驱动芯片和柔性电路板的厚度之和，能够实现轻薄化设计。
当显示面板较大时，排列于玻璃基板一边设置的驱动芯片不易进行散热，因此本申请中还提出了驱动芯片的不同设置方式。具体请参阅图5和图6，图5是本申请显示面板又一实施例的结构示意图，图6是图5所示显示面板实施例的侧面结构示意图。
图5所示实施例中显示面板300包括玻璃基板31、驱动芯片32和柔性电路板33，三者之间的相互关系与图3所示实施例类似，也即柔性电路板33设置在玻璃基板31上，驱动芯片32通过COF工艺设置于柔性电路板33上，两实施例相同部分不再赘述。
不同之处在于，本实施例中显示面板300的玻璃基板31包括一子区域311，多个驱动芯片32不再是排列设置在玻璃基板31的一边，而是设置于子区域311中，具体可阵列设置于子区域311中。
子区域311的面积为玻璃基板31面积的5%~20%，即本实施例中将显示面板300的驱动芯片32集中设置，因此，在对多个驱动芯片32进行散热时，在显示面板300中设置一个散热模块34即可对多个驱动芯片32同时实现散热。
若将多个驱动芯片32设置于一个子区域中，由于走线的要求，柔性电路板33的形状将会较为复杂，因此本实施例显示面板300的玻璃基板31也可设置多个子区域311，多个芯片32分别以一组一组的方式设置于多个子区域311中，以避免柔性电路板33走线过于复杂的情况。相应的显示面板300中每个子区域311配置一个散热模块34。
本实施例显示面板同样能够实现轻薄化设计，同时将驱动芯片集中设置能够很方便的实现散热。
本申请还提出一种显示器，请参阅图7，图7是本申请显示器一实施例的结构示意图。本实施例显示器400包括控制电路板41和显示面板42，显示面板42包括玻璃基板421、驱动芯片422和柔性电路板423。驱动芯片422和柔性电路板423共同设置于玻璃基板421上，控制电路板41连接柔性电路板423，以通过柔性电路板423与驱动芯片422电连接。
本实施例中控制电路板41为印制电路板，控制电路板41可通过连接器与柔性电路板423实现连接，控制电路板41也可通过软硬结合工艺与柔性电路板423实现连接，此时即无需额外的连接器。
本实施例中显示面板42可以是上述实施例显示面板100/200/300，即驱动芯片422可以通过COG工艺设置于玻璃基板421上，柔性电路板423设置于驱动芯片422和玻璃基板421上。或者，柔性电路板423设置于玻璃基板421上，驱动芯片422通过COF工艺设置于柔性电路板423上。具体来说，在图7中所示的显示面板42采用显示面板200的结构。
本实施例显示器所采用的显示面板能够实现轻薄化设计，因而显示器也能够降低厚度。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (15)

  1. 一种显示面板，其中，所述显示面板包括玻璃基板、驱动芯片以及柔性电路板；其中，所述驱动芯片电连接所述柔性电路板，且所述柔性电路板设置在所述玻璃基板上，所述驱动芯片通过COF工艺设置于所述柔性电路板上；
    所述显示面板包括多个驱动芯片，所述玻璃基板包括子区域，所述子区域面积为所述玻璃基板面积的5%~20%，所述多个驱动芯片阵列于所述子区域。
  2. 根据权利要求1所述的显示面板，其中，所述显示面板进一步包括一散热模块，所述散热模块设置于所述多个驱动芯片上。
  3. 一种显示面板，其中，所述显示面板包括玻璃基板、驱动芯片以及柔性电路板；其中，所述驱动芯片电连接所述柔性电路板，且所述驱动芯片和所述柔性电路板共同设置于所述玻璃基板上。
  4. 根据权利要求3所述的显示面板，其中，所述驱动芯片通过COG工艺设置于所述玻璃基板上，所述柔性电路板设置于所述驱动芯片和所述玻璃基板上。
  5. 根据权利要求3所述的显示面板，其中，所述柔性电路板设置在所述玻璃基板上，所述驱动芯片通过COF工艺设置于所述柔性电路板上。
  6. 根据权利要求3所述的显示面板，其中，所述显示面板包括多个驱动芯片，所述多个驱动芯片排列于所述玻璃基板的一边。
  7. 根据权利要求3所述的显示面板，其中，所述显示面板包括多个驱动芯片，所述玻璃基板包括子区域，所述子区域面积为所述玻璃基板面积的5%~20%，所述多个驱动芯片阵列于所述子区域。
  8. 根据权利要求7所述的显示面板，其中，所述显示面板进一步包括一散热模块，所述散热模块设置于所述多个驱动芯片上。
  9. 一种显示器，其中，所述显示器包括控制电路板以及显示面板，所述显示面板包括玻璃基板、驱动芯片以及柔性电路板；其中，所述驱动芯片电连接所述柔性电路板，且所述驱动芯片和所述柔性电路板共同设置于所述玻璃基板上；所述控制电路板连接所述柔性电路板，以通过所述柔性电路板与所述驱动芯片电连接。
  10. 根据权利要求9所述的显示器，其中，所述控制电路板为印制电路板，所述控制电路板通过软硬结合板工艺与所述柔性电路板实现连接。
  11. 根据权利要求9所述的显示器，其中，所述驱动芯片通过COG工艺设置于所述玻璃基板上，所述柔性电路板设置于所述驱动芯片和所述玻璃基板上。
  12. 根据权利要求9所述的显示器，其中，所述柔性电路板设置在所述玻璃基板上，所述驱动芯片通过COF工艺设置于所述柔性电路板上。
  13. 根据权利要求9所述的显示器，其中，所述显示面板包括多个驱动芯片，所述多个驱动芯片排列于所述玻璃基板的一边。
  14. 根据权利要求9所述的显示器，其中，所述显示面板包括多个驱动芯片，所述玻璃基板包括子区域，所述子区域面积为所述玻璃基板面积的5%~20%，所述多个驱动芯片阵列于所述子区域。
  15. 根据权利要求14所述的显示器，其中，所述显示面板进一步包括一散热模块，所述散热模块设置于所述多个驱动芯片上。
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