WO2019085586A1

WO2019085586A1 - Surface mounted structure, surface mounting method, motor, and surface mounted chip

Info

Publication number: WO2019085586A1
Application number: PCT/CN2018/100505
Authority: WO
Inventors: 梁赛嫦
Original assignee: 格力电器（武汉）有限公司; 珠海格力电器股份有限公司
Priority date: 2017-10-31
Filing date: 2018-08-14
Publication date: 2019-05-09
Also published as: CN107612226B; CN107612226A

Abstract

The present invention discloses a surface mounted structure, a surface mounting method, a motor, and a surface mounted chip capable of reducing a thickness of a printed circuit board, thereby reducing production costs of the printed circuit board, simplifying a manufacturing process of the printed circuit board, and extending service life of the printed circuit board. The surface mounted structure comprises: a printed circuit board having a void, a first surface of the printed circuit board being provided with a circuit layer; a sensor chip comprising a chip main body having a sensor element packaged therein and a lead led out from the chip main body, the chip main body being located in the void, the sensor element facing a second surface of the printed circuit board, and the lead being connected to the circuit layer.

Description

Surface mount structure, surface mount method, motor and surface mount chip

Related application

This application claims the priority of the Chinese patent application entitled "Surface Mounting Structure, Surface Mounting Method, Motor and Surface Mount Chip", which is filed on October 31, 2017, and whose application number is 201711050892.6. Introduced as a reference.

Technical field

The present application relates to the field of surface mount technology, and in particular to a surface mount structure, a surface mount method, a motor, and a surface mount chip.

Background technique

Sensor chips such as Hall chips are provided in the motors of electric appliances such as air conditioners, electric fans, and electric vehicles. As shown in FIG. 1A, FIG. 1B, FIG. 2A and FIG. 2B, at present, most sensor chips, such as Hall chip 03, are packaged in SOP (Small Out-line Package), and the number of pins 031 is Usually 8 to 44. Inside the motor, the first side 01A of the PCB (Printed Circuit Board) is provided with a stator connection pad 012 and a large number of electrical parts 02, and the second side 01B of the PCB is SMT (Surface Mount Technology). Loading technology), a plurality of Hall chips 03 are mounted in the forward direction according to the set distribution, that is, the Hall element 003 packaged in the Hall chip 03 shown in FIG. 1A is disposed facing away from the PCB 01. The stator 04 is fixed to the second face 01B of the PCB, and the terminal 043 of the stator winding 042 is connected to the stator connection pad 012 of the first face 01A of the PCB. The Hall chip 03 is connected to the power supply circuit of the stator winding 042.

When the rotor (not shown) passes near a certain Hall chip, the Hall chip outputs a voltage due to the Hall effect to turn on the power supply circuit of the stator winding 042, thereby supplying power to the stator winding 042, so that the stator winding 042 A magnetic field of the same polarity as the rotor is generated, and the repulsive rotor continues to rotate. When the rotor passes near the next Hall chip, the Hall chip operates to supply power to the stator winding 042, thereby repelling the rotor to continue rotating, while the previous Hall chip stops working; this cycle keeps the motor in operation.

The above prior art has a drawback in that since the second surface 01B of the PCB needs to be provided with the Hall chip 03, the second surface 01B of the PCB needs to be arranged with relevant lines and pads, thereby causing a large thickness of the PCB 01. The production cost is high and the production process is cumbersome; in addition, the Hall chip 03 is disposed on the second side of the PCB 01B, and the PCB 01 needs to be reflowed by two reflow furnaces, so the service life of the PCB 01 is not ideal.

Summary of the invention

The purpose of embodiments of the present application is to provide a surface mount structure, a surface mount method, a motor, and a surface mount chip to reduce the thickness of the PCB, reduce the production cost, simplify the manufacturing process, and prolong its service life.

The embodiment of the present application provides a surface mount structure, including:

a PCB having a hole, and a first layer of the PCB is provided with a circuit layer;

a sensor chip comprising a chip body encapsulating a sensor element, and a lead drawn from the chip body, the chip body being located in the hole, the sensor element facing a second side of the PCB, the lead The foot is connected to the circuit layer.

Optionally, the hole is located in an inner area of the PCB, or the hole is located at an edge of the PCB.

Optionally, the first side of the printed circuit board is further provided with a chip connection pad located at the edge of the hole and connected to the circuit layer; the pin of the sensor chip is soldered to the chip Disk connection.

Optionally, the pin is a flat pin.

Preferably, the length of the flat pin is 1±0.2 mm.

Preferably, the chip body is matched with the hole.

Optionally, the pin is a seagull pin, including a lead-out section located in the hole, and a connecting section extending to the first side of the printed circuit board.

Preferably, the length of the connecting section is 1±0.2 mm.

Optionally, the surface mount structure is applied to a motor, and a stator of the motor is fixed to a second side of the PCB; a first surface of the PCB is provided with a stator connection pad connected to the circuit layer;

The stator includes a stator core and stator windings wound around the stator core, terminals of the stator windings are coupled to the stator connection pads, and the stator windings include a plurality of sets of coils distributed circumferentially; There are at least two holes, each of which is located between two adjacent sets of the coils, and one of the sensor chips is disposed correspondingly at each of the holes.

Optionally, the sensor chip is an SOP sensor chip, a TSOP sensor chip, a QFP sensor chip, a TQFP sensor chip or a SOIC sensor chip.

With the surface mount structure of the above embodiment of the present application, the sensor chip is mounted on the first side of the PCB and the chip body of the sensor chip is placed in the boring hole. With this design, the second side of the PCB does not need to be provided with a circuit layer for the sensor chip. Compared with the prior art, the thickness of the PCB is reduced, the production cost is reduced, the manufacturing process is simplified, and the number of furnaces in the PCB process is reduced, thereby prolonging the service life of the PCB.

The embodiment of the present application further provides an electric motor, comprising the surface mount structure according to any of the foregoing technical solutions. The motor of the embodiment has a small PCB thickness, a low production cost, a simple production process, and a long service life of the PCB. Therefore, the working reliability of the motor is better.

The embodiment of the present application further provides a surface mount chip applied to the surface mount structure, including a chip body packaged with a sensor element, and a flat pin leaded from the chip body.

Preferably, the length of the flat pin is 1±0.2 mm.

The surface mount structure adopts the surface mount chip of the design, the thickness of the PCB is small, the production cost is low, the production process is simple, and the service life of the PCB is also long.

The embodiment of the present application further provides a surface mount method applied to the foregoing surface mount structure, comprising the steps of: mounting a sensor chip from a first side of a PCB to a hole of a PCB; wherein, the sensor chip A chip body is disposed in the cutout and a sensor element of the chip body faces a second side of the PCB, and a pin of the sensor chip is connected to a circuit layer of a first side of the PCB.

By adopting the surface mount method of the above embodiment, the process is simple, the production cost is low, and the life of the PCB is also long due to the reduction of the number of times of the PCB.

DRAWINGS

1A is a front view of a prior art Hall chip and a PCB surface mount;

1B is a top view of a prior art Hall chip;

2A is a schematic view showing a front structure of a PCB of the prior art;

2B is a schematic structural view of a back surface of a prior art PCB;

3A is a front elevational view showing a surface mount structure according to an embodiment of the present application;

3B is a schematic rear view of a surface mount structure according to an embodiment of the present application;

4A is a front view showing the surface mounting of a sensor chip and a PCB according to an embodiment of the present application;

4B is a top view of a sensor chip according to an embodiment of the present application;

FIG. 5 is a front view showing the surface mounting of a sensor chip and a PCB according to another embodiment of the present application.

Reference mark:

Existing technology section:

01-PCB; 01A-PCB first side; 01B-PCB second side; 012-stator connection pad;

02-Electrical parts; 03-Hall chip; 04-stator; 042-stator winding; 043-terminal;

003-Hall element; 031-pin.

Part of the embodiment of the application:

1-PCB; 10--hole; 2-electric parts; 11-chip connection pad; 3-sensor chip;

300-sensor element; 30-chip body; 31-pin; 1A-PCB first side; 420-coil;

1B-PCB second side; 311-lead section; 312-connection section; 4-stator; 12-stator connection pad;

41-stator core; 43-terminal.

Detailed ways

In order to reduce the thickness of the PCB, reduce the production cost, simplify the manufacturing process, and prolong the service life thereof, the embodiment of the present application provides a surface mount structure, a surface mount method, a motor and a surface mount chip. In order to make the objects, technical solutions and advantages of the present application more clear, the following examples will be further described in detail.

As shown in FIG. 3A, FIG. 3B, FIG. 4A and FIG. 4B, a surface mount structure according to an embodiment of the present application includes:

The PCB 1 has a hole 10, and the first side 1A of the PCB 1 is provided with a circuit layer (not shown);

The sensor chip 3 includes a chip body 30 enclosing the sensor element 300, and a lead 31 led out from the chip body 30. The chip body 30 is located in the hole 10, and the sensor element 300 faces the second side of the PCB 1, and the pin 31 is The line layer is connected.

As shown in FIG. 3A, the first side 1A of the PCB is usually also provided with an electrical component 2 such as a diode, which is also commonly referred to as the front side of the PCB 1, and correspondingly, the second side 1B of the PCB is referred to as a PCB 1 The back. The sensor chip 3 is mounted on the first hole 1A of the PCB at the boring hole 10 of the PCB 1, as shown in FIG. 3B and FIG. 4A, the sensor element 3 faces the second side 1B of the PCB, and the mounting method and the prior art The mounting direction is reversed, also known as reverse mounting.

Referring to FIG. 3A , in this embodiment, the first surface 1A of the PCB is further provided with a chip connection pad 11 located at the edge of the hole 10 and connected to the circuit layer; the pin 31 of the sensor chip 3 is soldered to the chip. The disk 11 is connected, that is, the pin 31 is connected to the wiring layer through the chip connection pad 11.

In the embodiment of the present application, the sensor chip 3 may be a Hall chip or other sensor chip. The specific package type of the sensor chip 3 is not limited, and may be, for example, an SOP sensor chip, a TSOP (Thin Small Outline Package) sensor chip, a QFP (Quad Flat Package) sensor chip, and a TQFP (Thin). Quad Flat Package, thin plastic package quad flat package) sensor chip or SOIC (Small Outline Integrated Circuit Package) sensor chip, and so on. The specific package type of the sensor chip 3 is different, and the number of the pins 31 may also be different.

In the embodiment of the present application, the specific number of the digging holes 10 is not limited and may be one, two or more. As shown in FIG. 3A, when there are at least two holes 10, the number of sensor chips is correspondingly disposed, and one sensor chip 3 is disposed correspondingly at each of the holes 10.

In the embodiment of the present application, the specific distribution position of the boring hole 10 is not limited, and may be designed according to the specific wiring of the circuit layer and the product specifically applied by the PCB 1. In an alternative embodiment of the present application, the boring hole 10 on the PCB 1 is located in the inner region. To facilitate the wiring layer layout design, as shown in Figures 3A and 3B, in a preferred embodiment of the present application, the boring hole 10 is located at the edge of the PCB 1.

With the surface mount structure of the above embodiment of the present application, the sensor chip 3 is mounted on the first side 1A of the PCB and the chip body 30 of the sensor chip 3 is placed in the boring hole 10. With this design, the second side 1B of the PCB does not need to be The circuit layer and the pad are provided for the sensor chip 3, which reduces the thickness of the PCB 1 , reduces the production cost, simplifies the manufacturing process, and since the sensor chip 3 is mounted on the first side 1A of the PCB, It is on the same side as the circuit layer, so it is only necessary to over-weld the structure of the first surface 1A of the PCB, thereby reducing the number of furnaces in the PCB 1 process and prolonging the service life of the PCB 1.

As shown in FIG. 3A and FIG. 3B, in the specific embodiment of the present application, the surface mount structure is applied to the motor, and the stator 4 of the motor is fixed to the second surface 1B of the PCB; the first surface 1A of the PCB is provided with the circuit layer Connected stator connection pads 12; the stator 4 includes a stator core 41 and stator windings wound around the stator core 41, the terminals 43 of the stator windings are connected to the stator connection pads 12, and the stator windings comprise a plurality of sets of coils distributed circumferentially 420; at least two boring holes 10, each boring hole 10 is located between two adjacent sets of coils 420, and a sensor chip 3 is disposed correspondingly at each boring hole 10. When the sensor chip 3 is a Hall chip, the working principle of the motor is similar to that of the prior art, and details are not described herein.

It is worth mentioning that the surface mount structure of the above embodiment can be applied to various products in which the orientation of the sensor chip 3 is opposite to the front direction of the PCB 1, and is not limited to application in the motor, the PCB 1 The specific shape and structure design are not limited.

As shown in FIG. 4A, in an optional embodiment of the present application, the pin 31 is a flat pin, and the chip body 30 is in clearance with the digging hole 10. Specifically, in this embodiment, the flat pin is soldered to the chip connection pad 11 of the first side 1A of the PCB. When the sensor chip 3 is mounted on the first surface 1A of the PCB, the hole 10 can be positioned to facilitate the assembly operation, and the structure design of the flat pin is also convenient for the processing of the sensor chip 3. Preferably, the length C of the flat pin is designed to be 1±0.2 mm, which not only facilitates soldering to the chip connection pad 11, but also has good soldering reliability.

As shown in FIG. 5, in another alternative embodiment of the present application, the pin 31 is a seagull pin, including a lead-out section 311 located in the hole 10, and a connecting section 312 extending to the first face 1A of the PCB. . Since the package structure of the commonly used sensor chip is usually a seagull pin, the existing rib mold can be used to make the pin, thereby saving equipment cost. In a preferred embodiment, the length A of the connecting segment 312 is designed to be 1 ± 0.2 mm to facilitate soldering to the chip connection pads 11 and to ensure solder reliability.

The embodiment of the present application further provides an electric motor, comprising the surface mount structure of any of the foregoing technical solutions. Referring to FIG. 3B, the stator 4 of the motor is fixed to the second face 1B of the PCB; the first face 1A of the PCB is provided with a stator connection pad 12 connected to the circuit layer; the stator 4 includes a stator core 41 and is wound around the stator magnet The stator winding of the core 41, the terminal 43 of the stator winding is connected to the stator connection pad 12, and the stator winding includes a plurality of sets of coils 420 distributed circumferentially; at least two of the digging holes 10, each of the digging holes 10 being located adjacent to the two A sensor chip 3 is disposed between the group coils 420 and correspondingly at each of the holes 10. The thickness of the PCB 1 of the motor of the embodiment is small, the production cost is low, the production process is simple, and the service life of the PCB 1 is long, and therefore, the working reliability of the motor is better.

4A and 4B, the embodiment of the present application further provides a surface mount chip 3 applied to the surface mount structure, including a chip body 30 encapsulating the sensor element 300, and an extraction lead from the chip body 30. Pin 31, pin 31 uses a flat pin.

The surface mount structure adopts the surface mount chip of the design, the thickness of the PCB is small, the production cost is low, the production process is simple, and the service life of the PCB is also long. The structure design of the flat pin is also convenient for processing the sensor chip. In a preferred embodiment, the length C of the flat pin is designed to be 1 ± 0.2 mm, which not only facilitates soldering to the chip connection pad, but also has good soldering reliability.

As shown in FIG. 4A, the embodiment of the present application further provides a surface mount method applied to the surface mount structure, which includes the following steps: mounting the sensor chip 3 from the first surface 1A of the PCB to the PCB 1 a hole 10; wherein the chip body 30 of the sensor chip 3 is placed in the hole 10 and the sensor element 300 of the chip body 30 faces the second side 1B of the PCB, the pin 31 of the sensor chip 3 and the first side 1A of the PCB The line layer is connected.

It will be apparent to those skilled in the art that various modifications and changes can be made in the present application without departing from the spirit and scope of the application. Thus, it is intended that the present invention cover the modifications and variations of the present invention.

Claims

A surface mount structure, comprising:

a printed circuit board having a hole, the first side of the printed circuit board is provided with a circuit layer;

a sensor chip comprising a chip body encapsulating a sensor element, and a lead drawn from the chip body, the chip body being located in the cutout hole, the sensor element facing a second side of the printed circuit board The pins are connected to the circuit layer.
A surface mount structure according to claim 1, wherein said cutout is located in an inner region of said printed circuit board, or said cutout is located at an edge of said printed circuit board.
The surface mount structure according to claim 1, wherein the first surface of the printed circuit board is further provided with a chip connection pad located at an edge of the cutout hole and connected to the circuit layer; The pins of the chip are connected to the chip connection pads.
The surface mount structure of claim 1 wherein said pins are flat pins.
The surface mount structure according to claim 4, wherein said flat pin has a length of 1 ± 0.2 mm.
The surface mount structure according to claim 4, wherein the chip body is mated with the cutout hole.
The surface mount structure of claim 1 wherein said pin is a seagull pin, comprising an extraction section located within said cutout and extending to a first side of said printed circuit board Connection segment.
The surface mount structure according to claim 7, wherein said connecting section has a length of 1 ± 0.2 mm.
The surface mount structure according to claim 1, wherein

The surface mount structure is applied to a motor, and a stator of the motor is fixed to a second side of the printed circuit board; a first surface of the printed circuit board is provided with a stator connection pad connected to the circuit layer;

The stator includes a stator core and a stator winding wound around the stator core, a terminal of the stator winding is connected to the stator connection pad, and the stator winding includes a plurality of sets of coils distributed circumferentially;

The boring holes are at least two, each of the boring holes is located between two adjacent sets of the coils, and one of the sensor chips is disposed correspondingly at each of the boring holes.
The surface mount structure according to claim 1, wherein the sensor chip is an SOP sensor chip, a TSOP sensor chip, a QFP sensor chip, a TQFP sensor chip, or a SOIC sensor chip.
An electric machine comprising the surface mount structure according to any one of claims 1 to 10.
A surface mount chip applied to the surface mount structure of claim 1, comprising a chip body encapsulating the sensor element, and a flat leg lead drawn from the chip body.
The surface mount chip according to claim 12, wherein said flat pin has a length of 1 ± 0.2 mm.
A surface mount method applied to the surface mount structure of claim 1, comprising the steps of:

Mounting the sensor chip from the first side of the printed circuit board to the cutout of the printed circuit board; wherein the chip body of the sensor chip is placed in the cutout and the sensor element of the chip body faces the printing On the second side of the circuit board, the pins of the sensor chip are connected to the circuit layer on the first side of the printed circuit board.