WO2019066504A2 - Thermosetting foam and manufacturing method therefor - Google Patents
Thermosetting foam and manufacturing method therefor Download PDFInfo
- Publication number
- WO2019066504A2 WO2019066504A2 PCT/KR2018/011451 KR2018011451W WO2019066504A2 WO 2019066504 A2 WO2019066504 A2 WO 2019066504A2 KR 2018011451 W KR2018011451 W KR 2018011451W WO 2019066504 A2 WO2019066504 A2 WO 2019066504A2
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- WO
- WIPO (PCT)
- Prior art keywords
- foam
- thermosetting
- thermosetting foam
- thickness
- phenolic resin
- Prior art date
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- 239000006260 foam Substances 0.000 title claims abstract description 145
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 111
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims abstract description 47
- 239000000203 mixture Substances 0.000 claims abstract description 43
- 239000005011 phenolic resin Substances 0.000 claims abstract description 39
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 34
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 33
- 239000004088 foaming agent Substances 0.000 claims abstract description 29
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 27
- 238000005187 foaming Methods 0.000 claims abstract description 26
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 20
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 36
- 239000004604 Blowing Agent Substances 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004202 carbamide Substances 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 19
- 238000009413 insulation Methods 0.000 description 17
- -1 CHF 2 CF = CH 2 Chemical class 0.000 description 10
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 10
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 10
- 125000003976 glyceryl group Chemical group [H]C([*])([H])C(O[H])([H])C(O[H])([H])[H] 0.000 description 8
- SXKNYNUXUHCUHX-UHFFFAOYSA-N 1,1,2,3,3,4-hexafluorobut-1-ene Chemical compound FCC(F)(F)C(F)=C(F)F SXKNYNUXUHCUHX-UHFFFAOYSA-N 0.000 description 6
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 239000004359 castor oil Substances 0.000 description 3
- 235000019438 castor oil Nutrition 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 3
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- NLOLSXYRJFEOTA-OWOJBTEDSA-N (e)-1,1,1,4,4,4-hexafluorobut-2-ene Chemical compound FC(F)(F)\C=C\C(F)(F)F NLOLSXYRJFEOTA-OWOJBTEDSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- FDMFUZHCIRHGRG-UHFFFAOYSA-N 3,3,3-trifluoroprop-1-ene Chemical class FC(F)(F)C=C FDMFUZHCIRHGRG-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 2
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000006269 thermoset foam Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- JSADPKAWAKXUTE-UHFFFAOYSA-N 1,1,1,2,3,4-hexafluorobut-2-ene Chemical compound FCC(F)=C(F)C(F)(F)F JSADPKAWAKXUTE-UHFFFAOYSA-N 0.000 description 1
- JVLWJKWBKARHRQ-UHFFFAOYSA-N 1,1,1,3,4,4-hexafluorobut-2-ene Chemical compound FC(F)C(F)=CC(F)(F)F JVLWJKWBKARHRQ-UHFFFAOYSA-N 0.000 description 1
- NDMMKOCNFSTXRU-UHFFFAOYSA-N 1,1,2,3,3-pentafluoroprop-1-ene Chemical compound FC(F)C(F)=C(F)F NDMMKOCNFSTXRU-UHFFFAOYSA-N 0.000 description 1
- PGJHURKAWUJHLJ-UHFFFAOYSA-N 1,1,2,3-tetrafluoroprop-1-ene Chemical compound FCC(F)=C(F)F PGJHURKAWUJHLJ-UHFFFAOYSA-N 0.000 description 1
- QAERDLQYXMEHEB-UHFFFAOYSA-N 1,1,3,3,3-pentafluoroprop-1-ene Chemical compound FC(F)=CC(F)(F)F QAERDLQYXMEHEB-UHFFFAOYSA-N 0.000 description 1
- BNYODXFAOQCIIO-UHFFFAOYSA-N 1,1,3,3-tetrafluoroprop-1-ene Chemical compound FC(F)C=C(F)F BNYODXFAOQCIIO-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- DMUPYMORYHFFCT-UHFFFAOYSA-N 1,2,3,3,3-pentafluoroprop-1-ene Chemical compound FC=C(F)C(F)(F)F DMUPYMORYHFFCT-UHFFFAOYSA-N 0.000 description 1
- ZUAQTIHDWIHCSV-UHFFFAOYSA-N 1,2,3,3-tetrafluoroprop-1-ene Chemical compound FC=C(F)C(F)F ZUAQTIHDWIHCSV-UHFFFAOYSA-N 0.000 description 1
- ZEDVIYBBMGBWDN-UHFFFAOYSA-N 1,2,3,4,4,4-hexafluorobut-1-ene Chemical compound FC=C(F)C(F)C(F)(F)F ZEDVIYBBMGBWDN-UHFFFAOYSA-N 0.000 description 1
- CDOOAUSHHFGWSA-UHFFFAOYSA-N 1,3,3,3-tetrafluoropropene Chemical compound FC=CC(F)(F)F CDOOAUSHHFGWSA-UHFFFAOYSA-N 0.000 description 1
- LYSWMVUQFULFQU-UHFFFAOYSA-N 1,3,3,4,4,4-hexafluorobut-1-ene Chemical compound FC=CC(F)(F)C(F)(F)F LYSWMVUQFULFQU-UHFFFAOYSA-N 0.000 description 1
- CZHLPWNZCJEPJB-UHFFFAOYSA-N 1-chloro-3-methylbutane Chemical compound CC(C)CCCl CZHLPWNZCJEPJB-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- SQCZQTSHSZLZIQ-UHFFFAOYSA-N 1-chloropentane Chemical compound CCCCCCl SQCZQTSHSZLZIQ-UHFFFAOYSA-N 0.000 description 1
- FXRLMCRCYDHQFW-UHFFFAOYSA-N 2,3,3,3-tetrafluoropropene Chemical compound FC(=C)C(F)(F)F FXRLMCRCYDHQFW-UHFFFAOYSA-N 0.000 description 1
- SEXMUFLAXLUDAL-UHFFFAOYSA-N FC(C=CC(F)(F)F)(F)F.FC(C=CC(F)(F)F)(F)F Chemical compound FC(C=CC(F)(F)F)(F)F.FC(C=CC(F)(F)F)(F)F SEXMUFLAXLUDAL-UHFFFAOYSA-N 0.000 description 1
- FVHQEWHLXHLZLU-UHFFFAOYSA-N FC=C(F)C(F)(F)C(F)F.FC(F)C(F)=C(F)C(F)F Chemical compound FC=C(F)C(F)(F)C(F)F.FC(F)C(F)=C(F)C(F)F FVHQEWHLXHLZLU-UHFFFAOYSA-N 0.000 description 1
- 238000003109 Karl Fischer titration Methods 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011489 building insulation material Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- QTBFPMKWQKYFLR-UHFFFAOYSA-N isobutyl chloride Chemical compound CC(C)CCl QTBFPMKWQKYFLR-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- ULYZAYCEDJDHCC-UHFFFAOYSA-N isopropyl chloride Chemical compound CC(C)Cl ULYZAYCEDJDHCC-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- SNMVRZFUUCLYTO-UHFFFAOYSA-N n-propyl chloride Chemical compound CCCCl SNMVRZFUUCLYTO-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000582 polyisocyanurate Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/12—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
- C08J9/14—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
- C08J9/149—Mixtures of blowing agents covered by more than one of the groups C08J9/141 - C08J9/143
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/12—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
- C08J9/14—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
Definitions
- Thermosetting foams and processes for their preparation are Thermosetting foams and processes for their preparation.
- Thermosetting foams are foamed or foamed foams formed by foaming and thermosetting a foamed composition, and are widely used as heat insulation materials because of their excellent properties such as heat insulation and sound absorption properties.
- thermosetting foams may vary in physical properties depending on the kinds of main resins, foaming agents, surfactants, and other additives contained in the foam composition, and their respective contents.
- foaming agents for example, polyurethane foams, polyisocyanurate foams, Phenol-based foams and the like.
- the freon series As the foaming agent used in the production of the thermosetting foams, the freon series has been mainly used. However, in recent years, hydrofluoroolefin foams or hydrocarbon series foams having a low ozone layer destruction index and warming coefficient are important.
- thermosetting foam that has a sufficient and uniform thickness, yet exhibits excellent heat insulation and excellent environmental friendliness.
- thermosetting foam which has a sufficient and uniform thickness, yet exhibits excellent heat insulation and good environment friendliness.
- the present invention provides, in one embodiment, a composition comprising a phenolic resin; A foaming agent comprising a hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17.
- the thermosetting foam is a foamed cured product of the foamable composition.
- thermosetting foam comprises a thermosetting foam.
- thermosetting foam and the method for producing the same are capable of realizing excellent heat insulation and excellent environment friendliness while having a sufficient and uniform thickness.
- FIG. 1 is a schematic diagram showing a method for measuring the thickness deviation of the thermosetting foam of the present invention.
- the formation or positioning of an arbitrary structure on the top (or bottom) of the substrate or on the top (or bottom) of the substrate means that any configuration is formed or located in contact with the top surface But is not limited to not including other configurations between the substrate and any structure formed on (or under) the substrate.
- step or step “step” does not mean "step for.
- the terms “about”, “substantially”, and the like are used herein to refer to the manufacturing and material tolerances inherent in the meaning referred to, Accurate or absolute numbers may be used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure.
- thermosetting foam is a foamed cured product of the foamable composition.
- thermosetting foams In general, the foaming agent used in the production of thermosetting foams is predominantly freon-based, but in recent years, hydrofluoroolefin foams or hydrocarbon-based foams having a low ozone layer destruction index and a low warming coefficient .
- the foamable composition forming the thermosetting foam simultaneously contains a hydrofluoroolefin compound and a hydrocarbon compound as a foaming agent, and the content of the hydrofluoroolefin compound and the hydrocarbon compound is controlled so that the thermosetting foam is formed to a sufficient and uniform thickness
- the foamable composition comprises a phenolic resin.
- the phenolic resin can be obtained, for example, by reacting phenol and formaldehyde, and can also be, for example, a resol-based phenolic resin.
- the phenolic resin may comprise from about 30% to about 90% by weight.
- the phenolic resin can be, for example, from about 1,000 cps to about 30,000 cps, and more specifically from about 3,000 cps to about 5,000 cps, at a temperature of 40 ° C.
- the viscosity can be measured using, for example, a Brookfield viscometer.
- the foaming power is appropriately controlled to form a closed cell at a good level, and the thickness of the thermosetting foam can be formed sufficiently and uniformly. Specifically, if the viscosity is too low or the viscosity is too low, the loss of the foaming gas may occur at the initial stage of foaming and the thermal conductivity may be lowered after the completion of production. When the viscosity is too high, the foaming rate is slower than the curing rate The thickness of the foam can not be formed to a sufficient level.
- the phenolic resin may have a moisture content of about 5% by weight or more, specifically about 5% by weight to about 20% by weight. More specifically from about 6% to about 15% by weight.
- the water content can be measured by the Karl Fischer titration method.
- excellent workability and excellent heat insulating property can be realized. Specifically, if the moisture content is out of the above-mentioned moisture content range and the moisture content is too low, it is difficult to smoothly mix with other components of the foamable composition and is difficult to control in the process. If the moisture content is too high, the adhesiveness of the foam decreases, , It may be difficult to adhere firmly by, for example, a surface material or the like by a lamination method.
- the phenolic resin may not contain a urea bond. Accordingly, moisture generated by the urea-formaldehyde reaction may not be generated in the polymerization process of the phenolic resin, so that the viscosity and moisture of the foamable composition can be easily controlled.
- the foamable composition includes two kinds of blowing agents, specifically, a hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound as a blowing agent.
- blowing agents specifically, a hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound as a blowing agent.
- HFO hydrofluoroolefin
- thermosetting foam can be formed to have a sufficient and uniform thickness by simultaneously containing the hydrofluoroolefin-based compound and the hydrocarbon-based compound and adjusting the content thereof.
- the hydrofluoroolefin-based compound may include, for example, a chlorinated hydrofluoroolefin-based compound, a non-chlorinated hydrofluoroolefin-based compound, or both of them.
- the hydrocarbon-based compound may include one to five hydrocarbons, and may include, for example, a chlorinated hydrocarbon compound, a non-chlorinated hydrocarbon compound, or both.
- the hydrocarbon-based compound may be at least one selected from the group consisting of dichloroethane, propyl chloride, isopropyl chloride, butyl chloride, isobutyl chloride, pentyl chloride, isopentyl chloride, n-butane, isobutane, n-pentane, isopentane, cyclopentane, But it is not limited thereto.
- the foaming agent may be a mixture of trifluoropropene and a hydrocarbon-based compound or hexafluorobutene and a hydrocarbon-based compound.
- the blowing agent may be a hydrofluoroolefin compound such as HFO-1233zdE, 1,1,1,4,4,4-hexafluoro-2-butene (1,1,1,4,4,4- hexafluoro-2-butene), and combinations thereof.
- Hydrocarbon compounds such as n-pentane, cyclopentane, isopentane, and combinations thereof may be used in combination.
- the thermosetting foam comprising the blowing agent may exhibit a sufficient and uniform thickness.
- the foamable composition may include about 5 to about 15 parts by weight of the blowing agent based on about 100 parts by weight of the phenolic resin.
- the foaming power can be controlled so that the thermosetting foam can have a stable cell structure while realizing its excellent strength.
- the foaming agent may contain the hydrofluoroolefin compound and the hydrocarbon compound in an equivalent amount or may contain the hydrofluoroolefin compound in a larger amount.
- the hydrofluoroolefin compound The weight ratio of the hydrocarbon compound may be about 1: 0.01 to about 1: 1, and more specifically about 1: 0.1 to about 1: 0.7.
- the thickness of the thermosetting foam can be sufficiently and uniformly included by the weight ratio within the above range. Specifically, when the amount of the hydrofluoroolefin compound is too much or the hydrocarbon compound is too small, the loss of the foaming agent at the early stage of foaming is large and the foaming power is low and the thickness of the thermosetting foam is thin And there is a problem that the thickness deviation may be large. When the hydrofluoroolefin compound contains too little or too much hydrocarbon compound, the cell structure of the thermosetting foam is unstable There is a problem that thermal conductivity and strength may be lowered.
- the foamable composition includes a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17, and preferably the HLB of the nonionic surfactant may be 13 to 16.
- HLB Hydrophile-Lipophile Balance
- the HLB is a numerical value indicating the degree of affinity of the surfactant for water and oil, which is a concept proposed by Wallace Griffin of Atlas Powder Company. It is from 0 to 20, and the closer to 0 the lipophilicity is, Big.
- the HLB value within the above range, it is possible to stably and uniformly form the foamed cells, while achieving excellent strength and excellent thermal conductivity.
- the interface can be stabilized in the process of growing the foamed cell to stably and uniformly form it, and the strength and thermal conductivity can be formed at a good level.
- the HLB is less than 12
- the HLB is more than 17, it is present in a high viscosity or solid state at room temperature, so that it is difficult to apply in the process and the hydrophilic property rapidly increases, so that the hydrophobic blowing agent can not be dispersed in the phenol resin.
- nonionic surfactant examples include glyceryl trinitolate ethylene oxide adduct to which an alkylene oxide is added to castor oil, that is, a castor oil ethylene oxide adduct, polyoxyalkylene sorbitan alkyl ester polyoxyalkylene sorbitan alkyl ester A polyoxyalkylene alkyl ester, a polyalkylsiloxane-based silicone surfactant, a polydimethylsiloxane-polyoxyalkylene copolymer, and a combination of these.
- the nonionic surfactant may have different HLB values depending on the molecular structure of the hydrophobic part, the length and the distribution of the repeating structure of the hydrophilic part.
- the nonionic surfactant includes a castor oil ethylene oxide adduct having an HLB of 12 to 17, and has a sufficient and uniform thickness, and can exhibit excellent heat insulation, compressive strength, and excellent environmental friendliness. More specifically, the nonionic surfactant may not include, for example, block copolymers of ethylene oxide-propylene oxide and polyoxyethylene dodecylphenyl ether.
- the block copolymer of ethylene oxide-propylene oxide and the polyoxyethylene dodecylphenyl ether are difficult to form a stable interface between the phenol resin and the foaming agent, so that the foaming cells are bonded to each other or burst when they are foamed, and the thermal conductivity of the final foam is deteriorated And shrinkage of the foam.
- the surfactant may be included in an amount of about 1 part by weight to about 20 parts by weight based on 100 parts by weight of the phenolic resin.
- the components in the foamable composition can be easily dispersed, and the foam structure of the thermosetting foam can be sufficiently and stably formed to realize excellent thermal conductivity and excellent physical strength.
- the foamable composition may further include at least one selected from the group consisting of a flame retardant, a plasticizer, a neutralizing agent, and a combination thereof as a curing agent, a solvent, and other additives.
- the curing agent may include, but is not limited to, at least one member selected from the group including, for example, acid anhydride compounds, inorganic acid compounds or organic acid compounds, isocyanate compounds, and combinations thereof.
- the foamable composition can be foamed and cured to obtain the thermosetting foam.
- the average thickness of the thermosetting foam can be from about 70 mm to about 300 mm.
- thermosetting foam has an average thickness within the above range, so that a sufficient level of heat insulation can be realized without excessively increasing the total thickness of the building insulation including it.
- the average thickness is less than about 70 mm
- the pressure is excessively generated at the time of foaming and the thickness deviation can not be adjusted.
- a thermal conductivity of 0.0184 W / mK can not be secured
- the growth rate of the foamed cells varies between the upper end, the lower end, and the lower end in the growth process of the foamed material, thereby causing cracks.
- the thickness variation according to the following equation 1 of the thermosetting foam may be less than about 5%, and specifically about 0.1% to about 5%:
- Thickness deviation (T d ,%) (T max - T min ) / T avg X 100
- T max means the maximum thickness measured for the foam to be measured
- T min means the minimum thickness measured for the foam
- T avg means the minimum thickness measured for the foam Means an average thickness.
- thermosetting foam By having the thickness deviation within the above range, the thermosetting foam can be formed with a more uniform thickness, and the long-term heat insulation property can be improved more effectively, and the product can be further improved in workability and workability when applied to a predetermined product.
- thermosetting foam can be prepared by suitably controlling the viscosity of the phenolic resin, the kind and content of the foaming agent, or the HLB of the nonionic surfactant to thereby make the thermosetting foam sufficiently thick and uniform Workability and workability can be improved while realizing heat insulation.
- thermosetting foam may have a thermal conductivity of 0.0184 W / mK or less measured at a temperature of about 20 ⁇ and a thickness of about 50 mm, and specifically about 0.0165 W / mK to about 0.0184 W / mK .
- thermosetting foam has an advantage of being able to maintain excellent heat insulation because it has a sufficiently thick thickness and does not lower its thermal conductivity.
- thermosetting foam may have a density of from about 20 kg / m 3 to about 50 kg / m 3 .
- the thermosetting foam can realize excellent strength and excellent heat insulating property.
- thermosetting foam can be applied, for example, to the use of a thermal insulation material for construction, thereby satisfying both the thermal conductivity and the thermal insulation required for a building thermal insulation material, while achieving excellent environmental friendliness.
- the building insulation may further include a surface material on one or both surfaces of the thermosetting foam, and the surface material may be of a kind known in the art, for example, an organic or inorganic- , Non-woven fabric, cloth, metal foil such as aluminum, paper, and the like.
- thermosetting foam In another embodiment of the present invention, a phenolic resin; A hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound as a blowing agent; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17, to prepare a foamable composition; And foaming and curing the foamable composition to form a thermosetting foam.
- HLB Hydrophile-Lipophile Balance
- the present invention also provides a method for producing a thermosetting foam.
- the thermosetting foams described above in one embodiment can be prepared by the above process.
- a phenolic resin A hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound as a blowing agent; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17 may be mixed to prepare a foamable composition, as described above in an embodiment.
- HFO Hydrofluoroolefin
- HLB Hydrophile-Lipophile Balance
- the phenolic resin may be mixed in the foamable composition in an amount of about 30% by weight to about 90% by weight.
- a phenolic resin having a viscosity of about 1,000 cps to about 30,000 cps under a temperature condition of 40 can be mixed.
- the foaming power is appropriately controlled, and excellent processability is realized, so that the thickness of the thermosetting foam can be formed to a sufficient and uniform level. Specifically, if the viscosity is too low or the viscosity is too low, the loss of the foaming gas may occur at the initial stage of foaming and the thermal conductivity may be lowered after the completion of production. When the viscosity is too high, the foaming rate is slower than the curing rate The thickness of the foam can not be formed to a sufficient level.
- the total amount of the foaming agent may be about 5 parts by weight to about 15 parts by weight based on about 100 parts by weight of the phenolic resin.
- thermosetting foam By adjusting the foaming power by mixing the total amount of the foaming agent to the above range, the thermosetting foam can have a stable cell structure while realizing its excellent strength.
- the weight ratio of the hydrofluoroolefin compound to the hydrocarbon compound may be in the range of about 1: 0.01 to about 1: 1, and specifically about 1: 0.1 to 1: They can be mixed so as to have a weight ratio of about 1: 0.7.
- the thickness of the thermosetting foam can be realized to a sufficient and uniform level. Specifically, when the amount of the hydrofluoroolefin compound is too much or the hydrocarbon compound is too small, the loss of the foaming agent at the early stage of foaming is large and the foaming power is low and the thickness of the thermosetting foam is thin If the hydrofluoroolefin compound contains too little or too much of the hydrocarbon compound, the cell structure of the thermosetting foam may become unstable and the strength may be lowered there is a problem.
- the surfactant may be mixed in an amount of about 1 part by weight to about 20 parts by weight based on 100 parts by weight of the phenolic resin.
- the components in the foamable composition can be easily dispersed by mixing the surfactant in a weight portion within the range, and the foam structure of the thermosetting foam can be sufficiently and stably formed.
- a nonionic surfactant having an HLB of about 13 to about 15 can be mixed.
- the foamable composition may be prepared by further mixing at least one selected from the group consisting of a flame retardant, a plasticizer, a neutralizer and a combination thereof as a curing agent, a solvent and other additives.
- the foamable composition can be foamed and cured to produce a thermosetting foam.
- the foamable composition is simultaneously foamed and cured, and either the foamed or the cured foam may be initiated at the same time, or they may be simultaneously initiated.
- the foaming and curing may be performed, for example, at a temperature of from about 50 to about 90 ° C.
- the foaming and curing may be performed for a time of about 2 minutes to about 20 minutes, but it is not limited thereto, and may be suitably varied according to the purpose and use of the invention.
- the foamable composition may be foamed and cured, for example, but not limited to, foamed and cured in a predetermined mold or foamed and cured while being injected or discharged between, for example, both surfaces.
- the thermosetting foam may have an average thickness of 70 mm to 300 mm.
- thermosetting foam is formed with an average thickness within the above range, so that a sufficient level of heat insulation can be realized without excessively increasing the total thickness of the building insulation material containing the foam.
- the average thickness is less than about 70 mm, there is a problem that the pressure is excessively generated at the time of foaming and the thickness deviation can not be adjusted.
- a thermal conductivity of 0.0184 W / mK can not be secured ,
- the growth rate of the foamed cells varies between the upper end, the lower end, and the lower end in the growth process of the foamed material, thereby causing cracks.
- the thickness variation of the thermosetting foam according to the following equation 1 can be formed to less than about 5%, and specifically about 0.1% to about 5%:
- Thickness deviation (Td,%) (T max - T min ) / T avg X 100
- T max means the maximum thickness measured for the foam to be measured
- T min means the minimum thickness measured for the foam
- T avg means the minimum thickness measured for the foam Means an average thickness.
- thermosetting foam can be formed to have a more uniform thickness by being formed with the thickness deviation within the above range, and the long-term heat insulation property can be improved more effectively thereby, and workability and workability can be further improved when applied to a predetermined product.
- thermosetting foam can be prepared by suitably controlling the viscosity of the phenolic resin, the kind and content of the foaming agent, or the HLB of the nonionic surfactant to thereby make the thermosetting foam sufficiently thick and uniform
- the workability and workability can be improved while realizing heat insulation.
- thermosetting foam may be manufactured such that the thermal conductivity measured in the direction of thickness under the conditions of a temperature of 20 ⁇ and a thickness of 50 mm is 0.0184 W / mK or less, specifically about 0.0165 W / mK to about 0.0184 W / mK .
- thermosetting foam is formed to have a sufficiently thick thickness and its thermal conductivity is not lowered, so that there is an advantage that excellent heat insulation can be maintained.
- thermosetting foam may have a density of from about 20 kg / m 3 to about 50 kg / m 3 .
- the thermosetting foam can be produced with a density within the above range to realize excellent strength and excellent heat insulation property.
- the thermoset foam may also have a compressive strength of from about 110 kPa to about 200 kPa. Or a compressive strength of from about 120 kPa to about 200 kPa or from about 130 kPa to about 200 kPa. By having a compressive strength within the above range, excellent long term durability can be exhibited.
- a phenol resin having a viscosity of 3,900 cps at a temperature of 40 ° C was prepared at a temperature of 20 ° C. Then, hydrofluoroolefin-based compound HFO-1233zdE and hydrocarbons-based compound n-pentane were added to 100 parts by weight of the phenolic resin : 0.25, and 5 parts by weight of a glyceryl trilinolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 15, were mixed to prepare a foamable composition .
- HLB Hydrofluoroolefin-based compound HFO-1233zdE
- hydrocarbons-based compound n-pentane were added to 100 parts by weight of the phenolic resin : 0.25, and 5 parts by weight of a glyceryl trilinolate ethylene oxide adduct, which is a nonionic surfactant having an HLB
- the foamable composition was mixed with 22 parts by weight of a 70% aqueous solution of para-toluenesulfonic acid (PTSA) serving as a curing catalyst at 2000 rpm to form a foam foam, which was then flowed under the caterpillar to produce a thermoset foam foam .
- PTSA para-toluenesulfonic acid
- the caterpillar as the forming mold was set so that the thickness of the thermosetting foamed foam was 90 mm at a line speed of 7 m / min and a temperature of 70 degrees.
- thermosetting foamed foam was prepared in the same manner as in Example 1 except that a caterpillar was set so that the thickness of the thermosetting foamed foam was 130 mm and a phenol resin having a viscosity of 3700 cps was used.
- thermosetting foamed foam was prepared in the same manner as in Example 1 except that a caterpillar was set so that the thickness of the thermosetting foamed foam was 200 mm and a phenol resin having a viscosity of 3300 cps was used.
- thermosetting foamed foam was prepared in the same manner as in Example 3 except that a phenol resin having a viscosity of 5000 cps was used.
- thermosetting foamed foam was prepared in the same manner as in Example 1, except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 12, was used.
- HLB Hydrophile-Lipophile Balance
- thermosetting foamed foam was prepared in the same manner as in Example 1, except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 17, was used.
- HLB Hydrophile-Lipophile Balance
- thermosetting foamed foam was prepared in the same manner as in Example 1, except that a foaming agent in which a hydrofluoroolefin-based compound, HFO-1233zdE, and a hydrocarbon compound, n-pentane, were mixed in a weight ratio of 1: 0.7.
- thermosetting foamed foam was prepared in the same manner as in Example 1, except that a polydimethylsiloxane-polyoxyalkylene copolymer, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 15, was used.
- HLB Hydrophile Balance
- thermosetting foamed foam was prepared in the same manner as in Example 1 except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant of HLB (Hydrophile-Lipophile Balance) 13, was used.
- HLB Hydrophile-Lipophile Balance
- thermosetting foamed foam was prepared in the same manner as in Example 1, except that glyceryl trirricolate ethylene oxide adduct, which is a nonionic surfactant of HLB (Hydrophile-Lipophile Balance) 16, was used.
- HLB Hydrophile-Lipophile Balance
- thermosetting foamed foam was prepared in the same manner as in Example 1, except that a blowing agent in which cyclopentane was mixed at a weight ratio of 1: 0.2 was used.
- thermosetting foamed foam was prepared in the same manner as in Example 1 except that the foaming agent containing hydrofluoroolefin-based compound HFO-1233zdE alone was used instead of the hydrocarbon-based compound n-pentane.
- thermosetting foamed foam was prepared in the same manner as in Example 1 except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 10, was used.
- HLB Hydrophile-Lipophile Balance
- thermosetting foamed foam was prepared in the same manner as in Example 1 except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 18, was used.
- HLB Hydrophile-Lipophile Balance
- thermosetting foamed foam was prepared.
- thermosetting foamed foam production conditions of the above Examples and Comparative Examples are shown in Table 1 below.
- thermosetting foams according to the above Examples and Comparative Examples were evaluated and are shown in Table 2 below.
- thermosetting foams of Examples and Comparative Examples were each prepared with a specimen having a size of 600 mm X 600 mm and a thickness corresponding thereto. Then, using a sliding caliper apparatus having a precision of 0.1 mm, the specimen was measured at intervals of 100 mm The thickness of five points was measured. That is, the thicknesses at 20 points on all four sides of the specimen were measured to set T avg , T max , T min , and the thickness deviation was measured according to the following equation (1).
- Thickness deviation (T d ,%) (T max - T min ) / T avg X 100
- T max denotes a maximum thickness measured on a foam sheet
- T min denotes a measured minimum thickness
- T avg denotes an average thickness measured.
- thermosetting foams of the examples and comparative examples were cut into a size of 300 mm ⁇ 300 mm and a thickness of 50 mm from the top, respectively, and the samples were pre-treated by drying at 70 ° C. for 12 hours.
- Each of the above specimens was measured using an HC-074-300 (EKO) thermal conductivity instrument at an average temperature of 20 ° C according to the measurement conditions of KS L 9016 (Flat Plate Heater Measurement Method).
- thermosetting foams of Examples and Comparative Examples were each prepared with a specimen having a size of 300 mm x 300 mm and a corresponding thickness, and the mass and volume were measured for each of the specimens, and the density was measured by the method of KS M ISO 845 standard.
- Measuring method Prepare the thermosetting foams of Examples and Comparative Examples in a size of 100 mm ⁇ 100 mm and a corresponding thickness, respectively, and set the specimen between the compression tester plates at a rate of 10% / min of the thickness of the specimen in the UTM equipment. Begin the compressive strength test to record the maximum load reached during the thickness reduction. The compressive strength was measured basically by the method of KS M ISO 845 standard.
- the embodiment has a thickness variation of less than 5%, has a uniform thickness, has excellent thermal conductivity and compressive strength, while the comparative example has considerably large thickness deviation.
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Abstract
Provided are a thermosetting foam and a manufacturing method therefor, the thermosetting foam being obtained by foaming and curing of a foamable composition containing: a phenolic resin; a foaming agent comprising a hydrofluoroolefin (HFO)-based compound and a hydrocarbon-based compound; and a non-ionic surfactant having a hydrophile-lipophile balance (HLB) of 12-17.
Description
열경화성 발포체 및 이의 제조방법에 관한 것이다.Thermosetting foams and processes for their preparation.
열경화성 발포체는 발포 조성물을 발포 및 열경화시켜 형성되는 발포체 또는 발포폼으로서 단열성, 흡음성 등의 물성이 양호하여 단열재 등으로 널리 사용되고 있다. BACKGROUND ART [0002] Thermosetting foams are foamed or foamed foams formed by foaming and thermosetting a foamed composition, and are widely used as heat insulation materials because of their excellent properties such as heat insulation and sound absorption properties.
이러한 열경화성 발포체는, 발포 조성물에 포함되는 주된 수지, 발포제, 계면활성제, 기타 첨가제들의 종류나 이들의 각 함량에 따라 물성이 달라질 수 있고, 예를 들어, 폴리우레탄계 발포체, 폴리이소시아누레이트계 발포체, 페놀계 발포체 등이 제작되고 있다. Such thermosetting foams may vary in physical properties depending on the kinds of main resins, foaming agents, surfactants, and other additives contained in the foam composition, and their respective contents. For example, polyurethane foams, polyisocyanurate foams, Phenol-based foams and the like.
열경화성 발포체의 제작에 사용되는 발포제는 종래 프레온 계열이 주로 사용되었으나, 최근에는 환경적인 측면과 관련하여 오존층 파괴지수 및 온난화 계수가 낮은 하이드로플루오로올레핀 계열의 발포제나 탄화수소 계열의 발포체가 중요시되고 있다.As the foaming agent used in the production of the thermosetting foams, the freon series has been mainly used. However, in recent years, hydrofluoroolefin foams or hydrocarbon series foams having a low ozone layer destruction index and warming coefficient are important.
본 발명의 일 구현예에서, 충분하고 균일한 두께를 가지면서도 우수한 단열성 및 우수한 친환경성을 구현하는 열경화성 발포체를 제공한다. In one embodiment of the present invention, there is provided a thermosetting foam that has a sufficient and uniform thickness, yet exhibits excellent heat insulation and excellent environmental friendliness.
본 발명의 다른 구현예에서, 충분하고 균일한 두께를 가지면서도 우수한 단열성 및 우수한 친환경성을 구현하는 열경화성 발포체의 제조방법을 제공한다.In another embodiment of the present invention, there is provided a process for producing a thermosetting foam which has a sufficient and uniform thickness, yet exhibits excellent heat insulation and good environment friendliness.
그러나, 본 발명이 이루고자 하는 기술적 과제는 이상에서 언급한 과제에 제한되지 않으며, 언급되지 않은 또 다른 과제들은 아래의 기재로부터 통상의 기술자에게 명확하게 이해될 수 있을 것이다.However, the technical problem to be solved by the present invention is not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.
본 발명은 일 구현 예에서, 페놀계 수지; 히드로플루오로올레핀(hydrofluoroolefin, HFO)계 화합물과 탄화수소계 화합물을 포함하는 발포제; 및 HLB(Hydrophile-Lipophile Balance)가 12 내지 17인 비이온성 계면활성제;를 포함하는 발포성 조성물의 발포 경화물인 열경화성 발포체를 제공한다.The present invention provides, in one embodiment, a composition comprising a phenolic resin; A foaming agent comprising a hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17. The thermosetting foam is a foamed cured product of the foamable composition.
본 발명의 다른 구현 예에서, 페놀계 수지; 발포제로서 히드로플루오로올레핀(hydrofluoroolefin, HFO)계 화합물과 탄화수소계 화합물; 및 HLB(Hydrophile-Lipophile Balance)가 12 내지 17인 비이온성 계면활성제;를 혼합하여 발포성 조성물을 준비하는 단계; 및 상기 발포성 조성물을 발포 및 경화시켜 열경화성 발포체를 제조하는 단계; 를 포함하는 열경화성 발포체의 제조방법을 제공한다.In another embodiment of the present invention, a phenolic resin; A hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound as a blowing agent; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17, to prepare a foamable composition; And foaming and curing the foamable composition to produce a thermosetting foam; Wherein the thermosetting foam comprises a thermosetting foam.
상기 열경화성 발포체 및 이의 제조방법은 충분하고 균일한 두께를 가지면서도 우수한 단열성 및 우수한 친환경성을 구현할 수 있다.The thermosetting foam and the method for producing the same are capable of realizing excellent heat insulation and excellent environment friendliness while having a sufficient and uniform thickness.
도 1은 본 발명의 열경화성 발포체의 두께 편차를 측정하는 방법을 간략하게 나타낸 모식도이다.BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing a method for measuring the thickness deviation of the thermosetting foam of the present invention.
본 명세서에서, 소정의 구현예 또는/및 이에 포함된 소정의 구성 요소가 어떤 구성 요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성 요소를 제외하는 것이 아니라 다른 구성 요소를 더 포함할 수 있는 것을 의미할 수 있다. In the present specification, it is to be understood that when certain embodiments and / or certain components included therein are referred to as " comprising ", it is understood that they do not exclude other components, It can mean that it can include more.
본 명세서에서, 기재의 상부 (또는 하부) 또는 기재의 상 (또는 하)에 임의의 구성이 형성되거나 위치한다는 것은, 임의의 구성이 상기 기재의 상면 (또는 하면)에 접하여 형성되거나 위치하는 것을 의미할 뿐만 아니라, 상기 기재와 기재 상에 (또는 하에) 형성된 임의의 구성 사이에 다른 구성을 포함하지 않는 것으로 한정하는 것은 아니다.In this specification, the formation or positioning of an arbitrary structure on the top (or bottom) of the substrate or on the top (or bottom) of the substrate means that any configuration is formed or located in contact with the top surface But is not limited to not including other configurations between the substrate and any structure formed on (or under) the substrate.
본 명세서에서 사용되는 정도의 용어 "~(하는) 단계" 또는 "~의 단계"는 "~를 위한 단계"를 의미하지 않는다.As used herein, the term " step " or " step " does not mean " step for.
본 명세서에서 사용되는 정도의 용어로서 "약", "실질적으로" 등은 언급된 의미에 고유한 제조 및 물질 허용 오차가 제시될 때 그 수치에서 또는 그 수치에 근접한 의미로 사용되고, 본원의 이해를 돕기 위해 정확하거나 절대적인 수치가 언급된 개시 내용을 비양심적인 침해자가 부당하게 이용하는 것을 방지하기 위해 사용될 수 있다.As used herein, the terms "about", "substantially", and the like are used herein to refer to the manufacturing and material tolerances inherent in the meaning referred to, Accurate or absolute numbers may be used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure.
이하, 본 발명의 구현예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 다만, 본 발명은 여러 가지 상이한 형태로 구현될 수 있는 것으로, 하기에 기재된 구현예들은 본 발명을 구체적으로 예시하거나 설명하기 위한 것에 불과하고, 여기에서 설명하는 구현예에 한정되지 않는다. Hereinafter, exemplary embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein.
본 발명의 일 구현예에서는, 페놀계 수지; 히드로플루오로올레핀(hydrofluoroolefin, HFO)계 화합물과 탄화수소계 화합물을 포함하는 발포제; 및 HLB(Hydrophile-Lipophile Balance)가 12 내지 17인 비이온성 계면활성제;를 포함하는 발포성 조성물의 발포 경화물인 열경화성 발포체를 제공한다.In one embodiment of the present invention, a phenolic resin; A foaming agent comprising a hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17. The thermosetting foam is a foamed cured product of the foamable composition.
일반적으로, 열경화성 발포체의 제작에 사용되는 발포제는 프레온 계열 가스가 주로 사용되었으나, 최근에는 환경적인 측면과 관련하여 오존층 파괴지수 및 온난화 계수가 낮은 히드로플루오로올레핀 계열의 발포제나 탄화수소 계열의 발포체가 중요시되고 있다. In general, the foaming agent used in the production of thermosetting foams is predominantly freon-based, but in recent years, hydrofluoroolefin foams or hydrocarbon-based foams having a low ozone layer destruction index and a low warming coefficient .
다만, 히드로플루오로올레핀 계열의 발포제를 단독으로 사용하는 경우 이의 휘발성이 너무 높아, 발포 초기에 발포제의 손실이 많으면서 발포력이 낮으므로 상기 발포제를 포함하는 발포 조성물은 충분하면서 균일한 두께로 발포되기 어려운 문제가 있다. However, when a hydrofluoroolefin-based blowing agent is used alone, its volatility is so high that the foaming agent is low at the initial stage of foaming due to the loss of the foaming agent, so that the foaming composition containing the foaming agent is sufficiently foamed There is a problem that is difficult to be done.
이에, 일 구현예에서는, 상기 열경화성 발포체를 형성하는 발포성 조성물이 발포제로서 히드로플루오로올레핀계 화합물과 탄화수소계 화합물을 동시에 포함하면서 이들의 함량을 조절함으로써 상기 열경화성 발포체는 충분하면서 균일한 두께로 형성될 수 있는 이점이 있다. Accordingly, in one embodiment, the foamable composition forming the thermosetting foam simultaneously contains a hydrofluoroolefin compound and a hydrocarbon compound as a foaming agent, and the content of the hydrofluoroolefin compound and the hydrocarbon compound is controlled so that the thermosetting foam is formed to a sufficient and uniform thickness There is an advantage to be able to.
이와 동시에, 우수한 열전도율 및 우수한 친환경성을 구현할 수 있다. At the same time, excellent thermal conductivity and excellent environment friendliness can be realized.
상기 발포성 조성물은 페놀계 수지를 포함한다. The foamable composition comprises a phenolic resin.
상기 페놀계 수지는 예를 들어, 페놀 및 포름알데히드가 반응하여 얻어질 수 있고, 또한 예를 들어, 레졸계 페놀 수지일 수 있다. The phenolic resin can be obtained, for example, by reacting phenol and formaldehyde, and can also be, for example, a resol-based phenolic resin.
상기 페놀계 수지는 약 30 중량% 내지 약 90 중량%로 포함할 수 있다. The phenolic resin may comprise from about 30% to about 90% by weight.
상기 범위 내의 함량으로 포함함으로써 발포셀을 안정적으로 형성하면서 우수한 난연성을 구현할 수 있다. 구체적으로, 약 30 중량% 미만인 경우 독립셀을 형성하기 어렵고 난연성이 저하되며, 약 90 중량% 초과인 경우 다른 첨가제 등의 비율이 낮아질 수 밖에 없어 발포셀의 형상이나 발포 공정 과정에서 불량이 발생할 수 있다. By including it in the content within the above range, excellent foam resistance can be realized while stably forming the foamed cell. Specifically, when the content is less than about 30% by weight, it is difficult to form an independent cell and the flame retardancy is deteriorated. When the content exceeds about 90% by weight, the ratio of other additives is inevitably lowered, have.
상기 페놀계 수지는 예를 들어, 점도가 40℃의 온도 조건 하에서 약 1,000cps 내지 약 30,000cps일 수 있고, 구체적으로는 약 3,000cps 내지 약 5,000cps 이하일 수 있다. 상기 점도는 예를 들어, Brookfield 점도계를 이용하여 측정할 수 있다. The phenolic resin can be, for example, from about 1,000 cps to about 30,000 cps, and more specifically from about 3,000 cps to about 5,000 cps, at a temperature of 40 ° C. The viscosity can be measured using, for example, a Brookfield viscometer.
상기 범위 내의 점도를 가짐으로써 발포력이 적절히 조절되면서 닫힌 셀을 우수한 수준으로 형성하여, 상기 열경화성 발포체의 두께를 충분하면서 균일하게 형성할 수 있다. 구체적으로, 상기 점도 범위를 벗어나, 점도가 너무 낮은 경우 발포 초기에 발포 가스의 손실이 발생하여 생산이 완료된 이후 열전도도가 저하될 수 있고, 점도가 너무 높은 경우에는 발포 속도가 경화 속도에 비해 느려져 발포체의 두께를 충분한 수준으로 형성할 수 없다.By having the viscosity within the above range, the foaming power is appropriately controlled to form a closed cell at a good level, and the thickness of the thermosetting foam can be formed sufficiently and uniformly. Specifically, if the viscosity is too low or the viscosity is too low, the loss of the foaming gas may occur at the initial stage of foaming and the thermal conductivity may be lowered after the completion of production. When the viscosity is too high, the foaming rate is slower than the curing rate The thickness of the foam can not be formed to a sufficient level.
또한, 상기 폐놀계 수지는 수분율이 약 5 중량% 이상일 수 있고, 구체적으로는 약 5 중량% 내지 약 20 중량%일 수 있다. 더 구체적으로는 약 6 중량% 내지 약 15 중량%일 수 있다. 상기 수분율은 Karl Fischer Titration 방법에 의해 측정할 수 있다. 상기 범위 내의 수분율을 가짐으로써 우수한 작업성 및 우수한 단열성을 구현할 수 있다. 구체적으로, 상기 수분율 범위를 벗어나, 수분율이 너무 낮은 경우 발포성 조성물의 다른 성분들과 원활히 배합되기 어렵고 공정상 제어가 어려우며, 수분율이 너무 높은 경우에는 단열성이 저하되면서 발포체의 접착성이 떨어져, 다른 구성, 예를 들어, 표면재 등과 라미네이트 방법에 의해 견고히 부착되기 어려울 수 있다. In addition, the phenolic resin may have a moisture content of about 5% by weight or more, specifically about 5% by weight to about 20% by weight. More specifically from about 6% to about 15% by weight. The water content can be measured by the Karl Fischer titration method. By having a water content in the above range, excellent workability and excellent heat insulating property can be realized. Specifically, if the moisture content is out of the above-mentioned moisture content range and the moisture content is too low, it is difficult to smoothly mix with other components of the foamable composition and is difficult to control in the process. If the moisture content is too high, the adhesiveness of the foam decreases, , It may be difficult to adhere firmly by, for example, a surface material or the like by a lamination method.
또한, 상기 페놀계 수지는 우레아 결합을 포함하지 않을 수 있다. 그에 따라 페놀 수지의 중합 과정에서 우레아-포름알데히드 반응에 따라 발생하는 수분이 생성되지 않을 수 있어 상기 발포성 조성물의 점도 및 수분을 쉽게 조절할 수 있다. In addition, the phenolic resin may not contain a urea bond. Accordingly, moisture generated by the urea-formaldehyde reaction may not be generated in the polymerization process of the phenolic resin, so that the viscosity and moisture of the foamable composition can be easily controlled.
또한, 상기 발포성 조성물은 발포제로서, 2종의 발포제 구체적으로 히드로플루오로올레핀(hydrofluoroolefin, HFO)계 화합물과 탄화수소계 화합물을 포함한다. Further, the foamable composition includes two kinds of blowing agents, specifically, a hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound as a blowing agent.
전술한 바와 같이, 히드로플루오로올레핀계 화합물과 탄화수소계 화합물을 동시에 포함하면서 이들의 함량을 조절함으로써 상기 열경화성 발포체는 충분하면서 균일한 두께로 형성될 수 있다.As described above, the thermosetting foam can be formed to have a sufficient and uniform thickness by simultaneously containing the hydrofluoroolefin-based compound and the hydrocarbon-based compound and adjusting the content thereof.
상기 히드로플루오로올레핀계 화합물은 예를 들어, 염소화 히드로플루오로올레핀계 화합물, 비염소화 히드로플루오로올레핀계 화합물, 또는 이들 모두를 포함할 수 있다. The hydrofluoroolefin-based compound may include, for example, a chlorinated hydrofluoroolefin-based compound, a non-chlorinated hydrofluoroolefin-based compound, or both of them.
상기 히드로플루오로올레핀계 화합물은, 이 기술분야에서 공지된 종류를 사용할 수 있고, 예를 들어, 트랜스 CF3CH=CClH(1233zdE), 시스 CF3CH=CClH(1233zdZ), 트랜스 CHF2CF=CClH(1233ydE), 시스 CHF2CF=CClH(1233ydZ), 트랜스 CHF2CH=CClF(1233zbE), 시스 CHF2CH=CClF(1233zbZ), 트랜스 CHF2CCl=CHF(1233xeE), 시스 CHF2CCl=CHF(1233xeZ), CH2FCCl=CF2(1233xc), 트랜스 CHFClCF=CFH(1233yeE), 시스 CHFClCF=CFH(1233yeZ), CH2ClCF=CF2(1233yc), CF2ClCF=CH2(1233xf) 등의 모노클로로트리플루오로프로펜; CHF2CF=CH2, CH3CF=CF2, CH2FCF=CF2, CH2FCH=CF2, CHF2CH=CHF 등의 트리플루오로프로펜; 1,2,3,3-테트라플루오로-1-프로펜, 2,3,3,3-테트라플루오로-1-프로펜, 1,3,3,3-테트라플루오로-1-프로펜, 1,1,2,3-테트라플루오로-1-프로펜, 1,1,3,3-테트라플루오로-1-프로펜, 1,2,3,3-테트라플루오로-1-프로펜 등의 테트라플루오로프로펜; 1,2,3,3,3-펜타플루오로-1-프로펜, 1,1,3,3,3-펜타플루오로-1-프로펜, 1,1,2,3,3-펜타플루오로-1-프로펜 등의 펜타플루오로프로펜; 2,3,3,4,4,4-헥사플루오로-1-부텐, 1,1,1,4,4,4-헥사플루오로-2-부텐, 1,3,3,4,4,4-헥사플루오로-1-부텐, 1,2,3,4,4,4-헥사플루오로-1-부텐, 1,2,3,3,4,4-헥사플루오로-1-부텐 1,1,2,3,4,4-헥사플루오로-2-부텐, 1,1,1,2,3,4-헥사플루오로-2-부텐, 1,1,1,2,3,3-헥사플루오로-2-부텐, 1,1,1,3,4,4-헥사플루오로-2-부텐, 1,1,2,3,3,4-헥사플루오로-1-부텐, 등의 헥사플루오로부텐 및 이들의 조합으로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있다. The hydrofluoroolefin compound may be selected from the group consisting of trans CF3CH = CClH (1233zdE), cis CF3CH = CClH (1233zdZ), trans CHF2CF = CClH CHF2CF = CClH (1233ydZ), trans CHF2CH = CClF (1233zbE), cis CHF2CH = CClF 1233zbZ, trans CHF2CCl = CHF 1233xeE, cis CHF2CCl = CHF 1233xeZ, CH2FCCl = CF2 1233xc, trans CHFClCF = CFH (1233yeE), cis CHFClCF = CFH (1233yeZ), CH2ClCF = CF2 (1233yc), CF2ClCF = CH2 (1233xf); Trifluoropropenes such as CHF 2 CF = CH 2 , CH 3 CF═CF 2 , CH 2 FCF = CF 2 , CH 2 FCH = CF 2 , CHF 2 CH = CHF; 1,2,3,3-tetrafluoro-1-propene, 2,3,3,3-tetrafluoro-1-propene, 1,3,3,3-tetrafluoro-1-propene , 1,1,2,3-tetrafluoro-1-propene, 1,1,3,3-tetrafluoro-1-propene, 1,2,3,3-tetrafluoro-1- Tetrafluoropropene such as pen; 1,2,3,3,3-pentafluoro-1-propene, 1,1,3,3,3-pentafluoro-1-propene, 1,1,2,3,3-pentafluoro Pentafluoropropene such as 1-propene; Hexafluoro-1-butene, 1,1,1,4,4,4-hexafluoro-2-butene, 1,3,3,4,4,4- Hexafluoro-1-butene, 1,2,3,4,4,4-hexafluoro-1-butene, 1,2,3,3,4,4-hexafluoro-1-butene 1 , 1,2,3,4,4-hexafluoro-2-butene, 1,1,1,2,3,4-hexafluoro-2-butene, 1,1,1,2,3,3 -Hexafluoro-2-butene, 1,1,1,3,4,4-hexafluoro-2-butene, 1,1,2,3,3,4-hexafluoro-1-butene, etc. Hexafluorobutene, hexafluorobutene, hexafluorobutene, and combinations thereof.
또한, 상기 탄화수소계 화합물은 탄소수 1개 내지 5개의 탄화수소를 포함할 수 있고, 예를 들어, 염소화 탄화수소 화합물, 비염소화 탄화수소 화합물, 또는 이들 모두를 포함할 수 있다.In addition, the hydrocarbon-based compound may include one to five hydrocarbons, and may include, for example, a chlorinated hydrocarbon compound, a non-chlorinated hydrocarbon compound, or both.
상기 탄화수소계 화합물은 디클로로에탄, 프로필클로라이드, 이소프로필클로라이드, 부틸클로라이드, 이소부틸클로라이드, 펜틸클로라이드, 이소펜틸클로라이드, n-부탄, 이소부탄, n-펜탄, 이소펜탄, 시클로펜탄 및 이들의 조합으로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있으나, 이에 제한되지 아니한다. The hydrocarbon-based compound may be at least one selected from the group consisting of dichloroethane, propyl chloride, isopropyl chloride, butyl chloride, isobutyl chloride, pentyl chloride, isopentyl chloride, n-butane, isobutane, n-pentane, isopentane, cyclopentane, But it is not limited thereto.
구체적으로, 상기 발포제는 트리플루오로프로펜 및 탄화수소계 화합물 또는 헥사플루오로부텐 및 탄화수소계 화합물의 혼합물일 수 있다. 예를 들어, 상기 발포제는 히드로플루오로올레핀계 화합물로 HFO-1233zdE, 1,1,1,4,4,4-헥사플루오로-2-부텐(1,1,1,4,4,4-hexafluoro-2-butene) 및 이들의 조합을 사용할 수 있고, 탄화수소계 화합물로 n-펜탄, 시클로펜탄, 이소펜탄 및 이들의 조합을 혼합하여 사용할 수 있다. 상기 발포제를 포함하는 열경화성 발포체는 충분하면서 균일한 두께를 나타낼 수 있다.Specifically, the foaming agent may be a mixture of trifluoropropene and a hydrocarbon-based compound or hexafluorobutene and a hydrocarbon-based compound. For example, the blowing agent may be a hydrofluoroolefin compound such as HFO-1233zdE, 1,1,1,4,4,4-hexafluoro-2-butene (1,1,1,4,4,4- hexafluoro-2-butene), and combinations thereof. Hydrocarbon compounds such as n-pentane, cyclopentane, isopentane, and combinations thereof may be used in combination. The thermosetting foam comprising the blowing agent may exhibit a sufficient and uniform thickness.
상기 발포성 조성물은 상기 페놀계 수지 약 100 중량부를 기준으로 상기 발포제를 총 함량 약 5 중량부 내지 약 15 중량부로 포함할 수 있다. The foamable composition may include about 5 to about 15 parts by weight of the blowing agent based on about 100 parts by weight of the phenolic resin.
상기 발포제의 총 함량을 상기 범위 내로 한정함으로써 발포력을 조절하여 상기 열경화성 발포체는 이의 강도를 우수한 수준으로 구현하면서 안정적인 셀 구조를 가질 수 있다.By limiting the total content of the foaming agent to the above range, the foaming power can be controlled so that the thermosetting foam can have a stable cell structure while realizing its excellent strength.
또한, 상기 발포제는 상기 히드로플루오로올레핀계 화합물과 탄화수소계 화합물을 동등한 함량으로 포함하거나 또는 상기 히드로플루오로올레핀계 화합물을 더 많이 포함할 수 있고, 예를 들어, 상기 히드로플루오로올레핀계 화합물 대 상기 탄화수소계 화합물의 중량비가 약 1:0.01 내지 약 1:1일 수 있고, 구체적으로는 약 1:0.1 내지 약 1:0.7일 수 있다.The foaming agent may contain the hydrofluoroolefin compound and the hydrocarbon compound in an equivalent amount or may contain the hydrofluoroolefin compound in a larger amount. For example, the hydrofluoroolefin compound The weight ratio of the hydrocarbon compound may be about 1: 0.01 to about 1: 1, and more specifically about 1: 0.1 to about 1: 0.7.
상기 범위 내의 중량비로 포함함으로써 상기 열경화성 발포체의 두께를 충분하면서도 균일한 수준으로 구현할 수 있다. 구체적으로, 상기 중량비의 범위를 벗어나, 상기 히드로플루오로올레핀계 화합물을 너무 많이 포함하거나 상기 탄화수소계 화합물을 너무 적게 포함하는 경우 발포 초기 발포제의 손실이 크고 발포력이 떨어져 상기 열경화성 발포체의 두께를 얇은 수준으로 형성할 수 밖에 없고 두께 편차가 크게 발생할 수 있는 문제가 있고, 상기 히드로플루오로올레핀계 화합물을 너무 적게 포함하거나 상기 탄화수소계 화합물을 너무 많이 포함하는 경우에는 상기 열경화성 발포체의 셀 구조가 불안정해지거나 터지면서 열전도도 및 강도가 저하될 수 있는 문제가 있다. The thickness of the thermosetting foam can be sufficiently and uniformly included by the weight ratio within the above range. Specifically, when the amount of the hydrofluoroolefin compound is too much or the hydrocarbon compound is too small, the loss of the foaming agent at the early stage of foaming is large and the foaming power is low and the thickness of the thermosetting foam is thin And there is a problem that the thickness deviation may be large. When the hydrofluoroolefin compound contains too little or too much hydrocarbon compound, the cell structure of the thermosetting foam is unstable There is a problem that thermal conductivity and strength may be lowered.
상기 발포성 조성물은 HLB(Hydrophile-Lipophile Balance)가 12 내지 17인 비이온성 계면활성제를 포함하고, 바람직하게는 상기 비이온성 계면활성제의 HLB는 13 내지 16일 수 있다.The foamable composition includes a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17, and preferably the HLB of the nonionic surfactant may be 13 to 16.
상기 HLB은, 아틀라스 파우더 회사의 월리엄 그리핀이 제안한 개념으로 계면활성제의 물과 기름에 대한 친화성 정도를 나타내는 수치이고, 0~20까지 있으며, 0에 가까울수록 친유성이 크고 20에 가까울수록 친수성이 크다. The HLB is a numerical value indicating the degree of affinity of the surfactant for water and oil, which is a concept proposed by Wallace Griffin of Atlas Powder Company. It is from 0 to 20, and the closer to 0 the lipophilicity is, Big.
상기 범위 내의 HLB 값을 가짐으로써 발포셀을 안정적이고 균일하게 형성할 수 있으면서 우수한 강도 및 우수한 열전도도를 구현할 수 있다. 발포셀이 성장하는 과정에서 계면을 안정화시켜 안정적이고 균일하게 형성할 수 있으면서 강도 및 열전도율을 우수한 수준으로 형성할 수 있다. 구체적으로, 상기 HLB가 12 미만인 경우 계면이 안정화되지 못해 발포셀이 터지거나 균일하게 성장하지 못하는 문제가 있다. 또한 상기 HLB가 17 초과인 경우 상온에서 고점도 또는 고체로 존재하여 공정상 적용하기 어려우며 친수성도가 급격히 증가하여 소수성인 발포제를 페놀수지 내 분산시키지 못하는 문제가 있다. By having the HLB value within the above range, it is possible to stably and uniformly form the foamed cells, while achieving excellent strength and excellent thermal conductivity. The interface can be stabilized in the process of growing the foamed cell to stably and uniformly form it, and the strength and thermal conductivity can be formed at a good level. Specifically, when the HLB is less than 12, there is a problem that the interface can not be stabilized so that the foamed cells can not be blown or uniformly grown. When the HLB is more than 17, it is present in a high viscosity or solid state at room temperature, so that it is difficult to apply in the process and the hydrophilic property rapidly increases, so that the hydrophobic blowing agent can not be dispersed in the phenol resin.
상기 비이온성 계면활성제로는 예를 들어, 피마자유에 알킬렌옥사이드가 부가된 즉, 피마자유 에틸렌옥사이드 부가물인 글리세릴트리리시놀레이트 에틸렌옥사이드 부가물, 폴리옥시알케닐렌소르비탄 알킬에스테르인 폴리옥시에틸렌소르비탄 에스테르, 폴리옥시알킬렌 알킬에스테르, 폴리알킬실옥산 계열의 실리콘계 계면활성제인 폴리디메틸실록산-폴리옥시알킬렌 공중합체 및 이들의 조합으로 이루어진 군에서 선택된 적어도 하나를 포함할 수 있다. Examples of the nonionic surfactant include glyceryl trinitolate ethylene oxide adduct to which an alkylene oxide is added to castor oil, that is, a castor oil ethylene oxide adduct, polyoxyalkylene sorbitan alkyl ester polyoxyalkylene sorbitan alkyl ester A polyoxyalkylene alkyl ester, a polyalkylsiloxane-based silicone surfactant, a polydimethylsiloxane-polyoxyalkylene copolymer, and a combination of these.
비이온성 계면활성제는 소수성 부분의 분자구조, 친수성 부분의 반복구조의 길이 및 분포에 따라서 HLB값이 상이하게 변화할 수 있다. 구체적으로, 상기 비이온성 계면활성제는 HLB 12 ~ 17인 피마자유 에틸렌옥사이드 부가물을 포함하여 충분하고 균일한 두께를 가지면서도 우수한 단열성, 압축강도 및 우수한 친환경성을 구현할 수 있다. 보다 구체적으로, 상기 비이온성 계면활성제는 예를 들어, 에틸렌옥사이드-프로필렌옥사이드의 블록공중합체 및 폴리옥시에틸렌도데실페닐에테르를 포함하지 않을 수 있다. 에틸렌옥사이드-프로필렌옥사이드의 블록공중합체 및 폴리옥시에틸렌도데실페닐에테르는 페놀수지와 상기 발포제 간에 안정적인 계면 형성이 어려워 발포시에 발포셀이 서로 결합되거나 터지는 현상이 발생되어 최종 발포체의 열전도도 저하 현상 및 발포체의 수축을 야기할 수 있다. The nonionic surfactant may have different HLB values depending on the molecular structure of the hydrophobic part, the length and the distribution of the repeating structure of the hydrophilic part. Specifically, the nonionic surfactant includes a castor oil ethylene oxide adduct having an HLB of 12 to 17, and has a sufficient and uniform thickness, and can exhibit excellent heat insulation, compressive strength, and excellent environmental friendliness. More specifically, the nonionic surfactant may not include, for example, block copolymers of ethylene oxide-propylene oxide and polyoxyethylene dodecylphenyl ether. The block copolymer of ethylene oxide-propylene oxide and the polyoxyethylene dodecylphenyl ether are difficult to form a stable interface between the phenol resin and the foaming agent, so that the foaming cells are bonded to each other or burst when they are foamed, and the thermal conductivity of the final foam is deteriorated And shrinkage of the foam.
상기 페놀계 수지 100 중량부에 대하여 상기 계면활성제를 약 1 중량부 내지 약 20 중량부로 포함할 수 있다. The surfactant may be included in an amount of about 1 part by weight to about 20 parts by weight based on 100 parts by weight of the phenolic resin.
상기 범위 내의 중량부로 포함함으로써 상기 발포성 조성물 내의 성분들을 용이하게 분산시킬 수 있으면서 상기 열경화성 발포체의 발포 구조를 충분하면서도 안정적으로 형성하여, 우수한 열전도도 및 우수한 물리적 강도를 구현할 수 있다.By including it as a weight portion within the above range, the components in the foamable composition can be easily dispersed, and the foam structure of the thermosetting foam can be sufficiently and stably formed to realize excellent thermal conductivity and excellent physical strength.
상기 발포성 조성물은 경화제, 용제, 기타 첨가제로서 난연제, 가소제, 중화제 및 이들의 조합으로 이루어진 군에서 선택되는 적어도 하나를 더 포함할 수 있다. The foamable composition may further include at least one selected from the group consisting of a flame retardant, a plasticizer, a neutralizing agent, and a combination thereof as a curing agent, a solvent, and other additives.
상기 경화제는 예를 들어, 산무수물계 화합물, 무기산계 또는 유기산계 화합물, 이소시아네이트계 화합물 및 이들의 조합을 포함하는 군에서 선택되는 적어도 하나를 포함할 수 있으나, 이에 제한되지 아니한다. The curing agent may include, but is not limited to, at least one member selected from the group including, for example, acid anhydride compounds, inorganic acid compounds or organic acid compounds, isocyanate compounds, and combinations thereof.
상기 페놀계 수지 약 100 중량부에 대하여 상기 경화제를 약 5 중량부 내지 약 30 중량부로 포함할 수 있다. And about 5 parts by weight to about 30 parts by weight of the curing agent relative to about 100 parts by weight of the phenolic resin.
상기 발포성 조성물이 발포 및 경화되어 상기 열경화성 발포체가 얻어질 수 있다. The foamable composition can be foamed and cured to obtain the thermosetting foam.
상기 열경화성 발포체의 평균 두께가 약 70mm 내지 약 300mm일 수 있다. The average thickness of the thermosetting foam can be from about 70 mm to about 300 mm.
상기 열경화성 발포체는 상기 범위 내의 평균 두께를 가짐으로써 이를 포함하는 건축용 단열재의 총 두께를 지나치게 증가시키지 않으면서 충분히 우수한 수준의 단열성을 구현할 수 있다. The thermosetting foam has an average thickness within the above range, so that a sufficient level of heat insulation can be realized without excessively increasing the total thickness of the building insulation including it.
구체적으로, 상기 평균 두께가 약 70mm 미만인 경우 발포시 압력이 과도하게 발생하여 두께 편차를 맞출 수 없는 문제가 있고 이를 해결하고자 발포제 함량을 낮추게 되면 열전도율 0.0184W/mK 성능을 확보할 수 없는 문제가 있고, 약 300mm 초과인 경우에는 발포체의 성장 과정에서 상단, 중단 및 하단 부분 간에 발포셀의 성장 속도가 달라져 이로 인한 균열이 발생하게 되므로 안정적으로 제조할 수 없는 문제가 있다.Specifically, when the average thickness is less than about 70 mm, there is a problem that the pressure is excessively generated at the time of foaming and the thickness deviation can not be adjusted. To lower the foaming agent content, a thermal conductivity of 0.0184 W / mK can not be secured , And when it is more than about 300 mm, the growth rate of the foamed cells varies between the upper end, the lower end, and the lower end in the growth process of the foamed material, thereby causing cracks.
또한, 상기 열경화성 발포체의 하기 계산식 1에 따른 두께 편차가 약 5% 미만일 수 있고, 구체적으로는 약 0.1% 내지 약 5%일 수 있다:Also, the thickness variation according to the following equation 1 of the thermosetting foam may be less than about 5%, and specifically about 0.1% to about 5%:
[계산식 1][Equation 1]
두께 편차(Td, %) = (Tmax
- Tmin)/Tavg Х 100Thickness deviation (T d ,%) = (T max - T min ) / T avg X 100
상기 계산식 1에서, 상기 Tmax는 두께 편차를 측정하고자 하는 발포체에 대하여 측정한 최대 두께를 의미하고, 상기 Tmin는 상기 발포체에 대하여 측정한 최소 두께를 의미하며, Tavg는 상기 발포체에 대하여 측정한 평균 두께를 의미한다. In Equation 1, T max means the maximum thickness measured for the foam to be measured, T min means the minimum thickness measured for the foam, T avg means the minimum thickness measured for the foam Means an average thickness.
상기 범위 내의 두께 편차를 가짐으로써 상기 열경화성 발포체는 더욱 균일한 두께로 형성될 수 있고, 그에 따라 장기 단열성이 더욱 효과적으로 향상될 수 있으면서 소정의 제품으로 적용시 가공성, 작업성이 더욱 우수할 수 있다. By having the thickness deviation within the above range, the thermosetting foam can be formed with a more uniform thickness, and the long-term heat insulation property can be improved more effectively, and the product can be further improved in workability and workability when applied to a predetermined product.
전술한 바와 같이, 상기 열경화성 발포체는 상기 페놀계 수지의 점도, 상기 발포제의 종류 및 함량 또는 상기 비이온성 계면활성제의 HLB를 적절히 조절하여 상기 열경화성 발포체를 충분하면서도 균일한 두께로 형성함에도 불구하고 더욱 우수한 단열성을 구현하면서 가공성, 작업성 및 시공성 개선될 수 있다. As described above, the thermosetting foam can be prepared by suitably controlling the viscosity of the phenolic resin, the kind and content of the foaming agent, or the HLB of the nonionic surfactant to thereby make the thermosetting foam sufficiently thick and uniform Workability and workability can be improved while realizing heat insulation.
또한, 상기 열경화성 발포체는 약 20℃의 온도 및 약 50mm의 두께 조건 하에서 두께 방향으로 측정한 열전도율이 0.0184W/mK 이하일 수 있고, 구체적으로는 약 0.0165W/mK 내지 약 0.0184W/mK일 수 있다.Also, the thermosetting foam may have a thermal conductivity of 0.0184 W / mK or less measured at a temperature of about 20 캜 and a thickness of about 50 mm, and specifically about 0.0165 W / mK to about 0.0184 W / mK .
통상 발포체의 두께가 두꺼워질수록 두께방향으로 측정한 열전도율은 저하될 염려가 존재하고 있다. There is a possibility that the thermal conductivity measured in the thickness direction generally decreases as the thickness of the foam increases.
상기 열경화성 발포체는 전술한 바와 같이 충분히 두꺼운 두께를 가지면서도 이의 열전도율을 저하시키지 않으므로 우수한 단열성을 유지할 수 있는 이점이 있다. As described above, the thermosetting foam has an advantage of being able to maintain excellent heat insulation because it has a sufficiently thick thickness and does not lower its thermal conductivity.
또한, 상기 열경화성 발포체는 밀도가 약 20kg/m3 내지 약 50kg/m3일 수 있다. 상기 범위 내의 밀도를 가짐으로써 상기 열경화성 발포체는 우수한 강도 및 우수한 단열성을 구현할 할 수 있다. In addition, the thermosetting foam may have a density of from about 20 kg / m 3 to about 50 kg / m 3 . By having a density within the above range, the thermosetting foam can realize excellent strength and excellent heat insulating property.
상기 열경화성 발포체는 예를 들어, 건축용 단열재의 용도로 적용될 수 있고, 그에 따라 건축용 단열재로서 요구되는 고후도 규격 및 우수한 단열성을 동시에 만족할 수 있으면서 우수한 친환경성을 구현할 수 있다.The thermosetting foam can be applied, for example, to the use of a thermal insulation material for construction, thereby satisfying both the thermal conductivity and the thermal insulation required for a building thermal insulation material, while achieving excellent environmental friendliness.
상기 건축용 단열재는 예를 들어, 상기 열경화성 발포체의 일면 또는 양면상에 표면재를 더 포함할 수 있고, 상기 표면재는 이 기술분야에서 공지된 종류를 사용할 수 있으며, 예를 들어, 유기물 또는 무기물 유래의 직물, 부직물, 천, 알루미늄 등의 금속 호일, 종이 등을 포함하는 재질일 수 있으나, 이에 제한되지 아니한다. For example, the building insulation may further include a surface material on one or both surfaces of the thermosetting foam, and the surface material may be of a kind known in the art, for example, an organic or inorganic- , Non-woven fabric, cloth, metal foil such as aluminum, paper, and the like.
본 발명의 다른 구현예에서, 페놀계 수지; 발포제로서 히드로플루오로올레핀(hydrofluoroolefin, HFO)계 화합물과 탄화수소계 화합물; 및 HLB(Hydrophile-Lipophile Balance)가 12 내지 17인 비이온성 계면활성제;를 혼합하여 발포성 조성물을 준비하는 단계; 및 상기 발포성 조성물을 발포 및 경화시켜 열경화성 발포체를 제조하는 단계;를 포함하는 열경화성 발포체의 제조방법을 제공한다. 상기 제조방법에 의해 일 구현예에서 전술한 열경화성 발포체를 제조할 수 있다. In another embodiment of the present invention, a phenolic resin; A hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound as a blowing agent; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17, to prepare a foamable composition; And foaming and curing the foamable composition to form a thermosetting foam. The present invention also provides a method for producing a thermosetting foam. The thermosetting foams described above in one embodiment can be prepared by the above process.
상기 제조방법에서, 페놀계 수지; 발포제로서 히드로플루오로올레핀(hydrofluoroolefin, HFO)계 화합물과 탄화수소계 화합물; 및 HLB(Hydrophile-Lipophile Balance)가 12 내지 17인 비이온성 계면활성제;를 혼합하여 발포성 조성물을 준비할 수 있고, 상기 발포성 조성물은 일 구현예에서 전술한 바와 같다. In the above production process, a phenolic resin; A hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound as a blowing agent; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17 may be mixed to prepare a foamable composition, as described above in an embodiment.
상기 발포성 조성물을 준비하는 단계에서, 상기 페놀계 수지는 상기 발포성 조성물 내에서 약 30 중량% 내지 약 90% 중량%의 함량으로 포함되도록 혼합할 수 있다. In the step of preparing the foamable composition, the phenolic resin may be mixed in the foamable composition in an amount of about 30% by weight to about 90% by weight.
또한, 점도가 40의 온도 조건 하에서 약 1,000cps 내지 약 30,000cps인 페놀계 수지를 혼합할 수 있다. Also, a phenolic resin having a viscosity of about 1,000 cps to about 30,000 cps under a temperature condition of 40 can be mixed.
상기 범위 내의 점도를 가지는 페놀계 수지를 혼합함으로써 발포력이 적절히 조절되면서 우수한 가공성을 구현하여, 상기 열경화성 발포체의 두께를 충분하면서 균일한 수준으로 형성할 수 있다. 구체적으로, 상기 점도 범위를 벗어나, 점도가 너무 낮은 경우 발포 초기에 발포 가스의 손실이 발생하여 생산이 완료된 이후 열전도도가 저하될 수 있고, 점도가 너무 높은 경우에는 발포 속도가 경화 속도에 비해 느려져 발포체의 두께를 충분한 수준으로 형성할 수 없다.By mixing a phenolic resin having a viscosity within the above range, the foaming power is appropriately controlled, and excellent processability is realized, so that the thickness of the thermosetting foam can be formed to a sufficient and uniform level. Specifically, if the viscosity is too low or the viscosity is too low, the loss of the foaming gas may occur at the initial stage of foaming and the thermal conductivity may be lowered after the completion of production. When the viscosity is too high, the foaming rate is slower than the curing rate The thickness of the foam can not be formed to a sufficient level.
상기 발포성 조성물을 준비하는 단계에서, 상기 페놀계 수지 약 100 중량부를 기준으로 상기 발포제를 총 함량 약 5 중량부 내지 약 15 중량부로 혼합할 수 있다.In the preparation of the foamable composition, the total amount of the foaming agent may be about 5 parts by weight to about 15 parts by weight based on about 100 parts by weight of the phenolic resin.
상기 발포제의 총 함량을 상기 범위가 되도록 혼합함으로써 발포력을 조절하여 상기 열경화성 발포체는 이의 강도를 우수한 수준으로 구현하면서 안정적인 셀 구조를 가질 수 있다.By adjusting the foaming power by mixing the total amount of the foaming agent to the above range, the thermosetting foam can have a stable cell structure while realizing its excellent strength.
또한, 상기 발포제로서, 상기 히드로플루오로올레핀계 화합물 대 상기 탄화수소계 화합물의 중량비가 약 1:0.01 내지 약 1:1의 중량비가 되도록 이들을 혼합할 수 있고, 있고, 구체적으로는 약 1:0.1 내지 약 1:0.7의 중량비가 되도록 이들을 혼합할 수 있다. As the foaming agent, the weight ratio of the hydrofluoroolefin compound to the hydrocarbon compound may be in the range of about 1: 0.01 to about 1: 1, and specifically about 1: 0.1 to 1: They can be mixed so as to have a weight ratio of about 1: 0.7.
상기 범위 내의 중량비로 혼합함으로써 상기 열경화성 발포체의 두께를 충분하면서도 균일한 수준으로 구현할 수 있다. 구체적으로, 상기 중량비의 범위를 벗어나, 상기 히드로플루오로올레핀계 화합물을 너무 많이 포함하거나 상기 탄화수소계 화합물을 너무 적게 포함하는 경우 발포 초기 발포제의 손실이 크고 발포력이 떨어져 상기 열경화성 발포체의 두께를 얇은 수준으로 형성할 수 밖에 없는 문제가 있고, 상기 히드로플루오로올레핀계 화합물을 너무 적게 포함하거나 상기 탄화수소계 화합물을 너무 많이 포함하는 경우에는 상기 열경화성 발포체의 셀 구조가 불안정해지면서 강도가 저하될 수 있는 문제가 있다.By mixing at a weight ratio within the above range, the thickness of the thermosetting foam can be realized to a sufficient and uniform level. Specifically, when the amount of the hydrofluoroolefin compound is too much or the hydrocarbon compound is too small, the loss of the foaming agent at the early stage of foaming is large and the foaming power is low and the thickness of the thermosetting foam is thin If the hydrofluoroolefin compound contains too little or too much of the hydrocarbon compound, the cell structure of the thermosetting foam may become unstable and the strength may be lowered there is a problem.
상기 발포성 조성물을 준비하는 단계에서, 상기 페놀계 수지 100 중량부에 대하여 상기 계면활성제를 약 1 중량부 내지 약 20 중량부로 혼합할 수 있다. In the preparation of the foamable composition, the surfactant may be mixed in an amount of about 1 part by weight to about 20 parts by weight based on 100 parts by weight of the phenolic resin.
상기 계면활성제를 상기 범위 내의 중량부로 혼합함으로써 상기 발포성 조성물 내의 성분들을 용이하게 분산시킬 수 있으면서 상기 열경화성 발포체의 발포 구조를 충분하면서도 안정적으로 형성할 수 있다.The components in the foamable composition can be easily dispersed by mixing the surfactant in a weight portion within the range, and the foam structure of the thermosetting foam can be sufficiently and stably formed.
구체적으로는, HLB가 약 13 내지 약 15인 비이온성 계면활성제를 혼합할 수 있다. 또한, 경화제, 용제, 기타 첨가제로서 난연제, 가소제, 중화제 및 이들의 조합으로 이루어진 군에서 선택되는 적어도 하나를 더 혼합하여, 상기 발포성 조성물을 준비할 수 있다. Specifically, a nonionic surfactant having an HLB of about 13 to about 15 can be mixed. Further, the foamable composition may be prepared by further mixing at least one selected from the group consisting of a flame retardant, a plasticizer, a neutralizer and a combination thereof as a curing agent, a solvent and other additives.
상기 제조방법에서, 상기 발포성 조성물을 발포 및 경화시켜 열경화성 발포체를 제조할 수 있다. In the above production method, the foamable composition can be foamed and cured to produce a thermosetting foam.
상기 발포성 조성물은 발포 및 경화를 동시에 진행할 있고, 이때 발포 또는 경화 중 어느 하나를 먼저 개시하거나, 또는 이들을 동시에 개시할 수도 있다. The foamable composition is simultaneously foamed and cured, and either the foamed or the cured foam may be initiated at the same time, or they may be simultaneously initiated.
상기 발포 및 경화는 예를 들어, 약 50 내지 약 90의 온도 조건 하에서 수행될 수 있다. The foaming and curing may be performed, for example, at a temperature of from about 50 to about 90 ° C.
또한, 상기 발포 및 경화는 약 2분 내지 약 20분의 시간 동안 수행될 수 있으나, 이에 제한되지 아니하고, 발명의 목적 및 용도에 따라 적절히 달라질 수 있다. In addition, the foaming and curing may be performed for a time of about 2 minutes to about 20 minutes, but it is not limited thereto, and may be suitably varied according to the purpose and use of the invention.
상기 발포성 조성물은 예를 들어, 소정의 몰드 내에서 발포 및 경화되거나 또는 예를 들어, 양 표면재 사이에 주입되거나 토출되면서 발포 및 경화될 수 있으나, 이에 제한되지 아니한다. The foamable composition may be foamed and cured, for example, but not limited to, foamed and cured in a predetermined mold or foamed and cured while being injected or discharged between, for example, both surfaces.
상기 열경화성 발포체를 제조하는 단계에서, 상기 열경화성 발포체는 평균 두께가 70mm 내지 300mm으로 형성될 수 있다. In the step of preparing the thermosetting foam, the thermosetting foam may have an average thickness of 70 mm to 300 mm.
상기 열경화성 발포체는 상기 범위 내의 평균 두께로 형성됨으로써 이를 포함하는 건축용 단열재의 총 두께를 지나치게 증가시키지 않으면서 충분히 우수한 수준의 단열성을 구현할 수 있다. 구체적으로, 상기 평균 두께가 약 70mm 미만인 경우 발포시 압력이 과도하게 발생하여 두께 편차를 맞출 수 없는 문제가 있고 이를 해결하고자 발포제 함량을 낮추게 되면 열전도율 0.0184W/mK 성능을 확보할 수 없는 문제가 있고, 약 300mm 초과인 경우에는 발포체의 성장 과정에서 상단, 중단 및 하단 부분 간에 발포셀의 성장 속도가 달라져 이로 인한 균열이 발생하게 되므로 안정적으로 제조할 수 없는 문제가 있다. 또한, 상기 열경화성 발포체의 하기 계산식 1에 따른 두께 편차가 약 5% 미만으로 형성될 수 있고, 구체적으로는 약 0.1% 내지 약 5%로 형성될 수 있다:The thermosetting foam is formed with an average thickness within the above range, so that a sufficient level of heat insulation can be realized without excessively increasing the total thickness of the building insulation material containing the foam. Specifically, when the average thickness is less than about 70 mm, there is a problem that the pressure is excessively generated at the time of foaming and the thickness deviation can not be adjusted. To lower the foaming agent content, a thermal conductivity of 0.0184 W / mK can not be secured , And when it is more than about 300 mm, the growth rate of the foamed cells varies between the upper end, the lower end, and the lower end in the growth process of the foamed material, thereby causing cracks. In addition, the thickness variation of the thermosetting foam according to the following equation 1 can be formed to less than about 5%, and specifically about 0.1% to about 5%:
[계산식 1][Equation 1]
두께 편차(Td, %) = (Tmax - Tmin)/Tavg X 100Thickness deviation (Td,%) = (T max - T min ) / T avg X 100
상기 계산식 1에서, 상기 Tmax는 두께 편차를 측정하고자 하는 발포체에 대하여 측정한 최대 두께를 의미하고, 상기 Tmin는 상기 발포체에 대하여 측정한 최소 두께를 의미하며, Tavg는 상기 발포체에 대하여 측정한 평균 두께를 의미한다. In Equation 1, T max means the maximum thickness measured for the foam to be measured, T min means the minimum thickness measured for the foam, T avg means the minimum thickness measured for the foam Means an average thickness.
상기 범위 내의 두께 편차로 형성됨으로써 상기 열경화성 발포체는 더욱 균일한 두께로 형성될 수 있고, 그에 따라 장기 단열성이 더욱 효과적으로 향상될 수 있으면서 소정의 제품으로 적용시 가공성, 작업성이 더욱 우수할 수 있다. The thermosetting foam can be formed to have a more uniform thickness by being formed with the thickness deviation within the above range, and the long-term heat insulation property can be improved more effectively thereby, and workability and workability can be further improved when applied to a predetermined product.
전술한 바와 같이, 상기 열경화성 발포체는 상기 페놀계 수지의 점도, 상기 발포제의 종류 및 함량 또는 상기 비이온성 계면활성제의 HLB를 적절히 조절하여 상기 열경화성 발포체를 충분하면서도 균일한 두께로 형성함에도 불구하고 더욱 우수한 단열성을 구현하면서 가공성 및 작업성이 개선될 수 있다. As described above, the thermosetting foam can be prepared by suitably controlling the viscosity of the phenolic resin, the kind and content of the foaming agent, or the HLB of the nonionic surfactant to thereby make the thermosetting foam sufficiently thick and uniform The workability and workability can be improved while realizing heat insulation.
또한, 상기 열경화성 발포체는 20℃의 온도 및 50mm의 두께 조건 하에서 두께 방향으로 측정한 열전도율이 0.0184W/mK 이하가 되도록 제조될 수 있고, 구체적으로는 약 0.0165W/mK 내지 약 0.0184 W/mK가 되도록 제조될 수 있다. In addition, the thermosetting foam may be manufactured such that the thermal conductivity measured in the direction of thickness under the conditions of a temperature of 20 캜 and a thickness of 50 mm is 0.0184 W / mK or less, specifically about 0.0165 W / mK to about 0.0184 W / mK .
상기 열경화성 발포체는 전술한 바와 같이 충분히 두꺼운 두께로 형성되면서도 이의 열전도율이 저하되지 않으므로 우수한 단열성을 유지할 수 있는 이점이 있다. As described above, the thermosetting foam is formed to have a sufficiently thick thickness and its thermal conductivity is not lowered, so that there is an advantage that excellent heat insulation can be maintained.
또한, 상기 열경화성 발포체는 밀도가 약 20kg/m3 내지 약 50 kg/m3로 제조될 수 있다. 상기 범위 내의 밀도로 제조됨으로써 상기 열경화성 발포체는 우수한 강도 및 우수한 단열성을 구현할 할 수 있다.In addition, the thermosetting foam may have a density of from about 20 kg / m 3 to about 50 kg / m 3 . The thermosetting foam can be produced with a density within the above range to realize excellent strength and excellent heat insulation property.
또한, 상기 열경화성 발포체는 약 110 kPa 내지 약 200 kPa의 압축강도를 가질 수 있다. 또는 약 120 kPa 내지 약 200 kPa의 압축강도 또는 약 130 kPa 내지 약 200 kPa를 가질 수 있다. 상기 범위 내의 압축 강도를 가짐으로써, 우수한 장기 내구성을 나타낼 수 있다.The thermoset foam may also have a compressive strength of from about 110 kPa to about 200 kPa. Or a compressive strength of from about 120 kPa to about 200 kPa or from about 130 kPa to about 200 kPa. By having a compressive strength within the above range, excellent long term durability can be exhibited.
이하에서는 본 발명의 구체적인 실시예들을 제시한다. 다만, 하기에 기재된 실시예들은 본 발명을 구체적으로 예시하거나 설명하기 위한 것에 불과하고, 이로써 본 발명이 제한되어서는 아니된다.Hereinafter, specific embodiments of the present invention will be described. However, the embodiments described below are only intended to illustrate or explain the present invention, and the present invention should not be limited thereto.
실시예Example
실시예Example
1 One
40의 온도 조건 하에서 점도가 3,900cps인 레졸계 페놀 수지를 20의 온도로 준비한 후 상기 페놀계 수지 100 중량부에 대하여 히드로플루오로올레핀계 화합물인 HFO-1233zdE와 탄화수소계 화합물인 n-펜탄이 1:0.25의 중량비로 혼합된 무색의 발포제 총 14 중량부, HLB(Hydrophile-Lipophile Balance)가 15인 비이온성 계면활성제인 글리세릴트리리시놀레이트 에틸렌옥사이드 부가물 5 중량부 혼합하여 발포성 조성물을 준비하였다.A phenol resin having a viscosity of 3,900 cps at a temperature of 40 ° C was prepared at a temperature of 20 ° C. Then, hydrofluoroolefin-based compound HFO-1233zdE and hydrocarbons-based compound n-pentane were added to 100 parts by weight of the phenolic resin : 0.25, and 5 parts by weight of a glyceryl trilinolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 15, were mixed to prepare a foamable composition .
이어서, 상기 발포성 조성물을 경화촉매 역할을 하는 para-Toluenesulfonic acid (PTSA) 70% 수용액 22 중량부와 2000rpm으로 믹싱하면 흰색의 발포폼이 형성되며 이를 캐터필러 하부에 흘려보내면 최종적으로 열경화성 발포폼이 제조된다. Subsequently, the foamable composition was mixed with 22 parts by weight of a 70% aqueous solution of para-toluenesulfonic acid (PTSA) serving as a curing catalyst at 2000 rpm to form a foam foam, which was then flowed under the caterpillar to produce a thermoset foam foam .
이때, 성형틀인 캐터필러는 7m/min의 라인속도, 70도의 온도에서 열경화성 발포폼의 두께가 90mm가 되도록 설정하였다.At this time, the caterpillar as the forming mold was set so that the thickness of the thermosetting foamed foam was 90 mm at a line speed of 7 m / min and a temperature of 70 degrees.
실시예Example
2 2
열경화성 발포폼의 두께가 130mm이 되도록 캐터필러를 설정하고, 3700cps의 점도를 갖는 페놀 수지를 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1 except that a caterpillar was set so that the thickness of the thermosetting foamed foam was 130 mm and a phenol resin having a viscosity of 3700 cps was used.
실시예Example
3 3
열경화성 발포폼의 두께가 200mm이 되도록 캐터필러를 설정하고, 3300cps의 점도를 갖는 페놀 수지를 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1 except that a caterpillar was set so that the thickness of the thermosetting foamed foam was 200 mm and a phenol resin having a viscosity of 3300 cps was used.
실시예Example
4 4
5000cps의 점도를 갖는 페놀 수지를 사용한 것을 제외하고는 상기 실시예 3과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 3 except that a phenol resin having a viscosity of 5000 cps was used.
실시예Example
5 5
HLB(Hydrophile-Lipophile Balance)가 12인 비이온성 계면활성제인 글리세릴트리리시놀레이트 에틸렌옥사이드 부가물을 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1, except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 12, was used.
실시예Example
6 6
HLB(Hydrophile-Lipophile Balance)가 17인 비이온성 계면활성제인 글리세릴트리리시놀레이트 에틸렌옥사이드 부가물을 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1, except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 17, was used.
실시예Example
7 7
히드로플루오로올레핀계 화합물인 HFO-1233zdE와 탄화수소계 화합물인 n-펜탄이 1:0.7의 중량비로 혼합된 발포제를 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1, except that a foaming agent in which a hydrofluoroolefin-based compound, HFO-1233zdE, and a hydrocarbon compound, n-pentane, were mixed in a weight ratio of 1: 0.7.
실시예Example
8 8
HLB(Hydrophile-Lipophile Balance)가 15인 비이온성 계면활성제인 폴리디메틸실록산-폴리옥시알킬렌 공중합체을 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1, except that a polydimethylsiloxane-polyoxyalkylene copolymer, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 15, was used.
실시예Example
9 9
HLB(Hydrophile-Lipophile Balance) 13의 비이온성 계면활성제인 글리세릴트리리시놀레이트 에틸렌옥사이드 부가물을 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1 except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant of HLB (Hydrophile-Lipophile Balance) 13, was used.
실시예Example
10 10
HLB(Hydrophile-Lipophile Balance) 16의 비이온성 계면활성제인 글리세릴트리리시놀레이트 에틸렌옥사이드 부가물을 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1, except that glyceryl trirricolate ethylene oxide adduct, which is a nonionic surfactant of HLB (Hydrophile-Lipophile Balance) 16, was used.
실시예Example
11 11
히드로플루오로올레핀계 화합물인 1,1,1,4,4,4-헥사플루오로-2-부텐(1,1,1,4,4,4-hexafluoro-2-butene)과 탄화수소계 화합물인 시클로펜탄이 1:0.2의 중량비로 혼합된 발포제를 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.1,1,1,4,4,4-hexafluoro-2-butene, which is a hydrofluoroolefin compound, and a hydrocarbon compound, A thermosetting foamed foam was prepared in the same manner as in Example 1, except that a blowing agent in which cyclopentane was mixed at a weight ratio of 1: 0.2 was used.
비교예Comparative Example
1 One
탄화수소계 화합물인 n-펜탄을 포함하지 않고, 히드로플루오로올레핀계 화합물인 HFO-1233zdE을 단독으로 포함하는 발포제를 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1 except that the foaming agent containing hydrofluoroolefin-based compound HFO-1233zdE alone was used instead of the hydrocarbon-based compound n-pentane.
비교예Comparative Example
2 2
HLB(Hydrophile-Lipophile Balance)가 10인 비이온성 계면활성제인 글리세릴트리리시놀레이트 에틸렌옥사이드 부가물을 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1 except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 10, was used.
비교예Comparative Example
3 3
HLB(Hydrophile-Lipophile Balance)가 18인 비이온성 계면활성제인 글리세릴트리리시놀레이트 에틸렌옥사이드 부가물을 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.A thermosetting foamed foam was prepared in the same manner as in Example 1 except that glyceryl trinitolate ethylene oxide adduct, which is a nonionic surfactant having an HLB (Hydrophile-Lipophile Balance) of 18, was used.
비교예Comparative Example
4 4
에틸렌옥사이드-프로필렌옥사이드의 블록 공중합체 및 폴리옥시에틸렌도데실페닐에테르를 1:1로 혼합하여, HLB(Hydrophile-Lipophile Balance)가 11인 (비이온성) 계면활성제를 사용한 것을 제외하고는 상기 실시예 1과 동일한 방법으로 열경화성 발포폼을 제조하였다.Except that a surfactant having an HLB (Hydrophile-Lipophile Balance) of 11 (nonionic) was used by mixing a block copolymer of ethylene oxide-propylene oxide and polyoxyethylene dodecylphenyl ether at a ratio of 1: 1. 1, a thermosetting foamed foam was prepared.
상기 실시예 및 비교예의 발포성 조성물 및 열경화성 발포폼 제조 조건 각각에 대하여, 하기 표 1에 기재하였다.The foamable compositions and the thermosetting foamed foam production conditions of the above Examples and Comparative Examples are shown in Table 1 below.
캐터필러 설정 두께Caterpillar setting thickness | 계면활성제 HLB값Surfactant HLB value | 수지 점도Resin viscosity | 발포제 배합 중량비Foaming agent mixing weight ratio | |
(mm)(mm) | (cps, 40℃)(cps, 40 < 0 > C) | (HFO:탄화수소)(HFO: hydrocarbon) | ||
실시예1Example 1 | 9090 | 1515 | 39003900 | 1:0.251: 0.25 |
실시예2Example 2 | 130130 | 1515 | 37003700 | 1:0.251: 0.25 |
실시예3Example 3 | 200200 | 1515 | 33003300 | 1:0.251: 0.25 |
실시예4Example 4 | 200200 | 1515 | 50005000 | 1:0.251: 0.25 |
실시예5Example 5 | 9090 | 1212 | 39003900 | 1:0.251: 0.25 |
실시예6Example 6 | 9090 | 1717 | 39003900 | 1:0.251: 0.25 |
실시예7Example 7 | 9090 | 1515 | 40004000 | 1:0.71: 0.7 |
실시예8Example 8 | 9090 | 1515 | 3900 3900 | 1:0.251: 0.25 |
실시예9Example 9 | 9090 | 1313 | 39003900 | 1:0.251: 0.25 |
실시예10Example 10 | 9090 | 1616 | 3900 3900 | 1:0.251: 0.25 |
실시예11Example 11 | 9090 | 1515 | 39003900 | 1:0.21: 0.2 |
비교예1Comparative Example 1 | 9090 | 1515 | 38003800 | 1:01: 0 |
비교예2Comparative Example 2 | 9090 | 1010 | 39003900 | 1:0.251: 0.25 |
비교예3Comparative Example 3 | 9090 | 1818 | 39003900 | 1:0.251: 0.25 |
비교예4 Comparative Example 4 | 9090 | 1111 | 39003900 | 1:0.251: 0.25 |
실험예Experimental Example
상기 실시예 및 상기 비교예에 따른 열경화성 발포체의 여러 물성을 평가하여 하기 표 2에 기재하였다. Various properties of the thermosetting foams according to the above Examples and Comparative Examples were evaluated and are shown in Table 2 below.
평가 방법Assessment Methods
실험예Experimental Example
1: 평균 두께 및 두께 편차 1: Average thickness and thickness variation
측정방법: 실시예 및 비교예의 열경화성 발포체를 600mmХ600mm 크기 및 해당 두께의 시편으로 각각 준비한 후 0.1mm 정밀도를 가진 슬라이딩 켈리퍼 기구를 사용하여, 도 1과 같이 상기 시편의 가로 및 세로 중 한면 당 100mm 간격으로 5개 지점의 두께를 측정하였다. 즉, 상기 시편의 총 4면의 20개 지점에서의 두께를 측정하여 Tavg
, Tmax , Tmin를 설정하고 하기 계산식 1에 의하여 두께 편차를 측정하였다.Measuring method: The thermosetting foams of Examples and Comparative Examples were each prepared with a specimen having a size of 600 mm X 600 mm and a thickness corresponding thereto. Then, using a sliding caliper apparatus having a precision of 0.1 mm, the specimen was measured at intervals of 100 mm The thickness of five points was measured. That is, the thicknesses at 20 points on all four sides of the specimen were measured to set T avg , T max , T min , and the thickness deviation was measured according to the following equation (1).
[계산식 1][Equation 1]
두께 편차(Td, %) = (Tmax
- Tmin)/Tavg Х 100Thickness deviation (T d ,%) = (T max - T min ) / T avg X 100
상기 계산식 1에서, 상기 Tmax는 발포체 시트에 대하여 측정한 최대 두께를 의미하고, 상기 Tmin는 측정한 최소 두께를 의미하며, Tavg는 측정한 평균 두께를 의미한다. In Equation 1, T max denotes a maximum thickness measured on a foam sheet, T min denotes a measured minimum thickness, and T avg denotes an average thickness measured.
실험예Experimental Example
2: 열전도도 2: Thermal conductivity
측정방법: 실시예 및 비교예의 열경화성 발포체를 300mmХ300mm 크기 및 두께는 상부부터 50mm로 절단하여 시편으로 각각 준비하고 이를 70도 12시간으로 건조하여 샘플을 전처리 하였다. 상기 각 시편에 대해 KS L 9016(평판 열류계법 측정방법)의 측정 조건에 따라 평균 온도 20℃에서 HC-074-300(EKO社) 열전도율 기기를 사용하여 측정하였다.Measuring method: The thermosetting foams of the examples and comparative examples were cut into a size of 300 mm × 300 mm and a thickness of 50 mm from the top, respectively, and the samples were pre-treated by drying at 70 ° C. for 12 hours. Each of the above specimens was measured using an HC-074-300 (EKO) thermal conductivity instrument at an average temperature of 20 ° C according to the measurement conditions of KS L 9016 (Flat Plate Heater Measurement Method).
실험예Experimental Example
3: 밀도 3: Density
측정방법: 실시예 및 비교예의 열경화성 발포체를 300mmХ300mm 크기 및 해당 두께의 시편으로 각각 준비하고, 상기 각 시편에 대해 질량 및 체적을 측정하여 밀도를 KS M ISO 845 규격의 방법으로 측정하였다.Measuring method: The thermosetting foams of Examples and Comparative Examples were each prepared with a specimen having a size of 300 mm x 300 mm and a corresponding thickness, and the mass and volume were measured for each of the specimens, and the density was measured by the method of KS M ISO 845 standard.
실험예Experimental Example
4: 압축강도 4: Compressive strength
측정방법: 실시예 및 비교예의 열경화성 발포체를 100mmХ100mm 크기 및 해당 두께의 시편으로 각각 준비하고, 시편을 압축 시험기 판 사이에 두고 UTM 장비에서 시편의 두께의 10%/min 속도로 설정한다. 압축강도 실험을 시작하여 두께가 감소되는 중에 도달하는 최대 하중을 기록한다. 압축강도는 기본적으로 KS M ISO 845 규격의 방법으로 측정하였다.Measuring method: Prepare the thermosetting foams of Examples and Comparative Examples in a size of 100 mm × 100 mm and a corresponding thickness, respectively, and set the specimen between the compression tester plates at a rate of 10% / min of the thickness of the specimen in the UTM equipment. Begin the compressive strength test to record the maximum load reached during the thickness reduction. The compressive strength was measured basically by the method of KS M ISO 845 standard.
평균 두께Average thickness | 두께 편차Thickness deviation | 열전도도Thermal conductivity | 밀도density | 압축강도Compressive strength | |
(mm)(mm) | (%)(%) | (W/mK)(W / mK) | (kg/m3)(kg / m 3 ) | (kPa)(kPa) | |
실시예1Example 1 | 90.490.4 | 1.41.4 | 0.01730.0173 | 3737 | 142142 |
실시예2Example 2 | 130.8130.8 | 2.32.3 | 0.01750.0175 | 3737 | 135135 |
실시예3Example 3 | 200.2200.2 | 2.72.7 | 0.01790.0179 | 3636 | 158158 |
실시예4Example 4 | 197.4197.4 | 3.33.3 | 0.01820.0182 | 3939 | 173173 |
실시예5Example 5 | 90.890.8 | 4.44.4 | 0.01820.0182 | 3737 | 118118 |
실시예6Example 6 | 9090 | 4.34.3 | 0.01820.0182 | 3737 | 127127 |
실시예7Example 7 | 90.390.3 | 1.71.7 | 0.01830.0183 | 3737 | 136136 |
실시예 8Example 8 | 90.7 90.7 | 2.12.1 | 0.01770.0177 | 3737 | 154154 |
실시예 9Example 9 | 90.690.6 | 2.42.4 | 0.01790.0179 | 3737 | 147147 |
실시예 10Example 10 | 90.2 90.2 | 2.92.9 | 0.01810.0181 | 3737 | 143143 |
실시예 11Example 11 | 90.490.4 | 2.32.3 | 0.01810.0181 | 3636 | 146146 |
비교예1Comparative Example 1 | 88.788.7 | 6.96.9 | 0.01670.0167 | 3838 | 124124 |
비교예2Comparative Example 2 | 90.690.6 | 2.72.7 | 0.02010.0201 | 3737 | 9898 |
비교예3Comparative Example 3 | 89.789.7 | 6.36.3 | 0.01890.0189 | 3737 | 100100 |
비교예4Comparative Example 4 | 88.788.7 | 7.17.1 | 0.02270.0227 | 3838 | 100100 |
상기 표 2에서 보는 바와 같이, 실시예는 5% 미만의 두께 편차를 가지는 바, 균일한 두께를 가지고, 우수한 열전도도와 압축강도를 가지는 반면, 비교예는 두께 편차가 상당히 큰 것을 알 수 있다.As shown in Table 2, it can be seen that the embodiment has a thickness variation of less than 5%, has a uniform thickness, has excellent thermal conductivity and compressive strength, while the comparative example has considerably large thickness deviation.
Claims (19)
- 페놀계 수지; 히드로플루오로올레핀(hydrofluoroolefin, HFO)계 화합물과 탄화수소계 화합물을 포함하는 발포제; 및 HLB(Hydrophile-Lipophile Balance)가 12 내지 17인 비이온성 계면활성제;를 포함하는 발포성 조성물의 발포 경화물인 Phenolic resin; A foaming agent comprising a hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17, which is a foamed composition of a foamable composition열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,상기 열경화성 발포체의 평균 두께가 70mm 내지 300mm인Wherein the thermosetting foam has an average thickness of 70 mm to 300 mm열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,상기 열경화성 발포체의 하기 계산식 1에 따른 두께 편차가 5% 미만인The thermosetting foam has a thickness deviation according to the following equation 1 of less than 5%열경화성 발포체:Thermosetting foams:[계산식 1][Equation 1]두께 편차(Td, %) = (Tmax - Tmin)/Tavg Х 100Thickness deviation (T d ,%) = (T max - T min ) / T avg X 100상기 계산식 1에서, 상기 Tmax는 두께 편차를 측정하고자 하는 발포체에 대하여 측정한 최대 두께를 의미하고, 상기 Tmin는 상기 발포체에 대하여 측정한 최소 두께를 의미하며, Tavg는 상기 발포체에 대하여 측정한 평균 두께를 의미한다. In Equation 1, T max means the maximum thickness measured for the foam to be measured, T min means the minimum thickness measured for the foam, T avg means the minimum thickness measured for the foam Means an average thickness.
- 제1항에 있어서,The method according to claim 1,상기 비이온성 계면활성제의 HLB는 13 내지 16인The nonionic surfactant has an HLB of 13 to 16열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,상기 폐놀계 수지는 점도가 40℃의 온도 조건 하에서 1,000cps 내지 30,000cps인The phenolic resin has a viscosity of from 1,000 cps to 30,000 cps열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,상기 페놀계 수지는 우레아 결합을 포함하지 않는The phenolic resin preferably contains no urea bond열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,상기 폐놀계 수지는 수분율이 5 중량% 이상인The phenolic resin has a water content of 5 wt%열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,상기 발포제는 상기 히드로플루오로올레핀계 화합물과 탄화수소계 화합물을 1:0.01 내지 1:1의 중량비로 포함하는Wherein the foaming agent comprises the hydrofluoroolefin compound and the hydrocarbon compound in a weight ratio of 1: 0.01 to 1: 1열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,상기 페놀계 수지 100 중량부 대비 상기 발포제의 총 함량이 5 중량부 내지 15 중량부인Wherein the total amount of the foaming agent is 5 parts by weight to 15 parts by weight relative to 100 parts by weight of the phenolic resin열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,상기 페놀계 수지 100 중량부에 대하여 상기 계면활성제를 1 중량부 내지 20 중량부로 포함하는Wherein the surfactant is contained in an amount of 1 to 20 parts by weight based on 100 parts by weight of the phenolic resin열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,20℃의 온도 및 50mm의 두께 조건 하에서 두께 방향으로 측정한 열전도율이 0.0184W/mK 이하인A thermal conductivity measured in the thickness direction under a condition of a temperature of 20 DEG C and a thickness of 50 mm is 0.0184 W / mK or less열경화성 발포체.Thermosetting foam.
- 제1항에 있어서,The method according to claim 1,밀도가 20kg/m3 내지 50 kg/m3인Having a density of 20 kg / m 3 to 50 kg / m 3열경화성 발포체.Thermosetting foam.
- 페놀계 수지; 발포제로서 히드로플루오로올레핀(hydrofluoroolefin, HFO)계 화합물과 탄화수소계 화합물; 및 HLB(Hydrophile-Lipophile Balance)가 12 내지 17인 비이온성 계면활성제;를 혼합하여 발포성 조성물을 준비하는 단계; 및Phenolic resin; A hydrofluoroolefin (HFO) -based compound and a hydrocarbon-based compound as a blowing agent; And a nonionic surfactant having a Hydrophile-Lipophile Balance (HLB) of 12 to 17, to prepare a foamable composition; And상기 발포성 조성물을 발포 및 경화시켜 열경화성 발포체를 제조하는 단계;Foaming and curing the foamable composition to produce a thermosetting foam;를 포함하는 열경화성 발포체의 제조방법.≪ / RTI >
- 제13항에 있어서,14. The method of claim 13,상기 열경화성 발포체를 제조하는 단계에서, 상기 열경화성 발포체는 평균 두께가 70mm 내지 300mm으로 형성되는In the step of producing the thermosetting foam, the thermosetting foam has an average thickness of 70 to 300 mm열경화성 발포체의 제조방법.A method of making a thermosetting foam.
- 제13항에 있어서, 14. The method of claim 13,상기 열경화성 발포체를 제조하는 단계에서, 상기 열경화성 발포체의 하기 계산식 1에 따른 두께 편차가 5% 미만으로 형성되는 In the step of producing the thermosetting foam, the thickness deviation of the thermosetting foam according to the following equation 1 is formed to be less than 5%열경화성 발포체의 제조방법:Method of preparing thermosetting foams:[계산식 1][Equation 1]두께 편차(Td, %) = (Tmax - Tmin)/Tavg Х 100Thickness deviation (T d ,%) = (T max - T min ) / T avg X 100상기 계산식 1에서, 상기 Tmax는 두께 편차를 측정하고자 하는 발포체에 대하여 측정한 최대 두께를 의미하고, 상기 Tmin는 상기 발포체에 대하여 측정한 최소 두께를 의미하며, Tavg는 상기 발포체에 대하여 측정한 평균 두께를 의미한다. In Equation 1, T max means the maximum thickness measured for the foam to be measured, T min means the minimum thickness measured for the foam, T avg means the minimum thickness measured for the foam Means an average thickness.
- 제13항에 있어서,14. The method of claim 13,상기 발포성 조성물을 준비하는 단계에서, HLB가 12 내지 17인 비이온성 계면활성제를 혼합하는In the step of preparing the foamable composition, a nonionic surfactant having an HLB of 12 to 17 is mixed열경화성 발포체의 제조방법.A method of making a thermosetting foam.
- 제13항에 있어서,14. The method of claim 13,상기 발포성 조성물을 준비하는 단계에서, 점도가 40℃의 온도 조건 하에서 1,000cps 내지 30,000cps인 페놀계 수지를 혼합하는In the step of preparing the foamable composition, a phenolic resin having a viscosity of 1,000 cps to 30,000 cps under a temperature condition of 40 캜 is mixed열경화성 발포체의 제조방법.A method of making a thermosetting foam.
- 제13항에 있어서,14. The method of claim 13,상기 발포성 조성물을 준비하는 단계에서, 상기 히드로플루오로올레핀계 화합물대 상기 탄화수소계 화합물의 중량비가 1:0.1 내지 1:1의 중량비가 되도록 이들을 혼합하는In the step of preparing the foamable composition, the weight ratio of the hydrofluoroolefin compound to the hydrocarbon compound is 1: 0.1 to 1: 1,열경화성 발포체의 제조방법.A method of making a thermosetting foam.
- 제13항에 있어서, 14. The method of claim 13,상기 열경화성 발포체는 20℃의 온도 및 50mm의 두께 조건 하에서 두께 방향으로 측정한 열전도율이 0.0184W/mK 이하가 되도록 제조되는The thermosetting foam is prepared so that the thermal conductivity measured in the direction of thickness under a condition of a temperature of 20 캜 and a thickness of 50 mm is 0.0184 W / mK or less열경화성 발포체의 제조방법.A method of making a thermosetting foam.
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