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WO2019050046A8 - 配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ - Google Patents

配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ Download PDF

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Publication number
WO2019050046A8
WO2019050046A8 PCT/JP2018/033711 JP2018033711W WO2019050046A8 WO 2019050046 A8 WO2019050046 A8 WO 2019050046A8 JP 2018033711 W JP2018033711 W JP 2018033711W WO 2019050046 A8 WO2019050046 A8 WO 2019050046A8
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WO
WIPO (PCT)
Prior art keywords
connection structure
flexible substrate
wiring substrate
substrate
conductor layer
Prior art date
Application number
PCT/JP2018/033711
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English (en)
French (fr)
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WO2019050046A1 (ja
Inventor
河村　卓
正人 石▲崎▼
直樹 後藤
Original Assignee
Ｎｇｋエレクトロデバイス株式会社
日本碍子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=65634879&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2019050046(A8) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ｎｇｋエレクトロデバイス株式会社, 日本碍子株式会社 filed Critical Ｎｇｋエレクトロデバイス株式会社
Priority to JP2019541053A priority Critical patent/JP6784846B2/ja
Priority to EP18854891.1A priority patent/EP3684147A4/en
Priority to CN201880053704.1A priority patent/CN111034372B/zh
Priority to CN202310223263.8A priority patent/CN116234163A/zh
Publication of WO2019050046A1 publication Critical patent/WO2019050046A1/ja
Publication of WO2019050046A8 publication Critical patent/WO2019050046A8/ja
Priority to US16/807,677 priority patent/US11178762B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

高周波信号の伝送損失を小さくし，かつ十分な機械的強度を有する配線基板とフレキシブル基板の接続構造を提供する。配線基板（７）とフレキシブル基板（８）とからなる接続構造であって，配線基板（７）は絶縁部材（４）と導体層（５）とグランド層（６ａ）とを備え，フレキシブル基板（８）は絶縁シート（９）と金属膜（１０）とを備え，この金属膜（１０）は接合材（２２）を介して導体層（５）に接合されるシグナル線パッド（１０ａ）を備え，接続構造（１）をフレキシブル基板（８）の裏面Ｑ´側から透視した際にシグナル線パッド（１０ａ）と導体層（５）とが重畳している重畳領域（２８）を備え，この重畳領域（２８）を信号の伝送方向に対して垂直な方向で切断した際の重畳領域（２８）に属しているシグナル線パッド（１０ａ）の幅をＷ，同じく重畳領域（２８）に属している導体層（５）の幅をＷ０とする場合に，Ｗ０＜Ｗを満たしている有用接続部分を備えていることを特徴とする配線基板とフレキシブル基板の接続構造（１）による。
PCT/JP2018/033711 2017-09-11 2018-09-11 配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ WO2019050046A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019541053A JP6784846B2 (ja) 2017-09-11 2018-09-11 配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ
EP18854891.1A EP3684147A4 (en) 2017-09-11 2018-09-11 CONNECTION STRUCTURE FOR WIRING SUBSTRATE AND FLEXIBLE SUBSTRATE, AND BOX FOR STORING ELECTRONIC COMPONENTS
CN201880053704.1A CN111034372B (zh) 2017-09-11 2018-09-11 布线基板与柔性基板的连接构造及电子器件收纳用封装体
CN202310223263.8A CN116234163A (zh) 2017-09-11 2018-09-11 布线基板与柔性基板的连接构造及电子器件收纳用封装体
US16/807,677 US11178762B2 (en) 2017-09-11 2020-03-03 Connection structure for wiring substrate and flexible substrate and package for housing electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-174391 2017-09-11
JP2017174391 2017-09-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/807,677 Continuation US11178762B2 (en) 2017-09-11 2020-03-03 Connection structure for wiring substrate and flexible substrate and package for housing electronic components

Publications (2)

Publication Number Publication Date
WO2019050046A1 WO2019050046A1 (ja) 2019-03-14
WO2019050046A8 true WO2019050046A8 (ja) 2019-05-09

Family

ID=65634879

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PCT/JP2018/033711 WO2019050046A1 (ja) 2017-09-11 2018-09-11 配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ

Country Status (5)

Country Link
US (1) US11178762B2 (ja)
EP (1) EP3684147A4 (ja)
JP (2) JP6784846B2 (ja)
CN (2) CN111034372B (ja)
WO (1) WO2019050046A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6848119B1 (ja) * 2020-11-11 2021-03-24 Ｎｇｋエレクトロデバイス株式会社 複合配線基板、パッケージおよび電子機器
JP7612968B2 (ja) 2021-09-28 2025-01-15 住友電工デバイス・イノベーション株式会社 半導体装置、半導体装置用のパッケージ及び半導体装置用のパッケージの製造方法
JP2023067351A (ja) 2021-11-01 2023-05-16 キヤノン株式会社 伝送モジュール、電子ユニット、及び電子機器
JPWO2023145817A1 (ja) 2022-01-31 2023-08-03
WO2024176458A1 (ja) * 2023-02-24 2024-08-29 日本電信電話株式会社 光モジュール
WO2024181322A1 (ja) * 2023-02-27 2024-09-06 京セラ株式会社 配線基板および配線基板を用いた光モジュール
WO2025009478A1 (ja) * 2023-07-03 2025-01-09 株式会社村田製作所 基板接続構造、アンテナ基板、表示装置

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JP4680410B2 (ja) * 2001-04-24 2011-05-11 日本特殊陶業株式会社 配線基板
JP3985634B2 (ja) * 2002-08-28 2007-10-03 セイコーエプソン株式会社 電子部品の実装基板、電気光学装置、電気光学装置の製造方法及び電子機器
JP2004247980A (ja) * 2003-02-14 2004-09-02 Hitachi Ltd 伝送線路の接続構造及び方法
JP2007005636A (ja) * 2005-06-24 2007-01-11 Kyocera Corp 入出力端子および電子部品収納用パッケージならびに電子装置
JP2007123742A (ja) * 2005-10-31 2007-05-17 Sony Corp 基板接続構造、フレックスリジッド基板、光送受信モジュール及び光送受信装置
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JP6218481B2 (ja) 2012-09-27 2017-10-25 三菱電機株式会社 フレキシブル基板、基板接続構造及び光モジュール
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WO2018003332A1 (ja) * 2016-06-27 2018-01-04 Ｎｇｋエレクトロデバイス株式会社 高周波用セラミックス基板および高周波用半導体素子収納パッケージ

Also Published As

Publication number Publication date
CN111034372A (zh) 2020-04-17
JP6784846B2 (ja) 2020-11-11
CN116234163A (zh) 2023-06-06
JP2021036592A (ja) 2021-03-04
CN111034372B (zh) 2023-03-14
US20200214130A1 (en) 2020-07-02
JP6951535B2 (ja) 2021-10-20
JPWO2019050046A1 (ja) 2020-04-30
EP3684147A1 (en) 2020-07-22
WO2019050046A1 (ja) 2019-03-14
EP3684147A4 (en) 2021-08-25
US11178762B2 (en) 2021-11-16

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