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WO2019037904A1 - Module de puissance à plaques de refroidissement - Google Patents

Module de puissance à plaques de refroidissement Download PDF

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Publication number
WO2019037904A1
WO2019037904A1 PCT/EP2018/062536 EP2018062536W WO2019037904A1 WO 2019037904 A1 WO2019037904 A1 WO 2019037904A1 EP 2018062536 W EP2018062536 W EP 2018062536W WO 2019037904 A1 WO2019037904 A1 WO 2019037904A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
power module
cooling plate
plates
electronic component
Prior art date
Application number
PCT/EP2018/062536
Other languages
German (de)
English (en)
Inventor
Michael Kohr
Gerhard Müller
Sebastian Appel
Tung Gärtner
Marcus Berner
Michael Fügl
Manuel Schwab
Original Assignee
Zf Friedrichshafen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102017214487.4A external-priority patent/DE102017214487A1/de
Priority claimed from DE102017214482.3A external-priority patent/DE102017214482A1/de
Priority claimed from DE102017214486.6A external-priority patent/DE102017214486A1/de
Priority claimed from DE102017214485.8A external-priority patent/DE102017214485A1/de
Application filed by Zf Friedrichshafen Ag filed Critical Zf Friedrichshafen Ag
Publication of WO2019037904A1 publication Critical patent/WO2019037904A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices

Definitions

  • the invention relates to a power module with an electronic component, a power module stack, an inverter and a motor vehicle drive train.
  • Stackable electronic modules are known which are each arranged on an external cooling plate.
  • electronics modules which are arranged together in a common housing. From such modules, an inverter can be constructed, which can be used for example for the electrical energization of an electric motor of a motor vehicle.
  • the object of the present invention is to improve the state of the art.
  • the proposed power module comprises a first cooling plate, a second cooling plate and an electronic component.
  • the two cooling plates are designed to absorb heat from the electronic module and transported away.
  • the electronic component in this case has a first cooling surface and a second cooling surface opposite thereto.
  • the electronic component transfers heat to its immediate surroundings via these two cooling surfaces.
  • the power module according to the invention also has a location for arranging the at least one electronic component between the first and second cooling plates. This ensures optimum heat transfer between the electronic component and the cooling plate.
  • the two cooling plates thereby essentially form a housing around the electronic component in which it is embedded. It is also possible to provide a plurality of such locations for a plurality of electronic components between the two sides. As a result, complex electrical circuits can be cooled with the heat sink module.
  • the two cooling plates each have an inner side and one outer side.
  • the inside of a cooling plate facing the other cooling plate wherein the outer sides of a cooling plate facing away from the other cooling plate.
  • the cooling plates each have an area with a surface structure which is suitable for releasing heat to a cooling medium, which flows past this surface structure.
  • the surface structure may represent a pin-fin structure or a channel structure through which a cooling medium can be passed.
  • the proposed power module has a passage for guiding a cooling medium from the outside of the one cooling plate to the outside of the other cooling plate.
  • the cooling plates of the proposed power module also have complementary grooves and springs.
  • a cooling plate has a groove, the other cooling plate a corresponding spring, which can engage in the assembly of the two cooling plates in the groove of a cooling plate.
  • a groove this is essentially a depression in the cooling plate understood.
  • a spring a corresponding survey on the cooling plate is understood, which is designed such that it can be introduced into the groove of the other cooling plate.
  • the grooves and springs are in each case arranged on the inside of the cooling plates and are thus opposite.
  • the grooves and springs are around the diameter arranged around it.
  • a simplification of the sealing of the location at which the electronic component is arranged can be achieved by the cooling medium.
  • the electronic component for the arrangement between the cooling surfaces of the heat sink module is in particular a heat-dissipating electronic component during operation.
  • This may in particular be a power electronic component, such as in particular a power semiconductor, such as an IGBT (bipolar transistor with insulated gate electrode) or a MOSFET (metal oxide semiconductor field effect transistor).
  • the electronic component can also be an electrical ohmic resistance and / or an electrical inductance and / or an electrical capacitance.
  • the electronic component may be a chip or a printed circuit board or the like, with one or more electrical components arranged thereon or therein.
  • the two cooling plates can in particular be made of a thermally conductive metal, expediently of the same material.
  • a thermally conductive material e.g. Iron or aluminum or copper or silver (this also includes Fe or Al or Cu or Ag alloys) ensures that rapid heat transfer within the cooling plates is possible, so that the heat emitted by the electronic component heat quickly to that on the cooling plates brieflyifcategorizedde cooling medium can be delivered.
  • thermal stresses between the two cooling plates can be prevented. This can ensure that even with different heating of the two cooling plates there is no tension within the power module.
  • the cooling plates are each formed in one piece.
  • the cooling plate comprises on the one hand the area in which the opening in the cooling plate is formed and on the other hand the area in which the location for arranging an electronic component is located.
  • the cooling plate also includes the area with the surface structure on the outside for dissipating heat to a cooling medium. Because the cooling plate te is integrally formed, can be dispensed with other parts, such as frames, carriers, etc, and the corresponding necessary joints or joining processes. The one-piece cooling plates are therefore particularly cost-effective.
  • the power module according to the invention is further distinguished by the fact that the cooling plates are materially connected to the electronic component.
  • the electronic component can be soldered to the cooling plates, welded, sintered or glued. This ensures optimum heat transfer from the heat surface of the electronic component to the cooling plates.
  • the first and second cooling plates are also materially connected to one another.
  • the two cooling plates are in the area of the passage, i. soldered, welded, sintered or glued in the area of the tongue and groove. This ensures that the two cooling plates are connected to each other media-tight and flowing within the passage cooling medium can not pass through the tongue and groove connection of the two cooling plates to the electronic component.
  • the tongue and groove of the cooling plates are thus intermeshing and ensure a secure sealing of the arranged between the cooling plates electronic component.
  • the tongue and groove in the cooling plates or, the tongue and groove connection in the power module can be designed such that upon engagement of the spring of a cooling plate in the groove of the other cooling plate, the spring is not at the bottom of the groove seated.
  • the groove of the other cooling plate is formed such that the spring of a cooling plate has a corresponding clearance within the groove, so that there is a gap between the bottom of the groove and the side walls of the groove to the spring.
  • the tongue and groove connection thus does not constitute a positive connection.
  • an optimal Ab- is adjustable to produce a material connection with an optimal heat transfer between the electronic component and the cooling plates.
  • spacers may be present on the inside of the cooling plates in a region of the cooling surfaces of the electronic component. These spacers may in this case be elevations which point from the inside of the cooling plate in the direction of the electronic component.
  • the spacers can also be inserts which are introduced between the inside of the cooling plates and the cooling surface of the electronic component. The spacers ensure that the distance between a cooling surface of the electronic component to a cooling plate remains constant despite existing tolerances in the thickness of the electronic component. This ensures that despite production-related tolerances in the manufacture of electronic components, the heat transfer between the cooling surface of an electronic component and a heat plate in the power modules always remains constant.
  • the power module according to the invention may be arranged between the groove and the spring and between a cooling surface of the electronic component and an inner side of the cooling plate, a sealing material.
  • the sealing material may be a sealant.
  • the sealing material may be a solder mass or a sintering paste.
  • the solder mass can be applied to the cooling surface of the electronic component, e.g. be printed.
  • the solder mass may also be applied to the spring of a cooling plate, e.g. be printed.
  • the solder mass can thus cover the entire cooling surface of the electronic component.
  • the solder mass may extend along the entire tongue and groove connection around the passage. The solder mass can fill the entire gap between the spring and the groove and thus ensure optimum connection and sealing.
  • the surface structure on an outer side of a cooling plate may be a pin-fin structure.
  • the pin-fin structure also referred to as a pin cooler, can by a plurality of Elevations, such as pins formed on the outside of a cooling plate.
  • Elevations such as pins formed on the outside of a cooling plate.
  • other designs for cooling structures are possible.
  • rib and / or honeycomb structures can be used. Some or all bumps are then formed accordingly by ribs or honeycombs.
  • the cooling plates may have a second passage.
  • the first and the second passage may be arranged at opposite ends of the cooling plate.
  • the cooling medium can be guided more effectively to the outside of the cooling plates.
  • the cooling medium can be led from one of the two passages and flow over the respective outer surface of a cooling plate and be discharged from the other of the two passages.
  • the passages thus serve to pass the cooling medium through the power module and past the outer sides of the cooling plates serving as cooling surfaces.
  • the cooling plates may have a lateral boundary for the electronic component on at least two sides. This makes it possible that the electronic component can be better positioned at the intended location between the two cooling plates.
  • a plurality of locations for arranging electronic components may be present between the cooling plates. This makes it possible to arrange electronic components next to one another on a larger base area, which can result in advantages in the circuit design and in the utilization of the available installation space.
  • the power module is designed so that it can be stacked with identical or identical power modules by arranging on an outside.
  • the power module is designed to be stacked with the further power module of choice on the first cooling plate or the second cooling plate. Both cooling plates of the power module are therefore equally suitable for arranging the further power module thereto.
  • Another aspect of the invention is a power module stack which has at least two power modules.
  • the power modules are arranged relative to one another in such a way that the first cooling plate of one power module bears against the second cooling plate of the power module directly adjacent thereto, the passages being arranged in series.
  • the arrangement is continued accordingly, so that always the first cooling plate of a power module is applied directly to the second cooling plate of a directly adjacent power module.
  • a distribution channel for a cooling medium may be formed between the first cooling plate of the one power module and the second cooling plate of the directly adjacent power module.
  • a distribution channel between adjacent power modules By forming a distribution channel between adjacent power modules, optimum heat dissipation of the individual power modules to the cooling medium can take place.
  • the individual power modules can be constructed to save space, since no separate distribution channel for guiding cooling medium along a cooling plate has to be provided for a single power module. Rather, the distribution channel for cooling medium can be formed by stacking two power modules accordingly. Between these two power modules, a distribution channel can then be formed between the first / second cooling plate of the one power module and the second / first cooling plate of the directly adjacent power module.
  • the power module has one or more electronic components for forming an inverter.
  • an inverter By means of an inverter, a direct current can be converted into an alternating current and / or vice versa.
  • the proposed power module may have at least one electrical half-bridge with a first and a second power semiconductor as electronic components.
  • the power module has a high-side power semiconductor and a low-side power semiconductor, in particular one IGBT or MOSFET each. From a plurality of identical or comparable power module can then be formed, for example, a full electrical bridge. For example, with three such power modules, which are then preferably stacked directly, a blast inverters are formed.
  • the proposed inverter for electrical energization of an electric motor therefore has several such proposed electronic modules stacked.
  • the electronic modules can be stacked directly on one another.
  • a B6 inverter may be formed by a stack of three such power modules.
  • Such an inverter can be constructed inexpensively by the simple mass producibility of such power module.
  • the use of additional cooling structures can be omitted.
  • such an inverter is easily scalable, since any number of modules can be stacked on top of each other.
  • the also proposed motor vehicle drive train has an electric motor as a traction drive.
  • the electric motor thus serves for vehicle propulsion or vehicle deceleration.
  • the electric motor and the inverter preferably operate as generators and charge the battery.
  • the powertrain may therefore serve for a purely electric powered electric vehicle, or it may be used with an internal combustion engine for a hybrid vehicle.
  • the motor vehicle drive train is characterized by the proposed inverter for electrical energization of the electric motor.
  • the inverter has a stack of several of the proposed power modules. Under such an electric current supply is both a supply of electric currents to the electric motor to understand, as well as a discharge of electric currents from the electric motor.
  • Fig. 1 is a three-dimensional view of the cooling plates of a power module
  • FIG. 2 is a sectional view through a power module stack
  • FIG. 3 is a three-dimensional sectional view through a power module stack
  • FIG. 6 is a sectional view through a power module with a plurality of electronic components
  • FIG. 7 shows a three-dimensional view of a power module with a plurality of electronic components
  • FIG. 1 shows a three-dimensional view of the first and second cooling plates 1 1 A, 1 1 B of a power module 1.
  • the two cooling plates 1 1 A and 1 1 B are hereby separated for better intuition.
  • the view of the provided thereon, complementary grooves 15 and springs 16 free. These surround each of the passages 12 and 13. This allows them to be sealed well.
  • first and second cooling plate 1 1 A and 1 1 B each have a recess for receiving an electronic component (not shown).
  • Each cooling plate 1 1 A and 1 1 B therefore has a location 8 for arranging the electronic component.
  • spacers 24 are arranged in the region of the point. On these spacers 24 lies in a composite power module, the electronic component (not shown). By the spacers 24 it is ensured that the distance between the electronic component and a cooling plate 1 1 A, 1 1 B is always constant.
  • FIG. 2 shows an exemplary stack of three identical power modules 1.
  • a power module 1 comprises a first cooling plate 1 1A, a second cooling plate 1 1 B and an electronic component 8A arranged therebetween.
  • This electronic component 8A is arranged at a suitable point 8 between the two cooling plates 1 1A, 1B.
  • the cooling plates 1 1A, 11 B have a tongue and groove connection system 15, 16.
  • the first cooling plate 11 A has a groove 15 and the second cooling plate 11 B a spring 16.
  • the groove 15 and the spring 16 are complementary to each other, so that they fit together when assembling the first cooling plate 1 1A on the second cooling plate 1 1 B.
  • a sealing material 23 is arranged between the groove 15 and the spring 16 in this case.
  • This sealing material 23 may e.g. a solder material for producing a material connection between the first and second cooling plate 1 1A, 11 B be.
  • the electronic component 8A has a first cooling surface 6 and a second cooling surface 7. These cooling surfaces 6, 7 are opposite each other and are each in thermal contact with a cooling plate 1 1A, 1 1 B. Between the cooling surfaces 6, 7 of the electronic component 8A and the insides B of the cooling plates 1 1 A, 1 1 B is a sealing material 23rd , In particular a solder material present, for producing a material connection between the electronic component 8A and the cooling plates 1 1A, 11 B.
  • a sealing material 23rd In particular a solder material present, for producing a material connection between the electronic component 8A and the cooling plates 1 1A, 11 B.
  • the electronic component 8A may in particular comprise one or more power semiconductors, such as an IGBT or MOSFET.
  • the electronic component 8A may, in particular, comprise a printed circuit board or a ceramic substrate on which one or more power semiconductors are arranged.
  • the electronic component 8A may form an electrical half-bridge with at least two power semiconductors.
  • Each cooling plate 11 A, 11 B has an inner side B and an outer side A. The inside B is in thermal contact with a cooling surface 6, 7 of the electronic component 8A.
  • the outer side A of a cooling plate 1 1 A, 1 1 B of a power module 1 has a surface structure.
  • These cooling structures are formed in the figures by way of example by so-called pin-fin structures, also called pin cooler.
  • the projections are accordingly formed by individual pins 22.
  • cooling structures are possible.
  • rib and / or honeycomb structures can be used. Some or all of the protrusions are then formed accordingly by ribs or honeycombs.
  • the surface structure is used in the heat exchange between the cooling medium and the cooling plate 1 1A, 1 1 B, wherein the cooling medium flows around the pins 22.
  • the cooling plates 1 1A, 1 B further have a first opening 12 and a second opening 13, which are formed at opposite ends of the cooling plates 1 1A, 1 1 B. These openings 12, 13 serve essentially to transport the cooling medium through the power module stack.
  • the surface structure on the outer side A of the first cooling plate 1 1 A of a power module 1 forms with the surface structure on the outer side A of the second cooling plate 1 1 B, a distribution channel 17 for the cooling medium.
  • a housing module 2 in the form of a dense cover plate.
  • another housing module 3 has at least one inlet 4 and a drain 5 for a cooling medium, for supplying and discharging cooling medium to the individual power modules 1.
  • the inlet and outlet 4, 5 for the cooling medium is connected to the passages 12, 13 in the cooling plates 1 1 A, 1 1 B and the distribution channel 17.
  • a preferred embodiment is that the housing module 3 is the inverter housing. In this version, inlet 4 and outlet 5 are integrated directly into the inverter housing.
  • the power module stack is placed directly on the inverter housing.
  • inlet and outlet 4, 5 for the cooling medium with the passages 12, 13 in the cooling plates 1 1A, 1 1 B and the distribution channel 17 are connected.
  • An alternative stack of power modules 1 has more or fewer such power modules 1.
  • no or other housing modules 2, 3 may be provided in the stack.
  • FIG. 3 shows a three-dimensional sectional representation through a power module stack, as already shown in FIG. 2. It can be clearly seen that each cooling plate 1 1A, 1 1 B has a first opening 12 and a second opening 13.
  • the openings 12, 13 are in such a way in the cooling plates 1 1A, 11 B formed that the surface structure with the pins 22 and the point 8 are arranged with the electronic component 8A therebetween.
  • the openings 12, 13 are connected to the distribution channel 17, which is formed between adjacent power modules 1.
  • the cooling medium passes from a first opening 12 through the distribution channel 17 to a second opening 13. This ensures optimum heat removal from the cooling plates 1 1A, 1 1 B to the cooling medium.
  • Fig. 3 it can be seen that the tongue and groove joint 15, 16 of the cooling plates 1 1A, 1 1 B of a power module 1 are each performed around the openings 12, 13 around.
  • a sealing compound 23 e.g. a lot introduced in the groove 15 .
  • a cohesive connection between the first cooling plate 1 1A and the second cooling plate 1 1 B can be produced. This ensures that the electronic module 8A is separated from the cooling medium flowing through the openings 12, 13 and the distribution channel 17.
  • FIG. 4 and 5 show a top view (FIG. 4) and a bottom view (FIG. 5) of a fanned stack of three identical power modules 1.
  • the electronic component 8A has electrical connections 14, which protrude laterally from the power module 1. As a result, the electronic component 8A can be electrically contacted on both sides. Corresponding electrical connections 14 are provided laterally on the heat sink modules 1.
  • the rest of the embodiment of the power module 1 in FIGS. 4 and 5 corresponds to that of FIG. 2 or FIG. 3. The explanations for this apply correspondingly also to FIGS. 4 and 5.
  • the embodiment of the power module 1 in FIG. 5 corresponds to that of FIG. 1 or FIG. 2. Accordingly, the explanations for this also apply to the embodiment according to FIG. 5.
  • FIG. 6 shows a power module 1 according to the embodiments of FIG. 2, 3.
  • the heat sink module 1 in Fig. 2, 3 however, several points 8 between the first and second cooling plate 1 1 A, 11 B are present here.
  • a plurality of exemplary 3, electronic components 8A between the first and second cooling plate 1 1A, 1 1 B are arranged.
  • FIG. 7 shows a three-dimensional representation of a power module 1 according to FIG. 6.
  • the second cooling plate 1 1 B has a plurality of exemplary regions 3 A in which a cooling surface 7 is integrated.
  • openings are formed, from which electrical connections 14 of the electronic components (not shown) led out of the module 1.
  • FIG. 9 shows a motor vehicle drive train, comprising an electric motor 18 as a traction drive and an inverter 19 for electrical energization of the electric motor 18.
  • the electric motor 18 may in particular be an induction machine, such as a synchronous or asynchronous machine ,
  • the electric machine 18 is supplied with alternating current from the inverter 19 via phase lines.
  • the inverter 19 draws the necessary electrical energy via DC lines from an electrical energy storage 20, such as from an accumulator or capacitor.
  • the electrical energy storage 20 thus provides a direct current. This is converted by the inverter 19 into alternating current for the electric motor 18.
  • the electric motor 18 then drives, for example, vehicle wheels 21.
  • the inverter 19 is constructed from a stack of power modules 1.
  • the inverter 19 may, for example, have or be constructed with a power module stack according to FIGS. 2, 3. As can be seen in FIG. 2, the axial terminations of the power module stack can be formed by housing modules 2, 3.
  • a flow control agent A flow control agent
  • a electronic component A electronic component

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un module de puissance (1), comprenant une première plaque de refroidissement (11A), une deuxième plaque de refroidissement (11B), un composant électronique (8A), lequel comporte une première surface de refroidissement (6) et une deuxième surface de refroidissement (7) opposée à cette dernière, un emplacement (8) destiné à agencer au moins un composant électronique (8A) entre la première et la deuxième plaque de refroidissement (11A, 11B) de telle sorte que de la chaleur peut être évacuée par les surfaces de refroidissement (6, 7) du composant électronique (8A) dans les plaques de refroidissement (11A, 11B), une plaque de refroidissement (11A, 11B) comportant une face intérieure tournée vers l'autre plaque de refroidissement (11B, 11A) et une face extérieure détournée de l'autre plaque de refroidissement (11B, 11A), les plaques de refroidissement (11A, 11B) comportant sur la face extérieure une zone pourvue d'une structure de surface pour l'évacuation de la chaleur dans un fluide de refroidissement circulant sur la structure de surface et les plaques de refroidissement (11A, 11B) comportant un premier passage (12) pour la conduite d'un fluide de refroidissement de la face extérieure d'une plaque de refroidissement (11A, 11B) à la face extérieure de l'autre plaque de refroidissement (11B, 11A) et les plaques de refroidissement (11A, 11B) étant équipées de rainures (15) et de ressorts (16) complémentaires, de sorte qu'une rainure (15) est réalisée autour d'un passage (12) sur la face intérieure d'une plaque de refroidissement (11A, 11B) et qu'un ressort complémentaire (16) est réalisé sur la face intérieure de l'autre plaque de refroidissement (11B, 11A) et les plaques de refroidissement (11A, 11B) étant respectivement monolithiques et les plaques de refroidissement (11A, 11B) étant reliées par pénétration de matière au composant électronique (8A) et les plaques de refroidissement (11A, 11B) étant reliées entre elles par pénétration de matière.
PCT/EP2018/062536 2017-08-21 2018-05-15 Module de puissance à plaques de refroidissement WO2019037904A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
DE102017214486.6 2017-08-21
DE102017214482.3 2017-08-21
DE102017214485.8 2017-08-21
DE102017214487.4A DE102017214487A1 (de) 2017-08-21 2017-08-21 Stapelbares Kühlkörpermodul
DE102017214482.3A DE102017214482A1 (de) 2017-08-21 2017-08-21 Vorrichtung zur Kühlung von Elektronikbauteilen
DE102017214487.4 2017-08-21
DE102017214486.6A DE102017214486A1 (de) 2017-08-21 2017-08-21 Stapelbares Kühlkörpermodul
DE102017214485.8A DE102017214485A1 (de) 2017-08-21 2017-08-21 Vorrichtung zur Kühlung von Elektronikbauteilen

Publications (1)

Publication Number Publication Date
WO2019037904A1 true WO2019037904A1 (fr) 2019-02-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/062536 WO2019037904A1 (fr) 2017-08-21 2018-05-15 Module de puissance à plaques de refroidissement

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WO (1) WO2019037904A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113883942A (zh) * 2021-11-15 2022-01-04 苏州惟新传热科技有限公司 一种模块化管翅式蓄冷板
CN115348798A (zh) * 2021-05-13 2022-11-15 百度（美国）有限责任公司 用于关键处理器的热管理板
CN115642471A (zh) * 2022-09-30 2023-01-24 深圳清华大学研究院 功率器件冷却装置和功率器件冷却系统
WO2024167577A1 (fr) * 2023-02-07 2024-08-15 Semiconductor Components Industries, Llc Ensembles de refroidissement direct à commutateur unique et procédés associés

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