WO2018230606A1

WO2018230606A1 - Laminated body and method for manufacturing recessed multilayer body using same

Info

Publication number: WO2018230606A1
Application number: PCT/JP2018/022577
Authority: WO
Inventors: 伊藤　弘幸; 立川　智之; 谷口　貴久; 由夏村上; 真邦井上; 寛明内田
Original assignee: 大日本印刷株式会社
Priority date: 2017-06-13
Filing date: 2018-06-13
Publication date: 2018-12-20
Also published as: TWI838337B; JPWO2018230606A1; TW201906727A; JP6741157B2

Abstract

The present disclosure provides a laminated body including at least a first layer, a first adhesive layer, and a patterned structure in this order, wherein the first adhesive layer has an adhesive force that changes due to adhesive force adjustment processing.

Description

Laminated body and method for producing multilayer body with recesses using the same

The present disclosure relates to a laminate capable of easily transferring a pattern-like structure.

Pattern-like structures placed on a member can be transferred onto the target surface using a transfer method when it is difficult to form directly on the surface to be placed or when it is desired to place them at multiple locations at once. Be placed. As a pattern-like structure, for example, a wiring pattern on a wiring board, a cell pattern used for a living tissue or an organ in the medical field, a wiring pattern formation process, a three-dimensional structure electronic component manufacturing process, etc. Examples thereof include a protective member disposed at a place where partial protection is required.

As a method of transferring the pattern-like structure to the transfer target, for example, using a carrier film on which the pattern-like structure is arranged, after bonding the structure on the carrier film and one surface of the transfer target, A method of peeling the carrier film is used. Patent Document 1 discloses a protective film with a carrier film that can prevent generation of wrinkles on a protective layer when a protective layer is transferred and arranged for the purpose of protecting a circuit or the like in the manufacture of a circuit board or the like. It is disclosed. The protective layer corresponds to the structure because it is transferred onto the circuit, but is not in a pattern.

Japanese Patent No. 5647593 JP-A-8-37378

The carrier film on which the structure is arranged needs to be bonded with a certain degree of strength before transfer. However, if the adhesive force between the structure and the carrier film is too high, it will be difficult to transfer the structure to the transfer target all at once. Depending on the mechanical strength of the structure, damage may occur during transfer. There are problems such as being likely to occur. Furthermore, depending on the type of structure, there is a problem in that the adhesive component of the carrier film remaining on the structure adversely affects the function and physical properties of the structure.

The present disclosure has been made in view of the above circumstances, and provides a laminate that can easily transfer a pattern-like structure to a transfer target, and a method for manufacturing a multilayer body with recesses using the laminate. Main purpose.

The present disclosure provides a laminate that includes at least a first layer, a first adhesive layer, and a pattern-like structure in this order, and the first adhesive layer undergoes an adhesive force adjustment process to change the adhesive force. To do.

In addition, the present disclosure is a method for manufacturing a multilayer body with a recess having a recess having an opening on one surface of the multilayer body using the above-described multilayer body, wherein the multilayer body is provided on one surface of a second layer. A contact step of contacting the structure directly or indirectly through a second adhesive layer, an adhesive force adjusting step of reducing the adhesive force of the first adhesive layer by the adhesive force adjusting process, and at least the first One or more other layers are formed on the surface of the second layer having the pattern portion on the side where the layer is peeled off and the pattern portion including at least the structure is transferred to the second layer in a pattern. Laminating step, laminating the pattern portion and the one or more other layers, the first region including the pattern portion and the other layer at a position overlapping the pattern portion in plan view, A partitioning step for partitioning into a second region; The first region was peeled off, and a recess forming step of forming the recesses, to provide a method of manufacturing a recessed multilayer body.

In the laminated body of the present disclosure, the first adhesive layer undergoes an adhesive force adjustment process and the adhesive force changes, whereby the pattern-like structure can be easily transferred onto the transfer target body. There exists an effect that generation | occurrence | production of the damage and the adhesive residue to the said structure side can be suppressed. Moreover, according to the manufacturing method of the multilayer body with a recessed part of this indication, there exists an effect that a recessed part can be easily formed in the multilayer body surface by using the said laminated body.

It is a schematic plan view which shows an example of the laminated body of this indication. FIG. 2 is a sectional view taken along line XX in FIG. It is process drawing explaining an example of the transfer method of the structure using the laminated body of this indication. It is a schematic sectional drawing which shows the other example of the laminated body of this indication. It is a schematic sectional drawing which shows the other example of the laminated body of this indication. It is process drawing explaining the other example of the transfer method of the structure using the laminated body of this indication. It is process drawing explaining the other example of the transfer method of the structure using the laminated body of this indication. It is process drawing which shows an example of the manufacturing method of the laminated body of this indication. It is process drawing which shows an example of the manufacturing method of the multilayer body with a recessed part of this indication. It is explanatory drawing explaining the position of the division line in a division process.

In this specification, when a certain configuration such as a certain member or a certain region is “above (or below)” another configuration such as another member or another region, unless otherwise limited, This includes not only when directly above (or directly below) another configuration, but also when above (or below) another configuration, i.e., another configuration above (or below) another configuration. This includes cases where elements are included.

The present disclosure includes a manufacturing method of a multilayer body and a multilayer body with a recess in an embodiment. Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, the present disclosure can be implemented in many different modes and should not be construed as being limited to the description of the embodiments exemplified below. Further, in order to clarify the description, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared with the embodiment, but are merely examples, and the interpretation of the present disclosure may be interpreted. It is not limited. In addition, in the present specification and each drawing, elements similar to those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate. Further, for convenience of explanation, the description may be made using the terms “upper” or “lower”, but the vertical direction may be reversed.

I. Laminate The laminate of the present disclosure has at least a first layer, a first adhesive layer, and a pattern-like structure in this order, and the first adhesive layer undergoes an adhesive force adjustment process and the adhesive force changes. To do.

FIG. 1 is a schematic plan view showing an example of the laminated body of the present disclosure, and FIG. 2 is a cross-sectional view taken along line XX of FIG. The laminated body 10 of the present disclosure has at least the first layer 1, the first adhesive layer 2, and the pattern-like structure 3 in this order, and the first adhesive layer 2 is subjected to an adhesive force adjustment process and has an adhesive force. Changes. In FIG. 2, the adhesive force between the first adhesive layer 2 and the first layer 1 before the adhesive force adjusting process is N ₁ , and the first adhesive layer 2 and the first layer 1 after the adhesive force adjusting process are The adhesive force between the first adhesive layer 2 before the N ₁ ′ adhesive strength adjustment process and the structure 3 is N ₂ , and the first adhesive layer 2 after the adhesive strength adjustment process and the structure 3 The adhesive strength between them is N ₂ ′.

3A to 3C are process diagrams illustrating an example of a structure transfer method using the laminate of the present disclosure. As a method of transferring the structure to the transfer target (second layer) using the laminate of the present disclosure, first, the structure 3 of the laminate 10 of the present disclosure is directly applied to one surface of the second layer 11. Alternatively, contact is indirectly made through the second adhesive layer (FIG. 3A, contact step). Next, the adhesive force of the first adhesive layer 2 is reduced by the adhesive force adjusting process T (FIG. 3B, adhesive force adjusting step). Thereafter, at least the first layer 1 is peeled (FIG. 3C, transfer step). In FIG. 3C, the first layer 1 and the first adhesive layer 2 are peeled off. As a result, the pattern portion 20 including at least the structure 3 is transferred onto the second layer 11 in a pattern on the second layer 11. In FIG. 3, the adhesive force between the structure and the second layer is N ₄ . Other reference numerals not described in FIG. 3 are the same as those in FIG.

As a method for transferring the patterned structure to the transfer target, for example, there is a method using a carrier film in which the patterned structure is arranged. The carrier film on which the structure is arranged needs to be bonded with a certain degree of strength before transfer. However, if the adhesive force between the structure and the carrier film is too high, it is difficult to transfer the structure to the transfer target at once. Depending on the mechanical strength of the structure, damage or the like may occur during transfer. There is a problem such as a problem. Furthermore, depending on the type of the structure, there is a problem that the adhesive component of the carrier film remaining on the structure adversely affects the function and physical properties of the structure.

In response to such a problem, the present inventors, as a laminate for transferring a patterned structure, have a patterned structure on an adhesive layer having a variable adhesive strength that is reduced by an adhesive force adjustment process. The laminated body of this indication which arranged this was developed, and it came to solve the said subject. That is, according to the laminated body of the present disclosure, by arranging the pattern-like structure on the first adhesive layer whose adhesive force is reduced by the adhesive force adjusting process, the first adhesive layer is formed before the adhesive force adjusting process. The structure can be held with a high adhesive force. On the other hand, after the adhesive force adjustment process, the adhesive force of the first adhesive layer to the structure is reduced, so that the structure can be easily peeled off. Thereby, the laminated body of this indication can transfer a structure to a transferred object collectively. In addition, since the first adhesive layer in the laminate of the present disclosure can sufficiently reduce the adhesive strength depending on the degree of the adhesive force adjustment processing, the laminate of the present disclosure can be applied to the mechanical strength and type of the structural body. Regardless, it is possible to achieve high transferability, and it is possible to suppress the breakage of the structure during transfer and the occurrence of adhesive residue on the structure side.

Here, the “pattern shape” means a state in which a structure is provided on a deposition surface of a layer on which the structure is disposed, and a part where the structure is not provided. In addition, a transfer body including at least a structure that is transferred to a transfer target by the laminate of the present disclosure may be referred to as a “pattern part”. The pattern part can be transferred onto the adherend in a pattern. Transferring to or being transferred to the transfer target means transfer or transfer onto one surface of the transfer target. Furthermore, the transfer target body onto which the pattern portion including the structure body is transferred by the laminate of the present disclosure may be referred to as a “second layer”. Hereinafter, the laminated body of this indication is demonstrated for every structure.

A. 1st adhesion layer The 1st adhesion layer in the layered product of this indication is a layer from which adhesive strength changes in response to adhesive strength adjustment processing. A 1st contact bonding layer has adhesiveness and / or adhesiveness before the adhesive force adjustment process.

1. Aspect of the first adhesive layer The first adhesive layer undergoes an adhesive force adjustment process and the adhesive force changes. Here, “the adhesive force changes upon receiving the adhesive force adjustment process” means that the adhesive force may be higher than before the adhesive force adjustment process and the adhesive force adjustment process. The adhesive strength may be lower than before receiving the adhesive strength adjustment processing. Among them, in the present disclosure, it is preferable that the adhesive force is reduced by receiving the adhesive force adjusting process, and it is more preferable that the adhesive force is lost after receiving the adhesive force adjusting process.

The first adhesive layer has a composition corresponding to the type of adhesive force adjustment treatment. As the adhesive force adjusting process, a process capable of reducing the adhesive force of the first adhesive layer is preferable, for example, heat treatment or heat treatment of cooling treatment, energy beam irradiation treatment, electric field application treatment or electric field treatment of no electric field treatment. , Etc.

That is, the first adhesive layer is a temperature-sensitive adhesive layer in which the adhesive strength is reduced by being subjected to heat treatment or cooling treatment, the energy ray responsive adhesive layer in which the adhesive strength is reduced by being subjected to the energy ray irradiation treatment. It can be roughly classified into the second aspect, which is an electric responsive adhesive layer whose adhesive strength is reduced by receiving an electric field application process or an electric field process. Hereinafter, the first adhesive layer will be described for each aspect.

(1) 1st aspect The 1st contact bonding layer of this aspect is a temperature-sensitive contact bonding layer which receives heat processing or a cooling process as an adhesive force adjustment process, and an adhesive force falls. The temperature-sensitive adhesive layer is an adhesive layer that repeats adhesiveness and non-adhesiveness in response to temperature changes. In the laminate of the present disclosure, even if it is a heat-peelable type in which the adhesive strength is reduced by heat treatment It may be a cooling peeling type in which the adhesive strength is reduced by the cooling treatment.

(A) Heat-peelable thermosensitive adhesive layer The heat-peelable thermosensitive adhesive layer is heated at a predetermined switching temperature or higher, so that the adhesive force is reduced and peeling is possible. The switching temperature can be appropriately set according to the composition of the heat-peelable thermosensitive adhesive layer, its melting point, and the like, and can be set in the range of 30 ° C. or higher and 200 ° C. or lower, for example, 40 ° C. or higher and 90 ° It is preferable to be within the range of ℃ or less. This is because workability at room temperature can be ensured by setting the switching temperature within the above-described range.

In addition, when the laminated body of this indication is used in the process with heat, it is preferable that switching temperature is higher than the temperature of the process with heat. Examples of the process accompanied by heat include a baking process (for example, about 120 ° C.) such as a solder resist in the production of a multilayer body with recesses described later, a reflow process (for example, about 260 ° C.), and the like.

The composition of the heat-peelable thermosensitive adhesive layer is not particularly limited as long as the desired physical properties can be exhibited. For example, a composition (composition A) containing at least an adhesive and a foaming agent or an expanding agent, an adhesive And a composition (composition B) containing at least a side chain crystalline polymer. In composition A, when the foaming agent is subjected to heat treatment, the expansion agent expands or the expansion agent expands, so that the contact area can be physically reduced to reduce the adhesive force and can be easily peeled off. . In addition, when the composition B is heated at a temperature equal to or higher than the melting point of the side chain crystalline polymer by heat treatment, the physical properties of the side chain crystalline polymer change due to the phase change and flow, and the adhesiveness of the temperature-sensitive adhesive layer is sufficient. And can be easily peeled off.

(I) Composition A
The composition A of the heat-peelable thermosensitive adhesive layer contains at least an adhesive and a foaming agent or an expanding agent.

接着 The adhesive contains a sticky polymer. Examples of the adhesive include natural rubber adhesive; synthetic rubber adhesive; styrene / butadiene latex-based adhesive; block copolymer type thermoplastic rubber; butyl rubber; polyisobutylene; acrylic adhesive; vinyl ether copolymer and the like. Can be mentioned. Specific examples include adhesives disclosed in JP 2008-13590 A, JP 3853247 A, and the like.

As the foaming agent or the expansion agent, a material that undergoes heat treatment to expand the foaming agent or expand the expansion agent can be used. The foaming agent may be a chemical foaming agent or a physical foaming agent. Specific examples of the foaming agent or the expanding agent include a foaming agent disclosed in JP 2008-13590 A, a thermally expandable microsphere disclosed in Japanese Patent No. 3853247, and the like. The temperature at which the foaming agent or expansion agent foams or expands, and the content of the foaming agent or expansion agent in the heat-peelable thermosensitive adhesive layer can be set as appropriate. Specifically, Japanese Patent Application Laid-Open No. 2008-13590. It can be made to be the same as the foaming or expanding temperature and content disclosed in Japanese Patent Publication No. 3853247.

The composition A can further include a side chain crystalline polymer. The side-chain crystalline polymer flows when heated at a temperature equal to or higher than the melting point, and can sufficiently reduce the adhesive force of the temperature-sensitive adhesive layer. Therefore, the content of the foaming agent in the temperature-sensitive adhesive layer is reduced. It is possible to reduce the thickness of the temperature-sensitive adhesive layer. Since the side chain crystalline polymer is described in “(ii) Composition B”, the description is omitted here. The content of the side chain crystalline polymer in the composition A is not particularly limited and can be set as appropriate.

(Ii) Composition B
The composition B of the heat-peelable thermosensitive adhesive layer contains at least an adhesive and a side chain crystalline polymer. Since it can be the same as that of the composition A about an adhesive agent, description here is abbreviate | omitted.

A side-chain crystalline polymer is a polymer that crystallizes at a temperature below the melting point and exhibits fluidity at a temperature above the melting point, and can reversibly cause a crystalline state and a fluidized state in response to a temperature change. It is. Examples of the side chain crystalline polymer include a polymer composed of (meth) acrylate having a linear alkyl group, an acrylic ester or methacrylic ester having an alkyl group, and a polar monomer. Specific examples include side chain crystalline polymers disclosed in Japanese Patent Application Laid-Open No. 2008-13590. The content of the side chain crystalline polymer in the composition B is not particularly limited, and the heat-peelable thermosensitive adhesive layer is substantially non-tacky at a temperature higher than a set temperature, and is tacky at a temperature lower than that. An amount sufficient to show the characteristics to be achieved can be set as appropriate. For example, the content can be set as disclosed in Japanese Patent Application Laid-Open No. 2008-13590.

(Iii) Other Examples of the heat-peelable thermosensitive adhesive layer containing the composition A described above include, for example, a heat-expandable layer of a heat-peelable pressure-sensitive adhesive sheet disclosed in Japanese Patent No. 3853247. Examples of the heat-peelable thermosensitive adhesive layer containing the composition B described above include a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet disclosed in Japanese Patent Application Laid-Open No. 2008-13590.

(B) Cooling and peeling type temperature-sensitive adhesive layer The cooling and peeling type temperature-sensitive adhesive layer is cooled at a predetermined switching temperature or lower so that the adhesive force is reduced and peeling is possible. The switching temperature can be appropriately set according to the composition of the cooling peelable thermosensitive adhesive layer, its melting point, and the like, and is preferably 10 ° C. or higher, for example. The switching temperature can be 70 ° C. or lower, and preferably 20 ° C. or lower. This is because, by setting the switching temperature within the above-described range, the cooling and peeling type temperature-sensitive adhesive layer can be easily peeled off at a normal temperature and in a cooling environment.

The composition of the cooling release type thermosensitive adhesive layer is not particularly limited as long as the desired physical properties can be exhibited. For example, an acrylic acid alkyl ester having 16 or more linear alkyl groups as side chains and / or The composition containing the side chain crystallizable polymer which comprises a methacrylic acid alkylester is mentioned.

Examples of the acrylic acid ester and / or methacrylic acid ester (generally referred to as (meth) acrylate) having 16 or more linear alkyl groups as side chains include hexadecyl (meth) acrylate, stearyl (meth) acrylate, docosyl ( Examples thereof include (meth) acrylates having a linear alkyl group having 16 to 22 carbon atoms such as (meth) acrylate.

The side chain crystallizable polymer is not particularly limited. For example, an acrylic acid alkyl ester and / or methacrylic acid alkyl ester having an alkyl group having 1 to 6 carbon atoms in the range of 40% by weight to 60% by weight A group-containing ethylenically unsaturated monomer within a range of 2 to 10% by weight, and an alkyl group having 16 to 22 carbon atoms and / or a methacrylic acid alkyl ester of 20 to 60% by weight. In the range, a monomer polymer containing the same can also be used.

The side chain crystallizable polymer preferably has a melting point (also referred to as a primary melting transition) in the range of 0 ° C. or higher and 70 ° C. or lower, particularly in the range of about 15 ° C. or higher and 55 ° C. or lower. Also, the side chain crystallizable polymer preferably melts in a relatively narrow temperature range below about 35 ° C, preferably below about 25 ° C. The amount of the side chain crystallizable polymer is not particularly limited, and it exhibits a characteristic that makes the temperature sensitive adhesive layer of the cooling release type almost non-tacky at a temperature below a set temperature and sticky at a temperature higher than that. A sufficient amount can be set as appropriate.

In addition, as a cooling peeling type temperature-sensitive adhesive layer containing the above-described composition, for example, an adhesive layer disclosed in JP-A No. 2000-351951 can be used.

(2) 2nd aspect The 1st contact bonding layer of this aspect is an energy beam responsive contact bonding layer which receives an energy beam irradiation process as an adhesive force adjustment process, and an adhesive force falls. The energy ray-responsive adhesive layer can be peeled due to a decrease in adhesive force and generation of shearing force on the adherend surface when the adhesive layer is cured and contracted by irradiation with energy rays.

The energy beam used for the energy beam irradiation treatment is not particularly limited as long as it can cause the reaction of the first adhesive layer, and can be appropriately selected according to the composition of the energy beam-responsive adhesive layer. Examples of the energy rays include various ionizing radiations such as rays of far ultraviolet rays, ultraviolet rays, near ultraviolet rays, infrared rays, electromagnetic waves such as X rays, electron rays and γ rays, proton rays and neutron rays. Of these, ultraviolet rays and electron beams are preferable.

The composition of the energy beam-responsive adhesive layer is not particularly limited as long as it can be cured by energy beam irradiation treatment. Examples of the composition of the energy beam responsive adhesive layer include a composition containing an acrylic polymer, an energy beam polymerizable oligomer or monomer, a polymerization initiator, and a crosslinking agent. In the present disclosure, “acryl” may also include “methacryl”.

Examples of the acrylic polymer include an acrylic ester copolymer which is a copolymer of an acrylic ester as a main monomer and a functional group-containing acrylic monomer copolymerizable with the acrylic ester. Examples of the functional group of the functional group-containing acrylic monomer include a hydroxyl group, a carboxyl group, an epoxy group, an isocyanate group, an amino group, and the like. As the acrylic ester and the functional group-containing monomer constituting the acrylic polymer, for example, acrylic esters and monomers disclosed in JP 2012-31316 A, JP 2004-158812 A, and the like can be used. Moreover, the said acrylic polymer can be made into the mass mean molecular weight (Mw) disclosed by the said gazette, for example.

The energy ray-polymerizable oligomer or monomer is not particularly limited as long as it can be polymerized by irradiation with energy rays, and examples thereof include oligomers or monomers such as photoradical polymerizability, photocationic polymerizability, and photoanion polymerizability. Can be mentioned. Specifically, energy beam polymerizable oligomers or monomers disclosed in JP 2012-31316 A, JP 2004-158812 A, and the like can be used. The energy ray-polymerizable oligomer or monomer can be, for example, the mass average molecular weight (Mw) and content disclosed in the above publication.

Examples of the polymerization initiator include IRGACURE754 (manufactured by BASF Japan), IRGACURE2959 (manufactured by BASF Japan), and photopolymerization initiators disclosed in JP-A No. 2004-158812. As the crosslinking agent, for example, an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, or the like can be used, and specifically, a crosslinking agent disclosed in JP 2012-31316 A can be used.

The energy beam responsive adhesive layer can further contain a gas generating agent. This is because the gas generating agent generates gas by irradiation with energy rays, and the gas moves to the interface between the adhesive layer and the adherend, so that peeling becomes easier. Although it does not specifically limit as a gas generating agent, For example, an azo compound and an azide compound can be used. Specific examples include azo compounds and azide compounds disclosed in JP-A No. 2004-158812. The content of the gas generating agent is not particularly limited as long as a desired function can be exhibited, but can be an amount disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-158812.

As the energy beam responsive adhesive layer, for example, an adhesive layer disclosed in JP 2012-31316 A, JP 2004-158812 A, or the like can be used.

(3) Third Aspect The first adhesive layer of this aspect is an electrically responsive adhesive layer that undergoes an electric field application process or a no-electric field process as an adhesive force adjustment process, and the adhesive force decreases. The electrically responsive adhesive layer is an adhesive layer that repeats adhesiveness and non-adhesiveness depending on whether or not an electric field is applied. In the laminate of the present disclosure, the electrically responsive adhesive layer may be an electro-releasable adhesive layer that exhibits an adhesive force in an electric field and decreases in an adhesive force when an electric field is applied. Alternatively, it may be an electroadhesive adhesive layer whose adhesive strength is reduced in an electric field. Especially, it is preferable that it is an electro-releasable contact bonding layer from which adhesive force falls by electric field application. This is because the transfer work and process can be performed in a normal environment.

If the first adhesive layer of the present embodiment is an electro-releasable adhesive layer, the adhesion adjusting process refers to an electric field application process for applying an electric field to the first adhesive layer under no electric field. That is, when the 1st contact bonding layer of this aspect is an electrodetachable contact bonding layer, the 1st contact bonding layer can have adhesiveness by putting the laminated body of this indication under an electric field. On the other hand, when the pattern part including the structure is transferred to the second layer, the electric field application process is performed by applying the electric field application by placing the laminated body of the present disclosure in the second layer under the electric field application state. The adhesive force of the adhesive layer is reduced, and at least the first layer can be peeled off.

Examples of the composition of such an electrically peelable adhesive layer include a composition containing an acrylic adhesive or a polyester adhesive and an electrolytic solution. The acrylic polymer constituting the acrylic adhesive is not particularly limited, but an acrylic polymer having a weight average molecular weight in the range of, for example, 10,000 to 5,000,000 can be used from the viewpoint of adhesiveness. The calculation method of the weight average molecular weight, and specific examples of the acrylic monomer and the polymerization initiator constituting such an acrylic polymer may be the same as the calculation method and materials disclosed in JP 2010-037354 A. I can do it.

The electrolytic solution is not particularly limited as long as it can exhibit a desired ionic conductivity, and examples thereof include a mixture containing a quaternary ammonium salt or alkali metal salt as an electrolyte and an organic solvent. The ionic conductivity of the electrolytic solution and the measuring method thereof, and the specific composition of the electrolytic solution are the same as the ionic conductivity and measuring method disclosed in JP 2010-37354 A and the composition of the electrolytic solution. be able to.

On the other hand, if the first adhesive layer of the present embodiment is an electroadhesive adhesive layer, the adhesive force adjusting process refers to an electric field process in which application of an electric field to the first adhesive layer is stopped to make no electric field. That is, when the first adhesive layer of this aspect is an electroadhesive adhesive layer, the first adhesive layer can have a desired adhesive force by applying an electric field to the first adhesive layer. On the other hand, when the pattern portion including the structure is transferred to the second layer, the application of the electric field to the first adhesive layer is stopped as an electric field treatment, so that the adhesive force of the first adhesive layer is reduced and the first Separation is possible at a desired interface between the adhesive layer and the adjacent layer.

Examples of the composition of such an electroadhesive adhesive layer include an electrorheological gel (ER gel) in which electrorheological particles (ER particles) are dispersed in a resin crosslinked body. Examples of the electroadhesive adhesive layer include an electroadhesive sheet as disclosed in, for example, JP 2013-049820 A, specifically, a silicon gel or urethane rubber having viscoelasticity in a porous sheet in which two layers are laminated. Alternatively, a sheet combining butadiene rubber can be used.

A known method can be used as a method of applying an electric field to the first adhesive layer. For example, a method of connecting a terminal to the conductive first layer and the structure and applying a voltage between the terminals, a terminal contacting the conductive first layer and the first adhesive layer, and applying a voltage between the terminals Methods and the like. As the conductive first layer, for example, a metal foil such as a copper foil or an aluminum foil can be used. The application conditions are not particularly limited, and can be set, for example, within an electric field range of 5 V to 50 V and an application time of 10 seconds to 120 seconds.

(4) Others The first adhesive layer of each aspect may contain other optional additives as necessary. Optional additives include, for example, powders such as colorants, pigments, surfactants, plasticizers, tackifiers, low molecular weight polymers, surface lubricants, leveling agents, antioxidants, corrosion inhibitors, and light stabilizers. Agents, ultraviolet absorbers, polymerization inhibitors, silane coupling agents, inorganic or organic fillers, metal powders, particles, foils, and the like.

2. Others It is preferable that the first adhesive layer exhibits a desired adhesive force before and after the adhesive force adjustment process. The adhesive force of the first adhesive layer before the adhesive force adjustment treatment depends on the composition and thickness of the adhesive layer, but is, for example, in the range of 0.1 N / 25 mm to 10 N / 25 mm, preferably 0.5 N / It is in the range of 25 mm or more and 5 N / 25 mm or less, more preferably in the range of 1 N / 25 mm or more and 3 N / 25 mm or less. Moreover, the adhesive force of the 1st adhesive layer after an adhesive force adjustment process should just be lower than before an adhesive force adjustment process. Especially, a 1st adhesive layer is easily peelable or non-adhesive with respect to a 1st layer or a structure. It is preferable to be able to show the property. The adhesive strength of the first adhesive layer after the adhesive strength adjustment treatment is, for example, 5 N / 25 mm or less, preferably 0.05 N / 25 mm or more and 2 N / 25 mm or less, and more preferably 0.05 N / 25 mm or more. It can be in the range of 5 N / 25 mm or less. Non-adhesive refers to a physical property that does not substantially have an adhesive force, and easy peelability refers to a tack that can be adhered to the first layer and the structure, and the first layer. Alternatively, it refers to a physical property that can be easily peeled from a structure.

The adhesive strength of the first adhesive layer before and after the adhesive strength adjustment treatment can be measured according to JIS Z0237-2009. For the measurement, a test piece having a first adhesive layer (width 25 mm, length 150 mm) lined with a 50 μm thick PET film was prepared, and the first adhesive layer of this test piece was bonded to a SUS304BA plate with a 2 kg roller. After two reciprocating pressure bonding, leave it for 1 to 24 hours under the conditions of temperature 20 ° C to 28 ° C and humidity 30% RH to 60% RH, and then a tensile tester (for example, A & D Co., Ltd., Tensilon Universal Test) Machine RTF-1150H) and stripping is performed under the conditions (peeling angle: 180 ° direction, tensile speed: 300 mm / min, peeling distance: 50 mm) according to JIS Z0237-2009. When measuring the adhesive strength of the first adhesive strength after the adhesive strength adjustment processing, the first adhesive layer of the test piece prepared by the above-described method is bonded to the SUS304BA plate, and the reciprocating pressure is applied twice with a 2 kg roller. After being left under the above conditions, an adhesive strength adjustment treatment is performed, and the treated specimen is peeled off using a tensile tester under the conditions in accordance with the above-described JIS Z0237-2009 and measured.

The thickness of the first adhesive layer is not particularly limited as long as it can exhibit a desired adhesive force with the first layer or the structure before and after the adhesive force adjustment treatment, and can be appropriately set. For example, it can be in the range of 1 μm to 500 μm, preferably in the range of 5 μm to 300 μm. The first adhesive layer may be a film or a sheet.

The first adhesive layer may be arranged on the entire surface of one surface of the first layer 1 as shown in FIG. 2, or may be arranged in the same pattern as the structure 3 as shown in FIG. . When the first adhesive layer has the same pattern as the structure, peeling occurs between the first layer after the adhesive force adjustment processing and the first adhesive layer, and thus the structure and the first layer on the structure It becomes possible to transfer the pattern portion having a surface to one surface of the second layer.

The mode of the first adhesive layer can be selected according to the use environment of the laminate of the present disclosure. For example, when used in a process that requires heat, such as a heating process, a heat-sensitive adhesive layer other than a heat-peelable adhesive layer is preferable, and an electric-responsive adhesive layer is more preferable because the operation is simple. Moreover, when using at the process of irradiating with an ultraviolet-ray, a thing other than an energy-beam-responsive adhesive layer is preferable, and a temperature sensitive adhesive layer is especially preferable.

B. First layer The first layer in the laminate of the present disclosure is a layer that supports the first adhesive layer and the structure. The first layer is a layer that is peeled and removed after bringing the laminated body of the present disclosure into contact with the second layer and performing an adhesive force adjusting process on the first adhesive layer, and is used for the laminated body of the present disclosure. Accordingly, it is a layer that becomes a release layer or a substrate.

The first layer can be bonded to the first adhesive layer before the adhesive strength adjusting process, and the first adhesive layer can exhibit a desired adhesive strength. Examples of the first layer include a resin layer, a metal layer such as a metal foil, a vapor deposition film having a metal film on one or both surfaces of the resin layer, a paper such as a release paper, a composite material of these materials, and the like. .

The resin layer is not particularly limited, but for example, polyesters such as polyethylene terephthalate and polyethylene naphthalate, acrylics such as polycarbonate and polymethyl methacrylate, olefins such as polyethylene and polypropylene, resins such as polyimide, cyclic polyolefin, and triacetyl cellulose. Layer.

Also, examples of the metal foil include copper foil and aluminum foil. As the copper foil, a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.). It may be used.

Among these, the first layer is preferably a resin layer. As will be described later, when the peeling position after the adhesive force adjustment processing is set between the first adhesive layer and the structure, the first layer is preferably a resin layer. This is because the adhesive force between the first adhesive layer and the first layer after the adhesive force adjusting process can be increased. Specifically, the first layer in this case is preferably a resin layer made of polyester such as PET, polyimide, polypropylene, polyethylene, or the like.

The surface of the first layer may be subjected to surface treatment on the side in contact with the first adhesive layer. The adhesive force between the first adhesive layer before and after the adhesive force adjustment process, particularly the first adhesive layer after the adhesive force adjustment process, can be increased, and the first adhesive layer and the first layer after the adhesive force adjustment process can be increased. It is because it can make it difficult to peel between. The method of surface-treating the surface of the first layer on the first adhesive layer side can be appropriately selected according to the type of material constituting the first layer. For example, a known method such as an oxidation method or an unevenness method. Is mentioned.

The thickness of the first layer is not particularly limited, but is preferably a thickness that provides a strength sufficient to support at least the first adhesive layer and the structure, for example, within a range of 5 μm to 1000 μm. be able to. The first layer may be a film or a sheet. Among these, a film is preferable from the viewpoint of peeling.

The first layer may or may not have optical transparency. When the first adhesive layer is an energy ray responsive adhesive layer, the first layer preferably has energy ray permeability. This is because the adhesive force of the first adhesive layer can be easily reduced by irradiating energy rays from the first layer side. The energy ray permeability of the first layer can be appropriately set according to the type of energy rays to be irradiated and the sensitivity of the material constituting the first layer to the energy rays. For example, if the energy ray is a light ray, the light transmittance of 400 nm or less of the first layer is preferably 60% or more. The light transmittance can be measured using a commercially available spectrophotometer (for example, MPC2200 manufactured by Shimadzu Corporation).

Further, when the first adhesive layer is a heat-peelable type thermosensitive adhesive layer, the first layer preferably has heat resistance. This is because when the adhesive force of the first adhesive layer is reduced by the heat treatment, thermal degradation of the first layer can be prevented and it can be easily peeled off. The first layer preferably has heat resistance that can withstand the heat treatment temperature of the heat-peelable thermosensitive adhesive layer, and specifically, the melting point of the first layer is preferably higher than the heat treatment temperature.

C. Structure The structure in the laminate of the present disclosure is a member that is disposed on the opposite side of the first adhesive layer from the first layer side. It is transferred to one surface of the second layer in a pattern directly or via another layer, thereby having a function corresponding to the application. In the laminate of the present disclosure, one or more structures are arranged in a pattern on the opposite side of the first adhesive layer from the first layer.

The structure can have a shape according to the application of the laminate of the present disclosure, for example, a layer shape such as a sheet or a film, a solid shape such as a sphere (ball), a cube, a rectangular parallelepiped, or the like. it can. The layered structure may be a single layer or may have a laminated structure. The size and thickness of the structure can be appropriately set according to the function and form of the structure and the use of the laminate of the present disclosure.

The material of the structure can be selected according to the use of the laminate of the embodiment of the present disclosure, the function and physical properties of the structure, and examples thereof include resins, metals, cells, and the like.

The structure itself may or may not have adhesiveness. When the structure has adhesiveness, the laminate of the present disclosure can directly transfer the pattern portion including the structure to the second layer without using an additional adhesive layer or the like. Here, the phrase “the structure has adhesiveness” includes not only that the structure has tackiness (adhesiveness) at room temperature but also the expression of tackiness by pressurization or heating.

The adhesive strength in the case where the structure has adhesiveness is not particularly limited as long as it can sufficiently adhere to the second layer as the transfer target, for example, within a range of 0.1 N / 25 mm to 5 N / 25 mm. Preferably, it can be in the range of 0.5 N / 25 mm or more and 1 N / 25 mm or less. The adhesive strength of the structure can be measured according to JIS Z0237-2009. The details of the measuring method are the same as the measuring method of the adhesive force described in the section “A. First Adhesive Layer”.

On the other hand, when the structure does not have adhesiveness, the laminated body of the present disclosure includes the structure and the second adhesive layer by having a second adhesive layer to be described later on the side opposite to the first adhesive layer side of the structure. Can be transferred to the second layer. That is, the structure can be transferred to the second layer indirectly via the second adhesive layer.

In addition to the adhesiveness described above, the structure can have a desired function and physical properties depending on the type of the structure, the use of the laminate of the present disclosure, and the like. Examples of physical properties required for the structure include heat resistance and chemical resistance.

Hereinafter, the structural body in the present disclosure will be described in more detail by dividing into application examples of the laminated body of the embodiment of the present disclosure.

(Application example 1)
Application example 1 is an example in which the laminate of the present disclosure is used as a carrier sheet for transfer, and can be used, for example, in the production of a multilayer body with recesses. Specifically, one of the members constituting the multilayer body is used as the second layer, and the pattern portion including the structure is transferred to the second layer using the laminated body of the present disclosure, and further on the structure. By disposing the constituent members of the multilayer body, the patterned structure can be disposed at a desired position in the production of the multilayer body. Then, after partitioning the multilayer body in accordance with the arrangement position of the structure, a partition region overlapping the structure in plan view can be peeled and removed, whereby a recess can be formed in the multilayer body. Since Application Example 1 will be described in detail in the section of “B. Manufacturing method of multilayer body with recesses” described later, description thereof is omitted here.

In Application Example 1, the structure can be a member constituting a multilayer body. For example, if it is a case where it uses for manufacture of the multilayer wiring board with a recessed part in the usage example 1, the member according to the process using the said laminated body can be used as said structure, Specifically, a protective layer, Examples include wiring patterns and solder balls. Among these, a protective layer can be suitably used as the structure.

In Application Example 1, the material of the structure can be appropriately selected from materials that exhibit physical properties in accordance with the process using the laminate. For example, if the structure is a protective layer, a resin may be used as a material for the structure. Moreover, if the said structure is a wiring pattern, as a material of a structure, the metal generally used for wiring, an electroconductive material, etc. are mentioned.

In Application Example 1, the structure may have desired physical properties depending on the application. In this case, the material of the structure can be appropriately selected according to physical properties. For example, the structure may have adhesiveness. Examples of the material of the structure having adhesiveness include adhesive rubbers such as polyurethane, butyl rubber, and polystyrene elastomer. These materials can be used alone or in combination of two or more.

In Application Example 1, the structure may have heat resistance. This is because the occurrence of a dimensional change of the structure due to heat can be suppressed. Especially, when the structure is a protective layer and is used for manufacturing a multilayer wiring board with a recess in Application Example 1, the structure is heated because it includes a heating step and it is necessary to form a recess with high dimensional accuracy. Requires high heat resistance. Examples of the material of the heat-resistant structure include polyester resins such as polyimide resin, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT), polyolefin resin, polyamide resin, polyimide resin, and polycarbonate. Examples thereof include resins, acrylic resins, polyvinyl chloride resins, and polyphenylene sulfide (PPS) resins. These resins can be used alone or in combination of two or more. Among these, polyphenylene sulfide (PPS) resin is preferable in that it has chemical resistance and the like described later.

Furthermore, in Application Example 1, the structure may have durability, chemical resistance, etc. in addition to heat resistance. This is because, when used for manufacturing a multilayer wiring board with recesses in Application Example 1, for example, when chemical treatment or the like is performed, deterioration due to the chemical solution of the structure and the second layer can be suppressed. Moreover, it is because generation | occurrence | production of adhesive residue can be suppressed when peeling and removing a division area.

In Application Example 1, the pattern-like structure is formed by arranging one or more structures in a pattern. The planar view shape per unit of the structure can correspond to the planar view shape per unit of the recess in the multilayer body with a recess when used in the manufacture of the multilayer wiring board with a recess in Application Example 1. The arrangement pattern of the structures can be the same as the arrangement pattern of the recesses formed in the multilayer body.

(Application example 2)
Application example 2 is an example in which the laminate of the present disclosure is used as a laminate for transferring a cell pattern. That is, a cell pattern can be transplanted to a living tissue by transferring the pattern portion including the structure to the second layer using the laminated body of the present disclosure using the living tissue, the culture substrate, or the like as the second layer.

In Application Example 2, examples of the structure include a cell sheet. The cell sheet is a sheet in which cultured cells are assembled and layered. Examples of the cells constituting the cell sheet include floating cells such as blood cells and lymphoid cells, and adhesive cells. Specific examples include cells disclosed in Japanese Patent Application Laid-Open No. 2007-014753.

In Application Example 2, the pattern-like structure is formed by arranging one or more structures in a pattern, and the planar view shape per unit of the structure is a unit per cell sheet in the cell pattern transfer laminate. It can correspond to a planar view shape. Further, the arrangement pattern of the structures can be the same as the arrangement pattern of the cell sheets in the cell pattern transfer laminate.

D. Second Adhesive Layer The laminate of the present disclosure may have a second adhesive layer having a composition different from that of the first adhesive layer on the side of the structure opposite to the first adhesive layer side. When the structure does not have adhesiveness, the structure is formed into the second layer via the second adhesive layer by having the second adhesive layer on the surface opposite to the first adhesive layer side of the structure. This is because it can be transferred. At this time, the pattern portion transferred to the second layer has at least the second adhesive layer and the structure in this order from the second layer side.
FIG. 5 is a schematic cross-sectional view illustrating another example of the laminated body of the present disclosure, and includes the second adhesive layer 4 on the side opposite to the first adhesive layer 2 side of the structure 3. In FIG. 5, the adhesive force between the structure 3 and the second adhesive layer 4 is N ₃ . Other reference numerals not described in FIG. 5 are the same as those in FIGS.

The second adhesive layer has adhesiveness and / or tackiness. Since the second adhesive layer is disposed on the surface opposite to the first adhesive layer side of the structure, the second adhesive layer is usually a pattern having the same shape as the structure.

The second adhesive layer has a composition different from that of the first adhesive layer. The composition different from the first adhesive layer refers to a composition in which the adhesive strength is unlikely to decrease when the adhesive strength adjusting process for the first adhesive layer is performed. Specifically, it refers to a composition in which the adhesive force of the second adhesive layer after the adhesive force adjustment process is higher than that of the first adhesive layer after the adhesive force adjustment process. In particular, the second adhesive layer preferably has a composition that does not lower the adhesive force due to various adhesive force adjustment treatments.

The composition of the second adhesive layer is not particularly limited as long as it can exhibit a desired adhesive force, and is composed mainly of a resin generally used for adhesives and pressure-sensitive adhesives such as thermoplastic resins and curable resins. Is mentioned. Examples of the resin include acrylic resin, epoxy resin, rubber, silicone resin, and polyester resin. One kind of these resins may be contained, or two or more kinds thereof may be contained. Of these, acrylic resins are preferred because of their excellent transparency, durability, heat resistance, and cost. The acrylic resin is not particularly limited, and a conventionally known polymer of acrylic monomer or methacrylic monomer can be used. Specifically, a monomer polymer used in the adhesive layer disclosed in JP-A-2009-226621 is exemplified. The second adhesive layer may contain the additive described in the section “A. First adhesive layer” as necessary.

The second adhesive layer preferably has physical properties according to the use of the laminate of the present disclosure. For example, if the laminate of the present disclosure is used in a method for manufacturing a multilayer body with a recess described later, the second adhesive layer preferably has heat resistance and chemical resistance.

The second adhesive layer preferably has a desired adhesiveness to each of the structure and the second layer to be transferred. When the structure is peeled from the laminated body of the present disclosure after the adhesive force adjustment processing, peeling may occur between the structure and the second adhesive layer, and the structure may be removed via the second adhesive layer. This is because it may be difficult to transfer to two layers. The adhesive force of the second adhesive layer can be, for example, in the range of 0.1 N / 25 mm to 5 N / 25 mm, and preferably in the range of 0.5 N / 25 mm to 1 N / 25 mm. The adhesive strength of the second adhesive layer can be measured according to JIS Z 0237-2009. The details of the measuring method are the same as the measuring method of the adhesive force described in the section “A. First Adhesive Layer”.

The thickness of the second adhesive layer is not particularly limited, and can be appropriately designed so as to be able to exhibit a desired adhesive force to the structure and the second layer. For example, within the range of 1 μm to 500 μm, Preferably, it can be in the range of 5 μm to 50 μm.

E. Arbitrary structure If the laminated body of this indication has adhesiveness, it can have a peeling layer on the opposite side to the 1st layer side of a structure. Moreover, if the laminated body of this indication has a 2nd contact bonding layer, it can have a peeling layer on a 2nd contact bonding layer. The release layer may have the same pattern as the structure, or may have a shape that covers the entire area of the arrangement surface of the structure of the first layer in plan view. A conventionally known release layer can be used.

F. Others The laminate of the present disclosure can collectively transfer one or more pattern portions including at least a structure to the second layer. The pattern portion is arranged in a pattern on the second layer.

1. Second Layer The second layer is a member that becomes a transfer target when a pattern portion including a structure is transferred from the laminated body of the present disclosure, and a release layer having an arbitrary configuration is excluded. A 2nd layer can be suitably selected according to the use of the laminated body of this indication. For example, if the laminated body of the present disclosure is used for manufacturing a multilayer body with concave portions described later, the second layer can be one of the members constituting the multilayer body. Specifically, if the multilayer body is a multilayer wiring board, examples of the second layer include a metal layer such as a wiring layer, a resin layer such as an insulating layer and a resin substrate, and the like. Moreover, when using the laminated body of this indication as a laminated body for cell pattern transcription | transfer, a culture substrate, a biological tissue, etc. are mentioned as a 2nd layer.

The second layer may be the same material as the first layer or a different material. However, when one surface of the structure is in contact with the first adhesive layer and the other surface is in contact with the second layer, the material of the second layer is between the structure and the second layer before and after the adhesive force adjustment processing. It is preferable that the adhesive force is selected so as to be different from the adhesive force between the first adhesive layer and the structure.

2. Relationship between Interlayer Adhesive Forces The laminated body of the present disclosure includes an adhesive force N ₁ between the first adhesive layer and the first layer before the adhesive force adjustment processing, and the first adhesive layer and the first layer after the adhesive force adjustment processing. N ₁ ′ may have a relationship of N ₁ > N ₁ ′, or may have a relationship of N ₁ <N ₁ ′. Further, the adhesive force N ₂ between the first adhesive layer and the structure before the adhesive force adjustment process, and the adhesive force N ₂ ′ between the first adhesive layer and the structure after the adhesive force adjustment process are N _It may have a relationship of ₂ > N ₂ ′, or may have a relationship of N ₂ <N ₂ ′.

Before the adhesive force adjusting processing, the magnitude relationship of the adhesive force N ₁ and adhesive force N ₂ is not particularly limited, it can have, for example, N _1> N ₂ relationship.

On the other hand, after the adhesive force adjustment processing, the adhesive force N ₁ ′ and the adhesive force N ₂ ′ may have a relationship of N ₁ ′> N ₂ ′, and have a relationship of N ₁ ′ <N ₂ ′. The pattern portion including the structure may be appropriately set depending on the peeling position when transferring the pattern portion to the second layer. That is, if N ₁ ′> N ₂ ′, when the pattern portion is transferred to the second layer, it can be easily peeled off at the interface between the first adhesive layer and the structure, while N ₁ ′ < If it is N ₂ ′, when the pattern portion is transferred to the second layer, it can be easily peeled off at the interface between the first adhesive layer and the first layer.

It is preferable that the adhesive forces N ₁ and N ₁ ′ between the first adhesive layer and the first layer before and after the adhesive force treatment have a desired size regardless of the material and type of the first layer. The adhesion _{N 1,} for example, 0.05 N / 25 mm or more and it is possible to, can be inter alia a 0.1 N / 25 mm or more 0.5 N / 25 mm in the following ranges. The upper limit of the adhesion _{N 1} is not particularly limited, it is possible to 5N / 25 mm or less. On the other hand, the adhesive force N ₁ ′ can be, for example, 5 N / 25 mm or less, and in particular, can be in the range of 0.1 N / 25 mm to 1 N / 25 mm.

Moreover, it is preferable that the adhesive forces N ₂ and N ₂ ′ between the first adhesive layer and the structure before and after the adhesive force treatment have a desired size regardless of the material or type of the material of the structure. The adhesion _{N 2,} for example, be a 0.5 N / 25 mm or more 10 N / 25 mm in the range, can be in the range Of these the following 1N / 25 mm or more 5N / 25 mm. Further, the adhesive force N ₂ ′ can be, for example, in the range of 0.05 N / 25 mm or more and 2 N / 25 mm or less, and in particular, in the range of 0.05 N / 25 mm or more and 0.5 N / 25 mm or less. it can.

Each adhesive force is measured for each adherend by transferring the adhesive layer to a PET substrate to form a PET / adhesive layer. The measurement method and measurement conditions can be the same as the measurement method and measurement conditions for the adhesive force described in the section “A. First Adhesive Layer 2. Others”.

In the laminate of the present disclosure, when the structure has adhesiveness, as shown in FIGS. 3A to 3B, the laminate of this specification is on the side opposite to the first adhesive layer side of the structure. In contact with the second layer at the surface Incidentally, the adhesive strength between the structure and the second layer and N _4. When the structure has adhesiveness, the magnitude relationship among the adhesive force N ₁ , the adhesive force N ₂ , and the adhesive force N ₄ is not particularly limited before the adhesive force adjustment processing. For example, N ₁ > N ₂ > N ₄ Can have a relationship.

On the other hand, after the adhesive force adjustment processing, as the magnitude relationship among the adhesive force N ₁ ′, the adhesive force N ₂ ′, and the adhesive force N ₄ , the adhesive force N ₄ is preferably the largest, for example, N ₄ > N ₁ It may have a relationship of “> N ₂ ”, or may have a relationship of N ₄ > N ₂ ′> N ₁ ′. By having the above relationship among the adhesive force N ₁ , the adhesive force N ₂ , and the adhesive force N ₄ , the interface between the first adhesive layer and the structure, or the interface between the first adhesive layer and the first layer This is because peeling easily occurs preferentially, so that the structure can be easily transferred to the second layer, and the structure can be fixed to the second layer with sufficient adhesive force.

Moreover, when the laminated body of this indication has the said 2nd adhesive layer on the opposite side to the said 1st adhesive layer side of the said structure, the laminated body of this indication is the structure side of the said 2nd adhesive layer. It contacts the second layer on the opposite surface. The laminated body of the present disclosure has the first adhesive layer and the structural body before and after the adhesive force adjustment processing when the surface of the second adhesive layer opposite to the structure side is brought into contact with the second layer. A first specification having a desired adhesive force relationship between the second adhesive layer and the second adhesive layer, and between the first layer and the first adhesive layer and the second adhesive layer. It can be roughly classified into a second specification having a desired adhesive force relationship with the second layer. Each specification will be described below.

(A) 1st specification When the laminated body of this specification makes the surface on the opposite side to the said structure side of the said 2nd contact bonding layer and a 2nd layer contact, the said 1st adhesion | attachment before the said adhesive force adjustment process adhesion between the layers and the structure N ₂ is, the adhesive force between the second adhesive layer and the second layer N is ₅ or more, the first adhesive layer after the adhesive force adjusting process and The adhesive force N ₂ ′ between the structures is lower than the adhesive force N ₅ between the second adhesive layer and the second layer.

6A to 6C are schematic views illustrating another example of the process of transferring the structure body to the second layer using the first specification of the laminated body of the present disclosure. The example which transfers the pattern part 20 containing the 2nd contact bonding layer 4 to the 2nd layer 11 is shown. 6, the adhesive strength between the second adhesive layer 4 and the second layer 11 and N _5. Other reference numerals not described in FIG. 6 are the same as those in FIGS.

According to this specification, before and after the adhesive force adjustment process, by having a predetermined adhesive force relationship between the first adhesive layer and the structure, and between the second adhesive layer and the second layer, As shown in FIG. 6C, peeling occurs between the first adhesive layer and the structure by the adhesive force adjustment process, and the pattern portion including at least the structure can be collectively transferred to the second layer. The pattern portion transferred to the second layer can have the second adhesive layer and the structure from the second layer side, and is arranged in a pattern on the second layer. In this specification, since the first adhesive layer remains on the first layer side, the first adhesive layer may cover the entire area of one surface of the first layer, and has the same pattern as the structure. May be.

In this specification, it is preferable that the adhesive force N ₂ and the adhesive force N ₅ have a relationship of N ₂ ≧ N ₅ before the adhesive force adjustment process. In addition, before and after the adhesive force adjustment process, the magnitude relationship among the adhesive force N ₁ , the adhesive force N ₂ , and the adhesive force N ₃ is not particularly limited, but may have a relationship of N ₁ > N ₂ > N ₃ , for example. . By having the above relationship among the adhesive force N ₁ , the adhesive force N ₂ , the adhesive force N ₃ , and the adhesive force N ₅ , it is possible to easily perform reattachment and position adjustment again. On the other hand, in this specification, it is preferable that the adhesive force N ₂ ′ and the adhesive force N ₅ have a relationship of N ₂ ′ <N ₅ after the adhesive force adjustment process, and the adhesive force N ₁ ′, the adhesive force N ₂ ′, It is more preferable that the adhesive strength N ₂ ′ is the smallest among the adhesive strength N ₃ and the adhesive strength N ₅ . Further, the relationship of the adhesive force between the adhesive force N ₁ ′ and the adhesive force N ₃ or the adhesive force N ₅ is not particularly limited. For example, the relationship of N ₃ ≧ N ₁ ′, the relationship of N ₅ > N ₁ ′ Can have. By having the above-mentioned relationship before and after the adhesive force adjustment process, the position can be readjusted before the adhesive force adjustment process, and after the adhesive force adjustment process, the first base material and the first adhesive layer are attached. It becomes possible to peel off at the same time.

Specific values of the adhesive strength N ₃ and the adhesive strength N ₅ are not particularly limited, and can have a desired size depending on the material and type of the structure.

In this specification, the difference Δ (N ₅ −N ₂ ′) between the adhesive force N ₂ ′ and the adhesive force N ₅ is not less than 0.1 N / 25 mm regardless of the material and type of the second layer and the structure. It is preferably within a range of 0.0 N / 25 mm or less, and more preferably within a range of 0.5 N / 25 mm or more and 2.0 N / 25 mm or less. This is because Δ (N ₅ −N ₂ ′) is within the above-described range, so that peeling can be easily caused at the interface between the first adhesive layer and the structure during transfer. Δ (N ₅ −N ₂ ′) is calculated by transferring the first adhesive layer and the second adhesive layer to the PET base material to form a PET / adhesive layer, and measuring the difference for each adherend. To do. The measurement method and measurement conditions can be the same as the measurement method and measurement conditions for adhesive strength described in the section “A. First Adhesive Layer 2. Others”.

This specification can be applied regardless of the use of the laminate of the present disclosure, but is particularly suitable as a specification for use as a laminate for cell pattern transfer. This is because if the first adhesive layer remains on the cell pattern, the function of the cell may be inhibited.

(B) Second specification The laminated body of the present specification has the first layer before the adhesive force adjustment processing when the second layer is brought into contact with the surface of the second adhesive layer opposite to the structure side. adhesion N ₁ between the adhesive layer and the first layer, and the adhesive force N ₅ or between the second adhesive layer and the second layer, the first adhesive after the adhesive force adjusting process It is preferable that the adhesive force N ₁ ′ between the layer and the first layer is lower than the adhesive force N ₅ between the second adhesive layer and the second layer.

FIGS. 7A to 7C are schematic views illustrating another example of the process of transferring the structure to the second layer using the second specification of the laminated body of the present disclosure. An example in which the pattern portion 20 including the subsequent first adhesive layer 2, structure 3, and second adhesive layer 4 is transferred to the second layer 11 is shown. Reference numerals not described in FIG. 7 are the same as those in FIGS.

According to this specification, before and after the adhesive strength adjustment process, the relationship between the first layer and the first adhesive layer and the relationship between the second adhesive layer and the second layer are as described above. Thus, peeling occurs between the first layer and the first adhesive layer by the adhesive force adjusting process, and the pattern portion including at least the structure can be collectively transferred to the second layer. The pattern portion transferred to the second layer has a second adhesive layer, a structure, and a first adhesive layer in this order from the second layer side. On the second layer, the pattern portion is a pattern. Arranged. In this specification, since the first adhesive layer remains on the structure side, the first adhesive layer is preferably in the same pattern as the structure.

In this specification, it is preferable that the adhesive force N ₁ and the adhesive force N ₅ have a relationship of N ₁ ≧ N ₅ before the adhesive force adjustment process. Further, before and after the adhesive force adjustment process, the magnitude relationship among the adhesive force N ₁ , the adhesive force N ₂ , and the adhesive force N ₃ is not particularly limited, but may be, for example, N ₁ > N ₂ > N ₃ . On the other hand, in this specification, it is preferable that the adhesive force N ₁ ′ and the adhesive force N ₅ have a relationship of N ₁ ′ <N ₅ after the adhesive force adjustment process, and the adhesive force N ₁ ′, the adhesive force N ₂ ′, More preferably, the adhesive strength N ₁ ′ is the smallest among the adhesive strength N ₃ and the adhesive strength N ₅ . This is because only the first layer can be removed by having the above relationship before and after the adhesive force adjustment processing.

The adhesive force N ₃ and the adhesive force N ₅ in this specification are the same as in the first specification.

In this specification, the difference Δ (N ₅ −N ₁ ′) between the adhesive force N ₁ ′ and the adhesive force N ₅ is 0.1 N / 25 mm or more regardless of the material and type of the first layer and the second layer. It is preferably within a range of 5.0 N / 25 mm or less, and more preferably within a range of 0.5 N / 25 mm or more and 2.0 N / 25 mm or less. This is because Δ (N ₅ −N ₁ ′) is within the above-described range, so that peeling can be easily caused at the interface between the first adhesive layer and the structure during transfer. The calculation method of Δ (N ₅ −N ₁ ′) can be the same as the calculation method of Δ (N ₅ −N ₂ ′).

This specification can be applied regardless of the use of the laminate of the present disclosure, but is particularly suitable as a specification for use in the production of a multilayer body with a recess. After transferring the structure to the second layer using the laminate of the present disclosure, when the other layer is laminated on the structure, the other layer may be temporarily fixed by the adhesive force remaining in the first adhesive layer. Because it can.

(C) Others When the laminate of this specification has a release layer on the second adhesive layer, the adhesive strength N ₁ , adhesive strength N ₂ , and adhesive strength N ₃ before the adhesive strength adjustment process are the same as the second adhesive layer higher than the adhesion N ₆ between the release layer is preferred.

F. Manufacturing method The manufacturing method of the laminated body of this indication is not specifically limited, According to a use, it can select suitably. For example, the following method can be used.

(1) 1st example As a 1st example of the manufacturing method of the layered product of this indication, the 1st member which has the 1st layer and the 1st adhesion layer, and the pattern-like structure arranged on the exfoliation layer are included. There is a method in which the structure is disposed on the first adhesive layer by bonding the second member.

Specifically, first, a first adhesive layer is formed on the first layer to obtain a first member. Further, the structure forming layer is disposed on the entire surface of the release layer to obtain the second member. The structure forming layer is patterned into a structure, and the material of the structure forming layer is the same as that of the structure. Next, the structure forming layer is patterned into a desired shape on the release layer to form a patterned structure. By laminating the surface of the second member opposite to the peeling layer side and the first adhesive layer of the first member, the laminated body of the present disclosure in which the patterned structure is disposed on the first adhesive layer Obtainable. When the structure forming layer does not have adhesiveness, the second member has a structure in which the second adhesive layer and the structure forming layer are arranged in this order on the release layer, and the structure is formed on the release layer. After patterning the forming layer and the second adhesive layer into a desired shape, the first adhesive layer of the first member is bonded.

As a method for forming the first adhesive layer, an adhesive composition containing the composition described in the section “A. First Adhesive Layer” is applied to one surface of the first layer, and the solvent is removed. Can be formed. A specific application method is not particularly limited, and for example, a method disclosed in JP-A-2015-108156 can be used. In addition, a commercially available tape containing the composition described in the above section “A. First Adhesive Layer” may be used as the first adhesive layer, and may be attached to the first layer. The second adhesive layer can also be formed on the release layer by the same method as the first adhesive layer.

The method for forming the structure forming layer is not particularly limited, and can be appropriately selected depending on the type of the structure. For example, the method of apply | coating the material of a structure on a peeling layer or a 2nd contact bonding layer etc. are mentioned. The method for patterning the structure forming layer can be appropriately selected according to the type of the structure, and for example, a known method such as punching or half-cutting can be used. The region other than the region that becomes the structure of the structure forming layer is peeled and removed.

In the example of the manufacturing method described above, the structure is formed by patterning the structure forming layer disposed on the entire surface of the release layer. However, the structure may be directly formed on the release layer in a pattern. . The method for forming the structure on the release layer can be appropriately selected depending on the type of the structure, and examples thereof include a printing method.

(2) Second Example As a second example of the manufacturing method of the laminated body of the present disclosure, the first adhesive layer is formed on the first layer, and the structure is directly formed on the first adhesive layer in a pattern. A method is mentioned. The method for directly forming the structure on the first adhesive layer can be appropriately selected according to the type of the structure, and examples thereof include a printing method.

(3) Third Example As a third example of the manufacturing method of the laminated body of the present disclosure, as illustrated in FIG. 8, the first layer 1, the first adhesive layer 2, and the structure forming layer 3A are at least in this order. There is a method of preparing a laminated body 50 laminated in (FIG. 8A) and patterning at least the structure forming layer 3A to form a patterned structure 3 (FIG. 8B). . The patterning method of the structure forming layer can be the same as the method described in the first example of the manufacturing method. Further, when the structure forming layer is patterned, the first adhesive layer may be patterned together.

(4) Fourth Example As a fourth example of the manufacturing method of the laminated body of the present disclosure, the first release layer, the first adhesive layer, the structure forming layer, and the second release layer are laminated at least in this order. There is a method in which a laminate is prepared, and after patterning at least the first release layer, the first adhesive layer, and the structure forming layer, the first release layer is released and the first layer is disposed. According to the method, the pattern portion including the structure and the first adhesive layer can be formed in a pattern on the first layer. The patterning method can be the same as the method described in the first example of the manufacturing method.

G. Applications The laminate of the present disclosure can be used in various applications that require transfer of a patterned structure, depending on the function of the structure. For example, the laminate of the present disclosure can be a transfer carrier sheet. Specifically, the laminate of the present disclosure has a first layer as a base material, a structure as a protective layer, a carrier film having a base material and a first adhesive layer, and a patterned protective layer. A carrier sheet for protective layer transfer can be obtained. By using the laminate of the present disclosure as a protective layer transfer carrier sheet, the patterned protective layer can be transferred to a desired position in the second layer. The carrier sheet for transfer of a protective layer can be suitably used for forming a recess in the production of a multilayer body with a recess. In particular, when the multilayer body with a recess is a multilayer wiring board with a recess, the other layer can be protected from a chemical solution or the like by transferring the protective layer and covering the surface of the other layer. The manufacturing method of the multilayer body with a recessed part using the laminated body of this indication is mentioned later. Further, the protective layer transfer carrier sheet can also be used as a masking material for masking a desired position of the second layer with a patterned protective layer.

Moreover, the laminated body of this indication has a cell support layer which has a base material and a 1st contact bonding layer, and a patterned cell sheet, for example, a 1st layer is a base material and a structure is a cell sheet. It can be set as the laminated body for cell pattern transfer. By making the laminate of the present disclosure a laminate for transferring a cell pattern, a cell pattern can be easily transferred directly to a second layer such as a cell culture substrate or a living tissue regardless of shape or size. Further, by selecting the type of the first adhesive layer, transfer can be performed without destroying the cells.

II. The manufacturing method of the multilayer body with a recessed part The manufacturing method of the multilayer body with a recessed part of this indication is a manufacturing method of the multilayer body with a recessed part provided with the recessed part which has an opening in one surface of a multilayer body using the above-mentioned laminated body, A contact step of contacting the structure of the laminate directly or indirectly through the second adhesive layer to one surface of the second layer, and the first adhesive layer by the adhesive force adjusting process. An adhesive force adjusting step for reducing the adhesive force, a transfer step for peeling at least the first layer and transferring a pattern portion including at least the structure to the second layer in a pattern, and the above for the second layer. A lamination step of laminating one or more other layers on the surface having the pattern portion, and the pattern portion and the one or more other layers are in a position overlapping the pattern portion and the pattern portion in plan view. First region including the other layers And a partitioning step of partitioning into other second regions, and a recess forming step of peeling and removing the first region to form the recesses.

FIG. 9 is a process diagram illustrating an example of a method for manufacturing a multilayer body with a recess according to the present disclosure. Since the contact process, the adhesive force adjustment process, and the transfer process have been described with reference to FIGS. 3, 6, and 7, illustration and description thereof are omitted here. FIG. 3 shows a case where the structure of the laminated body is brought into direct contact with one surface of the second layer in the contact step. FIGS. 6 and 7 show the second layer in the contact step. The case where the said structure of the said laminated body is made to contact indirectly through the said 2nd contact bonding layer is shown on one side of the layer. As shown in FIGS. 3, 6, and 7, the contact process (FIG. 3A, FIG. 6A, and FIG. 7A), the adhesive force adjustment process (FIG. 3B, and FIG. 6A). b), FIG. 7B), and the transfer step (FIG. 3C, FIG. 6C, FIG. 7C), and then the second layer 11 on the side having the pattern portion 20 One or more other layers 12 (12A to 12C) are stacked on the surface (FIG. 9A, stacking step). Subsequently, in the second layer 11, the pattern portion 20 and the one or more other layers 12A to 12C are placed on the pattern portion 20 and the other layers 12A to 12A in a position overlapping the pattern portion 20 in plan view. The first region 51 including 12C and the other second region 52 are partitioned (FIG. 9B, partitioning step). Thereafter, the first region 51 is peeled and removed to form a recess P (FIG. 9C, recess forming step). Thereby, the multilayer body 30 with a recessed part is obtained.

For example, in a component-mounted multilayer wiring board including a flexible printed wiring board (FPC), the adoption of a structure in which a recess having an opening is provided on one surface of the multilayer wiring board and a component such as a chip is placed in the recess is promoted. (See Patent Document 2). According to the above structure, the electronic component that has been placed on the surface of the multilayer wiring board can be placed in the recess, so that the entire component-mounted multilayer wiring board can be reduced in thickness and size. It becomes.

Here, as a method of forming the recess in the multilayer body such as a multilayer wiring board, cutting by an end mill or laser processing or the like is generally used. However, in these methods, since processing is required for each portion where the concave portion is to be provided, the concave portion cannot be easily provided, the position where the concave portion is formed is shifted during processing, and the position where the concave portion is formed is misaligned. There are problems such as damage to the layers.

In order to solve such a problem, the present inventors have arranged a structure that triggers the peeling in the multilayer body when the multilayer body is manufactured as a method of forming a recess in the multilayer wiring board. The present inventors have found a method of easily forming a concave portion at a desired position of a multilayer body by separating and peeling the area of the multilayer body overlapping in plan view with a half cut or the like. According to this method, it is possible to easily form a concave portion at the position of the partition region, and it is assumed that positional displacement during processing, damage to other layers, and the like can be suppressed.

However, in the above method, the structures must be arranged in accordance with the positions where the recesses are to be provided in the multilayer body, which not only complicates the arrangement work but also reduces the arrangement position accuracy. In addition, since the structure is arranged in a multilayer body and triggers peeling, it is required to be thin, flexible, and small in size. In particular, when the multilayer body is a multilayer wiring board, these demands on the structure increase. However, if such structures are individually arranged in a pattern according to the positions where the recesses are formed, the handling is inferior, and the arrangement work becomes more complicated.

As another method for disposing the structure in the multilayer body, the structure body is formed by patterning directly on a layer to be an adherend (second layer in the method for manufacturing a multilayer body with a recess according to the present disclosure). A method is also envisaged. However, there are problems such as an increase in the number of steps and an adverse effect on other layers depending on the patterning method.

Therefore, the present inventors can use the laminate described in the section “I. Laminate” to arrange the structures in a pattern in the multilayer body by a simpler method. I found it. That is, when the adhesive strength adjustment process is performed in a state where the second layer and the laminate are in contact with each other, the adhesive strength of the first adhesive layer of the laminate is reduced, and the pattern portion including the structure can be easily formed. Peelable. For this reason, regardless of the shape, thickness, size, or the like of the structure, the pattern portion can be collectively transferred to a desired position of the second layer in a pattern, and the transfer accuracy can be increased. Then, by laminating another layer on the surface of the second layer on which the pattern portion is transferred, the pattern portion is arranged in a pattern inside the multilayer body, and the pattern portion is formed on the second layer. By partitioning the first region having, the first region can be peeled and removed in a lump starting from the pattern portion. Thereby, the recessed part which has an opening in the one surface side of a multilayer body can be collectively formed in pattern shape. At this time, since the first region can be partitioned in accordance with the position of the pattern portion, the formation position accuracy of the recess can be increased.
Hereafter, each process of the manufacturing method of the multilayer body with a recessed part of this indication is demonstrated.

1. Contacting Step The contacting step in the present disclosure is a step of bringing the structure of the laminated body into contact with one surface of the second layer directly or indirectly through the second adhesive layer.

(1) Laminate Since the laminate used in this step has been described in detail in the above-mentioned section “I. Laminate”, description thereof is omitted here.

(2) 2nd layer The 2nd layer used in this process can be suitably selected according to the target multilayer object with a crevice, for example, the member illustrated by the above-mentioned item of "I. laminated body" is mentioned. Can be mentioned. The second layer may have another layer in advance on the surface opposite to the laminate side. The other layers will be described later.

(3) Contact method In this step, the patterned structure of the laminate is brought into contact with one surface of the second layer directly or indirectly through the second adhesive layer. When the structure of the laminated body has adhesiveness, the structure of the laminated body can be brought into direct contact with one surface of the second layer. Moreover, when the said laminated body has a 2nd contact bonding layer on the opposite side to the said 1st contact bonding layer side of a structure, the said structure is put on one surface of the said 2nd layer through the said 2nd contact bonding layer. Can be contacted indirectly. The method of bringing the structure of the laminate into contact with one surface of the second layer is not particularly limited, and a general method can be used. For example, various methods, such as a single wafer system and a roll-to-roll system, are mentioned.

2. Adhesive strength adjusting step The adhesive strength adjusting step in the present disclosure is a step of reducing the adhesive strength of the first adhesive layer by the adhesive strength adjusting process.

The adhesive strength adjusting process is performed to reduce the adhesive strength of the first adhesive layer in the laminate. The adhesive strength adjusting process can be selected according to the mode of the first adhesive layer described in the above-mentioned section “I. Laminate”. Hereinafter, the adhesive force adjustment process will be described for each aspect of the first adhesive layer.

(1) In the case of the first adhesive layer of the first aspect When the first adhesive layer is the first aspect, that is, a temperature-sensitive adhesive layer, in this step, a heat treatment or a cooling treatment is performed as an adhesive force adjustment treatment. Do.

If the first adhesive layer of this aspect is a heat-peelable type thermosensitive adhesive layer, the adhesive force of the first adhesive layer can be increased by performing a heat treatment for heating the first adhesive layer as an adhesive force adjusting treatment. Can be reduced. The heating temperature at this time can be set to a temperature equal to or higher than the switching temperature of the heat-peelable thermosensitive adhesive layer described above. Examples of the method for heating the heat-peelable thermosensitive adhesive layer include a method of heating in an oven, a method of heating on a hot plate, and a method of heating using a spot heater. The heating time can be appropriately set so that the adhesive strength of the first adhesive layer of the present embodiment after the heat treatment is within the range described in the above-mentioned section “I. Laminate”. Although the conditions of the said heat processing are not specifically limited, For example, it can be 10 minutes at 60 degreeC.

On the other hand, if the first adhesive layer of the present aspect is a cooling and peeling type temperature-sensitive adhesive layer, by performing a cooling process for cooling the first adhesive layer as the adhesive force adjusting process, Adhesive strength can be reduced. The cooling temperature at this time can be set to a temperature equal to or lower than the switching temperature of the above-described cooling release type thermosensitive adhesive layer. Examples of the cooling method of the cooling and peeling type thermosensitive adhesive layer include a method of cooling in a refrigerator and a method of cooling on a cooling plate. The cooling time can be appropriately set so that the adhesive strength of the first adhesive layer of the present embodiment after the cooling treatment is within the range described in the above-mentioned section “I. Laminate”. The conditions for the cooling treatment are not particularly limited, but may be, for example, 20 ° C. for 20 minutes.

(2) In the case of the first adhesive layer of the second aspect When the first adhesive layer is the second aspect, that is, the energy ray responsive adhesive layer, in this step, the energy ray irradiation treatment is performed as an adhesive force adjustment treatment. Do. In this step, the adhesive force of the first adhesive layer can be reduced by irradiating the first adhesive layer with energy rays as the energy ray irradiation treatment.

Since the energy ray has been described in the above-mentioned section “I. Laminate”, description thereof is omitted here. The light source of the energy beam is not particularly limited as long as it can emit light in a desired wavelength region. When ultraviolet rays are used as the energy ray, for example, a high pressure mercury lamp that emits light in a wavelength range of 150 nm to 450 nm, an ultrahigh pressure mercury lamp, a carbon arc lamp, a metal halide lamp, a xenon lamp, a chemical lamp, and the like can be given. Further, the integrated light amount of the energy beam can be appropriately set so that the first adhesive layer of the present embodiment after the energy beam irradiation is within the range described in the above-mentioned section “I. Laminate”.

The energy beam may be irradiated from the first layer side or the second layer side after the contact step. Among these, it is preferable to irradiate from the first layer side of the laminate. This is because energy beam irradiation treatment can be performed on the first layer regardless of whether the second layer is light transmissive or not.

(3) In the case of the first adhesive layer of the third aspect When the first adhesive layer is the third aspect, that is, the electrically responsive adhesive layer, in this step, an electric field application process or no electric field is used as the adhesive force adjustment process. Process.

If the first adhesive layer of this aspect is an electro-releasable adhesive layer, the adhesive force of the first adhesive layer is reduced by performing an electric field application process for applying an electric field to the first adhesive layer as an adhesive force adjusting process. be able to. The method for applying an electric field to the first adhesive layer is not particularly limited, and the method described in the above section “I. Laminate” can be used. For example, in the case of peeling by an electric field application process, the adhesive force adjustment process can be performed within a range of 10 to 120 seconds within an applied electric field range of 5 to 50 V.
The magnitude and application time of the applied voltage that defines the magnitude of the electric field can be appropriately set so that the adhesive force of the first adhesive layer after application of the electric field becomes a desired value. The upper limit of the applied voltage and the upper limit of the application time are not particularly defined from the viewpoint of peeling, but are preferably set in consideration of the influence on the electric field application device and other layers.

On the other hand, if the first adhesive layer of the present embodiment is an electroadhesive adhesive layer, the first adhesive layer is obtained by performing an electric field treatment for stopping the application of an electric field to the first adhesive layer as an adhesive force adjustment process. The adhesive strength of can be reduced.

3. Transfer Process The transfer process in the present disclosure is a process in which at least the first layer is peeled off and a pattern portion including at least the structure is transferred onto the second layer in a pattern.

In this step, since the adhesive force of the first adhesive layer is reduced by the adhesive force adjusting step, peeling occurs at a desired laminate interface including the first layer in the laminate. Thereby, the pattern part containing at least the structure can be collectively transferred onto the second layer in a pattern.

The method for peeling at least the first layer from the laminate is not particularly limited as long as it can be peeled off at a desired interface of the laminate, and may be manually peeled off or peeled off by a machine. May be. Specific examples of the peeling method include a method of peeling by adsorption, a method of attaching an adhesive film and peeling by the adhesive force of the adhesive film.

In this step, the peeling interface by the adhesive force adjustment process can be determined according to the specifications of the laminate, and the pattern portion having the layer configuration corresponding to the peeling position can be collectively transferred to the second layer in a pattern. Can do. That is, if the laminate is the first specification described in the above-mentioned section “I. Laminate F. Others 2. Relationship between Interlayer Adhesive Forces”, peeling occurs at the interface between the first adhesive layer and the structure. As a result, the first layer and the first adhesive layer can be peeled off. At this time, the pattern portion transferred onto the second layer has the second adhesive layer and the structure in this order from the second layer side.
On the other hand, if the laminated body is the second specification described in the above-mentioned section “I. Laminated body F. Others 2. Relationship between interlayer adhesive forces”, peeling is performed at the interface between the first layer and the first adhesive layer. And the first layer can be peeled off. At this time, the pattern portion transferred onto the second layer has the second adhesive layer, the structure, and the first adhesive layer in this order from the second layer side.

4). Lamination process The lamination process in this indication is a process of laminating | stacking one or more other layers on the surface of the side which has the said pattern part of the said 2nd layer.

Since the pattern portion including at least the structure is arranged in a pattern on one surface of the second layer by the transfer process, the other layer is laminated on the surface of the second layer on the side having the pattern portion. Is done. As said other layer, it can select suitably according to the kind of multilayer body with a recessed part to manufacture. For example, if a multilayer wiring board with a recess is manufactured using the method for manufacturing a multilayer body with a recess according to the present disclosure, a layer constituting the multilayer wiring board is generally used as the other layer. Specifically, a wiring board such as an insulating layer, a flexible wiring board, and a rigid wiring board can be used.

One or more of the other layers can be laminated on the surface of the second layer having the pattern part, and the number of laminated layers can be appropriately adjusted according to the target multilayer body with recesses. The method for laminating the other layers is not particularly limited, and the layers can be laminated using, for example, a coating method or a laminating method. The other layer can be formed so as to cover the surface of the second layer and the surface opposite to the second layer side of the pattern portion. In the case of manufacturing a multilayer wiring board with a recess, as a method for laminating the other layers, a method capable of taking electrical conduction can be used. For example, a general method such as laminating via a conductive bump is used. Further, it can be the same as the laminating method when the wiring board is multilayered. In addition, the layers can be laminated through a cover lay, a prepreg, an interlayer adhesive layer, an insulating layer, or the like. In the second layer, one or more other layers may be laminated on the surface opposite to the surface having the pattern portion.

5). Partitioning step The partitioning step in the present disclosure includes a first region including the pattern portion and the one or more other layers, the first region including the pattern portion and the other layer at a position overlapping the pattern portion in plan view, and It is a process of dividing into 2nd area | regions other than. The pattern portion and the one or more other layers disposed on the surface of the second layer having the pattern portion are partitioned into the first region and the second region in plan view. In addition, the respective regions are separated and exist independently on the second layer.

(1) Partitioning method The method of partitioning the pattern portion on the second layer and the one or more other layers may be any method that can partition the first region on the second layer, It may be a mechanical method or a chemical method.

As the mechanical method, for example, along the outer periphery of the pattern portion in plan view, the pattern portion on the second layer and the one or more other layers are cut in the stacking direction (thickness direction), The half cut which divides the said 1st area | region is mentioned. Specifically, it can be half-cut using a method in which an upper die attached with a cutter blade is moved up and down, a method of cutting with a cylinder type rotary cutter, a method of performing heat treatment with a laser processing means, or the like. .

As the chemical method, for example, the pattern portion on the second layer and the one or more other layers are etched in the stacking direction (thickness direction) along the outer periphery of the pattern portion in plan view. One example is half-etching that partitions the first region. Specifically, the outer peripheral shape of the pattern portion is formed on the surface of the laminate composed of the pattern portion and the one or more other layers disposed on the surface of the second layer having the pattern portion. A resist pattern corresponding to the above can be formed and half-etched by a wet etching method or a dry etching method. After the etching, the resist pattern is removed.

It is preferable to use a mechanical method as the partitioning method. This is because the first region and the second region can be partitioned with high positional accuracy.

The pattern portion on the second layer and the one or more other layers are cut in the thickness (lamination) direction and partitioned into a first region and a second region. A cutting line that divides and separates the stacked body into a first region and a second region is referred to as a lane marking.

In the partitioning step, the partition line that partitions the first region and the second region may be formed on the outer periphery in plan view of the pattern portion, as shown in FIG. As shown in FIG. 10 (b), it may be formed outside the outer periphery of the pattern portion in plan view, and as shown in FIG. 10 (c), from the outer periphery of the pattern portion in plan view. May also be formed inside. Further, the width of the partition line is not particularly limited. For example, as shown in FIG. 10D, it may be formed with a width including the inside and outside of the outer periphery of the pattern portion in plan view.
FIGS. 10A to 10D are explanatory views for explaining the positions of the lane markings, the left figure is a schematic plan view, and the right figure is a sectional view taken along the line XX of the left figure. In FIG. 10, a line L indicates a partition line.

The lane markings may be continuous in plan view or may be intermittent depending on the zoning method. Further, the partition line may be linear or non-linear in plan view.

The partition line preferably penetrates the pattern layer and the other layer at a position overlapping the pattern portion in plan view on the surface of the second layer having the pattern portion. This is because the first region can be easily peeled and removed in a recess forming step described later, and a part of the first region can hardly be left on the surface of the second layer. The partition line may be formed in a part of the second layer.

The first region includes the pattern portion and the other layer at a position overlapping the pattern portion in plan view on the surface of the second layer having the pattern portion. The planar view shape of the first region can be the same as the planar view shape of the pattern portion. The size of the first region in plan view may be larger, smaller, or the same as the size of the pattern portion in plan view depending on the position of the partition line.

6). Recess formation step The recess formation step in the present disclosure is a step of peeling and removing the first region to form the recess.

The first region can be peeled from the structure. Specifically, peeling occurs at the contact interface between the structure and the second layer. The method of peeling the first region is not particularly limited, and examples thereof include a method of peeling by adsorption, a method of attaching an adhesive film and peeling by the adhesive force of the adhesive film, and the like.

When the first region is peeled and removed, a concave portion having an opening is formed on one surface of the multilayer body. The recess is formed in a pattern in a plan view on one surface of the multilayer body. The size of the recess in plan view corresponds to the size of the first region in plan view.

7). Others The manufacturing method of the multilayer body with a recess according to the present disclosure can include an optional step in addition to the above-described steps. For example, when manufacturing the multilayer wiring board with a recessed part using the manufacturing method of the multilayer body with a recessed part of this indication, processes, such as a surface treatment process, an etching process, and a plating process, can be included.

In the method for manufacturing a multilayer body with recesses of the present disclosure, the transfer process using the laminate described in the section “I. Laminate” may be further performed in the lamination process. This is because an arbitrary structure can be transferred and disposed between the stacked layers of the other layers.
Moreover, even if the manufacturing method of the multilayer body with a recessed part of this indication performs a contact process, an adhesive force adjustment process, a transfer process, a lamination process, a division process, and a recessed part formation process with respect to both surfaces of a 2nd layer, respectively. good. This is because a multilayer body having recesses on both sides of the second layer can be manufactured.

8). Multilayer body with recesses The multilayer body with recesses obtained by the method for producing a multilayer body with recesses according to the present disclosure can be used, for example, as a multilayer wiring board with recesses, depending on the types of the second layer and the other layers. According to the method for manufacturing a multilayer body with recesses of the present disclosure, a recess can be formed easily and with high positional accuracy in the manufacturing process of the multilayer wiring board. Therefore, there is provided a component-mounted multilayer wiring board in which components are mounted in the recess. can get.

III. Others The present disclosure includes the following technical matters.
(1) A laminate having at least a first layer, a first adhesive layer, and a pattern-like structure in this order, wherein the first adhesive layer undergoes an adhesive force adjustment process to change the adhesive force.
(2) The laminate according to (1), wherein the first adhesive layer is a temperature-sensitive adhesive layer that is subjected to a heat treatment or a cooling treatment as the adhesive force adjustment treatment and has a reduced adhesive force.
(3) The laminate according to (1), wherein the first adhesive layer is an energy ray-responsive adhesive layer that is subjected to an energy ray irradiation treatment as the adhesive force adjustment treatment and has a reduced adhesive force.
(4) The laminate according to (1), wherein the first adhesive layer is an electrically responsive adhesive layer that undergoes an electric field application process or a no-electric field process as the adhesive force adjustment process and has a reduced adhesive force.
(5) The laminate according to any one of (1) to (4), wherein the structure has adhesiveness.
(6) The laminated body according to (1) to (4), which has a second adhesive layer having a composition different from that of the first adhesive layer on a side opposite to the first adhesive layer side of the structure. .
(7) The laminate according to any one of (1) to (6), wherein the first adhesive layer has the same pattern as the structure.
(8) Adhesion between the first adhesive layer and the structure before the adhesive force adjustment processing when the second layer is brought into contact with the surface opposite to the structure side of the second adhesive layer The force is greater than or equal to the adhesive force between the second adhesive layer and the second layer, and the adhesive force between the first adhesive layer and the structure after the adhesive force adjustment processing is the second The laminated body according to (6) or (7), which is lower than the adhesive force between the adhesive layer and the second layer.
(9) When the surface opposite to the structure side of the second adhesive layer is brought into contact with the second layer, the first adhesive layer between the first adhesive layer and the first layer before the adhesive force adjustment processing The adhesive force is equal to or greater than the adhesive force between the second adhesive layer and the second layer, and the adhesive force between the first adhesive layer and the first layer after the adhesive force adjustment processing is The laminate according to (7), which is lower than the adhesive force between the second adhesive layer and the second layer.

(10) A method for producing a multilayer body with a recess, comprising a recess having an opening on one surface of the multilayer body, using the laminate according to any one of (6), (8) and (9), A contact step of bringing the structure of the laminate into contact with one surface of the second layer directly or indirectly through the second adhesive layer, and adhesion of the first adhesive layer by the adhesive force adjustment process An adhesive force adjusting step for reducing force, a transfer step for peeling at least the first layer and transferring a pattern portion including at least the structure to the second layer in a pattern, and the pattern of the second layer A laminating step of laminating one or more other layers on the surface having the portion, and the pattern portion and the one or more other layers are in a position overlapping the pattern portion and the pattern portion in plan view A first region containing other layers, and other A partition step of partitioning into a second region, said first region is separated and removed, and a recess forming step of forming the concave portion, the manufacturing method of the recessed multilayer body.
(11) The method for producing a multilayer body with recesses according to (10), wherein the multilayer body with recesses is a multilayer wiring board with recesses.
(12) A method for transferring a structure using the laminate according to (6) or (7), wherein the structure is transferred to a second layer, opposite to the structure side of the second adhesive layer When the side surface and the second layer are brought into contact with each other, the adhesive force between the first adhesive layer and the structure before the adhesive force adjustment processing is such that the second adhesive layer and the second layer are The adhesive force between the first adhesive layer and the structure after the adhesive force adjustment process is greater than the adhesive force between the second adhesive layer and the second layer. The structure transfer method is also low.
(13) A method for transferring a structure using the laminate according to (6), wherein the structure is transferred to a second layer, wherein the first adhesive layer has the same pattern as the structure. When the second layer is brought into contact with the surface of the second adhesive layer opposite to the structure side, the adhesion between the first adhesive layer and the first layer before the adhesive force adjustment processing The force is equal to or greater than the adhesive force between the second adhesive layer and the second layer, and the adhesive force between the first adhesive layer and the first layer after the adhesive force adjustment processing is the first 2. A method for transferring a structure, which is lower than the adhesive force between the adhesive layer and the second layer.

Hereinafter, the present disclosure will be described in more detail with reference to Examples and Comparative Examples.

[Example 1]
1. Preparation of Laminate A laminate was prepared by the following method.

(1) Preparation of adhesive strength variable adhesive composition Acrylic pressure-sensitive adhesive (E-306, manufactured by Etec Co., Ltd.) 100 containing an acrylic polymer (average molecular weight 650,000) and an energy beam polymerization compound (average molecular weight 650,000) 60 parts by mass of urethane acrylate (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., trade name: UV-7600B) as an energy beam polymerizable compound, and 2,4-diethylthioxanthone (Nipponization) as a thioxanthone polymerization initiator with respect to parts by mass Yakuhin Co., Ltd., trade name: KAYACURE DETX-S) 0.2 parts by mass, isocyanate-based cross-linking agent (cross-linking agent, manufactured by Nippon Polyurethane Industry Co., Ltd., trade name: Coronate L, solid content: 75%) 1.6 Add each part by mass and dilute to 25% with a mixed solvent of toluene and methyl ethyl ketone. The composition was prepared.

(2) Production of Adhesive Sheet A Using PET film (trade name: E5100, manufactured by Toyobo Co., Ltd., thickness 50 μm) as the first layer, using an applicator, the coating thickness after heating and drying the adhesive strength variable adhesive composition Was applied to the first layer so as to be 10 μm and dried to form a first adhesive layer. Next, after laminating a silicone release treatment surface of a light release PET separator (trade name: E7006, thickness 38 μm, manufactured by Toyobo Co., Ltd.) having a silicone release treatment surface on the exposed surface of the first adhesive layer, The adhesive sheet A was obtained by carrying out curing for a day.

(3) Preparation of structure sheet A A polyimide film, an acrylic adhesive layer, and a heat-resistant masking tape (product name: 7414 made by 3M) having a release layer in this order are used, and the polyimide film and the acrylic adhesive layer are halved in the thickness direction. After cutting and partitioning the polyimide film and the acrylic adhesive layer into a pattern, unnecessary portions were removed. Thereby, the structure body A in which the pattern-like structure which has a polyimide film and an acrylic adhesion layer was arrange | positioned on the peeling layer was obtained.

(4) Production of Laminate A The lightly peeled PET separator of the adhesive sheet A is peeled off and bonded so that the exposed surface of the first adhesive layer and the polyimide film of the structure sheet A are in contact with each other. A laminate A having 1 adhesive layer, a patterned structure (in the order of the polyimide film and acrylic adhesive layer from the first adhesive layer side), and a release layer of the structure sheet A was obtained in this order.

2. Transfer of structure Using rolled copper foil (product name: RCF-T5B-35, manufactured by Fukuda Metals) as the second layer, the lightly peeled PET separator of laminate A was peeled off, and the exposed acrylic adhesive layer and the second layer And UV irradiation was performed at 500 mJ / cm ² (i-line) from the first layer side of the laminate A. By UV irradiation, the adhesive sheet A having the first adhesive layer and the first layer can be peeled off from the interface between the first adhesive layer and the polyimide film, and the second structure of the patterned structure having the polyimide film and the acrylic adhesive layer is removed. Could be transferred onto the layer.

[Example 2]
1. Preparation of Laminate A laminate was prepared by the following method.

(1) Preparation of Adhesive Composition for Second Adhesive Layer Acrylic copolymer (trade name: SK Dyne 1811L, manufactured by Soken Chemical Co., Ltd.) is 100 parts by mass, and an isocyanate curing agent (trade name: L-45, manufactured by Soken Chemical Co., Ltd., solid). The second adhesive layer adhesive composition was prepared by blending 3 parts by weight of 45 wt%).

(2) Production of Adhesive Sheet B On the silicone release treatment surface of a heavy release PET separator having a silicone release treatment surface (trade name: E7304, thickness 38 μm, manufactured by Toyobo Co., Ltd.), the thickness after drying is 10 μm. The second adhesive layer was formed by applying the adhesive composition for the second adhesive layer using an applicator and then drying. Next, after laminating a silicone release treatment surface of a light release PET separator (trade name: E7006, thickness 38 μm, manufactured by Toyobo Co., Ltd.) having a silicone release treatment surface on the exposed surface of the second adhesive layer, at 40 ° C. Curing for 3 days was carried out to obtain an adhesive sheet B having a second adhesive layer.

(3) Production of structure sheet B The lightly peelable PET separator of the adhesive sheet B is peeled off and bonded to a polyimide film (trade name: Kapton 200h manufactured by Toray DuPont), and the polyimide film and the second adhesive layer are in the thickness direction. After the half cut into a pattern, unnecessary portions were removed. Thereby, the structure sheet | seat B by which the pattern-like structure which has a polyimide film and a 2nd contact bonding layer was arrange | positioned on a heavy peeling type PET separator was obtained.

(4) Production of Laminate B The lightly peeled PET separator of the adhesive sheet A produced in Example 1 was peeled off and pasted so that the exposed surface of the first adhesive layer and the polyimide film of the structure sheet B were in contact with each other. The laminated body B was combined.

2. Transfer of structure Using the same rolled copper foil as in Example 1 as the second layer, peeling off the heavy release PET separator of laminate B, bringing the exposed second adhesive layer and second layer into contact, and laminating UV irradiation was performed at 500 mJ / cm ² (i-line) from the first layer side of the body B. By the UV irradiation, the adhesive sheet A having the first adhesive layer and the first layer can be peeled off from the interface between the first adhesive layer and the polyimide film, and the pattern-like structure having the polyimide film and the second adhesive layer is secondly removed. Could be transferred onto the layer.

[Example 3]
1. Preparation of Laminate A laminate was prepared by the following method.

(1) Preparation of adhesive sheet C Adhesive variable type prepared in Example 1 using a heavy release PET separator (trade name: 7304, thickness: 50 μm, manufactured by Toyobo Co., Ltd.) having a silicone release treatment surface and using an applicator The adhesive composition was applied to the silicone release treatment surface of the first layer so that the coating thickness after heating and drying was 10 μm, and dried to form a first adhesive layer. Next, after laminating a silicone release treatment surface of a light release PET separator (trade name: E7006, thickness 38 μm, manufactured by Toyobo Co., Ltd.) having a silicone release treatment surface on the exposed surface of the first adhesive layer, at 40 ° C. Curing for 3 days was carried out to obtain an adhesive sheet C.

(2) Production of Laminate C The lightly peelable PET separator of the adhesive sheet C was peeled off and bonded to one surface of the exposed first adhesive layer and a polyimide film (trade name: Kapton 200h manufactured by Toray DuPont) Furthermore, the peelable PET separator of the adhesive sheet B produced in Example 2 was peeled off, and the exposed second adhesive layer and the other surface of the polyimide film were bonded together. Next, the adhesive sheet B, the polyimide film, and the first adhesive layer were half-cut into a pattern in the thickness direction, and then unnecessary portions were removed. Thereby, the pattern-like structure which has the light peeling type PET separator of the adhesive sheet B, the 2nd adhesive layer, the polyimide film, and the 1st adhesive layer in this order was arrange | positioned on the heavy peeling type PET separator of the adhesive sheet A. A structure sheet C was obtained. Thereafter, the lightly peelable PET separator on the first adhesive layer side was peeled off, and an OPP base material was disposed as the first layer on the exposed first adhesive layer to obtain a laminate C.

2. Transfer of structure Using the same rolled copper foil as in Example 1 as the second layer, peeling the lightly peelable PET separator of laminate C, bringing the exposed second adhesive layer and second layer into contact, and laminating UV irradiation was performed at 500 mJ / cm ² (i-line) from the first layer side of the body C. By UV irradiation, the first layer can be peeled off from the interface between the first layer and the first adhesive layer, and the patterned structure having the first adhesive layer, the polyimide film and the second adhesive layer is transferred onto the second layer. We were able to.

DESCRIPTION OF SYMBOLS 1 ... 1st layer 2 ... 1st contact bonding layer 3 ... Structure 4 ... 2nd contact bonding layer 10 ... Laminated body 11 ...

2nd layer

12, 12A, 12B, 12C ... Other layer 20 ... Pattern part 30 ... Multilayer with a recessed part Body P ... Recess

Claims

Having at least a first layer, a first adhesive layer, and a patterned structure in this order;
The laminate in which the first adhesive layer undergoes an adhesive force adjustment process and the adhesive force changes.
The laminate according to claim 1, wherein the first adhesive layer is a temperature-sensitive adhesive layer that undergoes a heat treatment or a cooling treatment as the adhesive force adjustment treatment, and the adhesive strength is reduced.
The laminate according to claim 1, wherein the first adhesive layer is an energy ray-responsive adhesive layer that is subjected to an energy ray irradiation treatment as the adhesive force adjustment treatment and has a reduced adhesive force.
The laminate according to claim 1, wherein the first adhesive layer is an electrically responsive adhesive layer whose adhesive force is reduced by being subjected to an electric field application treatment or no electric field treatment as the adhesive force adjustment treatment.
The laminate according to any one of claims 1 to 4, wherein the structure has adhesiveness.
5. The device according to claim 1, wherein a second adhesive layer having a composition different from that of the first adhesive layer is provided on a side opposite to the first adhesive layer side of the structure. Laminated body.
The laminate according to any one of claims 1 to 4, wherein the first adhesive layer has the same pattern as the structure.
When the surface opposite to the structure side of the second adhesive layer is brought into contact with the second layer,
The adhesive force between the first adhesive layer and the structure before the adhesive force adjustment treatment is equal to or greater than the adhesive force between the second adhesive layer and the second layer;
The adhesive force between the first adhesive layer and the structure after the adhesive force adjustment processing is lower than the adhesive force between the second adhesive layer and the second layer. Laminated body.
When the surface opposite to the structure side of the second adhesive layer is brought into contact with the second layer,
The adhesive force between the first adhesive layer and the first layer before the adhesive force adjustment treatment is equal to or greater than the adhesive force between the second adhesive layer and the second layer;
The adhesive force between the first adhesive layer and the first layer after the adhesive force adjustment process is lower than the adhesive force between the second adhesive layer and the second layer. Laminated body.
A method for producing a multilayer body with a recess comprising a recess having an opening on one surface of the multilayer body using the laminate according to claim 6,
A contact step of bringing the structure of the laminate into contact with one surface of the second layer directly or indirectly through the second adhesive layer;
An adhesive force adjusting step for reducing the adhesive force of the first adhesive layer by the adhesive force adjusting process;
A transfer step of peeling at least the first layer and transferring a pattern portion including at least the structure to the second layer in a pattern;
A laminating step of laminating one or more other layers on the surface of the second layer having the pattern portion;
The pattern portion and the one or more other layers are partitioned into a first region including the pattern portion and the other layer at a position overlapping the pattern portion in plan view, and a second region other than the first region. Partitioning process,
A method of manufacturing a multilayer body with a recess, comprising: a recess forming step of peeling and removing the first region to form the recess.
The method for producing a multilayer body with recesses according to claim 10, wherein the multilayer body with recesses is a multilayer wiring board with recesses.
A method of transferring a structure using the laminate according to claim 6, wherein the structure is transferred to a second layer.
When the surface of the second adhesive layer opposite to the structure side is brought into contact with the second layer,
The adhesive force between the first adhesive layer and the structure before the adhesive force adjustment treatment is equal to or greater than the adhesive force between the second adhesive layer and the second layer;
The structure transfer method, wherein an adhesive force between the first adhesive layer and the structure after the adhesive force adjustment process is lower than an adhesive force between the second adhesive layer and the second layer.
A method of transferring a structure using the laminate according to claim 6, wherein the structure is transferred to a second layer.
The first adhesive layer has the same pattern as the structure,
When the surface of the second adhesive layer opposite to the structure side is brought into contact with the second layer,
The adhesive force between the first adhesive layer and the first layer before the adhesive force adjustment treatment is equal to or greater than the adhesive force between the second adhesive layer and the second layer;
A structure transfer method, wherein an adhesive force between the first adhesive layer and the first layer after the adhesive force adjustment treatment is lower than an adhesive force between the second adhesive layer and the second layer. .