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WO2018196035A1 - 阵列式按键、裁切模具、包装结构及按键生产方法 - Google Patents

阵列式按键、裁切模具、包装结构及按键生产方法 Download PDF

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Publication number
WO2018196035A1
WO2018196035A1 PCT/CN2017/083541 CN2017083541W WO2018196035A1 WO 2018196035 A1 WO2018196035 A1 WO 2018196035A1 CN 2017083541 W CN2017083541 W CN 2017083541W WO 2018196035 A1 WO2018196035 A1 WO 2018196035A1
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WO
WIPO (PCT)
Prior art keywords
button
array
button body
carrier
positioning
Prior art date
Application number
PCT/CN2017/083541
Other languages
English (en)
French (fr)
Inventor
蔡苗
杨道国
王思宇
郑建娜
梁永湖
杨笛
Original Assignee
桂林电子科技大学
桂林旭研机电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 桂林电子科技大学, 桂林旭研机电科技有限公司 filed Critical 桂林电子科技大学
Publication of WO2018196035A1 publication Critical patent/WO2018196035A1/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/06Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • B26F1/44Cutters therefor; Dies therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04Attaching a series of articles, e.g. small electrical components, to a continuous web

Definitions

  • the invention relates to the field of button technologies, and in particular to an array button, a cutting die, a packaging structure and a button production method.
  • the braiding method of the elastic button needs to first remove the welded protective sleeve of the molded type elastic button component, and die-cut into a single patch type elastic button component, and then put the patch type.
  • the elastic button component is placed in the vibrating plate, and the key component is accurately placed on the card position by vibration, thereby determining and correcting the button direction, and then entering the quality detecting and packaging steps.
  • a single patch-type elastic button component needs to undergo the processes of punching, bulk material accumulation, vibration feeding, etc., which not only easily affects the coplanarity of the button soldering foot, but also easily causes contamination of the soldering foot surface, thereby directly affecting the patch.
  • the solderability of the elastic button element because the shape of the patch type silicone elastic button is different from the general electronic components, and because of its inherent elastic characteristics, the silicone elastic button is punched and cut using the vibrating plate.
  • the button When the tape is packaged, the button is accurately shaken to the transfer card. The feeding speed is slow.
  • further determination and correction of the direction are required before entering the final quality inspection and packaging steps. It can be seen that the tape packaging method of the existing electronic components is used in the tape packaging of the patch type elastic button components, and the process is complicated, which not only easily affects the welding quality of the patch button components, but also seriously restricts the production rate of the tape packaging. .
  • the present invention aims to solve at least one of the technical problems existing in the prior art or related art.
  • a first object of the present invention is to provide an array type button.
  • a second object of the invention is to propose a cutting die.
  • a third object of the invention is to propose a packaging structure.
  • a fourth object of the present invention is to provide a method of producing a key.
  • the present invention provides an array type button, comprising: a plurality of button bodies and brackets, wherein the plurality of button bodies are arranged in an array, connected by a connecting portion; the bracket passes through the connecting portion.
  • the button body is connected to support the button body; the bracket is provided with a positioning hole for positioning the array button during the processing.
  • the array type button provided by the invention supports a plurality of button bodies through a bracket, and a positioning hole for positioning the array button during the processing is arranged on the bracket, so that the button obtained by cutting the array type button is obtained.
  • the predetermined order and position arrangement the need to re-vibrate the materializing process steps is eliminated, and the order and position of the keys are ensured, and the damage and pollution caused by the vibration material are avoided, thereby ensuring the use of the keys.
  • Reliability; and in the process of shaking the material the button is accurately shaken to the transfer card, the feeding speed is slow, and the process step of the vibration material is subtracted, thereby effectively improving the production efficiency and ensuring the button The speed of mass production.
  • array type button in the above technical solution provided by the present invention may further have the following additional technical features:
  • the button body comprises: a base, an elastic soft body and a button bump, wherein the base is connected with the connecting portion; the elastic soft body is connected with the base and is located above the base; the button bump is connected with the elastic soft body, and is located in the elastic Above the software.
  • the button body as a base, an elastic soft body and a button bump, the normal operation of the button body is ensured, and the structure is convenient for production, and the production efficiency can be effectively improved.
  • the button body further comprises: a soldering leg, the soldering leg is connected to the base, and is located below and/or laterally of the base; wherein the soldering legs are arranged in the same direction in the same column.
  • the solder body is placed under the base, and the button body of the same column is
  • the orientation of the soldering pins is set to be the same, ensuring that the keys and the related electrical components can be effectively connected, and also ensuring that the array of the keys can be directly packaged after cutting, and no vibration separation is required.
  • the solder fillet is covered with a protective cover to protect the solder fillet; wherein the protective sleeve is a separate protective sleeve or a protective sleeve integrally formed with the button body.
  • the welding leg is effectively protected, the contamination of the welding leg is avoided, the coplanarity of the welding leg is ensured, and the welding of the button body is improved.
  • the independent protective cover is easy to install and remove, and the protective sleeve integrally formed with the button body is firmly installed, which can effectively prevent the protective cover from falling off automatically during the production process and the soldering foot loses protection.
  • the present invention provides a cutting die for cutting an array type button according to any one of the above aspects, wherein the cutting die comprises: a lower die, a carrier plate and an upper die;
  • the lower die is provided with a first via hole;
  • the carrier plate is located above the lower die, the carrier plate is provided with a card slot and a second via hole;
  • the second via hole is located at the bottom of the card slot, and the other end is connected with the first via hole
  • the upper mold is located above the carrier plate, and the upper mold is provided with a punching slit, and the punching slit is matched with the carrier plate for cutting the material.
  • the cutting die According to the cutting die provided by the present invention, after the array type button is cut by the upper mold, it is directly dropped into the card slot of the carrier board, and the button body is arranged in exactly the same manner as before the cutting, in the array type button At the same time of cutting, the material of the button body is completed, the process steps of the vibration material are reduced, and the production efficiency is effectively improved; by setting the first via hole in the lower mold, the second via hole is arranged at the bottom of the card slot, and The first via hole is connected to the second via hole.
  • air may be discharged from the button body and the card slot by the first via hole and the second via hole to prevent air accumulation.
  • the effect of the button is smoothly dropped into the bottom of the card slot, ensuring the accuracy of the position of the button body after falling into the bottom of the card slot.
  • the cutting die in the above technical solution provided by the present invention may further have the following additional technical features:
  • the cutting die further includes: a suction nozzle, wherein the suction nozzle is in communication with the first through hole.
  • the suction nozzle in the process of setting the suction nozzle, can generate a suction force on the button body through the first through hole and the second through hole in the process of the button body falling into the bottom of the card slot, so that the button body Accurately fall into the card slot, and speed up the falling of the button body, and ensure the accuracy of the direction of the button body, while improving production efficiency.
  • the card slot is a groove disposed on the surface of the carrier plate and recessed downwardly, and the card slots are arranged in an array on the carrier board; wherein the card slot is matched with the button body.
  • the carrier plate is provided with a positioning pin for positioning the array button placed on the carrier.
  • the positioning pin by arranging the positioning pin on the carrier board, the positioning pin cooperates with the positioning hole of the array type button, thereby realizing the positioning of the button body, and ensuring the accuracy of the position of the button body.
  • the present invention provides a package structure for packaging a button body obtained by cutting the array type button according to any one of the above aspects, and the package structure comprises: a braided strip and a spacer. And a braided film; a plurality of spacers are arranged in parallel or in an array above the braid, and the plurality of barriers and braids enclose a cavity that is open at least in a row; the cavity is adapted to the button body, and the cavity is used for The button body is placed; the braid film is located above the barrier to cover the cavity.
  • the packaging structure provided by the invention ensures the stability of the packaging by providing the braiding, the spacer and the braiding film, and effectively protects the button body during transportation and the like, thereby avoiding the damage caused by the button body. damage.
  • the thickness of the barrier gradually increases from top to bottom.
  • the space between the braid and the barrier is larger than the area of the bottom wall, thereby ensuring that the button body can smoothly enter.
  • the space between the braid and the spacer ensures the firmness of the packaging structure.
  • a method for producing a button includes: placing an array type button according to any one of the above aspects into an automatic feeding device; and feeding the array button to the above
  • the cutting die according to the technical solution is positioned by the positioning hole of the array button; the array button is cut to obtain the button body, and the button body falls into the card slot of the carrier plate.
  • the button production method provided by the invention cuts the array button by the cutting die, and the array After being pressed by the upper die, the button is directly dropped into the card slot of the carrier. At this time, the button body is arranged in exactly the same manner as before the cutting, and the button body is cut while the button body is completed. The material is divided, the process steps of the vibration material are reduced, and the production efficiency is effectively improved.
  • buttons production method in the above technical solution provided by the present invention may further have the following additional technical features:
  • the button production method further includes: loading at least one button body or the button body The board is sent to the detecting station; wherein the detecting station is at least one; detecting the button body and determining whether the button body is qualified; when the judgment result is “No”, the button body is removed; when the judgment result is “Yes”
  • the button body is packaged by the package structure according to any of the above aspects.
  • the at least one button body or the carrier plate is sent to the detecting station, and the detecting body detects the button body, the non-conforming product is removed, and the qualified product is packaged to ensure the qualified rate of the product;
  • the button body is directly sent to the detecting station, multiple button bodies of the same row can be simultaneously fed into the detecting station to ensure that the welding pins are arranged in the same direction;
  • the detecting station can be multiple, and multiple detecting workers
  • the position of the button body obtained after cutting can be detected at the same time, the production button can be prevented from staying at the detecting station, and the production efficiency of the button can be effectively improved; when the button body is packaged, it can be behind each detecting station.
  • Each of them is provided with a packaging station, and a packaging station can be set after multiple inspection stations, which can effectively reduce the production cost of the product and improve the market competitiveness of the product while ensuring production efficiency.
  • the button production method further comprises: winding the packaged button body to form a disk-shaped product.
  • the disk-shaped product is formed by coiling the packaged button body, and the disk-shaped product is convenient for storage and transportation while ensuring the firmness of the package, and the subsequent use of the button.
  • the array button is preferably sent to the cutting die according to any one of the above technical solutions, and is positioned by the positioning hole of the array button.
  • the positioning holes of the array type button cooperate with the positioning pins of the carrier board to The positioning of the array of buttons is now performed; the carrier is fed into a cutting die as described in any of the above aspects.
  • the positioning pin on the carrier board cooperates with the positioning hole of the array button, thereby realizing the positioning of the button body, and ensuring the accuracy of the position of the button body.
  • the carrier is fed into the cutting die according to any one of the above aspects, wherein the carrier is fed through the central feeding system into any one of the above technical solutions. Cut the mold.
  • the carrier plate is fed into the cutting die through the central feeding system, and the feeding automation is realized in the production process, the production efficiency is effectively improved, the manual operation of the worker is reduced, and the worker operation safety is improved. At the same time, it reduces the labor intensity of workers.
  • the at least one button body or the carrier plate with the button body is sent to the detecting station, specifically: the carrier plate with the button body is mounted by at least one conveyor belt and/or at least one robot Send to the inspection station.
  • the carrier plate equipped with the button body is fed into the inspection station by at least one conveyor belt and/or at least one robot, thereby realizing automation of product inspection, effectively improving production efficiency, and reducing manual for workers.
  • the operation reduces the labor intensity of the workers while improving the safety of the workers.
  • the detecting button body is specifically configured to: detect a common face of the button body, a dimensional tolerance of the button body, and a structural defect of the button body.
  • the product quality is effectively ensured, and the product length competitiveness is improved.
  • the array type button according to any one of the above aspects is put into the automatic feeding device and the array type button is fed into the cutting die according to any one of the above technical solutions. And positioning between the positioning holes of the array button, the button production method further includes: removing the protective cover of the array button.
  • the protective cover of the array button by removing the protective cover of the array button, the subsequent use of the button body obtained after the array button is cut is ensured, so that the packaged button body can be directly welded when used again, which simplifies the process.
  • the process steps required to connect the button body to other electrical components enhance the utility of the button body.
  • Figure 1 shows a schematic diagram of an array of keys in accordance with one embodiment of the present invention
  • FIG. 2 illustrates a bottom view of an array of keys with a protective cover coated with a protective cover in accordance with one embodiment of the present invention
  • Figure 3 illustrates a bottom view of an array of buttons for a solder fillet removal boot in accordance with one embodiment of the present invention
  • Figure 4 shows a schematic view of a cutting die in accordance with one embodiment of the present invention
  • Figure 5 shows a schematic view of a carrier plate in accordance with one embodiment of the present invention
  • Figure 6 shows a schematic view of a package structure in accordance with one embodiment of the present invention.
  • Figure 7 is a flow chart showing a method of producing a key according to an embodiment of the present invention.
  • FIG. 8 is a flow chart showing a method of producing a key according to another embodiment of the present invention.
  • FIGS. 1 through 8 an array type button, a cutting die, a package structure, and a button production method according to some embodiments of the present invention will be described with reference to FIGS. 1 through 8.
  • the present invention provides an array type button, comprising: a plurality of button bodies 102 and a bracket 104, wherein the plurality of button bodies 102 are arranged in an array, through the connecting portion.
  • the bracket 104 is connected to the button body 102 through the connecting portion 106 for supporting the button body 102; the bracket 104 is provided with a positioning hole 108 for positioning the array button during the processing.
  • a plurality of button bodies 102 are supported by the brackets 104, and positioning holes 108 for positioning the array buttons during processing are provided on the brackets 104, so that the arrayed buttons are obtained after cutting.
  • the buttons are arranged in a predetermined order and position, and the process steps of re-shaping the material are eliminated.
  • the order and position of the buttons are ensured, the damage and pollution caused by the vibration of the buttons are avoided, and the use of the buttons is ensured.
  • Reliability in the process; and in the process of shaking the material the button is accurately shaken to the transfer card, and the feeding speed is slow. Since the process step of the vibration material is subtracted, the production efficiency is effectively improved, and the button is ensured. The speed of mass production.
  • the button body 102 includes a base 1026, an elastic soft body 1024, and a button bump 1022.
  • the base 1026 is connected to the connecting portion 106.
  • the elastic soft body 1024 and The base 1026 is connected to be located above the base 1026; the button bump 1022 is connected to the elastic soft body 1024 and is located above the elastic soft body 1024.
  • the button body 102 as the base 1026, the elastic soft body 1024, and the button bumps 1022, the normal operation of the button body 102 is ensured, and the structure is convenient for production, and the production efficiency can be effectively improved.
  • the button body 102 further includes a solder fillet 1028, and the solder fillet 1028 is connected to the base 1026, and is located below and/or laterally of the base 1026; Among them, the welding legs 1028 in the same column are arranged in the same direction.
  • the solder fillet 1028 is covered with a protective sleeve 110 to protect the solder fillet 1028; wherein the protective sleeve 110 is a separate protective sleeve, or a protective cover integrally formed with the button body 102.
  • the protective sleeve 110 on the solder fillet 1028, the solder fillet 1028 is effectively protected from contamination of the solder fillet 1028, and the coplanarity of the solder fillet 1028 is ensured.
  • the independent protective cover is easy to install and remove, and the protective sleeve integrally formed with the button body 102 is firmly installed, which can effectively prevent the protective cover from falling off automatically during the production process and the soldering foot 1028 loses protection.
  • the present invention provides a cutting die for cutting an array type button according to any one of the above aspects, wherein the cutting die comprises The lower mold 206, the carrier 204 and the upper mold 202; the lower mold 206 is provided with a first via 210; the carrier 204 is located above the lower mold 206, the carrier 204 is provided with a card slot 214 and a second via 208; The second via 208 is located at the bottom of the card slot 214, and the other end is in communication with the first via 210.
  • the upper die 202 is located above the carrier 204, and the upper die 202 is provided with a punching slit. The punching slit is matched with the carrier 204. Used to cut materials.
  • the button body 102 is arranged in exactly the same manner as before the cutting, in the array.
  • the dividing of the button body 102 is completed, the process steps of the vibration splitting are reduced, and the production efficiency is effectively improved; by setting the first via hole 210 in the lower mold 206, the bottom of the card slot 214 is set.
  • the second via hole 208 is connected to the second via hole 208.
  • the cutting die further includes a suction nozzle 212 that communicates with the first through hole 210.
  • the suction nozzle 212 can generate a suction force to the button body 102 through the first through hole 210 and the second through hole 208 during the process of the button body 102 falling into the bottom of the card slot 214. So that the button body 102 is accurately dropped into the card slot 214, and the pressing can be accelerated The speed at which the key body 102 falls, while ensuring the accuracy of the direction of the button body 102, improves production efficiency.
  • the card slot 214 is a groove disposed downwardly on the upper surface of the carrier 204, and the card slots 214 are arranged in an array on the carrier 204;
  • the card slot 214 is adapted to the button body 102.
  • the carrier plate 204 is provided with locating pins for positioning the array of buttons placed on the carrier 204.
  • the positioning pin by locating the positioning pin on the carrier 204, the positioning pin cooperates with the positioning hole 108 of the array button, thereby realizing the positioning of the button body 102, and ensuring the accuracy of the position of the button body 102.
  • the present invention provides a packaging structure for packaging a button body 102.
  • the package structure includes: a braid 306, a spacer 304, and a braid film 302;
  • the spacers 304 are arranged in parallel or in an array above the braids 306.
  • the plurality of spacers 304 and the braids 306 enclose at least one row of open cavities; the cavities are adapted to the button body 102, and the cavities are used to hold The button body 102 is placed; the braid film 302 is located above the spacer 304 to cover the cavity.
  • the braid 306, the spacer 304 and the braid film 302 by providing the braid 306, the spacer 304 and the braid film 302, the stability of the package is ensured, and the button body 102 is effectively protected during transportation and the like, thereby avoiding the button body. 102 caused damage.
  • the thickness of the barrier 304 is gradually increased from top to bottom.
  • the space between the braid 306 and the spacer 304 is larger than the area of the bottom wall, ensuring that the button body 102 can be
  • the smooth entry into the space separated by the braid 306 and the spacer 304 ensures the firmness of the packaging structure.
  • the present invention provides a method for producing a button, comprising: step 702, placing an array button into an automatic feeding device; and step 704, The array button is sent to the cutting die and positioned by the positioning hole of the array button; in step 706, the array button is cut to obtain the button body, and the button body falls into the card slot of the carrier.
  • the array type button is cut by the cutting die, and the array type button is cut into the card slot of the carrier board after being cut by the upper mold, and the arrangement of the button body at this time is completely completed before the cutting.
  • the material of the button body is completed, the process steps of the vibration material are reduced, and the production efficiency is effectively improved.
  • the button production method further includes: Step 810, The at least one button body or the carrier plate with the button body is sent to the detecting station; wherein the detecting station is at least one; step 812, detecting the button body, and determining whether the button body is qualified; when the judgment result is “No” Then, in step 814, the button body is removed; when the determination result is "Yes", in step 816, the button body is packaged through the package structure.
  • the defective product is removed, and the qualified product is packaged to ensure the qualified rate of the product;
  • the button body is directly sent to the detecting station, multiple button bodies of the same row can be simultaneously fed into the detecting station to ensure that the welding pins are arranged in the same direction; the detecting station can be multiple, and multiple detecting workers The position of the button body obtained after cutting can be detected at the same time, the production button can be prevented from staying at the detecting station, and the production efficiency of the button can be effectively improved; when the button body is packaged, it can be behind each detecting station.
  • Each of them is provided with a packaging station, and a packaging station can be set after multiple inspection stations, which can effectively reduce the production cost of the product and improve the market competitiveness of the product while ensuring production efficiency.
  • the button production method further includes: step 818, coiling the packaged button body to form a disk-shaped product.
  • the disc-shaped product is easy to store and transport while ensuring the packaging is secure, and the subsequent use of the button is continued.
  • the array button is sent to the cutting die, and is positioned by the positioning hole of the array button, specifically: the array button is fixed on the carrier board, The positioning hole of the array type button cooperates with the positioning pin of the carrier board to realize positioning of the array type button; the carrier board is fed into the cutting die.
  • the positioning of the button body is matched by the positioning pin on the carrier board to ensure the accuracy of the position of the button body.
  • feeding the carrier to the cutting die is specifically: feeding the carrier into the cutting die through a central feeding system.
  • the carrier plate is fed into the cutting die through the central feeding system, and in the production process, the feeding is automated, the production efficiency is effectively improved, and the manual operation of the worker is reduced, and the worker operation safety is improved. At the same time, it reduces the labor intensity of workers.
  • the at least one button body or the carrier plate with the button body is fed into the detecting station, specifically: the loading of the button body by at least one conveyor belt and/or at least one robot
  • the board is fed into the inspection station.
  • the carrier plate equipped with the button body is fed into the inspection station by at least one conveyor belt and/or at least one robot, thereby realizing automation of product inspection, effectively improving production efficiency, and reducing manual for workers.
  • the operation reduces the labor intensity of the workers while improving the safety of the workers.
  • the detecting button body is specifically configured to: detect a common face of the button body, a dimensional tolerance of the button body, and a structural defect of the button body.
  • the product quality is effectively ensured, and the market competitiveness of the product is improved.
  • the array button is placed in the automatic feeding device and the array button is sent to the cutting die, and is positioned through the positioning holes of the array button.
  • the button production method further includes: Step 804, removing the protective cover of the array button.
  • the protective cover of the array button by removing the protective cover of the array button, the subsequent use of the button body obtained after the array button is cut is ensured, so that the packaged button body can be directly welded when used again, simplifying the welding.
  • the process steps required to connect the button body to other electrical components enhance the utility of the button body.
  • step 802 the array button is placed in the automatic feeding device; in step 804, the protective cover of the array button is removed; step 806, the array is The button is sent to the cutting die and positioned by the positioning hole of the array button; in step 808, the array button is sent to the cutting die and positioned by the positioning hole of the array button; in step 810, the button body is installed.
  • the carrier board is sent to the detecting station; in step 812, the button body is detected, and it is judged whether the button body is qualified; when the determination result is "No", in step 814, the button body is removed; when the determination result is "Yes”, step 816
  • the button body is packaged by the packaging structure; in step 818, the packaged button body is coiled to form a disk-shaped product.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacture Of Switches (AREA)
  • Push-Button Switches (AREA)

Abstract

一种阵列式按键、裁切模具、包装结构及按键生产方法,阵列式按键包括:多个按键本体(102)和支架(104),多个按键本体(102)呈阵列式排列,通过连接部(106)连接;支架(104)通过连接部(106)与按键本体(102)连接,用于支撑按键本体(102);支架(104)上设置有定位孔(108),用于在加工过程中对阵列式按键进行定位。通过支架(104)支撑多个按键本体(102),并且在支架(104)上设置用于在加工过程中对阵列式按键进行定位的定位孔(108),使得该种阵列式按键裁切后得到的按键按照预定的顺序及位置排列,减去了需要重新进行震动分料工艺步骤,在确保按键的顺序及位置正确的同时,避免了震动分料对按键造成的损伤及污染,确保了按键使用过程中的可靠性。

Description

阵列式按键、裁切模具、包装结构及按键生产方法
本申请要求于2017年04月27日提交中国专利局、申请号为201710286695.8、发明名称为“阵列式按键、裁切模具、包装结构及按键生产方法”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本发明涉及按键技术领域,具体而言,涉及一种阵列式按键、裁切模具、包装结构及按键生产方法。
背景技术
目前,在相关技术中,弹性按键的编带方式,需要先将模压成型的阵列式弹性按键元件半成品先去除焊接保护套,并冲切成单颗贴片式弹性按键元件,然后将贴片式弹性按键元件散料放入震动盘中,通过震动使得按键元件准确落在卡位上,进而判定、纠正按键方向,然后进入质量检测和包装步骤。一方面,单颗贴片式弹性按键元件需要经受冲切、散料堆积、震动上料等工序,不但容易影响按键焊脚的共面性,而且容易造成焊脚表面污染,进而直接影响贴片式弹性按键元件的可焊接性;另一方面,由于贴片式硅胶弹性按键的外形不同于一般电子元器件,且由于其存在固有的弹性特征,在使用震动盘对冲切好的硅胶弹性按键进行编带包装时,按键准确被震动到传送卡位的上料速度缓慢,此外,按键进入卡位后需要进一步判定、纠正方向后才能进入最终的质量检测和包装步骤。可见,现有电子元器件的编带包装方法用在贴片式弹性按键元件的编带包装上,工艺过程复杂,不但容易影响贴片按键元件的焊接质量,而且严重制约编带包装的生产速率。
发明内容
本发明旨在至少解决现有技术或相关技术中存在的技术问题之一。
为此,本发明第一个目的在于提出一种阵列式按键。
本发明的第二个目的在于提出一种裁切模具。
本发明的第三个目的在于提出一种包装结构。
本发明的第四个目的在于提出一种按键生产方法。
有鉴于此,根据本发明的第一个目的,本发明提供了一种阵列式按键,包括:多个按键本体和支架,多个按键本体呈阵列式排列,通过连接部连接;支架通过连接部与按键本体连接,用于支撑按键本体;支架上设置有定位孔,用于在加工过程中对阵列式按键进行定位。
本发明所提供的阵列式按键,通过支架支撑多个按键本体,并且在支架上设置用于在加工过程中对阵列式按键进行定位的定位孔,使得该种阵列式按键裁切后得到的按键按照预定的顺序及位置排列,减去了需要重新进行震动分料工艺步骤,在确保按键的顺序及位置正确的同时,避免了震动分料对按键造成的损伤及污染,确保了按键使用过程中的可靠性;并且在震动分料的过程中,按键被准确地震动到传送卡位的上料速度缓慢,由于减去了震动分料的工艺步骤,有效地提升了生产效率,确保了按键的大批量生产的速度。
另外,本发明提供的上述技术方案中的阵列式按键还可以具有如下附加技术特征:
在上述技术方案中,优选地,按键本体包括:底座、弹性软体和按键凸块,底座与连接部连接;弹性软体与底座相连接,位于底座上方;按键凸块与弹性软体相连接,位于弹性软体上方。
在该技术方案中,通过将按键本体设置为底座、弹性软体和按键凸块,确保了按键本体的正常工作,并且该种结构便于生产,可有效地提升生产效率。
在上述任一技术方案中,优选地,按键本体还包括:焊脚,焊脚与底座相连接,位于底座下方和/或侧方;其中,同一列中焊脚的排列方向相同。
在该技术方案中,通过在底座下方设置焊脚,并将同一列的按键本体 的焊脚的方向设置为相同,在确保按键与相关电气元件可有效地连接的同时,还确保了阵列式按键在裁切后可直接包装,不需要再次进行震动分料。
在上述任一技术方案中,优选地,焊脚上包覆有保护套,以保护焊脚;其中,所述保护套为独立的保护套,或为与所述按键本体一体成型的保护套。
在该技术方案中,通过在焊脚上设置保护套,有效地对焊脚起到保护地作用,避免对焊脚的污染,并且可确保焊脚的共面度,提高了按键本体的可焊接性。独立保护套便于安装和取下,与按键本体一体成型的保护套安装牢固,可有效地防止保护套在生产过程中自动脱落进而使得焊脚失去保护。
根据本发明的第二个目的,本发明提供了一种裁切模具,用于裁切如上述任一技术方案所述的阵列式按键,裁切模具包括:下模、载板和上模;下模设置有第一过孔;载板位于下模的上方,载板上设置有卡槽和第二过孔;第二过孔一端位于卡槽的底部,另一端与第一过孔相连通;上模位于载板上方,上模设置有冲切口,冲切口与载板相配合,用于裁切物料。
本发明所提供的裁切模具,阵列式按键被上模裁切后,直接落入载板的卡槽中,此时的按键本体的排列方式与未裁切之前完全相同,在对阵列式按键裁切的同时,完成了对按键本体的分料,减少了震动分料的工艺步骤,有效地提升了生产效率;通过在下模设置第一过孔,卡槽的底部设置第二过孔,并将第一过孔与第二过孔连通,在按键本体落入卡槽底部的过程中,按键本体与卡槽之间由于空气可由第一过孔与第二过孔排出,避免空气的积累而影响按键本利顺利地落入卡槽的底部,确保了按键本体落入卡槽底部后位置的准确性。
另外,本发明提供的上述技术方案中的裁切模具还可以具有如下附加技术特征:
在上述技术方案中,优选地,裁切模具还包括:吸嘴,吸嘴与第一过孔连通。
在该技术方案中,通过设置吸嘴,在按键本体落入卡槽底部的过程中,吸嘴可通过第一过孔与第二过孔对按键本体产生一个吸力,以使按键本体 准确地落入卡槽中,并且可加快按键本体下落的速度,再确保按键本体的方向的准确性的同时,提升了生产效率。
在上述任一技术方案中,优选地,卡槽为设置在载板上表面向下方凹陷的凹槽,卡槽在载板上以阵列的方式排列;其中,卡槽与按键本体相适配。
在该技术方案中,通过将载板上的卡槽与阵列式按键的按键本体的排列方式相适配,确保了按键本体可准确地进入到卡槽中,提升了产品的合格率。
在上述任一技术方案中,优选地,载板上设置有定位销,定位销用于对置于载板上的阵列式按键进行定位。
在该技术方案中,通过在载板上设置定位销,定位销与阵列式按键的定位孔相配合,实现了对按键本体的定位,确保了按键本体位置的准确性。
根据本发明的第三个目的,本发明提供了一种包装结构,用于包装将上述任一技术方案所述的阵列式按键裁切后得到的按键本体,包装结构包括:编带、隔栏和编带膜;多个隔栏在编带上方平行或阵列式排列,多个隔栏与编带围成至少一排上方开口的腔体;腔体与按键本体相适配,腔体用于盛放按键本体;编带膜位于隔栏上方,以盖合腔体。
本发明所提供的包装结构,通过设置编带、隔栏和编带膜,确保了包装的稳定性,在运输等过程中,有效地对按键本体起到保护作用,避免了对按键本体所造成损伤。
在上述技术方案中,优选地,隔栏的厚度由上至下逐渐增加。
在该技术方案中,通过将隔栏的厚度设置为由上至下逐渐增加,使得编带与隔栏所间隔出的空间,开口的面积大于底壁的面积,确保按键本体可顺利地进入到编带与隔栏所间隔出的空间中,确保了包装结构的牢固。
根据本发明的第四个目的,本发明提供了一种按键生产方法,包括:将如上述任一技术方案所述的阵列式按键放入自动进料装置;将阵列式按键送入如上述任一技术方案所述的裁切模具,并通过阵列式按键的定位孔进行定位;裁切阵列式按键,得到按键本体,按键本体落入载板的卡槽中。
本发明所提供的按键生产方法,通过裁切模具裁切阵列式按键,阵列 式按键被上模裁切后,直接落入载板的卡槽中,此时的按键本体的排列方式与未裁切之前完全相同,在对阵列式按键裁切的同时,完成了对按键本体的分料,减少了震动分料的工艺步骤,有效地提升了生产效率。
另外,本发明提供的上述技术方案中的按键生产方法还可以具有如下附加技术特征:
在上述技术方案中,优选地,在裁切阵列式按键,得到按键本体,按键本体落入载板的卡槽中之后,按键生产方法还包括:将至少一个按键本体或装有按键本体的载板送入检测工位;其中,所述检测工位至少为一个;检测按键本体,并判断按键本体是否合格;当判断结果为“否”时,剔除按键本体;当判断结果为“是”时,通过如上述任一技术方案所述的包装结构包装按键本体。
在该技术方案中,通过将至少一个按键本体或载板送入检测工位,并经过检测工位对按键本体的检测,剔除不合格品,将合格品进行包装,确保了产品的合格率;在直接将按键本体送入到检测工位时,可将同一排的多个按键本体同时送入检测工位,以确保焊脚的排列方向一致;检测工位可以为多个,多个检测工位可同时对裁切后得到的按键本体进行检测,避免生产的按键在检测工位出现滞留,可有效地提升按键的生产效率;在对按键本体进行包装时,可在每个检测工位后面均设置一个包装工位,也可在多个检测工位后设置一个包装工位,在确保生产效率的同时可有效地降低产品的生产成本,提升产品的市场竞争力。
在上述任一技术方案中,优选地,在通过如上述任一技术方案所述的包装结构包装按键本体之后,按键生产方法还包括:将包装后的按键本体盘卷,形成盘状产品。
在该技术方案中,通过将包装后的按键本体盘卷,形成盘状产品,在确保包装牢固的同时,盘状产品便于储存及运输,以及后续对按键的继续使用。
在上述任一技术方案中,优选地,将阵列式按键送入如上述任一技术方案所述的裁切模具,并通过阵列式按键的定位孔进行定位具体为:将阵列式按键固定于载板上,阵列式按键的定位孔与载板的定位销配合,以实 现对阵列式按键的定位;将载板送入如上述任一技术方案所述的裁切模具。
在该技术方案中,通过载板上的定位销与阵列式按键的定位孔相配合,实现了对按键本体的定位,确保了按键本体位置的准确性。
在上述任一技术方案中,优选地,将载板送入如上述任一技术方案所述的裁切模具具体为:通过中央供料系统将载板送入如上述任一技术方案所述的裁切模具。
在该技术方案中,通过中央供料系统将载板送入裁切模具,在生产过程中,实现了送料的自动化,有效地提升了生产效率,并且减少了工人手动操作,在提高工人操作安全性的同时,降低了工人的劳动强度。
在上述任一技术方案中,优选地,将至少一个按键本体或装有按键本体的载板送入检测工位具体为:通过至少一条传送带和/或至少一个机械手将装有按键本体的载板送入检测工位。
在该技术方案中,通过至少一条传送带和/或至少一个机械手将装有按键本体的载板送入检测工位,实现了产品送检的自动化,有效地提升了生产效率,并且减少了工人手动操作,在提高工人操作安全性的同时,降低了工人的劳动强度。
在上述任一技术方案中,优选地,检测按键本体具体为:检测按键本体的焊脚共面度、按键本体的尺寸公差和按键本体的结构缺陷。
在该技术方案中,通过检测按键本体焊脚共面度、按键本体的尺寸公差和按键本体的结构缺陷,有效地确保了产品质量,提升了产品的时长竞争力。
在上述任一技术方案中,优选地,在将如上述任一技术方案所述的阵列式按键放入自动进料装置与将阵列式按键送入如上述任一技术方案所述的裁切模具,并通过阵列式按键的定位孔进行定位之间,按键生产方法还包括:将阵列式按键的保护套摘除。
在该技术方案中,通过将阵列式按键的保护套摘除,确保了阵列式按键被裁切后所得到的按键本体的后续使用,使得包装后的按键本体再次使用时可直接进行焊接,简化了按键本体与其它电气元件连接所需要的工艺步骤,提升了按键本体的实用性。
本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:
图1示出了根据本发明的一个实施例的阵列式按键的示意图;
图2示出了根据本发明的一个实施例的焊脚包覆有保护套的阵列式按键的仰视图;
图3示出了根据本发明的一个实施例的焊脚去除保护套的阵列式按键的仰视图;
图4示出了根据本发明的一个实施例的裁切模具的示意图;
图5示出了根据本发明的一个实施例的载板的示意图;
图6示出了根据本发明的一个实施例的包装结构示意图;
图7示出了根据本发明的一个实施例的按键生产方法的流程图;
图8示出了根据本发明的另一个实施例的按键生产方法的流程图;
其中,图1至图6中的附图标记与部件名称之间的对应关系为:
102按键本体,1022按键凸块,1024弹性软体,1026底座,1028焊脚,104支架,106连接部,108定位孔,110保护套,202上模,204载板,206下模,208第二过孔,210第一过孔,212吸嘴,214卡槽,302编带膜,304隔栏,306编带。
具体实施方式
为了能够更清楚地理解本发明的上述目的、特征和优点,下面结合附图和具体实施方式对本发明进行进一步的详细描述。需要说明的是,在不冲突的情况下,本申请的实施例及实施例中的特征可以相互组合。
在下面的描述中阐述了很多具体细节以便于充分理解本发明,但是,本发明还可以采用其他不同于在此描述的其他方式来实施,因此,本发明的保护范围并不受下面公开的具体实施例的限制。
下面参照图1至图8描述根据本发明一些实施例所述阵列式按键、裁切模具、包装结构及按键生产方法。
在本发明第一方面实施例中,如图1所示,本发明提供了一种阵列式按键,包括:多个按键本体102和支架104,多个按键本体102呈阵列式排列,通过连接部106连接;支架104通过连接部106与按键本体102连接,用于支撑按键本体102;支架104上设置有定位孔108,用于在加工过程中对阵列式按键进行定位。
在该实施例中,通过支架104支撑多个按键本体102,并且在支架104上设置用于在加工过程中对阵列式按键进行定位的定位孔108,使得该种阵列式按键裁切后得到的按键按照预定的顺序及位置排列,减去了需要重新进行震动分料工艺步骤,在确保按键的顺序及位置正确的同时,避免了震动分料对按键造成的损伤及污染,确保了按键使用过程中的可靠性;并且在震动分料的过程中,按键被准确地震动到传送卡位的上料速度缓慢,由于减去了震动分料的工艺步骤,有效地提升了生产效率,确保了按键的大批量生产的速度。
在本发明的一个实施例中,优选地,如图2和图3所示,按键本体102包括:底座1026、弹性软体1024和按键凸块1022,底座1026与连接部106连接;弹性软体1024与底座1026相连接,位于底座1026上方;按键凸块1022与弹性软体1024相连接,位于弹性软体1024上方。
在该实施例中,通过将按键本体102设置为底座1026、弹性软体1024和按键凸块1022,确保了按键本体102的正常工作,并且该种结构便于生产,可有效地提升生产效率。
在本发明的一个实施例中,优选地,如图2和图3所示,按键本体102还包括:焊脚1028,焊脚1028与底座1026相连接,位于底座1026下方和/或侧方;其中,同一列中焊脚1028的排列方向相同。
在该实施例中,通过在底座1026下方设置焊脚1028,并将同一列的按键本体102的焊脚1028的方向设置为相同,在确保按键与相关电气元件可有效地连接的同时,还确保了阵列式按键在裁切后可直接包装,不需要再次进行震动分料。
在本发明的一个实施例中,优选地,如图2所示,焊脚1028上包覆有保护套110,以保护焊脚1028;其中,所述保护套110为独立的保护套,或为与所述按键本体102一体成型的保护套。
在该实施例中,通过在焊脚1028上设置保护套110,有效地对焊脚1028起到保护地作用,避免对焊脚1028的污染,并且可确保焊脚1028的共面度,提高了按键本体102的可焊接性。独立保护套便于安装和取下,与按键本体102一体成型的保护套安装牢固,可有效地防止保护套在生产过程中自动脱落进而使得焊脚1028失去保护。
在本发明第二方面实施例中,如图4和图5所示,本发明提供了一种裁切模具,用于裁切如上述任一技术方案所述的阵列式按键,裁切模具包括:下模206、载板204和上模202;下模206设置有第一过孔210;载板204位于下模206的上方,载板204上设置有卡槽214和第二过孔208;第二过孔208一端位于卡槽214的底部,另一端与第一过孔210相连通;上模202位于载板204上方,上模202设置有冲切口,冲切口与载板204相配合,用于裁切物料。
在该实施例中,阵列式按键被上模202裁切后,直接落入载板204的卡槽214中,此时的按键本体102的排列方式与未裁切之前完全相同,在对阵列式按键裁切的同时,完成了对按键本体102的分料,减少了震动分料的工艺步骤,有效地提升了生产效率;通过在下模206设置第一过孔210,卡槽214的底部设置第二过孔208,并将第一过孔210与第二过孔208连通,在按键本体102落入卡槽214底部的过程中,按键本体102与卡槽214之间由于空气可由第一过孔210与第二过孔208排出,避免空气的积累而影响按键本利顺利地落入卡槽214的底部,确保了按键本体102落入卡槽214底部后位置的准确性。
在本发明的一个实施例中,优选地,如图4所示,裁切模具还包括:吸嘴212,吸嘴212与第一过孔210连通。
在该实施例中,通过设置吸嘴212,在按键本体102落入卡槽214底部的过程中,吸嘴212可通过第一过孔210与第二过孔208对按键本体102产生一个吸力,以使按键本体102准确地落入卡槽214中,并且可加快按 键本体102下落的速度,再确保按键本体102的方向的准确性的同时,提升了生产效率。
在本发明的一个实施例中,优选地,如图5所示,卡槽214为设置在载板204上表面向下方凹陷的凹槽,卡槽214在载板204上以阵列的方式排列;其中,卡槽214与按键本体102相适配。
在该实施例中,通过将载板204上的卡槽214与阵列式按键的按键本体102的排列方式相适配,确保了按键本体102可准确地进入到卡槽214中,提升了产品的合格率。
在本发明的一个实施例中,优选地,载板204上设置有定位销,定位销用于对置于载板204上的阵列式按键进行定位。
在该实施例中,通过在载板204上设置定位销,定位销与阵列式按键的定位孔108相配合,实现了对按键本体102的定位,确保了按键本体102位置的准确性。
在本发明第三方面实施例中,如图6所示,本发明提供了一种包装结构,用于包装按键本体102,包装结构包括:编带306、隔栏304和编带膜302;多个隔栏304在编带306上方平行或阵列式排列,多个隔栏304与编带306围成至少一排上方开口的腔体;腔体与按键本体102相适配,腔体用于盛放按键本体102;编带膜302位于隔栏304上方,以盖合腔体。
在该实施例中,通过设置编带306、隔栏304和编带膜302,确保了包装的稳定性,在运输等过程中,有效地对按键本体102起到保护作用,避免了对按键本体102所造成损伤。
在本发明的一个实施例中,优选地,如图6所示,隔栏304的厚度由上至下逐渐增加。
在该实施例中,通过将隔栏304的厚度设置为由上至下逐渐增加,使得编带306与隔栏304所间隔出的空间,开口的面积大于底壁的面积,确保按键本体102可顺利地进入到编带306与隔栏304所间隔出的空间中,确保了包装结构的牢固。
在本发明第四方面实施例中,如图7所示,本发明提供了一种按键生产方法,包括:步骤702,将阵列式按键放入自动进料装置;步骤704,将 阵列式按键送入裁切模具,并通过阵列式按键的定位孔进行定位;步骤706,裁切阵列式按键,得到按键本体,按键本体落入载板的卡槽中。
在该实施例中,通过裁切模具裁切阵列式按键,阵列式按键被上模裁切后,直接落入载板的卡槽中,此时的按键本体的排列方式与未裁切之前完全相同,在对阵列式按键裁切的同时,完成了对按键本体的分料,减少了震动分料的工艺步骤,有效地提升了生产效率。
在本发明的一个实施例中,优选地,如图8所示,在裁切阵列式按键,得到按键本体,按键本体落入载板的卡槽中之后,按键生产方法还包括:步骤810,将至少一个按键本体或装有按键本体的载板送入检测工位;其中,所述检测工位至少为一个;步骤812,检测按键本体,并判断按键本体是否合格;当判断结果为“否”时,步骤814,剔除按键本体;当判断结果为“是”时,步骤816,通过包装结构包装按键本体。
在该实施例中,通过将至少一个按键本体或载板送入检测工位,并经过检测工位对按键本体的检测,剔除不合格品,将合格品进行包装,确保了产品的合格率;在直接将按键本体送入到检测工位时,可将同一排的多个按键本体同时送入检测工位,以确保焊脚的排列方向一致;检测工位可以为多个,多个检测工位可同时对裁切后得到的按键本体进行检测,避免生产的按键在检测工位出现滞留,可有效地提升按键的生产效率;在对按键本体进行包装时,可在每个检测工位后面均设置一个包装工位,也可在多个检测工位后设置一个包装工位,在确保生产效率的同时可有效地降低产品的生产成本,提升产品的市场竞争力。
在本发明的一个实施例中,优选地,如图8所示,在通过包装结构包装按键本体之后,按键生产方法还包括:步骤818,将包装后的按键本体盘卷,形成盘状产品。
在该实施例中,通过将包装后的按键本体盘卷,形成盘状产品,在确保包装牢固的同时,盘状产品便于储存及运输,以及后续对按键的继续使用。
在本发明的一个实施例中,优选地,将阵列式按键送入裁切模具,并通过阵列式按键的定位孔进行定位具体为:将阵列式按键固定于载板上, 阵列式按键的定位孔与载板的定位销配合,以实现对阵列式按键的定位;将载板送入裁切模具。
在该实施例中,通过载板上的定位销与阵列式按键的定位孔相配合,实现了对按键本体的定位,确保了按键本体位置的准确性。
在本发明的一个实施例中,优选地,将载板送入裁切模具具体为:通过中央供料系统将载板送入裁切模具。
在该实施例中,通过中央供料系统将载板送入裁切模具,在生产过程中,实现了送料的自动化,有效地提升了生产效率,并且减少了工人手动操作,在提高工人操作安全性的同时,降低了工人的劳动强度。
在本发明的一个实施例中,优选地,将至少一个按键本体或装有按键本体的载板送入检测工位具体为:通过至少一条传送带和/或至少一个机械手将装有按键本体的载板送入检测工位。
在该实施例中,通过至少一条传送带和/或至少一个机械手将装有按键本体的载板送入检测工位,实现了产品送检的自动化,有效地提升了生产效率,并且减少了工人手动操作,在提高工人操作安全性的同时,降低了工人的劳动强度。
在本发明的一个实施例中,优选地,检测按键本体具体为:检测按键本体的焊脚共面度、按键本体的尺寸公差和按键本体的结构缺陷。
在该实施例中,通过检测按键本体焊脚共面度、按键本体的尺寸公差和按键本体的结构缺陷,有效地确保了产品质量,提升了产品的市场竞争力。
在本发明的一个实施例中,优选地,如图8所示,在将阵列式按键放入自动进料装置与将阵列式按键送入裁切模具,并通过阵列式按键的定位孔进行定位之间,按键生产方法还包括:步骤804,将阵列式按键的保护套摘除。
在该实施例中,通过将阵列式按键的保护套摘除,确保了阵列式按键被裁切后所得到的按键本体的后续使用,使得包装后的按键本体再次使用时可直接进行焊接,简化了按键本体与其它电气元件连接所需要的工艺步骤,提升了按键本体的实用性。
在本发明的一个实施例中,优选地,如图8所示,步骤802,将阵列式按键放入自动进料装置;步骤804,将阵列式按键的保护套摘除;步骤806,将阵列式按键送入裁切模具,并通过阵列式按键的定位孔进行定位;步骤808,将阵列式按键送入裁切模具,并通过阵列式按键的定位孔进行定位;步骤810,将装有按键本体的载板送入检测工位;步骤812,检测按键本体,并判断按键本体是否合格;当判断结果为“否”时,步骤814,剔除按键本体;当判断结果为“是”时,步骤816,通过包装结构包装按键本体;步骤818,将包装后的按键本体盘卷,形成盘状产品。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。

Claims (18)

  1. 一种阵列式按键,其特征在于,包括:
    多个按键本体,所述多个按键本体呈阵列式排列,通过连接部连接;
    支架,通过所述连接部与按键本体连接,用于支撑所述按键本体;
    所述支架上设置有定位孔,用于在加工过程中对所述阵列式按键进行定位。
  2. 根据权利要求1所述的阵列式按键,其特征在于,所述按键本体包括:
    底座,所述底座与所述连接部连接;
    弹性软体,所述弹性软体与所述底座相连接,位于所述底座上方;
    按键凸块,所述按键凸块与所述弹性软体相连接,位于所述弹性软体上方。
  3. 根据权利要求2所述的阵列式按键,其特征在于,所述按键本体还包括:
    焊脚,所述焊脚与所述底座相连接,位于所述底座下方和/或侧方;
    其中,同一列中所述焊脚的排列方向相同。
  4. 根据权利要求2所述的阵列式按键,其特征在于,所述焊脚上包覆有保护套,以保护所述焊脚;
    其中,所述保护套为独立的保护套,或为与所述按键本体一体成型的保护套。
  5. 一种裁切模具,用于裁切如权利要求1至4中任一项所述的阵列式按键,其特征在于,裁切模具包括:
    下模,所述下模设置有第一过孔;
    载板,所述载板位于所述下模的上方,所述载板上设置有卡槽和第二过孔;
    其中,所述第二过孔一端位于所述卡槽的底部,另一端与所述第一过孔相连通;
    上模,所述上模位于所述载板上方,所述上模设置有冲切口,所述冲 切口与所述载板相配合,用于裁切物料。
  6. 根据权利要求5所述的裁切模具,其特征在于,还包括:吸嘴,所述吸嘴与所述第一过孔连通。
  7. 根据权利要求5所述的裁切模具,其特征在于,
    所述卡槽为设置在所述载板上表面向下方凹陷的凹槽,所述卡槽在所述载板上以阵列的方式排列;
    其中,所述卡槽与所述按键本体相适配。
  8. 根据权利要求5所述的裁切模具,其特征在于,所述载板上设置有定位销,所述定位销用于对置于所述载板上的所述阵列式按键进行定位。
  9. 一种包装结构,用于包装将如权利要求1至4中任一项所述的阵列式按键裁切后得到的按键本体,其特征在于,所述包装结构包括:
    编带;
    隔栏,多个所述隔栏在所述编带上方平行或阵列式排列,多个所述隔栏与所述编带围成至少一排上方开口的腔体;
    其中,所述腔体与所述按键本体相适配,所述腔体用于盛放所述按键本体;
    编带膜,所述编带膜位于所述隔栏上方,以盖合所述腔体。
  10. 根据权利要求9所述的包装结构,其特征在于,所述隔栏的厚度由上至下逐渐增加。
  11. 一种按键生产方法,其特征在于,包括:
    将如权利要求1至4中任一项所述的阵列式按键放入自动进料装置;
    将所述阵列式按键送入如权利要求5至8中任一项所述的裁切模具,并通过所述阵列式按键的定位孔进行定位;
    裁切所述阵列式按键,得到按键本体,所述按键本体落入载板的卡槽中。
  12. 根据权利要求11所述的按键生产方法,其特征在于,在所述裁切所述阵列式按键,得到按键本体,所述按键本体落入载板的卡槽中之后,所述按键生产方法还包括:
    将至少一个按键本体或装有按键本体的载板送入检测工位;
    其中,所述检测工位至少为一个;
    检测所述按键本体,并判断所述按键本体是否合格;
    当判断结果为“否”时,剔除所述按键本体;
    当判断结果为“是”时,通过如权利要求9或10所述的包装结构包装所述按键本体。
  13. 根据权利要求12所述的按键生产方法,其特征在于,在所述通过如权利要求9或10所述的包装结构包装所述按键本体之后,所述按键生产方法还包括:将包装后的按键本体盘卷,形成盘状产品。
  14. 根据权利要求11所述的按键生产方法,其特征在于,所述将所述阵列式按键送入如权利要求5至8中任一项所述的裁切模具,并通过所述阵列式按键的定位孔进行定位具体为:
    将所述阵列式按键固定于载板上,所述阵列式按键的定位孔与所述载板的定位销配合,以实现对所述阵列式按键的定位;
    将所述载板送入如权利要求5至8中任一项所述的裁切模具。
  15. 根据权利要求14所述的按键生产方法,其特征在于,所述将所述载板送入如权利要求5至8中任一项所述的裁切模具具体为:通过中央供料系统将所述载板送入如权利要求5至8中任一项所述的裁切模具。
  16. 根据权利要求12所述的按键生产方法,其特征在于,所述将至少一个按键本体或装有按键本体的载板送入检测工位具体为:通过至少一条传送带和/或至少一个机械手将装有按键本体的载板送入检测工位。
  17. 根据权利要求12所述的按键生产方法,其特征在于,所述检测所述按键本体具体为:检测所述按键本体的焊脚共面度、所述按键本体的尺寸公差和所述按键本体的结构缺陷。
  18. 根据权利要求11至17中任一项所述的按键生产方法,其特征在于,在所述将如权利要求1至4中任一项所述的阵列式按键放入自动进料装置与所述将所述阵列式按键送入如权利要求5至8中任一项所述的裁切模具,并通过所述阵列式按键的定位孔进行定位之间,所述按键生产方法还包括:将所述阵列式按键的保护套摘除。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1825513A (zh) * 2005-02-22 2006-08-30 广达电脑股份有限公司 按键模块制造方法
CN102198671A (zh) * 2010-03-25 2011-09-28 毅嘉科技股份有限公司 按键集料治具
CN102347157A (zh) * 2011-09-06 2012-02-08 苏州达方电子有限公司 键帽本体模具及键帽的制作方法
US20140076019A1 (en) * 2012-09-14 2014-03-20 Chi-Jui Huang Keyboard cover fabrication method
CN104637716A (zh) * 2013-11-08 2015-05-20 深圳富泰宏精密工业有限公司 按键的制作方法及由该方法制得的按键
CN105655173A (zh) * 2016-03-29 2016-06-08 桂林旭研机电科技有限公司 一种焊脚内置的贴片式弹性按键及其制作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206953150U (zh) * 2017-04-27 2018-02-02 桂林电子科技大学 阵列式按键、裁切模具及包装结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1825513A (zh) * 2005-02-22 2006-08-30 广达电脑股份有限公司 按键模块制造方法
CN102198671A (zh) * 2010-03-25 2011-09-28 毅嘉科技股份有限公司 按键集料治具
CN102347157A (zh) * 2011-09-06 2012-02-08 苏州达方电子有限公司 键帽本体模具及键帽的制作方法
US20140076019A1 (en) * 2012-09-14 2014-03-20 Chi-Jui Huang Keyboard cover fabrication method
CN104637716A (zh) * 2013-11-08 2015-05-20 深圳富泰宏精密工业有限公司 按键的制作方法及由该方法制得的按键
CN105655173A (zh) * 2016-03-29 2016-06-08 桂林旭研机电科技有限公司 一种焊脚内置的贴片式弹性按键及其制作方法

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