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WO2018137303A1 - 移动终端 - Google Patents

移动终端 Download PDF

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Publication number
WO2018137303A1
WO2018137303A1 PCT/CN2017/087550 CN2017087550W WO2018137303A1 WO 2018137303 A1 WO2018137303 A1 WO 2018137303A1 CN 2017087550 W CN2017087550 W CN 2017087550W WO 2018137303 A1 WO2018137303 A1 WO 2018137303A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
board
segment
mobile terminal
sub
Prior art date
Application number
PCT/CN2017/087550
Other languages
English (en)
French (fr)
Inventor
尹帮实
尹建春
刘秀兰
薛康乐
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201780006179.3A priority Critical patent/CN108702401A/zh
Publication of WO2018137303A1 publication Critical patent/WO2018137303A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • the present application relates to the field of communications device technologies, and in particular, to a mobile terminal.
  • PCBs printed circuit boards
  • the motherboard is placed at the upper end of the battery, and a small board is placed at the lower end of the battery.
  • a flexible printed circuit (FPC) is used to connect the main board and the small board, and the flexible circuit board is placed across the battery.
  • the upper surface position or the lower surface position that is, between the display screen and the battery or between the battery and the back cover.
  • the flexible circuit board is disposed in the thickness direction of the smart phone, which inevitably increases the overall thickness of the smart phone, which is not conducive to the development of the thin and light of the smart phone.
  • the technical problem to be solved by the embodiments of the present application is to provide a mobile terminal with a thin overall thickness.
  • the embodiment of the present application provides a mobile terminal, including a device, a main circuit board, a sub-board, and a first circuit board.
  • the first circuit board includes a first connecting plate, a second connecting plate, and a third connecting plate that are integrally formed and sequentially connected.
  • the first connecting board is connected to the main circuit board, and the third connecting board is connected to the auxiliary circuit board.
  • the device includes two surfaces that are oppositely disposed and a circumferential side that is coupled between the two surfaces.
  • the main circuit board, the second connection board, and the auxiliary circuit board are disposed around the circumferential side, and a wiring surface of the second connection board is disposed facing the circumferential side.
  • the second connecting plate of the first circuit board is disposed around the circumferential side, the second connecting plate is disposed in a width direction of the mobile terminal, and the mobile terminal is reduced.
  • the number of devices in the thickness direction thereof so that the space of the mobile terminal in the width direction thereof can be fully utilized, and the space of the mobile terminal in the thickness direction thereof is saved, which is advantageous for reducing the thickness of the mobile terminal (
  • the thickness of the whole machine of the mobile terminal can be reduced by 0.1 mm to 0.2 mm or even more.
  • the dimension of the second connection board in the width direction of the mobile terminal is the thickness of the second connection board, and the second connection The thickness of the board is small, so that the size ratio of the whole machine width of the mobile terminal is small, so that the mobile terminal still has a better user experience.
  • the mobile terminal since the mobile terminal reduces the number of components in the thickness direction thereof and reduces the thickness of the whole machine, the design difficulty and processing difficulty of the front shell and/or the rear shell of the mobile terminal are reduced, which is advantageous.
  • the structure and processing procedure of the front case and/or the rear case of the mobile terminal are simplified, and the production cost of the mobile terminal is reduced.
  • the wiring surface of the second connection board is substantially parallel with the side surface of the circumferential side surface adjacent to the second connection board, so that the second connection board occupies in the width direction of the mobile terminal Small space is good for reason Controlling the overall width dimension of the mobile terminal.
  • an angle between the wiring surface of the second connecting board and the side of the circumferential side adjacent to the second connecting board may be formed at an angle of less than or equal to 15° to reduce assembly of the mobile terminal. Difficulty.
  • the first connecting plate and the second connecting plate form a folded structure.
  • the first connecting plate is folded over the second connecting plate, and the wiring surface of the first connecting plate is not parallel to the wiring surface of the second connecting plate.
  • the first connecting plate can be smoothly overlapped on the surface of the main circuit board (for example, a surface for carrying components).
  • the wiring surface of the first connection board may be substantially parallel to the surface of the main circuit board to reduce the assembly process difficulty of the first circuit board and the main circuit board.
  • the end of the first connecting plate away from the second connecting plate may be connected to the main circuit board through a connector.
  • the connector may be a ZIF (Zero Insertion Force) connector or a BTB (Board to board) connector.
  • the third connecting plate and the second connecting plate form a folded structure.
  • the third connecting plate is folded over the second connecting plate, and the wiring surface of the third connecting plate is not parallel to the wiring surface of the second connecting plate.
  • the third connecting plate can be smoothly overlapped on the surface of the auxiliary circuit board (for example, a surface for carrying components).
  • the wiring surface of the third connection board may be substantially parallel to the surface of the auxiliary circuit board to reduce the assembly process difficulty of the third circuit board and the auxiliary circuit board.
  • the third connecting plate is away from the end of the second connecting plate and can be connected to the auxiliary circuit board through a connector.
  • the connector may be a ZIF (Zero Insertion Force) connector or a BTB (Board to board) connector.
  • the first circuit board is a two-layer board or a multi-layer board.
  • the number of layers of the first circuit board can be set according to transmission requirements.
  • the second connecting board includes a first sub-connecting board and a second sub-connecting board which are stacked in a width direction of the mobile terminal, and two ends of the first sub-connecting board are respectively connected Both ends of the second sub-connecting plate.
  • an intermediate section of the first sub-connecting board (connected between both ends of the first sub-connecting board) and an intermediate section of the second sub-connecting board (connected to the second sub-connecting board) The hollowing between the ends of the two ends is not connected to each other, thereby facilitating the folding and forming of the second connecting plate.
  • the layer structure of the first sub-connecting plate and the second sub-connecting plate is the same as that of the first connecting plate.
  • the conductive traces of the second connection board may be arranged in the first sub-connection board and the second sub-connection board, that is, the first sub-connection board and the The second sub-connection board can realize signal transmission, so even if the size of the second connection board in the thickness direction of the mobile terminal is limited, the second connection board can be increased in width of the mobile terminal The number of trace layers in the direction to ensure or improve the transmission capability of the second connection board.
  • the second connecting plate further includes an end connecting plate for connecting the two ends of the first sub-connecting board and the two ends of the second sub-connecting board in one-to-one correspondence, the end portion
  • the connecting plate is integrally formed with the first sub-connecting plate and the second sub-connecting plate.
  • the first circuit board may be a flexible circuit board, a hard and soft combination circuit board or a rigid circuit board.
  • a gap may be formed in an intermediate portion of the second connecting board, and then folded along the slit to form a first sub-connecting board and a second sub-connecting board which are stacked.
  • the second connecting plate further includes a third sub-connecting plate, and the third sub-connecting plate and the second sub-connecting plate are stacked.
  • the third sub-connecting board is disposed on a side of the second sub-connecting board away from the first sub-connecting board, or the third sub-connecting board is disposed on the second sub-connecting board and the first Between the sub-connectors. Both ends of the third sub-connecting board are respectively connected to two ends of the second sub-connecting board (and both ends of the first sub-connecting board). At this time, the conductive traces of the second connection board may be arranged in the first sub-connection board, the second sub-connection board, and the third sub-connection board.
  • One end of the first sub-connecting board is connected to the first connecting board, and one end of the second sub-connecting board is away from the first connecting board to connect the third connecting board. Since the two ends of the first sub-connecting board are respectively connected to the two ends of the second sub-connecting board, the first connecting board connected to one end of the first sub-connecting board can pass the first sub-board The connection board and the second sub-connection board transmit signals, and the third connection board connected to one end of the second sub-connection board can transmit signals through the first sub-connection board and the second sub-connection board .
  • the first connecting plate, the second connecting plate, and the third connecting plate substantially form a zigzag plate, which is beneficial to improving the utilization rate of the jigsaw. Thereby reducing the cost of the first circuit board.
  • the mobile terminal further includes a second circuit board.
  • the second circuit board includes a first segment, a second segment, and a third segment that are integrally formed and sequentially connected.
  • the main circuit board is provided with a radio frequency circuit
  • the auxiliary circuit board is provided with an antenna feeding point
  • the first section is connected to the main circuit board to be electrically connected to the radio frequency circuit
  • the third section is connected
  • the secondary circuit board is electrically connected to the antenna feed point
  • the second section is disposed around the circumferential side.
  • the second circuit board can adopt the same or similar structure as the first circuit board
  • the first segment can adopt the same or similar structure as the first connecting plate
  • the second segment A structure identical or similar to the second connecting plate may be employed
  • the third segment may adopt the same or similar structure as the third connecting plate.
  • the second circuit board since the second circuit board is used to connect the RF circuit board and the antenna feed point, the RF line of the antenna component of the mobile terminal is arranged on the second circuit board.
  • the stacking arrangement and the routing settings of the second circuit board are used to control the impedance of the radio frequency line, thereby eliminating the coaxial cable and reducing the overall thickness of the mobile terminal.
  • the second circuit board further includes a fourth segment and a fifth segment.
  • the fourth segment is connected to one end of the second segment connecting the first segment, and the fourth segment is spaced apart from the first segment.
  • the fifth segment is connected to one end of the second segment connecting the third segment, and the fifth segment is spaced apart from the third segment.
  • the fourth segment is connected to the main circuit board, and the fifth segment is connected to the auxiliary circuit board.
  • the fourth segment may employ the same or similar structure as the first segment, and the fifth segment may employ the same or similar structure as the third segment.
  • the fourth segment and the first segment are isolated from each other for connection to different positions or devices of the main circuit board, and the fifth segment and the third segment are isolated from each other. Connected to different locations or devices of the secondary circuit board, such that the second circuit board can simultaneously be used to transmit different signals.
  • the second segment includes a first trace and a second trace that are isolated from each other, the first trace connects the first segment and the third segment, and the second trace connects the first Four paragraphs and the fifth paragraph. At this time, the first trace and the second trace can be used to transmit different signals.
  • first segment is connected to the main circuit board through a first connector
  • fourth segment is connected to the main circuit board through a second connector, the type of the first connector Different from the type of the second connector. Since the first segment and the fourth segment are used to transmit different signals, the connection can be performed through different types of connectors. Better enough to achieve signal transmission.
  • the second segment is stacked with the second connecting plate.
  • the mobile terminal further includes a display screen and a third circuit board, the display screen being stacked with the device.
  • the display screen includes a display panel and a flexible circuit board electrically connected to the display panel, the flexible circuit board electrically connecting the auxiliary circuit board.
  • the third circuit board includes an integrally formed first portion, a second portion, and a third portion, the first portion connecting the main circuit board, the third portion connecting the auxiliary circuit board to electrically connect to the flexible a circuit board, the second portion being disposed around the circumferential side.
  • the third circuit board is used to implement communication between the main board and the display panel.
  • the third circuit board can adopt the same or similar structure as the first circuit board, and the first part can adopt the same or similar structure as the first connecting board, and the second part can be The same or similar structure as the second connecting plate may be employed, and the third portion may adopt the same or similar structure as the third connecting plate.
  • the second portion and the second connecting plate are respectively disposed on two sides of the device.
  • the second connecting plate is disposed to fit the circumferential side.
  • the first circuit board portion is attached to the device arrangement, and the space between the first circuit board and the device can be omitted, thereby reducing the overall width of the mobile terminal.
  • the second segment of the second circuit board is disposed to fit the second connecting plate.
  • the mobile terminal further includes a housing, and the device and the first circuit board are both disposed inside the housing.
  • the second connecting plate is disposed to fit the inner wall of the housing.
  • the first circuit board portion is disposed to fit the inner wall of the casing, and the space between the first circuit board and the casing can be omitted, thereby reducing the overall width of the mobile terminal.
  • the second circuit board and the third circuit board are both disposed inside the housing.
  • the second segment of the second circuit board is disposed to fit the second connecting plate.
  • the third circuit board and the first circuit board are respectively disposed on opposite sides of the device, and the third circuit board is disposed on an inner wall of the housing.
  • FIG. 1 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application.
  • Figure 2 is a cross-sectional view of the structure taken along line II-II of Figure 1.
  • FIG. 3 is a schematic diagram showing a partial structure of the mobile terminal shown in FIG. 1.
  • Figure 4 is a partially exploded view of the structure of Figure 3.
  • Figure 5 is a partially exploded view of the structure of Figure 3.
  • Figure 6 is a partially exploded view of the structure of Figure 3.
  • FIG. 7 is a schematic structural diagram of an embodiment of a first circuit board of the mobile terminal shown in FIG. 1.
  • FIG. 7 is a schematic structural diagram of an embodiment of a first circuit board of the mobile terminal shown in FIG. 1.
  • FIG. 8 is a partial structural schematic view of the first circuit board shown in FIG. 7.
  • FIG. 8 is a partial structural schematic view of the first circuit board shown in FIG. 7.
  • FIG. 9 is a schematic structural view of the first circuit board shown in FIG. 7 in a flattened state.
  • FIG. 10 is a schematic structural view showing another embodiment of the first circuit board of the mobile terminal shown in FIG. 1 in a flattened state.
  • FIG. 10 is a schematic structural view showing another embodiment of the first circuit board of the mobile terminal shown in FIG. 1 in a flattened state.
  • FIG. 11 is a schematic structural view of a second circuit board of the mobile terminal shown in FIG. 1.
  • Figure 12 is a schematic view showing the structure of the second circuit board shown in Figure 11 in a flattened state.
  • the mobile terminal 100 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, or the like.
  • the mobile terminal 100 includes a device 1, a main circuit board 2, a sub-board 3, and a first circuit board 4.
  • the first circuit board 4 includes a first connecting plate 41, a second connecting plate 42 and a third connecting plate 43 which are integrally formed and sequentially connected.
  • the first connecting board 41 is connected to the main circuit board 2, and the third connecting board 43 is connected to the auxiliary circuit board 3.
  • the conductive traces in the first circuit board 4 sequentially pass through the first connecting plate 41, the second connecting plate 42 and the third connecting plate 43.
  • the conductive traces connect the main circuit board 2 and the auxiliary circuit board 3, thereby implementing communication between the main circuit board 2 and the auxiliary circuit board 3.
  • the device 1 comprises two surfaces 11 arranged opposite each other and a circumferential side 12 connected between the two surfaces 11.
  • the two surfaces 11 are arranged substantially in parallel.
  • the distance between the two surfaces 11 is much smaller than the spacing between the two opposite sides of the circumferential side 12, and the thickness direction X of the mobile terminal 100 is substantially perpendicular to the two surfaces 11.
  • the main circuit board 2, the second connection board 42 and the auxiliary circuit board 3 are disposed around the circumferential side surface 12, and the wiring surface 420 of the second connection board 42 is disposed facing the circumferential side surface 12.
  • the main circuit board 2, the second connection board 42 and the auxiliary circuit board 3 are both disposed at the periphery of the circumferential side surface 12, and the main circuit board 2 can be adjacent to the circumferential side surface 12.
  • the upper side surface 121 is disposed, and the auxiliary circuit board 3 can be disposed adjacent to the lower side surface 122 of the circumferential side surface 12, and the second connecting board 42 can be disposed adjacent to the left side surface 123 or the right side surface 124 of the circumferential side surface 12.
  • the width direction Y of the mobile terminal 100 is substantially parallel to the two surfaces 11 and is substantially perpendicular to the left side surface 123 or the right side surface 124.
  • a surface 21 of the main circuit board 2 for carrying components is substantially parallel to the two surfaces 11, and a surface of the main circuit board 2 close to the device 1 faces the upper side 121.
  • a surface 31 of the auxiliary circuit board 3 for carrying components is substantially parallel to the two surfaces 11, and a surface of the auxiliary circuit board 3 close to the device 1 faces the lower side 122.
  • the wiring surface 420 of the second connecting plate 42 refers to a surface of the second connecting plate 42 for arranging the conductive traces, and the wiring surface 420 of the second connecting plate 42 faces the left side surface 123 or The right side 124 is set.
  • the thickness direction of the second connecting plate 42 is perpendicular to the wiring surface 420 of the second connecting plate 42.
  • the second connecting plate 42 of the first circuit board 4 is disposed around the circumferential side surface 12, the second connecting plate 42 is disposed in the width direction Y of the mobile terminal 100.
  • the number of devices of the mobile terminal 100 in its thickness direction X is reduced, so that the space of the mobile terminal 100 in its width direction Y can be fully utilized, and the space of the mobile terminal 100 in its thickness direction X is saved. It is advantageous to reduce the overall thickness of the mobile terminal 100 (which can be reduced by 0.1 mm to 0.2 mm, or even more), and the overall thickness of the mobile terminal 100 is thin.
  • the dimension of the second connecting plate 42 in the width direction Y of the mobile terminal 100 is the second connecting plate 42.
  • the thickness of the second connecting plate 42 is small, so that the size ratio of the whole machine width of the mobile terminal 100 is small, so that the mobile terminal 100 still has a better user experience.
  • the mobile terminal 100 since the mobile terminal 100 reduces the number of components in the thickness direction X thereof, the thickness of the whole machine is reduced, thereby reducing the design difficulty and processing difficulty of the front case and/or the rear case of the mobile terminal 100. Conducive to simplification The structure and processing steps of the front case and/or the rear case of the mobile terminal 100 reduce the production cost of the mobile terminal 100.
  • the wiring surface 420 of the second connecting plate 42 that protrudes into the first slit faces the upper side 121.
  • the wiring surface 420 of the second connection plate 42 of the second slit is disposed facing the lower side surface 122.
  • the device 1 can be any component disposed between the main circuit board 2 and the auxiliary circuit board 3.
  • the present application is described by taking the device 1 as a battery.
  • the size of the second connecting plate 42 is less than or equal to the size of the device 1, thereby preventing the second connecting plate 42 from increasing the overall thickness of the mobile terminal 100.
  • the space occupied by the second connecting plate 42 in the width direction Y of the mobile terminal 100 is small, which is advantageous for reasonably controlling the overall width dimension of the mobile terminal 100.
  • the wiring surface 420 of the second connecting plate 42 and the side of the circumferential side surface 12 adjacent to the second connecting plate 42 may be formed to reduce the assembly difficulty of the mobile terminal 100.
  • the first connecting plate 41 and the second connecting plate 42 form a folded structure.
  • the first connecting plate 41 is folded over the second connecting plate 42 , and the wiring surface of the first connecting plate 41 (the surface for arranging the conductive traces) is not parallel to the second connecting plate The wiring surface 420 of 42.
  • the first connecting plate 41 can be smoothly overlapped on the surface of the main circuit board 2 (for example, the surface 21 for carrying components).
  • the wiring surface of the first connection board 41 may be substantially parallel to the surface of the main circuit board 2 to reduce the assembly process difficulty of the first circuit board 4 and the main circuit board 2.
  • the end of the first connecting plate 41 away from the second connecting plate 42 can be connected to the main circuit board 2 through a connector 411.
  • the connector 411 can be a ZIF (Zero Insertion Force) connector or a BTB (Board to Board) connector.
  • the third connecting plate 43 and the second connecting plate 42 form a folded structure.
  • the third connecting plate 43 is folded over the second connecting plate 42 , and the wiring surface of the third connecting plate 43 (the surface for arranging the conductive traces) is not parallel to the second connecting plate The wiring surface 420 of 42.
  • the third connecting plate 43 can be smoothly overlapped on the surface of the auxiliary circuit board 3 (for example, the surface 31 for carrying components).
  • the wiring surface of the third connection board 43 may be substantially parallel to the surface of the auxiliary circuit board 3 to reduce the assembly process difficulty of the third circuit board 7 and the auxiliary circuit board 3.
  • the end of the third connecting plate 43 away from the second connecting plate 42 can be connected to the auxiliary circuit board 3 through a connector 431.
  • the connector 431 can be a ZIF (Zero Insertion Force) connector or a BTB (Board to Board) connector.
  • the first circuit board 4 is a two-layer board or a multi-layer board.
  • the number of layers of the first circuit board 4 can be set according to transmission requirements.
  • the second connecting board 42 includes a first sub-connecting board 421 and a second sub-layer which are stacked in the width direction Y of the mobile terminal 100. Connection plate 422.
  • the two ends 4211 of the first sub-connecting board 421 are respectively connected to the two ends 4221 of the second sub-connecting board 422.
  • the first sub-connecting board 421 An intermediate section 4212 (connected between the two ends 4211 of the first sub-connecting board 421) and an intermediate section 4222 of the second sub-connecting board 422 (connected at both ends 4221 of the second sub-connecting board 422)
  • the hollowed-out arrangement between the two is not connected to each other, thereby facilitating the folding and forming of the second connecting plate 42.
  • the layer structure of the first sub-connecting plate 421 and the second sub-connecting plate 422 is the same as that of the first connecting plate 41.
  • the conductive traces of the second connecting plate 42 may be arranged in the first sub-connecting board 421 and the second sub-connecting board 422, that is, the first sub-connecting board. Both the 421 and the second sub-connecting board 422 can realize signal transmission, so even if the size of the second connecting board 42 in the thickness direction X of the mobile terminal 100 is limited, the second connecting board 42 can be The transmission capability of the second connection board 42 is ensured or improved by increasing the number of routing layers in the width direction Y of the mobile terminal 100.
  • the second connecting plate 42 further includes an end connecting plate 423 for connecting the two ends 4211 of the first sub-connecting board 421 and the two ends of the second sub-connecting board 422 in a one-to-one correspondence. 4221, the end connecting plate 423 is integrally formed with the first sub-connecting plate 421 and the second sub-connecting plate 422.
  • the first circuit board 4 can be a flexible circuit board, a hard and soft combination circuit board, or a rigid circuit board.
  • a gap may be formed in an intermediate portion of the second connecting board 42 and then folded along the slit to form a first sub-connecting board 421 and a second sub-connecting board which are stacked. 422.
  • the second connecting plate 42 further includes a third sub-connecting plate 424, and the third sub-connecting plate 424 is stacked with the second sub-connecting plate 422.
  • the third sub-connecting board 424 is disposed on a side of the second sub-connecting board 422 away from the first sub-connecting board 421, and two ends 4241 of the third sub-connecting board 424 are respectively connected to the second sub-board Both ends 4221 of the connection plate 422 are connected.
  • the conductive traces of the second connecting plate 42 may be arranged in the first sub-connecting board 421, the second sub-connecting board 422, and the third sub-connecting board 424.
  • one end of the first sub-connecting board 421 is connected to the first connecting board 41, and one end of the second sub-connecting board 422 away from the first connecting board 41 is connected to the third connecting board 43. Since the two ends 4211 of the first sub-connecting board 421 are respectively connected to the two ends 4221 of the second sub-connecting board 422, the first connecting board 41 connected to one end of the first sub-connecting board 421 can be The first sub-connecting board 421 and the second sub-connecting board 422 transmit signals, and the third connecting board 43 connected to one end of the second sub-connecting board 422 can pass the first sub-connecting board The 421 and the second sub-connector 422 transmit signals.
  • the first connecting plate 41, the second connecting plate 42 and the third connecting plate 43 substantially form a zigzag plate, which is beneficial to improve The board utilization rate reduces the cost of the first circuit board 4.
  • the mobile terminal 100 further includes a second circuit board 5.
  • the second circuit board 5 includes a first segment 51, a second segment 52, and a third segment 53 that are integrally formed and sequentially connected.
  • the main circuit board 2 is provided with a radio frequency circuit 22, and the auxiliary circuit board 3 is provided with an antenna feed point 23, and the first segment 51 is connected to the main circuit board 2 to be electrically connected to the radio frequency circuit 22.
  • the third segment 53 is connected to the auxiliary circuit board 3 to be electrically connected to the antenna feed point 23, and the second segment 52 is disposed around the circumferential side surface 12.
  • the second circuit board 5 can adopt the same or similar structure as the first circuit board 4, and the first segment 51 can adopt the same or similar structure as the first connecting board 41.
  • the second segment 52 may adopt the same or similar structure as the second connecting plate 42, and the third segment 53 may adopt the same or similar structure as the third connecting plate 43.
  • the second circuit board 5 is used to connect the RF circuit 22 board and the antenna feed point 23
  • the radio frequency line of the antenna component of the mobile terminal 100 is arranged on the second circuit board 5, and the impedance of the radio frequency line is controlled by the stacking arrangement and the routing setting of the second circuit board 5, thereby eliminating the same
  • the shaft cable reduces the overall thickness of the mobile terminal 100.
  • the second circuit board 5 further includes a fourth segment 54 and a fifth segment 55.
  • the fourth segment 54 is connected to one end of the second segment 52 connected to the first segment 51, and the fourth segment 54 is spaced apart from the first segment 51.
  • the fifth segment 55 is connected to one end of the second segment 52 connected to the third segment 53 , and the fifth segment 55 is spaced apart from the third segment 53 .
  • the fourth segment 54 is connected to the main circuit board 2, and the fifth segment 55 is connected to the auxiliary circuit board 3.
  • the fourth segment 54 may adopt the same or similar structure as the first segment 51, and the fifth segment 55 may adopt the same or similar structure as the third segment 53.
  • the fourth segment 54 and the first segment 51 are isolated from each other for connection to different positions or devices of the main circuit board 2, the fifth segment 55 and the third segment The 53 are isolated from each other for connection to different locations or devices of the sub-board 3, so that the second board 5 can simultaneously be used to transmit different signals.
  • first segment 51, the third segment 53, the fourth segment 54 and the fifth segment 55 form a folded structure between the second segment 52 and the second segment 52, and can be optimized.
  • the positional layout of the folded structure of the second circuit board 5 realizes the layout of the multilayer circuit board in a limited space, so that the second circuit board 5 realizes stronger signal transmission capability and optimizes the internal structure of the mobile terminal 100. Arrange.
  • the second segment 52 includes a first trace 521 and a second trace 522 that are isolated from each other, and the first trace 521 connects the first segment 51 and the third segment 53, A second trace 522 connects the fourth segment 54 and the fifth segment 55.
  • the first trace 521 and the second trace 522 can be used to transmit different signals.
  • the first trace 521 can be used to transmit an antenna signal
  • the second trace 522 can be used to transmit a power signal between the main circuit board 2 and the auxiliary circuit board 3
  • the first The circuit board 4 can only be used to transmit data signals (including control signals) between the main circuit board 2 and the sub-board 3, thereby reducing the transmission requirements for the first circuit board 4.
  • the first segment 51 is connected to the main circuit board 2 through a first connector 511
  • the fourth segment 54 is connected to the main circuit board 2 through a second connector 541.
  • the type of the first connector 511 is different from the type of the second connector 541. Since the first segment 51 and the fourth segment 54 are used to transmit different signals, the connection can be better achieved by connecting through different types of connectors. Of course, in other embodiments, the type of the first connector 511 and the type of the second connector 541 may also be the same.
  • the second segment 52 is disposed on the second connecting plate 42 .
  • the second circuit board 5 and the first circuit board 4 are substantially stacked, and the second circuit board 5 and the first circuit board 4 are disposed on the same side of the device 1 so as to be sufficient
  • the internal space of the mobile terminal 100 is utilized.
  • the second segment 52 and the second connecting plate 42 may also be disposed on opposite sides of the device 1, for example, the routing surface of the second segment 52 faces the left
  • the side surface 123 is disposed, and the wiring surface 420 of the second connecting plate 42 is disposed facing the right side surface 124.
  • the mobile terminal 100 further includes a display screen 6 and a third circuit board 7, and the display screen 6 is stacked with the device 1, and the The display surface of the display screen 6 is substantially parallel to the two surfaces 11.
  • the display screen 6 includes a display panel 61 and a flexible circuit board 62 electrically connected to the display panel 61, the flexibility
  • the circuit board 62 is electrically connected to the sub-board 3.
  • the third circuit board 7 includes an integrally formed first portion 71, a second portion 72, and a third portion 73.
  • the first portion 71 is connected to the main circuit board 2, and the third portion 73 is connected to the auxiliary circuit board.
  • 3 is electrically connected to the flexible circuit board 62, and the second portion 72 is disposed around the circumferential side 12.
  • the third circuit board 7 is used to implement communication between the main circuit board 2 and the display panel 61.
  • the third circuit board 7 can adopt the same or similar structure as the first circuit board 4, and the first portion 71 can adopt the same or similar structure as the first connecting board 41,
  • the second portion 72 may adopt the same or similar structure as the second connecting plate 42, and the third portion 73 may adopt the same or similar structure as the third connecting plate 43.
  • the mobile terminal 100 further includes a cover 8 attached to a surface of the display screen 6 remote from the device 1.
  • the cover plate 8 is a transparent hard plate member, so that the internal components of the mobile terminal 100 (for example, the display screen 6) can be well protected, and a good light transmission effect can be achieved.
  • the cover plate 8 can be a glass cover plate 8.
  • the display screen 6 can adopt an In-cell type touch screen (refer to a structure in which a touch panel function is embedded in a liquid crystal pixel) or an On-cell type touch screen (refer to embedding a touch panel function into a color filter)
  • the structure between the substrate and the polarizing plate can also be formed by an external touch screen, that is, a touch panel and a display panel 61 are disposed, and the touch panel is disposed on the cover 8 and the display panel 61.
  • the touch circuit layer (the circuit layer for sensing the gesture of the user) of the touch panel may be formed on the cover 8 such that the touch panel and the cover 8 form an integrated structure,
  • the display screen 6 forms an integrated structure with the cover plate 8.
  • the second portion 72 and the second connecting plate 42 are respectively disposed on two sides of the device 1.
  • the third circuit board 7 and the first circuit board 4 are respectively disposed on opposite sides of the device 1 to fully utilize the internal space of the mobile terminal 100.
  • the second portion 72 may also be stacked with the second connecting plate 42.
  • the second connecting plate 42 is disposed to fit the circumferential side 12 .
  • the first circuit board 4 is partially disposed to fit the device 1, and the space between the first circuit board 4 and the device 1 can be omitted, thereby reducing the overall width of the mobile terminal 100.
  • the first circuit board 4 and the device 1 may be assembled together, and then the first circuit board 4 and the main circuit board 2 and the auxiliary circuit board 3 are connected.
  • the second segment 52 of the second circuit board 5 is disposed to fit the second connecting plate 42.
  • the third circuit board 7 and the first circuit board 4 are respectively disposed on opposite sides of the device 1, and the third circuit board 7 is disposed on the circumferential side 12 of the device 1.
  • the mobile terminal 100 further includes a housing 9 , and the device 1 and the first circuit board 4 are both disposed inside the housing 9 .
  • the housing 9 can include a front housing and/or a rear housing.
  • the second connecting plate 42 is disposed to fit the inner wall of the casing 9.
  • the first circuit board 4 is partially disposed on the inner wall of the casing 9, and the space between the first circuit board 4 and the casing 9 can be omitted, thereby reducing the mobile terminal 100.
  • the first circuit board 4 can be assembled with the housing 9 and then the device 1 can be loaded into the interior of the housing 9.
  • the second circuit board 5 and the third circuit board 7 are both disposed inside the housing 9 .
  • the second segment 52 of the second circuit board 5 is disposed to fit the second connecting plate 42.
  • the third circuit board 7 and the first circuit board 4 are respectively disposed on opposite sides of the device 1, and the third circuit board 7 is disposed on the inner wall of the housing 9.

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Abstract

一种移动终端，包括器件、主电路板、辅电路板以及第一电路板。第一电路板包括一体成型并依次连接的第一连接板、第二连接板以及第三连接板。第一连接板连接主电路板，第三连接板连接辅电路板。器件包括相对设置的两个表面及连接于两个表面之间的周侧面。主电路板、第二连接板以及辅电路板围绕周侧面设置，第二连接板的布线面面向周侧面设置。所述移动终端整机厚度较薄。

Description

移动终端
本申请要求于2017年1月25日递交的申请号201710061353.6的中国专利申请的优先权，其全部内容以引入的方式并入本文本中。
技术领域
本申请涉及通信设备技术领域，尤其涉及一种移动终端。
背景技术
在智能手机等移动终端中，有时候会使用多块印刷电路板(Printed Circuit Board，PCB)。当手机中的印刷电路板不止一块时，各块印刷电路板之间就需要构建连接来进行数据和能量的通信。
目前多数智能手机都采用三段式的设计架构，在电池上端设置主板，在电池下端设置小板，采用柔性电路板(Flexible Printed Circuit，FPC)连接主板和小板，柔性电路板跨设在电池的上表面位置或下表面位置，也即设于显示屏与电池之间或电池与后盖之间。如此一来，柔性电路板设置在智能手机的厚度方向，不可避免地增加了智能手机的整体厚度，不利于智能手机的轻薄化发展。
发明内容
本申请实施例所要解决的技术问题在于提供一种整机厚度较薄的移动终端。
为了实现上述目的，本申请实施方式采用如下技术方案：
本申请实施例提供了一种移动终端，包括器件、主电路板、辅电路板以及第一电路板。所述第一电路板包括一体成型并依次连接的第一连接板、第二连接板以及第三连接板。所述第一连接板连接所述主电路板，所述第三连接板连接所述辅电路板。所述器件包括相对设置的两个表面及连接于所述两个表面之间的周侧面。所述主电路板、所述第二连接板以及所述辅电路板围绕所述周侧面设置，所述第二连接板的布线面面向所述周侧面设置。
在本实施方式中，由于所述第一电路板的所述第二连接板围绕所述周侧面设置，因此所述第二连接板设置在所述移动终端的宽度方向，减少了所述移动终端在其厚度方向上的器件数量，从而能够充分利用所述移动终端在其宽度方向上的空间，节约所述移动终端在其厚度方向上的空间，有利于降低所述移动终端的整机厚度(可降低0.1mm～0.2mm，甚至更多)，所述移动终端的整机厚度较薄。由于所述第二连接板的布线面面向所述周侧面设置，因此所述第二连接板在所述移动终端的宽度方向上的尺寸为所述第二连接板的厚度，所述第二连接板的厚度较小，因此所述移动终端的整机宽度所增加的尺寸比例很小，使得所述移动终端仍具有较佳的用户体验感。
可以理解的，由于所述移动终端减少了在其厚度方向上的器件数量，降低了整机厚度，因此降低了所述移动终端的前壳和/或后壳的设计难度和加工难度，有利于简化所述移动终端的前壳和/或后壳的结构和加工工序，降低所述移动终端的生产成本。
其中，所述第二连接板的布线面与所述周侧面的靠近所述第二连接板的侧面之间大致平行，使得所述第二连接板在所述移动终端的宽度方向上所占据的空间较小，有利于合理 控制所述移动终端的整机宽度尺寸。
在其他实施方式中，所述第二连接板的布线面与所述周侧面的靠近所述第二连接板的侧面之间可形成小于等于15°的夹角，以降低所述移动终端的组装难度。
其中，所述第一连接板与所述第二连接板之间构成翻折结构。换言之，所述第一连接板相对所述第二连接板翻折，所述第一连接板的布线面不平行于所述第二连接板的布线面。此时，所述第一连接板可顺利搭接在所述主电路板的表面(例如用于承载元器件的表面)上。所述第一连接板的布线面可大致平行于所述主电路板的表面，以降低所述第一电路板与所述主电路板的组装工艺难度。
所述第一连接板远离所述第二连接板的末端可通过连接器连接所述主电路板。所述连接器可为ZIF(Zero Insertion Force，零插入力)连接器或BTB(Board to board，板对板)连接器。
其中，所述第三连接板与所述第二连接板之间构成翻折结构。换言之，所述第三连接板相对所述第二连接板翻折，所述第三连接板的布线面不平行于所述第二连接板的布线面。此时，所述第三连接板可顺利搭接在所述辅电路板的表面(例如用于承载元器件的表面)上。所述第三连接板的布线面可大致平行于所述辅电路板的表面，以降低所述第三电路板与所述辅电路板的组装工艺难度。
所述第三连接板远离所述第二连接板的末端可通过连接器连接所述辅电路板。所述连接器可为ZIF(Zero Insertion Force，零插入力)连接器或BTB(Board to board，板对板)连接器。
其中，所述第一电路板为两层板或多层板。所述第一电路板的层数可依据传输需求进行设置。
在一种实施方式中，所述第二连接板包括在所述移动终端的宽度方向上层叠设置的第一子连接板和第二子连接板，所述第一子连接板的两端分别连接所述第二子连接板的两端。此时，所述第一子连接板的中间段(连接在所述第一子连接板的两端之间)与所述第二子连接板的中间段(连接在所述第二子连接板的两端之间)之间镂空设置，彼此不连接，从而有利于所述第二连接板的折叠和成型。所述第一子连接板和所述第二子连接板的层结构设置与所述第一连接板相同。
在本实施方式中，由于所述第二连接板的导电走线可排布在所述第一子连接板和所述第二子连接板内，也即所述第一子连接板和所述第二子连接板均可实现信号传输，因此即使所述第二连接板在所述移动终端的厚度方向上的尺寸受到限制，所述第二连接板也可通过增加在所述移动终端的宽度方向上的走线层数，来保证或提高所述第二连接板的传输能力。
可以理解的，所述第二连接板还包括端部连接板，用于一一对应地连接所述第一子连接板的两端和所述第二子连接板的两端，所述端部连接板与所述第一子连接板和所述第二子连接板一体成型。
其中，所述第一电路板可为软性电路板、软硬结合电路板或硬性电路板。所述第一电路板为软性电路板时，可在所述第二连接板的中间区域形成缝隙，而后沿缝隙折叠以形成层叠设置的第一子连接板和第二子连接板。
其中，所述第二连接板还包括第三子连接板，所述第三子连接板与所述第二子连接板层叠设置。所述第三子连接板设于所述第二子连接板远离所述第一子连接板的一侧，或所述第三子连接板设于所述第二子连接板与所述第一子连接板之间。所述第三子连接板的两端分别连接所述第二子连接板的两端(和所述第一子连接板的两端)。此时，所述第二连接板的导电走线可排布在所述第一子连接板、所述第二子连接板以及所述第三子连接板内。
其中，所述第一子连接板的一端连接所述第一连接板，所述第二子连接板远离所述第一连接板的一端连接所述第三连接板。由于所述第一子连接板的两端分别连接所述第二子连接板的两端，因此连接于所述第一子连接板的一端的所述第一连接板可通过所述第一子连接板和所述第二子连接板传输信号，连接于所述第二子连接板的一端的所述第三连接板可通过所述第一子连接板和所述第二子连接板传输信号。
在本实施方式中，所述第一电路板展平后，所述第一连接板、所述第二连接板以及所述第三连接板大致构成Z字型板，有利于提高拼板利用率，从而降低所述第一电路板的成本。
在一种实施方式中，所述移动终端还包括第二电路板。所述第二电路板包括一体成型并依次连接的第一段、第二段以及第三段。所述主电路板上设有射频电路，所述辅电路板上设有天线馈点，所述第一段连接所述主电路板以电连接至所述射频电路，所述第三段连接所述辅电路板以电连接至所述天线馈点，所述第二段围绕所述周侧面设置。
可以理解的，所述第二电路板可采用与所述第一电路板相同或相似的结构，所述第一段可采用与所述第一连接板相同或相似的结构，所述第二段可采用与所述第二连接板相同或相似的结构，所述第三段可采用与所述第三连接板相同或相似的结构。
在本实施方式中，由于所述第二电路板用于连接所述射频电路板和天线馈点，因此所述移动终端的天线组件的射频线排布在所述第二电路板上，利用所述第二电路板的层叠设置和走线设置来控制射频线的阻抗，从而能够省去同轴线缆，降低所述移动终端的整机厚度。
其中，所述第二电路板还包括第四段和第五段。所述第四段连接于所述第二段连接所述第一段的一端，所述第四段与所述第一段间隔设置。所述第五段连接于所述第二段连接所述第三段的一端，所述第五段与所述第三段间隔设置。所述第四段连接所述主电路板，所述第五段连接所述辅电路板。所述第四段可采用与所述第一段相同或相似的结构，所述第五段可采用与所述第三段相同或相似的结构。
在本实施方式中，所述第四段与所述第一段彼此隔离，用于连接在所述主电路板的不同位置或器件，所述第五段和所述第三段彼此隔离，用于连接在所述辅电路板的不同位置或器件，因此所述第二电路板可同时用于传输不同的信号。
其中，所述第二段包括彼此隔离的第一走线和第二走线，所述第一走线连接所述第一段和所述第三段，所述第二走线连接所述第四段和所述第五段。此时，所述第一走线和所述第二走线可用于传输不同的信号。
其中，所述第一段与所述主电路板之间通过第一连接器连接，所述第四段与所述主电路板之间通过第二连接器连接，所述第一连接器的类型与所述第二连接器的类型不同。由于所述第一段与所述第四段用于传输不同的信号，因此通过不同类型的连接器进行连接能 够更好地实现信号传输。
其中，所述第二段与所述第二连接板层叠设置。
在一种实施方式中，所述移动终端还包括显示屏和第三电路板，所述显示屏与所述器件层叠设置。所述显示屏包括显示面板和电连接所述显示面板的柔性电路板，所述柔性电路板电连接所述辅电路板。所述第三电路板包括一体成型的第一部分、第二部分以及第三部分，所述第一部分连接所述主电路板，所述第三部分连接所述辅电路板以电连接至所述柔性电路板，所述第二部分围绕所述周侧面设置。在本实施方式中，所述第三电路板用于实现所述主板与所述显示面板之间的通讯。
可以理解的，所述第三电路板可采用与所述第一电路板相同或相似的结构，所述第一部分可采用与所述第一连接板相同或相似的结构，所述第二部分可采用与所述第二连接板相同或相似的结构，所述第三部分可采用与所述第三连接板相同或相似的结构。
其中，所述第二部分与所述第二连接板分别设于所述器件的两侧。
在一种实施方式中，所述第二连接板贴合所述周侧面设置。此时，所述第一电路板部分贴合所述器件设置，能够省去所述第一电路板与所述器件之间的空间，从而降低所述移动终端的整机宽度。
其中，所述第二电路板的所述第二段贴合所述第二连接板设置。
在一种实施方式中，所述移动终端还包括壳体，所述器件与所述第一电路板均设于所述壳体内部。所述第二连接板贴合所述壳体的内壁设置。此时，所述第一电路板部分贴合所述壳体的内壁设置，能够省去所述第一电路板与所述壳体之间的空间，从而降低所述移动终端的整机宽度。
其中，所述第二电路板和所述第三电路板均设置在所述壳体内部。所述第二电路板所述第二段贴合所述第二连接板设置。所述第三电路板与所述第一电路板分别设置在所述器件的相对两侧，所述第三电路板贴合所述壳体的内壁设置。
附图说明
图1是本申请实施例提供一种移动终端的结构示意图。
图2是图1中沿Ⅱ-Ⅱ线处结构的剖视图。
图3是图1所示移动终端的部分结构的示意图。
图4是图3所示结构的部分分解图一。
图5是图3所示结构的部分分解图二。
图6是图3所示结构的部分分解图三。
图7是图1所示移动终端的第一电路板的一种实施方式的结构示意图。
图8是图7所示第一电路板的部分结构示意图。
图9是图7所示第一电路板在展平状态的结构示意图。
图10是图1所示移动终端的第一电路板的另一种实施方式在展平状态的结构示意图。
图11是图1所示移动终端的第二电路板的结构示意图。
图12是图11所示第二电路板在展平状态的结构示意图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
请一并参阅图1至图9，本申请实施例提供一种移动终端100。所述移动终端100可以是手机、平板电脑、笔记本电脑、可穿戴设备等。
所述移动终端100包括器件1、主电路板2、辅电路板3以及第一电路板4。所述第一电路板4包括一体成型并依次连接的第一连接板41、第二连接板42以及第三连接板43。所述第一连接板41连接所述主电路板2，所述第三连接板43连接所述辅电路板3。所述第一电路板4内导电走线依次经过所述第一连接板41、所述第二连接板42以及所述第三连接板43。所述导电走线连接所述主电路板2和所述辅电路板3，从而实现所述主电路板2与所述辅电路板3之间的通信。所述器件1包括相对设置的两个表面11及连接于所述两个表面11之间的周侧面12。所述两个表面11大致平行设置。所述两个表面11之间的距离远小于所述周侧面12的两个相对侧面之间的间距，所述移动终端100的厚度方向X大致垂直于所述两个表面11。所述主电路板2、所述第二连接板42以及所述辅电路板3围绕所述周侧面12设置，所述第二连接板42的布线面420面向所述周侧面12设置。
具体而言，所述主电路板2、所述第二连接板42以及所述辅电路板3均布置在所述周侧面12的周边，所述主电路板2可靠近所述周侧面12的上侧面121设置，所述辅电路板3可靠近所述周侧面12的下侧面122设置，所述第二连接板42可靠近所述周侧面12的左侧面123或右侧面124设置。所述移动终端100的宽度方向Y大致平行于所述两个表面11并大致垂直于所述左侧面123或所述右侧面124。所述主电路板2的用于承载元器件的表面21大致平行于所述两个表面11，所述主电路板2的靠近所述器件1的表面面向所述上侧面121设置。所述辅电路板3的用于承载元器件的表面31大致平行于所述两个表面11，所述辅电路板3的靠近所述器件1的表面面向所述下侧面122设置。所述第二连接板42的布线面420是指所述第二连接板42的用于排布导电走线的面，所述第二连接板42的布线面420面向所述左侧面123或右侧面124设置。所述第二连接板42的厚度方向垂直于所述第二连接板42的布线面420。本申请中所提到的方向用语，例如，“上”、“下”、“左”、“右”等，仅是参考附图的方向，因此上述方向用语并不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，不能理解为对本申请的限制。
在本实施例中，由于所述第一电路板4的所述第二连接板42围绕所述周侧面12设置，因此所述第二连接板42设置在所述移动终端100的宽度方向Y，减少了所述移动终端100在其厚度方向X上的器件数量，从而能够充分利用所述移动终端100在其宽度方向Y上的空间，节约所述移动终端100在其厚度方向X上的空间，有利于降低所述移动终端100的整机厚度(可降低0.1mm～0.2mm，甚至更多)，所述移动终端100的整机厚度较薄。由于所述第二连接板42的布线面420面向所述周侧面12设置，因此所述第二连接板42在所述移动终端100的宽度方向Y上的尺寸为所述第二连接板42的厚度，所述第二连接板42的厚度较小，因此所述移动终端100的整机宽度所增加的尺寸比例很小，使得所述移动终端100仍具有较佳的用户体验感。
可以理解的，由于所述移动终端100减少了在其厚度方向X上的器件数量，降低了整机厚度，因此降低了所述移动终端100的前壳和/或后壳的设计难度和加工难度，有利于简化 所述移动终端100的前壳和/或后壳的结构和加工工序，降低所述移动终端100的生产成本。
可以理解的，当部分所述第二连接板42伸入所述主电路板2与所述器件1之间的第一缝隙，以方便所述第一连接板41连接至所述主电路板2时，伸入所述第一缝隙的所述第二连接板42的布线面420面向所述上侧面121设置。当部分所述第二连接板42伸入所述辅电路板3与所述器件1之间的第二缝隙，以方便所述第三连接板43连接至所述辅电路板3时，伸入所述第二缝隙的所述第二连接板42的布线面420面向所述下侧面122设置。
可以理解的，所述器件1可以为布置在所述主电路板2与所述辅电路板3之间的任意部件，本申请以所述器件1为电池为例进行说明。在所述移动终端100的厚度方向X上，所述第二连接板42的尺寸小于等于所述器件1的尺寸，从而避免所述第二连接板42增加所述移动终端100的整机厚度。
可选的，所述第二连接板42的布线面420与所述周侧面12的靠近所述第二连接板42的侧面(例如所述左侧面123或所述右侧面124)之间大致平行，使得所述第二连接板42在所述移动终端100的宽度方向Y上所占据的空间较小，有利于合理控制所述移动终端100的整机宽度尺寸。
在其他实施方式中，所述第二连接板42的布线面420与所述周侧面12的靠近所述第二连接板42的侧面(例如所述左侧面123或所述右侧面124)之间可形成小于等于15°的夹角，以降低所述移动终端100的组装难度。
可选的，所述第一连接板41与所述第二连接板42之间构成翻折结构。换言之，所述第一连接板41相对所述第二连接板42翻折，所述第一连接板41的布线面(用于排布导电走线的面)不平行于所述第二连接板42的布线面420。此时，所述第一连接板41可顺利搭接在所述主电路板2的表面(例如用于承载元器件的表面21)上。所述第一连接板41的布线面可大致平行于所述主电路板2的表面，以降低所述第一电路板4与所述主电路板2的组装工艺难度。
所述第一连接板41远离所述第二连接板42的末端可通过连接器411连接所述主电路板2。所述连接器411可为ZIF(Zero Insertion Force，零插入力)连接器或BTB(Board to board，板对板)连接器。
可选的，所述第三连接板43与所述第二连接板42之间构成翻折结构。换言之，所述第三连接板43相对所述第二连接板42翻折，所述第三连接板43的布线面(用于排布导电走线的面)不平行于所述第二连接板42的布线面420。此时，所述第三连接板43可顺利搭接在所述辅电路板3的表面(例如用于承载元器件的表面31)上。所述第三连接板43的布线面可大致平行于所述辅电路板3的表面，以降低所述第三电路板7与所述辅电路板3的组装工艺难度。
所述第三连接板43远离所述第二连接板42的末端可通过连接器431连接所述辅电路板3。所述连接器431可为ZIF(Zero Insertion Force，零插入力)连接器或BTB(Board to board，板对板)连接器。
可选的，所述第一电路板4为两层板或多层板。所述第一电路板4的层数可依据传输需求进行设置。
请一并参阅图6至图10，作为一种可选实施例，所述第二连接板42包括在所述移动终端100的宽度方向Y上层叠设置的第一子连接板421和第二子连接板422。所述第一子连接板421的两端4211分别连接所述第二子连接板422的两端4221。此时，所述第一子连接板421 的中间段4212(连接在所述第一子连接板421的两端4211之间)与所述第二子连接板422的中间段4222(连接在所述第二子连接板422的两端4221之间)之间镂空设置，彼此不连接，从而有利于所述第二连接板42的折叠和成型。所述第一子连接板421和所述第二子连接板422的层结构设置与所述第一连接板41相同。
在本实施例中，由于所述第二连接板42的导电走线可排布在所述第一子连接板421和所述第二子连接板422内，也即所述第一子连接板421和所述第二子连接板422均可实现信号传输，因此即使所述第二连接板42在所述移动终端100的厚度方向X上的尺寸受到限制，所述第二连接板42也可通过增加在所述移动终端100的宽度方向Y上的走线层数，来保证或提高所述第二连接板42的传输能力。
可以理解的，所述第二连接板42还包括端部连接板423，用于一一对应地连接所述第一子连接板421的两端4211和所述第二子连接板422的两端4221，所述端部连接板423与所述第一子连接板421和所述第二子连接板422一体成型。
可选的，所述第一电路板4可为软性电路板、软硬结合电路板或硬性电路板。所述第一电路板4为软性电路板时，可在所述第二连接板42的中间区域形成缝隙，而后沿缝隙折叠以形成层叠设置的第一子连接板421和第二子连接板422。
可选的，所述第二连接板42还包括第三子连接板424，所述第三子连接板424与所述第二子连接板422层叠设置。所述第三子连接板424设于所述第二子连接板422远离所述第一子连接板421的一侧，所述第三子连接板424的两端4241分别连接所述第二子连接板422的两端4221。此时，所述第二连接板42的导电走线可排布在所述第一子连接板421、所述第二子连接板422以及所述第三子连接板424内。
可选的，所述第一子连接板421的一端连接所述第一连接板41，所述第二子连接板422远离所述第一连接板41的一端连接所述第三连接板43。由于所述第一子连接板421的两端4211分别连接所述第二子连接板422的两端4221，因此连接于所述第一子连接板421的一端的所述第一连接板41可通过所述第一子连接板421和所述第二子连接板422传输信号，连接于所述第二子连接板422的一端的所述第三连接板43可通过所述第一子连接板421和所述第二子连接板422传输信号。
在本实施例中，所述第一电路板4展平后，所述第一连接板41、所述第二连接板42以及所述第三连接板43大致构成Z字型板，有利于提高拼板利用率，从而降低所述第一电路板4的成本。
请一并参阅图2至图12，作为一种可选实施例，所述移动终端100还包括第二电路板5。所述第二电路板5包括一体成型并依次连接的第一段51、第二段52以及第三段53。所述主电路板2上设有射频电路22，所述辅电路板3上设有天线馈点23，所述第一段51连接所述主电路板2以电连接至所述射频电路22，所述第三段53连接所述辅电路板3以电连接至所述天线馈点23，所述第二段52围绕所述周侧面12设置。
可以理解的，所述第二电路板5可采用与所述第一电路板4相同或相似的结构，所述第一段51可采用与所述第一连接板41相同或相似的结构，所述第二段52可采用与所述第二连接板42相同或相似的结构，所述第三段53可采用与所述第三连接板43相同或相似的结构。
在本实施例中，由于所述第二电路板5用于连接所述射频电路22板和天线馈点23，因此 所述移动终端100的天线组件的射频线排布在所述第二电路板5上，利用所述第二电路板5的层叠设置和走线设置来控制射频线的阻抗，从而能够省去同轴线缆，降低所述移动终端100的整机厚度。
可选的，所述第二电路板5还包括第四段54和第五段55。所述第四段54连接于所述第二段52连接所述第一段51的一端，所述第四段54与所述第一段51间隔设置。所述第五段55连接于所述第二段52连接所述第三段53的一端，所述第五段55与所述第三段53间隔设置。所述第四段54连接所述主电路板2，所述第五段55连接所述辅电路板3。所述第四段54可采用与所述第一段51相同或相似的结构，所述第五段55可采用与所述第三段53相同或相似的结构。
在本实施例中，所述第四段54与所述第一段51彼此隔离，用于连接在所述主电路板2的不同位置或器件，所述第五段55和所述第三段53彼此隔离，用于连接在所述辅电路板3的不同位置或器件，因此所述第二电路板5可同时用于传输不同的信号。
可以理解的，所述第一段51、所述第三段53、所述第四段54以及所述第五段55均与所述第二段52之间形成翻折结构，可通过优化所述第二电路板5的翻折结构的位置布局，实现有限空间下多层电路板的布局，使得所述第二电路板5实现更强的信号传输能力，优化所述移动终端100的内部结构排布。
可选的，所述第二段52包括彼此隔离的第一走线521和第二走线522，所述第一走线521连接所述第一段51和所述第三段53，所述第二走线522连接所述第四段54和所述第五段55。此时，所述第一走线521和所述第二走线522可用于传输不同的信号。例如，所述第一走线521可用于传输天线信号，所述第二走线522可用于传输所述主电路板2与所述辅电路板3之间的电源信号，此时所述第一电路板4可仅用于传输所述主电路板2与所述辅电路板3之间的数据信号(包括控制信号)，从而降低对所述第一电路板4传输需求。换言之，本申请的单个电路板(例如所述第一电路板4和所述第二电路板5)内可传输不同的信号，也可将传输需求较高的信号分在不同的电路板中进行传输，因此所述移动终端100的电路板走线排布更为灵活，也更能合理满足所述移动终端100的信号传输需求。
可选的，所述第一段51与所述主电路板2之间通过第一连接器511连接，所述第四段54与所述主电路板2之间通过第二连接器541连接，所述第一连接器511的类型与所述第二连接器541的类型不同。由于所述第一段51与所述第四段54用于传输不同的信号，因此通过不同类型的连接器进行连接能够更好地实现信号传输。当然，在其他实施例中，所述第一连接器511的类型与所述第二连接器541的类型也可以相同。
可选的，所述第二段52与所述第二连接板42层叠设置。此时，所述第二电路板5与所述第一电路板4大致层叠设置，所述第二电路板5与所述第一电路板4设置在所述器件1的同一侧，从而能够充分利用所述移动终端100的内部空间。当然，在其他实施方式中，所述第二段52与所述第二连接板42也可以设置在所述器件1的相对两侧，例如所述第二段52的布线面面对所述左侧面123设置，所述第二连接板42的布线面420面对所述右侧面124设置。
请一并参阅图1至图9，作为一种可选实施例，所述移动终端100还包括显示屏6和第三电路板7，所述显示屏6与所述器件1层叠设置，所述显示屏6的显示面大致平行于所述两个表面11。所述显示屏6包括显示面板61和电连接所述显示面板61的柔性电路板62，所述柔性 电路板62电连接所述辅电路板3。所述第三电路板7包括一体成型的第一部分71、第二部分72以及第三部分73，所述第一部分71连接所述主电路板2，所述第三部分73连接所述辅电路板3以电连接至所述柔性电路板62，所述第二部分72围绕所述周侧面12设置。在本实施例中，所述第三电路板7用于实现所述主电路板2与所述显示面板61之间的通信。
可以理解的，所述第三电路板7可采用与所述第一电路板4相同或相似的结构，所述第一部分71可采用与所述第一连接板41相同或相似的结构，所述第二部分72可采用与所述第二连接板42相同或相似的结构，所述第三部分73可采用与所述第三连接板43相同或相似的结构。
可选的，所述移动终端100还包括盖板8，所述盖板8贴合在所述显示屏6的远离所述器件1的表面上。所述盖板8为透明的硬质板件，从而能够对所述移动终端100的内部零件(例如所述显示屏6)起到良好的保护作用，并且能够实现良好的透光作用。所述盖板8可为玻璃盖板8。
可选的，所述显示屏6可采用In-cell式触摸屏(是指将触摸面板功能嵌入到液晶像素中的结构)或On-cell式触摸屏(是指将触摸面板功能嵌入到彩色滤光片基板和偏光板之间的结构)。在其他实施方式中，所述显示屏6也可采用外挂式触摸屏，也即由触摸面板和显示面板61层叠设置所形成，所述触摸面板设置在所述盖板8与所述显示面板61之间，所述触摸面板的触摸电路层(用于感应用户手势动作的电路层)可形成在所述盖板8上，从而使所述触摸面板与所述盖板8形成一体化结构，所述显示屏6与所述盖板8形成一体化结构。
可选的，所述第二部分72与所述第二连接板42分别设于所述器件1的两侧。此时，所述第三电路板7和所述第一电路板4分别设置在所述器件1的相对两侧，从而充分利用所述移动终端100的内部空间。当然，在其他实施方式中，所述第二部分72也可与所述第二连接板42层叠设置。
在一种实施方式中，所述第二连接板42贴合所述周侧面12设置。此时，所述第一电路板4部分贴合所述器件1设置，能够省去所述第一电路板4与所述器件1之间的空间，从而降低所述移动终端100的整机宽度。组装时，可先将所述第一电路板4与所述器件1组装在一起，然后再连接所述第一电路板4与所述主电路板2和所述辅电路板3。
可选的，所述第二电路板5的所述第二段52贴合所述第二连接板42设置。所述第三电路板7与所述第一电路板4分别设置在所述器件1的相对两侧，所述第三电路板7贴合所述器件1的所述周侧面12设置。
在另一种实施方式中，所述移动终端100还包括壳体9，所述器件1与所述第一电路板4均设于所述壳体9内部。所述壳体9可包括前壳和/或后壳。所述第二连接板42贴合所述壳体9的内壁设置。此时，所述第一电路板4部分贴合所述壳体9的内壁设置，能够省去所述第一电路板4与所述壳体9之间的空间，从而降低所述移动终端100的整机宽度。组装时，可先将所述第一电路板4与所述壳体9组装在一起，然后将所述器件1装入所述壳体9内部。
可选的，所述第二电路板5和所述第三电路板7均设置在所述壳体9内部。所述第二电路板5所述第二段52贴合所述第二连接板42设置。所述第三电路板7与所述第一电路板4分别设置在所述器件1的相对两侧，所述第三电路板7贴合所述壳体9的内壁设置。

Claims (15)

  1. 一种移动终端，其特征在于，包括器件、主电路板、辅电路板以及第一电路板，所述第一电路板包括一体成型并依次连接的第一连接板、第二连接板以及第三连接板，所述第一连接板连接所述主电路板，所述第三连接板连接所述辅电路板，所述器件包括相对设置的两个表面及连接于所述两个表面之间的周侧面，所述主电路板、所述第二连接板以及所述辅电路板围绕所述周侧面设置，所述第二连接板的布线面面向所述周侧面设置。
  2. 如权利要求1所述的移动终端，其特征在于，所述第一连接板与所述第二连接板之间构成翻折结构。
  3. 如权利要求2所述的移动终端，其特征在于，所述第一连接板搭接在所述主电路板的表面上。
  4. 如权利要求1～3任一项所述的移动终端，其特征在于，所述第二连接板包括层叠设置的第一子连接板和第二子连接板，所述第一子连接板的两端分别连接所述第二子连接板的两端。
  5. 如权利要求4所述的移动终端，其特征在于，所述第二连接板还包括第三子连接板，所述第三子连接板与所述第二子连接板层叠设置，所述第三子连接板设于所述第二子连接板远离所述第一子连接板的一侧或所述第二子连接板与所述第一子连接板之间。
  6. 如权利要求4所述的移动终端，其特征在于，所述第一子连接板的一端连接所述第一连接板，所述第二子连接板远离所述第一连接板的一端连接所述第三连接板。
  7. 如权利要求1～6任一项所述的移动终端，其特征在于，所述移动终端还包括第二电路板，所述第二电路板包括一体成型并依次连接的第一段、第二段以及第三段，所述主电路板上设有射频电路，所述辅电路板上设有天线馈点，所述第一段连接所述主电路板以电连接至所述射频电路，所述第三段连接所述辅电路板以电连接至所述天线馈点，所述第二段围绕所述周侧面设置。
  8. 如权利要求7所述的移动终端，其特征在于，所述第二电路板还包括第四段和第五段，所述第四段连接于所述第二段连接所述第一段的一端，所述第四段与所述第一段间隔设置，所述第五段连接于所述第二段连接所述第三段的一端，所述第五段与所述第三段间隔设置，所述第四段连接所述主电路板，所述第五段连接所述辅电路板。
  9. 如权利要求8所述的移动终端，其特征在于，所述第二段包括彼此隔离的第一走线和第二走线，所述第一走线连接所述第一段和所述第三段，所述第二走线连接所述第四段和所述第五段。
  10. 如权利要求8或9所述的移动终端，其特征在于，所述第一段与所述主电路板之间通过第一连接器连接，所述第四段与所述主电路板之间通过第二连接器连接，所述第一连接器的类型与所述第二连接器的类型不同。
  11. 如权利要求7～10任一项所述的移动终端，其特征在于，所述第二段与所述第二连接板层叠设置。
  12. 如权利要求1～11任一项所述的移动终端，其特征在于，所述移动终端还包括显示屏和第三电路板，所述显示屏与所述器件层叠设置，所述显示屏包括显示面板和电连接所 述显示面板的柔性电路板，所述柔性电路板电连接所述辅电路板，所述第三电路板包括一体成型的第一部分、第二部分以及第三部分，所述第一部分连接所述主电路板，所述第三部分连接所述辅电路板以电连接至所述柔性电路板，所述第二部分围绕所述周侧面设置。
  13. 如权利要求12所述的移动终端，其特征在于，所述第二部分与所述第二连接板分别设于所述器件的两侧。
  14. 如权利要求1～13任一项所述的移动终端，其特征在于，所述第二连接板贴合所述周侧面设置。
  15. 如权利要求1～13任一项所述的移动终端，其特征在于，所述移动终端还包括壳体，所述器件与所述第一电路板均设于所述壳体内部，所述第二连接板贴合所述壳体的内壁设置。
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