WO2018019132A1

WO2018019132A1 - Chip test fixture and chip test system

Info

Publication number: WO2018019132A1
Application number: PCT/CN2017/092833
Authority: WO
Inventors: 高琳; 王永康; 丁庆
Original assignee: 深圳市华讯方舟微电子科技有限公司; 华讯方舟科技有限公司
Priority date: 2016-07-27
Filing date: 2017-07-13
Publication date: 2018-02-01
Also published as: CN106093483B; CN106093483A

Abstract

A chip test fixture comprises a base (100) and a fine adjustment structure (210, 220). The base (100) is provided with an accommodating structure (310, 320). The accommodating structure (310, 320) is used for placing a calibration member (400) and a chip supporting plate (500), and can make the calibration member (400) and the chip supporting plate (500) in contact. The surface of chip supporting plate (500) is used for welding a to-be-tested microwave chip. The fine adjustment structure (210, 220) is mounted on the base (100), and is used for adjusting and fixing the positions of the calibration member (400) and the chip supporting plate (500). Accordingly, in the chip test fixture and the chip test system comprising the chip test fixture, the positions of the calibration member (400) and the chip supporting plate (500) can be adjusted and fixed by means of the accommodating structure (310, 320) and the fine adjustment structure (210, 220); after the calibration member (400) and the to-be-tested microwave chip on the chip supporting plate (500) are aligned and the calibration member (400) and the chip supporting plate (500) are fixed, a fixed state can be kept between the calibration member (400) and the to-be-tested microwave chip without manual operations, and in this way, the phenomenon of shaking caused by the manual operations can be avoided, and further, the test precision is improved and the microwave chip can also be prevented from being damaged.

Description

Chip test fixture and chip test system

[Technical Field]

The present invention relates to the field of microwave testing technology, and in particular to a chip test fixture and a chip test system.

【Background technique】

Generally, the microwave device is tested by connecting the positive electrode of the external DC power source to the bottom of the microwave chip, and the negative electrode to a calibration piece. At the same time, the calibration component is connected to the upper surface of the microwave chip, and the contact point and contact position of the calibration component and the microwave chip are manually controlled by a person to align the test port of the microwave chip with the calibration component.

However, the traditional test method has the following defects: (1) Although the human arm is placed on the table, it is inevitable to tremble due to physiological factors and the like. Then, the contact point between the calibration piece and the microwave chip changes accordingly, resulting in poor contact between the calibration piece and the microwave chip or scratching of the microwave chip; (2) because the person is made by experience The calibration piece is in contact with the surface of the microwave chip, so the test port of the microwave chip may not be aligned with the calibration piece during the test, thereby reducing the accuracy of the test.

[Summary of the Invention]

Based on this, it is necessary to provide a chip test fixture and a chip test system for how to improve the traditional test method to reduce the test accuracy due to human reasons.

A chip test fixture comprising a base and a fine adjustment structure; the base is provided with a receiving structure; the receiving structure is for placing a calibration piece and a chip holder, and the calibration piece and the chip can be The surface of the chip carrier is used for soldering the microwave chip to be tested; the fine adjustment structure is mounted on the base, and the fine adjustment structure is used for adjusting and fixing the position of the calibration piece and the chip carrier .

In one embodiment, the receiving structure includes a first groove and a second groove; the first groove communicates with the second groove, and an axis of the first groove and the second concave The projections of the axes of the grooves intersect on the same plane;

Wherein the first groove is for placing the chip carrier; the second groove is for placing the calibration piece.

In one of the embodiments, the second groove is blocked by the first groove at a position for fixing the chip carrier.

In one of the embodiments, the first groove has a depth greater than the second groove.

In one embodiment, the fine tuning structure includes a first trimming unit and a second trimming unit; the first trimming unit extends from outside the base into the first recess, and the first trimming unit a position for adjusting and fixing the chip carrier; the second trimming unit extends from the outside of the base into the second recess, and the second trimming unit is configured to adjust and fix the calibration piece s position.

In one embodiment, the first fine adjustment unit includes a first bolt and a second bolt; the first bolt and the second bolt respectively penetrate from the outside of the base to the first through the threaded hole in opposite directions Inside the groove.

In one embodiment, the second fine adjustment unit includes a third bolt and a fourth bolt; the third bolt and the fourth bolt respectively penetrate from the outside of the base to the second through the threaded hole in opposite directions Inside the groove.

In one embodiment, the chip test fixture further includes a positioning structure; the positioning structure is detachably mounted on the base, and the positioning structure is configured to control the calibration member to be perpendicular to the second The direction of the bottom surface of the groove remains stationary.

In one embodiment, the positioning structure includes a plurality of positioning units, each of the positioning units being located on a different side of the calibration member;

The positioning unit includes a supporting portion and a positioning portion; the positioning portion is mounted on the supporting portion, and the supporting portion is detachably mounted on the base; meanwhile, the positioning portion and the supporting portion The part constitutes a stepped structure.

A chip test system includes a calibration component, a chip carrier soldered with a microwave chip to be tested, and the chip test fixture described above.

The above chip test fixture and chip test system have the beneficial effects that in the chip test fixture and the chip test system, the receiving structure is used for placing the calibration piece and the chip holder, and the calibration piece can be brought into contact with the chip holder. At the same time, the fine adjustment structure is mounted on the base, and the fine adjustment structure is used to adjust and fix the position of the calibration piece and the chip holder.

Therefore, the chip test fixture and the chip test system can adjust and fix the position of the calibration piece and the chip holder by accommodating the structure and the fine adjustment structure. Therefore, after the calibration component is aligned with the microwave chip to be tested on the chip carrier and the calibration component is fixed to the chip carrier, the calibration component and the microwave chip to be tested can be kept in a fixed state without manual operation. Avoid the phenomenon of tremor caused by manual operation, thereby improving the accuracy of the test and avoiding damage to the microwave chip.

[Description of the Drawings]

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and those skilled in the art can obtain drawings of other embodiments according to the drawings without any creative work.

1 is a schematic structural diagram of a chip test system according to an embodiment;

Figure 2 is a front elevational view of the chip test system of the embodiment of Figure 1;

Figure 3 is a right side view of the chip test system of the embodiment of Figure 1;

Figure 4 is a front elevational view of the chip test system of the embodiment of Figure 1;

Figure 5 is an exploded view of the chip test system of the embodiment of Figure 1.

【detailed description】

In order to facilitate the understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the understanding of the present disclosure will be more fully understood.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning meaning meaning The terminology used herein is for the purpose of describing the particular embodiments, The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

An embodiment provides a chip test system, as shown in Figures 1 through 5. The chip test system includes a chip test fixture, a calibration member 400, and a chip carrier 500. The surface of the chip carrier 500 is used for soldering a microwave chip to be tested (not shown). The microwave chip to be tested is, for example, a microwave device such as an antenna. At the same time, the shape of the chip carrier 500 is adapted to the shape of the microwave chip to be tested in order to solder the microwave chip to be tested.

In this embodiment, as shown in FIG. 5, the chip carrier 500 includes a first pallet unit 510 and a second pallet unit 520, wherein the first pallet unit 510 is located on the second pallet unit 520, and is to be tested. The microwave chip is soldered to the first pallet unit 510. In addition, the smoothness of the surface of the chip carrier 500 should ensure that the microwave chip to be tested does not have scratches when sliding on its surface. At the same time, the chip carrier 500 is a conductor.

The calibration component 400 is a test accessory for a vector network analyzer and can be an opener, a shunt, a load, and an adapter. As shown in FIG. 5, in the present embodiment, the calibration member 400 includes a first dielectric plate 410, a second dielectric plate 420, and a microstrip line 430. The first dielectric plate 410 is vertically connected to the second dielectric plate 420. The microstrip line 430 is disposed on the second dielectric plate 420. The first dielectric plate 410 is provided with an SMA connector through hole 411. As shown in FIG. During the test, one end of the microstrip line 430 is electrically connected to the test port of the microwave chip to be tested, and the other end is connected to the coaxial SMA connector for connecting the vector network analyzer through the SMA connector through hole 411.

The chip test fixture is used to place the calibration component 400 and the chip carrier 500, and can finely adjust and fix the position of the calibration component 400 and the chip carrier 500, so that the calibration component 400 is aligned with the test port of the microwave chip to be tested. status. Specifically, the chip test fixture includes a base 100 and a fine adjustment structure.

The base 100 is provided with a receiving structure. The receiving structure is used to place the calibration member 400 and the chip carrier 500, and enables the calibration member 400 to be in contact with the chip carrier 500. In other words, the space for placing the calibration member 400 and the chip carrier 500 in the receiving structure is in communication, so that the calibration member 400 can be in contact with the chip carrier 500, thereby establishing the electrical connection between the calibration member 400 and the microwave chip to be tested. connection.

The fine adjustment structure is mounted on the base 100, and the fine adjustment structure is movable and can serve as a fastening. In this embodiment, the fine adjustment structure 200 is used to adjust and fix the position of the calibration member 400 and the chip carrier 500. Then, after the calibration component 400 is in an aligned state with the test port of the microwave chip to be tested, the position of the calibration component 400 and the chip carrier 500 is fixed by the fine adjustment structure, and then the test process can be performed without manual operation by a person.

Wherein, the movable portion of the fine adjustment structure can extend at least to the corresponding position for fixing the calibration member 400 and the chip carrier 500 in the receiving structure, so that the fine adjustment structure can respectively adjust the calibration member 400 and the chip holder 500, fixed. At the same time, the portion of the receiving structure that is in contact with the calibration member 400 and the chip carrier 500 should also ensure good interchangeability, thereby avoiding damage to the calibration member 400 and the chip carrier 500 due to the fine adjustment of the position.

In addition, the fine adjustment structure adjusts the position of the chip carrier 500 by contacting the side of the first pallet unit 510 in the chip carrier 500, so that the fine adjustment structure does not touch the microwave chip to be tested. At the same time, the fine adjustment structure adjusts the position of the calibration member 400 by contacting the outside of the first dielectric plate 410 of the calibration member 400, so that the fine adjustment structure also does not touch the microstrip line 430. In a particular trimming process, the fine tuning structure may first fine tune the chip carrier 500 and secure it to a location suitable for contacting the calibration component 400. At the same time, since the shape of the chip holder 500 may be various, the position of the calibration member 400 also changes, so the calibration member 400 is finely adjusted by using the fine adjustment structure, so that the microstrip line 430 in the calibration member 400 is The test ports of the microwave chip to be tested are aligned and connected.

Therefore, the chip test system can adjust and fix the positions of the calibration component 400 and the chip carrier 500 by accommodating the structure and the fine adjustment structure, so that the calibration component 400 is aligned with the microwave chip to be tested on the chip carrier 500 and After the calibration component 400 is fixed to the chip carrier 500, the calibration component 400 and the microwave chip to be tested can be kept in a fixed state without manual operation, thereby avoiding the phenomenon of shaking by manual operation, thereby improving the test. The accuracy can also avoid damage to the microwave chip.

Specifically, the receiving structure includes a first groove 310 and a second groove 320. The first groove 310 is used to place the chip carrier 500. The second groove 320 is for placing the calibration member 400. Therefore, the chip holder 500 and the calibration member 400 can be moved in the first groove 310 and the second groove 320 respectively, thereby facilitating adjustment of the chip holder 500 and the calibration member 400 by the fine adjustment structure. In addition, due to the limiting effect of the sidewalls of the first groove 310 and the second groove 320, the fine adjustment structure can be assisted to respectively restrict the positions of the chip tray 500 and the calibration member 400, and the structure of the calibration plate 400 is more convenient. design.

In addition, the first groove 310 communicates with the second groove 320, and the axis of the first groove 310 intersects the projection of the axis of the second groove 320 on the same plane. The axis of the first groove 310 is parallel to the length of the first groove 310. The axis of the second groove 320 is parallel to the length of the second groove 320. Therefore, the first groove 310 and the second groove 320 are arranged to intersect, and the chip holder 500 can be brought into contact with the calibration member 400 at the intersection between the first groove 310 and the second groove 320.

It can be understood that the receiving structure is not limited to one case including the first groove 310 and the second groove 320 as long as the calibration member 400 and the chip holder 500 can be finely adjusted and fixed by the fine adjustment structure. For example, the chip carrier 500 can also be placed in the recess, and the calibration member 400 can be placed on the surface of the base 100 while a suitable fine-tuning structure is provided to fine-tune the calibration member 400 with the test port of the microwave chip to be tested. Align and maintain the alignment.

Specifically, as shown in FIG. 5, the second groove 320 is partitioned by the first groove 310 at a position for fixing the chip carrier 500. In other words, the second groove 320 includes two broken sub-grooves. The two sub-grooves each include only three side walls and one bottom surface, that is, the two sub-grooves have no side walls on the side close to the first recess 310 and are open-shaped, so that the calibration member 400 has no side walls. This side of the chip can access the chip carrier 500.

Therefore, when testing the microwave chip to be tested having two test ports, one calibration component 400 may be placed in each of the two sub-grooves, so that the two calibration components 400 respectively correspond to the microwave chip to be tested. Test port alignment and establish electrical connections. In addition, if the microwave chip to be tested has only one test port, it is only necessary to place a calibration member 400 in one of the sub-grooves. Therefore, in the embodiment, the second groove 320 includes two broken sub-grooves, which have a wide range of application. At the same time, the first groove 310 and the second groove 320 are perpendicular to each other, and this design method is more convenient for the fine adjustment structure to be finely adjusted.

Further, as shown in FIG. 5, the depth of the first groove 310 is greater than that of the second groove 320. Therefore, the bottom surface of the second groove 320 is higher than the bottom surface of the first groove 310, so that a stepped structure is formed at the boundary between the first groove 310 and the second groove 320, which is equivalent to the first groove 310 The intersection of the two grooves 320 still has a side wall. Then, after the chip carrier 500 is fixed in the first groove 310, in the process of fine-tuning the position of the calibration member 400 after the fine adjustment structure, the chip carrier 500 can be avoided due to the limitation of the stepped structure. The movement is performed along the axial direction of the second groove 320, thereby improving the adjustment efficiency of the fine adjustment structure.

It can be understood that the relationship between the first recess 310 and the second recess 320 is not limited to the above, as long as the trimming structure 400 and the chip carrier 500 are fine-tuned and fixed. For example, if the microwave chip to be tested has only one test port, the second groove 320 can also include only one sub-groove. At this time, only one side of the first groove 310 communicates with the second groove 320, and the opposite one is opposite. The height can be increased on one side to limit the chip carrier 500. At this time, after the chip carrier 500 is fixed in the first recess 310, one end of the test port is disposed to face the sub-groove to contact the calibration member 400.

Alternatively, the depth of the first groove 310 may be equal to the second groove 320, and the fine adjustment structure is correspondingly disposed so that the chip pad 500 is adjusted in the first groove 310, and the fine adjustment structure is further aligned with the calibration component 400. When the position is finely adjusted, it is possible to control the chip carrier 500 from moving in the axial direction of the second groove 320.

Specifically, as shown in FIG. 5, the fine adjustment structure includes a first fine adjustment unit 210 and a second fine adjustment unit 220. The first trimming unit 210 penetrates from the outside of the base 100 into the first recess 310, and the first trimming unit 210 is used to adjust and fix the position of the chip tray 500. In the present embodiment, the first trimming unit 210 can reciprocate in the axial direction of the first groove 310, so that the position of the chip carrier 500 can be finely adjusted.

In this embodiment, the first fine adjustment unit 210 includes a first bolt 211 and a second bolt 212. The first bolt 211 and the second bolt 212 respectively penetrate from the outside of the base 100 into the first recess 310 through the threaded hole 110 in opposite directions. The first bolt 211 and the second bolt 212 are both parallel to the axis of the first groove 310. At the same time, the heads of the two bolts are located outside the base 100, and the end of the screw away from the head is located in the first groove 310, and the screws of the two bolts are directed opposite. The threaded hole 100 is provided with an internal thread, and the internal thread is matched with the external thread on the screw of the first bolt 211 and the second bolt 212.

Therefore, after the chip tray 500 is placed in the first recess 310, the first bolt 211 and the second bolt 212 are respectively located on opposite sides of the chip tray 500. Thereafter, by rotating the first bolt 211 and the second bolt 212, the chip holder 500 can be finely adjusted and fixed by the screw engagement between the screw hole 110 and the screw.

The second trimming unit 220 extends from the outside of the base 100 into the second recess 320, and the second trimming unit 220 is used to adjust and fix the position of the calibration member 400. In the present embodiment, the second trimming unit 220 can reciprocate in the axial direction of the second groove 320, so that the position of the calibration member 400 can be finely adjusted.

In this embodiment, the second fine adjustment unit 220 includes a third bolt 221 and a fourth bolt 222. The third bolt 221 and the fourth bolt 222 respectively penetrate from the outside of the base 100 into the second groove 320 through the threaded hole 110 in opposite directions. The third bolt 221 and the fourth bolt 222 are both parallel to the axis of the second groove 320. At the same time, the heads of the two bolts are located outside the base 100, and the end of the screw away from the head is located in the second groove 320, and the screws of the two bolts are directed opposite. The threaded hole 100 is provided with an internal thread, and the internal thread is matched with the external thread on the screw of the third bolt 221 and the fourth bolt 222.

Therefore, after the position of the chip carrier 500 is fixed, the calibration member 400 is placed in the second recess 320. Specifically, the two calibration members 400 can be respectively inserted into the two sub-grooves of the second recess 320. After that, by rotating the third bolt 221 and the fourth bolt 222, the positions of the two calibration members 400 can be finely adjusted by the cooperation of the screw hole 110 and the screw, and the calibration member 400 and the microwave chip to be tested are The position of the calibration member 400 is fixed after the test port is aligned.

Therefore, in the embodiment, only the four bolts are combined with the corresponding groove structure, the position of the calibration member 400 and the chip carrier 500 can be finely adjusted and fixed, the structure is simple, the production and operation are easy, and the disassembly is easy. It can be understood that the fine adjustment structure is not limited to the above one case, as long as the position of the calibration member 400 and the chip holder 500 is finely adjusted and fixed.

Further, as shown in FIG. 5, the chip test fixture further includes a positioning structure 600. The positioning structure 600 is detachably mounted on the base 100. At the same time, the positioning structure 600 is used to control the calibration member 400 to remain stationary in a direction perpendicular to the bottom surface of the second groove 320. Wherein, after the calibration component 400 is placed in the second recess 320, the positioning structure 600 is installed. In addition, the positioning structure 600 is fixed to the base 100 by screws, for example. Therefore, under the control of the positioning structure 600, the calibration member 400 will not be able to move up and down with respect to the bottom surface of the second groove 320, and the calibration member 400 can only be performed along the axis direction of the second groove 320 under the control of the fine adjustment structure. Move to make it easier to fine tune the calibration piece 400.

It can be understood that the chip test fixture is not limited to one case including the positioning structure 600 as long as the calibration member 400 cannot be moved up and down with respect to the bottom surface of the second groove 320. For example, the fine adjustment structure can also adopt an appropriate structural design to control the calibration member 400 to move up and down with respect to the bottom surface of the second recess 320. In this case, the positioning structure 600 need not be provided.

Specifically, as shown in FIG. 5, the positioning structure 600 includes a plurality of positioning units 610. Each positioning unit 610 is located on a different side of the calibration member 400. In addition, each of the positioning units 610 is located in a direction perpendicular to the axis of the second groove 320, thereby avoiding affecting the movement of the calibration member 400 in the axial direction of the second groove 320 under the control of the fine adjustment structure.

Wherein, in the case that the second groove 320 includes two sub-grooves, the positioning structure 600 may include four positioning units 610. Two of the positioning units 610 are respectively located on both sides of a calibration member 400 in a direction perpendicular to the axial direction of the second groove 320. The other two positioning units 610 are respectively located on both sides of the other calibration member 400 in a direction perpendicular to the axial direction of the second groove 320. At the same time, the four positioning units 610 are all close to the intersection between the first groove 310 and the second groove 320, as shown in FIG.

In addition, as shown in FIG. 5, the positioning unit 610 includes a positioning portion 611 and a support portion 612. The positioning portion 611 is mounted on the support portion 612, and the support portion 612 is detachably mounted on the base 100. At the same time, the positioning portion 611 and the support portion 612 form a stepped structure, for example, an inverted L shape, so that the calibration member 400 can be restricted from moving up and down in a direction perpendicular to the surface of the base 100. In addition, the positioning portion 611 and the supporting portion 612 are respectively provided with through holes, and corresponding holes are provided in the base 100 at the position where the positioning unit 610 is mounted, so that the positioning unit 610 is provided. It can be detachably attached to the base 100 by screws.

It can be understood that the specific structure of the positioning structure 600 is not limited to the above one, as long as it can be detachably mounted on the base 100, and the calibration member 400 is controlled to remain stationary in a direction perpendicular to the bottom surface of the second groove 320. can.

The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.

The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims

A chip test fixture, characterized in that the chip test fixture comprises a base and a fine adjustment structure; the base is provided with a receiving structure; the receiving structure is for placing a calibration piece and a chip holder, and the calibration piece can be made Contacting the chip carrier; the chip carrier surface is used for soldering the microwave chip to be tested; the fine adjustment structure is mounted on the base, and the fine adjustment structure is used for adjusting and fixing the calibration component and the chip The position of the pallet.
The chip test fixture according to claim 1, wherein the receiving structure comprises a first groove and a second groove; the first groove is in communication with the second groove, and the first groove The axis of the intersection intersects the projection of the axis of the second groove on the same plane;

Wherein the first groove is for placing the chip carrier; the second groove is for placing the calibration piece.
The chip test jig according to claim 2, wherein the second groove is partitioned by the first groove at a position for fixing the chip carrier.
The chip test fixture according to claim 2, wherein the first groove has a depth greater than the second groove.
The chip test fixture according to claim 2, wherein the fine adjustment structure comprises a first trimming unit and a second trimming unit; the first trimming unit penetrates from the outside of the base into the first recess And the first trimming unit is configured to adjust and fix a position of the chip carrier; the second trimming unit penetrates from the outside of the base into the second groove, and the second trimming unit is used To adjust and fix the position of the calibration member.
The chip test fixture according to claim 5, wherein the first trimming unit comprises a first bolt and a second bolt; the first bolt and the second bolt respectively pass through the threaded hole in opposite directions from the The outside of the base penetrates into the first recess.
The chip test fixture according to claim 5, wherein the second trimming unit comprises a third bolt and a fourth bolt; the third bolt and the fourth bolt respectively pass through the threaded hole in opposite directions from the The outer portion of the base penetrates into the second recess.
The chip test fixture according to claim 2, wherein the chip test fixture further comprises a positioning structure; the positioning structure is detachably mounted on the base, and the positioning structure is used to control the calibration The piece remains stationary in a direction perpendicular to the bottom surface of the second groove.
The chip test fixture according to claim 8, wherein the positioning structure comprises a plurality of positioning units, each of the positioning units being located on a different side of the calibration member;

The positioning unit includes a supporting portion and a positioning portion; the positioning portion is mounted on the supporting portion, and the supporting portion is detachably mounted on the base; meanwhile, the positioning portion and the supporting portion The part constitutes a stepped structure.
A chip test system comprising a calibration member, a chip holder soldered with a microwave chip to be tested, and a chip test fixture according to any one of claims 1 to 9.