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WO2017177905A1 - 一种安全封装的金属智能卡 - Google Patents

一种安全封装的金属智能卡 Download PDF

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Publication number
WO2017177905A1
WO2017177905A1 PCT/CN2017/080134 CN2017080134W WO2017177905A1 WO 2017177905 A1 WO2017177905 A1 WO 2017177905A1 CN 2017080134 W CN2017080134 W CN 2017080134W WO 2017177905 A1 WO2017177905 A1 WO 2017177905A1
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metal
smart card
antenna circuit
circuit module
epoxy resin
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PCT/CN2017/080134
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English (en)
French (fr)
Inventor
扶志力
柯重来
俞国良
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深圳市高福科技有限公司
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Publication of WO2017177905A1 publication Critical patent/WO2017177905A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to the field of metal smart card manufacturing such as metal bank cards, membership cards, and commemorative cards, and solves the problem that the IC chip module in the metal smart card is easily stolen and the information and functions in the IC chip are stolen.
  • the metal smart card is one of the widely used smart card products.
  • the card body is made of metal material, which is different from the conventional plastic card. It is characterized by weather resistance, reliability, longer card body life, more durable and complicated process. It is different from the conventional card making process and is a high-end, differentiated and lean product series in smart card products.
  • the security of the metal smart card is very important. If the information, data and functions of the smart card chip are deciphered, it will have a significant loss and impact on the application of the smart card, the system application party and the public.
  • Hackers and attackers may take various detection methods to obtain hardware security mechanisms, access control mechanisms, authentication mechanisms, data protection systems, storage partitions, design details of cryptographic module programs, and initialization data, private data, passwords, or cryptographic keys. Sensitive data, and may illegally obtain the right to use the smart card by modifying the smart card's important security data.
  • metal smart cards or PVC smart card products are conventionally coated with ordinary hot melt adhesives when packaging contact chip modules and dual interface chip antenna circuit modules.
  • the schematic diagram of the longitudinal section of the antenna circuit module package structure of the dual interface metal smart card is shown in Fig. 1.
  • the antenna circuit board 12 is combined with the IC chip 14 and its curing protection sealant 15 and the contact electrode 11 and the ultra-thin ferrite absorbing electromagnetic shielding layer 13 to form an antenna circuit module.
  • the metal material card body 17 is grooved and has an inner wall. Coated with a hot glue layer 16, when encapsulating, the antenna circuit module is hot pressed into the metal groove, after cooling and solidifying That is, the packaging of the metal smart card is completed.
  • the shortcomings of the existing metal smart card products in terms of safety are: due to the bonding of the common hot melt adhesive when the contact chip module and the dual interface chip antenna circuit module are packaged, it is easy for the attacker to artificially heat or mechanically force. Completely steal the chip module or the antenna circuit module, thereby illegally obtaining the chip storage information and functions.
  • the problem to be solved by the present application is to provide a packaging scheme that can effectively prevent the chip module or the antenna circuit module from being easily and completely stolen on the metal smart card.
  • the packaging method is as follows: firstly, the commonly used hot melt adhesive is changed into epoxy adhesive, and secondly, according to the principle of the crucible structure in ancient Chinese architecture, the packaging groove on the metal substrate is applied by CNC machining. The technology is milled into a dovetail shaped groove in the structure, and then the antenna circuit module is embedded in the dovetail groove of the metal card body, and epoxy resin glue is dropped to form a dovetail structure. Since the sealing material of the chip is also a resin material, the epoxy resin glue in the antenna circuit module and the metal tank body forms an integral dovetail, which is in the dovetail groove, so that the two cannot be completely separated.
  • a securely packaged metal smart card as claimed in the present application the antenna circuit and IC chip of the securely packaged metal smart card and the curing protection sealant thereof, and the contact electrode and the ultra-thin ferrite absorbing electromagnetic shielding layer
  • the antenna circuit module is combined and embedded in a groove of a metal material card body having a dovetail shape, and an epoxy resin glue layer is dropped on the inner wall.
  • the metal smart card of the security package is as described above, wherein the antenna circuit module is embedded in a groove of a dovetail shape of a metal material card body and dripped with epoxy glue, and the dovetail is formed after the epoxy resin is solidified.
  • the shape of the ⁇ structure is as described above, wherein the antenna circuit module is embedded in a groove of a dovetail shape of a metal material card body and dripped with epoxy glue, and the dovetail is formed after the epoxy resin is solidified.
  • the double encapsulation scheme of the strong bonding and twisting structure of the present application enables the hacker and the attacker to completely obtain the antenna circuit module and the IC chip from the metal smart card body, thereby ensuring the hardness of the metal smart card. The security of the piece.
  • FIG. 1 is a longitudinal cross-sectional exploded view of an antenna circuit module package structure of a conventional dual interface metal smart card
  • FIG. 2 is a schematic longitudinal cross-sectional structural view of a metal smart card of a security package according to the present application.
  • the present application provides a packaging scheme that can effectively prevent a chip module or an antenna circuit module from being easily and completely stolen on a metal smart card.
  • the packaging method is as follows: firstly, the commonly used hot melt adhesive is changed into epoxy adhesive, and secondly, according to the principle of the crucible structure in ancient Chinese architecture, the packaging groove on the metal substrate is applied by CNC machining. The technology is milled into a dovetail shaped groove in the structure, and then the antenna circuit module is embedded in the dovetail groove of the metal card body, and epoxy resin glue is dropped to form a dovetail structure. Since the sealing material of the chip is also a resin material, the epoxy resin glue in the antenna circuit module and the metal tank body forms an integral dovetail, which is in the dovetail groove, so that the two cannot be completely separated.
  • FIG. 2 is a schematic diagram showing a longitudinal sectional structure of a securely packaged metal smart card according to the present application.
  • the antenna circuit 12 and the IC chip 14 of the securely packaged metal smart card and the curing thereof are protected.
  • the sealant 15 and the contact electrode 11 and the ultra-thin ferrite absorbing electromagnetic shielding layer 13 are combined to form an antenna circuit module which is embedded in a recess 27 of a metal material card body having a dovetail shape, and the inner wall thereof is dripped Epoxy resin glue layer 26.
  • the metal smart card of the security package is as described above, wherein the antenna circuit module 12 is embedded in the groove 27 of the dovetail shape of the metal material card body and dripped with epoxy glue, and the epoxy resin glue is solidified. A dovetail shape is formed.
  • the double encapsulation scheme of the strong bonding and twisting structure of the present application makes it impossible for hackers and attackers to completely obtain the antenna circuit module 12 and the IC chip 14 from the metal smart card body, thereby ensuring the safety of the metal smart card hardware.
  • the specific implementation manner of a securely packaged metal smart card is as follows: firstly, an FPC/PCBA antenna circuit board, an IC chip, an NXP Mifare S50, a 0.2 mm ultra-thin titanium oxide absorbing electromagnetic shielding layer, and the like,
  • the antenna circuit module 12 is formed by curing and bonding by a resin glue.
  • a dovetail-shaped groove 27 is milled by CNC machining technology, and then an epoxy resin glue to which a curing agent has been added is dropped into the groove 27, and the epoxy value is about 0.25-0.45, model 634.
  • the antenna circuit module 12 is embedded in the dovetail-shaped metal recess 27, and the metal smart card packaging process is completed after the epoxy resin is cured.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

一种安全封装的金属智能卡，涉及金属智能卡等制造领域，公开了一种金属智能卡模块封装的新结构，首先，改常用的热熔胶粘接为环氧树脂胶粘接，其次，根据中国古代建筑中的榫卯结构原理，将金属卡体上的封装凹槽(27)，应用CNC技术，铣成榫卯结构中的燕尾榫形，然后，将天线电路模块(12)镶入金属卡体的燕尾榫形的槽中，滴入环氧树脂胶水，其固化后形成燕尾榫结构。由于芯片封胶也是树脂材料，因此，天线电路模块(12)和金属槽体中的环氧树脂胶便形成整体的燕尾榫，卯死在燕尾榫形的金属槽体中。通过强力粘接加榫卯结构的双重封装的结构，使得无法人为地从智能卡的卡体中完整地截取电路模块(12)和IC芯片(14)，提高了金属智能卡硬件和信息的安全性。

Description

一种安全封装的金属智能卡
本申请基于申请号为CN 2016203003966、申请日为2016年4月13日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
【技术领域】
本申请涉及金属银行卡、会员卡、纪念卡等金属智能卡制造领域，解决了金属智能卡中IC芯片模块容易被窃取而导致IC芯片中的信息和功能被盗用的问题。
【背景技术】
金属智能卡是广泛应用的智能卡产品中的一种，其卡体材质为金属材料制作，有别于常规塑料卡片。其特点是耐侯性、可靠性、卡体寿命会更长，更耐用且工艺复杂，有别于常规制卡工艺，是智能卡产品中的高端、差别化、精益化产品系列。
金属智能卡和PVC智能卡一样，其安全性是非常重要的问题，如果智能卡芯片的信息、数据、功能被破译，将对智能卡的应用者、系统应用方及大众产生重大损失和影响。黑客、攻击者可能采取各种探测方法以获取硬件安全机制、访问控制机制、鉴别机制、数据保护系统、存储体分区、密码模块程序的设计细节以及初始化数据、私有数据、口令或密码密钥等敏感数据，并可能通过修改智能卡重要安全数据的方法，非法获得对智能卡的使用权。
目前在智能卡制造行业中，金属智能卡或者PVC智能卡产品在封装接触式芯片模块及双界面芯片天线电路模块时，常规采用普通热熔胶进行粘接。双界面金属智能卡的天线电路模块封装结构纵向剖面分解示意图如图1所示。天线电路板12与IC芯片14及其固化保护封胶15以及接触式电极11和超薄铁氧体吸波电磁屏蔽层13组合构成天线电路模块，金属材质卡体17铣有凹槽，其内壁涂有溶热胶层16，封装时，将天线电路模块热压入金属凹槽中，冷却固化后 即完成金属智能卡的封装。
现有金属智能卡产品在安全性方面的缺点是：由于在封装接触式芯片模块以及双界面芯片天线电路模块时，采用普通热熔胶进行粘接，从而容易被攻击者人为加热或机械加力而完整的窃取芯片模块或天线电路模块，进而非法获取芯片存储信息及功能。
【发明内容】
本申请要解决的问题是：提供一种可以有效防止在金属智能卡上，轻易地完整地窃取芯片模块或天线电路模块的封装方案。其封装方法是，首先将常用的热熔胶粘接改为环氧树脂胶粘接，其次是根据中国古代建筑中的榫卯结构的原理，将金属材质基片上的封装凹槽，应用CNC加工技术铣成榫卯结构中的燕尾榫形状凹槽，然后将天线电路模块镶入金属卡体的燕尾榫形凹槽中，滴入环氧树脂胶水，使其固化后形成燕尾榫结构。由于芯片的封胶也是树脂材料，因此，天线电路模块和金属槽体中的环氧树脂胶形成了整体的燕尾榫，卯在燕尾形凹槽中，使二者无法完整分离。
本申请所提出的一种安全封装的金属智能卡，所述一种安全封装的金属智能卡的天线电路与IC芯片及其固化保护封胶，以及接触式电极和超薄铁氧体吸波电磁屏蔽层组合构成天线电路模块，其镶嵌入具有燕尾榫形状的金属材质卡体的凹槽中，其内壁滴有环氧树脂胶水层。
如上所述的一种安全封装的金属智能卡，其中，所述金属材质卡体燕尾榫形状的凹槽的内壁滴有环氧树脂胶水，其环氧值为0.25-0.45。
如上所述的一种安全封装的金属智能卡，其中，所述天线电路模块镶嵌入金属材质卡体所铣燕尾榫形状并滴有环氧树脂胶水的凹槽中，环氧树脂胶水固化以后形成燕尾形状的榫卯结构。
本申请通过强力粘接加榫卯结构的双重封装方案，使得黑客和攻击者无法从金属智能卡卡体中完整地获取天线电路模块及IC芯片，保证了金属智能卡硬 件的安全性。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为通常的双界面金属智能卡的天线电路模块封装结构纵向剖面分解示意图；
图2为本申请一种安全封装的金属智能卡的纵向剖面结构示意图。
【具体实施方式】
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。
本申请提供一种可以有效防止在金属智能卡上，轻易地完整地窃取芯片模块或天线电路模块的封装方案。其封装方法是，首先将常用的热熔胶粘接改为环氧树脂胶粘接，其次是根据中国古代建筑中的榫卯结构的原理，将金属材质基片上的封装凹槽，应用CNC加工技术铣成榫卯结构中的燕尾榫形状凹槽，然后将天线电路模块镶入金属卡体的燕尾榫形凹槽中，滴入环氧树脂胶水，使其固化后形成燕尾榫结构。由于芯片的封胶也是树脂材料，因此，天线电路模块和金属槽体中的环氧树脂胶形成了整体的燕尾榫，卯在燕尾形凹槽中，使二者无法完整分离。
本申请所提出的一种安全封装的金属智能卡的纵向剖面结构示意图如图2所示，所述一种安全封装的金属智能卡的天线电路12与IC芯片14及其固化保 护封胶15，以及接触式电极11和超薄铁氧体吸波电磁屏蔽层13组合构成天线电路模块，其镶嵌入具有燕尾榫形状的金属材质卡体的凹槽27中，其内壁滴有环氧树脂胶水层26。
如上所述的一种安全封装的金属智能卡，其中，所述金属材质卡体燕尾榫形状的凹槽的内壁滴有环氧树脂胶水，其环氧值为0.25-0.45。
如上所述的一种安全封装的金属智能卡，其中，所述天线电路模块12镶嵌入金属材质卡体所铣燕尾榫形状并滴有环氧树脂胶水的凹槽27中，环氧树脂胶水固化以后形成燕尾形状的榫卯结构。
本申请通过强力粘接加榫卯结构的双重封装方案，使得黑客和攻击者无法从金属智能卡卡体中完整地获取天线电路模块12及IC芯片14，保证了金属智能卡硬件的安全性。
本申请提供的一种安全封装的金属智能卡的具体实施方式如下：首先由FPC/PCBA天线电路板、IC芯片、NXP Mifare S50、厚度为0.2mm超薄钛氧体吸波电磁屏蔽层等组件，通过树脂胶固化粘接，组成天线电路模块12。
其次，在金属TC4钛合金卡体上，以CNC加工技术铣出一个燕尾榫形状的凹槽27，然后，在凹槽27内滴入已加入固化剂的环氧树脂胶，其环氧值约0.25-0.45，型号为634，最后，将天线电路模块12镶嵌入燕尾榫形状的金属凹槽27内，等待环氧树脂胶固化后即完成金属智能卡的封装过程。
上述实施例为本申请较佳的实施方式，但本申请的实施方式并不受上述实施例的限制，其他的任何未背离本申请的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本申请的保护范围之内。

Claims (4)

  1. 一种安全封装的金属智能卡，其特征在于：所述一种安全封装的金属智能卡的天线电路板与IC芯片及其固化保护封胶以及接触式电极和超薄铁氧体吸波电磁屏蔽层，共同组合构成天线电路模块，所述天线电路模块镶嵌入具有燕尾榫形状的金属材质卡体的凹槽中，所述凹槽内壁滴有环氧树脂胶水层。
  2. 如权利要求1所述一种安全封装的金属智能卡，其特征在于：所述金属材质卡体是以CNC加工技术铣出燕尾榫形状的凹槽。
  3. 如权利要求1所述一种安全封装的金属智能卡，其特征在于：所述金属材质卡体燕尾榫形状的凹槽的内壁滴有环氧树脂胶水层，所述环氧树脂胶水环氧值为0.25-0.45。
  4. 如权利要求1所述一种安全封装的金属智能卡，其特征在于：所述天线电路模块镶嵌入金属材质卡体所铣燕尾榫形状并滴有环氧树脂胶水的凹槽中，环氧树脂胶水固化以后形成燕尾榫形状的榫卯结构。
PCT/CN2017/080134 2016-04-13 2017-04-11 一种安全封装的金属智能卡 WO2017177905A1 (zh)

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CN110909852A (zh) * 2019-12-11 2020-03-24 朱小锋 安全封装金属智能卡的制作装置
WO2021092532A1 (en) * 2019-11-08 2021-05-14 Federal Card Services, LLC Contactless metal transaction cards, and a compound filled recess for embedding an electronic component
WO2023034642A1 (en) 2021-09-06 2023-03-09 Metaland Llc Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card
US12159180B1 (en) 2021-11-29 2024-12-03 Metaland Llc RFID enabled metal transaction cards with coupler coil couplings and related methods

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CN205563658U (zh) * 2016-04-13 2016-09-07 深圳市高福科技有限公司 一种安全封装的金属智能卡
CN106897766A (zh) * 2017-03-31 2017-06-27 金邦达有限公司 带ic芯片的智能卡及智能卡的制造方法
CN106991466A (zh) * 2017-04-07 2017-07-28 金邦达有限公司 双界面智能卡及其制造方法

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