WO2016163491A1 - 耐衝撃剥離接着性の改善されたポリマー微粒子含有硬化性樹脂組成物 - Google Patents
耐衝撃剥離接着性の改善されたポリマー微粒子含有硬化性樹脂組成物 Download PDFInfo
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- WO2016163491A1 WO2016163491A1 PCT/JP2016/061474 JP2016061474W WO2016163491A1 WO 2016163491 A1 WO2016163491 A1 WO 2016163491A1 JP 2016061474 W JP2016061474 W JP 2016061474W WO 2016163491 A1 WO2016163491 A1 WO 2016163491A1
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- 229910052623 talc Inorganic materials 0.000 description 1
- WMXCDAVJEZZYLT-UHFFFAOYSA-N tert-butylthiol Chemical compound CC(C)(C)S WMXCDAVJEZZYLT-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical group ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000012749 thinning agent Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical group OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
- 125000005065 undecenyl group Chemical group C(=CCCCCCCCCC)* 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
Definitions
- the present invention relates to a curable resin composition mainly composed of an epoxy resin, which is excellent in impact-resistant peel adhesion.
- the cured epoxy resin is excellent in many respects such as dimensional stability, mechanical strength, electrical insulation characteristics, heat resistance, water resistance, and chemical resistance.
- cured products of epoxy resins have low fracture toughness and may exhibit very brittle properties, and such properties are often a problem in a wide range of applications.
- Patent Document 1 discloses a technique in which polymer fine particles having a core-shell structure are dispersed in a curable resin composition containing a curable resin such as an epoxy resin as a main component.
- Adhesives using epoxy resin compositions having toughness and impact resistance are used in structural adhesives for vehicles, and in particular, the impact resistance peel adhesion strength described in ISO 11343 is emphasized. Improvement is desired.
- a curable resin composition containing, as a main component, polymer fine particles having a core-shell structure in which the core layer is a diene rubber and the shell layer has a hydroxy group, and a polyol used for polyurethane or the like is used as a main component. Dispersion techniques are disclosed.
- Patent Document 4 discloses that an impact resistance peel adhesion property is improved by combining a polymer fine particle having a core-shell structure and a reinforcing agent other than the core-shell polymer fine particle in an adhesive composition using an epoxy resin as a main component. Is described.
- Patent Documents 2 and 3 use polymer fine particles for polyol and polyisocyanate, and can be said to be essentially different from the technique of Patent Document 4 using an epoxy resin as a main component.
- Patent Document 4 describes that the polymer constituting the shell layer of the core-shell polymer fine particles preferably has a functional group capable of chemically reacting with an epoxy resin or an epoxy curing agent in the adhesive composition. There is.
- Patent Document 4 describes various functional groups such as an epoxy group, a hydroxy group, an amino group, an amide group, and a carboxy group.
- Patent Document 4 describes a design concept of a curable resin composition intended for chemical bonding between a functional group (hydroxy group) of a shell layer of a core-shell polymer fine particle and a reinforcing agent (blocked urethane). Absent.
- the present inventors in a curable resin composition containing an epoxy resin, polymer fine particles, and blocked urethane, have impact-resistant peel adhesion (for example, dynamic splitting resistance) having a shell layer component of polymer fine particles (
- the inventors have found that the hydroxyl group is changed depending on the amount thereof and the amount thereof, and have intensively studied the shell layer of the polymer fine particles.
- This invention is made
- the present inventors have found that the epoxy resin (A), the polymer fine particles (B) having a core-shell structure in which the core layer is a diene rubber, and the polymer fine particles (B )
- the shell layer has a hydroxyl group of 0.01 to 0.8 mmol / g (preferably 0.01 to 0.4 mmol / g)
- the gist of the present invention is as follows: [1] With respect to 100 parts by mass of the epoxy resin (A), the core layer is a diene rubber, the polymer fine particles (B) having a core-shell structure having a hydroxy group in the shell layer, 1 to 100 parts by mass, blocked urethane ( C) A curable resin composition containing 1 to 100 parts by mass, wherein the content of hydroxy groups in the polymer fine particles (B) is 0.01 to 0.8 mmol / g. Resin composition.
- the polymer fine particle (B) includes a monomer having a hydroxy group and at least one monomer selected from the group consisting of an aromatic vinyl monomer, a vinyl cyan monomer, and a (meth) acrylate monomer in the core layer.
- Curable resin composition as described in [1] which has a shell layer formed by graft polymerization.
- the epoxy resin (A) contains a reactive diluent of polyepoxide, and the amount of the reactive diluent is 0.5 to 20% by mass in 100% by mass of the epoxy resin (A) [1] to [5 ]
- the curable resin composition of the present invention can improve the impact resistance peel adhesion of the resulting cured product.
- the curable resin composition of the present invention can improve the impact-resistant peel adhesion of the resulting cured product, and can also suppress an increase in viscosity.
- the epoxy resin (A), the polymer fine particles (B), and the blocked urethane (C) may be represented by (A) component, (B) component, and (C) component, respectively.
- Epoxy resin (A) An epoxy resin (A) is used as a main component of the curable resin composition of the present invention.
- the epoxy resin various hard epoxy resins can be used except for the rubber-modified epoxy resin and the urethane-modified epoxy resin described later, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy.
- Epoxidized products of unsaturated polymers such as aminoglycidyl ether resins, epoxy compounds obtained by adding bisphenol A (or F) or polybasic acids to the above epoxy resins, etc.
- epoxy resins may be used which are commonly used.
- examples of the polyalkylene glycol diglycidyl ether include polyethylene glycol diglycidyl ether and polypropylene glycol diglycidyl ether. More specific examples of the glycol diglycidyl ether include neopentyl glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, cyclohexanedimethanol diglycidyl ether, and the like. It is done.
- the diglycidyl ester of the aliphatic polybasic acid include dimer acid diglycidyl ester, adipic acid diglycidyl ester, sebacic acid diglycidyl ester, and maleic acid diglycidyl ester.
- the glycidyl ether of the dihydric or higher polyhydric aliphatic alcohol includes trimethylolpropane triglycidyl ether, trimethylolethane triglycidyl ether, castor oil-modified polyglycidyl ether, propoxylated glycerin triglycidyl ether, sorbitol. And polyglycidyl ether.
- Examples of the epoxy compound obtained by adding a polybasic acid to an epoxy resin include a dimer of tall oil fatty acid (dimer acid) and a bisphenol A type epoxy as described in WO2010-098950 pamphlet, for example. An addition reaction product with resin is mentioned. These epoxy resins may be used alone or in combination of two or more.
- the polyalkylene glycol diglycidyl ether, the glycol diglycidyl ether, the diglycidyl ester of the aliphatic polybasic acid, and the glycidyl ether of the divalent or higher polyhydric aliphatic alcohol are epoxy resins having a relatively low viscosity.
- epoxy resin (A) preferably contains a reactive diluent of polyepoxide.
- the monoepoxide functions as a reactive diluent as described later, but is not included in the epoxy resin (A).
- the amount of the reactive diluent is preferably 0.5 to 20% by mass, more preferably 1 to 10% by mass, and more preferably 2 to 5% by mass, based on 100% by mass of the epoxy resin (A) component. Is more preferable.
- the polyepoxide reactive diluent is preferably polyalkylene glycol diglycidyl ether or glycol diglycidyl ether, such as polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6- Hexanediol diglycidyl ether is more preferable, and polypropylene glycol diglycidyl ether and 1,6-hexanediol diglycidyl ether are further preferable.
- polyalkylene glycol diglycidyl ether or glycol diglycidyl ether such as polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6- Hexanediol diglycidyl ether is more preferable, and polypropylene glycol diglycidyl ether
- the chelate-modified epoxy resin is a reaction product of an epoxy resin and a compound containing a chelate functional group (chelate ligand), and added to the curable resin composition of the present invention to be used as an adhesive for vehicles.
- adhesion to the surface of a metal substrate contaminated with an oily substance can be improved.
- the chelate functional group is a functional group of a compound having a plurality of coordination sites capable of coordinating with metal ions in the molecule, and includes, for example, phosphorus-containing acid groups (for example, —PO (OH) 2 ), carboxylic acid groups ( CO 2 H), sulfur-containing acid groups (for example, —SO 3 H), amino groups and hydroxyl groups (particularly, hydroxyl groups adjacent to each other in the aromatic ring).
- chelating ligands include ethylenediamine, bipyridine, ethylenediaminetetraacetic acid, phenanthroline, porphyrin, and crown ether.
- Examples of commercially available chelate-modified epoxy resins include Adeka Resin EP-49-10N manufactured by ADEKA.
- the amount of the chelate-modified epoxy resin used in 100% by mass of the epoxy resin (A) component is preferably 0.1 to 10% by mass, more preferably 0.5 to 3% by mass.
- these epoxy resins those having at least two epoxy groups in one molecule are preferable from the viewpoint of high reactivity and easy formation of a three-dimensional network upon curing.
- epoxy resins bisphenol A type epoxy resins and bisphenol F type epoxy resins are preferable because the obtained cured products have high elastic modulus, excellent heat resistance and adhesion, and are relatively inexpensive. Resins are particularly preferred.
- an epoxy resin having an epoxy equivalent of less than 220 is preferable because the resulting cured product has high elastic modulus and heat resistance, and the epoxy equivalent is preferably 90 or more and 210 or less, more preferably 150 or more and 200 or less. Is more preferable.
- a bisphenol A type epoxy resin or a bisphenol F type epoxy resin having an epoxy equivalent of less than 220 is preferable because it is liquid at room temperature and the curable resin composition obtained is easy to handle.
- a bisphenol A type epoxy resin or a bisphenol F type epoxy resin having an epoxy equivalent of 220 or more and less than 5000 is preferably 40% by mass or less, more preferably 20% by mass or less in 100% by mass of the epoxy resin (A) component.
- the resulting cured product is preferable because it has excellent impact resistance, but the viscosity of the composition increases, and workability may be deteriorated.
- the curable resin composition of the present invention has a core-shell structure in which the core layer is a diene rubber and the shell layer contains 0.01 to 0.8 mmol / g of hydroxy groups with respect to 100 parts by mass of component (A).
- the polymer fine particles (B) having 1 to 100 parts by mass are used. Due to the effect of improving the toughness of the component (B), the resulting cured product is excellent in toughness and impact peel adhesion.
- the core layer of the component (B) is a diene rubber having a low affinity with the epoxy resin (A), no increase in viscosity over time due to swelling due to the component (A) is observed.
- the core layer is a diene rubber, the impact peel adhesion strength of the cured product is higher than that of polymer fine particles having a polysiloxane rubber or acrylic rubber as the core layer.
- the hydroxy group content of the component (B) (preferably the shell layer of the component (B)) to 0.01 to 0.8 mmol / g, a cured product having excellent impact peel resistance can be obtained.
- the hydroxy group content of the component (B) is less than 0.01 mmol / g, the impact-resistant peel adhesion of the resulting cured product tends to be lowered.
- it is larger than 0.8 mmol / g, the viscosity of the curable resin composition tends to increase, and the composition tends to be difficult to handle.
- the content of the hydroxy group of the component (B) is 0.01 to 0.8 mmol / g from the viewpoint of impact resistance peel adhesion of the resulting cured product and ease of handling of the curable resin composition.
- 02 to 0.6 mmol / g is preferable, 0.03 to 0.5 mmol / g is more preferable, 0.04 to 0.4 mmol / g is further preferable, and 0.05 to 0.3 mmol / g is particularly preferable.
- the component (B) is 1 to 100 parts by mass with respect to 100 parts by mass of the component (A). It is preferably 70 parts by weight, more preferably 3 to 50 parts by weight, still more preferably 3 to 30 parts by weight, and even more preferably 4 to 20 parts by weight.
- the particle diameter of the polymer fine particle is not particularly limited, but considering industrial productivity, the volume average particle diameter (Mv) is preferably 10 to 2000 nm, more preferably 30 to 600 nm, still more preferably 50 to 400 nm, and more preferably 50 to 300 nm. Is more preferable, and 100 to 200 nm is particularly preferable.
- the volume average particle diameter (Mv) of the polymer particles can be measured using Microtrac UPA150 (manufactured by Nikkiso Co., Ltd.).
- Component (B) is a curable resin composition obtained in the composition of the present invention having a half width of 0.5 to 1 times the number average particle size in the number distribution of the particle size. This is preferable because the product has a low viscosity and is easy to handle.
- the component is preferably dispersed in the state of primary particles in the curable resin composition.
- “the polymer fine particles are dispersed in the state of primary particles in the curable resin composition” means that the polymer fine particles are substantially independent (contacted).
- the dispersion state is, for example, by dissolving a part of the curable resin composition in a solvent such as methyl ethyl ketone, and using a particle size measuring device or the like by laser light scattering. This can be confirmed by measuring the particle diameter.
- volume average particle size (Mv) / number average particle size (Mn) by the particle size measurement is not particularly limited, but is preferably 3 or less, more preferably 2.5 or less, and even more preferably 2 or less. 1.5 or less is particularly preferable.
- volume average particle diameter (Mv) / number average particle diameter (Mn) is 3 or less, it is considered that the particles are well dispersed.
- a curable resin composition having a particle size distribution exceeding 3 may have low physical properties such as impact resistance and adhesiveness of the resulting cured product.
- the volume average particle diameter (Mv) / number average particle diameter (Mn) can be determined by measuring using Microtrac UPA (manufactured by Nikkiso Co., Ltd.) and dividing Mv by Mn.
- stable dispersion of polymer fine particles means that the polymer fine particles are not aggregated, separated, or precipitated in the continuous layer, and are constantly under normal conditions over a long period of time. Mean that the distribution of the polymer fine particles in the continuous layer does not substantially change, and the viscosity is lowered by heating these compositions in a range that is not dangerous. It is preferable that “stable dispersion” can be maintained even if stirring is performed.
- a component may be used independently and may be used together 2 or more types.
- the structure of the polymer fine particles is not particularly limited, but preferably has a core-shell structure of two or more layers. It is also possible to have a structure of three or more layers constituted by an intermediate layer covering the core layer and a shell layer further covering the intermediate layer.
- the core layer is preferably an elastic core layer having properties as a rubber in order to increase the toughness of the cured product of the curable resin composition of the present invention.
- the elastic core layer of the present invention preferably has a gel content of 60% by mass or more, more preferably 80% by mass or more, and further preferably 90% by mass or more. It is preferably 95% by mass or more.
- the gel content refers to when 0.5 g of polymer fine particles obtained by coagulation and drying are immersed in 100 g of toluene and left to stand at 23 ° C. for 24 hours, and then insoluble and soluble components are separated. Means the ratio of the insoluble content to the total amount of the insoluble content and the soluble content.
- conjugated diene monomer constituting the diene rubber used in the elastic core layer examples include 1,3-butadiene, isoprene, 2-chloro-1,3-butadiene, 2-methyl-1,3-butadiene and the like. Is mentioned. These conjugated diene monomers may be used alone or in combination of two or more.
- the conjugated diene monomer is preferably in the range of 50 to 100% by mass of the core layer, more preferably in the range of 70 to 100% by mass, and in the range of 90 to 100% by mass. Further preferred. If the content of the conjugated diene monomer is less than 50% by mass, the impact-resistant peel adhesion of the resulting cured product tends to be lowered.
- vinyl monomer copolymerizable with the conjugated diene monomer examples include vinyl arenes such as styrene, ⁇ -methyl styrene, monochlorostyrene and dichlorostyrene; vinyl carboxylic acids such as acrylic acid and methacrylic acid; Vinyl cyanides such as acrylonitrile and methacrylonitrile; vinyl halides such as vinyl chloride, vinyl bromide and chloroprene; vinyl acetate; alkenes such as ethylene, propylene, butylene and isobutylene; diallyl phthalate, triallyl cyanurate, tri And polyfunctional monomers such as allyl isocyanurate and divinylbenzene. These vinyl monomers may be used alone or in combination of two or more. Particularly preferred is styrene.
- the vinyl monomer copolymerizable with the conjugated diene monomer is preferably in the range of 0 to 50% by mass of the core layer, more preferably in the range of 0 to 30% by mass. More preferably, it is in the range of ⁇ 10% by mass.
- the content of the vinyl monomer copolymerizable with the conjugated diene monomer is more than 50% by mass, the impact-resistant peel adhesion of the resulting cured product tends to be lowered.
- the diene rubber has a high toughness-improving effect and an impact-removing adhesiveness-improving effect, and because of its low affinity with the matrix resin, it is difficult to increase the viscosity over time due to swelling of the core layer.
- Butadiene rubber using 3-butadiene or butadiene-styrene rubber which is a copolymer of 1,3-butadiene and styrene is preferable, and butadiene rubber is more preferable.
- butadiene-styrene rubber is more preferable because it can increase the transparency of the cured product obtained by adjusting the refractive index.
- the glass transition temperature of the core layer (hereinafter sometimes simply referred to as “Tg”) is preferably 0 ° C. or less, and ⁇ 20 ° C. or less in order to increase the toughness of the resulting cured product. More preferably, it is ⁇ 40 ° C. or lower, more preferably ⁇ 60 ° C. or lower.
- the volume average particle size of the core layer is preferably 0.03 to 2 ⁇ m, more preferably 0.05 to 1 ⁇ m. In many cases, it is difficult to stably obtain a volume average particle size of less than 0.03 ⁇ m, and when it exceeds 2 ⁇ m, the heat resistance and impact resistance of the final molded product may be deteriorated.
- the volume average particle diameter can be measured using Microtrac UPA150 (manufactured by Nikkiso Co., Ltd.).
- the core layer is preferably 40 to 97% by mass, more preferably 60 to 95% by mass, still more preferably 70 to 93% by mass, particularly preferably 80 to 90% by mass, based on 100% by mass of the entire polymer particles. If the core layer is less than 40% by mass, the effect of improving the toughness of the cured product may be reduced. If the core layer is larger than 97% by mass, the polymer fine particles are likely to aggregate, and the curable resin composition has a high viscosity and may be difficult to handle.
- the core layer often has a single-layer structure, but may have a multilayer structure composed of layers having rubber elasticity.
- the polymer composition of each layer may be different within the scope of the disclosure.
- an intermediate layer may be formed if necessary.
- the following rubber surface cross-linked layer may be formed as the intermediate layer. From the viewpoint of the effect of improving the toughness and the impact resistance improvement effect of the resulting cured product, it is preferable not to contain an intermediate layer, and in particular, not to contain the following rubber surface cross-linked layer.
- the ratio of the intermediate layer to 100 parts by mass of the core layer is preferably 0.1 to 30 parts by mass, more preferably 0.2 to 20 parts by mass, and further preferably 0.5 to 10 parts by mass. 1 to 5 parts by mass is particularly preferable.
- the rubber surface cross-linking layer polymerizes rubber surface cross-linking layer components composed of 30 to 100% by mass of a polyfunctional monomer having two or more radical polymerizable double bonds in the same molecule and 0 to 70% by mass of other vinyl monomers.
- the intermediate layer polymer thus formed has the effect of reducing the viscosity of the curable resin composition of the present invention and the effect of improving the dispersibility of the polymer fine particles (B) in the epoxy resin (A) component. It also has the effect of increasing the crosslinking density of the core layer and increasing the grafting efficiency of the shell layer.
- polyfunctional monomer do not include conjugated diene monomers such as butadiene, and include allylalkyl (meth) acrylates such as allyl (meth) acrylate and allylalkyl (meth) acrylate; allyloxyalkyl (meth) Acrylates; (poly) ethylene glycol di (meth) acrylate, butanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, etc.
- allylalkyl (meth) acrylates such as allyl (meth) acrylate and allylalkyl (meth) acrylate
- allyloxyalkyl (meth) Acrylates ethylene glycol di (meth) acrylate, butanediol di (meth) acrylate, ethylene glycol di (meth) acrylate,
- (meth) acrylates having two or more (meth) acrylic groups
- diallyl phthalate triallyl cyanurate
- triallyl isocyanurate divinylbenzene, etc.
- (meth) acrylate means acrylate and / or methacrylate.
- the outermost shell layer of the polymer fine particles is obtained by polymerizing the shell-forming monomer, and improves the compatibility between the polymer fine particle (B) component and the (A) component, and the curable resin composition of the present invention. Or a shell polymer that plays a role of allowing fine polymer particles to be dispersed in the form of primary particles in the cured product.
- Such a shell polymer is preferably grafted on the core layer and / or the intermediate layer.
- the polymer fine particles are preferably obtained by graft polymerization of a shell-forming monomer on the core layer.
- “when grafted on the core layer” includes an aspect in which the intermediate layer is grafted when the intermediate layer is formed on the core layer. More precisely, the monomer component used to form the shell layer is grafted to the core polymer that forms the core layer (if the intermediate layer is included, of course, the intermediate layer polymer that forms the intermediate layer also means the same).
- the shell polymer and the rubber polymer are substantially chemically bonded by polymerization (in the case where the rubber polymer has an intermediate layer, of course, it is also preferable that the rubber polymer is chemically bonded to the intermediate layer polymer). That is, the shell polymer is preferably formed by graft polymerization of the shell-forming monomer in the presence of a core polymer (meaning the core polymer in which the intermediate layer is formed. In this way, the core polymer is graft-polymerized and covers a part or the whole of the core polymer. This polymerization operation can be carried out by adding a monomer which is a constituent component of the shell polymer to the core polymer latex prepared and present in an aqueous polymer latex state and polymerizing it.
- the monomer for forming the shell layer from the viewpoint of compatibility and dispersibility of the component (B) in the curable resin composition, for example, a monomer having a hydroxy group, an aromatic vinyl monomer, a vinylcyan monomer, (meth) An acrylate monomer is preferable, and a monomer having a hydroxy group, an aromatic vinyl monomer, and a (meth) acrylate monomer are more preferable.
- These monomers for forming the shell layer may be used alone or in appropriate combination.
- the total amount of the aromatic vinyl monomer, vinyl cyan monomer and (meth) acrylate monomer is preferably 10 to 99.5% by mass in 100% by mass of the shell layer forming monomer, and is preferably 50 to 99% by mass. Is more preferably 65 to 98% by mass, particularly preferably 67 to 85% by mass, and most preferably 67 to 80% by mass.
- the shell layer forming monomer contains a monomer having a hydroxy group.
- the monomer having a hydroxy group is preferably contained in an amount of 0.5 to 90% by mass in 100% by mass of the shell-forming monomer, more preferably 1 to 70% by mass, still more preferably 3 to 50% by mass, 5 to 25% by mass is particularly preferred. If the monomer having a hydroxy group is less than 0.5% by mass in 100% by mass of the shell-forming monomer, the impact-resistant peel adhesion of the resulting cured product tends to be lowered. If the monomer having a hydroxy group is larger than 90% by mass in 100% by mass of the shell-forming monomer, the viscosity of the curable resin composition tends to increase, and the composition tends to be difficult to handle.
- the monomer having a hydroxy group is preferably used for forming the shell layer, and more preferably used only for the shell layer.
- an epoxy group, oxetane group, amino group is used as a shell layer forming monomer.
- a reactive group-containing monomer containing at least one selected from the group consisting of a group, an imide group, a carboxylic acid group, a carboxylic anhydride group, a cyclic ester, a cyclic amide, a benzoxazine group, and a cyanate ester group The monomer having an epoxy group is preferable.
- the monomer having an epoxy group is preferably contained in an amount of 0.5 to 90% by mass in 100% by mass of the shell-forming monomer, more preferably 1 to 50% by mass, still more preferably 2 to 35% by mass, 3 to 20% by mass is particularly preferred. If the monomer having an epoxy group is less than 0.5% by mass in the monomer for shell formation, the impact resistance improving effect of the cured product may be reduced, and the impact resistance peel resistance of the curable resin composition may be reduced. There is a case. When the monomer having an epoxy group is larger than 90% by mass in the monomer for shell formation, the impact resistance improving effect may be lowered, and the impact resistance peeling adhesiveness of the curable resin composition may be deteriorated. is there.
- the monomer having an epoxy group is preferably used for forming a shell layer, and more preferably used only for the shell layer.
- the shell layer forming monomer when a multifunctional monomer having two or more radical polymerizable double bonds is used as the shell layer forming monomer, swelling of the polymer fine particles in the curable resin composition is prevented, and the curable resin composition This is preferable because the viscosity of the resin tends to be low and the handleability tends to be improved.
- the polyfunctional monomer is, for example, 0 to 20% by mass, preferably 1 to 20% by mass, and more preferably 5 to 15% by mass in 100% by mass of the shell forming monomer.
- aromatic vinyl monomer examples include vinylbenzenes such as styrene, ⁇ -methylstyrene, p-methylstyrene, and divinylbenzene.
- vinylcyan monomer examples include acrylonitrile and methacrylonitrile.
- (meth) acrylate monomer examples include alkyl (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, and butyl (meth) acrylate.
- the monomer having a hydroxy group include hydroxy straight chain alkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate (particularly, Hydroxy linear C1-6 alkyl (meth) acrylate); caprolactone-modified hydroxy (meth) acrylate; hydroxy branched alkyl (meth) acrylate such as methyl ⁇ - (hydroxymethyl) acrylate and ethyl ⁇ - (hydroxymethyl) acrylate Hydroxyl group-containing (meth) acrylates such as mono (meth) acrylates of polyester diols (especially saturated polyester diols) obtained from divalent carboxylic acids (phthalic acid, etc.) and dihydric alcohols (propylene glycol, etc.) Theft, etc., and the like.
- hydroxy straight chain alkyl (meth) acrylates such as 2-hydroxyethyl (meth
- epoxy group-containing monomer examples include glycidyl group-containing vinyl monomers such as glycidyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate glycidyl ether, and allyl glycidyl ether.
- multifunctional monomer having two or more radical polymerizable double bonds include the same monomers as the above-mentioned multifunctional monomer, preferably allyl methacrylate and triallyl isocyanurate.
- aromatic vinyl monomer especially styrene
- vinyl cyan monomer especially acrylonitrile
- (meth) acrylate monomer especially methyl methacrylate) 0 to 100% by mass (preferably 0 to 90% by mass, more preferably 20 to 85% by mass)
- a shell layer is preferred. Thereby, a desired toughness improving effect and mechanical properties can be realized in a well-balanced manner.
- These monomer components may be used alone or in combination of two or more.
- the shell layer may be formed including other monomer components in addition to the monomer components.
- the graft ratio of the shell layer is preferably 70% or more (more preferably 80% or more, and further 90% or more). When the graft ratio is less than 70%, the viscosity of the liquid resin composition may increase.
- the method for calculating the graft ratio is as follows.
- an aqueous latex containing polymer fine particles is coagulated and dehydrated, and finally dried to obtain polymer fine particle powder.
- the MEK soluble component is separated from the MEK insoluble component, and the methanol insoluble component is further separated from the MEK soluble component.
- the graft ratio is calculated by calculating
- the polymer forming the core layer constituting the polymer fine particle used in the present invention comprises at least one monomer (first monomer) selected from diene monomers (conjugated diene monomers) and (meth) acrylate monomers.
- the core layer can be formed by, for example, emulsion polymerization, suspension polymerization, microsuspension polymerization, etc., and for example, the method described in WO2005 / 028546 can be used.
- the formation of the core layer can be produced by, for example, emulsion polymerization, suspension polymerization, microsuspension polymerization, etc.
- the method described in the pamphlet of WO 2006/070664 can be used.
- the intermediate layer can be formed by polymerizing the monomer for forming the intermediate layer by a known radical polymerization.
- the polymerization of the monomer having two or more radical polymerizable double bonds is preferably carried out by an emulsion polymerization method.
- the shell layer can be formed by polymerizing a shell layer forming monomer by known radical polymerization.
- the polymerization of the monomer for forming the shell layer is preferably performed by an emulsion polymerization method, for example, WO2005 / 028546 pamphlet.
- alkyl or aryl sulfonic acid represented by dioctylsulfosuccinic acid and dodecylbenzenesulfonic acid
- alkyl or arylether sulfonic acid alkyl or aryl represented by dodecylsulfuric acid, and the like.
- emulsifier dispersant
- an emulsifier (dispersant) is so preferable that the water solubility is high. If the water solubility is high, the emulsifier (dispersant) can be easily removed by washing with water, and adverse effects on the finally obtained cured product can be easily prevented.
- a known initiator that is, 2,2′-azobisisobutyronitrile, hydrogen peroxide, potassium persulfate, ammonium persulfate, or the like can be used as the thermal decomposition type initiator. .
- organic peroxides such as t-butylperoxyisopropyl carbonate, paramentane hydroperoxide, cumene hydroperoxide, dicumyl peroxide, t-butyl hydroperoxide, di-t-butyl peroxide, t-hexyl peroxide, etc.
- Oxides such as inorganic peroxides such as hydrogen peroxide, potassium persulfate, and ammonium persulfate; reducing agents such as sodium formaldehyde sulfoxylate and glucose as necessary; and iron sulfate (II as necessary) ),
- a chelating agent such as disodium ethylenediaminetetraacetate if necessary, and a redox type initiator using a phosphorus-containing compound such as sodium pyrophosphate if necessary.
- the polymerization can be performed even at a low temperature at which the peroxide is not substantially thermally decomposed, and the polymerization temperature can be set in a wide range, which is preferable.
- organic peroxides such as cumene hydroperoxide, dicumyl peroxide, and t-butyl hydroperoxide are preferably used as the redox initiator.
- the amount of the initiator used, or the redox type initiator is used, the amount of the reducing agent / transition metal salt / chelating agent used may be within a known range.
- a known chain transfer agent can be used within a known range.
- a surfactant can be used, but this is also within a known range.
- the conditions such as polymerization temperature, pressure and deoxygenation during the polymerization can be within the known ranges.
- the polymerization of the intermediate layer forming monomer may be performed in one stage or in two or more stages.
- a method of continuously adding it an elastic core layer is added to a reactor in which an intermediate layer forming monomer is charged in advance.
- a method of carrying out polymerization after adding an emulsion of a rubber elastic body to be constituted can be employed.
- ⁇ Blocked urethane (C)> In the curable resin composition of the present invention, it is essential to contain 1 to 100 parts by mass of blocked urethane (C) with respect to 100 parts by mass of component (A).
- Component (C) is a combination of polymer fine particles having hydroxy groups in the shell layer as component (B) described above, and the cured product obtained by curing the resulting curable resin composition has impact-resistant peel adhesion. Is remarkably superior.
- the blocked urethane is an elastomer type, and includes various blocks in which all or part of the terminal isocyanate group of the compound containing an urethane group and / or a urea group and having an isocyanate group at the terminal has an active hydrogen group. It is a compound capped with an agent. In particular, a compound in which all of the terminal isocyanate groups are capped with a blocking agent is preferable. Such a compound can be prepared, for example, by reacting an organic polymer having an active hydrogen-containing group at the terminal with an excess of a polyisocyanate compound to have a urethane group and / or a urea group in the main chain and an isocyanate group at the terminal. It is obtained by capping all or part of the isocyanate group with a blocking agent having an active hydrogen group after or simultaneously with the polymer (urethane prepolymer).
- the blocked urethane is, for example, the following general formula (1): A- (NR 2 —C ( ⁇ O) —X) a (1)
- a number of R 2 are each independently, .a a hydrocarbon group having 1 to 20 carbon atoms represent the average number per molecule of capped isocyanate groups, 1.1 or more It is preferably 1.5 to 8, more preferably 1.7 to 6, and particularly preferably 2 to 4.
- X is a residue obtained by removing an active hydrogen atom from the blocking agent. Is a residue obtained by removing a terminal isocyanate group from an isocyanate-terminated prepolymer.
- the hydrocarbon group may be an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, or an aromatic hydrocarbon group.
- the aliphatic hydrocarbon group include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, dodecyl group and the like alkyl group; ethenyl group, propenyl group Alkenyl groups such as butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, nonenyl group, decenyl group, undecenyl group, dodecenyl group, and the like.
- the aliphatic hydrocarbon group may be linear or branched.
- the alicyclic hydrocarbon group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclononyl group, a cyclodecyl group and the like; a cyclopropenyl group, a cyclobutenyl group, a cyclopentenyl group Group, cyclohexenyl group, cycloheptenyl group, cyclooctenyl group, cyclopentadienyl and the like.
- the aromatic hydrocarbon group include a phenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a biphenyl group, and a terphenyl group.
- the number average molecular weight of the blocked urethane is preferably from 2,000 to 40,000, more preferably from 3,000 to 30,000, and particularly preferably from 4,000 to 20,000, in terms of polystyrene measured by GPC.
- the molecular weight distribution (ratio of weight average molecular weight to number average molecular weight) is preferably 1 to 4, more preferably 1.2 to 3, and particularly preferably 1.5 to 2.5.
- C-1 Organic polymer having an active hydrogen-containing group at the terminal As the main chain skeleton constituting the organic polymer having an active hydrogen-containing group at the terminal, a polyether polymer, a polyacrylic polymer, a polyester polymer, a polydiene polymer, a saturated hydrocarbon polymer (polyolefin) ) And polythioether polymers.
- Examples of the active hydrogen-containing group constituting the organic polymer having an active hydrogen-containing group at the terminal include a hydroxyl group, an amino group, an imino group, and a thiol group. Among these, a hydroxyl group, an amino group, and an imino group are preferable from the viewpoint of availability, and a hydroxyl group is more preferable from the viewpoint of easy handling (viscosity) of the obtained blocked urethane.
- organic polymer having an active hydrogen-containing group at the terminal examples include a polyether polymer having a hydroxyl group at the terminal (polyether polyol), and a polyether polymer having an amino group and / or an imino group at the terminal (polyether amine). ), Polyacryl polyol, polyester polyol, diene polymer having a hydroxyl group at the terminal (polydiene polyol), saturated hydrocarbon polymer having a hydroxyl group at the terminal (polyolefin polyol), polythiol compound, polyamine compound, and the like.
- polyether polyol, polyether amine, and polyacryl polyol are excellent in compatibility with the epoxy resin (A) component, the glass transition temperature of the organic polymer is relatively low, and the resulting cured product has a low temperature. It is preferable because of its excellent impact resistance.
- polyether polyols and polyether amines are more preferred because the resulting organic polymer has a low viscosity and good workability, and polyether polyols are particularly preferred.
- the organic polymer having an active hydrogen-containing group at the terminal used when preparing the urethane prepolymer that is a precursor of blocked urethane may be used alone or in combination of two or more.
- the number average molecular weight of the organic polymer having an active hydrogen-containing group at the terminal is preferably from 800 to 7000, more preferably from 1500 to 5000, and particularly preferably from 2000 to 4000 in terms of polystyrene equivalent molecular weight measured by GPC.
- the polyether polymer essentially has the general formula (2): -R 1 -O- (2) (Wherein R 1 is a linear or branched alkylene group having 1 to 14 carbon atoms), and R 1 in the general formula (2) is a carbon atom.
- Specific examples of the repeating unit represented by the general formula (2) include —CH 2 O—, —CH 2 CH 2 O—, —CH 2 CH (CH 3 ) O—, —CH 2 CH (C 2 H 5 ) O—, —CH 2 C (CH 3 ) 2 O—, —CH 2 CH 2 CH 2 CH 2 O— and the like.
- the main chain skeleton of the polyether polymer may be composed of only one type of repeating unit, or may be composed of two or more types of repeating units.
- a polymer composed mainly of a polypropylene glycol having a propylene oxide repeating unit of 50% by mass or more is preferable from the viewpoint of T-shaped peel adhesion strength.
- PTMG polytetramethylene glycol
- the ratio of the polymer fine particles (B) to the blocked urethane (C) is 0.1-10. Preferably, it is 0.2 to 5, more preferably 0.3 to 4, and particularly preferably 1 to 3.
- the polyether polyol is a polyether polymer having a hydroxyl group at the terminal, and the polyether amine is a polyether polymer having an amino group or an imino group at the terminal.
- polyacryl polyol examples include a polyol having a (meth) acrylic acid alkyl ester (co) polymer as a skeleton and a hydroxyl group in the molecule.
- a polyacryl polyol obtained by copolymerizing a hydroxyl group-containing (meth) acrylic acid alkyl ester monomer such as 2-hydroxyethyl methacrylate is preferred.
- polyester polyol examples include polybasic acids such as maleic acid, fumaric acid, adipic acid, and phthalic acid, and acid anhydrides thereof, ethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanediol, Examples thereof include polymers obtained by polycondensation with polyhydric alcohols such as diethylene glycol, dipropylene glycol and neopentyl glycol in the presence of an esterification catalyst in a temperature range of 150 to 270 ° C. Also included are ring-opening polymers such as ⁇ -caprolactone and valerolactone, and active hydrogen compounds having two or more active hydrogens such as polycarbonate diol and castor oil.
- polybasic acids such as maleic acid, fumaric acid, adipic acid, and phthalic acid
- acid anhydrides thereof ethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanedi
- Polydiene polyol examples include polybutadiene polyol, polyisoprene polyol, polychloroprene polyol, and the like, and polybutadiene polyol is particularly preferable.
- Polyolefin polyol examples include polyisobutylene polyol and hydrogenated polybutadiene polyol.
- polyisocyanate compound examples include aromatic polyisocyanates such as toluene (tolylene) diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; fats such as isophorone diisocyanate, hexamethylene diisocyanate, hydrogenated toluene diisocyanate, and hydrogenated diphenylmethane diisocyanate.
- aromatic polyisocyanates such as toluene (tolylene) diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate
- fats such as isophorone diisocyanate, hexamethylene diisocyanate, hydrogenated toluene diisocyanate, and hydrogenated diphenylmethane diisocyanate.
- Group polyisocyanates can be mentioned. Among these, aliphatic polyisocyanates are preferable from the viewpoint of heat resistance, and is
- blocking agent examples include a primary amine blocking agent, a secondary amine blocking agent, an oxime blocking agent, a lactam blocking agent, an active methylene blocking agent, an alcohol blocking agent, a mercaptan blocking agent, and an amide.
- an oxime block agent, a lactam block agent, a hydroxy functional (meth) acrylate block agent, and a phenol block agent are preferable, and a hydroxy functional (meth) acrylate block agent and a phenol block agent are more preferable.
- a phenolic blocking agent is more preferable.
- Examples of the primary amine blocking agent include butylamine, isopropylamine, dodecylamine, cyclohexylamine, aniline, benzylamine and the like.
- Examples of the secondary amine blocking agent include dibutylamine, diisopropylamine, dicyclohexylamine, diphenylamine, dibenzylamine, morpholine, and piperidine.
- Examples of the oxime blocking agent include formaldoxime, acetoaldoxime, acetoxime, methyl ethyl ketoxime, diacetyl monooxime, cyclohexane oxime and the like.
- lactam blocking agent examples include ⁇ -caprolactam, ⁇ -valerolactam, ⁇ -butyrolactam, ⁇ -butyrolactam and the like.
- active methylene-based blocking agent examples include ethyl acetoacetate and acetylacetone.
- Examples of the alcohol blocking agent include methanol, ethanol, propanol, isopropanol, butanol, amyl alcohol, cyclohexanol, 1-methoxy-2-propanol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, benzyl alcohol Methyl glycolate, butyl glycolate, diacetone alcohol, methyl lactate, ethyl lactate and the like.
- Examples of the mercaptan-based blocking agent include butyl mercaptan, hexyl mercaptan, decyl mercaptan, t-butyl mercaptan, thiophenol, methylthiophenol, and ethylthiophenol.
- Examples of the amide blocking agent include acetic acid amide and benzamide.
- Examples of the imide-based blocking agent include succinimide and maleic imide.
- Examples of the heterocyclic aromatic compound blocking agent include imidazoles such as imidazole and 2-ethylimidazole, pyrroles such as pyrrole, 2-methylpyrrole, and 3-methylpyrrole, pyridine, 2-methylpyridine, and 4-methyl. Examples thereof include pyridines such as pyridine, and diazabicycloalkenes such as diazabicycloundecene and diazabicyclononene.
- the hydroxy functional (meth) acrylate blocking agent is a (meth) acrylate having one or more hydroxyl groups.
- Specific examples of hydroxy functional (meth) acrylate blocking agents include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-hydroxybutyl (meth) An acrylate etc. are mentioned.
- the phenolic blocking agent contains at least one phenolic hydroxyl group, that is, a hydroxyl group directly bonded to a carbon atom of an aromatic ring.
- the phenolic compound may have two or more phenolic hydroxyl groups, but preferably contains only one phenolic hydroxyl group.
- the phenolic compound may contain other substituents, but these substituents are preferably those that do not react with isocyanate groups under the conditions of the capping reaction, and are preferably alkenyl groups and allyl groups.
- substituents include linear, branched, or cycloalkyl alkyl groups; aromatic groups (eg, phenyl, alkyl-substituted phenyl, alkenyl-substituted phenyl, etc.); aryl-substituted alkyl groups; phenol-substituted alkyl groups Can be mentioned.
- phenolic blocking agent examples include phenol, cresol, xylenol, chlorophenol, ethylphenol, allylphenol (especially o-allylphenol), resorcinol, catechol, hydroquinone, bisphenol, bisphenol A, bisphenol AP (1,1- Bis (4-hydroxylphenyl) -1-phenylethane), bisphenol F, bisphenol K, bisphenol M, tetramethylbiphenol and 2,2′-diallyl-bisphenol A.
- the blocking agent is preferably bonded to the end of the polymer chain of the urethane prepolymer in such a manner that the terminal to which the blocking agent is bonded no longer has a reactive group.
- the blocking agent may be used alone or in combination of two or more.
- the blocked urethane may contain a residue of a crosslinking agent, a residue of a chain extender, or both.
- the blocked isocyanate used in the present invention is preferably a compound obtained by capping a urethane prepolymer containing a polyalkylene glycol structure with a blocking agent, and the urethane prepolymer containing a polypropylene glycol structure is preferably a blocking agent (preferably a phenolic block). It is more preferable that the compound is a compound capped with an agent) or a urethane prepolymer containing a polytetramethylene glycol structure capped with a blocking agent (preferably a phenolic blocking agent).
- the blocked isocyanate can be suitably used in terms of improving thixotropy and adhesion.
- a compound obtained by capping a urethane prepolymer containing a polypropylene glycol structure with a blocking agent may be used from the viewpoint of improving T-peel adhesion strength in addition to dynamic splitting resistance
- a blocking agent preferably a phenolic blocking agent
- a compound in which a urethane prepolymer containing a polytetramethylene glycol structure is capped with a blocking agent is a compound in which a urethane prepolymer containing a polypropylene glycol structure is capped with a blocking agent (preferably a phenolic blocking agent). It may be used from the viewpoint of improving the dynamic splitting resistance.
- the block NCO equivalent of blocked isocyanate is, for example, 300 to 3000, preferably 500 to 2000.
- a blocked isocyanate having at least one of these characteristics can be suitably used in the present invention.
- Crosslinking agent The molecular weight of the crosslinking agent is preferably 750 or less, more preferably 50 to 500, and a polyol or polyamine compound having at least three hydroxyl groups, amino groups and / or imino groups per molecule.
- Crosslinkers are useful for imparting branching to the blocked urethane and increasing the functionality of the blocked urethane (ie, the number of capped isocyanate groups per molecule).
- Chain extender The molecular weight of the chain extender is preferably 750 or less, more preferably 50 to 500, and a polyol or polyamine compound having two hydroxyl groups, amino groups and / or imino groups per molecule. Chain extenders are useful for increasing the molecular weight of a blocked urethane without increasing functionality.
- crosslinking agent and chain extender include trimethylolpropane, glycerin, trimethylolethane, ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, sucrose, sorbitol, pentaerythritol, ethylenediamine, triethanolamine, monoethanol.
- examples include amine, diethanolamine, piperazine, and aminoethylpiperazine.
- Resorcinol catechol, hydroquinone, bisphenol, bisphenol A, bisphenol AP (1,1-bis (4-hydroxylphenyl) -1-phenylethane), bisphenol F, bisphenol K, bisphenol M, tetramethylbiphenol, 2,2 Also included are compounds having two or more phenolic hydroxyl groups, such as' -diallyl-bisphenol A.
- Component (C) is used in an amount of 1 to 100 parts by weight, preferably 2 to 50 parts by weight, more preferably 3 to 40 parts by weight, based on 100 parts by weight of component (A). Is particularly preferred. If it is less than 1 part by mass, the impact-resistant peel adhesion of the resulting cured product may be lowered. When the amount is more than 100 parts by mass, the resulting cured product may have low heat resistance and elastic modulus (rigidity).
- a component may be used independently and may be used together 2 or more types.
- an epoxy curing agent (D) can be used as necessary.
- the curable resin composition of the present invention is used as a one-component composition (such as a one-component curable resin composition)
- the adhesive rapidly develops when heated to a temperature of 80 ° C. or higher, preferably 140 ° C. or higher.
- the component (D) is preferably selected so as to be cured.
- the component which shows activity by heating can be used.
- a latent epoxy curing agent an N-containing curing agent such as a specific amine curing agent (including an imine curing agent) can be used, for example, boron trichloride / amine complex, boron trifluoride / amine.
- dicyandiamide isophthalic acid dihydrazide, adipic acid dihydrazide, or 4,4'-diaminodiphenylsulfone, and dicyandiamide is particularly preferable.
- the latent epoxy curing agent is preferable because the curable resin composition of the present invention can be made into one component.
- the amount of the latent epoxy curing agent (dicyandiamide) used in the curable resin composition is preferably 4 to 10 parts by mass, more preferably 5 to 9 parts by mass, and more preferably 6 to 8 parts per 100 parts by mass of the component (A). Part by mass is more preferable. If the amount is less than 4 parts by mass, curing may be insufficient and the adhesiveness may be low. If the amount is more than 10 parts by mass, the resulting cured product may have low adhesiveness.
- the curable resin composition of the present invention when using the curable resin composition of the present invention as a two-component or multi-component composition, other amine-based curing agents (including imine-based curing agents) and mercaptan-based curing agents (room temperature-curable curing) (Sometimes referred to as an agent) can be selected as the component (D) exhibiting activity at a relatively low temperature of about room temperature.
- other amine-based curing agents including imine-based curing agents
- mercaptan-based curing agents room temperature-curable curing
- Examples of the component (D) exhibiting activity at a relatively low temperature include chain aliphatic polyamines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenediamine, diethylaminopropylamine, and hexamethylenediamine; N— Aminoethylpiverazine, bis (4-amino-3-methylcyclohexyl) methane, mensendiamine, isophoronediamine, 4,4′-diaminodicyclohexylmethane, 3,9-bis (3-aminopropyl) -2,4 , 8,10-tetraoxaspiro [5.5] undecane (spiroacetal diamine), norbornanediamine, tricyclodecanediamine, cycloaliphatic polyamines such as 1,3-bisaminomethylcyclohexane; fats such as metaxylenediamine Aromatic Polyamine epoxy resin adducts that are
- An amine-terminated polyether containing a polyether main chain and preferably having 1 to 4 (preferably 1.5 to 3) amino groups and / or imino groups on average per molecule is also used as component (D).
- Can be used as Commercially available amine-terminated polyethers include Huntsman's Jeffamine D-230, Jeffamine D-400, Jeffamine D-2000, Jeffamine D-4000, Jeffamine T-5000, and the like.
- an amine-terminated rubber containing a conjugated diene polymer main chain and preferably having 1 to 4 (more preferably 1.5 to 3) amino groups and / or imino groups on average per molecule is also used.
- the main chain of the rubber is preferably a polybutadiene homopolymer or copolymer, more preferably a polybutadiene / acrylonitrile copolymer, and an acrylonitrile monomer content of 5 to 40% by mass (more preferably 10 to 35% by mass, still more preferably 15 to Polybutadiene / acrylonitrile copolymers that are 30% by weight) are particularly preferred.
- Examples of commercially available amine-terminated rubbers include Hypro 1300X16 ATBN manufactured by CVC.
- polyamide amines Among the amine curing agents that exhibit activity at a relatively low temperature such as room temperature, polyamide amines, amine-terminated polyethers, and amine-terminated rubbers are more preferable. Polyamide amines, amine-terminated polyethers, and amine-terminated rubbers It is particularly preferable to use them in combination.
- acid anhydrides and phenols can be used as the component (D). Acid anhydrides and phenols require higher temperatures than amine-based curing agents, but have a longer pot life and cured products have a good balance of physical properties such as electrical, chemical, and mechanical properties. It is.
- acid anhydrides include polysebacic acid polyanhydride, polyazeline acid polyanhydride, succinic anhydride, citraconic acid anhydride, itaconic acid anhydride, alkenyl-substituted succinic acid anhydride, dodecenyl succinic acid anhydride, maleic acid anhydride, Tricarballylic anhydride, nadic anhydride, methyl nadic anhydride, linoleic acid adduct with maleic anhydride, alkylated terminal alkylene tetrahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, tetrahydrophthalic anhydride, hexahydro Phthalic anhydride, pyromellitic dianhydride, trimellitic anhydride, phthalic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, dichloromaleic anhydride,
- Component (D) is used in an amount sufficient to cure the composition. Typically, sufficient curing agent is provided to consume at least 80% of the epoxide groups present in the composition. A large excess over that required for consumption of epoxide groups is usually not necessary.
- the amount of component (D) used is preferably 1 to 80 parts by weight, more preferably 2 to 40 parts by weight, still more preferably 3 to 30 parts by weight, based on 100 parts by weight of component (A). Part is particularly preferred. If it is less than 1 mass part, the sclerosis
- a hardening accelerator (E) can be used as needed.
- the component (E) is a catalyst for promoting the reaction between the epoxy group and the epoxide reactive group on the other component of the curing agent or adhesive.
- component (E) examples include p-chlorophenyl-N, N-dimethylurea (trade name: Monuron), 3-phenyl-1,1-dimethylurea (trade name: Phenuron), and 3,4-dichlorophenyl-N.
- N-dimethylurea (trade name: Diuron), N- (3-chloro-4-methylphenyl) -N ′, N′-dimethylurea (trade name: Chlortoluron), 1,1-dimethylphenylurea (trade name) : Ureas such as Dyhard); 2,4 embedded in a benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, 2- (dimethylaminomethyl) phenol, poly (p-vinylphenol) matrix , 6-Tris (dimethylaminomethyl) phenol, triethylenediamine, N, N-dimethyl Tertiary amines such as piperidine; C1-C12 alkylene imidazole, N-aryl imidazole, 2-methylimidazole, 2-ethyl-2-methylimidazole, N-butylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate I
- tertiary amines and imidazoles can improve the curing speed, physical properties (heat resistance), etc. of the cured product when used in combination with the amine curing agent of component (D).
- a component may be used independently and may be used together 2 or more types.
- the amount of component (E) used is preferably 0.1 to 10 parts by weight, more preferably 0.2 to 5 parts by weight, and even more preferably 0.5 to 3 parts by weight with respect to 100 parts by weight of component (A). 0.8 to 2 parts by mass is preferable. If it is less than 0.1 mass part, the sclerosis
- the epoxy resin (A) is used as a reinforcing agent other than the component (B) and the component (C) for the purpose of further improving performances such as toughness, impact resistance, shear adhesion, and peel adhesion.
- a rubber-modified epoxy resin or a urethane-modified epoxy resin that is not contained can be used as necessary.
- the reinforcing agents other than the component (B) and the component (C) may be used alone or in combination of two or more.
- the rubber-modified epoxy resin is a reaction product obtained by reacting rubber with an epoxy group-containing compound and having an average of 1.1 or more, preferably 2 or more epoxy groups per molecule.
- NBR acrylonitrile butadiene rubber
- SBR styrene butadiene rubber
- HNBR hydrogenated nitrile rubber
- EPDM ethylene propylene rubber
- ACM acrylic rubber
- IIR butyl rubber
- butadiene rubber polypropylene oxide and polyethylene oxide.
- rubber polymers such as polyoxyalkylene such as polytetramethylene oxide.
- the rubber polymer is preferably one having a reactive group such as an amino group, a hydroxy group, or a carboxyl group at the terminal.
- the rubber-modified epoxy resin used in the present invention is a product obtained by reacting these rubber-based polymer and epoxy resin at an appropriate blending ratio by a known method.
- acrylonitrile-butadiene rubber-modified epoxy resin and polyoxyalkylene-modified epoxy resin are preferable from the viewpoint of adhesion of the resulting curable resin composition and impact peel resistance, and acrylonitrile-butadiene rubber-modified epoxy resin is preferable. More preferred.
- the acrylonitrile-butadiene rubber-modified epoxy resin can be obtained, for example, by reacting a carboxyl group-terminated NBR (CTBN) with a bisphenol A type epoxy resin.
- CBN carboxyl group-terminated NBR
- the content of the acrylonitrile monomer component in 100% by mass of the acrylonitrile-butadiene rubber is preferably 5 to 40% by mass from the viewpoint of adhesion of the resulting curable resin composition and impact-resistant peel adhesion. 35% by mass is more preferable, and 15 to 30% by mass is even more preferable. From the viewpoint of workability of the resulting curable resin composition, 20 to 30% by mass is particularly preferable.
- addition reaction products of amino group-terminated polyoxyalkylenes and epoxy resins are also included in rubber-modified epoxy resins.
- adducts addition reaction products of amino group-terminated polyoxyalkylenes and epoxy resins
- the adduct can be easily manufactured by a known method.
- the epoxy resin used in the production of the adduct include specific examples of the component (A) exemplified in the present invention, and bisphenol A type epoxy resins and bisphenol F type epoxy resins are preferable, and bisphenol A A type epoxy resin is more preferable.
- Examples of commercially available amino group-terminated polyoxyalkylenes used in the production of the adduct include Huntsman's Jeffamine D-230, Jeffamine D-400, Jeffamine D-2000, Jeffamine D-4000, Examples include Jeffamine T-5000.
- the average number of epoxide reactive end groups per molecule in the rubber is preferably 1.5 to 2.5, more preferably 1.8 to 2.2.
- the number average molecular weight of the rubber is preferably 1000 to 10,000, more preferably 2000 to 8000, and particularly preferably 3000 to 6000 in terms of polystyrene equivalent molecular weight measured by GPC.
- a rubber modified epoxy resin there is no restriction
- the rubber-modified epoxy resin is produced by heating to a temperature of 100 to 250 ° C.
- the epoxy group-containing compound used in producing the rubber-modified epoxy resin is not particularly limited, but bisphenol A type epoxy resin and bisphenol F type epoxy resin are preferable, and bisphenol A type epoxy resin is more preferable.
- the unreacted epoxy group-containing compound remaining after the reaction is included in the rubber-modified epoxy resin of the present invention. , Not included.
- the epoxy resin can be modified by pre-reaction with a bisphenol component.
- the bisphenol component used for the modification is preferably 3 to 35 parts by mass, and more preferably 5 to 25 parts by mass with respect to 100 parts by mass of the rubber component in the rubber-modified epoxy resin.
- a cured product obtained by curing a curable resin composition containing a modified rubber-modified epoxy resin is excellent in adhesion durability after high-temperature exposure and excellent in impact resistance at low temperatures.
- the glass transition temperature (Tg) of the rubber-modified epoxy resin is not particularly limited, but is preferably ⁇ 25 ° C. or lower, more preferably ⁇ 35 ° C. or lower, still more preferably ⁇ 40 ° C. or lower, and particularly preferably ⁇ 50 ° C. or lower.
- the number average molecular weight of the rubber-modified epoxy resin is preferably from 1500 to 40000, more preferably from 3000 to 30000, particularly preferably from 4000 to 20000 in terms of polystyrene equivalent molecular weight measured by GPC.
- the molecular weight distribution (ratio of weight average molecular weight to number average molecular weight) is preferably 1 to 4, more preferably 1.2 to 3, and particularly preferably 1.5 to 2.5.
- the amount of rubber-modified epoxy resin used is preferably 1 to 50 parts by weight, more preferably 2 to 40 parts by weight, still more preferably 5 to 30 parts by weight, with respect to 100 parts by weight of component (A). Part is particularly preferred. If the amount is less than 1 part by mass, the resulting cured product may be brittle and impact-resistant peel adhesion may be low. If the amount is more than 50 parts by mass, the resulting cured product may have low heat resistance and elastic modulus (rigidity).
- the rubber-modified epoxy resins can be used alone or in combination of two or more.
- the urethane-modified epoxy resin is obtained by reacting a compound containing a group having reactivity with an isocyanate group and an epoxy group with a urethane prepolymer containing an isocyanate group.
- a urethane-modified epoxy resin can be obtained by reacting a hydroxy group-containing epoxy compound with a urethane prepolymer.
- the number average molecular weight of the urethane-modified epoxy resin is preferably from 1500 to 40000, more preferably from 3000 to 30000, particularly preferably from 4000 to 20000 in terms of polystyrene-converted molecular weight measured by GPC.
- the molecular weight distribution (ratio of weight average molecular weight to number average molecular weight) is preferably 1 to 4, more preferably 1.2 to 3, and particularly preferably 1.5 to 2.5.
- the amount of urethane-modified epoxy resin used is preferably 1 to 50 parts by weight, more preferably 2 to 40 parts by weight, still more preferably 5 to 30 parts by weight, with respect to 100 parts by weight of component (A). Part is particularly preferred. If the amount is less than 1 part by mass, the resulting cured product may be brittle and impact-resistant peel adhesion may be low. If the amount is more than 50 parts by mass, the resulting cured product may have low heat resistance and elastic modulus (rigidity). Urethane-modified epoxy resins can be used alone or in combination of two or more.
- silicic acid and / or silicate can be added as an inorganic filler.
- Specific examples include dry silica, wet silica, aluminum silicate, magnesium silicate, calcium silicate, wollastonite, talc and the like.
- the dry silica also called fumed silica
- fumed silica is a surface-untreated hydrophilic fumed silica and a hydrophobic fumed silica produced by chemically treating the silanol group portion of the hydrophilic fumed silica with silane or siloxane.
- hydrophobic fumed silica is preferable.
- inorganic fillers include reinforcing fillers such as dolomite and carbon black; colloidal calcium carbonate, heavy calcium carbonate, magnesium carbonate, titanium oxide, ferric oxide, aluminum fine powder, zinc oxide, activated zinc white, etc. Is mentioned.
- the inorganic filler is preferably surface-treated with a surface treatment agent. The dispersibility of the inorganic filler in the composition is improved by the surface treatment, and as a result, various physical properties of the obtained cured product are improved.
- the amount of the inorganic filler used is preferably 1 to 100 parts by weight, more preferably 2 to 70 parts by weight, still more preferably 5 to 40 parts by weight, and 7 to 20 parts by weight with respect to 100 parts by weight of component (A). Is particularly preferred.
- An inorganic filler may be used independently and may be used together 2 or more types.
- Calcium oxide can be added to the curable resin composition of the present invention. Calcium oxide removes moisture by reaction with moisture in the curable resin composition, and solves various physical property problems caused by the presence of moisture. For example, it functions as an anti-bubble agent due to moisture removal and suppresses a decrease in adhesive strength.
- Calcium oxide can be surface treated with a surface treatment agent.
- the surface treatment improves the dispersibility of the calcium oxide in the composition.
- the physical properties such as the adhesive strength of the obtained cured product are improved as compared with the case where calcium oxide not subjected to surface treatment is used.
- the T-shaped peel adhesion and impact resistance peel adhesion are significantly improved.
- the surface treatment agent is not particularly limited, but is preferably a fatty acid.
- the amount of calcium oxide used is preferably 0.1 to 10 parts by weight, more preferably 0.2 to 5 parts by weight, still more preferably 0.5 to 3 parts by weight with respect to 100 parts by weight of component (A). 1 to 2 parts by mass is particularly preferred. If the amount is less than 0.1 parts by mass, the moisture removal effect may not be sufficient. If the amount is more than 10 parts by mass, the strength of the resulting cured product may be low. Calcium oxide may be used alone or in combination of two or more.
- numerator can be used as needed.
- a low molecular compound having a molecular weight of less than 300 and having at least one double bond in the molecule can be added.
- the low molecular weight compound has a function of adjusting viscosity, physical properties of a cured product, and curing speed by using in combination with the radical curable resin, and functions as a so-called reactive diluent for the radical curable resin.
- a radical polymerization initiator can be added to the curable resin composition of the present invention.
- the radical polymerization initiator is preferably a potential type that is activated when the temperature is increased (preferably, about 50 ° C. to about 150 ° C.).
- radical curable resins examples include unsaturated polyester resins, polyester (meth) acrylates, epoxy (meth) acrylates, urethane (meth) acrylates, polyether (meth) acrylates, and acrylated (meth) acrylates. These may be used alone or in combination.
- Specific examples of the radical curable resin include compounds described in WO2014-115778 pamphlet.
- Specific examples of the low molecular weight compound and the radical polymerization initiator include compounds described in WO2014-115778 pamphlet.
- the radical polymerization initiator is activated at a temperature different from the curing temperature of the epoxy resin, the partial curing of the curable resin composition is caused by selective polymerization of the radical curable resin. It becomes possible. This partial curing can increase the viscosity of the composition after coating and improve the wash-off resistance.
- the uncured adhesive composition is partially dissolved, scattered, or deformed by the shower water pressure during the washing shower process. The corrosion resistance of the coated steel sheet may be adversely affected, and the rigidity of the steel sheet may be reduced.
- the “hardness to be washed off” means resistance to this problem.
- this partial curing can provide a function of temporarily fixing (temporarily adhering) the substrates to each other until the composition is completely cured.
- the free radical initiator is preferably activated by heating to 80 ° C. to 130 ° C., more preferably 100 ° C. to 120 ° C.
- a monoepoxide can be used as necessary.
- the monoepoxide can function as a reactive diluent.
- Specific examples of monoepoxides include aliphatic glycidyl ethers such as butyl glycidyl ether, or aromatic glycidyl ethers such as phenyl glycidyl ether and cresyl glycidyl ether, such as 2-ethylhexyl glycidyl ether.
- Ethers consisting of alkyl groups and glycidyl groups, for example ethers consisting of phenyl groups having 6 to 12 carbon atoms and glycidyl groups which can be substituted by alkyl groups having 2 to 8 carbon atoms such as p-tertbutylphenylglycidyl ether, such as dodecyl Ethers composed of alkyl groups having 12 to 14 carbon atoms such as glycidyl ether and glycidyl groups; for example, aliphatic glycidyl esters such as glycidyl (meth) acrylate and glycidyl maleate; Glycol ester, neodecanoic acid glycidyl ester, glycidyl esters of aliphatic carboxylic acids having 8 to 12 carbon atoms, such as lauric acid glycidyl ester; and p-t-butylbenzoic acid glycidyl
- the amount used is preferably 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, and more preferably 1 to 5 parts by weight with respect to 100 parts by weight of component (A). Particularly preferred. If the amount is less than 0.1 parts by mass, the effect of reducing the viscosity may not be sufficient. If the amount is more than 20 parts by mass, physical properties such as adhesiveness may be deteriorated.
- photopolymerization initiator when photocuring the curable resin composition of this invention, you may add a photoinitiator.
- photopolymerization initiators include onium salts such as aromatic sulfonium salts and aromatic iodonium salts with anions such as hexafluoroantimonate, hexafluorophosphate, and tetraphenylborate, and light such as aromatic diazonium salts and metallocene salts.
- Examples include cationic polymerization initiators (photoacid generators). These photopolymerization initiators may be used alone or in combination of two or more.
- compounding component can be used as needed.
- Other compounding components include azo-type chemical foaming agents and expansion agents such as thermally expandable microballoons, fiber pulps such as aramid pulp, colorants such as pigments and dyes, extenders, ultraviolet absorbers, antioxidants, Stabilizer (anti-gelling agent), plasticizer, leveling agent, antifoaming agent, silane coupling agent, antistatic agent, flame retardant, lubricant, thinning agent, low shrinkage agent, organic filler, thermoplastic resin, A desiccant, a dispersing agent, etc. are mentioned.
- azo-type chemical foaming agents and expansion agents such as thermally expandable microballoons, fiber pulps such as aramid pulp, colorants such as pigments and dyes, extenders, ultraviolet absorbers, antioxidants, Stabilizer (anti-gelling agent), plasticizer, leveling agent, antifoaming agent, silane coupling agent, antistatic agent, flame retardant, lubricant, thinning agent, low shrinkage
- the curable resin composition of the present invention is a composition containing polymer fine particles (B) in the curable resin composition containing the component (A) as a main component, preferably the polymer fine particles (B) are 1 It is a composition dispersed in the form of secondary particles.
- polymer fine particles obtained in an aqueous latex state can be used as the component (A).
- examples include a method of removing unnecessary components such as water after contact, and a method of once removing polymer fine particles into an organic solvent and then mixing with the component (A), and then removing the organic solvent.
- WO 2005/028546 It is preferable to use the method described in the pamphlet.
- the specific production method is as follows: an aqueous latex containing polymer fine particles (B) (specifically, a reaction mixture after producing polymer fine particles by emulsion polymerization) has a solubility in water at 20 ° C.
- the first step of aggregating the polymer particles, and separating and collecting the agglomerated polymer fine particles (B) from the liquid phase After mixing with an organic solvent of 40% by mass or less and further mixing with excess water, the first step of aggregating the polymer particles, and separating and collecting the agglomerated polymer fine particles (B) from the liquid phase, A second step of mixing with an organic solvent to obtain an organic solvent solution of the polymer fine particles (B), and a third step of further distilling off the organic solvent after further mixing the organic solvent solution with the component (A). It is preferable to be prepared by.
- the component (A) is liquid at 23 ° C. because the third step is easy.
- “Liquid at 23 ° C.” means that the softening point is 23 ° C. or lower, and indicates fluidity at 23 ° C.
- the components (A), (C), (D), (E) The curable resin composition of the present invention in which the polymer fine particles (B) are dispersed in the form of primary particles can be obtained by further mixing the components and each of the other blending components as necessary.
- the powdered polymer fine particles (B) obtained by coagulation by a method such as salting out and the like are dried using a disperser having high mechanical shearing force such as three paint rolls, a roll mill, and a kneader.
- a disperser having high mechanical shearing force such as three paint rolls, a roll mill, and a kneader.
- the component (A) and the component (B) can disperse the component (B) efficiently by applying a mechanical shearing force at a high temperature.
- the temperature at the time of dispersion is preferably 50 to 200 ° C, more preferably 70 to 170 ° C, still more preferably 80 to 150 ° C, and particularly preferably 90 to 120 ° C.
- the component (B) may not be sufficiently dispersed.
- the component (A) or the component (B) may be thermally deteriorated.
- the curable resin composition of the present invention can be used as a one-component curable resin composition in which all the components are blended in advance and stored in a hermetically sealed state and cured by heating or light irradiation after application. Moreover, it contains (A) component as a main component, further contains (B) component and A liquid containing (C) component as required, (D) component and (E) component, and further if necessary Prepared as a two-component or multi-component curable resin composition comprising a separately prepared B solution containing the component (B) and / or the component (C), and the A solution and the B solution are used. It can also be mixed before use.
- the curable composition of this invention is excellent in storage stability, when it is used as a one-pack type curable resin composition, it is especially useful.
- the component (B) and the component (C) are only required to be contained in at least one of the liquid A and the liquid B, for example, only the liquid A, only the liquid B, It may be included in both.
- the present invention includes a cured product obtained by curing the curable resin composition.
- a curable resin composition in which polymer fine particles are dispersed in the form of primary particles
- a cured product in which the polymer fine particles are uniformly dispersed can be easily obtained by curing this.
- the polymer fine particles hardly swell and the viscosity of the curable resin composition is low, a cured product can be obtained with good workability.
- the curable resin composition of the present invention can be applied by any method. It can be applied at a low temperature of about room temperature, and can be applied by heating as necessary. Since the curable resin composition of the present invention is excellent in storage stability, it is particularly useful for a method of applying by heating.
- the curable resin composition of the present invention is extruded onto a substrate in the form of a bead, monofilament or swirl using a coating robot, or a mechanical coating method such as a caulking gun or other manual coating means. It can also be used.
- the composition can also be applied to the substrate using a jet spray method or a streaming method.
- the curable resin composition of the present invention is applied to one or both substrates, and the substrates are brought into contact with each other so that the composition is disposed between the substrates to be bonded, and bonded by curing.
- the viscosity of the curable resin composition is not particularly limited, and is preferably about 150 to 600 Pa ⁇ s at 45 ° C.
- a pressure of about 20 to 400 Pa ⁇ s at 45 ° C. is preferable.
- the curable resin composition of the present invention When used as an adhesive for vehicles, it is effective to increase the viscosity of the composition in order to improve the “hardness to be washed off”.
- the resin composition is preferable because it has high thixotropy and tends to have a high viscosity.
- a highly viscous composition can be adjusted to a viscosity that can be applied by heating.
- a polymer compound having a crystalline melting point near the coating temperature of the composition is used as the curable composition of the present invention. It is preferable to blend in.
- the composition has a low viscosity at the coating temperature (easy to apply), and a high viscosity at the temperature in the washing shower step, thus improving the “hardness to be washed off”.
- the polymer compound having a crystalline melting point near the coating temperature include various polyester resins such as crystalline or semicrystalline polyester polyols.
- a curable resin composition is made into a two-pack type, and as a curing agent to be used, amino And a method of using a latent curing agent such as dicyandiamide, which exhibits activity at a high temperature, using a small amount of a curing agent capable of being cured at room temperature (room temperature curing curing agent) such as an amine-based curing agent having a group or an imino group.
- a latent curing agent such as dicyandiamide
- partial curing proceeds immediately after application of the composition, resulting in a high viscosity at the time of the water-washing shower process and improving the “hardness to be washed off”.
- the dynamic splitting resistance is preferably more than 19 kN / m, and more preferably 20 kN / m or more.
- the upper limit of the dynamic splitting resistance is not particularly limited, but is about 100 kN / m, for example.
- the dynamic split resistance can be evaluated by, for example, ISO 11343.
- the viscosity of the curable resin composition at 50 ° C. is, for example, 1 to 500 Pa ⁇ s, preferably 5 to 300 Pa ⁇ s, more preferably 10 to 200 Pa ⁇ s, and further preferably 20 to 100 Pa ⁇ s.
- ⁇ Adhesive substrate> When various substrates are bonded using the resin composition of the present invention, for example, wood, metal, plastic, glass or the like can be bonded. It is preferable to join automobile parts, more preferably joining of automobile frames or joining of an automobile frame and other automobile parts.
- the substrate include various plastic substrates such as steel materials such as cold rolled steel and hot dip galvanized steel, aluminum materials such as aluminum and coated aluminum, general-purpose plastics, engineering plastics, and composite materials such as CFRP and GFRP.
- the curable resin composition of the present invention is excellent in adhesiveness such as dynamic splitting resistance. Therefore, the members obtained by curing the curable resin composition are bonded after the curable resin composition of the present invention is sandwiched between a plurality of members including an aluminum substrate. A laminated body is preferable in order to show high adhesive strength. Since the curable resin composition of the present invention is excellent in toughness, it is suitable for joining different kinds of substrates having different linear expansion coefficients.
- the curable resin composition of the present invention can also be used for joining aerospace components, particularly exterior metal components.
- the curing temperature of the curable resin composition of the present invention is not particularly limited, but when used as a one-component curable resin composition, it is preferably 50 ° C. to 250 ° C., more preferably 80 ° C. to 220 ° C. 100 ° C. to 200 ° C. is more preferable, and 130 ° C. to 180 ° C. is particularly preferable.
- it is not particularly limited, but is preferably 0 ° C to 150 ° C, more preferably 10 ° C to 100 ° C, still more preferably 15 ° C to 80 ° C, and more preferably 20 ° C to 60 ° C. is particularly preferred.
- the curable resin composition of the present invention is used as an automobile adhesive, after the adhesive is applied to an automobile member, a coating is then applied, and the adhesive is cured at the same time as the coating is baked and cured. Is preferable from the viewpoint of process shortening and simplification.
- the composition of the present invention is preferably a one-component curable resin composition from the viewpoint of handleability.
- the composition of the present invention includes structural adhesives for vehicles and aircraft, adhesives such as structural adhesives for wind power generation, paints, materials for lamination with glass fibers, printed wiring board materials, solder resists, interlayer insulation Films, build-up materials, adhesives for FPC, electrical insulation materials such as encapsulants for electronic components such as semiconductors and LEDs, die bond materials, underfills, semiconductor mounting materials such as ACF, ACP, NCF, NCP, liquid crystal panels, OLEDs It is preferably used for a sealing device for display devices and lighting devices such as lighting and OLED displays. In particular, it is useful as a structural adhesive for vehicles.
- volume average particle diameter (Mv) of the polymer particles dispersed in the aqueous latex was measured using Microtrac UPA150 (manufactured by Nikkiso Co., Ltd.). A sample diluted with deionized water was used as a measurement sample. The measurement was performed by inputting the refractive index of water and the refractive index of each polymer particle, adjusting the sample concentration so that the measurement time was 600 seconds and the Signal Level was in the range of 0.6 to 0.8. .
- Polymerization was initiated by adding 0.03 parts by mass of paramentane hydroperoxide (PHP), followed by 0.10 parts by mass of sodium formaldehyde sulfoxylate (SFS). 0.025 parts by mass of PHP was added at 3, 5, and 7 hours from the start of polymerization.
- EDTA 0.0006 parts by mass and FE 0.003 parts by mass were added to polymerization at 4, 6 and 8 hours, respectively.
- the residual monomer was removed by devolatilization under reduced pressure to complete the polymerization, and a polybutadiene rubber latex (R-1) containing polybutadiene rubber as a main component was obtained.
- the volume average particle diameter of the polybutadiene rubber particles contained in the obtained latex was 0.08 ⁇ m.
- Production Example 1-2 Preparation of Polybutadiene Rubber Latex (R-2) 21 parts by mass of polybutadiene rubber latex (R-1) obtained in Production Example 1-1 (including 7 parts by mass of polybutadiene rubber) in a pressure-resistant polymerization machine. ), 185 parts by mass of deionized water, 0.03 part by mass of tripotassium phosphate, 0.002 part by mass of EDTA, and 0.001 part by mass of FE were added, and after substituting with nitrogen sufficiently to remove oxygen. , 93 parts by mass of BD was added to the system, and the temperature was raised to 45 ° C. Polymerization was started by adding 0.02 parts by weight of PHP and subsequently 0.10 parts by weight of SFS.
- Production Example 2-1 Preparation of core-shell polymer latex (L-1) A glass reactor having a thermometer, a stirrer, a reflux condenser, a nitrogen inlet, and a monomer addition apparatus was prepared in Production Example 1-2. 241 parts by mass of polybutadiene rubber latex (R-2) (including 80 parts by mass of polybutadiene rubber particles) and 71 parts by mass of deionized water were charged and stirred at 60 ° C. while purging with nitrogen.
- R-2 polybutadiene rubber latex
- a graft monomer (17 parts by mass of methyl methacrylate (MMA), 2 parts by mass of styrene (ST), 4-hydroxybutyl acrylate (4HBA ) 1 part by weight) and 0.06 parts by weight of cumene hydroperoxide (CHP) were continuously added over 120 minutes.
- 0.04 part by mass of CHP was added, and stirring was further continued for 2 hours to complete the polymerization to obtain an aqueous latex (L-1) containing a core-shell polymer.
- the polymerization conversion rate of the monomer component was 99% or more.
- the volume average particle size of the core-shell polymer contained in the obtained aqueous latex was 0.21 ⁇ m.
- Production Example 2-2 Preparation of Core-Shell Polymer Latex (L-2)
- ⁇ methyl methacrylate (MMA) 17 parts by mass, styrene (ST) 2 parts by mass, 4-hydroxybutyl acrylate Production Example 2-1 except that ⁇ methyl methacrylate (MMA) 14 parts by mass, styrene (ST) 2 parts by mass, 4-hydroxybutyl acrylate (4HBA) 4 parts by mass> was used instead of 4 HBA) 1 part by mass>.
- an aqueous latex (L-2) of a core-shell polymer was obtained.
- the volume average particle size of the core-shell polymer contained in the obtained aqueous latex was 0.21 ⁇ m.
- Production Example 2-3 Preparation of Core-Shell Polymer Latex (L-3)
- the graft monomer ⁇ 17 parts by mass of methyl methacrylate (MMA), 2 parts by mass of styrene (ST), 4-hydroxybutyl acrylate ( 4HBA) 1 part by weight>
- an aqueous latex of core-shell polymer (L -3) was obtained.
- the volume average particle size of the core-shell polymer contained in the obtained aqueous latex was 0.21 ⁇ m.
- Production Example 2-4 Preparation of Core-Shell Polymer Latex (L-4)
- the graft monomer was ⁇ 17 parts by mass of methyl methacrylate (MMA), 2 parts by mass of styrene (ST), 4-hydroxybutyl acrylate ( Production Example 2-1 except that ⁇ methyl methacrylate (MMA) 15 parts by mass, styrene (ST) 3 parts by mass, 4-hydroxybutyl acrylate (4HBA) 2 parts by mass> was used instead of 4 HBA) 1 part by mass>.
- an aqueous latex (L-4) of a core-shell polymer was obtained.
- the volume average particle size of the core-shell polymer contained in the obtained aqueous latex was 0.21 ⁇ m.
- Production Example 2-5 Preparation of Core-Shell Polymer Latex (L-5)
- the graft monomer ⁇ 17 parts by mass of methyl methacrylate (MMA), 2 parts by mass of styrene (ST), 4-hydroxybutyl acrylate ( Production Example 2-1 except that ⁇ methyl methacrylate (MMA) 13 parts by mass, styrene (ST) 3 parts by mass, 4-hydroxybutyl acrylate (4HBA) 4 parts by mass> was used instead of 4 HBA) 1 part by mass>.
- an aqueous latex (L-5) of a core-shell polymer was obtained.
- the volume average particle size of the core-shell polymer contained in the obtained aqueous latex was 0.21 ⁇ m.
- Production Example 2-6 Preparation of Core Shell Polymer Latex (L-6)
- ⁇ methyl methacrylate (MMA) 17 parts by mass, styrene (ST) 2 parts by mass, 4-hydroxybutyl acrylate Production Example 2-1 except that ⁇ methyl methacrylate (MMA) 11 parts by mass, styrene (ST) 3 parts by mass, 4-hydroxybutyl acrylate (4HBA) 6 parts by mass >> was used instead of (4 HBA) 1 part by mass>.
- an aqueous latex (L-6) of a core-shell polymer was obtained.
- the volume average particle size of the core-shell polymer contained in the obtained aqueous latex was 0.21 ⁇ m.
- Production Example 2-7 Preparation of Core-Shell Polymer Latex (L-7)
- 4HBA 4-hydroxybutyl acrylate
- an aqueous latex of a core-shell polymer (L -7) was obtained.
- the volume average particle size of the core-shell polymer contained in the obtained aqueous latex was 0.21 ⁇ m.
- agglomerate containing a part of the aqueous phase was left, and 360 g of the aqueous phase was discharged from the discharge port at the bottom of the tank.
- 90 g of MEK was added to the obtained aggregate and mixed uniformly to obtain a dispersion in which the core-shell polymer was uniformly dispersed.
- 120 g of epoxy resin (A-1: manufactured by Mitsubishi Chemical Corporation, JER828: liquid bisphenol A type epoxy resin) as component (A) was mixed. From this mixture, MEK was removed with a rotary evaporator.
- a dispersion (M-1) in which polymer fine particles were dispersed in an epoxy resin was obtained.
- Production Example 3-2 Preparation of Dispersion (M-2) Production Example 3 except that (L-2) was used instead of (L-1) as the aqueous latex of the core-shell polymer in Production Example 3-1.
- (M-2) was used instead of (L-1) as the aqueous latex of the core-shell polymer in Production Example 3-1.
- a dispersion (M-2) in which polymer fine particles were dispersed in an epoxy resin was obtained.
- Production Examples 3-4 to 7 Preparation of Dispersion (M-4 to 7)
- Production Example 3-1 as an aqueous latex of the core-shell polymer, instead of (L-1), Production Examples 2-4 to 7 were prepared.
- the same procedure as in Production Example 3-1 was conducted except that (L-4 to 7) obtained in Step 1 was used and 93.3 g of the epoxy resin (A-1) as component (A) was mixed instead of 120 g.
- a dispersion (M-4 to 7) in which polymer fine particles were dispersed in an epoxy resin was obtained.
- the curable resin compositions of Examples 1 to 3 containing the component (A), the component (B), and the component (C) of the present invention are excellent in impact-resistant peel adhesion.
- the amount of component (A) contained in the curable resin composition of Table 1 is the component added as an epoxy resin, the component contained in the polymer fine particle dispersion (M), and the rubber-modified epoxy resin or urethane-modified resin. It is the amount obtained by adding the components contained in the epoxy resin.
- the component (B) of the present invention means polymer fine particles that satisfy a predetermined hydroxy group content.
- Examples 4 to 6, Comparative Example 9 According to the formulation shown in Table 2, each component was weighed and mixed well to obtain a curable resin composition. Using each composition in Table 2, the viscosity and dynamic splitting resistance were measured by the following methods. The results are shown in Table 2.
- ⁇ Viscosity> The viscosity of the curable resin composition was measured using a digital viscometer DV-II + Pro type manufactured by BROOKFIELD. Using a spindle CPE-52, the viscosity at 50 ° C. was measured at a shear rate of 2 (s ⁇ 1 ).
- ⁇ Dynamic splitting resistance (impact peel resistance)> The curable resin composition was applied to two SPCC steel plates, overlapped so as to have an adhesive layer thickness of 0.25 mm, cured under the conditions of 170 ° C. ⁇ 60 minutes, and dynamically split at 23 ° C. according to ISO 11343. Resistance was measured.
- the curable resin compositions of Examples 4 to 6 containing the component (A), the component (B), and the component (C) of the present invention are excellent in impact peel adhesion.
- the curable resin compositions of Example 4 and Example 5 were compositions having a relatively low viscosity and good workability.
- the amount of component (A) contained in the curable resin composition in Table 2 is an amount obtained by adding the component added as an epoxy resin and the component contained in the dispersion (M) of polymer fine particles.
- the component (B) of the present invention means polymer fine particles that satisfy a predetermined hydroxy group content.
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Abstract
Description
他方、前記特許文献4には、コアシェルポリマー微粒子のシェル層を構成するポリマーとして、接着剤組成物中のエポキシ樹脂やエポキシ硬化剤と化学的に反応し得る官能基を有することが好ましい旨の記載がある。それら官能基として、特許文献4には、エポキシ基、ヒドロキシ基、アミノ基、アミド基、カルボキシ基等の各種官能基が記載されている。また、コアシェルポリマー微粒子以外の強化剤として、ゴム変性エポキシ、ブロックドウレタン、ウレタン変性エポキシ樹脂などの各種強化剤が記載されている。しかしながら、シェル層の特定の官能基と、特定の強化剤との好ましい組み合わせに関する記載はなく、その組み合わせによる特異な耐衝撃剥離接着性改善効果は示唆されていない。また、コアシェルポリマー微粒子のシェル層の官能基(ヒドロキシ基)と強化剤(ブロックドウレタン)との化学的結合を意図した硬化性樹脂組成物の設計概念に関する記載は、特許文献4には見られない。
本発明の別の好ましい課題は、得られる硬化物の耐衝撃剥離接着性に優れ、粘度上昇を抑制できる硬化性樹脂組成物を提供することである。
[1] エポキシ樹脂(A)100質量部に対して、コア層がジエン系ゴムであり、シェル層にヒドロキシ基を有するコアシェル構造を有するポリマー微粒子(B)1~100質量部、ブロックドウレタン(C)1~100質量部を含有する硬化性樹脂組成物であって、ポリマー微粒子(B)中のヒドロキシ基の含有量が、0.01~0.8mmol/gであることを特徴とする硬化性樹脂組成物。
[2] ポリマー微粒子(B)が、ヒドロキシ基を有するモノマーと、芳香族ビニルモノマー、ビニルシアンモノマー、および(メタ)アクリレートモノマーよりなる群から選択される1種以上のモノマーとを、コア層にグラフト重合してなるシェル層を有する[1]に記載の硬化性樹脂組成物。
[3] ジエン系ゴムが、ブタジエンゴム、および/または、ブタジエン-スチレンゴムである[1]または[2]に記載の硬化性樹脂組成物。
[4] ブロックドウレタン(C)が、ポリアルキレングリコール構造を含むウレタンプレポリマーをブロック剤でキャップした化合物である[1]~[3]のいずれかに記載の硬化性樹脂組成物。
[5] ポリマー微粒子(B)/ブロックドウレタン(C)の質量比が、0.2~5である[1]~[4]のいずれかに記載の硬化性樹脂組成物。
[6] エポキシ樹脂(A)がポリエポキシドの反応性希釈剤を含み、前記反応性希釈剤の量がエポキシ樹脂(A)100質量%中0.5~20質量%である[1]~[5]のいずれかに記載の硬化性樹脂組成物。
[7] ポリマー微粒子(B)中のヒドロキシ基の含有量が、0.01~0.4mmol/gである[1]~[6]のいずれかに記載の硬化性樹脂組成物。
[8] エポキシ樹脂(A)成分100質量部に対して、更に、エポキシ硬化剤(D)1~80質量部を含有する[1]~[7]のいずれかに記載の硬化性樹脂組成物。
[9] エポキシ樹脂(A)成分100質量部に対して、更に、硬化促進剤(E)0.1~10質量部を含有する[1]~[8]のいずれかに記載の硬化性樹脂組成物。
[10] ポリマー微粒子(B)は、該硬化性樹脂組成物中で1次粒子の状態で分散している[1]~[9]のいずれかに記載の硬化性樹脂組成物。
[11] 硬化性樹脂組成物の硬化後に、動的割裂抵抗力が19kN/m超である[1]~[10]のいずれかに記載の硬化性樹脂組成物
[12] 前記[1]~[11]いずれかに記載の硬化性樹脂組成物を硬化した硬化物。
[13] [1]~[11]のいずれかに記載の一液型硬化性樹脂組成物。
[14] [1]~[11]のいずれかに記載の硬化性樹脂組成物を用いてなる構造接着剤。
本発明の硬化性樹脂組成物は、エポキシ樹脂(A)100質量部に対して、コア層がジエン系ゴムであり、シェル層にヒドロキシ基を有するコアシェル構造を有するポリマー微粒子(B)1~100質量部、ブロックドウレタン(C)1~100質量部を含有する硬化性樹脂組成物であって、(B)成分中のヒドロキシ基の含有量が、0.01~0.8mmol/gであることを特徴とする。以下、エポキシ樹脂(A)、ポリマー微粒子(B)、ブロックドウレタン(C)は、それぞれ、(A)成分、(B)成分、(C)成分で表す場合がある。
本発明の硬化性樹脂組成物の主成分として、エポキシ樹脂(A)を使用する。
エポキシ樹脂としては、後述のゴム変性エポキシ樹脂とウレタン変性エポキシ樹脂を除く、各種の硬質のエポキシ樹脂を使用することができ、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールAD型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ノボラック型エポキシ樹脂、ビスフェノールAプロピレンオキシド付加物のグリシジルエーテル型エポキシ樹脂、水添ビスフェノールA(又はF)型エポキシ樹脂、フッ素化エポキシ樹脂、テトラブロモビスフェノールAのグリシジルエーテルなどの難燃型エポキシ樹脂、p-オキシ安息香酸グリシジルエーテルエステル型エポキシ樹脂、m-アミノフェノール型エポキシ樹脂、ジアミノジフェニルメタン系エポキシ樹脂、各種脂環式エポキシ樹脂、N,N-ジグリシジルアニリン、N,N-ジグリシジル-o-トルイジン、トリグリシジルイソシアヌレート、ジビニルベンゼンジオキシド、レゾルシノールジグリシジルエーテル、ポリアルキレングリコールジグリシジルエーテル、グリコールジグリシジルエーテル、脂肪族多塩基酸のジグリシジルエステル、グリセリンのような二価以上の多価脂肪族アルコールのグリシジルエーテル、キレート変性エポキシ樹脂、ヒダントイン型エポキシ樹脂、石油樹脂などのような不飽和重合体のエポキシ化物、含アミノグリシジルエーテル樹脂や、上記のエポキシ樹脂にビスフェノールA(又はF)類または多塩基酸類等を付加反応させて得られるエポキシ化合物などが例示されるが、これらに限定されるものではなく、一般に使用されているエポキシ樹脂が使用され得る。
これらのエポキシ樹脂の中でもエポキシ基を一分子中に少なくとも2個有するものが、硬化に際し、反応性が高く硬化物が3次元的網目を作りやすいなどの点から好ましい。
特に、エポキシ当量が220未満のビスフェノールA型エポキシ樹脂やビスフェノールF型エポキシ樹脂は、常温で液体であり、得られる硬化性樹脂組成物の取扱い性がよい為に好ましい。
本発明の硬化性樹脂組成物は、(A)成分100質量部に対して、コア層がジエン系ゴムであり、シェル層にヒドロキシ基を0.01~0.8mmol/g含有するコアシェル構造を有するポリマー微粒子(B)1~100質量部を使用する。(B)成分の靱性改良効果により、得られる硬化物は靱性および耐衝撃剥離接着性に優れる。
≪コア層≫
コア層は、本発明の硬化性樹脂組成物の硬化物の靱性を高める為に、ゴムとしての性質を有する弾性コア層であることが好ましい。ゴムとして性質を有するためには、本発明の弾性コア層は、ゲル含量が60質量%以上であることが好ましく、80質量%以上であることがより好ましく、90質量%以上であることがさらに好ましく、95質量%以上であることが特に好ましい。なお、本明細書でいうゲル含量とは、凝固、乾燥により得られたポリマー微粒子0.5gをトルエン100gに浸漬し、23℃で24時間静置した後に不溶分と可溶分を分別したときの、不溶分と可溶分の合計量に対する不溶分の比率を意味する。
本発明では、必要により、中間層を形成させてもよい。特に、中間層として、以下のゴム表面架橋層を形成させてもよい。得られる硬化物の靱性改良効果および耐衝撃剥離接着性改良効果の点からは、中間層を含有しない事、特に、以下のゴム表面架橋層を含有しないことが好ましい。
ポリマー微粒子の最も外側に存在するシェル層は、シェル形成用モノマーを重合したものであるが、ポリマー微粒子(B)成分と(A)成分との相溶性を向上させ、本発明の硬化性樹脂組成物、又はその硬化物中においてポリマー微粒子が一次粒子の状態で分散することを可能にする役割を担うシェルポリマーからなる。
ヒドロキシ基を有するモノマーは、シェル層の形成に使用することが好ましく、シェル層のみに使用することがより好ましい。
エポキシ基を有するモノマーは、シェル層の形成に使用することが好ましく、シェル層のみに使用することがより好ましい。
シェル層のグラフト率は、70%以上(より好ましくは80%以上、さらには90%以上)であることが好ましい。グラフト率が70%未満の場合には、液状樹脂組成物の粘度が上昇する場合がある。なお、本明細書において、グラフト率の算出方法は下記の通りである。
(コア層の製造方法)
本発明で用いるポリマー微粒子を構成するコア層を形成するポリマーが、ジエン系モノマー(共役ジエン系モノマー)および(メタ)アクリレート系モノマーから選ばれる少なくとも1種のモノマー(第1モノマー)を含んで構成される場合には、コア層の形成は、例えば、乳化重合、懸濁重合、マイクロサスペンジョン重合などによって製造することができ、例えばWO2005/028546号パンフレットに記載の方法を用いることができる。
中間層は、中間層形成用モノマーを公知のラジカル重合により重合することによって形成することができる。コア層を構成するゴム弾性体をエマルジョンとして得た場合には、ラジカル重合性二重結合を2以上有するモノマーの重合は乳化重合法により行うことが好ましい。
本発明の硬化性樹脂組成物では、(A)成分100質量部に対して、ブロックドウレタン(C)1~100質量部を含有することが必須である。(C)成分は、前述の(B)成分であるシェル層にヒドロキシ基を有するポリマー微粒子と組み合わせることにより、得られる硬化性樹脂組成物を硬化して得られる硬化物は、耐衝撃剥離接着性が著しく優れる。
A-(NR2-C(=O)-X)a (1)
(式中、a個のR2は、それぞれ独立に、炭素原子数1~20の炭化水素基である。aはキャップされたイソシアネート基の1分子当たりの平均数を表し、1.1個以上が好ましく、1.5~8個がより好ましく、1.7~6個が更に好ましく、2~4個が特に好ましい。Xは、前記ブロック剤から活性水素原子を除いた残基である。Aは、イソシアネート末端化プレポリマーから末端イソシアネート基を除いた残基である。)で表される。
末端に活性水素含有基を有する有機重合体を構成する主鎖骨格としては、ポリエーテル系重合体、ポリアクリル系重合体、ポリエステル系重合体、ポリジエン系重合体、飽和炭化水素系重合体(ポリオレフィン)、ポリチオエーテル系重合体などが挙げられる。
末端に活性水素含有基を有する有機重合体を構成する活性水素含有基としては、水酸基、アミノ基、イミノ基、チオール基が挙げられる。これらの中でも、入手性の点から、水酸基、アミノ基、イミノ基が好ましく、更に得られるブロックドウレタンの取扱い易さ(粘度)の点から、水酸基がより好ましい。
前記ポリエーテル系重合体は、本質的に一般式(2):
-R1-O- (2)
(式中、R1は、炭素原子数1から14の直鎖状もしくは分岐アルキレン基である。)で示される繰り返し単位を有する重合体であり、一般式(2)におけるR1は、炭素原子数1から14の、好ましくは2から4の、直鎖状もしくは分岐状アルキレン基が好ましい。一般式(2)で示される繰り返し単位の具体例としては、-CH2O-、-CH2CH2O-、-CH2CH(CH3)O-、-CH2CH(C2H5)O-、-CH2C(CH3)2O-、-CH2CH2CH2CH2O-等が挙げられる。ポリエーテル系重合体の主鎖骨格は、1種類だけの繰り返し単位からなってもよいし、2種類以上の繰り返し単位からなってもよい。特に、プロピレンオキシドの繰り返し単位を50質量%以上有するポリプロピレングリコールを主成分とする重合体から成るものは、T字剥離接着強さの観点で好ましい。また、テトラヒドロフランを開環重合して得られるポリテトラメチレングリコール(PTMG)を主成分とする重合体から成るものは、動的割裂抵抗力の観点で、好ましい。
前記ポリエーテルポリオールは、末端に水酸基を有するポリエーテル系重合体であり、前記ポリエーテルアミンは、末端にアミノ基またはイミノ基を有するポリエーテル系重合体である。
前記ポリアクリルポリオールとしては、(メタ)アクリル酸アルキルエステル(共)重合体を骨格とし、かつ、分子内に水酸基を有するポリオールを挙げることができる。特に、2-ヒドロキシエチルメタクリレート等の水酸基含有(メタ)アクリル酸アルキルエステルモノマーを共重合して得られるポリアクリルポリオールが好ましい。
前記ポリエステルポリオールとしては、マレイン酸、フマル酸、アジピン酸、フタル酸等の多塩基酸およびその酸無水物と、エチレングリコール、プロピレングリコール、1,4-ブタンジオール、1,6-へキサンジオール、ジエチレングリコール、ジプロピレングリコール、ネオペンチルグリコール等の多価アルコールとを、エステル化触媒の存在下、150~270℃の温度範囲で重縮合させて得られる重合体が挙げられる。また、ε-カプロラクトン、バレロラクトン等の開環重合物やポリカーボネートジオールやヒマシ油等の活性水素を2個以上有する活性水素化合物等も挙げられる。
前記ポリジエンポリオールとしては、ポリブタジエンポリオール、ポリイソプレンポリオール、ポリクロロプレンポリオールなどを挙げることができ、特に、ポリブタジエンポリオールが好ましい。
前記ポリオレフィンポリオールとしては、ポリイソブチレンポリオール、水添ポリブタジエンポリオールなどを挙げることができる。
前記ポリイソシアネート化合物の具体例としては、トルエン(トリレン)ジイソシアネート、ジフェニルメタンジイソシアネート、キシリレンジイソシアネート等の芳香族系ポリイソシアネート;イソフォロンジイソシアネート、ヘキサメチレンジイソシアネート、水素化トルエンジイソシアネート、水素化ジフェニルメタンジイソシアネート等の脂肪族系ポリイソシアネートなどを挙げることができる。これらの中でも、耐熱性の点から、脂肪族系ポリイソシアネートが好ましく、更に入手性の点から、イソフォロンジイソシアネートやヘキサメチレンジイソシアネートがより好ましい。
前記ブロック剤は、例えば、第一級アミン系ブロック剤、第二級アミン系ブロック剤、オキシム系ブロック剤、ラクタム系ブロック剤、活性メチレン系ブロック剤、アルコール系ブロック剤、メルカプタン系ブロック剤、アミド系ブロック剤、イミド系ブロック剤、複素環式芳香族化合物系ブロック剤、ヒドロキシ官能性(メタ)アクリレート系ブロック剤、フェノール系ブロック剤が挙げられる。これらの中でも、オキシム系ブロック剤、ラクタム系ブロック剤、ヒドロキシ官能性(メタ)アクリレート系ブロック剤、フェノール系ブロック剤が好ましく、ヒドロキシ官能性(メタ)アクリレート系ブロック剤、フェノール系ブロック剤がより好ましく、フェノール系ブロック剤が更に好ましい。
ポリプロピレングリコール構造を含むウレタンプレポリマーをブロック剤(好ましくはフェノール系ブロック剤)でキャップした化合物は、動的割裂抵抗力に加え、T字剥離接着強さを改善する観点から使用されてもよく、ポリテトラメチレングリコール構造を含むウレタンプレポリマーをブロック剤(好ましくはフェノール系ブロック剤)でキャップした化合物は、ポリプロピレングリコール構造を含むウレタンプレポリマーをブロック剤(好ましくはフェノール系ブロック剤)でキャップした化合物よりも動的割裂抵抗力を改善する観点から使用されてもよい。
前記架橋剤の分子量は750以下が好ましく、より好ましくは50~500であり、かつ、1分子当たり少なくとも3個のヒドロキシル基、アミノ基および/またはイミノ基を有するポリオールまたはポリアミン化合物である。架橋剤はブロックドウレタンに分岐を付与し、ブロックドウレタンの官能価(即ち、キャップされたイソシアネート基の1分子当たりの数)を増加させるのに有用である。
前記鎖延長剤の分子量は750以下が好ましく、より好ましくは50~500であり、かつ、1分子当たり2個のヒドロキシル基、アミノ基および/またはイミノ基を有するポリオールまたはポリアミン化合物である。鎖延長剤は、官能価を増加させずにブロックドウレタンの分子量を上げるのに有用である。
(C)成分の使用量は、(A)成分100質量部に対して、1~100質量部であり、2~50質量部が好ましく、3~40質量部がより好ましく、5~30質量部が特に好ましい。1質量部未満では、得られる硬化物の耐衝撃剥離接着性が低下する場合がある。100質量部より多いと、得られる硬化物の耐熱性や弾性率(剛性)が低い場合がある。
(C)成分は単独で用いても良く2種以上併用してもよい。
本発明では、必要に応じてエポキシ硬化剤(D)を使用することができる。
本発明の硬化性樹脂組成物を仮に一成分型組成物(一液型硬化性樹脂組成物など)として使用する場合、80℃以上、好ましくは140℃以上の温度まで加熱すると接着剤が急速に硬化するように(D)成分を選択するのが好ましい。逆に、室温(約22℃)や少なくとも50℃までの温度では硬化するとしても非常にゆっくりとなるよう、(D)成分および後述の(E)成分を選択するのが好ましい。
本発明では、必要に応じて硬化促進剤(E)を使用することができる。
(E)成分は、エポキシ基と、硬化剤や接着剤の他の成分上のエポキシド反応性基との反応)を促進するための触媒である。
本発明では、靭性、耐衝撃性、せん断接着性、及び、剥離接着性などの性能を更に向上させる目的で、(B)成分および(C)成分以外の強化剤として、エポキシ樹脂(A)には含まれないゴム変性エポキシ樹脂、または、ウレタン変性エポキシ樹脂を、必要に応じて使用することができる。
(B)成分および(C)成分以外の強化剤は、単独で用いてもよく2種以上併用してもよい。
ゴム変性エポキシ樹脂は、ゴムとエポキシ基含有化合物とを反応させて得た、1分子当り平均して、エポキシ基を1.1個以上、好ましくは2個以上有する反応生成物であり、ゴムとしては,アクリロニトリルブタジエンゴム(NBR),スチレンブタジエンゴム(SBR)、水素添加ニトリルゴム(HNBR)、エチレンプロピレンゴム(EPDM)、アクリルゴム(ACM)、ブチルゴム(IIR)、ブタジエンゴム、ポリプロピレンオキシドやポリエチレンオキシドやポリテトラメチレンオキシド等のポリオキシアルキレンなどのゴム系重合体を挙げることができる。該ゴム系重合体は、アミノ基、ヒドロキシ基、またはカルボキシル基等の反応性基を末端に有するものが好ましい。これらのゴム系重合体とエポキシ樹脂とを公知の方法により適宜の配合比にて反応させた生成物が本発明に使用されるゴム変性エポキシ樹脂である。これらの中でも、アクリロニトリル-ブタジエンゴム変性エポキシ樹脂や、ポリオキシアルキレン変性エポキシ樹脂が、得られる硬化性樹脂組成物の接着性や耐衝撃剥離接着性の観点から好ましく、アクリロニトリル-ブタジエンゴム変性エポキシ樹脂がより好ましい。なお、アクリロニトリル-ブタジエンゴム変性エポキシ樹脂は、例えば、カルボキシル基末端NBR(CTBN)とビスフェノールA型エポキシ樹脂との反応により得られる。
ウレタン変性エポキシ樹脂は、イソシアネート基との反応性を有する基とエポキシ基とを含有する化合物と、イソシアネート基を含有するウレタンプレポリマーを反応させて得た、1分子当り平均して、エポキシ基を1.1個以上、好ましくは2個以上有する反応生成物である。例えば、ヒドロキシ基含有エポキシ化合物とウレタンプレポリマーを反応させることにより、ウレタン変性エポキシ樹脂が得られる。
本発明の硬化性樹脂組成物は、無機充填材として、ケイ酸および/またはケイ酸塩を添加することができる。
具体例としては、乾式シリカ、湿式シリカ、ケイ酸アルミニウム、ケイ酸マグネシウム、ケイ酸カルシウム、ウォラストナイト、タルクなどが挙げられる。
無機充填材は、表面処理剤により表面処理していることが好ましい。表面処理により無機充填材の組成物への分散性が向上し、その結果、得られる硬化物の各種物性が向上する。
本発明の硬化性樹脂組成物は、酸化カルシウムを添加することができる。
酸化カルシウムは、硬化性樹脂組成物中の水分との反応により水分を除去し、水分の存在により引き起こされる種々の物性上の問題を解決する。例えば、水分除去による気泡防止剤として機能し、接着強度の低下を抑制する。
本発明では、分子内に2個以上の二重結合を有するラジカル硬化性樹脂を、必要に応じて使用することができる。また、必要により、分子内に少なくとも1個の二重結合を有する分子量300未満の低分子化合物を添加することができる。前記低分子化合物は、前記ラジカル硬化性樹脂との併用により、粘度や硬化物の物性や硬化速度を調整する機能を有し、ラジカル硬化性樹脂の所謂反応性希釈剤として機能するものである。更に、本発明の硬化性樹脂組成物には、ラジカル重合開始剤を添加することができる。ここで、ラジカル重合開始剤は、温度を上げる(好ましくは、約50℃~約150℃)と活性化される潜在的なタイプであることが好ましい。
本発明では、必要に応じて、モノエポキシドを使用することができる。モノエポキシドは反応性希釈剤として機能しうる。モノエポキシドの具体例としては、例えばブチルグリシジルエーテルなどの脂肪族グリシジルエーテル、あるいは例えばフェニルグリシジルエーテル、クレジルグリシジルエーテルなどの芳香族グリシジルエーテル、例えば2-エチルヘキシルグリシジルエーテルなどの炭素数8~10のアルキル基とグリシジル基とからなるエーテル、例えばp-tertブチルフェニルグリシジルエーテルなどの炭素数2~8のアルキル基で置換され得る炭素数6~12のフェニル基とグリシジル基とからなるエーテル、例えばドデシルグリシジルエーテルなどの炭素数12~14のアルキル基とグリシジル基とからなるエーテル;例えばグリシジル(メタ)アクリレート、グリシジルマレエートなどの脂肪族グリシジルエステル;バーサチック酸グリシジルエステル、ネオデカン酸グリシジルエステル、ラウリン酸グリシジルエステルなどの炭素数8~12の脂肪族カルボン酸のグリシジルエステル;p-t-ブチル安息香酸グリシジルエステルなどが挙げられる。
また、本発明の硬化性樹脂組成物を光硬化する場合には、光重合開始剤を添加してもよい。かかる光重合開始剤としては、ヘキサフルオロアンチモネート、ヘキサフルオロホスフェート、テトラフェニルボレートなどのアニオンとの芳香族スルホニウム塩や芳香族ヨードニウム塩などのオニウム塩や、芳香族ジアゾニウム塩、メタロセン塩などの光カチオン重合開始剤(光酸発生剤)などが挙げられる。これらの光重合開始剤は単独で用いても、2種以上を組み合わせて用いてもよい。
本発明では、必要に応じて、その他の配合成分を使用することができる。その他の配合成分としては、アゾタイプ化学的発泡剤や熱膨張性マイクロバルーンなどの膨張剤、アラミド系パルプなどの繊維パルプ、顔料や染料等の着色剤、体質顔料、紫外線吸収剤、酸化防止剤、安定化剤(ゲル化防止剤)、可塑剤、レベリング剤、消泡剤、シランカップリング剤、帯電防止剤、難燃剤、滑剤、減粘剤、低収縮剤、有機質充填剤、熱可塑性樹脂、乾燥剤、分散剤等が挙げられる。
本発明の硬化性樹脂組成物は、(A)成分を主成分とする硬化性樹脂組成物中に、ポリマー微粒子(B)を含有する組成物であり、好ましくは、ポリマー微粒子(B)が1次粒子の状態で分散した組成物である。
本発明には、上記硬化性樹脂組成物を硬化した硬化物が含まれる。ポリマー微粒子が一次粒子の状態で分散している硬化性樹脂組成物の場合には、これを硬化することによって、ポリマー微粒子が均一に分散した硬化物を容易に得ることができる。また、ポリマー微粒子が膨潤し難く、硬化性樹脂組成物の粘性が低いことから、硬化物を作業性よく得ることができる。
本発明の硬化性樹脂組成物は、任意の方法によって塗布可能である。室温程度の低温で塗布可能であり、必要に応じて加温して塗布することも可能である。本発明の硬化性樹脂組成物は、貯蔵安定性に優れる為に、加温して塗布する工法に特に有用である。
硬化性樹脂組成物の50℃での粘度は、例えば1~500Pa・sであり、好ましくは5~300Pa・s、より好ましくは10~200Pa・s、さらに好ましくは20~100Pa・sである。
本発明の樹脂組成物を使用して、様々な基板同士を接着させる場合、例えば、木材、金属、プラスチック、ガラス等を接合することができる。自動車部品を接合することが好ましく、自動車フレーム同士の接合または自動車フレームと他の自動車部品との接合がより好ましい。基板としては、冷間圧延鋼や溶融亜鉛メッキ鋼などの鋼材、アルミニウムや被覆アルミニウムなどのアルミニウム材、汎用プラスチック、エンジニアリングプラスチック、CFRPやGFRP等の複合材料等の各種のプラスチック系基板が挙げられる。
本発明の硬化性樹脂組成物は、靭性に優れる為に、線膨張係数の異なる異種基材間の接合に適している。
また、本発明の硬化性樹脂組成物は、航空宇宙用の構成材、特に、外装金属構成材の接合にも使用できる。
本発明の硬化性樹脂組成物の硬化温度は、特に限定はないが、一液型硬化性樹脂組成物として使用する場合には、50℃~250℃が好ましく、80℃~220℃がより好ましく、100℃~200℃が更に好ましく、130℃~180℃が特に好ましい。二液型硬化性樹脂組成物として使用する場合には、特に限定はないが、0℃~150℃が好ましく、10℃~100℃がより好ましく、15℃~80℃が更に好ましく、20℃~60℃が特に好ましい。
本発明の組成物は、取扱い性の点から、一液型の硬化性樹脂組成物であるのが好ましい。
本発明の組成物は、車両や航空機向けの構造用接着剤、風力発電用構造接着剤などの接着剤、塗料、ガラス繊維との積層用材料、およびプリント配線基板用材料、ソルダーレジスト、層間絶縁膜、ビルドアップ材料、FPC用接着剤、半導体・LED等電子部品用封止材等の電気絶縁材料、ダイボンド材料、アンダーフィル、ACF、ACP、NCF、NCP等の半導体実装材料、液晶パネル、OLED照明、OLEDディスプレイ等の表示機器・照明機器用封止材の用途に好ましく用いられる。特に、車両用構造接着剤として有用である。
先ず、実施例および比較例によって製造した硬化性樹脂組成物の評価方法について、以下説明する。
水性ラテックスに分散しているポリマー粒子の体積平均粒子径(Mv)は、マイクロトラックUPA150(日機装株式会社製)を用いて測定した。脱イオン水で希釈したものを測定試料として用いた。測定は、水の屈折率、およびそれぞれのポリマー粒子の屈折率を入力し、計測時間600秒、Signal Levelが0.6~0.8の範囲内になるように試料濃度を調整して行った。
製造例1-1;ポリブタジエンゴムラテックス(R-1)の調製
耐圧重合機中に、脱イオン水200質量部、リン酸三カリウム0.03質量部、エチレンジアミン四酢酸二ナトリウム(EDTA)0.002質量部、硫酸第一鉄・7水和塩(FE)0.001質量部、及び、ドデシルベンゼンスルホン酸ナトリウム(SDS)1.55質量部を投入し、撹拌しつつ十分に窒素置換を行なって酸素を除いた後、ブタジエン(BD)99.6質量部とt-ドデシルメルカプタン0.4質量部を系中に投入し、45℃に昇温した。パラメンタンハイドロパーオキサイド(PHP)0.03質量部、続いてナトリウムホルムアルデヒドスルホキシレート(SFS)0.10質量部を投入し重合を開始した。重合開始から3、5、7時間目それぞれに、PHP0.025質量部を投入した。また、重合開始4、6、8時間目それぞれに、EDTA0.0006質量部、及びFE0.003質量部を投入した。重合15時間目に減圧下残存モノマーを脱揮除去して重合を終了し、ポリブタジエンゴムを主成分とするポリブタジエンゴムラテックス(R-1)を得た。得られたラテックスに含まれるポリブタジエンゴム粒子の体積平均粒子径は0.08μmであった。
耐圧重合機中に、製造例1-1で得たポリブタジエンゴムラテックス(R-1)を21質量部(ポリブタジエンゴム7質量部を含む)、脱イオン水185質量部、リン酸三カリウム0.03質量部、EDTA0.002質量部、及びFE0.001質量部を投入し、撹拌しつつ十分に窒素置換を行なって酸素を除いた後、BD93質量部を系中に投入し、45℃に昇温した。PHP0.02質量部、続いてSFS0.10質量部を投入し重合を開始した。重合開始から24時間目まで3時間おきに、それぞれ、PHP0.025質量部、及びEDTA0.0006質量部、及びFE0.003質量部を投入した。重合30時間目に減圧下残存モノマーを脱揮除去して重合を終了し、ポリブタジエンゴムを主成分とするポリブタジエンゴムラテックス(R-2)を得た。得られたラテックスに含まれるポリブタジエンゴム粒子の体積平均粒子径は0.20μmであった。
製造例2-1;コアシェルポリマーラテックス(L-1)の調製
温度計、撹拌機、還流冷却器、窒素流入口、及びモノマーの添加装置を有するガラス反応器に、製造例1-2で調製したポリブタジエンゴムラテックス(R-2)241質量部(ポリブタジエンゴム粒子80質量部を含む)、及び、脱イオン水71質量部を仕込み、窒素置換を行いながら60℃で撹拌した。EDTA0.004質量部、FE0.001質量部、及びSFS0.2質量部を加えた後、グラフトモノマー(メチルメタクリレート(MMA)17質量部、スチレン(ST)2質量部、4-ヒドロキシブチルアクリレート(4HBA)1質量部)、及び、クメンヒドロパーオキサイド(CHP)0.06質量部の混合物を120分間かけて連続的に添加した。添加終了後、CHP0.04質量部を添加し、さらに2時間撹拌を続けて重合を完結させ、コアシェルポリマーを含む水性ラテックス(L-1)を得た。モノマー成分の重合転化率は99%以上であった。得られた水性ラテックスに含まれるコアシェルポリマーの体積平均粒子径は0.21μmであった。
製造例2-1において、グラフトモノマーとして<メチルメタクリレート(MMA)17質量部、スチレン(ST)2質量部、4-ヒドロキシブチルアクリレート(4HBA)1質量部>の代わりに<メチルメタクリレート(MMA)14質量部、スチレン(ST)2質量部、4-ヒドロキシブチルアクリレート(4HBA)4質量部>を用いたこと以外は製造例2-1と同様にして、コアシェルポリマーの水性ラテックス(L-2)を得た。得られた水性ラテックスに含まれるコアシェルポリマーの体積平均粒子径は0.21μmであった。
製造例2-1において、グラフトモノマーとして<メチルメタクリレート(MMA)17質量部、スチレン(ST)2質量部、4-ヒドロキシブチルアクリレート(4HBA)1質量部>の代わりに<メチルメタクリレート(MMA)18質量部、スチレン(ST)2質量部>を用いたこと以外は製造例2-1と同様にして、コアシェルポリマーの水性ラテックス(L-3)を得た。得られた水性ラテックスに含まれるコアシェルポリマーの体積平均粒子径は0.21μmであった。
製造例2-1において、グラフトモノマーとして<メチルメタクリレート(MMA)17質量部、スチレン(ST)2質量部、4-ヒドロキシブチルアクリレート(4HBA)1質量部>の代わりに<メチルメタクリレート(MMA)15質量部、スチレン(ST)3質量部、4-ヒドロキシブチルアクリレート(4HBA)2質量部>を用いたこと以外は製造例2-1と同様にして、コアシェルポリマーの水性ラテックス(L-4)を得た。得られた水性ラテックスに含まれるコアシェルポリマーの体積平均粒子径は0.21μmであった。
製造例2-1において、グラフトモノマーとして<メチルメタクリレート(MMA)17質量部、スチレン(ST)2質量部、4-ヒドロキシブチルアクリレート(4HBA)1質量部>の代わりに<メチルメタクリレート(MMA)13質量部、スチレン(ST)3質量部、4-ヒドロキシブチルアクリレート(4HBA)4質量部>を用いたこと以外は製造例2-1と同様にして、コアシェルポリマーの水性ラテックス(L-5)を得た。得られた水性ラテックスに含まれるコアシェルポリマーの体積平均粒子径は0.21μmであった。
製造例2-1において、グラフトモノマーとして<メチルメタクリレート(MMA)17質量部、スチレン(ST)2質量部、4-ヒドロキシブチルアクリレート(4HBA)1質量部>の代わりに<メチルメタクリレート(MMA)11質量部、スチレン(ST)3質量部、4-ヒドロキシブチルアクリレート(4HBA)6質量部>を用いたこと以外は製造例2-1と同様にして、コアシェルポリマーの水性ラテックス(L-6)を得た。得られた水性ラテックスに含まれるコアシェルポリマーの体積平均粒子径は0.21μmであった。
製造例2-1において、グラフトモノマーとして<メチルメタクリレート(MMA)17質量部、スチレン(ST)2質量部、4-ヒドロキシブチルアクリレート(4HBA)1質量部>の代わりに<メチルメタクリレート(MMA)17質量部、スチレン(ST)3質量部>を用いたこと以外は製造例2-1と同様にして、コアシェルポリマーの水性ラテックス(L-7)を得た。得られた水性ラテックスに含まれるコアシェルポリマーの体積平均粒子径は0.21μmであった。
製造例3-1;分散物(M-1)の調製
25℃の1L混合槽にメチルエチルケトン(MEK)132gを導入し、撹拌しながら、前記製造例2-1で得られたコアシェルポリマーの水性ラテックス(L-1)を132g(ポリマー微粒子40g相当)投入した。均一に混合後、水200gを80g/分の供給速度で投入した。供給終了後、速やかに撹拌を停止したところ、浮上性の凝集体および有機溶媒を一部含む水相からなるスラリー液を得た。次に、一部の水相を含む凝集体を残し、水相360gを槽下部の払い出し口より排出させた。得られた凝集体にMEK90gを追加して均一に混合し、コアシェルポリマーを均一に分散した分散体を得た。この分散体に、(A)成分であるエポキシ樹脂(A-1:三菱化学社製、JER828:液状ビスフェノールA型エポキシ樹脂)120gを混合した。この混合物から、回転式の蒸発装置で、MEKを除去した。このようにして、エポキシ樹脂にポリマー微粒子が分散した分散物(M-1)を得た。
製造例3-1において、コアシェルポリマーの水性ラテックスとして(L-1)の代わりに(L-2)を用いたこと以外は製造例3-1と同様にして、エポキシ樹脂にポリマー微粒子が分散した分散物(M-2)を得た。
製造例3-1において、コアシェルポリマーの水性ラテックスとして(L-1)の代わりに(L-3)を用いたこと以外は製造例3-1と同様にして、エポキシ樹脂にポリマー微粒子が分散した分散物(M-3)を得た。
製造例3-1において、コアシェルポリマーの水性ラテックスとして(L-1)の代わりに、それぞれ前記製造例2-4~7で得られた(L-4~7)を用い、更に(A)成分であるエポキシ樹脂(A-1)を120gの代わりに93.3gを混合したこと以外は製造例3-1と同様にして、エポキシ樹脂にポリマー微粒子が分散した分散物(M-4~7)を得た。
表1に示す処方にしたがって、各成分をそれぞれ計量し、よく混合して硬化性樹脂組成物を得た。
表1の各組成物を用いて、以下の方法で、動的割裂抵抗力を測定した。結果を表1に示す。
硬化性樹脂組成物を2枚のSPCC鋼板に塗布し、接着層厚み0.25mmとなるように重ね合せ、170℃×25分間の条件で硬化させ、ISO 11343に従って、23℃での動的割裂抵抗力を測定した。試験結果を表1に示す。
なお、表1中の各種配合剤は、以下に示すものを使用した。
A-1:JER828(三菱化学製、常温で液状のビスフェノールA型エポキシ樹脂、エポキシ当量:184~194)
A-2:YED216(三菱化学製、ヘキサンジオールジグリシジルエーテル、エポキシ当量:110~130)
<エポキシ樹脂(A)中にポリマー微粒子(B)が分散した分散物(M)>
M-1~3:前記製造例3-1~3で得られた分散物
<ブロックドウレタン(C)>
C-1:QR-9466(ADEKA製、ポリプロピレングリコール構造を含むブロックドウレタン、ブロックNCO当量1400、粘度25000mPa・s/25℃)
C-2:Flexibilizer DY 965(HUNTSMAN製、ポリテトラメチレングリコール構造を含むブロックドウレタン、粘度 4400-12800cP/25℃)
≪ゴム変性エポキシ樹脂≫
Hypox RA 1340(CVC製、ゴム変性エポキシ樹脂:40wt%、ビスフェノールA型エポキシ樹脂濃度:60wt%、エポキシ当量:325~375)
≪ウレタン変性エポキシ樹脂≫
EPU-73B(ADEKA製、ウレタン変性エポキシ樹脂:40wt%、ビスフェノールA型エポキシ樹脂濃度:60wt%、エポキシ当量:245)
≪ヒュームドシリカ≫CAB-O-SIL TS-720(CABOT製、ポリジメチルシロキサンで表面処理されたヒュームドシリカ)、
≪重質炭酸カルシウム≫
ホワイトンSB(白石カルシウム製、表面無処理重質炭酸カルシウム、平均粒子径:1.8μm)
≪酸化カルシウム≫
CML#31(近江化学工業製、脂肪酸で表面処理した酸化カルシウム)
≪カーボンブラック≫
MONARCH 280(Cabot製)
<エポキシ硬化剤(D)>
Dyhard 100S(AlzChem製、ジシアンジアミド)
<硬化促進剤(E)>
Dyhard UR300(AlzChem製、1,1-ジメチル-3-フェニルウレア)
表2に示す処方にしたがって、各成分をそれぞれ計量し、よく混合して硬化性樹脂組成物を得た。
表2の各組成物を用いて、以下の方法で、粘度と動的割裂抵抗力を測定した。結果を表2に示す。
硬化性樹脂組成物の粘度は、BROOKFIELD社製デジタル粘度計DV-II+Pro型を用いて測定した。スピンドルCPE-52を使用し、Shear Rate(ずり速度)が2(s-1)における50℃での粘度を測定した。
硬化性樹脂組成物を2枚のSPCC鋼板に塗布し、接着層厚み0.25mmとなるように重ね合せ、170℃×60分の条件で硬化させ、ISO 11343に従って、23℃での動的割裂抵抗力を測定した。
<エポキシ樹脂(A)>
A-3:エポライト400P(共栄社化学製、ポリプロピレングリコールジグリシジルエーテル、エポキシ当量:300~330)
<エポキシ樹脂(A)中にポリマー微粒子(B)が分散した分散物(M)>
M-4~7:前記製造例3-4~7で得られた分散物
Claims (14)
- エポキシ樹脂(A)100質量部に対して、コア層がジエン系ゴムであり、シェル層にヒドロキシ基を有するコアシェル構造を有するポリマー微粒子(B)1~100質量部、ブロックドウレタン(C)1~100質量部を含有する硬化性樹脂組成物であって、ポリマー微粒子(B)中のヒドロキシ基の含有量が、0.01~0.8mmol/gであることを特徴とする硬化性樹脂組成物。
- ポリマー微粒子(B)が、ヒドロキシ基を有するモノマーと、芳香族ビニルモノマー、ビニルシアンモノマー、および(メタ)アクリレートモノマーよりなる群から選択される1種以上のモノマーとを、コア層にグラフト重合してなるシェル層を有する請求項1に記載の硬化性樹脂組成物。
- ジエン系ゴムが、ブタジエンゴム、および/または、ブタジエン-スチレンゴムである請求項1または2に記載の硬化性樹脂組成物。
- ブロックドウレタン(C)が、ポリアルキレングリコール構造を含むウレタンプレポリマーをブロック剤でキャップした化合物である請求項1~3のいずれかに記載の硬化性樹脂組成物。
- ポリマー微粒子(B)/ブロックドウレタン(C)の質量比が、0.2~5である請求項1~4のいずれかに記載の硬化性樹脂組成物。
- エポキシ樹脂(A)がポリエポキシドの反応性希釈剤を含み、前記反応性希釈剤の量がエポキシ樹脂(A)100質量%中0.5~20質量%である請求項1~5のいずれかに記載の硬化性樹脂組成物。
- ポリマー微粒子(B)中のヒドロキシ基の含有量が、0.01~0.4mmol/gである請求項1~6のいずれかに記載の硬化性樹脂組成物。
- エポキシ樹脂(A)100質量部に対して、更に、エポキシ硬化剤(D)1~80質量部を含有する請求項1~7のいずれかに記載の硬化性樹脂組成物。
- エポキシ樹脂(A)100質量部に対して、更に、硬化促進剤(E)0.1~10質量部を含有する請求項1~8のいずれかに記載の硬化性樹脂組成物。
- ポリマー微粒子(B)が、該硬化性樹脂組成物中で1次粒子の状態で分散している請求項1~9のいずれかに記載の硬化性樹脂組成物。
- 硬化性樹脂組成物の硬化後に、動的割裂抵抗力が19kN/m超である請求項1~10のいずれかに記載の硬化性樹脂組成物。
- 請求項1~11のいずれかに記載の硬化性樹脂組成物を硬化した硬化物。
- 請求項1~11のいずれかに記載の一液型硬化性樹脂組成物。
- 請求項1~11のいずれかに記載の硬化性樹脂組成物を用いてなる構造接着剤。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009506169A (ja) * | 2005-08-24 | 2009-02-12 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 改善された耐衝撃性を有するエポキシ組成物 |
WO2009034966A1 (ja) * | 2007-09-11 | 2009-03-19 | Kaneka Corporation | 液状樹脂組成物、および該液状樹脂組成物を用いた硬化物 |
JP2013224440A (ja) * | 2007-11-14 | 2013-10-31 | Sika Technology Ag | 非芳香族尿素を反応促進剤として含む熱硬化性エポキシ樹脂組成物 |
JP2014505761A (ja) * | 2010-12-26 | 2014-03-06 | ダウ グローバル テクノロジーズ エルエルシー | フェノール、ポリフェノールまたはアミノフェノール化合物でキャップした鎖延長化エラストマー型強化剤を含有する構造用エポキシ樹脂接着剤 |
WO2015064561A1 (ja) * | 2013-10-29 | 2015-05-07 | 株式会社カネカ | 貯蔵安定性の改善されたポリマー微粒子含有硬化性樹脂組成物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BRPI0809752B1 (pt) * | 2007-04-11 | 2017-05-16 | Dow Global Technologies Inc | "adesivo estrutural de um componente e método" |
WO2009014037A1 (ja) | 2007-07-25 | 2009-01-29 | Kaneka Corporation | 樹脂組成物、および該樹脂組成物を用いた重縮合体 |
WO2014196607A1 (ja) | 2013-06-07 | 2014-12-11 | 株式会社カネカ | 硬化性樹脂組成物、それを用いてなる構造接着剤、コーティング材又は繊維強化複合材料、それを発泡してなる発泡体、それを硬化してなる積層体、及びそれらの硬化物 |
EP3056540B1 (en) * | 2013-10-11 | 2020-02-19 | Kaneka Corporation | Core-shell polymer-containing epoxy resin composition, cured product of same and method for producing same |
-
2016
- 2016-04-08 ES ES16776657T patent/ES2758354T3/es active Active
- 2016-04-08 EP EP16776657.5A patent/EP3281965B1/en active Active
- 2016-04-08 WO PCT/JP2016/061474 patent/WO2016163491A1/ja active Application Filing
- 2016-04-08 CN CN201680020714.6A patent/CN107428913B/zh active Active
- 2016-04-08 JP JP2017511075A patent/JP6924135B2/ja active Active
- 2016-04-08 US US15/564,890 patent/US10017673B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009506169A (ja) * | 2005-08-24 | 2009-02-12 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 改善された耐衝撃性を有するエポキシ組成物 |
WO2009034966A1 (ja) * | 2007-09-11 | 2009-03-19 | Kaneka Corporation | 液状樹脂組成物、および該液状樹脂組成物を用いた硬化物 |
JP2013224440A (ja) * | 2007-11-14 | 2013-10-31 | Sika Technology Ag | 非芳香族尿素を反応促進剤として含む熱硬化性エポキシ樹脂組成物 |
JP2014505761A (ja) * | 2010-12-26 | 2014-03-06 | ダウ グローバル テクノロジーズ エルエルシー | フェノール、ポリフェノールまたはアミノフェノール化合物でキャップした鎖延長化エラストマー型強化剤を含有する構造用エポキシ樹脂接着剤 |
WO2015064561A1 (ja) * | 2013-10-29 | 2015-05-07 | 株式会社カネカ | 貯蔵安定性の改善されたポリマー微粒子含有硬化性樹脂組成物 |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018053026A (ja) * | 2016-09-27 | 2018-04-05 | 株式会社カネカ | 機械的強度に優れるポリマー微粒子含有硬化性組成物 |
US11384267B2 (en) | 2018-04-27 | 2022-07-12 | Kaneka Corporation | Adhesion method employing polymer microparticle-containing curable resin composition having excellent workability, and laminate obtained using said adhesion method |
WO2019208569A1 (ja) | 2018-04-27 | 2019-10-31 | 株式会社カネカ | 作業性に優れるポリマー微粒子含有硬化性樹脂組成物を用いる接着方法、及び、該接着方法を用いて得られる積層体 |
JP2019194316A (ja) * | 2018-04-27 | 2019-11-07 | 株式会社カネカ | 作業性に優れるポリマー微粒子含有硬化性樹脂組成物を用いる接着方法、及び、該接着方法を用いて得られる積層体 |
EP4470775A2 (en) | 2018-04-27 | 2024-12-04 | Kaneka Corporation | Adhesion method employing polymer microparticle-containing curable resin composition having excellent workability, and laminate obtained using said adhesion method |
US11781047B2 (en) | 2018-04-27 | 2023-10-10 | Kaneka Corporation | Adhesion method employing polymer microparticle-containing curable resin composition having excellent workability, and laminate obtained using said adhesion method |
JP7277241B2 (ja) | 2018-04-27 | 2023-05-18 | 株式会社カネカ | 作業性に優れるポリマー微粒子含有硬化性樹脂組成物を用いる接着方法、及び、該接着方法を用いて得られる積層体 |
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US12146079B2 (en) | 2018-07-25 | 2024-11-19 | Lg Chem, Ltd. | Adhesive composition |
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US12173195B2 (en) | 2018-07-25 | 2024-12-24 | Lg Chem, Ltd. | Adhesive composition |
US12173194B2 (en) | 2018-07-25 | 2024-12-24 | Lg Chem, Ltd. | Adhesive composition |
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Also Published As
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JPWO2016163491A1 (ja) | 2018-02-08 |
US20180094176A1 (en) | 2018-04-05 |
EP3281965A1 (en) | 2018-02-14 |
ES2758354T3 (es) | 2020-05-05 |
JP6924135B2 (ja) | 2021-08-25 |
CN107428913A (zh) | 2017-12-01 |
US10017673B2 (en) | 2018-07-10 |
CN107428913B (zh) | 2019-10-18 |
EP3281965B1 (en) | 2019-10-02 |
EP3281965A4 (en) | 2018-11-21 |
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