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WO2016002396A1 - Polishing apparatus - Google Patents

Polishing apparatus Download PDF

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Publication number
WO2016002396A1
WO2016002396A1 PCT/JP2015/065275 JP2015065275W WO2016002396A1 WO 2016002396 A1 WO2016002396 A1 WO 2016002396A1 JP 2015065275 W JP2015065275 W JP 2015065275W WO 2016002396 A1 WO2016002396 A1 WO 2016002396A1
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WO
WIPO (PCT)
Prior art keywords
polishing
polishing head
head
reciprocating
polishing apparatus
Prior art date
Application number
PCT/JP2015/065275
Other languages
French (fr)
Japanese (ja)
Inventor
拓郎 川井
藤原　学
元信 山田
哲也 高松
松田　健
Original Assignee
シャープ株式会社
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Publication of WO2016002396A1 publication Critical patent/WO2016002396A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/02—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/16—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces performing a reciprocating movement, e.g. during which the sense of rotation of the working-spindle is reversed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass

Definitions

  • the present invention relates to a polishing apparatus for polishing and removing foreign matters and shape defects present on the surface of a planar object to be polished such as glass.
  • the belt plate material polishing apparatus 200 of Patent Document 1 includes an apparatus body 210, a belt plate material transport mechanism 220 that horizontally transports the belt plate material W, and a tape transport that movably mounts the polishing tape T.
  • a mechanism 230 and a tape pressing mechanism 240 that presses the polishing tape T onto the strip plate W are provided.
  • the belt plate material polishing apparatus 200 reciprocates the tape pressure contact mechanism 240 on the belt plate material W by the rotation conduction mechanism 250 and simultaneously drives the counterweight member 260 that moves in the opposite direction to the tape pressure contact mechanism 240 to thereby press the tape pressure contact.
  • the vibration phenomenon due to the reaction force generated when the mechanism 240 is reversed in the reciprocating movement is suppressed.
  • the attachment of the counterweight member 260 causes problems such as an increase in the size of the apparatus and a complicated structure, resulting in a significant increase in cost. Further, when the polishing conditions are sequentially changed, such as rough polishing and finish polishing, it takes time to replace the polishing tape T and adjust the position, resulting in a problem that the working efficiency is lowered.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a polishing apparatus capable of efficiently performing a plurality of polishing steps by suppressing vibration phenomena with an inexpensive configuration that does not use a counterweight member. is there.
  • the polishing apparatus of the present invention includes a stage for transferring an object to be polished, a plurality of polishing heads that hold a polishing member and are arranged in the transfer direction of the object to be polished, and at least one of the polishing heads as an object to be polished. And a reciprocating mechanism that reciprocally moves the pressed polishing head and the other polishing head in a reverse phase in the horizontal direction with respect to the object to be polished.
  • polishing apparatus of the present invention it is possible to provide a polishing apparatus that can efficiently perform a plurality of polishing steps by suppressing vibration phenomena with an inexpensive configuration that does not use a counterweight member.
  • (A) is a perspective view which shows the reciprocating mechanism of a grinding
  • (b) is a top view of a reciprocating mechanism. It is a top view which shows another reciprocation mechanism. It is a top view which shows another reciprocation mechanism. It is a side view of the conventional grinding
  • FIG. 1 is a schematic side view of a polishing apparatus 100 according to Embodiment 1 of the present invention.
  • the polishing apparatus 100 includes a stage 30 and a stage driving mechanism 31 that transfer a workpiece W, a first polishing head 11 and a second polishing head 12 that hold a polishing member, and the first polishing head 11 or the second polishing head 11.
  • the polishing head 12 is provided in pressure contact with the workpiece W and driven in the horizontal direction.
  • the first polishing head 11 holds, for example, the first polishing sheet 14 having a coarse particle size as a polishing member, and is used for rough polishing in the initial step.
  • the second polishing head 12 holds a second polishing sheet 15 having a fine particle size as a polishing member, and is used for final polishing in the final process.
  • the holding surface of the polishing sheet be a flat surface with respect to the planar workpiece W, and glass can be easily obtained. You may affix a board as a holding surface. Further, when polishing is performed following the unevenness of the workpiece W, a cushioning member such as felt may be provided on the holding surface of the polishing sheet.
  • the polishing head drive unit 10 is disposed above the stage 30 and is brought close to the workpiece W by the lifting mechanism 17. Further, the polishing head drive unit 10 includes a pressurizing mechanism 18 such as an air cylinder that pressurizes the first polishing head 11 or the second polishing head 12 against the workpiece W, and the first polishing head 11 and the second polishing head 11.
  • a reciprocating mechanism 20 such as a linear motor that reciprocates the polishing head 12 horizontally with the object W in the opposite phase is provided.
  • the elevating mechanism 17, the pressurizing mechanism 18, and the reciprocating mechanism 20 are not limited to the order and arrangement shown in FIG. 1, but are configured so that each mechanism functions. Anything is acceptable.
  • FIG. 2 is a top view of the polishing apparatus 100 according to the first embodiment, showing the alignment direction of the polishing heads and the direction of reciprocation.
  • the polishing apparatus 100 according to the first embodiment has a configuration in which the arrangement direction of the first polishing head 11 and the second polishing head 12 is orthogonal to the direction of reciprocation of the polishing head.
  • the stage 30 has a configuration in which the workpiece W is held by a vacuum suction mechanism (not shown) and is transferred in the Y direction by the stage driving mechanism 31, for example.
  • the first polishing head 11 and the second polishing head 12 are arranged side by side in the transfer direction (Y direction) of the stage 30.
  • the first polishing head 11 and the second polishing head 12 are reciprocated in opposite phases in the left-right direction (X direction) of the stage 30 by the reciprocating mechanism 20.
  • a mark P is provided on the stage 30 in order to align the polishing head and the polishing area of the workpiece W.
  • the mark P is moved so that the polishing region aligned with the mark P passes through the center position of the reciprocating motion of the first polishing head 11 and the second polishing head 12.
  • the mark P may be formed directly on the holding surface of the stage 30, but the mark P may be indicated by irradiating the stage 30 with laser light from a laser pointer or the like provided in the polishing head driving unit 10 or the like.
  • the polishing apparatus 100 moves the stage 30 holding the workpiece W in the Y direction, and places the polishing area of the workpiece W below the center of the reciprocating motion of the first polishing head 11. To do. Subsequently, the first polishing head 11 is brought into pressure contact with the polishing region and reciprocated in the X direction to perform rough polishing. At this time, the second polishing head 12 is not pressed against the workpiece W, but is driven to reciprocate in the opposite phase to the first polishing head 11.
  • the polishing apparatus 100 raises the first polishing head 11 from the workpiece W and holds the workpiece W in order to perform finish polishing. 30 is further transferred in the Y direction, and the polishing region of the workpiece W is disposed below the center of the reciprocating motion of the second polishing head 12. Subsequently, the second polishing head 12 is brought into pressure contact with the polishing region and reciprocated in the X direction to perform final polishing. At this time, the first polishing head 11 is not brought into pressure contact with the workpiece W, but is driven to reciprocate in the opposite phase to the second polishing head 12.
  • the first polishing head 11 moves to the left as shown in FIG.
  • the second polishing head 12 is moved to the right
  • the second polishing head 12 ' is moved to the left when the first polishing head 11' is moved to the right.
  • the second polishing head 12 functions as a counterweight during polishing by the first polishing head 11, and the first polishing is performed during polishing by the second polishing head 12. Since the head 11 functions as a counterweight, the vibration phenomenon of the polishing head can be canceled without providing a separate counterweight mechanism.
  • the polishing head vibrates greatly and comes into contact with the outside of the polishing region, thereby damaging the workpiece W. I gave it.
  • the first polishing head 11 and the second polishing head 12 reciprocate in opposite phases, and the vibration phenomenon of the polishing head is cancelled. It was possible to polish well.
  • FIG. 3 shows, as a comparative example, a case where the arrangement direction of the first polishing head 11 and the second polishing head 12 is orthogonal to the X direction and the transfer direction of the stage 30 is orthogonal to the Y direction. .
  • a stage drive mechanism 31 that can be transferred to two axes of the X axis and the Y axis is necessary. In the drive mechanism 31, it is necessary to realign the workpiece W.
  • the direction in which the polishing heads are aligned and the direction in which the stage 30 is transferred are substantially the same (Y direction), so that the polishing region can be moved to the first polishing head only by transferring the stage 30 in one direction. 11. It can transfer to the reciprocation center position of the 2nd polishing head 12, can transfer efficiently to each polishing position, and can carry out a plurality of polish processes with a different polish sheet.
  • the polishing head is reciprocated while the stage 30 is stationary.
  • the stage 30 is configured to reciprocate in the orthogonal direction (Y direction).
  • the polishing head By reciprocating the stage 30 and the polishing head in the orthogonal direction, the polishing head can be compounded in the XY directions, and the polishing region can be polished more uniformly.
  • the reciprocating movement of the stage 30 is not necessarily driven at the same speed as the reciprocating movement of the polishing head. Further, the stage 30 does not necessarily have to be driven with the same amount of movement as the amount of movement of the polishing head, and may be set appropriately according to the size of the polishing region.
  • FIG. 4 is a top view of the polishing apparatus 100 according to the third embodiment, showing the alignment direction of the polishing heads and the direction of reciprocation.
  • the arrangement direction of the first polishing head 11 and the second polishing head 12 and the direction of reciprocation of the polishing head are made substantially the same.
  • the polishing apparatus 100 matches the direction of reciprocation with the direction in which the first polishing head 11 and the second polishing head 12 are aligned (Y direction). 11 and the second polishing head 12 were made to reciprocate linearly in opposite phases. This makes it difficult for a rotational moment to be applied to the polishing head during the reciprocating motion, and it is possible to reliably cancel the vibration phenomenon of the polishing head.
  • the alignment direction of the first polishing head 11 and the second polishing head 12 and the transfer direction of the stage 30 are substantially the same (Y direction). It is possible to efficiently transfer the polishing area to the reciprocation center position of the first polishing head 11 and the second polishing head 12 and to perform a plurality of polishing steps with different polishing sheets only by transferring in the direction.
  • FIG. 5A and 5B are schematic views of the reciprocating mechanism 20 used in the polishing apparatus 100 according to the fourth embodiment.
  • FIG. 5A is a perspective view of the reciprocating mechanism 20, and FIG. is there.
  • the reciprocating mechanism 20 includes a crank mechanism 21 that converts the rotational movement of the motor 22 into a reciprocating movement. Since the crank mechanism 21 drives the first polishing head 11 and the second polishing head 12 in opposite phases, each crank mechanism 21 is connected to the crank connecting portion with a phase difference of 180 °.
  • two linear motors are arranged to configure the reciprocating mechanism 20, and a linear motor that drives the first polishing head 11 and a linear motor that drives the second polishing head 12 are provided. It is necessary to control them in opposite phases.
  • the configuration of the polishing apparatus 100 according to the fourth embodiment by using the crank mechanism 21 instead of the linear motor, it is possible to perform reciprocal movement in the opposite phase with a simplified configuration, and the number of parts and the weight of the polishing apparatus 100 can be reduced. Can be realized.
  • FIG. 6 is a top view of the reciprocating mechanism 20 used in the polishing apparatus 100 of the fifth embodiment.
  • the crank mechanism 21 and the rocker arm 23 are combined to connect the first polishing head 11 and the second polishing head 12 to the rocker arm 23, so that one crank mechanism 21 is provided. It can be directly connected to the motor 22 for simplification, and maintenance can be facilitated, and the reciprocating mechanism 20 can be further downsized.
  • FIG. 7 is a top view of the reciprocating mechanism 20 in which a plurality of rocker arms 23 are connected.
  • the plurality of polishing heads including the third polishing head 13 can be reciprocated in mutually opposite phases.
  • the polishing apparatus of the present invention is characterized in that the direction in which the plurality of polishing heads are aligned and the direction of the reciprocating movement of the polishing heads are orthogonal to each other.
  • the polishing apparatus of the present invention is characterized in that the reciprocating mechanism has a crank mechanism for converting the rotational motion into the reciprocating motion.
  • the polishing apparatus of the present invention is characterized in that the plurality of polishing heads hold different polishing members.
  • Polishing head drive unit 11 First polishing head 12 Second polishing head 13 Third polishing head 14 First polishing sheet 15 Second polishing sheet 17
  • Lifting mechanism 18 Pressure mechanism 20 Reciprocating Movement mechanism 21 Crank mechanism 22 Motor 23 Rocker arm 30 Stage 31 Stage drive mechanism 100 Polishing device

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

This polishing apparatus (100) is characterized in being equipped with: a stage (30) for conveying an object to be polished (W); multiple polishing heads (11, 12), which hold a polishing sheet (14, 15) and are disposed in a row in the conveyance direction of the object being polished (W); a pressing mechanism (18) for pressing at least one of the polishing heads (11, 12) against the object being polished (W); and a reciprocating movement mechanism (20) for moving the pressed polishing head (11) and the other polishing head (12) in a reciprocating manner in the phase opposite to the object being polished (W) in the horizontal direction. Provided thereby is a polishing apparatus capable of limiting vibrational phenomena with an inexpensive configuration that does not use a counterweight member, and efficiently executing multiple polishing steps.

Description

研磨装置Polishing equipment
　本発明は、ガラス等の平面状の被研磨物の表面に存在する異物や形状不良を研磨除去する研磨装置に関するものである。 The present invention relates to a polishing apparatus for polishing and removing foreign matters and shape defects present on the surface of a planar object to be polished such as glass.
　従来の研磨装置として、水平搬送される被研磨物の表面に研磨テープを摺動させて研磨する研磨装置が知られている。例えば、特許文献１の帯板材研磨装置２００は、図８に示すように、装置機体２１０と、帯板材Ｗを水平搬送させる帯板材搬送機構２２０と、研磨テープＴを移送自在に架設するテープ移送機構２３０と、研磨テープＴを帯板材Ｗ上に圧接させるテープ圧接機構２４０を備えている。 As a conventional polishing apparatus, there is known a polishing apparatus that polishes by sliding a polishing tape on the surface of an object to be horizontally conveyed. For example, as shown in FIG. 8, the belt plate material polishing apparatus 200 of Patent Document 1 includes an apparatus body 210, a belt plate material transport mechanism 220 that horizontally transports the belt plate material W, and a tape transport that movably mounts the polishing tape T. A mechanism 230 and a tape pressing mechanism 240 that presses the polishing tape T onto the strip plate W are provided.
　帯板材研磨装置２００は、回転伝導機構２５０によりテープ圧接機構２４０を帯板材Ｗ上で往復移動させるともに、テープ圧接機構２４０と反対方向に移動するカウンターウエイト部材２６０を同時に駆動させることで、テープ圧接機構２４０の往復移動の反転時に発生する反力による振動現象を抑制している。 The belt plate material polishing apparatus 200 reciprocates the tape pressure contact mechanism 240 on the belt plate material W by the rotation conduction mechanism 250 and simultaneously drives the counterweight member 260 that moves in the opposite direction to the tape pressure contact mechanism 240 to thereby press the tape pressure contact. The vibration phenomenon due to the reaction force generated when the mechanism 240 is reversed in the reciprocating movement is suppressed.
日本国公開特許公報「特開２０１２－１１１０２２号公報」Japanese Patent Publication “JP 2012-1111022”
　しかしながら、特開文献１の帯板材研磨装置２００では、カウンターウエイト部材２６０を付属することで、装置の大型化や構造の複雑化などの支障があり、大幅なコストアップを招く問題があった。また、粗研磨や仕上げ研磨等、研磨条件を順次変更する場合、研磨テープTを交換したり位置調整する手間がかかり、作業効率が低下する問題があった。 However, in the band plate material polishing apparatus 200 of JP-A No. 2004-133260, the attachment of the counterweight member 260 causes problems such as an increase in the size of the apparatus and a complicated structure, resulting in a significant increase in cost. Further, when the polishing conditions are sequentially changed, such as rough polishing and finish polishing, it takes time to replace the polishing tape T and adjust the position, resulting in a problem that the working efficiency is lowered.
　本発明は、上記課題に鑑みなされたものであり、その目的は、カウンターウエイト部材を用いない安価な構成で振動現象を抑制し、複数の研磨工程を効率よく実施できる研磨装置を提供することにある。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a polishing apparatus capable of efficiently performing a plurality of polishing steps by suppressing vibration phenomena with an inexpensive configuration that does not use a counterweight member. is there.
　本発明の研磨装置は、被研磨物を移送するステージと、研磨部材を保持し、被研磨物の移送方向に並べて配置された複数の研磨ヘッドと、研磨ヘッドの少なくとも１つを被研磨物に圧接する加圧機構と、圧接した研磨ヘッドと他の研磨ヘッドとを被研磨物と水平方向に逆位相で往復運動させる往復運動機構と、を備えたことを特徴とする。 The polishing apparatus of the present invention includes a stage for transferring an object to be polished, a plurality of polishing heads that hold a polishing member and are arranged in the transfer direction of the object to be polished, and at least one of the polishing heads as an object to be polished. And a reciprocating mechanism that reciprocally moves the pressed polishing head and the other polishing head in a reverse phase in the horizontal direction with respect to the object to be polished.
　本発明の研磨装置によれば、カウンターウエイト部材を用いない安価な構成で振動現象を抑制し、複数の研磨工程を効率よく実施できる研磨装置を提供することができる。 According to the polishing apparatus of the present invention, it is possible to provide a polishing apparatus that can efficiently perform a plurality of polishing steps by suppressing vibration phenomena with an inexpensive configuration that does not use a counterweight member.
本発明の一実施形態に係る研磨装置の側面図である。It is a side view of the polish device concerning one embodiment of the present invention. 一実施形態に係る研磨装置の研磨ヘッドの並び方向と往復運動の方向を示す上面図である。It is a top view which shows the alignment direction of the polishing head of the polishing apparatus which concerns on one Embodiment, and the direction of reciprocation. 比較例である研磨装置の研磨ヘッドの並び方向と往復運動の方向を示す上面図である。It is a top view which shows the alignment direction of the polishing head of the polishing apparatus which is a comparative example, and the direction of reciprocation. 他の実施形態に係る研磨装置の研磨ヘッドの並び方向と往復運動の方向を示す上面図である。It is a top view which shows the line-up direction of the polishing head of the polishing apparatus which concerns on other embodiment, and the direction of reciprocation. （ａ）は研磨装置の往復運動機構を示す斜視図であり、（ｂ）は往復運動機構の上面図である。(A) is a perspective view which shows the reciprocating mechanism of a grinding | polishing apparatus, (b) is a top view of a reciprocating mechanism. 他の往復運動機構を示す上面図である。It is a top view which shows another reciprocation mechanism. 他の往復運動機構を示す上面図である。It is a top view which shows another reciprocation mechanism. 従来の研磨装置の側面図である。It is a side view of the conventional grinding | polishing apparatus.
　〔実施形態１〕
　図１は、本発明の実施形態１に係る研磨装置１００の概略側面図である。研磨装置１００は、被研磨物Ｗを移送するステージ３０及びステージ駆動機構３１と、研磨部材を保持する第１の研磨ヘッド１１及び第２の研磨ヘッド１２と、第１の研磨ヘッド１１または第２の研磨ヘッド１２を被研磨物Ｗに圧接し、水平方向に駆動する研磨ヘッド駆動部１０を備える。 [Embodiment 1]
FIG. 1 is a schematic side view of a polishing apparatus 100 according to Embodiment 1 of the present invention. The polishing apparatus 100 includes a stage 30 and a stage driving mechanism 31 that transfer a workpiece W, a first polishing head 11 and a second polishing head 12 that hold a polishing member, and the first polishing head 11 or the second polishing head 11. The polishing head 12 is provided in pressure contact with the workpiece W and driven in the horizontal direction.
　第１の研磨ヘッド１１は、例えば、研磨部材として粒度の粗い第１の研磨シート１４を保持し、初期工程の粗研磨に用いられる。第２の研磨ヘッド１２は、例えば、研磨部材として粒度の細かい第２の研磨シート１５を保持し、最終工程の仕上げ研磨に用いられる。第１の研磨ヘッド１１、第２の研磨ヘッド１２は、平板状の被研磨物Ｗに対しては、研磨シートの保持面が平面であることが望ましく、容易に平面が得られる構成として、ガラス板を保持面として貼り付けてもよい。また、被研磨物Ｗの凹凸に倣って研磨を行う場合には、研磨シートの保持面にフェルト等の緩衝部材を設けてもよい。 The first polishing head 11 holds, for example, the first polishing sheet 14 having a coarse particle size as a polishing member, and is used for rough polishing in the initial step. For example, the second polishing head 12 holds a second polishing sheet 15 having a fine particle size as a polishing member, and is used for final polishing in the final process. In the first polishing head 11 and the second polishing head 12, it is desirable that the holding surface of the polishing sheet be a flat surface with respect to the planar workpiece W, and glass can be easily obtained. You may affix a board as a holding surface. Further, when polishing is performed following the unevenness of the workpiece W, a cushioning member such as felt may be provided on the holding surface of the polishing sheet.
　研磨ヘッド駆動部１０は、ステージ３０の上方に配置され、昇降機構１７により被研磨物Ｗに近接される。また、研磨ヘッド駆動部１０は、第１の研磨ヘッド１１または第２の研磨ヘッド１２を被研磨物Ｗに加圧するエアシリンダ等の加圧機構１８と、第１の研磨ヘッド１１と第２の研磨ヘッド１２を被研磨物Ｗと水平に逆位相で往復運動させるリニアモータ等の往復運動機構２０を備えている。なお、本発明の研磨装置１００において、昇降機構１７、加圧機構１８、往復運動機構２０は、図１に示す、順番、配置に限定されるものではなく、各機構が機能するように構成されるものであればよい。 The polishing head drive unit 10 is disposed above the stage 30 and is brought close to the workpiece W by the lifting mechanism 17. Further, the polishing head drive unit 10 includes a pressurizing mechanism 18 such as an air cylinder that pressurizes the first polishing head 11 or the second polishing head 12 against the workpiece W, and the first polishing head 11 and the second polishing head 11. A reciprocating mechanism 20 such as a linear motor that reciprocates the polishing head 12 horizontally with the object W in the opposite phase is provided. In the polishing apparatus 100 of the present invention, the elevating mechanism 17, the pressurizing mechanism 18, and the reciprocating mechanism 20 are not limited to the order and arrangement shown in FIG. 1, but are configured so that each mechanism functions. Anything is acceptable.
　図２は、実施形態１の研磨装置１００の上面図であり、研磨ヘッドの並び方向と往復運動の方向を示している。実施形態１の研磨装置１００では、第１の研磨ヘッド１１と第２の研磨ヘッド１２の並び方向と、研磨ヘッドの往復運動の方向を直交させた構成となっている。 FIG. 2 is a top view of the polishing apparatus 100 according to the first embodiment, showing the alignment direction of the polishing heads and the direction of reciprocation. The polishing apparatus 100 according to the first embodiment has a configuration in which the arrangement direction of the first polishing head 11 and the second polishing head 12 is orthogonal to the direction of reciprocation of the polishing head.
　ステージ３０は、図示しない真空吸着機構で被研磨物Ｗを保持し、ステージ駆動機構３１により、例えば、Ｙ方向に移送する構成となっている。第１の研磨ヘッド１１と第２の研磨ヘッド１２は、ステージ３０の移送方向（Ｙ方向）に並べて配置される。また、第１の研磨ヘッド１１と第２の研磨ヘッド１２は、往復運動機構２０により、ステージ３０の左右方向（Ｘ方向）へ互いに逆位相で往復運動される。 The stage 30 has a configuration in which the workpiece W is held by a vacuum suction mechanism (not shown) and is transferred in the Y direction by the stage driving mechanism 31, for example. The first polishing head 11 and the second polishing head 12 are arranged side by side in the transfer direction (Y direction) of the stage 30. In addition, the first polishing head 11 and the second polishing head 12 are reciprocated in opposite phases in the left-right direction (X direction) of the stage 30 by the reciprocating mechanism 20.
　本発明の研磨装置１００では、研磨ヘッドと被研磨物Ｗの研磨領域を位置合わせするため、ステージ３０に目印Ｐをつけている。この目印Ｐは、ステージ３０をＹ方向に移送したときに、目印Ｐに位置合わせした研磨領域を、第１の研磨ヘッド１１と第２の研磨ヘッド１２の往復運動の中心位置を通るように移送させる。目印Ｐは、ステージ３０の保持面に直接形成してもよいが、研磨ヘッド駆動部１０等に設けたレーザポインタ等からステージ３０にレーザ光を照射して目印Ｐを示してもよい。 In the polishing apparatus 100 of the present invention, a mark P is provided on the stage 30 in order to align the polishing head and the polishing area of the workpiece W. When the stage 30 is moved in the Y direction, the mark P is moved so that the polishing region aligned with the mark P passes through the center position of the reciprocating motion of the first polishing head 11 and the second polishing head 12. Let The mark P may be formed directly on the holding surface of the stage 30, but the mark P may be indicated by irradiating the stage 30 with laser light from a laser pointer or the like provided in the polishing head driving unit 10 or the like.
　研磨装置１００は、最初の粗研磨のときには、被研磨物Ｗを保持したステージ３０をＹ方向に移送し、被研磨物Ｗの研磨領域を第１の研磨ヘッド１１の往復運動の中心下に配置する。続いて、第１の研磨ヘッド１１を研磨領域に圧接して、Ｘ方向に往復運動させて粗研磨を実施する。このとき、第２の研磨ヘッド１２は、被研磨物Ｗに圧接されないが、第１の研磨ヘッド１１と逆位相で往復運動するように駆動される。 In the first rough polishing, the polishing apparatus 100 moves the stage 30 holding the workpiece W in the Y direction, and places the polishing area of the workpiece W below the center of the reciprocating motion of the first polishing head 11. To do. Subsequently, the first polishing head 11 is brought into pressure contact with the polishing region and reciprocated in the X direction to perform rough polishing. At this time, the second polishing head 12 is not pressed against the workpiece W, but is driven to reciprocate in the opposite phase to the first polishing head 11.
　第１の研磨ヘッド１１による粗研磨が終了すると、続いて仕上げ研磨を実施するため、研磨装置１００は、第１の研磨ヘッド１１を被研磨物Ｗから上昇させ、被研磨物Ｗを保持したステージ３０をさらにＹ方向に移送し、被研磨物Ｗの研磨領域を第２の研磨ヘッド１２の往復運動の中心下に配置する。続いて、第２の研磨ヘッド１２を研磨領域に圧接して、Ｘ方向に往復運動させて仕上げ研磨を実施する。このとき、第１の研磨ヘッド１１は、被研磨物Ｗに圧接されないが、第２の研磨ヘッド１２と逆位相で往復運動するように駆動される。 When the rough polishing by the first polishing head 11 is completed, the polishing apparatus 100 raises the first polishing head 11 from the workpiece W and holds the workpiece W in order to perform finish polishing. 30 is further transferred in the Y direction, and the polishing region of the workpiece W is disposed below the center of the reciprocating motion of the second polishing head 12. Subsequently, the second polishing head 12 is brought into pressure contact with the polishing region and reciprocated in the X direction to perform final polishing. At this time, the first polishing head 11 is not brought into pressure contact with the workpiece W, but is driven to reciprocate in the opposite phase to the second polishing head 12.
　ここで、本発明の研磨装置１００において、第１の研磨ヘッド１１と第２の研磨ヘッド１２が逆位相で往復運動するとは、図２に示すように、第１の研磨ヘッド１１が左に移動するときは第２の研磨ヘッド１２が右に移動しており、第１の研磨ヘッド１１’が右に移動するときは第２の研磨ヘッド１２’が左に移動することである。 Here, in the polishing apparatus 100 of the present invention, when the first polishing head 11 and the second polishing head 12 reciprocate in opposite phases, the first polishing head 11 moves to the left as shown in FIG. When the second polishing head 12 is moved to the right, the second polishing head 12 'is moved to the left when the first polishing head 11' is moved to the right.
　このため、本発明の研磨装置１００では、第１の研磨ヘッド１１で研磨中には第２の研磨ヘッド１２がカウンターウエイトとして機能し、第２の研磨ヘッド１２で研磨中には第１の研磨ヘッド１１がカウンターウエイトとして機能することにより、カウンターウエイトの機構を別途設けなくても、研磨ヘッドの振動現象をキャンセリングすることができる。 For this reason, in the polishing apparatus 100 of the present invention, the second polishing head 12 functions as a counterweight during polishing by the first polishing head 11, and the first polishing is performed during polishing by the second polishing head 12. Since the head 11 functions as a counterweight, the vibration phenomenon of the polishing head can be canceled without providing a separate counterweight mechanism.
　一方、１つの研磨ヘッドの重量が１５０ｇ、回転数を５００ｒｐｍとして、従来の研磨装置で研磨を行うと、研磨ヘッドが大きく振動し研磨領域外に接触するなどして、被研磨物Ｗにダメージを及ぼした。しかし、本発明の研磨装置１００では、第１の研磨ヘッド１１と第２の研磨ヘッド１２が逆位相で往復運動し、研磨ヘッドの振動現象がキャンセリングされるため、研磨領域外にダメージを与えることなく良好に研磨することができた。 On the other hand, when polishing is performed with a conventional polishing apparatus with a single polishing head having a weight of 150 g and a rotation speed of 500 rpm, the polishing head vibrates greatly and comes into contact with the outside of the polishing region, thereby damaging the workpiece W. I gave it. However, in the polishing apparatus 100 of the present invention, the first polishing head 11 and the second polishing head 12 reciprocate in opposite phases, and the vibration phenomenon of the polishing head is cancelled. It was possible to polish well.
　また、図３には、比較例として、第１の研磨ヘッド１１と第２の研磨ヘッド１２の並び方向をＸ方向として、ステージ３０の移送方向をＹ方向として直交するように配置した場合を示す。比較例の構成では、研磨領域にそれぞれの研磨ヘッドの往復中心点に位置合わせするためには、Ｘ軸とＹ軸の２軸に移送できるステージ駆動機構３１が必要であり、Ｙ軸だけのステージ駆動機構３１では被研磨物Ｗの位置合わせをやり直す必要が生じる。 FIG. 3 shows, as a comparative example, a case where the arrangement direction of the first polishing head 11 and the second polishing head 12 is orthogonal to the X direction and the transfer direction of the stage 30 is orthogonal to the Y direction. . In the configuration of the comparative example, in order to align the polishing area with the reciprocation center point of each polishing head, a stage drive mechanism 31 that can be transferred to two axes of the X axis and the Y axis is necessary. In the drive mechanism 31, it is necessary to realign the workpiece W.
　本発明の研磨装置１００では、研磨ヘッドの並び方向とステージ３０の移送方向を略同一（Ｙ方向）にしているため、ステージ３０を一方向へ移送するだけで、研磨領域を第１の研磨ヘッド１１、第２の研磨ヘッド１２の往復中心位置へ移送することができ、それぞれの研磨位置へ効率よく移送し、異なる研磨シートで複数の研磨工程を実施することができる。 In the polishing apparatus 100 of the present invention, the direction in which the polishing heads are aligned and the direction in which the stage 30 is transferred are substantially the same (Y direction), so that the polishing region can be moved to the first polishing head only by transferring the stage 30 in one direction. 11. It can transfer to the reciprocation center position of the 2nd polishing head 12, can transfer efficiently to each polishing position, and can carry out a plurality of polish processes with a different polish sheet.
　〔実施形態２〕
　実施形態１の研磨装置１００では、ステージ３０を静止した状態で研磨ヘッドを往復運動させるものであったが、実施形態２の研磨装置では、図２において、破線矢印で示すように、研磨ヘッドの往復運動（Ｘ方向）と一緒に、ステージ３０を直交方向（Ｙ方向）に往復移動させる構成とした。 [Embodiment 2]
In the polishing apparatus 100 of the first embodiment, the polishing head is reciprocated while the stage 30 is stationary. However, in the polishing apparatus of the second embodiment, as shown by a broken line arrow in FIG. Along with the reciprocating motion (X direction), the stage 30 is configured to reciprocate in the orthogonal direction (Y direction).
　ステージ３０と研磨ヘッドを直交方向に往復運動させることにより、研磨ヘッドをＸＹ方向に複合運動させることが可能となり、研磨領域をより均一に研磨することができる。 By reciprocating the stage 30 and the polishing head in the orthogonal direction, the polishing head can be compounded in the XY directions, and the polishing region can be polished more uniformly.
　なお、ステージ３０の往復移動は、研磨ヘッドの往復運動と必ずしも同一速度で駆動する必要はない。また、ステージ３０は、研磨ヘッドの運動量と必ずしも同じ移動量で駆動する必要はなく、研磨領域の大きさに合わせて適宜設定すればよい。 Note that the reciprocating movement of the stage 30 is not necessarily driven at the same speed as the reciprocating movement of the polishing head. Further, the stage 30 does not necessarily have to be driven with the same amount of movement as the amount of movement of the polishing head, and may be set appropriately according to the size of the polishing region.
　〔実施形態３〕
　図４は、実施形態３の研磨装置１００の上面図であり、研磨ヘッドの並び方向と往復運動の方向を示している。実施形態３の研磨装置１００では、第１の研磨ヘッド１１と第２の研磨ヘッド１２の並び方向と、研磨ヘッドの往復運動の方向を略同一にしている。 [Embodiment 3]
FIG. 4 is a top view of the polishing apparatus 100 according to the third embodiment, showing the alignment direction of the polishing heads and the direction of reciprocation. In the polishing apparatus 100 according to the third embodiment, the arrangement direction of the first polishing head 11 and the second polishing head 12 and the direction of reciprocation of the polishing head are made substantially the same.
　実施形態３の研磨装置１００は、図４に示すように、第１の研磨ヘッド１１と第２の研磨ヘッド１２の並び方向（Ｙ方向）に往復運動の方向を合わせて、第１の研磨ヘッド１１と第２の研磨ヘッド１２が直線状に逆位相で往復運動するようにした。これにより、往復運動時の研磨ヘッドへの回転モーメントが生じ難くなり、研磨ヘッドの振動現象を確実にキャンセリングすることが可能となる。 As shown in FIG. 4, the polishing apparatus 100 according to the third embodiment matches the direction of reciprocation with the direction in which the first polishing head 11 and the second polishing head 12 are aligned (Y direction). 11 and the second polishing head 12 were made to reciprocate linearly in opposite phases. This makes it difficult for a rotational moment to be applied to the polishing head during the reciprocating motion, and it is possible to reliably cancel the vibration phenomenon of the polishing head.
　なお、実施形態３の研磨装置１００においても、第１の研磨ヘッド１１と第２の研磨ヘッド１２の並び方向とステージ３０の移送方向を略同一（Ｙ方向）にしているため、ステージ３０を一方向へ移送するだけで、研磨領域を第１の研磨ヘッド１１、第２の研磨ヘッド１２の往復中心位置へ効率よく移送し、異なる研磨シートで複数の研磨工程を実施することができる。 Also in the polishing apparatus 100 of the third embodiment, the alignment direction of the first polishing head 11 and the second polishing head 12 and the transfer direction of the stage 30 are substantially the same (Y direction). It is possible to efficiently transfer the polishing area to the reciprocation center position of the first polishing head 11 and the second polishing head 12 and to perform a plurality of polishing steps with different polishing sheets only by transferring in the direction.
　〔実施形態４〕
　図５は、実施形態４の研磨装置１００に用いられる往復運動機構２０の模式図であり、（ａ）は往復運動機構２０の斜視図であり、（ｂ）は往復運動機構２０の上面図である。往復運動機構２０は、図５に示すように、モーター２２の回転運動を往復運動に変換するクランク機構２１によって構成されている。クランク機構２１は、第１の研磨ヘッド１１と第２の研磨ヘッド１２を逆位相で駆動するため、各々のクランク機構２１をクランク連結部に１８０°の位相差を持たせて連結している。 [Embodiment 4]
5A and 5B are schematic views of the reciprocating mechanism 20 used in the polishing apparatus 100 according to the fourth embodiment. FIG. 5A is a perspective view of the reciprocating mechanism 20, and FIG. is there. As shown in FIG. 5, the reciprocating mechanism 20 includes a crank mechanism 21 that converts the rotational movement of the motor 22 into a reciprocating movement. Since the crank mechanism 21 drives the first polishing head 11 and the second polishing head 12 in opposite phases, each crank mechanism 21 is connected to the crank connecting portion with a phase difference of 180 °.
　実施形態１の研磨装置１００では、往復運動機構２０を構成するために２つのリニアモータを配置し、第１の研磨ヘッド１１を駆動するリニアモータと第２の研磨ヘッド１２を駆動するリニアモータを互いに逆位相で制御する必要がある。一方、実施形態４の研磨装置１００の構成では、リニアモータに代えてクランク機構２１を用いることにより、簡素化された構成で逆位相の往復運動を可能にし、研磨装置１００の部品削減と軽量化を実現することができる。 In the polishing apparatus 100 according to the first embodiment, two linear motors are arranged to configure the reciprocating mechanism 20, and a linear motor that drives the first polishing head 11 and a linear motor that drives the second polishing head 12 are provided. It is necessary to control them in opposite phases. On the other hand, in the configuration of the polishing apparatus 100 according to the fourth embodiment, by using the crank mechanism 21 instead of the linear motor, it is possible to perform reciprocal movement in the opposite phase with a simplified configuration, and the number of parts and the weight of the polishing apparatus 100 can be reduced. Can be realized.
　〔実施形態５〕
　図６は、実施形態５の研磨装置１００に用いられる往復運動機構２０の上面図である。実施形態４の研磨装置１００では、構造上クランク軸の中央に外部から回転を伝達する必要があり、構造が複雑になりメンテナンスが難しい。実施形態５の研磨装置１００では、クランク機構２１とロッカーアーム２３を組合せて、ロッカーアーム２３に第１の研磨ヘッド１１と第２の研磨ヘッド１２を接続する構成としたため、クランク機構２１が１つとなりモーター２２に直接連結して簡素化することができ、メンテナンスが容易になるとともに往復運動機構２０をさらに小型化することができる。 [Embodiment 5]
FIG. 6 is a top view of the reciprocating mechanism 20 used in the polishing apparatus 100 of the fifth embodiment. In the polishing apparatus 100 according to the fourth embodiment, it is necessary to transmit rotation from the outside to the center of the crankshaft because of its structure, and the structure becomes complicated and maintenance is difficult. In the polishing apparatus 100 according to the fifth embodiment, the crank mechanism 21 and the rocker arm 23 are combined to connect the first polishing head 11 and the second polishing head 12 to the rocker arm 23, so that one crank mechanism 21 is provided. It can be directly connected to the motor 22 for simplification, and maintenance can be facilitated, and the reciprocating mechanism 20 can be further downsized.
　図７は、ロッカーアーム２３を複数連結させた往復運動機構２０の上面図である。複数のロッカーアーム２３を連結することにより、さらに、第３の研磨ヘッド１３を含む複数の研磨ヘッドを互いに逆位相で往復運動させることが可能になる。なお、複数の研磨ヘッドを搭載する場合、研磨ヘッドの振動現象を確実にキャンセリングするため、一方に運動する研磨ヘッドの合計重量と他方に運動する研磨ヘッドの合計重量とのバランスをとることが望ましい。 FIG. 7 is a top view of the reciprocating mechanism 20 in which a plurality of rocker arms 23 are connected. By connecting the plurality of rocker arms 23, the plurality of polishing heads including the third polishing head 13 can be reciprocated in mutually opposite phases. When mounting a plurality of polishing heads, it is possible to balance the total weight of the polishing head moving in one direction and the total weight of the polishing head moving in the other direction in order to reliably cancel the vibration phenomenon of the polishing head desirable.
　このように、本発明の研磨装置は、複数の研磨ヘッドの並び方向と、研磨ヘッドの往復運動の方向とが直交することを特徴とする。 Thus, the polishing apparatus of the present invention is characterized in that the direction in which the plurality of polishing heads are aligned and the direction of the reciprocating movement of the polishing heads are orthogonal to each other.
　また、本発明の研磨装置は、複数の研磨ヘッドの並び方向と、研磨ヘッドの往復運動の方向とが略同一であることを特徴とする。 Further, the polishing apparatus of the present invention is characterized in that the direction in which the plurality of polishing heads are arranged and the direction of the reciprocating movement of the polishing heads are substantially the same.
　また、本発明の研磨装置は、往復運動機構は、回転運動を往復運動に変換するクランク機構を有することを特徴とする。 Further, the polishing apparatus of the present invention is characterized in that the reciprocating mechanism has a crank mechanism for converting the rotational motion into the reciprocating motion.
　また、本発明の研磨装置は、複数の研磨ヘッドは、それぞれ異なる研磨部材を保持することを特徴とする。 The polishing apparatus of the present invention is characterized in that the plurality of polishing heads hold different polishing members.
　以上、本発明の研磨装置について各実施形態を用いて説明したが、本発明は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。 As described above, the polishing apparatus of the present invention has been described using each embodiment. However, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims and are different. Embodiments obtained by appropriately combining technical means disclosed in the respective embodiments are also included in the technical scope of the present invention.
　Ｐ　目印
　Ｗ　被研磨物
　１０　研磨ヘッド駆動部
　１１　第１の研磨ヘッド
　１２　第２の研磨ヘッド
　１３　第３の研磨ヘッド
　１４　第１の研磨シート
　１５　第２の研磨シート
　１７　昇降機構
　１８　加圧機構
　２０　往復運動機構
　２１　クランク機構
　２２　モーター
　２３　ロッカーアーム
　３０　ステージ
　３１　ステージ駆動機構
　１００　研磨装置 P Mark W Workpiece 10 Polishing head drive unit 11 First polishing head 12 Second polishing head 13 Third polishing head 14 First polishing sheet 15 Second polishing sheet 17 Lifting mechanism 18 Pressure mechanism 20 Reciprocating Movement mechanism 21 Crank mechanism 22 Motor 23 Rocker arm 30 Stage 31 Stage drive mechanism 100 Polishing device

Claims (5)

  1. 　被研磨物を移送するステージと、
    　研磨部材を保持し、前記被研磨物の移送方向に並べて配置された複数の研磨ヘッドと、
    　前記研磨ヘッドの少なくとも１つを前記被研磨物に圧接する加圧機構と、
    　圧接した研磨ヘッドと他の研磨ヘッドとを前記被研磨物と水平方向に逆位相で往復運動させる往復運動機構と、
    　を備えたことを特徴とする研磨装置。     A stage for transferring an object to be polished;
    A plurality of polishing heads holding a polishing member and arranged side by side in the transfer direction of the object to be polished;
    A pressurizing mechanism for pressing at least one of the polishing heads against the object to be polished;
    A reciprocating mechanism for reciprocating the polishing head and the other polishing head in pressure contact with each other in the opposite phase in the horizontal direction;
    A polishing apparatus comprising:
  2. 　前記複数の研磨ヘッドの並び方向と、前記研磨ヘッドの往復運動の方向とが直交することを特徴とする請求項１に記載の研磨装置。 2. The polishing apparatus according to claim 1, wherein an arrangement direction of the plurality of polishing heads and a direction of reciprocation of the polishing heads are orthogonal to each other.
  3. 　前記複数の研磨ヘッドの並び方向と、前記研磨ヘッドの往復運動の方向とが略同一であることを特徴とする請求項１に記載の研磨装置。 2. The polishing apparatus according to claim 1, wherein an arrangement direction of the plurality of polishing heads and a reciprocating direction of the polishing heads are substantially the same.
  4. 　前記往復運動機構は、回転運動を往復運動に変換するクランク機構を有することを特徴とする請求項１に記載の研磨装置。 The polishing apparatus according to claim 1, wherein the reciprocating mechanism has a crank mechanism for converting a rotational motion into a reciprocating motion.
  5. 　前記複数の研磨ヘッドは、それぞれ異なる研磨部材を保持することを特徴とする請求項１から４のいずれか１項に記載の研磨装置。 The polishing apparatus according to any one of claims 1 to 4, wherein each of the plurality of polishing heads holds different polishing members.
PCT/JP2015/065275 2014-07-03 2015-05-27 Polishing apparatus WO2016002396A1 (en)

Applications Claiming Priority (2)

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JP2014-137406 2014-07-03
JP2014137406A JP2016013601A (en) 2014-07-03 2014-07-03 Polishing device

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107952995A (en) * 2017-12-22 2018-04-24 上海埃蒙迪材料科技股份有限公司 A kind of groove processing unit (plant) of metal support groove body
CN108527144A (en) * 2018-03-28 2018-09-14 昆山国显光电有限公司 Substrate grinding device and its grinding method
CN111590690A (en) * 2020-05-25 2020-08-28 廖国华 Wood board surface planing and polishing device
CN114952571A (en) * 2022-04-14 2022-08-30 深圳模微半导体有限公司 Security chip manufacturing management system based on Internet of things

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578070A (en) * 1980-06-17 1982-01-16 Hitachi Ltd Sliding motor driven tool
JPH02100760U (en) * 1989-01-30 1990-08-10
JPH03121739A (en) * 1989-10-03 1991-05-23 Nagase Iron Works Co Ltd Attachment for grinder and its work feeding mechanism
JPH05337796A (en) * 1992-04-30 1993-12-21 Nippon Steel Corp Surface grinding method for band-shaped metal piece
JP2006167842A (en) * 2004-12-14 2006-06-29 Toyota Motor Corp Manufacturing method of ring member

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578070A (en) * 1980-06-17 1982-01-16 Hitachi Ltd Sliding motor driven tool
JPH02100760U (en) * 1989-01-30 1990-08-10
JPH03121739A (en) * 1989-10-03 1991-05-23 Nagase Iron Works Co Ltd Attachment for grinder and its work feeding mechanism
JPH05337796A (en) * 1992-04-30 1993-12-21 Nippon Steel Corp Surface grinding method for band-shaped metal piece
JP2006167842A (en) * 2004-12-14 2006-06-29 Toyota Motor Corp Manufacturing method of ring member

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107952995A (en) * 2017-12-22 2018-04-24 上海埃蒙迪材料科技股份有限公司 A kind of groove processing unit (plant) of metal support groove body
CN107952995B (en) * 2017-12-22 2024-04-30 上海埃蒙迪材料科技股份有限公司 Groove machining device for metal bracket body
CN108527144A (en) * 2018-03-28 2018-09-14 昆山国显光电有限公司 Substrate grinding device and its grinding method
CN111590690A (en) * 2020-05-25 2020-08-28 廖国华 Wood board surface planing and polishing device
CN111590690B (en) * 2020-05-25 2021-12-07 山东绿城家居有限公司 Wood board surface planing and polishing device
CN114952571A (en) * 2022-04-14 2022-08-30 深圳模微半导体有限公司 Security chip manufacturing management system based on Internet of things
CN114952571B (en) * 2022-04-14 2023-11-10 深圳模微半导体有限公司 Security chip manufacturing management system based on Internet of things

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