WO2015188343A1 - 智能终端散热装置及智能终端 - Google Patents
智能终端散热装置及智能终端 Download PDFInfo
- Publication number
- WO2015188343A1 WO2015188343A1 PCT/CN2014/079725 CN2014079725W WO2015188343A1 WO 2015188343 A1 WO2015188343 A1 WO 2015188343A1 CN 2014079725 W CN2014079725 W CN 2014079725W WO 2015188343 A1 WO2015188343 A1 WO 2015188343A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat pipe
- flexible
- evaporation end
- flexible heat
- smart terminal
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 31
- 238000001704 evaporation Methods 0.000 claims abstract description 91
- 230000008020 evaporation Effects 0.000 claims abstract description 90
- 230000005494 condensation Effects 0.000 claims abstract description 21
- 238000009833 condensation Methods 0.000 claims abstract description 21
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 10
- 238000005452 bending Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a heat dissipation technology, in particular to a bendable intelligent terminal heat dissipation device and an intelligent terminal. Background technique
- Wearable terminals are smart terminal products behind tablets and smart phones.
- smart wearable terminals have Google glasses, smart headbands, smart shoes, and the widest range of smart watches.
- GPS Global Positioning System
- WIFI Wireless Fidelity
- 3G Third Generation Mobile
- the calorific value is derived from 0W to more than 3W
- the smart wearable terminal is concentrated in heat, which is easy to cause local hot zone.
- the smart wearable terminal is in contact with human skin for a long time, it is easy to cause burns on human skin. Therefore, it is necessary to control the heat generation problem of the smart wearable terminal, so that the temperature of the smart wearable terminal is rapidly decreased to avoid scalding the human skin.
- the heat-concentrated wearable terminal is dissipated through a flexible heat pipe, wherein the heat pipe can turn the point heat source into a line heat source, reducing the risk of the concentrated heat source scalding the human body, and the flexible heat pipe is bendable and can be used in the bendable device.
- the heat dissipation is performed, wherein the flexible heat pipe mechanism is as shown in FIG. 1 , and includes an evaporation section L1 , a soft section L2 and a condensation section L3 , wherein ⁇ ⁇ is a flexible heat pipe diameter, and the evaporation section L1 and the condensation section L3 are rigid portions of the flexible heat pipe.
- the heat from the evaporation section L1 of the flexible heat pipe is cooled in the condensation section L3 of the flexible heat pipe, and the soft segment L2 is the flexible part of the flexible heat pipe.
- the bending of the flexible heat pipe can be set within a certain angle range. Degree.
- the existing flexible heat pipe can only withstand a large bending in the soft section L2 area, and the remaining part (evaporation section L1 and condensation section L3) is easily broken after being bent, and the device cannot be dissipated, and the smart wearable terminal and the There are more bends in the bent smartphone, so use the existing soft When the heat pipe heats the smart wearable terminal and the future bendable smart phone, the heat dissipation effect is poor.
- the invention provides an intelligent terminal heat dissipating device and an intelligent terminal, which solves the technical problem that the heat dissipating effect is poor when the existing heat dissipating device dissipates heat to the bendable device with more bending regions.
- the present invention provides a smart terminal heat dissipation device, including:
- the flexible heat pipe has a condensation end at both ends, and an evaporation end in the middle, the condensation end is composed of one or more heat pipe rigid portions and one or more heat pipe flexible portions, and the heat pipe of the condensation end The rigid portion is alternately arranged with the flexible portion of the heat pipe of the condensation end, the evaporation end comprising at least a heat pipe rigid portion, and the intelligent terminal body is mounted above the evaporation end.
- the number of the flexible heat pipes is two, which are a first flexible heat pipe and a second flexible heat pipe, respectively, wherein the first flexible heat pipe and the second flexible heat pipe
- the smart terminal body is mounted on an evaporation end of the first flexible heat pipe and/or an evaporation end of the second flexible heat pipe.
- the number of the flexible heat pipes is two, which are respectively a first flexible heat pipe and a second flexible heat pipe, wherein the evaporation end of the first flexible heat pipe and the first The evaporation ends of the two flexible heat pipes are connected in series, and the smart terminal body is mounted on the evaporation end of the first flexible heat pipe and/or the evaporation end of the second flexible heat pipe.
- a third possible implementation manner of the first aspect when the evaporation end of the first flexible heat pipe is connected in series with the evaporation end of the second flexible heat pipe Passing the first capillary structure in the first flexible heat pipe and the second capillary structure in the second flexible heat pipe between the evaporation end of the first flexible heat pipe and the evaporation end of the second flexible heat pipe
- the three capillary structures are connected to each other.
- a first capillary structure in the first flexible heat pipe is connected in parallel with a second capillary structure in the second flexible heat pipe, and at an evaporation end of the first flexible heat pipe and an evaporation end of the second flexible heat pipe A plurality of fourth capillary structures are disposed therebetween, and the fourth capillary structure is vertically disposed.
- the evaporating end further includes: a heat pipe flexible portion, the smart terminal The body is mounted to the heat pipe flexible portion of the evaporation end and/or the heat pipe rigid portion of the evaporation end.
- the heat pipe flexible portion is composed of a multi-section soft body tube.
- the present invention provides an intelligent terminal, where the smart terminal includes:
- the smart terminal body is installed on the evaporation end of the heat sink of the smart terminal by a top-down detachable manner;
- the smart terminal body is mounted on the evaporation end of the heat sink of the smart terminal by a detachable manner from left to right; or
- the smart terminal body is fixed on an evaporation end of the heat sink of the smart terminal.
- the intelligent terminal heat dissipating device and the intelligent terminal provided by the embodiment of the invention provide a condensing end at both ends of the flexible heat pipe, and an evaporation end is arranged in the middle, and the condensing end is alternately formed by a plurality of heat pipe rigid portions and a plurality of heat pipe flexible portions
- the arrangement of the evaporation end includes at least a rigid portion of the heat pipe, which realizes the flexible heat dissipation of the bendable device with more bending regions, and solves the problem that the existing heat dissipation device dissipates heat when the bendable device has more bending regions. A technical problem with poor results.
- FIG. 1 is a schematic structural view of a conventional flexible heat pipe
- Embodiment 1 is a schematic structural diagram of Embodiment 1 of a heat dissipation device for a smart terminal according to the present invention
- FIG. 3 is a schematic view showing the capillary structure in the heat sink of the smart terminal shown in FIG. 2; 4 is a schematic structural diagram of Embodiment 2 of a heat sink device for a smart terminal according to the present invention;
- FIG. 5 is a schematic structural diagram of Embodiment 3 of a heat sink device for a smart terminal according to the present invention;
- Figure 6 is a schematic view A of the capillary structure in the heat sink of the intelligent terminal shown in Figure 5;
- FIG. 7 is a schematic view B of the capillary structure in the heat sink of the smart terminal shown in FIG. 5;
- Embodiment 8 is a schematic structural diagram of Embodiment 1 of a smart terminal according to the present invention.
- Figure 9 is a schematic view of the installation of the intelligent terminal of the present invention A.
- FIG. 10 is a schematic diagram B of the installation of the intelligent terminal of the present invention.
- FIG. 2 is a schematic structural view of a first embodiment of a heat sink of a smart terminal according to the present invention
- FIG. 3 is a schematic view showing a capillary structure of the heat sink of the smart terminal shown in FIG. 2.
- the capillary structure in the heat sink is usually multi-wire wound.
- the bundle of wires can withstand the bending and pass through the rigid portion and the flexible portion to form a continuous capillary structure, so that the cooled liquid is recirculated by the capillary force back to the evaporation end.
- the intelligent terminal heat sink can be The application can be used for dissipating heat in a smart terminal, and can also be applied to heat dissipation in a bendable smart wearable terminal and a bendable smart phone that appears in the future.
- the smart terminal heat sink includes:
- At least one flexible heat pipe that is, the intelligent terminal heat sink may be composed of a flexible heat pipe or a plurality of flexible heat pipes.
- a plurality of flexible heat pipes may be selected, and multiple The flexible heat pipes may be connected in parallel or in series.
- the flexible heat pipes in this embodiment may also be replaced by high heat conductive materials, such as embedded copper foil, embedded graphite tubes, and embedded high thermal conductive braids, but
- the heat sink of the intelligent terminal includes a flexible heat pipe, as shown in FIG.
- the two ends of the flexible heat pipe are the condensation end 201, and the middle is the evaporation end 202, wherein
- the condensation end 201 at both ends of the flexible heat pipe may be composed of a heat pipe rigid portion and a plurality of heat pipe flexible portions alternately arranged, or may be composed of a plurality of heat pipe rigid portions and a plurality of heat pipe flexible portions alternately arranged, or may be composed of multiple
- the rigid portion of the heat pipe and the flexible portion of the heat pipe are alternately arranged, and a rigid portion of the heat pipe and a flexible portion of the heat pipe are alternately arranged, which may be set according to the structure of the intelligent terminal involved in the practical application, and is not limited in this embodiment.
- the evaporation end 202 in the middle of the flexible heat pipe may include only the heat pipe rigid portion, and may further include a heat pipe rigid portion and a heat pipe flexible portion, and only the rigid portion of the evaporation end 202 is shown in FIG. 2, in this embodiment, all the flexible portions
- the flexible heat pipe is provided with a capillary structure 30, and the capillary structure 30 is a flexible sealing member designed by a vacuum, and the capillary structure 30 is installed therein. a liquid having a low boiling point and being easily volatilized.
- the evaporation end 202 of the flexible heat pipe When the smart terminal body is mounted on the evaporation end 202 of the flexible heat pipe and starts to work, the evaporation end 202 of the flexible heat pipe is heated, and the liquid at the evaporation end 202 can be quickly evaporated. a slight pressure difference flows to the two condensation ends 201 of the flexible heat pipe, and releases heat, heavy The liquid is condensed into a liquid, and the liquid flows back to the evaporation end 202 by the capillary force of the porous capillary material, so that the heat is radiated to the heat source of the intelligent terminal body by heat conduction.
- the condensing end is made of one or more heat pipes. And one or more heat pipe flexible parts, so that the bending device can be flexibly dissipated.
- the intelligent terminal heat dissipating device has a condensation end disposed at two ends of the flexible heat pipe, an evaporation end is disposed in the middle, and the condensation end is composed of one or more heat pipe rigid portions and one or more heat pipe flexible portions Alternatingly arranged, the evaporation end includes at least a rigid portion of the heat pipe, which realizes flexible heat dissipation of the bendable device with more bending regions, and solves the problem that the existing heat dissipation device dissipates heat to the bendable device with more bending regions.
- Technical problems with poor heat dissipation are described by the embodiment of the present invention.
- the heat sink of the smart terminal includes multiple flexible heat pipes, in order to explain the relationship between the flexible heat pipes.
- the smart terminal heat dissipation device includes two flexible heat pipes as an example. As shown in FIG. 4 , the smart terminal heat dissipation device includes: a first flexible heat pipe 41 and a second flexible heat pipe 42 , wherein A flexible heat pipe 41 and a second flexible heat pipe 42 are arranged in parallel.
- the smart terminal body 43 can be installed at the evaporation end of the first flexible heat pipe 41, or can be installed on the evaporation end of the second flexible heat pipe 42.
- the installation position can be selected according to the size of the smart terminal body 43, when the smart terminal body 43 is mounted on the evaporation end of the first flexible heat pipe 41 and When the evaporation end of the second flexible heat pipe 42 is used, the evaporation end of the first flexible heat pipe 41 and the evaporation end of the second flexible heat pipe 42 may be the same Different heat sources on the smart terminal body 43 perform heat dissipation.
- the capillary structure in the two flexible heat pipes in this embodiment can refer to the distribution of the capillary structure 30 shown in FIG.
- FIG. 5 is a schematic structural view of a third embodiment of the heat sink of the smart terminal of the present invention
- FIG. 6 is a schematic view of the capillary structure of the heat sink of the smart terminal shown in FIG. 5
- FIG. 7 is a capillary structure of the heat sink of the smart terminal shown in FIG.
- the schematic diagram B on the basis of the above embodiment, in the embodiment, the smart terminal heat dissipation device includes a plurality of flexible heat pipes, and in order to illustrate the relationship between the flexible heat pipes, the smart terminal heat dissipation device is used in this embodiment. For example, as shown in FIG.
- the intelligent terminal heat dissipation device includes: a first flexible heat pipe 51 and a second flexible heat pipe 52, wherein the evaporation end of the first flexible heat pipe 51 is The evaporation ends of the second flexible heat pipe 52 are connected to each other in series, that is, the evaporation end of the first flexible heat pipe 51 is in communication with the evaporation end of the second flexible heat pipe 52, and the smart terminal body 53 can be installed in the evaporation of the first flexible heat pipe 51.
- the first capillary structure 54 in the first flexible heat pipe 51 and The second capillary structure 55 in the second flexible heat pipe 52 is as shown in FIG. 6.
- the first capillary structure 54 and the second capillary structure 55 pass through the third end of the first flexible heat pipe 51 and the evaporation end of the second flexible heat pipe 52.
- the capillary structure 56a is connected to each other, wherein the third capillary structure 56a has a mesh structure in order to more completely dissipate heat dissipation of the devices in the smart terminal body 53.
- the evaporation of the first flexible heat pipe 51 is performed.
- the end and the evaporation end of the second flexible heat pipe 52 are connected in series with each other, and the first capillary structure 54 in the first flexible heat pipe 51 and the second capillary structure 55 in the second flexible heat pipe 52 are also connected in series to each other, thereby realizing the same intelligence.
- Different heat sources on the terminal body 43 have more capillary structures for heat dissipation, which improves the heat dissipation effect.
- connection relationship between the first capillary structure 54 in the first flexible heat pipe 51 and the second capillary structure 55 in the second flexible heat pipe 52 is as shown in FIG. 7, and the first capillary structure 54 And the second capillary structure 55 is connected in parallel, and a plurality of fourth capillary structures 56b are disposed between the evaporation end of the first flexible heat pipe 51 and the evaporation end of the second flexible heat pipe 52, the fourth capillary structure 56b is vertically disposed, that is, when the smart terminal main body 53 is installed at the evaporation end of the first flexible heat pipe 51 and the evaporation end of the second flexible heat pipe 52 and starts to work, the fourth capillary structure 56b is next to the smart terminal main body 53.
- the top of the heat source is evaporated by the heated liquid, the steam flows vertically toward the bottom of the fourth capillary structure 56b, and heat is released, recondensing into a liquid, and the liquid flows back to the top of the fourth capillary structure 56b by the capillary force of the porous capillary material.
- the heat source of the smart terminal body 53 is dissipated, and the heat dissipation method of the fourth capillary structure 56b can refer to the existing cold plate heat dissipation technology.
- FIG. 8 is a schematic structural diagram of Embodiment 1 of a smart terminal according to the present invention.
- FIG. 9 is a schematic diagram of installation of an intelligent terminal according to the present invention.
- FIG. 10 is a schematic diagram B of installing an intelligent terminal according to the present invention.
- the smart terminal includes: The main body 81 and the mobile terminal heat sink 80 provided by any of the above embodiments, the mobile terminal heat sink 80 has a condensation end 801 at both ends, and an evaporation end 802 in the middle, wherein the smart terminal body 81 is mounted on the mobile terminal heat sink 80.
- the smart terminal body 81 can be detachably mounted on the evaporation end 802 from top to bottom in the method shown in FIG.
- the mobile terminal heat dissipation device The 80 can serve as a wristband, a strap, and a lanyard of the smart wearable terminal, that is, the main body of the smart wearable terminal is mounted on the mobile terminal heat sink 80. Available to users.
- the aforementioned program can be stored in a computer readable storage medium.
- the program when executed, performs the steps including the above-described method embodiments; and the foregoing storage medium includes: a medium that can store program codes, such as a ROM, a RAM, a magnetic disk, or an optical disk.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14894606.4A EP3168562B1 (en) | 2014-06-12 | 2014-06-12 | Intelligent terminal heat dissipation device and intelligent terminal |
CN201480001443.0A CN104396357B (zh) | 2014-06-12 | 2014-06-12 | 智能终端散热装置及智能终端 |
CA2961277A CA2961277C (en) | 2014-06-12 | 2014-06-12 | Intelligent terminal heat dissipation apparatus and intelligent terminal |
PCT/CN2014/079725 WO2015188343A1 (zh) | 2014-06-12 | 2014-06-12 | 智能终端散热装置及智能终端 |
US15/508,890 US10088879B2 (en) | 2014-06-12 | 2014-06-12 | Intelligent terminal heat dissipation apparatus and intelligent terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2014/079725 WO2015188343A1 (zh) | 2014-06-12 | 2014-06-12 | 智能终端散热装置及智能终端 |
Publications (1)
Publication Number | Publication Date |
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WO2015188343A1 true WO2015188343A1 (zh) | 2015-12-17 |
Family
ID=52612517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2014/079725 WO2015188343A1 (zh) | 2014-06-12 | 2014-06-12 | 智能终端散热装置及智能终端 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10088879B2 (zh) |
EP (1) | EP3168562B1 (zh) |
CN (1) | CN104396357B (zh) |
CA (1) | CA2961277C (zh) |
WO (1) | WO2015188343A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112198942A (zh) * | 2019-07-08 | 2021-01-08 | 联想(新加坡)私人有限公司 | 散热模块、电子设备、散热模块用散热板 |
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US20160201994A1 (en) * | 2015-01-12 | 2016-07-14 | Asia Vital Components Co., Ltd. | Carrier with heat dissipation structure |
US9733680B1 (en) * | 2016-03-16 | 2017-08-15 | Microsoft Technology Licensing, Llc | Thermal management system including an elastically deformable phase change device |
KR20190013008A (ko) * | 2017-07-31 | 2019-02-11 | 송영석 | 플렉시블 히트 쿨러 |
US20210254899A1 (en) * | 2020-02-14 | 2021-08-19 | Hamilton Sundstrand Corporation | Compliant oscillating heat pipes |
TWM603524U (zh) * | 2020-07-27 | 2020-11-01 | 華碩電腦股份有限公司 | 導熱裝置 |
JP7667131B2 (ja) | 2020-08-03 | 2025-04-22 | サムスン エレクトロニクス カンパニー リミテッド | 可撓性印刷回路基板を含む電子装置 |
EP4001820B1 (en) | 2020-11-20 | 2024-05-29 | Nokia Technologies Oy | Oscillating heat pipe |
CN113983840B (zh) * | 2021-09-13 | 2023-12-15 | 江苏大学 | 一种具有刚性特性的可移植的仿生汗腺及智能机器人 |
CN113804035A (zh) * | 2021-09-30 | 2021-12-17 | 中国船舶重工集团公司第七二四研究所 | 一种微形变增强导热接触相变传热装置 |
CN114501928A (zh) | 2021-12-29 | 2022-05-13 | 联想(北京)有限公司 | 散热装置及电子设备 |
US20230309265A1 (en) * | 2022-03-22 | 2023-09-28 | Meta Platforms Technologies, Llc | Flexible thermal system |
CN115406275B (zh) * | 2022-07-28 | 2024-07-09 | 西安空间无线电技术研究所 | 一种可控快速响应相变储热系统、加工方法及传热方法 |
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- 2014-06-12 WO PCT/CN2014/079725 patent/WO2015188343A1/zh active Application Filing
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CN112198942A (zh) * | 2019-07-08 | 2021-01-08 | 联想(新加坡)私人有限公司 | 散热模块、电子设备、散热模块用散热板 |
CN112198942B (zh) * | 2019-07-08 | 2024-05-07 | 联想(新加坡)私人有限公司 | 散热模块、电子设备、散热模块用散热板 |
Also Published As
Publication number | Publication date |
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CN104396357A (zh) | 2015-03-04 |
EP3168562A1 (en) | 2017-05-17 |
EP3168562A4 (en) | 2017-11-01 |
EP3168562B1 (en) | 2019-08-07 |
US10088879B2 (en) | 2018-10-02 |
US20170220082A1 (en) | 2017-08-03 |
CA2961277C (en) | 2019-05-28 |
CA2961277A1 (en) | 2015-12-17 |
CN104396357B (zh) | 2017-01-25 |
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